CN118348750A - High-precision photoetching exposure system and image recognition device - Google Patents
High-precision photoetching exposure system and image recognition device Download PDFInfo
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- CN118348750A CN118348750A CN202410591165.4A CN202410591165A CN118348750A CN 118348750 A CN118348750 A CN 118348750A CN 202410591165 A CN202410591165 A CN 202410591165A CN 118348750 A CN118348750 A CN 118348750A
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- 238000001259 photo etching Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000003384 imaging method Methods 0.000 claims abstract description 16
- 238000001459 lithography Methods 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a high-precision photoetching exposure system and an image recognition device, comprising a mounting table, an image recognition module and a bearing module, wherein the image recognition module is used for detecting whether a projection exposure image is correct, a bracket is arranged at the top of the mounting table, a transverse plate is arranged on the inner wall of the bracket, an industrial camera is arranged at the top of the transverse plate, an ultraviolet imaging camera is arranged at the bottom of the transverse plate, the ultraviolet imaging camera and the industrial camera are electrically connected with the image recognition module, and the image recognition module comprises an image recognizer. The invention realizes the purpose of image recognition of the projection exposure pattern by arranging the industrial camera, the ultraviolet imaging camera and the image recognizer for collecting, extracting and comparing the exposure projection pattern image on the mask plate and the exposure forming pattern image on the substrate, and obtains clear and accurate exposure projection pattern on the substrate by adjusting the position of the first substrate, thereby improving the precision and accuracy of the photoetching exposure projection system.
Description
Technical Field
The invention relates to the technical field of lithography and image recognition, in particular to a high-precision lithography exposure system and an image recognition device.
Background
The lithography exposure refers to the use of an illumination light source to emit exposure light, the light passes through the shielding part of the solid part of the mask plate and the penetrating part of the solid part, so that the light passing through the penetrating part is focused by the lens of the optical system and then projected onto the photoresist on the top of the substrate, thereby realizing pattern transfer, which is an important procedure of the lithography process in the manufacture of integrated circuits, but the existing lithography exposure system is inconvenient to identify whether an exposure projection image on the substrate is completed or whether the size is the required size or not when the substrate is subjected to exposure treatment, and the lithography exposure precision is reduced.
The existing high-precision photoetching exposure system and the image recognition device have the defects that:
1. In the application document WO2013026361A1, how to move the workbench and the mask table to corresponding positions synchronously for exposure operation is mainly considered, but the problem of how to perform image recognition on the exposure projection image is not considered;
2. The problem of how to prevent the reflection force caused by the movement of the stage from propagating to the projection lens or other parts of the lithographic apparatus is mainly considered in JP2003264147a, and the problem of placing different size specifications of mask plates, lenses and substrates is not considered;
3. the patent document CN216622958U realizes the semiautomatic operation of the photoetching machine, and does not consider the problem that the work efficiency is reduced due to the fact that a person manually pulls out the wafer into the wafer carrying table;
4. the patent document CN110554571B mainly considers a lithographic apparatus and an exposure system which are simple in structure and low in cost, and does not consider the problem of facilitating adjustment of the lens position.
Disclosure of Invention
The present invention is directed to a high-precision lithography exposure system and an image recognition apparatus, which solve the problems set forth in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the high-precision photoetching exposure system comprises a mounting table, an image recognition module and a bearing module, wherein the bearing module is used for placing a substrate, a lens and a mask plate, and the image recognition module is used for detecting whether a projection exposure image is correct or not;
The top of the mounting table is provided with a bracket, the inner wall of the bracket is provided with a transverse plate, the top of the transverse plate is provided with an industrial camera, the bottom of the transverse plate is provided with an ultraviolet imaging camera, and the ultraviolet imaging camera and the industrial camera are electrically connected with an image recognition module;
The electric push rod I is installed to the inner wall of support, and electric push rod I is located the below of diaphragm, electric push rod I's output is connected with bears the weight of the module, electric push rod II is installed in the top embedding of mount table, and electric push rod is located the rear of support, and electric push rod II's output and the bottom fixed connection who bears the weight of the module.
