CN118349085A - Electronic equipment - Google Patents

Abstract

The embodiment of the present application provides an electronic device, including a device body and a fan. The device body includes a main body component and a bottom shell connected to each other, the device body forms a heat dissipation space, and the bottom shell is provided with at least one air inlet hole connected to the heat dissipation space; the fan includes a cover plate and an impeller, the cover plate is connected to the device body, the cover plate and the bottom shell are jointly arranged to form an air guide channel, the air inlet hole forms an air inlet of the air guide channel, the air outlet of the air guide channel faces the heat dissipation space, and the impeller is rotatably connected to the cover plate and is located in the air guide channel. The fan in the electronic device replaces the bottom plate with the bottom shell to form an air guide channel together with the cover plate. At this time, the fan does not need to be provided with a bottom plate, and the cover plate does not need to be provided with a connecting structure such as a buckle protrusion, and there is no need to set a vibration gap between the fan and the bottom shell. In this way, the thickness of the electronic device is at least reduced by the thickness of the bottom plate and the thickness of the vibration gap, thereby achieving the thinning of the electronic device.

Description

Electronic equipment

Technical Field

The present application relates to the field of electronic equipment, and in particular to an electronic equipment.

Background technique

With the rapid increase in chip processing speed in electronic devices such as laptops, the heat dissipation structure has become a design focus in electronic devices. The electronic device includes a device body and a fan. The device body includes a connected main body component and a bottom shell. The main body component and the bottom shell are jointly enclosed to form a heat dissipation space. The bottom shell is provided with an air inlet hole connected to the heat dissipation space. The fan is connected to the main body component and can generate an air flow from the air inlet hole to the heat dissipation space. The current fan generally includes a cover plate, a bottom plate and an impeller. The cover plate is connected to the bottom plate and is jointly enclosed to form an air guide channel. The air guide channel has an air inlet and an air outlet. The impeller is rotatably connected to the cover plate and is arranged in the air guide channel. Among them, the fan is connected to the bracket, and the bottom plate is spaced from the bottom shell. Its air inlet faces the air inlet hole on the bottom shell, and the air outlet faces the heat dissipation space. The thickness of the current device body is limited by the thickness of the fan and the thickness of the gap between the fan and the bottom shell, which is difficult to meet the current users' growing demand for thin and light electronic devices.

Summary of the invention

The present application provides an electronic device, which solves the problem that the thickness of current electronic devices meets the current users' increasing demand for lighter and thinner electronic devices.

In order to achieve the above purpose, this application adopts the following technical solutions:

The embodiment of the present application provides an electronic device, including a device body and a fan. The device body includes a main body component and a bottom shell connected to each other, the device body forms a heat dissipation space, and the bottom shell is provided with at least one air inlet hole connected to the heat dissipation space; the fan includes a cover plate and an impeller, the cover plate is connected to the device body, the cover plate and the bottom shell are jointly arranged to form an air guide channel, the air inlet hole forms an air inlet of the air guide channel, the air outlet of the air guide channel faces the heat dissipation space, and the impeller is rotatably connected to the cover plate and is located in the air guide channel.

The fan in the electronic device uses the bottom shell to replace the bottom plate to form an air guide channel together with the cover plate. In this case, the fan does not need to be provided with a bottom plate, and there is no need to set a connection structure such as a buckle protrusion on the cover plate, and there is no need to set a vibration gap between the fan and the bottom shell. In this way, compared with the current electronic equipment, the thickness of the electronic device provided by the embodiment of the present application is at least reduced by the thickness of the bottom plate and the thickness of the vibration gap, thereby achieving the thinning of the electronic device. At the same time, the setting of the fan shortens the distance between the impeller and the cold air outside the bottom shell, improves the air suction efficiency, and prevents the hot air in the heat dissipation space from being circulated through the vibration gap and sucked into the air guide channel, affecting the heat dissipation effect.

As an embodiment, the main component includes an upper shell, a bracket and a main board. The upper shell is connected to the bottom shell and together they form a accommodating cavity. The bracket and the main board are both located in the accommodating cavity. The bracket is connected to the upper shell. The heat dissipation space is formed between the bracket and the bottom shell. The main board is connected to the side of the bracket facing away from the upper shell, and the air outlet faces the main board to avoid heat in the heat dissipation space from accumulating at the main board.

As an embodiment, the cover plate includes an upper cover portion and a side portion connected to the upper cover portion, the side portion is extended along the edge of the upper cover portion, a notch is formed between two extended ends of the side portion, the notch faces the heat dissipation space, and the impeller is rotatably connected to the upper cover portion. The impeller forms negative pressure by rotating to suck external air into the air guide channel through the air inlet hole, and the side portion can guide the airflow sucked into the air guide channel by the impeller to flow to the air outlet.

