CN118399088B - Marine multi-frequency layer-selecting radome and low-loss preparation method thereof - Google Patents
Marine multi-frequency layer-selecting radome and low-loss preparation method thereof Download PDFInfo
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- CN118399088B CN118399088B CN202410814596.2A CN202410814596A CN118399088B CN 118399088 B CN118399088 B CN 118399088B CN 202410814596 A CN202410814596 A CN 202410814596A CN 118399088 B CN118399088 B CN 118399088B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 248
- 239000004744 fabric Substances 0.000 claims abstract description 46
- 239000000835 fiber Substances 0.000 claims abstract description 44
- 239000002356 single layer Substances 0.000 claims abstract description 33
- 239000006260 foam Substances 0.000 claims abstract description 19
- 238000012545 processing Methods 0.000 claims abstract description 15
- 238000007493 shaping process Methods 0.000 claims abstract description 9
- 239000012792 core layer Substances 0.000 claims abstract description 6
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- 238000001723 curing Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 238000000748 compression moulding Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000001914 filtration Methods 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
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- 238000003856 thermoforming Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
- H01Q15/0026—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices having a stacked geometry or having multiple layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/34—Adaptation for use in or on ships, submarines, buoys or torpedoes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
- H01Q1/422—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising two or more layers of dielectric material
- H01Q1/424—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising two or more layers of dielectric material comprising a layer of expanded material
Landscapes
- Details Of Aerials (AREA)
Abstract
The invention provides a multi-frequency layer-selecting radome for a ship and a low-loss preparation method thereof. The low-loss preparation method of the multi-frequency selective layer radome for the ship comprises the following steps of: determining the number N of fiber cloth layers forming the medium layer according to the thickness of the core layer of the frequency selective layer, and hot-pressing the N layers of fiber cloth to form a prefabricated medium layer; a first single-layer fiber cloth, a plurality of flexible frequency-selective microstrip circuit layers and a second single-layer fiber cloth are sequentially arranged in an aligned manner from top to bottom, a prefabricated medium layer is arranged between every two flexible frequency-selective microstrip circuit layers, and after the aligned arrangement, the frequency-selective layers are formed through hot press molding; and sequentially paving the first skin layer, the first foam layer, the frequency selection layer, the second foam layer and the second skin layer on a forming die, and sequentially packaging, curing and shaping the first skin layer, the first foam layer, the frequency selection layer, the second foam layer and the second skin layer to form the radome. The low-loss preparation method provided by the invention can improve the overall processing precision of the marine multi-frequency layer-selecting radome, thereby improving the stealth and filtering performance of the radome.
Description
Technical Field
The invention relates to the technical field of processing technology of marine auxiliary radomes, in particular to a marine multi-frequency layer-selecting radome and a low-loss preparation method thereof.
Background
Based on the electromagnetic compatibility of the antenna and the stealth design requirement of radar waves, the surrounding of the antenna of the large-scale platform electronic equipment gradually adopts a marine multi-frequency layer-selecting antenna housing to realize specific electromagnetic compatibility and stealth functions.
