Disclosure of Invention
In view of the above, the present invention aims to provide a heat dissipation type dc power supply based on the internet of things, which optimizes a heat dissipation control mode and a required heat dissipation temperature of the power supply, and increases operation adjustment after heat dissipation affects normal operation of the power supply, so as to effectively solve the problems set forth in the above background art.
The radiating type direct current power supply based on the Internet of things comprises a radiating terminal layout module, a radiating terminal layout module and a radiating terminal layout state diagram extracting module, wherein the radiating terminal layout module is used for carrying out radiating terminal layout in the direct current power supply and extracting a radiating terminal layout state diagram.
And the operation temperature monitoring module is used for monitoring the temperature inside the power supply in real time by utilizing the infrared thermal sensor in the power supply process of the power supply to form a heat map inside the power supply.
And the abnormal region identification module is used for identifying the abnormal region based on the formed power supply internal heat map.
And the adaptive heat dissipation terminal screening module is used for screening out the adaptive heat dissipation terminal based on the abnormal region.
The demand cooling amplitude analysis module is used for defining an adjacent area based on the abnormal area, further acquiring the temperature of the adjacent area and analyzing the demand cooling amplitude according to the temperature of the adjacent area.
And the demand operation grade determining module is used for determining the demand operation grade of the adaptive heat dissipation terminal according to the demand cooling amplitude.
And the heat dissipation execution module is used for starting the adaptive heat dissipation terminal to execute heat dissipation operation according to the required operation grade.
And the operation association influence judging module is used for analyzing the heat dissipation consumption power of the adaptive heat dissipation terminal according to the required operation grade of the adaptive heat dissipation terminal, comparing the heat dissipation consumption power with the supply power of the power supply and judging whether the heat dissipation has influence on the normal operation of the power supply.
And the operation reduction adjustment module is used for adjusting the power consumption distribution proportion of each operation item of the power supply when judging that the heat dissipation affects the normal operation of the power supply, so as to reduce and adjust the operation items of the power supply.
Compared with the prior art, the method has the beneficial effects that 1, the abnormal region is identified by utilizing the infrared thermal sensor to monitor the internal temperature of the power supply, and the adopted heat dissipation mode and the adaptive heat dissipation terminal are determined based on the duty ratio of the abnormal region, so that the targeted heat dissipation of the internal temperature of the power supply is realized, excessive heat dissipation is avoided on one hand, the work efficiency of electronic elements is guaranteed, and on the other hand, the heat dissipation can be carried out by selecting part of the heat dissipation terminals according to the abnormal region, so that the energy consumption is reduced while the heat dissipation purpose is achieved, the heat dissipation efficiency is improved, the equipment performance and reliability are improved, the maintenance cost is reduced, and the environmental protection benefit is brought.
2. According to the invention, when the abnormal region is identified, the adjacent region is defined based on the abnormal region, the temperature of the adjacent region is further obtained, the required cooling range is analyzed according to the temperature, and compared with the uniform temperature reduction to a temperature range, the operation considers the temperature difference between the abnormal region and the adjacent region, the heat dissipation control can be performed based on the temperature difference between the abnormal region and the adjacent region, so that excessive or insufficient heat dissipation is avoided, the heat dissipation accuracy is improved, the energy can be saved more effectively, the electronic devices in the abnormal region and the adjacent region are protected from being damaged due to the influence of the temperature, and the stability of the system is better maintained.
3. According to the invention, when the execution of the heat dissipation terminal affects the normal operation of the power supply, the power consumption distribution proportion of each operation item of the power supply is called, so that the operation item of the power supply is reduced and adjusted, the power supply can be kept in a stable working state, unstable operation conditions caused by overheat or other factors are avoided, meanwhile, the electric heating pressure of the equipment in operation can be reduced, the risk of equipment damage is reduced, and the reliability and stability of the whole power supply system are improved.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the invention provides a heat dissipation type direct current power supply based on the internet of things, which comprises a heat dissipation terminal layout module, an operation temperature monitoring module, an abnormal region identification module, an adaptive heat dissipation terminal screening module, a required cooling amplitude analysis module, a required operation gear determination module, a heat dissipation execution module, an operation association influence judgment module and an operation reduction adjustment module, wherein the operation temperature monitoring module is connected with the abnormal region identification module, the abnormal region identification module and the heat dissipation terminal layout module are both connected with the adaptive heat dissipation terminal screening module, the abnormal region identification module is connected with the required cooling amplitude analysis module, the required cooling amplitude analysis module is connected with the required operation gear determination module, the required operation gear determination module and the adaptive heat dissipation terminal screening module are both connected with the heat dissipation execution module, the required operation gear determination module is connected with the operation association influence judgment module, and the operation association influence judgment module is connected with the operation reduction adjustment module.
