CN118412419B - Preparation method of light-emitting substrate and display device - Google Patents

Abstract

The invention relates to the technical field of displays, in particular to a preparation method of a light-emitting substrate and a display device. The light-emitting unit is bound to the conductive layer at the first binding part of the glass substrate to obtain a light bar for displaying pictures, and the connector is bound to the conductive layer at the second binding part of the glass substrate to conduct an external power supply and the light-emitting unit. Wherein, form the filling hole on the second binding portion, pack the viscidity body in filling the hole, the soldering leg of connector welds on the conducting layer and stretches into in the viscidity body. Therefore, the solder fillets are further stretched into the adhesive body on the basis that the solder fillets are welded on the conductive layer, the connection strength of the connector, the glass substrate and the conductive layer can be increased under the action of the adhesive body, and the push-pull force of the connector can meet the production requirement.

Description

Preparation method of light-emitting substrate and display device

Technical Field

The present invention relates to the technical field of displays, and in particular to a method for preparing a light-emitting substrate and a display device.

Background Art

At present, while preparing liquid crystal display (LCD) glass substrates, the scraps can be used to prepare light-emitting substrates for light-emitting diode (LED) light strips, thereby improving the utilization rate of the light-emitting substrates.

However, there are still some problems to be overcome, including: Unlike the traditional printed circuit board (PCBA), the pins and solder feet of the connector can be melted into the printed circuit board, but because the light-emitting substrate is made of glass, the physical properties of the glass light-emitting substrate are stable, and the pins and solder feet of the connector can only be attached to the surface of the glass substrate, resulting in insufficient connection strength between the glass substrate and the connector, so that the push-pull force of the connector is insufficient to meet production needs.

Summary of the invention

The purpose of the present application is to provide a method for preparing a light-emitting substrate and a display device.

The present application provides a method for preparing a light-emitting substrate, comprising: providing a glass substrate, the glass substrate having a first binding portion and a second binding portion; providing a conductive layer, the conductive layer being arranged on the glass substrate; binding a light-emitting unit to the conductive layer at the first binding portion to form a light bar for displaying a picture; binding a connector to the conductive layer at the second binding portion; wherein a filling hole is formed at the second binding portion, and an adhesive is arranged in the filling hole; a soldering foot of the connector is soldered to the conductive layer to be electrically connected to the conductive layer, and the soldering foot of the connector extends into the adhesive, and the soldering foot is fixed by the adhesive.

In an exemplary embodiment of the present application, a filling hole is formed in the second binding portion, and a viscous body is arranged in the filling hole; the soldering foot of the connector is soldered to the conductive layer and extends into the viscous body, including: adding the viscous body in a molten state into the filling hole, and cooling to form the viscous body in a semi-fluid state; when the viscous body is in a semi-fluid state, removing part of the viscous body overflowing from the filling hole, so that the viscous body in the filling hole is flush with the surface of the glass substrate; cooling the viscous body in the semi-fluid state to form the viscous body in a hardened state; when the viscous body is in a hardened state, soldering the soldering foot to the conductive layer, the heat generated by the soldering will melt the viscous body in the hardened state, so that the soldering foot can be inserted into the viscous body.

In an exemplary embodiment of the present application, a solder foot contact is provided on the conductive layer, the solder foot contact corresponding to the light emitting unit is provided on the first binding portion, and the solder foot contact corresponding to the connector is provided on the second binding portion.

In an exemplary embodiment of the present application, in the second binding portion, the filling hole is formed by laser cutting the glass substrate, and the shape of the filling hole is rectangular, circular or irregular.

In an exemplary embodiment of the present application, the connector further comprises a pin, at least two solder feet are provided, the pin is located between two solder feet, and the solder feet and the pin are inserted into the adhesive body.

In an exemplary embodiment of the present application, the filling holes include two first filling holes and one second filling hole arranged along a first direction, the second filling hole is located between the two first filling holes, the solder foot of the connector is inserted into the first filling hole, and the pin of the connector is inserted into the second filling hole; or, the filling holes include a first filling hole and a second filling hole arranged along a second direction; along the first direction, the length of the first filling hole is greater than the length of the second filling hole, and the width of the solder foot of the connector is greater than the width of the pin of the connector; the solder foot of the connector is inserted into the first filling hole, and the pin of the connector is inserted into the second filling hole; the first direction is along the length direction of the glass substrate, the second direction is along the width direction of the glass substrate, and the first direction and the second direction are perpendicular.

