CN118392325B - Closed calibration device for wafer infrared temperature sensor - Google Patents
Closed calibration device for wafer infrared temperature sensor Download PDFInfo
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- CN118392325B CN118392325B CN202410814861.7A CN202410814861A CN118392325B CN 118392325 B CN118392325 B CN 118392325B CN 202410814861 A CN202410814861 A CN 202410814861A CN 118392325 B CN118392325 B CN 118392325B
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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Abstract
The invention provides a closed calibration device for an infrared temperature sensor of a wafer, which comprises a main machine box, wherein an opening is formed in the position, opposite to a storage cavity, of the lateral side surface of the main machine box, a turnover plate is arranged at the opening, and a discharge chute is formed in the position, opposite to a discharge cavity, of the lateral side surface of the main machine box; the wafer storage assembly capable of vertically moving is arranged in the storage cavity, the output assembly is arranged in the discharge cavity, and the bearing assembly is arranged in the middle of the output assembly; two groups of sealing assemblies are transversely and symmetrically arranged at the calibration cavity in a sliding mode, clamping assemblies are transversely and symmetrically arranged in the calibration cavity, each group of clamping assemblies are connected with a group of detection supporting assemblies in a linkage mode, and the detection supporting assemblies are used for installing a plurality of groups of wafer infrared sensors to be calibrated. The invention can calibrate a plurality of groups of wafer infrared sensors at the same time, and has high calibration efficiency; meanwhile, a plurality of types of standard wafers are configured, so that the wafer infrared sensor can be comprehensively calibrated.
Description
Technical Field
The invention relates to the technical field of wafer infrared temperature sensor calibration equipment, in particular to a closed calibration device for a wafer infrared temperature sensor.
Background
In the semiconductor manufacturing process, a plurality of working procedures such as wafer growth, cutting, cleaning, doping, film deposition and the like are required, the purpose of wafer temperature measurement is to monitor the temperature change of the wafer surface in real time so as to ensure the temperature control and the product quality in the manufacturing process, and a manufacturer is helped to monitor and control the temperature change of the wafer in different working procedures so as to ensure the product quality and consistency, and the method has wide application in the semiconductor manufacturing; the temperature measurement data can also be used for optimizing the manufacturing process, so that the production efficiency and the product yield are improved;
The non-contact temperature measurement is to measure the temperature of the surface of the wafer by an infrared radiation temperature measurement technology, and an infrared radiation temperature measurement instrument can determine the temperature by measuring infrared radiation emitted by the surface of the wafer; the method can realize nondestructive temperature measurement without contacting with the surface of the wafer, but has the defect of insufficient temperature measurement precision, so that calibration is required in the manufacturing production and later use processes to teach the precision of the wafer infrared sensor;
When the wafer infrared sensor is calibrated, the wafer infrared sensor is mostly placed in a closed area, then a standard heater is set to a specified temperature, the standard heater heats a standard wafer to the specified temperature, the accuracy of the wafer infrared sensor can be judged by comparing the measured temperature and the set temperature of the wafer infrared sensor, and the calibration can be completed by correcting the wafer infrared sensor through a background program; however, the current calibration closing device still has the following disadvantages:
only one wafer infrared sensor can be calibrated at a time, and the calibration efficiency is low;
Most of the used standard wafers are only one, so that the calibration range is insufficient, even if equipment for a plurality of standard wafers is partially used, when the equipment is replaced, the equipment is required to be opened, the standard wafers are detached and replaced, then the new standard wafers are heated, the whole process is long in time consumption, the operation is complicated, the calibration efficiency is affected, meanwhile, when the equipment is replaced, the closed area is damaged, heat is dissipated, the subsequent standard wafers are required to be heated again from low temperature, and the energy consumption of the equipment is high.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a closed calibration device for an infrared temperature sensor of a wafer, and solves the problems in the background art.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
The closed calibration device for the wafer infrared temperature sensor comprises a main case, wherein the middle part of the inside of the main case is a calibration cavity, the top of the inside is a storage cavity, and the bottom of the inside is a discharge cavity; an opening is formed in the position, opposite to the storage cavity, of the lateral side surface of the main machine box, a turnover plate is arranged at the opening, and a discharge chute is formed in the position, opposite to the discharge cavity, of the lateral side surface of the main machine box;
The wafer storage assembly capable of vertically moving is arranged in the storage cavity, the output assembly is arranged in the discharge cavity, and the bearing assembly is arranged in the middle of the output assembly; two groups of sealing assemblies are transversely and symmetrically arranged at the calibration cavity in a sliding manner, clamping assemblies are transversely and symmetrically arranged in the calibration cavity, each group of clamping assemblies is connected with a group of detection supporting assemblies in a linkage manner, and the detection supporting assemblies are used for installing a plurality of groups of wafer infrared sensors to be calibrated; the sealing assembly comprises a sealing cover, the side surface of the sealing cover is U-shaped, the opening of the sealing cover faces inwards, an electric heating ring is arranged on the inner bottom surface of the sealing cover, and a mesh plate is slidably arranged at the inner end of the upper surface of the sealing cover; the inner end of the bottom surface of the sealing cover is provided with the air guide cooling component;
The closed calibration device comprises the following states: in the first state, the wafer storage assembly descends to output a group of standard wafers, the clamping assembly clamps the standard wafers and drives the detection support assembly to turn over in parallel, so that a plurality of groups of wafer infrared sensors are arranged right above the standard wafers at intervals; in the second state, the two groups of sealing covers move inwards to form a sealing calibration cavity in a butt joint mode, and the two groups of mesh plates are in butt joint fit; the standard wafers and the plurality of groups of wafer infrared sensors are all arranged in the sealed calibration cavity; in a third state, the calibration cavity is sealed to heat the standard wafer to a set temperature, the wafer infrared sensors measure the temperature of the standard wafer, and the measured temperature is compared with the set temperature to calibrate each wafer infrared sensor; the air guide cooling component discharges air downwards to cool the standard wafer on the bearing component; in a fourth state, the two groups of sealing covers are moved outwards for opening at one time, and the two groups of mesh plates are kept in butt joint; the hot gas in the calibration cavity is dispersed and floated to the wafer storage component through the mesh plate step by step, and the dispersed hot gas uniformly and gradually preheats the next standard wafer; air guide cooling assembly tilting upward exhaust air to the sealing cover; in the fifth state, the two groups of sealing covers are moved outwards for opening for the second time, and the receiving assembly and the output assembly are matched to output the working standard wafer.
