CN118812999A - A high yellowing resistance resin composition and its application - Google Patents

Abstract

The invention discloses a high yellowing resistance resin composition and application thereof. The high yellowing resistance resin composition comprises, by weight, 20-100 parts of a maleimide resin, 10-80 parts of an alicyclic epoxy resin, and 5-60 parts of a curing agent. The maleimide resin contains a cyclohexane group. The invention combines a maleimide resin containing a cyclohexane structure with an alicyclic epoxy resin to obtain a resin composition with excellent heat yellowing resistance and heat resistance, low CTE and water absorption. The main reason is that the maleimide resin molecular structure contains a cyclohexane structure, the chemical property of the structure is very stable, it is not easy to be oxidized, and it is resistant to space radiation. The alicyclic structure in the alicyclic epoxy resin molecular structure is also relatively stable in chemical property and is not easy to be oxidized. Therefore, the product after the two are cured has the characteristics of excellent yellowing resistance, heat resistance, low CTE and water absorption.

Description

A high yellowing resistance resin composition and its application

Technical Field

The invention relates to the technical field of electronic materials, and in particular to a high yellowing resistance resin composition and application thereof.

Background Art

MiniLED backlight technology is gradually maturing, and the industry is entering the fast lane. LCDs using MiniLED backlight can greatly improve the existing LCD screen effects, while the cost is relatively easy to control, and are expected to become the mainstream of the market. MiniLED backlight places higher requirements on the reflectivity, glass transition temperature, UV resistance, heat discoloration resistance, and heat dissipation of copper clad laminates. Among them, since high thermal radiation usually causes obvious discoloration on the surface of the substrate, it will affect the reflectivity of the copper clad laminate, so the requirements for heat discoloration resistance are getting higher and higher.

In terms of the performance requirements of LED for white copper clad laminates, in addition to the general performance requirements of conventional CCLs, there are also some special performance requirements: (1) High reflectivity of the board surface: In order to make the LED have a higher luminous efficiency, the white substrate needs to have a higher reflectivity in the blue light and near-ultraviolet light wavelength region, that is, the visible short wavelength region: 380nm-420nm, high thermal radiation board surface discoloration, long-term ultraviolet irradiation board surface discoloration, etc.; (2) Resistance to ultraviolet discoloration and heat discoloration: The white substrate not only needs to have a high reflectivity, but also needs to maintain a high reflectivity for a long time; (3) In addition to the above requirements, the printed circuit board on which the LED is installed also needs the substrate to have a high heat resistance and a low thermal expansion coefficient.

Japanese Patent Nos. 4634856, CN101218285A, CN103641998A and CN103459493A disclose the use of alicyclic epoxy resins with special structures for preparing white packaging substrates for LEDs. Although this resin is indeed better than traditional bisphenol A epoxy resins in terms of heat aging and light aging, due to the molecular structure of this alicyclic epoxy resin, the cross-linking density of the resin is low, and the resulting substrate has disadvantages such as a low glass transition temperature (Tg), poor heat resistance and a high thermal expansion coefficient.

Therefore, the present invention provides a highly yellowing-resistant resin composition and its application, so as to realize a novel copper-clad laminate material having excellent yellowing resistance, high heat resistance, low thermal expansion coefficient and water absorption resin composition and its application.

Summary of the invention

The purpose of the present invention is to provide a highly yellowing-resistant resin composition and application thereof, so as to fill the gap in the current technology.

The purpose of the present invention is achieved through the following technical solutions:

A highly yellowing-resistant resin composition, comprising, by weight:

20-100 parts of maleimide resin;

10-80 parts of alicyclic epoxy resin;

5-60 parts of curing agent;

The maleimide resin contains a cyclohexyl group selected from at least one of the structural formulas (1) to (4);

Preferably, the maleimide resin comprises at least structural formula (3).

Preferably, the alicyclic epoxy resin is as shown in structural formula (5);

Among them, n=1-10.

Preferably, the curing agent is selected from at least one of active ester compounds, phenol compounds, acid anhydride compounds, amine compounds, benzoxazine compounds, cyanate compounds, and polyphenylene ether compounds.

Preferably, the amine compound is selected from at least one of diaminodiphenylmethane, diaminodiphenyl sulfone, diethylenetriamine, dicarboxyphthalimide, dicyandiamide or imidazole.