As an embodiment, the cover plate further comprises ears connected to the side edge, and the ears are fixedly connected to the device body. The ear arrangement realizes the connection between the fan and the device body, and does not occupy space in the thickness direction of the fan.

As an implementation mode, the ear portion is provided in plurality, and the plurality of ear portions are arranged around the upper cover portion to improve the stability of the connection between the cover plate and the device body.

As an implementation mode, the cover plate is connected to the bottom shell to improve the tightness of the connection between the fan and the bottom shell and the sealing of the air guide channel. During installation, the fan can be installed on the bottom shell first, and then the bottom shell is connected to the main body component.

As an embodiment, a connecting column is protruded from one side of the bottom shell facing the bracket, and the cover plate is connected to the connecting column. The provision of the connecting column can avoid providing a connecting structure on the bottom shell and reducing the structural strength of the bottom shell.

As an implementation manner, the cover plate and the bottom shell are clearance-matched to facilitate rapid installation of the fan and the bottom shell.

As an embodiment, the electronic device further comprises an elastic buffer, and the cover plate and the bottom shell jointly clamp the buffer. The buffer can absorb the vibration of the fan, thereby reducing the vibration of the bottom shell.

As an embodiment, the buffer member is extended along the edge of the cover plate and is sealed between the cover plate and the bottom shell. In this way, the air guide channel is sealed by the buffer member to prevent air leakage in the air guide channel due to the installation gap between the cover plate and the bottom shell.

As an embodiment, the bottom shell has an air inlet area, a plurality of air inlet holes are provided, the plurality of air inlet holes are all located in the air inlet area, the air inlet area is directly opposite to the impeller, and the cover plate is arranged on the air inlet area. In this way, the electronic device replaces the air inlet on the current fan bottom plate with a plurality of air inlet holes, thereby increasing the flow rate of the airflow and thus improving the heat dissipation efficiency.

As an embodiment, the electronic device further includes a display body, the display body includes a display end housing rotatably connected to the device body and a display screen connected to the display end housing, and the display screen is used to display images. The main body component also includes a keyboard connected to the bracket, the upper shell is provided with a positioning hole, the keys of the keyboard are inserted into the positioning hole, and the user can input instructions by operating the keyboard.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a three-dimensional structural diagram of an electronic device provided in an embodiment of the present application at a viewing angle;

FIG2 is a three-dimensional structural diagram of an electronic device provided in an embodiment of the present application at another viewing angle;

Fig. 3 is a cross-sectional view of the A-A position in Fig. 1;

FIG4 is an exploded view of the electronic device in FIG1 ;

FIG5 is a partial structural diagram of an electronic device provided with a current fan, wherein the bottom case is not shown;

Fig. 6 is a partial cross-sectional view of the electronic device in Fig. 5 at position B-B;

FIG7 is an exploded view of an electronic device provided in an embodiment of the present application;

Fig. 8 is a partial cross-sectional view of the C-C portion in Fig. 1;

FIG9 is an assembly diagram of a bottom housing, a fan, and a buffer member of an electronic device provided in an embodiment of the present application;

FIG. 10 is a three-dimensional structural diagram of a fan of an electronic device provided in an embodiment of the present application.

Description of reference numerals:

10. Equipment body; 11. Main body component; 111. Upper shell; 1110. Positioning hole; 112. Bracket; 1121. Avoidance hole; 113. Main board; 114. Keyboard; 1141. Keyboard; 12. Bottom shell; 121. Connecting column; 122. Boss; 120. Air inlet area; 1201. Air inlet hole; 101. Heat dissipation space; 20. Fan; 21. Cover plate; 211. Upper cover; 2111. Positioning column; 212. Side; 2121. Spiral section; 2122. Opening section; 213. Ear; 2131. Connecting hole; 22. Impeller; 221. Rotating shaft; 222. Blade assembly; 2221. Rotating blade; 223. Stop plate; 201. Air guide channel; 202. Air outlet; 30. Display body; 40. Buffer;

20’, fan; 21’, cover plate; 211’, upper cover; 212’, side; 213’, ear; 214’, snap-on protrusion; 2131’, connecting hole; 22’, bottom plate; 2201’, snap-on hole; 23’, impeller; 201’, air guide channel; 202’, air inlet; 203’, air outlet; 1122’, connecting column; 102’, vibration gap.

