CN118699544A - A five-axis laser processing device and method for large-taper drilling - Google Patents

Abstract

The present invention discloses a five-axis laser processing device and method for large-taper drilling, wherein the device comprises: a beam adjustment system, a beam position adjustment system, a dynamically adjustable lens system, a beam splitter and a focusing optical element arranged in sequence along the direction of the laser emission optical path; wherein the laser beam acts on the workpiece to be processed through the systems and elements in sequence; the beam position adjustment system is controlled by a rotating device, and changes the inclination and parallel displacement of the laser beam relative to the laser optical axis to achieve drilling processing of different diameters and inclinations; the dynamically adjustable lens system is controlled by a vibration device, and changes the divergence angle of the laser beam to achieve laser beam focus height control; the dynamically adjustable lens system expands the laser beam, increases the parallel displacement of the laser beam relative to the laser optical axis, and increases the inclination angle of the laser beam and the drilling taper. The device module structure of the present invention is simple, can be integrated with conventional laser processing, and the optical path is easy to adjust, and can quickly achieve zero-taper and large-taper positive cone and inverted cone drilling processing.

Description

A five-axis laser processing device and method for large-taper drilling

Technical Field

The present invention relates to the technical field of laser processing devices, and in particular to a five-axis laser processing device and method for large-taper drilling.

Background Art

The basic principle of laser processing is to focus the laser beam on the surface of the material, form a positive cone laser drilling on the material through the interaction between the laser beam and the material, and realize various taper structure processing by tilting and moving the sample or laser beam. Since it is difficult to control the tilted sample and the precision is low during the processing, the method of tilting the laser beam is currently mainly used. There are two existing methods to achieve the tilt of the laser beam: rotating or tilting the prism and vibrating the scanning galvanometer. The processing technologies based on these two principles have developed mature optical modules and products.

The five-axis laser processing equipment based on scanning galvanometer generally includes laser, light guide path, galvanometer scanning laser processing head and machine tool. Its basic principle is: the laser beam output from the laser passes through the light guide path to complete beam expansion and collimation, enters the galvanometer scanning laser processing head, and changes the displacement and inclination of the laser beam by coordinating the vibration angles of multiple galvanometers in the laser processing head. Then, it enters the telecentric lens (F-theta objective lens) for focusing and output to act on the processing object on the machine tool. Among them, the inclination angle of the laser beam is determined by the parallel displacement of the laser beam from the central axis before entering the telecentric lens, and the parallel displacement is limited by the vibration angle of the scanning galvanometer.

In the current galvanometer scanning five-axis laser processing equipment, the structure of the galvanometer scanning laser processing head is relatively simple, and the adjustable range of the laser beam inclination is small, which makes it difficult to meet the needs of drilling with a larger taper.

Summary of the invention

The purpose of the present invention is to provide a five-axis laser processing device for large-taper drilling, which is used to meet the needs of zero-taper drilling and larger-taper drilling in the current laser processing field.

In order to achieve the above object, the technical solution proposed by the present invention is:

A five-axis laser processing device for large-taper drilling, characterized in that the device comprises: a beam adjustment system, a beam position adjustment system, a dynamically adjustable lens system, a beam splitter and a focusing optical element arranged in sequence along the direction of the laser emission optical path; wherein the laser beam acts on a workpiece to be processed through the beam adjustment system, the beam position adjustment system, the dynamically adjustable lens system, the beam splitter and the focusing optical element in sequence; and the beam position adjustment system is controlled by a rotating device to change the inclination angle and parallel displacement of the laser beam relative to the laser optical axis to achieve drilling processing of different diameters and inclination angles; the dynamically adjustable lens system is controlled by a vibration device to change the laser beam divergence angle to achieve laser beam focus height control; and the dynamically adjustable lens system expands the laser beam, increases the parallel displacement of the laser beam relative to the laser optical axis, and increases the laser beam inclination angle and drilling taper;

The beam adjustment system is a beam expander with an adjustable magnification of 1-4 times;

The beam position adjustment system is composed of four plane reflectors connected to a rotating device;

The dynamically adjustable lens system is a beam expansion system composed of a first lens and a second lens;

or

The dynamically adjustable lens system is composed of the beam expansion system and a third lens; one side of the second lens or the third lens is connected to a vibration device;

The focusing optical element is a telecentric lens.