Preferably, the bearing module comprises a U-shaped frame, the connecting rods are connected with the two sides of the U-shaped frame in a penetrating manner, one end, close to each other, of the connecting rods is connected with a first placing frame, the two sides of the first placing frame are provided with adjusting plates in a penetrating manner, the tops of the adjusting plates are provided with limiting plates I, the limiting plates I are located on the inner sides of the first placing frame, the tops of the adjusting plates are provided with limiting plates II in a penetrating manner, the outer walls of the limiting plates II are connected with the outer walls of the limiting plates I in a sliding manner, the bottom of the adjusting plates are provided with supporting frames, the supporting frames are located on the inner walls of the first placing frame, the inner walls of the supporting frames are provided with electric pushing rods III, the output ends of the electric pushing rods III are fixedly connected with the front faces of the limiting plates II, the tops of the adjusting plates are provided with guide frames, the guide frames are located on the outer sides of the first placing frame, the tops of the guide frames are connected with sliding columns in a sliding manner, the bottoms of the sliding columns are embedded in the tops of the adjusting plates, the outer walls of the first placing frame are connected with electric pushing rods IV, the output ends of the electric pushing rods IV are connected with bumps, and the bump sleeves are arranged on the outer walls of the sliding columns.
Preferably, the number of the installation groups of the bearing modules and the first placing frames is two, the upper bearing modules penetrate through the back surface of the support and are fixedly connected with the support, the upper placing frames are used for placing the mask plate, the lower bearing modules are located below the transverse plates, and the lower placing frames are used for placing the base plate.
Preferably, the dwang is installed in the both sides penetration of U-shaped frame, and the dwang is located the front and back both sides of connecting rod, and the outer wall cover of dwang is equipped with the drive wheel, and the drive wheel is located U-shaped frame inside, and the outer wall cover of drive wheel is equipped with the drive belt, and the diapire of drive belt and the bottom fixed connection of connecting rod, and the outer wall cover of dwang is equipped with the worm wheel, and worm wheel symmetric distribution is in the both sides of U-shaped frame, and servo motor is installed at the top of mount pad, and servo motor's output is connected with the worm, and worm wheel meshing.
Preferably, the electric putter five is installed at the top of mount table, and electric putter is located the rear of support, and the stock is installed to electric putter five's output, and the surface that the stock is close to each other is connected with rack two, and rack two is located between two sets of racks one, and rack two is used for placing lens.
Preferably, the top of mount table is provided with the mounting bracket, and the mounting bracket is located the rear of support to the mounting bracket is located electric putter's the place ahead, and the inner wall and the mounting bracket back fixed connection of a set of bearing module in top, the inner wall and the back sliding connection of mounting bracket of a set of bearing module in below.
Preferably, an exposure light source is installed at the bottom end of the installation frame, and the exposure light source is located above the first placement frame.
The image recognition device comprises an image recognition module, wherein the image recognition module comprises an image recognition device arranged at the top of an installation table, the image recognition device is positioned on the right side of a support, a display screen is embedded in the front face of the image recognition device, a wireless signal transceiver, an optical filter and an image acquisition card are arranged in the image recognition device, the image acquisition card is electrically connected with the display screen and the optical filter, the optical filter is electrically connected with the wireless signal transceiver, and the wireless signal transceiver is electrically connected with a first electric push rod and a second electric push rod.
