CN118922027B

CN118922027B - Display device and manufacturing method thereof, and display apparatus

Info

Publication number: CN118922027B
Application number: CN202411420635.7A
Authority: CN
Inventors: 周一; 任清江; 隋运武; 林昌廷; 汤颖颖
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2024-10-12
Filing date: 2024-10-12
Publication date: 2025-01-28
Anticipated expiration: 2044-10-12
Also published as: CN118922027A

Abstract

The application discloses a display device, a preparation method thereof and a display device, and relates to the technical field of display, wherein the display device is provided with a plurality of pixel units, each pixel unit comprises at least three sub-pixels which emit light with different colors and different light emission bands, each sub-pixel comprises a white light emitting element, an optical conversion unit and a light filtering unit which are sequentially arranged on the light emission side of the white light emitting element, the color of each light filtering unit corresponds to the color of the emitted light, each optical conversion unit comprises at least one group of light conversion modules, each light conversion module comprises a super-surface structure and an optical conversion structure which are arranged in a stacked manner, each optical conversion structure is used for converting at least part of light rays with non-emitted light bands into light rays with emitted light bands, the interface between each super-surface structure and each optical conversion structure is a super-structure surface, and the resonance band of each light conversion module is at least partially identical to the conversion band of each optical conversion structure. The technical scheme of the application can improve the light emitting efficiency and the display brightness of the display device.

Description

Display device, manufacturing method thereof and display device

Technical Field

The invention relates to the technical field of display, in particular to a display device, a preparation method thereof and a display device.

Background

An OLED (Organic LIGHT EMITTING Diode) display device is an Organic thin film electroluminescent device, and is widely used in display devices such as televisions, mobile phones, computers, displays, and head-mounted display devices. In the related art, the OLED display device adopts a structure of a white organic light emitting layer and a color filter (colourfilter, CF) to realize full-color display, and the color filter is used to block light rays of non-light-emitting colors in corresponding sub-pixels from transmitting out, but the arrangement of the color filter also causes partial light energy loss, affects light transmission, affects light-emitting efficiency, and reduces brightness of the display device.

Disclosure of Invention

The invention mainly aims to provide a display device, a preparation method thereof and a display device, and aims to improve the light emitting efficiency and the display brightness of the display device.

In order to achieve the above purpose, the display device provided by the invention is provided with a plurality of pixel units, wherein the pixel units comprise at least three sub-pixels which emit light with different light emission bands and emit light with different colors, the sub-pixels comprise a white light emitting element, an optical conversion unit and a light filtering unit, the optical conversion unit and the light filtering unit are sequentially arranged on the light emission side of the white light emitting element, and the color of the light filtering unit corresponds to the light emission color;

The optical conversion unit comprises at least one group of optical conversion modules, the optical conversion modules comprise super-surface structures and optical conversion structures, the super-surface structures and the optical conversion structures are arranged in a stacked mode, the optical conversion structures are used for converting at least part of light rays which are not in light-emitting wave bands into light rays in light-emitting wave bands, the interface between each super-surface structure and each optical conversion structure is a super-structure surface, and the resonance wave bands of the optical conversion modules are at least partially identical to the conversion wave bands of the optical conversion structures.

In an embodiment, the resonance band of at least one of the optical conversion modules includes an output band of the sub-pixel.

In an embodiment, the at least three sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the optical conversion unit of the sub-pixel is configured to convert at least one of the other two colors of light into light in an output light band.

In an embodiment, the optical conversion unit of the red sub-pixel includes a group of the light conversion modules, and the optical conversion structure of the light conversion module includes an optical down-conversion material for converting at least one light of a green light band and a blue light band into red light;

Or, the optical conversion unit of the red light sub-pixel comprises two groups of the light conversion modules, wherein the optical conversion structure of one group of the light conversion modules comprises an optical down-conversion material for converting light rays in a green light wave band into red light, and the optical conversion structure of the other group of the light conversion modules comprises an optical down-conversion material for converting light rays in a blue light wave band into red light.

In one embodiment, the optical conversion unit of the green subpixel includes a group of the light conversion modules, and the light conversion modules are used for converting one light of the red light wave band and the blue light wave band into green light;

Or, the optical conversion unit of the green sub-pixel comprises two groups of the light conversion modules, wherein the optical conversion structure of one group of the light conversion modules comprises an optical up-conversion material for converting light rays in a red light wave band into green light, and the optical conversion structure of the other group of the light conversion modules comprises an optical down-conversion material for converting light rays in a blue light wave band into green light.

In an embodiment, the optical conversion unit of the blue sub-pixel includes a group of the light conversion modules, and the optical conversion structure of the light conversion module includes an optical up-conversion material for converting at least one light of red light band and green light band into blue light;

Or, the optical conversion unit of the blue sub-pixel comprises two groups of the optical conversion modules, wherein the optical conversion structure of one group of the optical conversion modules comprises an optical up-conversion material for converting light rays in a red light wave band into blue light, and the optical conversion structure of the other group of the optical conversion modules comprises an optical up-conversion material for converting light rays in a green light wave band into blue light.

In an embodiment, the resonance band of the optical conversion module is one of a red light band, a blue light band and a green light band;

In the super-surface structure of the light conversion module, the height h1 of the micro-nano structure is more than or equal to 50nm and less than or equal to 300nm;

and/or the refractive index n of the super-surface structure is satisfied, wherein n is more than or equal to 1.4 and less than or equal to 2.4;

And/or the height h2 of the optical conversion structure is satisfied, wherein h2 is more than or equal to 300um and less than or equal to 2000um.

In an embodiment, in the light conversion module of the red light sub-pixel, a slit width d1 between two adjacent micro-nano structures of the super-surface structure is satisfied, and d1 is more than or equal to 350nm and less than or equal to 440nm;

and/or, in the light conversion module of the green light sub-pixel, the width d2 of a slit between two adjacent micro-nano structures of the super-surface structure is satisfied, and d2 is more than or equal to 300nm and less than or equal to 360nm;

and/or, in the light conversion module of the blue photon pixel, the width d3 of a slit between two adjacent micro-nano structures of the super-surface structure is satisfied, and d3 is more than or equal to 260nm and less than or equal to 330nm.

In an embodiment, in the optical conversion module, the optical conversion structure is disposed on a light emitting side of the super-surface structure;

or, the super-surface structure is arranged on the light emitting side of the optical conversion structure.

In an embodiment, the optical conversion structure comprises one of an optical up-conversion material and an optical down-conversion material;

Wherein the optical up-conversion material comprises at least one of quantum dots and a rare earth ion-containing compound;

and/or the optical down-conversion material comprises at least one of quantum dots, fluorescent materials, phosphorescent materials, and laser dyes.

In an embodiment, the super-structured surface includes a plurality of first micro-nano structures arranged along a first direction, the first micro-nano structures extending along a second direction, the first direction and the second direction being disposed at an included angle;

and/or the super-structured surface comprises a plurality of second micro-nano structures arranged along a first direction and a second direction which are arranged in an included angle array;

And/or the display device further comprises a first optically transparent layer arranged between the optical conversion structure and the white light emitting element;

And/or the display device further comprises a second optically transparent layer arranged between the optical conversion structure and the filter unit.

The invention also provides a display device which is provided with a plurality of pixel units, wherein the pixel units comprise at least three sub-pixels which emit light with different light emission bands and emit light with different colors, the sub-pixels comprise a white light emitting element and an optical conversion unit arranged at the light emission side of the white light emitting element, and the optical conversion unit is used for converting light rays with non-light emission bands into light rays with light emission bands;

The optical conversion unit comprises at least one group of optical conversion modules, the optical conversion modules comprise super-surface structures and optical conversion structures, the super-surface structures and the optical conversion structures are arranged in a stacked mode, the optical conversion structures are used for converting at least part of light rays which are not in light-emitting wave bands into light rays in light-emitting wave bands, the interface between each super-surface structure and each optical conversion structure is a super-structure surface, and resonance wave bands of the super-surface structures are at least partially identical to conversion wave bands of the optical conversion structures.

The present invention also proposes a method for manufacturing a display device as described in any of the preceding embodiments, the display device having at least three sub-pixels emitting light of different colors, the method comprising the steps of:

Preparing a light-emitting substrate, wherein the light-emitting substrate comprises a white light-emitting element with a plurality of sub-pixels;

And preparing a plurality of optical conversion units corresponding to the white light luminous elements one by one on the light emitting surface of the luminous substrate to form an optical conversion layer, wherein the optical conversion units comprise at least one layer of light conversion module, and the light conversion module is formed by a super-surface structure and an optical conversion structure which are arranged in a stacked mode.

In an embodiment, the step of preparing a plurality of optical conversion units corresponding to the plurality of white light emitting elements on the light emitting surface of the light emitting substrate includes:

sequentially preparing light conversion modules of different types of sub-pixels on the light emitting surface of the light emitting substrate;

When at least one optical conversion unit of the sub-pixels is provided with at least two groups of optical conversion modules, after all the optical conversion modules positioned on the same layer are prepared, preparing other optical conversion modules of the sub-pixels on the layer of optical conversion modules until all the optical conversion units are prepared.

