CN118777834A - A circuit module testing method, device and equipment - Google Patents

Abstract

The present application provides a circuit module testing method, device and equipment, by sending a first test instruction to a first test module, after the first test module executes the action indicated by the first test instruction, obtaining first test data from the first test module; by sending a second test instruction to a second test module, after the second test module executes the action indicated by the second test instruction, obtaining second test data from a communication module; determining the test value corresponding to the target indicator according to the first test data and the second test data; and determining whether the circuit module is qualified based on the comparison result between the test value and the theoretical value corresponding to the target indicator. The present application can automatically obtain two types of data, and the test data that can be automatically obtained is more comprehensive, so that the automated test can be applied to more circuit module testing tasks.

Description

A circuit module testing method, device and equipment

Technical Field

The embodiments of the present application relate to the technical field of circuit module testing, and in particular, to a circuit module testing method, device and equipment.

Background Art

Circuit modules used in certain special fields must have high reliability. Simulating their working process and testing their performance indicators are key links to ensure the reliability of circuit modules. Using automatic test equipment to test the circuit modules under test can not only reduce the test time cost, but also improve the reliability and consistency of test data. Most of the existing automatic test equipment and test software are designed and developed based on the product system. There are few automatic test equipment for circuit modules that make up the system, which makes the testing of circuit modules difficult.

Summary of the invention

In order to solve the problem that the prior art lacks automated testing for circuit modules that constitute the entire system, and that the circuit module test does not take into account the communication characteristics between the test software and the test module, resulting in the test data that can be automatically acquired being not comprehensive enough and the versatility of the automated test being low, the embodiments of the present application provide a circuit module testing method, device and equipment.

According to a first aspect of an embodiment of the present application, a circuit module testing method is provided, which is applied to a testing device, wherein the testing device is used to test a target indicator of the circuit module, and the circuit module testing method includes:

Sending a first test instruction to a first test module, and obtaining first test data from the first test module after the first test module executes an action indicated by the first test instruction;

Sending a second test instruction to a second test module, and after the second test module executes an action indicated by the second test instruction, acquiring second test data from a communication module, wherein the communication module is in communication connection with the second test module;

Determine a test value corresponding to the target indicator according to the first test data and the second test data;

Based on the comparison result between the test value and the theoretical value corresponding to the target indicator, it is determined whether the target indicator of the circuit module is qualified.

Optionally, the acquiring the second test data from the communication module includes:

Wait for the communication module to return the second test data.

Optionally, the circuit module testing method includes:

In the first stage or the fourth stage, the step of sending the first test instruction to the first test module is executed, in the second stage or the fifth stage, the step of sending the second test instruction to the second test module is executed, and in the third stage or the sixth stage, the step of waiting for the communication module to return the second test data is executed.

Optionally, determining the test value corresponding to the target indicator according to the first test data and the second test data includes:

The first test data and the second test data are combined according to the combination method corresponding to the target indicator to obtain a test value corresponding to the target indicator.

Optionally, before combining the first test data with the second test data, the circuit module testing method further includes:

The first test data and/or the second test data are verified according to a communication protocol corresponding to the communication module.

Optionally, before combining the first test data with the second test data, the circuit module testing method further includes:

Extract target bytes from the first test data and/or the second test data.

Optionally, before combining the first test data with the second test data, the circuit module testing method further includes:

The first test data and/or the second test data are converted according to a unit corresponding to the target indicator.

Optionally, before sending the test instruction to the test module, the circuit module testing method further includes:

A test flow file prepared by a tester is obtained, and a test instruction is read from the test flow file, wherein the test instruction includes the first test instruction and the second test instruction.

According to a second aspect of an embodiment of the present application, a circuit module testing device is provided, the circuit module testing device comprising:

A first acquisition module, configured to send a first test instruction to a first test module, and acquire first test data from the first test module after the first test module executes an action indicated by the first test instruction;

A second acquisition module, configured to send a second test instruction to a second test module, and acquire second test data from a communication module after the second test module executes an action indicated by the second test instruction, wherein the communication module is in communication connection with the second test module;

A first determining module, configured to determine a test value corresponding to the target indicator according to the first test data and the second test data;

The second determination module is used to determine whether the circuit module is qualified based on the comparison result between the test value and the theoretical value corresponding to the target indicator.