Further, the sealing cover comprises an upper cover plate, side sealing plates and a lower cover plate, the lower cover plate is arranged under the upper cover plate at intervals relatively, the outer side of the bottom surface of the upper cover plate is connected with the outer side of the top surface of the lower cover plate into a whole through the side sealing plates, a first toothed plate is arranged in the middle of the bottom surface of the lower cover plate, an electric heating ring is arranged on the surface of the lower cover plate, and an abutting strip is arranged at the outer end of the surface of the upper cover plate; the bottom of the first toothed plate is in meshed connection with a first driving gear, and the first driving gear is longitudinally arranged on the inner wall of the calibration cavity; the surface outside of mesh board is equipped with the overhanging board, and the inside lateral sliding of overhanging board runs through and has the guide arm, and the guide arm transversely sets firmly in the mainframe inner wall perpendicularly, and the bottom surface outside of mesh board is equipped with second cooperation strip, bottom surface inboard is equipped with first cooperation strip, and the laminating of contradicting strip is in the bottom surface of mesh board and is arranged in between first cooperation strip and the second cooperation strip.
Further, a tooth slot is formed in the outer side of the bottom surface of the first toothed plate, a lower exhaust hole is formed in the inner side of the bottom surface, the lower exhaust hole is located in the inner side of the first driving gear, an inner channel is formed in the first toothed plate, an air guide cooling assembly is slidably mounted in the inner channel and comprises an air guide inclined block, an inclined surface of the air guide inclined block faces inwards, a side exhaust hole is formed in the inclined surface of the air guide inclined block, an air guide hole is formed in the bottom surface of the air guide inclined block, the middle of the outer end of the air guide inclined block is communicated with an air guide pipe, and a spring rod is arranged on the outer end face of the air guide inclined block;
In the second state, when the two groups of sealing covers are in butt joint, the two groups of air guide inclined blocks are mutually abutted and received in the inner channel, the air guide holes are communicated with the lower exhaust holes, and cooling air can be downwards exhausted to the top surface of the standard wafer on the bearing assembly only through the lower exhaust holes;
in the fourth state, when the two groups of sealing covers are separated, the two groups of air guide inclined blocks are reset and extend outwards, and cooling air can be discharged upwards only through the side exhaust holes in an inclined mode, so that the floating speed of hot air in the sealing covers is increased, and the bottom surface of a standard wafer is cooled.
Further, the wafer storage assembly includes a main housing and a side support assembly; the two longitudinal sides of the main cover body are symmetrically provided with side cover bodies, a group of supporting components are arranged in each side cover body, a plurality of groups of clamping rings are inserted between the two groups of supporting components, a group of standard wafers are arranged in each group of clamping rings, and a group of side supporting components are arranged on the outer sides of each group of side cover bodies; the side support assembly comprises a support side seat, a second driving gear is arranged at the top of the inside of the support side seat, a second toothed plate is vertically and slidably arranged at the outer side of the inside of the support side seat, the outer side of the second driving gear is connected with the second toothed plate in a meshed manner, a top frame is arranged at the top end of the second toothed plate, and the top frame is fixedly connected with a side cover body; the top surface of the main case is provided with a perforation for the main cover body and the top frame to penetrate.
Further, the supporting component comprises a vertical circulating belt, and a plurality of supporting plates are vertically and equidistantly arranged on the outer wall of the vertical circulating belt; the clamping ring comprises an outer ring body, the inner wall of the outer ring body is slidably provided with a supporting arm, the inner end of the supporting arm is fixedly connected with a clamping sleeve, and the clamping sleeve is clamped on the outer wall of the standard wafer; the clamping ring is arranged between the two groups of vertical circulating belts and on the two groups of supporting plates.
Further, the clamping assembly comprises a fixed side plate, the fixed side plate is longitudinally fixed in the main case, the back plate is arranged in the middle of the surface of the fixed side plate, a first driving rod is arranged in the middle of the back plate, the output end of the first driving rod is vertically connected to the middle of the outer side of the movable plate, the movable plate is arranged on the inner side of the fixed side plate at parallel intervals, the outer wall of the movable plate is vertically symmetrically provided with a first sliding rod, the first sliding rod vertically slides to penetrate through the back plate, two ends of the movable plate are vertically and slidably provided with elastic clamping frames, the middle of the outer wall of the back plate is rotationally connected with a detection supporting assembly, and the middle of the top surface of the fixed side plate is provided with an inclined top frame for supporting the detection supporting assembly.
Further, detect supporting component includes the backup pad, the outer wall middle part fixed connection connecting rod of backup pad, the perpendicular fixed connection pivot of outer end of connecting rod, the connecting rod slope is laid, the pivot is rotated and is installed in the inner wall top of backplate and is rotated the junction and install the torsional spring, the inner wall both ends of backup pad are equipped with cylindric suspension assembly perpendicularly, a set of wafer infrared sensor is all installed perpendicularly to the outer end of every group suspension assembly.
Further, a rectangular groove is formed in the inclined top frame, the inclined top frame is inclined towards the back plate, an included angle between the inclined top frame and the moving plate is 100-150 degrees, the connecting rod penetrates through the rectangular groove in a sliding mode, the length of the rectangular groove is larger than the diameter of the connecting rod, and the width of the rectangular groove is identical to the diameter of the connecting rod.
Further, the suspension assembly comprises a hanging rod, the hanging rod is vertically and fixedly connected to two ends of the inner wall of the supporting plate, a baffle is arranged on the outer wall of the hanging rod, a sliding block is sleeved at the end part of the hanging rod in a sliding mode, clamping plates are symmetrically and slidably arranged on the side wall of the sliding block, and a wafer infrared sensor is clamped between the two groups of clamping plates.