In an embodiment, the step of sequentially preparing the light conversion modules of different types of sub-pixels on the light emitting surface of the light emitting substrate includes:

Preparing a transparent medium layer on the light-emitting surface of the light-emitting substrate;

spin coating photoresist on the transparent dielectric layer, and performing exposure etching on the target sub-pixel area by using a mask plate to form a super-structured surface pattern of the target sub-pixel;

Covering the photoresist with an optical conversion material of the target sub-pixel, and removing the photoresist and the optical conversion material of the non-target sub-pixel area to complete the preparation of the optical conversion module of the target sub-pixel;

Repeating the spin-coating photoresist and the subsequent steps to sequentially prepare the light conversion modules of the sub-pixels of different types.

spin-coating nano imprinting glue on the light-emitting surface of the light-emitting substrate, and imprinting the nano imprinting glue by using a mask plate to form super-structured surface patterns of each light conversion module on the nano imprinting glue;

Solidifying the nano-imprinting glue after imprinting to form a super-surface layer;

And sequentially preparing optical conversion structures of different types of sub-pixels on the super-surface layer to finish the preparation of optical conversion modules of the different types of sub-pixels.

In one embodiment, the step of sequentially preparing the optical conversion structures of the different types of sub-pixels on the super-surface layer includes:

Spin-coating photoresist on the super surface layer, and carrying out exposure etching on the target sub-pixel area by using a mask plate;

Covering the photoresist with an optical conversion material of the target sub-pixel, and removing the photoresist and the optical conversion material of the non-target sub-pixel area to complete the preparation of the optical conversion structure of the target sub-pixel;

Repeating the steps to sequentially prepare the optical conversion structures of other types of sub-pixels.

In an embodiment, the optical conversion structure is formed on the light emitting surface of the super surface structure by one of an inkjet printing process, a thin film deposition process and a material spin coating process.

In an embodiment, after the step of preparing a plurality of optical conversion units corresponding to the plurality of white light emitting elements one by one on the light emitting surface of the light emitting substrate to form an optical conversion layer, the method further includes:

and preparing a color filter layer on the light emitting side of the optical conversion layer, wherein the color filter layer comprises a plurality of filter units corresponding to each sub-pixel area one by one.

The invention also proposes a display device comprising a display device as described in any of the previous embodiments.

According to the technical scheme, the optical conversion units are arranged in the sub-pixels of the display device, when the white light emitted by the white light emitting element passes through the optical conversion units, at least part of light rays which are not in the light emitting wave band can be converted into light rays in the light emitting wave band through the optical conversion structures in the optical conversion units, the converted light rays can be emitted outwards through the optical filtering units, the utilization of the part of light rays is improved, and therefore the light emitting efficiency and the display brightness are improved, the unconverted light rays can be blocked by the optical filtering units and cannot be emitted outwards, and therefore the fact that each sub-pixel only emits light with a specific color is ensured.

And the optical conversion unit is provided with a super-surface structure and an optical conversion structure which are adjacently laminated to form a light conversion module, when incident light is emitted to the junction position of the super-surface structure and the optical conversion structure in the optical conversion unit, at least part of light rays in a resonance wave band of the incident light can generate an optical resonance effect, at least part of light rays generating resonance can be converted by the optical conversion structure, the absorption of the optical conversion structure to the light rays in the wave band is enhanced through the optical resonance effect, the optical conversion efficiency is improved, more light rays in the wave band are converted into light rays which can pass through the filtering unit, and the light emitting efficiency and the display brightness of the display device are further improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of a group of pixel units in an embodiment of a display device according to the present invention;

FIG. 2 is a schematic diagram illustrating the light-emitting of an embodiment of a display device according to the present invention;

FIG. 3 is a schematic diagram illustrating light emission of another embodiment of a display device according to the present invention;

FIG. 4 is a block diagram of an embodiment of an optical conversion module in a display device according to the present invention;

FIG. 5 is a block diagram of an embodiment of an optical conversion unit in a display device according to the present invention;

FIG. 6 is a block diagram of another embodiment of an optical conversion module in a display device according to the present invention;

Fig. 7 is a block diagram of another embodiment of an optical conversion unit in a display device according to the present invention.

Reference numerals illustrate:

100. The light emitting device comprises a display device, 1, a light emitting substrate, 11, a substrate, 12, a white light emitting element, 121, an anode layer, 122, a light emitting layer, 123, a common cathode layer, 13, a pixel definition layer, 14, a packaging layer, 15, a first optical transparent layer, 2, an optical conversion layer, 21, an optical conversion unit, 21a, a red light conversion unit, 21b, a green light conversion unit, 21c, a blue light conversion unit, 211, a light conversion module, 211a, a red light conversion module, 211b, a green light conversion module, 211c, a blue light conversion module, 2111, a super surface structure, 2111a, a transparent medium layer, 2111b, a first micro-nano structure, 2111c, a second micro-nano structure, 2112, an optical conversion structure, 3, a color filter layer, 31, a filter unit, 311, a red filter unit, 312, a green filter unit, 313, a blue filter unit, 4, a second optical transparent layer, 5, a pixel unit, 51, a subpixel, 511, a red subpixel, 512, a green subpixel, 513 and a blue subpixel.

The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear are referred to in the embodiments of the present invention), the directional indications are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture, and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

In order to solve the above-described problems, the present invention proposes a display device 100.

Referring to fig. 1 to 3, in an embodiment of the invention, a display device 100 has a plurality of pixel units 5, the pixel units 5 include at least three sub-pixels 51 with different light emitting wavelength bands and emitting different color light, the sub-pixels 51 include a white light emitting element 12, an optical conversion unit 21 and a filter unit 31 sequentially disposed on a light emitting side of the white light emitting element 12, the color of the filter unit 31 corresponds to the light emitting color, the optical conversion unit 21 includes at least one group of light conversion modules 211, the light conversion modules 211 include a super-surface structure 2111 and an optical conversion structure 2112 which are stacked, the optical conversion structure 2112 is used for converting at least part of light rays with non-light emitting wavelength bands into light rays with light emitting wavelength bands, an interface between the super-surface structure 2111 and the optical conversion structure 2112 is a super-structured surface, and a resonance wavelength band of the light conversion module 211 is at least partially identical to a conversion wavelength band of the optical conversion structure 2112.

In the embodiment of the present application, a plurality of pixel units 5 are disposed in an array in the display device 100, each pixel unit 5 includes at least three sub-pixels 51 with different light emission colors, and optionally, the at least three sub-pixels 51 may include a red sub-pixel 511, a blue sub-pixel 513 and a green sub-pixel 512. The sub-pixel 51 includes a white light emitting element 12, a filter unit 31 provided on the light emitting side of the white light emitting element 12, and an optical conversion unit 21 between the white light emitting element 12 and the filter unit 31.

The light-emitting substrate 1 may be disposed in the display device 100, the white light-emitting element 12 of the plurality of sub-pixels 51 is disposed on the light-emitting substrate 1, the light-emitting substrate 1 further includes a driving circuit for controlling the light emission of the white light-emitting element 12, and the driving circuit may be disposed as a thin film transistor array, where each thin film transistor corresponds to one of the white light-emitting elements 12. Optionally, the light emitting substrate 1 includes a substrate 11, a pixel defining layer 13 and a plurality of white light emitting elements 12 disposed on the substrate 11, the driving circuit layer is disposed on the substrate 11, which may be a conductive pattern formed in the substrate 11, a plurality of opening regions corresponding to the plurality of sub-pixels 51 one by one are formed in the pixel defining layer 13, the white light emitting elements 12 include an anode layer 121, a light emitting layer 122 and a cathode layer sequentially stacked, at least the anode layer 121 and the light emitting layer 122 are disposed in the opening regions, the anode layer 121 and the driving circuit layer, each white light emitting element 12 may share a cathode, and a common cathode layer 123 is disposed on a surface of the pixel defining layer 13 to cover each opening region. Alternatively, the encapsulation layer 14 may be disposed on the light-emitting surface of the common cathode layer 123 to protect each white light emitting element 12.

The color of the filter unit 31 of the sub-pixel 51 is the same as the color of the light emitted from the sub-pixel 51 to block other light rays with non-light-emitting colors from being emitted outwards, and the filter units 31 of several sub-pixels 51 may be arranged at the same level to form a color filter layer 3 in the display device 100.

The optical conversion unit 21 of the sub-pixel 51 may include one, two or more groups of light conversion modules 211, where the light conversion modules 211 include a super-surface structure 2111 formed with a super-structure surface and an optical conversion structure 2112 for converting light, the super-structure surface is located at an interface position between the super-surface structure 2111 and the optical conversion structure 2112, and refractive indexes of the super-surface structure 2111 and the optical conversion structure 2112 are different. The optical conversion structure 2112 is configured to convert at least part of light rays of a non-light-emitting band in the incident light into light rays of a light-emitting band, the optical conversion structure 2112 is provided with an optical conversion material, which may be an optical up-conversion material or an optical down-conversion material, the optical up-conversion material is configured to convert light rays of a long wavelength into light rays of a short wavelength, and may include, but is not limited to, one or at least two of a quantum dot and a compound containing rare earth ions, and the optical down-conversion material is configured to convert light rays of a short wavelength into light rays of a long wavelength, and may include, but is not limited to, one or at least two of a quantum dot, a fluorescent material, a phosphorescent material, and a laser dye.

Alternatively, in the present embodiment, the optical conversion unit 21 in the sub-pixel 51 may convert all the light rays of the non-light emitting band into the light rays of the light emitting band through one or at least two groups of the light conversion modules 211, and the optical conversion unit 21 may also convert only part of the light rays of the non-light emitting band into the light rays of the light emitting band, and the light rays which are not converted will be blocked by the optical filter unit 31 and will not be emitted outwards, so as to ensure that the sub-pixel 51 only displays the corresponding color.