A high-precision lithography exposure system and an application method of an image recognition device are provided, wherein the application method of the high-precision lithography exposure system and the application method of the image recognition device are as follows:
S1, preparing a mask plate, a lens and a substrate, placing the lens in a second placing frame, placing the mask plate in a first placing frame set above, and placing the substrate in a first placing frame set below;
S2, driving the first placement frame to move backwards through the transmission belt and the long rod, and moving to the position below the exposure light source through the upper part of the transverse plate;
s3, the industrial camera collects image information including the shape of the exposure image at the bottom of the mask plate and transmits the image information to the image identifier for processing and storage;
S4, the exposure light source emits exposure light, an exposure image is formed on the top of the substrate after passing through the mask plate and the lens, the ultraviolet imaging camera collects the exposure image and transmits the exposure image to the image identifier for processing, comparing and storing, and whether the shape of the exposure image is complete and the proportion is correct is judged;
S5, adjusting the positions of the first placing frame and the second placing frame below according to the comparison result, and further adjusting the positions of the substrate and the lens to obtain a complete and correct exposure image shape.
Preferably, in the step S1, the method further includes the following steps:
S11, moving the first placing frame to the front of the bracket, and adjusting the positions of the adjusting plate, the first limiting plate and the second limiting plate according to the sizes of the mask plate and the substrate.
Compared with the prior art, the invention has the beneficial effects that:
1. The invention is provided with an industrial camera, an ultraviolet imaging camera and an image identifier, which are used for collecting mask images and extracting outline image shapes for exposure projection, collecting and processing image of exposure projection patterns at the top of a substrate, extracting the image shapes formed by the exposure projection, comparing the two groups of image shapes, judging whether the outline shapes are the same or whether the exposure projection patterns at the top of the substrate are the required pattern sizes amplified or reduced in an equal ratio, realizing the purpose of image identification of the projection exposure patterns, and adjusting the position of the first substrate through the first electric push rod and the second electric push rod, so that clear and accurate exposure projection patterns can be obtained on the substrate, and the precision and the accuracy of a photoetching exposure projection system are improved.
2. According to the invention, the bearing module, the U-shaped frame and the first placement frame are arranged, the electric push rod is driven to be started up four times according to the sizes of the grinding mask plate and the substrate, the electric push rod is extended four times, the adjusting plates are driven to move outwards through the sliding columns, the distance between the first limiting plates at the tops of the two groups of adjusting plates is increased, the distance between the first limiting plates is reduced otherwise, the electric push rod is extended five times, the limiting plates are pushed to move backwards, otherwise, the second limiting plates are moved backwards, and the placement space is adjusted and used for placing mask plates, substrates and lenses with different sizes.
3. According to the invention, the connecting rod, the driving belt and the rotating rod are arranged, the worm is driven to rotate through the rotation of the servo motor, the driving rod is driven to rotate through the meshing transmission between the worm and the worm wheel, the rotating rod drives the driving wheel to rotate, the driving wheel drives the driving belt to move, and the first placing rack is driven to move through the connecting rod, so that the first placing rack is convenient to move to the front of the bracket to place the mask plate and the substrate, and after the placing is finished, the mask plate and the substrate automatically move to the position below the exposure light source, thereby being beneficial to improving the placing efficiency of the mask plate and the substrate and further improving the photoetching exposure efficiency.
4. According to the invention, the lens is placed in the second placing frame through the second placing frame, the long rod and the electric push rod, the long rod is driven to move upwards or downwards by the electric push rod, and then the second placing frame and the lens are driven to move upwards or downwards, so that the lens can be conveniently adjusted to a proper placing position according to the focal lengths of different lenses, a projection graph with clear outline can be conveniently obtained, and the photoetching projection precision is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of an image recognition module according to the present invention;
FIG. 3 is a schematic view of an exposure light source according to the present invention;
FIG. 4 is a schematic view of a load bearing module structure according to the present invention;
FIG. 5 is a schematic view of a rack according to the present invention;
FIG. 6 is a schematic view of a connecting rod structure according to the present invention;
FIG. 7 is an enlarged schematic view of the structure of FIG. 1 according to the present invention;
FIG. 8 is a schematic view of a second embodiment of the rack of the present invention;
fig. 9 is a flowchart of the operation of the present invention.
