CN118363199A - Panel driving circuit, method, display device and equipment - Google Patents

Abstract

The present application relates to a panel driving circuit, method, display device and equipment, in which a panel heating module heats the panel according to a target voltage signal output by a boost control circuit module, and a temperature detection signal corresponding to the panel is fed back to the boost control circuit module through a thermistor module, so that the boost control circuit module can perform boost control according to the temperature detection signal and the input voltage signal of the panel to form a loop to maintain the constant temperature of the panel and meet the heating panel demand, thereby effectively improving the liquid crystal response speed and reducing the grayscale response time, thereby solving the ghosting problem caused by the long liquid crystal response time in the existing display technology.

Description

Panel driving circuit, method, display device and equipment

Technical Field

The present application relates to the field of display technology, and in particular to a panel driving circuit, method, display device and equipment.

Background technique

With the rapid development of display technology, liquid crystal display products have been widely used. For example, liquid crystal display (LCD) has the advantages of low power consumption, small size, and low radiation, and is used for screen display of televisions and computers.

In the specific implementation, the liquid crystal display screen is mainly displayed through the LCD panel. The basic principle of LCD panel display is: by controlling the electric field strength loaded on the liquid crystal, the liquid crystal rotation angle is controlled to change the light flux passing through the liquid crystal, and different grayscales are displayed, and the red (Red, R) green (Green, G) blue (Blue, B) color resistance ratio is matched to realize the display of various colors. Because the liquid crystal molecules have viscosity, it takes time to rotate. When displaying a high-speed moving picture, the grayscale between frames switches quickly, and the liquid crystal does not respond in time, and it looks like there will be a smear phenomenon. At present, in order to solve the smear phenomenon, an overdrive (OD) method is usually used to control the rotation of the liquid crystal. This solution is to compensate by comparing the grayscale values of the previous and next two frames. When the target grayscale of the next frame is greater than the current frame, the next frame will output a grayscale larger than the target grayscale to compensate, and vice versa. Output a smaller grayscale to compensate. However, this technical solution cannot take effect when the target grayscale is the maximum/minimum value, because there is no larger/smaller grayscale to compensate.

Summary of the invention

The present application provides a panel driving circuit, method, display device and equipment to solve the problem of ghosting caused by the long response time of liquid crystal in the existing display technology.

In a first aspect, an embodiment of the present application provides a panel driving circuit, including: a boost control circuit module, a panel heating module and a thermal sensor module;

The panel heating module is used to heat the panel according to the target voltage signal output by the boost control circuit module;

The thermistor module is used to feed back the temperature detection signal corresponding to the panel to the boost control circuit module;

The boost control circuit module is used to perform boost control according to the temperature detection signal and the input voltage signal of the panel, generate the target voltage signal and output it.

Optionally, the panel heating module includes: a heating resistor of the panel, a power input end of the heating resistor is electrically connected to an output end of the boost control module, and a power output end of the heating resistor is electrically connected to a reference ground of the panel.

Optionally, the heating resistor is an indium tin oxide thin film layer disposed on the surface of the panel, and the panel is provided with at least two groups of electrode access points, each group of electrode access points includes a first access point and a second access point, the first access point is used to connect the indium tin oxide thin film layer to the output end of the boost control module, and the second access point is used to electrically connect the indium tin oxide thin film layer to the reference ground.

Optionally, the boost control circuit module includes a boost chopper circuit and a boost control chip;

The feedback input end of the boost control chip is electrically connected to the output end of the thermistor module, the control output end of the boost control chip is electrically connected to the control end of the boost chopper circuit, and the boost control chip is used to determine the pulse duty ratio according to the temperature detection signal, and output a pulse control signal to the boost chopper circuit according to the pulse duty ratio;

The output end of the boost chopper circuit is electrically connected to the power input end of the panel heating module and the power input end of the thermistor module. The boost chopper circuit is used to boost the input voltage signal of the panel based on the pulse control signal, generate the target voltage signal, and transmit the target voltage signal to the panel heating module and the thermistor module.

Optionally, the boost chopper circuit comprises an inductor, a transistor and a diode;

The first end of the inductor is electrically connected to the power input end of the panel, the second end of the inductor is electrically connected to the first end of the transistor and the anode of the diode, the control end of the transistor is electrically connected to the control output end of the boost control chip, the second end of the transistor is electrically connected to the reference ground of the panel, and the cathode of the diode is electrically connected to the power input end of the panel heating module and the power input end of the thermistor module.

Optionally, the boost chopper circuit further comprises a first capacitor;

One end of the first capacitor is electrically connected to the first end of the inductor and the power input end of the panel, and the other end of the first capacitor is electrically connected to the reference ground of the panel.

Optionally, the thermistor module comprises a thermistor, a first resistor and a second resistor;

The first end of the thermistor is electrically connected to the first end of the first resistor and the output end of the boost control circuit module, the second end of the thermistor, the second end of the first resistor and the first end of the second resistor are all electrically connected to the feedback input end of the boost control circuit module, and the second end of the second resistor is electrically connected to the reference ground of the panel;

The feedback input terminal of the boost control circuit module is used to receive the temperature detection signal.

Optionally, the thermistor module further includes a second capacitor, a first end of the second capacitor is electrically connected to the first end of the thermistor, the first end of the first resistor and the output end of the boost control circuit module, and a second end of the second capacitor is electrically connected to the reference ground of the panel.

In a second aspect, an embodiment of the present application provides a panel driving method, which is applied to the driving circuit as described in any one of the first aspects, and the driving method includes:

Heating the panel through a target voltage signal output by a boost control circuit module;

Feeding back the temperature detection signal corresponding to the panel to the boost control circuit module;

According to the temperature detection signal and the input voltage signal of the panel, a boost control is performed through a boost control circuit module to generate and output the target voltage signal.

In a third aspect, an embodiment of the present application provides a display device, comprising a driving circuit and a power supply module as described in any one of the first aspects, wherein the power supply module is used to control power supply to the driving circuit.

In a fourth aspect, an embodiment of the present application provides a display device, comprising: at least one communication interface; at least one bus connected to the at least one communication interface; at least one processor connected to the at least one bus; and at least one memory connected to the at least one bus, wherein the processor is configured to: heat a panel through a target voltage signal output by a boost control circuit module; feed back a temperature detection signal corresponding to the panel to the boost control circuit module; perform boost control through the boost control circuit module based on the temperature detection signal and the input voltage signal of the panel, generate the target voltage signal and output it.

In summary, the driving circuit, method, display device and equipment provided in the embodiments of the present application heat the panel through the target voltage signal output by the boost control circuit module, and feed back the temperature detection signal corresponding to the panel to the boost control circuit module to form a loop, so that the boost control circuit module can perform boost control based on the temperature detection signal and the input voltage signal of the panel, generate and output the target voltage signal to maintain the constant temperature of the panel and meet the heating panel requirements, thereby effectively improving the liquid crystal response speed and reducing the grayscale response time, solving the ghosting problem caused by the long liquid crystal response time in the existing related technologies.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

FIG1 is a driving schematic diagram of a driving circuit provided in an embodiment of the present application;

FIG2 is a schematic diagram of a driving circuit of a panel provided in an optional embodiment of the present application;

FIG3 is a schematic diagram of heating and power supply for an ITO thin film layer provided in an example of the present application;

FIG4 is a schematic diagram of providing multiple groups of metal electrodes on the surface of a panel according to an example of the present application;

FIG5 is a schematic diagram of a step flow of a panel driving method provided in an embodiment of the present application;

FIG6 is a structural block diagram of a display device provided in an embodiment of the present application;

FIG. 7 is a schematic diagram of the structure of a display device provided in an embodiment of the present application.

Among them, R_HIT is a heating resistor, FB is a feedback input terminal, Gate is a control output terminal, ITO is an indium tin oxide film, L1 is an inductor, M1 is a transistor, D1 is a diode, C1 is a first capacitor, C2 is a second capacitor, RT is a thermistor, R1 is a first resistor, R2 is a second resistor, 600 is a display device, 610 is a drive circuit, 611 is a power supply module, 111 is a processor, 112 is a communication interface, 113 is a memory, and 114 is a bus.

Detailed ways

In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

The disclosure below provides many different embodiments or examples to implement the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the application can repeat reference numbers and/or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and/or settings discussed.

Since the viscosity of liquid crystal decreases with increasing temperature, that is, the higher the temperature, the lower the viscosity. Under the same electric field strength, the liquid crystal rotates faster. For example, the gray scale response time (Grey To Gre, GTG) of LCD at 5°C is about 20ms, while the gray scale response time at 25°C is about 5ms, and the gray scale response time at 40°C is about 3ms.

Based on the above, the embodiments of the present application provide a panel driving circuit, method, display device and equipment, by building a heating structure into the panel as a panel heating module, and driving the circuit to heat the panel to improve the liquid crystal response speed and reduce the grayscale response time, thereby solving the ghosting problem caused by the long liquid crystal response time in the existing display technology.

FIG1 is a driving schematic diagram of a panel driving circuit provided by an embodiment of the present application. The panel driving circuit provided by the present embodiment may specifically include: a boost control circuit module, a panel heating module and a thermistor module; the panel heating module is used to heat the panel according to the target voltage signal output by the boost control circuit module; the thermistor module is used to feed back the temperature detection signal corresponding to the panel to the boost control circuit module; the boost control circuit module is used to perform boost control according to the temperature detection signal and the input voltage signal of the panel, generate the target voltage signal and output it.

Among them, the input voltage signal of the panel refers to the voltage signal generated based on the input power supply, such as the input voltage signal may refer to the input voltage signal of the panel; the temperature detection signal corresponding to the panel may refer to the temperature signal detected by the temperature detection of the panel; the target voltage signal refers to the voltage signal output by the boost control circuit module, such as the target voltage signal may refer to the voltage signal output by the boost control module to power the panel. Specifically, the driving circuit of the panel provided in the embodiment of the present application uses a boost control circuit module as a core control circuit module, and performs boosting based on the input voltage signal of the panel, that is, the input voltage is boosted, and the signal obtained after the boosting is used as the target voltage signal, which is supplied to the panel heating module, so that the panel heating module can heat the panel according to the target voltage signal output by the boost control circuit module, and at the same time, the temperature of the panel can be detected by the thermistor module to generate a temperature detection signal corresponding to the panel, and the temperature detection signal can be fed back to the boost control circuit module, so that the boost control circuit module can perform boost control according to the temperature detection signal and the input voltage signal of the panel to form a loop, so that the target voltage signal output by the boost control circuit module can finally stabilize at a suitable voltage value to maintain the constant temperature of the panel and meet the heating panel requirements, thereby improving the liquid crystal response speed and reducing the grayscale response time.

It can be seen that the driving circuit of the panel provided in the embodiment of the present application heats the panel according to the target voltage signal output by the boost control circuit module through the panel heating module, and feeds back the temperature detection signal corresponding to the panel to the boost control circuit module through the thermistor module, so that the boost control circuit module can perform boost control according to the temperature detection signal and the input voltage signal of the panel to form a loop to maintain the constant temperature of the panel and meet the heating panel demand, thereby effectively improving the liquid crystal response speed and reducing the grayscale response time, thereby solving the ghosting problem caused by the long liquid crystal response time in the existing related technology.

In an embodiment of the present application, the panel heating module may be a heating module inside the panel, such as the heating module may be a heating resistor R_HIT inside the LCD panel, as shown in FIG2 , so as to utilize the heating resistor R_HIT to heat the panel. Optionally, the panel heating module in the embodiment of the present application includes: a heating resistor R_HIT of the panel, the power input end of the heating resistor R_HIT is electrically connected to the output end of the boost control module, and the power output end of the heating resistor R_HIT is electrically connected to the reference ground of the panel, so that the heating resistor R_HIT can be heated according to the target voltage signal output by the boost control circuit module to achieve panel heating.

In an optional implementation of the present application, the boost control circuit module may include a boost chopper circuit and a boost control chip; the feedback input terminal FB of the boost control chip is electrically connected to the output terminal of the thermistor module, and the control output terminal Gate of the boost control chip is electrically connected to the control terminal of the boost chopper circuit, so that the boost control chip can determine the pulse duty cycle according to the temperature detection signal, so as to output a pulse control signal to the boost chopper circuit according to the pulse duty cycle, so that the boost chopper circuit can boost the input voltage signal of the panel based on the pulse control signal, generate the target voltage signal, and transmit it to the panel heating module and the thermistor module to power the panel heating module and thermistor module, thereby ensuring that the panel heating module and thermistor module can work normally.

The boost control chip is used to determine the pulse duty cycle according to the temperature detection signal, and output a pulse control signal to the boost chopper circuit according to the pulse duty cycle. The output end of the boost chopper circuit is electrically connected to the power input end of the panel heating module and the power input end of the thermistor module, so that the boost chopper circuit can transmit the target voltage signal to the panel heating module and the thermistor module. The boost chopper circuit is used to boost the input voltage signal of the panel based on the pulse control signal, generate the target voltage signal, and transmit the target voltage signal to the panel heating module and the thermistor module.

In some optional embodiments of the present application, the heating resistor R_HIT inside the panel can be made of an indium tin oxide (ITO) film to heat the panel using the ITO film. For example, another layer of ITO film can be covered on the panel to heat the panel. It should be noted that ITO is a conductive transparent material and usually acts as a power supply electrode VCOM in the panel.

In the specific implementation, due to the resistance distribution of ITO, if the heating voltage is only sent from one side of the panel, it will cause the temperature of the sending side to meet the heating requirements while the temperature at the far end is not enough. As shown in Figure 3, the metal electrode is connected to the ITO, and the external power supply is connected to the metal electrode. Due to the resistance distribution of the entire surface of ITO, the resistance close to the power supply side is small and the temperature is high, while the temperature away from the power supply side gradually decreases. In order to avoid this problem, multiple electrode access points can be arranged. As shown in Figure 4, multiple groups of metal electrodes can be set on the surface of the panel as electrode access points for the panel to connect the ITO heating resistor, so that in actual application, the voltage can be switched in turn through multiple groups of metal electrodes. For example, only one group of metal electrodes is connected to the voltage at the same time, so that high-frequency switching can be used to achieve uniform heating effect on the entire surface.

Optionally, the heating resistor R_HIT in the embodiment of the present application is an indium tin oxide thin film layer arranged on the surface of the panel, and the panel is provided with at least two groups of electrode access points, each group of electrode access points includes a first access point and a second access point, the first access point is used to connect the indium tin oxide thin film layer to the output end of the boost control module, and the second access point is used to electrically connect the indium tin oxide thin film layer to the reference ground.

In some optional embodiments of the present application, a BOOST boost circuit can be used as the boost chopper circuit in the embodiments of the present application, so as to use the BOOST boost circuit to boost the input voltage, and the output voltage signal obtained after the boost can be provided to the panel as a target voltage signal, so that the boosted output voltage is supplied to the panel heating module, and at the same time, the built-in thermistor module of the panel is used as a temperature sensor, and the detected temperature signal can be used as a temperature detection signal and fed back to the boost control chip to form a loop to maintain the constant temperature of the panel.

For example, when the input voltage uses the panel's regular power supply voltage of 12V, a BOOST control IC can be used as a boost control chip in the boost control circuit module, and the boost chopper circuit in the boost control circuit module can use a BOOST architecture composed of an inductor L1, a transistor M1, and a diode D1. As shown in Figure 2, when the transistor M1 is turned on, the inductor L1 stores energy; when the transistor M1 is turned off, since the current of the inductor L1 cannot change suddenly, the voltage on the right side of the inductor L1 is raised, and the diode D1 is turned on, thereby achieving a boost. By controlling the proportion of the transistor M1 being turned on and off, that is, controlling the duty cycle of the pulse control signal output to the transistor M1, different output voltages can be achieved. Among them, the first resistor R1 and the second resistor R2 form a feedback circuit to feed back the temperature detection signal to the BOOST control IC, such as the voltage of the node where the thermistor RT in the thermistor sensor module is connected to the first resistor R1 and the second resistor R2, as a feedback voltage, transmitted to the feedback input terminal FB of the boost control chip to control the duty cycle of the transistor M1 gate signal to achieve a voltage stabilization effect.

Optionally, the boost chopper circuit in the embodiment of the present application includes an inductor L1, a transistor M1 and a diode D1; the first end of the inductor L1 is electrically connected to the power input end of the panel, the second end of the inductor L1 is electrically connected to the first end of the transistor M1 and the anode of the diode D1, the control end of the transistor M1 is electrically connected to the control output end Gate of the boost control chip, the second end of the transistor M1 is electrically connected to the reference ground of the panel, and the cathode of the diode D1 is electrically connected to the power input end of the panel heating module and the power input end of the thermistor module.

Of course, the boost chopper circuit in the embodiment of the present application may include other circuit components in addition to the inductor L1, the transistor M1 and the diode D1, such as a first capacitor C1, so as to stabilize the input voltage through the first capacitor C1.

Optionally, the boost chopper circuit in the embodiment of the present application may include an inductor L1, a transistor M1, a diode D1 and a first capacitor C1; one end of the first capacitor C1 is electrically connected to the first end of the inductor L1 and the power input end of the panel, and the other end of the first capacitor C1 is electrically connected to the reference ground of the panel. The power input end of the panel is used to provide an input voltage signal of the panel.

In some optional embodiments of the present application, the thermistor module includes a thermistor RT, a first resistor R1 and a second resistor R2; the first end of the thermistor RT is electrically connected to the first end of the first resistor R1 and the output end of the boost control circuit module, the second end of the thermistor RT, the second end of the first resistor R1 and the first end of the second resistor R2 are all electrically connected to the feedback input end FB of the boost control circuit module, and the second end of the second resistor R2 is electrically connected to the reference ground of the panel, so that the thermistor module can use the feedback circuit composed of the first resistor R1 and the second resistor R2 to feed back the voltage of the node where the thermistor RT is connected to the first resistor R1 and the second resistor R2 as a temperature detection signal to the feedback input end FB of the boost control circuit module, so that the feedback input end FB of the boost control circuit module can receive the temperature detection signal. Wherein, the feedback input end FB of the boost control circuit module is used to receive the temperature detection signal, so that the boost control chip can determine the pulse duty cycle according to the temperature detection signal, and then output the pulse control signal to the boost chopper circuit according to the pulse duty cycle to achieve voltage stabilization.

Of course, the thermistor module in the embodiment of the present application may include not only the thermistor RT, the first resistor R1 and the second resistor R2, but also other circuit components, such as a second capacitor CR2, so as to stabilize the target voltage signal output by the boost control circuit module through the second capacitor CR2.

Optionally, the thermistor sensor module in the embodiment of the present application includes a thermistor RT, a first resistor R1, a second resistor R2 and a second capacitor CR2, the first end of the second capacitor CR2 is electrically connected to the first end of the thermistor RT, the first end of the first resistor R1 and the output end of the boost control circuit module, and the second end of the second capacitor CR2 is electrically connected to the reference ground of the panel.

In some optional embodiments of the present application, the thermistor RT in the thermistor sensing module may be composed of a negative temperature coefficient thermistor (NTC) on the panel, so as to generate a temperature detection signal corresponding to the panel through detection by the negative temperature coefficient thermistor, and the temperature detection signal may be fed back to the boost control circuit module, so as to introduce a temperature variable in the feedback, so that the boost control circuit module can perform boost control according to the temperature detection signal, and further the target voltage signal output by the boost control circuit module can change with the panel temperature and finally stabilize at a suitable value.

In an embodiment of the present application, the higher the temperature, the smaller the resistance value of the thermistor RT. In the embodiment of the present application, the thermistor RT is connected in parallel with the first resistor R1 to introduce a temperature variable in the feedback, so that the output voltage of the boost control circuit module changes with the panel temperature and finally stabilizes at a suitable value, and the stable voltage value can be determined by the power of heating the panel to the required temperature, and the power size can be determined by the size of the LCD panel, which is not limited in the embodiment of the present application.

For example, assuming that the required heating temperature is Th℃, the power is Ph, the resistance of the thermistor RT is Rt, and the resistance of the panel heating resistor R_HIT is Rh, the voltage value Vout of the output target voltage signal can be obtained by calculation according to the formula P＝U^2/R, that is, Based on the feedback voltage VFB and the resistance value Rt of the thermistor RT when the temperature is stable, according to the formula The values of the first resistor R1 and the second resistor R2 can be calculated.

In a specific implementation, the values of the first resistor R1 and the second resistor R2 can be more than one group. For example, considering that the chip feedback pin will consume current, the resistance value is usually in the kilo-ohm range. Specifically, when the device is turned on, due to the low room temperature, the resistance Rt of the thermistor RT is relatively large, and the parallel resistance of the first resistor R1 and the thermistor RT is large. At this time, the output voltage is large and the power is large, which can quickly heat the LCD panel; when the panel temperature rises, the resistance Rt of the thermistor RT decreases with the temperature rise, and the parallel resistance of the first resistor R1 and the thermistor RT also decreases, the output voltage decreases, and the power decreases until the loop formed by the heating temperature and the thermistor RT reaches a steady state. After the panel temperature reaches the target temperature and is constant, the liquid crystal response speed is improved, thereby solving the problem of ghosting caused by low temperature, high liquid crystal viscosity, and untimely liquid crystal response.

Furthermore, the embodiment of the present application also provides a panel driving method, which is applied to the driving circuit as described in any one of the above embodiments of the present application. As shown in FIG5 , the panel driving method provided in the embodiment of the present application may specifically include the following steps:

Step 510, heating the panel through the target voltage signal output by the boost control circuit module;

Step 520, feeding back the temperature detection signal corresponding to the panel to the boost control circuit module;

Step 530, performing boost control through a boost control circuit module according to the temperature detection signal and the input voltage signal of the panel, generating and outputting the target voltage signal.

It can be seen that the embodiment of the present application heats the panel through the target voltage signal output by the boost control circuit module, and feeds back the temperature detection signal corresponding to the panel to the boost control circuit module to form a loop, so that the boost control circuit module can perform boost control based on the temperature detection signal and the input voltage signal of the panel, generate and output the target voltage signal to maintain the constant temperature of the panel and meet the heating panel requirements, thereby effectively improving the liquid crystal response speed and reducing the grayscale response time, solving the ghosting problem caused by the long liquid crystal response time in the existing related technologies.

Furthermore, the embodiment of the present application also provides a display device, including the above-mentioned driving circuit and power supply module provided in the embodiment of the present application, wherein the power supply module is used to control the power supply to the driving circuit. Since the principle of solving the problem of the display device is similar to that of the aforementioned driving circuit, the implementation of the driving circuit in the display device can refer to the implementation of the driving circuit of the panel in the aforementioned example, and the repeated parts will not be repeated.

For example, as shown in FIG. 6 , the display device 600 includes: a panel driving circuit 610 and a power supply module 611 , wherein the power supply module 611 is used to control the power supply to the driving circuit 610 ; wherein the driving circuit 610 may be any panel driving circuit provided in the above embodiments.

In a specific implementation, the display device 600 can be a display device with a display screen, such as a monitor, a mobile phone, a television, a laptop computer, an electronic paper, a digital photo frame, a navigator, etc., and this application does not impose any specific limitation on this.

Furthermore, an embodiment of the present application also provides a display device, as shown in Figure 7, the display device includes: at least one communication interface 112; at least one bus 114 connected to the at least one communication interface 112; at least one processor 111 connected to the at least one bus 114; at least one memory 113 connected to the at least one bus 114, wherein the processor 111 is configured to: heat the panel through the target voltage signal output by the boost control circuit module; feed back the temperature detection signal corresponding to the panel to the boost control circuit module; perform boost control through the boost control circuit module based on the temperature detection signal and the input voltage signal of the panel, generate the target voltage signal and output it.

It can be seen that the display device provided in the embodiment of the present application heats the panel through the target voltage signal output by the boost control circuit module, and feeds back the temperature detection signal corresponding to the panel to the boost control circuit module to form a loop, so that the boost control circuit module can perform boost control based on the temperature detection signal and the input voltage signal of the panel, generate and output the target voltage signal, so as to maintain the constant temperature of the panel and meet the heating panel demand, thereby effectively improving the liquid crystal response speed, reducing the grayscale response time, and solving the ghosting problem caused by the long liquid crystal response time in the existing related technology.

The above described apparatus and device embodiments are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a general hardware platform, and of course, by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM/RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiment.

It should be understood that the terms used in the text are only for the purpose of describing specific example embodiments, and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used in the text may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and/or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and/or combinations thereof. The method steps, processes, and operations described in the text are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims (11)

1. A driving circuit of a panel, comprising: the panel heating module is used for heating the panel;

The panel heating module is used for heating the panel according to the target voltage signal output by the boost control circuit module;

The heat-sensitive sensing module is used for feeding back a temperature detection signal corresponding to the panel to the boost control circuit module;

The boost control circuit module is used for performing boost control according to the temperature detection signal and the input voltage signal of the panel, generating the target voltage signal and outputting the target voltage signal.

2. The drive circuit of claim 1, wherein the panel heating module comprises: the power supply input end of the heating resistor is electrically connected with the output end of the boosting control module, and the power supply output end of the heating resistor is electrically connected with the reference ground of the panel.

3. The drive circuit of claim 2, wherein the heating resistor is an indium tin oxide thin film layer disposed on a surface of the panel, the panel is provided with at least two sets of electrode access points, each set of electrode access points including a first access point for connecting the indium tin oxide thin film layer with an output of the boost control module and a second access point for electrically connecting the indium tin oxide thin film layer with the reference.

4. The drive circuit according to claim 1, wherein the boost control circuit module includes a boost chopper circuit and a boost control chip;

The feedback input end of the boost control chip is electrically connected with the output end of the heat-sensitive sensing module, the control output end of the boost control chip is electrically connected with the control end of the boost chopper circuit, and the boost control chip is used for determining a pulse duty ratio according to the temperature detection signal and outputting a pulse control signal to the boost chopper circuit according to the pulse duty ratio;

The output end of the boost chopper circuit is electrically connected with the power input end of the panel heating module and the power input end of the heat-sensitive sensing module, and the boost chopper circuit is used for boosting the input voltage signal of the panel based on the pulse control signal, generating the target voltage signal and transmitting the target voltage signal to the panel heating module and the heat-sensitive sensing module.

5. The drive circuit according to claim 4, wherein the boost chopper circuit includes an inductor, a transistor, and a diode;

The first end of the inductor is electrically connected with the power input end of the panel, the second end of the inductor is electrically connected with the first end of the transistor and the anode of the diode, the control end of the transistor is electrically connected with the control output end of the boost control chip, the second end of the transistor is electrically connected with the reference of the panel, and the cathode of the diode is electrically connected with the power input end of the panel heating module and the power input end of the heat-sensitive sensing module.

6. The drive circuit of claim 5, wherein the boost chopper circuit further comprises a first capacitor;

one end of the first capacitor is electrically connected with the first end of the inductor and the power input end of the panel, and the other end of the first capacitor is electrically connected with the reference of the panel.

7. The drive circuit according to any one of claims 1 to 6, wherein the heat-sensitive sensing module includes a thermistor, a first resistor, and a second resistor;

The first end of the thermistor is electrically connected with the first end of the first resistor and the output end of the boost control circuit module, the second end of the thermistor, the second end of the first resistor and the first end of the second resistor are electrically connected with the feedback input end of the boost control circuit module, and the second end of the second resistor is electrically connected with the reference ground of the panel;

And the feedback input end of the boost control circuit module is used for receiving the temperature detection signal.

8. The drive circuit of claim 7, wherein the heat sensitive sensing module further comprises a second capacitor, a first end of the second capacitor being electrically connected to the first end of the thermistor, the first end of the first resistor, and the output of the boost control circuit module, a second end of the second capacitor being electrically connected to a reference of the panel.

9. A driving method of a panel, characterized in that it is applied to the driving circuit according to any one of claims 1 to 8, the driving method comprising:

heating the panel through a target voltage signal output by the boost control circuit module;

Feeding back a temperature detection signal corresponding to the panel to the boost control circuit module;

And performing boost control through a boost control circuit module according to the temperature detection signal and the input voltage signal of the panel, generating and outputting the target voltage signal.

10. A display device comprising a drive circuit as claimed in any one of claims 1 to 8 and a power supply module for controlling the power supply to the drive circuit.

11. A display device, characterized by comprising: at least one communication interface; at least one bus connected to the at least one communication interface; at least one processor coupled to the at least one bus; at least one memory coupled to the at least one bus, wherein the processor is configured to: heating the panel through a target voltage signal output by the boost control circuit module; feeding back a temperature detection signal corresponding to the panel to the boost control circuit module; and performing boost control through a boost control circuit module according to the temperature detection signal and the input voltage signal of the panel, generating and outputting the target voltage signal.