CN118809454B - A semiconductor polishing liquid supply and delivery device - Google Patents
A semiconductor polishing liquid supply and delivery device Download PDFInfo
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- CN118809454B CN118809454B CN202411176154.6A CN202411176154A CN118809454B CN 118809454 B CN118809454 B CN 118809454B CN 202411176154 A CN202411176154 A CN 202411176154A CN 118809454 B CN118809454 B CN 118809454B
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- 239000007788 liquid Substances 0.000 title claims abstract description 147
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000005498 polishing Methods 0.000 title claims description 16
- 239000012530 fluid Substances 0.000 claims abstract description 43
- 238000007667 floating Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 8
- 239000010720 hydraulic oil Substances 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000011550 stock solution Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 abstract description 8
- 239000000654 additive Substances 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to the technical field of semiconductor grinding, and discloses a semiconductor grinding fluid supply and conveying device, which comprises a base, wherein a grinding groove is formed in the middle of the upper surface of the base, the inner wall of the grinding groove is fixedly connected with a fixed clamping seat, a plurality of telescopic rods are fixedly arranged on the upper surface of the base, and the telescopic ends of the telescopic rods are fixedly connected with a fixed fluid ring. According to the invention, the floating strong magnetic block floats on the liquid level of the grinding fluid, when the grinding fluid in the liquid storage shell is consumed, the floating strong magnetic block moves downwards along with the liquid level, so that the strong magnetic body is driven to move downwards, the indication number of the pointer is changed, and the residual quantity of the grinding fluid is displayed in real time, thereby solving the problems that the existing grinding fluid contains chemical additives which are corrosive and can corrode the material of the liquid level sensor, grinding particles can also block the detection part or the connecting pipeline of the sensor, the normal work of the sensor is influenced, and the sensor is seriously disabled directly.
Description
Technical Field
The invention belongs to the technical field of semiconductor grinding, and particularly relates to a semiconductor grinding fluid supply and conveying device.
Background
Chemical Mechanical Polishing (CMP), also known as chemical mechanical planarization, is one method of planarizing a wafer surface. The roughness of the wafer surface can be greatly reduced by using chemical mechanical polishing, so as to achieve the effect of high-precision planarization. When the chemical mechanical polishing is performed, the polishing liquid supply system outputs the polishing liquid to the polishing area in the CMP machine table, and the polishing liquid can effectively reduce the unevenness of the wafer surface.
The semiconductor polishing liquid is stored in a light-tight sealed container for preventing oxidation by air and decomposition by light. In order to observe the residual quantity of the grinding fluid pumped out by the liquid pump in the light-resistant sealed container, a liquid level sensor is usually arranged at the bottom, but the grinding fluid contains chemical additives which are corrosive and can corrode the materials of the sensor, grinding particles in the grinding fluid can also block the detection part or the connecting pipeline of the sensor, the normal operation of the sensor is affected, and the sensor is seriously disabled. Secondly, the supply pressure of the polishing liquid needs to be kept stable and avoid fluctuation to ensure uniform distribution of the polishing liquid, but as the polishing liquid in the container is consumed, the inlet pressure of the liquid pump is reduced, thereby seriously affecting the actual supply pressure of the pump, and the reduction of the supply pressure leads to reduction of the polishing rate and deterioration of the polishing effect.
Disclosure of Invention
The present invention is directed to a semiconductor polishing liquid supply and conveying device, which solves the problems set forth in the background art.
In order to achieve the above purpose, the technical scheme is that the semiconductor grinding liquid supply and conveying device comprises a base, a grinding groove is formed in the middle of the upper surface of the base, a fixed clamping seat is fixedly connected to the inner wall of the grinding groove, a plurality of telescopic rods are fixedly installed on the upper surface of the base, a fixed liquid ring is fixedly connected to the telescopic ends of the telescopic rods, a plurality of connecting plates are fixedly connected to the inner side of the fixed liquid ring, a motor is fixedly installed at the inner ends of the connecting plates, a grinding head is fixedly connected to the bottom end of an output shaft of the motor, a liquid outlet pipe is communicated with the lower surface of the fixed liquid ring, a spray head is movably sleeved at the lower end of the liquid outlet pipe, a liquid storage shell is fixedly connected to the left side of the base, a liquid inlet pipe is fixedly installed at the left side of the liquid storage shell, a liquid supply pipe is communicated with the back side of the liquid storage shell, a liquid pump is connected to the right end of the liquid supply pipe, a connecting hose is fixedly connected to the upper surface of the liquid storage shell, a liquid storage cavity is fixedly connected to the inner side of the fixed liquid ring, a motor is fixedly installed between the liquid storage shell and the liquid storage cavity, a one-way valve is fixedly installed at the inner end of the connecting pipe, the front end of the air outlet pipe is fixedly connected to the front end of the air outlet pipe is communicated with the front end of the connecting pipe, and the front end of the connecting pipe is communicated with the front end of the connecting pipe.
