Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides a high-temperature-resistant fluoroelastomer processing aid for a slurry polyethylene process and a preparation method thereof, which are used for improving melt fracture, improving processing performance, improving material flow rate and simultaneously having better flame retardant effect.
(II) technical scheme
The invention provides a high-temperature resistant fluoroelastomer processing aid for a slurry polyethylene process, which comprises, by weight, 4-8 parts of graphene oxide modified epoxy resin, 10-25 parts of fluorine-containing modified epoxy resin and 40-60 parts of tetrafluoroethylene-vinylidene fluoride copolymer.
Preferably, the preparation method of the graphene oxide modified epoxy resin comprises the following steps:
s1, adding the water-based epoxy resin and the ethylenediamine curing agent into a reactor, stirring at a high speed, adding graphene oxide into the reactor, and performing ultrasonic treatment for 40-70min to obtain the graphene oxide modified epoxy resin.
Preferably, the mass ratio of the aqueous epoxy resin to the ethylenediamine curing agent to the graphene oxide is 1:0.02-0.04:1.1-1.3.
Preferably, the preparation method of the fluorine-containing modified epoxy resin comprises the following steps:
(1) Adding p-hydroxybenzaldehyde and o-aminotrifluorotoluene into an N, N-dimethylformamide solvent, reacting for 8-12h at 75-90 ℃, distilling under reduced pressure after the reaction is finished, filtering and drying to obtain an intermediate 1;
(2) Adding an intermediate 1 and 4-amino-3-fluorobenzene mercaptan into an N, N-dimethylformamide solvent, uniformly stirring, then adding a benzoin dimethyl ether photoinitiator, irradiating with 365nm ultraviolet light for 2-4h at 40-50 ℃, centrifuging, washing with distilled water, and drying to obtain an intermediate 2;
(3) Adding an intermediate 2, polyethylene glycol and epichlorohydrin into a tetrahydrofuran solvent, stirring and dissolving, then continuously adding a boron trifluoride diethyl etherate catalyst, reacting for 2-4 hours at 20-25 ℃, then continuously adding sodium hydroxide into the mixture for ring closure reaction, heating to 60-70 ℃ for reacting for 3-4 hours, centrifuging and separating after the completion, and washing with n-hexane for 2-3 times to obtain the fluorine-containing modified epoxy resin.
Preferably, the mass ratio of the parahydroxybenzaldehyde to the o-aminotrifluorotoluene in the step (1) is 1:1.1-1.3.
Preferably, the mass ratio of the intermediate 1, 4-amino-3-fluorobenzene mercaptan to benzoin dimethyl ether photoinitiator in the step (2) is 1.2-1.3:1:0.02-0.03.
Preferably, the mass ratio of the intermediate 2, the polyethylene glycol, the epichlorohydrin, the boron trifluoride diethyl ether catalyst and the sodium hydroxide in the step (3) is 0.8-1.2:1:2.8-3.5:0.04-0.06:0.05-0.07.
Preferably, the preparation method of the high-temperature-resistant fluoroelastomer processing aid for the slurry method polyethylene process comprises the steps of adding graphene oxide modified epoxy resin, fluorine-containing modified epoxy resin and tetrafluoroethylene-vinylidene fluoride copolymer into a double-screw extruder, extruding at 170-180 ℃ for 50-60min, crushing the extrudate, extracting with acetone for 6-9h, filtering and drying to obtain the high-temperature-resistant fluoroelastomer processing aid for the slurry method polyethylene process.
(III) beneficial technical effects
According to the invention, graphene oxide modified epoxy resin, fluorine-containing modified epoxy resin and tetrafluoroethylene-vinylidene fluoride copolymer are added into a double-screw extruder to be extruded, the extrudate is crushed, acetone is extracted, and the high-temperature-resistant fluoroelastomer processing aid for a slurry polyethylene process is obtained after filtration and drying.
The graphene oxide modified epoxy resin and the fluorine-containing modified epoxy resin have epoxy resin structures, so that the graphene oxide modified epoxy resin and the fluorine-containing modified epoxy resin have good compatibility, the dispersibility in a high-temperature-resistant fluoroelastomer processing aid for a slurry polyethylene process is improved, the epoxy resin has good temperature resistance, the graphene oxide has good lubricating effect, the orifice of a die head cannot be blocked, a large amount of fluoride contained by grafting is used in the polyethylene, friction among the resins can be reduced, melt fracture of shark skin is delayed, the surface of the shark skin is smoother, the processing performance and the material flow rate are improved, and the graphene oxide has good flame retardant effect and sulfur element synergistic flame retardant in the aid.
