CN118565525B - Multi-degree-of-freedom micro-displacement measuring device of hemispherical resonator gyroscope - Google Patents
Multi-degree-of-freedom micro-displacement measuring device of hemispherical resonator gyroscope Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
- G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5776—Signal processing not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
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Abstract
本申请公开了一种半球谐振陀螺的多自由度微位移测量装置，其采用了优化设计与制造的压电悬臂梁探针、能实现多级位移控制的多级多自由度位移台、高频声波激振模块以及皮米级位移检测模块等，可实现高频振动下1皮米振幅的检测精度，为半球谐振陀螺开展低成本高精度的质量不平衡检测提供新的检测手段，检测结果可为后续利用开展半球谐振陀螺调平提供依据。
The present application discloses a multi-degree-of-freedom micro-displacement measuring device for a hemispherical resonant gyroscope, which adopts a piezoelectric cantilever beam probe of optimized design and manufacture, a multi-stage multi-degree-of-freedom displacement platform capable of realizing multi-stage displacement control, a high-frequency acoustic wave excitation module, and a picometer-level displacement detection module, etc., and can realize a detection accuracy of 1 picometer amplitude under high-frequency vibration, providing a new detection means for low-cost and high-precision mass imbalance detection of a hemispherical resonant gyroscope, and the detection result can provide a basis for subsequent use in carrying out hemispherical resonant gyroscope leveling.
Description
Technical Field
The invention relates to a displacement measuring device of a hemispherical resonator gyroscope, in particular to a hemispherical resonator gyroscope displacement measuring device based on a piezoelectric cantilever probe.
Background
The excellent performance of the hemispherical resonator gyroscope is limited by defects of harmonic oscillators of quartz materials, including defects of quality, rigidity and damping, and the defects of quality and rigidity, so that natural frequencies of two main vibration modes of the quartz harmonic oscillator, namely the harmonic oscillator, are not matched, and the performance of the hemispherical resonator gyroscope in precision, reliability, service life and the like is greatly reduced. Under the condition of the existing manufacturing capability, the leveling technology for improving the quartz harmonic oscillator is a main means for solving the mass unbalance of the quartz harmonic oscillator.
In the aspect of the identification method of the rigid shaft position of the harmonic oscillator and the unbalanced mass, according to the leveling theory of the unbalanced mass, the accurate identification of the rigid shaft position of the harmonic oscillator and the unbalanced mass is a primary condition for realizing high-precision leveling. The frequency difference caused by the defect of uneven density of the quartz harmonic oscillator can cause drift of the four antinode vibration mode positions of the harmonic oscillator relative to the direction of an inherent axis, frequency cracking is generated to cause errors of hemispherical resonance gyro precision, and therefore the size and the direction of uneven density parameters need to be identified, a foundation is provided for compensating uneven density harmonic waves of one to three times by using a leveling technology, and preparation is provided for improving gyro precision. The quality balance index of the hemispherical resonator gyroscope is extremely high, and the quality unbalance detection resolution of the hemispherical resonator gyroscope is usually required to be better than 2ppm, and the angle identification precision is better than 2 degrees, so that the amplitude detection precision under the vibration mode of the hemispherical resonator gyroscope is up to 2pm. At present, a laser Doppler instrument is generally adopted for detecting the mass unbalance of the hemispherical resonator gyroscope, and the method has the advantages of non-contact measurement, high precision and simple measurement, and has the defect of high price, and huge cost is generated when mass production detection is carried out.
In addition, the harmonic oscillator is a precise component with high requirements on vibration characteristics, and has the characteristics of light weight, small volume and the like. When the contact type piezoelectric microsensor is used for testing the vibration characteristics, the factors such as the measurement range, the measurement sensitivity, the performance interference of prestress on the harmonic oscillator, the feasibility of sensor preparation and the like are considered, and meanwhile, the accurate detection and extraction of weak piezoelectric signals are also the precondition for realizing picometer displacement measurement.
Disclosure of Invention
The application aims to construct a low-cost multi-degree-of-freedom harmonic oscillator micro-vibration detection device so as to realize large-scale application of a high-precision hemispherical resonator gyroscope.