In an exemplary embodiment of the present application, along a third direction, the connector and the light emitting unit are located on the same side surface of the glass substrate, the third direction is along the height direction of the glass substrate, and the first direction, the second direction and the third direction are perpendicular to each other.

In an exemplary embodiment of the present application, along a third direction, the light emitting unit and the connector are located on opposite surfaces of the glass substrate, the third direction is along the height direction of the glass substrate, and the first direction, the second direction and the third direction are perpendicular to each other.

In an exemplary embodiment of the present application, the viscous body is at least one of resin, polyurethane containing glass fiber, and polycarbonate containing glass fiber.

The present application also provides a display device, comprising a light-emitting substrate obtained by the light-emitting substrate preparation method, wherein the light-emitting substrate comprises: a glass substrate, wherein the glass substrate comprises a first binding portion and a second binding portion, wherein the second binding portion is provided with a filling hole, and an adhesive is provided in the filling hole; a conductive layer, wherein the conductive layer is provided on the glass substrate; a light-emitting unit, wherein the light-emitting unit is bound to the conductive layer at the first binding portion; and a connector, wherein the connector comprises a solder foot, wherein the solder foot is soldered to the conductive layer on the second binding portion to be electrically connected to the conductive layer, and wherein the solder foot extends into the adhesive and is fixed by the adhesive.

A method for preparing a light-emitting substrate and a display device of the present application scheme have the following beneficial effects: a light-emitting unit is bound to a conductive layer at a first binding portion of a glass substrate to obtain a light bar for displaying a picture, and a connector is bound to a conductive layer at a second binding portion of the glass substrate to conduct an external power supply and the light-emitting unit. A filling hole is formed on the second binding portion, and a viscous body is filled in the filling hole. The soldering feet of the connector are welded to the conductive layer to be electrically connected to the conductive layer, and the soldering feet of the connector extend into the viscous body, and the soldering feet are fixed by the viscous body. Thus, the electrical connection between the connector and the conductive layer is achieved, and fixing the soldering feet by the viscous body can increase the stability of the electrical connection between the connector and the conductive layer. And by welding the soldering feet to the conductive layer, the soldering feet are further extended into the viscous body, and the viscosity of the viscous body can increase the connection strength between the connector and the glass substrate and the conductive layer, so that the push-pull force of the connector can meet the production requirements.

Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

FIG1 is a schematic flow diagram of a method for preparing a light-emitting substrate in an embodiment of the present invention;

FIG2 is a schematic diagram of a first structure of a light-emitting substrate in an embodiment of the present invention;

FIG3 is a second structural schematic diagram of a light-emitting substrate in an embodiment of the present invention;

FIG4 is a schematic diagram of a third structure of a light-emitting substrate in an embodiment of the present invention;

FIG5 is a fourth structural schematic diagram of the light-emitting substrate in an embodiment of the present invention;

FIG6 is a schematic diagram of the process of step S400 in FIG1 ;

7 is a schematic diagram of a structure in which a conductive layer is provided on a glass substrate in an embodiment of the present invention;

8 is a schematic structural diagram of a connector according to an embodiment of the present invention;

FIG9 is a schematic diagram of the structure of some embodiments of the filling hole in the embodiment of the present invention;

10 is a schematic structural diagram of another embodiment of a filling hole in an embodiment of the present invention;

FIG. 11 is a schematic structural diagram of another embodiment of a connector in an embodiment of the present invention.

Description of reference numerals:

100, glass substrate; 110, first binding part; 120, second binding part; 200, conductive layer; 210, solder foot contact; 220, pin contact; 300, light-emitting unit; 400, connector; 410, solder foot; 420, pin; 500, filling hole; 510, first filling hole; 520, second filling hole; 600, adhesive; X1, first direction; X2, second direction; X3, third direction.

DETAILED DESCRIPTION

Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

It should be noted that the "multiple" mentioned in this article refers to two or more. "And/or" describes the association relationship of the associated objects, indicating that there can be three relationships. For example, A and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character "/" generally indicates that the associated objects before and after are in an "or" relationship.

At present, while preparing liquid crystal display (LCD) glass substrates, the scraps can be used to prepare light-emitting substrates for light-emitting diode (LED) light strips, thereby improving the utilization rate of the light-emitting substrates.

