CN118398577B - Multi-chip packaging structure capable of enhancing stability - Google Patents
Multi-chip packaging structure capable of enhancing stability Download PDFInfo
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- CN118398577B CN118398577B CN202410865037.4A CN202410865037A CN118398577B CN 118398577 B CN118398577 B CN 118398577B CN 202410865037 A CN202410865037 A CN 202410865037A CN 118398577 B CN118398577 B CN 118398577B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 174
- 238000007789 sealing Methods 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000006698 induction Effects 0.000 claims abstract description 14
- 239000000428 dust Substances 0.000 claims abstract description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 54
- 238000009434 installation Methods 0.000 claims description 24
- 230000005855 radiation Effects 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000000110 cooling liquid Substances 0.000 claims description 5
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
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- 230000005611 electricity Effects 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 16
- 238000013461 design Methods 0.000 abstract description 12
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 3
- 230000002265 prevention Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000003292 glue Substances 0.000 description 7
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 239000002826 coolant Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
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- 239000011425 bamboo Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a multi-chip packaging structure for enhancing stability, and belongs to the technical field of chip packaging. The invention comprises a packaging substrate, an upper sealing cover and a plurality of chips, and also comprises: the heat-conducting rubber pad, the mounting bracket, the heat dissipation assembly and the induction exhaust assembly; according to the invention, through the top and bottom sectional heat dissipation design, the bottom of the chip is positioned and thermally conductive by utilizing the thermal conductive rubber pad, the mounting stability of the chip is obviously improved by combining the arrangement of the mounting bracket, and then the heat generated by the chip is effectively conducted to the outside by utilizing the boss as a heat conduction point, and the heat dissipation and dust prevention are both realized; the heat dissipation channel is opened by pushing the sealing push plate under the combined action of the thermal expansion of nitrogen and the thermal expansion of air, so that the hot air is allowed to be discharged, and the heat dissipation performance of the heat dissipation module is enhanced; secondly, high-pressure nitrogen gas also serves as a heat transfer medium, helps the heat conduction cylinder transfer heat to the piston and the push rod, enables the push rod to extend out of the heat dissipation channel due to thermal expansion, and further improves the heat dissipation efficiency of the packaging structure.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a multi-chip packaging structure for enhancing stability.
Background
The chip package structure is a shell for mounting semiconductor integrated circuit chips, plays roles of placing, fixing, sealing, protecting chips and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chips with external circuits, and contacts on the chips are connected to pins of the package shell by wires, and the pins are connected with other devices by wires on a printed board.
Multichip integrated packages are currently more common, but more packaging methods currently have the following drawbacks in practical use: firstly, due to the increase of the number of chips and the improvement of the integration level, a large amount of heat is generated during working, the traditional packaging mode is difficult to consider dustproof performance when the heat dissipation effect is pursued, and dust and impurities easily enter the package due to the existence of a heat dissipation channel or a heat dissipation hole, so that the stability and the reliability of the chips are affected; secondly, during the mounting and testing stage of the package structure, various impacts and vibrations may be affected, which may cause cracks, breaks or other forms of damage to the package structure, and the damaged package structure cannot effectively exert its heat dissipation effect, so that heat generated by the chip operation cannot be effectively dissipated, and thus damage to the semiconductor chip and product reliability problems may be caused.
How to develop a multi-chip package structure with enhanced robustness to improve these problems is a urgent problem for those skilled in the art.
Disclosure of Invention
In order to overcome the above disadvantages, the present invention provides a multi-chip package structure with enhanced stability, which aims to improve the above-mentioned problems.
The invention is realized in the following way:
the invention provides a multi-chip packaging structure for enhancing stability, which comprises a packaging substrate, an upper sealing cover and a plurality of chips, wherein the upper sealing cover is buckled on the packaging substrate, pins are arranged at the bottoms of the chips, a plurality of mounting cavities are arranged on the packaging substrate in a cross-shaped separation mode, pin connecting grooves matched with the pins are arranged at the bottoms of the mounting cavities, and the pin connecting grooves are electrically connected with the corresponding pins, and the multi-chip packaging structure further comprises:
the heat conduction rubber pad: the heat-conducting rubber pad is arranged between the mounting cavity and the chip and is used for conducting heat to the bottom of the chip for positioning;
an outer heat dissipation chamber and an inner heat dissipation chamber: the outer side heat dissipation cavity and the inner side heat dissipation cavity are arranged on two sides of the mounting cavity, gaps exist between the adjacent outer side heat dissipation cavity and the adjacent inner side heat dissipation cavity, the outer side heat dissipation cavity and the inner side heat dissipation cavity are used for guiding out heat generated at the bottom of the chip, and meanwhile the probability that external water vapor or dust enters the mounting cavity can be reduced;
And (2) mounting a bracket: the mounting bracket is arranged between the chip and the upper sealing cover and is used for supporting and positioning the top of the chip;
and a heat radiation assembly: the heat dissipation assembly is arranged on the mounting bracket and is used for dissipating heat at the top of the chip;
inductive exhaust assembly: the induction exhaust assembly is arranged inside the heat dissipation assembly, and the induction exhaust assembly is used for controlling exhaust according to the temperature of the heat dissipation assembly.
