CN118642424B - Safety control system and method for semiconductor equipment - Google Patents

Abstract

The present invention relates to the field of semiconductor equipment technology, and more specifically, to a safety control system and method for semiconductor equipment. The safety control system of the present invention includes a state detection module for detecting and acquiring safety state data of semiconductor equipment components; a safety control module for receiving safety state data of the state detection module and sending it to a logic IO module; an execution module, which is arranged at an execution position corresponding to the semiconductor equipment component, and is used to perform safety control processing on the semiconductor equipment component according to the safety control instructions of the safety control module; and a logic IO module, which determines whether the safety control triggering conditions are met according to preset logic rules and operation strategies and generates a logic IO signal, which is sent to the corresponding safety control module to trigger the corresponding safety control processing action. The present invention uniformly processes complex safety control processing signals to generate logic IO signals, which significantly improves the overall processing efficiency, stability and scalability of the safety control system.

Description

Safety control system and method for semiconductor equipment

Technical Field

The present invention relates to the field of semiconductor devices, and more particularly, to a safety control system and method for a semiconductor device.

Background

Semiconductor devices are devices used to fabricate, test, or process semiconductor materials and devices. The development and advancement of semiconductor devices has significant implications for the development of the entire electronics industry, which directly impacts the performance, cost, and production efficiency of semiconductor devices.

Parameter signal interaction and safety control in semiconductor equipment are key links for ensuring the stability of a process and the safety of the equipment. For example, the semiconductor device includes a TM (transmission cavity) and a PM (process cavity), and the transmission cavity is mainly responsible for transmitting and positioning the wafer between the process links, so as to ensure that the wafer can enter each process cavity accurately in the manufacturing process. The process chamber is responsible for performing specific process steps such as photolithography, etching, thin film deposition, etc., which are critical to the formation of circuit structures and functions on the chip. According to different technological processes, various technological cavities have unique application scenes and functions.

Each process has specific parameter requirements, and for some key parameters, such as pressure, temperature, power, stability of air flow and the like, the process result is directly affected, some parameters are even directly related to the safety of equipment, and once the parameters deviate from the normal range and fail to be detected in time and corresponding signal transmission and safety control treatment is performed, a large number of wafers can be damaged, and even safety accidents are caused.

Therefore, in the semiconductor device, safety control of the semiconductor device is particularly important. At present, the safety control of a plurality of semiconductor devices and components thereof cannot be effectively and uniformly processed.

At present, the semiconductor device is mainly controlled safely through an upper computer, because a large number of analog parameters are involved in the operation process of the semiconductor device, and complex logic operation, multipoint communication interaction and other complex operations are involved. However, there are also the following problems depending on the host processing entirely:

The variability among different devices leads to different processing modes, and lack of unified standards and specifications, which increases the complexity and uncertainty of safety control;

When the upper computer processes other multiple tasks, the problems of resource competition, priority conflict and the like can be met, so that the detection and response of parameters such as temperature, pressure, power and the like, the interaction of complex logic and the timeliness of safety control are affected, and under the condition, the upper computer can not accurately judge and adjust in time, thereby affecting the normal operation and safety of equipment.

In addition, safety control using a PLC (programmable logic controller) alone is also difficult to effectively cope with these demands. While PLCs have wide application in the field of industrial automation, when faced with such complex and sophisticated control requirements of semiconductor devices, the need to handle complex logic interactions and safety controls may result in reduced performance and stability. Meanwhile, as the number of devices increases, the number of PLC controllers increases, and the logic to be implemented becomes more complex.

Finally, because the implementation logics of the safety control are different in different devices and the dependent hardware resources are also different, the safety control among the different devices is difficult to realize high-efficiency multiplexing, and the research and development cost of the devices is obviously improved.

Disclosure of Invention

The invention aims to provide a safety control system and method of semiconductor equipment, which solve the problems of high complexity and poor instantaneity in the safety control of the semiconductor equipment in the prior art.

In order to achieve the above object, the present invention provides a safety control system of a semiconductor device including a plurality of semiconductor device parts;

The safety control system comprises a logic IO module, a plurality of safety control modules, a plurality of state detection modules and a plurality of execution modules;

The logic IO module is in communication connection with each safety control module, and performs unified and centralized processing on a plurality of safety control modules of the safety control system;

Each of the safety control modules is configured to be connected with one or more semiconductor device components to perform safety control on the one or more semiconductor device components;

Each semiconductor equipment component is provided with a corresponding state detection module and an execution module;

Each safety control module is in communication connection with the state detection module and the execution module of the corresponding semiconductor equipment component;

The state detection modules are respectively arranged at corresponding detection positions of the semiconductor equipment component and are used for detecting and acquiring safety state data of the semiconductor equipment component;

Each safety control module is used for receiving the safety state data of the state detection module and sending the safety state data to the logic IO module, receiving the logic IO signal of the logic IO module and sending a safety control instruction to the corresponding execution module based on the logic IO signal;

The execution modules are respectively arranged at corresponding execution positions of the semiconductor equipment component and are used for carrying out safety control processing on the semiconductor equipment component according to the safety control instruction of the safety control module;

The logic IO module is selectively arranged in various computing platforms and is used for receiving, calculating and processing the safety state data, judging whether the safety control triggering condition is met or not according to a preset logic rule and an operation strategy, generating a logic IO signal, and sending the logic IO signal to a corresponding safety control module for triggering corresponding safety control processing actions.

In some embodiments, the logic IO module predicts the computing resources required for executing the security control process according to the security state data of each security control module in combination with a preset logic rule and an operation policy, selects a corresponding computing platform, and performs the computing process on the security state data input by each security control module.

In some embodiments, the logic IO module includes an input unit, a calculation processing unit, and an IO signal output unit:

the input unit is used for receiving the safety state data from each safety control module;

the computing processing unit is used for judging whether the safety control triggering condition is met or not according to a preset logic rule and an operation strategy and generating a logic IO signal;

the IO signal output unit is used for outputting the generated logic IO signal and sending the logic IO signal to the corresponding safety control module.

