CN118794794A - In-situ testing method, device, computer equipment and medium for tensile strength of blind holes - Google Patents

Abstract

The present application relates to the technical field of PCB performance testing, and in particular to an in-situ test method, device, computer equipment, computer-readable storage medium and computer program product for the tensile strength of blind holes. The method comprises: sampling to obtain a test board having at least three electroplated blind hole structures; performing surface roughness treatment on the electroplated blind hole structure and the pulling probe; controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature; pulling the pulling probe in-situ at a preset speed until a preset change occurs on the test board, and recording the tensile strength value of the electroplated blind hole structure. The use of this method can directly reflect the actual state of the electroplated blind hole structure and improve the accuracy of the tensile strength.

Description

In-situ testing method, device, computer equipment and medium for tensile strength of blind holes

Technical Field

The present application relates to the technical field of PCB performance testing, and in particular to a method, device, computer equipment, computer-readable storage medium and computer program product for in-situ testing of the tensile strength of blind holes.

Background Art

Blind vias are special groove structures that extend only to one surface of a printed circuit board. They are conductive holes that achieve interlayer interconnection without penetrating the entire board. As electronic products develop toward shorter, thinner, lighter, smaller, and higher performance, the wiring density and hole density of interconnected circuit boards carrying electronic devices are getting higher and higher, the manufacturing process is becoming more and more complex, and the reliability requirements are getting higher and higher. In order to meet the needs of multi-functional and high-reliability applications, the industry currently mainly uses electroplated blind via structure technology to achieve multi-layer interconnection and high-density interconnection.

At present, the method for measuring the tensile strength and elongation of the internal structure of the electroplated copper layer requires the preparation of standard samples on the substrate according to the set electroplating process conditions, and then the tensile measurement of the samples is performed to indirectly obtain the mechanical properties evaluation results of the metal structure. This method cannot directly reflect the actual state of the electroplated blind hole structure in terms of electroplating process, size/structural morphology, internal microscopic composition, etc. The measurement conditions vary greatly, and the measurement results are not accurate enough.

Summary of the invention

Based on this, it is necessary to provide an in-situ testing method, device, computer equipment, computer-readable storage medium and computer program product for the tensile strength of blind holes, which can directly reflect the actual state of the electroplated blind hole structure and improve the accuracy of the tensile strength.

In a first aspect, the present application provides an in-situ testing method for tensile strength of a blind hole, comprising:

Sampling and obtaining a test board having at least three electroplated blind hole structures;

Performing surface roughness treatment on the electroplated blind hole structure and the pulling probe;

Controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The pulling probe is pulled in situ at a preset speed until a preset change phenomenon occurs on the test plate, and the tensile strength value of the electroplated blind hole structure is recorded.

In one embodiment, the surface roughness treatment is performed on the electroplated blind hole structure, including:

According to the micro-sectioning sample preparation requirements, the surface of the electroplated blind hole structure is initially ground and polished;

The surface of the electroplated blind hole structure is activated under vacuum conditions by using a fast atomic beam source or plasma source technology.

In one embodiment, the method further comprises:

The surface of the drawing probe is activated under vacuum conditions by using a fast atomic beam source or a plasma source technology.

In one embodiment, the surface roughness treatment is performed on the pulling probe, comprising:

When the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated;

When the surface roughness of the pulling probe reaches the atomic level, the corresponding activation treatment is ended.

In one of the embodiments, the pulling probe includes a head bonding layer and a support body; wherein the head bonding layer is used to bond the electroplated blind hole structure, and the connection method between the head bonding layer and the support body includes welding.

In one embodiment, after recording the tensile strength value of the electroplated blind hole structure, the method further includes:

An average value of the tensile strength values of at least three electroplated blind hole structures is obtained and used as the target blind hole tensile strength value of the test board.

In a second aspect, the present application also provides an in-situ testing device for tensile strength of a blind hole, comprising:

A sampling module, used for sampling and obtaining a test board having at least three electroplated blind hole structures;

A processing module, used for performing surface roughness processing on the electroplated blind hole structure and the drawing probe;

A bonding module, used for controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

A moving module, used for in-situ drawing of the drawing probe at a preset speed until a preset change phenomenon occurs on the test plate;

The calculation module is used to record the tensile strength value of the electroplated blind hole structure.