Detailed ways

The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

In order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish the same items or similar items with substantially the same functions and effects. For example, the first limiting portion and the second limiting portion are only used to distinguish different limiting portions, and do not limit their order. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like do not necessarily limit them to be different.

It should be noted that, in this application, the words "in one embodiment" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described in this application as "in one embodiment" or "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the words "in one embodiment" or "for example" is intended to present the relevant concepts in a specific way.

In this application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

With the rapid increase in chip processing speed in electronic devices, heat dissipation structures such as fans have become a design focus in electronic devices.

An embodiment of the present application provides an electronic device, which may be a tablet computer, tablet computer accessories, a television, a wearable device, a vehicle-mounted device, an augmented reality (AR)/virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA) and other mobile terminals, or may also be a digital camera, a SLR camera/micro-single camera, a sports camera, a gimbal camera, a drone and other professional shooting equipment. The embodiment of the present application does not impose any special restrictions on the specific form of the electronic device, as long as the electronic device uses a fan as a heat dissipation structure.

Please refer to FIG. 1 and FIG. 2 , the electronic device provided in the embodiment of the present application includes a device body 10 .

The device body 10 includes a main body component 11 and a bottom shell 12 connected to each other. The bottom shell 12 can be detachably connected to the main body component 11 after the main body component 11 is assembled. Referring to FIG. 3 , the main body component 11 can generate heat, and the device body 10 forms a heat dissipation space 101. The main body component 11 can dissipate heat into the heat dissipation space 101. The heat dissipation space 101 can be formed by the main body component 11, or can be formed by the main body component 11 and the bottom shell 12. The bottom shell 12 is provided with at least one air inlet 1201, and the air inlet 1201 is connected to the heat dissipation space 101.

Optionally, an air inlet area 120 is provided on the bottom shell 12, and a plurality of air inlet holes 1201 are provided and all are located in the air inlet area 120. The arrangement of the plurality of air inlet holes 1201 can prevent external impurities from entering the heat dissipation space 101 while providing ventilation.

In some embodiments, please refer to FIG. 3 and FIG. 4 , the main body component 11 includes an upper shell 111, a bracket 112 and a control component. The bottom shell 12 is connected to the upper shell 111 and is jointly arranged to form a receiving cavity. The upper shell 111 and the bottom shell 12 provide protection for some parts of the electronic device. Among them, the bottom shell 12 can be detachably connected to the upper shell 111, and the detachable connection method includes but is not limited to snap connection, screw connection, etc. The thickness direction of the device body 10 is the direction from the upper shell 111 to the bottom shell 12. The bracket 112 and the control component are both located in the receiving cavity, the bracket 112 is connected to the upper shell 111, the bracket 112 can provide a mounting base for various internal parts of the electronic device, the control component is connected to the bracket 112, and the bracket 112 can also be connected to a functional structural member electrically connected to the control component, and the control component can control the functional structural member to realize its function. The control component may include one or more of the heating devices such as the main board 113, the battery module, the wireless communication module, the camera module, the audio playback module, the chip, and the electronic component, and the main body component 11 dissipates heat through the control component. The layout and installation method of these control components are not specifically limited in this application. Those skilled in the art should understand that the electronic device may include one or more of the control components listed above, and of course may also include components not limited to those listed above in this article, and may also include other components. The materials of the upper shell 111, the bottom shell 12 and the bracket 112 are not limited here. In specific practice, those skilled in the art can choose according to actual needs; for example, it can be metal, plastic, ceramic or glass.

Taking the electronic device as a laptop computer as an example, the upper shell 111 can be equivalent to the C shell of the laptop computer, and the bottom shell 12 can be equivalent to the D shell of the laptop computer. The motherboard 113 is a typical heat-generating electronic device. In the following embodiments, the control component is described as the motherboard 113. The main body component 11 also includes a keyboard 114, which is the above-mentioned functional structural component. The keyboard 114 is connected to the bracket 112 and is electrically connected to the control component. The upper shell 111 avoids the keys 1141 of the keyboard 114. Specifically, a positioning hole 1110 is opened on the main body component 11, and the keys 1141 of the keyboard 114 are inserted into the positioning hole 1110 for user operation. The user can input instructions through the keyboard 114 to enable the motherboard 113 to execute the corresponding program.

The electronic device further includes a display body 30, which includes a display end housing and a display screen. The display end housing is rotatably connected to the device body 10, specifically, the display end housing is rotatably connected to the upper shell 111, and the display screen is connected to the display end housing and electrically connected to the main board 113. The display screen is used to display images. The display body 30 has a covering position covering the device body 10, and the display body 30 can reach the covering position or leave the covering position by rotating relative to the device body 10. When the display body 30 is in the covering position, the display screen faces the keyboard 114 to protect the display screen and the keyboard 114.

