CN118366918B - Semiconductor packaging device and manufacturing method thereof - Google Patents
Semiconductor packaging device and manufacturing method thereof Download PDFInfo
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- CN118366918B CN118366918B CN202410764101.XA CN202410764101A CN118366918B CN 118366918 B CN118366918 B CN 118366918B CN 202410764101 A CN202410764101 A CN 202410764101A CN 118366918 B CN118366918 B CN 118366918B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 238000005498 polishing Methods 0.000 claims abstract description 36
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 9
- 239000000047 product Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 3
- 238000003754 machining Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 84
- 238000001125 extrusion Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- -1 gold tin copper aluminum Chemical compound 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to the technical field of semiconductor packaging, and discloses a semiconductor packaging device and a manufacturing method thereof, wherein the semiconductor packaging device comprises a feeding box, an operation box is arranged on one side of the feeding box, a control box is arranged on one side of the operation box, a base is fixedly arranged at the bottom of the operation box, a conveying structure is arranged on one side of the top of the base, a groove is arranged in the middle of the base, the groove top is provided with the processing platform, and the base is close to control box inner wall top fixed mounting and has the mounting bracket, and the mounting bracket top is provided with first motor, first motor conveying end fixedly connected with threaded rod, threaded rod middle part threaded connection have the screw thread piece, screw thread piece one side fixedly connected with limit pole, limit pole one side and control box inner wall sliding connection. Through turning over the wafer, can continue polishing the back after pasting the membrane to the front of wafer to need not carry the wafer from the pad pasting machine to polish on polishing the machine, thereby facilitate the use, be favorable to improving work efficiency.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a semiconductor packaging device and a manufacturing method thereof.
Background
Semiconductor packaging refers to the process of processing a wafer that passes testing to obtain individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the wafer front process is cut into small chips (Die) through the dicing process, then the cut chips are attached to the corresponding islands of the substrate (Lead frame) frame by glue, and then the bonding pads (Bond pads) of the chips are connected to the corresponding pins (Lead) of the substrate by using ultra-fine metal (gold tin copper aluminum) wires or conductive resin, and the required circuit is formed; and then packaging and protecting the independent wafers by using a plastic shell, performing a series of operations after plastic packaging, performing finished product testing after packaging, generally performing procedures such as inspection, testing and packaging, and finally warehousing and delivering.
In the prior art, before the back of a wafer is ground, a layer of protection adhesive tape is firstly required to be covered on the front of the wafer, and then the wafer is turned over and conveyed to a grinding machine to grind the back of the wafer by using a grinding wheel, so that the working effect is inconvenient to improve during use.
Disclosure of Invention
The invention aims at the problems that in the prior art, before the back of a wafer is ground, a layer of protection adhesive tape is covered on the front of the wafer, and then the wafer is turned over and conveyed to a grinding machine to grind the back of the wafer by using a grinding wheel, so that the working efficiency is inconvenient to improve when the wafer is used, and the invention provides the following technical scheme:
The utility model provides a semiconductor packaging device, including last workbin, it is provided with the control box to go up workbin one side, control box one side is provided with the control box, control box bottom fixed mounting has the base, base top one side is provided with conveying structure, the base middle part is seted up flutedly, the recess top is provided with the processing platform, base is close to control box inner wall top fixed mounting and has the mounting bracket, the mounting bracket top is provided with first motor, first motor conveying end fixedly connected with threaded rod, threaded rod middle part threaded connection has the screw thread piece, screw thread piece one side fixedly connected with prescribing a limit to pole, prescribing a limit to pole one side and control box inner wall sliding connection, screw thread piece bottom fixedly connected with connecting block, connecting block bottom fixedly connected with first electric putter, first electric putter bottom fixed mounting has the pad structure, connecting block one side fixedly connected with fixed block, fixed block one side fixedly connected with mounting panel, mounting panel bottom fixedly mounted with second electric putter, second electric putter bottom fixedly connected with polishing structure, the base top just is located processing platform both sides and all is provided with the movable block, first and second rack of fixedly connected with, first rack one side meshing has the gear, gear one side meshing has the second rack, gear middle part fixedly connected with rotary shaft, gear middle part fixedly connected with electric motor rotation bottom fixedly connected with first electric putter bottom the electric putter bottom fixedly connected with a telescopic link, telescopic link top fixedly connected with a servo motor top fixedly connected with a telescopic link.