Furthermore, the rotating device is a servo motor; and the vibrating device is a voice coil motor.

A method for realizing large-taper drilling based on the above device comprises the following steps:

The first step is to fix and install the beam adjustment system, beam position adjustment system, dynamically adjustable lens system, beam splitter and focusing optical element in sequence according to the laser irradiation line, and place the workpiece to be processed on the machine table;

In the second step, the workpiece to be processed is placed under the focusing optical element and the processing part is placed under the laser beam;

The third step is to start the rotating device and the vibrating device: the four plane mirrors vibrate at high speed along mutually perpendicular axes, and the inclination angles of the laser beam in the x and y directions are controlled respectively through the coordinated vibration of the first and third plane mirrors and the coordinated vibration of the second and fourth plane mirrors, and the displacement of the laser beam in the x and y directions are controlled respectively through the vibration of the third and fourth plane mirrors; the second lens or the third lens vibrates at high speed along the optical axis of the laser beam to change the divergence angle of the laser beam and control the focal height of the laser beam on the z axis after focusing, and at the same time cooperates with the first lens or the beam expansion system to expand the laser beam and increase the parallel displacement of the laser beam relative to the laser optical axis, thereby increasing the inclination angle and drilling taper of the laser beam after focusing; at the same time, during the processing, a laser beam quality analyzer is set behind the beam splitter to receive the laser beam transmitted from the beam splitter, monitor the position, inclination and divergence of the laser beam in real time, and compensate by comparing with the preset processing parameters; until the processing is completed.

Compared with the prior art, the invention solves the shortcomings of the existing laser processing device, which is specifically embodied in:

Since this optical module places a dynamically adjustable lens system after the beam position adjustment system, the off-axis distance of the laser beam can be magnified by the dynamically adjustable lens system, and the magnification factor is the beam expansion factor of the laser beam by the dynamically adjustable lens system, so that the inclination angle of the laser beam after being focused by the focusing optical element is magnified, and the magnification factor is also the beam expansion factor of the laser beam by the dynamically adjustable lens system; since this dynamically adjustable lens system is placed after the beam position adjustment system, the vibration angle of the plane reflector in the beam position adjustment system is reduced, so that the control accuracy of the rotating device in the beam position adjustment system is higher; since this dynamically adjustable lens system is placed after the beam position adjustment system, the optical path adjustment of this dynamically adjustable lens system will not affect the optical path of the beam position adjustment system, and optical adjustment is relatively easy; the lens in this dynamically adjustable lens system is connected to a voice coil motor to achieve rapid position adjustment, and the two lenses coordinate with each other to simultaneously achieve the effects of expanding the off-axis distance of the laser beam and adjusting the laser focus height.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a first embodiment of the present invention;

FIG2 is a schematic diagram showing the principle of using a dynamically adjustable lens system to achieve larger taper drilling in the present invention;

FIG3 is a schematic structural diagram of a second embodiment of the present invention.

DETAILED DESCRIPTION

The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

Referring to Figures 1 to 3, the present invention is a five-axis laser processing device for large-taper drilling, which receives a laser beam emitted from a laser emitting device. It includes: a beam adjustment system 1, a beam position adjustment system 2, a dynamically adjustable lens system 3, a beam splitter 4 and a focusing optical element 5 arranged in sequence along the laser emission optical path; wherein the laser beam acts on the workpiece to be processed through the beam adjustment system 1, the beam position adjustment system 2, the dynamically adjustable lens system 3, the beam splitter 4 and the focusing optical element 5 in sequence; and the beam position adjustment system 2 is controlled by a rotating device to change the parallel displacement and inclination of the laser beam relative to the laser optical axis to achieve drilling processing with different diameters and inclinations; the dynamically adjustable lens system 3 is controlled by a vibration device to change the divergence angle of the laser beam to achieve laser beam focus height control.