Preferably, the lateral wall symmetry of installation cavity is provided with the constant head tank, the both ends fixedly connected with of heat conduction cushion with constant head tank assorted locating piece, inside the packing of heat conduction cushion has the heat conduction glue, corresponds the pin the side of heat conduction cushion is provided with incompletely surrounds, incompletely surrounded lateral wall is provided with the nozzle that runs through in the heat conduction cushion inner chamber, the nozzle is pressure type setting.
Preferably, the outside heat dissipation chamber is located the outside of encapsulation base plate, the inboard heat dissipation chamber is located the inboard of encapsulation base plate, the tip in outside heat dissipation chamber runs through in the lateral wall of installation chamber and the lateral wall of encapsulation base plate respectively, the tip in inboard heat dissipation chamber runs through in the lateral wall of installation chamber and the diapire of encapsulation base plate respectively, be close to in the installation chamber the port in outside heat dissipation chamber and inboard heat dissipation chamber is all higher than the bottom of installation chamber, be close to in the installation chamber the port in outside heat dissipation chamber and inboard heat dissipation chamber is less than other end port, the cross-section in outside heat dissipation chamber is the setting of upwards slope, the cross-section in inboard heat dissipation chamber is L shape setting.
Preferably, the bottom fixedly connected with baffle of installing support, the top fixedly connected with location cavity of installing support, the lateral wall of location cavity offsets with the lateral wall of installation cavity, the diapire of baffle offsets with the upper lateral wall of chip, the top of location cavity flushes with the upper lateral wall of encapsulation base plate, the diapire of upper cover is provided with the apron with location cavity assorted.
Preferably, the radiating assembly comprises a radiating module arranged on the outer side wall of the mounting bracket and a cooling box arranged in the mounting bracket, the radiating module is positioned on one side of the mounting bracket facing the outer side wall of the packaging substrate, the radiating module consists of an upper radiating block and a lower radiating fin, an installation groove matched with the radiating module is formed in the upper side of the packaging substrate, the top of the lower radiating fin is flush with the top wall of the installation groove, the cross section of the cooling box is in a convex shape, and the cooling box is clamped and installed on the inner side of the mounting bracket.
Preferably, the cooling box is inside cavity type setting, the inside of cooling box is filled with the coolant liquid, the top of cooling box runs through in its inner chamber and is provided with annotates the liquid hole, the diapire of cooling box is provided with a plurality of bosss, boss and cooling box's inner chamber intercommunication, a plurality of the boss is matrix type and distributes, the bottom of boss offsets with the upper side wall of chip, there is the clearance between the upper side wall of bottom and the chip of cooling box, the cooling box is high heat conduction material setting.
Preferably, the induction exhaust assembly comprises a heat conduction cylinder fixedly connected with the inner side wall of the cooling tank, a piston is connected with the inner side wall of the heat conduction cylinder in a sealing sliding manner, the piston is elastically connected with the inner side top wall of the heat conduction cylinder through a connecting spring, a push rod is fixedly connected with the side wall of the piston towards the connecting spring, the end part of the push rod penetrates through the side wall of the cooling tank and extends between the upper radiating block and the lower radiating fin, a sealing push plate is fixedly connected with the end part of the push rod, a high-pressure nitrogen gas is filled between the side wall of the piston far away from the push rod and the inner cavity of the heat conduction cylinder, and the heat conduction cylinder is made of high-heat-conduction copper-nickel alloy.
Preferably, the induction exhaust assembly further comprises an air outlet groove arranged on the side wall of the mounting bracket towards the heat radiation module, the end part of the air outlet groove penetrates through the side wall of the mounting bracket, the caliber of the air outlet groove is larger than the diameter of the push rod, the sealing push plate in an initial state is positioned between the upper heat radiation block and the lower heat radiation fin, the sealing push plate is in sealing sliding connection between the upper heat radiation block and the lower heat radiation fin, and the side wall of the sealing push plate abuts against the side wall of the mounting groove.
