CN118412313B - Centering jig and method for semiconductor equipment - Google Patents
Centering jig and method for semiconductor equipment Download PDFInfo
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- CN118412313B CN118412313B CN202410867275.9A CN202410867275A CN118412313B CN 118412313 B CN118412313 B CN 118412313B CN 202410867275 A CN202410867275 A CN 202410867275A CN 118412313 B CN118412313 B CN 118412313B
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 86
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 description 14
- 230000009286 beneficial effect Effects 0.000 description 9
- 238000009434 installation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000013618 particulate matter Substances 0.000 description 3
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
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- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention provides a centering jig and a centering method for semiconductor equipment. The jig comprises: the device comprises a beam assembly, a ball seat assembly, a conical column ball head assembly, a connecting seat, a movable slipway, a base and a reflective sensor; the beam assembly comprises a beam which can be erected on the equipment cavity, and a positioning groove is formed in the beam; the ball seat assembly comprises a ball seat and a plurality of balls with different sizes, wherein the balls are positioned in the ball seat; the cone column ball head assembly comprises a cone column ball head shaft, one end of a cone column of the cone column ball head shaft is a cone surface, the other end of the cone column is a sphere, and a through hole penetrating through the cone column upwards is formed in the center of the cone column; the connecting seat is provided with a groove matched with the spherical end of the ball head shaft of the conical column; the movable sliding table is arranged between the connecting seat and the base; the sensor comprises a transmitting part and a reflecting part, wherein the reflecting part is arranged in a positioning groove of the cross beam, and the transmitting part is arranged in a through hole of the conical column. The invention is helpful for improving centering accuracy and centering efficiency.
Description
Technical Field
The present invention relates to the field of integrated circuit manufacturing technology, and in particular, to a centering jig and method for semiconductor devices.
Background
In various semiconductor process equipment such as Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD), a rotating lift mechanism is provided that functions to lift and/or rotate a wafer during a process so that all surfaces of the wafer are in the same process atmosphere, thereby improving process uniformity. Therefore, in the process of mounting semiconductor devices such as CVD, it is generally necessary to perform centering adjustment on the rotation lifting mechanism and the chamber, so as to mechanically ensure that the wafer is positioned in the middle of the chamber when rotating, thereby improving process uniformity. At present, the rotating mechanism is installed without a corresponding centering jig, so that the centering operation mainly depends on personal experience of engineers, or simple measurement is carried out by means of tools such as a measuring scale and the like, the operation is complicated, the efficiency and the equipment output are reduced, and large errors are often caused, so that the production yield is reduced.
It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present invention and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the invention section.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a centering fixture and method for a semiconductor device, which are used for solving the problems of complicated operation and errors in the prior art, which are caused by the fact that there is no proper centering fixture, and measurement is performed mainly by means of personal experience of an engineer or by means of a measuring scale when a rotation mechanism of the semiconductor device is centered.
To achieve the above and other related objects, the present invention provides a centering jig for a semiconductor device for centering a rotating mechanism of the semiconductor device, comprising: the device comprises a beam assembly, a ball seat assembly, a conical column ball head assembly, a connecting seat, a movable slipway, a base and a reflective sensor; the beam assembly comprises a beam which can be erected on the equipment cavity, and a positioning groove is formed in the beam; the ball seat assembly comprises a ball seat and a plurality of balls with different sizes, wherein the balls are positioned in the ball seat; the cone column ball head assembly comprises a cone column ball head shaft, one end of a cone column of the cone column ball head shaft is a cone surface, the other end of the cone column is a sphere, and a through hole penetrating through the cone column upwards is formed in the center of the cone column; the connecting seat is provided with a groove matched with the spherical end of the ball head shaft of the conical column; the movable sliding table is arranged between the connecting seat and the base; the sensor comprises a transmitting part and a reflecting part, wherein the reflecting part is arranged in a positioning groove of the cross beam, and the transmitting part is arranged in a through hole of the conical column.
Optionally, the cross beam is provided with a supporting screw and a positioning pin matched with the positioning pin hole of the cavity.
Optionally, a mounting groove is formed in the position, close to the spherical end, of the conical column, and the transmitting part is fixed in the mounting groove through a screw.
