CN118348383A - Test equipment and system for mobile phone motherboard - Google Patents

Abstract

The application provides a test device and a system thereof for a mobile phone motherboard, which are applied to the technical field of motherboard test devices, and a test instrument comprises an oscilloscope, a signal source, a power supply and the like, and are used for testing various electrical parameters and signal waveforms of the motherboard; the test fixture is used for fixing and connecting the mobile phone motherboard, connecting the motherboard with the test instrument and providing a test interface; the simulation environment is established to simulate various external environment conditions such as temperature, humidity, vibration and the like; by using the environment simulation equipment, the induction degree and the function under different environments can be tested; the simulated environment test can provide more real and controllable environment conditions, and reduce the influence of human factors on test results; the test equipment is calibrated and calibrated regularly, so that the accuracy and consistency of the test equipment are ensured; the reliability of the test result can be improved by calibration and calibration, and the measurement error is reduced.

Description

A mobile phone motherboard testing device and system

Technical Field

The present application relates to the technical field of motherboard testing equipment, and in particular to a testing equipment and system for a mobile phone motherboard.

Background technique

The mobile phone motherboard is the main circuit board in the mobile phone. The mobile phone motherboard is a board containing the main electronic components and interfaces, some auxiliary electronic components, and the circuit system. It solves the problem of disorderly components and random scattered lines. The main electronic components are similar to the central processing unit;

As the precision of processing technology gradually increases, standard configurations, such as sound cards, graphics cards, memory, cameras, etc., need to be plugged into the motherboard, that is, combined into one board. The function of the mobile phone motherboard is to integrate mobile phone operation management;

In the test of mobile phone motherboard, it is necessary to evaluate the induction degree and function of each interface, sensing element and different external environments; the accuracy of testing the test function is low, and inaccurate sensing may occur when each interface is touched and tested manually, which has additional human factors.

Summary of the invention

The present application aims to solve the technical problems of needing to evaluate the sensing degree and function of each interface, sensing element and under different external environments; the low accuracy of testing the test function, inaccurate sensing may occur when contacting and testing each interface through manual operation, and having additional human factors, and provides a mobile phone motherboard testing device and system thereof.

This application adopts the following technical means to solve the technical problem: a mobile phone motherboard testing device and system thereof,

A test device for a mobile phone motherboard and a system thereof, wherein the mobile phone motherboard is tested by the test device, and the test device comprises:

Test instruments, including oscilloscopes, signal sources, power supplies, etc., are used to test various electrical parameters and signal waveforms of the motherboard;

The test fixture is used to fix and connect the mobile phone mainboard, connect the mainboard to the test instrument, and provide a test interface.

A testing device for a mobile phone motherboard and a system thereof, the system comprising:

The control module is used to control the test instrument and execute the test process. The test software has an automated test function and can perform comprehensive functional and performance tests on the motherboard.

Data acquisition module, used to obtain various data generated during the test, including electrical parameters, signal waveforms, fault codes, data acquisition modules include but are not limited to data acquisition cards, sensors, etc.;

Data storage module, used to store test data and test results for subsequent analysis and backtracking. The data storage module includes but is not limited to database, file system or cloud storage;

Data analysis module, used to analyze and process test data and extract key indicators and conclusions. The data analysis module includes but is not limited to statistical analysis, trend analysis, anomaly detection, etc.;

Power module, providing power supply for testing;

The environmental monitoring module is used to monitor the test environment's temperature, humidity, air pressure and other parameters, as well as environmental conditions such as noise and vibration.

Furthermore, it also includes a communication interface module for communicating with the mobile phone mainboard, sending test instructions and receiving test results.

Furthermore, it also includes an automated test process control module for setting and adjusting test parameters, executing automated test processes, and automatically switching test modes and test items.

Furthermore, it also includes a fault diagnosis module for diagnosing and locating the fault of the mainboard according to the test results and abnormal information.

Furthermore, it also includes a remote control module for realizing remote monitoring and control, and can remotely access the test equipment through the network for remote operation and management.

Furthermore, the data analyzes the parameters and power consumption of the mobile phone motherboard and performs scoring using a weighted algorithm.

