CN1188269A - Notebook computer with heat dissipating lid hinge structure - Google Patents
Notebook computer with heat dissipating lid hinge structure Download PDFInfo
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- CN1188269A CN1188269A CN97108784A CN97108784A CN1188269A CN 1188269 A CN1188269 A CN 1188269A CN 97108784 A CN97108784 A CN 97108784A CN 97108784 A CN97108784 A CN 97108784A CN 1188269 A CN1188269 A CN 1188269A
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Abstract
A notebook computer display housing is pivotally connected to its associated CPU housing by a heat dissipating hinge structure having telescoped, relatively rotatable first and second sections respectively anchored to the CPU and display housings. The heat absorbing evaporation end of a first thermosyphoning heat pipe is conductively connected to a heat generating electronic component within the CPU housing, with the heat rejecting condensing end of the heat pipe defining the first hinge structure section. During computer operation, heat from the electronic component is sequentially transferred through the heat pipe and the second hinge structure section, in which the first hinge section is journaled, to the display housing for dissipation therefrom to ambient. Heat transfer from the second hinge structure section to the display housing is representatively facilitated by a second thermosyphoning heat pipe having an evaporator end received in an opening in the second hinge structure section, and laterally offset from the condensing end of the first heat pipe, and a condensing end thermally communicated with the display housing.
Description
Present invention relates in general to the heat radiation of element work in electronic installation, in most preferred embodiment, more specifically to during using notebook computer, the heat of the electronic component CPU cabinet from notebook computer partly is delivered on the corresponding display case, to reach the purpose of heat radiation.
Various electronic components in the computing machine will produce heat in their normal work period.In these elements, be typically microprocessor.If heat is not removed from thermogenesis element, heat will make device temperature be elevated to the degree that reduces equipment dependability and service life, and will produce deleterious effect near element.Because the power of microprocessor and other electron component increases in recent years, correspondingly produces more heat, it is more outstanding that this problem has become.
The present age, notebook type and sub-notebook formula computing machine combined CPU (central processing unit) (CPU) cabinet and the display case that is fixed on the CPU cabinet in the mode of rotating around pivot, this display case is as a lid, shut down computer, in order to storage and transport, open computing machine and show its keyboard portion.Display or lid cabinet comprise visual display assembly and various other element.The heating of display case is less relatively during computer run.
In general, the small computer of operation can dissipate by the major part of each surperficial temperature rise of CPU cabinet with the generation heat.Do not need to force the circulation of air in the CPU cabinet, only need natural ventilation and radiation just the heat in the CPU cabinet can be removed.For the heat that gets on to fall from cabinet, these two kinds of phenomenons must occur in the CPU cabinet outside surface (with simply in cabinet the distribution again of heat different).
By natural convection (different) or radiation with forced convertion, the surface of heat from appointment can be passed, this heat be subjected to available surface area and should the surface and its surrounding environment (as, air) between the restriction of the temperature difference.For notebook computer, the temperature of cabinet outside surface and casing other parts does not allow to surpass the computer user and feels comfortable temperature.Simultaneously, naturally, this be intended to portable computer cabinet outside surface must be little, make that like this its surface temperature correspondingly must be higher, so that take away necessary operation heat.These two kinds of conditions--keep the relatively low temperature of outside surface; On relatively little surface area, dissipate simultaneously relatively bigger heat--be basic the opposition.
Therefore, to small-size computer, the deviser of notebook computer for example, by the calorie spread mechanism of natural convection and radiation, utilize as much as possible available surface area with calorie spread in surrounding air, be very significant.The outside cabinet surface area that can be used for calorie spread is big more, and when continuing to propagate heat with the phase same rate, average surface temperature just can be low more.
At present, the display case back side of notebook computer is not also utilized in this respect fully, and at run duration, this surperficial temperature is just than the slight rising of temperature on every side.Simultaneously, the temperature on CPU cabinet surface reaches such level, promptly all feels uncomfortable when different operator's touch.
