CN118376806B - Vibration isolation combined beam structure and low-stress MEMS accelerometer thereof - Google Patents
Vibration isolation combined beam structure and low-stress MEMS accelerometer thereof Download PDFInfo
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- CN118376806B CN118376806B CN202410813301.XA CN202410813301A CN118376806B CN 118376806 B CN118376806 B CN 118376806B CN 202410813301 A CN202410813301 A CN 202410813301A CN 118376806 B CN118376806 B CN 118376806B
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- 238000002955 isolation Methods 0.000 title claims abstract description 132
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- 238000001514 detection method Methods 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 230000008646 thermal stress Effects 0.000 claims abstract description 24
- 230000035882 stress Effects 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 244000126211 Hericium coralloides Species 0.000 claims description 29
- 230000001133 acceleration Effects 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 12
- 210000001520 comb Anatomy 0.000 claims description 10
- 230000002401 inhibitory effect Effects 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000005259 measurement Methods 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000013016 damping Methods 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/003—Details of instruments used for damping
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0882—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system for providing damping of vibrations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The invention discloses a vibration isolation combined beam structure and a low-stress MEMS accelerometer thereof, which structurally comprises the following components: an outer ring-like isolation mechanism, an inner rectangular ring double-ring nesting mechanism, a left fixed comb anchor double-ring nesting mechanism and a right fixed comb anchor double-ring nesting mechanism; the accelerometer includes: the substrate layer, the device layer and the device layer comprise the vibration isolation combined beam structure, at least two movable mass blocks, a left detection electrode unit and a right detection electrode unit; the influence of residual stress and thermal stress introduced by the MEMS accelerometer in a process manufacturing link, a packaging patch link and the like on the temperature sensitivity of the device is solved, and the full-temperature characteristic index of the accelerometer is improved; the decoupling of the MEMS accelerometer to the surrounding environment is realized, the influence of environmental impact and vibration on the measurement precision of the device is effectively restrained, and the output of the accelerometer is more stable; the vibration rectification error value of the accelerometer device is reduced, the dependence degree of the navigation carrier on additional damping design is effectively reduced, and the device navigation accuracy is improved.
Description
Technical Field
The invention relates to the technical field of MEMS accelerometers, in particular to a vibration isolation combined beam structure and a low-stress MEMS accelerometer thereof.
Background
The MEMS accelerometer sensor is used as one of core devices in the field of inertial navigation equipment, the index and the error size of the MEMS accelerometer sensor directly influence the navigation precision of equipment, and particularly in the field of aviation, aerospace and military equipment with high-precision application requirements, the MEMS accelerometer sensor is subjected to higher requirements on indexes and the like.
In the prior art, the MEMS accelerometer has poor full-temperature characteristic index, large vibration rectification error and the like, which become technical bottlenecks for accelerometer product application, seriously hamper and limit the application of the MEMS accelerometer in the high-precision field, and the phenomenon that the temperature sensitivity index of the accelerometer is obviously deteriorated along with the change of the environmental temperature due to the residual stress and thermal stress introduced by process manufacturing, packaging patch and the like still exists due to the interference of external environmental impact and vibration.
Disclosure of Invention
The invention mainly aims to provide a vibration isolation combined beam structure and a low-stress MEMS accelerometer thereof, which can effectively solve the problems that when vibration, impact and sensor environment temperature change exist outside, structural shaking is caused, residual stress in the process of manufacturing and thermal stress of glue and a substrate in the process of packaging a patch are changed, a sensitive structure can generate structural shaking, inclination and thermal deformation under the action of an inner beam and a fixed anchor point, so that the capacitance of sensitive comb teeth of the accelerometer is changed, and finally, non-responsive output signals of the accelerometer are generated to form an error source, so that the vibration rectification error value and the full-temperature characteristic index of a device are influenced.
