CN118540634A - Audio conversion unit - Google Patents
Audio conversion unit Download PDFInfo
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- CN118540634A CN118540634A CN202311543550.3A CN202311543550A CN118540634A CN 118540634 A CN118540634 A CN 118540634A CN 202311543550 A CN202311543550 A CN 202311543550A CN 118540634 A CN118540634 A CN 118540634A
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- audio
- conversion unit
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2430/00—Signal processing covered by H04R, not provided for in its groups
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- General Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The invention relates to an audio transducer unit (1), in particular for an in-ear earphone, comprising an electrodynamic audio transducer (2) having a first membrane (10), preferably with a membrane cutout (42), and comprising at least one MEMS audio transducer (3) having a second membrane (30). According to the invention, the audio conversion unit (1) comprises a sound transmission element (16) for passing sound waves generated by the MEMS audio transducer (3) by the electrodynamic audio transducer (2), in particular by the first membrane (10) of the electrodynamic audio transducer (2).
Description
Technical Field
The invention relates to an audio conversion unit, in particular for an in-ear headphone, comprising an electrodynamic audio converter having a first membrane with a membrane gap and comprising at least one MEMS audio converter having a second membrane.
Background
In WO 2022/121740 A1 an audio conversion unit with a powered audio converter and a MEMS audio converter is disclosed.
Disclosure of Invention
An object of the present invention is to provide a compact audio conversion unit composed of an electrodynamic audio converter and a MEMS audio converter.
The solution to achieve the object of the invention is an audio conversion unit, an electronic device and an application of an audio conversion unit according to the independent claims.
The invention proposes an audio conversion unit, in particular for an in-ear headphone or earphone, comprising an electrodynamic audio transducer having a first membrane with a membrane cutout, and comprising at least one MEMS audio transducer having a second membrane. The audio conversion unit is also applied to other electronic devices. The electronic device may be an in-ear earphone as described, but may also be a smart phone, a notebook computer, a tablet computer, a smart watch, etc.
The audio conversion unit further comprises a sound transmission element by means of which sound waves generated by the MEMS audio transducer can be passed by the electrodynamic audio transducer. In this case, the sound waves generated by the MEMS audio transducer can also be passed by the first diaphragm of the electrodynamic audio transducer. Therefore, the mutual influence of sound waves generated by the MEMS audio converter and sound waves generated by the electric audio converter is prevented. The acoustic waves of the MEMS audio transducer and the acoustic waves of the electrodynamic audio transducer are separated from each other. This prevents the sound waves generated by the MEMS audio transducer from resonating, diffracting and/or interfering with the sound waves on the electrodynamic audio transducer, on the first diaphragm and/or due to the electrodynamic audio transducer.
Preferably, the MEMS audio transducer is integrated in the electrodynamic audio transducer in such a way that sound waves which can be generated by the second membrane can be emitted from the audio transducer unit through the membrane gap. In this way a compact audio conversion unit can be realized. The sound waves of the MEMS audio converter are guided out through the diaphragm gap, so that the sound waves are only slightly disturbed, and high sound quality is maintained.
Also preferably, the electrodynamic audio transducer is arranged around the at least one MEMS audio transducer. In this way, the electrodynamic audio transducer encloses the MEMS audio transducer. The MEMS audio transducer is arranged inside the electrodynamic audio transducer, thereby realizing a compact audio conversion unit.
Furthermore preferably, the first membrane is annular. This enables sound waves with less distortion to be emitted through the first diaphragm of the electrodynamic audio transducer. The first membrane is in particular disc-shaped with a preferably circular, in particular centrally located, aperture.
Furthermore preferably, the electrodynamic audio transducer is ring-shaped. In this way, the electrodynamic audio transducer has a through hole for the at least one sound wave of the MEMS audio transducer to pass at least partially through. The electric audio transducer may also be in the form of a ring.
Furthermore, it is preferred that the MEMS audio transducer is arranged in a through-hole of the annular electrodynamic audio transducer. This results in a compact audio conversion unit, since the MEMS audio transducer is arranged inside the electrodynamic audio transducer. The size of the audio conversion unit is thus given by the size of the electrodynamic audio converter. In the case of an electrodynamic audio transducer in the form of a ring, the MEMS audio transducer may also be arranged in a through hole of the ring. Here, the shape of the electrodynamic audio transducer may also be similar to the shape of the ring body. The electrodynamic audio transducer may have a shape similar to a ring body.
The audio conversion unit comprises a sound transmission element. The sound waves generated by the MEMS audio transducer are conducted by means of the sound conducting element. The sound-transmitting element may be, for example, a sound tube or a sound-transmitting channel. Additionally or alternatively, the sound-transmitting element extends through the electrodynamic audio transducer and/or through the diaphragm cutout, and thus also through the first diaphragm. With the sound-transmitting element, sound waves of the MEMS audio transducer can be made to pass beside the electrodynamic audio transducer and/or beside the first diaphragm of the electrodynamic audio transducer and/or beside other devices. This allows to avoid resonances, diffraction and/or disturbances on the electrodynamic audio transducer, on the first diaphragm and/or for the sound waves of the electrodynamic audio transducer.
Furthermore, it is preferred that the sound-transmitting element protrudes out of the first diaphragm and/or is embodied as a projection protruding out of the first diaphragm. In this way, the sound waves of the MEMS audio transducer can pass by the first diaphragm.
Furthermore, preferably, the sound-transmitting element is straight or curved. Thereby enabling the sound of the MEMS audio transducer to be directed to a desired location.
Preferably, at least one spacer is arranged on the outside of the sound-transmitting element. In the case of an audio conversion unit arranged in a predetermined manner in the electronic component, the sound-transmitting element is spaced apart from the surrounding housing part of the electronic component by means of the spacer. In the case where the electronic device is an in-ear earphone, the housing member may be an ear member. Additionally or alternatively, the sound-transmitting element can also be held in place or fixedly secured relative to the housing part by means of the at least one spacer. This ensures that sound is always emitted in a defined direction when the sound waves leave the sound-transmitting element.
Furthermore preferably, the at least one spacer is labyrinth-like. Additionally or alternatively, the at least one spacer is preferably helical. The at least one spacer may also be zigzagged. This forces the sound passing by the sound-transmitting element, i.e. the sound waves of the electrodynamic audio transducer, to follow a spiral trajectory or labyrinth of labyrinth spacers. The sound quality can thus be influenced, since the running time, the volume and/or the frequency spectrum of the sound waves can thus be adjusted.
Furthermore, preferably, a damping material is arranged on the outside of the sound-transmitting element. Additionally or alternatively, the damping material may also be arranged on the at least one spacer. Preferably, the damping material is arranged between the sound-transmitting element and the surrounding housing part, ear part, housing or section of the electronic device, in particular in a predetermined layout of the audio conversion unit. The damping material is used for weakening sound waves emitted by the electrodynamic audio transducer and/or influencing the sound thereof.
It is also preferred that the audio conversion unit has a transducer cavity in which the MEMS audio transducer and/or electronic unit is arranged. The transducer cavity may be formed at least in part by a through hole of the annular electrodynamic audio transducer. The transducer cavity may be arranged inside the electrodynamic audio transducer, thereby realizing a compact audio conversion unit. The transducer cavity here serves as a receiving cavity for the MEMS audio transducer and/or the electronics unit.
