CN118629900B - Wafer drying equipment - Google Patents
Wafer drying equipment Download PDFInfo
- Publication number
- CN118629900B CN118629900B CN202410521258.XA CN202410521258A CN118629900B CN 118629900 B CN118629900 B CN 118629900B CN 202410521258 A CN202410521258 A CN 202410521258A CN 118629900 B CN118629900 B CN 118629900B
- Authority
- CN
- China
- Prior art keywords
- wafer
- gas
- wafer box
- tank body
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001035 drying Methods 0.000 title claims abstract description 45
- 235000012431 wafers Nutrition 0.000 claims abstract description 122
- 239000007789 gas Substances 0.000 claims abstract description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 39
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 19
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims 4
- 238000000605 extraction Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to wafer drying equipment, wherein a first air jet pipe is arranged in a groove body of the wafer drying equipment and is aligned with a die assembly line on a wafer box, and larger liquid drops are usually remained at the die assembly line and are the most difficult places on the wafer box to dry, so that an outlet of the air jet pipe is aligned with the die assembly line on the wafer box, the drying effect of the place can be enhanced, and the drying efficiency is improved. The cover body is internally provided with a second air jet pipe which jets mixed gas of isopropanol and nitrogen from top to bottom to dry the whole wafer box and wafers in the wafer box.
Description
Technical Field
The application belongs to the technical field of wafer production equipment, and particularly relates to wafer drying equipment.
Background
During the process of each wafer, the wafer needs to be cleaned because contaminants such as particles adhere to the wafer due to the etching operation with the treating agent. After each cleaning, the wafer needs to be dried. The chinese patent document CN117153741B discloses a wafer drying device of an integrated wafer cleaning and drying device, in which a wafer is placed in a wafer box to be dried, and at this time, the wafer box and the wafer need to be dried together, and the wafer box is generally difficult to be dried, especially, liquid often remains on a mold clamping line on the wafer box, so that the drying effect is poor.
Disclosure of Invention
The invention aims to solve the technical problem of providing wafer drying equipment with good drying effect in order to solve the defects in the prior art.
The technical scheme adopted for solving the technical problems is as follows:
a wafer drying apparatus comprising:
A housing having a cavity therein;
The tank body is arranged in the shell, the bottom of the tank body is provided with a liquid outlet, a first air injection pipe is arranged in the tank body and used for injecting nitrogen, and the bottom of the tank body is provided with the liquid outlet and used for being connected with an air supply device to discharge fluid in the tank body;
the cover body is hinged to the shell and is used for being covered on the top of the tank body, and a second air ejector tube is arranged in the cover body and is used for ejecting mixed gas of isopropanol and nitrogen;
The wafer box support frame is arranged in the groove body and used for supporting the wafer box, the outlet of the first air ejector tube is aligned with the die assembly line on the outer side of the wafer box from the side face, and the second air ejector tube is aligned with the die assembly line on the inner side of the wafer box from the upper side.
Preferably, in the wafer drying apparatus of the present invention, a heating plate is attached to an outer wall of the tank.
Preferably, in the wafer drying apparatus of the present invention, four second air injection pipes are disposed in the cover body, and the second air injection pipes on two sides are aligned to the die line on the inner side of the wafer box.
Preferably, when the wafer drying equipment is placed in the wafer box in the groove body, the first air ejector pipe and the second air ejector pipes at two sides eject normal-temperature nitrogen, and then all the second air ejector pipes eject mixed gas of isopropanol and nitrogen to dry the wafer.
Preferably, in the wafer drying device of the present invention, the cover body is further provided with an air supply pipe, the second temperature sensor is used for sensing the temperature of the air in the air supply pipe, a gas collecting block is arranged in the cover body, channels are arranged in the gas collecting block to communicate a plurality of second air injection pipes with the air supply pipe, and the mixed gas of isopropanol and nitrogen is sprayed out from the second air injection pipes through the air supply pipe.
Preferably, in the wafer drying device of the present invention, the cover body is provided with a tee, one end of the tee is connected with an air supply pipe connected with the air supply tank, one end of the tee is connected with the air supply pipe connected with the air collecting block, and one end of the tee is provided with a second temperature sensor extending into the air supply pipe.
Preferably, in the wafer drying device of the present invention, a gas-liquid separator is further disposed inside the housing, and the gas-liquid separator is connected to the liquid outlet and is used for separating the gas and the liquid flowing out from the liquid outlet.
