CN118814005A - A method for preparing a high thermal conductivity Cu-Cr-GR composite material - Google Patents
A method for preparing a high thermal conductivity Cu-Cr-GR composite material Download PDFInfo
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Abstract
一种高导热Cu‑Cr‑GR复合材料的制备方法,包括如下步骤:(1)材料预处理;(2)粘结剂及铬、石墨浆料制备;(3)浆料涂覆;(4)放电等离子烧结;(5)时效处理。本发明通过加入过渡元素Cr和采用时效处理方法来改善铜‑石墨的界面性质,烧结后固溶在铜基体中的Cr原子经时效处理后扩散到界面处并与石墨反应生成铬的碳化物,减少了铜‑石墨的界面间隙,有效提高了复合材料的导热性能;以铜箔的方式引入铜基体,采用流延法加层叠法的方式来定向调控石墨取向,进一步提高了复合材料的导热性能,制备出高导热Cu‑Cr‑GR复合材料,解决了传统粉末冶金法制备铜‑石墨复合材料难以控制石墨在铜基体中取向,限制其导热提高的问题。A method for preparing a high thermal conductivity Cu-Cr-GR composite material comprises the following steps: (1) material pretreatment; (2) preparation of a binder and chromium and graphite slurry; (3) slurry coating; (4) spark plasma sintering; (5) aging treatment. The present invention improves the interface properties of copper-graphite by adding the transition element Cr and adopting an aging treatment method. After sintering, the Cr atoms dissolved in the copper matrix diffuse to the interface after aging treatment and react with graphite to form chromium carbides, thereby reducing the interfacial gap of copper-graphite and effectively improving the thermal conductivity of the composite material; the copper matrix is introduced in the form of copper foil, and the graphite orientation is directional-controlled by a tape casting method plus a lamination method, thereby further improving the thermal conductivity of the composite material, preparing a high thermal conductivity Cu-Cr-GR composite material, and solving the problem that it is difficult to control the orientation of graphite in the copper matrix when preparing copper-graphite composite materials by the traditional powder metallurgy method, thereby limiting the improvement of its thermal conductivity.
Description
技术领域Technical Field
本发明属于铜-石墨复合材料高导热强化技术领域,具体涉及一种高导热Cu-Cr-GR复合材料的制备方法,通过引入过渡元素Cr和时效处理,并采用层叠法和放电等离子烧结制备。The invention belongs to the technical field of high thermal conductivity strengthening of copper-graphite composite materials, and specifically relates to a method for preparing a high thermal conductivity Cu-Cr-GR composite material, which is prepared by introducing a transition element Cr and performing aging treatment, and adopting a lamination method and spark plasma sintering.
背景技术Background Art
随着电子元器件向着大功率、高频化、小型化方向发展,传统的电子封装材料如W-Cu、Mo-Cu等已无法满足其较高的性能需求。铜-石墨复合材料凭借其优异的导热性能以及较低的热膨胀系数和密度,逐渐成为新一代电子封装材料。As electronic components develop towards high power, high frequency and miniaturization, traditional electronic packaging materials such as W-Cu and Mo-Cu can no longer meet their higher performance requirements. Copper-graphite composite materials have gradually become a new generation of electronic packaging materials due to their excellent thermal conductivity, low thermal expansion coefficient and density.
利用展向高热导率的石墨强化铜基体的热学性能是一种极佳的方法。石墨具有高热导率、低热膨胀系数以及低密度的特点,而且相比于其它碳材料,石墨的来源更广、价格更低,铜-石墨复合材料是一种出色的高导热材料。It is an excellent method to use graphite with high thermal conductivity in the extension direction to strengthen the thermal properties of the copper matrix. Graphite has the characteristics of high thermal conductivity, low thermal expansion coefficient and low density. Compared with other carbon materials, graphite has a wider source and lower price. Copper-graphite composite materials are excellent high thermal conductivity materials.
传统的铜-石墨复合材料制备方法是铜基体粉末与石墨均匀混合后烧结。但铜基体与石墨之间的润湿性较差,铜与石墨之间存在间隙,且无法保证石墨在铜基体横向平面内全部以展向分布,难以发挥其优异的导热性能。充分发挥材料的设计自由性,探索高性能、低成本的铜-石墨复合材料的制备工艺,推进高性能电子元器件封装材料发展,是时代的重要课题。The traditional method of preparing copper-graphite composite materials is to evenly mix copper matrix powder and graphite and then sinter them. However, the wettability between copper matrix and graphite is poor, there is a gap between copper and graphite, and it is impossible to ensure that the graphite is fully distributed in the transverse plane of the copper matrix in the span direction, making it difficult to exert its excellent thermal conductivity. It is an important topic of the times to give full play to the design freedom of materials, explore the preparation process of high-performance and low-cost copper-graphite composite materials, and promote the development of high-performance electronic component packaging materials.
发明内容Summary of the invention
本发明提供了一种高导热Cu-Cr-GR复合材料的制备方法,以铜箔的方式引入铜基体,通过流延法在铜基体上添加过渡元素Cr和镀铜石墨,再通过层叠法进行放电等离子烧结,定向调控了铜基体内石墨的取向,提高了复合材料的热导率,最后将烧结后样品进行时效处理,促进了烧结后固溶在基体中的Cr原子向边界扩散,减少了铜与石墨润湿性较差的问题,提高了材料的综合性能。The present invention provides a preparation method of a high thermal conductivity Cu-Cr-GR composite material, wherein a copper matrix is introduced in the form of copper foil, a transition element Cr and copper-plated graphite are added to the copper matrix by a tape casting method, and then spark plasma sintering is performed by a stacking method, so that the orientation of graphite in the copper matrix is directionally regulated and the thermal conductivity of the composite material is improved, and finally the sintered sample is subjected to aging treatment, so that the Cr atoms dissolved in the matrix after sintering are promoted to diffuse to the boundary, the problem of poor wettability between copper and graphite is reduced, and the comprehensive performance of the material is improved.