Detailed Description
Example 1
(1) Adding parahydroxybenzaldehyde and o-aminotrifluorotoluene into an N, N-dimethylformamide solvent, wherein the mass ratio of the parahydroxybenzaldehyde to the o-aminotrifluorotoluene is 1:1.1, reacting for 8 hours at 75 ℃, decompressing and distilling after finishing, filtering and drying to obtain an intermediate 1;
(2) Adding an intermediate 1 and 4-amino-3-fluorobenzene mercaptan into an N, N-dimethylformamide solvent, uniformly stirring, then adding a benzoin dimethyl ether photoinitiator into the mixture, wherein the mass ratio of the intermediate 1 to the 4-amino-3-fluorobenzene mercaptan to the benzoin dimethyl ether photoinitiator is 1.2:1:0.02, irradiating 365nm ultraviolet light for 2 hours at 40 ℃, centrifuging, washing with distilled water, and drying to obtain an intermediate 2;
(3) Adding an intermediate 2, polyethylene glycol and epichlorohydrin into a tetrahydrofuran solvent, stirring and dissolving, then continuously adding a boron trifluoride diethyl ether catalyst, reacting for 2 hours at 20 ℃, then continuously adding sodium hydroxide into the mixture for ring-closure reaction, wherein the mass ratio of the intermediate 2 to the polyethylene glycol to the epichlorohydrin to the boron trifluoride diethyl ether catalyst to the sodium hydroxide is 0.8:1:2.8:0.04:0.05, heating the mixture to 60 ℃ for reacting for 3 hours, centrifuging the mixture after the reaction is finished, and washing the mixture with n-hexane for 2 times to obtain fluorine-containing modified epoxy resin;
(4) Adding the aqueous epoxy resin and the ethylenediamine curing agent into a reactor, stirring at a high speed, and then adding graphene oxide into the reactor, wherein the mass ratio of the aqueous epoxy resin to the ethylenediamine curing agent to the graphene oxide is 1:0.02:1.1, and performing ultrasonic treatment for 40min to obtain graphene oxide modified epoxy resin;
(5) Adding 4 parts by weight of graphene oxide modified epoxy resin, 10 parts by weight of fluorine-containing modified epoxy resin and 40 parts by weight of tetrafluoroethylene-vinylidene fluoride copolymer into a double-screw extruder, extruding at 170 ℃ for 50min, crushing the extrudate, extracting with acetone for 6h, filtering and drying to obtain the high-temperature-resistant fluoroelastomer processing aid for the slurry polyethylene process.
Example 2
(1) Adding p-hydroxybenzaldehyde and o-aminotrifluorotoluene into an N, N-dimethylformamide solvent, wherein the mass ratio of the p-hydroxybenzaldehyde to the o-aminotrifluorotoluene is 1:1.3, reacting for 12 hours at 90 ℃, decompressing and distilling after the reaction is finished, filtering and drying to obtain an intermediate 1;
(2) Adding an intermediate 1 and 4-amino-3-fluorobenzene mercaptan into an N, N-dimethylformamide solvent, uniformly stirring, then adding a benzoin dimethyl ether photoinitiator into the mixture, wherein the mass ratio of the intermediate 1 to the 4-amino-3-fluorobenzene mercaptan to the benzoin dimethyl ether photoinitiator is 1.3:1:0.03, irradiating 365nm ultraviolet light for 4 hours at 50 ℃, centrifuging, washing with distilled water, and drying to obtain an intermediate 2;
(3) Adding an intermediate 2, polyethylene glycol and epichlorohydrin into a tetrahydrofuran solvent, stirring and dissolving, then continuously adding a boron trifluoride diethyl ether catalyst, reacting for 4 hours at 25 ℃, then continuously adding sodium hydroxide into the mixture for ring-closure reaction, wherein the mass ratio of the intermediate 2 to the polyethylene glycol to the epichlorohydrin to the boron trifluoride diethyl ether catalyst to the sodium hydroxide is 1.2:1:3.5:0.06:0.07, heating to 70 ℃ for reacting for 4 hours, centrifuging after the reaction is finished, and washing with n-hexane for 3 times to obtain fluorine-containing modified epoxy resin;
(4) Adding the aqueous epoxy resin and the ethylenediamine curing agent into a reactor, stirring at a high speed, and then adding graphene oxide into the reactor, wherein the mass ratio of the aqueous epoxy resin to the ethylenediamine curing agent to the graphene oxide is 1:0.04:1.3, and performing ultrasonic treatment for 70min to obtain graphene oxide modified epoxy resin;
(5) Adding 8 parts by weight of graphene oxide modified epoxy resin, 25 parts by weight of fluorine-containing modified epoxy resin and 60 parts by weight of tetrafluoroethylene-vinylidene fluoride copolymer into a double-screw extruder, extruding at 180 ℃ for 60min, crushing the extrudate, extracting with acetone for 9h, filtering and drying to obtain the high-temperature-resistant fluoroelastomer processing aid for the slurry polyethylene process.