Optionally, the second acquisition module acquires the second test data from the communication module, including:

The second acquisition module waits for the communication module to return the second test data.

Optionally, the first acquisition module is used to perform the step of sending the first test instruction to the first test module in the first stage or the fourth stage;

The second acquisition module is used to execute the step of sending the second test instruction to the second test module in the second stage or the fifth stage, and to execute the step of waiting for the communication module to return the second test data in the third stage or the sixth stage.

Optionally, the first determination module is used to combine the first test data and the second test data according to a combination method corresponding to the target indicator to obtain a test value corresponding to the target indicator.

Optionally, the circuit module testing device further includes:

A verification module is used to verify the first test data and/or the second test data according to the communication protocol corresponding to the communication module before combining the first test data with the second test data.

Optionally, the circuit module testing device further includes:

An extraction module is used to extract target bytes from the first test data and/or the second test data before combining the first test data with the second test data.

Optionally, the circuit module testing device further includes:

A conversion module is used to convert the first test data and/or the second test data according to the unit corresponding to the target indicator before combining the first test data with the second test data.

Optionally, the circuit module testing device further includes:

The third acquisition module is used to acquire a test flow file created by a tester before sending the test instruction to the test module, and read the test instruction from the test flow file, wherein the test instruction includes the first test instruction and the second test instruction.

According to a third aspect of an embodiment of the present application, a circuit module testing device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, any one of the circuit module testing methods provided in the first aspect is implemented.

The technical solution provided by this application may have the following beneficial effects:

The present application sends a first test instruction to a first test module, and after the first test module executes the action indicated by the first test instruction, obtains the first test data from the first test module; sends a second test instruction to a second test module, and after the second test module executes the action indicated by the second test instruction, obtains the second test data from the communication module, wherein the communication module is connected to the second test module; determines the test value corresponding to the target indicator according to the first test data and the second test data; determines whether the circuit module is qualified based on the comparison result between the test value and the theoretical value corresponding to the target indicator. The present application can automatically obtain two types of data, the first type is the first test data directly obtained from the test module based on direct communication between the test software and the test module, and the second type is the second test data obtained from the communication module connected to the test module based on indirect communication between the test software and the test module. The communication characteristics between the test software and the test module are taken into consideration, and the test data that can be automatically obtained are more comprehensive, so that the automated test can be applied to more circuit module testing tasks.

It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and do not limit the embodiments of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings herein are incorporated into the specification and constitute a part of the embodiments of the present application, illustrate embodiments consistent with the embodiments of the present application, and together with the description are used to explain the principles of the embodiments of the present application.

FIG. 1 is a first flow chart of a circuit module testing method provided in an embodiment of the present application.

FIG. 2 is a second flow chart of a circuit module testing method provided in an embodiment of the present application.

FIG. 3A is a third flow chart of a circuit module testing method provided in an embodiment of the present application.

FIG. 3B is a flowchart of obtaining test data provided in an embodiment of the present application.

FIG. 4 is a structural block diagram of a circuit module testing device provided in an embodiment of the present application.

DETAILED DESCRIPTION

Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the embodiments of the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the embodiments of the present application as detailed in the appended claims.

The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and/or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

It should be understood that, although the terms first, second, third, etc. may be used to describe various information in the embodiments of the present application, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the embodiments of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at..." or "when..." or "in response to determination".

Circuit modules used in some special fields must have high reliability. Simulating their working process and testing their performance indicators are key links to ensure the reliability of circuit modules. Using automatic test equipment to test the circuit modules can not only reduce the test time cost, but also improve the reliability and consistency of test data.