Further, the bearing assembly comprises a second driving rod and a bearing plate, the second driving rod is vertically arranged in the middle of the discharging cavity of the main machine box, the top end of the output end of the second driving rod is vertically connected with the bearing plate, the outer wall of the output end of the second driving rod is vertically provided with a bottom plate, two ends of the bottom plate are vertically and symmetrically provided with inner sealing plates, and the inner sealing plates are used for sealing the discharging groove; the output assembly comprises conveying rollers which are transversely and symmetrically arranged in the discharging cavity, conveying belts which are transversely arranged are symmetrically arranged on the outer walls of the two groups of conveying rollers, and the two groups of conveying belts are symmetrically arranged on the two sides of the receiving plate; in a fifth state, the second driving rod drives the bearing plate to lift upwards, the bearing plate is attached to the bottom surface of the standard wafer, and then the clamping assembly is separated; the second driving rod drives the bearing plate to descend, and the bearing plate places the standard wafer on the conveying belt; the inner sealing plate descends to be separated from the discharge chute, and the conveying belt outputs the standard wafer to the discharge chute.
The invention provides a closed calibration device for an infrared temperature sensor of a wafer. Compared with the prior art, the method has the following beneficial effects:
The infrared sensors of a plurality of groups of wafers can be calibrated at the same time, so that the calibration efficiency is high; meanwhile, a plurality of types of standard wafers are configured, so that the wafer infrared sensor can be calibrated comprehensively, and the calibration error of a single standard wafer is eliminated;
each standard wafer can realize automatic feeding and discharging, and meanwhile, an openable sealing cover is designed to cooperate, so that the automation and the continuity of the whole calibration work are realized;
The design mesh plate can disperse and guide out hot air to the upper part, so that uniform slow preheating of the standard wafer to be used is realized, and the heating power consumption of a single standard wafer can be reduced.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a schematic diagram of a closed calibration device for an infrared temperature sensor of a wafer;
FIG. 2 is a schematic diagram showing the internal structure of the calibration device of the present invention;
FIG. 3 shows a schematic view of the lifting structure of the detection support assembly of the present invention;
FIG. 4 shows a schematic view of the seal assembly of the present invention;
FIG. 5 is a schematic diagram of a wafer storage assembly according to the present invention;
FIG. 6 is a schematic diagram showing the internal cross-sectional structure of the wafer storage assembly of the present invention;
FIG. 7 shows a schematic view of the structure of the lift-up assembly of the present invention;
FIG. 8 is a schematic diagram of a standard wafer clamping configuration of the present invention;
FIG. 9 is a schematic view of a clamping assembly and test support assembly of the present invention;
Fig. 10 is a schematic diagram showing the operation state structure of the wafer infrared sensor of the present invention;
FIG. 11 shows an enlarged schematic view of the structure at A of FIG. 9;
FIG. 12 is a schematic view of the structure of the receiving assembly and output assembly of the present invention;
FIG. 13 is a schematic view showing the butt-joint sealing state structure of two sets of sealing covers of the invention;
FIG. 14 shows a schematic view of a two-pack boot one-time opening configuration of the present invention;
FIG. 15 shows a schematic view of the first toothed plate end structure of the present invention;
FIG. 16 is a schematic diagram showing the downward exhaust state of the air guiding inclined block when the two groups of sealing covers are sealed;
FIG. 17 is a schematic diagram showing the structure of the air guiding inclined block in the upward air exhausting state when two groups of sealing covers are opened;
the figure shows: 1. the main case, 11, the flip board, 12, the discharge chute, 2, the sealing component, 21, the sealing cover, 211, the upper cover board, 2111, the collision bar, 212, the side seal board, 213, the side cover board, 22, the first toothed plate, 221, the tooth socket, 222, the lower exhaust hole, 223, the inner channel, 23, the air guide cooling component, 231, the air guide inclined block, 2311, the side exhaust hole, 2312, the air guide hole, 232, the spring rod, 233, the air guide pipe, 24, the electric heating ring, 25, the first driving gear, 26, the mesh board, 261, the first matching bar, 262, the second matching bar, 27, the guide rod, 3, the wafer storage component, 31, the main cover body, 32, the side cover body, 33, the supporting component, 331, the vertical circulating belt, 332, 34, the supporting side seat, 35, the second driving gear, 36 and the second toothed plate, 361, top frame, 4, clamping assembly, 41, fixed side plate, 42, moving plate, 421, first slide bar, 43, elastic clamping frame, 431, U-shaped frame, 432, roller, 433, second slide bar, 434, spring, 44, back plate, 45, first driving rod, 46, diagonal top frame, 461, rectangular slot, 5, detection supporting assembly, 51, supporting plate, 52, hanging assembly, 521, hanging rod, 5211, baffle, 522, sliding block, 523, clamping plate, 53, rotating shaft, 54, connecting rod, 6, receiving assembly, 61, second driving rod, 62, receiving plate, 63, bottom plate, 64, inner sealing plate, 7, output assembly, 71, conveying roller, 72, conveying belt, 8, standard wafer, 9, clamping ring, 91, outer ring, 92, supporting arm, 93, jacket, 9a, wafer infrared sensor.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
In order to solve the technical problems in the background technology, the following closed calibration device for the wafer infrared temperature sensor is provided:
Referring to fig. 1-17, the closed calibration device for the wafer infrared temperature sensor provided by the invention comprises a main case 1, wherein a calibration cavity is formed in the middle of the inside of the main case 1, a storage cavity is formed in the top of the inside, and a discharge cavity is formed in the bottom of the inside; an opening is formed in the position, opposite to the storage cavity, of the lateral side surface of the main machine case 1, a turnover plate 11 is arranged at the opening, and a discharge chute 12 is formed in the position, opposite to the discharge cavity, of the lateral side surface of the main machine case 1; the wafer storage assembly 3 which moves vertically is arranged in the storage cavity, the output assembly 7 is arranged in the discharge cavity, and the bearing assembly 6 is arranged in the middle of the output assembly 7; two groups of sealing assemblies 2 are transversely and symmetrically arranged at the calibration cavity in a sliding manner, clamping assemblies 4 are transversely and symmetrically arranged in the calibration cavity, each group of clamping assemblies 4 is connected with a group of detection supporting assemblies 5 in a linkage manner, and the detection supporting assemblies 5 are used for installing a plurality of groups of wafer infrared sensors 9a to be calibrated; the sealing assembly 2 comprises a sealing cover, the side surface of the sealing cover is U-shaped, the opening of the sealing cover faces inwards, an electric heating ring 24 is arranged on the inner bottom surface of the sealing cover, and a mesh plate 26 is slidably arranged at the inner end of the upper surface of the sealing cover; the closed calibration device comprises the following states:
In the first state, the wafer storage assembly 3 descends to output a group of standard wafers 8, the clamping assembly 4 clamps the standard wafers 8, and meanwhile, the detection support assembly drives a plurality of groups of wafer infrared sensors 9a to be arranged right above the standard wafers 8 at intervals; in the second state, the two groups of sealing covers move inwards to form a sealing calibration cavity in a butt joint mode, and the two groups of mesh plates 26 are in butt joint fit; the standard wafer 8 and a plurality of groups of wafer infrared sensors 9a are all arranged in the sealed calibration cavity; in the third state, the calibration cavity is sealed to heat the standard wafer 8 to a set temperature, the wafer infrared sensor 9a measures the temperature of the standard wafer 8, and the measured temperature is compared with the set temperature to calibrate each wafer infrared sensor 9a;
The thickness and the outer diameter of different standard wafers are different; if the temperature measured by the wafer infrared sensor is within the set temperature range of the standard wafer, the wafer infrared sensor does not need to be calibrated, and if the temperature measured by the wafer infrared sensor is not within the set temperature range of the standard wafer, an operator corrects and calibrates the numerical value of the wafer infrared sensor through the background host.
In the fourth state, the two sets of sealing covers are moved outwards for opening at a time, and the two sets of mesh plates 26 are kept in butt joint; the hot air in the calibration cavity is dispersed and floated to the wafer storage component 3 through the mesh plate 26 step by step, and the dispersed hot air uniformly and gradually preheats the next standard wafer 8; in the fifth state, the two sets of sealing covers are moved outwards for two times, and the receiving component 6 and the output component 7 cooperate to output the working standard wafer 8.
In the scheme, the method comprises the following steps:
The design of the wafer storage assembly can have the following effects: 1.1, each standard wafer can be stored for the infrared sensor to detect and calibrate one by one, so that the infrared sensor is more comprehensively calibrated, and the problem of incomplete calibration caused by detecting only one wafer is avoided; 1.2, the wafers can be output to the calibration cavity one by one, so that automatic turnover is realized, and a host case is not required to be opened manually for transferring the wafers; 1.3, the wafer can be lifted and exposed, so that standard wafers can be conveniently taken and placed;
two groups of sealing components with opening and closing actions are designed, and the following effects can be achieved:
2.1, when the two groups of sealing covers are relatively closed, a closed calibration cavity can be formed, hot air can not leak, the heating environment is more stable, and the standard wafer can be accurately heated to a set temperature;
2.2, when the sealing cover is opened, the mesh plate can be opened step by step, and the following effect can be achieved in the step by step opening process: 2.2.1, when the sealing cover is opened, hot gas can be released to the standard wafer above, so that the next standard wafer to be used can be preheated, the heating time of the preheated standard wafer in the calibration cavity can be shortened, and the energy consumption is reduced; 2.2.2, the opening process of the sealing cover is gradually opened, so that hot gas can be gradually released, a large amount of hot gas is prevented from rapidly upwards flowing to bake the standard wafer above, and the stability of the standard wafer is ensured; 2.2.3, the hot gas is dispersed and floats upwards through the mesh plate, so that the hot gas can be ensured to uniformly heat the standard wafer, and the preheating uniformity is ensured; 2.2.4, when the mesh plate is completely opened, the preheating work is completed, so that a space is reserved for discharging the wafer storage assembly;
2.3, an electric heating ring is arranged in the bottom surface of the inner part of the sealing cover, so that the standard wafer above can be directly heated;
The design of the clamping assembly can have the following effects: 3.1, the standard wafer can be opened and closed, clamped and positioned to be placed down, so that the standard wafer is stably placed in the calibration cavity; 3.2, when the wafer infrared sensor is clamped, the detection support assembly can be driven to overturn downwards in a linkage way, so that the wafer infrared sensor is placed above a standard wafer, and the subsequent detection is facilitated; when the device is in loosening action, the detection support assembly can be driven to turn upwards, so that the wafer infrared sensor can not influence the loading and unloading of a standard wafer;
the two groups of detection support assemblies can clamp and position four groups of wafer infrared sensors to be detected, so that detection calibration of multiple groups of wafer infrared sensors is realized;
The receiving component and the output component can be matched with the used standard wafer to be received and then output for the next calibration.
The turnover plate can be opened, the wafer infrared sensor needing to be detected is replaced, and the output assembly can output a standard wafer to be output through the discharge chute.
In this embodiment, the seal cover includes an upper cover 211, a side sealing plate 212, and a lower cover 213, the lower cover 213 is disposed under the upper cover 211 at an opposite interval, the outer side of the bottom surface of the upper cover 211 and the outer side of the top surface of the lower cover 213 are connected into a whole through the side sealing plate 212, a first toothed plate 22 is disposed in the middle of the bottom surface of the lower cover 213, an electric heating ring 24 is disposed on the surface of the lower cover 213, and an abutting strip 2111 is disposed at the outer end of the surface of the upper cover 211; the bottom of the first toothed plate 22 is in meshed connection with a first driving gear 25, and the first driving gear 25 is longitudinally arranged on the inner wall of the calibration cavity.
In the scheme, the method comprises the following steps: the electric heating ring can heat the standard wafer from the bottom, and the first driving gear can drive the first toothed plate to translate, so as to drive the sealing cover to move in and out.