Example 3
(1) Adding p-hydroxybenzaldehyde and o-aminotrifluorotoluene into an N, N-dimethylformamide solvent, wherein the mass ratio of the p-hydroxybenzaldehyde to the o-aminotrifluorotoluene is 1:1.2, reacting for 10 hours at 82.5 ℃, and after the reaction, distilling under reduced pressure, filtering and drying to obtain an intermediate 1;
(2) Adding an intermediate 1 and 4-amino-3-fluorobenzene mercaptan into an N, N-dimethylformamide solvent, uniformly stirring, then adding a benzoin dimethyl ether photoinitiator, wherein the mass ratio of the intermediate 1 to the 4-amino-3-fluorobenzene mercaptan to the benzoin dimethyl ether photoinitiator is 1.25:1:0.025, irradiating 365nm ultraviolet light for 3 hours at 45 ℃, centrifuging, washing with distilled water, and drying to obtain an intermediate 2;
(3) Adding an intermediate 2, polyethylene glycol and epichlorohydrin into a tetrahydrofuran solvent, stirring and dissolving, then continuously adding a boron trifluoride diethyl ether catalyst, reacting for 3 hours at 22.5 ℃, then continuously adding sodium hydroxide into the mixture for ring closure reaction, wherein the mass ratio of the intermediate 2 to the polyethylene glycol to the epichlorohydrin to the boron trifluoride diethyl ether catalyst to the sodium hydroxide is 1.0:1:3.15:0.05:0.06, heating to 65 ℃ for reacting for 3.5 hours, centrifuging and separating after the reaction is finished, and washing n-hexane for 2.5 times to obtain fluorine-containing modified epoxy resin;
(4) Adding the aqueous epoxy resin and the ethylenediamine curing agent into a reactor, stirring at a high speed, and then adding graphene oxide into the reactor, wherein the mass ratio of the aqueous epoxy resin to the ethylenediamine curing agent to the graphene oxide is 1:0.03:1.2, and performing ultrasonic treatment for 55min to obtain graphene oxide modified epoxy resin;
(5) Adding 6 parts by weight of graphene oxide modified epoxy resin, 17.5 parts by weight of fluorine-containing modified epoxy resin and 50 parts by weight of tetrafluoroethylene-vinylidene fluoride copolymer into a double-screw extruder, extruding at 175 ℃ for 55min, crushing the extrudate, extracting with acetone for 7.5h, filtering and drying to obtain the high-temperature-resistant fluoroelastomer processing aid for the slurry polyethylene process.
Example 4
(1) Adding parahydroxybenzaldehyde and o-aminotrifluorotoluene into an N, N-dimethylformamide solvent, wherein the mass ratio of the parahydroxybenzaldehyde to the o-aminotrifluorotoluene is 1:1.1, reacting for 8 hours at 75 ℃, decompressing and distilling after finishing, filtering and drying to obtain an intermediate 1;
(2) Adding an intermediate 1 and 4-amino-3-fluorobenzene mercaptan into an N, N-dimethylformamide solvent, uniformly stirring, then adding a benzoin dimethyl ether photoinitiator into the mixture, wherein the mass ratio of the intermediate 1 to the 4-amino-3-fluorobenzene mercaptan to the benzoin dimethyl ether photoinitiator is 1.2:1:0.02, irradiating 365nm ultraviolet light for 2 hours at 40 ℃, centrifuging, washing with distilled water, and drying to obtain an intermediate 2;
(3) Adding an intermediate 2, polyethylene glycol and epichlorohydrin into a tetrahydrofuran solvent, stirring and dissolving, then continuously adding a boron trifluoride diethyl ether catalyst, reacting for 4 hours at 25 ℃, then continuously adding sodium hydroxide into the mixture for ring-closure reaction, wherein the mass ratio of the intermediate 2 to the polyethylene glycol to the epichlorohydrin to the boron trifluoride diethyl ether catalyst to the sodium hydroxide is 1.2:1:3.5:0.06:0.07, heating to 70 ℃ for reacting for 4 hours, centrifuging after the reaction is finished, and washing with n-hexane for 3 times to obtain fluorine-containing modified epoxy resin;
(4) Adding the aqueous epoxy resin and the ethylenediamine curing agent into a reactor, stirring at a high speed, and then adding graphene oxide into the reactor, wherein the mass ratio of the aqueous epoxy resin to the ethylenediamine curing agent to the graphene oxide is 1:0.04:1.3, and performing ultrasonic treatment for 70min to obtain graphene oxide modified epoxy resin;
(5) Adding 6 parts by weight of graphene oxide modified epoxy resin, 17.5 parts by weight of fluorine-containing modified epoxy resin and 50 parts by weight of tetrafluoroethylene-vinylidene fluoride copolymer into a double-screw extruder, extruding at 175 ℃ for 55min, crushing the extrudate, extracting with acetone for 7.5h, filtering and drying to obtain the high-temperature-resistant fluoroelastomer processing aid for the slurry polyethylene process.
