CN118866759B - Chip fixing device for chip processing equipment - Google Patents
Chip fixing device for chip processing equipment Download PDFInfo
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- CN118866759B CN118866759B CN202410907600.XA CN202410907600A CN118866759B CN 118866759 B CN118866759 B CN 118866759B CN 202410907600 A CN202410907600 A CN 202410907600A CN 118866759 B CN118866759 B CN 118866759B
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- 238000001816 cooling Methods 0.000 claims abstract description 163
- 239000000463 material Substances 0.000 claims abstract description 53
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 230000001105 regulatory effect Effects 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims description 36
- 238000012544 monitoring process Methods 0.000 claims description 25
- 238000003860 storage Methods 0.000 claims description 23
- 238000005192 partition Methods 0.000 claims description 16
- 230000033001 locomotion Effects 0.000 claims description 13
- 238000003756 stirring Methods 0.000 claims description 11
- 238000004458 analytical method Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 3
- 238000012417 linear regression Methods 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims 1
- 230000001276 controlling effect Effects 0.000 abstract description 8
- 239000000126 substance Substances 0.000 description 19
- 230000000875 corresponding effect Effects 0.000 description 12
- 239000007921 spray Substances 0.000 description 12
- 230000002596 correlated effect Effects 0.000 description 10
- 238000003825 pressing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000883990 Flabellum Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a chip fixing device for chip processing equipment, which belongs to the technical field of chip processing and comprises a bearing table, a device body, a temperature adjusting mechanism, a positioning assembly and a regulating system, wherein the temperature adjusting mechanism is used for adjusting the temperature of a fixing material paved on the bearing surface of the bearing table and adjusting the temperature of a processing area of a chip during chip processing, the humidity adjusting mechanism is used for adjusting the humidity of the environment where the fixing material paved on the bearing surface of the bearing table is located, the positioning assembly is used for positioning and limiting the chip, the regulating system is used for adjusting the temperature and the humidity of the environment where the fixing material is located by controlling the temperature adjusting mechanism and the humidity adjusting mechanism, the temperature adjusting mechanism comprises a heater and a cooling assembly, and the chip can be quickly fixed on the bearing table under the proper temperature and humidity of the fixing material, and meanwhile, the chip can be precisely cooled in the local area where the fixing material is located during chip processing.
Description
Technical Field
The invention belongs to the technical field of chip processing, and particularly relates to a chip fixing device for chip processing equipment.
Background
Integrated circuits, also known as microcircuits, microchips, and die/chips, are a form of miniaturization that has been commonly manufactured on semiconductor wafer surfaces, primarily including semiconductor devices, as well as passive components.
The chip is generally limited and installed on the bearing table surface by adopting a fixing material for processing, and the performance of the fixing material is influenced by the humidity and the temperature of the environment, so that the fixing material is required to be caused to be at a proper temperature and under a proper humidity condition, the chip can be rapidly limited and fixed, and meanwhile, when the chip is processed, the chip is generally cooled in a comprehensive cooling mode, and resources are wasted.
The chip fixing device for the chip processing equipment can provide proper temperature and humidity, promote the chip to be fast fixed on the bearing table surface through the fixing material, and simultaneously can accurately cool the local area of chip processing.
Disclosure of Invention
The invention provides a chip fixing device for chip processing equipment, which solves the problems.