In this embodiment, referring to FIG. 3 and FIG. 4 , the electronic device further includes a fan 20 , which is connected to the main component 11 and disposed in the heat dissipation space 101 . When in operation, the fan 20 can generate an airflow from the air inlet 1201 to the heat dissipation space 101 , and the airflow can take away the heat in the heat dissipation space 101 .

Correspondingly, the device body 10 may also have at least one air outlet connected to the heat dissipation space 101. When the fan 20 is in operation, air can enter the air inlet 1201 from the outside, flow through the heat dissipation space 101, and then be discharged from the air outlet. In this way, the hot air in the heat dissipation space 101 can be brought out of the device body 10, thereby achieving heat dissipation of the device body 10.

Optionally, the motherboard 113 is connected to the side of the bracket 112 facing away from the upper shell 111, and a heat dissipation space 101 is formed between the bracket 112 and the bottom plate. The motherboard 113 is at least partially exposed to the heat dissipation space 101, and the heat of the motherboard 113 can be dissipated to the heat dissipation space 101. In order to avoid heat accumulation when the motherboard 113 is working, the fan 20 can guide the airflow to blow toward the motherboard 113 to dissipate heat from the motherboard 113.

Please refer to Figures 5 and 6. The current fan 20' generally includes a cover plate 21', a bottom plate 22' and an impeller 23'. The cover plate 21' is connected to the bottom plate 22' and together surrounds a wind guide channel 201'. The wind guide channel 201' has an air inlet 202' and an air outlet 203'. The impeller 23' is rotatably connected to the cover plate 21' and is disposed in the wind guide channel. The impeller 23' rotates relative to the cover plate 21' during operation. The wind guide channel 201' is used to guide the flow direction of the airflow so that the airflow blows from the air inlet 202' to the air outlet 203'. The thickness direction of the fan 20' is the extension direction of the rotation axis of the impeller 23'. To achieve the thinning of the fan 20', the air inlet 202' is opened on the bottom plate 22', and the cover plate 21' and the bottom plate 22' are jointly surrounded to form the air outlet 203'. The opening direction of the air inlet 202' is the same as the extension direction of the rotation axis of the impeller 23', and the opening direction of the air outlet 203' is perpendicular to the opening direction of the air inlet 202'. The air inlet 202' faces the air inlet 1201, and the air outlet 203' faces the main board 113.

Specifically, the cover plate 21' includes an upper cover portion 211', a side portion 212' and an ear portion 213', the side portion 212' is connected to the upper cover portion 211', the side portion 212' is extended along the edge of the upper cover portion 211', and is bent toward one side of the upper cover portion 211', a notch is formed between the two extended ends of the side portion 212', and the notch faces the heat dissipation space 101, the ear portion 213' is connected to the outer side of the side portion 212', and the cover plate 21' is connected to the protruding portion 213' on the bracket. The connecting column 1122' is connected, wherein the side portion 212' is provided with a connecting structure for connecting with the bottom plate 22', and the connecting structure can be a buckle protrusion 214' protruding from the edge of the side portion 212' away from the upper cover portion 211' and extending in a direction away from the upper cover portion 211'. Correspondingly, the bottom plate 22' can be provided with a buckle hole 2201', and the buckle protrusion 214' is penetrated through the buckle hole 2201' and is buckled with the bottom plate 22' through the buckle hole 2201'. The cover plate 21' and the bottom plate 22' form an air outlet 203' of the air guide channel 201' at the notch of the side portion 212', the upper cover portion 211' and the bottom plate 22' respectively form the upper and lower cavity walls of the air outlet 203', and the two extended ends of the side portion 212' form the left and right cavity walls of the air outlet 203'. The impeller 23' is rotatably connected to the upper cover 211', the rotation axis of the impeller 23' is perpendicular to the upper cover 211', and the impeller 23' is directly opposite to the air inlet 202'. The thickness of the impeller 23' is less than the distance between the upper cover 211' and the bottom plate 22', so that the impeller 23' is accommodated in the air guide channel 201', so that the airflow can converge at the air inlet 202', thereby increasing the flow rate of the airflow in the air guide channel 201'.

