CN118404491B - Polishing pad surface treatment device and method - Google Patents
Polishing pad surface treatment device and method Download PDFInfo
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- CN118404491B CN118404491B CN202410868200.2A CN202410868200A CN118404491B CN 118404491 B CN118404491 B CN 118404491B CN 202410868200 A CN202410868200 A CN 202410868200A CN 118404491 B CN118404491 B CN 118404491B
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- flow blocking
- polishing
- polishing pad
- liquid
- flushing
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- 238000005498 polishing Methods 0.000 title claims abstract description 320
- 238000004381 surface treatment Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000000903 blocking effect Effects 0.000 claims abstract description 236
- 239000007788 liquid Substances 0.000 claims abstract description 153
- 239000002245 particle Substances 0.000 claims abstract description 96
- 238000011010 flushing procedure Methods 0.000 claims abstract description 71
- 239000012530 fluid Substances 0.000 claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims description 57
- 239000007921 spray Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 21
- 239000002002 slurry Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000007792 addition Methods 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000009991 scouring Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention provides a polishing pad surface treatment device and a polishing pad surface treatment method, belongs to the technical field of wafer polishing, and solves the problem that large particles on a polishing pad in the prior art are difficult to treat. The invention is applied to a polishing disk, wherein a polishing pad is arranged on the polishing disk and used for bearing polishing liquid, and the processing device comprises an image acquisition assembly, a first flow blocking assembly, a second flow blocking assembly and a flushing assembly. According to the invention, the flow blocking wall and the flow blocking piece are enclosed to form the flow blocking area to prevent the polishing solution containing large particles from being mixed into clean polishing solution, and the polishing solution with the large particles in the flow blocking area is discharged out of the polishing pad by utilizing the flushing component, so that the polishing sheet and the polishing pad are not easy to damage during polishing, and the polishing sheet quality is improved; the flow blocking wall constructed by the fluid is not a hard part, so that large particles are prevented from being mixed into clean polishing liquid and the polishing pad is not damaged; by rotating the flow blocking piece, the liquid outlet on the flow blocking piece can be transferred to other areas, so that the flow blocking area is closed.
Description
Technical Field
The invention belongs to the technical field of wafer polishing, and particularly relates to a polishing pad surface treatment device and a polishing pad surface treatment method.
Background
Polishing plays an important role in the semiconductor processing technology, and polishing can realize mirror surface of the polished wafer and improve the flatness of the polished wafer.
Currently, polishing devices generally include a polishing head on which a polishing sheet to be polished is carried, and a polishing disk on which a polishing pad is disposed. Before polishing starts, a layer of polishing liquid needs to be supplied to the polishing pad as an auxiliary polishing agent, and larger particles possibly exist in the polishing liquid, so that polishing sheets and the polishing pad are easily worn during polishing.
In the prior art, the surface of the polishing pad can be detected after the polishing liquid is distributed, if larger particles exist in the polishing liquid, the polishing liquid layer is required to be removed and then distributed again, and the polishing process is carried out after the detection is qualified. However, this method requires a high level of polishing liquid and is prone to waste of polishing liquid.
Based on the above, the technical problems to be solved by the application are as follows: how to treat large particles on the polishing pad.
Disclosure of Invention
The application aims at solving the problems in the prior art, and provides a polishing pad surface treatment device and a polishing pad surface treatment method, which solve the problem that large particles on the surface of a polishing pad in the prior art are not easy to treat. The technical effects of the scheme of the application are as follows: large particles on the polishing pad can be treated, and waste of polishing liquid is avoided.
The aim of the invention can be achieved by the following technical scheme: a polishing pad surface treatment device applied to a polishing disk, the polishing disk being provided with a polishing pad for carrying a polishing liquid, the treatment device comprising: the image acquisition component is arranged above the polishing pad and can be projected downwards to the upper surface of the polishing pad to acquire image information; a first flow blocking assembly, the first flow blocking assembly comprising: a fluid supply tube disposed above the polishing pad, the fluid supply tube having a fluid outlet directed toward the polishing pad for ejecting a fluid to form a flow blocking wall; the first driving mechanism is arranged on the fluid supply pipe, is electrically/communicatively connected with the image acquisition assembly, and acts on the fluid supply pipe to drive the fluid supply pipe to form flow blocking walls with different positions; a second flow blocking assembly, the second flow blocking assembly comprising: the flow blocking piece is movably arranged on the periphery of the polishing disk, and forms a flow blocking area together with the flow blocking wall, and the flow blocking area is provided with a liquid outlet; the second driving mechanism is arranged below the flow blocking piece, is electrically/communicatively connected with the image acquisition assembly or the first driving mechanism, and acts on the flow blocking piece to drive the flow blocking piece to circumferentially rotate along the periphery of the polishing pad; and a flush assembly, the flush assembly comprising: the flushing piece is arranged above the polishing pad and is provided with a flushing port, and the flushing port can spray flushing fluid; and the third driving mechanism is arranged on the flushing piece, is electrically/communicatively connected with the image acquisition assembly, and acts on the flushing piece to drive the flushing piece to move to the flow blocking area and enable the flushing port to face the liquid outlet.