In order to improve the stealth effect of a discrete antenna, a traditional marine multi-frequency selective layer radome comprises a first skin layer, a first foam layer and frequency selective layers (electromagnetic functional materials formed by laminating and paving one or more flexible frequency selective microstrip circuits, wherein each flexible frequency selective microstrip circuit layer is supported by a low-loss dielectric layer, the dielectric layer is usually made of multi-layer glass fiber cloth), a second foam layer and a second skin layer, wherein the frequency selective layers are of multi-layer (more than two layers are referred to as more than two layers and the same as each other) flexible frequency selective microstrip circuit structures, and each layer of the marine multi-frequency selective layer radome is formed by one-step paving through a vacuum hot pressing technology. The one-step paving and shaping technology is to finish the paving of the frequency selective layer by layer on the surface of the shaping mould of the marine multi-frequency selective layer radome, and finish the processing of the frequency selective layer by adopting a glass fiber resin vacuum bag pressing shaping technology. The defects mainly include the following points:
(1) Because the thickness of the flexible frequency selection microstrip circuit layer is small (about 0.1 mm), the base material of the flexible frequency selection microstrip circuit can deform by itself in the one-time paving and shaping process of the flexible frequency selection microstrip circuit layer and glass fiber resin, so that alignment errors are out of standard (when the frequency selection layer is formed by paving the multi-frequency selection microstrip circuits layer by layer, up-and-down alignment errors of patterns among the plurality of frequency selection microstrip circuits are a key core parameter in the processing of the frequency selection layer);
(2) Because the interlayer medium of the multi-frequency selective layer radome for the ship is made of glass fiber reinforced plastic materials, in the one-time paving and shaping process, the thickness of the medium between the multi-layer flexible frequency selective microstrip circuits is generally controlled by the number of glass fiber cloth layers, the overall processing precision requirement of the frequency selective core layer is much higher (more than one order of magnitude higher) than that of the conventional glass fiber reinforced resin composite material process, the prior art is not easy to achieve the interlayer medium thickness precision control requirement of the flexible frequency selective microstrip circuits, and the medium thickness error exceeds the standard (the medium thickness error refers to the error between the medium thickness and the theoretical thickness among a plurality of frequency selective microstrip circuits forming the frequency selective layer, and is another key core parameter in the processing of the frequency selective layer);
(3) In the traditional processing process of the marine multi-frequency selective layer radome, a single-layer structure of a radome frequency band core layer is formed by transversely splicing a plurality of flexible frequency selective microstrip circuits (generally square), a plurality of splicing gaps exist in the whole radome, when the outer size of the marine multi-frequency selective layer radome is larger than the maximum applicable power frequency selective layer size, the gaps between the frequency selective layer and the adjacent frequency selective layers or the frequency selective layers at the splicing gaps are discontinuous, insertion loss (the insertion loss refers to the attenuation amplitude of field intensity after the radar antenna radiates electromagnetic waves and passes through the marine multi-frequency selective layer radome, the insertion loss leads to the detection distance of electronic equipment to be reduced, and the larger the insertion loss is, the influence on the detection distance of radar is larger), so that the adaptability of the antenna is seriously reduced.
Disclosure of Invention
The invention mainly aims to provide a marine multi-frequency selective layer radome and a low-loss preparation method thereof, and aims to improve the overall processing precision of the marine multi-frequency selective layer radome, so as to improve the stealth and filtering performance of the marine multi-frequency selective layer radome.
In order to achieve the above purpose, the invention provides a low-loss preparation method of a multi-frequency layer-selecting radome for a ship, which comprises the following steps:
Determining the number N of fiber cloth layers forming the medium layer according to the thickness of the core layer of the frequency selective layer, and hot-pressing the N layers of fiber cloth to form a prefabricated medium layer;
A first single-layer fiber cloth, a plurality of flexible frequency-selective microstrip circuit layers and a second single-layer fiber cloth are sequentially arranged in an aligned manner from top to bottom, a prefabricated medium layer is arranged between every two flexible frequency-selective microstrip circuit layers, and after the aligned arrangement, the frequency-selective layers are formed through hot press molding;
And sequentially paving the first skin layer, the first foam layer, the frequency selection layer, the second foam layer and the second skin layer on a forming die, and sequentially packaging, curing and shaping the first skin layer, the first foam layer, the frequency selection layer, the second foam layer and the second skin layer to form the radome.
Preferably, an alignment fixture is used for installing the first single-layer fiber cloth, the multi-layer flexible frequency-selective microstrip circuit layer and the second single-layer fiber cloth, wherein the alignment fixture comprises a bottom plate and a positioning column fixed on the bottom plate, and the positioning column is used for penetrating through positioning holes in the first single-layer fiber cloth, the multi-layer flexible frequency-selective microstrip circuit layer, the prefabricated medium layer and the second single-layer fiber cloth.
Preferably, the N layers of fiber cloth are formed into the prefabricated medium layer by adopting a compression molding thermal forming process.