The chip fixing device for the chip processing equipment comprises a bearing table and a device body, wherein the bearing table is arranged in the device body, and a sealing cover body for sealing the inner space of the device body is arranged on the device body, and the chip fixing device further comprises:
The temperature adjusting mechanism is arranged on the bearing table and is used for adjusting the temperature of the fixed material paved on the bearing surface of the bearing table and adjusting the temperature of a processing area of the chip during chip processing;
the humidity adjusting mechanism is arranged on the bearing table and used for adjusting the humidity of the environment where the fixed materials paved on the bearing surface of the bearing table are located;
the positioning assembly is arranged on the bearing table and used for positioning and limiting the chip;
the regulation and control system regulates the temperature and the humidity of the environment where the fixed material is positioned by controlling the temperature regulating mechanism and the humidity regulating mechanism;
Wherein, temperature adjustment mechanism includes the heater, the heater is installed inboard at the chip upper end, still includes:
the cooling assembly is arranged on the bearing table and is used for cooling the fixed materials paved on the bearing surface of the bearing table;
The cooling assembly comprises a partition plate, a first valve member and a first temperature sensor, wherein the partition plate is arranged in a third cavity formed in a bearing table and is fixedly connected with the bearing table, the partition plate divides the third cavity into a second cooling cavity comprising a first cooling cavity and a plurality of second cooling cavities which are distributed in a rectangular shape, the first cooling cavity is communicated with the second cooling cavity through the first valve member arranged on the partition plate, the plurality of first temperature sensors are correspondingly arranged in the second cooling cavities, and the first temperature sensors are embedded and fixedly connected inside the upper end of the bearing table and further comprise:
and the cooling unit is arranged on the bearing table and used for guiding the gas cooling substance and the liquid cooling substance into the first cooling cavity and mixing the gas cooling substance and the liquid cooling substance.
Based on the technical scheme, the invention also provides the following optional technical schemes:
The cooling unit comprises a cooling cylinder, a cooling pipe and a second piston plate, wherein the two cooling cylinders are symmetrically arranged on a bearing table and are communicated with a first cooling cavity through first atomizing spray heads arranged at the inner side end parts, the cooling pipe is rotationally connected to the cooling cylinder, the second piston plate and the cooling cylinder slide in a limiting manner, a pushing column in sliding fit with a spiral groove formed in the cooling pipe is fixedly connected to the second piston plate, the cooling pipe is communicated with a second cooling cavity, the second piston plate divides a cavity in the cooling cylinder into an air cavity and a liquid cavity, the cooling pipe is communicated with the air cavity through a second valve element arranged on the second piston plate, a gas spray head is arranged at one end of the inner side of the cooling pipe, and stirring fan blades are fixedly connected to the cooling pipe and are positioned in the liquid cavity.
The humidity adjusting mechanism comprises a first piston plate, a second linear motion piece and a spray pipe, wherein the first piston plate is arranged in a second cavity arranged in a bearing table, the second cavity is communicated with a first cavity arranged in the bearing table, the first piston plate is in sliding fit with the second cavity, the output end of the second linear motion piece positioned in the second cavity is fixedly connected with the first piston plate, a third valve piece is arranged on the second linear motion piece, one end of the spray pipe extends into the first cavity and is fixedly connected with the bearing table, a second atomizing nozzle is arranged at the other end of the spray pipe, and liquid for adjusting the humidity in the device body is filled in the first cavity.
The device comprises a bearing table, a device body, a connecting mechanism, a first rod body, a second rod body, a first rod body and a second rod body, wherein the connecting mechanism is used for connecting the bearing table and the device body, the connecting mechanism comprises a limiting cylinder body, a piston push plate, a supporting rod, a first rod body and an electric valve element, the four limiting cylinder bodies are distributed in a rectangular shape in a first cavity and are fixedly connected with the bearing table, the limiting cylinder body is connected with the first cavity in a penetrating mode through the electric valve element arranged on the limiting cylinder body, the supporting rod is fixedly connected with the piston push plate, the piston push plate is arranged in the limiting cylinder body and is in limiting sliding with the limiting cylinder body, the supporting rod penetrates through the bearing table and is in sliding fit with the bearing table, the first rod body is fixedly connected between the two supporting rods, the first rod body is hinged to the device body, and the second rod body is fixedly connected between the other two supporting rods and is in sliding fit with the limiting sliding cylinder body which is fixedly connected with the device body.
According to a further technical scheme, the positioning assembly comprises a first mounting plate, first linear moving parts and pressing plates, wherein the first mounting plate is fixedly connected with a bearing table, the pressing plates are fixedly connected with the output ends of the first linear moving parts, the other ends of the first linear moving parts are embedded and fixedly connected to the first mounting plate, and the four first mounting plates are distributed on the outer side of the bearing table in a rectangular shape.