The polishing liquid is supplied to the polishing pad, the image acquisition component is configured as a high-precision CCD camera, the CCD camera is utilized to shoot the surface of the polishing pad, the information such as pixel outline, color depth and the like of the shot image is traversed, whether large particles in the polishing liquid exist or not is judged, if the large particles exist, the position distribution of the large particles is determined, if the large particles do not exist, a polishing head of the polishing device can bear a wafer to press down onto the polishing pad, and polishing operation is performed. It will be appreciated that when large particles are present in the slurry, the operator cannot rely on visual recognition to manually remove the particles, and therefore, with the information sent by the CCD camera, the flushing assembly can be precisely positioned to flush the large particles in the corresponding location out of the polishing pad. It should be noted that the fluid supply tube in the first flow blocking assembly preferably supplies a gas to avoid dilution of the polishing particle concentration in the polishing liquid, and the flow blocking wall formed by the flow blocking assembly is a flow wall constructed so as not to damage the surface of the polishing pad, and the polishing pad can be divided into a plurality of areas so as to prevent the polishing liquid containing large particles from being washed and mixed into the areas not containing large particles when the washing assembly washes. The first driving mechanism in the first choke assembly is used for adjusting the position of the fluid supply pipe, so that a choke wall formed by the first driving mechanism is matched with the area where the large particles are located. The flow blocking piece in the second flow blocking assembly is made of hard materials and is arranged on the periphery of the polishing pad, so that polishing liquid is prevented from being influenced by the flow blocking wall to extend out of the polishing pad Zhou Yichu. The second driving mechanism in the second choke assembly drives the choke piece to move so that the choke piece can adapt to the pose of the choke wall and form a choke zone in a matched mode. The liquid outlet of the flow blocking area is used for discharging polishing liquid containing large particles. The flushing member of the flushing assembly supplies flushing fluid, the flushing fluid comprises liquid and/or gas, preferably dry hot air flow, and the flushing mode starts to flush from the midpoint of the flow blocking wall to two sides until the polishing liquid and the particulate matters in the flow blocking area are flushed out of the polishing pad from the liquid outlet. It can be understood that the minimum inner diameter of the liquid outlet is preferably not smaller than the inner diameter of the flushing port of the flushing member, so that the cleaning efficiency is prevented from being influenced.
In the polishing pad surface treatment device, the fluid supply pipe comprises at least 2 spray pipes, at least 2 spray pipes are respectively provided with the fluid outlets, and the first driving mechanisms are a plurality of and respectively correspond to the spray pipes one by one so as to respectively drive the spray pipes to move to form flow blocking walls in different positions.
It can be understood that through setting up at least 2 spray tubes, and set up corresponding first actuating mechanism for each spray tube respectively, each first actuating mechanism drives corresponding spray tube motion respectively, both can produce the flow blocking wall of multiple position appearance, can conveniently control the flow blocking wall simultaneously with the enclose of flow blocking piece and close regional position and size. Furthermore, the spray pipes can be hinged, so that the flow blocking wall is clung to the spray pipes, and the enclosing is convenient to realize.
In the polishing pad surface treatment device, the fluid supply pipe is a hose, the hose comprises at least 2 supply sections, at least 2 supply sections are respectively provided with the fluid outlets, and the first driving mechanisms are 2 and respectively correspondingly drive the supply sections to move to form the flow blocking walls with different positions.
It will be appreciated that in some embodiments, since the fluid supply pipe is configured as a hose, a fluid inlet may be disposed in the middle of the hose, and two sides of the hose are divided into a plurality of supply sections, and each supply section is driven to move by a corresponding first driving mechanism, so that a choke wall with multiple positions can be generated.
In the polishing pad surface treatment device, the flow blocking piece is in an open loop shape, the liquid outlet is arranged on the flow blocking piece, and the second driving mechanism can drive the flow blocking piece to move so that the liquid outlet faces the flow blocking wall.
It will be appreciated that in some embodiments, the flow-blocking member is a single body and is open-loop, with the remainder being closed except for the outlet, to prevent slurry that does not contain large particles from escaping the polishing pad. The second driving mechanism comprises a motor, a transmission part is vertically connected to an output shaft of the motor, and the motor is connected with the flow blocking part through the transmission part, so that the motor can drive the flow blocking part to rotate around the circumference of the polishing pad until a liquid outlet on the flow blocking part is opposite to the flow blocking wall.
In the polishing pad surface treatment device, the flow blocking piece comprises a plurality of arc-shaped flow blocking sections, the second driving mechanism is arranged in a plurality of one-to-one correspondence with the flow blocking sections respectively, so that the flow blocking sections and the flow blocking walls are respectively driven to enclose to form the flow blocking areas, and at least one gap is formed between the flow blocking sections to form the liquid outlet.
It will be appreciated that in some embodiments, the flow blocking member includes a plurality of arc-shaped flow blocking sections, each arc-shaped flow blocking section is circumferentially distributed around the periphery of the polishing pad, and by configuring each flow blocking section with a corresponding second driving mechanism, the corresponding flow blocking sections are respectively driven to circumferentially move around the periphery of the polishing pad, the moved flow blocking sections can be enclosed with the flow blocking wall to form a flow blocking area, and a gap is reserved between the flow blocking sections to form a liquid outlet of the flow blocking area.
In the polishing pad surface treatment device, an annular guide rail is arranged on the periphery of the polishing pad, and the flow blocking section is arranged on the annular guide rail. It can be appreciated that by arranging the annular guide rail, the precision of circumferential rotation of the choke section around the polishing pad can be ensured, so that the tightness of the choke area formed by surrounding the choke wall is improved.
Another object of the present application is to provide a polishing pad surface treatment method, which is applied to the polishing pad surface treatment apparatus, comprising the steps of: acquiring image information of the upper surface of a polishing pad provided with polishing liquid; determining the distribution position of large particles in the polishing solution based on the image information; constructing a flow blocking wall based on the distribution position of large particles in the polishing solution and forming a flow blocking area by matching with a flow blocking piece; and flushing the polishing liquid in the flow blocking area out of the polishing pad.