本发明的技术解决方案:The technical solution of the present invention:
一种高导热Cu-Cr-GR复合材料的制备方法,包括如下步骤:A method for preparing a high thermal conductivity Cu-Cr-GR composite material comprises the following steps:
(1)材料预处理(1) Material pretreatment
分别将铜箔、镀铜石墨置于HCl溶液中超声波清洗,以除去表面杂质和氧化物,将铜箔裁剪成一定尺寸形状,用筛网对镀铜石墨进行过筛处理,并用无水乙醇对铜箔和过筛后的镀铜石墨进行清洗直至表面没有明显污垢出现,之后将所需材料置于无水乙醇中保存;The copper foil and the copper-plated graphite are respectively placed in an HCl solution for ultrasonic cleaning to remove surface impurities and oxides, the copper foil is cut into a certain size and shape, the copper-plated graphite is sieved with a sieve, and the copper foil and the sieved copper-plated graphite are cleaned with anhydrous ethanol until no obvious dirt appears on the surface, and then the required materials are placed in anhydrous ethanol for storage;
(2)粘结剂及铬、石墨浆料制备(2) Preparation of binder, chromium and graphite slurry
在烧杯中按一定比例加入聚乙烯醇缩丁醛和无水乙醇,在30 ℃下磁力搅拌至清澈无胶状物,取出静置至无气泡产生,制得粘结剂,将一定量的高纯铬粉和步骤(1)中的镀铜石墨加入制备好的粘结剂中并进行磁力搅拌30 min至均匀混合,制得石墨浆料;Add polyvinyl butyral and anhydrous ethanol in a certain proportion to a beaker, stir magnetically at 30°C until the mixture is clear and free of colloid, take out and let stand until no bubbles are generated, thereby preparing a binder, add a certain amount of high-purity chromium powder and the copper-plated graphite in step (1) to the prepared binder, stir magnetically for 30 minutes until the mixture is evenly mixed, thereby preparing a graphite slurry;
(3)浆料涂覆(3) Slurry coating
采用刮刀将步骤(2)中制好的石墨浆料均匀涂覆在步骤(1)中的铜箔一侧表面,将涂覆浆料的铜箔置于管式炉中进行煅烧还原;Using a scraper, the graphite slurry prepared in step (2) is evenly coated on one side of the copper foil in step (1), and the copper foil coated with the slurry is placed in a tube furnace for calcination and reduction;
(4)放电等离子烧结(4) Spark plasma sintering
将步骤(3)中涂覆浆料的铜箔按相同方向依次放入石墨模具中,将石墨模具预压紧实后放入放电等离子烧结炉腔内,在真空环境下按照设定程序进行烧结,获得Cu-Cr-GR复合材料;The copper foil coated with the slurry in step (3) is sequentially placed in the same direction into the graphite mold, the graphite mold is pre-pressed and compacted, and then placed into the spark plasma sintering furnace chamber, and sintered according to the set program under a vacuum environment to obtain a Cu-Cr-GR composite material;
(5)时效处理(5) Timeliness treatment
将步骤(4)中获得的复合材料去除表面碳纸后,置于管式炉中通入高纯氢气进行时效处理,最终得到高导热Cu-Cr-GR复合材料。After removing the carbon paper from the surface of the composite material obtained in step (4), the composite material is placed in a tubular furnace and subjected to aging treatment by passing high-purity hydrogen gas, thereby finally obtaining a high thermal conductivity Cu-Cr-GR composite material.
所述步骤(1)中铜箔为电解铜箔,尺寸形状为厚度30 μm、直径25 mm的圆片。The copper foil in step (1) is an electrolytic copper foil, and its size and shape are a round piece with a thickness of 30 μm and a diameter of 25 mm.
所述步骤(1)中所需镀铜石墨的规格为500 μm。The specification of the copper-plated graphite required in step (1) is 500 μm.
所述步骤(1)中超声波清洗30 min,所用超声波清洗器为JK-5200B型超声波清洗器,功率为200 W,频率为40 KHz。In the step (1), the ultrasonic cleaning is performed for 30 min, and the ultrasonic cleaner used is a JK-5200B ultrasonic cleaner with a power of 200 W and a frequency of 40 KHz.
所述步骤(2)中聚乙烯醇缩丁醛和无水乙醇的质量比为1:8。In the step (2), the mass ratio of polyvinyl butyral to anhydrous ethanol is 1:8.
所述步骤(2)中铬粉的含量为0.25 wt%,镀铜石墨的含量为20 vol%。In the step (2), the content of chromium powder is 0.25 wt%, and the content of copper-plated graphite is 20 vol%.
所述步骤(2)中所用磁力搅拌器为DF-101S型集热式磁力搅拌器。The magnetic stirrer used in step (2) is a DF-101S heat-collecting magnetic stirrer.
