CN118362082A - Verticality detection method and dicing saw - Google Patents
Verticality detection method and dicing saw Download PDFInfo
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- CN118362082A CN118362082A CN202410597528.5A CN202410597528A CN118362082A CN 118362082 A CN118362082 A CN 118362082A CN 202410597528 A CN202410597528 A CN 202410597528A CN 118362082 A CN118362082 A CN 118362082A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/22—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
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- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a verticality detection method and a dicing saw, and belongs to the technical field of dicing saw. The verticality detection method comprises the following steps: s1: detecting the flatness n1 of the working disc; s2: obtaining displacement values from a displacement sensor distributed at three points on the periphery of a microscope to a working disc, wherein the displacement values are x1, x2 and x3 respectively, and calculating to obtain y1=max (x 1, x2 and x 3) -min (x 1, x2 and x 3); s3: detecting the flatness n2 of the workpiece on the working disc; s4: obtaining displacement values from a displacement sensor distributed at three points on the periphery of a microscope to a workpiece, wherein the displacement values are x4, x5 and x6 respectively, and calculating to obtain y2=max (x 4, x5 and x 6) -min (x 4, x5 and x 6); when n1 is less than 9um, y1 is less than (9+m) um, n2 is less than 7um and y2 is less than (7+m) um, the perpendicularity between the microscope and the working disk is preset perpendicularity. According to the perpendicularity detection method, the perpendicularity is automatically detected, time and labor are saved, the detection efficiency and the detection precision are high, and the scribing quality of a workpiece can be guaranteed.
Description
Technical Field
The invention relates to the technical field of dicing saws, in particular to a verticality detection method and a dicing saw.
Background
Dicing the plurality of wafers on the substrate, typically using a dicing saw, to form individual wafers and form dicing cuts in the substrate; in the process of dicing the wafer by the dicing saw, the accuracy of detecting the tool marks is determined by the perpendicularity between a microscope on the dicing saw and the working disk, so that the quality of the diced wafer can be determined according to the detected tool marks, and the problem of edge breakage or breakage of the wafer is avoided.
At present, the perpendicularity between the microscope and the working disc is detected in an artificial mode, time and labor are wasted, the detection precision is low, and the dicing quality of the wafer cannot be guaranteed.
In view of the above, there is a need for a verticality detection method and dicing saw to solve the above problems.
Disclosure of Invention
The invention aims to provide a verticality detection method and a dicing saw, which can automatically detect the verticality between a microscope and a working disk, save time and labor, have higher detection efficiency and detection precision, and can ensure the dicing quality of workpieces.
To achieve the purpose, the invention adopts the following technical scheme:
the verticality detection method is used for detecting the verticality between the microscope and the working disc and comprises the following steps:
s1: detecting the flatness n1 of the working disc;
s2: obtaining displacement values from a three-point distributed displacement sensor at the periphery of the microscope to the working disk, wherein the displacement values are x1, x2 and x3 respectively, and calculating to obtain y1=max-min;
s3: detecting the flatness n2 of the workpiece on the working disc;
S4: obtaining displacement values from the displacement sensor to the workpiece, which are distributed at three points on the periphery of the microscope, to be x4, x5 and x6 respectively, and calculating to obtain y2=max-min;
Wherein when n1 < 9um, y1 < (9+m) um, n2 < 7um, and y2 < (7+m) um, the perpendicularity between the microscope and the working disk is a preset perpendicularity; wherein m is an error value determined according to a definition parameter observed by the microscope, and m is a constant related to the microscope.
Alternatively, a laser radar sensor is used to detect the flatness n1 of the work plate and the flatness n2 of the work piece on the work plate, respectively.
Alternatively, when the perpendicularity between the microscope and the working disk is not the preset perpendicularity, the microscope is adjusted to adjust y1 and y2.
Alternatively, the microscope is mounted on the support through a fixing plate, a jackscrew is threaded on the fixing plate, and when the jackscrew is screwed, the deflection angle and the pitching angle of the axis of the microscope relative to the Z axis can be adjusted.
As an alternative, the jackscrew includes first jackscrew and second jackscrew, first jackscrew and second jackscrew are installed respectively to two adjacent curb plates on the fixed plate, follow the Y axle screw thread and twist first jackscrew, can adjust the axis of microscope relative to the yaw angle of Z axle in the left and right directions, follow the X axle screw thread and twist second jackscrew, can adjust the axis of microscope relative to the pitch angle of Z axle in the fore-and-aft direction.
Alternatively, the early warning device issues an alarm when the perpendicularity between the microscope and the working disk is not the preset perpendicularity.
As an alternative, the periphery of the microscope is sleeved with a mounting ring, three displacement sensors are mounted on the mounting ring in a distributed manner, and the mounting ring and the microscope are coaxially arranged.
Dicing saw including working plate and microscope, the straightness between working plate and the microscope detects based on straightness detection method as described above, the dicing saw further includes:
and the camera is connected to the microscope and is used for acquiring images of tool marks on the surface of the workpiece.
Alternatively, the workpiece comprises a substrate and a plurality of wafers connected to the substrate; the dicing saw further includes:
the bracket is connected with a mounting plate;
And one end of the rotating shaft is rotatably arranged to the mounting plate, the other end of the rotating shaft is provided with a cutter disc, and the cutter disc is used for scribing each wafer from the substrate so as to form a tool mark on the substrate.
Alternatively, a point light source is further arranged on the bracket, and is used for providing light for the microscope and the camera.
The beneficial effects of the invention are as follows:
The flatness n1 of the working disc is detected firstly, so that the problem of serious warping of the working disc is avoided, and subsequent perpendicularity detection can be performed on the basis of ensuring the flatness of the working disc; obtaining displacement values from the three-point distributed displacement sensors at the periphery of the microscope to the working disk, wherein the displacement values are x1, x2 and x3 respectively, and calculating to obtain y1=max (x 1, x2, x 3) -min (x 1, x2 and x 3) so as to obtain the specific position of a plane formed by the three-point displacement sensors relative to the surface of the working disk; then detecting the flatness n2 of the workpiece on the working disc to avoid serious warping of the workpiece, so that subsequent perpendicularity detection can be performed on the basis of ensuring the flatness of the workpiece; obtaining displacement values from three-point distributed displacement sensors at the periphery of the microscope to a workpiece to be x4, x5 and x6 respectively, and calculating to obtain y2=max (x 4, x5, x 6) -min (x 4, x5 and x 6) so as to obtain a specific position of a plane formed by the three-point displacement sensors relative to the surface of the workpiece; when n1 is less than 9um, y1 is less than (9+m) um, n2 is less than 7um and y2 is less than (7+m) um, the perpendicularity between the microscope and the working disc is preset perpendicularity, so that a tool mark image on a workpiece can be accurately detected, the quality of a sliced wafer can be determined according to the detected tool mark, and the problem of edge breakage or breakage of the wafer is avoided; above-mentioned automatic detection straightness's mode that hangs down, labour saving and time saving, detection efficiency is higher, and detection precision is higher, can guarantee the quality of cutting to the wafer.
Drawings
FIG. 1 is a schematic flow chart of a verticality detection method provided by the invention;
FIG. 2 is a schematic view of a dicing saw according to the present invention;
Fig. 3 is a schematic view of an assembly structure between a jackscrew and a fixing plate provided by the invention.
Reference numerals illustrate:
1-a working disc; 2-microscopy; 3-camera; 4-a bracket; 5-fixing the frame; 6-fixing plates; 61-a first side plate; 62-a second side panel; 71-a first jackscrew; 72-a second jackscrew; 8-fastening bolts; 9-point light sources; 10-mounting plates; 11-a rotating shaft; 12-cutterhead; 13-a lidar sensor; 14-locking nut; 15-a mounting ring; 16-displacement sensor.
Detailed Description
All of the features disclosed in this specification, or all of the steps in a method or process disclosed, may be combined in any combination, except for mutually exclusive features and/or steps.
Any feature disclosed in this specification may be replaced by alternative features serving the same or equivalent purpose, unless expressly stated otherwise. That is, each feature is one example only of a generic series of equivalent or similar features, unless expressly stated otherwise. Like reference numerals refer to like elements throughout the specification.
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings.
Example 1
In this embodiment, a verticality detecting method is provided, which is used to detect the verticality between a microscope and a working disc, and the working disc is used to place a workpiece, so as to scribe the workpiece. The dicing of the workpiece refers to dicing each wafer on the substrate to form each independent wafer, and a tool mark is formed on the substrate.
Specifically, as shown in fig. 1 to 3, the perpendicularity detection method includes the steps of: s1: detecting the flatness n1 of the working disk 1; s2: obtaining displacement values of the three-point distributed displacement sensor 16 on the periphery of the microscope 2 to the working disk 1, wherein the displacement values are x1, x2 and x3 respectively, and calculating and obtaining y1=max (x 1, x2, x 3) -min (x 1, x2 and x 3); s3: detecting the flatness n2 of the workpiece on the work disk 1; s4: obtaining displacement values from a three-point distributed displacement sensor 16 at the periphery of the microscope 2 to a workpiece, wherein the displacement values are x4, x5 and x6 respectively, and calculating and obtaining y2=max (x 4, x5, x 6) -min (x 4, x5 and x 6); when n1 is less than 9um, y1 is less than (9+m) um, n2 is less than 7um and y2 is less than (7+m) um, the perpendicularity between the microscope 2 and the working disk 1 is preset perpendicularity; where m is an error value determined from the sharpness parameter observed by microscope 2 and m is a constant associated with microscope 2.
Compared with the prior art, the perpendicularity detection method in the embodiment changes the detection mode of perpendicularity; by detecting the flatness n1 of the working disk 1 first, the problem of serious warping of the working disk 1 is avoided, so that subsequent perpendicularity detection can be performed on the basis of ensuring the flatness of the working disk 1; obtaining displacement values from the three-point distributed displacement sensor 16 on the periphery of the microscope 2 to the working disk 1, wherein the displacement values are x1, x2 and x3 respectively, and calculating y1=max (x 1, x2, x 3) -min (x 1, x2 and x 3) to obtain a specific position of a plane formed by the three-point displacement sensor 16 relative to the surface of the working disk 1; then detecting the flatness n2 of the workpiece on the working disc 1 to avoid serious warping of the workpiece, so that subsequent perpendicularity detection can be performed on the basis of ensuring the flatness of the workpiece; obtaining displacement values from the three-point distributed displacement sensor 16 to the workpiece at the periphery of the microscope 2, wherein the displacement values are x4, x5 and x6 respectively, and calculating and obtaining y2=max (x 4, x5, x 6) -min (x 4, x5 and x 6) so as to obtain a specific position of a plane formed by the three-point displacement sensor 16 relative to the surface of the workpiece; when n1 is less than 9um, y1 is less than (9+m) um, n2 is less than 7um and y2 is less than (7+m) um, the perpendicularity between the microscope 2 and the working disk 1 is a preset perpendicularity, so that a tool mark image on a workpiece can be accurately detected, the quality of a sliced wafer can be determined according to the detected tool mark, and the problem of edge breakage or breakage of the wafer is avoided; above-mentioned automatic detection straightness's mode that hangs down, labour saving and time saving, detection efficiency is higher, and detection precision is higher, can guarantee the quality of cutting to the wafer.
It should be noted that, by detecting the flatness n1 of the working disc 1 and the flatness n2 of the workpiece on the working disc 1, the working disc 1 and the workpiece with serious warpage can be directly detected, so that the influence of the unqualified working disc 1 and workpiece on the subsequent detection result of the perpendicularity is avoided, and the accuracy of the perpendicularity detection can be ensured to be high; moreover, by acquiring y2, the perpendicularity between the microscope 2 and the work piece can be reversely verified by the perpendicularity between the microscope 2 and the work disk 1, and further the accuracy of the perpendicularity detection can be ensured to be higher.
For example, if the flatness of the working plate 1 and the workpiece are not detected in advance, when the working plate 1 and the workpiece are warped, the warping effects of the working plate 1 and the workpiece may cancel each other, so that the detected verticality between the microscope 2 and the working plate 1 is still the preset verticality, resulting in detection errors, and further, the accuracy of the detection result of the verticality can be ensured on the basis of ensuring the flatness of the working plate 1 and the workpiece.
Specifically, as shown in fig. 2, the above-mentioned laser radar sensor 13 is used to detect the flatness n1 of the work table 1 and the flatness n2 of the work piece on the work table 1, respectively, and the laser radar sensor 13 has the characteristics of high detection accuracy, high anti-interference capability, light weight and small volume.
Further, when the perpendicularity between the microscope 2 and the working disk 1 is not the preset perpendicularity, the microscope 2 needs to be adjusted to adjust y1 and y2 so that both y1 and y2 meet the requirement; in addition, the detected n1, n2, y1 and y2 signals are connected to the controller, so that the controller can acquire specific numerical values of the n1, n2, y1 and y2 in real time, when the perpendicularity changes caused by external force or equipment fastening failure after long-time working, the perpendicularity between the microscope 2 and the working disc 1 in the dicing process can be monitored in real time and adjusted in time, the dicing quality of the wafer is improved conveniently and rapidly; when n1 and n2 acquired by the controller do not meet the requirements, namely n1 is more than 9um and n2 is more than 7um, the working disc 1 and the workpiece need to be replaced or adjusted; when the specific values of y1 and y2 obtained by the controller do not meet the requirements, namely y1 > (9+m) um and y2 > (7+m) um, the controller controls the early warning device to send out an alarm, so that the verticality can be adjusted in time. The early warning device in this embodiment may adopt an early warning structure common in the prior art.
Specifically, as shown in fig. 2 and 3, the microscope 2 is mounted to the bracket 4 via the fixing plate 6, and a fixing frame 5 is mounted on the outer periphery of the microscope 2, that is, the microscope 2 is connected to the fixing plate 6 via the fixing frame 5, and jackscrews are threaded through the fixing plate 6, and can abut against the fixing frame 5; when the jack screw is screwed, the yaw angle and pitch angle of the axis of the microscope 2 with respect to the Z axis can be adjusted by the abutting action of the jack screw on the fixing frame 5 and the microscope 2. Wherein, the fixed plate 6 is connected with the fixed frame 5 through a fastening bolt 8.
Specifically, as shown in fig. 2 and 3, the jackscrew includes a first jackscrew 71 and a second jackscrew 72, the first jackscrew 71 and the second jackscrew 72 are respectively mounted to two adjacent side plates on the fixed plate 6, the two side plates being a first side plate 61 and a second side plate 62, respectively; firstly unscrewing a fastening bolt 8 between the first side plate 61 and the fixed frame 5, screwing a first jackscrew 71 on the first side plate 61 along a Y-axis thread, wherein the first jackscrew 71 can be abutted against and push a part of the microscope 2 to move along the Y-axis, and at the moment, due to the limiting effect of the fastening bolt 8 on the fixed frame 5, the other part of the microscope 2 can move along the opposite direction of the Y-axis, so that the deflection angle of the axis of the microscope 2 relative to the Z-axis in the left-right direction can be adjusted; firstly unscrewing a fastening bolt 8 between the second side plate 62 and the fixed frame 5, screwing a second jackscrew 72 on the second side plate 62 along an X-axis thread, wherein the second jackscrew 72 can abut against and push a part of the microscope 2 to move along the X-axis, and at the moment, due to the limiting effect of the fastening bolt 8 on the fixed frame 5, the other part of the microscope 2 can move along the opposite direction of the X-axis, so that the pitching angle of the axis of the microscope 2 relative to the Z-axis in the front-back direction can be adjusted; until it is adjusted to y1 and y2 to meet the above requirements. In this embodiment, the first jack screw 71 and the second jack screw 72 are bolts, respectively, and the first jack screw 71 and the second jack screw 72 are two, respectively.
Further, as shown in fig. 2, a mounting ring 15 is sleeved on the periphery of the microscope 2, the mounting ring 15 is located below the fixed frame 5, three displacement sensors 16 are mounted on the mounting ring 15 in a distributed manner, and the mounting ring 15 is coaxially arranged with the microscope 2, so that the plane formed by the three displacement sensors 16 can be ensured to be concentric with the microscope 2, the working disk 1 and the workpiece respectively, and the accuracy of the measurement result of the verticality can be ensured.
The specific detection process of the verticality detection method in this embodiment is as follows, as shown in fig. 1:
Firstly, detecting the flatness n1 of the working disc 1, and when n1 is smaller than 9um, the flatness of the working disc 1 is better; when n1 is more than 9um, the flatness of the working disk 1 needs to be adjusted or the working disk 1 needs to be replaced; then, according to the displacement sensor 16 distributed at three points, y1=max (x 1, x2, x 3) -min (x 1, x2, x 3) is obtained, and when y1 < (9+m) um, the perpendicularity between the working disc 1 and the microscope 2 is good; when y1 > (9+m) um, the perpendicularity between the working disk 1 and the microscope 2 does not meet the requirement, the first jack screw 71 and/or the second jack screw 72 need to be adjusted until y1 < (9+m) um.
Then, placing the workpiece on a working disc 1, detecting the flatness n2 of the workpiece, and when n2 is less than 7um, the flatness of the workpiece is better; when n2 is more than 7um, the flatness of the workpiece needs to be adjusted; then, according to the displacement sensor 16 distributed at three points, y2=max (x 4, x5, x 6) -min (x 4, x5, x 6) is obtained, when y2 < (7+m) um, the perpendicularity between the microscope 2 and the workpiece is better, so that the perpendicularity between the working disc 1 and the microscope 2 can be reversely verified to be better; when y2 > (7+m) um, the perpendicularity between the workpiece and the microscope 2 does not meet the requirement, and the first jackscrew 71 and/or the second jackscrew 72 need to be adjusted until y2 < (7+m) um, at this time, the perpendicularity between the microscope 2 and the working disk 1 can be ensured to be better.
According to the perpendicularity detection method in the embodiment, the flatness of the working disc 1 and the workpiece is detected firstly, so that the influence of the flatness of the working disc 1 and the workpiece on the subsequent detection of perpendicularity is avoided; judging the perpendicularity between the microscope 2 and the working disc 1 according to the acquired y 1; finally, the perpendicularity between the microscope 2 and the working disc 1 is verified reversely according to the obtained y2, so that the accuracy of the perpendicularity between the microscope 2 and the working disc 1 can be ensured to be higher. The present embodiment relates to the perpendicularity between the microscope 2 and the working plate 1, and specifically refers to the perpendicularity between the lens of the microscope 2 and the working plate 1.
Example two
In this embodiment, a dicing saw is proposed, as shown in fig. 2 and 3, which includes the above-mentioned working plate 1 and the above-mentioned microscope 2, and the perpendicularity between the working plate 1 and the microscope 2 is detected based on the perpendicularity detecting method as in the embodiment, and further includes a camera 3, the camera 3 is connected to the microscope 2, and the camera 3 is used for capturing an image of a tool mark on the surface of the workpiece. The camera 3 is connected with the microscope 2 through the lock nut 14, the microscope 2 is used for providing the function of magnification for the camera 3, and the camera 3 can be ensured to acquire more accurate tool mark images of the workpieces on the working disc 1 due to the fact that the perpendicularity between the microscope 2 and the working disc 1 is good. In this embodiment, the camera 3 may be a CCD camera.
Further, as shown in fig. 2, the dicing saw further includes a rotating shaft 11 and the bracket 4, and the mounting plate 10 is fixedly connected to the bracket 4; one end of the rotating shaft 11 is rotatably arranged to the mounting plate 10, the other end of the rotating shaft 11 is provided with the cutter disc 12, and when the rotating shaft 11 is rotated, the cutter disc 12 can be driven to rotate from the substrate to scratch each wafer so as to form a cutter mark on the substrate and scratch each wafer.
Specifically, as shown in fig. 2, a point light source 9 is further disposed on the support 4, so as to provide light for the microscope 2 and the camera 3, and ensure that the camera 3 collects tool mark images of the workpiece on the working disc 1 more clearly and accurately.
The foregoing is merely exemplary of the present invention, and those skilled in the art should not be considered as limiting the invention, since modifications may be made in the specific embodiments and application scope of the invention in light of the teachings of the present invention.
Claims (10)
1. The perpendicularity detection method is used for detecting perpendicularity between a microscope (2) and a working disc (1), and is characterized by comprising the following steps of:
s1: detecting the flatness n1 of the working disk (1);
s2: obtaining displacement values from a three-point distributed displacement sensor (16) at the periphery of the microscope (2) to the working disc (1) to be x1, x2 and x3 respectively, and calculating to obtain y1=max (x 1, x2, x 3) -min (x 1, x2 and x 3);
S3: detecting the flatness n2 of the workpiece on the working disk (1);
S4: obtaining displacement values of the displacement sensor (16) distributed at three points on the periphery of the microscope (2) to the workpiece, wherein the displacement values are respectively x4, x5 and x6, and calculating to obtain y2=max (x 4, x5, x 6) -min (x 4, x5 and x 6);
Wherein when n 1< 9um, y 1< (9+m) um, n2 < 7um and y2 < (7+m) um, the perpendicularity between the microscope (2) and the working disk (1) is a preset perpendicularity; wherein m is an error value determined from a sharpness parameter observed by the microscope (2), and m is a constant associated with the microscope (2).
2. The perpendicularity detection method according to claim 1, characterized in that a laser radar sensor (13) is used to detect the flatness n1 of the work plate (1) and the flatness n2 of the work piece on the work plate (1), respectively.
3. The perpendicularity detection method according to claim 1, characterized in that when the perpendicularity between the microscope (2) and the working disk (1) is not the preset perpendicularity, the microscope (2) is adjusted to adjust y1 and y2.
4. A verticality detection method according to claim 3, wherein the microscope (2) is mounted on the support (4) through a fixing plate (6), a jackscrew is threaded on the fixing plate (6), and when the jackscrew is screwed, a deflection angle and a pitching angle of an axis of the microscope (2) relative to a Z axis can be adjusted.
5. The verticality detection method according to claim 4, wherein the jackscrews comprise a first jackscrew (71) and a second jackscrew (72), the first jackscrew (71) and the second jackscrew (72) are respectively mounted on two adjacent side plates on the fixed plate (6), the first jackscrew (71) is screwed along a Y axis, a yaw angle of an axis of the microscope (2) relative to a Z axis in a left-right direction can be adjusted, the second jackscrew (72) is screwed along an X axis, and a pitch angle of the axis of the microscope (2) relative to the Z axis in a front-rear direction can be adjusted.
6. A perpendicularity detection method according to claim 3, characterized in that the warning means issues an alarm when the perpendicularity between the microscope (2) and the working disk (1) is not the preset perpendicularity.
7. The method for detecting verticality according to any one of claims 1 to 6, wherein a mounting ring (15) is sleeved on the periphery of the microscope (2), three displacement sensors (16) are mounted on the mounting ring (15) in a distributed manner, and the mounting ring (15) and the microscope (2) are coaxially arranged.
8. Dicing saw, characterized by comprising a work plate (1) and a microscope (2), the perpendicularity between the work plate (1) and the microscope (2) being detected based on the perpendicularity detection method according to any one of claims 1-7, the dicing saw further comprising:
-a camera (3), the camera (3) being connected to the microscope (2), the camera (3) being adapted to acquire images of tool marks of the surface of the workpiece.
9. The dicing saw of claim 8, wherein the workpiece comprises a substrate and a plurality of wafers attached to the substrate; the dicing saw further includes:
the support (4) is connected with a mounting plate (10);
The rotating shaft (11), one end of the rotating shaft (11) is rotatably arranged to the mounting plate (10), a cutter disc (12) is arranged at the other end of the rotating shaft (11), and the cutter disc (12) is used for scribing each wafer from the substrate so as to form the tool marks on the substrate.
10. Dicing saw according to claim 9, characterized in that the frame (4) is further provided with a point light source (9) for providing light to the microscope (2) and the camera (3).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410597528.5A CN118362082A (en) | 2024-05-14 | 2024-05-14 | Verticality detection method and dicing saw |
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| CN202410597528.5A CN118362082A (en) | 2024-05-14 | 2024-05-14 | Verticality detection method and dicing saw |
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