It can be understood that the particle size of large particles in the polishing solution is generally in the micron level, and the surface of the polishing pad is photographed by a CCD camera with the same high precision, so that corresponding image information is obtained, the distribution position of the large particles can be obtained by analyzing the image information, a flow blocking wall can be constructed in a corresponding area on the surface of the polishing pad based on the distribution position of the large particles, and a flow blocking area is formed by surrounding the flow blocking part on the periphery, and the large particles and the polishing solution thereof are flushed out of the polishing pad through a flushing part in the flow blocking area, so that the abrasion of the polishing sheet or the polishing pad in the subsequent polishing process is reduced, and the polishing quality is improved.
In the above polishing pad surface treatment method, the "determining the distribution position of large particles in the polishing liquid based on the image information" specifically includes: and judging whether large particles with the particle size larger than a set threshold exist or not based on the pixel outline and the color depth in the image information, and determining the position coordinates of each large particle on the polishing pad.
It can be appreciated that the color depth of the polishing pad is different from the color depth of the polishing liquid and the large particles, and the outline of the large particles is obviously different from the polishing pad, so that the storage amount and the position coordinates of the large particles are comprehensively judged through the pixel outline and the color depth in the image information.
In the above polishing pad surface treatment method, the "constructing a choke wall and forming a choke area in cooperation with a choke piece based on a distribution position of large particles in a polishing liquid" specifically includes: and constructing a flow blocking wall of a corresponding pose based on the position coordinates of each large particle on the polishing pad, and controlling the flow blocking piece to rotate by a corresponding angle so as to form a flow blocking area by surrounding the flow blocking wall.
It will be appreciated that the included angle and position of the flow blocking wall can be adjusted, when large particles are concentrated in a smaller area, the included angle of the flow blocking wall can be reduced, and when the area where the large particles are concentrated is close to the periphery of the polishing pad, the size of the flow blocking wall can be adaptively reduced, so that the position of the flow blocking wall is also close to the periphery of the polishing pad or the flow blocking piece, thereby reducing the scouring amount of the polishing liquid.
It should be noted that when the distribution of the large particles in the polishing solution is relatively loose, for example, the large particles on the polishing pad M are at least three distribution areas, the centers of the at least three distribution areas are connected to form a polygon, the center of the polishing pad M is located in the polygon, and additionally, a plurality of first driving mechanisms can be used to control the end-to-end connection of the hoses respectively so as to construct a closed flow blocking wall, the movement of the hoses is controlled so as to gather the polishing solution in the flow blocking wall to the end, close to the flow blocking piece, of the polishing solution on the polishing pad, then the end-to-end separation of the hoses is controlled so as to reconstruct the flow blocking wall, and the flow blocking area is formed by matching with the adjacent parts on the flow blocking piece, so that the polishing solution can be discharged from the liquid outlet of the flow blocking area X.
The polishing pad surface treatment method further comprises the following steps: based on the liquid outlet position of the flow blocking area, a liquid receiving device is arranged to receive the flushed polishing liquid. It can be understood that the liquid receiving device is arranged outside the liquid outlet, so that the flushed polishing liquid can be collected, and the filtering is performed again to realize the recycling. In some embodiments, the liquid receiving device may be an annular liquid receiving tank, and the annular liquid receiving tank can receive liquid without moving to align with the liquid receiving port. In some embodiments, the liquid receiving device comprises a movable liquid receiving hopper and a driving piece for driving the liquid receiving hopper to move, so that the liquid receiving hopper moves along the periphery of the polishing pad in a circumferential direction to align with the liquid outlet.
The polishing pad surface treatment method further comprises the following steps:
controlling the flow blocking piece to rotate so as to form a flow blocking area without a liquid outlet by matching with the flow blocking wall;
adding polishing solution into the choked flow area without the liquid outlet;
Homogenizing the polishing solution in the choked flow area without the liquid outlet;
Decomposing the choke wall.
It will be appreciated that in some embodiments, by closing the flow blocking area, the polishing liquid can be added again, and the added polishing liquid is homogenized, so that the plane uniformity of the polishing sheet processing is ensured, and after the flow blocking wall is decomposed, the polishing head of the polishing device can be put on the polishing pad to perform polishing work.
In the above polishing pad surface treatment method, before the step of adding the polishing liquid into the flow blocking area without the liquid outlet, the method further comprises: and determining the addition amount of the polishing liquid to be added into the choke zone without the liquid outlet based on the area in the choke zone and the polishing liquid depth outside the choke zone. It is understood that, since the areas of the inner side and the outer side of the choke area can be calculated, and the depth of the outer side of the choke area can be obtained through the image information, the addition amount of the polishing liquid can be calculated, so that the depth of the inner side of the choke area is easily controlled to be substantially identical to the depth of the outer side of the choke area.
In the above polishing pad surface treatment method, the "decomposing flow blocking wall" specifically includes: the fluid supply flow rate of the fluid supply pipe is gradually reduced until the supply is stopped. It will be appreciated that the slurry near the flow blocking wall may be stabilized by gradually reducing the fluid supply flow rate, and the slurry depth on both sides of the flow blocking wall may be made uniform.
In the above polishing pad surface treatment method, the "homogenizing the polishing liquid in the choke zone without liquid outlet" specifically includes: the choke zone without a liquid outlet is divided into a plurality of small areas, and uniform air flow is respectively applied to each small area so as to blow away the polishing liquid and homogenize the polishing liquid. It is understood that the distribution of the polishing liquid can be accelerated by the uniform air flow and is uniformly distributed.