所述步骤(3)中单片铜箔所涂覆浆料中铬粉的含量为0.25 wt%,镀铜石墨的含量为5.54 wt%。In the step (3), the content of chromium powder in the slurry coated on the single copper foil is 0.25 wt%, and the content of copper-plated graphite is 5.54 wt%.
所述步骤(3)中管式炉型号为GSL-1200X,设定程序如下:以10 ℃/min从室温升至200 ℃,保温2 h后随炉冷却至室温。The model of the tube furnace in step (3) is GSL-1200X, and the setting program is as follows: increase the temperature from room temperature to 200°C at 10°C/min, keep it at that temperature for 2 h, and then cool it to room temperature with the furnace.
所述步骤(3)中通入氢气流量为300 mL/min。The flow rate of hydrogen introduced in step (3) is 300 mL/min.
所述步骤(4)中放入石墨模具中铜箔的总质量为25 g。The total mass of the copper foil placed in the graphite mold in step (4) is 25 g.
所述步骤(4)中预压压强为10 MPa。The pre-pressing pressure in step (4) is 10 MPa.
所述步骤(4)中放电等离子烧结系统型号为LaboxTM-300,采用热电偶测温,设定程序如下:以100 ℃/min的速率升到600 ℃,保温5 min;接着以100 ℃/min的速率升到920℃,在此过程中将压力从10 MPa升到50 MPa,保温5 min后快速冷却。The spark plasma sintering system in step (4) is LaboxTM-300, and a thermocouple is used for temperature measurement. The program is set as follows: the temperature is raised to 600°C at a rate of 100°C/min and kept at that temperature for 5 min; then the temperature is raised to 920°C at a rate of 100°C/min, during which the pressure is increased from 10 MPa to 50 MPa, and the temperature is kept at that temperature for 5 min before rapid cooling.
所述步骤(5)中管式炉型号为GSL-1200X,设定程序如下:以10 ℃/min从室温升至400~500 ℃,保温2 h后随炉冷却至室温。The model of the tube furnace in step (5) is GSL-1200X, and the setting program is as follows: increase the temperature from room temperature to 400-500°C at 10°C/min, keep the temperature for 2 h, and then cool to room temperature with the furnace.
所述步骤(5)中通入氢气流量为300 mL/min。The flow rate of hydrogen introduced in step (5) is 300 mL/min.
本发明的有益效果:本发明通过加入过渡元素Cr和采用时效处理方法来改善铜-石墨的界面性质,烧结后固溶在铜基体中的Cr原子经时效处理后扩散到界面处并与石墨反应生成铬的碳化物,减少了铜-石墨的界面间隙,有效提高了复合材料的导热性能;本发明通过以铜箔的方式引入铜基体,采用流延法加层叠法的方式来定向调控石墨的取向,进一步提高了复合材料的导热性能,最终制备出高导热Cu-Cr-GR复合材料,解决了传统粉末冶金法制备铜-石墨复合材料难以控制石墨在铜基体中的取向,限制其导热提高的问题。The beneficial effects of the present invention are as follows: the present invention improves the interface properties of copper-graphite by adding the transition element Cr and adopting an aging treatment method; the Cr atoms dissolved in the copper matrix after sintering diffuse to the interface after aging treatment and react with graphite to generate chromium carbide, thereby reducing the interface gap between copper and graphite and effectively improving the thermal conductivity of the composite material; the present invention introduces the copper matrix in the form of copper foil and adopts a casting method plus a lamination method to directionally control the orientation of graphite, thereby further improving the thermal conductivity of the composite material, and finally preparing a high thermal conductivity Cu-Cr-GR composite material, thereby solving the problem that it is difficult to control the orientation of graphite in the copper matrix when preparing the copper-graphite composite material by the traditional powder metallurgy method, thereby limiting the improvement of its thermal conductivity.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为Cu-Cr-GR 450℃时效处理复合材料的表面形貌图;Figure 1 is a surface morphology of the Cu-Cr-GR composite material after aging treatment at 450°C;
图2为Cu-Cr-GR、Cu-Cr-GR 400℃时效处理、Cu-Cr-GR 450℃时效处理和Cu-Cr-GR500℃时效处理复合材料的X射线衍射图;FIG2 is an X-ray diffraction pattern of the Cu-Cr-GR, Cu-Cr-GR 400°C aging treatment, Cu-Cr-GR 450°C aging treatment and Cu-Cr-GR 500°C aging treatment composite materials;
图3为图2中红色虚线框区域的X射线衍射图。FIG3 is an X-ray diffraction pattern of the red dashed box area in FIG2 .
具体实施方式DETAILED DESCRIPTION
以下结合附图和具体实施案例对本发明做进一步说明。The present invention is further described below with reference to the accompanying drawings and specific implementation examples.
实施例1:Embodiment 1:
本实施例中的Cu-GR复合材料通过流延法、煅烧还原、层叠法、放电等离子烧结和时效处理制备而成,其中镀铜石墨的体积分数为20%,其余为电解铜箔。The Cu-GR composite material in this embodiment is prepared by tape casting, calcination reduction, lamination, spark plasma sintering and aging treatment, wherein the volume fraction of copper-plated graphite is 20%, and the rest is electrolytic copper foil.