Preferably, the wafer drying apparatus of the present invention, a wafer cassette support frame, comprises:
The bottom plate is of a hollow rectangle, and the long edge of the bottom plate is provided with a mounting groove;
The top block is arranged in the mounting groove and used for supporting the bottom of the wafer box;
The limiting blocks are arranged at four corners of the bottom plate and used for limiting the four corners of the wafer box;
The mounting plate is arranged on the bottom plate and is positioned above the hollow part, and the middle of the mounting plate is provided with a hollowed-out part;
And the top plates are respectively arranged on two sides of the mounting plate and are used for jacking up wafers in the wafer box.
Preferably, in the wafer drying apparatus of the present invention, the top block includes a top block bottom plate and a top block inclined plate, and the width of the top block inclined plate gradually decreases toward the top end.
The beneficial effects of the invention are as follows:
according to the wafer drying equipment, the first air ejector is arranged in the groove body and is aligned with the die assembly line on the wafer box, and larger liquid drops are left at the die assembly line and are the most difficult places to dry on the wafer box, so that the outlet of the air ejector is aligned with the die assembly line on the wafer box, the drying effect on the places can be enhanced, and the drying efficiency is improved. The cover body is internally provided with a second air jet pipe which jets mixed gas of isopropanol and nitrogen from top to bottom to dry the whole wafer box and wafers in the wafer box.
Drawings
The technical scheme of the application is further described below with reference to the accompanying drawings and examples.
FIG. 1 is a schematic view of a wafer drying apparatus according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of a wafer drying apparatus according to an embodiment of the present application;
FIG. 3 is a cross-sectional perspective view of a wafer drying apparatus according to an embodiment of the present application;
FIG. 4 is a perspective view of an air supply-related assembly according to an embodiment of the present application;
FIG. 5 is a schematic view of a wafer drying apparatus with a hidden housing according to an embodiment of the present application;
FIG. 6 is a perspective view of a wafer cassette support bracket according to an embodiment of the present application;
FIG. 7 is a perspective view of another orientation of a wafer cassette support bracket according to an embodiment of the present application;
FIG. 8 is a top view of a wafer cassette support bracket according to an embodiment of the present application;
FIG. 9 is a perspective view of a cassette support bracket with cassettes according to an embodiment of the application;
The reference numerals in the figures are:
1. A housing;
2. a cover body;
3. a tank body;
4. A wafer cassette support;
9. A wafer cassette;
11. a gas supply tank;
12. a gas-liquid separator;
21. A second gas lance;
22. An air supply pipe;
23. A second temperature sensor;
24. a gas collecting block;
25. Sealing grooves;
26. A hinge;
27. A tee joint;
31. A first gas lance;
32. a liquid outlet;
33. a first temperature sensor;
34. A heating sheet;
41. a bottom plate;
42. a top block;
43. a limiting block;
44. a mounting plate;
45. a top plate;
91. a die line;
411. hollow;
412. A mounting groove;
421. a top block bottom plate;
422. a top block sloping plate;
441. A hollowed-out part;
442. a hexagonal screw;
451. Long waist hole.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art in a specific case.
The technical scheme of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.
Examples
The present embodiment provides a wafer drying apparatus, as shown in fig. 1, including:
a housing 1 having a cavity therein;
the tank body 3 is arranged in the shell 1, the bottom of the tank body is provided with a liquid outlet 32, a first air jet pipe 31 is arranged in the tank body 3 and used for jetting out nitrogen, and the bottom of the tank body 3 is provided with the liquid outlet and used for being connected with an air supply and exhaust device to exhaust fluid in the tank body 3;
the cover body 2 is hinged on the shell 1 (through a hinge 26) and is used for being covered on the top of the groove body 3, a second air jet pipe 21 is arranged in the cover body 2, and the second air jet pipe 21 is used for jetting mixed gas of isopropanol and nitrogen;
The wafer cassette support frame 4 is disposed in the tank body 3, and is used for supporting the wafer cassette, the outlet of the first air jet pipe 31 is aligned with the mold clamping line 91 on the outer side of the wafer cassette from the side (aligned by adjusting the setting height and the outlet direction of the air jet pipe 31), and the second air jet pipe 21 is aligned with the mold clamping line 91 on the inner side of the wafer cassette from the upper side.