In order to achieve the above purpose, one of the technical schemes adopted by the invention is as follows: the utility model provides a vibration isolation composite beam structure, this structure is used for carrying out effectual shock attenuation, isolation and release to external environment vibration, impact and residual thermal stress, and keep apart, release the thermal stress that the substrate layer of MEMS accelerometer introduced, restrain the influence of the thermal stress of encapsulation paster to the fixed broach electrode of MEMS accelerometer, prevent sensitive structure and electrode at the during operation and receive external environment to interfere and produce shake, slope and thermal deformation, prevent the production of device vibration and temperature error source, its structure includes:
the external ring-like isolation mechanism and the internal rectangular ring double-ring nesting mechanism are jointly used for effectively absorbing, isolating and releasing external environment vibration, impact and residual thermal stress;
the left fixed comb anchor double-ring nesting mechanism and the right fixed comb anchor double-ring nesting mechanism are used for isolating and releasing the thermal stress introduced by the substrate layer and inhibiting the influence of the thermal stress of the packaging patch on the corresponding fixed comb electrode;
The inner rectangular ring double-ring nesting mechanism is positioned in the inner part formed by the outer ring-like isolation mechanism;
the left fixed comb anchor double-ring nesting mechanism and the right fixed comb anchor double-ring nesting mechanism have the same structure and are bilaterally symmetrical about the vertical center line of the structure;
The inner rectangular ring double-ring nesting mechanism, the outer ring-like isolation mechanism, the left fixed comb anchor point double-ring nesting mechanism and the right fixed comb anchor point double-ring nesting mechanism are all installed on the substrate layer.
Further, the outer ring-like isolation mechanism includes:
At least eight groups of outer ring folding beams, wherein the eight groups of outer ring folding beams are connected end to form a rectangular folding frame; the rectangular folding frame is fixedly anchored through the outer layer, and four vertex angles of the rectangular folding frame are arranged on the substrate layer;
at least four inner side double-end supporting beams which are symmetrical to the center part of the rectangular folding frame; at least two outer double-end clamped beams which are positioned at the left side and the right side in the rectangular folding frame;
One end of each inner side double-end supporting beam is connected with the inner rectangular ring double-ring nesting mechanism;
one end of each outer double-end clamped beam is connected with the rectangular folding frame.
Further, the inner rectangular ring double ring nesting mechanism comprises:
The inner layer fixing anchor point is used for fixedly mounting the inner rectangular ring double-ring nesting mechanism on the substrate layer;
The inner layer first isolation rectangular ring is sleeved outside the inner layer fixing anchor point;
at least four inner layer first isolation short beams which are used for connecting inner layer fixed anchor points and four corners of an inner layer first isolation rectangular ring;
The inner layer second isolation rectangular ring is sleeved outside the inner layer first isolation rectangular ring;
At least four inner layer second isolation short beams which are used for connecting four corners of the inner layer first isolation rectangular ring and four corners of the inner layer second isolation rectangular ring;
the outer frame of the inner layer second isolation rectangular ring is connected with one end of each inner side double-end clamped beam.
Further, the left fixed comb anchor point double-ring nesting mechanism comprises:
The left fixed comb anchor point is used for fixedly mounting the left fixed comb anchor point double-ring nesting mechanism on the substrate layer;
the left fixed comb teeth first isolation rectangular ring is sleeved outside the left fixed comb teeth anchor points;
at least four left fixed comb teeth first isolation short beams which are used for connecting left fixed comb teeth anchor points and four corners of a left fixed comb teeth first isolation rectangular ring;
the left fixed comb teeth second isolation rectangular ring is sleeved outside the left fixed comb teeth first isolation rectangular ring;
The at least four left fixed comb tooth second isolation short beams are used for connecting four corners of the left fixed comb tooth first isolation rectangular ring and four corners of the left fixed comb tooth second isolation rectangular ring;
The outer frame of the left fixed comb tooth second isolation rectangular ring is connected with the left fixed comb tooth of the MEMS accelerometer.