The beneficial effects of the invention are as follows:
According to the invention, through unique top and bottom sectional heat dissipation designs, the bottom of the chip is positioned and thermally conductive by utilizing the thermal conductive rubber pad, the mounting stability of the chip is obviously improved by combining the arrangement of the mounting bracket, and then the heat generated by the chip is effectively conducted to the outside by utilizing the boss as a heat conduction point; when the chip is overheated, the sealing push plate is pushed to open the heat dissipation channel under the combined action of the thermal expansion of nitrogen and the thermal expansion of air, so that hot air is allowed to be discharged from the space between the top of the chip and the cooling box, and the heat dissipation performance of the heat dissipation module is greatly enhanced; secondly, high-pressure nitrogen is also used as a heat transfer medium to help the heat conduction cylinder to transfer heat to the piston and the push rod rapidly, so that the push rod can extend out of the heat dissipation channel due to thermal expansion, the heat dissipation efficiency is further improved, in addition, due to the existence of the air outlet groove, hot air between the top of the chip and the cooling box can be smoothly discharged, the heat dissipation efficiency is further improved, meanwhile, due to the pushing of the hot air, even if the heat dissipation channel is opened, external water vapor and dust are difficult to enter the inside of the heat dissipation system, and the dustproof performance of the system is ensured;
In summary, the multi-chip package assembly heat dissipation system of the invention realizes high-efficiency heat dissipation performance and good dustproof performance through the sectional heat dissipation design of the top and the bottom, the boss heat conduction point, the heat expansion and heat transfer effect of high-pressure nitrogen and the ingenious application of the air outlet groove, and the design not only ensures the stable operation of the chip, but also improves the reliability and the service life of the system.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an overall structure of a multi-chip package structure with enhanced robustness according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a bottom structure of a multi-chip package structure with enhanced stability according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an explosion structure of a multi-chip package structure with enhanced stability according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a multi-chip package structure with enhanced stability according to an embodiment of the present invention;
FIG. 5 is an enlarged schematic view of the structure of the portion A in FIG. 4 of a multi-chip package structure with enhanced robustness according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a package substrate with a multi-chip package structure for enhancing stability according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a mounting bracket and a heat dissipation module for a multi-chip package structure with enhanced stability according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a multi-chip package structure chip and a thermal pad for enhancing robustness according to an embodiment of the present invention;
FIG. 9 is a schematic diagram illustrating an internal structure of a multi-chip package structure with enhanced robustness according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of a multi-chip package structure induction exhaust assembly with enhanced robustness according to an embodiment of the present invention;
FIG. 11 is an enlarged schematic view of the structure of the multi-chip package structure of FIG. 10 with enhanced robustness according to an embodiment of the present invention;
fig. 12 is an enlarged schematic view of a structure of fig. 10C of a multi-chip package structure with enhanced robustness according to an embodiment of the present invention.
In the figure: 1. packaging a substrate; 2. an upper cover; 3. a heat conducting rubber pad; 4. a chip; 5. a mounting bracket; 6. a heat dissipation module; 7. a cooling box; 8. a heat conduction tube; 9. a sealing push plate; 101. an outer heat dissipation cavity; 102. an inner side heat dissipation cavity; 103. a mounting cavity; 104. a pin connection groove; 105. a positioning groove; 106. a mounting groove; 301. a nozzle; 302. a positioning block; 401. pins; 501. a partition plate; 502. positioning the cavity; 503. an air outlet groove; 601. an upper heat dissipation block; 602. a lower fin; 701. a boss; 702. a liquid injection hole; 801. a connecting spring; 802. a piston; 803. a push rod.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
Referring to fig. 1-8, a multi-chip package structure for enhancing stability includes a package substrate 1, an upper cover 2 and a plurality of chips 4, the upper cover 2 is buckled on the package substrate 1, pins 401 are disposed at the bottom of the chips 4, a plurality of mounting cavities 103 are disposed on the package substrate 1 in a cross-shaped separation manner, the mounting cavities 103 are separated in a cross-shaped manner, an independent mounting space is provided for the chips 4, pin connecting grooves 104 matched with the pins 401 are disposed at the bottom of the mounting cavities 103, and the pin connecting grooves 104 are electrically connected with the corresponding pins 401, and further includes:
Heat conduction rubber pad 3: the heat-conducting rubber pad 3 is arranged between the mounting cavity 103 and the chip 4, and the heat-conducting rubber pad 3 is used for conducting heat to the bottom of the chip 4 for positioning;
an outer heat dissipation chamber 101 and an inner heat dissipation chamber 102: the outer side heat dissipation cavity 101 and the inner side heat dissipation cavity 102 are arranged on two sides of the mounting cavity 103, gaps exist between the adjacent outer side heat dissipation cavities 101 and the adjacent inner side heat dissipation cavities 102, interference between adjacent chips 4 is avoided, the outer side heat dissipation cavities 101 and the inner side heat dissipation cavities 102 are used for guiding out heat generated at the bottoms of the chips 4, and meanwhile the probability that external water vapor or dust enters the mounting cavity 103 can be reduced;
mounting bracket 5: the mounting bracket 5 is arranged between the chip 4 and the upper sealing cover 2, and the mounting bracket 5 is used for supporting and positioning the top of the chip 4;
And a heat radiation assembly: the heat dissipation component is arranged on the mounting bracket 5 and is used for dissipating heat at the top of the chip 4;
inductive exhaust assembly: the induction exhaust assembly is arranged inside the heat dissipation assembly and is used for controlling exhaust according to the temperature of the heat dissipation assembly.