Compared with the prior art, the invention has the following beneficial effects:
1. According to the application, the flow blocking wall and the flow blocking piece are enclosed to form the flow blocking area, and the scouring component is utilized to discharge the polishing liquid with large particles in the flow blocking area out of the polishing pad, so that the polishing sheet and the polishing pad are not easy to damage during polishing, and the polishing sheet quality is improved;
2. according to the application, through the non-hard part of the flow blocking wall constructed by the fluid, large particles are prevented from being mixed into clean polishing liquid, and meanwhile, the polishing pad is not damaged;
3. According to the application, through the image information acquired by the image acquisition component, the pose of the flow blocking wall can be correspondingly changed by matching with the first driving mechanism, so that flow blocking areas with different sizes and positions are formed, and the flushing component can quickly flush large particles out of the polishing pad;
4. according to the application, the flow blocking piece is rotated, so that a liquid outlet on the flow blocking piece can be transferred to other areas, thereby closing the flow blocking area, facilitating the re-addition of polishing liquid and preventing overflow from the peripheral edge of the polishing pad;
5. according to the application, the fluid supply pipe is driven by the first driving mechanism, so that large particles dispersed in different areas on the polishing pad are gathered, the flushing area is reduced, and the waste of polishing liquid is reduced.
Drawings
FIG. 1 is a schematic view showing the structure of a first embodiment of a polishing pad surface treating apparatus according to the present invention;
FIG. 2 is a schematic view showing a partial structure of a first embodiment of the polishing pad surface treating apparatus of the present invention;
FIG. 3 is a schematic view showing a partial structure of a second embodiment of the polishing pad surface treating apparatus of the present invention;
FIG. 4 is a schematic view showing a part of the structure of a third embodiment of a polishing pad surface treating apparatus according to the present invention;
FIG. 5 is a schematic view showing a part of a surface treatment apparatus for polishing pad according to a third embodiment of the present invention;
FIG. 6 is a schematic view of the structure of a first embodiment of the fluid supply tube of the present invention;
FIG. 7 is a schematic view of a second embodiment of a fluid supply tube of the present invention;
FIG. 8 is a simplified schematic structural view of a flushing assembly of the present invention;
FIG. 9 is a schematic flow chart of a method for treating a polishing pad surface according to the present invention;
FIG. 10 is a second flow chart of the polishing pad surface treatment method of the present invention;
In the figure, D, polishing disc; m, polishing pad; x, choke area; 100. an image acquisition component; 200. a first choke assembly; 210. a fluid supply tube; 211. a spray pipe; 212. a fluid outlet; 213. a supply section; 214. a choke wall; 220. a first driving mechanism; 221. a first motor; 222. a connecting piece; 300. a second choke assembly; 310. a flow blocking member; 311. a liquid outlet; 312. a choke section; 320. a second driving mechanism; 321. a second motor; 322. a transmission member; 330. an annular guide rail; 400. flushing the assembly; 410. a flushing member; 411. flushing the mouth; 420. and a third driving mechanism.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1 and 2 of the drawings, the polishing pad M surface treatment apparatus of the present application is applied to a polishing disk D, on which a polishing pad M is disposed, and the polishing pad M is used for carrying a polishing liquid, and the treatment apparatus includes an image acquisition assembly 100, a first flow blocking assembly 200, a second flow blocking assembly 300, and a flushing assembly 400. The image capturing assembly 100 is disposed above the polishing pad M and can be projected downward onto the upper surface of the polishing pad M to capture image information. The first choke assembly 200 includes a fluid supply tube 210 disposed above the polishing pad M and having a fluid outlet 212, the fluid outlet 212 facing the polishing pad M and being capable of ejecting fluid to form a choke wall 214, and a first driving mechanism 220 disposed on the fluid supply tube 210 and electrically/communicatively connected to the image capturing assembly 100 and acting on the fluid supply tube 210 to drive the fluid supply tube 210 to form the choke wall 214 in different positions. The second choke assembly 300 includes a choke 310 and a second driving mechanism 320, the choke 310 is movably disposed on the outer periphery of the polishing disk D, the choke 310 and the choke wall 214 enclose together to form a choke area X, the choke area X has a liquid outlet 311, and the second driving mechanism 320 is disposed below the choke 310, is electrically connected/communicatively connected to the image capturing assembly 100 or the first driving mechanism 220, and acts on the choke 310 to drive the choke 310 to rotate along the outer periphery of the polishing pad M. Referring to fig. 1 and 8, the flushing assembly 400 includes a flushing member 410 and a third driving mechanism 420, the flushing member 410 is disposed above the polishing pad M and has a flushing port 411, the flushing port 411 can eject a flushing fluid, and the third driving mechanism 420 is disposed on the flushing member 410, electrically/communicatively connected to the image acquisition assembly 100, and acts on the flushing member 410 to drive the flushing member 410 to move into the flow blocking area X and to make the flushing port 411 face the liquid outlet 311.