Alternatively, the number of groups of light conversion modules 211 of different optical conversion units 21 may be the same or different, for example, a group of light conversion modules 211 may be disposed in the red sub-pixel 511 for converting at least one light of a green light band and a blue light band, a group of light conversion modules 211 may be disposed in the green sub-pixel 512 for converting light of a red light band or a blue light band, or two groups of light conversion modules 211 may be disposed in the green sub-pixel 512 for converting light of a red light band and light of a blue light band, respectively, and two groups of light conversion modules 211 may be disposed in the red sub-pixel 511 for converting light of a green light band and light of a blue light band, respectively. When the number of groups of the optical conversion units 21 of the different types of sub-pixels 51 is different, a transparent dielectric material may be covered on the light-emitting side of the optical conversion units 21 to planarize the light-emitting surface of the optical conversion layer 2 composed of the respective optical conversion units 21, so that the color filter layer 3 is conveniently prepared.

Optionally, the optical conversion structure 2112 may also be used to convert yellow light, orange light, and the like. The arrangement of the optical conversion structure 2112 converts the light which would be blocked by the filter unit 31 into the light which can pass through the filter unit 31, thereby improving the light extraction efficiency and being beneficial to improving the display brightness of the sub-pixel 51.

The super-surface structure 2111 includes a transparent dielectric layer 2111a and a plurality of sub-wavelength micro-nano structures arranged on the surface of the transparent dielectric layer 2111a in a periodic array, so as to form a super-structured surface, and the super-structured surface is arranged at the interface between the super-surface structure 2111 and the optical conversion unit 21. Alternatively, the transparent dielectric layer 2111a may include one or more materials of silicon dioxide, silicon nitride, and titanium dioxide, and the micro-nano structure may be formed by one of a photolithography process or a nanoimprint process. When incident light irradiates to the boundary position of the super-surface structure 2111 and the optical conversion structure 2112, partial reflection exists, the super-structure surface is arranged, so that light rays in a specific wave band generate an optical resonance effect on the super-structure surface, obvious formants or resonance valleys can be generated in a resonance wave band, the reflected light intensity after resonance can be greatly weakened, more light in the resonance wave band can be emitted outwards, and the light emitting efficiency is improved. The light conversion module 211 can generate optical resonance effect only for light rays of a specific wave band, and can also respond to light rays of a plurality of wave bands, namely each layer of super surface structure 2111 can be designed to have one or two or three or more resonance peak responses, and the resonance wave band of the light conversion module 211 can be adjusted by adjusting the arrangement period and the height of the micro-nano structure of the super surface, the thickness and the refractive index of the super surface structure 2111, the thickness and the refractive index of the optical conversion structure 2112, and the like.

For example, the light conversion module 211 may generate an optical resonance effect in response to only light in a red light band, the generated resonance peak is located in a spectrum region of the red light, the light conversion module 211 may also simultaneously respond to light in a red light band and light in a green light band to achieve dual-wavelength resonance, the resonance bands of which may be located in the green light band and the red light band, respectively, or the light conversion module 211 may simultaneously respond to light in the red light band and light in the blue light band to generate an optical resonance effect, or the light conversion module 211 may simultaneously respond to light in the red light band, the green light band, and light in the blue light band to generate an optical resonance effect.

In the embodiment of the present application, in the same light conversion module 211, the resonance band of the light conversion module 211 is at least partially the same as the band of the light that can be absorbed and converted by the optical conversion structure 2112, that is, the light in the specific band can realize optical resonance on the super-structure surface, and can also be absorbed and converted by the optical conversion structure 2112 into the light in the light emitting band, the absorption of the light in the light emitting band by the optical conversion structure 2112 is enhanced by the optical resonance effect, so as to improve the optical conversion efficiency, and enable more light in the light emitting band to be converted into the light that can pass through the optical filter unit 31, thereby further improving the light emitting efficiency and the display brightness. Alternatively, the optical conversion structure 2112 may be disposed on the light emitting side of the super surface structure 2111, or the super surface structure 2111 may be disposed on the light emitting side of the optical conversion structure 2112.

Optionally, the resonance band of the light conversion module 211 may further include an emitting band of the sub-pixel 51, so that more light in the emitting band in the white light can be emitted outwards, thereby improving the light emitting efficiency and the display brightness.

That is, in the technical solution of the present invention, by providing the optical conversion unit 21 in each sub-pixel 51 of the display device 100, when the white light emitted from the white light emitting element 12 passes through the optical conversion unit 21, at least part of the light in the non-light emitting band can be converted into the light in the light emitting band by the optical conversion structure 2112 in the optical conversion unit 21, the converted light can be emitted outwards through the optical filter unit 31, so as to improve the light emitting efficiency and the display brightness, and the unconverted light can be blocked by the optical filter unit 31 and not emitted outwards, so that each sub-pixel 51 is ensured to emit only the light of the specific color.

In addition, the optical conversion unit 21 is provided with the super-surface structure 2111 and the optical conversion structure 2112, which are adjacently stacked to form the light conversion module 211, when the incident light is directed to the boundary position between the super-surface structure 2111 and the optical conversion structure 2112 in the optical conversion unit 21, at least part of the light in the resonance band in the incident light can generate an optical resonance effect, and at least part of the light generating resonance can be converted by the optical conversion structure 2112, the absorption of the light in the band by the optical conversion structure 2112 is enhanced by the optical resonance effect, the optical conversion efficiency is improved, more light in the band is converted into light which can pass through the filter unit 31, and the light emitting efficiency and the display brightness of the display device 100 are further improved.

Referring to fig. 4, in an embodiment, in the light conversion module 211, an optical conversion structure 2112 is disposed on a light emitting side of a super surface structure 2111. In this arrangement, the incident light first passes through the super-surface structure 2111, and the light in the resonance band generates an optical resonance phenomenon on the super-structure surface to reduce the reflected light in the band, so that more light is incident into the optical conversion structure 2112 and is absorbed and converted, thereby improving the optical conversion efficiency.

In one embodiment, the super surface structures 2111 are disposed on the light emitting side of the optical conversion structures 2112. In this arrangement, light in the resonance band is absorbed by the optical conversion structure 2112 at the interface position of the optical conversion structure 2112 and the super-structure surface structure to be converted into light in the light-emitting band, and the optical conversion efficiency can be improved as well.

In one embodiment, the resonance band of the at least one light conversion module 211 includes the light emitting band of the sub-pixel 51.

In this embodiment, the optical conversion unit 21 of the sub-pixel 51 may include one, two or more groups of light conversion modules 211, and when one group of light conversion modules 211 is disposed, the resonance band of the super-surface structure 2111 in the light conversion module 211 includes the light emitting band of the sub-pixel 51 in addition to at least a part of the conversion band of the optical conversion unit 21, and when two or more groups of light conversion modules 211 are disposed, the resonance band of one group of super-surface structure 2111 may include the light emitting band, or the resonance band of at least two groups of super-surface structure 2111 may include the resonance band. By the arrangement mode, the light extraction efficiency of the light extraction wave band can be improved while the light absorption efficiency of the optical conversion structure 2112 on the converted wave band is improved.

For example, taking the red sub-pixel 511 as an example, the resonance band of the light conversion module 211 in the red sub-pixel 511 may be located in the green band and the red band, so that not only the absorption and conversion of the light in the green band may be increased, but also the light emitting efficiency in the red band may be improved. Or the resonance wave band of the light conversion module 211 in the red sub-pixel 511 can be positioned in the green wave band, the blue wave band and the red wave band, so that not only can the absorption and conversion of the light rays in the green wave band and the blue wave band be increased, but also the light ray emitting efficiency of the red wave band can be improved.

In an embodiment of the application, the optical conversion structure 2112 includes one of an optical up-conversion material and an optical down-conversion material.

In one embodiment, the optical conversion structure 2112 includes an optical up-conversion material that can absorb light of long wavelength and convert it to light of short wavelength, for example, in the blue sub-pixel 513, the optical conversion structure 2112 includes an optical up-conversion material that can convert light of at least one of red and green wavelength bands to blue light, and in the green sub-pixel 512, light of red wavelength band to green light. Optionally, the optical up-conversion material comprises at least one of quantum dots and a rare earth ion containing compound.

In one embodiment, the optical conversion structure 2112 includes an optical down-conversion material that can absorb short wavelength light and convert it to long wavelength light, for example, in the red subpixel 511, the optical conversion structure 2112 includes an optical down-conversion material that can convert light in at least one of the green and blue wavelength bands to red light, and in the green subpixel 512, light in the blue wavelength band to green light. Optionally, the optical down-conversion material comprises at least one of quantum dots, fluorescent materials, phosphorescent materials, and laser dyes.

Referring to fig. 2 and 3, in the embodiment of the application, at least three sub-pixels 51 include a red sub-pixel 511, a green sub-pixel 512 and a blue sub-pixel 513, and the optical conversion unit 21 of the sub-pixel 51 is used for converting at least one of the other two colors of light into light in an outgoing light band.

In this embodiment, each pixel unit 5 includes at least one red sub-pixel 511, at least one green sub-pixel 512 and at least one blue sub-pixel 513, and optionally, the number of the sub-pixels 51 in each pixel unit 5 may be one, two or more, for example, two or more red sub-pixels 511 may be provided, and the number of the green sub-pixels 512 and the blue sub-pixels 513 may be adjusted as required. Optionally, the pixel unit 5 may also include at least one white subpixel 51 for improving the light emitting brightness.