Example 5
(1) Adding p-hydroxybenzaldehyde and o-aminotrifluorotoluene into an N, N-dimethylformamide solvent, wherein the mass ratio of the p-hydroxybenzaldehyde to the o-aminotrifluorotoluene is 1:1.3, reacting for 12 hours at 90 ℃, decompressing and distilling after the reaction is finished, filtering and drying to obtain an intermediate 1;
(2) Adding an intermediate 1 and 4-amino-3-fluorobenzene mercaptan into an N, N-dimethylformamide solvent, uniformly stirring, then adding a benzoin dimethyl ether photoinitiator into the mixture, wherein the mass ratio of the intermediate 1 to the 4-amino-3-fluorobenzene mercaptan to the benzoin dimethyl ether photoinitiator is 1.3:1:0.03, irradiating 365nm ultraviolet light for 4 hours at 50 ℃, centrifuging, washing with distilled water, and drying to obtain an intermediate 2;
(3) Adding an intermediate 2, polyethylene glycol and epichlorohydrin into a tetrahydrofuran solvent, stirring and dissolving, then continuously adding a boron trifluoride diethyl ether catalyst, reacting for 3 hours at 22.5 ℃, then continuously adding sodium hydroxide into the mixture for ring closure reaction, wherein the mass ratio of the intermediate 2 to the polyethylene glycol to the epichlorohydrin to the boron trifluoride diethyl ether catalyst to the sodium hydroxide is 1.0:1:3.15:0.05:0.06, heating to 65 ℃ for reacting for 3.5 hours, centrifuging and separating after the reaction is finished, and washing n-hexane for 2.5 times to obtain fluorine-containing modified epoxy resin;
(4) Adding the aqueous epoxy resin and the ethylenediamine curing agent into a reactor, stirring at a high speed, and then adding graphene oxide into the reactor, wherein the mass ratio of the aqueous epoxy resin to the ethylenediamine curing agent to the graphene oxide is 1:0.03:1.2, and performing ultrasonic treatment for 55min to obtain graphene oxide modified epoxy resin;
(5) Adding 4 parts by weight of graphene oxide modified epoxy resin, 10 parts by weight of fluorine-containing modified epoxy resin and 40 parts by weight of tetrafluoroethylene-vinylidene fluoride copolymer into a double-screw extruder, extruding at 170 ℃ for 50min, crushing the extrudate, extracting with acetone for 6h, filtering and drying to obtain the high-temperature-resistant fluoroelastomer processing aid for the slurry polyethylene process.
Comparative example 1
In this comparative example, no graphene oxide-modified epoxy resin was added as compared with example 5.
Comparative example 2
In this comparative example, no fluorine-containing modified epoxy resin was added as compared with example 5.
The fluoroelastomer process aid of examples 1-5 and comparative examples 1-2 were mixed with polyethylene and extrusion tested on a haak rheometer for extrusion time and extrusion torque, head pressure, melt fracture test results are shown in table 1.
TABLE 1 fluoroelastomer processing aid performance test.
As can be seen from Table 1, the fluoroelastomer processing aids prepared in examples 1-5 of the present invention have reduced melt fracture elimination time and more head pressure and torque reduction than the fluoroelastomer processing aids prepared in comparative examples 1-2, indicating better flow rates, improved melt fracture and improved processability.
The limiting oxygen index of the material was measured using an oxygen index meter and the combustion grade of the mixed material was measured using a horizontal vertical burner with fluoroelastomer processing aid and polyethylene.
TABLE 2 flame retardancy test.
Project |
Limiting oxygen index (%) |
Combustion grade |
Example 1 |
28 |
V-0 |
Example 2 |
35 |
V-0 |
Example 3 |
33 |
V-0 |
Example 4 |
29 |
V-0 |
Example 5 |
30 |
V-0 |
Comparative example 1 |
24 |
V-1 |
Comparative example 2 |
21 |
V-1 |
As can be seen from Table 2, the fluoroelastomer processing aid prepared in examples 1-5 of the present invention was applied to polyethylene to provide a better flame retardant effect than the fluoroelastomer processing aid prepared in comparative examples 1-2.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.