[go: up one dir, main page]

CN118399773B - Inverter brick structure, motor controller, powertrain and vehicle having the same - Google Patents

Inverter brick structure, motor controller, powertrain and vehicle having the same Download PDF

Info

Publication number
CN118399773B
CN118399773B CN202410842463.6A CN202410842463A CN118399773B CN 118399773 B CN118399773 B CN 118399773B CN 202410842463 A CN202410842463 A CN 202410842463A CN 118399773 B CN118399773 B CN 118399773B
Authority
CN
China
Prior art keywords
heat dissipation
dissipation plate
plate
capacitor
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202410842463.6A
Other languages
Chinese (zh)
Other versions
CN118399773A (en
Inventor
周治港
徐鲁辉
张有新
陈玉麒
赵博悦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to CN202410842463.6A priority Critical patent/CN118399773B/en
Publication of CN118399773A publication Critical patent/CN118399773A/en
Application granted granted Critical
Publication of CN118399773B publication Critical patent/CN118399773B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using DC to AC converters or inverters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)

Abstract

The invention discloses an inversion brick structure, a motor controller, a power assembly and a vehicle with the inversion brick structure, and relates to the technical field of electrical equipment, wherein the inversion brick structure comprises a capacitor module, a first flow channel is arranged on one side surface of the capacitor module; the power module is arranged on one side of the first heat dissipation plate, which is far away from the capacitor module, and is connected with the first heat dissipation plate. The inversion brick structure has the advantages of simple structure, compact arrangement and high heat dissipation efficiency, can well reduce the use of parts, reduces the cost, and ensures that the integral structure of the inversion brick structure has higher integration degree.