The red sub-pixel 511 includes a red light conversion unit 21a and a red light filtering unit 311 sequentially stacked on the light emitting side of the white light emitting element 12, the red light conversion unit 21a includes at least one group of red light conversion modules 211a, the red light conversion modules 211a include a first super-surface structure and a first optical conversion structure, which are stacked, the first optical conversion structure is used for converting at least one light of a green light band and a blue light band into red light, and converting light of the green light band and the blue light band into red light into optical down-conversion. Alternatively, a set of red light conversion modules 211a may be provided to convert light in both the green light band and the blue light band into red light, a set of red light conversion modules 211a may be provided to convert light in either the green light band or the blue light band into red light, the unconverted light may be blocked by the red filter unit 311 and not emitted outwards, and two sets of red light conversion modules 211a may be provided to convert light in both the green light band and the blue light band into red light, respectively.

The green sub-pixel 512 includes a green light conversion unit 21b and a green light filtering unit 312 sequentially stacked on the light emitting side of the white light emitting element 12, the green light conversion unit 21b includes at least one group of green light conversion modules 211b, the green light conversion modules 211b include a second super-surface structure and a second optical conversion structure stacked thereon, the second optical conversion structure is used for converting light in a red light band or a blue light band into green light, converting light in the red light band into green light into optical up-conversion, and converting light in the blue light band into green light into optical down-conversion. Alternatively, a set of green light conversion modules 211b may be provided to convert light of red light or blue light into green light, which is not converted, but is blocked by the green filter unit 312 and is not emitted outward, and two sets of green light conversion modules 211b may be provided to convert light of red light and blue light into green light, respectively.

The blue sub-pixel 513 includes a blue light conversion unit 21c and a blue light filtering unit 313 sequentially stacked on the light emitting side of the white light emitting element 12, the blue light conversion unit 21c includes at least one group of blue light conversion modules 211c, the blue light conversion modules 211c include a third super-surface structure and a third optical conversion structure stacked thereon, and the third optical conversion structure is configured to convert at least one of light in a red light band and a green light band into blue light, and light in the red light band and light in the green light band are both optically up-converted into blue light. Alternatively, a group of blue light conversion modules 211c may be provided to convert light in both red and green light bands into blue light, a group of blue light conversion modules 211c may be provided to convert light in either red or green light bands into blue light, the unconverted light may be blocked by the blue filter 313 and not emitted outwards, and two groups of blue light conversion modules 211c may be provided to convert light in both red and green light bands into blue light, respectively.

Referring to fig. 3, in one embodiment, the optical conversion unit 21 of the red sub-pixel 511 includes a set of optical conversion modules 211, and the optical conversion modules 211 are used for converting at least one of the green light band and the blue light band into the red light.

In this embodiment, only one group of light conversion modules 211 is disposed in the red sub-pixel 511 as the optical conversion unit 21, and the optical conversion structure 2112 of the group of light conversion modules 211 includes an optical down-conversion material that can be used to absorb light in the green wavelength band and convert the light into red light, and light in the blue wavelength band and other wavelength bands that are not converted are blocked by the red filter unit 311. Alternatively, the resonance band of the group of light conversion modules 211 may include only a blue light band, or may include both a red light band and a green light band, so as to improve the light emission efficiency of the red light band while improving the absorption conversion efficiency of the light of the green light band.

Or the group of light conversion modules 211 may be used for absorbing light in the blue light band and converting the light into red light, the unconverted light in the blue light band and other light bands may be blocked by the red filter unit 311, and the unabsorbed converted blue light may be blocked by the red filter unit 311 and not emitted outwards, so as to ensure that the red sub-pixel 511 emits red light outwards. Alternatively, the resonance band of the group of light conversion modules 211 may include only a blue light band, or may include both a red light band and a blue light band, so as to improve the light emission efficiency of the red light band while improving the absorption conversion efficiency of the light of the blue light band.

Or referring to fig. 3, the set of light conversion modules 211 may be used to absorb light in the green light band and the blue light band and convert the light into red light, so that more light in the white light is converted into red light that can pass through the red filter unit 311, thereby better improving the light emitting efficiency of the red sub-pixel 511, being beneficial to improving the display brightness of the red sub-pixel 511, reducing the level in the red sub-pixel 511, being beneficial to the light and thin of the display device 100, reducing the manufacturing procedure of the display device 100, reducing the damage risk in the manufacturing of the display device 100, and improving the yield compared with the mode of adopting two sets of light conversion modules 211. Optionally, the resonance bands of the group of light conversion modules 211 may include only a green light band and a blue light band, or may include a red light band, a green light band, and a blue light band at the same time, so as to improve the light emission efficiency of the red light band while improving the absorption conversion efficiency of the light of the green light band and the blue light band.

Referring to fig. 2, in one embodiment, the optical conversion unit 21 of the red sub-pixel 511 includes two groups of optical conversion modules 211, wherein one group of optical conversion modules 211 and 2112 includes an optical down-conversion material for converting light in a green light band into red light, and the other group of optical conversion modules 211 and 2112 includes an optical down-conversion material for converting light in a blue light band into red light.

In the present embodiment, two sets of light conversion modules 211 are provided to form the optical conversion unit 21 of the red sub-pixel 511, wherein the optical conversion structure 2112 of one set of light conversion modules 211 includes an optical down-conversion material that can absorb light in the green wavelength band and convert the light into red light, and the optical conversion structure 2112 of the other set of light conversion modules 211 includes an optical down-conversion material that can absorb light in the blue wavelength band and convert the light into red light. This arrangement improves the light conversion efficiency and the light extraction efficiency, and also facilitates the structural design of each layer of light conversion module 211 in the red sub-pixel 511.

Alternatively, the resonance band of the light conversion module 211 for absorbing green light may include a green light band, or may include both a red light band and a green light band, so as to improve the emission efficiency of light in the red light band while improving the absorption conversion efficiency of light in the green light band.

Optionally, the resonance band of the light conversion module 211 for absorbing blue light may include a blue light band, or may include a red light band and a blue light band at the same time, so as to improve the emission efficiency of light in the red light band while improving the absorption conversion efficiency of light in the blue light band.

In one embodiment, the optical conversion unit 21 of the green subpixel 512 includes a set of light conversion modules 211, and the light conversion modules 211 are used to convert one of the red light band and the blue light band into green light.

In this embodiment, the optical conversion unit 21 in the green sub-pixel 512 is provided with a group of optical conversion modules 211, and the optical conversion structure 2112 in the optical conversion module 211 may include an optical up-conversion material for absorbing light in the red wavelength band and converting the light into green light, so that the optical conversion structure 2112 can absorb red light and convert the light into green light for emitting, and the blue light which is not absorbed and converted is blocked by the green filter unit 312 and is not emitted outwards, thereby ensuring that the green sub-pixel 512 emits green light outwards. Optionally, the resonance band of the light conversion module 211 may include a red light band, or may include both a red light band and a green light band, so as to enhance the light absorption and conversion efficiency of the red light band and improve the light emission efficiency of the green light band.

In another embodiment, the optical conversion structure 2112 in the set of light conversion modules 211 may include an optical down-conversion material for absorbing light in the blue wavelength band and converting it into green light, so that the optical conversion structure 2112 may absorb blue light and convert it into green light for emission. Optionally, the resonance band of the group of light conversion modules 211 may include a blue light band, or may include both a blue light band and a green light band, so as to enhance the light absorption conversion efficiency of the blue light band and improve the light emission efficiency of the green light band.

Referring to fig. 2 and 3, in one embodiment, the optical conversion unit 21 of the green sub-pixel 512 includes two groups of optical conversion modules 211, wherein the optical conversion structure 2112 of one group of optical conversion modules 211 includes an optical up-conversion material for converting light in the red light band into green light, and the optical conversion structure 2112 of the other group of optical conversion modules 211 includes an optical down-conversion material for converting light in the blue light band into green light.

In this embodiment, the two groups of light conversion modules 211 respectively convert the light beams in the red light band and the blue light band into green light in the green sub-pixel 512, so that more light beams in the white light are converted into green light that can pass through the green filter unit 312, thereby better improving the light emitting efficiency of the green sub-pixel 512 and being beneficial to improving the display brightness of the green sub-pixel 512.

Referring to fig. 3, in one embodiment, the optical conversion unit 21 of the blue sub-pixel 513 includes a set of light conversion modules 211, and the light conversion modules 211 are configured to convert at least one of the green light and the red light into blue light.

In the present embodiment, only one group of light conversion modules 211 is disposed in the blue sub-pixel 513 as the optical conversion unit 21, and the optical conversion structure 2112 of the group of light conversion modules 211 includes an optical up-conversion material, which can be used to absorb light in the green wavelength band and convert the light into blue light, and light in the red wavelength band and other wavelength bands that are not converted are blocked by the blue filter unit 313. Correspondingly, the resonance wave band of the group of light conversion modules 211 comprises a green light wave band, and optionally, the resonance wave band of the group of light conversion modules 211 also comprises a blue light wave band, so as to improve the light emitting efficiency of the blue light wave band light in the white light emitted by the white light emitting element 12.

Or the group of light conversion modules 211 may be used to absorb light of red wavelength band and convert the light into blue light, and the unconverted light of red wavelength band and other wavelength bands may be blocked by the blue filter unit 313. Correspondingly, the resonance wave band of the group of light conversion modules 211 comprises a red light wave band, and optionally, the resonance wave band of the group of light conversion modules 211 also comprises a blue light wave band, so as to improve the light emitting efficiency of blue light wave band light in the white light emitted by the white light emitting element 12.