In some embodiments, the semiconductor device component includes a transfer chamber, a process chamber, a reaction source transfer apparatus, a chamber gas inlet path, and a chamber gas outlet path.

In some embodiments, the safety state data includes temperature data, pressure data, flow data, electrical parameter data, and device state data.

In some embodiments, the status detection module includes a number of sensors:

the sensor includes an optical sensor, a temperature sensor, a pressure sensor, a position sensor, a flow sensor, a humidity sensor, a motion sensor, and a gas sensor.

In some embodiments, the computing platform comprises a PLC, an embedded system, and an industrial control computer.

In some embodiments, the safety control module is comprised of a separate PLC:

each PLC is connected with the logic IO module, and is connected with the state detection module and the execution module of the corresponding semiconductor equipment component.

In some embodiments, the execution module includes a heating unit, a cooling unit, a valve, a relay, a flow controller, a pressure controller, and an actuator;

And the execution module executes the safety control processing action according to the safety control instruction corresponding to the safety control module.

In some embodiments, the semiconductor device component is a reaction source transport apparatus;

The state detection module comprises a plurality of temperature sensors, flow sensors and pressure sensors which are respectively arranged at corresponding detection positions of the reaction source transmission device;

The safety state data comprises temperature data, flow data and pressure data corresponding to the detection position of the reaction source transmission device;

the execution module comprises a heating unit, a cooling unit, a reaction source inlet and outlet valve, a transmission pipeline valve and a flow controller.

In some embodiments, the reaction source transmission device is an air inlet channel;

the state detection module comprises a plurality of temperature sensors which are respectively arranged at two ends of the air inlet air path;

The safety state data comprise temperature data at two ends of the air inlet air path.

In some embodiments, the semiconductor device component is a process chamber having a wafer support pedestal disposed therein:

The state detection module comprises a plurality of temperature sensors which are respectively arranged at the top of the cavity, the bottom of the cavity and/or the side wall of the cavity and the wafer support base;

The safety state data comprises temperature data in the cavity and temperature data of the wafer support base;

The execution module comprises a heating unit and/or a cooling unit;

The safety control module is used for receiving temperature data of a plurality of temperature sensors arranged on the wafer support base and at different positions of the cavity, comprehensively detecting the temperature of the process cavity, and carrying out multi-element temperature control on the process cavity by combining with the execution module correspondingly arranged on the semiconductor equipment.

In some embodiments, the semiconductor device component is a process chamber:

The state detection module comprises a position detection unit and is arranged in the cavity;

The safety state data comprises the switching state of an air inlet valve of the process cavity, the switching state of a wafer transmission port of the process cavity and the position information of a servo mechanism of the process cavity.

In order to achieve the above object, the present invention provides a safety control method of a semiconductor device, implemented based on a safety control system of the semiconductor device, comprising the steps of:

Detecting and acquiring safety state data of the semiconductor equipment component;

Calculating and processing safety state data, judging whether safety control triggering conditions are met or not according to preset logic rules and operation strategies, and generating logic IO signals;

And sending a safety control instruction based on the logic IO signal, and performing safety control processing on the corresponding semiconductor equipment component.

The invention provides a safety control system and a method of semiconductor equipment, wherein the system creatively combines a safety control module with a logic IO module to realize unified processing of complex control processing signals, converts the complex control processing signals into the logic IO signals so as to trigger safety control actions, simplifies the information interaction flow among the modules, realizes high-efficiency safety control, and greatly shortens the detection and response processing time of abnormal conditions of the system, thereby remarkably improving the overall processing efficiency of the system.

Drawings

The above and other features, properties and advantages of the present invention will become more apparent from the following description of the embodiments with reference to the accompanying drawings in which like reference numerals refer to like features throughout, and in which:

FIG. 1 discloses a functional block diagram of a safety control system of a semiconductor device according to an embodiment of the present invention;

FIG. 2 illustrates a schematic diagram of the operation of a logic IO module in accordance with an embodiment of the present invention;

Fig. 3 discloses a schematic diagram of a safety control system of a semiconductor device according to embodiment 1 of the present invention;

fig. 4 discloses a schematic diagram of a safety control system of a semiconductor device according to embodiment 2 of the present invention;

fig. 5 discloses an overall structure schematic diagram of a safety control system of a semiconductor device according to embodiment 3 of the present invention;

fig. 6 discloses a schematic view of the base position of the safety control system of the semiconductor device according to embodiment 3 of the present invention.

The meaning of the reference numerals in the figures is as follows:

111 a first safety control module;

112 a second security control module;

121 a first state detection module;

122 a second state detection module;

131 a first execution module;

132 a second execution module;

141 a first semiconductor device component;

142 second semiconductor device components;

200 logic IO module;

210 an input unit;

220 a calculation processing unit;

230IO signal output unit;

310 liquid source/solid source;

311 first source inlet valve;

312 a second source inlet valve;

320 a first air inlet path;

321 a first temperature sensor;

a second temperature sensor 322;

323 a first heating unit;

330 a first process chamber;

410 a second inlet gas path;

420 a second process chamber;

421 a third temperature sensor;

422 a fourth temperature sensor;

423 a fifth temperature sensor;

a sixth temperature sensor 424;

425 a third heating unit;

426 a fourth heating unit;

427 a fifth heating unit;

428 a sixth heating unit;

430 tail exhaust path;

440 wafer support pedestal;

510 a transmission cavity;

520 third process chamber;

521 a third wafer transfer port;

530 a fourth process chamber;

531 a fourth wafer transfer port;

540 a fifth process chamber;

541 a fifth wafer transfer port;

550 a sixth process chamber;

551 a sixth wafer transfer port;

552 servo mechanism;

553 initial position;

554 process location;

555 the first air inlet valve;

556 second inlet valve;

560 load lock mechanism.

Detailed Description

The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Fig. 1 discloses a schematic block diagram of a safety control system of a semiconductor device according to an embodiment of the present invention, and as shown in fig. 1, the safety control system of a semiconductor device according to the present invention includes a first semiconductor device part 141 and a second semiconductor device part 142;

The safety control system may include, for example, a first safety control module 111, a second safety control module 112, a first state detection module 121, a second state detection module 122, a first execution module 131, a second execution module 132, and a logic IO module 200.