The applicant has found that it is necessary to obtain a variety of test data during the circuit module test process. According to the communication characteristics between the test software and the test module, the test data that needs to be obtained can be divided into two categories. The first type of data can be called the first test data, which is the data obtained by the test software directly communicating with the test module, and the acquisition process does not need to wait. Specifically, the test software and the test module are directly communicated and connected, and the test software can directly issue test instructions to the test module. After the test module executes the test instructions, the corresponding test data can be fed back to the test software immediately. In one embodiment, the test software can be directly communicated and connected with the test module of the board type, so that when the test module executes the test instruction, the test data can be obtained without waiting. The test module of direct communication can be called the first test module, and the first test module can be a board such as voltage and current acquisition, switch relay control, IO (Input/Output) acquisition and control in a specific example. The second type of data can be called the second test data, which is the data obtained by the test software and the test module indirectly communicating, and the acquisition process needs to wait. Specifically, the test software and the test module are not directly connected by communication, but indirectly communicated through the communication module, that is, the communication module is connected between the test software and the test module. During the test, the test command issued by the test software needs to be forwarded to the test module through the communication module. After the test module executes the test command, the test data also needs to be fed back to the test software through the communication module, so the acquisition of the test data needs to wait. The test module that indirectly communicates with the test software can be called the second test module, and the test software communicates with the communication module. In a specific example, the test software can communicate with a serial port, a network, 1553B (a kind of information transmission bus standard), etc.

However, existing circuit module testing software does not consider the differences in the acquisition process of the above two types of test data. For example, it can often only acquire one type of test data, the type of test data that can support automated acquisition is not comprehensive, and the versatility of automated testing is low.

To solve this problem, the present application provides a circuit module testing method that can automatically acquire two types of data. The automatically acquired test data is more comprehensive, making the automated test applicable to more circuit module testing tasks.

Specifically, the circuit module testing method can be applied to a test device, and the test device can be used to test the target indicators of the circuit module. It can be understood that the circuit module test involves multiple indicators, and the target indicator can be any one of the multiple indicators, which can be selected according to the needs of the tester. The test device can be installed with automated testing software. In one embodiment, the test device can execute the circuit module testing method provided in the embodiment of the present application during the operation of the test software.

Please refer to Figure 1, which is a first flow chart of a circuit module testing method provided by an embodiment of the present application. The circuit module testing method includes the following steps:

S101: Send a first test instruction to a first test module, and after the first test module executes an action indicated by the first test instruction, obtain first test data from the first test module.

S102: Send a second test instruction to a second test module, and after the second test module executes an action indicated by the second test instruction, obtain second test data from a communication module, wherein the communication module is in communication connection with the second test module.

As mentioned above, the first test module communicates directly with the test software, so after obtaining the first test instruction, the test software can directly send the first test instruction to the first test module. It can be understood that the test instruction can indicate the action that the test module needs to perform, such as closing the relay, turning off the relay, waiting for 1 second, collecting voltage, etc. When the first test module receives the first test instruction, it can execute the action indicated by the first test instruction, and when the action is completed, the first test data can be obtained, and the first test data can be sent to the test software without waiting.

The second test module communicates with the test software indirectly through the communication module. After obtaining the second test instruction, the test software can send the second test instruction to the second test module through the communication module. After obtaining the second test instruction, the second test module executes the action indicated by the second test instruction and sends the second test data to the communication module. The communication module sends the second test data to the test software. Therefore, for the test software, it is necessary to wait for the communication module to return the second test data.

It should be noted that the first test module and the second test module can be different modules or the same module. For example, for a test module, it can have multiple communication modes, and the test data types that can be obtained can include both the first test data and the second test data. In one possible situation, for the first test data, the test module can directly obtain and send it to the test software. For the second test module, after obtaining the data, due to the particularity of the data in terms of format, data volume, etc., the test module needs to use the communication module for transmission, so it can only communicate indirectly.

The first test module and the second test module can be modules independent of the circuit module, or they can be modules owned by the circuit module itself. In addition to components that realize basic functions, the circuit module may also have data acquisition modules such as sensors and acquisition circuits, so that the circuit module can self-check and inform the user when faults and abnormalities are found. In this case, the first test module and the second test module can be data acquisition modules that come with the circuit module.

S103: Determine a test value corresponding to the target indicator according to the first test data and the second test data.

It should be noted that different test indicators have different calculation methods, and the first test data and the second test data do not necessarily directly correspond to the test value of the target indicator. For example, if the target indicator is the voltage difference from point A to point B, the first test data can be the voltage data of point A, and the second test data can be the voltage data of point B. Then the test value corresponding to the target indicator can be the difference between the first test data and the second test data. In another example, the test value corresponding to the target indicator can be the sum of the first test data and the second test data. For example, if the target indicator is the total current, the first test data is the current value of branch A, and the second test data is the current value of branch B.