Further, the lateral wall symmetry of installation cavity 103 is provided with constant head tank 105, the both ends fixedly connected with of heat conduction cushion 3 and constant head tank 105 assorted locating piece 302 of constant head tank 105, the locating piece 302 at the both ends of heat conduction cushion 3 and the constant head tank 105 assorted of installation cavity 103 lateral wall ensure the accurate installation of heat conduction cushion 3, heat conduction cushion 3 intussuseption is filled with the heat conduction glue, first heat conduction cushion 3 can be with the heat transfer of chip 4 bottom to package substrate 1 on, second can carry out the injecting glue through the heat conduction glue to pin spread groove 104, supplementary chip 4 location, the side of heat conduction cushion 3 corresponding to pin 401 is provided with incomplete the surrounding, the lateral wall that incompletely surrounds is provided with the nozzle 301 that runs through in the heat conduction cushion 3 inner chamber, through the setting of incomplete surrounding, can guide the distribution of heat conduction glue, nozzle 301 is the pressure type setting, when heat conduction cushion 3 receives the extrusion, at first, install heat conduction cushion 3 in installation cavity 103, then install chip 4, chip 4 bottom's pin 401 can insert pin spread the heat conduction cushion 3, second can extrude heat conduction cushion 3, can be passed through nozzle 301 and thermal connection groove 104 is completely, the effect is realized through the nozzle 301 is completely to the heat conduction cushion, can be closely connected with the pin 104 through the thermal connection groove is realized to the thermal connection groove is completely, the thermal connection is realized to the thermal connection of the pin is realized with the thermal connection groove is completely, the thermal connection is difficult, the chip 4 is convenient for the thermal connection is easy, and the thermal connection is convenient for the thermal connection is convenient, and the thermal connection is easy.
It should be noted that: the outside heat dissipation chamber 101 is located the outside of encapsulation base plate 1, the inboard heat dissipation chamber 102 is located the inboard of encapsulation base plate 1, the design in outside heat dissipation chamber 101 and inboard heat dissipation chamber 102 helps exporting the heat that chip 4 bottom produced effectively, the tip in outside heat dissipation chamber 101 runs through in the lateral wall of installation cavity 103 and the lateral wall of encapsulation base plate 1 respectively, the tip in inboard heat dissipation chamber 102 runs through the lateral wall of installation cavity 103 and the diapire of encapsulation base plate 1 respectively, the port that is close to the outside heat dissipation chamber 101 of installation cavity 103 and inboard heat dissipation chamber 102 is higher than the bottom of installation cavity 103, the setting can avoid spilling over from outside heat dissipation chamber 101 or inboard heat dissipation chamber 102 by the heat conduction glue that nozzle 301 spouted, the port that is close to outside heat dissipation chamber 101 and inboard heat dissipation chamber 102 of installation cavity 103 is less than the other end port, the cross-section of outside heat dissipation chamber 101 is the setting of upwards slope, the cross-section of inboard heat dissipation chamber 102 is L shape setting, external steam or dust have reduced the probability that outside through outside heat dissipation chamber 101 or inboard heat dissipation chamber 102 enters into installation cavity 103.
Further, the bottom fixedly connected with baffle 501 of installing support 5, the top fixedly connected with location cavity 502 of installing support 5, the lateral wall of location cavity 502 offsets with the lateral wall of installation cavity 103, and the diapire of baffle 501 offsets with the upper lateral wall of chip 4, ensures the stability of chip 4, and the top of location cavity 502 flushes with the upper lateral wall of encapsulation base plate 1, and the diapire of upper cover 2 is provided with the apron with location cavity 502 assorted, like this is provided with and helps the accurate installation of upper cover 2.
In this embodiment, the chip 4 is inserted into the corresponding pin connection groove 104 on the package substrate 1 through the pin 401 at the bottom thereof, so as to realize electrical connection, the heat-conducting rubber pad 3 is arranged between the mounting cavity 103 and the chip 4, the positioning blocks 302 at the two ends of the chip are matched with the positioning grooves 105 on the side wall of the mounting cavity 103, accurate mounting of the heat-conducting rubber pad 3 is ensured, when the chip 4 is mounted and pressed into the mounting cavity 103, the heat-conducting rubber pad 3 is extruded, the heat-conducting rubber in the inner cavity of the heat-conducting rubber pad is sprayed out through the pressure nozzle 301, the gap between the pin 401 and the pin connection groove 104 is filled, tight connection of the pin 401 and the pin connection groove 104 is ensured, positioning of the chip 4 is assisted, the mounting bracket 5 is arranged between the chip 4 and the upper sealing cover 2, the partition 501 at the bottom end of the mounting bracket is propped against the upper side wall of the chip 4, and top support and positioning are provided for the chip 4, meanwhile, the positioning cavity 502 at the top of the mounting bracket 5 is propped against the side wall of the mounting cavity 103, stability of the mounting bracket 5 is ensured, and the probability of damage of the package structure in the test process is reduced due to the setting of the heat-conducting rubber pad 3.