Further, after the step of analyzing the parameters and power consumption of the mobile phone motherboard and performing weighted algorithm scoring,

Several mobile phone motherboards tested are registered according to the weighted algorithm scores to determine the average yield rate.

Furthermore, the comprehensive production situation of the mobile phone motherboard and the reasons for the high defective rate are judged based on the average yield rate.

The present application provides a mobile phone motherboard testing device and system thereof, which has the following beneficial effects:

Introduce automated testing equipment and tools to replace manual operations for interface and functional testing; automated testing can reduce the impact of human factors and improve test accuracy and consistency; by writing test scripts, the sensing degree and function of each interface, sensing element, and different external environments can be quickly and accurately evaluated;

Establish a simulation environment to simulate various external environmental conditions, such as temperature, humidity, vibration, etc. By using environmental simulation equipment, the sensing degree and function in different environments can be tested; simulated environment testing can provide more realistic and controllable environmental conditions and reduce the impact of human factors on test results;

Regularly calibrate and calibrate the test equipment to ensure its accuracy and consistency; calibration and calibrating can improve the reliability of test results and reduce measurement errors;

Based on the test results and analysis, timely feedback is given to designers and engineers, and suggestions for improvement are made; through continuous feedback and improvement, the design of interfaces and functions can be optimized, and the test accuracy and reliability can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a flow chart of an embodiment of a testing device and system for a mobile phone motherboard of the present application.

The implementation, functional features and advantages of the present application will be further described in conjunction with embodiments and with reference to the accompanying drawings.

Detailed ways

It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

It should be noted that the terms "include", "comprises" and "have" and any variations thereof in the specification and claims of the present application and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices. In the claims, specification and drawings of the present application, relational terms such as "first" and "second" are merely used to distinguish one entity/operation/object from another entity/operation/object, and do not necessarily require or imply any such actual relationship or order between these entities/operations/objects.

Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

Refer to Figure 1, which is a flow chart of a mobile phone motherboard testing device and its system in one embodiment of the present application;

Embodiment 1

A test device for a mobile phone motherboard and a system thereof, wherein the mobile phone motherboard is tested by the test device, and the test device comprises:

Test instruments, including oscilloscopes, signal sources, power supplies, etc., are used to test various electrical parameters and signal waveforms of the motherboard;

The test fixture is used to fix and connect the mobile phone mainboard, connect the mainboard to the test instrument, and provide a test interface.

A testing device for a mobile phone motherboard and a system thereof, the system comprising:

The control module is used to control the test instrument and execute the test process. The test software has an automated test function and can perform comprehensive functional and performance tests on the motherboard.

Data acquisition module, used to obtain various data generated during the test, including electrical parameters, signal waveforms, fault codes, data acquisition modules include but are not limited to data acquisition cards, sensors, etc.;

Data storage module, used to store test data and test results for subsequent analysis and backtracking. The data storage module includes but is not limited to database, file system or cloud storage;

Data analysis module, used to analyze and process test data and extract key indicators and conclusions. The data analysis module includes but is not limited to statistical analysis, trend analysis, anomaly detection, etc.;

Power module, providing power supply for testing;

The environmental monitoring module is used to monitor the temperature, humidity, air pressure and other parameters of the test environment, as well as environmental conditions such as noise and vibration.

In this embodiment, a communication interface module is also included, which is used to communicate with the mobile phone mainboard, send test instructions and receive test results.

specific,

Determine the communication protocol used between the communication interface module and the mobile phone motherboard, such as UART, SPI, I2C, etc.; ensure that the selected communication protocol is compatible with the hardware interface of the mobile phone motherboard and meets the requirements of data transmission;

Define a set of test-related instructions, including starting the test, stopping the test, and obtaining the test results. Ensure that the format and content of the instructions are clear and unambiguous to facilitate programming of the communication interface module and parsing of the mobile phone motherboard.

An error handling mechanism is implemented in the communication interface module, including detection of communication errors, data verification errors, etc. When an error occurs, the communication interface module can handle the error in a timely manner to ensure the reliability and stability of communication.