Or the group of light conversion modules 211 can be used for absorbing light rays of green light wave bands and red light wave bands and converting the light rays into blue light, so that more light rays in white light are converted into blue light which can be transmitted through the blue light filtering unit 313, the light emitting efficiency of the blue light sub-pixel 513 is better improved, the display brightness of the blue light sub-pixel 513 is improved, the level in the blue light sub-pixel 513 is reduced, the light and thin of the display device 100 is facilitated, the manufacturing procedure of the display device 100 can be reduced, the damage risk in manufacturing the display device 100 can be reduced, and the yield is improved compared with the mode of adopting two groups of light conversion modules 211. The resonance band of the light conversion module 211 includes a green light band and a red light band, and optionally, the resonance band of the light conversion module 211 may also include a blue light band.

Referring to fig. 2, in one embodiment, the optical conversion unit 21 of the blue sub-pixel 513 includes two groups of light conversion modules 211, wherein one group of light conversion modules 211 is used for converting light in a green light band into blue light, and the other group of light conversion modules 211 is used for converting light in a red light band into blue light.

In this embodiment, two sets of light conversion modules 211 are provided to form the optical conversion unit 21 of the blue sub-pixel 513, wherein the optical conversion structure 2112 of one set of light conversion modules 211 includes an optical up-conversion material that can absorb light in the green light band and convert the light into blue light, and the resonance band of the set of light conversion modules 211 may include the green light band, or may include both the blue light band and the green light band. The optical conversion structure 2112 of the other set of optical conversion modules 211 includes an optical up-conversion material that absorbs light in the red wavelength band and converts the light into blue light, and the resonance wavelength band of the set of optical conversion modules 211 may include the red wavelength band, or may include both the blue wavelength band and the red wavelength band. By the arrangement mode, the light conversion efficiency and the light emitting efficiency are improved, and meanwhile, the structural design of each layer of light conversion module 211 in the blue sub-pixel 513 is facilitated.

In an embodiment, the resonance band of the light conversion module 211 is one of a red light band, a blue light band and a green light band.

In the present embodiment, at least one group of the light conversion modules 211 implements single resonance, that is, the resonance band of the light conversion module 211 corresponds to the wavelength range of one color light, and the resonance peak generated on the super-structure surface of the light conversion module 211 is located in the spectrum interval of one color light.

Optionally, in the super-surface structure 2111 of the light conversion module 211, the height h1 of the micro-nano structure satisfies 50 nm.ltoreq.h1.ltoreq.300 nm. The height of the micro-nano structure can be arbitrarily selected from 50nm, 60nm, 80nm, 100nm, 130nm, 150nm, 200nm, 250nm, 300nm and 50nm to 300nm, and can be correspondingly adjusted according to the resonance wave band required to generate the optical resonance effect.

Optionally, the refractive index n of the super surface structure 2111 is 1.4 n.ltoreq.2.4, where the super surface structure 2111 is a transparent dielectric material and may include one or a combination of several of silicon dioxide, silicon nitride, and titanium dioxide. The refractive index of the super surface structure 2111 may be any value between 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, and 1.4 to 2.4.

Optionally, the height h2 of the optical conversion structure 2112 is 300 um.ltoreq.h2.ltoreq.2000 um. The height of the optical conversion structure 2112 may be 300um, 400um, 600um, 800um, 1000um, 1200um, 1500um, 1800um, 2000um, or any value from 300um to 2000um. It should be noted that, in the present embodiment, the height limitation of the optical conversion structure 2112 can well satisfy the requirement that the optical conversion module 211 realizes optical resonance on light rays of one wavelength band, and when the optical conversion module 211 needs to generate dual-band resonance or tri-band resonance effects, that is, optical resonance on light rays of two or three wavelength bands, the height of the optical conversion structure 2112 can be arbitrarily selected from the above ranges, or can be adjusted according to the refractive index of the super-surface structure 2111, the shape and the height of the super-structure surface, and the like.

In one embodiment, in the light conversion module 211 of the red light sub-pixel 511, the slit width d1 between two adjacent micro-nano structures of the super-surface structure 2111 is satisfied, and 350nm is equal to or less than d1 is equal to or less than 440nm. The slit width between two adjacent micro-nano structures in the red sub-pixel 511 can take any value of 350nm, 360nm, 370nm, 380nm, 390nm, 400nm, 410nm, 420nm, 430nm, 440nm and 350nm to 440nm. In the range of the value, the light conversion module 211 formed by combining the super surface structure 2111 and the optical conversion structure 2112 can generate better optical resonance on the blue light wave band or the green light wave band required to be absorbed and converted, so that the absorption and conversion efficiency is improved. Alternatively, when optical resonance of two or three wavelength bands needs to be implemented in the same optical conversion module 211, at least a portion of the slit width of the super surface structure 2111 may be set to any value in the above range, for example, when the super surface of the super surface structure 2111 is formed by a two-dimensional periodic sub-wavelength array, the slit width in one direction may be made to satisfy the above range limitation.

In one embodiment, in the light conversion module 211 of the green sub-pixel 512, the slit width d2 between two adjacent micro-nano structures of the super-surface structure 2111 is satisfied, and 300nm < d2 < 360nm. The slit width between two adjacent micro-nano structures in the green sub-pixel 512 can take any of 300nm, 310nm, 320nm, 330nm, 340nm, 350nm, 360nm and 300nm to 360nm. In the range of the value, the light conversion module 211 formed by combining the super surface structure 2111 and the optical conversion structure 2112 can generate better optical resonance on the blue light wave band or the red light wave band required to be absorbed and converted, so that the absorption and conversion efficiency is improved. Alternatively, when optical resonance of two or three wavelength bands needs to be implemented in the same optical conversion module 211, at least a portion of the slit width of the super surface structure 2111 may be set to any value in the above range, for example, when the super surface of the super surface structure 2111 is formed by a two-dimensional periodic sub-wavelength array, the slit width in one direction may be made to satisfy the above range limitation.

In one embodiment, in the light conversion module 211 of the blue sub-pixel 513, the slit width d3 between two adjacent micro-nano structures of the super-surface structure 2111 is satisfied, and 260nm < d3 > is equal to or less than 330nm. The slit width between two adjacent micro-nano structures in the blue photon pixel 513 may take any of values of 260nm, 270nm, 280nm, 290nm, 300nm, 310nm, 320nm, 330nm, and 260nm to 330nm. In the range of the value, the light conversion module 211 formed by combining the super surface structure 2111 and the optical conversion structure 2112 can generate better optical resonance on the red light wave band or the green light wave band required to be absorbed and converted, so that the absorption and conversion efficiency is improved. Alternatively, when optical resonance of two or three wavelength bands needs to be implemented in the same optical conversion module 211, at least a portion of the slit width of the super surface structure 2111 may be set to any value in the above range, for example, when the super surface of the super surface structure 2111 is formed by a two-dimensional periodic sub-wavelength array, the slit width in one direction may be made to satisfy the above range limitation.

Referring to fig. 4 and 5, in an embodiment, the super-structure surface includes a plurality of first micro-nano structures 2111b arranged along a first direction, the first micro-nano structures 2111b extend along a second direction, and the first direction and the second direction form an included angle.

In this embodiment, the super-structure surface of the super-surface structure 2111 may be formed by a one-dimensional periodic sub-wavelength array, and includes a plurality of first micro-nano structures 2111b arranged along a first direction, where the first micro-nano structures 2111b are elongated and extend along a second direction, and the first direction and the second direction may be perpendicular to each other or may be disposed at an acute angle, which is not limited herein. An optical gap is formed between two adjacent first micro-nano structures 2111b, and the distance between the two first micro-nano structures 2111b, that is, the width of the optical gap, can be correspondingly adjusted according to the resonance conversion requirement.

Referring to fig. 6 and 7, in an embodiment, the super-structure surface includes a plurality of second micro-nano structures 2111c arranged along a first direction and a second direction arranged at an angle.

In this embodiment, the super-structure surface of the super-surface structure 2111 may be composed of a two-dimensional periodic sub-wavelength array, and includes a plurality of second micro-nano structures 2111c arranged in an array along a first direction and a second direction, where the second micro-nano structures 2111c may be cylinders, cubes, cones, and other regular or irregular structures, alternatively, a space between two second micro-nano structures 2111c adjacent along the first direction may be the same as or different from a space between two second micro-nano structures 2111c adjacent along the second direction, for example, by making a space between two second micro-nano structures 2111c adjacent along the first direction different from a distance between two second micro-nano structures 2111c adjacent along the second direction so as to respectively correspond to two resonance bands, so as to improve design flexibility.

In an embodiment, the display device 100 further includes a first optical transparent layer 15 disposed between the optical conversion structure 2112 and the white light emitting element 12, where the first optical transparent layer 15 may be a transparent resin or other transparent polymer, and the first optical transparent layer 15 may planarize a surface of the light emitting substrate 1 provided with the plurality of white light emitting elements 12, so as to facilitate the arrangement of the optical conversion unit 21, reduce a height difference of the light emitting surface of each sub-pixel 51, and improve the light emitting effect.