The regulation and control system comprises:
the monitoring module is used for monitoring and acquiring humidity information in the device body and temperature information of the bearing surface of the bearing table;
the storage module is used for storing the data information acquired by the monitoring module and establishing a data set;
The processing module is used for retrieving the temperature information and the humidity information at the current moment in the storage module and forming judgment information;
The control module is used for receiving the judgment information and controlling the temperature adjusting mechanism and the humidity adjusting mechanism according to the judgment information;
Wherein, the monitoring module includes:
The humidity monitoring unit is arranged in the device body and used for monitoring and acquiring humidity information in the device body and is a humidity sensor;
The temperature monitoring unit is arranged on the bearing surface of the bearing table and used for monitoring and acquiring temperature information of the bearing surface and is a second temperature sensor;
wherein the processing module comprises:
A threshold unit for retrieving the humidity information in the device body at the current time and the temperature information of the bearing surface of the bearing table in the storage module, correspondingly comparing the humidity information with a preset humidity threshold and a preset temperature threshold, and forming judgment information if at least one of the humidity information and the temperature information exceeds the corresponding threshold
The analysis unit is used for retrieving the humidity information in the device body at the current moment and the temperature information of the bearing surface of the bearing platform in the storage module to form a humidity predicted value and a temperature predicted value, correspondingly comparing the formed two predicted values with a preset humidity threshold and a preset temperature threshold, forming judgment information if at least one of the two predicted values exceeds the corresponding threshold, correlating the temperature predicted value and the humidity predicted value to form a correlation value, comparing the formed correlation value with a preset correlation value threshold, and forming judgment information if the correlation value exceeds the correlation value threshold.
The specific processing mode of the analysis unit is as follows:
S1, acquiring temperature information at the current moment and humidity information at the current moment in a data set in a storage module, and marking the temperature information and the humidity information as T 1、T2、...、Ti-1,R1、R2、...、Ri-1;
S2, predicting temperature information at the next moment and humidity information at the next moment in a linear regression mode, obtaining a corresponding predicted value T i,Ri, correspondingly comparing the T i,Ri with a preset temperature threshold value and a preset humidity threshold value, and forming judgment information if at least one of the temperature information and the humidity information exceeds the corresponding threshold value;
S3, based on the predicted value, estimating a correlation value between the temperature at the time t, namely the next time and the humidity at the next time, wherein the calculation mode is as follows:
wherein N is the number of items, T t,i is the temperature at time T, i.e., the next time, and R t,i is the humidity at time T, i.e., the next time;
s4, comparing the obtained association value with a preset association value threshold value, and forming judgment information if the predicted value is larger than the preset threshold value;
S5, transmitting the formed judgment information to a control module for control of a related module.
The invention provides a chip fixing device for chip processing equipment, which has the following beneficial effects compared with the prior art:
1. The temperature regulating mechanism regulates the temperature in the device body and the temperature information of the bearing surface of the bearing table according to the temperature information acquired by the regulating system, namely, when the temperature is too low, the heater is started to raise the temperature in the device body, when the temperature is too low, the cooling unit guides the gas cooling substance and the liquid cooling substance into the first cooling cavity and mixes the gas cooling substance and the liquid cooling substance, at the moment, the first valve is started until the temperature of the bearing surface of the bearing table reaches the temperature of the proper fixing material, at the moment, related technicians cover the chip on the fixing material and position the chip through the positioning component, so that the chip is quickly limited and fixed;