Preferably, after the first single-layer fiber cloth, the multi-layer flexible frequency selective microstrip circuit layer, the second single-layer fiber cloth and the prefabricated medium layer are arranged on the alignment tool, the frequency selective layer is preformed by adopting a vacuum hot-press forming process.
Preferably, the frequency selective layer is formed by splicing a plurality of frequency selective layer units.
Preferably, when two adjacent frequency selective layer units are spliced, the distance between the two frequency selective layer units is the distance of a complete period unit of the frequency selective microstrip circuit, the splicing unit is adopted for splicing, and the splicing unit is a flexible frequency selective microstrip circuit layer bonded on the medium layer.
Preferably, the flexible frequency selective microstrip circuit layer on the splicing unit is provided with a first unit circuit, a second unit circuit and a third unit circuit, the third unit circuit is a complete cycle unit of the frequency selective microstrip circuit, the first unit circuit is correspondingly arranged with the edge side unit circuit of one frequency selective layer unit, the second unit circuit is correspondingly arranged with the edge side unit circuit of the other frequency selective layer unit, and after the splicing unit is aligned with a gap between the two frequency selective layer units, the two frequency selective layer units and the splicing unit are stuck together through an adhesive tape.
Preferably, the length of the splicing unit is the same as the length of the gap between the adjacent two frequency selective layer units.
Preferably, the first single-layer fiber cloth, the multi-layer flexible frequency-selective microstrip circuit layer and the second single-layer fiber cloth are sequentially arranged in an aligned manner from top to bottom, a layer of prefabricated medium layer is arranged between every two flexible frequency-selective microstrip circuit layers, and after the step of hot press forming the frequency-selective layer after the aligned arrangement, the method further comprises the following steps:
and detecting the electrical property of the frequency selective layer, and checking the consistency of processing.
The invention further provides a marine multi-frequency layer-selecting antenna housing, which is manufactured by adopting the low-loss manufacturing method of the marine multi-frequency layer-selecting antenna housing.
The low-loss preparation method provided by the invention can improve the overall processing precision of the marine multi-frequency layer-selecting radome, thereby improving the stealth and filtering performance of the radome. The low-loss preparation method has simple process and easy operation, can control the interlayer dielectric thickness error of the multi-frequency selective layer radome within 0.05mm, can reduce the interlayer alignment precision to within 0.3mm, and reduces the insertion loss caused by the splicing gap by 44% (the frequency selective interlayer alignment error, the frequency selective interlayer dielectric thickness error and the frequency selective splicing gap are the main reasons for forming the traditional multi-frequency selective layer radome with larger insertion loss).
Drawings
FIG. 1 is a schematic structural view of a marine multi-frequency selective layer radome of the present invention;
FIG. 2 is a schematic flow chart of a method for manufacturing a low-loss multi-frequency selective layer radome for a ship according to the present invention;
FIG. 3 is a schematic process diagram of a multi-frequency selective layer spliced in a gap in the low-loss manufacturing method of the marine multi-frequency selective layer radome of the present invention;
Fig. 4 is a schematic diagram of an alignment principle of an alignment tool in the low-loss manufacturing method of the marine multi-frequency selective layer radome according to the present invention;
fig. 5 is a diagram showing a comparison between a low-loss manufacturing method of a multi-frequency selective layer radome for a ship and a transmission characteristic simulation of a structure of a prior art frequency selective material.
In the figure, 1-first skin layer, 2-first foam layer, 3-frequency selective layer, 4-second foam layer, 5-second skin layer, 6-first frequency selective layer unit, 7-splicing unit, 8-second frequency selective layer unit, 9-alignment fixture, 10-positioning column, 11-fiber cloth and 12-flexible frequency selective microstrip circuit layer.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The invention provides a low-loss preparation method of a marine multi-frequency layer-selecting radome.