Preferably, the middle part sliding connection of intercommunication chamber has the strong magnetic path of floating, the inside fixedly connected with of intercommunication chamber two limiting plates, the right side fixedly connected with sliding tray of intercommunication chamber, the middle part sliding connection of sliding tray has strong magnet, the right side fixedly connected with pointer of strong magnet, the lower surface fixedly connected with current-conducting plate of pointer, the front bottom fixed mounting of intercommunication chamber has the alarm.
Preferably, the control mechanism comprises a rectangular block, a sliding block is connected inside the rectangular block in a sliding manner, two compression springs are fixedly connected to the right side of the sliding block, the compression springs are fixedly connected with the inner wall of the rectangular block, a C-shaped pipe is fixedly connected to the left side of the rectangular block, a fixing ring is fixedly connected to the lower end of the C-shaped pipe, an I-shaped rod is connected to the middle portion of the fixing ring in a sliding manner, the sliding block is connected with the upper end of the C-shaped pipe in a sliding manner, the middle portion of the rectangular block is fixedly connected with the liquid storage shell and is communicated with the inner portion of the rectangular block, and the C-shaped pipe is fixedly connected with the liquid storage shell.
Preferably, the waste liquid cavity is arranged in the base, a plurality of through holes are arranged at the bottom of the grinding groove, and the communication cavity is fixedly connected with the base.
Preferably, the connecting hose is communicated with the fixed liquid ring, the connecting hose is made of rubber materials, and the liquid pump is fixedly connected with the back surface of the base.
Preferably, the floating strong magnetic block adsorbs the strong magnetic body and the upper surface is in same horizontal plane, the front of intercommunication chamber is carved with the liquid level scale mark, the direction of opening of check valve is the directional gas storage chamber of stock solution shell.
Preferably, the lower end of the C-shaped pipe penetrates into the liquid storage shell, the C-shaped pipe between the left side of the rectangular block and the I-shaped rod is filled with hydraulic oil, and a round hole is formed in the middle of the sliding block.
The beneficial effects of the invention are as follows:
1. According to the invention, the floating strong magnetic block floats on the liquid level of the grinding fluid, when the grinding fluid in the liquid storage shell is consumed, the floating strong magnetic block moves downwards along with the liquid level, so that the strong magnetic body is driven to move downwards, the indication of the pointer is changed, the residual quantity of the grinding fluid is displayed in real time, when the pointer is positioned at the lowest position, the upper end of the alarm is contacted with the conductive plate, so that the alarm gives out an alarm, and meanwhile, the liquid pump stops working, thereby solving the problems that the existing grinding fluid contains chemical additives which are corrosive and can corrode the material of the liquid level sensor, the grinding particles can also block the detection part or connecting pipeline of the sensor, the normal work of the sensor is influenced, and the sensor is seriously disabled directly.
2. When the grinding liquid in the liquid storage shell is consumed, the pressure born by the right end of the H-shaped rod is reduced, the compression spring can push the sliding block to move leftwards, the hydraulic oil in the C-shaped pipe can push the H-shaped rod to move rightwards, the sliding block moves leftwards, the round hole of the sliding block and the opening formed by the rectangular block can open the air outlet pipe and the liquid storage shell, and the protective gas in the gas storage cavity enters the liquid storage shell, so that the pressure at the right end of the H-shaped rod is increased to an initial value, namely the pressure of the grinding liquid at the left end of the liquid supply pipe is kept unchanged, and the problems that the inlet pressure of the liquid pump is reduced along with the consumption of the grinding liquid in the container, the actual liquid supply pressure of the pump is seriously influenced, the grinding rate is reduced and the grinding effect is poor due to the reduction of the supply pressure are solved.