Description

Inversion brick structure, motor controller, power assembly and vehicle with inversion brick structure
Technical Field
The invention relates to the technical field of electrical equipment, in particular to an inversion brick structure, a motor controller, a power assembly and a vehicle with the inversion brick structure.
Background
In the related art, a heat dissipation structure is generally required to be arranged in the inversion brick structure to dissipate heat of the power module, in the inversion brick structure with a cooling runner, a runner plate is often required to be arranged separately to be matched with a heat dissipation plate to form the runner structure, so that more parts are arranged in the inversion brick structure, and the integral integration level of the inversion brick structure is poor and the cost is high.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention aims to provide the inversion brick structure which can reduce the number of parts, so that the inversion brick structure is compact in whole, good in integration level and low in cost.
The invention also provides a motor controller with the inversion brick structure.
The invention also provides a power assembly with the motor controller.
The invention further provides a vehicle with the power assembly.
The inversion brick structure comprises a capacitor module, a first heat dissipation plate and a power module, wherein a first flow channel is formed in the surface of one side of the capacitor module, the first heat dissipation plate is arranged on the opening of the first flow channel in a covering mode, and the power module is arranged on one side, away from the capacitor module, of the first heat dissipation plate and is connected with the first heat dissipation plate.
According to the inversion brick structure, the first runner groove is formed in the capacitor module, the first cooling plate covers the opening of the first runner groove, the power module is arranged on one side, away from the capacitor module, of the first cooling plate and is connected with the first cooling plate, the structure is simple, the arrangement is compact, the cooling efficiency is high, the use of parts can be well reduced, the cost is reduced, and the integration degree of the whole inversion brick structure is higher.
In some embodiments of the invention, at least one of the capacitor module and the first heat dissipation plate is provided with a first mounting groove, the first mounting groove extends along the periphery of the first flow channel groove to form a ring shape, and the inversion brick structure further comprises a first sealing piece, wherein the first sealing piece is arranged in the first mounting groove, and the first sealing piece is connected between the capacitor module and the first heat dissipation plate.
In some embodiments of the invention, the capacitor module comprises a capacitor shell and a capacitor core, wherein the capacitor core is arranged inside the capacitor shell, the first runner groove is arranged on one side surface of the capacitor shell, and the first runner groove is isolated from the capacitor core through part of the capacitor shell.
In an embodiment of the invention, the capacitor shell is a plastic piece.
In an embodiment of the invention, the capacitor shell is a plastic part, and the first heat dissipation plate is a metal part.
In some embodiments of the present invention, the inversion structure further includes a second heat dissipation plate connected to the power module and disposed on a side of the power module facing away from the first heat dissipation plate.
In one embodiment of the invention, the first heat dissipation plate is welded with the power module, or a heat conduction member is filled between the first heat dissipation plate and the power module, and the second heat dissipation plate is welded with the power module, or a heat conduction member is filled between the second heat dissipation plate and the power module.
In one embodiment of the invention, the first heat dissipation plate is provided with a first liquid inlet hole and a first liquid outlet hole which are communicated with the first flow channel, the second heat dissipation plate is provided with a second liquid inlet hole and a second liquid outlet hole which penetrate through the second heat dissipation plate in the thickness direction of the second heat dissipation plate, the first liquid inlet hole is communicated between the second liquid inlet hole and the first flow channel, and the first liquid outlet hole is communicated between the second liquid outlet hole and the first flow channel.
In some examples of the invention, the inversion brick structure further comprises a first support table arranged between the first heat dissipation plate and the second heat dissipation plate, wherein the first support table extends into a ring shape along the peripheral edge of the first liquid inlet hole and defines a first communication hole for communicating the first liquid inlet hole with the second liquid inlet hole, and a second support table arranged between the first heat dissipation plate and the second heat dissipation plate, and the second support table extends into a ring shape along the peripheral edge of the first liquid outlet hole and defines a second communication hole for communicating the first liquid outlet hole with the second liquid outlet hole.
In one example of the present invention, the first support stand is integrally formed with one of the first heat dissipation plate and the second heat dissipation plate, and the second support stand is integrally formed with one of the first heat dissipation plate and the second heat dissipation plate.
In some examples of the present invention, the inversion brick structure further includes a substrate, a second flow channel groove is provided on the substrate, the second heat dissipation plate is covered on an opening of the second flow channel groove, the second liquid inlet and the second liquid outlet are both communicated with the second flow channel groove, and a liquid inlet and a liquid outlet are formed at a bottom of the second flow channel groove.
In one example of the invention, at least one of the base plate and the second heat dissipation plate is provided with a fourth mounting groove, the fourth mounting groove extends to be annular along the peripheral edge of the second flow channel, and the inversion brick structure further comprises a fourth sealing piece, wherein the fourth sealing piece is arranged in the fourth mounting groove, and the fourth sealing piece is connected between the base plate and the second heat dissipation plate in a sealing way.
In some embodiments of the present invention, the inverter tile structure further includes a circuit board disposed on one side of the capacitor module in the first direction, the circuit board being mounted on the capacitor module.
In some embodiments of the present invention, the capacitor module includes a capacitor case, and the inverter brick structure further includes three-phase copper bars, where the three-phase copper bars are fixedly connected to the capacitor case.
The motor controller according to the second aspect of the present invention comprises a case and the inverter brick structure according to the first aspect of the present invention, the inverter brick structure being mounted on the case.
According to the motor controller disclosed by the invention, by arranging the inversion brick structure of the first aspect, the first runner groove is arranged on the capacitor module, the first cooling plate covers the opening of the first runner groove, the power module is arranged on one side of the first cooling plate, which is far away from the capacitor module, and is connected with the first cooling plate, so that the structure is simple, the arrangement is compact, the cooling efficiency is high, the use of parts can be well reduced, the cost is reduced, and the integration degree of the whole structure of the inversion brick structure is higher.
In some embodiments of the invention, the inverted tile structure includes a base plate configured as part of the box or disposed within the box.
The powertrain according to the third aspect of the invention comprises a motor controller according to the second aspect of the invention.
According to the power assembly provided by the invention, the motor controller of the second aspect is arranged, the inversion brick structure of the first aspect is arranged, the first runner groove is arranged on the capacitor module, the first cooling plate covers the opening of the first runner groove, the power module is arranged on one side of the first cooling plate, which is far away from the capacitor module, and is connected with the first cooling plate, so that the power assembly is simple in structure, compact in arrangement and high in heat dissipation efficiency, the use of parts can be well reduced, the cost is reduced, and the integral structure of the inversion brick structure is higher in integration degree.
A vehicle according to a fourth aspect of the invention comprises a powertrain according to the third aspect of the invention.
According to the vehicle disclosed by the invention, the power assembly of the third aspect is arranged, the inversion brick structure of the first aspect is arranged, the first runner groove is arranged on the capacitor module, the first cooling plate covers the opening of the first runner groove, the power module is arranged on one side, away from the capacitor module, of the first cooling plate and is connected with the first cooling plate, the structure is simple, the arrangement is compact, the heat dissipation efficiency is high, the use of parts can be well reduced, the cost is reduced, and the integration degree of the integral structure of the inversion brick structure is higher.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic view of an inverted tile structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a substrate separated from a capacitive module according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a substrate separated from a capacitor module, a first heat spreader, a second heat spreader, and a power module according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a capacitor module assembled with a first heat spreader plate, a second heat spreader plate, a power module, a circuit board, and a three-phase copper bar according to an embodiment of the present invention;
fig. 5 is an exploded view of an inverted tile structure according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a capacitor module and a three-phase copper bar according to an embodiment of the present invention;
FIG. 7 is an exploded view of a first heat spreader, a second heat spreader, and a power module according to an embodiment of the present invention;
Fig. 8 is a schematic view of a substrate and a fourth seal according to an embodiment of the invention.
Reference numerals:
10. the capacitor module, 11, the first runner groove, 12, the first mounting groove;
21. the device comprises a first radiating plate, 211, a first supporting table, 2111, a second mounting groove, 212, a second supporting table, 22, a second radiating plate, 201, a first liquid inlet hole, 202, a first liquid outlet hole, 203, a second liquid inlet hole, 204, a second liquid outlet hole, 205 and a fin column;
30. The power module comprises a power module, a circuit board, a 50-phase copper bar and a three-phase copper bar;
60. A substrate; 61, a second flow channel, 601, a liquid inlet, 602, a liquid outlet;
71. first seal 72, second seal 73, third seal 74, fourth seal;
100. And (5) inverting the brick structure.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
An inverter tile structure 100 according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1-8.
As shown in fig. 1 to 8, the inverter tile structure 100 according to the first aspect of the present invention includes a capacitor module 10, a first heat dissipation plate 21, and a power module 30.
Specifically, a first flow channel 11 is formed on one side surface of the capacitor module 10, a first heat dissipation plate 21 is mounted on one side of the capacitor module 10, the first heat dissipation plate 21 covers an opening of the first flow channel 11, and a power module 30 is arranged on one side of the first heat dissipation plate 21 away from the capacitor module 10 and connected with the first heat dissipation plate 21.
In this embodiment, the first runner groove 11 is disposed on the capacitor module 10, and the first heat dissipation plate 21 covers the opening of the first runner groove 11, so that the first heat dissipation plate 21 can be matched with the first runner groove 11 of the capacitor module 10 to form a good runner cavity structure, and the cooling liquid can flow in the first runner groove 11 stably.