In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

Sampling and obtaining a test board having at least three electroplated blind hole structures;

Performing surface roughness treatment on the electroplated blind hole structure and the pulling probe;

Controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The pulling probe is pulled in situ at a preset speed until a preset change phenomenon occurs on the test plate, and the tensile strength value of the electroplated blind hole structure is recorded.

In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the following steps are implemented:

Sampling and obtaining a test board having at least three electroplated blind hole structures;

Performing surface roughness treatment on the electroplated blind hole structure and the pulling probe;

Controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The pulling probe is pulled in situ at a preset speed until a preset change phenomenon occurs on the test plate, and the tensile strength value of the electroplated blind hole structure is recorded.

In a fifth aspect, the present application further provides a computer program product, including a computer program, which implements the following steps when executed by a processor:

Sampling and obtaining a test board having at least three electroplated blind hole structures;

Performing surface roughness treatment on the electroplated blind hole structure and the pulling probe;

Controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The pulling probe is pulled in situ at a preset speed until a preset change phenomenon occurs on the test plate, and the tensile strength value of the electroplated blind hole structure is recorded.

The above-mentioned blind hole tensile strength in-situ test method, device, computer equipment, computer readable storage medium and computer program product can be directly tested on the electroplated blind hole structure, avoiding the complex process of preparing standard samples in the traditional method, so as to more directly reflect the actual state of the blind hole. Through in-situ testing, that is, tensile measurement on the actual electroplated blind hole structure, the error caused by the difference in sample preparation and measurement conditions can be reduced, and the accuracy of the measurement results can be improved. The method simplifies the test process, reduces the time for sample preparation and measurement, and thus improves the efficiency of the test. The method is suitable for electroplated blind hole structures of different sizes and structures and has good versatility. Through surface roughness treatment and room temperature bonding technology, the connection stability during the test process can be ensured, the test error caused by poor connection can be reduced, and the reliability of the test results can be improved. The method can more accurately evaluate the mechanical properties of the internal organizational structure of the metal, and helps to understand the influence of the microscopic composition of the electroplated blind hole structure on its performance. The data obtained by this test method can help optimize the electroplating process and improve the quality and performance of the blind hole.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

FIG1 is a diagram showing the application environment of an in-situ test method for tensile strength of blind holes in one embodiment;

FIG2 is a schematic flow chart of a method for in-situ testing of tensile strength of blind holes in one embodiment;

FIG3 is a schematic diagram of a test process of the steps of an in-situ test method for tensile strength of blind holes in one embodiment;

FIG4 is a schematic flow chart of an in-situ test method for tensile strength of blind holes in another embodiment;

FIG5 is a structural block diagram of an in-situ testing device for tensile strength of blind holes in one embodiment;

FIG. 6 is a diagram showing the internal structure of a computer device in one embodiment.

DETAILED DESCRIPTION

In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

The in-situ tensile strength test method of a blind hole provided in an embodiment of the present application can be applied in an application environment as shown in FIG1 . The terminal 102 communicates with the server 104 via a network. The data storage system can store data that the server 104 needs to process. The data storage system can be integrated on the server 104, or it can be placed on a cloud or other network server.

The server 104 samples and obtains a test board having at least three electroplated blind hole structures; performs surface roughness treatment on the electroplated blind hole structure; controls the pulling probe to align with the electroplated blind hole structure, and bonds the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature; pulls the pulling probe in situ at a preset speed until a preset change phenomenon occurs on the test board, and records the tensile strength value of the electroplated blind hole structure.

The terminal 102 may be, but is not limited to, various personal computers, laptops, smart phones, and tablet computers. The server 104 may be an independent physical server, a server cluster or a distributed system composed of multiple physical servers, or a cloud server that provides cloud computing services.

In an exemplary embodiment, as shown in FIG2 , a method for in-situ testing of tensile strength of blind holes is provided, which is described by taking the method applied to the server in FIG1 as an example, and includes the following steps S202 to S208 . Among them:

Step S202, sampling and obtaining a test board having at least three electroplated blind hole structures.