Optionally, the tapered column ball head shaft and the connecting seat are fixed through a plurality of adjusting screws and through hole cover nuts which are connected to the adjusting screws in a threaded mode.
Optionally, the balls are steel balls, and after the steel balls are assembled in the ball seats, the ball seats are sleeved on the conical surface ends of the conical columns.
Optionally, the movable slipway is a manual X-direction and Y-direction cross slipway.
Optionally, a guiding structure extending upwards to limit the lifting mechanism is arranged on the base.
Optionally, the centering fixture further comprises a lifting platform located below the base.
Optionally, the sensor comprises a laser sensor.
The invention also provides a centering method of the semiconductor device, which is used for centering the rotating mechanism of the semiconductor device and comprises the following steps:
providing a centering jig as described in any one of the above schemes;
The method comprises the steps that a reflecting part of a sensor is arranged in a positioning groove of a beam, the beam is arranged on a cavity of semiconductor equipment in an erecting mode, and the reflecting part corresponds to the center of the cavity vertically;
mounting the transmitting part of the sensor on the tapered column ball head shaft, and finely adjusting the sensor to enable signals sent by the transmitting part to pass through the through hole of the tapered column ball head shaft;
the spherical end of the ball head shaft of the conical column is arranged in a groove of the connecting seat;
Assembling the ball seat and the big ball and the small ball, and sleeving the ball seat and the big ball on the conical surface of the ball head shaft of the conical column;
the movable slipway is arranged on the base;
The connecting seat is connected and fastened with the movable slipway;
The rotary mechanism to be centered is placed on the ball seat assembly, and balls in the ball seat assembly are extruded by the conical surface of the ball head shaft of the conical column due to the gravity of the rotary mechanism, and the upper large balls and the lower small balls center and clamp the rotary mechanism to realize the centering of the rotary mechanism;
the height of the rotating mechanism is adjusted, so that the length of a mounting bolt of the rotating mechanism is contacted with a mounting threaded hole of the cavity;
The sensor is electrified, and a signal sent by the transmitting part passes through the through hole of the ball head shaft of the cone column and is shot to the cross beam;
Adjusting the movable slipway to enable the emission signal of the emission part to be aligned with the reflection part;
the fine tuning taper column ball head shaft assembly indicates that the centering of the rotating mechanism is completed when the transmitting part receives the reflection signal of the reflecting part;
and adjusting the height of the rotating mechanism, screwing the mounting bolt of the rotating mechanism into the mounting threaded hole of the cavity, and completing centering and fastening of the rotating mechanism.
As described above, the centering jig and method for semiconductor devices provided by the invention have the following beneficial effects: according to the centering jig provided by the invention, through ingenious design and matching of the modules such as the beam assembly, the ball seat assembly, the conical column ball head shaft assembly, the connecting seat, the movable sliding table and the like, the accurate centering of the rotary mechanism and the center of the cavity can be realized, the error existing only by manual operation can be effectively reduced, the centering accuracy of the rotary mechanism installation is improved, the centering adjustment time is saved, and the working efficiency is improved. In addition, the invention realizes centering by utilizing the reflection principle of the reflection type sensor, can realize zero contact between the centering jig and the cavity and the non-vacuum part of the rotating mechanism, can greatly reduce particle pollution generated in the centering jig and the centering operation process, and is beneficial to improving the production yield of equipment. The centering jig is simple in structure, convenient to use and extremely high in applicability. The centering method based on the centering jig is convenient to operate and is beneficial to reducing the labor cost.
Drawings
Fig. 1 is a schematic diagram illustrating a use of the centering fixture provided in the invention when a rotation mechanism of a semiconductor device is installed.
Fig. 2 is a partially exploded view of fig. 1.
Fig. 3 is a schematic view showing the assembly of the beam assembly, the sensor and the cavity of the centering fixture provided by the invention.
Fig. 4 is a schematic structural view of a ball assembly of a centering fixture according to the present invention.
Fig. 5 is a schematic view illustrating an exemplary structure of a tapered-column ball component of the centering fixture according to the present invention.