In this embodiment, an overhanging plate is disposed on the outer side of the surface of the mesh plate 26, a guide rod 27 is transversely and slidably inserted through the overhanging plate, the guide rod 27 is transversely and vertically fixed on the inner wall of the main chassis 1, a second matching strip 262 is disposed on the outer side of the bottom surface of the mesh plate 26, a first matching strip 261 is disposed on the inner side of the bottom surface, and an abutting strip 2111 is slidably attached to the bottom surface of the mesh plate 26 and disposed between the first matching strip 261 and the second matching strip 262; in the fourth state, the abutting strip 2111 moves outwards gradually until the abutting strip 2111 abuts against the second matching strip 262; in the fifth state, the abutting strip 2111 abuts against the second engaging strip 262, so that the mesh plate 26 is moved outward along the guide bar 27.
In the scheme, the method comprises the following steps: the sealing cover can be linked to contact the mesh plate to translate when the sealing cover translates by utilizing the matching design among the abutting strips, the first matching strips and the second matching strips, and the mesh plate does not need to be independently driven to act; simultaneously, when the sealing cover moves outwards, the mesh plate can move in a lagging way, so that the continuity of the hot gas is ensured, waiting is not needed, and the opening action and the preheating work are synchronously completed.
In this embodiment, the outside of the bottom surface of the first toothed plate 22 is provided with a tooth slot 221, the inside of the bottom surface is provided with a lower exhaust hole 222, the lower exhaust hole is located inside the first driving gear, the inside of the first toothed plate is provided with an inner channel 223, the inside of the inner channel is slidably provided with an air guiding and cooling assembly 23, the air guiding and cooling assembly comprises an air guiding inclined block 231, the inclined surface of the air guiding inclined block faces inwards and is provided with a side exhaust hole 2311, the bottom surface of the air guiding inclined block is provided with an air guiding hole 2312, the middle part of the outer end of the air guiding inclined block is communicated with an air guiding pipe 233, and the outer end surface of the air guiding inclined block is provided with a spring rod 232;
In the second state, when the two groups of sealing covers are in butt joint, the two groups of air guide inclined blocks are mutually abutted and received in the inner channel, the air guide holes are communicated with the lower exhaust holes, and cooling air can be downwards exhausted to the top surface of the standard wafer on the bearing assembly only through the lower exhaust holes;
in the fourth state, when the two groups of sealing covers are separated, the two groups of air guide inclined blocks are reset and extend outwards, and cooling air can be discharged upwards only through the side exhaust holes in an inclined mode, so that the floating speed of hot air in the sealing covers is increased, and the bottom surface of a standard wafer is cooled.
In the scheme, the method comprises the following steps:
The air guide inclined blocks synchronously linked with the sealing covers are mutually abutted and retracted into the inner channel when the two groups of sealing covers are in butt joint sealing, the spring rod is compressed, and meanwhile, when the air guide inclined blocks move inwards, the air guide holes on the bottom surface of the air guide inclined blocks are in butt joint with the lower exhaust holes, so that the cold air input by the air guide pipes can be output through the air guide holes and the lower exhaust holes, and the air can be output through the side exhaust holes, but the two groups of air guide inclined blocks are in butt joint to form a sealed triangular cavity, and the air cannot be continuously output, so that the air can only be output through the lower exhaust holes; therefore, the heating process of the standard wafer by the sealing cover is not disturbed, cooling is blown out to the top surface of the working standard wafer above the bearing assembly and the output assembly, and the standard wafer is cooled, so that the temperature during output is normal, the operator cannot take the standard wafer well, and the standard wafer can be output by the output assembly after the standard wafer is cooled for a period of time;
When two sets of sealed cowls are once opened, spring bar drive wind-guiding sloping block stretches out and resets, and the wind-guiding hole inward movement is blocked, and the air conditioning just can be upwards discharged through the slope of side exhaust hole, so, can form ascending air current in the sealed cowling for the speed of steam upward movement improves preheating efficiency, simultaneously, the air conditioning slope upwards blows to the bottom surface of standard wafer to cool off the bottom surface.
Example two
In order to enable the wafer storage assembly to achieve the above functions, the following are further given in this embodiment based on the above embodiment:
in this embodiment, the wafer storage module 3 includes a main housing 31 and a side support module; the two longitudinal sides of the main cover body 31 are symmetrically provided with side cover bodies 32, a group of supporting components 33 are arranged in each side cover body 32, a plurality of groups of clamping rings 9 are inserted between the two groups of supporting components 33, a group of standard wafers 8 are arranged in each group of clamping rings 9, and a group of side supporting components are arranged on the outer sides of each group of side cover bodies 32; the side support assembly comprises a support side seat 34, a second driving gear 35 is arranged at the top of the inside of the support side seat 34, a second toothed plate 36 is vertically and slidably arranged at the outer side of the inside of the support side seat 34, the outer side of the second driving gear 35 is in meshed connection with the second toothed plate 36, a top frame 361 is arranged at the top end of the second toothed plate 36, and the top frame 361 is fixedly connected with the side cover 32; the top surface of the main case 1 is provided with a perforation for the main cover 31 and the top frame 361 to penetrate; the wafer storage assembly 3 includes the following modes: storage mode: the main cover body 31 is flush with the plugging perforation; and (3) blanking: the driving gear drives the main cover body 31 to descend, and the supporting component 33 lowers the clamping ring 9 and the standard wafer 8; and (3) feeding mode: the main housing 31 extends outside the main housing 1, and the standard wafers 8 are inserted between two sets of supporting members 33 one by one.
In the scheme, the method comprises the following steps:
when the standard wafer needs to be lowered, the second driving gear drives the second toothed plate to move downwards, the second toothed plate drives the main cover body to move downwards, when the lowest standard wafer in the main cover body is placed on the bearing assembly, the second toothed plate drives the main cover body to move upwards, and meanwhile, the supporting assembly rotates, so that the lowest standard wafer is separated from the supporting assembly, and meanwhile, the supporting assembly keeps supporting other unused standard wafers.