Preferably, the transducer cavity is surrounded in radial direction by a magnet unit, in particular a magnet, of the electrodynamic audio transducer. Wherein the magnet unit may directly enclose the transducer cavity. The magnet unit thus defines a transducer cavity. This eliminates the need for additional devices, thereby realizing a compact and lightweight audio conversion unit.
Additionally or alternatively, the MEMS audio transducer and/or the electronic unit is arranged along the axis of the audio transducer unit at the level of the magnet unit, in particular the magnet. The magnet unit, in particular the magnet, thus extends radially around the MEMS audio transducer and/or the electronics unit. The magnet unit, in particular the magnet, therefore overlaps the MEMS audio transducer and/or the electronic unit at least partially, in particular completely, in the axial direction of the audio transducer unit.
Preferably, the MEMS audio transducer, the electronic unit, the holder and/or the sound transmission element have an overlap region in the axial direction of the audio transducer unit with a magnet unit (in particular a magnet) of the electrodynamic audio transducer, a coil of the electrodynamic audio transducer and/or a transducer housing of the audio transducer unit. Thus, for example, the MEMS audio transducer overlaps the magnet unit, in particular the magnet, in the axial direction. The magnet unit, in particular the magnet, therefore encloses the MEMS audio transducer, wherein the two overlap in the axial direction at least in one section.
It is also preferred that the MEMS audio transducer is arranged on the holder of the audio transducer unit and/or on the magnet unit, in particular on the first pole element of the electrodynamic audio transducer. Additionally or alternatively, the MEMS audio transducer may have a contact surface with the holder and/or the magnet unit, in particular with the first pole element. Preferably, the MEMS audio transducer is connected to the holder and/or to the magnet unit, in particular to the first pole element. For example, the MEMS audio transducer is glued together with the holder and/or the magnet unit, in particular with the first pole element. The contact surface may be at least partially an adhesive surface.
Preferably, the electronic unit has an electronic device feedthrough connected to the MEMS cavity of the MEMS audio transducer. The electronic device through part is used for realizing pressure balance in the movement process of the second diaphragm. The connection to the rear volume of the MEMS audio transducer or the in-ear earphone can be established or formed by means of the electronics through-opening.
Furthermore, it is preferred that the sound propagation axis of the electrodynamic audio transducer and the sound propagation axis of the MEMS audio transducer are mutually coaxial, in particular in the axial direction of the audio transducer unit.
Preferably, the audio conversion unit has at least one sealing element. The at least one sealing element may be arranged on the peripheral side of the audio conversion unit. The audio conversion unit can thereby be inserted into a housing of the electronic component, for example an ear piece, so that moisture and/or sound is prevented from passing by the audio conversion unit. The audio conversion unit can in particular thereby separate the two spaces from one another, so that it is provided with a seal for moisture and/or sound waves. The sealing element may be, for example, a sealing ring, preferably made of rubber or silicone.
Preferably, the audio conversion unit comprises at least one joint. Furthermore, the electronic unit and/or the printed circuit board may also have the at least one connector. An electrical signal and/or feed can be led to the audio conversion unit via the at least one connector. The at least one joint can be embodied as a flexible connection section. The connector may be constructed, for example, as a flexible PCB. In this case, the joint may be rotated so that the connection is made from different directions. Additionally or alternatively, the at least one connector can also be constructed as a plug. For example, plugs and flexible connection sections may also be provided. The plug is used, for example, for feeding electricity, and the flexible connection section is used for conducting electrical signals.
Preferably, the audio conversion unit has at least one microphone, whereby at least sound waves and/or ambient noise that can be generated by the electrodynamic audio converter can be detected. By detecting the sound waves of the electrodynamic audio transducer, it can be determined whether the electrodynamic audio transducer is functioning properly and/or whether the sound waves have a high sound quality. In case of ambient noise detection, active noise reduction can thereby be implemented. Anti-noise is generated that cancels and suppresses the ambient noise.
The invention also proposes an audio conversion unit, in particular for an in-ear earphone, comprising an electrodynamic audio transducer with a first membrane and comprising at least one MEMS audio transducer with a second membrane. The audio conversion unit may have at least one of the features described hereinbefore and/or hereinafter.
The invention proposes an electronic device, in particular an in-ear earphone, comprising an audio conversion unit as described above, wherein the features mentioned can be applied individually or in any combination. The electronic device can also be a smart phone, a tablet computer, a notebook computer and the like.
Preferably, the electronic device has an outlet and/or the sound-transmitting element extends from the diaphragm cutout to the outlet. Whereby the sound-transmitting element directs sound waves of the MEMS audio transducer through the electronic device. This avoids interaction of the acoustic waves generated by the MEMS audio transducer with the interior of the electronic device.
The invention proposes the use of an audio conversion unit in an electronic device. Preferably, the audio conversion unit and/or the electronics are constructed in accordance with the foregoing and/or the following description, wherein the features mentioned can be applied individually or in combination.
The audio conversion unit may comprise, for example, a woofer, a tweeter, an electronic unit and a sound transmission element for an in-ear earphone or an in-ear telephone. The woofer may have a "ring tube" shape comprising an open space and/or a through hole and/or a transducer cavity, preferably at the center. The MEMS tweeter is inserted into this space.
A sound transmission element ("sound guide") is connected to the tweeter for transmitting sound directly from the tweeter to the output of the in-ear earphone or electronics. This solution is acoustically reasonable because the high frequencies of the tweeter are thereby allowed to reach the outlet of the in-ear earphone or the electronics in a way that is unfiltered and undisturbed by the sound of the woofer.
The electronic unit may be mounted directly under the tweeter and amplify the audio signal as necessary for the tweeter.
At least one microphone (for active noise reduction) may be arranged by a flexible board or PCB in an area beside the sound-transmitting element. Here, the audio conversion unit includes the at least one microphone. The microphone may correspond to an electrodynamic audio transducer in order to detect sound waves generated by the electrodynamic audio transducer. Thus, the tone quality can be monitored. In addition or alternatively, ambient noise can also be detected by means of the microphone. Anti-noise may be formed accordingly, which may be generated by the electrodynamic audio transducer and/or the MEMS audio transducer, to cancel ambient noise, thereby suppressing the ambient noise.
The sound-transmitting element (sound guide) is capable of directly conducting the sound of the tweeter to the output of an in-ear earphone or electronic device. The sound-transmitting element is held by a structure or holder which can be adapted to the sound of the woofer. Thereby achieving simple fine tuning. Furthermore 2 different damping materials can be used:
At the output end of the sound-transmitting element, a standard mesh material may be provided. Whereby a certain friction (damping) is achieved on both channels (woofer and tweeter).
Between the spacer and the sealing element between the sound-transmitting element and the ear part or the housing part, a foam material may be arranged, so as to apply additional damping to the woofer.
For in-ear headphones or telephone applications or electronics, the combination of the electrodynamic woofer and MEMS tweeter is a coaxial structure.
A "ring-shaped tubular" electrodynamic woofer with MEMS tweeters integrated at the center forms a coaxial speaker for in-ear headphones, in-ear phones, or for electronics.
