CN118348029A - Surface defect detection method and device for light-emitting chip - Google Patents
Surface defect detection method and device for light-emitting chip Download PDFInfo
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8874—Taking dimensions of defect into account
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- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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Abstract
The embodiment of the application provides a surface defect detection method of a light-emitting chip, and belongs to the technical field of computers. The method comprises the following steps: providing a light-emitting chip to be tested; cleaning the surface of the light-emitting chip to be tested by using ultrasonic waves and a high-pressure air gun; sequentially irradiating the surface of the light emitting chip to be detected by using at least three different light sources, and respectively capturing image information under various light sources; comparing the image information under the various light sources to obtain a color change area of the surface of the light emitting chip to be detected; and determining an abnormal pattern area on the surface of the light emitting chip to be detected according to the color change area. By applying the technical scheme of the application, the areas with different colors on the light-emitting chip to be detected can be detected and identified, the problem of missing detection is avoided, and in addition, the detection precision and efficiency can be improved.
Description
Technical Field
The present application relates to the field of semiconductor detection technology, and in particular, to a method and apparatus for detecting surface defects of a light emitting chip, an electronic device, and a medium.
Background
In modern industrial production, optical detection techniques and image processing techniques are widely used in the quality control links of products. The surface image information of the product can be obtained by carrying out optical detection on the product, and then the information is analyzed by an image processing technology to judge whether the quality of the product meets the requirement. The method not only can improve the quality of products, but also can greatly improve the production efficiency and reduce the production cost.
In the prior art, a common solution is to use an Automated Optical Inspection (AOI) system to inspect the product. The AOI system can shoot the product through a camera, and then analyze the shot image through a computer vision technology to judge whether the product has defects. However, this method has some problems in practical application. For example, when the surface abnormal items of the to-be-detected piece are diversified, the abnormal pattern area on the surface is smaller or the color is lighter, all the abnormal detection cannot be reduced under the condition that the AOI system adopts the same light source, so that the condition of missed detection occurs. This is because in this case, the camera of the AOI system may not be able to capture these abnormal pattern areas, or even if it is able to capture them, it is not possible to accurately analyze them by computer vision techniques.
Disclosure of Invention
The application provides a method, a device, electronic equipment and a medium for detecting surface defects of a light-emitting chip, and aims to solve the problems.
In a first aspect, the present application provides a method for detecting a surface defect of a light emitting chip, the method comprising: providing a light-emitting chip to be tested; cleaning the surface of the light-emitting chip to be tested by using ultrasonic waves and a high-pressure air gun; sequentially irradiating the surface of the light emitting chip to be detected by using at least three different light sources, and respectively capturing image information under various light sources; comparing the image information under the various light sources to obtain a color change area of the surface of the light emitting chip to be detected; and determining an abnormal pattern area on the surface of the light emitting chip to be detected according to the color change area.
In one embodiment, further comprising: the anomalous pattern region is further scanned using a laser sensor to determine the shape, size, and depth of the anomalous defect.
In one embodiment, the step of determining the abnormal pattern area of the surface of the light emitting chip to be measured according to the color change area includes: identifying the color change region through a pre-trained neural network model to anomaly a graphic region; the neural network model is configured to: the discontinuous portion in the color change region is defined as an abnormal pattern region, and the continuous portion in the color change region is defined as a normal pattern region.
In one embodiment, the step of comparing the image information under the various light sources to obtain the color change area of the surface of the light emitting chip to be measured includes: projecting and splicing the image information under various light sources to obtain a fusion spliced image; extracting features of the fusion spliced images to generate corresponding feature images to be predicted; and determining a color change area of the surface of the light emitting chip to be detected based on the feature map to be predicted.
In one embodiment, the step of projecting and stitching the image information under the various light sources to obtain a fused stitched image includes: and (3) projecting and splicing the image information under various light sources by adopting a weighted average method to obtain a fusion spliced image.