The heat dissipation terminal layout module is used for carrying out heat dissipation terminal layout in the direct-current power supply and extracting a heat dissipation terminal layout state diagram, wherein the heat dissipation terminal can be a heat dissipation fan.
The running temperature monitoring module is used for monitoring the temperature inside the power supply in real time by utilizing the infrared thermal sensor in the power supply process of the power supply to form a heat map inside the power supply.
According to the invention, when the running temperature in the power supply is collected, the infrared thermal sensor is adopted to form a heat map, on one hand, the non-contact measurement of the internal temperature of the power supply can be realized, the power supply or the internal elements of the power supply are not required to be directly contacted, the interference or damage possibly caused by the contact sensor is avoided, on the other hand, the temperature distribution condition of each area in the power supply can be comprehensively known by forming the heat map, the working state and the heat dissipation condition of the power supply can be comprehensively evaluated, and furthermore, the infrared thermal sensor has smaller volume and a convenient installation mode relative to other sensors, is easy to be deployed in the power supply, and meanwhile, the layout and the structure in the power supply are not influenced.
The abnormal region identification module is used for identifying abnormal regions based on the formed power supply internal heat map, and specifically, the abnormal region identification process comprises the steps of extracting temperature distribution characteristics from the power supply internal heat map, wherein the temperature distribution characteristics specifically comprise the number of the temperature distribution regions and chromaticity values corresponding to the temperature distribution regions.
And comparing the chromaticity value corresponding to each temperature distribution area with the temperature represented by each chromaticity in the heat map, and obtaining the temperature corresponding to each temperature distribution area.
And comparing the temperature corresponding to each temperature distribution area with the limiting temperature in the power supply, and identifying a temperature distribution area with the temperature being greater than the limiting temperature as an abnormal area.
In the example of the above scheme, in general, the ambient temperature of most power supplies ranges between 0 ℃ and 40 ℃. Exceeding this range may lead to reduced power supply performance or failure, and thus the limiting temperature within the power supply may be 40 ℃.
The adaptive heat dissipation terminal screening module is used for screening the adaptive heat dissipation terminals based on the abnormal areas, and the specific screening process comprises the steps of first step, identifying whether the heat dissipation terminals are arranged in the abnormal areas based on the heat dissipation terminal arrangement state diagram, and executing the second step, the third step and the fourth step if the heat dissipation terminals are arranged.
As a further innovation of the above scheme, counting the number of the abnormal areas is further included before whether the heat dissipation terminals are arranged in the abnormal areas is identified, and comparing the number of the abnormal areas with the number of the temperature distribution areas to obtain an abnormal occupation ratio, and further comparing the abnormal occupation ratio with a set high occupation ratio, wherein the high occupation ratio can be set to 0.8 by way of example, and if the abnormal occupation ratio is greater than or equal to the high occupation ratio, all the heat dissipation terminals arranged in the direct-current power supply are used as the adaptive heat dissipation terminals.
It can be understood that the heat dissipation effect can be maximized by enabling all the heat dissipation terminals to perform the overall heat dissipation mode when the abnormal area is relatively large. By utilizing all the heat dissipation terminals, heat can be discharged from the abnormal region as quickly as possible, the temperature of the abnormal region is effectively reduced, the stable operation of the electronic device is protected, and when the abnormal region occupies a relatively small area, partial heat dissipation terminals are started to execute a local heat dissipation mode, so that energy sources can be saved. Because the abnormal area is smaller, the heat dissipation requirement can be met only by partial heat dissipation terminals to participate in heat dissipation, and unnecessary energy consumption is avoided, so that energy conservation is realized. Therefore, the whole heat radiation mode or the local heat radiation mode is flexibly selected according to the size and the position of the abnormal region, the efficiency of the system can be improved on the premise of ensuring the heat radiation effect, and the heat radiation system can maintain the optimal performance under different working loads.
The high duty ratio mentioned above is initially set by the system, and is aimed at assisting the selection of the overall heat dissipation mode and the local heat dissipation mode.
It should be noted that, the layout position of the heat dissipation terminal can be obtained from the layout state diagram of the heat dissipation terminal, so that whether the heat dissipation terminal is laid in the abnormal area is identified according to the layout position of the heat dissipation terminal.
And step two, counting the number of the radiating terminals arranged in the abnormal area, taking the radiating terminal as an adaptive radiating terminal if only one radiating terminal is arranged, and executing the step three if more than one radiating terminal is arranged.