In an embodiment, the display device 100 further comprises a second optically transparent layer 4 arranged between the optical conversion structure 2112 and the filter unit 31. The second optical transparent layer 4 may be a transparent resin or other transparent polymer, and the second optical transparent layer 4 may reduce a height difference of the light emitting surfaces of the optical conversion units 21, so as to planarize the light emitting surface of the optical conversion layer 2 formed by the optical conversion units 21, so as to facilitate the arrangement of the light filtering unit 31 and improve the light emitting effect.

The technical scheme of the application will be illustrated in the following specific examples.

Referring to fig. 2, in the first embodiment of the present invention, a plurality of white light emitting elements 12 are formed on a light emitting substrate 1, and a red sub-pixel 511 includes two groups of light conversion modules 211 stacked together, wherein an optical conversion structure 2112 in one group of light conversion modules 211 is provided with an optical down-conversion material capable of converting green light into red light, the group of light conversion modules 211 has obvious resonance peaks or resonance valleys in a green light band, and the absorption of the light of the green light band by the light conversion modules 211 can be improved by the optical resonance effect, so that the conversion efficiency of converting green light into red light can be improved. The other group of light conversion modules 211 is provided with an optical down-conversion material capable of converting blue light into red light, the group of light conversion modules 211 has obvious resonance peaks or resonance valleys in a blue light wave band, and the absorption of light in the blue light wave band can be improved through an optical resonance effect, so that the conversion efficiency of converting blue light into red light is improved. In the light conversion module 211 of the red light sub-pixel 511, the refractive index n of the super surface structure 2111 satisfies 1.4 n 2.4, the height h of the micro-nano structure of the super surface structure 2111 satisfies 50nm h1 300nm, the slit width d1 between two adjacent micro-nano structures satisfies 350nm d1 440nm, and the height h2 of the optical conversion structure 2112 satisfies 300um h2 2000um.

The green-photon pixel 512 includes two groups of light conversion modules 211 stacked, wherein an optical conversion structure 2112 in one group of light conversion modules 211 is provided with an optical up-conversion material capable of converting red light into green light, the group of light conversion modules 211 has obvious formants or resonance valleys in a red light wave band, and the absorption of the light of the red light wave band by the light conversion modules 211 can be improved through an optical resonance effect, so that the conversion efficiency of converting red light into green light is improved. The other group of light conversion modules 211 is provided with an optical down-conversion material capable of converting blue light into green light, the group of light conversion modules 211 has obvious resonance peaks or resonance valleys in a blue light wave band, and the absorption of light rays in the blue light wave band can be improved through an optical resonance effect, so that the conversion efficiency of converting blue light into green light is improved. In the light conversion module 211 of the green sub-pixel 512, the refractive index n of the super surface structure 2111 satisfies 1.4 n 2.4, the height h1 of the micro-nano structure of the super surface structure 2111 satisfies 50nm 300nm, the slit width d2 between two adjacent micro-nano structures satisfies 300nm d2 360nm, and the height h2 of the optical conversion structure 2112 satisfies 300um h2 2000um.

The blue sub-pixel 513 includes two groups of light conversion modules 211 stacked, wherein an optical conversion structure 2112 in one group of light conversion modules 211 is provided with an optical up-conversion material capable of converting red light into blue light, the group of light conversion modules 211 has obvious formants or resonance valleys in a red light band, and the absorption of the light conversion modules 211 to the light of the red light band can be improved through an optical resonance effect, so that the conversion efficiency of converting red light into blue light is improved. The other group of light conversion modules 211 is provided with an optical up-conversion material capable of converting green light into blue light, the group of light conversion modules 211 has obvious resonance valleys in a green light wave band, and the absorption of the light conversion modules 211 to the light of the green light wave band can be improved through an optical resonance effect, so that the conversion efficiency of converting green light into green light is improved. In the light conversion module 211 of the blue photon pixel 513, the refractive index n of the super surface structure 2111 satisfies 1.4 n 2.4, the height h1 of the micro-nano structure of the super surface structure 2111 satisfies 50nm h1 300nm, the slit width d3 between two adjacent micro-nano structures satisfies 260nm d3 330nm, and the height h2 of the optical conversion structure 2112 satisfies 300um h2 2000um.

In the second embodiment of the present invention, the optical conversion unit 21 of the red sub-pixel 511 includes a group of optical conversion modules 211, and the optical conversion structure 2112 in the group of optical conversion modules 211 is provided with an optical down-conversion material capable of converting green light and blue light into red light, and the group of optical conversion modules 211 can achieve optical resonance effects of two wavelength bands of green light and blue light, that is, at least one resonance peak or resonance valley in a spectral region of green light and blue light, and in addition, the group of optical conversion modules 211 can achieve optical resonance effects of three wavelength bands of red light, green light and blue light, that is, at least one resonance peak or resonance valley in a spectral region of green light, blue light and red light, thereby not only improving light absorption conversion efficiency of the green light and blue light but also improving light emission efficiency of the red light.

The optical conversion unit 21 of the green subpixel 512 includes a group of light conversion modules 211, and the optical conversion structure 2112 of the group of light conversion modules 211 is provided with an optical up-conversion material capable of converting red light into green light, and can achieve an optical resonance effect of a red light band or an optical resonance effect of light rays of two bands of the red light band and the green light band, thereby not only improving the absorption conversion efficiency of light rays of the red light band but also improving the light ray emission efficiency of the green light band. Or the optical conversion structure 2112 of the light conversion module 211 is provided with a down-conversion material capable of converting blue light into blue light, and the optical conversion unit 21 can realize an optical resonance effect of a blue light band or an optical resonance effect of light rays of two bands of green light band and blue light band, thereby not only improving the absorption conversion efficiency of light rays of the blue light band, but also improving the light ray emission efficiency of the green light band.

The optical conversion unit 21 of the blue sub-pixel 513 includes a group of optical conversion modules 211, and the optical conversion structure 2112 in the group of optical conversion modules 211 is provided with an optical down-conversion material capable of converting red light and green light into blue light, and the optical conversion unit 21 can achieve optical resonance effects of two bands of red light band and green light band, and also can achieve optical resonance effects of three bands of red light band, green light band and blue light band, thereby not only improving light absorption conversion efficiency of the red light band and the green light band, but also improving light emission efficiency of the blue light band.

Referring to fig. 3, in the third embodiment of the present invention, the arrangement structure of the red sub-pixel 511 and the blue sub-pixel 513 is the same as that of the second embodiment, and the green sub-pixel 512 includes two groups of light conversion modules 211 stacked, wherein the optical conversion structure 2112 in one group of light conversion modules 211 is provided with an optical up-conversion material capable of converting red light into green light, and the group of light conversion modules 211 has obvious resonance peaks or resonance valleys in the red light band, so that the absorption of the light conversion modules 211 to the light of the red light band can be improved by the optical resonance effect, and the conversion efficiency of converting red light into green light can be improved; the optical resonance effects of the light rays in the red light wave band and the green light wave band can be achieved by the light conversion module 211, and obvious resonance peaks or resonance valleys are formed in the red light wave band and the green light wave band, so that the absorption conversion efficiency of the light rays in the red light wave band can be improved, and the emergent efficiency of the light rays in the green light wave band can also be improved. The other group of light conversion modules 211 is provided with an optical down-conversion material capable of converting blue light into green light, the group of light conversion modules 211 has obvious resonance valleys in a blue light wave band, the absorption of light rays in the blue light wave band can be improved through an optical resonance effect, the conversion efficiency of converting blue light into green light is improved, the group of light conversion modules 211 can also realize the optical resonance effect of light rays in two wave bands of the blue light wave band and the green light wave band, and the group of light conversion modules 211 has obvious resonance peaks or resonance valleys in the blue light wave band and the green light wave band, so that the absorption conversion efficiency of light rays in the blue light wave band can be improved, and the emission efficiency of light rays in the green light wave band can also be improved.

The application also provides a display device 100, the display device 100 is provided with a plurality of pixel units 5, each pixel unit 5 comprises at least three sub-pixels 51 which emit light with different light emission bands, each sub-pixel 51 comprises a white light emitting element 12 and an optical conversion unit 21 arranged on the light emission side of the white light emitting element 12, each optical conversion unit 21 is used for converting light rays with non-light emission bands into light rays with the light emission bands, each optical conversion unit 21 comprises at least one group of light conversion modules 211, each light conversion module 211 comprises a super-surface structure 2111 and an optical conversion structure 2112 which are arranged in a stacked mode, each optical conversion structure 2112 is used for converting at least part of light rays with the light emission bands into light rays with the light emission bands, the interface between each super-surface structure 2111 and each optical conversion structure 2112 is a super-structured surface, and the resonance band of each super-surface structure 2111 is at least partially identical with the conversion band of each optical conversion structure 2112.

Specifically, the specific arrangement of the white light emitting element 12 and the optical conversion unit 21 refers to the foregoing embodiments, and will not be described herein. In this embodiment, each sub-pixel 51 in the display device 100 converts all the other light rays in the non-light emitting band into the light rays in the light emitting band through the optical conversion unit 21, so that each sub-pixel 51 emits the light rays with the corresponding color, which can sufficiently reduce the light loss in the light emitting process, improve the light emitting efficiency and the display brightness, and can eliminate the need of the filter unit 31.

For the red sub-pixel 511, only one group of light conversion modules 211 may be provided to convert light of green light and blue light into red light, or two groups of light conversion modules 211 may be provided to convert light of green light and blue light into red light, respectively. For the blue sub-pixel 513, only one set of the light conversion modules 211 may be provided to convert light of red and green bands into blue light, or two sets of the light conversion modules 211 may be provided to convert light of red and green bands into blue light, respectively. For the green sub-pixel 512, two sets of light conversion modules 211 are required to convert light in the red wavelength band and the blue wavelength band into green light, respectively. The structure of the display device 100 in this embodiment may be correspondingly set with reference to the previous embodiment, and will not be described herein.