2. The related technical staff guides the gas cooling material with pressure into the cooling pipe, at the moment, a part of the gas cooling material enters the air cavity through the second valve element, and the other part of the gas cooling material is sprayed into the second cooling cavity from the gas spray head, the gas cooling material entering the air cavity pushes the second piston plate to linearly move along the length direction of the cooling cylinder body, meanwhile, a pushing column fixedly connected with the second piston plate slides along a spiral groove arranged on the cooling pipe and extrudes the inner wall of the spiral groove to drive the cooling pipe to perform rotary motion in the horizontal direction, the cooling pipe pushes the stirring fan blade to synchronously rotate, the liquid cooling material in the liquid cavity is stirred, at the same time, the second piston plate extrudes the liquid cooling material in the liquid cavity, the liquid cooling material is sprayed into the second cooling cavity from the first atomization spray head, at the moment, the gas cooling material sprayed from the two cooling cylinders carries atomized liquid cooling material in the second cooling cavity to collide with each other, form turbulence to be mixed, and rapidly distributed and filled in the second cooling cavity, and the purpose of the arrangement is that the gas cooling material and the liquid cooling material are guided into the second cooling cavity to be fully mixed for processing the chip;
3. The method comprises the steps that a monitoring module monitors and obtains humidity information in a device body and temperature information of a bearing surface of a bearing platform, the temperature information and the temperature information of the bearing surface of the bearing platform are transmitted to a storage module for storage and data set establishment, a threshold unit invokes the humidity information in the device body and the temperature information of the bearing surface of the bearing platform at the current moment in the storage module, the two are correspondingly compared with the preset humidity threshold and the preset temperature threshold to form a correlation value, if at least one of the correlation value exceeds the preset correlation value threshold, judgment information is formed, an analysis unit invokes the humidity information in the device body and the temperature information of the bearing surface of the bearing platform at the current moment in the storage module to form a humidity predicted value and a temperature predicted value, the two formed predicted values are correspondingly compared with the preset humidity threshold and the preset temperature predicted value, if at least one of the two exceeds the corresponding threshold, the correlation value is compared with the preset correlation value threshold, the judgment information is formed, the control module receives the judgment information, and the temperature of a heater or a cooling assembly in the temperature mechanism is controlled according to the judgment information, the temperature predicted value is controlled by the temperature predicted value, the chip is controlled by the temperature controller or the cooling assembly, the chip is controlled by the chip, and the temperature is controlled by the chip, namely, the temperature is controlled by the chip, the temperature controller is controlled by the temperature controller, and the chip is controlled by the temperature controller, and the temperature is controlled by the chip.
Drawings
FIG. 1 is a schematic three-dimensional structure of the present invention.
Fig. 2 is a schematic structural diagram of the whole present invention.
Fig. 3 is a schematic structural view of the humidity control mechanism and the temperature control mechanism according to the present invention.
Fig. 4 is a schematic structural view of the connecting mechanism of the present invention.
Fig. 5 is a schematic structural view of the separator of the present invention.
Fig. 6 is an enlarged schematic view of the structure of the portion a in fig. 3 according to the present invention.
Fig. 7 is an enlarged schematic view of the B-section structure of fig. 4 according to the present invention.
FIG. 8 is a schematic diagram of a control system according to the present invention.
Reference numerals notes 1, carrying table; 101, first cavity, 102, second cavity, 103, third cavity, 1031, first cooling cavity, 1032, second cooling cavity, 2, device body, 3, connecting mechanism, 301, limit cylinder, 302, piston push plate, 303, strut, 304, first rod, 305, electric valve, 306, limit slide cylinder, 307, second rod, 4, fixed material, 5, chip, 6, positioning component, 601, first mounting plate, 602, first linear movement, 603, pressing plate, 7, humidity adjusting mechanism, 701, first piston plate, 702, second linear movement, 703, spray pipe, 8, temperature adjusting mechanism, 801, heater, 802, cooling component, 8021, partition board, 8022, first valve, 8023, first temperature sensor, 8024, cooling unit, 80241, cooling cylinder, 80242, cooling pipe, 80243, second plate, 80244, stirring fan blade, 245, second piston unit, 9, system, 11, temperature monitoring unit, 702, second linear movement, 703, spray pipe, 8, temperature adjusting mechanism, 801, heater, 802, cooling component, 8021, partition board, 8022, 8023, first temperature sensor, 8024, 80242, cooling unit, cooling pipe, 80243, 80244, stirring fan blade, 80245, second piston plate, 9, temperature monitoring unit, 9032, humidity monitoring unit, control module, 9032, control module, and control module.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Specific implementations of the invention are described in detail below in connection with specific embodiments.