S104: Based on the comparison result between the test value and the theoretical value corresponding to the target indicator, determine whether the target indicator of the circuit module is qualified.

If the test value of the target indicator matches the theoretical value of the target indicator, it can be considered that the target indicator of the circuit module is qualified. If the test value of the target indicator does not match the theoretical value of the target indicator, it can be considered that the target indicator of the circuit module is unqualified. The matching here, i.e., the qualified standard, in one embodiment, the qualified standard can be the size comparison between the test value and the theoretical value, for example, the test value can be greater than the theoretical value, or the test value can be less than the theoretical value, or the test value can be equal to the theoretical value. In one embodiment, the qualified standard can also be the error between the test value and the theoretical value within the error range. In one embodiment, the qualified standard can also be a comparison of consistency, for example, the test value is consistent with the theoretical value.

The embodiment of the present application can automatically acquire two types of data by executing the method corresponding to the above steps. The first type is first test data acquired directly from the test module based on direct communication between the test software and the test module. The second type is second test data acquired from a communication module connected to the test module based on indirect communication between the test software and the test module. The communication characteristics between the test software and the test module are taken into consideration, and the test data that can be automatically acquired are more comprehensive, so that the automated test can be applied to more circuit module testing tasks.

Reference may be further made below to FIG. 2 , which is a second flow chart of a circuit module testing method provided in an embodiment of the present application, the method comprising the following steps:

S201: Obtain a test process file created by a tester, and read test instructions from the test process file.

A test flow file can be created by a tester, in which the test flow can be recorded. The test flow may include multiple test instructions, and the test instructions may include a first test instruction for obtaining first test data and a second test instruction for obtaining second test data. In addition to recording the test flow, the test flow file may also record other contents such as the name of the target indicator to be tested, the theoretical value of the target indicator, etc. In one example, the test flow file can be embodied in the form of a table file, that is, the tester can edit and create the test flow file in the table file. The completed test flow file can be sent to the test software, and the test software reads the test instructions from the test flow file.

The test process is separated from the test software through the test process file. The test process is not fixed but can be produced by testers. Therefore, it can improve software development efficiency, quickly solve software upgrade iteration problems caused by updates to the tested products, and increase the portability of software codes.

S202: In the first stage or the fourth stage, a first test instruction is sent to a first test module, and after the first test module executes an action indicated by the first test instruction, first test data is obtained from the first test module.

S203: In the second stage or the fifth stage, sending a second test instruction to the second test module so that the second test module executes an action indicated by the second test instruction.

S204: In the third stage or the sixth stage, waiting for the communication module to return the second test data.

In one embodiment, the test flow recorded in the test flow file can be divided into six stages, and the six stages can be divided into two test data acquisition processes, wherein the first to third stages are the first test data acquisition process, and the fourth to sixth stages are the second test data acquisition process. The stages of the first test data acquisition process and the second test data acquisition process can be corresponding, for example, the first stage can correspond to the fourth stage, both of which are used to execute the acquisition of the first test data, the second stage can correspond to the fifth stage, both of which are used to execute the acquisition of the second test data, and the third stage can correspond to the sixth stage, both of which are used to wait for the communication module to return the second test data. In a specific implementation, the six stages can be executed in sequence, and when all six stages are executed, the test data is acquired. By designing six stages that are executed in sequence, in the six stages, two types of test data are acquired alternately, and the test flow of most test indicators can be covered, thereby improving the versatility of the test software.

S205: Verify the first test data and/or the second test data according to the communication protocol corresponding to the communication module.

To ensure that the acquired test data complies with the communication protocol regulations corresponding to the notification module, in one embodiment, the first test data and/or the second test data can be verified according to the communication protocol corresponding to the communication module, for example, verifying the data word length of the test data, whether the actual bytes and theoretical bytes of different symbol bytes are consistent, etc.

S206: Extract target bytes from the first test data and/or the second test data.