An electrodynamic woofer with a ring magnet and a MEMS tweeter integrated at the center forms a coaxial speaker for in-ear headphones or phone applications or for electronics.
A "ring-shaped tubular" electrodynamic woofer with MEMS tweeters integrated at the center, which forms a coaxial speaker for in-ear headphones or phone applications or for electronics.
An audio conversion unit comprising a "ring-tube" electrodynamic woofer, a MEMS tweeter integrated at the centre, and a microphone, in particular a feedback microphone, thus forming a coaxial speaker for in-ear headphones or telephone applications or for electronic devices.
The sound-transmitting element may also be a sound-transmitting tube or be constructed in this way.
-Inserting the (MEMS) tweeter from the back into the "annular tubular" electrodynamic woofer. A simple electrical connection is achieved at the back side.
-Integrating the MEMS tweeter and the electronic unit inside the electrodynamic woofer.
-Loading a (MEMS) tweeter with an electronic unit into an electrodynamic woofer from the back side. A simple electrical connection is achieved at the back side.
-Integrating the MEMS tweeter into the available space at the center of the speaker module in combination with a ring magnet for the electrodynamic woofer.
-A holder integrating three functions: a sound transmission element ("sound guide") is accommodated, an inner ring or inner diaphragm carrier is accommodated in the diaphragm of the woofer, and a MEMS tweeter is accommodated.
A holder at the center of the audio conversion unit, which integrates three functions: a Sound transmitting element ("Sound Guide"), an inner ring or inner diaphragm carrier of a woofer diaphragm, and a MEMS tweeter. Whereby the sound channel of the tweeter and the sound channel of the woofer membrane can be optimized independently. It is also an efficient assembly method.
-A sound-transmitting element that conducts sound directly to the output of the in-ear earphone or to the output of the electronics for the tweeter.
The earphone shell or ear piece has a spacer which holds the sound-transmitting element in place.
The shape and size of the spacer or spacer holding the sound-transmitting element can be adjusted to optimize the acoustic power of the woofer.
In addition to the conventional outlet mesh or sealing element, the bridge-based or spacer-based integration of additional damping foam material into the sound channel of the woofer is also possible.
Drawings
Further advantages of the invention are described in the examples below. Wherein:
Figure 1 is a cross-sectional view of an audio conversion unit with an electrodynamic audio transducer and a MEMS audio transducer,
Figure 2 is a cross-sectional view of a MEMS audio transducer,
Fig. 3 is a cross-sectional view of an in-ear earphone, with an audio conversion unit in the earphone housing,
Figure 4 is a cross-sectional view of an electrodynamic audio transducer,
Figure 5 is a cross-sectional view of an electrodynamic audio transducer and a MEMS audio transducer,
Figure 6 is a top view of a MEMS audio transducer,
Fig. 7 is a cross-sectional view of an in-ear earphone or audio conversion unit with an embodiment of a spacer and with at least one sealing element, and
Fig. 8 is a cross-sectional view of an audio conversion unit with a microphone.
Detailed Description
Fig. 1 shows an audio conversion unit 1 with an electrodynamic audio converter 2 and a MEMS audio converter 3. The audio conversion unit 1 may be applied, for example, in an in-ear headphone 34. Such in-ear headphones 34 are used, for example, as hearing aids for communication (e.g., making a telephone call) or listening to music. The in-ear headphones 34 shown in fig. 3 can be at least partially inserted into the ear canal of an ear. The audio conversion unit 1 may also be applied in a smart phone or other electronic device. The in-ear headphones 34 shown in fig. 3 are one example of an electronic device. The audio conversion unit 1 may also be applied in headphones, smart phones, notebook computers, tablet computers, smart watches, etc.
The audio conversion unit 1 has an axial direction 21 and a radial direction 22.
The audio conversion unit 1 comprises a converter housing 4. The electrodynamic audio transducer 2 and/or the MEMS audio transducer 3 are at least partially arranged in a transducer housing 4. The electrodynamic audio transducer 2 may also be referred to herein as a woofer, because in the audio conversion unit 1 herein the electrodynamic audio transducer 2 or the woofer is mainly used for generating bass sound. Such bass frequencies are for example about 20Hz to 1000Hz. Thus, the electrodynamic audio transducer 2 in the audio conversion unit 1 here serves as a woofer. And the at least one MEMS audio transducer 3 in the audio conversion unit 1 herein may be referred to as a tweeter or a tweeter. The MEMS audio transducer 3 generates sound in the audio conversion unit 1 at a frequency that is particularly higher than that of the electrodynamic audio transducer 2 or the woofer or woofer. For example, MEMS audio transducer 3 generates sound or rattle having a frequency between about 500Hz and 20 kHz. Thus in this specification the electrodynamic audio transducer 2 may also be referred to as a woofer or woofer. The MEMS audio transducer 3 in this specification may also be referred to as a tweeter or a tweeter.
The MEMS audio transducer 3 is shown in detail in fig. 2.
The electrodynamic audio transducer 2 or woofer 2 comprises at least one pole element 5, 6. According to the present embodiment, the woofer 2 comprises first and second pole elements 5, 6. Between these two pole elements 5, 6 a magnet 7, preferably a permanent magnet, is arranged. The magnet 7 generates a magnetic field and the two pole elements 5, 6 guide and/or bind the magnetic flux of the magnet 7. At least the at least one pole element 5, 6 and the magnet 7 together form a magnet unit 52. The magnet unit 52, in particular the at least one pole element 5, 6 and/or the magnet 7, may be annular.
The electrodynamic audio transducer and the MEMS audio transducers 2,3 are arranged coaxially with each other. In this case, the sound propagation directions of the electrodynamic audio transducer and the MEMS audio transducers 2,3 are coaxial with each other. In fig. 1 here, the sound of the electrodynamic and MEMS audio transducers 2,3 is emitted in the axial direction 21, here upwards. As a result, these sound propagation directions are also oriented in the axial direction 21, here upwards.
The two pole elements 5, 6 are shown at a distance from each other in the axial direction 21 of the audio conversion unit 1. Additionally or alternatively, the two pole elements 5, 6 are spaced apart from each other in the radial direction 22 of the audio conversion unit 1. A magnetic gap 14 is also arranged between the two pole elements 5, 6 spaced apart in the radial direction 22. Additionally or alternatively, a magnetic gap 14 is arranged between the first pole element 5 and the magnet 7 in the radial direction 22. In this magnetic gap 14, the coil 8 of the woofer 2 is arranged. The coil 8 is immersed in the magnetic gap 14. An electrical signal is applied to the coil 8 so that it is flown by an electric current. In the case where the electrodynamic audio transducer 2 operates as a speaker, the electric signal corresponds to sound generated by the electrodynamic audio transducer 2 or the woofer 2. The current formed by the electrical signal in the coil 8 also results in a magnetic field that cooperates with the magnetic field of the magnet 7 and/or the pole elements 5, 6. The magnet 7 and/or the pole elements 5, 6 are fixed, so that the coil 8 moves.
The movement of the coil 8 is transferred to the membrane unit 9, wherein the membrane unit 9 causes the air above it to vibrate in accordance with the movement of the coil 8. The diaphragm unit 9 thereby generates sound.