And thirdly, marking a central point in the abnormal area, extracting the layout positions of all the heat dissipation terminals in the abnormal area from the layout state diagram of the heat dissipation terminals, comparing the central point positions of the abnormal area with the layout positions of all the heat dissipation terminals to obtain the distance between the layout positions of all the heat dissipation terminals and the central point of the abnormal area, and taking the heat dissipation terminal with the minimum distance as the adaptive heat dissipation terminal.
It is to be understood that by comparing the distance between the positions of the heat dissipating terminals and the center point of the abnormal area, the heat dissipating terminal corresponding to the minimum distance is selected as the adaptive heat dissipating terminal, because the heat dissipating terminal near the center point of the abnormal area can enable heat to be more evenly dispersed in all directions, the local overheat or supercooling is avoided, the balance of the heat dissipating effect is improved, the heat dissipating effect can be further improved to the greatest extent, meanwhile, the loss of energy in the transmission process can be reduced, because only the nearest heat dissipating terminal needs to operate, and other heat dissipating terminals can be kept in a closed or low-power operation state, thereby reducing the energy consumption of the heat dissipating system and realizing the purposes of energy conservation and emission reduction.
And fourthly, extracting the boundary outline of the abnormal region from the internal heat map of the power supply, thereby identifying the heat dissipation terminals positioned at the periphery of the abnormal region based on the heat dissipation terminal layout state diagram, and marking the heat dissipation terminals as alternative heat dissipation terminals.
Fifthly, comparing the layout position of the alternative heat dissipation terminal with the position of the central point of the abnormal area to obtain the distance between the layout position of the alternative heat dissipation terminal and the central point of the abnormal area, and extracting the layout orientation of the alternative heat dissipation terminal from the layout state diagram of the heat dissipation terminal, so that the heat dissipation coverage of the alternative heat dissipation terminal is obtained, and further comparing the heat dissipation coverage with the boundary outline of the abnormal area to obtain the coverage overlap ratio.
Preferably, the coverage overlap ratio may be obtained according to the obtained size, for example, area and volume, of the overlapping region and dividing the obtained size by the size of the heat dissipation coverage of the alternative heat dissipation terminal.
It should be explained that, the heat dissipation terminal generally dissipates heat through heat conduction, and different orientations of the heat dissipation terminal affect a path of heat conduction, so as to affect a release direction and a range of heat, thereby determining a heat dissipation coverage area of the heat dissipation terminal.
Sixthly, calculating the selection value degree of the alternative heat dissipation terminal by combining the distance between the arrangement position of the alternative heat dissipation terminal and the central point of the abnormal area and the coverage coincidence degree, wherein the calculation expression of the selection value degree is specifically as followsIn the middle ofIndicating the selection value degree of the i-th alternative heat dissipation terminal, i indicating the number of the alternative heat dissipation terminal, i=1, 2,.. σ i represents coverage overlap ratio corresponding to the ith alternative heat dissipation terminal, and further, the alternative heat dissipation terminal corresponding to the maximum selection value is extracted from the coverage overlap ratio as the adaptive heat dissipation terminal.
It is to be understood that when no heat dissipation terminal is arranged in the abnormal region, the heat dissipation effect of the abnormal region can be maximized by selecting the adaptive heat dissipation terminal from the heat dissipation terminals positioned at the periphery of the abnormal region based on the interval distance between the arrangement position of the heat dissipation terminal and the center point of the abnormal region and the heat dissipation coverage range of the heat dissipation terminal and the overlap ratio of the abnormal region, and such selection can ensure that the heat dissipation terminal covers most of the heat generation region of the abnormal region and effectively discharges heat.
The demand cooling amplitude analysis module is used for defining an adjacent area based on the abnormal area, further obtaining the temperature of the adjacent area, and analyzing the demand cooling amplitude according to the temperature.
It should be noted that the adjacent region refers to a region sharing a boundary contour with the abnormal region.
In particular, the definition of the adjacent region based on the abnormal region is performed by focusing the power supply internal heat map on the abnormal region, and extracting a region sharing the boundary contour with the abnormal region therefrom as the adjacent region.
The temperature of the adjacent region can be obtained from the internal heat map of the power supply.
The method is applied to the embodiment, and the analysis of the required cooling amplitude is realized by counting the number of adjacent areas and extracting the sizes of the adjacent areas from the internal heat map of the power supply.
Comparing the temperatures of the adjacent regions, extracting the highest temperature and the lowest temperature therefrom, and introducing the same into the expressionThe temperature approach degree TD, tmax, tmin of the adjacent region is calculated to represent the highest temperature and the lowest temperature, respectively, and e represents a natural constant, wherein the smaller the difference between the highest temperature and the lowest temperature is, the larger the temperature approach degree is.