In this embodiment, an automated test process control module is also included, which is used to set and adjust test parameters, execute automated test processes, and automatically switch test modes and test items.

specific,

Test mode: select single test mode, which will perform photo taking, video recording and face recognition tests in sequence;

Test item, select front camera;

Test parameters: set the photo resolution to 8 MP, the video recording resolution to 1080p, and the face recognition threshold to 0.7;

Data simulation,

Initialization: the automated test process control module establishes a communication connection with the communication interface module of the mobile phone motherboard and performs initialization settings;

Set the test parameters, set the test mode to single test, the test item to front camera, and the test parameter to photo resolution of 8 MP;

Execute the photo test. The automated test process control module sends a photo command to the mobile phone mainboard, requesting it to take a photo. After receiving the command, the mobile phone mainboard calls the front camera to take a photo and returns the photo data.

Record the test results. The automated test process control module receives the captured photo data and records and stores it. The recorded data may include evaluation indicators such as the resolution and clarity of the photo.

Set the test parameters and set the video recording resolution to 1080p;

Execute the video recording test. The automated test process control module sends a video recording instruction to the mobile phone mainboard, requesting to record a video. After receiving the instruction, the mobile phone mainboard calls the front camera to start recording the video and returns the recorded video data.

Record the test results. The automated test process control module receives the recorded video data and records and stores it. The recorded data may include evaluation indicators such as the resolution and frame rate of the video.

Set the test parameters and set the face recognition threshold to 0.7;

Execute the face recognition test. The automated test process control module sends a face recognition command to the mobile phone motherboard, requesting face recognition. After receiving the command, the mobile phone motherboard calls the front camera to perform face recognition and returns the recognition result.

Record the test results. The automated test process control module receives the face recognition results and records and stores them. The recorded data may include evaluation indicators such as face recognition accuracy and recognition time.

In this embodiment, a fault diagnosis module is also included, which is used to diagnose and locate the fault of the mainboard according to the test results and abnormal information.

specific,

Scenario description: The motherboard of a smartphone is being tested, including the processor, memory, and communication module. The test requirements include performance testing, stability testing, and communication function testing. The fault diagnosis module diagnoses and locates the fault of the motherboard based on the test results and abnormal information.

Digital simulation:

Initialization: The fault diagnosis module establishes a communication connection with the automated test process control module and performs initialization settings;

Execute test process: The automated test process control module executes performance test, stability test and communication function test, and generates test results and abnormal information;

Receiving test results and exception information: The fault diagnosis module receives the test results and exception information transmitted from the automated test process control module;

Analyze test results and abnormal information: The fault diagnosis module analyzes test results and abnormal information, and determines whether there is a motherboard fault based on preset fault diagnosis rules and algorithms;

Fault diagnosis and location: If there is a motherboard fault, the fault diagnosis module will provide location suggestions based on the test results and abnormal information, indicating the possible cause and location of the fault; for example, the performance test shows that the processor performance is abnormal, the stability test has a power-off restart abnormality, and the communication function test cannot connect to the network. These may all be manifestations of a motherboard fault;

Output fault report: The fault diagnosis module generates a fault report based on the diagnosis and positioning results; the fault report includes relevant information of the motherboard fault, positioning suggestions and possible solutions;

precise data:

Performance test results: The processor performance test score was 80, lower than the expected 90 points;

Stability test results: Under high load conditions, the phone's motherboard experienced an abnormal power outage and restart;

Communication function test results: The mobile phone motherboard cannot connect to the wireless network normally;

Fault diagnosis and location results:

According to the performance test results, the fault diagnosis module determines that there may be a processor module fault;

Based on the stability test results, the fault diagnosis module indicates that there may be a power management module fault;

According to the communication function test results, the fault diagnosis module infers that the wireless communication module may be faulty;

Fault report: Based on the analysis of the test results and abnormal information, the fault diagnosis module generates the following fault report:

Mainboard fault information: The processor module, power management module and wireless communication module are faulty;

Positioning suggestion: It is recommended to check the processor module, power management module and wireless communication module to determine the specific cause and location of the fault;

solution:

For processor module failure: it is recommended to replace the processor or repair the processor module;

For power management module failure: it is recommended to check the connection and power supply of the power management module, or replace the power management module;

For wireless communication module failure: It is recommended to check the connection and settings of the wireless communication module, or replace the wireless communication module.