The logic IO module 200 is connected with the first security control module 111 and the second security control module 112 in a communication manner, and performs unified centralized processing on the first security control module 111 and the second security control module 112;

The first safety control module 111 is configured to be connected to the first semiconductor device part 141, and perform safety control on the first semiconductor device part 141;

The second safety control module 112 is configured to be connected to the second semiconductor device part 142, and perform safety control on the second semiconductor device part 142;

a first semiconductor device part 141 provided with a corresponding first state detection module 121 and first execution module 131;

the first safety control module 111 is in communication connection with the first state detection module 121 and the first execution module 131;

a second semiconductor device part 142 provided with a corresponding second state detection module 122 and second execution module 132;

the second safety control module 112 is communicatively connected to the second status detection module 122 and the second execution module 132.

The number of the first state detection modules 121 may be one or more, and are respectively disposed at corresponding detection positions of the first semiconductor device part 141, and are used for detecting and acquiring the safety state data of the first semiconductor device part 141;

The number of the second status detection modules 122 may be one or more, and are respectively disposed at corresponding detection positions of the second semiconductor device assembly 142, for detecting and acquiring the safety status data of the second semiconductor device assembly 142.

The first security control module 111 is connected to the first state detection module 121 and the logic IO module 200, and is configured to receive the security state data of the first state detection module 121 and send the security state data to the logic IO module 200;

The second security control module 112 is connected to the second state detection module 122 and the logic IO module 200, and is configured to receive the security state data of the second state detection module 122 and send the security state data to the logic IO module 200;

The logic IO module 200 is selectively disposed in various computing platforms, and is configured to receive the security status data of the first security control module 111 and the second security control module 112, perform computation processing, determine whether the security control triggering condition is met according to a preset logic rule and an operation policy, generate a logic IO signal, and send the logic IO signal to the corresponding first security control module 111 or second security control module 112, so as to trigger a corresponding security control processing action.

The first security control module 111 is connected to the first execution module 131, and sends a security control instruction to the first execution module 131 based on the logic IO signal after receiving the logic IO signal of the logic IO module 200.

The first execution module 131 is disposed at a corresponding execution position of the first semiconductor device 141, and performs security control processing on the first semiconductor device 141 according to a security control instruction of the first security control module 111;

The second security control module 112 is connected to the second execution module 132, and after receiving the logic IO signal of the logic IO module 200, sends a security control instruction to the second execution module 132 based on the logic IO signal.

The second execution module 132 is disposed at a corresponding execution position of the second semiconductor device assembly 142, and performs a safety control process on the second semiconductor device assembly 142 according to a safety control instruction of the second safety control module 112.

It should be noted that, on the same semiconductor device component, there may be one or more status detection modules for detecting and acquiring the security status data. For example, the number of the first state detecting modules 121 on the first semiconductor device part 141 may be plural, depending on the specific detecting requirements such as the number of the detecting positions thereof.

The number of execution modules on the same semiconductor device assembly may also be one or more, and the specific types of functions may be the same or different, for executing the safety control actions to implement the safety control process of the semiconductor device assembly. For example, the number of first execution modules 131 on the first semiconductor device part 141 may be plural, and the specific kinds of functions may be different depending on the requirements of actions and the like that it needs to take when executing the safety control.

The same safety control module may be connected to one or more semiconductor device components, for example, the first safety control module 111 may be connected to other semiconductor device components in addition to the first semiconductor device component 141, so as to ensure accuracy and real-time performance of safety control.

Of course, there is also one semiconductor device component connecting multiple safety control modules at the same time, which obviously takes redundancy and reliability into account.

Further, the safety control module of the present invention is not limited to the first safety control module 111 and the second safety control module 121, and a plurality of safety control modules may be optionally provided for connecting and controlling different semiconductor device components, and the plurality of safety control modules are respectively connected with the logic IO module 200 in a communication manner, and perform unified centralized processing on the plurality of safety control modules.

Still further, the semiconductor device component provided in the present invention includes, but is not limited to, a transmission cavity, a process cavity, a reaction source transmission device, a cavity air inlet channel, a cavity air outlet channel, and the like:

The transmission cavity is used for transmitting the wafer from the wafer loading mechanism (load locking mechanism) to the process cavity and transmitting the processed wafer in the process cavity to the outside; and/or transferring wafers from one process chamber to another, etc., ensuring continuity and efficiency of the overall process flow.

The process cavity is used for realizing key processes such as wafer growth, film formation, etching, doping and the like by precisely controlling parameters such as temperature, pressure, gas flow and the like;

The reaction source transmission device accurately transmits reaction source substances into the process cavity according to the process requirements, and necessary process conditions are provided for wafer processing;

The cavity air inlet air channel is responsible for providing the cavity with required gas or gas mixture, so that the gas environment in the cavity can meet specific process requirements;

the main function of the cavity exhaust gas path is to exhaust the waste gas in the cavity so as to keep the gas environment in the cavity to always meet the process requirements;

The cavity air inlet channel and the reaction source transmission device can be mutually independent in practical application, and can also have close overlapping relationship. For example, the reactant delivery apparatus may include a chamber inlet gas path in certain specific situations. However, this does not mean that the reactant delivery apparatus in all cases contains a chamber inlet gas path. In practice, the relationship and boundaries between the two vary from device design to device design.

In addition to the above several core components, the semiconductor device component may also comprise some extensions. For example, the process chamber may include a wafer support pedestal, an upper chamber, a lower chamber, a clamping device, a shower plate, and a wafer heating assembly, a sealing assembly, etc.