The diaphragm unit 9 comprises a first diaphragm 10 for generating sound, which is connected to the coil 8 by means of a coupling unit 11 in order to transmit the movement of the coil 8 to the first diaphragm 10. The electrodynamic audio transducer 2 is mainly used for generating bass sound, and thus the first diaphragm 10 may also be referred to as a bass diaphragm. The membrane unit 9 further comprises an inner membrane carrier 12 and an outer membrane carrier 13. The inner diaphragm carrier 12 is located radially inward and the outer diaphragm carrier 13 is located radially outward from 22. The first membrane 10 is tensioned between the two membrane carriers 12, 13. The first membrane 10 and/or the membrane unit 9 thus have the shape of a perforated disc. The membrane unit 9 and/or the first membrane 10 has a membrane cutout 42, which is arranged in the central region, in particular centrally, of the first membrane 10 and/or the membrane unit 9. In addition, the inner diaphragm carrier 12 surrounds the diaphragm cutout 42. The inner and/or outer membrane carriers 12, 13 may be annular in shape. Thus, the first diaphragm 10 has a circular shape including a circular hole in the center region. The outer foil carrier 13 is arranged on the converter housing 4. The inner membrane carrier 12 is arranged on a holder 15. The first membrane 10 or the membrane unit 9 may have a ring shape.
Furthermore, the audio conversion unit 1 has a transducer cavity 41 in which the mems audio transducer 3 is arranged. The woofer 2 may also have a transducer cavity 41. The transducer cavity 41 is more clearly shown in fig. 4, since the MEMS audio transducer 3 is omitted. Thus, the woofer 2 extends around the MEMS audio transducer 3. The MEMS audio transducer 3 is arranged inside the electrodynamic audio transducer 2. The MEMS audio transducer 3 is arranged at the center of the electrodynamic audio transducer 2. The electrodynamic audio transducer 2 surrounds the MEMS audio transducer 3. Thereby a very compact structure of the audio conversion unit 1 is achieved.
According to the present embodiment, the first pole element 5 and/or the magnet 7 or the magnet unit 52 encloses the converter cavity 41. The translator cavity 41 is arranged inside the first pole element 5 and/or the magnet 7 or the magnet unit 52.
According to the present embodiment, at least the MEMS audio transducer 3 is arranged at the same height as the magnet unit 52, in particular the magnet 7 and/or the first pole element 5, in the axial direction 21 of the audio transducer unit 1. The MEMS audio transducer 3 has an overlap section with the magnet unit 52, in particular the magnet 7, in the axial direction 21. Thus, the MEMS audio transducer 3 overlaps the magnet unit 52, in particular the magnet 7, in the axial direction 21.
As also shown in fig. 1, the MEMS audio transducer 3 and the electrodynamic audio transducer 2 are coaxially arranged with each other. The electrodynamic audio transducer 2 is arranged around the MEMS audio transducer 3 in a radial direction 22.
The electrodynamic audio transducer 2, in particular the magnet unit 52, also has the shape of a ring or is similar to a ring. Alternatively, the electrodynamic audio transducer 2, in particular the magnet unit 52, has a ring shape. The electrodynamic audio transducer 2 forms the outer layer of the audio transducer unit 1 and the MEMS audio transducer 3 forms the core. The electrodynamic audio transducer 2 has the shape of an annular tube. The diaphragm cutout 42 and/or the transducer cavity 41 and/or the acoustic cavity 17, which will be described below, form an opening or through-hole of a ring or annular tube or of the electrodynamic audio transducer 2. The diaphragm cutout 42 is more clearly shown in fig. 4. The acoustic chamber 17 is preferably constructed as small as possible or omitted as it affects the sound quality.
The audio conversion unit 1 further comprises a holder 15. According to the present embodiment, the holder 15 is arranged or attached on the first pole element 5 or on the magnet unit 52. An inner membrane carrier 12 is also arranged on the holder 15. The holder 15 thereby connects the inner diaphragm carrier 12 with the first pole element 5. The retainer 15 supports the inner diaphragm carrier 12. The MEMS audio transducer 3 is also arranged at least partially on the inner diaphragm carrier 12 and/or on the first pole element 5. The MEMS audio transducer 3, the first pole element 5, the inner diaphragm carrier 12 and/or a sound transmission element 16, which will be described below, can be arranged on the holder 15. The holder 15 is preferably composed of plastic.
A sound transmission element 16 is also arranged on the holder 15. The sound-transmitting element 16 may be glued to the holder 15, for example. The sound generated by the MEMS audio transducer 3 is conducted by means of the sound-conducting element 16. Thus, a higher sound than the sound wave of the woofer 2 is conducted by the sound-transmitting element 16. This sound can be passed by the sound-transmitting element 16, in particular, by the sound of the electrodynamic audio transducer 2. Avoiding interference or diffraction on the device. This enables the sound of the MEMS audio transducer 3 to be directed into the ear canal or to be conducted to the ear canal, as shown in fig. 3. The sound-transmitting element 16 may be constructed as a tube or hose, preferably having a circular cross-section. The sound transmission element 16 may also be a sound transmission channel. The sound-transmitting element 16 is also a hollow waveguide.
Furthermore, the sound-transmitting element 16 is arranged such that sound waves of the woofer 2 surround the sound-transmitting element 16. And the sound wave of the MEMS audio transducer 3 is conducted in the sound-conducting element 16. In this way, the sound-transmitting element 16 separates the sound waves of the electrodynamic audio transducer 2 from the sound waves of the MEMS audio transducer 3.
Furthermore, the sound-transmitting element 16 may be arranged coaxially with respect to the woofer 2 and/or tweeter 3. The sound transmitting element 16 passes through the first diaphragm 10 in a manner that passes through the diaphragm cutout 42. The first diaphragm 10 is arranged around the sound transmitting element 16.
But preferably the woofer 2 and tweeter 3 are coaxial with each other. Furthermore, the sound-transmitting element 16 may be displaced, i.e. arranged eccentrically, in relation to the tweeter 3 and/or the woofer 2 in the radial direction 22. This is advantageous in providing the necessary space for other devices. The sound of the tweeter 3 can be passed by other devices by means of the sound-transmitting element 16. For this purpose, the sound-transmitting element 16 can be displaced in the radial direction such that it is no longer coaxial with the woofer 2 and/or tweeter 3.
Furthermore, an acoustic chamber 17 can be provided, which is arranged here between the MEMS audio transducer 3 and the sound-conducting element 16. The acoustic chamber may also at least partially form the front volume of the tweeter 3.
The electronics unit 18 preferably has an electronics through-going part 19 which at least partly forms the rear volume of the tweeter 3. Whereby pressure equalization can also be achieved.
In order to achieve pressure equalization, the first pole element 5 may additionally or alternatively have at least one pole through 20, which may be embodied as a hole or as a drilled hole. Here, a plurality of magnetic pole through portions 20a, 20b are shown.