Referring to fig. 1 to 4, in the preferred embodiment, a method for manufacturing a low-loss multi-frequency selective layer radome for a ship includes the following steps:
Step S10, determining the number N of fiber cloth layers forming a medium layer according to the thickness of the core layer of the frequency selective layer 3, and hot-pressing the N layers of fiber cloth to form a prefabricated medium layer;
step S20, sequentially aligning and installing a first single-layer fiber cloth, a plurality of flexible frequency selective microstrip circuit layers 12 and a second single-layer fiber cloth from top to bottom, arranging a prefabricated medium layer between every two flexible frequency selective microstrip circuit layers 12, and performing hot press molding to form a frequency selective layer 3 after aligned installation;
Step S30, sequentially paving the first skin layer 1, the first foam layer 2, the frequency selective layer 3, the second foam layer 4 and the second skin layer 5 (resin glue is needed to be used in paving) on a forming die, sequentially packaging, curing (resin glue is melted and then solidified in curing, so that multiple layers are adhered together) and shaping to form the radome.
In step S10, the N layers of fiber cloth are formed into a prefabricated medium layer by adopting a compression molding thermal forming process. The dimensions of the media preform were inspected after the compression thermoforming process was completed.
Further, step S20 further includes:
Step S21, the electrical property of the frequency selective layer 3 is detected, and the consistency of the processing is checked.
In step S20, the flexible frequency selective microstrip circuit layer 12 may be subjected to laser etching or chemical etching to complete the processing of the copper foil pattern.
Specifically, referring to fig. 4, step S20 uses an alignment tool 9 to install the first single-layer fiber cloth, the multi-layer flexible frequency selective microstrip circuit layer 12, and the second single-layer fiber cloth, where the alignment tool 9 includes a bottom plate and a positioning post 10 fixed on the bottom plate, and the positioning post 10 is used to pass through positioning holes in the first single-layer fiber cloth, the multi-layer flexible frequency selective microstrip circuit layer 12, the prefabricated dielectric layer, and the second single-layer fiber cloth. A single-layer fiber cloth is arranged on the upper side and the lower side of the multi-layer flexible frequency selective microstrip circuit layer 12 so as to facilitate the adhesion of the frequency selective layer 3 and the foam layer.
Specifically, after the first single-layer fiber cloth, the multi-layer flexible frequency selective microstrip circuit layer 12, the second single-layer fiber cloth and the prefabricated medium layer are installed on the alignment tool 9, the preforming of the frequency selective layer 3 is completed by adopting a vacuum hot-press forming process (the subsequent hot pressing is directly performed on the alignment tool 9).
Because the size of the frequency selective layer 3 is large, a plurality of frequency selective layer units are needed to be transversely spliced. Because the electrical continuity between the two frequency selective layer units of the splice gap is damaged, the damaged copper foil becomes an electromagnetic wave scattering structure, and the insertion loss is obviously improved.
Therefore, the application provides a splicing gap repairing process, which specifically comprises the following steps: when adjacent two frequency selective layer units are spliced, the distance between the two frequency selective layer units is the distance of a complete period unit of the frequency selective microstrip circuit, the splicing unit 7 is adopted for splicing, and the splicing unit 7 is a flexible frequency selective microstrip circuit layer 12 bonded on a medium layer.
The flexible frequency selection microstrip circuit layer 12 on the splicing unit 7 is provided with a first unit circuit, a second unit circuit and a third unit circuit, wherein the third unit circuit is a complete cycle unit of the frequency selection microstrip circuit, the first unit circuit is correspondingly arranged with the edge side unit circuit of one frequency selection layer unit, the second unit circuit is correspondingly arranged with the edge side unit circuit of the other frequency selection layer unit, and after the splicing unit 7 is aligned with a gap between the two frequency selection layer units, the two frequency selection layer units and the splicing unit 7 are adhered together through an adhesive tape. The length of the splicing unit 7 is the same as the length of the gap between the adjacent two frequency selective layer units. When the splicing unit 7 is used, the gap below the gap between the two frequency selective layer units is filled with resin glue.