Specifically, it refers to the selection of a portion of samples from a production batch. These samples should be representative of the characteristics and quality of the entire batch. It refers to the printed circuit board (PCB) used for testing. In this case, the test board is the object of the experiment, which is used to evaluate the performance of the electroplated blind via structure. It means that the selected test board should contain at least three blind vias, which are formed by the electroplating process and have specific structural characteristics. Blind vias are special conductive holes that extend only to one surface of the PCB and are used to achieve electrical connections between layers. It refers to a surface treatment process that deposits a metal layer (usually copper) on the inner wall of the blind hole by electrochemical methods to achieve the required conductivity and connectivity. The purpose of sampling is to obtain sufficiently representative samples to ensure that the test results can accurately reflect the performance of the electroplated blind via structure of the entire production batch.

Step S204, performing surface roughness treatment on the electroplated blind hole structure and the pulling probe.

Specifically, surface roughness refers to the microscopic geometric shape characteristics of the surface of an object, such as unevenness, texture, etc. In electroplated blind hole structures and pull-out probes, surface roughness affects the contact quality between them and the test equipment, and thus affects the accuracy of the test results. Through surface roughness treatment, the surface condition of electroplated blind hole structures and pull-out probes can be improved, the test errors caused by surface defects or unevenness can be reduced, and the reliability of the test results can be improved. Surface roughness treatment includes mechanical grinding, chemical polishing, electrolytic polishing and other methods, depending on the material, shape and required surface quality of the electroplated blind hole structure and the pull-out probe. The treated surface should meet certain quality standards, such as smoothness, cleanliness, etc., to ensure the connection stability and data accuracy during the test process. Surface roughness treatment is a necessary preparatory step before testing to create good conditions for subsequent pull-out tests. In in-situ testing, the pull-out probe needs to form a stable connection with the blind hole surface. Surface roughness treatment helps to improve the stability of this connection and reduce test errors caused by poor contact.

Step S206, controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature.

Specifically, the pull probe refers to the equipment component used to apply the pulling force, which will directly contact and connect with the electroplated blind hole structure. Make sure that the pull probe is accurately aligned with the center or predetermined position of the blind hole, in order to ensure that the pulling force is evenly applied in the desired direction and avoid the deviation of the test results caused by eccentric force.

The electroplated blind hole structure refers to a non-penetrating conductive hole formed on a PCB through an electroplating process for inter-layer interconnection.

Before bonding, the surface of the blind hole has been treated with a specific surface roughness to ensure that the contact surface with the pull-off probe is smooth and clean, thereby improving the quality of bonding and the accuracy of the test. It refers to the connection between the probe and the surface of the blind hole through physical or chemical methods at room temperature without the help of additional heat or pressure. Bonding at room temperature can avoid the interference of temperature factors on the test results. The purpose of bonding is to ensure that during the pull-off test, the pull-off probe and the blind hole maintain a stable connection, and there will be no test failure or inaccurate data due to unstable connection. Precise alignment and stable bonding are essential to obtain accurate test data, which can avoid errors caused by improper operation or connection problems.

For example, as shown in FIG3, the test temperature of room temperature bonding is (25°C ± 2°C) or lower, the pressure of the ultra-vacuum environment can be ( ^10-3 Pa ~ ^10-9 Pa) or lower, the pulling probe is aligned with the electroplated blind hole structure, the center axis alignment accuracy is controlled within 5nm-10nm, and the two interface coverage areas account for 60%-100% of the surface of the electroplated blind hole structure. Apply appropriate pressure to the pulling probe, the surface of the pulling probe contacts the surface of the electroplated blind hole structure, and strong adhesion is generated to achieve bonding.

Step S208, pulling the pulling probe in situ at a preset speed until a preset change phenomenon occurs on the test board, and recording the tensile strength value of the electroplated blind hole structure.

Specifically, the preset speed refers to the speed at which the pulling probe moves in the pulling test, which is set in advance. In the present application, the preset speed may be 0.005 mm/min-0.500 mm/min; slow pulling is performed within this moving speed, and this speed needs to be able to ensure the stability of the test and the accuracy of the data.

In-situ means that the test is performed in the original position of the sample without moving the sample from its normal position. Pull-out means that the probe applies an outward pulling force to the sample.

The preset change phenomena include the destruction of blind hole structure, the fracture of materials, the failure of connections, etc. These change phenomena will be defined in advance during the test as the judgment criteria for the end of the test.