Referring to fig. 1 to 6, in one embodiment of the present invention, a chip fixing device for a chip processing apparatus includes a carrying table 1 and a device body 2, wherein the carrying table 1 is installed in the device body 2 through a connection mechanism, a sealing cover (not shown) for sealing an internal space of the device body 2 is disposed on the device body 2, and the chip fixing device further includes:
A temperature adjusting mechanism 8, which is installed on the bearing table 1, and is used for adjusting the temperature of the fixing material 4 paved on the bearing surface of the bearing table 1 and adjusting the temperature of the processing area of the chip 5 when the chip 5 is processed;
the humidity adjusting mechanism 7 is arranged on the bearing table 1 and is used for adjusting the humidity of the environment where the fixing material 4 paved on the bearing surface of the bearing table 1 is located;
The positioning component 6 is arranged on the bearing table 1 and is used for positioning and limiting the chip 5;
The regulation and control system 9 regulates the temperature and the humidity of the environment where the fixing material 4 is positioned by controlling the temperature regulating mechanism 8 and the humidity regulating mechanism 7;
Wherein, temperature adjustment mechanism 8 includes heater 801, heater 801 installs inboard in chip 5 upper end, still includes:
a cooling component 802, which is installed on the bearing table 1 and is used for cooling the fixing material 4 paved on the bearing surface of the bearing table 1;
The cooling assembly 802 includes a partition 8021, a first valve 8022 and a first temperature sensor 8023, the partition 8021 is disposed in a third cavity 103 formed on the bearing table 1 and is fixedly connected with the bearing table 1, the partition 8021 divides the third cavity 103 into a second cooling cavity 1032 including a first cooling cavity 1031 and a plurality of rectangular distribution, the first cooling cavity 1031 is communicated with the second cooling cavity 1032 by the first valve 8022 mounted on the partition 8021, a plurality of first temperature sensors 8023 are correspondingly disposed in the second cooling cavity 1032, and the first temperature sensor 8023 is embedded and fixedly connected inside the upper end of the bearing table 1, and the cooling assembly further includes:
a cooling unit 8024 is mounted on the carrying platform 1, and is used for introducing and mixing the gas cooling substance and the liquid cooling substance into the first cooling chamber 1031.
In the embodiment of the present invention, the humidity adjustment mechanism 7 is selectively started according to the humidity information obtained by the regulation and control system 9, to adjust the humidity of the device body 2, that is, the environment where the fixing material 4 is located, until the environment is located in the environment where the fixing material 4 is suitable for humidity, meanwhile, the temperature adjustment mechanism 8 adjusts the temperature in the device body 2 and the temperature information of the bearing surface of the bearing table 1 according to the temperature information obtained by the regulation and control system 9, that is, when the temperature is too low, the heater 801 is started to raise the temperature in the device body 2, when the temperature is too low, the cooling unit 8024 introduces a gas cooling substance and a liquid cooling substance into the first cooling cavity 1031 and mixes them, at this time, the first valve 8022 is opened until the temperature of the bearing surface of the bearing table 1 reaches the temperature suitable for the fixing material 4, at this time, a relevant technician covers the chip 5 on the fixing material 4, and positions the chip 5 through the positioning component 6, so as to achieve the technical effect of rapidly limiting and fixing the chip 5, at the same time, when the chip 5 is processed, the first temperature sensor 8023 can monitor the temperature of the processing area of the chip 5, if the temperature of the processing area is too low, the first temperature sensor 8023 is able to introduce a gas cooling substance into the first cooling chamber 1031 and mix the cooling substance, and then opens the corresponding cooling substance.
Specifically, the partition 8021 is embedded with a discharge pipe (not shown) for discharging the mixture of the gas cooling substance and the liquid cooling substance in the first cooling chamber 1031, the discharge pipe is communicated with the first cooling chamber 1031 through a first joint (not shown) mounted on the partition 8021, and the discharge pipe output end extends to the outside of the apparatus body 2 through the bearing table 1 and the apparatus body 2. The purpose of this arrangement is to discharge the gas-cooled substance and the liquid-cooled substance that are not effective in the second cooling chamber 1032.
Referring to fig. 3 and 6, as an embodiment of the present invention, the cooling unit 8024 includes a cooling cylinder 80241, a cooling tube 80242 and a second piston plate 80243, wherein the two cooling cylinders 80241 are symmetrically installed on the carrying platform 1 and are all communicated with the first cooling chamber 1031 through a first atomizer (not shown) installed at an inner end portion, the cooling tube 80242 is rotatably connected to the cooling cylinder 80241, the second piston plate 80243 is in limited sliding connection with the cooling cylinder 80241, a pushing column (not shown) in sliding fit with a spiral groove (not shown) formed on the cooling tube 80242 is fixedly connected to the second piston plate 80243, the cooling tube 80242 is communicated with the second cooling chamber 1032, the second piston plate 80243 divides the chamber in the cooling cylinder 80241 into an air chamber (not shown) and a liquid chamber (not shown) and the cooling tube 80242 is installed at one end of the cooling tube 80242 through the second atomizer (not shown).