Fig. 6 is an exemplary structural schematic diagram of a connection base of the centering fixture provided by the present invention.
Fig. 7 and 8 are schematic installation views of the tapered-column ball head assembly and the connecting seat of the centering fixture provided by the invention.
Fig. 9 is a schematic diagram illustrating an exemplary structure of a moving sliding table of a centering fixture according to the present invention.
Fig. 10 is a schematic diagram of an exemplary structure of a base of a centering fixture according to the present invention.
Fig. 11 is a schematic structural diagram of an elevating platform of a centering fixture according to the present invention.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of the present invention, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex. In order to make the illustration as concise as possible, not all structures are labeled in the drawings.
The invention provides a centering jig for a semiconductor device, which is used for centering a rotating mechanism 1 of the semiconductor device.
As shown in fig. 1 to 2, the centering jig includes: the device comprises a beam assembly 3, a ball seat assembly 4, a tapered column ball head assembly 5, a connecting seat 6, a movable sliding table, a base 8 and a reflective sensor.
As shown in fig. 3, the cross member 31 may be a generally rectangular flat metal plate, such as a stainless steel plate, having a length such that it spans at least directly above the cavity 2 and passes over the center of the cavity 2. If the apparatus is of a side-by-side dual chamber construction, the length of the cross beam 31 may extend across and span over both chambers 2. When the cross beam 31 is fixed above the cavity 2, it is necessary to ensure that the positioning slot 311 on the cross beam 31 vertically corresponds to the central hole 21 (the central hole is a rotation axis for installing the heater) of the cavity 2. During the centring operation of the rotary mechanism 1, the cross beam 31 may be fixed above the cavity 2 in any suitable manner, preventing shaking displacement during the centring operation. In the preferred embodiment of the present invention, the beam assembly 3 is provided with a positioning pin 313 engaged with the pin hole of the cavity 2 and a plurality of supporting screws 312 positioned at both ends of the beam 31 for further fixing the beam 31 to the cavity 2. The positioning pins 313 are typically plural. The beam 31 is screwed with the positioning pin 313, and the positioning of the beam 31 is realized by the pin hole cooperation of the positioning pin 313 and the cavity 2. The pin holes in the chamber 2 are used for mounting other components of the device, such as cover rings, and the specific positions and numbers thereof are different according to the devices. For example, in some examples, the pin hole portion of the cavity 2 is located between two cavities 2, and the positioning pin 313 on the beam assembly 3 is located between two positioning grooves 311 of the beam 31, respectively. Through the existing structure on the make full use of equipment, can reduce the damage to equipment, improve installation effectiveness. One of the positioning grooves 311 on the cross beam 31 is used for aligning with the central hole 21 of the cavity 2, and the other is used for installing the reflecting part 92 of the sensor, for example, the reflecting part 92 can be fixed in the installation groove 53 of the cross beam 31 through a plurality of set screws, and the reflecting surface faces the central hole 21 of the cavity 2.
The ball seat assembly 4 is an important part for directly supporting the rotation mechanism 1 to center and clamp the rotation mechanism 1 during centering operation of the rotation mechanism 1, and the structure thereof can be shown in fig. 4, and mainly comprises a ball seat 41 and a plurality of balls 42 with different sizes positioned in the ball seat 41. Specifically, the ball seat 41 includes a support platform 43 and a hollow cylindrical ball frame fixed to the support platform 43. In order to match the tapered posts of the tapered post ball assembly, the ball cage has a radial dimension that tapers from top to bottom (i.e., is in the shape of an inverted cone), and the ball diameters in different radial directions are different. A through hole in the center of the ball frame corresponds up and down to the center hole of the support platform 43, and a plurality of balls 42 having different sizes are mounted on the ball frame. During centering operation, the ball is fitted into the center hole of the rotation mechanism 1, and the ball 42 is in contact with the inner wall of the center hole of the rotation mechanism 1. The circumferential end surface of the support platform 43 may be provided with an upward limit structure 44 to prevent the rotation mechanism 1 from falling off when standing on the surface of the ball seat assembly 4. The whole ball seat 41 can be made of metal materials such as stainless steel, namely the balls 42 can be steel balls, so that the balls 42 can bear a large degree of extrusion.