Specifically, the light-emitting substrate is made of glass, and a whole piece of glass is cut to form a glass substrate for a display panel, for example, a substrate substrate for a TFT (thin film transistor) and a CF (color film substrate). The glass substrate is first divided so that the glass substrate forms two cutting areas, a panel cutting area and a light bar cutting area, and each cutting area forms a panel area and a light bar area respectively. The panel cutting area includes a plurality of panel areas, and the light bar cutting area includes a plurality of light bar areas. Each panel area can be a substrate substrate for a display panel, and each light bar area can be a substrate substrate for a light bar. By utilizing the residual material left after cutting the display panel and cutting the light bar substrate, the loss and waste of glass can be reduced, the utilization rate of glass can be improved, and the production cost can be reduced.

However, there are still some problems to be overcome, including: unlike the traditional printed circuit board (PCBA), the pins and solder feet of the connector can be melted into the printed circuit board (PCBA), the physical properties of the glass light-emitting substrate are stable, and the pins and solder feet of its connector can only be attached to the surface of the glass substrate, resulting in insufficient connection strength between the glass substrate and the connector, so that the push-pull force of the connector is insufficient to meet production needs.

1 to 5 , in order to solve the above technical problems, the present application provides a method for preparing a light-emitting substrate, which specifically includes steps S100 to S400 .

Step S100 : providing a glass substrate 100 , wherein the glass substrate 100 comprises a first binding portion 110 and a second binding portion 120 .

2 , the glass substrate 100 can be formed by cutting a whole piece of glass or by further cutting the leftovers from cutting a display panel. The glass substrate 100 is divided into a first binding portion 110 and a second binding portion 120 to set the light emitting unit 300 and the connector 400 in the subsequent process.

Step S200 : providing a conductive layer 200 , wherein the conductive layer 200 is disposed on the glass substrate 100 .

As shown in FIG. 3 , the glass substrate 100 is etched, exposed or developed, and a conductive layer 200 is formed on the surface of the glass substrate 100 and covers the entire surface area. At the same time, a conductive layer 200 is formed on both the first binding part 110 and the second binding part 120, so that the conductive layers 200 of the first binding part 110 and the second binding part 120 are manufactured in the same process, and the conductive layers 200 have a cathode electrode and an anode electrode. Before cutting the whole piece of glass, the cutting area of the display panel and the cutting area of the light bar are divided, and the conductive layer 200 is set on the surface of the whole piece of glass before cutting. The conductive layer 200 of the light bar is formed while the conductive layer 200 of the display panel is formed, and then the glass substrate 100 of the display panel and the light bar are cut to save preparation time and improve production efficiency. In other embodiments, the conductive layer 200 can also be set on the whole piece of glass dedicated to the light bar before cutting. It is selected according to the actual situation.

Step S300 : Binding the light emitting unit 300 to the conductive layer 200 at the first binding portion 110 to form a light bar for displaying images.

As shown in FIG4 , a plurality of light-emitting units 300 arranged in a matrix form a display screen of the display device, each color block includes at least one red, green, and blue light-emitting diode, and the color block density is more than 110,000 dots per square meter. Each LED light-emitting unit is individually controlled by controlling the conduction and disconnection of the power switch tube and the display control circuit, thereby controlling the color image display of the display screen. The light-emitting substrate can be set on the back panel of the display device by means of screws or welding. The light-emitting substrate formed by splicing a plurality of light strips serves as the display screen of the display device. Specifically, the light strips are designed to be connected in series in the length direction, so that the number of light strips spliced according to display devices of different sizes can be adjusted, and there is no need to re-develop and design the display screen of the display device separately, thereby effectively solving the problem of repeated development and design, realizing the sharing of light strips, saving processes and costs, and improving the efficiency of glass use.

Step S400: The connector 400 is bound to the conductive layer 200 at the second binding part 120. The filling hole 500 is formed in the second binding part 120, and the adhesive body 600 is arranged in the filling hole 500. The soldering foot 410 of the connector 400 is soldered to the conductive layer 200 to be electrically connected to the conductive layer 200, and the soldering foot 410 of the connector 400 extends into the adhesive body 600, and the soldering foot 410 is fixed by the adhesive body 600.