In this embodiment, the power module 30 is disposed on a side of the first heat dissipation plate 21 facing away from the capacitor module 10, when the inverter brick structure 100 is operated, heat generated by the power module 30 is transferred to the first heat dissipation plate 21, and the cooling liquid can flow along the first flow channel to exchange heat with the first heat dissipation plate 21, so that the power module 30 is well cooled, and meanwhile, the cooling liquid in the first flow channel groove 11 can absorb the heat generated by the capacitor module 10, so that the capacitor module 10 is cooled during the flow process of the cooling liquid.
It can be appreciated that when the power module 30 and the capacitor module 10 are cooled by liquid cooling in the inverter brick structure 100, a closed flow channel structure needs to be formed, so that the cooling liquid can flow stably and perform cooling and heat dissipation operations, therefore, in the related art, components such as a flow channel plate and a cover plate are often required to be arranged to cooperate with the heat dissipation plate to form a flow channel, so that the number of components in the inverter brick structure 100 is large, and when the components such as the flow channel plate and the cover plate are arranged, the capacitor module 10 and the power module 30 have larger overall structure volume, thus reducing the integrated arrangement effect of the capacitor module 10 and the power module 30 and the like, and making the integration of the inverter brick structure 100 worse.
In this embodiment, the first runner groove 11 is provided in the capacitor module 10 and is matched with the first heat dissipation plate 21 to form a runner structure, so that the structure is simple, the use of components such as a runner plate and a cover plate is omitted, the capacitor module 10 and the power module 30 are more compact when assembled and arranged, the whole volume of the capacitor module 10, the power module 30 and the first heat dissipation plate 21 is smaller, and the whole structure of the inverter brick structure 100 is more compact and the integration is better.
In this embodiment, the cooling liquid in the first flow channel 11 can perform heat dissipation and cooling operations on the capacitor module 10 and the power module 30 at the same time, so that the heat dissipation efficiency of the inverter brick structure 100 is improved well, the cooling liquid flows in the first flow channel 11 to dissipate heat of the capacitor module 10, and the use of a heat conducting pad, a heat conducting adhesive and the like can be omitted, so that the cost of the inverter brick structure 100 can be reduced, the overall structure of the inverter brick structure 100 is more compact, and the integration degree is higher.
In this embodiment, the first runner groove 11 is formed in a side surface of the capacitor module 10, the first heat dissipation plate 21 and the power module 30 are all arranged on one side of the capacitor module 10, the first heat dissipation plate 21 and the power module 30 can be arranged in a stacked manner, the structure is simple, the assembly is convenient, the first heat dissipation plate 21 is installed on the capacitor module 10, the power module 30 is connected with the first heat dissipation plate 21, and the modularized design requirement of the inverter brick structure 100 can be well met.
According to the inversion brick structure 100 of the embodiment of the invention, the first runner groove 11 is arranged on the capacitor module 10, the first heat dissipation plate 21 covers the opening of the first runner groove 11, the power module 30 is arranged on one side of the first heat dissipation plate 21, which is far away from the capacitor module 10, and is connected with the first heat dissipation plate 21, so that the structure is simple, the arrangement is compact, the heat dissipation efficiency is high, the use of parts can be well reduced, the cost is reduced, and the integral structure of the inversion brick structure 100 is more integrated.
In some embodiments of the present invention, referring to fig. 5, at least one of the capacitor module 10 and the first heat dissipation plate 21 may be provided with a first mounting groove 12, the first mounting groove 12 extending in a ring shape along a circumferential edge of the first flow channel groove 11, and the inverter tile structure 100 may further include a first sealing member 71 provided in the first mounting groove 12, the first sealing member 71 being sealingly connected between the capacitor module 10 and the first heat dissipation plate 21.
In this embodiment, the first sealing member 71 is sealingly connected between the capacitor module 10 and the first heat dissipation plate 21, so that a good sealing effect can be achieved on the flow channel cavity structure formed by the cooperation of the first flow channel 11 and the first heat dissipation plate 21, and leakage of cooling liquid can be well avoided, so that the inverter brick structure 100 can obtain a stable and good heat dissipation effect in the operation process and can operate stably and reliably.
In this embodiment, the first mounting groove 12 is disposed in at least one of the capacitor module 10 and the first heat dissipation plate 21, the first sealing member 71 is disposed in the first mounting groove 12, the structure is simple, the first sealing member 71 is convenient to be assembled and fixed between the capacitor module 10 and the first heat dissipation plate 21, the first mounting groove 12 can play a role in limiting and positioning the first sealing member 71 to a certain extent, so that the first sealing member 71 can stably surround the periphery of the first flow channel 11, and the capacitor module 10, the first heat dissipation plate 21 and the first sealing member 71 are relatively convenient and easy to assemble and arrange, and the first sealing member 71 can be stably and reliably connected between the first heat dissipation plate 21 and the capacitor module 10 in a sealing manner.
For example, the capacitor module 10 may be provided with the first mounting groove 12, or the first heat dissipation plate 21 and the capacitor module 10 may be provided with the first mounting groove 12, and the first mounting groove 12 may be reasonably set according to assembly requirements and processing requirements.
In some embodiments of the present invention, referring to fig. 5, the capacitor module 10 may include a capacitor case and a capacitor core, wherein the capacitor core is disposed inside the capacitor case, the first flow channel 11 is disposed on one side surface of the capacitor case, and the first flow channel 11 is isolated from the capacitor core by a part of the capacitor case.
In this embodiment, the first flow channel 11 is formed on the capacitor shell of the capacitor module 10, which has a simple structure and is convenient for processing and manufacturing, and the capacitor shell can well play a role in sealing and protecting the capacitor core, so that the capacitor module 10 operates stably and well.
In one embodiment of the present invention, referring to fig. 5, the capacitor case may be a plastic part. Therefore, the material cost of the capacitor shell can be conveniently reduced, the capacitor shell has a good electric insulation effect, the plastic part is convenient to process and shape, and the capacitor module 10 can be conveniently processed and manufactured.
In one embodiment of the present invention, the capacitor housing may be a plastic part, and the first heat dissipation plate 21 may be a metal part.
In this embodiment, the first heat dissipation plate 21 is set to be a metal piece, so that the first heat dissipation plate 21 has good heat conduction capability, and thus the first heat dissipation plate 21 can have good heat dissipation effects on the power module 30 and the capacitor module 10. For example, the first heat dissipation plate 21 may be a ferrous member or a copper member, etc.
The capacitor shell is a plastic part, so that the capacitor core and the first heat dissipation plate 21 can be well insulated and separated, and the capacitor module 10 and the first heat dissipation plate 21 can be tightly assembled together when assembled, thereby well meeting the assembly requirement of the inverter brick structure 100.
In some embodiments of the present invention, as shown in fig. 5, the inverter tile structure 100 may further include a second heat dissipation plate 22, where the second heat dissipation plate 22 is connected to the power module 30 and disposed on a side of the power module 30 facing away from the first heat dissipation plate 21.
In this embodiment, the inverter brick structure 100 is provided with the second heat dissipation plate 22, where the second heat dissipation plate 22 is connected with the power module 30 and is disposed on one side of the power module 30, which is different from the first heat dissipation plate 21, and has a simple structure, and the second heat dissipation plate 22 can cooperate with the first heat dissipation plate 21 to perform heat dissipation operation on the power module 30 on two sides of the power module 30, so that the power module 30 can obtain a better heat dissipation effect, and the power module 30 can operate more stably, so that the inverter brick structure 100 operates more stably.
In this embodiment, the second heat dissipation plate 22 is disposed on the side of the power module 30 facing away from the first heat dissipation plate 21, which is simple in structure and reasonable in arrangement.
In one embodiment of the present invention, the first heat dissipation plate 21 and the power module 30 may be welded, or a heat conducting member may be filled between the first heat dissipation plate 21 and the power module 30, the second heat dissipation plate 22 and the power module 30 may be welded, or a heat conducting member may be filled between the second heat dissipation plate 22 and the power module 30.
In this embodiment, the first heat dissipation plate 21 is welded to the power module 30, so that the first heat dissipation plate 21 and the power module 30 are assembled more firmly, and heat transfer between the first heat dissipation plate 21 and the power module 30 is more efficient, so that the first heat dissipation plate 21 can have a better heat dissipation effect on the power module 30.
In this embodiment, the heat conducting member is filled between the first heat dissipation plate 21 and the power module 30, and the heat conducting member can play a role in connection to make the power module 30 be assembled and connected with the first heat dissipation plate 21 relatively stably, and the heat conducting member can improve the heat transfer efficiency between the first heat dissipation plate 21 and the power module 30, so that the power module 30 can obtain a better heat dissipation effect. The connection manner of the first heat dissipation plate 21 and the power module 30 may be set reasonably according to the need.
In one embodiment of the present invention, the second heat dissipation plate 22 and the power module 30 may be welded, or a heat conductive member may be filled between the second heat dissipation plate 22 and the power module 30.
In this embodiment, the second heat dissipation plate 22 is welded to the power module 30, so that the second heat dissipation plate 22 and the power module 30 can be assembled more firmly, and the heat transfer between the second heat dissipation plate 22 and the power module 30 is more efficient, so that the second heat dissipation plate 22 can have a better heat dissipation effect on the power module 30.
In this embodiment, the heat conducting member is filled between the second heat dissipation plate 22 and the power module 30, and the heat conducting member can play a certain role in connection, so that the power module 30 can be assembled and connected with the second heat dissipation plate 22 relatively stably, and the heat conducting member can improve the heat transfer efficiency between the second heat dissipation plate 22 and the power module 30, so that the power module 30 can obtain a better heat dissipation effect. The connection mode between the second heat dissipation plate 22 and the power module 30 can be set reasonably according to the requirement.
In one embodiment of the present invention, as shown in fig. 3 to 5, the first heat dissipation plate 21 may be provided with a first liquid inlet hole 201 and a first liquid outlet hole 202 communicating with the first flow channel 11, the second heat dissipation plate 22 may be provided with a second liquid inlet hole 203 and a second liquid outlet hole 204 penetrating through the second heat dissipation plate 22 in a thickness direction of the second heat dissipation plate 22, the first liquid inlet hole 201 communicating between the second liquid inlet hole 203 and the first flow channel 11, and the first liquid outlet hole 202 communicating between the second liquid outlet hole 204 and the first flow channel 11.