During the test, the force and displacement applied by the pull-out probe are continuously monitored and recorded until the preset change phenomenon is reached. At this time, the maximum value of the recorded force is the tensile strength value of the electroplated blind hole structure. The purpose of the test is to evaluate the mechanical properties of the electroplated blind hole structure when subjected to tension, especially its maximum bearing capacity, that is, tensile strength.

In the above-mentioned in-situ test method for the tensile strength of blind holes, the test can be performed directly on the electroplated blind hole structure, avoiding the complex process of preparing standard specimens in the traditional method, thereby more directly reflecting the actual state of the blind hole. Through in-situ testing, that is, tensile measurement on the actual electroplated blind hole structure, the error caused by differences in sample preparation and measurement conditions can be reduced, and the accuracy of the measurement results can be improved. This method simplifies the test process, reduces the time for sample preparation and measurement, and thus improves the efficiency of the test. This method is suitable for electroplated blind hole structures of different sizes and structures, and has good versatility. Through surface roughness treatment and room temperature bonding technology, the connection stability during the test process can be ensured, the test error caused by poor connection can be reduced, and the reliability of the test results can be improved. This method can more accurately evaluate the mechanical properties of the internal organizational structure of the metal, and helps to understand the influence of the microscopic composition of the electroplated blind hole structure on its performance. The data obtained by this test method can help optimize the electroplating process and improve the quality and performance of the blind hole.

In an exemplary embodiment, as shown in FIG. 4 , surface roughness treatment is performed on the electroplated blind hole structure, including:

Step S402, performing preliminary grinding and polishing on the surface of the electroplated blind hole structure according to the micro-sectioning sample preparation requirements;

In addition, in order to further reduce the surface roughness of the electroplated blind hole structure, obtain a highly uniform surface of the blind hole structure, and improve the subsequent bonding effect, further fine grinding and polishing can be performed, and the process means include but are not limited to mechanical method, chemical-mechanical method, etc.;

Step S404, using a fast atomic beam source or a plasma source technology to activate the surface of the electroplated blind hole structure under vacuum conditions.

Specifically, the microsectioning sample preparation requirement is a sample preparation process, the purpose of which is to prepare the sample for microscopic examination or further surface analysis. Grinding is to use sandpaper or other grinding tools to remove the rough parts of the material surface and reduce the surface roughness. Polishing is to further smooth the surface, usually using polishing paste and polishing cloth to obtain a smoother and more reflective surface. For example, according to the microsectioning sample preparation requirements, the surface of the electroplated blind hole structure is ground and polished, and the ground surface is observed with a 100X-200X metallographic microscope until it is flat and bright. The surface roughness of the ground and polished sample is between 1μm and 5μm. These steps help to remove defects generated during the electroplating process, such as burrs, uneven coatings, etc.

Fast atom beam source or plasma source technology is a surface treatment technology used to improve the physical and chemical properties of the material surface. Fast atom beam sources (such as ion implantation) can introduce new atoms or molecules to the surface of the material, changing the composition and structure of the surface layer. Plasma source technology uses the active particles of plasma (such as ions, free radicals, etc.) to react with the surface of the material to clean or modify the surface. The vacuum environment can reduce the interference of air on the treatment process, such as the influence of oxidation and other contaminants.

Exemplarily, the ion source includes but is not limited to Ar+, He+, etc., and the activation chamber voltage is between 500V-5000V. In order to avoid re-oxidation of the surface of the electroplated blind hole structure after activation, the bombardment activation process must be controlled under ultra-vacuum protection, and the vacuum degree is set to ^10-3Pa ~ ^10-9Pa or lower. The ion source bombardment parameters are adjusted so that the average roughness of the surface of the electroplated blind hole structure after bombardment is reduced. The purpose of the activation treatment is to improve the activity of the surface of the electroplated blind hole structure, for example, by cleaning the organic pollutants on the surface of the electroplated blind hole structure, increasing the surface energy, etc. This treatment can enhance the subsequent bonding force with the surface of the pulling probe.

In this embodiment, the surface of the electroplated blind hole structure is subjected to different roughness treatments in order to improve the surface quality of the electroplated blind hole structure and provide better surface conditions for subsequent testing or applications. The surface treatment can ensure the accuracy of the test and avoid errors caused by surface defects.