In order to reduce the impact of the vibration generated by the fan 20' when it is running on the device body 10, the fan 20' is generally connected to the bracket 112, and the cover plate 21' is connected to the bracket 112 and away from the bottom shell 12, the bottom plate 22' is close to the bottom shell 12, and the bottom plate 22' is spaced from the bottom shell 12, so that a vibration gap 102' is reserved between the fan 20' and the bottom shell 12, the air inlet 202' faces the air inlet hole 1201 on the bottom shell 12, and the air outlet 203' faces the heat dissipation space 101. In this way, the bracket 112 can buffer the vibration of the fan 20', and the setting of the vibration gap 102' can prevent the fan 20' from hitting the bottom shell 12 during the vibration process. When the fan 20' is in operation, the external airflow flows through the air inlet hole 1201, the vibration gap 102', the air inlet 202', the air guide channel 201', and the air outlet 203' in sequence, and then blows to the heat dissipation space 101, thereby taking away the heat in the heat dissipation space 101. In order to achieve the thinning of the device body 10, an avoidance hole 1121 can be opened on the bracket 112, and the fan 20' is installed on the bracket 112 and penetrated in the avoidance hole 1121, so as to shorten the total thickness of the main component 11 and the fan 20'. However, the thickness of the current device body is still limited by the thickness of the fan 20' and the thickness of the vibration gap 102', which is difficult to meet the current users' growing demand for thinner and lighter electronic devices.

To solve this problem, please refer to Figures 7 to 9. The fan 20 in the electronic device provided in the present application includes a cover plate 21 and an impeller 22. The cover plate 21 is connected to the device body 10. The cover plate 21 and the bottom shell 12 are jointly arranged to form an air guide channel 201, that is, the bottom shell 12 forms a part of the wall of the air guide channel 201. The air guide channel 201 has an air inlet and an air outlet 202. The air inlet hole 1201 on the bottom shell 12 forms the air inlet of the air guide channel 201. The air outlet 202 of the air guide channel 201 faces the heat dissipation space 101. The impeller 22 is rotatably connected to the cover plate 21 and is located in the air guide channel 201. When the impeller 22 is in operation, the air flow in the air guide channel 201 can be blown from the air inlet 1201 to the air outlet 202. At this time, the external air flow flows through the air inlet 1201, the air guide channel 201, the air outlet 202 in sequence, and then blows toward the heat dissipation space 101, thereby taking away the heat in the heat dissipation space 101.

The fan 20 in the electronic device replaces the bottom plate 22' (as shown in FIG. 6) with the cover plate 21 through the bottom shell 12 to form the air guide channel 201 together. At this time, the fan 20 does not need to be provided with a bottom plate, and the cover plate 21 does not need to be provided with a connection structure such as a snap-on protrusion 214' (as shown in FIG. 6), and there is no need to set a vibration gap 102' (as shown in FIG. 6) between the fan 20 and the bottom shell 12. In this way, compared with the current electronic equipment, the thickness of the electronic device provided by the embodiment of the present application is at least reduced by the thickness of the bottom plate 22' (as shown in FIG. 6) and the thickness of the vibration gap 102' (as shown in FIG. 6), thereby achieving the thinning of the electronic device. At the same time, the setting of the fan 20 shortens the distance between the impeller 22 and the cold air outside the bottom shell 12, improves the air intake efficiency, and prevents the hot air in the heat dissipation space 101 from being circulated through the vibration gap and sucked into the air guide channel 201, affecting the heat dissipation effect.

Specifically, please refer to FIG. 8 and FIG. 9 , the cover plate 21 includes an upper cover portion 211 and a side portion 212 connected to the upper cover portion 211, the side portion 212 is extended along the edge of the upper cover portion 211, and is bent toward one side of the upper cover portion 211. In the illustrated embodiment, the upper cover portion 211 is in the shape of a flat plate, and the side portion 212 is vertically bent relative to the upper cover portion 211. A notch is formed between the two extended ends of the side portion 212, and the notch faces the heat dissipation space 101. The cover plate 21 and the bottom shell 12 form an air outlet 202 at the notch of the side portion 212. Among them, the edge of the side portion 212 away from the upper cover portion 211 is flat, and there is no need to set a snap protrusion, and the side portion 212 can be gap-matched with the bottom shell 12.

Optionally, the cover plate 21 is disposed on the air inlet area 120, and the side edge portion 212 is disposed outside the air inlet area 120 so that all the air inlet holes 1201 are connected to the air guide channel 201. In this way, the electronic device replaces the air inlet on the bottom plate of the current fan 20 with multiple air inlet holes 1201, thereby increasing the flow rate of the air flow and thus improving the heat dissipation efficiency. The size of the air inlet area 120 can be the same as the size of the air inlet on the bottom plate of the current fan 20.