3. According to the invention, as the grinding fluid enters the interior of the liquid storage shell, the floating strong magnetic block can move upwards, meanwhile, the pressure of the protective gas above the interior of the liquid storage shell is larger than the initial pressure born by the right end of the H-shaped rod, an opening is not formed between the round hole of the sliding block and the rectangular block, but the one-way valve is opened, so that the protective gas above the interior of the liquid storage shell enters the interior of the gas storage cavity, and the recycling of the protective gas is realized.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic top view of the structure of the present invention;
FIG. 3 is a schematic view of a gas storage chamber of the present invention in semi-section;
FIG. 4 is a schematic diagram of a control mechanism of the present invention in semi-section;
FIG. 5 is a schematic view of a communication chamber according to the present invention in semi-section.
The device comprises a base, a grinding tank, a fixed clamping seat, a telescopic rod, a fixed liquid ring, a connecting plate, a 7, a motor, a 8, a grinding head, a 9, a liquid outlet pipe, a 10, a spray head, a 11, a liquid storage shell, a 12, a liquid inlet pipe, a 13, a liquid supply pipe, a 14, a liquid pump, a 15, a connecting hose, a 16, a gas storage cavity, a 17, a one-way valve, a 18, a gas outlet pipe, a 19, a control mechanism, a 191, a rectangular block, a 192, a sliding block, a 193, a compression spring, a 194, a C-shaped pipe, a 195, a fixed ring, a 196, an I-shaped rod, a 20, a communicating pipe, a 21, a communicating cavity, a 22, a floating strong magnet, a 23, a limiting plate, a 24, a sliding groove, a 25, a strong magnet, a 26, a pointer, a 27, a conductive plate, a 28 and an alarm.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 5, the embodiment of the invention provides a semiconductor grinding fluid supply and conveying device, which comprises a base 1, wherein a grinding groove 2 is formed in the middle of the upper surface of the base 1, the inner wall of the grinding groove 2 is fixedly connected with a fixed clamping seat 3, a plurality of telescopic rods 4 are fixedly arranged on the upper surface of the base 1, the telescopic ends of the telescopic rods 4 are fixedly connected with a fixed fluid ring 5, the inner side of the fixed fluid ring 5 is fixedly connected with a plurality of connecting plates 6, the inner end of the connecting plates 6 is fixedly provided with a motor 7, the bottom end of an output shaft of the motor 7 is fixedly connected with a grinding head 8, the lower surface of the fixed fluid ring 5 is communicated with a liquid outlet pipe 9, the lower end of the liquid outlet pipe 9 is movably sleeved with a spray head 10, the left side of the base 1 is fixedly connected with a liquid storage shell 11, the left side of the liquid storage shell 11 is fixedly provided with a liquid inlet pipe 12, the back of the liquid storage shell 11 is communicated with a liquid supply pipe 13, the right end of the liquid supply pipe 13 is connected with a liquid pump 14, the upper surface of the liquid pump 14 is fixedly connected with a connecting hose 15, the upper surface of the liquid storage shell 11 is fixedly connected with a gas storage cavity 16, a one-way valve 17 is fixedly arranged between the liquid storage shell 11 and the gas storage cavity 16, the front side of the gas storage cavity 16 is communicated with a gas outlet pipe 18, the lower end of the gas outlet pipe 18 is fixedly connected with a control mechanism 19, the front side of the liquid storage shell 11 is communicated with two communicating pipes 20, the right end of each communicating pipe 20 is communicated with a communicating cavity 21, the effect is that the floating strong magnetic block 22 can move upwards along with the grinding fluid entering the liquid storage shell 11 through the liquid inlet pipe 12, meanwhile, the pressure of the protective gas above the inside of the liquid storage shell 11 is higher than the initial pressure born by the right end of the H-shaped rod 196, an opening is not formed between a round hole of the sliding block 192 and the rectangular block 191, but the one-way valve 17 is opened, so that the protective gas above the inside of the liquid storage shell 11 enters the inside of the gas storage shell 16, thereby realizing the recycling of the shielding gas.