本实施例中的Cu-GR复合材料制备方法如下:The preparation method of the Cu-GR composite material in this embodiment is as follows:
(1)材料预处理(1) Material pretreatment
使用HCl溶液对30 μm电解铜箔和镀铜石墨于常温下超声波清洗30 min,待清洗结束后将铜箔裁剪成直径25 mm的圆片并对镀铜石墨进行500 μm过筛处理,将聚乙烯醇缩丁醛和无水乙醇按质量比1:8加入烧杯中并在30 ℃下磁力搅拌至清澈无胶状物,取出静置至无气泡产生,制得粘结剂,称取1.38 g、500 μm镀铜石墨加入制备好的粘结剂中并进行磁力搅拌30 min至均匀混合,制得石墨浆料;HCl solution was used to ultrasonically clean 30 μm electrolytic copper foil and copper-plated graphite at room temperature for 30 min. After cleaning, the copper foil was cut into discs with a diameter of 25 mm and the copper-plated graphite was sieved through 500 μm. Polyvinyl butyral and anhydrous ethanol were added into a beaker at a mass ratio of 1:8 and magnetically stirred at 30 °C until clear and free of colloid. The mixture was taken out and allowed to stand until no bubbles were generated to prepare a binder. 1.38 g of 500 μm copper-plated graphite was weighed and added into the prepared binder and magnetically stirred for 30 min until uniformly mixed to prepare a graphite slurry.
(2)浆料涂覆(2) Slurry coating
称取23.62 g、30 μm裁剪好的电解铜箔,使用刮刀将制备好的石墨浆料均匀涂敷在铜箔的一侧表面,单片铜箔上镀铜石墨的质量分数为5.54%,随后将涂覆好浆料的铜箔置于管式炉中煅烧还原,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至200 ℃,保温2 h后随炉冷却至室温;Weigh 23.62 g of 30 μm cut electrolytic copper foil, use a scraper to evenly coat the prepared graphite slurry on one side of the copper foil, the mass fraction of copper-plated graphite on a single copper foil is 5.54%, then place the copper foil coated with the slurry in a tubular furnace for calcination and reduction, and introduce high-purity hydrogen at a flow rate of 300 mL/min. The program is set as follows: increase the temperature from room temperature to 200 °C at 10 °C/min, keep warm for 2 h, and then cool to room temperature with the furnace;
(3)放电等离子烧结(3) Spark plasma sintering
将还原后的铜箔按相同方向依次放入包裹碳纸的石墨模具中,将石墨模具预压紧实后放入放电等离子烧结炉腔内,在真空环境下按照设定程序进行烧结,采用热电偶测温,设定程序如下:以100 ℃/min的速率升到600 ℃,保温5 min;接着以100 ℃/min的速率升到920 ℃,在此过程中将压力从10 MPa升到50 MPa,保温5 min后快速冷却,获得Cu-GR复合材料。The reduced copper foil was placed in the graphite mold wrapped with carbon paper in the same direction. The graphite mold was pre-pressed and placed in the spark plasma sintering furnace chamber. It was sintered according to the set program under a vacuum environment. The temperature was measured by a thermocouple. The set program was as follows: the temperature was increased to 600 ℃ at a rate of 100 ℃/min and kept for 5 min; then it was increased to 920 ℃ at a rate of 100 ℃/min. During this process, the pressure was increased from 10 MPa to 50 MPa. After keeping for 5 min, it was quickly cooled to obtain the Cu-GR composite material.
实施例2:Embodiment 2:
本实施例中的Cu-Cr-GR复合材料通过流延法、煅烧还原、层叠法、放电等离子烧结和时效处理制备而成,其中Cr的质量分数为0.25%,镀铜石墨的体积分数为20%,其余为电解铜箔。The Cu-Cr-GR composite material in this embodiment is prepared by tape casting, calcination reduction, lamination, spark plasma sintering and aging treatment, wherein the mass fraction of Cr is 0.25%, the volume fraction of copper-plated graphite is 20%, and the rest is electrolytic copper foil.
本实施例中的Cu-Cr-GR复合材料制备方法如下:The preparation method of the Cu-Cr-GR composite material in this embodiment is as follows:
(1)材料预处理(1) Material pretreatment
使用HCl溶液对30 μm电解铜箔和镀铜石墨于常温下超声波清洗30 min,待清洗结束后将铜箔裁剪成直径25 mm的圆片并对镀铜石墨进行500 μm过筛处理,将聚乙烯醇缩丁醛和无水乙醇按质量比1:8加入烧杯中并在30 ℃下磁力搅拌至清澈无胶状物,取出静置至无气泡产生,制得粘结剂,称取0.06 g高纯铬粉和1.38 g、500 μm镀铜石墨加入制备好的粘结剂中并进行磁力搅拌30 min至均匀混合,制得石墨浆料;HCl solution was used to ultrasonically clean 30 μm electrolytic copper foil and copper-plated graphite at room temperature for 30 min. After cleaning, the copper foil was cut into discs with a diameter of 25 mm and the copper-plated graphite was sieved through 500 μm. Polyvinyl butyral and anhydrous ethanol were added into a beaker in a mass ratio of 1:8 and magnetically stirred at 30 °C until clear and free of colloid. The mixture was taken out and allowed to stand until no bubbles were generated to prepare a binder. 0.06 g of high-purity chromium powder and 1.38 g of 500 μm copper-plated graphite were weighed and added into the prepared binder and magnetically stirred for 30 min until uniformly mixed to prepare a graphite slurry.