Further, right fixed broach anchor point dicyclo nested mechanism includes:
The right fixed comb anchor point is used for fixedly mounting the right fixed comb anchor point double-ring nesting mechanism on the substrate layer;
the right fixed comb teeth first isolation rectangular ring is sleeved outside the right fixed comb teeth anchor points;
At least four first isolation short beams of right fixed comb teeth, which are used for connecting right fixed comb teeth anchor points and four corners of the first isolation rectangular ring of the right fixed comb teeth;
the right fixed comb teeth second isolation rectangular ring is sleeved outside the right fixed comb teeth first isolation rectangular ring;
The at least four right fixed comb tooth second isolation short beams are used for connecting four corners of the right fixed comb tooth first isolation rectangular ring and four corners of the right fixed comb tooth second isolation rectangular ring;
the outer frame of the right fixed comb tooth second isolation rectangular ring is connected with the right fixed comb tooth of the MEMS accelerometer.
In order to achieve the above purpose, the present invention adopts another technical scheme as follows: a low stress MEMS accelerometer for detecting acceleration of a navigation device, the accelerometer comprising:
a substrate layer made of silicon;
A device layer located above the substrate layer and fixedly mounted on the substrate layer by corresponding anchors;
The device layer comprises the vibration isolation combined beam structure, at least two movable mass blocks, a left detection electrode unit and a right detection electrode unit.
Further, the left detection electrode unit and the right detection electrode unit have the same structure and are bilaterally symmetrical relative to the vertical center line of the vibration isolation combined beam structure;
Further, the left detection stage unit includes:
A left movable frame;
A left fixed frame;
A plurality of left fixed detection comb teeth, each of which is mounted on a left fixed frame;
the left movable detection comb teeth are arranged on the left movable frame, and the left movable frame is driven to move left and right through external acceleration to drive the left movable detection comb teeth to move left and right;
Wherein, the left fixed detection comb teeth and the left movable detection comb teeth are mutually inserted;
the outer frame of the second isolation rectangular ring of the left fixed comb teeth is connected with the vertical beam of the left fixed frame.
Further, the right detection stage unit includes:
A right movable frame;
a right fixed frame;
a plurality of right fixed detection combs, each of the right fixed detection combs being mounted on a right fixed frame;
the right movable detection comb teeth are arranged on the right movable frame, and the right movable frame is driven to move left and right through external acceleration to drive the right movable detection comb teeth to move left and right;
wherein, the right fixed detection comb teeth and the right movable detection comb teeth are mutually inserted and arranged;
The outer frame of the right fixed comb tooth second isolation rectangular ring is connected with the right fixed frame.
Further, each movable mass block is bilaterally symmetrical with respect to a vertical center line of the vibration isolation combined beam structure;
And are respectively positioned at the junction of the corresponding right movable frame, left movable frame and the other end of the inner side double-end clamped beam.
Compared with the prior art, the invention has the following beneficial effects:
1. The influence of residual stress and thermal stress introduced by the MEMS accelerometer in a process manufacturing link, a packaging patch link and the like on the temperature sensitivity of the device is solved, and the full-temperature characteristic index of the accelerometer is improved;
2. The decoupling of the MEMS accelerometer to the surrounding environment is realized, the influence of environmental impact and vibration on the measurement precision of the device is effectively restrained, and the output of the accelerometer is more stable;
3. The vibration rectification error value of the accelerometer device is reduced, the dependence degree of the navigation carrier on additional damping design is effectively reduced, and the device navigation accuracy is improved;
4. the invention has the advantages of easy realization of the whole structure process, small chip size, mass production and manufacture and wide application in high-end fields such as aviation, military and the like.
Drawings
Fig. 1 is a schematic structural view of a vibration isolation composite beam structure of the present invention;
fig. 2 is a schematic structural view of a low stress MEMS accelerometer with vibration isolation composite beam structure of the present invention.