Known to the applicant, current also do not have method to be used for effectively calorie spread with CPU cabinet during the computer run to display case, so that heat is disseminated in the surrounding air.As mentioned above, utilize the converter heat radiation of fan or process CPU cabinet outside surface usually, and do not utilize display case significantly, and between CPU cabinet and display case, do not shift the clear and definite project of heat as the calorie spread entity.
Although the known display cabinet can be used for the thermal convection of computer cabinet part and the potential enlarged areas of heat loss through radiation, but for the heat that the CPU cabinet produces, display case is that requirement display or cabinet are being opened and closed between the two positions and rotate with respect to CPU or computing machine drain pan part as the major obstacles of effective use of heat-delivery surface.Though conduction heat generally is not difficult between two point of fixity,, at small-size computer, under the restriction as notebook and sub-notebook formula Computer Design, it is complicated transmitting heat between 2 of relative position variation.
Therefore, an object of the present invention is to provide a kind of apparatus and method, be used for heat electrical equipment from first computer cabinet part is delivered to the second computer cabinet part that is fixed to first cabinet part in the mode of rotating around pivot, thereby, the heat that improvement is assigned to surrounding air from second crate part distributes, and reduces the surperficial running temperature of first cabinet part.
Aspect realization principle of the present invention, according to most preferred embodiment, comprise the electronic installation of cabinet with first and second parts, such as notebook computer, be equipped with heater element, for example, be installed in the processor in first cabinet part.
Hinge arrangement links together first and second cabinets, so that can pivot relative to one another, this hinge arrangement has the second portion that first that (1) and first cabinet partly be connected and (2) and second cabinet partly are connected, this second portion and second cabinet partly have the relation of heat transmission, and link together in the mode of rotating with first hinge fraction.
Heat transfer component is delivered to the second cabinet part with the heat that element produced in first cabinet part through hinge arrangement effectively, and this heat transfer component has the first and the second portion that form first hinge fraction logical with described element heat channel.
In most preferred embodiment of the present invention, heat transfer component is the first thermosyphon heat pipe, and this heat pipe has with the evaporation ends part of heater element heat interchange with the form of axle journal and is in condensation end part in second hinge arrangement part.Therefore, first heat pipe has two kinds of effects (1) the element heat partly is delivered to the second cabinet part from first cabinet, thereby heat is dispersed in the surrounding air, and (2) form the hinge arrangement that the first and second crate part branches is interconnected in the mode that pivots each other.
Thereby make whole hinge arrangement as a kind of pivoting friction clutch in order to increase the friction that heat pipe condensation end part and this heat pipe condensation end partly insert between wherein second hinge fraction, insert partly at heat pipe condensation end part and this heat pipe condensation end that setting has the more friction material of great friction coefficient on the relative pivot surface of wherein second hinge portions.
According to another feature of the invention, utilize the second temperature circulating hot-pipe to increase with the element of heat transferred to second cabinet part, this heat pipe is installed in the second cabinet part, and have the evaporation ends with the second hinge fraction heat interchange, and be positioned at the position and the condensation end part second cabinet part heat interchange of separating with hinge arrangement.
Fig. 1 is the simple skeleton view of notebook computer CPU and display case part, wherein heat pipe is connected with the radiator structure of particular design, this structure partly is connected with display case with CPU by pivot, be used for effectively the heat of electronic component work is delivered to display case from the CPU cabinet,, between the operating period heat is dispersed in the ambient air at computing machine;
Fig. 2 is the cut-open view of the amplification cut open along the line 2-2 of Fig. 1 through the heat radiation hinge arrangement;
Fig. 3 and Fig. 4 schematically illustrate the another kind of method that the condensation end of secondary hinge structure heat pipe is interrelated with heat exchange pattern and graphoscope cabinet.