In this embodiment, the supporting assembly 33 includes a vertical circulation belt 331, and a plurality of supporting plates 332 are vertically and equidistantly arranged on the outer wall of the vertical circulation belt 331; the clamping ring 9 comprises an outer ring body 91, a supporting arm 92 is slidably arranged on the inner wall of the outer ring body 91, the inner end of the supporting arm 92 is fixedly connected with a clamping sleeve 93, and the clamping sleeve 93 is clamped on the outer wall of the standard wafer 8; the clamping ring 9 is placed between two sets of vertical endless belts 331 and on two sets of pallets 332.
In the scheme, the method comprises the following steps: a motor is arranged in the vertical circulation belt and can drive the supporting plate to rotate, and the motion strokes of the vertical circulation belt are consistent each time;
when the standard wafer is replenished, the main cover body penetrates through the perforated overhanging machine box, an operator inserts the clamping ring and the standard wafer on the supporting plate positioned at the lowest position, then the vertical circulating belt rotates, so that the placed standard wafer is upwards received into the main cover body, then the actions are repeated, the next standard wafer is placed, and the replenishment storage of a plurality of standard wafers is realized.
The outer ring body is designed to ensure that the outer diameter of the clamping ring is always, the supporting plate is convenient to convey, the movable supporting arm is designed, and the supporting arm is fixed through a screw, so that the position of the clamping sleeve can be adjusted, and therefore wafers with different sizes can be clamped.
In this embodiment, the clamping assembly 4 includes a fixed side plate 41, the fixed side plate 41 is longitudinally fixed in the inside of the mainframe box 1, a back plate 44 is disposed in the middle of the surface of the fixed side plate 41, a first driving rod 45 is disposed in the middle of the back plate 44, an output end of the first driving rod 45 is vertically connected to the middle of the outer side of the moving plate 42, the moving plate 42 is disposed in the inner side of the fixed side plate 41 at parallel intervals, a first sliding rod 421 is vertically symmetrically disposed on the outer wall of the moving plate 42, the first sliding rod 421 vertically slides through the back plate 44, two ends of the moving plate 42 vertically slide and are provided with an elastic clamping frame 43, the middle of the outer wall of the back plate 44 is rotationally connected with the detection supporting assembly 5, and a slanted top frame 46 for abutting against the detection supporting assembly 5 is disposed in the middle of the top surface of the fixed side plate 41.
In the scheme, the method comprises the following steps:
The elastic clamping frame 43 comprises a U-shaped frame 431, rollers 432, a second sliding rod 433 and springs 434, wherein the second sliding rod vertically slides and penetrates through the moving plate, the inner end of the moving plate is connected with the U-shaped frame, the rollers are mounted in the U-shaped frame, the springs are sleeved on the outer wall of the second sliding rod, and the rollers are clamped on the outer wall of the clamping ring in a fitting mode.
The first driving rod can drive the movable plate to move inside and outside, the first sliding rod moves in the back plate and can guide the movable plate, and the elastic clamping frame can firmly clamp the positioning clamping ring.
In this embodiment, the detecting and supporting assembly 5 includes a supporting plate 51, a connecting rod 54 is fixedly connected to the middle part of the outer wall of the supporting plate 51, the outer end of the connecting rod 54 is vertically and fixedly connected to a rotating shaft 53, the connecting rod 54 is obliquely arranged, the rotating shaft 53 is rotatably mounted above the inner wall of the back plate 44, a torsion spring is mounted at the rotating joint, cylindrical hanging assemblies 52 are vertically arranged at two ends of the inner wall of the supporting plate 51, and a group of wafer infrared sensors 9a are vertically mounted at the outer ends of each group of hanging assemblies 52.
In this embodiment, a rectangular slot 461 is formed in the inclined top frame 46, the inclined top frame 46 is inclined toward the back plate 44, an included angle between the inclined top frame 46 and the moving plate 42 is 100 ° -150 °, the connecting rod 54 slides through the rectangular slot 461, the length of the rectangular slot 461 is larger than the diameter of the connecting rod 54, and the width of the rectangular slot 461 is the same as the diameter of the connecting rod 54.
In the scheme, the method comprises the following steps: when the moving plate moves inwards, the moving plate drives the inclined top frame to move, the torsion spring drives the rotating shaft and the connecting rod to rotate downwards, the connecting rod acts in the rectangular groove, and the connecting rod drives the two groups of hanging components to rotate downwards, so that the wafer infrared sensor is in a vertical state and is vertically arranged above a standard wafer;
when the movable plate moves outwards, the movable plate drives the inclined top frame to move outwards, the inclined top frame props against the connecting rod to rotate upwards and compress the torsion spring, so that the suspension assembly rotates upwards until the wafer infrared sensor is positioned on the inner side of the flip plate, and meanwhile, a space for the main cover body to descend and supplement can be exposed between the suspension assemblies.
In this embodiment, the suspension assembly 52 includes a hanging rod 521, the hanging rod 521 is vertically and fixedly connected to two ends of the inner wall of the supporting plate 51, a baffle 5211 is disposed on the outer wall of the hanging rod 521, a sliding block 522 is slidably sleeved on the end of the hanging rod 521, clamping plates 523 are symmetrically slidably mounted on the side walls of the sliding block 522, and a wafer infrared sensor 9a is clamped between the two groups of clamping plates 523.
In the scheme, the method comprises the following steps: an operator can clamp and fix the wafer infrared sensor between the two groups of clamping plates in advance, then the sliding block is sleeved on the hanging rod in a sliding way, and the sliding block can be positioned by screwing the locking knob; thereby clamping and positioning wafer infrared sensors with different sizes;
The sliding block is inserted and installed, the installation is simple and convenient, and the baffle is designed, so that the sliding block can be quickly positioned when being inserted vertically, and the installation accuracy is ensured.