Specifically, the cooling tube 80242 is fixedly connected with a stirring fan blade 80244, and the stirring fan blade 80244 is located in the liquid cavity. The purpose of this kind of setting is that utilize rotation cooling tube 80242 to drive stirring flabellum 80244 and carry out the rotation in horizontal direction, realizes stirring the liquid cooling material that is located the liquid chamber, prevents that it from producing the phenomenon of precipitation or separation.
In the embodiment of the present invention, a related technician introduces a gas cooling material with pressure into the cooling tube 80242, at this time, a part of the gas cooling material enters the air cavity through the second valve 80245, and a part of the gas cooling material is sprayed from the gas spray head into the second cooling cavity 1032, the gas cooling material entering the air cavity pushes the second piston plate 80243 to linearly move along the length direction of the cooling cylinder 80241, and at the same time, the pushing column fixedly connected to the second piston plate 80243 slides along the spiral groove formed on the cooling tube 80242 and presses the inner wall of the spiral groove, so as to promote the cooling tube 80242 to perform a rotation motion in the horizontal direction, the cooling tube 80242 pushes the stirring blades 80244 to synchronously rotate, and at the same time, the second piston plate 80243 extrudes the liquid cooling material in the liquid cavity, so as to promote the liquid cooling material to be sprayed from the first atomizer into the second cooling cavity 1032, at this time, the liquid cooling material carried by the gas cooling material sprayed from the two cooling cylinders 80241 collides into the second cooling cavity 1032, and forms a mixing and a turbulent flow in the second cooling cavity 1032, and the second cooling material is fully processed in the cooling cavity 5.
Referring to fig. 1-3, the humidity adjusting mechanism 7 includes a first piston plate 701, a second linear moving member 702, and a nozzle 703, wherein the first piston plate 701 is disposed in a second cavity 102 formed in the bearing table 1, the second cavity 102 is communicated with a first cavity 101 formed in the bearing table 1, the first piston plate 701 is slidably matched with the second cavity 102, an output end of the second linear moving member 702 located in the second cavity 102 is fixedly connected with the first piston plate 701, a third valve member is mounted on the second linear moving member 702, one end of the nozzle 703 extends into the first cavity 101 and is fixedly connected with the bearing table 1, a second atomizer is mounted at the other end of the nozzle 703, and the first cavity 101 is filled with a liquid for adjusting the humidity in the device body 2.
In the embodiment of the present invention, the second linear motion member 702 pushes the first piston plate 701 to slide along the second cavity 102, the first piston plate 701 presses the liquid in the first cavity 101 and directs the liquid into the spray tube 703 under pressure, and the liquid in the spray tube 703 is sprayed into the device body 2 through the second atomizer, so as to achieve the technical effect of adjusting the humidity in the device body 2.
Referring to fig. 1, 4 and 7, the connecting mechanism includes a limit cylinder 301, a piston pushing plate 302, a supporting rod 303, a first rod body 304 and an electric valve 305, four limit cylinders 301 are rectangular and distributed in the first cavity 101 and fixedly connected with the bearing table 1, the limit cylinder 301 is connected with the first cavity 101 through the electric valve 305 installed on the limit cylinder 301, the supporting rod 303 is fixedly connected with the piston pushing plate 302, the piston pushing plate 302 is disposed in the limit cylinder 301 and slides with the limit cylinder 301 in a limited manner, the supporting rod 303 penetrates through the bearing table 1 and is in sliding fit with the bearing table 1, a first rod body 304 is fixedly connected between two supporting rods 303, the first rod body 304 is hinged on the device body 2, a second rod body 307 is fixedly connected between the other two supporting rods 303, and the second rod body 307 is in sliding fit with a limit slide cylinder 306 fixedly connected with the device body 2.