Some embodiments of the application provide a multi-degree-of-freedom micro-displacement measurement device of a hemispherical resonator gyroscope, which comprises a piezoelectric cantilever probe, a multi-degree-of-freedom displacement table, a high-frequency sound wave excitation module and a picometer-level displacement detection module, wherein the piezoelectric cantilever probe is used for detecting picometer-level micro-displacements generated by a harmonic oscillator of the hemispherical resonator gyroscope under resonance frequency vibration and generating charges representing the micro-displacements, the multi-degree-of-freedom displacement table is used for positioning the piezoelectric cantilever probe to a measurement position of the harmonic oscillator and making contact with the harmonic oscillator, the high-frequency sound wave excitation module is used for generating sound wave signals with the same resonance frequency as the harmonic oscillator so as to provide excitation signals for the harmonic oscillator, and the picometer-level displacement detection module is used for obtaining the charges from the piezoelectric cantilever probe and processing the charges so as to calculate and obtain picometer-level displacements.
In some embodiments, the piezoelectric cantilever probe is designed based on dynamic simulation optimization of a harmonic oscillator, the maximum output of the instantaneous charge quantity of the piezoelectric cantilever probe is calculated as a target, the intensity of the piezoelectric cantilever probe and the threshold value of the time-course displacement response variation degree of the hemispherical resonator gyroscope are used as constraint conditions, and the optimized problem that the geometric dimension of the piezoelectric cantilever probe, the thickness of a substrate layer of a titanium alloy material, the size of a welding lug, the thickness of a piezoelectric layer and the thickness of an upper electrode of a titanium/copper metal material are used as variables is solved, so that the optimized structural form of the piezoelectric cantilever probe is obtained.
In some embodiments, the manufacturing of the designed piezoelectric cantilever probe is based on an MEMS preparation process and comprises the steps of firstly welding a substrate layer formed by a substrate sheet and a piezoelectric ceramic layer formed by piezoelectric ceramic in a vacuum environment by utilizing a soldering lug to form a composite piezoelectric cantilever structure, then precisely machining the piezoelectric ceramic layer after protecting the piezoelectric ceramic layer, turning a conical probe structure, then sputtering titanium/copper metal on the surface of the piezoelectric ceramic layer by utilizing a magnetron sputtering table to form an electrode layer, then spin-coating photoresist on the surface of the electrode layer by utilizing a photoresist homogenizer, performing pre-baking, exposure, development and post-baking MEMS photoetching processes, patterning the photoresist electrode pattern, then etching the exposed part of the electrode layer by utilizing copper/titanium electrode etching liquid to form an electrode on the patterned piezoelectric cantilever, then applying a direct current electric field to polarize the piezoelectric ceramic layer to generate a piezoelectric effect, and finally forming a single piezoelectric cantilever probe by utilizing a high-power laser cutting machine.
In some embodiments, the multi-stage multi-degree-of-freedom displacement table comprises a three-axis displacement control module, a visual contact feedback module and a sensor clamping module, wherein the three-axis displacement control module comprises a first displacement control part for controlling the displacement of a first axis, a second displacement control part for controlling the displacement of a second axis and a third displacement control part for controlling the displacement of a third axis, each of the first displacement control part, the second displacement control part and the third displacement control part comprises a first-stage displacement control unit for controlling a larger displacement range and a second-stage displacement control unit for controlling a smaller displacement range, and a rack-and-pinion mechanism is adopted as the first-stage displacement control unit and a piezoelectric ceramic actuator is adopted as the second-stage displacement control unit.
In some embodiments, for a displacement range of the rack and pinion mechanism in the second displacement control portion of between 0-10 mm, a resolution of up to 10 μm may be used to roughly position the piezoelectric cantilever probe near the center of the resonator, the piezoelectric ceramic actuator has a resolution of 5nm and a displacement range of 0-40 μm, and the piezoelectric ceramic actuator is configured to micro-step the piezoelectric cantilever probe until contacting the resonator.