In this embodiment, the first heat dissipation plate 21 is provided with the first liquid inlet 201 and the first liquid outlet 202, the first liquid inlet 201 and the first liquid outlet 202 are both communicated with the first flow channel 11, when the inversion brick structure 100 operates, the cooling liquid can enter the first flow channel 11 from the first liquid inlet 201, then flow along the first flow channel 11 to exchange heat with the first heat dissipation plate 21 and the capacitor module 10, and the cooling liquid after heat exchange flows out from the first liquid outlet 202, so that the cooling liquid can circulate, and the power module 30 and the capacitor module 10 can be continuously cooled.
In this embodiment, the second heat dissipation plate 22 is provided with the second liquid inlet 203 and the second liquid outlet 204, the first liquid inlet 201 is communicated between the second liquid inlet 203 and the first flow channel 11, the first liquid outlet 202 is communicated between the second liquid outlet 204 and the first flow channel 11, when the inverter brick structure 100 is operated, the cooling liquid can flow from the second liquid inlet 203 on the second heat dissipation plate 22 to the first liquid inlet 201 on the first heat dissipation plate 21, the cooling liquid further flows into the first flow channel 11, the cooling liquid subjected to heat exchange flows from the first liquid outlet 202 to the second liquid outlet 204, and the cooling liquid further flows from the second liquid outlet 204.
In this embodiment, by arranging the first liquid inlet 201 and the first liquid outlet 202 in the first heat dissipation plate 21 and arranging the second liquid inlet 203 and the second liquid outlet 204 in the second heat dissipation plate 22, the second liquid inlet 203 and the first liquid inlet 201 cooperate to form a flow channel structure for cooling liquid to flow into the first flow channel 11, and the second liquid outlet 204 cooperates with the first liquid outlet 202 to form a flow channel structure for cooling liquid to flow out of the first flow channel 11, so that the cooling liquid flow channel of the inverter brick structure 100 can be formed in the first heat dissipation plate 21 and the second heat dissipation plate 22, additional pipeline arrangement is avoided, cost is well saved, and the overall structure of the flow channel structure and the capacitor module 10 in the inverter brick structure 100, the first heat dissipation plate 21, the second heat dissipation plate 22 and the power module 30 is more compact, thereby enabling the integration degree of the inverter brick structure 100 to be higher.
In some examples of the present invention, as shown in fig. 5, the inverter tile structure 100 may further include a first support table 211 and a second support table 212, the first support table 211 is disposed between the first heat dissipation plate 21 and the second heat dissipation plate 22, the first support table 211 extends in a ring shape along a peripheral edge of the first liquid inlet hole 201 and defines a first communication hole communicating the first liquid inlet hole 201 with the second liquid inlet hole 203, the second support table 212 is disposed between the first heat dissipation plate 21 and the second heat dissipation plate 22, and the second support table 212 extends in a ring shape along a peripheral edge of the first liquid outlet hole 202 and defines a second communication hole communicating the first liquid outlet hole 202 with the second liquid outlet hole 204.
In this embodiment, the first supporting table 211 and the second supporting table 212 are provided, the first supporting table 211 can play a role of connecting and supporting the first heat dissipation plate 21 and the second heat dissipation plate 22, so that when the first heat dissipation plate 21 is assembled with the power module 30 and the second heat dissipation plate 22, a relatively stable clearance space can be formed between the first heat dissipation plate 21 and the second heat dissipation plate 22 through the first supporting table 211 and the second supporting table 212, and therefore the risk of damage to the power module 30 caused by excessive clamping of the first heat dissipation plate 21 and the second heat dissipation plate 22 after the assembly of the power module 30 is avoided, and the power module 30 and the first heat dissipation plate 21 and the second heat dissipation plate 22 are relatively convenient to assemble.
In this embodiment, the first supporting platform 211 forms a first communication hole, and the first communication hole is communicated with the first liquid inlet 201 and the second liquid inlet 203, so that the first communication hole can cooperate with the first liquid inlet 201 and the second liquid inlet 203 to form a good flow channel structure, and the cooling liquid can flow into the first flow channel 11 relatively stably.
In this embodiment, the second support table 212 forms a second communication hole, and the second communication hole is communicated with the first liquid outlet 202 and the second liquid outlet 204, so that the second communication hole can form a good flow channel structure in cooperation with the first liquid outlet 202 and the second liquid outlet 204, and the cooling liquid can flow into the first flow channel 11 more stably.
In one example of the present invention, the first support 211 may be integrally formed with one of the first and second heat dissipation plates 21 and 22.
In this embodiment, the first supporting platform 211 and one of the first heat dissipation plate 21 and the second heat dissipation plate 22 are integrally formed, so that the structure is simple, and the processing is convenient. For example, when the first support 211 and the first heat dissipation plate 21 are integrally formed, the first communication hole may be formed simultaneously with the first liquid inlet 201, and when the first support 211 and the second heat dissipation plate 22 are integrally formed, the first communication hole may be formed simultaneously with the second liquid inlet 203.
In one example of the present invention, the second support table 212 may be integrally formed with one of the first and second heat dissipation plates 21 and 22.
In this embodiment, the second support stand 212 and one of the first heat dissipation plate 21 and the second heat dissipation plate 22 are integrally formed, so that the structure is simple and the processing is convenient. For example, when the second support base 212 is integrally formed with the first heat dissipation plate 21, the second communication hole may be formed simultaneously with the first liquid outlet 202, and when the second support base 212 is integrally formed with the second heat dissipation plate 22, the second communication hole may be formed simultaneously with the second liquid outlet 204.
In some embodiments of the present invention, referring to fig. 5 and 7, the first support table 211 and the second support table 212 may each be disposed on the first heat dissipation plate 21, and the inverter tile structure 100 may further include a second sealing member 72 and a third sealing member 73, at least one of the first support table 211 and the second heat dissipation plate 22 being formed with a second mounting groove 2111, the second sealing member 72 being disposed in the second mounting groove 2111 and being sealingly connected between the first support table 211 and the second heat dissipation plate 22, and at least one of the second support table 212 and the second heat dissipation plate 22 being formed with a third mounting groove, the third sealing member 73 being disposed in the third mounting groove and being sealingly connected between the second support table 212 and the second heat dissipation plate 22.
In this embodiment, the second sealing member 72 is disposed between the first supporting platform 211 and the second heat dissipation plate 22 in a sealing manner, specifically, the first supporting platform 211 may be integrally formed on the first heat dissipation plate 21, the second sealing member 72 may extend into a ring shape along the circumferential direction of the first communication hole, and the second sealing member 72 is sealingly connected between the first supporting platform 211 and the second heat dissipation plate 22, so that the second sealing member 72 may perform a good sealing function in the process of flowing the cooling liquid from the second liquid inlet 203 to the first liquid inlet 201, avoiding leakage of the cooling liquid, and enabling the cooling liquid to stably flow into the first flow channel 11.
In this embodiment, the third sealing member 73 is disposed between the second supporting platform 212 and the second heat dissipation plate 22, specifically, the second supporting platform 212 may be integrally formed on the first heat dissipation plate 21, the third sealing member 73 may extend into a ring shape along the circumference of the second communication hole, and the third sealing member 73 is sealingly connected between the second supporting platform 212 and the second heat dissipation plate 22, so that the third sealing member 73 may perform a good sealing function in the process of flowing the cooling liquid from the first liquid outlet 202 to the second liquid outlet 204, avoiding leakage of the cooling liquid, and enabling the cooling liquid to flow out from the second liquid outlet 204 stably.
In this embodiment, the second mounting groove 2111 is formed in at least one of the first support table 211 and the second heat dissipation plate 22, so that the second seal member 72 is easy to mount and fix, and the second seal member 72 can be stably and reliably connected between the first support table 211 and the second heat dissipation plate 22 in a sealing manner, and the second mounting groove 2111 can play a role in limiting and positioning the second seal member 72 to a certain extent, so that the second seal member 72 can be stably arranged between the first support table 211 and the second heat dissipation plate 22, the second heat dissipation plate 22 and the second seal member 72 are easy and convenient to assemble and arrange.
For example, the first support 211 may have a second mounting groove 2111 formed thereon, or the second heat dissipating plate 22 may have a second mounting groove 2111 formed thereon, or both the first support 211 and the second heat dissipating plate 22 may have a second mounting groove 2111 formed thereon, and the second mounting groove 2111 may be reasonably configured according to the assembly requirement and the processing requirement.
In this embodiment, a third mounting groove is formed in at least one of the second support table 212 and the second heat dissipation plate 22, so that the structure is simple, the third sealing member 73 is convenient to mount and fix, the third sealing member 73 can be stably and reliably connected between the second support table 212 and the second heat dissipation plate 22 in a sealing manner, the third mounting groove can play a role in limiting and positioning the third sealing member 73 to a certain extent, the third sealing member 73 can be stably arranged between the second support table 212 and the second heat dissipation plate 22, the second heat dissipation plate 22 and the third sealing member 73 are convenient and easy in assembly and arrangement.
For example, a third mounting groove may be formed on the second support table 212, or a third mounting groove may be formed on the second heat dissipation plate 22, or third mounting grooves may be formed on both the second support table 212 and the second heat dissipation plate 22, and the third mounting groove may be reasonably set according to the assembly requirement and the processing requirement.
Of course, in other embodiments, when the first support stand 211 and the second support stand 212 are both disposed on the second heat dissipation plate 22, the second sealing member 72 may be respectively and hermetically connected between the first support stand 211 and the first heat dissipation plate 21, and the third sealing member 73 may be respectively and hermetically connected between the second support stand 212 and the first heat dissipation plate 21.
When the first support table 211 and the second support table 212 are disposed on the first heat dissipation plate 21 and the second heat dissipation plate 22, respectively, for example, the first support table 211 is disposed on the first heat dissipation plate 21 and the second support table 212 is disposed on the second heat dissipation plate 22, the second seal member 72 may be sealingly connected between the first support table 211 and the second heat dissipation plate 22, the third seal member 73 may be sealingly connected between the second support table 212 and the first heat dissipation plate 21, or the first support table 211 is disposed on the second heat dissipation plate 22 and the second support table 212 is disposed on the first heat dissipation plate 21, the second seal member 72 may be sealingly connected between the first support table 211 and the first heat dissipation plate 21, and the third seal member 73 may be sealingly connected between the second support table 212 and the second heat dissipation plate 22. The second sealing member 72 and the third sealing member 73 may be adjusted accordingly according to the arrangement of the first support 211 and the second support 212 on the first heat dissipation plate 21 and the second heat dissipation plate 22, so as to meet the sealing requirement.