Comparing the temperature approach of the adjacent areas with the configured effective temperature approach, wherein the effective temperature approach may be configured to be 0.9, if the temperature approach of the adjacent areas is greater than or equal to the effective temperature approach, the average value of the temperatures of the adjacent areas is calculated to obtain a target temperature, otherwise, the sizes of the adjacent areas are compared, and the temperature of the adjacent area with the largest size is extracted as the target temperature, wherein the target temperature is the cooling temperature required to be reached.
And performing difference operation on the temperature of the abnormal region and the current temperature to obtain the required cooling range.
The above-mentioned adjacent region is a region having a temperature not higher than the limit temperature.
The above-mentioned effective temperature approach is the initial configuration of the system, and is aimed at assisting in the analysis of the cooling target.
The temperature of the adjacent area is subjected to approaching analysis when the temperature of the adjacent area corresponding to the abnormal area is subjected to the required cooling amplitude analysis, so that the average value of the temperatures of the adjacent areas is used as the cooling temperature required to be achieved when the temperatures of the adjacent areas are relatively close according to the analysis result, and the temperature of the adjacent areas corresponding to the maximum size is used as the cooling temperature required to be achieved when the temperature of the adjacent areas is relatively large in difference, and the situation of excessive heat dissipation or insufficient heat dissipation can be avoided. When the temperatures of the adjacent areas are close, the average value is taken as a cooling target, so that the heat dissipation strength can be effectively controlled, and the waste of energy sources is avoided; when the temperature difference of the adjacent areas is large, the temperature of the adjacent areas corresponding to the maximum size is used as a cooling target, so that the cooling target of the abnormal area can be ensured to cover the adjacent areas in a large range, and the influence of the cooling area of the abnormal area on the electronic device due to the large temperature difference of the adjacent areas can be reduced to the greatest extent.
The demand operation gear determining module is used for determining a demand operation gear of the adaptive heat dissipation terminal according to the demand cooling range, and is specifically implemented by calculating a heat dissipation demand coefficient of an abnormal region by combining the demand cooling range of the abnormal region with the size of the abnormal region and the coverage overlap ratio of the adaptive heat dissipation terminal, wherein the specific calculation formula is as followsWherein DeltaT represents the required cooling amplitude of the abnormal region, T Abnormality of represents the temperature of the abnormal region, S represents the size of the abnormal region, S 0 represents the sum of the sizes of the temperature distribution regions in the power supply internal heat map, lambda represents the coverage overlap ratio of the adaptive heat dissipation terminal, and in particular, the coverage overlap ratio value of the adaptive heat dissipation terminal is 1 when the adaptive heat dissipation terminal is positioned in the abnormal region.
And obtaining the model specification of the adaptive heat dissipation terminal, thereby obtaining the heat dissipation demand coefficient range of the adaptive heat dissipation terminal under each operation grade.
It should be noted that, in particular, the operation level of the heat dissipating terminal generally refers to a power level of the heat dissipating terminal, which is formed when the heat dissipating terminal is designed and manufactured, and may be specifically read from the usage specification based on the model specification of the heat dissipating terminal, and illustratively, the operation level may be classified into a low level, a medium level, and a high level, where in the low level mode, the heat dissipating terminal may operate at a lower power, and the heat dissipating effect is weaker.
The middle-grade mode is a standard working mode of the heat dissipation terminal, has moderate power and can balance heat dissipation effect and energy consumption. In most cases, the heat dissipating terminal is capable of meeting conventional heat dissipating requirements in a mid-range mode.
In the high-grade mode, the heat dissipation terminal can operate with higher power, and the heat dissipation effect is stronger.
And matching the heat radiation demand coefficient of the abnormal region with the heat radiation demand coefficient range of the adaptive heat radiation terminal under each operation grade, and further taking the successfully matched operation grade as a demand operation grade.
The heat dissipation execution module is used for starting the adaptive heat dissipation terminal to execute heat dissipation operation according to the required operation grade.
The operation association influence judging module is used for analyzing the heat dissipation consumption power of the adaptive heat dissipation terminal according to the operation gear of the demand of the adaptive heat dissipation terminal, comparing the heat dissipation consumption power with the supply power of the power supply and judging whether heat dissipation affects the normal operation of the power supply.
It should be added that, since the operation gear of the heat dissipating terminal is associated with power, the association between the operation gear and power can be read from the usage specification of the heat dissipating terminal, thereby obtaining the heat dissipating power consumption adapted to the heat dissipating terminal.