In an exemplary embodiment, performing surface roughness treatment on a pulling probe includes:

The surface of the drawn probe is activated under vacuum conditions using a fast atomic beam source or plasma source technology.

Specifically, illustratively, the ion source includes but is not limited to Ar+, He+, etc., the activation chamber voltage is between 500V-5000V, and in order to avoid re-oxidation of the surface of the activated pulling probe, the bombardment activation process must be controlled under ultra-vacuum protection, and the vacuum degree is set to ^10-3Pa ~ ^10-9Pa or lower, and the ion source bombardment parameters are adjusted so that the average roughness of the surface of the pulled probe after bombardment is reduced. The purpose of the activation treatment is to increase the activity of the surface of the pulled probe, for example, by cleaning the organic pollutants on the surface of the pulled probe, increasing the surface energy, etc. This treatment can enhance the subsequent bonding with the surface of the electroplated blind hole structure.

In this embodiment, the surface of the pulling probe is subjected to different roughness treatments in order to improve the surface quality of the pulling probe and provide better surface conditions for subsequent tests or applications. The surface treatment can ensure the accuracy of the test and avoid errors caused by surface defects.

In an exemplary embodiment, when the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated; when the surface roughness of the pulling probe reaches the atomic level, the corresponding activation treatment is terminated.

Specifically, atomic-level surface roughness means that the surface is very smooth, close to the flatness of the atomic scale. When the surface roughness of the electroplated blind hole structure and the pulled probe reaches the atomic level, it is considered that the activation treatment is sufficient and this step can be ended. This is usually determined by high-precision surface roughness measurement equipment (such as atomic force microscope (AFM), scanning electron microscope (SEM), etc.).

In this embodiment, the extremely high requirement of surface roughness is achieved by precisely controlling the activation process.

In an exemplary embodiment, the pulling probe includes a head bonding layer and a support body; wherein the head bonding layer is used to bond the electroplated blind hole structure, and the connection method of the head bonding layer and the support body includes welding.

Specifically, the head bonding layer is a part of the pulling probe, and its main function is to form a stable connection with the electroplated blind hole structure. This layer needs to have good adhesion or bonding ability to ensure that the connection with the blind hole structure will not break during the pulling process. The support body is another part of the pulling probe, which provides the necessary support and stability for the head bonding layer. The design of the support body needs to take into account strength and rigidity to withstand the forces generated during the pulling process. The materials of the head bonding layer include but are not limited to Cu, Al, Ni, SiO ₂ , Al ₂ O ₃ , etc. The diameter of the probe bonding layer can range from 30μm to 2mm.

The connection method between the head bonding layer and the support body determines the overall stability and reliability of the pulling probe. The connection method needs to be able to withstand the force generated during the pulling process while ensuring the durability of the connection; in addition to welding, the connection method can also be mechanical connection and bonding.

Welding is a common joining method that heats two materials until they are molten and mix, then form a strong connection during cooling. In pull-off probes, welding can provide a very stable connection because it forms a metallurgical bond between the tip bonding layer and the support.

In this embodiment, the head bonding layer and the support body are connected by welding, so that a sealed connection can be formed to prevent the penetration of liquid or gas.

In an exemplary embodiment, after recording the tensile strength value of the electroplated blind hole structure, the method further includes:

Obtain an average of the tensile strength values of at least three electroplated blind hole structures and use it as the target blind hole tensile strength value of the test board.

Specifically, in the pull-out test, each test will get a tensile strength value of the electroplated blind hole structure, which is the maximum tensile force that the material can withstand. Through repeated tests, multiple tensile strength values can be collected. The average value of these values is calculated to reduce the impact of random errors or outliers in individual tests on the results. The average value is used to represent the overall tensile strength characteristics of the electroplated blind holes of the test board. It can be used as an important indicator to evaluate the quality of the electroplated blind hole structure.

In addition to calculating the mean, other statistical analyses can be performed, such as calculating the standard deviation, coefficient of variation, etc., to assess the degree of dispersion of the data.

In this embodiment, the average tensile strength values of at least three electroplated blind hole structures are obtained in order to obtain a reliable value that can represent the target blind hole tensile strength of the test board. This value helps to scientifically evaluate the performance of the material and serves as a basis for quality control and process improvement.