In the figure: 1. a mounting table; 2. a bracket; 3. a cross plate; 4. an industrial camera; 5. an ultraviolet imaging camera; 6. an electric push rod I; 7. a U-shaped frame; 8. an image identifier; 9. a display screen; 10. a wireless signal transceiver; 11. an optical filter; 12. an image acquisition card; 13. an electric push rod II; 14. a first placing frame; 15. a connecting rod; 16. an adjusting plate; 17. a first limiting plate; 18. a limiting plate II; 19. a support frame; 20. an electric push rod III; 21. a guide frame; 22. fourth, an electric push rod; 23. a sliding column; 24. a rotating lever; 25. a driving wheel; 26. a transmission belt; 27. a worm wheel; 28. a worm; 29. a servo motor; 30. a mounting frame; 31. an exposure light source; 32. a long rod; 33. fifth electric push rod; 34. and a second placing frame.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 4 and 5, an embodiment of the present invention is provided: a high-precision photoetching exposure system comprises a mounting table 1, an image recognition module and a bearing module, wherein the bearing module is used for placing a substrate, a lens and a mask plate, the bearing module comprises a U-shaped frame 7, two sides of the U-shaped frame 7 are connected with connecting rods 15 in a penetrating way, one end, close to each other, of each connecting rod 15 is connected with a first placing frame 14, the first placing frame 14 is a U-shaped frame 7 frame, the first placing frame 14 is positioned at the inner side of the U-shaped frame, two sides of the first placing frame 14 are provided with two adjusting plates 16 in penetrating way, the number of the adjusting plates 16 is two, the adjusting plates 16 are positioned at the inner side of the U-shaped frame 7, the top of the adjusting plates 16 is provided with a first limiting plate 17, the first limiting plate 17 is positioned at the inner side of the first placing frame 14, the back of the first limiting plate 17 is connected with the inner wall of the first placing frame 14 in a sliding way, the top of the adjusting plates 16 is provided with a second limiting plate 18 in a penetrating way, the lower half part of the second limiting plate 18 extends to the lower part of the adjusting plates 16, the outer wall of the limiting plate II 18 is in sliding connection with the outer wall of the limiting plate I17, the supporting frame 19 is arranged at the bottom of the adjusting plate 16, the supporting frame 19 is positioned at the inner side of the first accommodating plate 16, the third electric push rod 20 is arranged at the inner wall of the supporting frame 19, the output end of the third electric push rod 20 is fixedly connected with the front surface of the limiting plate II 18, the guide frame 21 is arranged at the top of the adjusting plate 16, the number of the installation groups of the guide frames 21 is two, the guide frame 21 is positioned at the outer side of the first accommodating plate 14, the top of the guide frame 21 is in sliding connection with the sliding column 23, the upper section and the lower section of the sliding column 23 are rectangular, the middle section is cylindrical, the bottom of the sliding column 23 is embedded into and connected with the top of the adjusting plate 16, the sliding column 23 is in sliding connection with the top of the adjusting plate 16, the outer wall of the first accommodating plate 14 is rotationally connected with the fourth electric push rod 22, the fourth electric push rod 22 is positioned above the adjusting plate 16, the output of electric putter fourth 22 is connected with the lug, and the outer wall of the middle cylinder section of slip post 23 is located to the lug cover, and the installation group number of carrier module and rack first 14 is two sets of, and a set of carrier module in top runs through the back of support 2 to with support 2 fixed connection, a set of rack first 14 in top is used for placing the mask plate, a set of carrier module in below is located the below of diaphragm 3, a set of rack first 14 in below is used for placing the base plate, has the same structure on the rack second 34 with the rack first 14.
Further, according to the size of the grinding mask plate and the substrate, the electric push rod IV 22 is driven to start, the electric push rod IV 22 stretches, the adjusting plate 16 is driven to move outwards through the sliding column 23, the distance between the first limiting plates 17 at the tops of the two groups of adjusting plates 16 is increased, otherwise, the electric push rod IV 22 shortens, the adjusting plate 16 is driven to move inwards through the sliding column 23, the distance between the first limiting plates 17 of the two groups of adjusting plates is reduced, the electric push rod V33 stretches, the second limiting plates 18 are pushed to move backwards, the electric push rod V33 shortens, the second limiting plates 18 are pulled to move forwards, and the adjustment placing space is realized for placing mask plates, substrates and lenses with different sizes.