In this embodiment, a remote control module is also included to implement remote monitoring and control, and the test equipment can be remotely accessed through the network for remote operation and management.

In this embodiment, the data is analyzed based on the parameters and power consumption of the mobile phone motherboard, and a weighted algorithm is used to score the data.

After the steps of analyzing the parameters and power consumption of the mobile phone motherboard and scoring by weighted algorithm,

Several mobile phone motherboards tested are registered according to the weighted algorithm scores to determine the average yield rate.

The comprehensive production situation of mobile phone motherboards and the reasons for the high defective rate are judged based on the average yield rate.

specific,

Scenario description: After testing the mobile phone motherboard, we use a weighted algorithm to score the parameters and power consumption data of the mobile phone motherboard to evaluate the quality and performance of the mobile phone motherboard; based on the scoring results, we register several tested mobile phone motherboards and calculate the average yield rate; based on the average yield rate, we can judge the comprehensive production situation of the mobile phone motherboard and deeply analyze the reasons for the high defective rate;

Mobile phone motherboard parameter data:

- Processor model: A12

Memory capacity: 64GB

Communication module: 4G LTE

Screen resolution: 1080 x 2340

Camera pixels: 12MP + 16MP

Battery capacity: 4000mAh

Mobile phone motherboard power consumption data:

Standby power consumption: 100mA

Talk power consumption: 500mA

Game running power consumption: 1000mA

Weighted algorithm scoring:

Processor performance weight: 40%

Memory capacity weight: 20%

Communication module weight: 15%

Screen resolution weight: 10%

Camera pixel weight: 10%

Battery capacity weight: 5%

Register the mobile phone motherboard and score results:

Motherboard 1: A12 processor, 64GB memory, 4G LTE communication module, 1080 x 2340 screen resolution, 12MP + 16MP camera, 4000mAh battery; Rating: 85 points

Motherboard 2: A11 processor, 128GB memory, 4G LTE communication module, 1440 x 2960 screen resolution, 16MP + 20MP camera, 3500mAh battery; Rating: 78 points

Motherboard 3: A12 processor, 32GB memory, 5G communication module, 1080 x 2340 screen resolution, 12MP + 16MP camera, 3500mAh battery; Rating: 82 points

Average yield calculation:

Total number of tested motherboards: 3

Number of good motherboards: 2

Average yield rate: 2/3 = 66.67%

Judging the comprehensive production situation and the reasons for the high defective rate based on the average yield rate:

In this embodiment, the average yield rate is 66.67%, which means that 1/3 of the produced mobile phone motherboards are defective;

The high defect rate may be due to specific faults or defective components, such as unstable processor performance, unqualified memory capacity test, communication module connection problems, abnormal screen resolution display, substandard camera pixels, insufficient battery capacity, etc.

To further analyze the reasons for the high defect rate, it may be necessary to perform more detailed fault diagnosis and location on each defective motherboard to determine the specific cause and location of the fault; for example, the processor module, memory module, communication module, display module, camera module and power module may be tested through the fault diagnosis module to determine which module or component is faulty;

Through further analysis of defective motherboards, we can determine the specific production links or process problems, and then take corresponding improvement measures to improve the production quality of mobile phone motherboards and reduce the defect rate;

in,

Bad motherboard data:

Motherboard 1: The processor performance is unstable, the memory capacity test fails, there is a problem with the communication module connection, the screen resolution is abnormal, the camera pixel does not meet the standard, and the battery capacity is insufficient;

Motherboard 2: The processor performance is unstable, the memory capacity test fails, there is a problem with the communication module connection, and the camera pixel does not meet the standard;

Mainboard 3: There is a problem with the communication module connection, the screen resolution is abnormal, and the battery capacity is insufficient;

Motherboard 4: The processor performance is unstable, the memory capacity test fails, there is a problem with the communication module connection, and the screen resolution display is abnormal;

Analysis of bad motherboard:

Further analysis of the faulty motherboard through the fault diagnosis module leads to the following conclusions:

The processor modules of Mainboard 1 and Mainboard 2 are faulty, causing unstable performance;

The memory modules of motherboard 1 and motherboard 4 failed the test;

There is a connection problem with the communication modules of Mainboard 1, Mainboard 3 and Mainboard 4;