Example III
In order to enable the receiving assembly output assembly to achieve the effect of rapid output, the following is further provided in this embodiment based on the above embodiment:
In this embodiment, the receiving assembly 6 includes a second driving rod 61 and a receiving plate 62, the second driving rod 61 is vertically disposed in the middle of the discharge cavity of the main chassis 1, the top end of the output end of the second driving rod 61 is vertically connected with the receiving plate 62, a bottom plate 63 is vertically disposed on the outer wall of the output end of the second driving rod 61, two ends of the bottom plate 63 are vertically symmetrically provided with inner sealing plates 64, and the inner sealing plates 64 are used for sealing the discharge chute 12; the output assembly 7 comprises conveying rollers 71, the conveying rollers 71 are transversely and symmetrically arranged in the discharging cavity, conveying belts 72 which are transversely arranged are symmetrically arranged on the outer walls of the two groups of conveying rollers 71, and the two groups of conveying belts 72 are symmetrically arranged on two sides of the receiving plate 62;
In the fifth state, the second driving rod 61 drives the bearing plate 62 to lift up, the bearing plate 62 is attached to the bottom surface of the standard wafer 8, and then the clamping assembly 4 is separated;
the second driving rod 61 drives the bearing plate 62 to descend, and the bearing plate 62 places the standard wafer 8 on the conveying belt 72; the inner seal plate 64 is lowered away from the spout 12 and the conveyor 72 outputs the standard wafers 8 to the spout 12.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. Wafer infrared temperature sensor closed calibrating device, its characterized in that: the device comprises a main machine box, wherein the middle part of the inside of the main machine box is a calibration cavity, the top of the inside is a storage cavity, and the bottom of the inside is a discharge cavity; an opening is formed in the position, opposite to the storage cavity, of the lateral side surface of the main machine box, a turnover plate is arranged at the opening, and a discharge chute is formed in the position, opposite to the discharge cavity, of the lateral side surface of the main machine box;
The wafer storage assembly capable of vertically moving is arranged in the storage cavity, the output assembly is arranged in the discharge cavity, and the bearing assembly is arranged in the middle of the output assembly; two groups of sealing assemblies are transversely and symmetrically arranged at the calibration cavity in a sliding manner, clamping assemblies are transversely and symmetrically arranged in the calibration cavity, each group of clamping assemblies is connected with a group of detection supporting assemblies in a linkage manner, and the detection supporting assemblies are used for installing a plurality of groups of wafer infrared sensors to be calibrated; the sealing assembly comprises a sealing cover, the side surface of the sealing cover is U-shaped, the opening of the sealing cover faces inwards, an electric heating ring is arranged on the inner bottom surface of the sealing cover, and a mesh plate is slidably arranged at the inner end of the upper surface of the sealing cover; the inner end of the bottom surface of the sealing cover is provided with the air guide cooling component;
The closed calibration device comprises the following states:
in the first state, the wafer storage assembly descends to output a group of standard wafers, the clamping assembly clamps the standard wafers and drives the detection support assembly to turn over in parallel, so that a plurality of groups of wafer infrared sensors are arranged right above the standard wafers at intervals;
In the second state, the two groups of sealing covers move inwards to form a sealing calibration cavity in a butt joint mode, and the two groups of mesh plates are in butt joint fit; the standard wafers and the plurality of groups of wafer infrared sensors are all arranged in the sealed calibration cavity;
In a third state, the calibration cavity is sealed to heat the standard wafer to a set temperature, the wafer infrared sensors measure the temperature of the standard wafer, and the measured temperature is compared with the set temperature to calibrate each wafer infrared sensor; the air guide cooling component discharges air downwards to cool the standard wafer on the bearing component;
in a fourth state, the two groups of sealing covers are moved outwards for opening at one time, and the two groups of mesh plates are kept in butt joint; the hot gas in the calibration cavity is dispersed and floated to the wafer storage component through the mesh plate step by step, and the dispersed hot gas uniformly and gradually preheats the next standard wafer; air guide cooling assembly tilting upward exhaust air to the sealing cover;
in the fifth state, the two groups of sealing covers are moved outwards for opening for the second time, and the receiving assembly and the output assembly are matched to output the working standard wafer.
2. The wafer infrared temperature sensor closed calibration device according to claim 1, wherein: the sealing cover comprises an upper cover plate, side sealing plates and a lower cover plate, wherein the lower cover plate is oppositely arranged under the upper cover plate at intervals, the outer side of the bottom surface of the upper cover plate is connected with the outer side of the top surface of the lower cover plate into a whole through the side sealing plates, a first toothed plate is arranged in the middle of the bottom surface of the lower cover plate, an electric heating ring is arranged on the surface of the lower cover plate, and an abutting strip is arranged at the outer end of the surface of the upper cover plate; the bottom of the first toothed plate is in meshed connection with a first driving gear, and the first driving gear is longitudinally arranged on the inner wall of the calibration cavity; the surface outside of mesh board is equipped with the overhanging board, and the inside lateral sliding of overhanging board runs through and has the guide arm, and the guide arm transversely sets firmly in the mainframe inner wall perpendicularly, and the bottom surface outside of mesh board is equipped with second cooperation strip, bottom surface inboard is equipped with first cooperation strip, and the laminating of contradicting strip is in the bottom surface of mesh board and is arranged in between first cooperation strip and the second cooperation strip.
3. The wafer infrared temperature sensor closed calibration apparatus according to claim 2, wherein: the inner channel is formed in the first toothed plate, the air guide cooling assembly is slidably arranged in the inner channel and comprises an air guide inclined block, the inclined surface of the air guide inclined block faces inwards, a side exhaust hole is formed in the inclined surface of the air guide inclined block, an air guide hole is formed in the bottom surface of the air guide inclined block, the middle of the outer end of the air guide inclined block is communicated with an air guide pipe, and a spring rod is arranged on the outer end face of the air guide inclined block;
In the second state, when the two groups of sealing covers are in butt joint, the two groups of air guide inclined blocks are mutually abutted and received in the inner channel, the air guide holes are communicated with the lower exhaust holes, and cooling air can be downwards exhausted to the top surface of the standard wafer on the bearing assembly only through the lower exhaust holes;
in the fourth state, when the two groups of sealing covers are separated, the two groups of air guide inclined blocks are reset and extend outwards, and cooling air can be discharged upwards only through the side exhaust holes in an inclined mode, so that the floating speed of hot air in the sealing covers is increased, and the bottom surface of a standard wafer is cooled.