The format of the test data usually needs to comply with the communication protocol. Not all bytes of data in the test data are required data. In one embodiment, the first test data and/or the second test data can be extracted, for example, data related to the target indicator of specific bytes can be extracted.

S207: Convert the first test data and/or the second test data according to the unit corresponding to the target indicator.

According to different units used for the target indicator, the first test data and/or the second test data may be converted, for example, the test data may be converted by applying a preset formula.

It is understandable that S205, S206 and S207 may be selectively executed or not executed, that is, the tester may test the requirements and perform one or more of the three processes of verification, extraction and conversion on the first test data and/or the second test data, or may perform none of the three processes.

S208: Combine the first test data and the second test data according to the combination method corresponding to the target indicator to obtain a test value corresponding to the target indicator.

Different test indicators have different calculation methods, and the test value of the target indicator is obtained by combining the first test data and the second test data. There can be many ways of combination, for example, the first test data and the second test data can be added or subtracted, or the first test data and the second test data can be multiplied or divided. Of course, in one embodiment, the first test data and the second test data can also be merged, that is, pieced together, for example, the first test data is 100, the second test data is 200, and the result of the merger is 100200. In short, the embodiment of the present application does not limit the combination method.

S209: Based on the comparison result between the test value and the theoretical value corresponding to the target indicator, determine whether the target indicator of the circuit module is qualified.

The embodiment of the present application can automatically obtain two types of data by executing the method corresponding to the above steps. The first type is the first test data directly obtained from the test module based on the direct communication between the test software and the test module, and the second type is the second test data obtained from the communication module connected to the test module based on the indirect communication between the test software and the test module. Considering the communication characteristics between the test software and the test module, the test data that can be automatically obtained is more comprehensive, so that the automated test can be used for more circuit module test tasks. In addition, the method provided by the embodiment of the present application can also verify or extract test data for different communication protocols, that is, it can be used for different communication protocols and can effectively cope with changes in communication protocols. The test process is separated from the software code through the test process file, so that the scalability of the test software is increased, and the test indicators can be quickly deleted and added, shortening the test software development time, shortening the test verification time of the test equipment and the tested product, enhancing the portability of the software code, reducing the cost of the test, and also improving the reliability and consistency of the test data.

Please refer to FIG. 3A, which is a third flow chart of a circuit module testing method provided in an embodiment of the present application. In this embodiment, the circuit module testing method includes the following steps:

S301: Read the test process file in the form of an Excel table created by the tester.

By reading the test process file, you can obtain the theoretical value of the target indicator, data type, test process and other information. As an example, the test process file can be set according to the following meanings and rules:

S302: Execute the test instructions of stages S1 to S6 in the test flow file in sequence to obtain test data TestData.

Please refer to Figure 3B, which is a flowchart of test data acquisition provided by an embodiment of the present application. The process of acquiring test data is divided into six stages S1-S6, S1-S3 is the first data acquisition, and S4-S6 is the second data acquisition.

S303: Determine whether the test data TestData needs to be verified and extract valid information according to the data source in the Excel table. If necessary, proceed to S304, otherwise proceed directly to S305.

S304: Verify the test data TestData and extract valid data according to the data verification and data extraction fields in the Excel table.

S305: According to the data conversion formula in the Excel table, the test data TestData is converted into the comparison data CompData.

S306: According to the theoretical value of the test index in the Excel table and the data comparison type, determine whether the comparison data CompData is qualified. If qualified, the target index test ends; if not qualified, execute S307.

S307: Determine whether retesting is required. If so, return to S302. If not, the target indicator test ends.

The description of the above steps has been fully expanded in the embodiments corresponding to FIG. 1 and FIG. 2 , and will not be repeated here.

The embodiment of the present application can automatically acquire two types of data by executing the method corresponding to the above steps. The first type is first test data acquired directly from the test module based on direct communication between the test software and the test module. The second type is second test data acquired from a communication module connected to the test module based on indirect communication between the test software and the test module. The communication characteristics between the test software and the test module are taken into consideration, and the test data that can be automatically acquired are more comprehensive, so that the automated test can be applied to more circuit module testing tasks.

A specific application example is provided below.