Before the polishing pad M processing apparatus of the present invention is operated, a polishing liquid is supplied onto the polishing pad M, and then the polishing pad M is monitored by the image acquisition assembly 100. The image capturing assembly 100 is configured as a high-precision CCD camera, and the surface of the polishing pad M is photographed by the CCD camera, and the information such as the pixel profile, the color depth, etc. of the photographed image is traversed to determine whether large particles in the polishing liquid exist, and if so, the position distribution of the large particles is determined, and if not, the polishing head of the polishing apparatus can bear the wafer and press the wafer onto the polishing pad M, and perform the polishing operation. It will be appreciated that when large particles are present in the slurry, the operator cannot rely on visual recognition to manually remove the particles, and therefore, with the information sent by the CCD camera, the flushing assembly 400 can be precisely positioned to flush the large particles in the corresponding locations out of the polishing pad M. It should be noted that the fluid supply pipe 210 of the first flow blocking assembly 200 preferably supplies a gas, so that the concentration of polishing particles in the polishing liquid is prevented from being diluted, and the flow blocking wall 214 is formed as a flow wall constructed so as not to damage the surface of the polishing pad M, and the polishing pad M is divided into a plurality of regions, thereby preventing the polishing liquid portion containing large particles from being flushed and mixed into the region containing no large particles when the flushing assembly 400 flushes. The first driving mechanism 220 in the first choke assembly 200 is used for adjusting the pose of the fluid supply pipe 210, and illustratively, the first driving mechanism 220 includes a first motor 221 and a connecting piece 222, an output shaft on the first motor 221 acts on the connecting piece 222, the connecting piece 222 is connected with the fluid supply pipe 210, so that the output shaft of the first motor 221 rotates to drive the fluid supply pipe 210 to rotate, and the choke wall 214 formed by the fluid supply pipe 210 is matched with the area where large particles are located. The flow blocking member 310 of the second flow blocking assembly 300 is made of a hard material, and the flow blocking member 310 is disposed at the outer periphery of the polishing pad M, so as to prevent the polishing liquid from flowing out of the outer periphery of the polishing pad M due to the action of the flow blocking wall 214. The second driving mechanism 320 in the second choke assembly 300 includes a second motor 321, a transmission member 322 is connected to an output shaft of the second motor 321, the transmission member 322 is meshed with the choke 310, and the second motor 321 drives the choke 310 to move, so that the choke 310 can adapt to the pose of the choke wall 214 to form the choke zone X in a matching manner. The liquid outlet 311 of the choke zone X is used for discharging polishing liquid containing large particles. Illustratively, the third drive mechanism 420 of the flush assembly 400 includes a movable arm (not shown) having multiple degrees of freedom for movement in multiple directions and coupled to the flush member 410 to move the flush member 410 in multiple directions. The flushing member 410 of the flushing assembly 400 is supplied with a flushing fluid, which includes a liquid and/or a gas, preferably a dry hot gas flow, in a manner that the flushing starts from the midpoint of the flow blocking wall 214 to the two sides until the polishing liquid and the particles thereof in the flow blocking area X are flushed out of the polishing pad M through the liquid outlet 311. It is understood that the minimum inner diameter of the liquid outlet 311 is preferably not smaller than the inner diameter of the flushing port 411 of the flushing member 410, so as to avoid affecting the cleaning efficiency.
With continued reference to FIG. 1, in some embodiments, the polishing pad M is peripherally provided with an annular rail 330, and the flow blocking section 312 is disposed on the annular rail 330. It will be appreciated that by providing the annular guide 330, the accuracy of the circumferential rotation of the choke section 312 about the polishing pad M can be ensured, thereby improving the tightness of the choke area X after being enclosed with the choke wall 214.
Referring to fig. 1 to 3, in some embodiments, the flow blocking member 310 includes a plurality of arc-shaped flow blocking sections 312, the second driving mechanism 320 is disposed in a plurality of arc-shaped flow blocking sections 312 and is in one-to-one correspondence with the plurality of arc-shaped flow blocking sections 312, so as to respectively drive the flow blocking sections 312 and the flow blocking wall 214 to enclose a flow blocking area X, and at least one gap is formed between the plurality of arc-shaped flow blocking sections 312 to form the liquid outlet 311. It can be appreciated that the flow blocking piece 310 includes a plurality of arc-shaped flow blocking sections 312, each arc-shaped flow blocking section 312 is circumferentially distributed around the periphery of the polishing pad M, and by configuring each flow blocking section 312 with a corresponding second driving mechanism 320, the corresponding flow blocking sections 312 are respectively driven to circumferentially move around the periphery of the polishing pad M, the moved flow blocking sections 312 can be enclosed with the flow blocking wall 214 to form a flow blocking area X, and a gap is reserved between the flow blocking sections 312 to form the liquid outlet 311 of the flow blocking area X.
Referring to fig. 4 and 5, in some embodiments, the flow blocking member 310 is in an open loop shape, and the liquid outlet 311 is disposed on the flow blocking member 310, and the second driving mechanism 320 can drive the flow blocking member 310 to move such that the liquid outlet 311 faces the flow blocking wall 214. It will be appreciated that the flow blocking member 310 is a single body and is open-loop, and the remainder is closed except for the liquid outlet 311 to prevent the slurry that does not contain large particles from overflowing the polishing pad M. The second driving mechanism 320 includes a second motor 321, an output shaft of the second motor 321 is vertically connected with a transmission member 322, and an outer periphery of the transmission member 322 is meshed with an outer periphery of the flow blocking member 310, so that the second motor 321 can drive the flow blocking member 310 to rotate circumferentially around the polishing pad M until a liquid outlet 311 on the flow blocking member 310 is opposite to the flow blocking wall 214.
Referring to fig. 6, in some embodiments, the fluid supply pipe 210 includes at least 2 nozzles 211, at least 2 nozzles 211 each have a fluid outlet 212, and the first driving mechanisms 220 are plural and respectively correspond to the nozzles 211 one by one, so as to respectively drive the nozzles 211 to form the flow blocking walls 214 with different positions. It can be appreciated that by providing at least 2 nozzles 211 and providing corresponding first driving mechanisms 220 for each nozzle 211, each first driving mechanism 220 drives the corresponding nozzle 211 to move, so that the choke wall 214 with various positions can be generated, and the position and the size of the surrounding area of the choke wall 214 and the choke piece 310 can be controlled conveniently. Further, the nozzles 211 may be hinged, so that the choke wall 214 is tightly attached to facilitate enclosing.