At the time of splicing, referring to fig. 3, the specific manner is as follows: firstly, cutting the splicing edges of a first frequency selective layer unit 6 and a second frequency selective layer unit 8, ensuring that frequency selective microstrip circuits at the edges of the first frequency selective layer unit 6 and the second frequency selective layer unit 8 are complete and unbroken, placing the first frequency selective layer unit 6 and the second frequency selective layer unit 8 on a splicing platform, and adjusting the interval between the first frequency selective layer unit 6 and the second frequency selective layer unit 8 by facing the metal surface upwards so that the interval between the gaps between the first frequency selective layer unit 6 and the second frequency selective layer unit 8 is just the size of a complete period unit. The metal surface of the splicing unit 7 is downward, the first unit circuit pattern on the left side of the splicing unit 7 is aligned with the periodic unit pattern on the edge of the first frequency selective layer unit 6, the second unit circuit pattern on the right side of the splicing unit 7 is aligned with the periodic unit pattern on the edge of the second frequency selective layer unit 8, the first frequency selective layer unit 6 aligned by adopting an ultrathin adhesive tape is fixed with the splicing unit 7, and the second frequency selective layer unit 8 aligned by adopting the ultrathin adhesive tape is fixed with the splicing unit 7.
Fig. 5 shows a comparison of the result of the wave-transmitting rate test of the template processed by the present low-loss preparation method and the result of the wave-transmitting rate test of the template processed by the conventional processing technology, in which the splice gap of the frequency selective layer 3 is arranged in the center of the template, the overall insertion loss of the template of the marine multi-frequency selective layer radome is slightly larger, the insertion loss at the splice gap is significantly increased, and the overall insertion loss and the insertion loss at the splice gap are significantly reduced after the low-loss composite technology of the multi-frequency selective layer 3 radome is adopted.
The low-loss preparation method provided by the embodiment can improve the overall processing precision of the marine multi-frequency layer-selecting radome, thereby improving the stealth and filtering performance of the radome. The low-loss preparation method has simple process and easy operation, can control the interlayer dielectric thickness error of the multi-frequency selective layer 3 radome within 0.05mm, can reduce the interlayer alignment accuracy to within 0.3mm, and reduces the insertion loss caused by the splicing gap by 44% (the alignment error between the frequency selective layers 3, the dielectric thickness error between the frequency selective layers 3 and the frequency selective splicing gap are the main reasons for forming the traditional multi-frequency selective layer 3 radome with larger insertion loss).
The invention further provides a multi-frequency layer-selecting radome for a ship.
In the preferred embodiment, the marine multi-frequency layer-selecting radome is manufactured by adopting the low-loss manufacturing method of the marine multi-frequency layer-selecting radome.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but is intended to cover all equivalent structures modifications, direct or indirect application in other related arts, which are included in the scope of the present invention.
Claims (6)
1. The low-loss preparation method of the marine multi-frequency layer-selecting radome is characterized by comprising the following steps of:
Determining the number N of fiber cloth layers forming the medium layer according to the thickness of the core layer of the frequency selective layer, and hot-pressing the N layers of fiber cloth to form a prefabricated medium layer;
A first single-layer fiber cloth, a plurality of flexible frequency selective microstrip circuit layers and a second single-layer fiber cloth are sequentially arranged in an aligned manner from top to bottom, a prefabricated medium layer is arranged between every two flexible frequency selective microstrip circuit layers, and after the aligned arrangement, the single-layer fiber cloth, the flexible frequency selective microstrip circuit layers and the prefabricated medium layer are subjected to hot press molding to form the frequency selective layer;
Sequentially paving the first skin layer, the first foam layer, the frequency selection layer, the second foam layer and the second skin layer on a forming die, and sequentially packaging, curing and shaping the first skin layer, the first foam layer, the frequency selection layer, the second foam layer and the second skin layer to form the radome;
The frequency selective layer is formed by splicing a plurality of frequency selective layer units; when adjacent two frequency selective layer units are spliced, the distance between the two frequency selective layer units is the distance of a complete period unit of the frequency selective microstrip circuit, the splicing unit is adopted for splicing, and the splicing unit is a flexible frequency selective microstrip circuit layer adhered on the dielectric layer; the flexible frequency selection microstrip circuit layer on the splicing unit is provided with a first unit circuit, a second unit circuit and a third unit circuit, the third unit circuit is a complete cycle unit of the frequency selection microstrip circuit, the first unit circuit is correspondingly arranged with the edge side unit circuit of one frequency selection layer unit, the second unit circuit is correspondingly arranged with the edge side unit circuit of the other frequency selection layer unit, the splicing unit is aligned to a gap between the two frequency selection layer units, and then the two frequency selection layer units and the splicing unit are stuck together through an adhesive tape; the length of the splicing unit is the same as the length of the gap between the two adjacent frequency selective layer units.