The screen resolution of motherboard 1, motherboard 3 and motherboard 4 is abnormal;

The camera pixels of Mainboard 1 and Mainboard 2 do not meet the standards;

The battery capacity of Mainboard 1, Mainboard 3 and Mainboard 4 is insufficient;

improvement measures:

According to the analysis results of defective motherboards, the following improvement measures are formulated to improve the production quality of mobile phone motherboards and reduce the defective rate:

Processor module: Optimize production process to ensure the stability and performance of processor modules meet standards;

Memory modules: Strengthen quality control and improve the test accuracy and reliability of memory modules;

Communication module: Improve the connection process to ensure good connection between the communication module and other components;

Screen resolution: Optimize display technology to improve the stability and accuracy of screen resolution;

Camera module: Strengthen the inspection and calibration process to ensure that the camera pixels meet the requirements;

Battery modules: Strengthen battery supply chain management to ensure battery capacity meets specification requirements;

Improvement effect evaluation:

After a period of improvement measures were implemented, the mobile phone motherboards were produced and tested again;

Test and analyze the improved motherboard and calculate the average yield rate;

Compare the average yield rate before and after improvement to evaluate the effectiveness of the improvement measures and the degree of improvement in production quality.

Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

The present invention is described with reference to the flowcharts and/or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present invention. It should be understood that each process and/or box in the flowchart and/or block diagram, as well as the combination of the processes and/or boxes in the flowchart and/or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device produce a device for implementing the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device that implements the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.

These computer program instructions may also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, whereby the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more processes in the flowchart and/or one or more boxes in the block diagram.

Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims (9)

1. The utility model provides a test equipment and system of mobile phone motherboard, mobile phone motherboard is tested by test equipment, its characterized in that, test equipment includes:

The testing instrument comprises an oscilloscope, a signal source, a power supply and the like and is used for testing various electrical parameters and signal waveforms of the main board;

The test fixture is used for fixing and connecting the mobile phone motherboard, connecting the motherboard with the test instrument and providing a test interface.

2. The utility model provides a test equipment and system of mobile phone motherboard which characterized in that, the system includes:

the control module is used for controlling the test instrument and executing the test flow, and the test software has an automatic test function and can perform comprehensive functional test and performance test on the main board;

The data acquisition module is used for acquiring various data generated in the test process, including electrical parameters, signal waveforms and fault codes, and comprises a data acquisition card, a sensor and the like;

the data storage module is used for storing test data and test results for subsequent analysis and backtracking, and comprises a database, a file system, cloud storage or other forms;

The data analysis module is used for analyzing and processing the test data, extracting key indexes and conclusions, and comprises but is not limited to statistical analysis, trend analysis, anomaly detection and the like;

the power module is used for providing power supply for the test;

The environment monitoring module is used for monitoring parameters such as temperature, humidity, air pressure and the like of the test environment and environmental conditions such as noise, vibration and the like.

3. The device and system according to claim 2, further comprising a communication interface module for communicating with the mobile phone motherboard, sending a test command, and receiving a test result.

4. The device and system according to claim 2, further comprising an automated test flow control module for setting and adjusting test parameters, performing an automated test flow, and automatically switching test modes and test items.

5. The test device and system for a mobile phone motherboard according to claim 2, further comprising a fault diagnosis module for diagnosing and locating a fault of the motherboard according to the test result and the abnormality information.

6. The test device and system of the mobile phone motherboard of claim 2, further comprising a remote control module for implementing remote monitoring and control, wherein the test device can be accessed remotely through a network for remote operation and management.

7. The device and system for testing a mobile phone motherboard according to claim 2, wherein the data analyzes parameters and power consumption of the mobile phone motherboard, and performs weighting algorithm scoring.

8. The device and system for testing a motherboard of a mobile phone according to claim 7, wherein after the step of analyzing the motherboard parameters and power consumption of the mobile phone and scoring the weight algorithm,

Registering the tested mobile phone mainboards according to the weight algorithm scoring, and judging the average yield.

9. The test device and system for a mobile phone motherboard according to claim 8, wherein the reason for the high yield and the comprehensive production condition of the mobile phone motherboard are determined according to the average yield.