Preferably, the acid anhydride compound is selected from at least one of phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, hydrogenated phthalic anhydride, nadic anhydride or styrene-maleic anhydride.

Preferably, the cyanate ester resin is selected from at least one of bisphenol A cyanate ester, bisphenol F cyanate ester, bisphenol E cyanate ester, bisphenol M cyanate ester, DCPD cyanate ester, naphthalene cyanate ester, phenolic cyanate ester and biphenyl cyanate ester.

Preferably, the phenolic compound is selected from at least one of bisphenol A phenolic resin, phenol phenolic resin, naphthalene phenolic resin, biphenyl phenol phenolic resin, biphenyl phenol naphthol resin, dicyclopentadiene phenol addition type resin, phenol aralkyl resin, and naphthol aralkyl resin.

Preferably, the active ester compound is a compound having structural formula (6):

Wherein, X is phenyl or naphthyl; j is 0 or 1; k is 0 or 1; and n represents a repeating unit, which is 0.25-1.25.

More preferably, when the curing agent is an active ester compound, the ester group, cyclohexane group and alicyclic group in the active ester are combined to further improve the yellowing resistance of the substrate.

Preferably, the maleimide resin comprises 10-90 parts of the structural formula (3) based on 100 parts by weight.

Preferably, the highly yellowing-resistant resin composition further comprises an inorganic filler in an amount of 30-200 parts.

Preferably, the inorganic filler is selected from at least one of spherical silica, titanium dioxide, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder.

Further preferably, the inorganic filler is selected from at least one of spherical silica, titanium dioxide, alumina or aluminum hydroxide.

More preferably, titanium dioxide is used, and rutile titanium dioxide is selected.

Preferably, the high yellowing resistance resin composition further comprises a coupling agent, the content of which is 0.01-5 parts, and the coupling agent is selected from a silane coupling agent or a titanate coupling agent.

Further preferably, the silane coupling agent is selected from the following structures:

The brands are KBM-573 produced by Shin-Etsu Chemical Co., Ltd. and Z-6883 produced by Dow Corning Corporation;

The brand is KBM-1003 produced by Shin-Etsu Chemical Co., Ltd.

The brand is KBM-1403 produced by Shin-Etsu Chemical Co., Ltd.

Preferably, the high yellowing resistance resin composition further comprises a catalyst in an amount of 0.01-5 parts, and the catalyst is selected from at least one of imidazole catalysts, pyridine catalysts, phosphorus catalysts, and organic metal salt catalysts.

Further preferably, the catalyst is an imidazole catalyst, and the imidazole catalyst is selected from at least one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole or modified imidazoles thereof.

Preferably, the highly yellowing-resistant resin composition does not include an aromatic maleimide resin, wherein the aromatic maleimide resin contains a benzene ring group in the structure, such as BMI-1000, BMI-1000H, BMI-1100, BMI-1100H, BMI-2000, BMI-2300, BMI-3000, BMI-3000H, BMI-4000 manufactured by Yamato Chemical Industry Co., Ltd. H, BMI-5000, BMI-5100, BMI-7000 and BMI-7000H, etc.; BMI, BMI-70, BMI-80, etc. manufactured by KI Chemical Industry Co., Ltd. of Japan; MIR-3000, MIR-5000, etc. manufactured by Nippon Kayaku Co., Ltd.; X9-450, X9-470, etc. manufactured by DIC Corporation of Japan; D936, D937, D939, D950, etc. manufactured by Sichuan Dongcai Company.

Preferably, the highly yellowing-resistant resin composition does not include an aromatic epoxy resin, and the aromatic epoxy resin does not contain a benzene ring group in its structure, such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol E epoxy resin, phosphorus-containing epoxy resin, o-cresol epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, triphenylmethane epoxy resin, tetraphenylethane epoxy resin, biphenyl epoxy resin or naphthalene ring epoxy resin.

Preferably, the highly yellowing-resistant resin composition further comprises a flame retardant in an amount of 1-60 parts.

Preferably, the flame retardant is selected from at least one of bromine flame retardants, phosphorus flame retardants, nitrogen flame retardants, organosilicon flame retardants, organometallic flame retardants and inorganic flame retardants.

Preferably, the brominated flame retardant is selected from at least one of decabromodiphenyl ether, decabromodiphenyl ethane, brominated styrene or tetrabromophthalamide.