Refer to FIG. 1, which is a schematic diagram of the structure of the first embodiment of the present invention. It can be seen from the figure that the five-axis laser processing device for large-taper drilling receives the laser beam emitted from the laser emitting device. The device includes a beam adjustment system 1 arranged in sequence along the direction of the laser emission optical path, and the beam adjustment system 1 includes a beam expansion system. The laser beam after passing through the beam adjustment system 1 is expanded by 1-4 times and collimated, and then enters the beam position adjustment system 2 arranged behind the beam adjustment system 1. The beam position adjustment system 2 includes plane reflectors 21, 22, 23 and 24, and one side of the four plane reflectors is connected to the rotating devices 25, 26, 27 and 28 respectively through a connecting member. The rotating device is a servo motor, which drives the plane reflectors to vibrate at high speed around the fixed axis. The vibration angles of the four plane reflectors cooperate with each other to reflect the laser beam at different angles, thereby dynamically changing the focusing position and inclination of the laser beam. At the same time, a dynamically adjustable lens system 3 is provided behind the beam position adjustment system 2, including a first lens 31 and a second lens 32, and one side of the second lens 32 is connected to a vibration device 35, which is a voice coil motor, driving the second lens 32 to vibrate back and forth at high speed along the optical path of the laser beam. The focusing height of the laser beam is changed by changing the divergence angle of the laser beam. A beam splitter 4 placed at 45° is provided behind the dynamically adjustable lens system 3, which can transmit a small part of the laser beam to detect the position, inclination and divergence of the laser beam. The focusing optical element 5 is a telecentric lens (also known as an F-theta objective lens), which can focus the parallel off-axis laser beam to the center point.

Refer to FIG2, which is a schematic diagram of the principle of using a dynamically adjustable lens system 3 to achieve larger taper drilling. As can be seen from the figure, the first lens 31 is a concave lens, and the second lens 32 is a convex lens. After the laser beam is expanded by the two lenses, the distance from the axis is magnified, and the magnification factor is the expansion factor of the laser beam by the first lens 31 and the second lens 32, so that the inclination angle of the laser beam after focusing is magnified, and the magnification factor is also the expansion factor of the laser beam by the first lens 31 and the second lens 32. And the second lens 32 vibrates back and forth along the optical axis of the laser beam under the drive of the vibration device, changing the divergence angle of the laser beam to adjust the focal height of the laser beam.

Refer to FIG3, which is a schematic diagram of the structure of the second embodiment of the present invention. The difference between the second embodiment and the first embodiment is that the dynamically adjustable lens system 3 (i.e., the first lens 31 and the second lens 32 in the first embodiment) is composed of a beam expansion system 33 and a third lens 34. The beam expansion system 33 is composed of the first lens 31 and the second lens 32, and is used to amplify the parallel displacement of the off-axis laser beam. One side of the third lens 34 is connected to a vibration device 35, which drives the third lens 34 to vibrate back and forth along the optical axis of the laser beam, changing the divergence angle of the laser beam to adjust the focal height of the laser beam. The other structural parts are exactly the same as those of the first embodiment and will not be repeated here.

The processing method of the five-axis laser processing device for large-taper drilling using the first embodiment includes the following steps:

The first step is to fix and install the beam adjustment system 1, the beam position adjustment system 2, the dynamically adjustable lens system 3, the beam splitter 4 and the focusing optical element 5 in sequence according to the laser irradiation line, and place the workpiece to be processed on the machine table 6;

The second step is to place the workpiece to be processed under the focusing optical element 5 and place the processing part under the laser beam;

The third step is to start the rotating device and the vibrating device: the four plane mirrors vibrate at high speed along mutually perpendicular axes, and the inclination angles of the laser beam in the x and y directions are controlled respectively through the coordinated vibration of the plane mirrors 21 and 23 and the coordinated vibration of the plane mirrors 22 and 24, and the displacement of the laser beam in the x and y directions are controlled respectively through the vibration of the plane mirrors 23 and 24; the second lens 32 vibrates at high speed along the optical axis of the laser beam to change the divergence angle of the laser beam and control the focal height of the laser beam on the z axis after focusing, and at the same time cooperates with the first lens 31 to expand the laser beam and increase the parallel displacement of the laser beam relative to the laser optical axis, thereby increasing the inclination angle of the laser beam after focusing and the drilling taper;

At the same time, during the processing, a laser beam quality analyzer is arranged behind the beam splitter 4 to receive the laser beam transmitted from the beam splitter 4, monitor the position, inclination and divergence of the laser beam in real time, and compare it with the preset processing parameters for compensation.