Referring to fig. 1, 6 and 7, an embodiment of the present invention provides: the utility model provides a high accuracy photoetching exposure system, the both sides of U-shaped frame 7 run through and install dwang 24, the installation group number of dwang 24 is four, and every two sets of dwang 24 are about rack one 14 bilateral symmetry distribution, two sets of dwang 24 that are located U-shaped frame 7 and are located the front and back both sides of connecting rod 15, the outer wall cover of dwang 24 is equipped with drive wheel 25, and drive wheel 25 is located U-shaped frame 7 inside, the outer wall cover of drive wheel 25 is equipped with drive belt 26, and drive belt 26 is located U-shaped frame 7 inside, the connecting rod runs through between top drive belt 26 and below drive belt 26, and the diapire of drive belt 26 and the bottom fixed connection of connecting rod, the outer wall cover of dwang 24 is equipped with worm wheel 27, and worm wheel 27 symmetric distribution is in the both sides of U-shaped frame 7, worm wheel 27 in the rear of support 2 of the both sides of a set of U-shaped frame 7 of top, servo motor 29 is installed at the top of mount 1, servo motor 29's output is connected with worm wheel 28, and worm wheel 28 meshes with worm wheel 27.
Further, the servo motor 29 rotates positively to drive the worm wheel 27 to rotate, the worm wheel 27 drives the rotating rod 24 to rotate clockwise through meshing with the worm 28, the rotating rod 24 drives the driving wheel 25 to rotate, and then the long rod 32 is driven to move forwards through the driving belt 26, the long rod 32 drives the first placing frame 14 to move forwards to the front of the support 2, so that the mask plate and the substrate can be placed conveniently, after the placement is finished, the servo motor 29 is driven to rotate reversely, then the worm wheel 27 drives the rotating rod 24 to rotate anticlockwise, the rotating rod 24 drives the driving wheel 25 to rotate, and then the long rod 32 is driven to move backwards through the driving belt 26, and the first placing frame 14 and the mask plate or the substrate are driven to move backwards through the long rod 32 and to the lower part of the exposure light source 31, so that the placement of the mask plate and the substrate is finished, the placement efficiency of the mask plate and the substrate is improved, and the photoetching exposure efficiency is improved.
Referring to fig. 1,2,3 and 9, an embodiment of the present invention is provided: the high-precision photoetching exposure system comprises a mounting table 1, an image recognition module and a bearing module, wherein the image recognition module is used for detecting whether a projection exposure image is correct or not;
the top of the mounting table 1 is provided with a support 2, the inner wall of the support 2 is provided with a transverse plate 3, the top of the transverse plate 3 is provided with an industrial camera 4, the industrial camera 4 is used for collecting images of the bottom of the mask, the bottom of the transverse plate 3 is provided with an ultraviolet imaging camera 5, the ultraviolet imaging camera 5 is used for collecting exposure forming images of the top of the substrate, and the ultraviolet imaging camera 5 and the industrial camera 4 are electrically connected with an image recognition module;
The inner wall of the bracket 2 is provided with a first electric push rod 6, the first electric push rod 6 is positioned below the transverse plate 3, the output end of the first electric push rod 6 is connected with a bearing module, the top of the mounting table 1 is embedded and provided with a second electric push rod 13, the second electric push rod 13 is positioned at the rear of the bracket 2, and the output end of the second electric push rod 13 is fixedly connected with the bottom of the lower group of bearing modules;
The image recognition device comprises an image recognition device 8 arranged at the top of an installation table 1, wherein the image recognition device 8 is positioned on the right side of a support 2, a display screen 9 is embedded in the front of the image recognition device 8, a wireless signal transceiver 10, an optical filter 11 and an image acquisition card 12 are arranged in the image recognition device 8, the image acquisition card 12 is electrically connected with the display screen 9 and the optical filter 11, the optical filter 11 is electrically connected with the wireless signal transceiver 10, and the wireless signal transceiver 10 is electrically connected with an electric push rod I6 and an electric push rod II 13.