Please refer to FIG. 8 , the impeller 22 faces the air inlet area 120 , and the rotation axis of the impeller 22 is parallel to the central axis of the air inlet hole 1201 in the air inlet area 120 , so that the airflow generated by the impeller 22 enters the air guide channel 201 from the air inlet hole 1201 .

Please refer to FIG. 10 , the impeller 22 includes a rotating shaft 221 and a blade assembly 222. The blade assembly 222 includes a plurality of rotating blades 2221 connected to the rotating shaft. The plurality of rotating blades 2221 are arranged at equal intervals along the circumference of the rotating shaft 221 and extend in a direction away from the rotating shaft 221. The extension ends of the rotating blades 2221 are bent toward the same side. The rotating shaft 221 is rotatably connected to the upper cover 211 and is electrically connected to the main board 113 through the wire 23. When the fan 20 is in operation, the main board 113 controls the rotating shaft 221 to rotate, and the plurality of rotating blades 2221 rotate with the rotating shaft 221, so that negative pressure is generated near the rotating shaft 221, and the airflow enters the air guide channel 201 from the air inlet and is centrifugally blown toward the peripheral side of the rotating blades 2221. The side edge 212 can guide the airflow blowing toward the peripheral side to flow toward the air outlet 202. The side portion 212 includes a spiral section 2121 and an opening section 2122 connected to each other, and the spiral section 2121 can extend in a spiral shape relative to the rotating shaft 221. The distal end of the spiral section 2121 away from the rotating shaft 221 forms a side wall of the air outlet 202 of the air guide channel 201, and the opening section 2122 is connected to the proximal end of the spiral section 2121 close to the rotating shaft 221, and forms the other side wall of the air outlet 202 of the air guide channel 201. In order to expand the blowing range, the air outlet 202 formed by the opening section 2122 and the distal end of the spiral section 2121 is trumpet-shaped.

Optionally, the impeller 22 further includes a limiting plate 223, which is disposed around the rotating shaft 221 and connected to the extended ends of the plurality of rotating blades 2221 to position the rotating blades 2221. The limiting plate 223 is connected to a side of the blade assembly 222 close to the upper cover 211 to avoid blocking the airflow from entering the air guide channel 201.

It should be noted that, in order to ensure the smooth rotation of the impeller 22 , the blade assembly 222 and the limiting plate 223 are both spaced apart from the upper cover 211 .

In some embodiments, referring to Figures 9 and 10, the cover plate 21 further includes an ear portion 213, the ear portion 213 protrudes from the side of the side portion 212 facing away from the air guide channel 201, and the ear portion 213 is fixedly connected to the device body 10. The fan 20 is fixedly connected to the device body 10 via the ear portion 213 to avoid increasing the thickness of the fan 20.

Optionally, a plurality of ears 213 are provided, and the plurality of ears 213 are arranged around the upper cover 211 , so that the cover plate 21 is stably fixed in the circumferential direction through the plurality of ears 213 .

In some embodiments, referring to FIG8 and FIG9 , the cover plate 21 is connected to the bottom shell 12. The connection between the cover plate 21 and the bottom shell 12 may be bonding, screw connection, clamping, etc. In this embodiment, when assembling the electronic device, the fan 20 may be connected to the bottom shell 12 first, and then the bottom shell 12 may be installed on the assembled main body member 11.

As one of the embodiments, a connecting column 121 is protruded from the side of the bottom shell 12 facing the bracket 112, and the number of the connecting columns 121 is the same as the number of the ears 213, and each ear 213 is fixedly connected to a connecting column 121. The ears 213 are fixedly connected to the connecting columns 121 to achieve a fixed connection between the cover plate 21 and the bottom shell 12. In this embodiment, the connecting column 121 can be integrally formed with the bottom shell 12.

Among them, the ear 213 can be connected to the extension end of the connecting column 121 away from the bottom shell 12, so that the connecting column 121 can absorb part of the vibration of the fan 20 through its own slight elastic deformation, thereby reducing the vibration on the bottom shell 12. At the same time, there is no need to open a connecting structure on the bottom shell 12, thereby ensuring the flatness and structural strength of the bottom shell 12.

Optionally, a connection slot may be provided on the connection column 121, and a connection hole 2131 is provided on the ear portion 213. The opening direction of the connection hole 2131 is the same as the opening direction of the connection hole 2131, and the connection hole 2131 is directly opposite to the connection slot. The electronic device further includes a locking member, which passes through the connection hole 2131 and is connected to the connection slot in cooperation with the connection column 121 to clamp the ear portion 213 together with the connection column 121, thereby achieving the locking of the ear portion 213 with the connection column 121. The locking member may be a screw, which is threadedly connected to the groove wall of the connection slot, and may also be threadedly connected to the hole wall of the connection hole 2131.