Preferably, the phosphorus flame retardant is selected from inorganic phosphorus, condensed phosphate compounds, phosphonic acid compounds, phosphinic acid compounds, phosphine oxide compounds, 9,10-dihydro-9-oxa-10-phosphophananthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphophananthrene-10-oxide, 10-phenyl-9,10-dihydro-9-oxa-10-phosphophananthrene-10-oxide, tri(2,6-dimethylphenyl)phosphine, (m is an integer from 1 to 5), At least one of the organic phosphorus-containing compounds such as phosphazene, wherein DOPO is

Preferably, the nitrogen-based flame retardant is selected from at least one of triazine compounds, cyanuric acid compounds, isocyanate compounds and phenothiazine.

Preferably, the organic silicon flame retardant is selected from at least one of organic silicon oil, organic silicon rubber, organic silicon resin and the like.

Preferably, the organic metal salt flame retardant is selected from at least one of ferrocene, acetylacetone metal complex, organic metal carbonyl compound and the like.

Preferably, the inorganic flame retardant is selected from at least one of aluminum hydroxide, magnesium hydroxide, aluminum oxide, barium oxide and the like.

Further preferably, the flame retardant is selected from at least one of SPB-100 manufactured by Otsuka Chemical, FP-100, FP-300B or FP-390 manufactured by Fushimi Pharmaceutical, PX-200, PX-201 or PX-202 manufactured by Daihachi Chemical, OP-935 or OP-930 manufactured by Clariant, SAYTEX8010, HP-7010 or BT-93W manufactured by Albemarle, OL3001 or OL5000 manufactured by FRX of the United States, etc.

The present application also claims to protect the application of a highly yellowing-resistant resin composition, wherein the highly yellowing-resistant resin composition is applied to prepregs, copper-clad laminates, insulating plates, insulating films, circuit substrates and electronic devices.

The highly yellowing-resistant resin composition is used in prepregs, copper-clad laminates, insulating plates, insulating films, circuit substrates and electronic devices.

Specifically, the prepreg comprises a reinforcing material and the above-mentioned high yellowing resistance resin composition attached to the surface of the reinforcing material.

Preferably, the preparation method of the prepreg is:

Dissolving the highly yellowing-resistant resin composition with a solvent to prepare a yellowing-resistant resin composition glue solution;

The reinforcing material is immersed in the yellowing-resistant resin composition glue solution, and the immersed reinforcing material is taken out and baked at a temperature of 100-180° C. for 1-15 minutes; after drying, the semi-cured sheet can be obtained.

Preferably, the solvent is selected from at least one of acetone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.

Preferably, the reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics. Preferably, the reinforcing material is glass fiber cloth, and the glass fiber cloth is preferably open fiber cloth or flat cloth. More preferably, the glass fiber cloth is E glass fiber cloth, S glass fiber cloth, T glass fiber cloth or Q glass fiber cloth.

In addition, when the reinforcing material is glass fiber cloth, the glass fiber cloth is chemically treated with a coupling agent in advance to improve the interface bonding between the resin composition and the glass fiber cloth; the coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent or a titanate coupling agent, so that the reinforcing material has good water resistance and heat resistance.

Preferably, the laminate comprises a piece of the above-mentioned prepreg and a metal foil arranged on at least one side of the prepreg, or the laminate comprises a composite sheet formed by overlapping a plurality of the above-mentioned prepregs and a metal foil arranged on at least one side of the composite sheet.

Preferably, the method for preparing the laminate is:

The laminated board can be obtained by coating one or both sides of the prepreg with metal foil, or by stacking at least two prepregs to form a composite sheet, coating one or both sides of the composite sheet with metal foil, and hot pressing.

The hot pressing conditions are: pressing for 2-4 hours at a pressure of 0.2-2 MPa and a temperature of 150-250°C.

Preferably, the metal foil is selected from copper foil or aluminum foil, and the thickness of the metal foil is not particularly limited, such as 5 μm, 8 μm, 12 μm, 18 μm, 35 μm or 70 μm.

Preferably, the insulating plate includes at least one prepreg sheet mentioned above.

Preferably, the insulating film comprises a carrier film and the above-mentioned high yellowing resistance resin composition attached to the surface of the carrier film, and the heat resistance of the insulating film is significantly improved.