An exemplary configuration of the tapered stud ball component 5 is shown with reference to fig. 5, and generally includes a tapered stud ball shaft 51. The tapered ball shaft 51 has a tapered column with one end being a spherical surface and the opposite end being a conical surface 56, the conical surface 56 having a radial dimension gradually increasing from top to bottom. The center of the tapered column is provided with a through hole 52 penetrating the tapered column upward. To facilitate mounting with other structures, such as the connection seat 6, a mounting boss 55 extending horizontally and outwardly in a radial direction may be provided in the circumferential direction of the middle of the tapered column, and the mounting boss 55 may be generally T-shaped, and each end surface may be provided as an arc-shaped end surface. The mounting boss 55 is provided with a plurality of mounting holes, for example, 3 mounting holes, but not limited to this number, so long as the number of mounting holes matches the number of connecting pieces on the connecting base 6. In some examples, the tapered post is provided with a mounting groove 53 proximate the spherical end 54, the mounting groove 53 being located proximate the spherical end 54, for example, between the spherical end 54 and a mounting boss 55. The transmitting part 91 of the sensor is fixed in the mounting groove 53 by the screw 57, and the transmitting part 91 is correspondingly positioned in the through hole 52 of the tapered column.
An exemplary configuration of the connection socket 6 may be as shown with reference to fig. 6, which is provided with a recess 61 matching the spherical end 54 of the tapered stud ball stud 51. For connection, as shown in fig. 7 and 8, the connection seat 6 may have a connection table top with a shape substantially the same as that of the mounting boss of the tapered column ball head shaft 51, the groove 61 is disposed on the table top, pin holes matching the number of the mounting holes of the mounting boss are disposed around the groove 61, the tapered column ball head shaft 51 and the connection seat 6 are fixed by a plurality of adjusting screws 62 and through hole cap nuts 63 screwed on the adjusting screws 62, and such a structural design can greatly facilitate fine adjustment in the centering process. The circumference of the connection table top of the connection seat 6 can be provided with an outer edge surface with a height lower than that of the connection table top, a plurality of screw holes are formed in the outer edge surface, and the connection seat 6 is connected with the movable sliding table 7 through screws 64 penetrating through the screw holes.
The movable sliding table 7 is arranged between the connecting seat 6 and the base 8, and the movement of the structure borne on the movable sliding table 7 can be driven by the movement of the movable sliding table 7, so that the position adjustment of the related structure in the centering process is realized. In order to make the overall structure of the centering fixture simpler, in this embodiment, the moving sliding table 7 is preferably a manual X-direction and Y-direction cross sliding table, and a preferred structure example thereof may be shown in fig. 9. As shown in fig. 9, the movable sliding table 7 includes a substantially rectangular horizontal table surface, and a plurality of screw holes are formed in the table surface, and the connecting seat 6 is connected with the movable sliding table 7 by screws penetrating through the screw holes. The lower part of the horizontal table top can be provided with X-direction and Y-direction slide rails, slide blocks sleeved on the slide rails and other structures. The X-direction moving mechanism and the Y-direction moving mechanism can be arranged on two sides of the horizontal table top. The X-direction moving mechanism and the Y-direction moving mechanism comprise a micrometer, the micrometer is connected to the side face of the sliding block, and the sliding block is driven to move on the sliding rail through the micrometer, so that the moving position of the moving sliding table is accurately adjusted. In addition, the micrometer protrudes from the circumference of the horizontal table top to play a limiting role.
The base 8 is disposed at the bottom of the movable sliding table, and the structure thereof can be shown with reference to fig. 10, and comprises a horizontal table top for supporting the movable sliding table 7, wherein the edge of the table top is provided with a pin hole 82 corresponding to the movable sliding table 7, and the movable sliding table 7 is connected with the base 8 by a screw penetrating through the pin hole 82. In a further example, the base 8 is provided with a guide structure 81 extending upwards to limit the lifting mechanism. The guide structure 81 is, for example, two folded plates with vertical corners arranged at intervals on the edge of the table top of the base 8, the upper ends of the two folded plates are in an inverted-L structure, and an interval is arranged between the lower parts of the two folded plates, so that the manual operation of moving the sliding table is facilitated.