Fig. 1 skeleton view is an electronic equipment part of implementing the principle of the invention, and representative is a notebook computer 10.Computing machine 10 comprises drain pan or CPU cabinet part 12, and lid or display case part 14.CPU cabinet 12 has general rectangular shape, and this rectangle has base plate 16, have the perpendicular outer wall 18 of angle part 18a of indentation and the end face 20 of opening, and keyboard (end shows) stretches the other end from an end of end face 20 in the horizontal direction.Typically, in the computer circuits of on the CPU cabinet, arranging be a printed circuit board (PCB) 22 that is installed on the base plate 16.Heater element mainly is the top that processor chips 24 are installed in this printed circuit board (PCB) 22.
Therefore, at the notebook computer run duration of conventional structure, its CPU cabinet become mould get up than its display case more heat-heat transfer mechanisms of each part by natural convection and radiation with heat transferred in surrounding air.Because notebook computer is more and more faster, and computing power is more and more stronger, and the thermal load in the CPU cabinet increases accordingly, the external temperature of CPU cabinet continues to increase unacceptable degree to the user, and before relied on natural convection and heat radiation heat to be delivered to the surrounding air from the CPU cabinet, can not satisfy the demand from the CPU cabinet.
It is the needs of doing computing machine more and more littler that quickening distributes the extra heat of notebook computer.Certainly, this will reduce the CPU cabinet can be used to by natural convection and radiation the internal operation heat is dispersed into external surface area in the surrounding air.The dwindling of the space outerpace envelope of modern notebook computer and sub-notebook continued to make and utilized conventional householder method, as, utilize inner cooling fan, the internal operation heat is distributed from the CPU cabinet, more difficulty and weak effect.
Yet, the present invention will move heat uniquely and be dispersed into display case 14 from processor 24 (or other similar heater element), to utilize its big external surface area increase radiation and convection current that heat is dispersed in CPU cabinet 12 ambient airs, use 36 heat radiations of friction hinge structure as illustrated in fig. 1 and 2 of particular design.Combine with the hinge means of other conventional structure that is fit to (end shows), this hinge arrangement 36 is used for around the mode of pivotal rotation display case 14 being connected to the back edge part of CPU cabinet 12, so as roughly as shown in Figure 1 vertical traffic direction and approximate horizontal off-position (end shows) between pivoted motion.
Yet, according to an importance of the present invention, hinge arrangement 36 also is used for by hinge 36, and utilization is delivered to display case 14 with considerable operation heat from processor 24 with the conventional temperature circulating hot-pipe 38 that processor 24 carries out heat interchange, and designs heat radiation hinge arrangement 36 dexterously.
Use usual way, the heat of vaporization that is delivered to heat pipe evaporation ends 38a is arranged in the liquid of core material, and the evaporating liquid that produces is delivered to condensation end 38b by the inside 44 of heat pipe 38, has removed heat from evaporating liquid through the condensation end 38b of superheater tube 38.Liquid is cooled off, is condensed into to evaporated liquid at last in the 38b of heat pipe end, then, this liquid is absorbed by the core material among the 38b of heat pipe end 40, and by siphon product heat cal rod end 38a, is used for evaporating again, as mentioned above, and the repeated temperature circulation heat transferred cycle.
Hot square 46 (see figure 1)s of copper are set at the top of processor 24, receive the operation heat that conduction is come, the evaporation ends 38a of heat pipe 38 is attached to above the hot piece 46, and the conduction heat transferred that will receive again is to the condensation end 38b of heat pipe 38.The condensation end 38b of heat pipe 38 stretches out through the circular port 48 on the CPU cabinet outer wall 18, and embeds by hinge fraction 52 formed cylindrical channels 50, and suitably remains on the inner surface of display case, with its maintenance thermally conductive relation.
In general, hinge fraction 52 is by copper production, and display case 14 (as CPU cabinet 12) is by the plastics manufacturing.Yet display case 14 may be by the metal manufacturing, and if desired, hinge fraction 36 and display case are an integral body.
As shown in Figure 2, hinge fraction 52 has: the chassis 54 of part-circular, done cylinder type passage 50 in the above, and actiniform crack 56 extends upward through chassis 54 to cylinder type passage 50; And the top margin flange 58 of part-circular, cylinder type passage 60 extends in parallel through this flange and passage 50.