(2)浆料涂覆(2) Slurry coating
称取23.56 g、30 μm裁剪好的电解铜箔,使用刮刀将制备好的石墨浆料均匀涂敷在铜箔的一侧表面,单片铜箔上铬的质量分数为0.25%,镀铜石墨的质量分数为5.54%,随后将涂覆好浆料的铜箔置于管式炉中煅烧还原,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至200 ℃,保温2 h后随炉冷却至室温;Weigh 23.56 g of 30 μm cut electrolytic copper foil, use a scraper to evenly coat the prepared graphite slurry on one side of the copper foil. The mass fraction of chromium on the single copper foil is 0.25%, and the mass fraction of copper-plated graphite is 5.54%. Then, the copper foil coated with the slurry is placed in a tubular furnace for calcination and reduction, and high-purity hydrogen is introduced at a flow rate of 300 mL/min. The program is set as follows: increase the temperature from room temperature to 200 °C at 10 °C/min, keep warm for 2 h, and then cool to room temperature with the furnace;
(3)放电等离子烧结(3) Spark plasma sintering
将还原后的铜箔按相同方向依次放入包裹碳纸的石墨模具中,将石墨模具预压紧实后放入放电等离子烧结炉腔内,在真空环境下按照设定程序进行烧结,采用热电偶测温,设定程序如下:以100 ℃/min的速率升到600 ℃,保温5 min;接着以100 ℃/min的速率升到920 ℃,在此过程中将压力从10 MPa升到50 MPa,保温5 min后快速冷却,获得Cu-Cr-GR复合材料。The reduced copper foil was placed in the graphite mold wrapped with carbon paper in the same direction. The graphite mold was pre-pressed and placed in the spark plasma sintering furnace chamber. It was sintered according to the set program under a vacuum environment. The temperature was measured by a thermocouple. The set program was as follows: the temperature was increased to 600 ℃ at a rate of 100 ℃/min and kept for 5 min; then it was increased to 920 ℃ at a rate of 100 ℃/min. During this process, the pressure was increased from 10 MPa to 50 MPa. After keeping for 5 min, it was quickly cooled to obtain the Cu-Cr-GR composite material.
实施例3:Embodiment 3:
本实施例中的Cu-Cr-GR复合材料通过流延法、煅烧还原、层叠法、放电等离子烧结和时效处理制备而成,其中Cr的质量分数为0.25%,镀铜石墨的体积分数为20%,其余为电解铜箔。The Cu-Cr-GR composite material in this embodiment is prepared by tape casting, calcination reduction, lamination, spark plasma sintering and aging treatment, wherein the mass fraction of Cr is 0.25%, the volume fraction of copper-plated graphite is 20%, and the rest is electrolytic copper foil.
本实施例中的Cu-Cr-GR复合材料制备方法如下:The preparation method of the Cu-Cr-GR composite material in this embodiment is as follows:
(1)材料预处理(1) Material pretreatment
使用HCl溶液对30 μm电解铜箔和镀铜石墨于常温下超声波清洗30 min,待清洗结束后将铜箔裁剪成直径25 mm的圆片并对镀铜石墨进行500 μm过筛处理,将聚乙烯醇缩丁醛和无水乙醇按质量比1:8加入烧杯中并在30 ℃下磁力搅拌至清澈无胶状物,取出静置至无气泡产生,制得粘结剂,称取0.06 g高纯铬粉和1.38 g、500 μm镀铜石墨加入制备好的粘结剂中并进行磁力搅拌30 min至均匀混合,制得石墨浆料;HCl solution was used to ultrasonically clean 30 μm electrolytic copper foil and copper-plated graphite at room temperature for 30 min. After cleaning, the copper foil was cut into discs with a diameter of 25 mm and the copper-plated graphite was sieved through 500 μm. Polyvinyl butyral and anhydrous ethanol were added into a beaker at a mass ratio of 1:8 and magnetically stirred at 30 °C until clear and free of colloid. The mixture was taken out and allowed to stand until no bubbles were generated to prepare a binder. 0.06 g of high-purity chromium powder and 1.38 g of 500 μm copper-plated graphite were weighed and added into the prepared binder and magnetically stirred for 30 min until uniformly mixed to prepare a graphite slurry.
(2)浆料涂覆(2) Slurry coating
称取23.56 g、30 μm裁剪好的电解铜箔,使用刮刀将制备好的石墨浆料均匀涂敷在铜箔的一侧表面,单片铜箔上铬的质量分数为0.25%,镀铜石墨的质量分数为5.54%,随后将涂覆好浆料的铜箔置于管式炉中煅烧还原,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至200 ℃,保温2 h后随炉冷却至室温;Weigh 23.56 g of 30 μm cut electrolytic copper foil, use a scraper to evenly coat the prepared graphite slurry on one side of the copper foil. The mass fraction of chromium on the single copper foil is 0.25%, and the mass fraction of copper-plated graphite is 5.54%. Then, the copper foil coated with the slurry is placed in a tubular furnace for calcination and reduction, and high-purity hydrogen is introduced at a flow rate of 300 mL/min. The program is set as follows: increase the temperature from room temperature to 200 °C at 10 °C/min, keep warm for 2 h, and then cool to room temperature with the furnace;
(3)放电等离子烧结(3) Spark plasma sintering
将还原后的铜箔按相同方向依次放入包裹碳纸的石墨模具中,将石墨模具预压紧实后放入放电等离子烧结炉腔内,在真空环境下按照设定程序进行烧结,采用热电偶测温,设定程序如下:以100 ℃/min的速率升到600 ℃,保温5 min;接着以100 ℃/min的速率升到920 ℃,在此过程中将压力从10 MPa升到50 MPa,保温5 min后快速冷却,获得Cu-Cr-GR复合材料;The reduced copper foil was placed in the same direction into the graphite mold wrapped with carbon paper, and the graphite mold was pre-pressed and compacted before being placed in the spark plasma sintering furnace. The sintering was performed according to the set program under vacuum environment, and the temperature was measured by thermocouple. The set program was as follows: the temperature was increased to 600 °C at a rate of 100 °C/min and kept for 5 min; then the temperature was increased to 920 °C at a rate of 100 °C/min, and the pressure was increased from 10 MPa to 50 MPa during the process. After keeping for 5 min, the temperature was rapidly cooled to obtain the Cu-Cr-GR composite material.