As shown, the audio conversion unit 1 is rotationally symmetrical. In particular the electrodynamic audio transducer 2, in particular the magnet unit 52, the magnet 7, the first and/or second pole elements 5, 6, the coil 8, the diaphragm unit 9, the first diaphragm 10 and/or the inner and/or outer diaphragm carriers 12, 13 are circular and/or rotationally symmetrical. Additionally or alternatively, the holder 15 is circular and/or rotationally symmetrical. Additionally or alternatively, the coupling unit 11 is circular and/or rotationally symmetrical. Additionally or alternatively, the converter housing 4 is circular and/or rotationally symmetrical.
Furthermore, as shown, a first contact surface 56 is arranged and/or embodied between the MEMS audio transducer 3 and the magnet unit 52, in particular the first pole element 5. The MEMS audio transducer 3 is thus arranged on the magnet unit 52, in particular on the first pole element 5. Additionally or alternatively, a second contact surface 57 may be arranged and/or embodied between the MEMS audio transducer 3 and the holder 15. Thus, the MEMS audio transducer 3 is arranged on the holder 15.
The MEMS audio transducer 3 can be connected to the magnet unit 52 (in particular the first pole element 5) and/or the holder 15 by means of the first and/or the second contact surface 56, 57. The first and/or second contact surfaces 56, 57 may be, for example, adhesive surfaces, such that the MEMS audio transducer 3 is adhered to the magnet unit 52 (in particular the first pole element 5) and/or to the holder 15.
Furthermore, the MEMS audio transducer 3 rests on the holder 15 and/or on the magnet unit 52, in particular on the first pole element 5, on the side facing away from the first diaphragm 10. Thereby, the first diaphragm 10 is arranged on one side of the holder 15 and/or the magnet unit 52, in particular the first pole element 5, and the MEMS audio transducer 3 is arranged on the other side.
For simplicity, features that have been described in at least one of the preceding figures will not be described again. Furthermore, some of the features may be described in the drawings or in at least one of the following figures. Furthermore, for simplicity, the same reference numerals are used for the same features. Moreover, for the sake of clarity, all features may not be shown in the following figures and/or reference numerals are not used to identify all features. However, features shown in one or several of the preceding figures may also be present in this figure or in one or several of the following figures. Furthermore, some features may be shown in this drawing or in one or more of the following drawings and/or identified by reference numerals for clarity. Nevertheless, features shown in one or more of the following figures may already be present in the present figures or in the previous figures.
Fig. 2 is a cross-sectional view of the MEMS audio transducer 3. The tweeter 3 comprises a carrier substrate 23 and at least one carrier layer 24 arranged thereon. At least one piezoelectric layer 25 is arranged on the carrier substrate 23 and/or on the at least one carrier layer 24. The tweeter 3 has two carrier layers 24a, 24b and two piezoelectric layers 25a, 25b. The at least one carrier layer 24 and the at least one piezoelectric layer 25 are arranged overlapping in the axial direction 21.
The at least one piezoelectric layer 25 deflects according to an electrical signal applied thereto, thereby vibrating air and thereby producing sound.
The tweeter 3 further comprises a coupling element 26, which is connected to the at least one piezoelectric layer 25 and/or the carrier layer 24 by means of at least one spring element 27. The coupling element 26 is capable of transmitting the deflection of the at least one piezoelectric layer 25 to the MEMS diaphragm unit 29. A coupling plate 28 is arranged between the coupling element 26 and the MEMS diaphragm unit 29, so that the deflection transmitted from the coupling element 26 is transmitted in a planar manner to the MEMS diaphragm unit 29.
The MEMS diaphragm unit 29 comprises at least one second diaphragm 30 capable of vibrating air to produce sound in response to deflection of the at least one piezoelectric layer 25. The MEMS diaphragm unit 29 may also include a MEMS diaphragm frame 31 on which the second diaphragm 30 is disposed. Furthermore, MEMS diaphragm frame 31 may be circular or polygonal in shape.
The MEMS audio transducer 3 may further comprise a cover 32 arranged on the MEMS membrane unit 29 and/or on the carrier substrate 23. The cover portion 32 forms a cover of the tweeter 3. The cover 32 has a cover through portion 33 for transmitting the generated sound. The lid portion through portion 33 may also at least partially, in particular completely, form the front volume of the tweeter 3.
The MEMS audio transducer 3 further comprises a MEMS cavity 54. In the case where the MEMS audio transducer 3 is arranged in the audio transducer unit 1 as shown in fig. 1, the electronic device conducting part 19 is connected to the MEMS cavity 54. Thus, as shown in FIG. 3, MEMS cavity 54 makes contact with closure cavity 45. Thereby, the electronics penetration 19 and/or the enclosure cavity 45 form the back volume of the MEMS audio transducer 3.
The MEMS audio transducer 3 further comprises a MEMS printed circuit board 60. The MEMS printed circuit board 60 corresponds to the MEMS audio transducer 3. The electrical signals can be conducted to the piezoelectric layer 24 by means of the MEMS printed circuit board 60, for example, or the electrical signals can be distributed by means of the MEMS printed circuit board 60. The MEMS printed circuit board 60 also has a printed circuit board cavity 61. Which may at least partially form the back volume of the MEMS audio transducer 3. Further, the carrier substrate 23 may be disposed on the MEMS printed circuit board 60.
Fig. 3 is a cross-sectional view of in-ear headphones 34. An audio conversion unit 1 for generating sound is arranged in the in-ear headphones 34. In-ear headphones 34 are one example of an electronic device. The electronic device may also be a headset, a smart phone, a notebook computer, a tablet computer, a smart watch, etc.
The in-ear headphones 34 shown here as electronics comprise a headphone housing 35, in which headphone housing 35 the audio conversion unit 1 is arranged. According to the present embodiment, the earphone housing 35 adopts a two-part construction scheme. The earphone housing 35 comprises an ear piece 36 which is inserted into the ear canal of the user when the in-ear earphone 34 is used in a predetermined manner. An attachment, for example, composed of silicone, may also be attached to the ear piece 36. The attachment forms an earplug that is at least partially inserted into the ear canal. The attachment may be constructed of a skin-friendly flexible material. Furthermore, it is preferred that the attachment or earplug adopts a construction scheme that is adapted to the ear canal or has been adjusted according to the ear canal.
The ear piece 36 also has an outlet 43 through which sound of the electrodynamic and MEMS audio transducers 2, 3 can pass out of the ear piece 36 or out of the earphone housing 35. Preferably, the outlet 43 is closed by the sealing element 38, preventing dirt from entering. The sealing element 38 may be, for example, a grid, mesh or foam material, so as to allow sound to pass through but retain dirt.
Furthermore, the sound-transmitting element 16 extends to the outlet 43, so that sound of the MEMS audio transducer 3 can be guided to the outlet 43.
It can also be seen here that the sound-transmitting element 16 is arranged in such a way that the sound of the electrodynamic audio transducer 2 passes by the sound-transmitting element 16. The sound of the MEMS audio transducer 3 is then conducted through the sound-conducting element 16. Sound is conducted within the sound-conducting element 16. By means of the sound-transmitting element 16, the sound waves of the woofer 2 and the sound waves of the tweeter 3 are separated from each other in the earphone housing 35.
Furthermore, at least one spacer 40 is arranged between the ear piece 36 and the sound-transmitting element 16, wherein two spacers 40a, 40b are shown in fig. 3. This allows the sound of the electrodynamic audio transducer 2 to pass by the sound transmitting element 16. Furthermore, this maintains the sound-transmitting element 16 in a particularly coaxial orientation with respect to the ear piece 36. Thereby guiding sound well into the ear canal.