The present application also proposes a method of manufacturing a display device 100 for manufacturing a display device 100 as in any of the previous embodiments, the display device 100 having at least three sub-pixels 51 emitting light of different colors, the method comprising the steps of:

In step S10, a light-emitting substrate 1 is prepared, wherein the light-emitting substrate 1 includes white light-emitting elements 12 of a plurality of sub-pixels 51.

In this embodiment, a Thin Film Transistor (TFT) array is fabricated on a substrate 11 to form a driving circuit layer, then a pixel defining layer 13 is prepared on the substrate 11, which has completed TFT packaging, the pixel defining layer 13 may be formed by inkjet printing, evaporation, etc., the pixel defining layer 13 has a plurality of opening regions corresponding to the plurality of sub-pixels 51 one by one after patterning, an anode layer 121 and an organic light emitting layer 122 of a white light emitting element 12 are disposed in the opening regions, and then a common cathode layer 123 is prepared to cover the organic light emitting layer 122 and the pixel defining layer 13, thereby forming the white light emitting element 12 distributed in each opening region. Optionally, a first transparent dielectric layer 2111a may be disposed on the light-emitting surface of the common cathode layer 123, which is beneficial for flattening the light-emitting surface of the light-emitting substrate 1.

In step S20, a plurality of optical conversion units 21 corresponding to the white light emitting elements 12 one by one are prepared on the light emitting surface of the light emitting substrate 1 to form the optical conversion layer 2, where the optical conversion units 21 include at least one layer of light conversion module 211, and the light conversion module 211 is formed by a stacked super surface structure 2111 and an optical conversion structure 2112.

After the preparation of the light emitting substrate 1 is completed, the optical conversion units 21 of the sub-pixels 51 are prepared on the light emitting surface of the light emitting substrate 1, and the optical conversion units 21 of the sub-pixels 51 are combined to form one optical conversion layer 2, wherein the optical conversion unit 21 of each sub-pixel 51 may include one group, two groups or more than two groups of light conversion modules 211. The light conversion module 211 includes a super surface structure 2111 and an optical conversion structure 2112 which are stacked, and the super surface structure 2111 of the same level in each sub-pixel 51 can be prepared first to form a super surface layer, then the optical conversion structures 2112 of different sub-pixels 51 are respectively prepared on the super surface layer, for example, a nano imprinting process is adopted, a mask plate with a super structure surface pattern of each sub-pixel 51 prepared in advance is used for imprinting, patterns of each super surface structure 2111 are formed simultaneously, and after nano glue is solidified, the super surface layer is formed. In addition, after the super surface structure 2111 and the optical conversion structure 2112 of one sub-pixel 51 are sequentially prepared to form the optical conversion module 211 of the sub-pixel 51, the super surface structure 2111 and the optical conversion structure 2112 of another sub-pixel 51 may be prepared, and the detailed description is omitted herein with reference to the following embodiments.

By arranging the optical conversion unit 21, when the white light emitted from the white light emitting element 12 passes through the optical conversion unit 21, at least part of light rays with non-light emitting wave bands can be converted into light rays with light emitting wave bands through the optical conversion structure 2112 in the optical conversion unit 21, the converted light rays can be emitted outwards through the optical filter unit 31, the utilization of the part of light rays is improved, the light emitting efficiency and the display brightness are improved, the unconverted light rays can be blocked by the optical filter unit 31 and can not be emitted outwards, and accordingly, each sub-pixel 51 is ensured to emit light with a specific color only.

In addition, the optical conversion unit 21 is provided with the super-surface structure 2111 and the optical conversion structure 2112 which are adjacently stacked to form the optical conversion module 211, when the incident light is directed to the boundary position between the super-surface structure 2111 and the optical conversion structure 2112 in the optical conversion unit 21, at least part of the light in the resonance band can generate an optical resonance effect, and at least part of the light generating resonance can be converted by the optical conversion structure 2112, the absorption of the light in the band by the optical conversion structure 2112 is enhanced by the optical resonance effect, the optical conversion efficiency is improved, and more light in the band is converted into light which can pass through the optical filter unit 31, so that the light emitting efficiency and the display brightness of the display device 100 are further improved.

In an embodiment, the step S20 of preparing the plurality of optical conversion units 21 corresponding to the plurality of white light emitting elements 12 one by one on the light emitting surface of the light emitting substrate 1 includes:

Step S21, sequentially preparing light conversion modules 211 of different types of sub-pixels 51 on the light-emitting surface of the light-emitting substrate 1;

In step S22, when at least one optical conversion unit 21 of the sub-pixel 51 has at least two groups of optical conversion modules 211, after all optical conversion modules 211 located on the same layer are prepared, other optical conversion modules 211 of the sub-pixel 51 are prepared on the layer of optical conversion modules 211 until all optical conversion units 21 are prepared.

In the embodiment of the present application, the optical conversion unit 21 of the sub-pixel 51 may include one, two or more groups of light conversion modules 211. After the light conversion modules 211 of the red sub-pixel 511, the light conversion modules 211 of the green sub-pixel 512 and the light conversion modules 211 of the blue sub-pixel 513 are prepared in any order on the light emitting substrate 1 to form a complete film layer, the light conversion modules 211 of other levels are prepared on the film layer, for example, if the red sub-pixel 511, the green sub-pixel 512 and the blue sub-pixel 513 all have the second group of light conversion modules 211, the second group of light conversion modules 211 of each sub-pixel 51 are sequentially prepared above the prepared film layer, so that the light conversion modules 211 of different levels are prepared layer by layer, and the yield of the preparation of the display device 100 is improved, wherein if only some sub-pixels 51 such as the green sub-pixel 512 have the second group of light conversion modules 211, after the second group of light conversion modules 211 of the green sub-pixel 512 are prepared, the optical transparent layer can be prepared on the other sub-pixels 51 to reduce the height difference of each optical conversion unit 21, so that the light emitting surface of the optical conversion layer 2 formed by each optical conversion unit 21 is flattened.

In an embodiment, the step S21 of sequentially preparing the light conversion modules 211 of the different types of sub-pixels 51 on the light emitting surface of the light emitting substrate 1 includes:

step S211, preparing a transparent dielectric layer 2111a on the light emitting surface of the light emitting substrate 1;

step S212, spin coating photoresist on the transparent dielectric layer 2111a, and performing exposure etching on the target sub-pixel area by using a mask plate to form a super-structured surface pattern of the target sub-pixel;

Step S213, covering the photoresist with the optical conversion material of the target sub-pixel, and removing the photoresist and the optical conversion material of the non-target sub-pixel region to complete the preparation of the optical conversion module 211 of the target sub-pixel;

step S214, repeating the spin-coating photoresist and the subsequent steps to sequentially prepare the light conversion modules 211 of different types of sub-pixels 51.

In this embodiment, the light conversion modules 211 of the various sub-pixels 51 are sequentially prepared through a photolithography process, the transparent dielectric layer 2111a in the super-surface structure 2111 is prepared on the light-emitting surface of the light-emitting substrate 1, then photoresist is spin-coated on the transparent dielectric layer 2111a, the mask plate is used to perform exposure etching of the required super-surface structure 2111 on the photoresist to form the required super-surface structure 2111, then the photoresist is coated with the optical conversion material required in the currently prepared light conversion module 211 through one of an inkjet printing process, a thin film deposition process and a material spin-coating process, and the photoresist and the optical conversion material thereon in other sub-pixel areas are removed, thereby completing the preparation of the light conversion module 211 in the target area. Taking the example of preparing the red photon pixel 511 first, after completing the preparation of the first group of light conversion modules 211 of the red photon pixel 511, recoating photoresist on the transparent dielectric layer 2111a, performing exposure etching by using a mask plate to form a super-surface structure 2111 of the green photon pixel 512 or the blue photon pixel 513, covering the corresponding optical conversion material, removing the photoresist and the optical conversion material in other areas to form the light conversion modules 211 of the second seed pixel 51, and repeating the steps to complete the light conversion modules 211 of the third seed pixel 51.

When the sub-pixel 51 has two sets of light conversion modules 211, the above-mentioned preparation of the transparent dielectric layer 2111a and subsequent processes are repeated on the first film layer that has been prepared until the preparation of all the optical modules is completed.

Step S215, spin-coating nano-imprinting glue on the light-emitting surface of the light-emitting substrate 1, and imprinting the nano-imprinting glue by using a mask plate to form super-structured surface patterns of each light conversion module 211 on the nano-imprinting glue;

step S216, solidifying the stamped nano stamping glue to form a super surface layer;

in step S217, the optical conversion structures 2112 of the different types of sub-pixels 51 are sequentially prepared on the super-surface layer to complete the preparation of the optical conversion modules 211 of the different types of sub-pixels 51.