(4)时效处理(4) Timeliness treatment
将放电等离子烧结获得的Cu-Cr-GR复合材料去除表面碳纸后置于管式炉中进行时效处理,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至400 ℃,保温2 h后随炉冷却至室温,最终获得高导热Cu-Cr-GR复合材料。The Cu-Cr-GR composite material obtained by spark plasma sintering was removed from the surface carbon paper and placed in a tubular furnace for aging treatment. High-purity hydrogen was introduced at a flow rate of 300 mL/min. The program was set as follows: the temperature was increased from room temperature to 400 ℃ at 10 ℃/min, and then kept warm for 2 h and cooled to room temperature with the furnace. Finally, a high thermal conductivity Cu-Cr-GR composite material was obtained.
实施例4:Embodiment 4:
本实施例中的Cu-Cr-GR复合材料通过流延法、煅烧还原、层叠法、放电等离子烧结和时效处理制备而成,其中Cr的质量分数为0.25%,镀铜石墨的体积分数为20%,其余为电解铜箔。The Cu-Cr-GR composite material in this embodiment is prepared by tape casting, calcination reduction, lamination, spark plasma sintering and aging treatment, wherein the mass fraction of Cr is 0.25%, the volume fraction of copper-plated graphite is 20%, and the rest is electrolytic copper foil.
本实施例中的Cu-Cr-GR复合材料制备方法如下:The preparation method of the Cu-Cr-GR composite material in this embodiment is as follows:
(1)材料预处理(1) Material pretreatment
使用HCl溶液对30 μm电解铜箔和镀铜石墨于常温下超声波清洗30 min,待清洗结束后将铜箔裁剪成直径25 mm的圆片并对镀铜石墨进行500 μm过筛处理,将聚乙烯醇缩丁醛和无水乙醇按质量比1:8加入烧杯中并在30 ℃下磁力搅拌至清澈无胶状物,取出静置至无气泡产生,制得粘结剂,称取0.06 g高纯铬粉和1.38 g、500 μm镀铜石墨加入制备好的粘结剂中并进行磁力搅拌30 min至均匀混合,制得石墨浆料;HCl solution was used to ultrasonically clean 30 μm electrolytic copper foil and copper-plated graphite at room temperature for 30 min. After cleaning, the copper foil was cut into discs with a diameter of 25 mm and the copper-plated graphite was sieved through 500 μm. Polyvinyl butyral and anhydrous ethanol were added into a beaker in a mass ratio of 1:8 and magnetically stirred at 30 °C until clear and free of colloid. The mixture was taken out and allowed to stand until no bubbles were generated to prepare a binder. 0.06 g of high-purity chromium powder and 1.38 g of 500 μm copper-plated graphite were weighed and added into the prepared binder and magnetically stirred for 30 min until uniformly mixed to prepare a graphite slurry.
(2)浆料涂覆(2) Slurry coating
称取23.56 g、30 μm裁剪好的电解铜箔,使用刮刀将制备好的石墨浆料均匀涂敷在铜箔的一侧表面,单片铜箔上铬的质量分数为0.25%,镀铜石墨的质量分数为5.54%,随后将涂覆好浆料的铜箔置于管式炉中煅烧还原,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至200 ℃,保温2 h后随炉冷却至室温;Weigh 23.56 g of 30 μm cut electrolytic copper foil, use a scraper to evenly coat the prepared graphite slurry on one side of the copper foil. The mass fraction of chromium on the single copper foil is 0.25%, and the mass fraction of copper-plated graphite is 5.54%. Then, the copper foil coated with the slurry is placed in a tubular furnace for calcination and reduction, and high-purity hydrogen is introduced at a flow rate of 300 mL/min. The program is set as follows: increase the temperature from room temperature to 200 °C at 10 °C/min, keep warm for 2 h, and then cool to room temperature with the furnace;
(3)放电等离子烧结(3) Spark plasma sintering
将还原后的铜箔按相同方向依次放入包裹碳纸的石墨模具中,将石墨模具预压紧实后放入放电等离子烧结炉腔内,在真空环境下按照设定程序进行烧结,采用热电偶测温,设定程序如下:以100 ℃/min的速率升到600 ℃,保温5 min;接着以100 ℃/min的速率升到920 ℃,在此过程中将压力从10 MPa升到50 MPa,保温5 min后快速冷却,获得Cu-Cr-GR复合材料;The reduced copper foil was placed in the same direction into the graphite mold wrapped with carbon paper, and the graphite mold was pre-pressed and compacted before being placed in the spark plasma sintering furnace. The sintering was performed according to the set program under vacuum environment, and the temperature was measured by thermocouple. The set program was as follows: the temperature was increased to 600 °C at a rate of 100 °C/min and kept for 5 min; then the temperature was increased to 920 °C at a rate of 100 °C/min, and the pressure was increased from 10 MPa to 50 MPa during the process. After keeping for 5 min, the temperature was rapidly cooled to obtain the Cu-Cr-GR composite material.