The packaging substrate 1 is provided with an outer heat dissipation cavity 101 and an inner heat dissipation cavity 102 which are respectively positioned at the outer side and the inner side of the packaging substrate 1 and used for effectively leading out heat generated by the chips 4, the port design of the outer heat dissipation cavity 101 and the inner heat dissipation cavity 102 considers the problems of avoiding overflow of heat conducting glue and preventing external water vapor or dust from entering the mounting cavity 103, the part of the port, which is close to the mounting cavity 103, is higher than the bottom of the mounting cavity 103, the section design is also beneficial to reducing the entry of the water vapor and the dust, the upper sealing cover 2 is buckled on the packaging substrate 1, the bottom wall of the upper sealing cover is provided with a cover plate matched with the positioning cavity 502 of the mounting bracket 5, so that the sealing property and the stability of the packaging structure are ensured, and the packaging structure integrally provides stable and efficient operation environment and protection for the chips 4, and ensures stable connection between the chips 4 and effective heat dissipation.
In summary, the multi-chip package structure in this embodiment realizes stable package and efficient heat dissipation of the chip 4 through reasonable installation and positioning, heat dissipation design, and other mechanisms, and improves the operation stability and reliability of the chip 4.
Referring to fig. 3-9, the heat dissipation assembly includes a heat dissipation module 6 disposed on an outer side wall of the mounting bracket 5 and a cooling box 7 disposed in the mounting bracket 5, the heat dissipation module 6 is disposed on a side of the mounting bracket 5 facing the outer side wall of the package substrate 1, the heat dissipation module 6 is composed of an upper heat dissipation block 601 and a lower heat dissipation plate 602, the heat dissipation module 6 forms a high-efficiency heat dissipation path through a combination of the upper heat dissipation block 601 and the lower heat dissipation plate 602, heat generated by the chip 4 is rapidly transferred to an outer side of the package substrate 1 and is dissipated to an environment in an air convection manner, and the like, a mounting groove 106 matched with the heat dissipation module 6 is disposed on an upper side of the package substrate 1, so that the heat dissipation module 6 can be stably mounted and closely attached to the package substrate 1, a top of the lower heat dissipation plate 602 is flush with a top wall of the mounting groove 106, a section of the cooling box 7 is in a convex shape, and the cooling box 7 is mounted on an inner side of the mounting bracket 5 in a clamping manner.
Further, the cooling tank 7 is arranged in a hollow manner, the cooling tank 7 is internally filled with cooling liquid, liquid with high heat conductivity, low viscosity and good electric conductivity is selected, water (subjected to corrosion prevention treatment), glycol solution, fluorinated liquid (such as Novec liquid of 3M company) and the like are commonly used, the cooling liquid is used for carrying away heat generated by the chip 4 through heat exchange, and is transferred to the heat dissipation module 6 through the cooling tank 7, so that rapid heat dissipation of the top of the chip 4 is realized, the top of the cooling tank 7 penetrates through the inner cavity of the cooling tank to be provided with a liquid injection hole 702 for adding or replacing the cooling liquid, the continuous heat dissipation effect of the cooling tank 7 is ensured, the bottom wall of the cooling tank 7 is provided with a plurality of bosses 701, the bosses 701 are communicated with the inner cavity of the cooling tank 7, the bosses 701 are distributed in a matrix, the bottom end of the bosses 701 are abutted against the upper side wall of the chip 4, the cooling tank 7 can be directly contacted with the chip 4, heat dissipation efficiency is improved, a gap exists between the bottom of the cooling tank 7 and the upper side wall of the chip 4, meanwhile, the cooling tank 7 is prevented from flowing between the cooling tank 7 and the chip 4, the cooling tank 7 is pressed by the high heat conductivity, the ceramic material such as ceramic material has high heat conductivity, and the ceramic material can be hardly corroded by the heat dissipation material, and the ceramic material can be quickly transferred to the chip, and the heat insulation material can be hardly corroded by the ceramic material, and the heat is cooled.
In this embodiment, heat generation and transfer: when the chip 4 is operated, a large amount of heat is generated, and the heat is firstly transferred to the package substrate 1 through the pins 401 at the bottom of the chip 4, and at the same time, part of the heat is directly transferred to the boss 701 of the cooling box 7 through the upper side wall of the chip 4, and is transferred to the mounting bracket 5 through the cooling box 7, and is then transferred to the heat dissipation module 6.
Bottom heat dissipation: the heat conducting rubber pad 3 is located between the chip 4 and the packaging substrate 1, the heat conducting rubber in the heat conducting rubber pad can rapidly transfer the heat of the bottom of the chip to the packaging substrate 1, and the packaging substrate 1 is provided with an outer side heat dissipation cavity 101 and an inner side heat dissipation cavity 102, and the heat transferred by the heat conducting rubber pad 3 can be effectively led out and dissipated into the environment in an air convection mode and the like.