Preferably, the method for preparing the insulating film is:

Dissolving the highly yellowing-resistant resin composition with a solvent to prepare a highly yellowing-resistant resin composition glue solution;

The insulating film can be obtained by coating the highly yellowing-resistant resin composition glue on the carrier film and heating and drying the carrier film coated with the highly yellowing-resistant resin composition glue.

Preferably, the solvent is selected from at least one of acetone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.

Preferably, the carrier film is selected from at least one of PET film, PP film, PE film and PVC film.

Preferably, the circuit substrate includes at least one of the prepreg and the laminate.

Preferably, the method for preparing the circuit substrate is a conventional technical means in the art and will not be described in detail here.

The present invention also provides an electronic device, comprising the above-mentioned circuit substrate.

Preferably, the electronic device comprises the above-mentioned circuit substrate.

Preferably, the method for preparing the electronic device is a conventional technical means in the art and will not be described in detail here.

Working mechanism of the present invention:

The present invention can obtain a resin composition with excellent heat-resistant yellowing and heat resistance, low CTE and water absorption by combining a maleimide resin containing a cyclohexane structure and an alicyclic epoxy resin. The main reason is that the maleimide resin molecular structure contains a cyclohexane structure, which has very stable chemical properties (the chair conformation of cyclohexane has no tension and exhibits chemical inertness like straight-linked alkanes), is not easily oxidized, and is resistant to space radiation; and the alicyclic structure in the alicyclic epoxy resin molecular structure is also relatively stable in chemical properties and is not easily oxidized. Therefore, the product after the two are cured has the characteristics of excellent yellowing resistance, heat resistance, low CTE and water absorption.

Due to the application of the above technical solution, the present invention has the following beneficial effects compared with the prior art:

1. The present invention solves the problem that the color difference of the substrate changes greatly after being heated;

2. The present invention solves the problem that the yellowing resistance of the substrate decays too quickly under ultraviolet light, heating and other environments;

3. The present invention solves the problem of poor heat resistance (Tg) of the substrate and high coefficient of thermal expansion (CTE);

4. The present invention has the characteristics of good yellowing resistance, excellent heat resistance, low thermal expansion coefficient and low water absorption.

DETAILED DESCRIPTION

In order to have a clearer understanding of the technical features, purposes and effects of the present invention, a specific implementation scheme is now described in detail.

The present invention is further described below in conjunction with the examples, but the present invention is not limited to the following examples. The implementation conditions used in the examples can be further adjusted according to the different requirements of specific use, and the implementation conditions not indicated are conventional conditions in the industry. The technical features involved in each embodiment of the present invention can be combined with each other as long as they do not conflict with each other.

Example 1

The present embodiment provides a highly yellowing-resistant resin composition, which comprises, by weight: 10 parts of bismaleimide structure 1, 10 parts of bismaleimide structure 3, 80 parts of alicyclic epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Example 2

The present embodiment provides a highly yellowing-resistant resin composition, which comprises, by weight: 20 parts of bismaleimide structure 2, 80 parts of bismaleimide structure 3, 20 parts of alicyclic epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Example 3

The present embodiment provides a highly yellowing-resistant resin composition, which comprises, by weight: 50 parts of bismaleimide structural formula 3, 50 parts of alicyclic epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Example 4

The present embodiment provides a highly yellowing-resistant resin composition, which comprises, by weight: 15 parts of bismaleimide structure 1, 25 parts of bismaleimide structure 3, 60 parts of alicyclic epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Example 5

The present embodiment provides a highly yellowing-resistant resin composition, which comprises, by weight: 30 parts of bismaleimide structure 2, 40 parts of bismaleimide structure 3, 30 parts of alicyclic epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Comparative Example 1

The present embodiment provides a high yellowing resistance resin composition, which includes, by weight: 20 parts of BMI-2300, 80 parts of SQAN-201K80 epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Comparative Example 2

The present embodiment provides a high yellowing resistance resin composition, which includes, by weight: 100 parts of BMI-3000, 20 parts of SQAN-201K80 epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Comparative Example 3

The present embodiment provides a high yellowing resistance resin composition, which includes, by weight: 50 parts of BMI-5000, 50 parts of SQAN-201K80 epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Comparative Example 4

The present embodiment provides a highly yellowing resistant resin composition, which comprises, by weight: 20 parts of BMI-2300, 20 parts of BMI-3000, 60 parts of SQAN-201K80 epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

Comparative Example 5

The present embodiment provides a highly yellowing-resistant resin composition, which includes, by weight: 100 parts of 1,5-bis(maleimide maleimide)-2-methyl-pentane, 20 parts of alicyclic epoxy, 30 parts of SQAN-201K80 epoxy, 30 parts of active ester, 0.10 parts of titanate coupling agent, 0.15 parts of TPP, 50 parts of rutile titanium dioxide, and 50 parts of aluminum oxide.