In some examples of the present invention, as shown in fig. 3 and 8, the inverter brick structure 100 may further include a base plate 60, a second runner groove 61 is provided on the base plate 60, the second heat dissipation plate 22 is covered on an opening of the second runner groove 61, the second liquid inlet 203 and the second liquid outlet 204 are both communicated with the second runner groove 61, and a liquid inlet 601 and a liquid outlet 602 are formed at a bottom of the second runner groove 61.
In this embodiment, the substrate 60 is provided, the second flow channel groove 61 is provided on the substrate 60, and the second heat dissipation plate 22 covers the opening of the second flow channel groove 61, so that the second flow channel groove 61 of the second heat dissipation plate 22 can cooperate with the second heat dissipation plate 22 to form a flow channel cavity structure, and the cooling liquid can flow in the second flow channel groove 61, so that the power module 30 can obtain a better cooling and heat dissipation effect on the side with the second heat dissipation plate 22.
In this embodiment, the second runner groove 61 is communicated with the second liquid inlet 203 and the second liquid outlet 204, and the bottom of the second runner groove 61 is formed with a liquid inlet 601 and a liquid outlet 602, when the inverting brick structure 100 is operated, the cooling liquid can flow into the second runner groove 61 from the liquid inlet 601, and then a part of the cooling liquid flows along the second runner groove 61 and flows out from the liquid outlet 602, and another part of the cooling liquid flows into the first runner groove 11 from the second liquid inlet 203 through the first liquid inlet 201, flows in the first runner groove 11 and flows back into the second runner groove 61 from the first liquid outlet 202 through the second liquid outlet 204, and the cooling liquid flowing into the second runner groove 61 from the second liquid outlet 204 flows out from the liquid outlet 602 together with the cooling liquid in the second runner groove 61, so that the cooling liquid can perform heat dissipation cooling operation on both sides of the power module 30.
In this embodiment, the second flow channel 61 is disposed on the substrate 60, and the second heat dissipation plate 22 covers the opening of the second flow channel 61, so that the structure is simple, the arrangement is compact, and the power module 30 can obtain a better heat dissipation effect, thereby making the operation of the inverter brick structure 100 more stable.
In this embodiment, the liquid inlet 601 and the liquid outlet 602 are disposed in the second flow channel 61, and the liquid inlet 601 and the liquid outlet 602 are respectively communicated with the second liquid inlet 203 and the second liquid outlet 204, so that the inflow and outflow of the cooling liquid can be facilitated, the structure is simple, and the arrangement is reasonable.
In one example of the present invention, referring to fig. 3 and 8, at least one of the base plate 60 and the second heat dissipation plate 22 may be provided with a fourth mounting groove extending in a ring shape along the circumferential edge of the second flow path groove 61, and the inverter tile structure 100 may further include a fourth sealing member 74 provided in the fourth mounting groove, the fourth sealing member 74 being sealingly connected between the base plate 60 and the second heat dissipation plate 22.
In this embodiment, the fourth sealing member 74 is sealingly connected between the substrate 60 and the second heat dissipation plate 22, so that a good sealing effect can be achieved on the flow channel cavity structure formed by the cooperation of the second flow channel 61 and the second heat dissipation plate 22, and leakage of cooling liquid is well avoided, so that the inverter brick structure 100 can obtain a stable and good heat dissipation effect and can operate stably and reliably during operation.
In this embodiment, the fourth mounting groove is formed in at least one of the substrate 60 and the second heat dissipation plate 22, the fourth sealing member 74 is disposed in the fourth mounting groove, so that the structure is simple, the fourth sealing member 74 is convenient to assemble and fix between the substrate 60 and the second heat dissipation plate 22, the fourth mounting groove can play a role in limiting and positioning the fourth sealing member 74 to a certain extent, so that the fourth sealing member 74 can stably surround and be disposed on the periphery of the second flow channel 61, and therefore, the substrate 60, the second heat dissipation plate 22 and the fourth sealing member 74 are relatively convenient and easy to assemble and arrange, and the fourth sealing member 74 can be stably and reliably connected between the second heat dissipation plate 22 and the substrate 60 in a sealing manner.
For example, the substrate 60 may be provided with a fourth mounting groove, or the second heat dissipation plate 22 and the substrate 60 may be provided with fourth mounting grooves, and the fourth mounting grooves may be reasonably arranged according to assembly requirements and processing requirements.
In some embodiments of the present invention, as shown in fig. 7, a side of the first heat dissipation plate 21 facing away from the power module 30 may be arranged with a plurality of fin columns 205 in an array, where the fin columns 205 extend into the first runner groove 11.
In this embodiment, the fin columns 205 are disposed on the first heat dissipation plate 21, so that the heat exchange efficiency of the first heat dissipation plate 21 can be further improved, and the power module 30 can obtain a better heat dissipation effect. The fin posts 205 extend into the first runner groove 11, so that the capacitor module 10 and the first heat dissipation plate 21 can be more compact during assembly, and the integral integration degree of the inversion brick structure 100 is higher.
In some embodiments of the present invention, as shown in fig. 5, a side of the second heat dissipation plate 22 facing away from the power module 30 may be arranged with a plurality of fin columns 205 in an array, where the fin columns 205 extend into the second runner groove 61.
In this embodiment, the fin columns 205 are disposed on the second heat dissipation plate 22, so that the heat exchange efficiency of the second heat dissipation plate 22 can be further improved, and the power module 30 can obtain a better heat dissipation effect. The fin posts 205 extend into the second runner grooves 61, so that the substrate 60 and the second heat dissipation plate 22 can be more compact during assembly, and the integration degree of the inverter brick structure 100 is higher.
In some embodiments of the present invention, as shown in fig. 5, the inverter tile structure 100 may further include a circuit board 40, where the circuit board 40 is disposed on one side of the capacitor module 10 in the first direction (left-right direction as shown in fig. 5), and the circuit board 40 is mounted on the capacitor module 10.
In this embodiment, the circuit board 40 is disposed on one side of the capacitor module 10 in the first direction and is mounted on the capacitor module 10, which has a simple structure and compact arrangement, and can well meet the modularized design requirement, so that the integral inverter brick structure 100 has a better integration effect.
In one embodiment of the present invention, as shown in fig. 5, two circuit boards 40 may be provided, and two circuit boards 40 are respectively disposed at both sides of the capacitive module 10 in the first direction, and the circuit boards 40 are fastened to the capacitive module 10.
The two circuit boards 40 are arranged in the embodiment, so that the operation requirement of the inversion brick structure 100 can be met, the two circuit boards 40 are respectively arranged on two sides of the capacitor module 10 in the first direction, the structure is simple, the arrangement is convenient and reasonable, the circuit boards 40 are in fastening connection with the capacitor module 10, the assembly and the disassembly are convenient, and the processing and the manufacturing of the inversion brick structure 100 are convenient and the subsequent maintenance is convenient and easy.
In some embodiments of the present invention, referring to fig. 5, the capacitor module 10 may include a capacitor case, and the inverter tile structure 100 may further include three-phase copper bars 50, where the three-phase copper bars 50 are fixedly connected to the capacitor case.
In this embodiment, the three-phase copper bar 50 is fixedly connected with the capacitor shell, and the structure is simple and the assembly is convenient. For example, the three-phase copper bar 50 may be fixed with the capacitor case by a fastener, and the three-phase copper bar 50 may be fixedly connected with the capacitor case by riveting, clamping, or the like.
In one embodiment of the invention, the three-phase copper bar 50 may be integral with the capacitor housing. Therefore, the raw materials for single injection molding of the three-phase copper bar 50 can be reduced, the cost of parts for fixing the connecting parts such as fasteners and the capacitor shell is saved, the assembly process of the three-phase copper bar 50 is reduced, and the inverter brick structure 100 is more efficient in production and lower in cost.
In one embodiment of the present invention, both the first heat dissipation plate 21 and the second heat dissipation plate 22 may be fastened to the capacitor case of the capacitor module 10.
In this embodiment, the first heat dissipation plate 21 and the second heat dissipation plate 22 are fastened and connected to the capacitor housing of the capacitor module 10, so that the whole of the first heat dissipation plate 21, the second heat dissipation plate 22, the capacitor module 10 and the power module 30 is more compact, and the first heat dissipation plate 21, the second heat dissipation plate 22, the power module 30, the capacitor module 10 and the circuit board 40 form a compact arrangement after being assembled, so that the whole of the inverter brick structure 100 is more compact, the integration degree is higher, the whole volume of the inverter brick structure 100 is smaller to a certain extent, and the inverter brick structure 100 can be integrally installed and fixed when being assembled with other external structures, thereby reducing the number of parts required during assembly, and facilitating the assembly of the inverter brick structure 100 and the external structures.
A motor controller according to an embodiment of the second aspect of the present invention is described below with reference to fig. 1 to 8.
As shown in fig. 1 to 8, the motor controller according to the embodiment of the present invention includes a case and an inverter brick structure 100 according to the embodiment of the first aspect of the present invention.
Other constructions and operations of motor controllers according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
According to the motor controller of the embodiment of the invention, by arranging the inversion brick structure 100 of the embodiment of the first aspect, the first runner groove 11 is arranged on the capacitor module 10, the first heat dissipation plate 21 covers the opening of the first runner groove 11, and the power module 30 is arranged on one side of the first heat dissipation plate 21, which is far away from the capacitor module 10, and is connected with the first heat dissipation plate 21.
In some embodiments of the present invention, referring to fig. 1, the inverter tile structure 100 may include a base plate 60, the base plate 60 being configured as a part of a box, or the base plate 60 being provided in the box.
In this embodiment, the substrate 60 is formed as a part of the box body, so that the structure is simple, and the number of components in the inversion brick structure 100 can be further reduced, so that the overall structure of the inversion brick structure 100 is more compact and the integration degree is higher.
In this embodiment, the substrate 60 is disposed in the box body, so that the inverter brick structure 100 can be assembled and fixed in the box body.