In the embodiment of the invention, when the drop or gradient exists on the ground of the environment where the device body 2 is located, the support rod 303 located at a higher position pushes the piston push plate 302 to slide along the limiting cylinder 301 in the vertical direction, at this time, the piston push plate 302 extrudes the liquid located in the limiting cylinder 301 and the first cavity 101 to flow in the first cavity 101, the flowing liquid pushes the piston push plate 302 located at a lower position to drive the support rod 303 to perform linear motion in the vertical direction and to press the device body 2, the drop of the ground of the environment where the device body 2 is located is compensated, at this time, the electric valve 305 is closed, the bearing table 1 is caused to be in a horizontal balance state, and meanwhile, a related technician can drive the first piston plate 701 to extrude the liquid in the first cavity 101 to flow by driving the second linear motion member 702, so that the technical effect of adjusting the height position of the bearing table 1 in the device body 2 is achieved.
Referring to fig. 1-2, as an embodiment of the invention, the positioning assembly 6 includes a first mounting plate 601, a first linear moving member 602, and a pressing plate 603, where the first mounting plate 601 is fixedly connected to the carrying platform 1, the pressing plate 603 is fixedly connected to an output end of the first linear moving member 602, another end of the first linear moving member 602 is fixedly connected to the first mounting plate 601 in an embedded manner, and four first mounting plates 601 are rectangular and distributed on an outer side of the carrying platform 1.
In the embodiment of the present invention, the purpose of this arrangement is to utilize the first linear moving member 602 to push the pressing plate 603 to perform linear movement in the horizontal direction, so as to achieve the technical effect of driving the pressing plates 603 to press the side of the chip 5 opposite to each other and to position and limit the chip 5.
Referring to fig. 8, as an embodiment of the present invention, the regulation system 9 includes:
the monitoring module 901 is configured to monitor and acquire humidity information in the device body 2 and temperature information of a bearing surface of the bearing table 1;
The storage module 902 is configured to store the data information acquired by the monitoring module 901 and establish a data set;
The processing module 903 is configured to retrieve temperature information and humidity information at the current time in the storage module 902, and form judgment information;
The control module 904 is configured to receive the judgment information and control the temperature adjustment mechanism 8 and the humidity adjustment mechanism 7 according to the judgment information;
wherein, the monitoring module 901 includes:
The humidity monitoring unit 9012 is installed in the device body 2, and is used for monitoring and acquiring humidity information in the device body 2, and is a humidity sensor;
the temperature monitoring unit 9011 is arranged on the bearing surface of the bearing table 1 and is used for monitoring and acquiring temperature information of the bearing surface and is a second temperature sensor;
wherein, the processing module 903 comprises:
a threshold unit 9031 for retrieving the humidity information in the device body 2 and the temperature information of the carrying surface of the carrying platform 1at the current time in the storage module 902, correspondingly comparing the humidity information with a preset humidity threshold and a preset temperature threshold, and forming judgment information if at least one of the humidity information and the temperature information exceeds the corresponding threshold, and
The analyzing unit 9032 is configured to retrieve the humidity information in the device body 2 and the temperature information of the bearing surface of the bearing platform 1 at the current time in the storage module 902, to form a humidity predicted value and a temperature predicted value, correspondingly compare the two formed predicted values with a preset humidity threshold and a preset temperature threshold, if at least one of the two predicted values exceeds the corresponding threshold, form judgment information, correlate the temperature predicted value and the humidity predicted value to form a correlated value, and compare the formed correlated value with a preset correlated value threshold, and if the correlated value exceeds the correlated value threshold, form judgment information;
The specific processing manner of the analysis unit 9032 is as follows:
S1, acquiring temperature information at the current moment and humidity information at the current moment in a data set in a storage module 902, and marking the temperature information and the humidity information as T 1、T2、...、Ti-1,R1、R2、...、Ri-1;
S2, predicting temperature information at the next moment and humidity information at the next moment in a linear regression mode, obtaining a corresponding predicted value T i,Ri, correspondingly comparing the T i,Ri with a preset temperature threshold value and a preset humidity threshold value, and forming judgment information if at least one of the temperature information and the humidity information exceeds the corresponding threshold value;
S3, based on the predicted value, estimating a correlation value between the temperature at the time t, namely the next time and the humidity at the next time, wherein the calculation mode is as follows:
wherein N is the number of items, T t,i is the temperature at time T, i.e., the next time, and R t,i is the humidity at time T, i.e., the next time;
s4, comparing the obtained association value with a preset association value threshold value, and forming judgment information if the predicted value is larger than the preset threshold value;
And S5, transmitting the formed judgment information to the control module 904 for control of the related module.