The invention has the advantages that when the floating strong magnet 22 floats on the liquid level of the grinding fluid, the grinding fluid in the liquid storage shell 11 is consumed, the floating strong magnet 22 moves downwards along with the liquid level, so that the strong magnet 25 is driven to move downwards, the indication number of the pointer 26 is changed, the residual quantity of the grinding fluid is displayed in real time, when the pointer 26 is positioned at the lowest part, the upper end of the alarm 28 is contacted with the conductive plate 27, the alarm 28 gives an alarm, and meanwhile, the liquid pump 14 stops the mouth working, so that the problems that the chemical additive contained in the existing grinding fluid has corrosivity and causes corrosion to the material of the liquid level sensor, the grinding fluid also blocks the sensor or the sensor is directly influenced by the connection of the pipeline and the normal work position are solved.
Wherein the control mechanism 19 comprises a rectangular block 191, a sliding block 192 is connected in the rectangular block 191 in a sliding way, two compression springs 193 are fixedly connected to the right side of the sliding block 192, the compression springs 193 are fixedly connected with the inner wall of the rectangular block 191, a C-shaped pipe 194 is fixedly connected to the left side of the rectangular block 191, a fixed ring 195 is fixedly connected to the inner part of the lower end of the C-shaped pipe 194, an I-shaped rod 196 is connected in the middle of the fixed ring 195 in a sliding way, the sliding block 192 is connected in a sliding way with the upper end of the C-shaped pipe 194, the middle of the rectangular block 191 is fixedly connected with the liquid storage shell 11 and is communicated with the inner part of the liquid storage shell 11, the C-shaped pipe 194 is fixedly connected with the liquid storage shell 11, the lower end of the C-shaped pipe 194 penetrates into the liquid storage shell 11, hydraulic oil is filled in the C-shaped pipe 194 between the left side of the rectangular block 191 and the I-shaped rod 196, a round hole is formed in the middle of the sliding block 192, when the grinding fluid in the liquid storage shell 11 is consumed, the pressure on the right end of the H-shaped rod 196 is reduced, the compression spring 193 can push the sliding block 192 to move leftwards, the hydraulic oil in the C-shaped pipe 194 pushes the H-shaped rod 196 to move rightwards, the sliding block 192 moves leftwards, the round hole of the sliding block 192 and the opening formed by the rectangular block 191 enable the air outlet pipe 18 to be communicated with the liquid storage shell 11, and the protective gas in the air storage cavity 16 enters the liquid storage shell 11, so that the pressure on the right end of the H-shaped rod 196 is increased to an initial value, namely, the pressure of the grinding fluid on the left end of the liquid supply pipe 13 is kept unchanged, and the problems that the actual liquid supply pressure of the pump is seriously affected, the grinding rate is reduced and the grinding effect is poor due to the reduction of the supply pressure are solved.
Wherein, waste liquid chamber has been seted up to the inside of base 1, and a plurality of through-holes have been seted up to the bottom of grinding groove 2, and communication chamber 21 and base 1 fixed connection, coupling hose 15 and fixed liquid ring 5 intercommunication, coupling hose 15 are made by rubber materials, and the back fixed connection of liquid pump 14 and base 1, its effect is, and the grinding fluid after the use can flow in the inside of waste liquid chamber through the through-hole to retrieve the grinding fluid after the use.
Wherein, float strong magnetic path 22 adsorbs strong magnet 25 and the upper surface is in same horizontal plane, the front of intercommunication chamber 21 is carved with the liquid level scale mark, the direction of opening of check valve 17 is that stock solution shell 11 points to air storage chamber 16, its effect is, float strong magnetic path 22 can float on the liquid level of lapping liquid, the liquid level of lapping liquid changes, float strong magnetic path 22 can slide, float strong magnetic path 22 adsorbs strong magnet 25, thereby make the pointer reciprocate, and then make the demonstration of pointer change, when pointer 26 is located the below, the both ends of alarm 28 can contact with current conducting plate 27, thereby make alarm 28 send the police dispatch newspaper, liquid pump 14 will stop work simultaneously.