Top heat dissipation: the cooling box 7 is located the top of chip 4 to through the upper side wall direct contact of boss 701 and chip 4, the inside coolant liquid that has filled of cooling box 7, when the coolant liquid flows through boss 701, can absorb the heat that chip 4 produced, the coolant liquid flows at cooling box 7 inside circulation, transfer the heat of absorption to radiating module 6 through the wall of cooling box 7, radiating module 6 comprises last radiating block 601 and lower fin 602, install in the top of packaging substrate 1, with cooling box 7 tight fit, when the coolant liquid gives radiating module 6 with heat, go up radiating block 601 and lower fin 602 and give off the heat in the air rapidly, the combined design of going up radiating block 601 and lower fin 602 has increased the radiating area, the radiating efficiency has been improved.
Through the heat dissipation process, the heat generated by the chip 4 is effectively led out and dissipated to the environment, so that the stable running temperature of the chip 4 is maintained, and the heat dissipation system in the embodiment forms a high-efficiency and complete heat dissipation system by combining a plurality of modes such as bottom heat dissipation, top heat dissipation and heat dissipation of the heat dissipation module 6.
Referring to fig. 6-12, the induction exhaust assembly includes a heat conducting cylinder 8 fixedly connected to the inner side wall of the cooling tank 7, a piston 802 is slidably connected in a sealing manner in the heat conducting cylinder 8, the piston 802 is elastically connected to the inner top wall of the heat conducting cylinder 8 through a connecting spring 801, the piston 802 is allowed to move freely in the heat conducting cylinder 8, and is simultaneously acted by the elastic force of the connecting spring 801, a push rod 803 is fixedly connected to the side wall of the piston 802 facing the connecting spring 801, the end of the push rod 803 penetrates through the side wall of the cooling tank 7 and extends between the upper heat dissipating block 601 and the lower heat dissipating fin 602, the movement of the piston 802 can be directly transmitted to the heat dissipating module 6 through the push rod 803, a sealing push plate 9 is fixedly connected to the end of the push rod 803, high-pressure nitrogen is filled between the side wall of the piston 802 far away from the push rod 803 and the inner cavity of the heat conducting cylinder 8, and the high-pressure nitrogen plays two roles herein: first, as a driving force, the piston 802 and the push rod 803 are pushed to move; secondly, as the heat transfer medium, help heat conduction section of thick bamboo 8 to transfer heat to piston 802 and push rod 803 fast, heat conduction section of thick bamboo 8 is the setting of high heat conduction copper nickel alloy material, ensures that the heat can transfer fast.
Further, the induction exhaust assembly further comprises an air outlet groove 503 which is arranged on the side wall of the mounting bracket 5 facing the heat radiation module 6, the end part of the air outlet groove 503 penetrates through the side wall of the mounting bracket 5, the caliber of the air outlet groove 503 is larger than the diameter of the push rod 803, the sealing push plate 9 in the initial state is positioned between the upper heat radiation block 601 and the lower heat radiation fin 602, the sealing push plate 9 is in sealing sliding connection between the upper heat radiation block 601 and the lower heat radiation fin 602, hot air is ensured not to leak from a gap, external dust or water vapor is prevented from entering, and the side wall of the sealing push plate 9 abuts against the side wall of the mounting groove 106, so that the sealing performance is further enhanced.
In this embodiment, when the chip 4 generates a large amount of heat, the heat is effectively transferred to the heat-conducting tube 8 through the cooling liquid, and the heat-conducting tube 8 is made of a high heat-conducting copper-nickel alloy material, so that the heat can be rapidly and uniformly distributed, and along with the transfer of the heat, the air between the top of the chip 4 and the cooling box 7 is heated and expanded, and meanwhile, the heat is rapidly transferred to the piston 802 and the push rod 803 through the heat-conducting tube 8;
On the one hand, the high-pressure nitrogen is taken as a driving medium and expands after being heated, the expansion force pushes the piston 802 to move outwards, meanwhile, the connecting spring 801 is extruded, the movement of the piston 802 further drives the push rod 803 and the sealing push plate 9 to move outwards, and under the combined action of the high-pressure nitrogen and the hot air, the sealing push plate 9 can slide outwards continuously (refer to fig. 11) until a heat dissipation channel (namely, the air outlet groove 503) between the upper heat dissipation block 601 and the lower heat dissipation plate 602 is opened;
On the other hand, high-pressure nitrogen gas is used as a heat transfer medium to help the heat conduction cylinder 8 to transfer heat to the piston 802 and the push rod 803 quickly, and because the nitrogen gas has good heat conduction performance, the nitrogen gas can effectively transfer heat on the heat conduction cylinder 8 to the piston 802 and the push rod 803, and the heat conduction not only helps the heat dissipation system to dynamically adjust the opening and closing of the heat dissipation channel according to the temperature, but also enables the push rod 803 to extend out of the heat dissipation channel due to thermal expansion, so that the heat dissipation area of the push rod 803 is increased, and the heat dissipation efficiency is improved.