As the preference of above-mentioned technical scheme, the delivery port has been seted up to operation panel one side, and conveying structure one end is located the delivery port, and conveying structure is located processing platform one side, and the pad pasting structure is located processing bench top, and the structure of polishing is located pad pasting structure one side, and processing bench bottom fixed mounting has electric telescopic column, and processing bench bottom is provided with protective structure, and electric telescopic column and protective structure all are located inside the recess.
As the preference of above-mentioned technical scheme, first motor and operation box inner wall fixed mounting, threaded rod one end is rotated with the operation box inner wall that keeps away from first motor and is connected, and the limit pole is located the mounting bracket top, and the spout has been seted up at the mounting bracket top, connecting block, mounting panel both sides all with spout sliding connection.
As the preference of above-mentioned technical scheme, the mounting groove has been seted up at base top and is located recess one side, and mounting groove inside and second motor fixed mounting, dwang pass the mounting groove and extend to the base top, and first rack, second rack and gear all are located the base top, and it all is located processing platform and keeps away from conveying structure one side, movable block, first rack and second rack bottom all with base top surface sliding connection.
As the preference of above-mentioned technical scheme, electric telescopic handle be located the movable block both ends, the installation piece is close to processing platform one side and has been seted up the arc mouth, and the fixed slot has been seted up to the installation piece inside, servo motor and fixed slot fixed mounting, and the grip block is located arc mouth department, and the grip block is located the recess both sides, grip block, axis of rotation and servo motor with processing platform central symmetry setting.
As the preference of above-mentioned technical scheme, the shape of grip block is the arc, and grip block is close to processing platform one side fixed connection third electric putter, and third electric putter one end fixedly connected with clamping plate, third electric putter are located grip block both ends with the clamping plate, and it sets up with grip block central symmetry.
As the preference of above-mentioned technical scheme, protective structure includes the fixed plate, and fixed mounting has the third motor in the middle of the fixed plate bottom, and third motor output fixedly connected with lead screw, lead screw surface threaded connection have the movable plate, and the equal swing joint in movable plate both ends has the gag lever post, and the movable plate both sides all articulate there is the stripper plate, and stripper plate one end articulates there is the movable block, and movable block one end is provided with the expansion plate.
As the preference of above-mentioned technical scheme, fixed plate top and electric telescopic column bottom fixed mounting, lead screw bottom and operation box bottom inner wall rotate to be connected, and the expansion plate passes recess and operation box bottom inner wall sliding connection, and the expansion plate is located electric telescopic column outside, and it is located the processing platform bottom.
As the preference of above-mentioned technical scheme, the expansion plate sets up with fixed plate central symmetry, and the movable block keeps away from extrusion piece one end and expansion plate fixed connection, and the movable block is located the expansion plate inboard, and its and operation box bottom inner wall sliding connection.
The invention also provides a manufacturing method using the semiconductor packaging device, which comprises the following steps:
step one: firstly, a film laminating mechanism is utilized to protect a circuit area on the front surface of a wafer, the back surface of the wafer is polished through a polishing mechanism, the film is removed after the back surface is polished to a proper thickness, a cutting mechanism is utilized to cut the wafer into chips, the chips are firstly placed on a packaging substrate, and then the chips are bonded together through an adhesive, so that heat dissipation and packaging firmness of the chips are ensured;
Step two: then, a gold wire or an aluminum wire is used for conducting wire bonding, and the chip and the pins are connected in a welding mode, so that connectivity of a circuit is ensured;
step three: then the chip and the wire bonding are packaged in the protective shell through the packaging material of resin or plastic, so that the chip and the wire bonding are protected, and the damage to the device caused by the external environment is prevented;
step four: then, carrying out static test and dynamic test on the packaged semiconductor device for verifying the function of the device and checking the performance and reliability of the device;
Step five: and finally, cleaning, polishing, marking and the like are carried out on the packaged product so as to enable the packaged product to meet the requirements of the final product.
The beneficial effects of the invention are as follows:
(1) According to the invention, the wafer can be turned over, and the back surface of the wafer can be polished continuously after the front surface of the wafer is coated, so that the wafer does not need to be conveyed from a film coating machine to a polishing machine for polishing, the use is convenient, and the work efficiency is improved;
(2) According to the invention, the wafer on the processing table can be limited through the expansion plate, so that the movement of the wafer during polishing is prevented, meanwhile, the wafer can be protected and shielded during polishing, and the generation of scraps during polishing is prevented, so that the cleaning is inconvenient.