In the figure: 1. a substrate layer;
2. an outer ring-like isolation mechanism; 201. an outer ring folding beam; 202. the outer layer is fixedly anchored; 203. the inner side double-end clamped beam; 204. the outer side is fixedly supported by the double end;
3. An internal rectangular ring double ring nesting mechanism; 301. an inner layer is fixed with anchor points; 302. an inner layer first isolation rectangular ring; 303. an inner layer first isolation short beam; 304. an inner layer second isolation rectangular ring; 305. an inner layer second isolation short beam;
4. a left fixed comb anchor point double-ring nesting mechanism; 401. a comb anchor point is fixed on the left; 402. a left fixed comb tooth first isolation rectangular ring; 403. the left fixed comb teeth are provided with first isolation short beams; 404. a left fixed comb second isolation rectangular ring; 405. the left fixed comb teeth are provided with second isolation short beams;
5. a right fixed comb anchor point double-ring nesting mechanism; 501. right fixed comb anchor points; 502. right fixed comb teeth first isolation rectangular ring; 503. the right fixed comb teeth are provided with first isolation short beams; 504. a right fixed comb second isolation rectangular ring; 505. the right fixed comb teeth are provided with second isolation short beams;
6. a device layer; 7. a movable mass;
8. A left detection stage unit; 801. a left movable frame; 802. a left fixed frame; 803. the left fixed detection comb teeth; 804. a left movable detection comb tooth;
9. a right detection stage unit; 901. a right movable frame; 902. a right fixed frame; 903. the right fixed detection comb teeth; 904. the right movable detecting comb teeth.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
Example 1
As shown in fig. 1, the vibration isolation composite beam structure is used for effectively absorbing, isolating and releasing external environmental vibration, impact and residual thermal stress, isolating and releasing the thermal stress introduced by a substrate layer 1 of the MEMS accelerometer, inhibiting the influence of thermal stress of a packaging patch on a fixed comb electrode of the MEMS accelerometer, preventing the sensitive structure and the electrode from being dithered, inclined and thermally deformed due to external environmental interference during operation, and preventing the vibration of a device and the generation of a temperature error source, and the vibration isolation composite beam structure comprises:
The outer ring-like isolation mechanism 2 and the inner rectangular ring double-ring nesting mechanism 3 are jointly used for effectively absorbing, isolating and releasing external environment vibration, impact and residual thermal stress, preventing sensitive structures and electrodes from being interfered by the external environment to generate vibration, inclination and thermal deformation when working, preventing devices from vibrating and generating temperature error sources, and finally achieving the purposes of reducing the vibration arrangement error value of the accelerometer devices and improving the full-temperature characteristic index, so that the accelerometer is widely applied to the high-end fields such as aviation, military and the like;
wherein the inner rectangular ring double ring nesting mechanism 3 is located inside the outer ring-like isolation mechanism 2.
Specifically, the outer ring-like isolation mechanism 2 includes:
At least eight groups of outer ring folding beams 201, wherein the eight groups of outer ring folding beams 201 are connected end to form a rectangular folding frame; the rectangular folding frame is anchored by the outer layer fixing anchors 202, and four vertex angles of the rectangular folding frame are arranged on the substrate layer 1;
At least four inner side double-end supporting beams 203, which are symmetrical to the center of the rectangular folding frame; at least two outer double-ended clamped beams 204 located on the left and right sides within the rectangular folding frame;
wherein, one end of each inner side double-end supporting beam 203 is connected with the inner rectangular ring double-ring nesting mechanism 3;
One end of each outer double clamped beam 204 is connected to a rectangular folding frame.
Specifically, the inner rectangular ring double ring nesting mechanism 3 includes:
An inner layer fixing anchor point 301 for fixing the inner rectangular ring double ring nesting mechanism 3 to the substrate layer 1;
an inner first isolation rectangular ring 302 which is sleeved outside the inner fixed anchor point 301;
at least four inner layer first isolation short beams 303 for connecting the inner layer fixing anchor points 301 and four corners of the inner layer first isolation rectangular ring 302;
An inner second insulating rectangular ring 304, which is externally sleeved outside the inner first insulating rectangular ring 302;
at least four inner layer second isolation short beams 305 for connecting four corners of the inner layer first isolation rectangular ring 302 and the inner layer second isolation rectangular ring 304;
wherein, the outer frame of the inner second isolating rectangular ring 304 is connected with one end of each inner double-end clamped beam 203.