2. The method for manufacturing the low-loss multi-frequency selective layer radome for the ship according to claim 1, wherein an alignment tool is used for installing the first single-layer fiber cloth, the multi-layer flexible frequency selective microstrip circuit layer and the second single-layer fiber cloth, wherein the alignment tool comprises a bottom plate and a positioning column fixed on the bottom plate, and the positioning column is used for penetrating through positioning holes in the first single-layer fiber cloth, the multi-layer flexible frequency selective microstrip circuit layer, the prefabricated medium layer and the second single-layer fiber cloth.
3. The method for manufacturing the low-loss multi-frequency selective layer radome for the ship according to claim 1, wherein the N-layer fiber cloth is formed into the prefabricated dielectric layer by adopting a compression molding thermal forming process.
4. The method for manufacturing the low-loss multi-frequency selective layer radome for the ship according to claim 1, wherein after the first single-layer fiber cloth, the multi-layer flexible frequency selective microstrip circuit layer, the second single-layer fiber cloth and the prefabricated medium layer are arranged on the alignment tool, the preforming of the frequency selective layer is completed by adopting a vacuum hot-press forming process.
5. The method for manufacturing the low-loss multi-frequency selective layer radome for the ship according to any one of claims 1 to 4, wherein a first single-layer fiber cloth, a plurality of flexible frequency selective microstrip circuit layers and a second single-layer fiber cloth are sequentially arranged in an aligned manner from top to bottom, a prefabricated medium layer is arranged between every two flexible frequency selective microstrip circuit layers, and after the step of hot press molding into the frequency selective layer after the aligned arrangement, the method further comprises:
and detecting the electrical property of the frequency selective layer, and checking the consistency of processing.
6. A multi-frequency selective layer radome for a ship, which is characterized by being manufactured by adopting the low-loss manufacturing method of the multi-frequency selective layer radome for the ship according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202410814596.2A CN118399088B (en) | 2024-06-24 | 2024-06-24 | Marine multi-frequency layer-selecting radome and low-loss preparation method thereof |
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| CN202410814596.2A CN118399088B (en) | 2024-06-24 | 2024-06-24 | Marine multi-frequency layer-selecting radome and low-loss preparation method thereof |
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| CN118399088B true CN118399088B (en) | 2024-08-23 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102806697A (en) * | 2011-06-01 | 2012-12-05 | 深圳光启高等理工研究院 | Dielectric substrate splicing structure and metamaterial |
| CN105186131A (en) * | 2015-07-13 | 2015-12-23 | 中国电子科技集团公司第十研究所 | Preparation method of multilayer FSS antenna radome anti-media substrate layering |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108123222A (en) * | 2017-12-08 | 2018-06-05 | 中国船舶重工集团公司第七二四研究所 | The joining method of printed board in a kind of frequency selection antenna house processing technology |
| CN108539424A (en) * | 2018-05-29 | 2018-09-14 | 中国舰船研究设计中心 | Dual band frequencies select composite material sandwich structure and its manufacturing method |
| CN117855823A (en) * | 2023-12-18 | 2024-04-09 | 中国电子科技集团公司第十研究所 | Preparation method of low-profile multilayer frequency selective surface composite antenna housing |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102806697A (en) * | 2011-06-01 | 2012-12-05 | 深圳光启高等理工研究院 | Dielectric substrate splicing structure and metamaterial |
| CN105186131A (en) * | 2015-07-13 | 2015-12-23 | 中国电子科技集团公司第十研究所 | Preparation method of multilayer FSS antenna radome anti-media substrate layering |
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