In the use process, the lifting of the centering jig can be realized through an external lifting mechanism. In a preferred embodiment of the present invention, the centering fixture further comprises a lifting platform 10 located below the base 8, and thus the base 8 is further provided with screws 83 for connection with the lifting platform 10. The lifting platform is arranged, so that the applicability of the centering jig provided by the invention is further improved. The lifting platform 10 may be one of a straight arm type, a crank arm type, a scissor type, a mast type, etc., and in this embodiment, the scissor type is taken as an example, and the mechanism thereof may be shown in fig. 11. The lifting platform 10 can be used for supporting the rotating mechanism 1, the base 8, the moving sliding table 7 and other mechanisms to lift up and down. The lifting platform 10 may be provided on an electrical box 11 of the apparatus.
The sensor employed in the present embodiment is a reflective sensor, and thus it includes an emitting portion 91 and a reflecting portion 92. The transmitting part 91 is disposed in the through hole 52 of the tapered column, and includes a transmitter and a receiver for transmitting signals and receiving signals reflected by the reflecting part. The reflecting portion 92 is disposed in the positioning slot 311 of the beam 31, and has a reflecting surface for receiving and reflecting the signal emitted from the emitting portion. In a preferred example, the sensor is a laser sensor. The signal emitted from the emitting portion 91, for example, the laser beam is reflected after being incident on the reflecting portion 92, and if the reflected signal is received by the emitting portion 91, it means that the emitting portion 91 and the reflecting portion 92 are on the same straight line without any obstacle therebetween.
Although only the centering operation of the rotating mechanism is described in the present embodiment, in most semiconductor devices, the rotating mechanism and the lifting mechanism are collectively referred to as a rotating lifting mechanism and all require the centering operation, and thus the centering jig provided by the present invention is suitable for installation adjustment. For example, the centering jig provided by the invention can be used for centering a rotating lifting mechanism of the CVD equipment, ensures that the CVD equipment always keeps centering in the rotating lifting process, and is beneficial to improving the film deposition uniformity. The centering jig provided by the invention can also be used for centering a rotating mechanism of UV curing equipment, and is beneficial to improving the heating uniformity of a wafer in the UV curing process.
According to the centering jig provided by the invention, through ingenious design and matching of the modules such as the beam assembly, the ball seat assembly, the conical column ball head shaft assembly, the connecting seat, the movable sliding table and the like, the accurate centering of the rotary mechanism and the center of the cavity can be realized, the error existing only by manual operation can be effectively reduced, the centering accuracy of the rotary mechanism installation is improved, the centering adjustment time is saved, and the working efficiency is improved. In addition, the invention realizes centering by utilizing the reflection principle of the reflection type sensor, can realize zero contact between the centering jig and the cavity and the non-vacuum part of the rotating mechanism, can greatly reduce particle pollution generated in the centering jig and the centering operation process, and is beneficial to improving the production yield of equipment. The centering jig is simple in structure, convenient to use and extremely high in applicability.
In order to make the technical scheme and advantages of the invention more prominent, the assembly and use steps of the centering jig provided by the invention are described in more detail below with reference to the accompanying drawings.