The target indicator is the voltage difference between points AB, and the qualified standard is that the voltage difference between points AB is greater than the theoretical value of 0.1V. The test process includes the following actions: close the relay (RelayOn) channel 0 → wait (Delay) 1s → disconnect the relay (RelayOff) channel 1 → read the voltage acquisition board (AD) channel 1 (point A voltage) → serial port RS422_1 sends a command (0XFF0011), no return data → wait (Delay) 1s → serial port RS422_2 sends a point B voltage acquisition command (0XFF3232) → wait to receive the return data from RSS422_2.

In the above test process, the voltage collected by AD does not need to be converted and is the actual voltage; the RS422_2 communication protocol stipulates that the data word length received by RS422_2 is 50 bytes, the 0th to 2nd bytes are the symbol bytes 0XFF00AA, the 49th byte is 0XFF, bytes 0 to 48 perform BBC XOR check, and the 3rd to 4th bytes are the voltage of point B to be extracted. Voltage value = 0.0001*value.

The test flow file corresponding to this application example is as follows:

In the application example, the comparison data of the target indicator comes from the voltages at points A and B. The voltage at point A is acquired through the fourth AD acquisition in the S1 phase, and the data source of the voltage at point A is represented as "S1-4". The data acquisition of the voltage at point B comes from the data received by RS422_2 in the S6 phase, and the data source of the voltage at point B is represented as "S6". Therefore, the data source of the comparison of the voltage difference between points A and B is represented as "S1-4; S6; -".

Please refer to FIG4, which is a block diagram of a circuit module testing device provided in an embodiment of the present application. The circuit module testing device provided in an embodiment of the present application includes:

A first acquisition module 401 is used to send a first test instruction to a first test module, and after the first test module executes an action indicated by the first test instruction, acquire first test data from the first test module;

A second acquisition module 402, configured to send a second test instruction to a second test module, and acquire second test data from a communication module after the second test module executes an action indicated by the second test instruction, wherein the communication module is in communication connection with the second test module;

A first determination module 403, configured to determine a test value corresponding to the target indicator according to the first test data and the second test data;

The second determination module 404 is used to determine whether the circuit module is qualified based on the comparison result between the test value and the theoretical value corresponding to the target indicator.

Optionally, the second acquisition module acquires the second test data from the communication module, including:

The second acquisition module waits for the communication module to return the second test data.

Optionally, the first acquisition module is used to perform the step of sending the first test instruction to the first test module in the first stage or the fourth stage;

The second acquisition module is used to execute the step of sending the second test instruction to the second test module in the second stage or the fifth stage, and to execute the step of waiting for the communication module to return the second test data in the third stage or the sixth stage.

Optionally, the first determination module is used to combine the first test data and the second test data according to a combination method corresponding to the target indicator to obtain a test value corresponding to the target indicator.

Optionally, the circuit module testing device further includes:

A verification module is used to verify the first test data and/or the second test data according to the communication protocol corresponding to the communication module before combining the first test data with the second test data.

Optionally, the circuit module testing device further includes:

An extraction module is used to extract target bytes from the first test data and/or the second test data before combining the first test data with the second test data.

Optionally, the circuit module testing device further includes:

A conversion module is used to convert the first test data and/or the second test data according to the unit corresponding to the target indicator before combining the first test data with the second test data.

Optionally, the circuit module testing device further includes:

The third acquisition module is used to acquire a test flow file created by a tester before sending the test instruction to the test module, and read the test instruction from the test flow file, wherein the test instruction includes the first test instruction and the second test instruction.

The implementation process of the functions and effects of each module in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, which will not be repeated here.

The embodiment of the present application can automatically acquire two types of data through the circuit module testing device. The first type is first test data acquired directly from the test module based on direct communication between the test software and the test module. The second type is second test data acquired from a communication module connected to the test module based on indirect communication between the test software and the test module. The communication characteristics between the test software and the test module are taken into consideration, and the test data that can be automatically acquired are more comprehensive, so that the automated test can be applied to more circuit module testing tasks.

For the device embodiment, since it basically corresponds to the method embodiment, the relevant parts refer to the partial description of the method embodiment. The device embodiment described above is only schematic, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the embodiment scheme of the present application. Those of ordinary skill in the art can understand and implement it without paying creative work.