In the wafer drying apparatus of this embodiment, the first air ejector 31 is disposed in the tank body 3 and aligned with the mold clamping line 91 on the wafer cassette, and large droplets generally remain at the mold clamping line 91, which is the most difficult place on the wafer cassette to dry, so that the gas outlet of the first air ejector 31 is aligned with the mold clamping line 91 on the wafer cassette from the side surface, and the gas outlet of the second air ejector 21 is aligned with the mold clamping line 91 on the inner side of the wafer cassette from the upper side, which can enhance the drying effect on the place and improve the drying efficiency. The cover body 2 is internally provided with a second air jet pipe 21 which jets mixed gas of isopropanol and nitrogen from top to bottom to dry the whole wafer box and wafers in the wafer box.
The mold line refers to the flow or overflow of the wafer cassette at the mold junction during the injection molding process, leaving visible marks, sometimes referred to as mold marks or interface lines, after the flash is not cut or removed.
Further, four second air nozzles 21 are disposed in the cover 2, and the second air nozzles 21 on both sides are aligned with the mold clamping line 91 on the inner side of the circular box.
Further, heating plates 34, such as silica gel heating plates, are attached to the outer walls of the tank body 3, and are disposed on the vertical outer walls at the front end and at the two sides of the tank body 3. When the wafer is dried, the temperature in the tank 3 is adjusted by the heating sheet 34. Temperature control is performed by measuring the temperature of the tank body 3 by the first temperature sensor 33, and the PLC adjusts the heating power of the heating plate 34 according to the temperature measured by the first temperature sensor 33, thereby realizing the stability of the temperature in the tank body 3.
Four second air ejector tubes 21 are arranged in the cover body 2, and the second air ejector tubes 21 on two sides are aligned with a mold clamping line 91 on the inner side of the circular box. When the wafer box (wafer box is loaded with wafers) is placed in the groove body 3, the first air ejector tube 31 and the second air ejector tubes 21 on two sides eject normal-temperature nitrogen, the large particle liquid on the wafer box is firstly blown off or the size of the large particle liquid is reduced, and meanwhile, the air in the groove body 3 is exhausted, namely, the wafer box is firstly dried, and because the drying of the wafer box is generally difficult, the wafer box can be dried synchronously with the drying of the wafer box, and then the second air ejector tubes 21 eject the mixed gas of isopropanol and nitrogen to dry the wafer. Because of the inflammable and explosive nature of isopropanol, the air of the tank body 3 needs to be exhausted, and meanwhile, the isopropanol is not suitable to be at a higher temperature just after entering the tank body 3, so that normal-temperature nitrogen gas is used for blowing.
Further, the cover body 2 is further provided with an air supply pipe 22, the second temperature sensor 23 is used for sensing the temperature of the air in the air supply pipe 22, the cover body 2 is internally provided with a gas collecting block 24, channels are arranged in the gas collecting block 24 to be communicated with the plurality of second air injection pipes 21 and the air supply pipe 22, and the mixed gas of isopropanol and nitrogen is sprayed out from the second air injection pipes 21 through the air supply pipe 22. As shown in fig. 4, four second gas nozzles 21 are provided, and the mixed gas of isopropyl alcohol and nitrogen enters the gas collecting block 24 in advance, and the four second gas nozzles 21 are connected with the gas collecting block 24 in a unified manner.
Further, the top end of the tank body 3 is provided with a sealing groove 25, and a sealing ring is arranged in the sealing groove 25 to be matched with the cover body 2 so as to seal a gap between the tank body 3 and the cover body 2. By providing the above-described closed structure, IPA is prevented from diffusing out of the tank body 3.
Further, a tee joint 27 is arranged on the cover body 2, one end of the tee joint 27 is connected with an air supply pipe connected with the air supply tank 11, one end of the tee joint is connected with the air supply pipe connected with the air collecting block 24, and the other end of the tee joint is provided with a second temperature sensor 23 extending into the air supply pipe. An air supply pipe connected with the air supply tank 11 penetrates through a hollow hole in the top of the shell 1 and is connected with the air supply tank in the shell 1. The gas supply pipe connected to the gas supply tank is omitted in fig. 4.
Further, a gas-liquid separator 12 is provided in the housing 1, and the gas-liquid separator 12 is connected to the liquid outlet 32 to separate the gas and the liquid, typically IPA, flowing out from the liquid outlet 32.