The safety state data detected and acquired by the various semiconductor device components described above is generally of a wide variety including, but not limited to, temperature data, pressure data, flow data, electrical parameter data, and device state data:

detecting and acquiring the temperature of each component of the equipment, including a process cavity, a transmission cavity, an electronic element and the like, so as to ensure that the equipment operates in a safe temperature range;

detecting and acquiring the pressure in each component of the equipment so as to ensure that the equipment operates in a safe pressure range and avoid safety risks caused by too high or too low pressure;

Detecting and acquiring flow data in each component of the equipment to ensure that the working environment of the gas meets the process requirements;

detecting and acquiring electrical parameters such as voltage, current, power and the like in each component of the equipment so as to ensure the normal operation of an electrical system of the equipment and avoid the problem caused by electrical faults;

And detecting and acquiring various equipment states, such as a switch state, an operation state, a fault state and the like, of each component of the equipment and the working mode of the equipment, so as to ensure that the equipment operates in a safe state.

These safety state data may be digital signals or analog signals, including for example current, voltage, pressure, temperature, etc., for ease of understanding; the digital signals include, for example, signals of a temperature switch, a pressure switch, a bit switch, or a proximity switch (LIMIT SWITCH), etc.

The various security status data are all required to be detected and obtained by a status detection module on the semiconductor device component. Generally, the state detection module may be a sensor, a microwave radar device, an image acquisition device, or the like.

Still further, the sensors include, but are not limited to, optical sensors, temperature sensors, pressure sensors, position sensors, flow sensors, humidity sensors, motion sensors, liquid level sensors, and gas sensors:

The optical sensor is used for detecting the intensity, color, direction and the like of light, and commonly comprises a photoresistor, a photodiode, a photoelectric switch and the like;

the temperature sensor is used for measuring the temperature of the environment or objects, and is commonly provided with a thermistor, a thermocouple, an infrared sensor and the like;

the pressure sensor is used for measuring the pressure of fluid, and is commonly a piezoresistive sensor, a piezoelectric sensor and the like;

the position sensor is used for detecting the position information of an object, and commonly comprises a photoelectric position sensor, an inductive position sensor and the like;

the flow sensor is used for detecting the flow change of liquid or gas, and commonly includes an air flow sensor, a liquid flow sensor and the like;

humidity sensors are used for measuring humidity levels in the environment, and capacitive humidity sensors, resistive humidity sensors and the like are common;

The motion sensor is used for detecting the motion or position of an object, and commonly comprises an acceleration sensor, a magnetic force sensor and the like;

the liquid level sensor is used for detecting the height or position of liquid, and commonly comprises a capacitive liquid level sensor, an optical liquid level sensor and the like;

the gas sensor is used for detecting a gas component, a concentration, and the like in the environment, and a gas sensor array, a gas concentration sensor, and the like are common.

When performing security control processing on a plurality of semiconductor device units, it is generally necessary to comprehensively consider security state data fed back by the plurality of semiconductor device units, and determine whether a specific security control trigger condition is satisfied through complex logic determination and calculation processing, instead of relying on only single security state data as the trigger condition. Therefore, the safety control system of the semiconductor device provided by the invention creatively introduces the logic IO module 200, performs unified and centralized calculation processing on the safety state data of each safety control module, judges whether a specific safety control triggering condition is met or not through the processes of a preset logic rule, an operation strategy and the like, generates a simple logic IO signal, and synchronously transmits the simple logic IO signal to the safety control module of the corresponding semiconductor device component.

The logic IO module can realize unified management and scheduling of each safety control module in the safety control system in a centralized processing mode, and the unified centralized processing mode not only improves the overall performance and stability of the safety control system, but also remarkably simplifies the whole control process, improves the control processing efficiency of the system and ensures the safe and stable operation of the semiconductor equipment.

In this embodiment, the safety control module is used as one of the key components and is formed by an independent PLC, and serves as a key connection link between the plurality of semiconductor device components and the logic IO module, which is responsible for collecting and transmitting the collected safety status data such as temperature, pressure, flow and the like to the logic IO module for unified centralized processing, and for receiving the logic IO signals of the logic IO module and transmitting the safety control instructions to the execution module based on the logic IO signals to execute the corresponding safety control processing actions.

The invention avoids the problem of poor timeliness or high complexity when the upper computer or the PLC is singly adopted for processing in the prior art by combining the safety control module with the logic IO module, thereby remarkably improving the safety control processing efficiency and simplifying the whole control flow.

Logic IO signals are typically used to describe input and output signals in digital logic circuits, which may be input signals for controlling logic functions, or output results of controlling logic functions, to represent the results or states of particular logic functions.

Logic IO signals are typically digital signals and relate to various external devices or systems, such as heating units, cooling units, valves, relays, actuators, etc., for implementing different control and interaction functions.

For example, when certain conditions are met, the logic IO module generates logic IO signals to control the actions of the actuator, the start or stop of the device, and the like.

The logic IO module 200 uses input data of a plurality of security control modules as data sources, judges whether a specific security control triggering condition is met through preset logic rules and operation strategy calculation processing, and generates a simple logic IO signal according to the judging result of the security control triggering condition to send the simple logic IO signal to the related security control modules.

Logic IO module 200 is optionally disposed in a variety of computing platforms. Computing platforms include, but are not limited to, PLCs, embedded systems, industrial control computers, and the like.

Programmable Logic Controllers (PLCs) are digital operation electronic systems designed specifically for use in an industrial environment. The embedded system is composed of hardware and software, and is a device capable of operating independently. Industrial control computer, as a special computer device for industrial automation control. Generally, an industrial control computer may be used as an upper computer.

In some embodiments, the logic IO module is deployed in the PLC; in other embodiments, the logic IO module is deployed within other computing platforms such as a host computer.

Thus, the logic IO block 200 has extremely high flexibility, and is capable of processing various types of data or signals inputted. The logic IO module has excellent processing capability for various safety state data, which means that the logic IO module can adapt to various application scenes and meet the operation and control requirements of semiconductor equipment in various complex environments.

Furthermore, the logic IO module 200 predicts the computing resources required for executing the security control process according to the security state data of each security control module in combination with the preset logic rules and the operation strategies, selects the corresponding computing platform, and performs the computing process on the security state data input by each security control module.

The logic rule covers various logic judging modes, such as sequence judgment, AND or relation, judging whether to judge, comparing judgment and the like;

The operational strategies include, but are not limited to, computational formulas, computational methods, etc., such as linear calculations, weighted evaluations, etc.