The earphone housing 35 further comprises a closure 37 which closes the in-ear earphone 34. This prevents moisture or water from entering the audio conversion unit 1. The enclosure 37 may also have a wire through 39 for guiding wires (e.g. from a battery or other electronics) to the audio conversion unit 1. In the case where the audio signal or the like is supplied to the audio conversion unit 1 by wireless connection, for example, the line penetration portion 39 may not be employed. In this way, the closure 37 can be closed and thus also moisture can be prevented from entering. Alternatively, openings may still be provided in order to achieve pressure equalization for the two audio transducers 2, 3 during operation of the audio conversion unit 1.
The ear piece 36 also has an ear piece cavity 44. Which forms the front volume of the woofer 2 and/or directs sound waves of the woofer 2 through the earpiece cavity 44 towards the outlet 43 and/or past the sound-transmitting element 16. Additionally, the closure 37 has a closure cavity 45. Which may form the rear volume of the tweeter 3 and/or the rear volume of the woofer 2.
The ear piece 36 also encloses the converter housing 4 and/or the outer film carrier 13. For example, an adhesive connection can be established between the converter housing 4 and/or the outer film carrier 13 and the ear piece 36 and/or the closure 37. Preferably, the audio conversion unit 1 comprises a protective element, not shown here, which is arranged around the converter housing 4 and extends at least partially radially 22 from the outside to above the first membrane 10. The first membrane 10 is thereby protected, wherein the protective element is axially spaced from the first membrane 10. In this case, the adhesive connection may be present between the protective element and the ear piece 36 and/or between the protective element and the closure 37.
Furthermore, in the present embodiment, damping material 69 is arranged on the sound-transmitting element 16 and/or on the at least one spacer 40. It can also be seen here that the damping material 69 is arranged such that, in the case of the audio conversion unit 1 being arranged in a predetermined manner in an electronic component, for example in the in-ear headphones 34 shown here, the damping material is arranged between the sound-transmitting element 16 and the surrounding housing, the section of the electronic component or the ear piece 36 shown here. Thus, sound waves emitted by the electrodynamic audio transducer 2 pass through the damping material 69 on a path leading to the outlet 43. In this way, the sound can be influenced by the damping material, thereby improving the sound quality. The damping material 69 can be, for example, a foam material or a mesh.
Fig. 4 is a cross-sectional view of the electrodynamic audio transducer 2. The MEMS audio transducer 3 is omitted here for clarity.
Here a transducer cavity 41 is shown, which is arranged at the centre of the woofer 2. The first pole element 5 extends around the translator cavity 41 and delimits this translator cavity. The MEMS audio transducer 3 is arranged in a transducer cavity 41. An acoustic cavity is also arranged in the first pole element 5, into which acoustic cavity the tweeter 3 transmits sound. As shown in fig. 1, a sound-transmitting element 16, preferably constructed as a sound-transmitting channel, is connected to the sound cavity 17.
The woofer 2 further comprises a vibration cavity 46 in which the coil 8 and/or the first diaphragm 10 can vibrate in the axial direction 21. By means of the vibration cavity 46, the first diaphragm 10 can be moved towards the first pole element 5 and/or towards the tweeter 3 when the first diaphragm 10 vibrates. The vibration cavity 46 transitions into the magnetic gap 14 in the region of the coil 8.
Also shown here is a diaphragm cutout 42. This diaphragm cutout forms an opening of the electrodynamic audio transducer 2 with the acoustic cavity 17, the transducer cavity 41 and/or at least partly with the vibration cavity 46. The sound transmitting element 16 also passes through the diaphragm cutout 42.
Fig. 5 is a cross-sectional view of the electrodynamic and MEMS audio transducers 2, 3. For clarity, most of the reference numerals are omitted herein. The MEMS audio transducer 3 is also shown in detail here. The features are described in detail in fig. 2. As shown, the area of the second diaphragm 30 is at least as large as the area of the diaphragm cutout 42. Here, the area of the second diaphragm 30 is larger than the area of the diaphragm cutout 42.
The area of the second diaphragm 30 is at least as large as the area of the cover portion through portion 33 and/or the acoustic cavity 17. Furthermore, as can be seen in connection with fig. 5 and 1, the area of the second diaphragm 30 is larger than the cross-sectional area of the sound-transmitting element 16 and at least as large as the cross-sectional area of the sound cavity 17.
Preferably, the cover through 33 and the acoustic chamber 17 overlap and/or are flush with each other in the magnet unit 52, in particular in the pole element 5.
Fig. 6 is a top view of the MEMS audio transducer 3. In the present embodiment, the MEMS audio transducer 3 has a polygonal shape. Here, the MEMS audio transducer 3 has a hexagonal shape. Thus, the MEMS audio transducer 3 has six carrier layers 24a-24f. Furthermore, the MEMS audio transducer 3 has six piezoelectric layers 25, which are, however, covered by carrier layers 24a to 24f. Each of the piezoelectric layer 25 and the carrier layers 24a-24f is connected to the coupling element 26 by means of a spring element 27a-27 f. The MEMS membrane unit 29 comprising the second membrane 30 is arranged on the carrier substrate 23 shown here. The MEMS membrane unit 29 and the second membrane 30 have a shape which matches the carrier substrate 23. The MEMS diaphragm unit 29 and the second diaphragm 30 are in particular hexagonal as shown here. Based on the shape shown here, the MEMS audio transducer 3 can be matched to a circular transducer cavity 41. By means of the several carrier and piezoelectric layers 24, 25, a greater degree of deflection of the second membrane 30 is enabled. Thus, the sound pressure can be raised.
Fig. 7 is a cross-sectional view of an in-ear headphone 34 or an audio conversion unit 1 with an embodiment of a spacer 40 and with at least one sealing element 53. For simplicity, only the most important features are indicated by reference numerals. Furthermore, in contrast to fig. 3, the closure is no longer shown.
The audio conversion unit 1 here comprises at least one sealing element 53 for sealing the audio conversion unit 1 into the earphone housing 35. As shown, the sealing element 53 is arranged on the converter housing 4. With the sealing element 53 arranged on the converter housing 4, moisture can be prevented from entering the closure cavity 45 from the ear piece cavity 44 as shown in fig. 3. The sealing element 53 may be annular as shown. Additionally or alternatively, the exchange of sound between the ear piece cavity 44 and the closure piece cavity 45 can also be prevented by means of the at least one sealing element 53. Furthermore, the sealing element 53 is arranged in the housing groove 55 of the converter housing 4. The sealing element 53 may be, for example, a rubber ring or a silicone ring. Furthermore, the audio conversion unit 1 may also have several sealing elements 53 which are axially spaced apart from one another. Here two sealing elements 53a, 53b are shown. The at least one sealing element 53 may be configured as a sealing ring. The at least one sealing element 53 and/or the housing groove 55 may be arranged on the peripheral side 70 of the audio conversion unit 1 and/or the converter housing 4.
Further, one embodiment of a spacer 40 is shown herein. The at least one spacer 40 is arranged on the outer side 68 of the sound transmission channel 16.