The components and addition amounts of Examples 1-5 and Comparative Examples 1-5 are shown in Table 1.

Table 1

The raw material brands or manufacturers of each component used in Examples 1-5 and Comparative Examples 1-5 are shown in Table 2.

Table 2

Components Brand or manufacturer Double horse structure 1 TCI S0853 Double horse structure 2 Kawaguchi Chemical IPBM Double horse structure 3 Kawaguchi Chemical CBM 1,5-Bis(maleimide maleimide)-2-methyl-pentane Kawaguchi Chemical 2MPBM Alicyclic Epoxy Daicel EHPE3105 (Structural Formula 5) Aromatic Double Horse 1 Yamato Chemical Co., Ltd. BMI-2300 Aromatic Double Horse 2 Yamato Chemical Co., Ltd. BMI-3000 Aromatic Double Horse 3 Yamato Chemical Co., Ltd. BMI-5000 Aromatic Epoxy Shengquan SQAN-201K80 Active ester DIC HPC-8000-65T

The above-mentioned embodiments and comparative examples also disclose a prepreg, comprising glass fiber cloth as a reinforcing material and a high yellowing resistance resin composition coated on the glass fiber cloth by an impregnation method; wherein the glass fiber cloth is a fiber-spreading cloth pre-treated with an epoxy silane coupling agent.

Specifically, the components of the high yellowing resistance resin composition of Examples 1-5 and Comparative Examples 1-5 in Table 1 were dissolved in butanone, stirred and mixed, and diluted into a glue solution with a solid content of 65wt%; the E glass fiber cloth 2116 used as a reinforcing material was pretreated with an epoxy silane coupling agent, immersed in the above-mentioned glue solution, taken out after infiltration, placed in a blast drying oven at 160°C, and baked for 3-6min to obtain a semi-cured sheet.

The above embodiments and comparative examples also disclose a laminate, which is prepared by the following method:

Take two of the above-mentioned semi-cured sheets, cut them to 300×300 mm, and stack them into a certain stacking structure. Then, place a low-profile electrolytic copper foil with a thickness of 12 μm on both sides of the combined sheet, place them in a vacuum hot press, and hot press them for 1.5 hours at a pressure of 1.5 MPa and a temperature of 220°C to obtain a copper-clad laminate.

The above-mentioned embodiments and comparative examples also disclose an insulating board, comprising at least one of the above-mentioned prepreg sheets.

The above-mentioned embodiments and comparative examples also disclose an insulating film, comprising a carrier film and the high yellowing resistance resin composition coated thereon.

The above-mentioned embodiment and comparative example also disclose a circuit substrate, including a prepreg sheet mentioned above, which is prepared by a conventional preparation method in the prior art, and will not be described in detail here.

The copper clad laminates obtained in Examples 1-5 and Comparative Examples 1-5 were tested for performance, and the test results are shown in Table 3.

Table 3

The properties of the copper-clad laminates prepared in the above examples and comparative examples were tested as follows:

(1) Tg: DMA, heating rate 10°C/min, frequency 10 Hz;

(2) Peel strength: The peel strength of the metal cover layer was tested according to the "after thermal stress" experimental conditions in the IPC-TM-6502.4.8 method;

(3) Color difference value: a new physical quantity that characterizes the LED luminous brightness and the various light reflectance characteristics of the substrate, namely the color difference value (ΔE*ab); the color difference value comprehensively represents the contribution of the substrate to the LED luminous efficiency. When the substrate changes color and the light reflectivity decreases significantly, the color difference value is large; the color difference value (ΔE*ab) is affected by three change values, namely the color difference change after heating treatment (Δa*), the color difference change after UV treatment (Δb*), and the change in LED brightness after a certain working time (ΔL*);

The color difference value (ΔE*ab) can be expressed by the following formula:

(ΔE*ab)＝(Δa*2+Δb*2+ΔL*2) ^1/2 ; Test sample size: 50×50 (mm), quantity 5, etched substrate, test the L, a and b values of the substrate, put the tested sample into a hot air dryer at 200°C for 20 hours of heating treatment, and then test its L, a and b values again after cooling, and then calculate the changes (ΔL, Δa and Δb) before and after the substrate treatment, and use the formula (ΔE*ab)＝(Δa*2+Δb*2+ΔL*2) ^1/2 to calculate the color difference value (average value of n＝5);

(4) Reflectivity: After cutting the double-sided copper-clad laminate into a size of 50×50 mm with a dicing saw, the surface copper foil was removed by etching to obtain a measurement sample; the reflectivity of the measurement sample at 457 nm was measured using a spectrophotometer (manufactured by Konica Minolta, Inc.: CM3610d) in accordance with JIS Z-8722 (average value of n=5);

Reflectivity after heating: After the sample obtained in (1) Tg is heated in a hot air dryer at 200°C for 20 hours, the reflectivity is measured in the same manner as the above reflectivity measurement (average value of n=5);

Reflectivity after light irradiation: The sample obtained in (1) Tg above was irradiated with ultraviolet light (wavelength: 295-450 nm) at an irradiation intensity of 100 mW/ ^cm2 for 24 hours in a weather tester dryer (SUV-F11, manufactured by IWASAKI ELECTRIC CO., LTD.), and then the reflectivity was measured in the same manner as the above reflectivity measurement (average value of n=5).

(5) X/Y axis thermal expansion coefficient (CTE): measured by TMA method in accordance with IPC-TM-650 method, with a heating rate of 10°C/min and a test temperature range of 30 to 300°C.

(6) Water absorption: The water absorption rate was measured according to the method of IPC-TM-6502.6.2.1. Specifically, three samples with a length × width of 10 cm × 10 cm and a thickness of 0.4 mm were taken, and the electrolytic copper foil on both sides was removed. The samples were dried at 100°C for 2 h, and weighed. The weight was recorded as W1. The samples were then placed in a pressure cooker and treated at 121°C and 2 atmospheres for 6 h. The samples were weighed and the weight was recorded as W2. The water absorption rate was measured as (W2-W1)/W1×100%.

In summary, the present invention solves the problem of large color difference change of the substrate after being heated; solves the problem of too fast yellowing resistance attenuation of the substrate under ultraviolet rays, heating and other environments; solves the problem of poor heat resistance (Tg) and low thermal expansion coefficient (CTE) of the substrate; and the present invention has the characteristics of good yellowing resistance, excellent heat resistance, low thermal expansion coefficient and low water absorption.

The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims (10)

1. A highly yellowing-resistant resin composition, characterized in that, by weight, it comprises: 20-100 parts of maleimide resin; 10-80 parts of alicyclic epoxy resin; 5-60 parts of curing agent; The maleimide resin contains a cyclohexyl group selected from at least one of the structural formulas (1) to (4); 2. A highly yellowing-resistant resin composition according to claim 1, characterized in that the alicyclic epoxy resin is as shown in structural formula (5); Among them, n=1-10. 3. A highly yellowing-resistant resin composition according to claim 1, characterized in that the curing agent is selected from at least one of active ester compounds, phenolic compounds, acid anhydride compounds, amine compounds, benzoxazine compounds, cyanate compounds, and polyphenylene ether compounds. 4. A highly yellowing-resistant resin composition according to claim 1, characterized in that the maleimide resin comprises at least structural formula (3). 5. A highly yellowing-resistant resin composition according to claim 4, characterized in that the maleimide resin comprises 10-90 parts of the structural formula (3) based on 100 parts by weight. 6. A highly yellowing resistant resin composition according to claim 1, characterized in that the highly yellowing resistant resin composition further comprises an inorganic filler in an amount of 30-200 parts. 7. A highly yellowing-resistant resin composition according to claim 6, characterized in that the inorganic filler is selected from at least one of spherical silica, titanium dioxide, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder. 8. A highly yellowing resistant resin composition according to claim 1, characterized in that the highly yellowing resistant resin composition does not contain an aromatic maleimide resin. 9 . The highly yellowing-resistant resin composition according to claim 1 , wherein the highly yellowing-resistant resin composition does not contain an aromatic epoxy resin. 10. Use of the highly yellowing-resistant resin composition according to any one of claims 1 to 9 in prepregs, copper-clad laminates, insulating boards, insulating films, circuit substrates and electronic devices.