Referring to fig. 7, in some embodiments, the fluid supply pipe 210 is a hose, the hose includes at least 2 supply sections 213, at least 2 supply sections 213 each have a fluid outlet 212, and the first driving mechanism 220 is 2 and respectively drives the flow blocking walls 214 of the supply sections 213 to move to form different positions. It can be appreciated that, since the fluid supply pipe 210 is configured as a hose, a fluid inlet may be disposed in the middle of the hose, two sides of the hose are divided into a plurality of supply sections 213, and the respective supply sections 213 are driven to move by the corresponding first driving mechanism 220, so that the choke wall 214 with various positions can be generated.
It should be noted that when the distribution of the large particles on the polishing pad M is detected to be loose, for example, the large particles on the polishing pad M are at least three distributed areas, the centers of the at least three distributed areas are connected to form a polygon, the center of the polishing pad M is located in the polygon, and additionally, the first driving mechanisms 220 can be used to control the end-to-end connection of the hoses respectively to construct the closed flow blocking wall 214, the movement of the hoses is controlled to gather the polishing solution in the flow blocking wall 214 to the end of the polishing pad M near the flow blocking member 310, and then the end-to-end separation of the hoses is controlled to reconstruct the flow blocking wall 214, and the flow blocking area X is formed in cooperation with the adjacent part on the flow blocking member 310, so that the polishing solution can be discharged from the liquid outlet 311 of the flow blocking area X. In some extreme cases, when the distribution of the large particles in the polishing liquid is very loose, and the polygon formed by connecting the centers of the distribution areas of the peripheral large particles occupies 1/2 or more of the area of the polishing pad M, and the polygon still has a set amount of large particles therein, the polishing liquid on the polishing pad M is completely flushed out of the polishing pad M directly through the flushing assembly 400. Regarding the selection application of the hose and the nozzle 211, the determination can be made based on the image information of the CCD camera, the plurality of straight nozzles 211 can be applied to the scene with smaller large particle distribution area, and the first driving mechanism 220 is more convenient to control, the hose is more flexible and is applicable to the scene with more dispersed large particles, but the time for constructing the fluid wall is longer than the driving control of the nozzle 211, so that the two fluid supply pipes 210 can be simultaneously applied, and the corresponding selection can be made according to the distribution situation of the large particles.
Referring to fig. 8, the flushing assembly 400 includes a flushing member 410 and a third driving mechanism 420, wherein the flushing member 410 is disposed above the polishing pad M and has a flushing port 411, the flushing port 411 can spray flushing fluid, and the third driving mechanism 420 is disposed on the flushing member 410, electrically/communicatively connected with the image acquisition assembly 100, and acts on the flushing member 410 to drive the flushing member 410 to move into the flow blocking area X and make the flushing port 411 face the liquid outlet 311.
Referring to fig. 9, the polishing pad M surface treatment method of the present application, which applies a polishing pad M surface treatment apparatus, includes the steps of:
s100, acquiring image information of the upper surface of a polishing pad M provided with polishing liquid;
s200, determining distribution positions of large particles in the polishing solution based on image information;
s300, constructing a flow blocking wall 214 based on the distribution position of large particles in the polishing solution and forming a flow blocking area X by matching with a flow blocking piece 310;
S400, flushing the polishing solution in the flow blocking area X out of the polishing pad M.
It can be understood that the particle size of the large particles in the polishing solution is generally in the micron level, the surface of the polishing pad M is photographed by a CCD camera with the same high precision, so that corresponding image information is obtained, the distribution position of the large particles can be obtained by analyzing the image information, the flow blocking wall 214 can be constructed in the corresponding area of the surface of the polishing pad M based on the distribution position of the large particles, and the flow blocking area X is enclosed by the flow blocking piece 310 on the periphery, so that the large particles and the polishing solution thereof are flushed out of the polishing pad M through the flushing piece 410 in the flow blocking area X, thereby reducing the abrasion of the polishing sheet or the polishing pad M in the subsequent polishing process and improving the polishing quality.
In some embodiments, "S200, determining the distribution position of large particles in the polishing liquid based on the image information" specifically includes: s210, based on pixel outline and color depth in the image information; s220, judging whether large particles with particle sizes larger than a set threshold exist or not; s230, determining the position coordinates of each large particle on the polishing pad M. It can be understood that the color depth of the polishing pad M is different from the color depth of the polishing liquid and the large particles, and the outline of the large particles is obviously different from the polishing pad M, so that the storage amount and the position coordinates of the large particles are comprehensively determined by the pixel outline and the color depth in the image information.
In some embodiments, "constructing the choke wall 214 and forming the choke area X in cooperation with the choke 310 based on the distribution position of the large particles in the polishing liquid" specifically includes: based on the position coordinates of each large particle on the polishing pad M, the flow blocking wall 214 of the corresponding pose is constructed, and the flow blocking piece 310 is controlled to rotate by the corresponding angle so as to enclose the flow blocking wall 214 to form the flow blocking area X.
It will be appreciated that by adjusting the included angle and the position of the flow blocking wall 214, when large particles are concentrated in a smaller area, the included angle of the flow blocking wall 214 can be reduced, and when the area where large particles are concentrated is close to the periphery of the polishing pad M, the size of the flow blocking wall 214 can be adaptively reduced, so that the position of the flow blocking wall 214 is also close to the periphery of the polishing pad M or the flow blocking member 310, thereby reducing the flushing amount of the polishing liquid.