In the embodiment of the present invention, the monitoring module 901 monitors and obtains the humidity information in the device body 2 and the temperature information of the bearing surface of the bearing table 1, and transmits the humidity information and the temperature information of the bearing surface of the bearing table 1 to the storage module 902 for storage and data set establishment, the threshold unit 9031 invokes the humidity information in the device body 2 and the temperature information of the bearing surface of the bearing table 1 at the current time in the storage module 902, correspondingly compares the humidity information and the temperature information with preset humidity threshold and temperature threshold, if at least one of the humidity information and the temperature information exceeds the corresponding threshold, forms judgment information, the analysis unit 9032 invokes the humidity information in the device body 2 and the temperature information of the bearing surface of the bearing table 1 at the current time in the storage module 902 to form a humidity predicted value and a temperature predicted value, correspondingly compares the formed two predicted values with the preset humidity threshold and temperature threshold, if at least one of the above values exceeds the corresponding threshold value, forming judgment information, correlating the temperature predicted value and the humidity predicted value to form a correlated value, comparing the formed correlated value with a preset correlated value threshold value, if the correlated value exceeds the correlated value threshold value, forming judgment information, receiving the judgment information by the control module 904, controlling the heater or the cooling component 802 in the temperature regulating mechanism according to the judgment information to realize the purpose of regulating and controlling the temperature of the bearing surface of the bearing table 1, controlling the second linear moving member 702 in the humidity regulating mechanism 7 to realize the regulation and control of the humidity in the device body 2, namely, by regulating and controlling the temperature and the humidity of the environment where the fixing material 4 is located, the fixing material 4 is caused to rapidly and effectively limit the chip 5 on the bearing surface of the bearing table 1, and simultaneously when the chip 5 is processed, the control module 904 can also control the cooling component 802 to cool the processing area of the chip 5 exceeding the preset temperature, so as to improve the production yield of the chip 5.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
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| CN113053775A (en) * | 2019-12-27 | 2021-06-29 | 中微半导体设备(上海)股份有限公司 | Wafer temperature controller, system and method and plasma processing device |
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| US5667622A (en) * | 1995-08-25 | 1997-09-16 | Siemens Aktiengesellschaft | In-situ wafer temperature control apparatus for single wafer tools |
| US6717115B1 (en) * | 2000-04-25 | 2004-04-06 | Teradyne, Inc. | Semiconductor handler for rapid testing |
| KR101672873B1 (en) * | 2016-02-17 | 2016-11-04 | 주식회사 티에스시 | Apparatus for Chemical-Mechanical Polishing of Wafer |
| KR102154488B1 (en) * | 2018-07-09 | 2020-09-10 | 주식회사 테스 | Cooling module and Substrate supporting unit having the same |
| KR102160436B1 (en) * | 2019-01-08 | 2020-09-28 | 주식회사 앤아이윈 | Wafer processing chamber for wet clean equipment with temperature and humidity adjustable heater |
| KR102288754B1 (en) * | 2019-08-16 | 2021-08-12 | 주식회사 에프에스티 | temperature-adjusting device for high temperature having an open or close adjusting valve system |
| CN114446808A (en) * | 2020-11-02 | 2022-05-06 | 第一检测有限公司 | Chip Test System |
| CN117619476A (en) * | 2023-12-04 | 2024-03-01 | 广东心里程教育集团有限公司 | Experimental control console convenient for adjusting azimuth of device |
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| CN111063632A (en) * | 2019-10-15 | 2020-04-24 | 北京烁科中科信电子装备有限公司 | High-density array type Faraday cylinder measuring probe |
| CN113053775A (en) * | 2019-12-27 | 2021-06-29 | 中微半导体设备(上海)股份有限公司 | Wafer temperature controller, system and method and plasma processing device |
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