By carrying out calculation resource prediction on preset logic rules and operation strategies, logic IO modules deployed on different calculation platforms can be flexibly selected and used so as to adapt to different application scenes.

For example, in some workflows, for simple computing tasks (e.g., security state data for digital signal classes), logic IO modules are deployed directly within separate PLCs to perform computation decisions, and then the processing results are transferred to an upper computer or directly to a security control module for subsequent control processing.

In some workflows, relatively complex logic computation and judgment tasks are responsible for computation and judgment by a logic IO module in the deployment host computer, and the results are sent to a security control module for subsequent control processing.

Fig. 2 illustrates an operation schematic diagram of a logic IO module according to an embodiment of the present invention, and as shown in fig. 2, a logic IO module 200 is used as an independent functional module, and is closely connected to a device and a hardware structure, and its core structure includes 3 parts: an input unit 210, a calculation processing unit 220, and an IO signal output unit 230.

The input unit 210 is used to receive security status data from each security control module.

The safety state data can be diversified as the basis of the calculation processing of the logic IO module, and can be flexibly adjusted according to the specific actual situation of the semiconductor equipment.

The safety state data sources are wide, and can be IO interaction signals, PLC analog signals, PLC structural body data or other complex data sources.

The calculation processing unit 220 is configured to perform calculation and logic judgment on the input safety state data, determine whether safety control triggering conditions, such as power overrun, temperature overrun, differential pressure overrun, flow overrun, voltage and current overrun, valve opening interlock judgment, are met according to a preset logic rule and an operation policy, and generate a simple logic IO signal according to a judgment result;

Among them, the logic design is highly scalable, even when handling up to 10000 IO cases, the average time consumption can still be below 2ms.

The IO signal output unit 230 is configured to output the finally generated logic IO signal, and send the logic IO signal to the corresponding security control module.

In this embodiment, the safety control module reads the logic IO signals and sends a safety control instruction to the corresponding execution module, where the execution module performs safety control processing on the semiconductor device component.

When the judgment result is that the safety control trigger condition is met, the logic IO signal generated by the system sends a safety control instruction, and the execution module is controlled to perform corresponding safety control processing. When the judgment result is that the safety control triggering condition is not met, the system also generates logic IO signals and sends safety control instructions, but at the moment, the instructions do not lead the control execution module to carry out actual safety control processing. This is because the system considers the current state to be safe without taking any additional measures. This mechanism helps to avoid unnecessary interventions and misoperations, ensuring a stable operation of the system.

For example, the system sets an excessive temperature as a safety control trigger condition, when the judgment result is "the excessive temperature", the heating unit is controlled to perform safety control processing actions such as stopping heating or starting cooling by the cooling unit to reduce the temperature, and when the judgment result does not meet the "the excessive temperature", the temperature is in a normal range, and the heating unit or the cooling unit is not triggered to perform corresponding safety control processing actions.

In this embodiment, the execution module includes, but is not limited to, a heating unit, a cooling unit, a valve, a relay, a flow controller, a pressure controller, an actuator, and the like:

the heating unit is used for realizing temperature rise control and regulation;

the cooling unit is used for realizing cooling control and regulation;

the valve controls the flow and direction of the fluid medium through various actions such as opening, closing, opening adjustment, position adjustment, mode adjustment and the like;

The relay acts according to the input signal to control the on-off of the current of the output part;

The flow controller is used for controlling the flow of the fluid according to the set parameters or signals so as to meet specific process requirements or the running needs of the system;

a pressure controller for monitoring, regulating and controlling the pressure in the pipe, vessel, cavity or system;

And the actuator performs accurate displacement, rotation or other specified actions according to the control signals.

For example, the safety control module receives the logic IO signal from the logic IO module in real time, and outputs a corresponding safety control instruction to a corresponding execution module according to the content of the logic IO signal, so as to perform a safety control action on the corresponding semiconductor device component.

For example, safety control actions include, but are not limited to, heating, cooling, adjusting pressure, power, voltage, current, valve interlocks, turning off the heating device, pressure valve control (pressure relief), wafer transfer position interlocks, and the like.

In the following, a process of generating a logic IO signal by judging the state data of the semiconductor device component according to a preset logic rule and an operation policy to perform a security control process will be described in detail by using 3 specific embodiments.

Example 1: safety control of temperature of air inlet air path

Fig. 3 is a schematic diagram of a safety control system of a semiconductor device according to embodiment 1 of the present invention, in which in embodiment 1 shown in fig. 3, a semiconductor device component is a first gas inlet path 320 of a reaction chamber, and the first gas inlet path 320 is a part of a reaction source transmission device for connecting a liquid source/solid source 310 and a first process chamber 330.

The state detection module includes a first temperature sensor 321 and a second temperature sensor 322;

The execution module includes a first heating unit 323, a first source inlet valve 311, and a second source inlet valve 312.

When the temperature of the first air inlet path 320 is too high to be greater than the set range, the process flow must be stopped immediately, and the corresponding heating unit and source air inlet valve should be closed in time to avoid damage to the wafer.

In this embodiment, a first temperature sensor 321 and a second temperature sensor 322 are respectively disposed at two ends of the first air inlet path 320, and are used for measuring the temperature of the first air inlet path 320, and the safety state data includes temperature data at two ends of the first air inlet path 320;

The safety control module sends acquired temperature data analog quantities obtained by measurement of the first temperature sensor 321 and the second temperature sensor 322 to the logic IO module;

The logic IO module calculates the actual temperature value of the detection position of the first temperature sensor 321 and the second temperature sensor 322 according to the linear relation between the temperature data analog quantity and the actual temperature range, and judges whether the specific safety control logic triggering condition is met.

When the actual temperature of any one of the detection positions of the first temperature sensor 321 and the second temperature sensor 322 exceeds the set value, it is determined that the safety control logic triggering condition "the air inlet channel is too high" is satisfied, and the logic IO module generates a logic IO signal corresponding to "the air inlet channel is too high" and outputs the logic IO signal to the safety control module.

The set value can be flexibly adjusted according to actual requirements as a configuration parameter.