In this embodiment, the super surface structures 2111 in the light conversion modules 211 of the same layer are formed synchronously by a nano transfer process, firstly, nano imprint glue, which may be epoxy resin or other easily solidified materials, is spin-coated on the light emitting surface of the light emitting substrate 1, the nano imprint glue is imprinted by using a mask plate with the super surface patterns of the light conversion modules 211 to form the super surface patterns of the light conversion modules 211 on the nano imprint glue, and the nano imprint glue with the patterns is solidified by thermal curing or ultraviolet curing according to the material characteristics of the nano imprint glue, so that the preparation of the super surface structures 2111 of the light conversion modules 211 is completed to form the super surface layer. The corresponding optical conversion material may then be covered in the corresponding regions of each sub-pixel 51 to sequentially form the optical conversion structures 2112 of each sub-pixel 51, and the optical conversion material may be sequentially prepared on the super-surface layer using one of an inkjet printing process, a thin film deposition process, and a material spin-coating process.

In an embodiment, the step S217 of sequentially preparing the optical conversion structures 2112 of the different types of sub-pixels 51 on the super-surface layer includes:

step S2171, spin coating photoresist on the super surface layer, and carrying out exposure etching on the target sub-pixel area by using a mask plate;

step S2172, covering the photoresist with the optical conversion material of the target sub-pixel, and removing the photoresist and the optical conversion material of the non-target sub-pixel region to complete the preparation of the optical conversion structure 2112 of the target sub-pixel;

step S2173, repeating the above steps, sequentially preparing the optical conversion structures 2112 of the other types of sub-pixels 51.

In this embodiment, each optical conversion structure 2112 is formed on the super surface layer by using a photolithography process, photoresist is spin-coated on the super surface layer, exposure etching is performed on the target sub-pixel region by using a mask plate, then the photoresist is covered with an optical conversion material required in the currently prepared optical conversion module 211 by one of an inkjet printing process, a thin film deposition process and a material spin-coating process, and the photoresist and the optical conversion material thereon in other sub-pixel regions are removed, thereby completing the preparation of the target region optical conversion module 211. Taking the example of preparing the red sub-pixel 511 first, after completing the preparation of the optical conversion structure 2112 of the red sub-pixel 511, coating photoresist on the super surface layer again, performing exposure etching on the corresponding region of the green sub-pixel 512 or the blue sub-pixel 513 by using a mask plate, covering the corresponding optical conversion material, removing the photoresist and the optical conversion material in other regions to form the optical conversion module 211 of the second sub-pixel 51, and repeating the above steps to complete the optical conversion module 211 of the third sub-pixel 51.

Optionally, the optical conversion structure 2112 is formed on the light emitting surface of the super surface structure 2111 by one of an inkjet printing process, a thin film deposition process and a material spin coating process.

In an embodiment, after the step of preparing the plurality of optical conversion units 21 corresponding to the plurality of white light emitting elements 12 one by one on the light emitting surface of the light emitting substrate 1 to form the optical conversion layer 2, the method further includes:

in step S30, a color filter layer 3 is prepared on the light emitting side of the optical conversion layer 2, where the color filter layer 3 includes a plurality of filter units 31 corresponding to the sub-pixel regions one by one.

In the present embodiment, after the preparation of the optical conversion units 21 of the respective sub-pixels 51 is completed to form the optical conversion layer 2, the filter units 31 of the corresponding colors are prepared corresponding to the respective sub-pixel regions on the light emitting side of the optical conversion layer 2 to form the color filter layer 3, and the color filter layer 3 may be formed by one of coating, thin film deposition, vapor deposition, and an inkjet process. By the arrangement of the color filter layer 3, it is ensured that each sub-pixel 51 emits light of only a specific color.

The invention also proposes a display device comprising a display device 100 as in any of the previous embodiments. The display device may be, but is not limited to, a cell phone, a tablet computer, a notebook computer, a desktop display, a television, and head-mounted display devices such as AR (Augmented Reality) glasses, VR (Virtual Reality) glasses, and MR (Mixed Reality) glasses. The specific structure of the display device 100 refers to the above embodiment, and since the present display device adopts all the technical solutions of all the embodiments, at least the technical solutions of the embodiments have all the beneficial effects, which are not described in detail herein.

The foregoing description is only exemplary embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present invention.

Claims

1. The display device is characterized by comprising a plurality of pixel units, wherein each pixel unit comprises at least three sub-pixels which emit light with different colors and different light emission bands, each sub-pixel comprises a white light emitting element, an optical conversion unit and a light filtering unit, wherein the optical conversion units and the light filtering units are sequentially arranged on the light emission side of the white light emitting element, and the colors of the light filtering units correspond to the light emission colors;

The optical conversion unit comprises at least one group of optical conversion modules, the optical conversion modules comprise super-surface structures and optical conversion structures which are arranged in a stacked mode, the optical conversion structures are arranged on the light emergent side of the super-surface structures, the refractive indexes of the super-surface structures are different from that of the optical conversion structures, the optical conversion structures are used for converting at least part of light rays which are not in the light emergent wave band into light rays in the light emergent wave band, the interface between the super-surface structures and the optical conversion structures is a super-structure surface, and the resonance wave band of the optical conversion modules is at least partially identical to the conversion wave band of the optical conversion structures;

at least part of light rays in a resonance wave band generate an optical resonance effect on the super-structure surface, and at least part of the light rays generating resonance are converted into light rays in an outgoing wave band by the optical conversion structure.

2. The display device of claim 1, wherein the resonance band of at least one of the light conversion modules comprises an exit band of the sub-pixel.

3. The display device of claim 1, wherein the at least three sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the optical conversion unit of the sub-pixel is configured to convert at least one of the other two colors of light into light in an output light band.

4. A display device as claimed in claim 3, characterized in that the optical conversion unit of the red sub-pixel comprises a set of the light conversion modules, the optical conversion structure of the light conversion modules comprising an optical down-conversion material for converting at least one light of the green and blue wavelength band into red light;

5. A display device as claimed in claim 3, characterized in that the optical conversion unit of the green sub-pixel comprises a set of the light conversion modules for converting one of the red light band and the blue light band into green light;

6. A display device as claimed in claim 3, characterized in that the optical conversion unit of the blue sub-pixel comprises a set of the light conversion modules, the optical conversion structure of the light conversion modules comprising an optical up-conversion material for converting at least one of the light in the red and green wavelength band into blue light;

7. The display device of claim 3, wherein the resonance band of the light conversion module is one of a red light band, a blue light band, and a green light band;

wherein, in the super surface structure of the light conversion module, the height h1 of the micro-nano structure is satisfied, and h1 is more than or equal to 50nm and less than or equal to 300nm;

8. The display device according to claim 7, wherein in the light conversion module of the red light sub-pixel, a slit width d1 between two adjacent micro-nano structures of the super-surface structure is satisfied, and d1 is not less than 350nm and not more than 440nm;

9. A display device as claimed in any one of claims 1 to 8, characterized in that the optical conversion structure comprises one of an optical up-conversion material and an optical down-conversion material;

10. A display device as claimed in any one of claims 1 to 8, wherein the super-structured surface comprises a plurality of first micro-nano structures arranged along a first direction, the first micro-nano structures extending along a second direction, the first direction being disposed at an angle to the second direction;

11. The display device is characterized by comprising a plurality of pixel units, wherein each pixel unit comprises at least three sub-pixels which emit light with different light emission bands and emit light with different colors, each sub-pixel comprises a white light emitting element and an optical conversion unit arranged on the light emission side of the white light emitting element, and the optical conversion unit is used for converting all light rays which do not emit light bands into light rays with light emission bands;

The optical conversion unit comprises at least one group of optical conversion modules, the optical conversion modules comprise a super-surface structure and an optical conversion structure which are arranged in a stacked mode, the optical conversion structure is arranged on the light emitting side of the super-surface structure, the refractive index of the super-surface structure is different from that of the optical conversion structure, the optical conversion structure is used for converting at least part of light rays which are not emitted into light waves into light rays which are emitted into the light waves, the interface between the super-surface structure and the optical conversion structure is a super-structure surface, and the resonance wave band of the super-surface structure is at least partially identical with the conversion wave band of the optical conversion structure;

12. A method of manufacturing a display device having at least three sub-pixels emitting light of different colors for manufacturing the display device according to any one of claims 1 to 11, the method comprising the steps of:

13. The method of manufacturing a white light emitting device according to claim 12, wherein the step of manufacturing a plurality of optical conversion units corresponding to the plurality of white light emitting elements one by one on the light emitting surface of the light emitting substrate comprises:

14. The method of claim 13, wherein the step of sequentially preparing the light conversion modules of the different types of sub-pixels on the light emitting surface of the light emitting substrate comprises:

15. The method of claim 13, wherein the step of sequentially preparing the light conversion modules of the different types of sub-pixels on the light emitting surface of the light emitting substrate comprises:

16. The method of manufacturing as claimed in claim 15, wherein the step of sequentially manufacturing the optical switching structures of the different types of sub-pixels in the super-surface layer comprises:

Step S2172, covering the photoresist with the optical conversion material of the target sub-pixel, and removing the photoresist and the optical conversion material of the non-target sub-pixel area to complete the preparation of the optical conversion structure of the target sub-pixel;

the above steps S2171 and S2172 are repeated to sequentially prepare the optical conversion structures of the other types of sub-pixels.

17. The method of claim 12, wherein the optical conversion structure is formed on the light-emitting surface of the super-surface structure by one of an inkjet printing process, a thin film deposition process, and a material spin-coating process.

18. The method according to any one of claims 12 to 17, wherein after the step of preparing a plurality of optical conversion units corresponding to the plurality of white light emitting elements one to one on the light emitting surface of the light emitting substrate to form the optical conversion layer, further comprising:

19. A display apparatus, characterized in that the display apparatus comprises a display device as claimed in any one of claims 1 to 11.