The method also comprises the following steps: the left fixed comb anchor double-ring nesting mechanism 4 and the right fixed comb anchor double-ring nesting mechanism 5 are used for enabling a subsequently additionally installed MEMS accelerometer sensitive unit and an electrode to be in a suspension state, isolating and releasing thermal stress introduced by the substrate layer 1 and inhibiting the influence of thermal stress of the packaging patch on the corresponding fixed comb electrode;
further, the left fixed comb anchor double-ring nesting mechanism 4 and the right fixed comb anchor double-ring nesting mechanism 5 are identical in structure and are bilaterally symmetrical about a vertical central line of the structure.
Specifically, the left fixed comb anchor point double-ring nesting mechanism 4 comprises:
A left fixed comb anchor 401 for fixedly mounting the left fixed comb anchor double-ring nesting mechanism 4 on the substrate layer 1;
a left fixed comb first isolation rectangular ring 402, which is sleeved outside the left fixed comb anchor 401;
At least four left fixed comb-teeth first isolation short beams 403 for connecting the left fixed comb-teeth anchor points 401 and four corners of the left fixed comb-teeth first isolation rectangular ring 402;
A left fixed comb second isolation rectangular ring 404, which is sleeved outside the left fixed comb first isolation rectangular ring 402;
at least four left fixed comb teeth second isolation short beams 405 for connecting four corners of the left fixed comb teeth first isolation rectangular ring 402 and the left fixed comb teeth second isolation rectangular ring 404;
wherein the outer frame of the left fixed comb second isolation rectangular ring 404 is connected with the left fixed comb of the MEMS accelerometer.
By arranging the left fixed comb anchor double-ring nesting mechanism 4, the thermal stress introduced into the substrate layer 1 is isolated and released, and the influence of the thermal stress of the packaging patch on the corresponding left fixed comb electrode is restrained.
Specifically, the right fixed comb anchor point double-ring nesting mechanism 5 comprises:
A right fixed comb anchor 501 for fixedly mounting the right fixed comb anchor double-loop nesting mechanism 5 on the substrate layer 1;
A right fixed comb first isolation rectangular ring 502 which is sleeved outside the right fixed comb anchor point 501;
At least four right fixed comb first isolation short beams 503 for connecting the right fixed comb anchor points 501 and four corners of the right fixed comb first isolation rectangular ring 502;
a right fixed comb second isolation rectangular ring 504 that is externally sleeved outside the right fixed comb first isolation rectangular ring 502;
At least four right fixed comb second isolation short beams 505 for connecting four corners of the right fixed comb first isolation rectangular ring 502 and the right fixed comb second isolation rectangular ring 504;
wherein the outer frame of the right fixed comb second isolation rectangular ring 504 is connected with the right fixed comb of the MEMS accelerometer.
By arranging the right fixed comb anchor double-ring nesting mechanism 5, the thermal stress introduced into the substrate layer 1 is isolated and released, and the influence of the thermal stress of the packaging patch on the corresponding right fixed comb electrode is restrained.
Further, the inner rectangular ring double-ring nesting mechanism 3, the outer ring-like isolation mechanism 2, the left fixed comb anchor double-ring nesting mechanism 4 and the right fixed comb anchor double-ring nesting mechanism 5 are all arranged on the substrate layer 1.
Example 2
As shown in fig. 2, a low stress MEMS accelerometer for detecting acceleration of a navigation device, the accelerometer comprising:
A substrate layer 1 made of silicon;
A device layer 6 which is located above the substrate layer 1 and fixedly mounted on the substrate layer 1 by corresponding anchors;
Specifically, the structural material of the device layer 6 is silicon.
Specifically, the device layer 6 includes the vibration isolation composite beam structure described in embodiment 1, at least two movable masses 7, a left detection stage unit 8, and a right detection stage unit 9.