Once the safety control module receives the logic IO signal corresponding to the "the temperature of the air inlet channel is too high", the safety control module sends a safety control instruction to the first heating unit 323, the first source air inlet valve 311 and the second source air inlet valve 312 according to the logic IO signal, closes the first heating unit 323, or reduces the power of the first heating unit 323, and simultaneously closes the first source air inlet valve 311 and the second source air inlet valve 312.

It should be clear that only a part of the reaction source transport apparatus, namely, the first intake air path 320, is shown in embodiment 1. However, in practical applications, the reaction source transport apparatus generally includes a plurality of parts, and each part needs to be precisely controlled for safety.

When carrying out safety control to other parts of reaction source transmission device, the state detection module can also contain a plurality of flow sensor and pressure sensor, sets up respectively in reaction source transmission device's corresponding detection position, and flow sensor can the real-time supervision gas flow change in the transmission process. Meanwhile, the pressure sensor can detect pressure change in the transmission pipeline. In this case, the safety state data may also include flow data, pressure data, and the like corresponding to the detection position of the reaction source transmission device.

The execution module can also comprise a cooling unit, a reaction source inlet and outlet valve, a transmission pipeline valve, a flow controller and the like. These components play a critical role in the operation of the reaction source transport device. For example, the reaction source inlet and outlet valves can control the inlet and outlet of gas, ensure that the gas source can be rapidly cut off when needed, and prevent gas leakage. The transmission pipeline valve can adjust the flow direction and flow of the gas, and ensures that the gas is transmitted according to a preset path and speed. The flow controller can accurately control the flow of the gas, so that the smooth progress of the reaction is ensured.

Example 2: process chamber temperature safety control

Fig. 4 is a schematic diagram of a safety control system of a semiconductor device according to embodiment 2 of the present invention, in which in embodiment 2 shown in fig. 4, a semiconductor device component includes a second process chamber 420, a top portion of the second process chamber 420 is connected to a second gas inlet path 410, a bottom portion is connected to a tail gas outlet path 430, and a wafer supporting base 440 (hereinafter referred to as a base) is disposed in the second process chamber 420.

The state detection module includes, for example, a third temperature sensor 421, a fourth temperature sensor 422, a fifth temperature sensor 423, and a sixth temperature sensor 424;

The safety state data comprise, for example, temperature data of the top of the cavity, the bottom of the cavity, the outer ring of the base and the inner ring of the base;

The execution module includes a third heating unit 425, a fourth heating unit 426, a fifth heating unit 427, and a sixth heating unit 428.

Optionally, the temperature sensor may be further installed on a side wall of the cavity, and the corresponding safety status data may further include temperature data of the side wall of the cavity.

If local temperature overheating occurs in the second process chamber 420 and the temperature value is greater than the set temperature, measures must be immediately taken to prevent serious impact on the process results. The corresponding heating units need to be turned off in time and an alarm is given to ensure that the wafer does not work at a non-set temperature, thereby avoiding unnecessary losses.

Each part in the second process chamber 420 is provided with a heating unit and a temperature sensor, and each part comprises:

a third heating unit 425 and a third temperature sensor 421 at the top of the chamber;

a fourth heating unit 426 and a fourth temperature sensor 422 at the bottom of the chamber;

A fifth heating unit 427 and a fifth temperature sensor 423 of the inner ring of the susceptor;

A sixth heating unit 428 of the base outer race and a sixth temperature sensor 424.

The temperature data collected by the third to sixth temperature sensors 421 to 424 are sent to the logic IO module through the safety control module.

And the logic IO module is used for judging whether the safety control logic triggering condition is met according to the obtained temperature data.

When any one of the four measurement positions of the third temperature sensor 421 to the sixth temperature sensor 424 detects that the temperature exceeds the set value, it is determined that the safety control logic triggering condition "the cavity temperature is too high" is satisfied, and the logic IO module generates a logic IO signal corresponding to "the cavity temperature is too high" and outputs the logic IO signal to the safety control module.

The set value is used as a configuration parameter and can be flexibly adjusted according to actual requirements.

In this embodiment, the safety control module receives temperature data of a plurality of temperature sensors disposed on the wafer support base and disposed at different positions of the chamber, comprehensively detects the temperature of the process chamber, and performs multiple temperature control on the process chamber in combination with the execution module correspondingly disposed on the semiconductor device component.

According to the safety control system provided by the invention, the process cavity is precisely and polynary temperature controlled according to the temperature data obtained by comprehensive detection, so that the stability and reliability of the process are ensured.

In the aspect of multielement temperature control, various control methods and technical means can be adopted:

For example, the temperatures of a plurality of detection points can be respectively and independently controlled according to the process requirements, and the overall temperature of the cavity can be adjusted;

For example, according to the analysis result of the temperature data, the temperature range and the adjustment speed to be adjusted can be determined;

For example, accurate control of the process chamber temperature can be achieved by adjusting the power and operating time of the heating or cooling units;

for example, the temperature gradients of different regions can be set according to the process requirements to meet the requirements of complex process procedures.

For example, in this embodiment, once the safety control module receives the logic IO signal corresponding to "the cavity temperature is too high", an alarm is sent and the process flow is stopped, the safety control instruction is sent to the corresponding heating unit, and the heating unit at the corresponding position is turned off, specifically as follows:

when the temperature of the third temperature sensor 421 is too high, exceeding a set value, the third heating unit 425 is turned off;

when the temperature of the fourth temperature sensor 422 is too high, exceeding a set value, the fourth heating unit 426 is turned off;

when the temperature of the fifth temperature sensor 423 is too high to exceed a set value, the fifth heating unit 427 is turned off;

When the temperature of the sixth temperature sensor 424 is too high, exceeding a set value, the sixth heating unit 428 is turned off.

In the present embodiment, the execution module employs a heating unit, but may actually employ a cooling unit. This is because both heating and cooling are means for effectively controlling the temperature. When selecting a specific execution module, it should be determined according to the actual requirements and environmental conditions to achieve the best process effect and operation efficiency.