4. The wafer infrared temperature sensor closed calibration apparatus according to claim 3, wherein: the wafer storage assembly comprises a main cover body and a side support assembly; the two longitudinal sides of the main cover body are symmetrically provided with side cover bodies, a group of supporting components are arranged in each side cover body, a plurality of groups of clamping rings are inserted between the two groups of supporting components, a group of standard wafers are arranged in each group of clamping rings, and a group of side supporting components are arranged on the outer sides of each group of side cover bodies; the side support assembly comprises a support side seat, a second driving gear is arranged at the top of the inside of the support side seat, a second toothed plate is vertically and slidably arranged at the outer side of the inside of the support side seat, the outer side of the second driving gear is connected with the second toothed plate in a meshed manner, a top frame is arranged at the top end of the second toothed plate, and the top frame is fixedly connected with a side cover body; the top surface of the main case is provided with a perforation for the main cover body and the top frame to penetrate.
5. The wafer infrared temperature sensor closed calibration apparatus according to claim 4, wherein: the supporting component comprises a vertical circulating belt, and a plurality of supporting plates are vertically and equidistantly arranged on the outer wall of the vertical circulating belt; the clamping ring comprises an outer ring body, the inner wall of the outer ring body is slidably provided with a supporting arm, the inner end of the supporting arm is fixedly connected with a clamping sleeve, and the clamping sleeve is clamped on the outer wall of the standard wafer; the clamping ring is arranged between the two groups of vertical circulating belts and on the two groups of supporting plates.
6. The wafer infrared temperature sensor closed calibration apparatus according to claim 5, wherein: the clamping assembly comprises a fixed side plate, the fixed side plate is longitudinally and fixedly arranged in the main case, a backboard is arranged in the middle of the surface of the fixed side plate, a first driving rod is arranged in the middle of the backboard, the output end of the first driving rod is vertically connected to the middle of the outer side of the movable plate, the movable plate is arranged on the inner side of the fixed side plate at parallel intervals, the outer wall of the movable plate is vertically and symmetrically provided with a first sliding rod, the first sliding rod vertically slides to penetrate through the backboard, two ends of the movable plate are vertically and slidably provided with elastic clamping frames, the middle of the outer wall of the backboard is rotationally connected with a detection supporting assembly, and the middle of the top surface of the fixed side plate is provided with an inclined top frame for abutting against the detection supporting assembly to rotate.
7. The wafer infrared temperature sensor closed calibration apparatus according to claim 6, wherein: the detection supporting component comprises a supporting plate, the middle part of the outer wall of the supporting plate is fixedly connected with a connecting rod, the outer end of the connecting rod is vertically and fixedly connected with a rotating shaft, the connecting rod is obliquely arranged, the rotating shaft is rotatably arranged above the inner wall of the backboard and is rotatably connected with a torsion spring, the two ends of the inner wall of the supporting plate are vertically provided with cylindrical hanging components, and the outer ends of each group of hanging components are vertically provided with a group of wafer infrared sensors.
8. The wafer infrared temperature sensor closed calibration apparatus according to claim 7, wherein: the inside of the inclined top frame is provided with a rectangular groove, the inclined top frame is inclined towards the backboard, an included angle between the inclined top frame and the moving plate is 100-150 degrees, the connecting rod slides and penetrates through the rectangular groove, the length of the rectangular groove is larger than the diameter of the connecting rod, and the width of the rectangular groove is identical to the diameter of the connecting rod.
9. The wafer infrared temperature sensor closed calibration apparatus according to claim 8, wherein: the hanging assembly comprises a hanging rod, the hanging rod is vertically and fixedly connected to two ends of the inner wall of the supporting plate, a baffle is arranged on the outer wall of the hanging rod, a sliding block is sleeved at the end part of the hanging rod in a sliding mode, clamping plates are symmetrically and slidably arranged on the side wall of the sliding block, and a wafer infrared sensor is clamped between the two groups of clamping plates.
10. The wafer infrared temperature sensor closed calibration apparatus according to claim 9, wherein: the bearing assembly comprises a second driving rod and a bearing plate, the second driving rod is vertically arranged in the middle of the discharging cavity of the main machine box, the top end of the output end of the second driving rod is vertically connected with the bearing plate, the outer wall of the output end of the second driving rod is vertically provided with a bottom plate, two ends of the bottom plate are vertically and symmetrically provided with inner sealing plates, and the inner sealing plates are used for sealing the discharging grooves; the output assembly comprises conveying rollers which are transversely symmetrically arranged in the discharging cavity, conveying belts which are transversely arranged are symmetrically arranged on the outer walls of the two groups of conveying rollers, and the two groups of conveying belts are symmetrically arranged on the two sides of the receiving plate.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113432737A (en) * | 2020-03-19 | 2021-09-24 | 长鑫存储技术有限公司 | Method for measuring and calibrating temperature of wafer chuck and temperature measuring system |
| CN116929600A (en) * | 2023-06-06 | 2023-10-24 | 厦门润积集成电路技术有限公司 | Calibrating device and system for ultra-high precision digital temperature sensor chip |
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| US7734439B2 (en) * | 2002-06-24 | 2010-06-08 | Mattson Technology, Inc. | System and process for calibrating pyrometers in thermal processing chambers |
| CN207183216U (en) * | 2017-09-12 | 2018-04-03 | 北京同方微电子有限公司 | A kind of temperature calibration system suitable for the wafer sort stage |
| KR102325984B1 (en) * | 2019-11-04 | 2021-11-12 | 한국표준과학연구원 | Calibrator with Active Point Heaters for Wafer Temperature Sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113432737A (en) * | 2020-03-19 | 2021-09-24 | 长鑫存储技术有限公司 | Method for measuring and calibrating temperature of wafer chuck and temperature measuring system |
| CN116929600A (en) * | 2023-06-06 | 2023-10-24 | 厦门润积集成电路技术有限公司 | Calibrating device and system for ultra-high precision digital temperature sensor chip |
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