As shown in FIG. 5 , the connector 400 is connected to the conductive layer 200 by welding. The connector 400 may be a serial connector 400, which can connect multiple light bars in series and has at least two groups of connecting electrodes, one of which can be connected to one light bar through the conductive layer 200, and the other can be connected to another light bar through the conductive layer 200. In this embodiment, the two light bars connected by the connector 400 may be light bars of the same type or light bars of different types. For example, light bars of the same specification may be connected in series, or light bars of different specifications may be connected in series, such as light bars with different numbers of lamp beads, as long as the use requirements of the light-emitting substrate can be met. It should be noted that when the two light bars connected by the connector 400 are of the same type, the positive and negative directions of the connecting electrodes at both ends may be opposite. When the two light bars connected by the connector 400 are of different types, the directions of the positive and negative poles of the two spliced light bars may be the same.

On the second binding part 120, a filling hole 500 is formed by laser cutting or lathing. The filling hole 500 may penetrate the glass substrate 100 or may not penetrate the glass substrate 100. The area and depth of the filling hole 500 are selected according to the required volume of the filled viscous body 600. When the filling hole 500 penetrates the glass substrate 100, laser cutting may be used. When the viscous body 600 is filled, one side of the filling hole 500 needs to be blocked before the viscous body 600 is filled to prevent the flow of the viscous body 600. The connector 400 may be set on any of the two openings of the filling hole 500. When the filling hole 500 does not penetrate the glass substrate 100, lathing may be used. However, the opening of the filling hole 500 that does not penetrate the glass substrate 100 faces the direction of the conductive layer 200 so that the connector 400 can be installed later and can extend into the viscous body 600 after welding.

The viscous body 600 may be at least one of a resin, a polyurethane containing glass fiber, and a polycarbonate containing glass fiber. It has different states in different temperature environments, generally including a molten state, a semi-fluid state, and a hardened state. When the soldering foot 410 of the connector 400 is inserted into the viscous body 600, the state of the viscous body 600 is changed by controlling the temperature, so that the soldering foot 410 is inserted into the viscous body 600 in the molten state, and the viscous body 600 fixes the soldering foot 410 in the hardened state to enhance the connection.

In this embodiment, as shown in FIG. 1 to FIG. 5 , a whole piece of glass is cut to form a glass substrate 100, and a first binding portion 110 and a second binding portion 120 of the glass substrate 100 are used to set a light-emitting unit 300 and a connector 400, respectively. A conductive layer 200 is formed on each of the first binding portion 110 and the second binding portion 120, so that the conductive layers 200 of the first binding portion 110 and the second binding portion 120 are manufactured in the same process, and each of the conductive layers 200 has a cathode electrode and an anode electrode. The light-emitting substrate formed by splicing a plurality of light bars serves as a display screen of a display device, thereby controlling the color image display of the display screen. The viscous body 600 in the filling hole 500 has different states in environments with different temperatures. The state of the viscous body 600 is changed by controlling the temperature, and the solder foot 410 is inserted into the viscous body 600 in a molten state, and the solder foot 410 is fixed to the viscous body 600 in a hardened state to enhance the connection. Thus, the electrical connection between the connector 400 and the conductive layer 200 is achieved, and the stability of the electrical connection between the connector 400 and the conductive layer 200 can be increased by fixing the soldering foot 410 with the adhesive body 600. Furthermore, by soldering the soldering foot 410 to the conductive layer 200 and further extending the soldering foot 410 into the adhesive body 600, the connection strength between the connector 400 and the glass substrate 100 can be increased under the viscosity of the adhesive body 600, so that the push-pull force of the connector 400 can meet the production requirements.

As shown in FIG. 6 , a filling hole 500 is formed in the second binding portion 120 , and an adhesive body 600 is disposed in the filling hole 500 ; the soldering foot 410 of the connector 400 is soldered to the conductive layer 200 and extends into the adhesive body 600 , specifically including steps S410 to S440 .

Step S410: Add the viscous body 600 in a molten state into the filling hole 500 and cool it to form the viscous body 600 in a semi-fluid state.

The resin, the polyurethane containing glass fiber and the polycarbonate containing glass fiber are heated to the melting point temperature to be melted or mixed to form a molten viscous body 600, and the molten viscous body 600 is added to the filling hole 500 and cooled to a semi-fluid state. The semi-fluid state refers to a material state between solid and liquid, that is, a viscous liquid.

Step S420 : when the viscous body 600 is in a semi-fluid state, removing a portion of the viscous body 600 that overflows the filling hole 500 , so that the viscous body 600 in the filling hole 500 is flush with the surface of the glass substrate 100 .