It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

Based on the same inventive concept, the embodiment of the present application also provides a blind hole tensile strength in-situ testing device for implementing the above-mentioned blind hole tensile strength in-situ testing method. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above-mentioned method, so the specific limitations in one or more blind hole tensile strength in-situ testing device embodiments provided below can refer to the limitations of the blind hole tensile strength in-situ testing method above, and will not be repeated here.

In an exemplary embodiment, as shown in FIG5 , a blind hole tensile strength in-situ testing device is provided, comprising: a sampling module 502 for sampling and obtaining a test board having at least three electroplated blind hole structures;

A processing module 504 is used to perform surface roughness processing on the electroplated blind hole structure and the pulling probe;

A bonding module 506, used for controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The moving module 508 is used to pull the pulling probe in situ at a preset speed until a preset change phenomenon occurs on the test plate;

The calculation module 510 is used to record the tensile strength value of the electroplated blind hole structure.

In an exemplary embodiment, the processing module 504 is also used to perform preliminary grinding and polishing on the surface of the electroplated blind hole structure according to the requirements of micro-sectioning and sample preparation; and to activate the surface of the electroplated blind hole structure under vacuum conditions using a fast atomic beam source or plasma source technology.

In an exemplary embodiment, the processing module 504 is further configured to use a fast atomic beam source or a plasma source technology to perform activation processing on the surface of the pulling probe under vacuum conditions.

In an exemplary embodiment, the processing module 504 is also used to end the corresponding activation treatment when the surface roughness of the electroplated blind hole structure reaches the atomic level; and end the corresponding activation treatment when the surface roughness of the pulling probe reaches the atomic level.

In an exemplary embodiment, the pulling probe includes a head bonding layer and a support body; wherein the head bonding layer is used to bond the electroplated blind hole structure, and the connection method of the head bonding layer and the support body includes welding.

In an exemplary embodiment, the calculation module 510 is further used to obtain an average value of the tensile strength values of at least three electroplated blind hole structures and use it as the target blind hole tensile strength value of the test board.

Each module in the above-mentioned blind hole tensile strength in-situ testing device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

In an exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be shown in FIG6. The computer device includes a processor, a memory, an input/output interface (Input/Output, referred to as I/O) and a communication interface. Among them, the processor, the memory and the input/output interface are connected through a system bus, and the communication interface is connected to the system bus through the input/output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store tensile strength value data. The input/output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for in-situ testing of the tensile strength of a blind hole is implemented.

Those skilled in the art will understand that the structure shown in FIG. 6 is merely a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

In an exemplary embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

Sampling and obtaining a test board having at least three electroplated blind hole structures;

Surface roughness treatment for electroplated blind hole structures and pull-out probes;

Control the pulling probe to align with the electroplated blind hole structure, and bond the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The pulling probe is pulled in situ at a preset speed until the test plate shows a preset change phenomenon, and the tensile strength value of the electroplated blind hole structure is recorded.

In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

According to the requirements of microsection sample preparation, the surface of the electroplated blind hole structure is initially ground and polished;

The surface of the electroplated blind hole structure is activated under vacuum conditions using a fast atomic beam source or plasma source technology.

In one embodiment, when the processor executes the computer program, the following steps are also implemented:

The surface of the drawn probe is activated under vacuum conditions using a fast atomic beam source or plasma source technology.

In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

When the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated;

When the surface roughness of the drawn probe reaches the atomic level, the corresponding activation treatment is terminated.

In one embodiment, when the processor executes the computer program, the following steps are also implemented:

The pulling probe comprises a head bonding layer and a support body; wherein the head bonding layer is used for bonding the electroplated blind hole structure, and the connection method of the head bonding layer and the support body comprises a welding method.

In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

Obtain an average of the tensile strength values of at least three electroplated blind hole structures and use it as the target blind hole tensile strength value of the test board.