The at least one spacer 40 is constructed and/or arranged in such a way that sound generated by the electrodynamic audio transducer 2 is guided to the outlet 43. The spacer 40 has a spiral shape here, which is arranged around the sound-transmitting element 16 and extends along the sound-transmitting element 16 in the axial direction 21. This prevents sound from the electrodynamic audio transducer 2 from reaching the outlet 43 in a direct, in particular shortest, path. Thereby extending or changing the path for the sound, wherein the sound is changed, so that the sound can be adjusted. Additionally or alternatively, a plurality of spacers 40 may be provided at a distance from each other in the axial and radial directions 21, 22, so that the sound reaches the outlet 43 in a zigzag path.
Thus, the at least one spacer 40 may be constructed to form a labyrinth for sound generated by the electrodynamic audio transducer 2. The labyrinth serves to divert sound on its way to the outlet 43 so that the sound can be changed. The labyrinth spacer 40 is arranged between the sound-transmitting element 16 and the ear piece 36 or (in case the electronics are not in-ear headphones 34) the housing piece. In order to form the labyrinth, several spacers 40 may preferably be arranged at a distance from each other in the axial and/or radial direction 21, 22.
Fig. 8 is a cross-sectional view of the audio conversion unit 1 with the microphone 62. The audio conversion unit 1 further comprises an electronic unit 18, a MEMS audio transducer 3 and a printed circuit board 58. The components of the electronics unit 18 may also be arranged in the printed circuit board 58. The electronic unit 18 schematically illustrated here may be a MEMS printed circuit board 60 having a printed circuit board cavity 61 as shown in fig. 2. The electronics through-portion 19 may be a printed circuit board cavity 61 of the printed circuit board. These embodiments of MEMS printed circuit board 60, electronics unit 18, and/or printed circuit board 58 may also be present in the embodiments of the other figures. The audio conversion unit 1 can therefore have an electronic unit 18, a MEMS printed circuit board 60 and/or a printed circuit board 58, wherein the components of the electronic unit 18 can be arranged in particular in the MEMS printed circuit board 60 and/or in the printed circuit board 58. The electronics unit 18 and MEMS audio transducer 3 shown here may form the MEMS audio transducer 3 of fig. 2, wherein the electronics unit 18 is a MEMS printed circuit board 60.
The sound conversion unit 1 shown here also comprises at least one microphone 62, wherein here two microphones 62a, 62b are shown. The at least one microphone 62 is arranged in such a way that sound waves emitted by the electrodynamic audio transducer 2 reach the at least one microphone 62. The at least one microphone 62 may face the first diaphragm 10 such that sound waves arrive at the at least one microphone 62 in a direct or straight-through path. The at least one microphone 62 may be a feedback microphone. The sound quality of the sound waves emitted by the electrodynamic audio transducer 2 can be monitored by means of the at least one microphone 62. Additionally or alternatively, the at least one microphone 62 is also capable of detecting ambient noise in the surroundings of the audio conversion unit 1 and/or in the surroundings of the electronic device (e.g. a headset, a smart phone, a tablet, a notebook, etc.). The anti-noise generated by the electrodynamic audio transducer 2 and/or the MEMS audio transducer 3 may be formed from the measured ambient noise. This eliminates environmental noise. Thereby enabling active noise reduction. In the electronics, for example in the in-ear headphones 34 as shown in fig. 3, a further microphone 62 can also be provided. This microphone may be oriented towards the surroundings of the electronic device, for example the surroundings of the in-ear headphones 34 or the surroundings of the wearer of the in-ear headphones 34, in order to generate anti-noise to suppress ambient noise.
The at least one microphone 62 is here arranged on the ear piece 36, which is shown in this section. Ear piece 36 is here one particular embodiment of a housing piece 66. The audio conversion unit 1 comprises a housing part 66 or is arranged in the housing part 66. The housing member 66 may be a component of an electronic device. In the case where the electronic device is an in-ear earphone 34, the housing member 66 is an ear member 36.
In addition or alternatively, the at least one microphone 62 may also be arranged on a housing, in particular a protective housing, for the sound conversion unit 1, wherein the housing serves as a protection for the audio conversion unit 1 and in particular for the first membrane 10 of the electrodynamic audio converter 2. The housing member 66 and/or the ear member 36 shown herein may be used as a housing or the housing may be formed by the housing member 66 and/or the ear member 36.
Further, several lines 63a-63d are schematically shown in this embodiment. The lines 63a-63d may be (particularly multi-core) cables or lines 63a-63d. The electrical signals for operating the audio conversion unit 1 can be distributed by means of the lines 63a-63d. The first line 63a leads to the electronic unit 18 and/or the MEMS audio transducer 3. The second line 63b leads to the coil 8 of the electrodynamic audio transducer 2. The third line 63c leads to the first microphone 62a shown herein and the fourth line 63d leads to the second microphone 62b shown herein. The lines 63a-63d are coupled to the printed circuit board 58. Further, as shown, the traces 63a-63d are coupled to the printed circuit board 58 on a back side 64 thereof.
The lines 63a-63d may be arranged in suitable channels here. As shown, two lines 63c, 63d are arranged between the transducer housing 4 and the ear part 36 or the housing part 66.
The printed circuit board 58 may also have a connector 67, through which connector 67 an electrical signal is conducted from the external unit to the audio conversion unit 1. The connector 67 can be embodied here as a flexible section, for example as a flexible PCB, so that the connector 67 can be rotated or bent in order to achieve a connection with the connector 67 from different directions. The connector 67 is arranged here on the rear side 64 of the printed circuit board 58. The connector 67 may also include and/or be configured as a plug. The plug may be a flat plug and/or may be soldered to the printed circuit board 58.
Furthermore, the plug (in particular if it is embodied as a flat plug) can also be arranged on the front side 65 of the printed circuit board 58. The front face 65 here faces the MEMS audio transducer 3 and/or the electronics unit 18. In this case, the plug passes through the printed circuit board 58, for example through the printed circuit board through-hole 59.
The flat plug can be embodied, for example, as a flexible printed circuit board, in order to lay the plug or flat plug flat on the printed circuit board 58. In this way, the plug or flat plug can also be arranged between the printed circuit board 58 and the MEMS audio transducer 3 and/or the electronic unit 18, in particular on the front side 65 of the printed circuit board 58. Additionally or alternatively, the plug can also be coupled thereby with the MEMS audio transducer 3 and/or the electronic unit 18.
The invention is not limited to the embodiments shown and described. Variations within the scope of the claims may be employed, as well as combinations of features, even if such features are disclosed and described in different embodiments.