Further, after the mask plate is placed on the inner side of the first placement frame 14, the mask plate moves backward and passes over the industrial camera 4, the industrial camera 4 collects a bottom image of the mask plate from below, wherein the bottom image of the mask plate comprises an outline of an exposure image shape, the bottom image is transmitted to an image recognition device, image information is received through the wireless signal transceiver 10 and is transmitted to the image collection card 12 after being processed through the optical filter 11, the outline and the size of the image shape for photoetching exposure are extracted and are displayed through the display screen 9, the exposure light source 31 performs exposure irradiation, a projection exposure pattern is formed on a lens substrate, the ultraviolet imaging camera collects the projection exposure pattern image and is transmitted to the image recognition device, the optical filter 11 performs filtering treatment on the light of the non-exposure light source 31, the accuracy of the obtained projection exposure pattern image is improved, the image collection card 12 obtains the projection exposure pattern, the outline and the size are extracted, the outline extracted from the projection exposure pattern image is compared with the outline extracted from the image for photoetching exposure, whether the outline shape is identical or not, or whether the projection exposure pattern at the top of the substrate is the size which is required to be enlarged or reduced, the projection exposure pattern is the same as the size, the image or not, the accuracy of the projection exposure pattern is required to be enlarged or reduced, and the like, the projection exposure pattern is obtained, and the accuracy of the projection exposure pattern is accurately is adjusted on the first projection system and the second projection system can be adjusted, and the projection system can be clear, and the projection exposure accuracy is improved.
Referring to fig. 1,2, 7 and 8, an embodiment of the present invention is provided: the utility model provides a high accuracy photoetching exposure system, electric putter five 33 is installed at the top of mount table 1, electric putter five 33's installation group number is four, and every two sets of electric putter five 33 symmetric distribution in the both sides that bear the weight of the module, and electric putter two 13 are located the rear of support 2, long pole 32 is installed to electric putter five 33's output, long pole 32 is located between two upper and lower groups and bears the weight of the module, the surface that long pole 32 is close to each other is connected with rack two 34, and rack two 34 are located between two sets of racks one 14, rack two 34 are used for placing the lens.
Further, the lens is placed in the second placement frame 34, the electric push rod five 33 drives the long rod 32 to move upwards or downwards, and then drives the second placement frame 34 and the lens to move upwards or downwards, so that the lens can be conveniently adjusted to a proper placement position according to the focal lengths of different lenses, a projection graph with clear outline can be conveniently obtained, and the photoetching projection precision is improved.
Referring to fig. 1 and 8, an embodiment of the present invention is provided: the top of mount table 1 is provided with mounting bracket 30, and mounting bracket 30 is located the rear of support 2, and mounting bracket 30 is located the place ahead of electric putter two 13, the inner wall of a set of carrier module in top and the back fixed connection of mounting bracket 30, the inner wall of a set of carrier module in below and the back sliding connection of mounting bracket 30, exposure light source 31 is installed to the bottom of mounting bracket 30, and exposure light source 31 is located the top of rack one 14, produce lithography exposure through exposure light source 31 and use light, light is sheltered from and lens refraction focus through the mask, form exposure projection figure on the base plate.