In some embodiments, the visual contact feedback module comprises a high definition electron microscope and/or a camera configured to provide visual feedback signals to the triaxial displacement control module, or the high definition electron microscope and/or the camera and the third displacement control portion form a joint feedback mechanism to provide joint feedback including visual feedback signals and voltage feedback signals to the triaxial displacement control module.
In some embodiments, the sensor clamping module is used for firmly clamping the piezoelectric cantilever beam probe, and comprises a lead screw sliding block mechanism and a clamping head matched with the lead screw sliding block mechanism.
In some embodiments, the high-frequency sound wave excitation module comprises a piezoelectric ceramic block or a microphone device, a signal generator and a power amplifier, wherein the frequency of the signal generator is set to the starting frequency of the hemispherical resonator gyroscope, and a voltage signal output by the signal generator is output to the piezoelectric ceramic block or the microphone device through the power amplifier, so that the piezoelectric ceramic block or the microphone device generates a sound wave signal to excite the hemispherical resonator gyroscope.
In some embodiments, the picometer level displacement detection module comprises a charge amplifier, a phase-locked amplifier and a displacement calculation module, wherein the charge amplifier is configured to collect and amplify charges generated by the piezoelectric cantilever probe, the phase-locked amplifier is configured to lock the frequency of a voltage signal output by the charge amplifier, extract a nanovolt level weak useful signal with the same resonant frequency, and filter an environmental noise signal, and the displacement calculation module is configured to calculate the picometer level displacement by taking the output of the phase-locked amplifier as an input.
In some embodiments, the phase-locked amplifier adopts an external input reference signal or an internal input reference signal, and if the external input reference signal is adopted, the voltage signal output by the signal generator is split into one path and is sent to an external input end of the phase-locked amplifier.
The measuring device provided by the application has the beneficial effects that the piezoelectric cantilever beam probe which is optimally designed and manufactured, the multistage multi-degree-of-freedom displacement platform which can realize multistage displacement control, the high-frequency sound wave excitation module, the picometer displacement detection module and the like are adopted, the detection precision of 1pm amplitude under high-frequency vibration can be realized, a new detection means is provided for the hemispherical resonator gyro to develop low-cost high-precision mass unbalance detection, and the detection result can provide a basis for the subsequent utilization of the hemispherical resonator gyro to develop leveling.
Drawings
Fig. 1 is a schematic structural diagram of a multi-degree-of-freedom micro-displacement measuring device of the hemispherical resonator gyroscope according to an embodiment of the application.
Fig. 2 is a schematic structural diagram of a piezoelectric cantilever beam probe in the multiple degree of freedom micro-displacement measurement device of the hemispherical resonator gyroscope according to an embodiment of the application.
Fig. 3 is a schematic flow chart of a method for manufacturing the piezoelectric cantilever probe.
Fig. 4 is a schematic structural diagram of a multi-stage multi-degree-of-freedom displacement table in a multi-degree-of-freedom micro-displacement measuring device of a hemispherical resonator gyroscope according to the present application.
Fig. 5 is a functional block diagram of a multiple degree of freedom micro-displacement measuring device of a hemispherical resonator gyro according to an embodiment of the application.
Detailed Description
The technical scheme of the application is further described below with reference to the accompanying drawings.
In general, the application provides a multi-degree-of-freedom micro-displacement measuring device of a hemispherical resonator gyroscope, and the application is further described in detail below for making the purposes, technical schemes and effects of the application clearer and more definite. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Specific structural and functional details disclosed herein are merely representative and are for purposes of describing exemplary embodiments of the application. The application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be noted that, in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may in fact be executed substantially concurrently or the figures may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
The multi-degree-of-freedom micro-displacement measuring device of the hemispherical resonator gyroscope mainly comprises a piezoelectric cantilever probe 10, a multi-degree-of-freedom displacement platform 20, a high-frequency sound wave excitation module 30 and a picometer-level displacement detecting module 40, wherein the piezoelectric cantilever probe 10 is used for detecting picometer-level displacement signals generated by mass unbalance of a harmonic oscillator A of the hemispherical resonator gyroscope under resonance frequency vibration, and the multi-degree-of-freedom displacement platform 20 has the function of accurately positioning the piezoelectric cantilever probe 10 to a measuring position of the harmonic oscillator A and generating trace interference contact with the harmonic oscillator A, so that the piezoelectric cantilever probe 10 generates millivolt-level charges. The function of the high-frequency acoustic excitation module 30 is to generate an acoustic signal at the same resonant frequency as that of the resonator a, thereby providing an excitation signal to the resonator a.