The opening direction of the connection groove may be the same as the extension direction of the rotation axis of the impeller 22, so as to facilitate the installation of the locking member. Of course, the opening direction of the connection groove may not be the same as the extension direction of the rotation axis of the impeller 22, and the ear 213 and the connection column 121 may also be detachably connected by bonding, clamping, etc., which is not limited here.

In other embodiments, the cover plate 21 may also be connected to the main body member 11, for example, the cover plate 21 is connected to the bracket 112, so that the bracket 112 absorbs the vibration of the fan 20 and reduces the vibration of the bottom shell 12. In this case, a connecting column 121 may be protruded on the bracket 112, and the ear 213 is fixedly connected to the connecting column 121 by a locking member, which is not limited here. It should be noted that among the multiple ears 213, part of them can be connected to the bottom shell 12, and the other part can be connected to the bracket 112, which is not limited here.

In order to facilitate the positioning of the fan 20 and the bottom shell 12, please refer to Figures 8 and 10. A plurality of positioning posts 2111 may be provided on the side of the upper cover 211 facing the impeller 22. Accordingly, positioning grooves adapted to be plugged in with the positioning posts 2111 may be provided on the bottom shell 12. The number of positioning grooves is equal to the number of positioning posts 2111. During installation, the fan 20 may be first buckled on the bottom shell 12, and the positioning posts 2111 may be inserted into the positioning grooves. At this time, the connection holes 2131 on the ear 213 are directly opposite to the connection grooves on the connection posts 121. The locking member may directly pass through the connection holes 2131 and be connected to the connection grooves. The positioning posts 2111 may have a chamfered surface to facilitate plugging and matching with the positioning grooves.

In order to avoid affecting the structural strength of the bottom shell 12 , a boss 122 may be protruded from one side of the bottom shell 12 facing the bracket 112 , and a positioning groove may be formed on the boss 122 .

In some embodiments, referring to FIG. 7 and FIG. 8 , a relief hole 1121 is provided on the bracket 112, and the cover plate 21 is passed through the relief hole 1121. When assembling the electronic device, the fan 20 can be first installed on the bottom shell 12, and then the bottom shell 12 is connected to the assembled main body 11. The relief hole 1121 not only further reduces the thickness of the device body 10, but also accommodates the design tolerance to avoid collision between the fan 20 and the bracket 112.

7 and 8 , the electronic device further comprises a buffer 40 , which is elastic and is held by the cover 21 and the bottom case 12 . The buffer 40 can absorb the vibration of the fan 20 , thereby reducing the vibration of the bottom case 12 .

As one of the embodiments, the buffer member 40 is extended along the edge of the cover plate 21 and is sealed between the cover plate 21 and the bottom shell 12. In this way, the air guide channel 201 is sealed by the buffer member 40, thereby preventing the air guide channel 201 from leaking due to the installation gap between the cover plate 21 and the bottom shell 12.

Optionally, the buffer member 40 extends along the extension path of the side edge portion 212 and covers the side edge portion 212 to improve the connection stability between the cover plate 21 and the bottom shell 12 and the sealing performance of the air guide channel 201 .

In other embodiments, the buffer member 40 may also be a non-solid structure such as a spring, and a plurality of buffer members 40 may also be provided at intervals along the edge of the side portion 212, which is not limited here.

It should be noted that, in this embodiment, the thickness of the side portion 212 is smaller than the thickness of the current side portion 212, and the sum of the thickness of the side portion 212 and the thickness of the buffer 40 may be approximately the same as the thickness of the current side portion 212, that is, the thickness of the air guide channel 201 remains unchanged after the buffer 40 is set, so as to avoid the buffer 40 occupying the thickness of the device body 10.

Optionally, the buffer member 40 may be a rubber strip, foam, etc. When the side portion 212 and the bottom shell 12 clamp the buffer member 40, the buffer member 40 may be compressed to strengthen the sealing of the air guide channel 201 and improve the connection stability of the buffer member 40 between the cover plate 21 and the bottom shell 12. The rubber strip may also be bonded between the side portion 212 and the bottom shell 12.

Optionally, the buffer member 40 may also be an adhesive layer. The adhesive layer may be formed of a structural adhesive, such as a backing adhesive, or of a liquid adhesive, such as glue. The glue has elasticity after curing. During installation, glue may be applied to the side portion 212 first, and then the cover 21 is connected to the bottom shell 12. At this time, the glue bonds the side portion 212 and the bottom shell 12 and has a certain thickness. After the glue is cured, a buffer member 40 is formed. The buffer member 40 can not only buffer the fan 20, but also achieve a fixed connection between the fan 20 and the bottom shell 12.