Specifically, the left detection electrode unit 8 and the right detection electrode unit 9 have the same structure and are bilaterally symmetrical about the vertical center line of the vibration isolation combined beam structure;
The left detection stage unit 8 and the right detection stage unit 9 detect acceleration through comb differential capacitance, including open loop, closed loop, multiplexing detection electrodes, adding a separate detection feedback electrode, and other detection modes.
Specifically, the left detection stage unit 8 includes:
A left movable frame 801;
a left fixed frame 802;
A plurality of left fixed sensing combs 803, each of the left fixed sensing combs 803 being mounted on a left fixed frame 802;
a plurality of left movable detection comb teeth 804, wherein each left movable detection comb tooth 804 is mounted on a left movable frame 801, and the left movable frame 801 is driven to move left and right by external acceleration to drive the left movable detection comb teeth 804 to move left and right;
wherein, the left fixed detection comb 803 and the left movable detection comb 804 are mutually inserted;
Specifically, the left fixed detection comb 803 and the left movable detection comb 804 form a pair of left detection capacitors, and N pairs of the left detection capacitors together form a left detection electrode of the accelerometer.
The outer frame of the left fixed comb second spacer rectangular ring 404 is connected to the vertical beams of the left fixed frame 802.
Specifically, the right detection stage unit 9 includes:
A right movable frame 901;
A right fixed frame 902;
A plurality of right fixed sensing combs 903, each of the right fixed sensing combs 903 being mounted on a right fixed frame 902;
A plurality of right movable detecting comb teeth 904, wherein each right movable detecting comb tooth 904 is installed on the right movable frame 901, and the right movable frame 901 is driven to move left and right by external acceleration, so that the right movable detecting comb teeth 904 are driven to move left and right;
Wherein, the right fixed detection comb 903 and the right movable detection comb 904 are mutually inserted;
specifically, the right fixed detecting comb 903 and the right movable detecting comb 904 form a pair of right detecting capacitors, and N pairs of capacitors together form a right detecting electrode of the accelerometer.
The outer frame of the right fixed comb second spacer rectangular ring 504 is connected to the right fixed frame 902.
Further, each movable mass block 7 is bilaterally symmetrical with respect to the vertical center line of the vibration isolation composite beam structure;
and are respectively positioned at the junctions of the other ends of the corresponding right movable frame 901, left movable frame 801 and inner double-ended clamped beam 203.
The working principle is as follows: the low-stress MEMS accelerometer mainly works based on the movable mass block 7, when external acceleration acts, the movable mass block 7 moves left and right, so that the left movable frame 801 and the right movable frame 901 are driven to generate displacement, capacitance change of corresponding structure electrodes is further caused, capacitance detection is completed through an external interface circuit, acceleration measurement is finally achieved, the MEMS accelerometer sensitive unit and the electrodes are in a suspension state through the vibration isolation combined beam structure in the embodiment 1, vibration, impact and residual/thermal stress of the external environment can be effectively damped, isolated and released, vibration, inclination and thermal deformation of the sensitive structure and the electrodes caused by the interference of the external environment during working are prevented, device vibration and temperature error sources are prevented, and the purposes of reducing vibration arrangement error values of the accelerometer devices and improving full-temperature characteristic indexes are finally achieved, so that the low-stress MEMS accelerometer is widely applied to high-end fields such as industry, aviation and military.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. Vibration isolation composite beam structure, its characterized in that: the structure comprises:
The external ring-like isolation mechanism (2) and the internal rectangular ring double-ring nesting mechanism (3) are jointly used for effectively absorbing, isolating and releasing external environment vibration, impact and residual thermal stress;
The left fixed comb anchor double-ring nesting mechanism (4) and the right fixed comb anchor double-ring nesting mechanism (5) are used for isolating and releasing the thermal stress introduced by the substrate layer (1) and inhibiting the influence of the thermal stress of the packaging patch on the corresponding fixed comb electrode;