A powertrain according to an embodiment of a third aspect of the present invention is described below with reference to fig. 1-8.
As shown in fig. 1-8, a powertrain according to an embodiment of the present invention includes a motor controller according to an embodiment of the second aspect of the present invention.
Other constructions and operation of the locomotion assembly according to embodiments of the present invention are known to those skilled in the art and will not be described in detail herein.
According to the power assembly of the embodiment of the invention, by arranging the motor controller of the second aspect, the first runner groove 11 is arranged on the capacitor module 10, the first heat dissipation plate 21 covers the opening of the first runner groove 11, and the power module 30 is arranged on one side of the first heat dissipation plate 21, which is far away from the capacitor module 10, and is connected with the first heat dissipation plate 21.
A vehicle according to a fourth aspect of the present invention is described below with reference to fig. 1 to 8.
As shown in fig. 1-8, a vehicle according to an embodiment of the invention includes a powertrain according to an embodiment of the third aspect of the invention.
Other components and operations of a vehicle according to embodiments of the invention are known to those of ordinary skill in the art and will not be described in detail herein.
According to the vehicle of the embodiment of the invention, by arranging the power assembly of the third embodiment, the first runner groove 11 is arranged on the capacitor module 10, the first heat dissipation plate 21 covers the opening of the first runner groove 11, the power module 30 is arranged on one side of the first heat dissipation plate 21 away from the capacitor module 10 and is connected with the first heat dissipation plate 21, and the vehicle has the advantages of simple structure, compact arrangement, high heat dissipation efficiency, capability of well reducing the use of parts, cost reduction and higher integration degree of the whole structure of the inversion brick structure 100.
A vehicle according to a specific embodiment of the present invention will be described below with reference to fig. 1 to 8.
As shown in fig. 1-8, the vehicle includes a powertrain having a motor controller that includes a housing, a portion of which is formed as a base plate 60, and an inverter brick structure 100.
The base plate 60 is provided with a second flow channel groove 61 and a fourth mounting groove, the second flow channel groove 61 extends along a second direction (front-rear direction as shown in fig. 1), two ends of the groove bottom are respectively provided with a liquid inlet 601 and a liquid outlet 602, specifically, the tank body can be provided with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are respectively arranged at two sides of the base plate 60 in the second direction, the liquid inlet pipe is communicated with the liquid inlet 601, the liquid outlet pipe is communicated with the liquid outlet 602, and the liquid inlet pipe and the liquid outlet pipe can be connected with a liquid supply pipeline of external liquid supply equipment so that the second flow channel groove 61 is connected in series in the liquid supply pipeline.
The inverter tile structure 100 includes the capacitor module 10, the first heat dissipation plate 21, the second heat dissipation plate 22, the power module 30, the circuit board 40, the three-phase copper bar 50, the first seal 71, the second seal 72, the third seal 73, and the fourth seal 74. The capacitor module 10 includes a capacitor case on which a first flow channel groove 11 and a first mounting groove 12 are formed, the first flow channel groove 11 being arranged at one side of the capacitor module 10 in a third direction (up-down direction as shown in fig. 1), the first mounting groove 12 extending in a ring shape along an opening of the first flow channel groove 11, and a first seal 71 being a seal ring and being provided in the first mounting groove 12. The capacitor module 10 further includes a capacitor copper bar electrically connected to the power module 30, the three-phase copper bar 50 is electrically connected to the power module 30, the circuit board 40 is electrically connected to the power module 30, specifically, the terminals of the power module 30 may be electrically connected to the three-phase copper bar 50 and the capacitor copper bar by means of screw fixing connection or laser welding. The three-phase copper bar 50 and the capacitor case are formed into one piece by injection molding.
The power modules 30 may be single-tube power modules 30, half-bridge power modules 30, and full-bridge power modules 30. The first heat dissipation plate 21 and the second heat dissipation plate 22 are arranged in a stacked mode in the third direction, the power module 30 is arranged between the first heat dissipation plate 21 and the second heat dissipation plate 22, a heat conduction piece is arranged between the power module 30 and the first heat dissipation plate 21 and the second heat dissipation plate 22, the heat conduction piece is heat conduction silicone grease, and the heat conduction silicone grease is coated between the first heat dissipation plate 21 and the power module 30 and between the second heat dissipation plate 22 and the power module 30.
The first cooling plate 21 is provided with a first liquid inlet hole 201 and a first liquid outlet hole 202, the first liquid inlet hole 201 and the first liquid outlet hole 202 are arranged at two ends of the first cooling plate 21 in the second direction, the second cooling plate 22 is provided with a second liquid inlet hole 203 and a second liquid outlet hole 204, the second liquid inlet hole 203 and the second liquid outlet hole 204 are arranged at two ends of the second cooling plate 22 in the second direction, the first liquid inlet hole 201 is provided with a first supporting table 211, the first supporting table 211 is annular and is formed on the first cooling plate 21, the first supporting table 211 is formed with a first communication hole communicated with the first liquid inlet hole 201, the end face of the second supporting table 212 faces the second cooling plate 22 and is formed with a second installation groove 2111, the second supporting table 212 is arranged at the first liquid outlet hole 202, the second supporting table 212 is annular and is formed on the first cooling plate 21, the second supporting table 212 is formed with a second communication hole communicated with the first liquid outlet hole 202, and the end face of the second supporting table 212 faces the second cooling plate 22 and is formed with a third installation groove.
The second sealing member 72 is a sealing ring, the second sealing member 72 is disposed in the second mounting groove 2111 and is in sealing connection with the second heat dissipation plate 22, the third sealing member 73 is a sealing ring, and the third sealing member 73 is disposed in the third mounting groove and is in sealing connection with the second heat dissipation plate 22.
The substrate 60 is provided with a fourth mounting groove, the fourth mounting groove extends along the periphery of the second flow channel 61 to form a ring shape, the fourth sealing element 74 is a sealing ring and is arranged in the fourth mounting groove, and the fourth sealing element 74 is connected between the substrate 60 and the second heat dissipation plate 22 in a sealing manner.
The first heat dissipation plate 21 and the second heat dissipation plate 22 are respectively provided with a plurality of fin columns 205, and the fin columns 205 are arranged on one side of the first heat dissipation plate 21, which is away from the power module 30, and one side of the second heat dissipation plate 22, which is away from the power module 30. The first heat dissipation plate 21 and the second heat dissipation plate 22 are fixed on the capacitor case of the capacitor module 10 through fasteners, and illustratively, a mounting boss may be formed on the second heat dissipation plate 22, the mounting boss is provided with a mounting hole, the first heat dissipation plate 21 is correspondingly provided with a mating mounting hole, and the fasteners may pass through the mating mounting hole and the mounting hole to fix the first heat dissipation plate 21 and the second heat dissipation plate 22 to the capacitor module 10.
The circuit boards 40 are provided with two circuit boards 40, the two circuit boards 40 are respectively arranged on two sides of the capacitor module 10 in the first direction and are fixedly connected with the capacitor module 10, and illustratively, a capacitor shell of the capacitor module 10 can be formed with a connecting boss, the connecting boss is away from the capacitor module 10 along the first direction and protrudes, and the circuit boards 40 are fixedly connected on the connecting boss, so that heat dissipation of the circuit boards 40 can be facilitated.
When the inverter tile structure 100 is assembled, the first heat dissipation plate 21 and the second heat dissipation plate 22 are connected with the power module 30 through heat conduction silicone grease, the second sealing member 72 and the third sealing member 73 are respectively arranged in the second installation groove 2111 and the third installation groove, the first sealing member 71 is assembled in the first installation groove 12, the first heat dissipation plate 21, the second heat dissipation plate 22 and the power module 30 can be integrally fixed to corresponding positions of the capacitor module 10 through fasteners and form a runner cavity structure in cooperation with the first runner groove 11, the two circuit boards 40 are fixed to the capacitor module 10 through fasteners, the fourth sealing member 74 is arranged in the fourth installation groove, and the capacitor module 10, the first heat dissipation plate 21, the second heat dissipation plate 22 and the like are integrally fixed to corresponding positions of the substrate 60, so that the assembly of the inverter tile structure 100 is completed.
According to the embodiment, the first runner groove 11 is formed in the capacitor module 10, the first heat dissipation plate 21 seals the opening of the first runner groove 11, the power module 30 is arranged on one side, away from the capacitor module 10, of the first heat dissipation plate 21 and is connected with the first heat dissipation plate 21, the structure is simple, the arrangement is compact, the heat dissipation efficiency is high, the use of parts can be well reduced, the cost is reduced, and the integration degree of the integral structure of the inversion brick structure 100 is higher. The first heat dissipation plate 21, the second heat dissipation plate 22, the circuit board 40, the power module 30 and the three-phase copper bar 50 in the embodiment are all assembled and fixed with the capacitor shell of the capacitor module 10, so that the whole package can be performed, the integration level is high, the occupied space in the motor controller is less, the space utilization rate of the motor controller can be improved, the inverter brick structure 100 can be assembled into the motor controller conveniently and conveniently, and the assembly efficiency is high.
In another embodiment of the present invention, the substrate 60 may also be separately disposed and become a part of the inversion brick structure 100, so that the flow channel structure of the inversion brick structure 100 is more complete, and the overall structure can better meet the modular design requirement.
In still another embodiment of the present invention, the number of the power modules 30 may be plural, the plural power modules 30 are stacked, the first heat dissipation plate 21 and the second heat dissipation plate 22 are correspondingly disposed in plural groups, and a runner plate may be disposed between the adjacent first heat dissipation plate 21 and second heat dissipation plate 22, and the runner plate may form a runner groove structure to cooperate with the first heat dissipation plate 21 or the second heat dissipation plate 22 to form a runner, so as to implement water cooling heat dissipation for each power module 30, or the first heat dissipation plate 21 and the second heat dissipation plate 22 may form a runner groove structure, so that the adjacent two first heat dissipation plates 21 and the second heat dissipation plate 22 may cooperate to form a runner cavity structure, so as to meet cooling requirements of the plural power modules 30. The multiple power modules 30 are provided in this embodiment, so that the inverter brick structure 100 can meet the requirements of more usage scenarios, and the application scenarios of the inverter brick structure 100 in this embodiment are enlarged.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, or in communication, directly connected, or indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.