The power supplied by the power supply means the maximum output power that the power supply can supply. The power supplied by the power supply depends on its design and specifications, with different types of power supplies having different power supplies.
In the optimized implementation of the scheme, judging whether heat dissipation affects the normal operation of the power supply is performed by comparing the heat dissipation consumption power of the adaptive heat dissipation terminal with the supply power of the power supply, and calculating the proportion of the heat dissipation consumption power, wherein
Comparing the heat dissipation power consumption specific gravity with a preset association influence specific gravity, wherein the association influence specific gravity can be preset to be 20% by way of example, if the heat dissipation power consumption specific gravity is larger than the association influence specific gravity, judging whether heat dissipation affects the normal operation of the power supply, otherwise judging that heat dissipation does not affect the normal operation of the power supply.
The operation reduction adjustment module is used for adjusting the power consumption distribution proportion of each operation item of the power supply when judging that heat dissipation affects the normal operation of the power supply, so that the operation items of the power supply are reduced and adjusted.
Illustratively, the operating terms of the power supply include, but are not limited to, output voltage and current, regulated current, over-voltage and over-current protection, start-up and shut-down control, remote control and monitoring, display and indication, etc., each operating term requiring power consumption for operation.
Preferably, the cutting and adjusting of the operation items of the power supply are specifically implemented by matching each operation item of the power supply with a basic operation item of the power supply to obtain the operation necessity degree corresponding to each operation item, wherein the basic operation items of the power supply comprise output voltage and current, starting and closing control, overvoltage protection, overcurrent protection and the like.
In the above, when an operation item of the power supply is a basic operation item, the operation necessity corresponding to the operation item is 1, whereas the operation necessity corresponding to the operation item is 0.
And calling the historical operation record, and summarizing the occurrence frequency of each operation item in an abnormal state from the historical operation record, wherein the historical operation record contains a record result of whether each operation item is in the abnormal state.
Counting the operation demand indexes corresponding to the operation items by combining the necessary operation indexes corresponding to the operation items with the occurrence frequency in an abnormal state, wherein the specific calculation expression is as followsWherein OI represents an operation demand index corresponding to an operation item, χ represents operation necessity degree corresponding to the operation item, k represents occurrence frequency of abnormal states in a history operation record corresponding to the operation item, and z represents total number of the history operation records corresponding to the fetched operation item.
According to the invention, when the operation requirement analysis is carried out on the power supply operation item, whether the power supply operation item is the basic operation item or not is analyzed by combining the abnormal occurrence rate of the operation item in the historical operation record, so that the overall reliability of an analysis result can be improved.
And arranging the operation items according to the order from high to low of the power consumption distribution proportion to obtain a power consumption arrangement result corresponding to the operation items, and arranging the operation items according to the order from low to high of the operation demand index to obtain an operation demand arrangement result.
Evaluating the corresponding reduction value coefficient of each operation item according to the ranking number of each operation item in the power consumption ranking result and the operation demand ranking result, wherein the specific evaluation expression is as followsAnd d represents the ranking number of the operation items in the power consumption arrangement result, f represents the ranking number of the operation items in the operation demand arrangement, and then the operation items are arranged according to the reduction value coefficient descending order to obtain the reduction value arrangement result corresponding to the operation items.
It should be noted that, the closer the order of the operation items in the power consumption arrangement result is to 1, the more the operation items need to be cut, and the closer the order of the operation items in the operation demand arrangement result is to 1, the more the operation items need to be cut.
And selecting a target operation item from the reduction value arrangement results corresponding to each operation item to reduce.
In the above scheme, the operation items arranged at the first position may be selected first for reduction, whether the released energy can meet the heat dissipation consumption of the adaptive heat dissipation terminal is judged, and then the operation items arranged at the subsequent position are selected for reduction according to the judging result, until the released energy after the selected operation items are reduced can meet the heat dissipation consumption of the adaptive heat dissipation terminal, and the selection is stopped.
The invention adopts the method of reducing the operation items of the power supply to cope with the reduction of the actual output power when the heat dissipation control is carried out on the heat dissipation type direct current power supply, can reduce the work load and the energy consumption of the power supply, can adapt to the heat dissipation consumption of the heat dissipation terminal on one hand, and reduces the heat generated by the power supply on the other hand, thereby reducing the heat dissipation requirement, lightening the burden of a heat dissipation system and being beneficial to keeping the stable working temperature of the electronic equipment.
The foregoing is merely illustrative and explanatory of the principles of this invention, as various modifications and additions may be made to the specific embodiments described, or similar arrangements may be substituted by those skilled in the art, without departing from the principles of this invention or beyond the scope of this invention as defined in the claims.