Working principle: preparing a mask plate, a lens and a substrate, placing the lens in the second rack 34, placing the mask plate in the first rack 14, placing the substrate in the first rack 14, driving the first rack 14 to move backwards through the transmission belt 26 and the long rod 32, moving to the position below the exposure light source 31 through the upper part of the transverse plate 3, acquiring image information of the shape of the mask plate at the bottom, transmitting the image information to the image recognizer 8 for processing and storing, transmitting exposure light by the exposure light source 31, forming an exposure image at the top of the substrate after passing through the mask plate and the lens, acquiring the exposure image by the ultraviolet imaging camera 5, transmitting the exposure image to the image recognizer 8 for processing, comparing and storing, judging whether the shape of the exposure image is complete and correct, adjusting the positions of the first rack 14 and the second rack 34 according to the comparison result, further adjusting the positions of the substrate and the lens, and acquiring the complete and correct exposure image shape.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. The high-precision photoetching exposure system is characterized by comprising a mounting table, an image recognition module and a bearing module, wherein the bearing module is used for placing a substrate, a lens and a mask plate, and the image recognition module is used for detecting whether a projection exposure image is correct or not;
The device comprises an installing table (1), wherein a support (2) is installed at the top of the installing table (1), a transverse plate (3) is installed on the inner wall of the support (2), an industrial camera (4) is installed at the top of the transverse plate (3), an ultraviolet imaging camera (5) is installed at the bottom of the transverse plate (3), and the ultraviolet imaging camera (5) and the industrial camera (4) are electrically connected with an image recognition module;
The electric push rod I (6) is installed to the inner wall of support (2), and electric push rod I (6) are located the below of diaphragm (3), the output of electric push rod I (6) is connected with and bears the weight of the module, electric push rod II (13) are installed in the top embedding of mount table (1), and electric push rod II (13) are located the rear of support (2), and the output and the bottom fixed connection who bears the weight of the module of electric push rod II (13).
2. A high precision lithography exposure system according to claim 1, wherein: the bearing module comprises a U-shaped frame (7), connecting rods (15) are connected with two sides of the U-shaped frame (7) in a penetrating manner, one ends of the connecting rods (15) which are close to each other are connected with a first placing frame (14), two sides of the first placing frame (14) are provided with adjusting plates (16) in a penetrating manner, the tops of the adjusting plates (16) are provided with limiting plates (17) which are located on the inner side of the first placing frame (14), the tops of the adjusting plates (16) are provided with limiting plates (18) in a penetrating manner, the outer walls of the limiting plates (18) are connected with the outer walls of the limiting plates (17) in a sliding manner, the bottoms of the adjusting plates (16) are provided with supporting frames (19), the supporting frames (19) are located on the inner side of the first placing frame (14), the inner walls of the supporting frames (19) are provided with electric pushing rods (20), the output ends of the electric pushing rods (20) are fixedly connected with the front faces of the limiting plates (18), the tops of the adjusting plates (16) are provided with guide frames (21), the guide frames (21) are located on the outer sides of the first placing frame (14), the tops of the guide frames (21) are provided with the tops of the limiting plates, the tops of the guide frames (21) are connected with the top posts (22) in a sliding manner, the bottoms of the four electric pushing rods (22) are connected with the bottoms of the four pushing rods (22) in a sliding manner, and the bottoms of the four pushing rods (22) are connected with the bottoms of the four pushing rods in a sliding mode, and the convex block is sleeved on the outer wall of the sliding column (23).
3. A high precision lithography exposure system as claimed in claim 2, wherein: the number of the installation groups of the bearing modules and the first placing frames (14) is two, the upper bearing modules penetrate through the back face of the support (2) and are fixedly connected with the support (2), the upper placing frames (14) are used for placing mask plates, the lower bearing modules are located below the transverse plates (3), and the lower placing frames (14) are used for placing base plates.
4. A high precision lithography exposure system as claimed in claim 2, wherein: the utility model discloses a U-shaped frame, including U-shaped frame (7), connecting rod (15) and servo motor (29) are installed in the outer wall cover of connecting rod (15), U-shaped frame (7) both sides run through and install dwang (24), and dwang (24) are located the front and back both sides of connecting rod (15), the outer wall cover of dwang (24) is equipped with drive belt (26), and the outer wall cover of drive belt (26) and the bottom fixed connection of connecting rod, the outer wall cover of dwang (24) is equipped with worm wheel (27), and worm wheel (27) symmetric distribution is in the both sides of U-shaped frame (7), servo motor (29) are installed at the top of mount table (1), the output of servo motor (29) is connected with worm (28), and worm (28) and worm wheel (27) meshing.