the inner rectangular ring double-ring nesting mechanism (3) is positioned in the inner part formed by the outer ring-like isolation mechanism (2);
The left fixed comb anchor double-ring nesting mechanism (4) and the right fixed comb anchor double-ring nesting mechanism (5) have the same structure and are bilaterally symmetrical about the vertical central line of the structure;
The inner rectangular ring double-ring nesting mechanism (3), the outer ring-like isolation mechanism (2), the left fixed comb anchor point double-ring nesting mechanism (4) and the right fixed comb anchor point double-ring nesting mechanism (5) are all arranged on the substrate layer (1);
The outer ring-like isolation mechanism (2) comprises:
At least eight groups of outer ring folding beams (201), wherein the eight groups of outer ring folding beams (201) are connected end to form a rectangular folding frame; the rectangular folding frame is anchored by an outer layer fixed anchor (202) and four vertex angles of the rectangular folding frame are arranged on the substrate layer (1);
at least four inner side double-end clamped beams (203), and the two inner side double-end clamped beams are symmetrical to the center part of the rectangular folding frame; at least two outer double-ended clamped beams (204) positioned on the left and right sides in the rectangular folding frame;
one end of each inner side double-end supporting beam (203) is connected with an inner rectangular ring double-ring nesting mechanism (3);
one end of each outer double-end clamped beam (204) is connected with the rectangular folding frame;
The inner rectangular ring double ring nesting mechanism (3) comprises:
An inner layer fixing anchor point (301) for fixing the inner rectangular ring double ring nesting mechanism (3) on the substrate layer (1);
an inner layer first isolation rectangular ring (302) which is sleeved outside the inner layer fixing anchor point (301);
At least four inner layer first isolation short beams (303) for connecting the inner layer fixed anchor points (301) and four corners of the inner layer first isolation rectangular rings (302);
An inner second isolation rectangular ring (304) which is sleeved outside the inner first isolation rectangular ring (302);
at least four inner layer second isolation short beams (305) for connecting four corners of the inner layer first isolation rectangular ring (302) and the inner layer second isolation rectangular ring (304);
The outer frame of the inner layer second isolation rectangular ring (304) is connected with one end of each inner side double-end clamped beam (203);
the left fixed comb anchor point double-ring nesting mechanism (4) comprises:
The left fixed comb anchor point (401) is used for fixedly installing the left fixed comb anchor point double-ring nesting mechanism (4) on the substrate layer (1);
the left fixed comb teeth first isolation rectangular ring (402) is sleeved outside the left fixed comb teeth anchor point (401);
At least four left fixed comb teeth first isolation short beams (403) for connecting the left fixed comb teeth anchor points (401) and four corners of the left fixed comb teeth first isolation rectangular ring (402);
A left fixed comb second isolation rectangular ring (404) which is sleeved outside the left fixed comb first isolation rectangular ring (402);
At least four left fixed comb tooth second isolation short beams (405) which are used for connecting four corners of the left fixed comb tooth first isolation rectangular ring (402) and the left fixed comb tooth second isolation rectangular ring (404);
the outer frame of the left fixed comb tooth second isolation rectangular ring (404) is connected with the left fixed comb tooth of the MEMS accelerometer.
2. The vibration isolation composite beam structure of claim 1, wherein: the right fixed comb anchor point double-ring nesting mechanism (5) comprises:
The right fixed comb anchor point (501) is used for fixedly installing the right fixed comb anchor point double-ring nesting mechanism (5) on the substrate layer (1);
a right fixed comb tooth first isolation rectangular ring (502) which is sleeved outside the right fixed comb tooth anchor point (501);
at least four right fixed comb teeth first isolation short beams (503) for connecting right fixed comb teeth anchor points (501) and four corners of the right fixed comb teeth first isolation rectangular ring (502);
a right fixed comb second isolation rectangular ring (504) which is sleeved outside the right fixed comb first isolation rectangular ring (502);
at least four right fixed comb tooth second isolation short beams (505) for connecting four corners of the right fixed comb tooth first isolation rectangular ring (502) and the right fixed comb tooth second isolation rectangular ring (504);
The outer frame of the right fixed comb tooth second isolation rectangular ring (504) is connected with the right fixed comb tooth of the MEMS accelerometer.