In some embodiments, the method further comprises the steps of: s500, a liquid receiving device (not shown in the figure) is arranged to receive the flushed polishing liquid based on the position of the liquid outlet 311 of the flow blocking area X. It can be understood that the liquid receiving device is arranged outside the liquid outlet 311, so that the flushed polishing liquid can be collected, and then filtered for recycling. In some embodiments, the liquid receiving device may be an annular liquid receiving tank, and the annular liquid receiving tank can receive liquid without moving to align with the liquid receiving port. In some embodiments, the liquid receiving device comprises a movable liquid receiving hopper and a driving piece for driving the liquid receiving hopper to move, so that the liquid receiving hopper moves along the circumference of the polishing pad M to align with the liquid outlet 311.
Referring to fig. 10, in some embodiments, the method further comprises the steps of: s600, controlling the flow blocking piece 310 to rotate so as to form a flow blocking area X without a liquid outlet 311 in cooperation with the flow blocking wall 214; s700, adding polishing solution into the choked flow area X without the liquid outlet 311; s800, homogenizing the polishing solution in the choked flow area X without the liquid outlet 311; s900, decomposing the choke wall 214. It will be appreciated that by closing the flow blocking area X, the polishing liquid can be added again, and the added polishing liquid is homogenized, so that the plane uniformity of the polishing process is ensured, and after the flow blocking wall 214 is decomposed, the polishing head of the polishing apparatus can be put onto the polishing pad M to perform polishing work.
In some embodiments, before the step of adding the polishing solution into the choked flow area X without the liquid outlet 311, the method further includes: based on the area in the choke zone X and the polishing liquid depth outside the choke zone X, the addition amount of the polishing liquid to be added to the choke zone X without the liquid outlet 311 is determined. It will be appreciated that, since the areas of the inner side and the outer side of the choke zone X can be calculated, and the depth of the choke zone X can be obtained by the image information, the addition amount of the polishing liquid can be calculated, so that the depth in the choke zone X can be easily controlled to be substantially identical to the depth of the choke zone X.
In some embodiments, "S800, homogenizing the polishing liquid in the flow blocking area X without the liquid outlet 311" specifically includes: s810, dividing the choke zone X without the liquid outlet 311 into a plurality of small areas; s820, applying uniform air flow to each small area to blow off the polishing solution and homogenize. It is understood that the distribution of the polishing liquid can be accelerated by the uniform air flow and is uniformly distributed.
In some embodiments, "S900, the split choke wall 214" specifically includes: the fluid supply flow rate of the fluid supply pipe 210 is gradually reduced until the supply is stopped. It will be appreciated that by gradually reducing the fluid supply flow rate, the slurry near the flow blocking wall 214 may be stabilized, and the slurry depth on both sides of the flow blocking wall 214 may be made uniform.
The beneficial effects are that:
According to the application, the flow blocking wall 214 and the flow blocking piece 310 are enclosed to form the flow blocking area X, and meanwhile, the scouring component 400 is utilized to discharge the polishing liquid with large particles in the flow blocking area X out of the polishing pad M, so that the polishing piece and the polishing pad M are not easy to damage during polishing, and the polishing piece quality is improved; the flow blocking wall 214 constructed by the fluid is not a hard part, prevents large particles from being mixed into clean polishing liquid and does not damage the polishing pad M; the image information acquired by the image acquisition assembly 100 can correspondingly change the pose of the flow blocking wall 214 in cooperation with the first driving mechanism 220, so that flow blocking areas X with different sizes and positions are formed, and the flushing assembly 400 can quickly flush large particles out of the outer side of the polishing pad M; by rotating the flow blocking piece 310, the liquid outlet 311 on the flow blocking piece 310 can be transferred to other areas, so that the flow blocking area X is closed, the polishing liquid is convenient to add again, and the polishing liquid cannot overflow from the peripheral edge of the polishing pad M; the fluid supply pipe 210 is driven by the first driving mechanism 220 so that large particles dispersed in different areas on the polishing pad M are gathered, and the flushing area, i.e., the waste of the polishing liquid, is reduced.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (10)
1. A polishing pad surface treatment device applied to a polishing disk (D), wherein a polishing pad (M) is provided on the polishing disk (D), and the polishing pad (M) is used for carrying a polishing liquid, characterized in that the treatment device comprises:
An image acquisition assembly (100), the image acquisition assembly (100) being disposed above the polishing pad (M) and being projectable downwardly onto an upper surface of the polishing pad (M) to acquire image information;
a first flow blocking assembly (200), the first flow blocking assembly (200) comprising:
A fluid supply tube (210), the fluid supply tube (210) being disposed above the polishing pad (M) and having a fluid outlet (212), the fluid outlet (212) being oriented towards the polishing pad (M) for ejecting fluid to form a flow blocking wall (214);
A first driving mechanism (220), wherein the first driving mechanism (220) is arranged on the fluid supply pipe (210), is electrically/communicatively connected with the image acquisition assembly (100), and acts on the fluid supply pipe (210) to drive the fluid supply pipe (210) to form a flow blocking wall (214) with different poses;
a second flow blocking assembly (300), the second flow blocking assembly (300) comprising:
the flow blocking piece (310) is movably arranged on the periphery of the polishing disc (D), the flow blocking piece (310) and the flow blocking wall (214) are jointly enclosed to form a flow blocking area (X), and the flow blocking area (X) is provided with a liquid outlet (311);
A second driving mechanism (320), the second driving mechanism (320) is disposed below the flow blocking member (310), is electrically connected/in communication with the image acquisition assembly (100) or the first driving mechanism (220), and acts on the flow blocking member (310) to drive the flow blocking member (310) to rotate along the peripheral circumference of the polishing pad (M); and
A flush assembly (400), the flush assembly (400) comprising:
A flushing member (410), wherein the flushing member (410) is arranged above the polishing pad (M) and is provided with a flushing port (411), and the flushing port (411) can spray flushing fluid;
And the third driving mechanism (420) is arranged on the flushing piece (410), is electrically/communicatively connected with the image acquisition assembly (100), and acts on the flushing piece (410) to drive the flushing piece (410) to move to the flow blocking area (X) and enable the flushing port (411) to face the liquid outlet (311).