Working principle:
Before the invention is used, a proper amount of semiconductor grinding fluid is injected into the liquid storage shell 11 through the liquid inlet pipe 12, the most amount of semiconductor grinding fluid is that the floating strong magnet 22 is contacted with the upper limiting plate 23, the rest space in the liquid storage shell 11 is filled with protective gas with certain pressure, the interior of the gas storage cavity 16 is filled with the protective gas with the pressure higher than that in the liquid storage shell 11, the pressure at the bottom of the liquid storage shell 11 is higher, the H-shaped rod 196 is pushed to move leftwards, hydraulic oil in the C-shaped pipe 194 is extruded, and the hydraulic oil pushes the sliding block 192 to move rightwards so as to enable the compression spring 193 to be in a compression state;
When the semiconductor grinding machine is used, a semiconductor to be ground is placed into a notch of the fixed clamping seat 3, the fixed clamping seat 3 clamps and fixes the semiconductor, the angle of the spray head 10 is adjusted to a proper position, the motor 7 rotates to drive the grinding head 8 to rotate, meanwhile, the telescopic rod 4 shortens to drive the fixed liquid ring 5 to move downwards, so that the grinding head 8 moves downwards slowly and contacts with the semiconductor to be ground under the grinding machine, when the semiconductor grinding machine is in quick contact with the grinding machine, the liquid pump 14 works, semiconductor grinding liquid in the liquid storage shell 11 is sucked out through the liquid supply pipe 13 and pumped into the fixed liquid ring 5 through the connecting hose 15, finally the semiconductor grinding liquid enters the liquid outlet pipe 9, the spray head 10 opens the semiconductor grinding liquid to be sprayed on the semiconductor and the grinding head 8, and when the grinding head 8 grinds the semiconductor, the grinding liquid accelerates the grinding efficiency;
When the grinding fluid in the liquid storage shell 11 is consumed, the pressure born by the right end of the H-shaped rod 196 is reduced, the compression spring 193 pushes the sliding block 192 to move leftwards, the hydraulic oil in the C-shaped pipe 194 pushes the H-shaped rod 196 to move rightwards, the sliding block 192 moves leftwards, an opening formed by a round hole of the sliding block 192 and the rectangular block 191 is formed, the air outlet pipe 18 is communicated with the liquid storage shell 11, the shielding gas in the air storage cavity 16 enters the liquid storage shell 11, so that the pressure at the right end of the H-shaped rod 196 is increased to an initial value, in the process, the sliding block 192 moves rightwards, when the pressure born by the right end of the H-shaped rod 196 is the initial value, the opening formed by the round hole of the sliding block 192 and the rectangular block 191 disappears, so that the air outlet pipe 18 and the liquid storage shell 11 are not communicated any more, the pressure born by the H-shaped rod 196 is prevented from being overlarge, and the pressure of the grinding fluid at the left end of the liquid supply pipe 13 is kept unchanged;
As the grinding fluid in the liquid storage shell 11 is consumed, the floating strong magnetic block 22 moves downwards along with the liquid level, so that the strong magnetic body 25 is driven to move downwards, the indication number of the pointer 26 is changed, the residual quantity of the grinding fluid is displayed in real time, when the pointer 26 is positioned at the lowest position, the upper end of the alarm 28 is contacted with the conductive plate 27, so that the alarm 28 gives an alarm, and meanwhile, the liquid pump 14 stops working;
when the grinding fluid needs to be filled into the liquid storage shell 11 again, the grinding fluid enters the liquid storage shell 11 through the liquid inlet pipe 12, the floating strong magnetic block 22 moves upwards along with the grinding fluid entering the liquid storage shell 11, meanwhile, the pressure of the protective gas above the liquid storage shell 11 is larger than the initial pressure of the pressure applied to the right end of the H-shaped rod 196, an opening is not formed between a round hole of the sliding block 192 and the rectangular block 191, but the one-way valve 17 is opened, so that the protective gas above the liquid storage shell 11 enters the air storage cavity 16, and the recovery of the protective gas is realized.