Further, the wafer cassette support stand 4 includes:
the bottom plate 41 is rectangular with a hollow 411, and a mounting groove 412 is formed on the long side of the bottom plate 41;
a top block 42 installed in the installation groove 412 for supporting the bottom of the wafer cassette 9;
the limiting blocks 43 are arranged at four corners of the bottom plate 41 and are used for limiting the four corners of the wafer box 9;
The mounting plate 44 is arranged on the bottom plate 41 and is positioned above the hollow 411, and a hollowed-out part 441 is arranged in the middle of the mounting plate 44;
top plates 45 are respectively mounted on both sides of the mounting plate 44, and are used for lifting up wafers in the wafer cassette 9.
In the wafer box supporting seat of this embodiment, the mounting groove 412 is formed on the bottom plate 41, the top block 42 is positioned and mounted conveniently by the setting of the mounting groove 412, the top block 42 is used for directly contacting the bottom of the wafer box 9 and slightly jacking the wafer box 9, compared with the case that the wafer box 9 is directly placed on the bottom plate 41, the contact area with the wafer box 9 can be reduced, the wafer in the wafer box 9 can be slightly jacked by the setting of the top plate 45, so that the bottom of the wafer is separated from the direct contact with the wafer box 9, and the drying effect is improved.
The hollow part 441 on the mounting plate 44 is matched with the hollow 411, so that the bottom air flow can be ensured to pass through, and the drying effect of the wafer box is improved. The long waist holes 451 are formed in the top plate 45 in the vertical direction, the screws penetrate through the long waist holes 451 to fix the top plate 45 on the mounting plate 44, and the height of the top plate 45 can be adjusted by adjusting the positions of the screws in the long waist holes 451. The top plate 45 has a slope on the top to reduce the thickness of the top end, thereby reducing the contact area with the wafer.
Further, both ends of the mounting plate 44 are mounted to the bottom plate 41 by hexagonal screws 442.
The limiting block 43 is L-shaped. The mounting grooves 412 and the top blocks 42 are four, and the four top blocks 42 are arranged in a rectangular shape. The two corresponding mounting grooves 412 on both sides of the bottom plate 41 are machined by the same milling cutter, so that the mounting grooves 412 are collinear, the four mounting grooves 412 can be machined by two milling cutters, the machining is convenient, and the positions of the mounting grooves 412 are corresponding.
Further, the top block 42 includes a top block bottom plate 421 and a top block inclined plate 422, and the width of the top block inclined plate 422 is gradually reduced toward the top end, thereby reducing the contact area with the wafer cassette.
With the above-described preferred embodiments according to the present application as a teaching, the worker skilled in the art could make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410521258.XA CN118629900B (en) | 2024-04-28 | 2024-04-28 | Wafer drying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410521258.XA CN118629900B (en) | 2024-04-28 | 2024-04-28 | Wafer drying equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118629900A CN118629900A (en) | 2024-09-10 |
| CN118629900B true CN118629900B (en) | 2024-12-20 |
Family
ID=92602322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410521258.XA Active CN118629900B (en) | 2024-04-28 | 2024-04-28 | Wafer drying equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118629900B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115388619A (en) * | 2022-08-23 | 2022-11-25 | 上海提牛机电设备有限公司 | Silicon wafer drying box |
| CN116313882A (en) * | 2022-09-08 | 2023-06-23 | 上海至纯洁净系统科技股份有限公司 | Liquid tension control method capable of improving wafer drying efficiency |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10321585A (en) * | 1997-05-22 | 1998-12-04 | Mitsubishi Electric Corp | Drying method and apparatus |
| US6328814B1 (en) * | 1999-03-26 | 2001-12-11 | Applied Materials, Inc. | Apparatus for cleaning and drying substrates |
| CN219656562U (en) * | 2023-05-08 | 2023-09-08 | 无锡亚电智能装备有限公司 | Groove cover structure of wafer drying groove body |
| CN219647198U (en) * | 2023-05-08 | 2023-09-08 | 无锡亚电智能装备有限公司 | Mixing tank for isopropanol and nitrogen |
| CN116544144B (en) * | 2023-05-16 | 2023-10-27 | 江苏亚电科技有限公司 | Wafer cleaning, drying and lifting mechanism with air injection function |
-
2024
- 2024-04-28 CN CN202410521258.XA patent/CN118629900B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115388619A (en) * | 2022-08-23 | 2022-11-25 | 上海提牛机电设备有限公司 | Silicon wafer drying box |
| CN116313882A (en) * | 2022-09-08 | 2023-06-23 | 上海至纯洁净系统科技股份有限公司 | Liquid tension control method capable of improving wafer drying efficiency |
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| Publication number | Publication date |
|---|---|
| CN118629900A (en) | 2024-09-10 |
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