The condensation end 38a of heat pipe 38 has formed the part of whole hinge arrangement 36 dexterously, whole hinge arrangement 36 can be called as controlled friction hinge or rotation " clutch coupling ", its allows to relatively rotate between display case 14 and the CPU cabinet 12, allows the user to adjust simultaneously and keeps display screen 32 relatively and the use orientation angle of CPU cabinet 12.Between heat pipe end 38b and hinge fraction, exist friction " threshold value " torque.The user must overcome this threshold value torque could change the CPU of previous selected computing machine 10 and the orientation angle between the display case part 12,14.Otherwise this threshold value torque will be used for preventing that display case 14 from falling from selecteed orientation angle forward or backward.
Owing to for example be used as the outer wall of hinge fraction 52 and temperature circulating hot-pipe 38 with copper, because the high-termal conductivity of copper, by for example at heat pipe end 38b outer surface, and on hinge channel 50 outer surfaces of embedding heat pipe end 38b friction material thin layer 62 is set, 64, clutch friction of interface pivot and wear properties will be enhanced between heat pipe end 38b and the hinge fraction.Preferably a kind of harder metal material of this friction material, and for example chromium plating on the inner surface of the outer surface of heat pipe condensation end 38b and hinge fraction passage 50 maybe will approach steel band and be pressed into and be engaged in the passage 50 and above the 38b of heat pipe end.Actiniform crack 56 in the hinge fraction 52 allows heat pipe end 38b is inserted passage 50, so that outwards apply " elastic force " to hinge bottom parts 54 lightly in the horizontal direction, keeps suitable friction clutch power between contact friction material layer 62,64.
At computing machine 10 duration of works, the heat that processor 24 is produced is passed to the evaporation ends 38a of heat pipe 38 by hot piece 46.The heat that the evaporation ends 38a of heat pipe 38 is received is passed to its condensation/hinge end 38b along heat pipe 38, is delivered to display case 14 by hinge fraction 52 then, and the latter is dispersed into heat in the surrounding air by radiation and natural convection.Therefore, the heat quilt " dispersion " of the most of processor (or other heater elements) that is absorbed in the portable computer CPU cabinet is at CPU cabinet and display case 12, in 14, the touch of so present CPU cabinet has got on to feel cold many, and the working temperature that heat-sensitive element bore in the CPU cabinet 12 can be lower.
In notebook computer 10 normal work period, CPU cabinet underside wall 16 is placed on the horizontal support surface, as, on desktop or the aircraft seat backrest pallet, therefore, will hinder the radiation and the Natural Heat Convection of CPU cabinet 12 main outer surface part in general.Yet on the contrary, raised next display case 14 is exposed in the surrounding air fully, for use in the purpose of radiation and heat loss through convection.Therefore, the application of display case large tracts of land heat radiation of the present invention has increased the approach of main area of computer aided heat radiation.
In representative described portable notebook formula computing machine 10, use auxiliary second heat pipe 66 be positioned on the display case 14,14 transmission has been strengthened the heat that the work of CPU cabinet element is produced widely from hinge fraction 52 to display case.Identical on heat pipe 66 and heat pipe 38 structures noted earlier, have evaporation ends 66a, and condensation end 66b.Evaporation ends 66a is embedded in the hinge fraction passage 60, and it is near the hinge fraction passage 50 of the condensation end 38b that is embedded with heat pipe 38, and the condensation end 66b of heat pipe 66 and evaporation ends 66a leave at interval, and it and display case 14 carry out heat interchange.
In this way, the heat that hinge fraction 52 is absorbed from the condensation end 38b of heat pipe 38 is passed to the evaporation ends 66b of heat pipe 66, be delivered on the display case away from hinge fraction 52 by heat pipe 66 then, therefore more effectively CPU cabinet element heat gone out along display case 14 " propagation ".