In one embodiment, a computer readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

Sampling and obtaining a test board having at least three electroplated blind hole structures;

Surface roughness treatment for electroplated blind hole structures and pull-out probes;

Control the pulling probe to align with the electroplated blind hole structure, and bond the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The pulling probe is pulled in situ at a preset speed until the test plate shows a preset change phenomenon, and the tensile strength value of the electroplated blind hole structure is recorded.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

According to the requirements of microsection sample preparation, the surface of the electroplated blind hole structure is initially ground and polished;

The surface of the electroplated blind hole structure is activated under vacuum conditions using a fast atomic beam source or plasma source technology.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

The surface of the drawn probe is activated under vacuum conditions using a fast atomic beam source or plasma source technology.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

When the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated;

When the surface roughness of the drawn probe reaches the atomic level, the corresponding activation treatment is terminated.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

The pulling probe comprises a head bonding layer and a support body; wherein the head bonding layer is used for bonding the electroplated blind hole structure, and the connection method of the head bonding layer and the support body comprises a welding method.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

Obtain an average of the tensile strength values of at least three electroplated blind hole structures and use it as the target blind hole tensile strength value of the test board.

In one embodiment, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the following steps:

Sampling and obtaining a test board having at least three electroplated blind hole structures;

Surface roughness treatment for electroplated blind hole structures and pull-out probes;

Control the pulling probe to align with the electroplated blind hole structure, and bond the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature;

The pulling probe is pulled in situ at a preset speed until the test plate shows a preset change phenomenon, and the tensile strength value of the electroplated blind hole structure is recorded.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

According to the requirements of microsection sample preparation, the surface of the electroplated blind hole structure is initially ground and polished;

The surface of the electroplated blind hole structure is activated under vacuum conditions using a fast atomic beam source or plasma source technology.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

The surface of the drawn probe is activated under vacuum conditions using a fast atomic beam source or plasma source technology.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

When the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated;

When the surface roughness of the drawn probe reaches the atomic level, the corresponding activation treatment is terminated.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

The pulling probe comprises a head bonding layer and a support body; wherein the head bonding layer is used for bonding the electroplated blind hole structure, and the connection method of the head bonding layer and the support body comprises a welding method.

In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

Obtain an average of the tensile strength values of at least three electroplated blind hole structures and use it as the target blind hole tensile strength value of the test board.

It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims (10)

1. A method for in-situ testing of tensile strength of blind holes, characterized in that the method comprises: Sampling and obtaining a test board having at least three electroplated blind hole structures; Performing surface roughness treatment on the electroplated blind hole structure and the pulling probe; Controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature; The pulling probe is pulled in situ at a preset speed until a preset change phenomenon occurs on the test plate, and the tensile strength value of the electroplated blind hole structure is recorded. 2. The method according to claim 1, characterized in that the surface roughness treatment of the electroplated blind hole structure comprises: According to the micro-sectioning sample preparation requirements, the surface of the electroplated blind hole structure is initially ground and polished; The surface of the electroplated blind hole structure is activated under vacuum conditions by using a fast atomic beam source or plasma source technology. 3. The method according to claim 2, characterized in that the surface roughness treatment of the pulling probe comprises: The surface of the drawing probe is activated under vacuum conditions by using a fast atomic beam source or a plasma source technology. 4. The method according to claim 3, characterized in that the method further comprises: When the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated; When the surface roughness of the pulling probe reaches the atomic level, the corresponding activation treatment is ended. 5. The method according to claim 1 is characterized in that the pulling probe comprises a head bonding layer and a support body; wherein the head bonding layer is used to bond the electroplated blind hole structure, and the connection method between the head bonding layer and the support body comprises welding. 6. The method according to claim 1, characterized in that after recording the tensile strength value of the electroplated blind hole structure, it also includes: An average value of the tensile strength values of at least three electroplated blind hole structures is obtained and used as the target blind hole tensile strength value of the test board. 7. A blind hole tensile strength in-situ testing device, characterized in that the device comprises: A sampling module, used for sampling and obtaining a test board having at least three electroplated blind hole structures; A processing module, used for performing surface roughness processing on the electroplated blind hole structure and the drawing probe; A bonding module, used for controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature; A moving module, used for in-situ drawing of the drawing probe at a preset speed until a preset change phenomenon occurs on the test plate; The calculation module is used to record the tensile strength value of the electroplated blind hole structure. 8. A computer device, comprising a memory and a processor, wherein the memory stores a computer program, wherein the processor implements the steps of the method according to any one of claims 1 to 6 when executing the computer program. 9. A computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented. 10. A computer program product, comprising a computer program, characterized in that when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.