Drawings
FIG. 1 is a schematic view showing the overall structure of an embodiment;
FIG. 2 is a view showing an internal construction of an operation box of the embodiment;
FIG. 3 is a block diagram of the top of the base of the embodiment;
FIG. 4 shows a side view of an embodiment mount;
FIG. 5 is a block diagram illustrating a moving block and a mounting block of an embodiment;
FIG. 6 is a block diagram of the base of the embodiment;
FIG. 7 is a diagram showing the internal construction of an embodiment mounting block;
FIG. 8 is a block diagram illustrating a guard structure of an embodiment;
Fig. 9 is a structural view showing a telescoping plate of the embodiment.
In the figure: 1. feeding a material box; 2. an operation box; 3. a control box; 4. a base; 5. a conveying structure; 6. a processing table; 7. a mounting frame; 8. a first motor; 9. a threaded rod; 10. a screw block; 11. a connecting block; 12. a first electric push rod; 13. a film pasting structure; 14. a fixed block; 15. a mounting plate; 16. a second electric push rod; 17. polishing the structure; 18. a moving block; 19. a first rack; 20. a second rack; 21. a gear; 22. a rotating lever; 23. a second motor; 24. an electric telescopic rod; 25. a mounting block; 26. a servo motor; 27. an electric telescopic column; 28. a clamping block; 29. a protective structure; 291. a fixing plate; 292. a third motor; 293. a screw rod; 294. a moving plate; 295. an extrusion plate; 296. a movable block; 297. a telescoping plate; 30. a third electric push rod; 31. and clamping the plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments.
The invention provides a semiconductor packaging device, as shown in figures 1-7, which comprises a feeding box 1, wherein one side of the feeding box 1 is provided with an operation box 2, one side of the operation box 2 is provided with a control box 3, the bottom of the operation box 2 is fixedly provided with a base 4, one side of the top of the base 4 is provided with a conveying structure 5, the middle part of the base 4 is provided with a groove, the top of the groove is provided with a processing table 6, the top of the base 4, which is close to the inner wall of the control box 3, is fixedly provided with a mounting frame 7, the top of the mounting frame 7 is provided with a first motor 8, the conveying end of the first motor 8 is fixedly connected with a threaded rod 9, the middle part of the threaded rod 9 is in threaded connection with a threaded block 10, one side of the threaded block 10 is fixedly connected with a limiting rod, one side of the limiting rod is in sliding connection with the inner wall of the operation box 2, the bottom of the threaded block 10 is fixedly connected with a connecting block 11, the bottom of the connecting block 11 is fixedly connected with a first electric push rod 12, the bottom of the first electric push rod 12 is fixedly provided with a film pasting structure 13, a fixed block 14 is fixedly connected to one side of the connecting block 11, a mounting plate 15 is fixedly arranged on one side of the fixed block 14, a second electric push rod 16 is fixedly arranged at the bottom of the mounting plate 15, a polishing structure 17 is fixedly arranged at the bottom of the second electric push rod 16, a first motor 8 is fixedly arranged on the inner wall of the operating box 2, one end of a threaded rod 9 is rotationally connected with the inner wall of the operating box 2 far away from the first motor 8, a limiting rod is positioned at the top of the mounting frame 7, a sliding groove is formed in the top of the mounting frame 7, the connecting block 11 and the two sides of the mounting plate 15 are both slidingly connected with the sliding groove, a movable block 18 is arranged at the top of the base 4 and both sides of the processing table 6, a first rack 19 and a second rack 20 are respectively fixedly connected to one side of the movable block 18, a gear 21 is meshed with one side of the first rack 19, a second rack 20 is meshed with one side of the gear 21, a rotary rod 22 is fixedly connected to the middle part of the gear 21, the second motor 23 is fixedly connected to the bottom of the rotating rod 22, the electric telescopic rod 24 is fixedly connected to the top of the moving block 18, the installation block 25 is fixedly connected to the top of the electric telescopic rod 24, the servo motor 26 is arranged inside the installation block 25, the rotating shaft is fixedly connected to one side of the output end of the servo motor 26, and the clamping block 28 is fixedly connected to one end of the rotating shaft.