As shown in Figure 1, for example, the condensation end 66b of auxiliary heat pipe 66 is attached on the hot piece 68 of copper, and copper billet is attached to the inner wall surface of the lid 26 of display case again afterwards.In addition, for instance, heat pipe condensation end 66b can be attached on the metal edge frame part 34 of display screen 32 (as shown in Figure 3), or leans against on metal electromagnetic induction (EMI) masked segment 70 of display case 14 (as shown in Figure 4).
Noted in detail is just in order to be well understood to given example and explanation, and the spirit and scope of the present invention only are subjected to the restriction of accompanying Claim book.
Claims (26)
1. electronic installation is characterized in that comprising:
Cabinet with first and second parts;
Partly be connected, make the hinge arrangement of their pivoted motions relative to one another with described first and second cabinets, described hinge arrangement has the first that (1) and described first cabinet partly are connected, (2) second portion that partly is connected with described second cabinet, this hinge arrangement and described second cabinet partly have the heat transferred relation, and are rotationally connected with described first hinge fraction;
Be installed in the heater element in described first cabinet part;
Heat transfer component, it is delivered to the described second cabinet part with the heat that described element produces by described hinge arrangement, and described heat transfer component has the first that carries out heat interchange with described element, and the second portion that limits described first hinge fraction.
2. according to the electronic installation of claim 1, it is characterized in that:
Described electronic installation is a portable computer.
3. according to the electronic installation of claim 2, it is characterized in that:
Described portable computer is a notebook computer.
4. according to the electronic installation of claim 1, it is characterized in that:
Described heat transfer component has the condensation end part of carrying out the evaporation ends part of heat interchange with described heater element and limiting the described first of described hinge arrangement.
5. the electronic installation of claim 4 is characterized in that also comprising:
Second heat pipe, this heat pipe have the evaporation ends part of partly carrying out heat interchange with described second hinge arrangement, and the condensation end part of carrying out heat interchange with described second cabinet.
One kind the heat radiation hinge arrangement, it is characterized in that comprising:
First heat pipe with the end that limits first hinge arrangement part;
By the second hinge arrangement part that Heat Conduction Material is made, described second hinge arrangement part is admitted the described first hinge arrangement part rotationally, and is in the state that the heat conduction relation is arranged with it.
7. according to the heat radiation hinge arrangement of claim 6, it is characterized in that also comprising:
Its end is fixed on second heat pipe that described second hinge arrangement is partly gone up and have heat conduction to concern with it, and described second heat pipe partly rotates with respect to described first hinge arrangement with described second hinge arrangement part.
8. according to the heat radiation hinge arrangement of claim 6, it is characterized in that:
The described end of described first heat pipe is its condensation end part.
9. according to the heat radiation hinge arrangement of claim 6, it is characterized in that:
Described second hinge fraction has: the passage of substantial cylindrical within it, this passage are admitted the described end of described first heat pipe; And the inside surface with certain friction factor, this inner surface lining is with its friction factor friction material higher than the friction factor of described inside surface,
The described end of described first heat pipe has the outside surface of certain friction factor, and this outside surface is coated with its friction factor friction material bigger than the friction factor of described outside surface, by described friction material with the friction, but releasable mode be engaged on the described inside surface of described second hinge fraction.
10. according to the heat radiation hinge arrangement of claim 9, it is characterized in that:
The outer wall section of described second hinge fraction and described first heat pipe is done by copper, and each described friction material is to be made by harder metal.
11. the method with the heat that heater element produced in electronic equipment first cabinet distributes is characterized in that may further comprise the steps:
Assemble the second cabinet part that has hinge fraction on it;
Assembling has the first cabinet part of evaporation ends and condensation end;
Assembling has first heat pipe of evaporation ends and condensation end;
Make described evaporation ends be in the state that carries out heat interchange with described element;
The described evaporation ends of described first heat pipe is rotatably connected to described hinge fraction; And
The heat of the element of spontaneous heating in the future is delivered to the described second cabinet part continuously by described first heat pipe and described hinge fraction.