Example 3: safety interlock for opening process cavity door

Fig. 5 discloses a schematic overall structure of a safety control system of a semiconductor device according to embodiment 3 of the present invention, and in embodiment 3 shown in fig. 5, semiconductor device components include third to sixth process chambers 520 to 550.

The state detection module comprises a position detection unit and is arranged in the cavity;

The safety state data comprises the switching state of an air inlet valve of the process cavity, the switching state of a wafer transmission port of the process cavity and the position information of a servo mechanism of the process cavity;

The execution module comprises a wafer transmission port opening/closing actuator.

The transfer chamber 510 is connected to the third process chamber 520, the fourth process chamber 530, the fifth process chamber 540, and the sixth process chamber 550, respectively, as an important part of a semiconductor process line, each of which may perform any number of processes on a wafer, and each of which may perform the same or different processes, such as Atomic Layer Deposition (ALD), physical Vapor Deposition (PVD), chemical Vapor Deposition (CVD), etching, annealing, curing, pre-cleaning, metal or metal oxide removal, or the like.

The transfer chamber 510 may include a transfer robot configured to transfer wafers between the process chambers, load lock 560, etc., described above; the transfer robot may include one or more arms, and an end of each arm of the respective arms includes one or more end effectors; the end effector may be configured to support and transport wafers, by which wafers processed through process steps of one process chamber are transported to the outside through the load lock mechanism 560 and/or precisely to the next process chamber for processing.

Fig. 6 is a schematic diagram showing the position of the base of the safety control system of the semiconductor device according to embodiment 3 of the present invention, as shown in fig. 5 and 6, when the wafer transfer port of the process chamber is opened for performing the wafer transfer operation, it is necessary to confirm that the servo mechanism has driven the wafer support base to be at the initial position (home position) allowing the wafer transfer first in order to ensure the safety of the operation process. In addition, the source air inlet valve of the process cavity and the wafer transmission ports of other process cavities are kept in a closed state, so that the risk of gas pollution among different cavities is prevented.

Taking the sixth process chamber 550 as an example, a position detecting unit is disposed inside the sixth process chamber 550 for acquiring position information of the servo 552.

Further, the security control module obtains the following 6 status signals:

① Whether the first air inlet valve 555 of the sixth process chamber 550 is in a closed state, and the wafer transmission condition is satisfied when the first air inlet valve 555 is closed;

② Whether the second air inlet valve 556 of the sixth process chamber 550 is in a closed state, which satisfies the wafer transfer condition;

③ Whether the third wafer transfer port 521 of the third process chamber 520 is in a closed state, and satisfies a wafer transfer condition when closed;

④ Whether the fourth wafer transfer port 531 of the fourth process chamber 530 is in a closed state, and satisfies a wafer transfer condition when closed;

⑤ Whether the fifth wafer transmission port 541 of the fifth process chamber 540 is in a closed state, and satisfies a wafer transmission condition when closed;

⑥ Whether the position information of the servo 552 of the sixth process chamber 550 is at the initial position, and the wafer transmission condition is satisfied when the position information is at the initial position;

More specifically, the position information of the servo 552 of the sixth Process chamber 550 is determined (the position of the servo determines the position of the wafer support pedestal), the condition is satisfied to allow the wafer to be transferred if the wafer support pedestal is determined to be at the home position 553 based on the position information of the servo 552, and the logic IO signal "allow the wafer to be transferred" is output, and the wafer transfer condition is not satisfied if the wafer support pedestal is determined to be at the Process position 554 based on the position information of the servo 552.

When the above 6 status signals simultaneously meet the wafer transmission conditions, the logic IO module determines that the safety control logic triggering condition "allow the wafer transmission port of the sixth process chamber 550 to be opened" is met, and generates and outputs a corresponding logic IO signal to a corresponding safety control module.

When the safety control module needs to perform the operation of opening the sixth wafer transmission port 551 of the sixth process chamber 550, if a logic IO signal corresponding to "allow the opening of the wafer transmission port of the sixth process chamber 550" is received from the logic IO module, the safety control module sends a safety control instruction to the wafer transmission port opening/closing actuator, and the sixth wafer transmission port 551 of the sixth process chamber 550 may be opened. If the signal is not received, the safety control module sends a safety control instruction to the wafer transmission port opening/closing actuator to trigger the safety interlocking mechanism, so that the sixth wafer transmission port 551 of the sixth process chamber 550 is in an interlocking state and cannot be opened.

Further, at this time, the wafer transfer ports of the third process chamber 520, the fourth process chamber 530, and the fifth process chamber 550 do not receive the corresponding safety control instruction for "allowing the wafer transfer port to be opened", so that the wafer transfer ports of the process chambers correspondingly trigger the safety interlock mechanism, and the wafer transfer ports of the process chambers are in an interlocked state and cannot be opened.

Based on the safety control system of the semiconductor device, the invention also provides a safety control method of the semiconductor device, which comprises the following steps:

Detecting and acquiring safety state data of the semiconductor equipment component;

Calculating and processing safety state data, judging whether safety control triggering conditions are met or not according to preset logic rules and operation strategies, and generating logic IO signals;

And sending a safety control instruction based on the logic IO signal, and performing safety control processing on the corresponding semiconductor equipment component.

Since the workflow of the safety control system of the semiconductor device has been previously described in detail, the specific content of the safety control method of the semiconductor device according to the present invention may correspond to the workflow, and thus will not be described herein.

While, for purposes of simplicity of explanation, the methodologies are shown and described as a series of acts, it is to be understood and appreciated that the methodologies are not limited by the order of acts, as some acts may, in accordance with one or more embodiments, occur in different orders and/or concurrently with other acts from that shown and described herein or not shown and described herein, as would be understood and appreciated by those skilled in the art.

The safety control system and method of the semiconductor device provided by the invention have the following beneficial effects:

1) The logic IO module effectively simplifies the safety control logic among the modules, converts the originally complex safety control processing process into logic IO signals, and greatly improves the processing efficiency of the system;

2) By decoupling the safety control function from different semiconductor devices, the reusability of the safety control system among the different semiconductor devices is obviously improved, and the flexibility and expandability of the whole system are improved;

3) By optimizing the control processing flow, the timeliness of the equipment in the aspect of safety processing is obviously improved, the detection time and response processing time of abnormal conditions are greatly reduced, and the stability and reliability of the equipment are effectively improved.