The wafer is fed through the feeding box 1, thereby the wafer is conveyed to the conveying structure 5 in the operation box 2, the wafer is conveyed to the processing table 6 through the conveying structure 5, the second motor 23 is started to drive the rotating rod 22 and the gear 21 to rotate, the first rack 19 and the second rack 20 drive the moving block 18 to move close to each other, the electric telescopic rod 24 and the mounting block 25 are driven to move close to the processing table 6, the clamping block 28 at one side of the mounting block 25 is driven to move to both sides of the wafer on the processing table 6, the wafer is clamped and fixed, the wafer is prevented from moving during film pasting, the film pasting structure 13 is driven to move downwards by the first electric push rod 12, the film pasting structure 13 is enabled to paste the front surface of the wafer, after film pasting is completed, the first electric push rod 12 is conveniently installed through the connecting block 11, the first electric push rod 12 is started to drive the film pasting structure 13 to move upwards away from the processing table 6, the third electric push rod 30 is started to drive the clamping plate 31 to move, so that the clamping plate 31 clamps two sides of a wafer, the wafer is fixed in one step, the electric telescopic rod 24 drives the mounting block 25 to move upwards, the wafer is far away from the processing table 6, the servo motor 26 is started to drive the rotating shaft and the clamping block 28 to rotate, the wafer clamped by the clamping plate 31 is enabled to rotate and turn over, after the turning over is completed, the electric telescopic rod 24 drives the wafer to move to the top of the processing table 6, the second motor 23 is used to rotate, the rotating rod 22 and the gear 21 rotate, under the action of the first rack 19 and the second rack 20, the moving block 18 is driven to move to the original position, the clamping block 28 and the clamping plate 31 on one side of the mounting block 25 are not clamped to the wafer any more, and move to the original position, the wafer is moved to the outer side of the processing table 6 through the protection structure 29, the electric telescopic column 27 drives the processing table 6 to move downwards, the wafer that makes processing bench 6 top removes expansion plate 297 middle part, start first motor 8 and drive threaded rod 9 rotation, make thread piece 10 drive connecting block 11 bottom along the spout removal under limiting rod effect, make the first electric putter 12 of connecting block 11 bottom remove with pad pasting structure 13 to being close to first motor 8, and drive mounting panel 15 and second electric putter 16 through fixed block 14 and remove, make polishing structure 17 remove processing bench 6 top, stop first motor 8 rotation again, drive polishing structure 17 through starting second electric putter 16 and remove the wafer top on the processing bench 6 downwards, polish the wafer after turning over through polishing structure 17, take out the wafer after polishing can, thereby be convenient for can continue polishing the back after pasting the wafer front, do benefit to improvement work efficiency.
As shown in fig. 2, 3, 6 and 9, a conveying port is formed in one side of the operation box 2, one end of a conveying structure 5 is located in the conveying port, the conveying structure 5 is located on one side of the processing table 6, a film pasting structure 13 is located at the top of the processing table 6, a polishing structure 17 is located on one side of the film pasting structure 13, an electric telescopic column 27 is fixedly installed at the bottom of the processing table 6, a protective structure 29 is arranged at the bottom of the processing table 6, and the electric telescopic column 27 and the protective structure 29 are located in the groove.
The wafer inside the feeding box 1 is convenient to be conveyed to the conveying structure 5 through the conveying port, the conveying structure 5 is convenient to convey the wafer to the processing table 6 for processing, thereby the pad pasting structure 13 at the top of the processing table 6 is convenient for carry out the pad pasting, after the pad pasting is accomplished, the pad pasting structure 13 is moved to drive the polishing structure 17 and is moved to the top of the processing table 6, thereby the wafer is convenient for overturn on the processing table 6, the wafer can be polished on the back surface thereof without moving, the processing table 6 is driven to move downwards through the electric telescopic column 27, the wafer after overturn moves along with the inside of the groove of the processing table 6, and the wafer is moved to the outer side of the processing table 6 through the protecting structure 29, protection shielding is carried out when the wafer is convenient for polishing, and debris adhesion is prevented from being inconvenient to clean.
As shown in fig. 4-6, a mounting groove is formed in the top of the base 4 and located at one side of the groove, the inside of the mounting groove is fixedly mounted with the second motor 23, the rotating rod 22 extends to the top of the base 4 through the mounting groove, the first rack 19, the second rack 20 and the gear 21 are located at the top of the base 4 and located at one side of the processing table 6 far away from the conveying structure 5, and the bottom of the moving block 18, the bottom of the first rack 19 and the bottom of the second rack 20 are slidably connected with the top surface of the base 4.
The second motor 23 is convenient to install through the mounting groove, and the rotating rod 22 and the gear 21 are driven to rotate through the second motor 23, so that the first rack 19 and the second rack 20 are convenient to move close to or away from each other on the top surface of the base 4, the moving block 18 drives the electric telescopic rod 24 and the mounting block 25 to move, the clamping block 28 limits the wafer, and the wafer is convenient to prevent from moving during film pasting and polishing, and the film pasting and polishing effects are affected.