1. The reflection part 92 of the sensor is mounted in the positioning groove 311 of the beam 31 by a screw, and the supporting screw 312 and the beam 31 are mounted;
2. Positioning pins 313 on the cross beam 31 are matched with positioning pin holes of the cavity 2, and supporting screws 312 of the cross beam assembly 3 are supported on the cavity 2;
3. The transmitting part 91 of the laser reflection type sensor is assembled in the mounting groove 53 of the tapered column ball head shaft 51 by using the screw 57, and the sensor is finely adjusted, so that the light beam emitted by the transmitting part 91 passes through the through hole 52 of the tapered column ball head shaft 51;
4. the spherical end 54 of the conical column ball head shaft 51 is seated in the spherical groove 61 of the connecting seat 6, and the conical column ball head shaft 51 and the connecting seat 6 are connected by an adjusting screw 62 and a through hole cover nut 63;
5. the ball seat 41 is assembled with the big ball 42 and sleeved on the conical surface 56 of the conical column ball head shaft 51;
6. Placing the lifting platform 10 on the top cover of the electric box 11;
7. The base 8 is connected with the lifting platform 10 by bolts 83;
8. 4 positioning pins of the manual X and Y-direction cross sliding table are inserted into the pin holes 82 of the base 8, and the movable sliding table is seated on the base 8;
9. The connecting seat 6, the conical column ball head assembly 5 and the ball seat assembly 4 are assembled, and the connecting seat 6 is connected and fastened with the manual cross moving sliding table by using screws;
10. The rotary mechanism 1 is arranged on the ball seat assembly 4, and due to the gravity of the rotary mechanism 1, the balls 42 in the ball seat assembly 4 are extruded by the conical surface 56 of the conical column ball head shaft 51, so that the upper and lower big balls and the small balls center and clamp the rotary mechanism 1, and at the moment, the rotary mechanism 1 and the conical column ball head shaft 51 are centered and clamped;
11. The rotary mechanism 1 is roughly centered with the cavity 2 by moving the cross sliding table;
12. lifting platform 10 is heightened, so that the length of the mounting bolt of rotary mechanism 1 contacts with the mounting threaded hole of cavity 2;
13. the laser reflection type sensor is electrified, and laser beams emitted by the emitting part 91 pass through the through holes 52 of the tapered column ball head shaft 51 and are emitted to the cross beam 31;
14. Adjusting the X and Y axes of the manual cross slide table so that the laser beam passes through the circular hole of the cross beam 31, and the laser beam falls on the reflecting portion 92 of the positioning groove 311 mounted on the cross beam 31;
15. The through hole cover nuts on the three adjusting screws are finely adjusted, when the transmitting part receives the signal reflected by the reflecting part, the central axis of the rotating mechanism 1 is vertical to the reflecting part 92 on the cross beam 31 and is aligned with the round hole of the cross beam 31, and the centering of the rotating mechanism 1 is completed;
16. And (3) heightening the lifting platform 10, and installing threaded holes in the cavity 2 into which the installation bolts of the rotating mechanism 1 are screwed, so that the centering and fastening of the rotating mechanism 1 are completed.
After the centering of the rotation mechanism and the fastening with the cavity are completed, other components such as a heater and the like are mounted on the cavity.
The above description is merely exemplary, and the adaptability adjustment may be performed according to the specific structure of the centering jig, which is not strictly limited.
The invention also provides a centering method of the semiconductor device, which is used for centering the rotating mechanism of the semiconductor device and comprises the following steps:
providing a centering jig as described in any one of the above schemes;
The reflection part 92 of the sensor is arranged in the positioning groove 311 of the cross beam 31, and the cross beam 31 is arranged on the cavity 2 of the semiconductor device, so that the reflection part 92 corresponds to the center of the cavity 2 vertically;
mounting the transmitting part 91 of the sensor on the tapered column ball head shaft 51, and fine-adjusting the sensor so that a signal sent by the transmitting part 91 passes through the through hole 52 of the tapered column ball head shaft 51;
the spherical end 54 of the tapered column ball head shaft 51 is arranged in the groove 61 of the connecting seat 6;
The ball seat 41 is assembled with the big ball 42 and sleeved on the conical surface 56 of the conical column ball head shaft 51;
the movable slipway is arranged on the base 8;
The connecting seat 6 is connected and fastened with the movable slipway;
The rotary mechanism 1 to be centered is placed on the ball seat assembly 4, and due to the gravity of the rotary mechanism 1, the balls 42 in the ball seat assembly 4 are extruded by the conical surface 56 of the conical column ball head shaft 51, and the upper and lower big balls 42 and the small balls 42 center and clamp the rotary mechanism 1 to realize the centering of the rotary mechanism 1;
The height of the rotating mechanism 1 is adjusted, so that the length of a mounting bolt of the rotating mechanism 1 contacts with a mounting threaded hole of the cavity 2;
The sensor is electrified, and a signal sent by the transmitting part 91 passes through the through hole 52 of the tapered column ball head shaft 51 and is shot to the cross beam 31;
Adjusting the moving slide 7 so that the signal emitted from the emitting part 91 of the sensor is directed to the reflecting part 92;
a fine tuning taper-column ball-head shaft assembly 5, which indicates that the centering of the rotating mechanism 1 is completed when the transmitting part receives the reflected signal of the reflecting part;
and adjusting the height of the rotary mechanism 1, screwing the mounting bolts of the rotary mechanism 1 into the mounting threaded holes of the cavity 2, and completing centering and fastening of the rotary mechanism 1.