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a semiconductor grinding fluid supply conveying device, includes base (1), grinding groove (2) have been seted up at the upper surface middle part of base (1), the inner wall fixedly connected with fixed clamp seat (3) of grinding groove (2), the upper surface fixed mounting of base (1) has a plurality of telescopic links (4), a plurality of the telescopic link's (4) telescopic end fixedly connected with fixed liquid ring (5), the inboard fixedly connected with a plurality of connecting plates (6) of fixed liquid ring (5), the inner fixed mounting of connecting plate (6) has motor (7), the bottom fixedly connected with grinding head (8) of motor (7) output shaft, the lower surface intercommunication of fixed liquid ring (5) has drain pipe (9), the lower extreme activity of drain pipe (9) cup joints shower nozzle (10), its characterized in that, the left side fixedly connected with stock solution shell (11) of base (1), the left side fixedly connected with feed liquor pipe (12), the back intercommunication of stock solution shell (11) has feed liquor pipe (13), the fixed liquid pump (14) are connected with on the fixed surface of the upper surface of the air pump (14), a one-way valve (17) is fixedly arranged between the liquid storage shell (11) and the gas storage cavity (16), an air outlet pipe (18) is communicated with the front side of the gas storage cavity (16), a control mechanism (19) is fixedly connected with the lower end of the air outlet pipe (18), two communicating pipes (20) are communicated with the front side of the liquid storage shell (11), a communicating cavity (21) is communicated with the right end of the communicating pipe (20), a floating strong magnetic block (22) is slidingly connected with the middle part of the communicating cavity (21), two limiting plates (23) are fixedly connected with the inside of the communicating cavity (21), a sliding groove (24) is fixedly connected with the right side of the communicating cavity (21), a strong magnet (25) is slidingly connected with the middle part of the sliding groove (24), a pointer (26) is fixedly connected with a conducting plate (27) on the lower surface of the pointer (26), an alarm (28) is fixedly connected with the bottom end of the front side of the communicating cavity (21), the control mechanism (19) comprises a rectangular block (191), the rectangular block (191) is internally connected with a sliding block (192) and the two compression springs (193) are fixedly connected with the inner wall (193), the left side fixedly connected with C venturi tube (194) of rectangular piece (191), the inside fixedly connected with solid fixed ring (195) of lower extreme of C venturi tube (194), the middle part sliding connection of solid fixed ring (195) has worker shape pole (196), the upper end sliding connection of sliding block (192) and C venturi tube (194), the middle part and the stock solution shell (11) fixed connection of rectangular piece (191) and rather than inside intercommunication, C venturi tube (194) and stock solution shell (11) fixed connection.
2. The semiconductor grinding fluid supply and conveying device according to claim 1, wherein a waste liquid cavity is formed in the base (1), a plurality of through holes are formed in the bottom of the grinding groove (2), and the communicating cavity (21) is fixedly connected with the base (1).
3. A semiconductor polishing liquid supply and delivery apparatus according to claim 2, wherein the connection hose (15) is in communication with the stationary liquid ring (5), the connection hose (15) is made of a rubber material, and the liquid pump (14) is fixedly connected to the back surface of the base (1).
4. The semiconductor grinding fluid supply and conveying device according to claim 3, wherein the floating strong magnet (22) adsorbs the strong magnet (25) and the upper surface is in the same horizontal plane, the front surface of the communicating cavity (21) is marked with liquid level scale marks, and the opening direction of the one-way valve (17) is that the liquid storage shell (11) points to the air storage cavity (16).
5. The semiconductor grinding fluid supply and delivery device according to claim 4, wherein the lower end of the C-shaped pipe (194) penetrates into the liquid storage shell (11), the C-shaped pipe (194) between the left side of the rectangular block (191) and the I-shaped rod (196) is filled with hydraulic oil, and a round hole is formed in the middle of the sliding block (192).
Priority Applications (1)
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CN202411176154.6A CN118809454B (en) | 2024-08-26 | 2024-08-26 | A semiconductor polishing liquid supply and delivery device |
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CN202411176154.6A CN118809454B (en) | 2024-08-26 | 2024-08-26 | A semiconductor polishing liquid supply and delivery device |
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CN118809454A CN118809454A (en) | 2024-10-22 |
CN118809454B true CN118809454B (en) | 2024-12-13 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115464561A (en) * | 2022-09-22 | 2022-12-13 | 上海集成电路装备材料产业创新中心有限公司 | Grinding fluid supply device, system and method |
CN117067093A (en) * | 2023-09-14 | 2023-11-17 | 冠礼控制科技(上海)有限公司 | Grinding fluid supply and conveying device of semiconductor grinding equipment |
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