As shown in fig. 5-7, the electric telescopic rod 24 is located at two ends of the moving block 18, an arc opening is formed in one side, close to the processing table 6, of the mounting block 25, a fixing groove is formed in the mounting block 25, the servo motor 26 is fixedly mounted with the fixing groove, the clamping block 28 is located at the arc opening, the clamping block 28 is located at two sides of the groove, the clamping block 28, the rotating shaft and the servo motor 26 are symmetrically arranged with the center of the processing table 6, the clamping block 28 is arc-shaped, a third electric push rod 30 is fixedly connected to one side, close to the processing table 6, of the clamping block 28, one end of the third electric push rod 30 is fixedly connected with a clamping plate 31, the third electric push rod 30 and the clamping plate 31 are located at two ends of the clamping block 28, and the clamping block 28 is symmetrically arranged with the center of the clamping block 28.
Because the arc mouth has been seted up to installation piece 25 near processing platform 6 one side, be convenient for movable block 18 drive electric telescopic handle 24 and installation piece 25 remove processing platform 6 department, can laminate with processing platform 6 outside, thereby be convenient for grip block 28 carries out spacingly to the wafer both sides, prevent the removal of wafer, promote grip block 31 laminating wafer both sides through third electric putter 30, the stability to the wafer centre gripping is convenient for improve through the grip block 31 that the symmetry set up, the electric telescopic handle 24 at movable block 18 top both ends is convenient for promote the installation piece 25 and remove, thereby be convenient for servo motor 26 drive axis of rotation and grip block 28 when rotating, the wafer can remain stable, can not drop at the upset in-process.
As shown in fig. 8-9, the protection structure 29 includes a fixed plate 291, a third motor 292 is fixedly mounted in the middle of the bottom of the fixed plate 291, a screw rod 293 is fixedly connected to the output end of the third motor 292, the outer surface of the screw rod 293 is in threaded connection with a moving plate 294, both ends of the moving plate 294 are movably connected with limiting rods, both sides of the moving plate 294 are hinged with squeezing plates 295, one end of the squeezing plate 295 is hinged with a movable block 296, and one end of the movable block 296 is provided with a telescopic plate 297.
The fixed plate 291 is convenient for fix the third motor 292, the screw rod 293 is driven to rotate by starting the third motor 292, and the movable plate 294 is convenient to drive to move downwards along the limiting rod and the screw rod 293 under the action of the limiting rod, so that the extrusion plate 295 deflects and pushes the movable block 296 to move towards the outer side of the processing table 6, the movable block 296 is convenient to push the telescopic plate 297 to move, the telescopic plate 297 stretches and moves to the outer side of the processing table 6, shielding protection is convenient to be carried out on the processing table 6 moving to the inside of the groove, and sweeps are prevented from being inconvenient to clean when polishing.
As shown in fig. 8-9, the top of the fixing plate 291 is fixedly mounted on the bottom of the electric telescopic column 27, the bottom of the screw rod 293 is rotatably connected with the inner wall of the bottom of the operation box 2, the telescopic plate 297 passes through the groove and is slidably connected with the inner wall of the bottom of the operation box 2, the telescopic plate 297 is positioned outside the electric telescopic column 27 and is positioned at the bottom of the processing table 6, the telescopic plate 297 is arranged in a central symmetry manner with the fixing plate 291, one end of the movable block 296, which is far away from the extrusion block, is fixedly connected with the telescopic plate 297, the movable block 296 is positioned inside the telescopic plate 297 and is slidably connected with the inner wall of the bottom of the operation box 2.
The electric telescopic column 27 is installed through the fixed plate 291, because the bottom of the screw rod 293 is rotationally connected with the inner wall of the bottom of the operation box 2, the telescopic plate 297 penetrates through the groove to be in sliding connection with the inner wall of the bottom of the operation box 2, when the third motor 292 rotates, the telescopic plate 297 is limited by the limiting rod, the movable plate 294 moves, the movable block 296 is enabled to move under the rotation of the extrusion plate 295, thereby pushing the telescopic plate 297 to stretch and move along the inner wall of the bottom of the operation box 2, when the telescopic plate 297 moves to the outer side of the processing table 6, the inner wall is attached to the processing table 6, the telescopic plate 297 is arranged through symmetry, when the movable plate is convenient to drive the fixed column to move, the telescopic plate 297 stretches from the two sides of the processing table 6, the telescopic plate 297 can shield the processing table 6, the movement of the third motor 292 is stopped, the wafer moving to the top of the processing table 6 moving to the inside the groove can be limited, the movement is prevented when the wafer is polished, the wafer can be protected and shielded when the wafer is polished, and scraps are prevented from being inconvenient to clean when the wafer is polished.