12. according to the method for claim 11, it is characterized in that also comprising following step: assembling has second heat pipe of evaporation ends and condensation end;
Make the described evaporation ends of second heat pipe be in the state that carries out heat interchange with described hinge fraction, so that receive heat from the described condensation end of described first heat pipe;
Make the described condensation end of described second heat pipe be in the state that carries out heat interchange with described second cabinet, increase heat transmission thus from heater element to described second cabinet part.
13. a portable computer is characterized in that comprising:
The CPU cabinet;
Heater element in described CPU cabinet;
Display case;
Be fixed on the described display case, and the hinge fraction that carries out heat interchange with it;
Heat is delivered to described hinge fraction from described heater element, thus first heat pipe that utilizes display case to dispel the heat,
The evaporation ends of described first heat pipe and described heater element carry out heat interchange, thereby receive operation heat from described element, the condensation end of described first heat pipe embeds described hinge fraction with the form of pivot, thereby allows described display case to rotate around described condensation end with respect to described CPU cabinet.
14. the portable computer according to claim 13 is characterized in that:
Described portable computer is a notebook computer.
15. the portable computer according to claim 13 is characterized in that:
Described heater element is a processor.
16. the portable computer according to claim 13 is characterized in that:
The condensation end of described first heat pipe and described hinge fraction constitute the friction hinge structure.
17., it is characterized in that also comprising according to the portable computer of claim 13:
Have the evaporation ends part of carrying out heat interchange with described hinge fraction, and carry out second heat pipe of the condensation end part of heat interchange with described display case.
18. the portable computer according to claim 17 is characterized in that:
Described display case has outer wall section and inside surface,
Described portable computer also comprise pasting described inside surface, with described hinge arrangement the metal fever transferring elements of certain intervals is arranged, and
The described condensation end part of described second heat pipe contacts with described heat transfer component.
19. the portable computer according to claim 17 is characterized in that:
Described display case has the display screen that has metal edge frame.
20. the portable computer according to claim 17 is characterized in that:
Described display screen has metal electromagnetic induction (EMI) shield member,
The condensation end of described second heat pipe contacts with described electromagnetic induction (EMI) shield member.
21. the portable computer according to claim 13 is characterized in that:
Described portable computer also comprises the metal fever transferring elements that is clipped in the middle and contacts with the described evaporation ends portion of hot conduction of described heater element and described first heat pipe.
22. the portable computer according to claim 21 is characterized in that:
Described heater element is a processor.
23. the portable computer according to claim 17 is characterized in that:
Described hinge fraction contains first cylindrical channel roughly within it, and this passage is admitted the described condensation end part of described first heat pipe; And second cylindrical channel roughly, this passage is admitted the described evaporation ends part of described second heat pipe.
24. the portable computer according to claim 23 is characterized in that:
Described first and second passages are close mutually in described hinge fraction, and mutual almost parallel.
25. the portable computer according to claim 13 is characterized in that:
Described hinge fraction has: the passage of general cylindrical shape within it, this passage are admitted the described condensation end part of described first heat pipe; And the inside surface with friction factor, this inner surface lining is with its friction factor friction material higher than the friction factor of described inside surface,
The described condensation end of described first heat pipe partly has the outside surface of certain friction factor, and this outside surface is coated with its friction factor friction material higher than the friction factor of this outside surface, and by described friction material with the friction but releasable mode be engaged on the described inside surface of described hinge fraction.