When the viscous body 600 is in a semi-fluid state, it is processed and cut to remove the overflow, which is the part of the viscous body 600 that overflows the filling hole 500. After removing the overflow, it can also be polished according to actual conditions, or repeatedly remove the overflow and repeatedly polish to meet the process standards. Finally, the viscous body 600 in the filling hole 500 is made flush with the surface of the glass substrate 100, and a flat surface is formed on both surfaces of the glass substrate 100, so as to facilitate the arrangement of electronic components such as the conductive layer 200 and the connector 400 in the subsequent process.

Step S430: Cooling the viscous body 600 in a semi-fluid state to form the viscous body 600 in a hardened state.

The hardened adhesive body 600 can provide stronger adhesion and structural stability, and has the ability to not return to a semi-fluid or molten state at the operating temperature or room temperature of the display device, so that the connector 400 and the glass substrate 100 are connected through the adhesive body 600 .

Step S440 : When the viscous body 600 is in a hardened state, the soldering foot 410 is soldered to the conductive layer 200 . The heat generated by the soldering will melt the hardened viscous body 600 , so that the soldering foot 410 can be inserted into the viscous body 600 .

Since the viscous body 600 has been hardened in the previous process, when the soldering foot 410 is soldered to the conductive layer 200, the heat is transferred to the hardened viscous body 600 to melt the hardened viscous body 600, so that the hardened viscous body 600 is partially restored to a molten state or a semi-fluid state, so that the soldering foot 410 can be inserted into the viscous body 600. After static hardening, the soldering foot 410 is fixed in the viscous body 600.

In this embodiment, the state of the viscous body 600 is changed by changing the temperature, so that the viscous body 600 is transformed in a molten state, a semi-fluid state and a hardened state, so as to fill, level and fix the solder feet 410 of the connector 400. In this way, the process difficulty can be reduced, and the connector 400 has a better connection strength, meeting the production requirements of the push-pull force of the connector 400.

In some embodiments, as shown in FIG. 7 , solder foot contacts 210 are provided on the conductive layer 200, solder foot contacts 210 corresponding to the light emitting unit 300 are provided on the first binding portion 110, and solder foot contacts 210 corresponding to the connector 400 are provided on the second binding portion 120. Each light emitting unit 300 may include at least two solder feet 410, and the two solder feet 410 are provided at both ends of one side of the light emitting unit 300. A solder foot contact 210 corresponding to the light emitting unit 300 is provided on the first binding portion 110, and the solder foot contact 210 protrudes toward the side away from the glass substrate 100, and each solder foot 410 corresponds to one solder foot contact 210, and the solder foot 410 is inserted into the solder foot contact 210, and then the solder foot 410 is soldered to the solder foot contact 210 by solder. A solder foot contact 210 corresponding to the connector 400 is provided in the second binding portion 120. The solder foot 410 of the connector 400 is longer than the solder foot 410 of the light-emitting unit 300. After the solder foot 410 of the connector 400 is inserted into the solder foot contact 210, heating and welding are started. The welding temperature melts the adhesive body 600 so that the solder foot 410 continues to be inserted into the adhesive body 600, and solder is added to fix the solder foot contact 210 and the solder foot 410.

In some embodiments, in the second binding portion 120, the filling hole 500 is formed by laser cutting the glass substrate 100, and the shape of the filling hole 500 is rectangular, circular or irregular. Laser cutting facilitates the control of the shape of the filling hole 500. Rectangular and circular shapes are regular shapes, and irregular shapes are irregular shapes. The shape of the cutting is selected according to actual needs.

In some embodiments, as shown in FIGS. 7 and 8 , the connector 400 further includes a pin 420, at least two soldering feet 410 are provided, the pin 420 is located between the two soldering feet 410, and the soldering feet 410 and the pin 420 are inserted into the adhesive body 600. The conductive layer 200 further includes a pin contact 220, which is used for soldering and contacting with the pin 420. A corresponding number of pin contacts 220 are provided according to the number of the pins 420. Generally, a plurality of pins 420 are provided, and an array is formed on the surface of the connector 400, located between the two soldering feet 410. When soldering the soldering feet 410, the pin 420 is inserted into the pin contact 220 at the same time. After the adhesive body 600 is melted by the heat generated by soldering, the pin 420 can also be inserted into the adhesive body 600.