The invention also provides a manufacturing method using the semiconductor packaging device, which comprises the following steps:
step one: firstly, a film laminating mechanism is utilized to protect a circuit area on the front surface of a wafer, the back surface of the wafer is polished through a polishing mechanism, the film is removed after the back surface is polished to a proper thickness, a cutting mechanism is utilized to cut the wafer into chips, the chips are firstly placed on a packaging substrate, and then the chips are bonded together through an adhesive, so that heat dissipation and packaging firmness of the chips are ensured;
Step two: then, a gold wire or an aluminum wire is used for conducting wire bonding, and the chip and the pins are connected in a welding mode, so that connectivity of a circuit is ensured;
step three: then the chip and the wire bonding are packaged in the protective shell through the packaging material of resin or plastic, so that the chip and the wire bonding are protected, and the damage to the device caused by the external environment is prevented;
step four: then, carrying out static test and dynamic test on the packaged semiconductor device for verifying the function of the device and checking the performance and reliability of the device;
Step five: and finally, cleaning, polishing, marking and the like are carried out on the packaged product so as to enable the packaged product to meet the requirements of the final product.
Working principle: when in use, the wafer is fed through the feeding box 1, the wafer is conveyed to the conveying structure 5 in the operation box 2 through the control box 3, the wafer is conveyed to the processing table 6 through the conveying structure 5, the second motor 23 is started to drive the rotating rod 22 and the gear 21 to rotate, the first rack 19 and the second rack 20 drive the moving block 18 to move close to each other, the electric telescopic rod 24 and the mounting block 25 are driven to move close to the processing table 6, the clamping block 28 at one side of the mounting block 25 is driven to move to two sides of the wafer on the processing table 6, the wafer is clamped and fixed, the wafer is prevented from moving during film pasting, the first electric push rod 12 is driven to move downwards, the film pasting structure 13 is driven to paste the front surface of the wafer, after film pasting is completed, the first electric push rod 12 is started to drive the film pasting structure 13 to move upwards and away from the processing table 6, the third electric push rod 30 is started to drive the clamping plate 31 to move, so that the clamping plate 31 clamps two sides of a wafer, the wafer is fixed in one step, the electric telescopic rod 24 drives the mounting block 25 to move upwards, the wafer is far away from the processing table 6, the servo motor 26 is started to drive the rotating shaft and the clamping block 28 to rotate, the wafer clamped by the clamping plate 31 is turned over, the electric telescopic rod 24 drives the wafer to move to the top of the processing table 6 after the turning over is finished, the second motor 23 is started to rotate, the rotating rod 22 and the gear 21 rotate, the moving block 18 is driven to move to the original position under the action of the first rack 19 and the second rack 20, the clamping block 28 and the clamping plate 31 on one side of the mounting block 25 are not clamped to the wafer any more, the wafer is moved to the original position, the electric telescopic rod 27 drives the processing table 6 to move downwards, the wafer on the top of the processing table 6 is driven to move the middle part of the electric telescopic plate 297, the first motor 8 is started to drive the threaded rod 9 to rotate, the threaded block 10 is enabled to drive the bottom end of the connecting block 11 to move along the sliding groove under the action of the limiting rod, the first electric push rod 12 and the film pasting structure 13 at the bottom of the connecting block 11 move towards being close to the first motor 8, the fixing block 14 is used for driving the mounting plate 15 and the second electric push rod 16 to move, the polishing structure 17 is enabled to move to the top of the processing table 6, the first motor 8 is stopped to rotate, the second electric push rod 16 is enabled to drive the polishing structure 17 to move downwards to the top of a wafer on the processing table 6, the turned wafer is polished through the polishing structure 17, the wafer is taken out after polishing is completed, and therefore polishing of the back surface can be continued after the front film pasting of the wafer is facilitated, and work efficiency is improved.
When the electric telescopic column 27 drives the processing table 6 to move towards the inside of the groove, the screw rod 293 is driven to rotate by starting the third motor 292, the moving plate 294 moves downwards under the action of the limiting rod, the extrusion plate 295 deflects to drive the movable block 296 to move towards the two sides of the screw rod 293, the movable block 296 drives the telescopic plate 297 to move towards the outer side of the processing table 6, the telescopic plate 297 stretches, when the telescopic plate 297 moves to the outer side of the processing table 6, and when the inner wall of the telescopic plate is attached to the outer side of the processing table 6, the third motor 292 is stopped, the electric telescopic column 27 drives the processing table 6 to move downwards, the middle part of the electric telescopic plate 297 is driven to move through the telescopic plate 297, so that the processing table 6 is protected conveniently by the telescopic plate 297, scraps produced during wafer polishing are reduced to adhere to the clamping blocks 28 and other structures, cleaning is inconvenient, and the processing effect is affected.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting.
Claims (10)
1. The utility model provides a semiconductor packaging hardware, includes material loading case (1), its characterized in that, material loading case (1) one side is provided with control box (2), control box (2) one side is provided with control box (3), control box (2) bottom fixed mounting has base (4), base (4) top one side is provided with conveying structure (5), base (4) middle part is seted up flutedly, the recess top is provided with processing platform (6), base (4) are close to control box (3) inner wall top fixed mounting and have mounting bracket (7), mounting bracket (7) top is provided with first motor (8), first motor (8) conveying end fixedly connected with threaded rod (9), threaded rod (9) middle part threaded connection has screw thread block (10), screw thread block (10) one side fixedly connected with limiting rod, limiting rod one side and control box (2) inner wall sliding connection, screw thread block (10) bottom fixedly connected with (11), first electric putter (12) are connected with bottom fixed connection, first electric putter (12) are close to control box (3) inner wall top fixed mounting bracket (14), connecting block (14) fixed mounting bracket (14), the utility model discloses a grinding device for a machining bench, including mounting panel (15) and fixed mounting, mounting panel (15) bottom fixed mounting has second electric putter (16), second electric putter (16) bottom fixed mounting has polishing structure (17), base (4) top just is located processing bench (6) both sides all and is provided with movable block (18), movable block (18) one side is fixedly connected with first rack (19) and second rack (20) respectively, first rack (19) one side meshing has gear (21), gear (21) one side meshing has second rack (20), gear (21) middle part fixedly connected with dwang (22), dwang (22) bottom fixedly connected with second motor (23), movable block (18) top fixedly connected with electric telescopic handle (24), electric telescopic handle (24) top fixedly connected with installation piece (25), installation piece (25) inside is provided with servo motor (26), servo motor (26) output one side fixedly connected with axis of rotation, axis one end fixedly connected with grip block (28).
2. The semiconductor packaging device according to claim 1, wherein a conveying port is formed in one side of the operation box (2), one end of the conveying structure (5) is located in the conveying port, the conveying structure (5) is located on one side of the processing table (6), the film pasting structure (13) is located at the top of the processing table (6), the polishing structure (17) is located on one side of the film pasting structure (13), an electric telescopic column (27) is fixedly installed at the bottom of the processing table (6), a protection structure (29) is arranged at the bottom of the processing table (6), and the electric telescopic column (27) and the protection structure (29) are located in the groove.
3. The semiconductor packaging device according to claim 1, wherein the first motor (8) is fixedly mounted on the inner wall of the operation box (2), one end of the threaded rod (9) is rotatably connected with the inner wall of the operation box (2) far away from the first motor (8), the limiting rod is located at the top of the mounting frame (7), a sliding groove is formed in the top of the mounting frame (7), and the two sides of the connecting block (11) and the two sides of the mounting plate (15) are slidably connected with the sliding groove.
4. The semiconductor packaging device according to claim 1, wherein a mounting groove is formed in the top of the base (4) and located at one side of the groove, the mounting groove is fixedly mounted with the second motor (23), the rotating rod (22) penetrates through the mounting groove to extend to the top of the base (4), the first rack (19), the second rack (20) and the gear (21) are located at the top of the base (4), and are located at one side of the processing table (6) away from the conveying structure (5), and the bottoms of the moving block (18), the first rack (19) and the second rack (20) are slidably connected with the top surface of the base (4).
5. The semiconductor packaging device according to claim 1, wherein the electric telescopic rod (24) is located at two ends of the moving block (18), an arc opening is formed in one side, close to the processing table (6), of the mounting block (25), a fixing groove is formed in the mounting block (25), the servo motor (26) is fixedly mounted with the fixing groove, the clamping block (28) is located at the arc opening, the clamping block (28) is located at two sides of the groove, and the clamping block (28), the rotating shaft and the servo motor (26) are arranged in a central symmetry mode of the processing table (6).
6. The semiconductor packaging device according to claim 1, wherein the clamping block (28) is arc-shaped, a third electric push rod (30) is fixedly connected to one side of the clamping block (28) close to the processing table (6), a clamping plate (31) is fixedly connected to one end of the third electric push rod (30), the third electric push rod (30) and the clamping plate (31) are located at two ends of the clamping block (28), and the clamping plate and the clamping block are arranged in a central symmetry manner with the clamping block (28).
7. The semiconductor packaging device according to claim 2, wherein the protective structure (29) comprises a fixed plate (291), a third motor (292) is fixedly installed in the middle of the bottom of the fixed plate (291), a screw rod (293) is fixedly connected to the output end of the third motor (292), a movable plate (294) is connected to the outer surface of the screw rod (293) in a threaded manner, limit rods are movably connected to two ends of the movable plate (294), pressing plates (295) are hinged to two sides of the movable plate (294), a movable block (296) is hinged to one end of the pressing plates (295), and a telescopic plate (297) is arranged at one end of the movable block (296).
8. The semiconductor packaging device according to claim 7, wherein the top of the fixing plate (291) is fixedly mounted on the bottom of the electric telescopic column (27), the bottom of the screw rod (293) is rotatably connected with the bottom inner wall of the operation box (2), the telescopic plate (297) passes through the groove and is slidably connected with the bottom inner wall of the operation box (2), the telescopic plate (297) is located outside the electric telescopic column (27), and is located at the bottom of the processing table (6).
9. The semiconductor packaging device according to claim 8, wherein the expansion plate (297) is arranged with a center symmetry of the fixed plate (291), one end of the movable block (296) away from the pressing block is fixedly connected with an inner wall of the expansion plate (297), the movable block (296) is located inside the expansion plate (297), and is slidably connected with an inner wall of a bottom of the operation box (2).
10. A manufacturing method using the semiconductor package apparatus of claim 9, comprising the steps of:
step one: firstly, a film laminating mechanism is utilized to protect a circuit area on the front surface of a wafer, the back surface of the wafer is polished through a polishing mechanism, the film is removed after the back surface is polished to a proper thickness, a cutting mechanism is utilized to cut the wafer into chips, the chips are firstly placed on a packaging substrate, and then the chips are bonded together through an adhesive, so that heat dissipation and packaging firmness of the chips are ensured;
Step two: then, a gold wire or an aluminum wire is used for conducting wire bonding, and the chip and the pins are connected in a welding mode, so that connectivity of a circuit is ensured;
step three: then the chip and the wire bonding are packaged in the protective shell through the packaging material of resin or plastic, so that the chip and the wire bonding are protected, and the damage to the device caused by the external environment is prevented;
step four: then, carrying out static test and dynamic test on the packaged semiconductor device for verifying the function of the device and checking the performance and reliability of the device;
Step five: and finally, cleaning, polishing, marking and the like are carried out on the packaged product so as to enable the packaged product to meet the requirements of the final product.
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| CN118692980B (en) * | 2024-08-22 | 2024-11-12 | 南轩（天津）科技有限公司 | A centering platform for silicon wafer back sealing machine |
| CN119480653A (en) * | 2025-01-13 | 2025-02-18 | 成都鸿立芯半导体有限公司 | Chip plastic package device and method for integrated circuit production |
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| JP2005109155A (en) * | 2003-09-30 | 2005-04-21 | Disco Abrasive Syst Ltd | Processing method of semiconductor wafer |
| JP2018074082A (en) * | 2016-11-02 | 2018-05-10 | 株式会社ディスコ | Processing method of wafer |
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| JP2005086074A (en) * | 2003-09-10 | 2005-03-31 | Disco Abrasive Syst Ltd | Method for transferring semiconductor wafer |
| JP6249318B2 (en) * | 2017-02-21 | 2017-12-20 | 株式会社東京精密 | Manufacturing system and manufacturing method of thin chip having high bending strength |
| CN108091605B (en) * | 2017-12-06 | 2018-12-21 | 英特尔产品（成都）有限公司 | A method of it reducing wafer and accidentally removes |
| CN110561264B (en) * | 2019-10-10 | 2020-08-25 | 温州冲亚电子科技有限公司 | Crystal bar outer diameter grinding equipment for semiconductor components and parts |
| CN113732851B (en) * | 2021-11-05 | 2022-02-01 | 四川明泰微电子有限公司 | Device for polishing back of semiconductor wafer |
| CN218160325U (en) * | 2022-08-30 | 2022-12-27 | 苏州利亚得智能装备有限公司 | Automatic wafer feeding machine |
| CN116646255B (en) * | 2023-05-24 | 2024-03-22 | 浙江嘉辰半导体有限公司 | Wafer level packaging technology meeting electromagnetic compatibility requirement |
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| JP2005109155A (en) * | 2003-09-30 | 2005-04-21 | Disco Abrasive Syst Ltd | Processing method of semiconductor wafer |
| JP2018074082A (en) * | 2016-11-02 | 2018-05-10 | 株式会社ディスコ | Processing method of wafer |
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