(4)时效处理(4) Timeliness treatment
将放电等离子烧结获得的Cu-Cr-GR复合材料去除表面碳纸后置于管式炉中进行时效处理,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至450 ℃,保温2 h后随炉冷却至室温,最终获得高导热Cu-Cr-GR复合材料。The Cu-Cr-GR composite material obtained by spark plasma sintering was removed from the surface carbon paper and placed in a tubular furnace for aging treatment. High-purity hydrogen was introduced at a flow rate of 300 mL/min. The program was set as follows: the temperature was increased from room temperature to 450 ℃ at 10 ℃/min, and then kept warm for 2 h and cooled to room temperature with the furnace. Finally, a high thermal conductivity Cu-Cr-GR composite material was obtained.
实施例5:Embodiment 5:
本实施例中的Cu-Cr-GR复合材料通过流延法、煅烧还原、层叠法、放电等离子烧结和时效处理制备而成,其中Cr的质量分数为0.25%,镀铜石墨的体积分数为20%,其余为电解铜箔。The Cu-Cr-GR composite material in this embodiment is prepared by tape casting, calcination reduction, lamination, spark plasma sintering and aging treatment, wherein the mass fraction of Cr is 0.25%, the volume fraction of copper-plated graphite is 20%, and the rest is electrolytic copper foil.
本实施例中的Cu-Cr-GR复合材料制备方法如下:The preparation method of the Cu-Cr-GR composite material in this embodiment is as follows:
(1)材料预处理(1) Material pretreatment
使用HCl溶液对30 μm电解铜箔和镀铜石墨于常温下超声波清洗30 min,待清洗结束后将铜箔裁剪成直径25 mm的圆片并对镀铜石墨进行500 μm过筛处理,将聚乙烯醇缩丁醛和无水乙醇按质量比1:8加入烧杯中并在30 ℃下磁力搅拌至清澈无胶状物,取出静置至无气泡产生,制得粘结剂,称取0.06 g高纯铬粉和1.38 g、500 μm镀铜石墨加入制备好的粘结剂中并进行磁力搅拌30 min至均匀混合,制得石墨浆料;HCl solution was used to ultrasonically clean 30 μm electrolytic copper foil and copper-plated graphite at room temperature for 30 min. After cleaning, the copper foil was cut into discs with a diameter of 25 mm and the copper-plated graphite was sieved through 500 μm. Polyvinyl butyral and anhydrous ethanol were added into a beaker in a mass ratio of 1:8 and magnetically stirred at 30 °C until clear and free of colloid. The mixture was taken out and allowed to stand until no bubbles were generated to prepare a binder. 0.06 g of high-purity chromium powder and 1.38 g of 500 μm copper-plated graphite were weighed and added into the prepared binder and magnetically stirred for 30 min until uniformly mixed to prepare a graphite slurry.
(2)浆料涂覆(2) Slurry coating
称取23.56 g、30 μm裁剪好的电解铜箔,使用刮刀将制备好的石墨浆料均匀涂敷在铜箔的一侧表面,单片铜箔上铬的质量分数为0.25%,镀铜石墨的质量分数为5.54%,随后将涂覆好浆料的铜箔置于管式炉中煅烧还原,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至200 ℃,保温2 h后随炉冷却至室温;Weigh 23.56 g of 30 μm cut electrolytic copper foil, use a scraper to evenly coat the prepared graphite slurry on one side of the copper foil. The mass fraction of chromium on the single copper foil is 0.25%, and the mass fraction of copper-plated graphite is 5.54%. Then, the copper foil coated with the slurry is placed in a tubular furnace for calcination and reduction, and high-purity hydrogen is introduced at a flow rate of 300 mL/min. The program is set as follows: increase the temperature from room temperature to 200 °C at 10 °C/min, keep warm for 2 h, and then cool to room temperature with the furnace;
(3)放电等离子烧结(3) Spark plasma sintering
将还原后的铜箔按相同方向依次放入包裹碳纸的石墨模具中,将石墨模具预压紧实后放入放电等离子烧结炉腔内,在真空环境下按照设定程序进行烧结,采用热电偶测温,设定程序如下:以100 ℃/min的速率升到600 ℃,保温5 min;接着以100 ℃/min的速率升到920 ℃,在此过程中将压力从10 MPa升到50 MPa,保温5 min后快速冷却,获得Cu-Cr-GR复合材料;The reduced copper foil was placed in the same direction into the graphite mold wrapped with carbon paper, and the graphite mold was pre-pressed and compacted before being placed in the spark plasma sintering furnace. The sintering was performed according to the set program under vacuum environment, and the temperature was measured by thermocouple. The set program was as follows: the temperature was increased to 600 °C at a rate of 100 °C/min and kept for 5 min; then the temperature was increased to 920 °C at a rate of 100 °C/min, and the pressure was increased from 10 MPa to 50 MPa during the process. After keeping for 5 min, the temperature was rapidly cooled to obtain the Cu-Cr-GR composite material.