In some embodiments, the first direction X1 is along the length direction of the glass substrate 100, the second direction X2 is along the width direction of the glass substrate 100, and the third direction X3 is along the height direction of the glass substrate 100. The first direction X1, the second direction X2 and the third direction X3 are perpendicular to each other.

In some embodiments, as shown in FIG. 9 , the filling hole 500 includes two first filling holes 510 and one second filling hole 520 arranged along the first direction X1, and one second filling hole 520 is located between the two first filling holes 510, and the solder foot 410 of the connector 400 is inserted into the first filling hole 510, and the pin 420 of the connector 400 is inserted into the second filling hole. In another embodiment, as shown in FIG. 10 , the filling hole 500 includes one first filling hole 510 and one second filling hole 520 arranged along the second direction X2; along the first direction X1, the length of the first filling hole 510 is greater than the length of the second filling hole 520, and the width of the solder foot 410 of the connector 400 is greater than the width of the pin 420 of the connector 400; the solder foot 410 of the connector 400 is inserted into the first filling hole 510, and the pin 420 of the connector 400 is inserted into the second filling hole 520. According to the actual positions of the pins 420 and the solder feet 410 of the connector 400, the positions of the first filling hole 510 and the second filling hole 520 are divided, and the first filling hole 510 and the second filling hole 520 are formed by segmented laser cutting. Thus, the cutting yield can be improved after multiple small cuttings, and the manufacturing process of the glass substrate 100 can be further improved. The first filling hole 510 and the second hole can also be cut at the same time, which can further shorten the operation time and thus improve the overall production capacity.

In some embodiments, as shown in FIGS. 2 to 5 , along the third direction X3, the connector 400 and the light-emitting unit 300 are located on the same side surface of the glass substrate 100. Thus, by forming the reflective unit and the connector 400 on the same side, the consumables between the light-emitting unit 300 and the connector 400 can be reduced, thereby saving costs. In another embodiment, as shown in FIG. 11 , along the third direction X3, the light-emitting unit 300 and the connector 400 are located on opposite surfaces of the glass substrate 100. Thus, for some narrow-frame models, it is necessary to make the connector 400 on the back of the glass substrate 100, which can be achieved through this embodiment. While improving the production yield of glass-based light strips, it also enriches the application field of glass-based light strips.

In the present application, a whole piece of glass is cut to form a glass substrate 100, and a first binding portion 110 and a second binding portion 120 of the glass substrate 100 are used to set a light-emitting unit 300 and a connector 400, respectively. A conductive layer 200 is formed on both the first binding portion 110 and the second binding portion 120, and a light-emitting substrate formed by splicing a plurality of light bars is used as a display screen of a display device, thereby controlling the color image display of the display screen. The viscous body 600 in the filling hole 500 has different states in environments with different temperatures. The state of the viscous body 600 is changed by changing the temperature, so that the viscous body 600 is transformed in a molten state, a semi-fluid state and a hardened state, so as to achieve filling, leveling and fixing of the solder pin 410 of the connector 400, and the solder pin 410 is extended into the viscous body 600. Under the viscosity of the viscous body 600, the connection strength between the connector 400 and the glass substrate 100 and the conductive layer 200 can be increased, so that the push-pull force of the connector 400 can meet the production requirements.

As shown in FIGS. 1 to 11 , the present application further provides a display device, the display device comprising a light-emitting substrate obtained by the above-mentioned method for preparing a light-emitting substrate. The light-emitting substrate comprises a glass substrate 100, a conductive layer 200, a light-emitting unit 300 and a connector 400. The glass substrate 100 comprises a first binding portion 110 and a second binding portion 120, the second binding portion 120 is provided with a filling hole 500, and an adhesive body 600 is provided in the filling hole 500. The conductive layer 200 is provided on the glass substrate 100. The light-emitting unit 300 is bound to the conductive layer 200 at the first binding portion 110. The connector 400 comprises a solder foot 410, the solder foot 410 is soldered to the conductive layer 200 on the second binding portion 120 and is electrically connected to the conductive layer 200, and the solder foot 410 extends into the adhesive body 600, and the solder foot 410 is fixed by the adhesive body 600. Thus, the electrical connection between the connector 400 and the conductive layer 200 is achieved, and the stability of the electrical connection between the connector 400 and the conductive layer 200 can be increased by fixing the soldering foot 410 with the adhesive body 600. Moreover, on the basis of soldering the soldering foot 410 to the conductive layer 200, the soldering foot 410 is further extended into the adhesive body 600, and the viscosity of the adhesive body 600 can increase the connection strength between the connector 400 and the glass substrate 100, so that the push-pull force of the connector 400 can meet the production requirements.