As shown in fig. 2, the piezoelectric cantilever probe 10 has a laminated structure including a composite layer structure including a base layer and a piezoelectric ceramic layer, the base layer having a conical probe structure 11, and the piezoelectric ceramic layer having an electrode structure 12 formed thereon.
The piezoelectric cantilever probe can be designed by using a dynamic simulation optimization design scheme based on a harmonic oscillator A, wherein the scheme can be that the maximum instantaneous charge quantity output of the piezoelectric cantilever probe 10 is used as a target, the intensity of the piezoelectric cantilever probe 10 and the threshold value of the time course displacement response variation degree of a hemispherical resonator gyroscope are used as constraint conditions, and the optimized problems of the geometrical size of the piezoelectric cantilever probe 10, the thickness of a matrix layer of a titanium alloy TC4 material, the size of a soldering lug, the thickness of a piezoelectric layer (PZT) and the thickness of an upper electrode of a titanium/copper metal material are used as variables are calculated, so that the structure form of the optimized piezoelectric cantilever probe 10 is obtained.
In some embodiments, as shown in fig. 3, the fabrication of the designed piezoelectric cantilever probe 10 may be based on a MEMS fabrication process, which may include a step S101 of welding a substrate layer formed by a substrate sheet and a piezoelectric ceramic layer formed by piezoelectric ceramic in a vacuum environment by using a soldering tab to form a composite piezoelectric cantilever structure, a step S102 of protecting the piezoelectric ceramic layer, then precisely machining the substrate layer, turning a conical probe structure, a step S103 of sputtering titanium/copper metal on the surface of the piezoelectric ceramic layer by using a magnetron sputtering table to form an electrode layer, a step S104 of spin-coating photoresist on the surface of the electrode layer by using a spin coater to perform a pre-bake, exposure, development, and post-bake MEMS lithography process to pattern a photoresist electrode pattern, a step S105 of etching away a portion of the exposed electrode layer by using a copper/titanium electrode etching solution to form an electrode on the patterned cantilever, a step S106 of applying a dc electric field to polarize the piezoelectric ceramic layer to generate a piezoelectric effect, and finally forming a single cantilever probe 10 by using a high-power laser cutting machine.
As shown in fig. 1 and 4, the multi-stage multi-degree-of-freedom displacement stage 20 includes a triaxial displacement control module 21, a visual contact feedback module 22, and a sensor clamping module 23. Wherein the triaxial displacement control module 21 comprises a first displacement control portion 211 for controlling the displacement of the first axis, a second displacement control portion 212 for controlling the displacement of the second axis, and a third displacement control portion 213 for controlling the displacement of the third axis. Each of the first displacement control portion 211, the second displacement control portion 212, and the third displacement control portion 213 includes a first stage displacement control unit that controls a larger displacement range and a second stage displacement control unit that controls a smaller displacement range. For example, the first displacement control portion 211 includes a first displacement control unit 2111 and a second displacement control unit 2112, the second displacement control portion 212 includes a third displacement control unit 2121 and a fourth displacement control unit 2122, and the third displacement control portion 213 includes a fifth displacement control unit 2131 and a sixth displacement control unit 2132;
Specifically, taking the second displacement control portion 212 as an example, the third displacement control unit 2121 includes a gear-rack mechanism, and controls a larger displacement range by manual driving, the displacement range is between 0mm and 10mm, the resolution can reach 10 μm, the piezoelectric cantilever probe 10 is roughly positioned near the center of the harmonic oscillator a of the hemispherical resonator gyroscope, the fourth displacement control unit 2122 includes a piezoelectric ceramic actuator, the resolution can reach 5nm, the movement range is between 0 μm and 40 μm, and the piezoelectric ceramic actuator is configured to make the piezoelectric cantilever probe 10 perform micro-stepping, i.e. slowly step until contacting the harmonic oscillator a.