The opening of the heat dissipation channel remarkably enhances the heat dissipation effect of the heat dissipation module 6, so that heat can be more effectively dissipated from the chip 4 to the external environment, and meanwhile, due to the existence of the air outlet groove 503, hot air between the top of the chip 4 and the cooling box 7 can be directly discharged through the air outlet groove 503, so that the heat dissipation efficiency is further improved.
It should be noted that, due to the pushing of the hot air, even if the heat dissipation channel is opened, the external water vapor and dust are difficult to enter the inside of the heat dissipation system, and the design not only ensures the improvement of the heat dissipation performance, but also meets the dustproof requirement.
When the heat generated by the chip 4 is reduced, the temperature of the heat conduction cylinder 8 and the piston 802 starts to decrease, and the high-pressure nitrogen gas volume is contracted, at this time, the elastic force of the connecting spring 801 starts to act to push the piston 802 and the push rod 803 back to the original position (refer to fig. 12), and as the push rod 803 is retracted, the heat dissipation channel (i.e., the air outlet groove 503) between the upper heat dissipation block 601 and the lower heat dissipation plate 602 is re-closed by the sealing push plate 9, so that the heat dissipation system can be kept in a closed state when not needed.
Through the design, the induction exhaust component can dynamically adjust the heat dissipation effect of the packaging structure according to the heat dissipation requirement of the chip 4, when the chip 4 generates a large amount of heat, a heat dissipation channel is opened, and the heat dissipation performance is enhanced; when the heat generated by the chip 4 is reduced, the heat dissipation channel is closed, and the internal environment is kept stable; the design gives consideration to the requirements of dust prevention and heat dissipation, and improves the overall performance and efficiency of the heat dissipation system.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
It should be noted that, specific model specifications of the motor need to be determined by selecting a model according to actual specifications of the device, and a specific model selection calculation method adopts the prior art in the field, so detailed description is omitted.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides an strengthen multicore piece packaging structure of steadiness, includes package substrate (1), goes up closing cap (2) and a plurality of chip (4), go up closing cap (2) lock and set up on package substrate (1), the bottom of chip (4) is provided with pin (401), be cross-shaped separation on package substrate (1) and be provided with a plurality of installation cavity (103), the bottom of installation cavity (103) is provided with pin (401) assorted pin spread groove (104), pin spread groove (104) are connected with corresponding pin (401) electricity, its characterized in that still includes:
Heat conduction rubber pad (3): the heat-conducting rubber pad (3) is arranged between the mounting cavity (103) and the chip (4), and the heat-conducting rubber pad (3) is used for conducting heat to the bottom of the chip (4) for positioning;
An outer heat dissipation chamber (101) and an inner heat dissipation chamber (102): the outer side heat dissipation cavity (101) and the inner side heat dissipation cavity (102) are arranged on two sides of the mounting cavity (103), gaps exist between the adjacent outer side heat dissipation cavity (101) and the adjacent inner side heat dissipation cavity (102), the outer side heat dissipation cavity (101) and the inner side heat dissipation cavity (102) are used for guiding out heat generated at the bottom of the chip (4), and meanwhile the probability that external water vapor or dust enters the mounting cavity (103) can be reduced;
mounting bracket (5): the mounting bracket (5) is arranged between the chip (4) and the upper sealing cover (2), and the mounting bracket (5) is used for supporting and positioning the top of the chip (4);
And a heat radiation assembly: the heat dissipation assembly is arranged on the mounting bracket (5) and is used for dissipating heat at the top of the chip (4);
inductive exhaust assembly: the induction exhaust assembly is arranged inside the heat dissipation assembly, and the induction exhaust assembly is used for controlling exhaust according to the temperature of the heat dissipation assembly.
2. The multi-chip packaging structure for enhancing stability according to claim 1, wherein positioning grooves (105) are symmetrically arranged on the side wall of the mounting cavity (103), positioning blocks (302) matched with the positioning grooves (105) are fixedly connected to two ends of the heat-conducting rubber pad (3), heat-conducting rubber is filled in the heat-conducting rubber pad (3), incomplete surrounding is arranged on the side edge of the heat-conducting rubber pad (3) corresponding to the pin (401), a nozzle (301) penetrating through the inner cavity of the heat-conducting rubber pad (3) is arranged on the side wall of the incomplete surrounding, and the nozzle (301) is arranged in a pressure mode.
3. The multi-chip package structure with enhanced stability according to claim 1, wherein the outer heat dissipation cavity (101) is located at the outer side of the package substrate (1), the inner heat dissipation cavity (102) is located at the inner side of the package substrate (1), the end portions of the outer heat dissipation cavity (101) respectively penetrate through the side wall of the mounting cavity (103) and the outer side wall of the package substrate (1), the end portions of the inner heat dissipation cavity (102) respectively penetrate through the side wall of the mounting cavity (103) and the bottom wall of the package substrate (1), the ports of the outer heat dissipation cavity (101) and the inner heat dissipation cavity (102) close to the mounting cavity (103) are higher than the bottom of the mounting cavity (103), the ports of the outer heat dissipation cavity (101) and the inner heat dissipation cavity (102) close to the mounting cavity (103) are smaller than the other end ports, the cross section of the outer heat dissipation cavity (101) is arranged in an upward inclined mode, and the cross section of the inner heat dissipation cavity (102) is arranged in an L shape.