Another processing method using the five-axis laser processing device for large-taper drilling of the second embodiment includes the following steps:

The first step is to fix and install the beam adjustment system 1, the beam position adjustment system 2, the dynamically adjustable lens system 3, the beam splitter 4 and the focusing optical element 5 in sequence according to the laser irradiation line, and place the workpiece to be processed on the machine table 6;

The second step is to place the workpiece to be processed under the focusing optical element 5 and place the processing part under the laser beam;

The third step is to start the rotating device and the vibrating device: the four plane mirrors vibrate at high speed along mutually perpendicular axes, and the inclination angles of the laser beam in the x and y directions are controlled respectively through the coordinated vibration of the plane mirrors 21 and 23 and the coordinated vibration of the plane mirrors 22 and 24, and the displacement of the laser beam in the x and y directions are controlled respectively through the vibration of the plane mirrors 23 and 24; the third lens 34 vibrates at high speed along the optical axis of the laser beam to change the divergence angle of the laser beam and control the focal height of the laser beam on the z axis after focusing. At the same time, the beam expansion system 33 expands the laser beam and increases the parallel displacement of the laser beam relative to the laser optical axis, thereby increasing the inclination angle of the laser beam after focusing and the drilling taper;

At the same time, during the processing, a laser beam quality analyzer is arranged behind the beam splitter 4 to receive the laser beam transmitted from the beam splitter 4, monitor the position, inclination and divergence of the laser beam in real time, and compare it with the preset processing parameters for compensation.

Using any of the above methods can achieve the requirement of controlling the taper and realize drilling of different shapes with large taper and controllable diameter.

Claims (3)

1. A five-axis laser processing device for large-taper drilling, characterized in that the device comprises: a beam adjustment system, a beam position adjustment system, a dynamically adjustable lens system, a beam splitter and a focusing optical element arranged in sequence along the direction of the laser emission optical path; wherein the laser beam acts on the workpiece to be processed through the beam adjustment system, the beam position adjustment system, the dynamically adjustable lens system, the beam splitter and the focusing optical element in sequence; the beam position adjustment system is controlled by a rotating device to change the inclination angle and parallel displacement of the laser beam relative to the laser optical axis to achieve drilling processing with different diameters and inclination angles; the dynamically adjustable lens system is controlled by a vibration device to change the laser beam divergence angle to achieve laser beam focus height control; the dynamically adjustable lens system can expand the laser beam, increase the parallel displacement of the laser beam relative to the laser optical axis, and increase the laser beam inclination angle and drilling taper; The beam adjustment system is a beam expander with an adjustable magnification of 1-4 times; The beam position adjustment system is composed of four plane reflectors connected to a rotating device; The dynamically adjustable lens system is a beam expansion system composed of a first lens and a second lens; or The dynamically adjustable lens system is composed of the beam expansion system and a third lens; one side of the second lens or the third lens is connected to a vibration device; The focusing optical element is a telecentric lens. 2. The five-axis laser processing device according to claim 1 is characterized in that the rotating device is a servo motor; and the vibrating device is a voice coil motor. 3. A method for realizing large-taper drilling based on the device of claim 1, characterized in that it comprises the following steps: The first step is to fix and install the beam adjustment system, beam position adjustment system, dynamically adjustable lens system, beam splitter and focusing optical element in sequence according to the laser irradiation line, and place the workpiece to be processed on the machine table; In the second step, the workpiece to be processed is placed under the focusing optical element and the processing part is placed under the laser beam; The third step is to start the rotating device and the vibrating device: the four plane mirrors vibrate at high speed along mutually perpendicular axes, and the inclination angles of the laser beam in the x and y directions are controlled respectively through the coordinated vibration of the first and third plane mirrors and the coordinated vibration of the second and fourth plane mirrors, and the displacement of the laser beam in the x and y directions are controlled respectively through the vibration of the third and fourth plane mirrors; the second lens or the third lens vibrates at high speed along the optical axis of the laser beam to change the divergence angle of the laser beam and control the focal height of the laser beam on the z axis after focusing, and at the same time cooperates with the first lens or the beam expansion system to expand the laser beam and increase the parallel displacement of the laser beam relative to the laser optical axis, thereby increasing the inclination angle and drilling taper of the laser beam after focusing; at the same time, during the processing, a laser beam quality analyzer is set behind the beam splitter to receive the laser beam transmitted from the beam splitter, monitor the position, inclination and divergence of the laser beam in real time, and compensate by comparing with the preset processing parameters; until the processing is completed.