26. the portable computer according to claim 25 is characterized in that:
The outer wall section of described hinge fraction and described first heat pipe is done by copper, and each described friction material is to be made by harder metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97108784A CN1188269A (en) | 1996-12-19 | 1997-12-19 | Notebook computer with heat dissipating lid hinge structure |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US769,795 | 1996-12-19 | ||
| CN97108784A CN1188269A (en) | 1996-12-19 | 1997-12-19 | Notebook computer with heat dissipating lid hinge structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1188269A true CN1188269A (en) | 1998-07-22 |
Family
ID=5170647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97108784A Pending CN1188269A (en) | 1996-12-19 | 1997-12-19 | Notebook computer with heat dissipating lid hinge structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1188269A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100340945C (en) * | 2004-07-06 | 2007-10-03 | Lg电子株式会社 | Hinge frame for portable computer and structure for mounting the same |
| CN100345084C (en) * | 2004-07-16 | 2007-10-24 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
| CN100346261C (en) * | 2004-11-19 | 2007-10-31 | 童明辉 | Liquid phase cooling system for notebook computer |
| CN100447707C (en) * | 2003-10-01 | 2008-12-31 | 英特尔公司 | Method and system for switching reversible two-phase and refrigeration circuits |
| CN101901036A (en) * | 2010-07-02 | 2010-12-01 | 华南理工大学 | A cooling device for a notebook computer |
| CN102007832A (en) * | 2008-03-10 | 2011-04-06 | 固利吉股份有限公司 | Thermal bus or junction for the removal of heat from electronic components |
| CN101517185B (en) * | 2006-07-18 | 2013-06-12 | 力博特公司 | Integral swivel hydraulic connectors, door hinges, and methods and systems for the use thereof |
| TWI647994B (en) * | 2017-05-15 | 2019-01-11 | 廣達電腦股份有限公司 | Electronic device with heat-dissipation structure |
| CN110134214A (en) * | 2019-05-29 | 2019-08-16 | 英业达科技有限公司 | Portable electronic devices |
| CN112486300A (en) * | 2020-12-08 | 2021-03-12 | 苏州英普录电子有限公司 | Heat radiator of electronic equipment capable of conducting heat to upper cover |
| CN113672043A (en) * | 2021-08-30 | 2021-11-19 | 江苏精研科技股份有限公司 | High heat conduction notebook computer heat pipe hinge means and notebook computer |
| CN114980708A (en) * | 2022-07-21 | 2022-08-30 | 维沃移动通信有限公司 | Electronic equipment |
| US11914432B2 (en) | 2021-04-21 | 2024-02-27 | Acer Incorporated | Portable electronic device |
-
1997
- 1997-12-19 CN CN97108784A patent/CN1188269A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100447707C (en) * | 2003-10-01 | 2008-12-31 | 英特尔公司 | Method and system for switching reversible two-phase and refrigeration circuits |
| CN100340945C (en) * | 2004-07-06 | 2007-10-03 | Lg电子株式会社 | Hinge frame for portable computer and structure for mounting the same |
| CN100345084C (en) * | 2004-07-16 | 2007-10-24 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
| CN100346261C (en) * | 2004-11-19 | 2007-10-31 | 童明辉 | Liquid phase cooling system for notebook computer |
| CN101517185B (en) * | 2006-07-18 | 2013-06-12 | 力博特公司 | Integral swivel hydraulic connectors, door hinges, and methods and systems for the use thereof |
| CN102007832A (en) * | 2008-03-10 | 2011-04-06 | 固利吉股份有限公司 | Thermal bus or junction for the removal of heat from electronic components |
| CN101901036A (en) * | 2010-07-02 | 2010-12-01 | 华南理工大学 | A cooling device for a notebook computer |
| TWI647994B (en) * | 2017-05-15 | 2019-01-11 | 廣達電腦股份有限公司 | Electronic device with heat-dissipation structure |
| CN110134214A (en) * | 2019-05-29 | 2019-08-16 | 英业达科技有限公司 | Portable electronic devices |
| CN112486300A (en) * | 2020-12-08 | 2021-03-12 | 苏州英普录电子有限公司 | Heat radiator of electronic equipment capable of conducting heat to upper cover |
| US11914432B2 (en) | 2021-04-21 | 2024-02-27 | Acer Incorporated | Portable electronic device |
| CN113672043A (en) * | 2021-08-30 | 2021-11-19 | 江苏精研科技股份有限公司 | High heat conduction notebook computer heat pipe hinge means and notebook computer |
| CN114980708A (en) * | 2022-07-21 | 2022-08-30 | 维沃移动通信有限公司 | Electronic equipment |
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