Claims (15)

1. An inversion brick structure, characterized by comprising:
the capacitor module comprises a capacitor shell, and a first runner groove is formed in one side surface of the capacitor shell;
The first radiating plate is arranged on one side of the capacitor module and covers the opening of the first runner groove;
The power module is arranged on one side, away from the capacitor module, of the first radiating plate and is connected with the first radiating plate;
The second radiating plate is connected with the power module and is arranged on one side of the power module, which is far away from the first radiating plate, and the second radiating plate, the power module and the first radiating plate are arranged in a stacked mode along the thickness direction of the first radiating plate;
The first cooling plate is provided with a first liquid inlet hole and a first liquid outlet hole which are communicated with the first flow channel groove, the second cooling plate is provided with a second liquid inlet hole and a second liquid outlet hole which are communicated with the second cooling plate in the thickness direction of the second cooling plate, the first liquid inlet hole is communicated between the second liquid inlet hole and the first flow channel groove, and the first liquid outlet hole is communicated between the second liquid outlet hole and the first flow channel groove;
The base plate, be equipped with the second runner groove on the base plate, the second heating panel lid is established the opening in second runner groove, the second feed liquor hole with the second goes out the liquid hole all with second runner groove intercommunication, the tank bottom in second runner groove is formed with inlet and liquid outlet.
2. The inverted tile structure of claim 1, wherein at least one of the capacitor module and the first heat sink plate is provided with a first mounting groove extending in a ring shape along a peripheral edge of the first flow channel groove, and further comprising a first seal disposed within the first mounting groove, the first seal being connected between the capacitor module and the first heat sink plate.
3. The inverted tile structure of claim 1, wherein the capacitive module further comprises a capacitive core disposed within the capacitive housing, the first flow channel being isolated from the capacitive core by a portion of the capacitive housing.
4. The inverted tile structure of claim 3, wherein the capacitor housing is a plastic piece.
5. The inverted tile structure of claim 3, wherein the capacitor housing is a plastic part and the first heat dissipating plate is a metal part.
6. The inverted tile structure of claim 1, wherein the first heat spreader is welded to the power module, or wherein a heat conducting member is filled between the first heat spreader and the power module;
And the second radiating plate is welded with the power module, or a heat conducting piece is filled between the second radiating plate and the power module.
7. The inverted tile structure of claim 1, further comprising:
The first support platform is arranged between the first heat dissipation plate and the second heat dissipation plate, extends into a ring shape along the peripheral edge of the first liquid inlet hole, and defines a first communication hole for communicating the first liquid inlet hole and the second liquid inlet hole;
The second supporting platform is arranged between the first heat dissipation plate and the second heat dissipation plate, extends into a ring shape along the peripheral edge of the first liquid outlet hole, and defines a second communication hole for communicating the first liquid outlet hole and the second liquid outlet hole.
8. The inverted tile structure of claim 7, wherein the first support stand is integrally formed with one of the first heat spreader and the second heat spreader;
The second supporting table is integrally formed with one of the first heat dissipation plate and the second heat dissipation plate.
9. The tile structure of claim 8, wherein at least one of the base plate and the second heat sink plate is provided with a fourth mounting groove extending in a ring shape along a peripheral edge of the second flow channel, and further comprising a fourth seal provided in the fourth mounting groove, the fourth seal being sealingly connected between the base plate and the second heat sink plate.
10. The inverted tile structure of claim 1, further comprising a circuit board disposed on a side of the capacitive module in the first direction, the circuit board being mounted on the capacitive module.
11. The inverted tile structure of claim 1, wherein the capacitor module comprises a capacitor housing, the inverted tile structure further comprising a three-phase copper bar, the three-phase copper bar being fixedly connected to the capacitor housing.
12. A motor controller comprising a casing and the inverter brick structure according to any one of claims 1 to 11, the inverter brick structure being mounted on the casing.
13. The motor controller of claim 12 wherein the inverter brick structure comprises a base plate configured as part of the housing or the base plate is disposed within the housing.
14. A power assembly is characterized in that, comprising the motor controller of claim 12.
15. A vehicle is characterized in that, comprising the locomotion assembly of claim 14.
CN202410842463.6A 2024-06-27 2024-06-27 Inverter brick structure, motor controller, powertrain and vehicle having the same Active CN118399773B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410842463.6A CN118399773B (en) 2024-06-27 2024-06-27 Inverter brick structure, motor controller, powertrain and vehicle having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410842463.6A CN118399773B (en) 2024-06-27 2024-06-27 Inverter brick structure, motor controller, powertrain and vehicle having the same