3. A low stress MEMS accelerometer for detecting acceleration of a navigation device, the accelerometer comprising:
a substrate layer (1) made of silicon;
a device layer (6) which is located above the substrate layer (1) and fixedly mounted on the substrate layer (1) by means of corresponding anchors;
Wherein the device layer (6) comprises the vibration isolation composite beam structure of claim 2, at least two movable masses (7), a left detection stage unit (8) and a right detection stage unit (9).
4. A low stress MEMS accelerometer according to claim 3, wherein the left detection stage unit (8) and the right detection stage unit (9) are identical in structure and are bilaterally symmetrical about a vertical centre line of the vibration isolation composite beam structure.
5. The low stress MEMS accelerometer of claim 4, wherein the left sense stage unit (8) comprises:
a left movable frame (801);
a left fixed frame (802);
a plurality of left fixed detection combs (803), each of the left fixed detection combs (803) being mounted on a left fixed frame (802);
A plurality of left movable detection comb teeth (804), wherein each left movable detection comb tooth (804) is arranged on a left movable frame (801), and the left movable frame (801) is driven to move left and right through external acceleration to drive the left movable detection comb teeth (804) to move left and right;
Wherein, the left fixed detection comb teeth (803) and the left movable detection comb teeth (804) are mutually inserted and arranged;
The outer frame of the left fixed comb second isolation rectangular ring (404) is connected with the vertical beam of the left fixed frame (802).
6. The low stress MEMS accelerometer of claim 5, wherein the right detection stage unit (9) comprises:
A right movable frame (901);
a right fixed frame (902);
A plurality of right fixed sensing combs (903), each of the right fixed sensing combs (903) mounted on a right fixed frame (902);
A plurality of right movable detection comb teeth (904), wherein each right movable detection comb tooth (904) is arranged on the right movable frame (901), and the right movable frame (901) is driven to move left and right through external acceleration so as to drive the right movable detection comb teeth (904) to move left and right;
wherein, the right fixed detection comb teeth (903) and the right movable detection comb teeth (904) are mutually inserted and arranged;
The outer frame of the right fixed comb second isolation rectangular ring (504) is connected with the right fixed frame (902).
7. The low stress MEMS accelerometer of claim 6, wherein each of the movable masses (7) is bilaterally symmetric about a vertical centerline of the vibration isolation composite beam structure;
And are respectively positioned at the junction of the other ends of the right movable frame (901), the left movable frame (801) and the inner side double-end clamped beam (203).
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2498115A1 (en) * | 2004-03-03 | 2005-09-03 | Northrop Grumman Corporation | Oscillation of vibrating beam in a first direction for a first time period and a second direction for a second time period to sense angular rate of the vibrating beam |
| CN102147253A (en) * | 2010-12-29 | 2011-08-10 | 重庆邮电大学 | Vibrating-beam gyro of vibrating-beam-type dual-cantilever-face bracing structure |
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| CN106970244B (en) * | 2017-04-18 | 2023-03-28 | 四川知微传感技术有限公司 | Multi-range MEMS closed-loop accelerometer |
| US11377346B2 (en) * | 2019-09-11 | 2022-07-05 | Murata Manufacturing Co., Ltd. | Low-noise multi axis MEMS accelerometer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CA2498115A1 (en) * | 2004-03-03 | 2005-09-03 | Northrop Grumman Corporation | Oscillation of vibrating beam in a first direction for a first time period and a second direction for a second time period to sense angular rate of the vibrating beam |
| CN102147253A (en) * | 2010-12-29 | 2011-08-10 | 重庆邮电大学 | Vibrating-beam gyro of vibrating-beam-type dual-cantilever-face bracing structure |
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