(4)时效处理(4) Timeliness treatment
将放电等离子烧结获得的Cu-Cr-GR复合材料去除表面碳纸后置于管式炉中进行时效处理,通入流速300 mL/min高纯氢气,设定程序如下:以10 ℃/min从室温升至500 ℃,保温2 h后随炉冷却至室温,最终获得高导热Cu-Cr-GR复合材料。The Cu-Cr-GR composite material obtained by spark plasma sintering was removed from the surface carbon paper and placed in a tubular furnace for aging treatment. High-purity hydrogen was introduced at a flow rate of 300 mL/min. The program was set as follows: the temperature was increased from room temperature to 500 ℃ at a rate of 10 ℃/min, and then cooled to room temperature with the furnace after keeping the temperature for 2 h. Finally, a high thermal conductivity Cu-Cr-GR composite material was obtained.
下表1是Cu-GR、Cu-Cr-GR、Cu-Cr-GR 400℃时效处理、Cu-Cr-GR 450℃时效处理和Cu-Cr-GR 500℃时效处理复合材料的热学性能和力学性能表。与未时效Cu-GR复合材料和Cu-Cr-GR复合材料对比,在加入Cr之后材料的热导率略有下降,原因是低热导率的Cr原子固溶在铜基体中导致整体热导率下降,在经时效处理后材料的热导率明显提升;引入Cr之后复合材料的抗拉强度略有上升,原因是烧结后Cr在铜基体中形成固溶体起到固溶强化的作用,致使抗拉强度得以提高,在经时效处理后材料的抗拉强度无明显趋势,但均高于原始状态的复合材料,证实了复合材料的抗拉强度是固溶强化和晶界强化共同作用的结果。Table 1 below is a table of thermal and mechanical properties of Cu-GR, Cu-Cr-GR, Cu-Cr-GR 400℃ aging treatment, Cu-Cr-GR 450℃ aging treatment and Cu-Cr-GR 500℃ aging treatment composite materials. Compared with the unaged Cu-GR composite material and the Cu-Cr-GR composite material, the thermal conductivity of the material decreases slightly after the addition of Cr, because the low thermal conductivity Cr atoms are dissolved in the copper matrix, resulting in a decrease in the overall thermal conductivity. After the aging treatment, the thermal conductivity of the material is significantly improved; after the introduction of Cr, the tensile strength of the composite material increases slightly, because after sintering, Cr forms a solid solution in the copper matrix, which plays a role in solid solution strengthening, resulting in an increase in tensile strength. After the aging treatment, there is no obvious trend in the tensile strength of the material, but it is higher than the composite material in the original state, which confirms that the tensile strength of the composite material is the result of the combined effect of solid solution strengthening and grain boundary strengthening.
表1 试样块体性能表Table 1 Performance table of sample blocks
由图1可以看出,Cu-0.25%wtCr-20%volGR(Cu)复合材料表面呈现出明显的基体-界面-石墨三个区域,界面层位于铜和石墨之间,改善了二者的界面性质,证明了时效处理可以通过生成界面层来改善界面性质。As can be seen from Figure 1, the surface of the Cu-0.25%wtCr-20%volGR(Cu) composite material shows three obvious regions of matrix-interface-graphite. The interface layer is located between copper and graphite, which improves the interface properties of the two, proving that aging treatment can improve the interface properties by generating an interface layer.
由图2和图3可以看出,复合材料经时效处理后检测出CrC相,而未处理的材料未检测出,证明了时效处理可以促进固溶在铜基体中的Cr原子扩散到晶界处并于石墨反应生成碳化物。As can be seen from Figures 2 and 3, CrC phase was detected in the composite material after aging treatment, while it was not detected in the untreated material, which proves that aging treatment can promote the diffusion of Cr atoms dissolved in the copper matrix to the grain boundaries and react with graphite to form carbides.
本发明加入过渡元素Cr和时效处理来改善铜-石墨的界面性质,烧结后固溶在铜基体中的Cr原子经时效处理后扩散到界面处并与石墨反应生成铬的碳化物,减少了铜-石墨的界面间隙,有效提高了复合材料的导热性能;传统粉末冶金法制备铜-石墨复合材料难以控制石墨在铜基体中的取向,限制了其导热的提高,通过以铜箔的方式引入铜基体,采用流延法加层叠法的方式来定向调控石墨的取向,进一步提高了复合材料的导热性能,最终制备出高导热Cu-Cr-GR复合材料。The invention improves the interface property of copper-graphite by adding transition element Cr and performing aging treatment. After sintering, Cr atoms dissolved in the copper matrix diffuse to the interface after aging treatment and react with graphite to generate chromium carbide, thereby reducing the interface gap between copper and graphite and effectively improving the thermal conductivity of the composite material. It is difficult to control the orientation of graphite in the copper matrix when preparing the copper-graphite composite material by the traditional powder metallurgy method, which limits the improvement of its thermal conductivity. By introducing the copper matrix in the form of copper foil and adopting the tape casting method plus the lamination method to directionally control the orientation of graphite, the thermal conductivity of the composite material is further improved, and finally a high thermal conductivity Cu-Cr-GR composite material is prepared.
上述实施例仅例示出本公开的具体实施方案,但是本公开的实施方案并不受上述内容的限制。在未实质性背离本公开的发明构思的主旨和原理的情况下所做出的任何改变、修饰、替代、组合、简化,均应为等效的置换方式,并包含在由权利要求所确定的保护范围之内。The above embodiments only illustrate specific implementations of the present disclosure, but the implementations of the present disclosure are not limited by the above contents. Any changes, modifications, substitutions, combinations, and simplifications made without substantially departing from the main idea and principle of the inventive concept of the present disclosure shall be equivalent replacement methods and shall be included in the scope of protection determined by the claims.
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