5. A high precision lithography exposure system according to claim 1, wherein: electric putter five (33) are installed at the top of mount table (1), and electric putter two (13) are located the rear of support (2), and stock (32) are installed to the output of electric putter five (33), and the surface that stock (32) are close to each other is connected with rack two (34), and rack two (34) are located between two sets of racks one (14), and rack two (34) are used for placing the lens.
6. A high precision lithography exposure system according to claim 1, wherein: the top of mount table (1) is provided with mounting bracket (30), and mounting bracket (30) are located the rear of support (2) to mounting bracket (30) are located the place ahead of electric putter two (13), and the inner wall and the mounting bracket (30) back fixed connection of a set of bearing module in top, the inner wall and the back sliding connection of mounting bracket (30) of a set of bearing module in below.
7. A high precision lithography exposure system according to claim 1, wherein: an exposure light source (31) is arranged at the bottom end of the mounting frame (30), and the exposure light source (31) is positioned above the first placing frame (14).
8. An image recognition apparatus adapted for use in a high precision lithography exposure system as recited in claim 1, wherein: the image recognition module comprises an image recognition device (8) arranged at the top of the mounting table (1), the image recognition device (8) is located on the right side of the support (2), a display screen (9) is embedded in the front of the image recognition device (8), a wireless signal transceiver (10), an optical filter (11) and an image acquisition card (12) are arranged in the image recognition device (8), the image acquisition card (12) is electrically connected with the display screen (9) and the optical filter (11), the optical filter (11) is electrically connected with the wireless signal transceiver (10), and the wireless signal transceiver (10) is electrically connected with a first electric push rod (6) and a second electric push rod (13).
9. A method for using the high-precision lithography exposure system and the image recognition device, which are applicable to the high-precision lithography exposure system and the image recognition device according to any one of claims 1 to 8, characterized in that the method for using the high-precision lithography exposure system and the image recognition device comprises the following steps:
s1, preparing a mask plate, a lens and a substrate, placing the lens in a second placing frame (34), placing the mask plate in a first placing frame (14) above, and placing the substrate in a first placing frame (14) below;
S2, driving the first placing frame (14) to move backwards through the transmission belt (26) and the long rod (32), and moving to the position below the exposure light source (31) through the upper part of the transverse plate (3);
S3, the industrial camera (4) collects the shape of the exposure image on the mask plate and transmits the shape to the image identifier (8) for processing and storage;
s4, an exposure light source (31) emits exposure light, an exposure image is formed on the top of the substrate after passing through the mask plate and the lens, an ultraviolet imaging camera (5) collects the exposure image and transmits the exposure image to an image identifier (8) for processing, comparing and storing, and whether the shape of the exposure image is complete and the proportion is correct is judged;
s5, adjusting the positions of the first rack (14) and the second rack (34) below according to the comparison result, and further adjusting the positions of the substrate and the lens to obtain a complete and correct exposure image shape.
10. The method of using a high-precision lithography exposure system and an image recognition apparatus according to claim 9, wherein in the step S1, further comprising the steps of:
s11, moving the first placing frame (14) to the front of the bracket (2), and adjusting the positions of the adjusting plate (16), the first limiting plate (17) and the second limiting plate (18) according to the sizes of the mask plate and the substrate;
in the step S3, the method further includes the following steps:
S31, a wireless signal transceiver (10) receives the bottom image of the mask plate acquired by the industrial camera (4), acquires the shape outline and the shape size of the exposure image through an image acquisition card (12), and displays the shape outline and the shape size of the exposure image through a display screen (9).
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| CN202410591165.4A CN118348750A (en) | 2024-05-13 | 2024-05-13 | High-precision photoetching exposure system and image recognition device |
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