As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be internal to two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

Those of skill in the art would understand that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

The various illustrative logical modules, and circuits described in connection with the embodiments disclosed herein may be implemented or performed with a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.

The embodiments described above are intended to provide those skilled in the art with a full range of modifications and variations to the embodiments described above without departing from the inventive concept thereof, and therefore the scope of the invention is not limited by the embodiments described above, but is to be accorded the broadest scope consistent with the innovative features recited in the claims.

Claims (12)

1. A safety control system of a semiconductor device, characterized in that the semiconductor device comprises a number of semiconductor device components;

The safety control system comprises a logic IO module, a plurality of safety control modules, a plurality of state detection modules and a plurality of execution modules;

The logic IO module is in communication connection with each safety control module, and performs unified and centralized processing on a plurality of safety control modules of the safety control system;

Each of the safety control modules is configured to be connected with one or more semiconductor device components to perform safety control on the one or more semiconductor device components;

Each semiconductor equipment component is provided with a corresponding state detection module and an execution module;

Each safety control module is in communication connection with the state detection module and the execution module of the corresponding semiconductor equipment component;

The state detection modules are respectively arranged at corresponding detection positions of the semiconductor equipment component and are used for detecting and acquiring safety state data of the semiconductor equipment component;

Each safety control module is used for receiving the safety state data of the state detection module and sending the safety state data to the logic IO module, receiving the logic IO signal of the logic IO module and sending a safety control instruction to the corresponding execution module based on the logic IO signal;

The execution modules are respectively arranged at corresponding execution positions of the semiconductor equipment component and are used for carrying out safety control processing on the semiconductor equipment component according to the safety control instruction of the safety control module;

The logic IO module is selectively arranged in various computing platforms and is used for receiving, calculating and processing the safety state data, judging whether the safety control triggering condition is met or not according to a preset logic rule and an operation strategy, generating a logic IO signal, and sending the logic IO signal to a corresponding safety control module for triggering a corresponding safety control processing action;

The logic IO module predicts the computing resources required by executing the safety control processing according to the safety state data of each safety control module and combining with preset logic rules and operation strategies, selects a corresponding computing platform and performs computing processing on the safety state data input by each safety control module.

2. The safety control system of a semiconductor device according to claim 1, wherein the logic IO module includes an input unit, a calculation processing unit, and an IO signal output unit:

the input unit is used for receiving the safety state data from each safety control module;

the computing processing unit is used for judging whether the safety control triggering condition is met or not according to a preset logic rule and an operation strategy and generating a logic IO signal;

the IO signal output unit is used for outputting the generated logic IO signal and sending the logic IO signal to the corresponding safety control module.

3. The safety control system of a semiconductor device according to claim 1, wherein the semiconductor device component comprises a transfer chamber, a process chamber, a reaction source transfer device, a chamber gas inlet path, and a chamber gas outlet path.

4. The safety control system of a semiconductor device according to claim 1, wherein the safety state data includes temperature data, pressure data, flow data, electrical parameter data, and device state data.

5. The safety control system of a semiconductor device according to claim 1, wherein the status detection module comprises a number of sensors:

the sensor comprises an optical sensor, a temperature sensor, a pressure sensor, a position sensor, a flow sensor, a humidity sensor, a motion sensor, a liquid level sensor and a gas sensor.

6. The semiconductor device security control system of claim 1, wherein the computing platform comprises a PLC, an embedded system, and an industrial control computer.

7. The safety control system of a semiconductor device according to claim 1, wherein the safety control module is constituted by an independent PLC:

each PLC is connected with the logic IO module, and is connected with the state detection module and the execution module of the corresponding semiconductor equipment component.

8. The safety control system of a semiconductor device according to claim 1, wherein the execution module includes a heating unit, a cooling unit, a valve, a relay, a flow controller, a pressure controller, and an actuator;

And the execution module executes the safety control processing action according to the safety control instruction corresponding to the safety control module.

9. The safety control system of a semiconductor device according to claim 1, wherein the semiconductor device component is a reaction source transmission means;

The state detection module comprises a plurality of temperature sensors, flow sensors and pressure sensors which are respectively arranged at corresponding detection positions of the reaction source transmission device;

The safety state data comprises temperature data, flow data and pressure data corresponding to the detection position of the reaction source transmission device;

the execution module comprises a heating unit, a cooling unit, a reaction source inlet and outlet valve, a transmission pipeline valve and a flow controller.

10. The safety control system of a semiconductor device according to claim 1, wherein the semiconductor device component is a process chamber having a wafer support pedestal disposed therein:

The state detection module comprises a plurality of temperature sensors which are respectively arranged at the top of the cavity, the bottom of the cavity and/or the side wall of the cavity and the wafer support base;

The safety state data comprises temperature data in the cavity and temperature data of the wafer support base;

The execution module comprises a heating unit and/or a cooling unit;

The safety control module is used for receiving temperature data of a plurality of temperature sensors arranged on the wafer support base and at different positions of the cavity, comprehensively detecting the temperature of the process cavity, and carrying out multi-element temperature control on the process cavity by combining with the execution module correspondingly arranged on the semiconductor equipment.

11. The safety control system of a semiconductor device of claim 1, wherein the semiconductor device component is a process chamber:

The state detection module comprises a position detection unit and is arranged in the cavity;

The safety state data comprises the switching state of an air inlet valve of the process cavity, the switching state of a wafer transmission port of the process cavity and the position information of a servo mechanism of the process cavity.

12. A safety control method of a semiconductor device, implemented based on a safety control system of a semiconductor device according to any one of claims 1 to 11, characterized by comprising the steps of:

Detecting and acquiring safety state data of the semiconductor equipment component;

Calculating and processing safety state data, judging whether safety control triggering conditions are met or not according to preset logic rules and operation strategies, and generating logic IO signals;

And sending a safety control instruction based on the logic IO signal, and performing safety control processing on the corresponding semiconductor equipment component.