4. The multi-chip packaging structure with enhanced stability according to claim 1, wherein a partition plate (501) is fixedly connected to the bottom end of the mounting bracket (5), a positioning cavity (502) is fixedly connected to the top of the mounting bracket (5), the side wall of the positioning cavity (502) is propped against the side wall of the mounting cavity (103), the bottom wall of the partition plate (501) is propped against the upper side wall of the chip (4), the top of the positioning cavity (502) is flush with the upper side wall of the packaging substrate (1), and a cover plate matched with the positioning cavity (502) is arranged on the bottom wall of the upper sealing cover (2).
5. The multi-chip packaging structure with enhanced stability according to claim 1, wherein the heat dissipation assembly comprises a heat dissipation module (6) arranged on the outer side wall of the mounting bracket (5) and a cooling box (7) arranged in the mounting bracket (5), the heat dissipation module (6) is positioned on one side of the mounting bracket (5) facing the outer side wall of the packaging substrate (1), the heat dissipation module (6) is composed of an upper heat dissipation block (601) and a lower heat dissipation plate (602), a mounting groove (106) matched with the heat dissipation module (6) is arranged on the upper side of the packaging substrate (1), the top of the lower heat dissipation plate (602) is flush with the top wall of the mounting groove (106), the cross section of the cooling box (7) is in a convex shape, and the cooling box (7) is clamped and mounted on the inner side of the mounting bracket (5).
6. The multi-chip packaging structure with stability enhancement according to claim 5, wherein the cooling box (7) is arranged in a hollow manner, cooling liquid is filled in the cooling box (7), a liquid injection hole (702) is formed in the top of the cooling box (7) in a penetrating manner, a plurality of bosses (701) are formed in the bottom wall of the cooling box (7), the bosses (701) are communicated with the inner cavity of the cooling box (7), the bosses (701) are distributed in a matrix manner, the bottom ends of the bosses (701) are abutted against the upper side wall of the chip (4), a gap is formed between the bottom of the cooling box (7) and the upper side wall of the chip (4), and the cooling box (7) is made of a high heat conduction material.
7. The multi-chip packaging structure for enhancing stability according to claim 1, wherein the induction exhaust component comprises a heat conducting tube (8) fixedly connected with the inner side wall of the cooling box (7), a piston (802) is connected in a sealing sliding manner inside the heat conducting tube (8), the piston (802) is elastically connected with the inner side top wall of the heat conducting tube (8) through a connecting spring (801), a push rod (803) is fixedly connected with the side wall of the piston (802) facing the connecting spring (801), the end part of the push rod (803) penetrates through the side wall of the cooling box (7) and extends to the position between the upper radiating block (601) and the lower radiating fin (602), a sealing push plate (9) is fixedly connected with the end part of the push rod (803), high-pressure nitrogen is filled between the side wall of the piston (802) far away from the push rod (803) and the inner cavity of the heat conducting tube (8), and the heat conducting tube (8) is made of high-heat conducting copper nickel alloy.
8. The multi-chip package structure with enhanced stability according to claim 7, wherein the induction exhaust assembly further comprises an air outlet groove (503) arranged on the side wall of the mounting bracket (5) facing the heat dissipation module (6), the end portion of the air outlet groove (503) penetrates through the side wall of the mounting bracket (5), the caliber of the air outlet groove (503) is larger than the diameter of the push rod (803), the sealing push plate (9) in the initial state is located between the upper heat dissipation block (601) and the lower heat dissipation plate (602), the sealing push plate (9) is in sealing sliding connection between the upper heat dissipation block (601) and the lower heat dissipation plate (602), and the side wall of the sealing push plate (9) abuts against the side wall of the mounting groove (106).
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| CN201820758U (en) * | 2010-09-15 | 2011-05-04 | 杨东佐 | A kind of LED integrated structure with cooling device |
| CN117038609A (en) * | 2023-10-10 | 2023-11-10 | 深圳长微科技半导体有限公司 | Combined embedded multi-chip packaging structure |
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| JPH08288438A (en) * | 1995-04-14 | 1996-11-01 | Hitachi Ltd | Electronic device cooling device |
| CN115132709B (en) * | 2022-06-27 | 2023-07-11 | 深圳宏芯宇电子股份有限公司 | Chip stacking and packaging structure |
| CN220439595U (en) * | 2023-06-20 | 2024-02-02 | 江苏华芯智造半导体有限公司 | Chip packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201820758U (en) * | 2010-09-15 | 2011-05-04 | 杨东佐 | A kind of LED integrated structure with cooling device |
| CN117038609A (en) * | 2023-10-10 | 2023-11-10 | 深圳长微科技半导体有限公司 | Combined embedded multi-chip packaging structure |
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