An embodiment of the present application also provides a circuit module testing device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the circuit module testing method provided in the embodiment of the present application is implemented.

The above describes specific embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

As long as there is no conflict or contradiction in the technical features provided in the above embodiments, those skilled in the art can combine the various technical features according to actual conditions to form various different embodiments. However, due to the limited length of this application document, various different embodiments are not described in detail, but it can be understood that various different embodiments also belong to the scope disclosed in the embodiments of this application.

Those skilled in the art will readily come to other embodiments of the present application after considering the specification and practicing the inventions applied for herein. The present application embodiments are intended to cover any variations, uses or adaptations of the present application embodiments, which follow the general principles of the present application embodiments and include common knowledge or customary technical means in the art that are not applied for by the present application embodiments. The specification and embodiments are to be regarded as exemplary only, and the true scope and spirit of the present application embodiments are indicated by the following claims.

It should be understood that the embodiments of the present application are not limited to the precise structures described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the embodiments of the present application is limited only by the appended claims.

The above description is only a preferred embodiment of the embodiments of the present application and is not intended to limit the embodiments of the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the embodiments of the present application.

Claims (10)

1. A circuit module testing method, characterized in that it is applied to a testing device, the testing device is used to test the target index of the circuit module, and the circuit module testing method comprises: Sending a first test instruction to a first test module, and obtaining first test data from the first test module after the first test module executes an action indicated by the first test instruction; Sending a second test instruction to a second test module, and after the second test module executes an action indicated by the second test instruction, acquiring second test data from a communication module, wherein the communication module is in communication connection with the second test module; Determine a test value corresponding to the target indicator according to the first test data and the second test data; Based on the comparison result between the test value and the theoretical value corresponding to the target indicator, it is determined whether the target indicator of the circuit module is qualified. 2. The circuit module testing method according to claim 1, wherein the obtaining the second test data from the communication module comprises: Wait for the communication module to return the second test data. 3. The circuit module testing method according to claim 2, characterized in that the circuit module testing method comprises: In the first stage or the fourth stage, the step of sending the first test instruction to the first test module is executed, in the second stage or the fifth stage, the step of sending the second test instruction to the second test module is executed, and in the third stage or the sixth stage, the step of waiting for the communication module to return the second test data is executed. 4. The circuit module testing method according to claim 1, wherein determining the test value corresponding to the target indicator according to the first test data and the second test data comprises: The first test data and the second test data are combined according to the combination method corresponding to the target indicator to obtain a test value corresponding to the target indicator. 5. The circuit module testing method according to claim 4, characterized in that before combining the first test data with the second test data, the circuit module testing method further comprises: The first test data and/or the second test data are verified according to a communication protocol corresponding to the communication module. 6. The circuit module testing method according to claim 4, characterized in that before combining the first test data with the second test data, the circuit module testing method further comprises: Extract target bytes from the first test data and/or the second test data. 7. The circuit module testing method according to claim 4, characterized in that before combining the first test data with the second test data, the circuit module testing method further comprises: The first test data and/or the second test data are converted according to a unit corresponding to the target indicator. 8. The circuit module testing method according to any one of claims 1 to 7, characterized in that before sending the test instruction to the test module, the circuit module testing method further comprises: A test flow file prepared by a tester is obtained, and a test instruction is read from the test flow file, wherein the test instruction includes the first test instruction and the second test instruction. 9. A circuit module testing device, characterized in that the circuit module testing device comprises: A first acquisition module, configured to send a first test instruction to a first test module, and acquire first test data from the first test module after the first test module executes an action indicated by the first test instruction; A second acquisition module, configured to send a second test instruction to a second test module, and acquire second test data from a communication module after the second test module executes an action indicated by the second test instruction, wherein the communication module is in communication connection with the second test module; A first determining module, configured to determine a test value corresponding to the target indicator according to the first test data and the second test data; The second determination module is used to determine whether the circuit module is qualified based on the comparison result between the test value and the theoretical value corresponding to the target indicator. 10. A circuit module testing device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the circuit module testing method according to any one of claims 1 to 8 when executing the program.