For further description of the centering fixture and the method for installing the rotating mechanism of the semiconductor device based on the centering fixture, refer to the foregoing, and will not be repeated for the sake of brevity. The method is convenient to operate and is beneficial to reducing the labor cost.
In summary, the centering jig provided by the invention realizes accurate centering of the rotating mechanism and the cavity center through ingenious design and matching of the modules such as the cross beam assembly, the ball seat assembly, the conical column ball head shaft assembly, the connecting seat, the movable sliding table and the like, can effectively reduce errors existing only by manual operation, improves the centering accuracy of the rotating mechanism, saves the centering adjustment time and improves the working efficiency. In addition, the invention realizes centering by utilizing the reflection principle of the reflection type sensor, can realize zero contact between the centering jig and the cavity and the non-vacuum part of the rotating mechanism, can greatly reduce particle pollution generated in the centering jig and the centering operation process, and is beneficial to improving the production yield of equipment. The centering jig is simple in structure, convenient to use and extremely high in applicability. The centering method based on the centering jig is convenient to operate and is beneficial to reducing the labor cost. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A centering jig for a semiconductor device for centering a rotating mechanism of the semiconductor device, comprising: the device comprises a beam assembly, a ball seat assembly, a conical column ball head assembly, a connecting seat, a movable slipway, a base and a reflective sensor; the beam assembly comprises a beam which can be erected on the equipment cavity, and a positioning groove is formed in the beam; the ball seat assembly comprises a ball seat and a plurality of balls with different sizes, wherein the balls are positioned in the ball seat; the cone column ball head assembly comprises a cone column ball head shaft, one end of a cone column of the cone column ball head shaft is a cone surface, the other end of the cone column is a sphere, and a through hole penetrating through the cone column upwards is formed in the center of the cone column; the connecting seat is provided with a groove matched with the spherical end of the ball head shaft of the conical column; the movable sliding table is arranged between the connecting seat and the base; the sensor comprises a transmitting part and a reflecting part, wherein the reflecting part is arranged in a positioning groove of the cross beam, and the transmitting part is arranged in a through hole of the conical column;
When the sensor is used, the reflecting part of the sensor is arranged in the positioning groove of the cross beam, the cross beam is erected on the cavity of the semiconductor device, the transmitting part of the sensor is arranged on the ball head shaft of the cone column, and the spherical end of the ball head shaft of the cone column is arranged in the groove of the connecting seat; the ball seat with assembled balls is sleeved on the conical surface of the ball head shaft of the conical column, the movable sliding table is arranged on the base, and the connecting seat is connected and fastened with the movable sliding table.
2. The centering fixture of claim 1, wherein the cross beam is provided with a support screw and a locating pin that mates with a locating pin hole of the cavity.
3. The centering jig of claim 1, wherein the tapered post is provided with a mounting groove near the spherical end, and the transmitting portion is fixed in the mounting groove by a screw.
4. The centering fixture of claim 1, wherein the tapered stud ball stud and the connection mount are secured by a plurality of adjustment screws and a through hole cap nut threaded onto the adjustment screws.
5. The centering fixture of claim 1, wherein the balls are steel balls, and the ball seats are sleeved on the conical surface ends of the conical columns after the steel balls are assembled in the ball seats.
6. The centering fixture of claim 1, wherein the moving slipway is a manual X and Y-direction cross slipway.
7. The centering jig of claim 1, wherein the base is provided with a guide structure extending upward to limit the lifting mechanism.