Similar to the second displacement control portion 212, the first displacement control portion 211 and the third displacement control portion 213 may employ a rack-and-pinion mechanism and a piezoelectric ceramic actuator as the first stage displacement control unit and the second stage displacement control unit, respectively.
As shown in fig. 1, the visual contact feedback module 22 detects whether the piezoelectric cantilever probe 10 contacts the resonator a by using the high-definition electron microscope 221, or a combined feedback mechanism formed by the high-definition electron microscope 221 and a voltage threshold of the piezoelectric ceramic actuator serving as the fourth displacement control unit 2122. The high definition electron microscope 221 may provide visual feedback to the triaxial displacement control module 21 alone. Or forms a joint feedback with the voltage signal feedback of the fourth displacement control unit 2122.
When the piezoelectric ceramic actuator makes the probe structure 1 of the piezoelectric cantilever probe 10 contact with the harmonic oscillator a of the hemispherical resonator gyro fixed on the fixture from above during the micro-stepping process, the piezoelectric cantilever probe 10 generates an instantaneous voltage signal due to the contact with the harmonic oscillator a. Therefore, the instantaneous voltage signal can be detected, and the piezoelectric ceramic actuator is immediately stopped when the instantaneous voltage signal is detected to exceed the voltage threshold preset by the piezoelectric ceramic actuator control module. The setting of the voltage threshold is determined by the piezoelectric sensitivity coefficient of the piezoelectric cantilever probe 10.
In addition, as a supplementary structure of the visual contact feedback module 22, a camera 223 may be provided, by which the contact condition of the piezoelectric cantilever probe 10 and the resonator a is observed.
In addition, as a supplementary structure to the visual contact feedback module 22, a camera 223 may be provided, and the contact condition of the piezoelectric cantilever probe 10 and the resonator a may be observed through the camera 223.
The sensor clamping module 23 is used to firmly clamp the piezoelectric cantilever probe 10. The sensor clamping module 23 can be matched with the clamping head 232 by adopting the lead screw sliding block mechanism 231, the clamping force of the clamping head can be adjusted by driving the clamping head through the lead screw sliding block, the clamping and the loosening are realized, and the clamping is stably carried out in the measuring process. The adjustment may be performed manually. The clamping head can be made of frosted acrylic material.
As shown in fig. 1 and 5, the high-frequency acoustic excitation module 30 includes a piezoelectric ceramic block or microphone device 31, a signal generator 32, and a power amplifier 33, where the frequency of the signal generator 32 is set to the oscillation frequency of the harmonic oscillator a, in particular, for example, 8260Hz. The voltage signal output from the signal generator 32 is output to the piezoelectric ceramic block or microphone device 31 via the power amplifier 33, so that the piezoelectric ceramic block or microphone device 31 generates an acoustic wave signal.
As shown in fig. 1 and 5, the picometer displacement detection module 40 includes a charge amplifier 41, a lock-in amplifier 42, and a displacement calculation module 43. The charge amplifier 41 collects and amplifies the charges generated by the piezoelectric cantilever probe 10, the lock-in amplifier 42 locks the frequency of the voltage signal output by the charge amplifier 41, extracts the nano-level weak useful signal with the same resonance frequency, and filters out the environmental noise signal. The lock-in amplifier 42 adopts an external input reference signal or an internal input reference signal, and if the external input reference signal is adopted, the voltage signal output by the signal generator 32 can be split into one path to the external input end of the lock-in amplifier 42. If the reference signal is input internally, the signal frequency set by the signal generator 32 may be input manually. The output of the lock-in amplifier 42 is used as an input to the displacement calculation module 43, and the displacement of picometer level is calculated by the displacement calculation module 43.
It should be understood that the examples described herein are for the purpose of illustration and explanation only and are not intended to limit the present invention. Some insubstantial modifications and adaptations of the invention by those skilled in the art are within the scope of the invention.
Claims (10)
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