Publications (2)

Publication Number Publication Date
CN118399773A CN118399773A (en) 2024-07-26
CN118399773B true CN118399773B (en) 2025-01-14

Family

ID=91996214

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202410842463.6A Active CN118399773B (en) 2024-06-27 2024-06-27 Inverter brick structure, motor controller, powertrain and vehicle having the same

Country Status (1)

Country Link
CN (1) CN118399773B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118739866A (en) * 2024-09-04 2024-10-01 深蓝汽车南京研究院有限公司 Flat-lay inverter brick assembly and vehicle

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219499230U (en) * 2023-02-09 2023-08-08 比亚迪股份有限公司 Inverter with a power supply
CN221127778U (en) * 2023-10-09 2024-06-11 格至达智能科技(江苏)有限公司 Power capacitor module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059404B2 (en) * 2008-10-09 2011-11-15 GM Global Technology Operations LLC Power inverters
CN105578838B (en) * 2014-10-16 2018-01-05 中山大洋电机股份有限公司 A kind of electric machine controller
CN116800082A (en) * 2022-03-18 2023-09-22 北京车和家汽车科技有限公司 Motor controller, motor controller installation assembly and vehicle
CN219812082U (en) * 2023-02-07 2023-10-10 华为数字能源技术有限公司 Inverter applied to motor controller, motor controller and vehicle
CN221175976U (en) * 2023-10-30 2024-06-18 华为数字能源技术有限公司 Double-sided radiating motor controller of capacitor module, power assembly and vehicle
CN117690726A (en) * 2023-10-30 2024-03-12 华为数字能源技术有限公司 A motor controller, powertrain and vehicle

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219499230U (en) * 2023-02-09 2023-08-08 比亚迪股份有限公司 Inverter with a power supply
CN221127778U (en) * 2023-10-09 2024-06-11 格至达智能科技(江苏)有限公司 Power capacitor module

Also Published As

Publication number Publication date
CN118399773A (en) 2024-07-26

Similar Documents

Publication Publication Date Title
US10414286B1 (en) Hybrid power control unit for vehicle
EP3518413B1 (en) Power conversion device
CN215453694U (en) Motor controller and vehicle with same
CN118399773B (en) Inverter brick structure, motor controller, powertrain and vehicle having the same
CN109413958B (en) Vehicle-mounted charger device and automobile
CN113572314B (en) Multifunctional controller and power assembly
CN214707588U (en) Motor controller and vehicle
JP4827770B2 (en) Cooling casing and inverter device using the cooling casing
CN219499230U (en) Inverter with a power supply
CN117747301A (en) Film capacitor module integrated with EMC filter capacitor and motor controller
CN214822623U (en) Integrated controller for electric automobile
CN113437037B (en) Package cooling device for power semiconductor
CN212752103U (en) Modular power module
CN118572993B (en) Inverter, motor controller, motor assembly and vehicle
CN221043589U (en) Power device module, power supply system and vehicle
CN222128447U (en) Inverter module, inverter and automobile
CN222515467U (en) Motor Controllers and Vehicles
CN216532366U (en) Radiator, PINFEN formula module and flat-plate module radiator
CN221948635U (en) Motor controller and vehicle
CN222146002U (en) Film capacitor, motor controller assembly and driving motor
CN115249672B (en) IGBT module, motor controller and vehicle
CN222706411U (en) Power module and inverter
CN219842985U (en) Power assembly and vehicle
CN219576843U (en) Power supply device
CN222421651U (en) A new power module and motor controller

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant