CN1183588C - Ball grid array package substrate and manufacturing method thereof - Google Patents

Abstract

A ball grid array package substrate and its manufacturing method, wherein one side of the substrate has a single pattern layer for connecting the solder balls to the wire pattern, a heat dissipation layer is combined with the other side of the substrate, the heat dissipation layer provides the grounding pattern and/or power pattern of the BGA substrate for dispersing the area required by the grounding pattern and/or power pattern of the substrate pattern layer, wherein the grounding solder ball and/or power solder ball of the substrate is connected with the heat dissipation layer by the conductive glue filling the through hole. The heat dissipation layer is not only a heat dissipation layer, but also can be used as a ground pattern and a power pattern, so that the area required by the ground pattern and the power pattern required by the substrate pattern layer can be dispersed, and the flexibility and the heat dissipation of the layout design are improved.

Description

Ball grid array package substrate and manufacturing method thereof

technical field

The present invention discloses a packaging technology related to BGA (ball grid array), especially the packaging technology of a BGA substrate with a heat sink layer. ground) or power solder balls (solder ball for power), or may include power patterns and ground patterns, and use conductive vias to connect with power solder balls (Solder ball for Power) and ground solder balls (Solder ball for ground) respectively.

Background technique

With the advancement of the integrated circuit manufacturing process, it has become a trend to reduce the unit cost by reducing the overall size of the chip (die). The semiconductor industry expects some aspects of performance, such as execution speed, to be significantly improved, and a single chip can Inject more functionality. However, as the size of the chip shrinks, although the functions of the chip increase, the number of components increases instead of decreasing, resulting in denser connecting wires. Therefore, the resulting parasitic capacitance and the increase in the resistance of the interconnection lead to a decrease in chip performance.

In order to solve the above problems, the semiconductor manufacturing industry, in addition to using low-resistance copper wires to replace traditional aluminum wires to reduce wire resistance, also seeks a low-k dielectric layer to solve the problem of parasitic capacitance. Another area that has a direct and critical impact on cost and performance is packaging technology. Because it is conceivable that when the chip components are added to inject new functions, the problem of increasing the number of input and output terminals to connect with the system is bound to be increased, and at the same time, the power consumption and heat dissipation problems of the chip are also more prominent. In order to overcome the above problems, even the new generation of flip-chip packaging technology and BGA packaging technology of ball grid array need to be studied.

Figures 1-8 show the conventional BGA package substrate manufacturing process including heat dissipation layer. The steps are as follows: first please refer to FIG. 1, a substrate 5 is pressed together with a copper foil 8, and a TAB through hole 10 (sprocket hole) is formed. In the boundary of the substrate 5, the TAB through hole 10 is conducive to the substrate 5 on the conveyor belt. transmission. The substrate 5 may be one of insulating materials such as BT (bismaleimide-triazine) or glass fiber, reinforced epoxy resin, and polyamide. For T-BGA, there is only one layer of metal patterns on a typical substrate, and the copper foil 8 is used to define the wiring patterns and the connection patterns of solder balls.

Subsequently, as shown in FIG. 2 , the surface of the TAB through-hole 10 is deburred, chemically polished, and the like. Next, a photoresist (not shown in the figure) is formed on the copper foil 8, and a photolithography process is applied to define a pattern. After development, the photoresist pattern is used as an etching mask to etch the copper foil to form the electrical wiring pattern and/or the connection pattern 20 of the solder ball, and finally the photoresist is stripped.

Subsequently, as shown in FIG. 3 , a back adhesive film 25 is covered on the back of the substrate 5 to prevent solder mask from adhering. Subsequently, a solder resist 30 with insulation and preventing solder from sticking is formed on the copper foil 8 . Then, the solder resist on the connection pattern 20 of the solder balls of the copper foil 8 is removed through a photolithography process and a developing step.

Please refer to FIG. 4 , and then, an electroplating process is performed to sequentially form a nickel film layer and a gold film layer 35 on the copper foil 8 . Then remove the adhesive film 25 again.

Referring to FIG. 5 , the substrate is diced, and then an adhesive layer 42 is pasted on the back of the substrate 5 , and the material of the core area of the substrate is cut off to form a recessed area 40 for accommodating chips. If necessary, bus through holes and component through holes can also be formed, and finally, solder balls are formed on the gold film layer 35 by screen printing. The result is shown in Figure 6.

In order to form a heat dissipation layer in the traditional manufacturing process, heat sinks need to be pasted one by one. Therefore, it is not only time-consuming, but also has limited effect. Because the heat sink 55 is separated from the power supply wire or the ground wire of the front pattern layer through a layer of insulating substrate, they are not connected to each other.

As shown in Figures 6 and 7, it is the method of 3M Company. After the TAB through hole 10 is formed, 3M Company uses the method of extruding conductive glue into the TAB through hole 10 to conduct the front side of the substrate pattern and the heat dissipation layer. However, the above connection does not fully exert the heat dissipation effect of the pattern layer, after all, the electric wires connected to the voltage or the grounded electric wires are not connected to the heat dissipation layer.

Therefore, the heat dissipation layer of the BGA substrate produced by the conventional technology has poor effect and has not been further utilized. The present invention will provide a new BGA substrate structure, improve the above problems, and provide a corresponding manufacturing method.

Contents of the invention

The object of the present invention is to provide a ball grid array package substrate and a manufacturing method thereof.

Another object of the present invention is to use through holes to connect the pattern layer of the BGA substrate with the ground pattern and/or power pattern of the heat dissipation layer. Due to the conduction of the heat dissipation layer, the ground pattern and/or the power supply pattern of the BGA substrate pattern are scattered on the heat dissipation layer, thereby increasing the wire wiring area or reducing the BGA substrate area.

The technical solution of the present invention is: a ball grid array packaging substrate, which has a single pattern layer connected with solder balls on one side of the BGA substrate, and the heat dissipation layer is combined with the other side of the substrate, and is characterized in that: the heat dissipation layer not only provides In addition to the heat dissipation of the BGA substrate, the grounding and/or power pattern of the BGA substrate is also provided to disperse the area required for the grounding and/or power pattern of the BGA substrate pattern layer, wherein the grounding and/or power supply tin of the BGA substrate The balls are connected to the heat dissipation layer through holes filled with conductive glue. in:

The conductive glue includes at least one of silver glue and copper glue.

The non-adhesive film is a film that has no affinity with the conductive adhesive.

The non-adhesive film comprises at least one of polyethylene film, polypropylene film, polyester film or acrylic resin.

A method for manufacturing a ball grid array package substrate, at least including the following steps:

Provide a BGA substrate with a layer of non-adhesive film on the upper and lower sides of the substrate;

Forming several through holes and a recessed area in the substrate, the through holes are formed at the predetermined ground solder ball position of the substrate, and the recessed area is used to place a chip;

The through hole of the substrate is filled with conductive glue;

removal of non-mucosal membranes;

A heat dissipation layer and a copper foil are respectively formed on the upper and lower surfaces of the substrate;

Forming the pattern and wire pattern connected by solder balls of the BGA substrate on the copper foil;

coating black ink on the heat dissipation layer;

forming a black ink in the recessed area;

Coating a solder resist on the pattern and the wire pattern including the solder ball connection of the BGA substrate;

A photolithography process is applied to expose the copper foil pattern connected by the solder balls of the BGA substrate;

Applying an electroplating process to plate a nickel film and a gold film on the copper foil pattern;

forming solder balls on the gold film;

The chip is placed on the black ink, and the contact pad on the chip is connected with the solder ball of the BGA substrate to connect the pattern and the wire pattern with the wire. in:

The conductive glue containing at least one of silver glue and copper glue is injected into the through hole by scraping or roller printing.

The heat dissipation layer is coated with a nickel layer on the heat dissipation layer before coating the black ink.

A method for manufacturing a ball grid array package substrate, at least including the following steps:

A substrate is provided, one side of the substrate includes a layer of copper foil, and a layer of non-adhesive film is provided on the upper and lower sides;

Forming a plurality of through holes and a recessed area in the substrate, the through holes are formed at the predetermined positions of the ground solder ball and the power solder ball of the substrate, and the recessed area is used to place a chip;

Conductive glue is formed in the through holes of the substrate;

removal of non-mucosal membranes;

forming a heat dissipation layer on the other side of the substrate that does not contain copper foil;

forming a black ink in the recessed area;

Patterning the copper foil to form a signal pattern and a pattern connecting the power solder ball and the ground solder ball therein;

patterning the heat dissipation layer to form a ground pattern and a power pattern therein;

forming black ink on the heat dissipation layer;

forming a solder resist on one side of the substrate containing signal patterns;

Apply a photolithography process to expose a part of the copper foil pattern, which is used to connect the power solder ball and the ground solder ball;

Applying an electroplating process to sequentially plate a nickel film and a gold film on the exposed copper foil pattern;

Solder balls are formed on the gold film, so that the ground solder balls and power solder balls of the substrate can be connected to the ground pattern and power pattern of the heat dissipation layer through the conductive glue in the through hole of the substrate;

The chip is placed on the black ink, and the contact pad on the chip is connected with the solder ball of the BGA substrate to connect the pattern and the wire pattern with the wire. in:

The patterning of the copper foil and the patterning of the heat dissipation layer are carried out by photolithography and etching processes.

The conductive glue containing at least one of silver glue and copper glue is injected into the through hole by scraping or roller printing one of the conductive glue.

Beneficial effects of the present invention:

1. Connect the conductive solder balls and electric wires on the substrate to the ground/or to the power supply with the heat sink through several through holes, so it is beneficial to the heat dissipation of the substrate.

2. The above-mentioned through holes connecting the front and back of the substrate are made by extruding conductive glue, which is more convenient and cheaper than the general through holes using electroplating. Among them, in order to prevent the parts that do not need to be connected from sticking to the conductive adhesive, a non-adhesive film layer is used. So don't worry, the front side of the copper foil is glued with conductive glue.

3. Because the present invention forms the required pattern on the substrate and the heat dissipation layer (including the pattern) in one go by thermocompression bonding. There is no need to attach the heat sink piece by piece to the substrate. Therefore, manpower and materials can be saved.

4. The heat dissipation layer of the present invention is not only a heat dissipation layer, but also can be used as a grounding pattern and a power supply pattern. Therefore, the area required for the grounding and power supply patterns required by the BGA substrate pattern layer can be dispersed. Can increase the flexibility of layout design.

Description of drawings

Figure 1-6 is a flow chart of the manufacturing process of a traditional BGA substrate, and there is no connection between the heat dissipation layer and the BGA pattern layer.

7 and 8 are flow charts of the manufacturing process of a BGA substrate produced by another conventional technology. The BGA pattern layer of the substrate is only connected to the heat dissipation layer by TAB through holes.

9-20 are the flow charts of the manufacturing process of the method according to the first embodiment of the present invention. In the BGA pattern layer, the heat dissipation layer is connected to the ground solder ball of the BGA pattern layer by several conductive through-holes.

FIG. 21 is a structural diagram of a BGA substrate manufactured by the method of the first and second embodiments of the present invention.

22-25 are process flow charts for manufacturing BGA substrates by the method of the second embodiment of the present invention, and only the parts different from the process flow of the first embodiment are shown in the figures.

26-35 are the process flow diagrams for manufacturing BGA substrates according to the third embodiment of the present invention. In the BGA pattern layer, the ground solder balls and power solder balls are respectively connected to the ground pattern and power pattern of the heat dissipation layer through through holes.

Fig. 36 is a structure diagram of a BGA substrate manufactured by the method of the third embodiment of the present invention.

Detailed ways

In view of the background of the invention, in the prior art, the heat dissipation layer pasted on the substrate is opposed to the pattern layer through the substrate, so the achievable heat dissipation effect must be limited. Even if the traditional BGA substrate is connected, for example, 3M's patent, a substrate only utilizes about 8 through holes (sprocket holes) reserved on the conveyor belt, and the heat dissipation effect that can be increased is limited. In view of this,

The invention provides an improved ball grid array packaging substrate and a manufacturing method thereof, which can solve the above problems.

Referring to Figures 9-20, the process flow for manufacturing a BGA substrate according to the first embodiment of the present invention is as follows:

First, referring to FIG. 9 , a layer of release film (release film) 210a, 210b is pasted on both sides of the substrate 205 respectively. The non-adhesive film is selected from a film that has no affinity with the conductive adhesive, such as polyethylene film (polyethylene film), polypropylene film (polyacryline film), polyester film (PET) or acrylic (acrylic) resin, any one of which is acceptable. Subsequently, CO 2 laser drilling is used to form through holes 215 , and the substrate is cut to form recessed regions 220 in the substrate 205 . Please note that the position of the through hole 215 is set at the predetermined position of the solder ball for ground. Next, as shown in FIG. 10 , the conductive glue 225 is extruded into the through hole 215 by roller printing or scraper. Since the substrate 205 has non-adhesive films 210a, 210b, only the through hole 215 adheres the conductive adhesive 225, and after forming a rivet shape as shown in FIG. Immediately afterwards, the non-adhesive film 210a is removed, and the non-adhesive film 210b is kept, and the result is shown in FIG. 11 . Referring to FIGS. 12 and 13 , a thicker copper foil is formed on the substrate 205 as the heat dissipation layer 230 by means of thermocompression. Then, a black ink 235 is formed on the surface of the recessed area 220, and the black ink 235 has a function of increasing the fixation of the chip to the recessed area.

Please refer to FIG. 14 , next, the non-adhesive film layer 210b is removed. The second copper foil 206 is bonded to the side of the substrate 205 without the heat dissipation layer, as a conductive pattern layer of the BGA substrate. Subsequently, as shown in FIG. 15 , a negative photoresist 245 is formed, and the masks 250 a and 250 b are used as a photolithography mask, and then an exposure process is performed to define a pattern. The photoresist patterns 245c, 245a, and 245b shown in FIG. 16 are then formed through a developing process. Please note that since the heat dissipation layer 230 is a light-transmitting mask 250a, the photoresist pattern 245c will not be developed and removed after the photoresist is illuminated. In addition to the photoresist pattern 245a connected by solder balls, the second copper foil 206 also has a photoresist pattern 245b of conductive traces as an etching mask.

Referring to FIG. 17 , using the photoresist patterns 245c, 245a, and 245b as masks, the second copper foil 206 is etched with an acid solution or plasma to form a pattern layer 206a. Finally, the photoresist patterns 245c, 245a, and 245b are removed.

Next, as shown in FIG. 18 , black ink 252 is coated on the heat dissipation layer 230 as an insulating layer. Please note that before coating the black ink on the heat dissipation layer, a nickel layer can be optionally plated on the heat dissipation layer 230 . Then apply a solder resist 255 (solder mask) on the pattern layer 206a.

Referring to FIG. 19 , the exposure and development processes are performed with the mask pattern 260 to expose the copper foil to be connected by the solder balls. Finally, nickel and gold films 270 are sequentially plated on the bare copper foil by electroplating process, and the result is shown in FIG. 20 . Finally, solder balls are seeded on the gold-plated film layer 270 by screen printing. The chip 275 is disposed in the recessed area 220 , and the contact pads on the chip 275 are connected to the pattern layer 206 a by wire pins 280 . Finally, the chip 275 and the wires are covered with resin 285 to obtain the structure shown in FIG. 21 .

In the above-mentioned process procedure, some steps can be changed in sequence without affecting the final result.

Please refer to FIG. 22, the method of the second embodiment of the invention, after injecting the conductive glue 225 into the through hole 215, and removing the conductive glue above the surface of the substrate 205 with a scraper and removing the non-adhesive films 210a, 210b (see FIG. 10 ) That is, the copper foil 206 and the heat dissipation layer 230 are pressure-bonded on both sides of the substrate 205 at the same time.

Next, as shown in FIG. 23 , photoresist patterns 245 a , 245 b and 245 c are formed by using photolithography technology.

Subsequently, as shown in FIG. 24 , etching is performed again, and the pattern layer 206 a is formed by using the photoresist patterns 245 a , 245 b and 245 c as a mask to form a pattern layer for connecting solder balls and a wire pattern layer.

Next, as shown in FIG. 25 , black ink 252 is coated on the heat dissipation layer 230 as an insulating layer. A protective film 232 is pasted on the pattern layer 206a. Subsequently, black ink 235 is formed in the recessed area 220 .

Subsequently, the protective film 232 is torn off. The solder resist 255 is coated and the photolithography process is performed as described in the first embodiment to expose the copper foil connected to the solder, and then nickel and gold are plated to connect the solder balls. The result is shown in FIG. 21 .

Since the heat dissipation layer and the pattern layer of the substrate can be connected by conductive through holes, several power supply patterns and ground patterns of the pattern layer on the BGA substrate can be distributed to the heat dissipation layer of the substrate. Therefore, the method of the third embodiment of the present invention is described in detail as follows:

First, referring to FIG. 26 , a layer of release film (release film) 210a, 210b is pasted on both sides of the substrate 205 including a layer of copper foil 206 (the front surface of the substrate). The non-adhesive film is a film that has no affinity with the conductive adhesive. For example, any one of polyethylene film, polyacryline film, polyester film (PET) or acrylic resin may be used. Subsequently, CO ₂ laser drilling is used to form through-holes 215 , and the substrate is cut to form recessed regions 220 in the substrate 205 , as shown in FIG. 27 . Please note that the through holes 215 are located at the predetermined ball-grid for ground and ball-grid for power positions. Next, as shown in FIG. 28 , the conductive glue 225 is extruded into the through hole 215 by roller printing or scraper. Since the upper and lower surfaces of the substrate 205 contain non-adhesive film layers 210a and 210b respectively, only the through hole 215 is adhered with the conductive adhesive 225 , forming a rivet shape as shown in FIG. 28 .

Subsequently, the conductive glue higher than the surface of the substrate 205 is removed with a scraper. Immediately afterwards, the non-adhesive film layers 210b, 210a are removed, and the result is shown in FIG. 29 .

Referring to FIG. 30 , another thicker copper foil is formed on the substrate as a heat dissipation layer 230 by means of thermocompression. Next, a protective film 232 is pasted on the copper foil 206 and the heat dissipation layer 230 of the substrate 205 . Subsequently, black ink 235 is coated on the surface of the recessed area 220 , and the black ink 235 has the function of adhering the chip and fixing it on the recessed area 220 .

Please refer to FIG. 31, and then, after removing the protective film 232, apply a negative photoresist 245 on the heat dissipation layer 230 and the copper foil 206 respectively, and then use the masks 250a and 250b as photolithography masks, and then expose process to define the pattern. Note that the pattern of the mask 250a includes a power pattern/ground pattern. The patterns of the mask 250b include signal patterns and power/ground patterns.

As shown in FIG. 32 , the photoresist patterns 245 a and 245 b are formed through the developing process. The photoresist pattern 245a on the heat dissipation layer 230 is a power pattern and a ground pattern. The photoresist pattern 245b on the copper foil 206 is a conductive pattern for signal connection, and a power pattern and a ground pattern for connecting solder balls. Then, the photoresist patterns 245a, 245b are used as masks, and an etching process is performed to form the pattern layers 230a and 206a. In other words, by using the method of the present invention, the required power supply pattern and ground pattern in the BGA pattern layer can be moved to the heat dissipation layer 230 , and the heat dissipation layer 230 can bear it. The copper foil 206 only needs to arrange signal patterns and necessary patterns for connecting solder balls. Therefore, since the signal wires are on one side of the substrate, and the conductive patterns such as grounding and power supply are on the other side of the substrate, not only can the area required by the entire BGA be reduced, but also noise can be reduced.

As shown in FIG. 33 , the remaining photoresist pattern is stripped off, and then black ink 252 is coated on the heat dissipation pattern layer 230 a as an insulating layer. Please note that before coating the black ink on the heat dissipation layer, a nickel layer can be selectively plated on the heat dissipation layer 230a. Next, apply a solder resist 255 (solder mask) on the pattern layer 206a.

Referring to FIG. 34 , using the mask patterns 260a and 260b as masks, the exposure and development processes are performed to expose the copper foils to be connected by the solder balls. The exposed copper foil 206a is used to connect with power and ground solder balls. Then, the solder resist and black ink are used as a mask, and an electroplating process is applied to plate nickel and gold film layers 270 sequentially. The result is shown in FIG. 35 .

Referring to FIG. 36 , solder balls are formed on the gold-plated film layer by screen printing. The chip 275 is disposed in the recessed area 220 , and the contact pads on the chip are connected to the pattern layer 206 a by wires 280 . Finally, the chip 275 and the wires are covered with resin 285 . The structure shown in Figure 36 is obtained.

To sum up, the BGA substrate has a single pattern layer for connecting solder balls to the wire pattern. A heat dissipation layer is combined on the other side of the substrate, and the heat dissipation layer is also a ground layer to disperse the area required for the ground conductive pattern of the BGA substrate, wherein the ground solder balls of the BGA substrate are sealed by through holes filled with conductive glue Connect the heat sink. Alternatively, the heat dissipation layer may also be a power supply pattern layer, which is used to disperse the required area of the power supply pattern of the BGA substrate.

Furthermore, the heat dissipation layer can also provide the grounding and power patterns of the BGA substrate at the same time, so as to disperse the area required for the grounding and power patterns of the BGA substrate pattern layer, wherein the grounding solder balls and power soldering balls of the BGA substrate are filled with The through-holes of the conductive glue are used to connect the grounding and power patterns of the heat dissipation layer respectively.

The method for manufacturing the ball grid array package substrate of the present invention is to first cover the upper and lower sides of the substrate with a layer of non-adhesive film, then drill and cut the substrate to form several through holes and depressions, and then fill the through holes Conductive plastic.

In the first embodiment of the present invention, the non-adhesive film on one side of the substrate is first removed to attach the heat dissipation layer to the surface, and the remaining non-adhesive film is used to cover the surface of the substrate, and then black ink is formed on the recessed area, and the other side is to be removed. After the non-adhesive film is formed, a copper foil is formed on the surface of the substrate. The BGA pattern is formed on the surface of the copper foil by photolithography and etching technology, including the pattern of the wire and the connection pattern of the solder ball. Afterwards, black ink is applied to the surface of the heat dissipation layer for insulation, and the BGA pattern surface is covered with solder resist on the wire pattern. Finally, nickel and gold film electroplating and screen printing are performed to connect solder balls, and the chip is placed in the recessed area to make the final chip, and then the pin is connected to the BGA pattern, and then resin is injected to seal the chip and the pin.

In the second embodiment of the present invention, after the conductive glue of the first embodiment is injected into the through holes, the non-adhesive films on the upper and lower sides of the substrate are removed simultaneously, and then the copper foil and the heat dissipation layer are attached to the substrate at the same time. The copper foil is then formed into a BGA pattern by photolithography and etching techniques, and then a protective film is pasted on the surface of the BGA pattern, and then black ink is formed on the recessed area to remove the protective film. Subsequent steps are as described in the first embodiment.

And the method steps of manufacturing a ball grid array package substrate with a heat dissipation layer providing grounding and power supply patterns at the same time, that is, the third embodiment of the present invention, is to cover the upper and lower sides of the substrate including a copper foil surface with a layer After that, the substrate is drilled to form a plurality of through holes and the substrate is cut to form recessed areas. Then fill the conductive glue into the through hole, and use the non-stick film to prevent the conductive glue from adhering to the substrate. After removing the non-adhesive film, paste the heat dissipation layer on the back of the substrate. Then form a protective film on the front and back surfaces of the substrate, and then form black ink on the recessed area. Next, after removing the rest of the protective film, use photolithography and etching techniques to form BGA patterns on the copper foil surface, including wire patterns, and patterns connected to solder balls. And a ground pattern and a conductive pattern are formed on the heat dissipation layer. Then apply black ink on the surface of the heat dissipation layer for insulation, and the BGA pattern surface covers the wire pattern with solder resist. Finally, nickel and gold film electroplating and screen printing are performed to connect solder balls, the chip is placed in the recessed area as the final chip, the pin is connected to the BGA pattern, and resin is injected to seal the chip and the pin.

Claims (10)

1. ball grid array package substrate have the single pattern layer that connects solder ball in the one side of BGA substrate, and heat dissipating layer is incorporated into the another side of this substrate, it is characterized in that:

This heat dissipating layer is except that providing the heat radiation of BGA substrate, the ground connection and/or the power supply pattern of this BGA substrate also are provided simultaneously, in order to ground connection and/or the required area of power supply pattern that disperses this BGA substrate pattern layer, wherein the ground connection of this BGA substrate and/or power supply tin ball are to utilize the through hole that fills up conducting resinl to be connected with this heat dissipating layer.

2. ball grid array package substrate according to claim 1 is characterized in that: described conducting resinl comprise at least elargol, copper glue one of them.

3. ball grid array package substrate according to claim 1 is characterized in that: described not mucous membrane is not have a film of compatibility with conducting resinl.

4. ball grid array package substrate according to claim 1 is characterized in that: it is one kind of that described not mucous membrane comprises polyethylene film, polypropylene screen, polyester film or acrylic resin at least.

5. the manufacture method of a ball grid array package substrate comprises following steps at least:

One BGA substrate is provided, and this substrate upper and lower faces respectively has not mucous membrane of one deck;

Form several through holes and a depressed area in this substrate, this through hole is formed at the predetermined ground connection solder ball position of this substrate, and the depressed area is used for putting a chip;

Fill with conducting resinl in the through hole of this substrate;

Remove not mucous membrane;

Form a heat dissipating layer and a Copper Foil respectively at this substrate upper and lower faces;

On this Copper Foil, form pattern and the wire pattern that this BGA substrate solder ball connects;

Painting black printing ink on this heat dissipating layer;

In this depressed area, form a black ink;

On pattern that comprises this BGA substrate solder ball connection and wire pattern, be coated with solder resist;

Impose lithographic process, in order to the copper foil pattern of exposed this BGA substrate solder ball connection;

Impose electroplating process, in order to plated nickel film on this copper foil pattern and golden film;

On this gold film, form solder ball;

This chip is placed on the black ink, and the contact mat on this chip is connected with wire pattern with the pattern that this BGA substrate solder ball is connected with lead.

6. the manufacture method of ball grid array package substrate according to claim 5 is characterized in that: described one of them the conducting resinl of elargol, copper glue that comprises at least is with scraper or roll printing is one kind of flows in the through hole.

7. the manufacture method of ball grid array package substrate according to claim 5, described heat dissipating layer are before painting black printing ink, can plate nickel dam at heat dissipating layer earlier.

8. the manufacture method of a ball grid array package substrate comprises following steps at least:

One substrate is provided, and the one side of this substrate includes one deck Copper Foil, and upper and lower faces respectively has not mucous membrane of one deck;

Form several through holes and a depressed area in this substrate, this through hole is formed at this substrate predetermined ground connection solder ball and power supply solder ball position, and this depressed area is used for putting a chip;

Form conducting resinl in the through hole of this substrate;

Remove not mucous membrane;

The another side that does not contain Copper Foil at this substrate forms a heat dissipating layer;

Form a black ink in this depressed area;

To this copper foil patternization, with the pattern that forms signal pattern and connect power supply tin ball and ground connection tin ball in wherein;

To this heat dissipating layer patterning, to form grounding pattern and power supply pattern in wherein;

On this heat dissipating layer, form black ink;

Comprise at this substrate on the one side of signal pattern and form solder resist;

Impose lithographic process, with the copper foil pattern of exposed part, the copper foil pattern of this part is in order to connect power supply tin ball and ground connection tin ball;

Impose electroplating process, in order to plated nickel film and golden film in regular turn on this exposed copper foil pattern;

On this gold film, form the tin ball, make the ground connection tin ball of this substrate and power supply tin ball be connected to the grounding pattern and the power supply pattern of this heat dissipating layer respectively by the conducting resinl of this substrate through hole;

This chip is placed on the black ink, and the contact mat on this chip is connected with wire pattern with the pattern that this BGA substrate solder ball is connected with lead.

9. the manufacture method of ball grid array package substrate according to claim 8 is characterized in that: described to this copper foil patternization and this heat dissipating layer patterning, and utilize photoetching and etch process to carry out.

10. the manufacture method of ball grid array package substrate according to claim 8, described one of them the conducting resinl of elargol, copper glue that comprises at least is to inject this through hole with scraper or roll printing a kind of conducting resinl wherein.

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