It should be noted that the fan 20 and the bottom shell 12 can be pre-fixed by an adhesive layer, and then the connection between the ear 213 and the connecting column 121 can be achieved by a locking piece, so that the cover 21 and the bottom shell 12 fit tightly. Of course, the fan 20 can also be fixedly connected only by the adhesive layer without connecting the ear 213 and the bottom shell 12.

In other embodiments, the buffer member 40 may also be disposed between the upper cover portion 211 and the bottom shell 12 , or between the ear portion 213 and the bottom shell 12 (or the connecting column 121 ), which is not limited here.

In some embodiments, the cover plate 21 and the bottom shell 12 are matched with a gap to reduce the air leakage of the air guide channel 201, and at the same time, the fan 20 and the bottom shell 12 are quickly installed. It can be understood that for a fan 20 with relatively slight vibration in the running state, the cover plate 21 can be directly sealed against the bottom shell 12 to improve the sealing of the air guide channel 201. For an ordinary fan 20, the cover plate 21 can also be separated from the bottom shell 12 by a small gap, which can be used to accommodate tolerances and reserve a certain vibration space for the fan 20. Among them, the distance between the impeller 22 and the bottom shell 12 can be equal to the distance between the impeller 22 and the bottom plate in the current fan 20, or it can be slightly larger than the distance between the current impeller 22 and the bottom plate. It should be noted that this embodiment is applied to electronic equipment where the area of the bottom shell 12 opposite to the cover plate 21 has a good degree of fit (such as a good flatness at the junction of the two) or has low requirements for the sealing of the whole machine. At this time, since there is no need to set a buffer, materials can be saved and costs can be reduced.

Finally, it should be noted that the above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (12)

1. An electronic device, comprising:

The equipment main body comprises a main body member and a bottom shell which are connected, wherein a heat dissipation space is formed in the equipment main body, and at least one air inlet hole communicated with the heat dissipation space is formed in the bottom shell;

The fan comprises a cover plate and an impeller, wherein the cover plate is connected to the equipment main body, the cover plate and the bottom shell are jointly enclosed to form an air guide channel, the air inlet hole forms an air inlet of the air guide channel, the air outlet of the air guide channel faces the heat dissipation space, and the impeller is rotationally connected to the cover plate and is positioned in the air guide channel.

2. The electronic device of claim 1, wherein the main body member comprises an upper shell, a bracket and a main board, the upper shell is connected with the bottom shell and forms a containing cavity together, the bracket and the main board are both positioned in the containing cavity, the bracket is connected with the upper shell, the heat dissipation space is formed between the bracket and the bottom shell, the main board is connected to one side of the bracket, which is opposite to the upper shell, and the air outlet faces the main board.

3. The electronic device of claim 2, wherein the cover plate comprises an upper cover portion and a side portion connected to the upper cover portion, the side portion extends along an edge of the upper cover portion, a gap is formed between two extending ends of the side portion, the gap faces the heat dissipation space, and the impeller is rotatably connected to the upper cover portion.

4. The electronic device of claim 3, wherein the cover further comprises an ear attached to the side portion, the ear being fixedly attached to the device body.

5. The electronic device of claim 4, wherein a plurality of the ears are provided, the plurality of ears being disposed around the upper cover portion.

6. The electronic device of any one of claims 1-5, wherein the cover is coupled to the bottom case.

7. The electronic device of claim 6, wherein a side of the bottom case facing the bracket is convexly provided with a connection post, and the cover plate is connected to the connection post.

8. The electronic device of any of claims 1-7, wherein the cover is clearance fit with the bottom case.

9. The electronic device according to any one of claims 1 to 7, further comprising a buffer member having elasticity, wherein the cover plate and the bottom chassis sandwich the buffer member together.

10. The electronic device of claim 9, wherein the buffer member extends along an edge of the cover plate and is sealingly connected between the cover plate and the bottom case.

11. The electronic device of any one of claims 1 to 10, wherein the bottom shell has an air inlet area, a plurality of air inlets are formed in the bottom shell, the plurality of air inlets are all located in the air inlet area, the air inlet area faces the impeller, and the cover plate covers the air inlet area.

12. The electronic device of any one of claims 1 to 10, further comprising a display body, wherein the display body comprises a display end housing rotatably connected to the device body and a display screen connected to the display end housing, the body member further comprises a keyboard connected to the bracket, the upper housing is provided with a positioning hole, and a key of the keyboard is arranged through the positioning hole.