2. The polishing pad surface treatment apparatus according to claim 1, wherein the fluid supply pipe (210) comprises at least 2 nozzles (211), at least 2 of the nozzles (211) each have the fluid outlet (212), and the first driving mechanism (220) is plural and corresponds to the nozzles (211) one by one, so as to drive the nozzles (211) to move to form the blocking walls (214) of different positions.
3. The polishing pad surface treatment device according to claim 1, wherein the fluid supply pipe (210) is a hose, the hose includes at least 2 supply sections (213), at least 2 of the supply sections (213) each have the fluid outlet (212), and the first driving mechanism (220) is 2 and respectively drives the supply sections (213) to move to form the blocking walls (214) of different positions.
4. The polishing pad surface treatment device according to claim 1, wherein the flow blocking member (310) is in an open loop shape, the liquid outlet (311) is disposed on the flow blocking member (310), and the second driving mechanism (320) can drive the flow blocking member (310) to move so that the liquid outlet (311) faces the flow blocking wall (214).
5. The polishing pad surface treatment device according to claim 1, wherein the flow blocking member (310) comprises a plurality of arc-shaped flow blocking sections (312), the second driving mechanism (320) is provided in a plurality of one-to-one correspondence with the plurality of flow blocking sections (312) respectively, so as to drive the flow blocking sections (312) and the flow blocking walls (214) to enclose to form the flow blocking area (X), and at least one gap is provided between the plurality of flow blocking sections (312) to form the liquid outlet (311).
6. The polishing pad surface treatment device according to claim 5, wherein an annular guide rail (330) is provided on an outer periphery of the polishing pad (M), and the flow blocking section (312) is provided on the annular guide rail (330).
7. A polishing pad surface treatment method using the polishing pad surface treatment apparatus according to any one of claims 1 to 6, comprising the steps of:
acquiring image information of the upper surface of a polishing pad (M) provided with polishing liquid;
Determining the distribution position of large particles in the polishing solution based on the image information;
constructing a flow blocking wall (214) based on the distribution position of large particles in the polishing solution and forming a flow blocking area (X) by matching with a flow blocking piece (310);
and flushing the polishing solution in the flow blocking area (X) out of the polishing pad (M).
8. The method for surface treatment of a polishing pad according to claim 7, wherein the determining the distribution position of the large particles in the polishing liquid based on the image information specifically comprises:
Based on the pixel outline and the color depth in the image information, whether large particles with the particle size larger than a set threshold value exist or not is judged, and the position coordinates of each large particle on the polishing pad (M) are determined.
9. The method for polishing pad surface treatment according to claim 8, wherein constructing the flow blocking wall (214) and forming the flow blocking area (X) in cooperation with the flow blocking member (310) based on the distribution position of the large particles in the polishing liquid specifically comprises:
Based on the position coordinates of each large particle on the polishing pad (M), constructing a flow blocking wall (214) with corresponding pose, and controlling the flow blocking piece (310) to rotate by corresponding angles so as to form a flow blocking area (X) by surrounding the flow blocking wall (214).
10. The method for surface treatment of a polishing pad as recited in claim 7, further comprising the steps of:
Based on the position of the liquid outlet (311) of the flow blocking area (X), a liquid receiving device is arranged to receive the flushed polishing liquid.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150073376A (en) * | 2013-12-23 | 2015-07-01 | 주식회사 케이씨텍 | Cleaning device of carrier head in chemical mechanical polishing system |
| CN117984230A (en) * | 2022-11-07 | 2024-05-07 | 杭州众硅电子科技有限公司 | Polishing pad recycling and processing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004047801A (en) * | 2002-07-12 | 2004-02-12 | Sumitomo Mitsubishi Silicon Corp | Polishing process of semiconductor wafer |
| US6872128B1 (en) * | 2003-09-30 | 2005-03-29 | Lam Research Corporation | System, method and apparatus for applying liquid to a CMP polishing pad |
| JP2016111265A (en) * | 2014-12-09 | 2016-06-20 | 株式会社荏原製作所 | Buff processing device and substrate processing device |
| CN108942638B (en) * | 2018-08-15 | 2020-11-13 | 长江存储科技有限责任公司 | Grinding device |
| CN113967875A (en) * | 2020-07-23 | 2022-01-25 | 苏州诺天美新材料技术有限公司 | Grinding pad |
| CN117300904B (en) * | 2023-11-28 | 2024-01-23 | 苏州博宏源机械制造有限公司 | Polishing pad dressing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150073376A (en) * | 2013-12-23 | 2015-07-01 | 주식회사 케이씨텍 | Cleaning device of carrier head in chemical mechanical polishing system |
| CN117984230A (en) * | 2022-11-07 | 2024-05-07 | 杭州众硅电子科技有限公司 | Polishing pad recycling and processing device |
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