In this application, unless otherwise clearly specified and limited, the terms "disposed (provided with)", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In the description of this specification, the description of reference terms such as "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims (9)

1. A method for preparing a light-emitting substrate, comprising: Providing a glass substrate, wherein the glass substrate has a first binding portion and a second binding portion; Providing a conductive layer, wherein the conductive layer is disposed on the glass substrate; Binding the light emitting unit to the conductive layer at the first binding portion to form a light bar for displaying images; Binding the connector to the conductive layer at the second binding portion includes: forming a filling hole in the second binding portion, adding a viscous body in a molten state into the filling hole, and cooling the viscous body to form a semi-fluid state; When the viscous body is in a semi-fluid state, removing a portion of the viscous body overflowing from the filling hole, so that the viscous body in the filling hole is flush with the surface of the glass substrate; Cooling the viscous body in a semi-fluid state to form the viscous body in a hardened state; When the viscous body is in a hardened state, the soldering foot is soldered to the conductive layer, and the heat generated by the soldering melts the hardened viscous body, so that the soldering foot can be inserted into the viscous body, and the soldering foot is fixed by the viscous body. 2. The method for preparing the light-emitting substrate according to claim 1 is characterized in that a solder foot contact is provided on the conductive layer, the solder foot contact corresponding to the light-emitting unit is provided on the first binding portion, and the solder foot contact corresponding to the connector is provided on the second binding portion. 3 . The method for preparing a light-emitting substrate according to claim 2 , wherein, in the second binding portion, the filling hole is formed by laser cutting the glass substrate, and the shape of the filling hole is rectangular or circular. 4. The method for preparing a light-emitting substrate according to claim 1, characterized in that the connector further comprises a pin, at least two solder feet are provided, the pin is located between two solder feet, and the solder foot and the pin are inserted into the adhesive body. 5. The method for preparing a light-emitting substrate according to claim 4, characterized in that: The filling holes include two first filling holes and one second filling hole arranged along a first direction, the second filling hole is located between the two first filling holes, the solder feet of the connector are inserted into the first filling holes, and the pins of the connector are inserted into the second filling holes; or, The filling holes include a first filling hole and a second filling hole arranged along the second direction; along the first direction, the length of the first filling hole is greater than the length of the second filling hole, and the width of the solder foot of the connector is greater than the width of the pin of the connector; the solder foot of the connector is inserted into the first filling hole, and the pin of the connector is inserted into the second filling hole; The first direction is along a length direction of the glass substrate, the second direction is along a width direction of the glass substrate, and the first direction is perpendicular to the second direction. 6. The method for preparing a light-emitting substrate according to claim 5 is characterized in that, along a third direction, the connector and the light-emitting unit are located on the same side surface of the glass substrate, the third direction is along the height direction of the glass substrate, and the first direction, the second direction and the third direction are perpendicular to each other. 7. The method for preparing a light-emitting substrate according to claim 5 is characterized in that, along a third direction, the light-emitting unit and the connector are located on opposite surfaces of the glass substrate, the third direction is along the height direction of the glass substrate, and the first direction, the second direction and the third direction are perpendicular to each other. 8 . The method for preparing a light-emitting substrate according to claim 1 , wherein the viscous body is at least one of a resin, a polyurethane containing glass fiber, and a polycarbonate containing glass fiber. 9. A display device, characterized in that it comprises a light-emitting substrate obtained by the method for preparing a light-emitting substrate according to any one of claims 1 to 8, wherein the light-emitting substrate comprises: A glass substrate, the glass substrate comprising a first binding portion and a second binding portion, the second binding portion being provided with a filling hole, and a viscous body being provided in the filling hole; A conductive layer, wherein the conductive layer is disposed on the glass substrate; a light emitting unit, wherein the light emitting unit is bound to the conductive layer at the first binding portion; The connector comprises a soldering foot, wherein the soldering foot is soldered to the conductive layer on the second binding portion to be electrically connected to the conductive layer, and the soldering foot extends into the adhesive body to be fixed by the adhesive body.