8. The centering jig of claim 1, further comprising a lifting platform located below the base.
9. The centering fixture of claim 1, wherein the sensor comprises a laser sensor.
10. A centering method of a semiconductor device for centering a rotating mechanism of the semiconductor device, comprising the steps of:
providing the centering jig of claim 1;
The method comprises the steps that a reflecting part of a sensor is arranged in a positioning groove of a beam, the beam is arranged on a cavity of semiconductor equipment in an erecting mode, and the reflecting part corresponds to the center of the cavity vertically;
mounting the transmitting part of the sensor on the tapered column ball head shaft, and finely adjusting the sensor to enable signals sent by the transmitting part to pass through the through hole of the tapered column ball head shaft;
the spherical end of the ball head shaft of the conical column is arranged in a groove of the connecting seat;
Assembling the ball seat and the big ball and the small ball, and sleeving the ball seat and the big ball on the conical surface of the ball head shaft of the conical column;
the movable slipway is arranged on the base;
The connecting seat is connected and fastened with the movable slipway;
The rotary mechanism to be centered is placed on the ball seat assembly, and balls in the ball seat assembly are extruded by the conical surface of the ball head shaft of the conical column due to the gravity of the rotary mechanism, and the upper large balls and the lower small balls center and clamp the rotary mechanism to realize the centering of the rotary mechanism;
the height of the rotating mechanism is adjusted, so that the length of a mounting bolt of the rotating mechanism is contacted with a mounting threaded hole of the cavity;
The sensor is electrified, and a signal sent by the transmitting part passes through the through hole of the ball head shaft of the cone column and is shot to the cross beam;
Adjusting the movable slipway to enable the emission signal of the emission part to be aligned with the reflection part;
the fine tuning taper column ball head shaft assembly indicates that the centering of the rotating mechanism is completed when the transmitting part receives the reflection signal of the reflecting part;
and adjusting the height of the rotating mechanism, screwing the mounting bolt of the rotating mechanism into the mounting threaded hole of the cavity, and completing centering and fastening of the rotating mechanism.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012189603A (en) * | 2012-05-14 | 2012-10-04 | Chuden Plant Co Ltd | Laser irradiation device |
| CN206638167U (en) * | 2017-03-17 | 2017-11-14 | 长春工业大学 | Large apertures system laser centring device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19858428C2 (en) * | 1998-12-17 | 2002-09-12 | Leica Microsystems | Coordinate-measuring arrangement |
| US8110775B2 (en) * | 2004-06-18 | 2012-02-07 | Electro Scientific Industries, Inc. | Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing |
| TWI284214B (en) * | 2005-08-25 | 2007-07-21 | Jeng-Hung Wang | Jig for precisely assembling optical lens and method thereof |
| US9371584B2 (en) * | 2011-03-09 | 2016-06-21 | Applied Materials, Inc. | Processing chamber and method for centering a substrate therein |
| DE112017000083T5 (en) * | 2016-03-18 | 2018-04-26 | Fuji Electric Co., Ltd. | SEMICONDUCTOR DEVICE, METAL ELECTRODE ELEMENT AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE |
| CN106226152B (en) * | 2016-07-08 | 2018-06-01 | 吉林大学 | Material mechanical property in-situ tests System and method under quiet Dynamic Load Spectrum |
| LU502142B1 (en) * | 2022-04-29 | 2022-12-19 | Suzhou Keyiying Information Tech Co Ltd | Portable security and protection lifting platform |
| CN115831843B (en) * | 2022-11-23 | 2024-06-18 | 中科长光精拓智能装备(苏州)有限公司 | Precise alignment device and method for semiconductor flip-chip technology |
| CN116295003B (en) * | 2023-02-16 | 2023-12-01 | 苏州艾微视图像科技有限公司 | Jig calibration device and calibration method |
| CN116682774B (en) * | 2023-07-27 | 2023-12-22 | 深圳市立可自动化设备有限公司 | Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012189603A (en) * | 2012-05-14 | 2012-10-04 | Chuden Plant Co Ltd | Laser irradiation device |
| CN206638167U (en) * | 2017-03-17 | 2017-11-14 | 长春工业大学 | Large apertures system laser centring device |
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