Reference numeral table
1 Audio conversion Unit
2 Electric audio transducer-Bass horn/woofer
3MEMS Audio transducer/high loudspeaker/tweeter
4. Converter housing
5. First magnetic pole element
6. Second magnetic pole element
7. Magnet body
8. Coil
9. Diaphragm unit
10. First membrane
11. Coupling unit
12. Inner membrane carrier
13. Outer membrane carrier
14. Magnetic gap
15. Retaining member
16. Sound transmission element
17. Acoustic cavity
18. Electronic unit
19. Through part of electronic device
20. Magnetic pole through part
21. Axial direction
22. Radial direction
23. Carrier substrate
24. Carrier layer
25. Piezoelectric layer
26. Coupling element
27. Spring element
28. Coupling plate
29MEMS diaphragm unit
30 Second diaphragm
31MEMS diaphragm frame
32. Cover part
33. Cover portion through portion
34. In-ear earphone
35. Earphone shell
36. Ear part
37. Closure element
38. Sealing element
39. Line through part
40. Spacing piece
41. Converter cavity
42. Diaphragm opening
43. An outlet
44. Ear part cavity
45. Closure cavity
46. Vibrating cavity
52. Magnet unit
53. Sealing element
54MEMS cavity
55. Shell groove
56. A first contact surface
57. Second contact surface
58. Printed circuit board
59. Through part of printed circuit board
60MEMS printed circuit board
61. Printed circuit board cavity
62. Microphone
63. Circuit arrangement
64. Back surface
65. Front face
66. Shell member
67. Joint
68. Outside is provided with
69. Damping material
70. Peripheral side
Claims (24)
1. An audio conversion unit (1), in particular for an in-ear earphone,
Comprising an electrodynamic audio transducer (2) having a first membrane (10), preferably with a membrane cutout (42), and
Comprising at least one MEMS audio transducer (3) having a second membrane (30), characterized in that,
The audio conversion unit (1) comprises a sound transmission element (16), the sound transmission element (16) being used for passing sound waves generated by the MEMS audio transducer (3) beside the electrodynamic audio transducer (2), in particular beside a first membrane (10) of the electrodynamic audio transducer (2).
2. The audio conversion unit according to the preceding claim, characterized in that the MEMS audio converter (3) is integrated in the electrodynamic audio converter (2) in such a way that sound waves that can be generated by the second membrane (30) can be emitted from the audio conversion unit (1) through the membrane gap (42).
3. The audio conversion unit according to any of the preceding claims, characterized in that the electrodynamic audio transducer (2) is arranged around the at least one MEMS audio transducer (3).
4. The audio conversion unit according to any of the preceding claims, wherein the first membrane (10) is ring-shaped.
5. The audio conversion unit according to any of the preceding claims, wherein the electrodynamic audio converter (2) is ring-shaped.
6. The audio conversion unit according to any of the preceding claims, characterized in that the MEMS audio transducer (3) is arranged in a through hole of a ring body.
7. The audio conversion unit according to any of the preceding claims, characterized in that the sound-transmitting element (16) is a sound-transmitting tube, and/or
The sound-transmitting element (16) extends through the electrodynamic audio transducer (2) and/or the diaphragm cutout (42).
8. The audio conversion unit according to any of the preceding claims, characterized in that the sound-transmitting element (16) protrudes out of the first diaphragm (10) and/or is constructed as a protrusion out of the first diaphragm (10).
9. The audio conversion unit according to any of the preceding claims, characterized in that the sound-transmitting element (16) is straight or curved.
10. The audio conversion unit according to any of the preceding claims, characterized in that at least one spacer (40) is arranged on the outer side (62) of the sound-transmitting element (16) in order to space the sound-transmitting element (16) a distance from an enclosing housing part of an electronic device, in particular an in-ear earphone (34), in case the audio conversion unit (1) is arranged in the electronic device in a predetermined manner.
11. The audio conversion unit according to any of the preceding claims, wherein the at least one spacer (40) is labyrinth-like and/or spiral-like.
12. The audio conversion unit according to any of the preceding claims, characterized in that a damping material (69) is arranged on the outer side (68) of the sound-transmitting element (16) and/or on the spacer (40).
13. The audio conversion unit according to any of the preceding claims, characterized in that the audio conversion unit (1) has a transducer cavity (41) in which the MEMS audio transducer (3) and/or an electronic unit (18) is arranged, wherein the transducer cavity (41) is preferably formed at least in part by a through-hole of the electrically powered audio transducer in the shape of a ring.
14. The audio conversion unit according to any of the preceding claims, characterized in that the converter cavity (41) is surrounded by a magnet unit (52), in particular a magnet (7), of the electrodynamic audio converter (2), and/or
The MEMS audio transducer (3) and/or the electronic unit (18) are arranged at the level of the magnet unit (52), in particular the magnet (7), in the axial direction of the audio transducer unit (1).
15. The audio conversion unit according to any of the preceding claims, characterized in that the MEMS audio converter (3), the electronic unit (18), the holder (15) and/or the sound-transmitting element (16) have an overlap area with a magnet unit (52), in particular a magnet (7), of the electrodynamic audio converter (2), a coil (8) of the electrodynamic audio converter (2) and/or a converter housing (4) of the audio conversion unit (1) in an axial direction (21) of the audio conversion unit (1).
16. The audio conversion unit according to any of the preceding claims, characterized in that the MEMS audio converter (3) is arranged on a holder (15) of the audio conversion unit (1) and/or on a magnet unit (52) of the electrodynamic audio converter (2), and/or has contact surfaces with these elements.
17. The audio conversion unit according to any of the preceding claims, characterized in that the electronic unit (18) has an electronic device through-opening (19) which is connected to a MEMS cavity (54) of the MEMS audio transducer (3).
18. The audio conversion unit according to any of the preceding claims, characterized in that the sound propagation axis of the electrodynamic audio transducer (2) and the sound propagation axis of the MEMS audio transducer (3) are mutually coaxial, in particular in the axial direction of the audio conversion unit (1).
19. The audio conversion unit according to any of the preceding claims, characterized in that the audio conversion unit (1) has at least one sealing element (53), which is preferably arranged on the peripheral side of the audio conversion unit (1).
20. The audio conversion unit according to any of the preceding claims, characterized in that the audio conversion unit (1) comprises at least one joint (67), wherein the at least one joint (67) is preferably constructed as a flexible connection section and/or as a plug.
21. The audio conversion unit according to any of the preceding claims, characterized in that the audio conversion unit (1) has at least one microphone (62) by means of which at least sound waves and/or ambient noise that can be generated by the electrodynamic audio converter (2) can be detected.
22. An electronic device, in particular an in-ear earphone (34), having an audio conversion unit (1) as claimed in any one or more of the preceding claims.
23. Electronic device according to the preceding claim, characterized in that the electronic device has an outlet (43) and/or that the sound-transmitting element (16) extends from the diaphragm cutout (42) to the outlet (43).
24. Use of an audio conversion unit (1), in particular constructed according to any of the preceding claims, in an electronic device, in particular constructed according to any of the preceding claims.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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DE1020221320928 | 2022-12-02 | ||
DE1020221347311 | 2022-12-23 | ||
DE102023104021.9A DE102023104021A1 (en) | 2022-12-02 | 2023-02-17 | Transducer unit |
DE1020231040219 | 2023-02-17 |
Publications (1)
Publication Number | Publication Date |
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CN118540634A true CN118540634A (en) | 2024-08-23 |
Family
ID=92381455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202311543550.3A Pending CN118540634A (en) | 2022-12-02 | 2023-11-20 | Audio conversion unit |
Country Status (1)
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CN (1) | CN118540634A (en) |
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2023
- 2023-11-20 CN CN202311543550.3A patent/CN118540634A/en active Pending
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