In one embodiment, further comprising: acquiring position coordinates associated with the abnormal graphic area;
Acquiring a positioning instruction sent out based on the abnormal graphic area, and determining the position coordinates of a target abnormal area pointed by the positioning instruction; and controlling a target detection device to be aligned with the target abnormal region according to the position coordinates of the target abnormal region so as to carry out the repeated judgment detection.
In one embodiment, the resolution of the object detection device is higher than the resolution of the detection device used to capture image information under the various light sources.
In a second aspect, the present application provides a surface defect detection device for a light emitting chip, the device comprising: the providing unit is used for providing a light-emitting chip to be tested; the cleaning unit is used for cleaning the surface of the light-emitting chip to be tested by using ultrasonic waves and a high-pressure air gun; the illumination unit is configured to sequentially illuminate the surface of the light emitting chip to be detected by using at least three different light sources and respectively capture image information under various light sources; the comparison unit is used for comparing the image information under the various light sources to obtain a color change area of the surface of the light-emitting chip to be detected; and an abnormal pattern area determining unit for determining an abnormal pattern area of the surface of the light emitting chip to be detected according to the color change area.
According to the surface defect detection method, device, electronic equipment and medium for the light emitting chip, disclosed by the application, the surface of the light emitting chip is cleaned before detection, then RGB different light sources are respectively tested on the surface of the same light emitting chip, and the results of three lights are integrated and output, so that a tiny abnormal pattern area or an abnormal pattern area with lighter color on the surface of the light emitting chip can be more accurately and effectively detected, the detection precision is greatly improved, and the detection omission condition is reduced. 2. The problem of surface defect omission of light emitting chip is solved: according to the technical scheme, different abnormal pattern areas in different areas of the core particle are effectively measured, the trouble of missing detection of surface defects of the light-emitting chip is solved, and the quality control of the light-emitting chip is more reliable. 3. The production efficiency is improved: due to the technical scheme, the defects of the light emitting chip can be detected more accurately, so that the problems can be found and processed in time in the production process, defective products caused by missing detection are prevented from flowing into the market, the production efficiency is improved, and the production cost is reduced. 4. Optimizing an image processing technology: according to the technical scheme, the RGB different light sources of the product are tested, so that the data sources of image processing are enriched, the image processing technology is optimized, and the accuracy and the efficiency of the image processing are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to a first embodiment of the present application;
Fig. 2 is a flowchart of a method for detecting surface defects of a light emitting chip according to a second embodiment of the present application;
fig. 3 is a schematic functional block diagram of a surface defect detecting device of a light emitting chip according to a third embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
First embodiment: fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application, and in the present application, an electronic device 100 that is an example of a method, an apparatus, an electronic device, and a medium for detecting a surface defect of a light emitting chip according to an embodiment of the present application may be described by using the schematic structural diagram shown in fig. 1.
As shown in fig. 1, an electronic device 100 includes one or more processors 102, one or more storage devices 104, an input device 106, and an output device 108, which are interconnected by a bus system and/or other forms of connection mechanisms (not shown). It should be noted that the components and structures of the electronic device 100 shown in fig. 1 are exemplary only and not limiting, and that the electronic device may have some of the components shown in fig. 1 or may have other components and structures not shown in fig. 1, as desired.
The processor 102 may be a Central Processing Unit (CPU) or other form of processing unit having data processing and/or instruction execution capabilities, and may control other components in the electronic device 100 to perform desired functions.
It should be appreciated that the processor 102 in embodiments of the present application may be a central processing unit (central processing unit, CPU), which may also be other general purpose processors, digital signal processors (DIGITAL SIGNAL processors, DSPs), application Specific Integrated Circuits (ASICs), off-the-shelf programmable gate arrays (field programmable GATE ARRAY, FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The storage 104 may include one or more computer program products, which may include various forms of computer-readable storage media.
It should be appreciated that the storage device 104 in embodiments of the present application may be either volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. The nonvolatile memory may be a read-only memory (ROM), a Programmable ROM (PROM), an erasable programmable ROM (erasable PROM), an electrically erasable programmable EPROM (EEPROM), or a flash memory. The volatile memory may be random access memory (random access memory, RAM) which acts as external cache memory. By way of example, and not limitation, many forms of random access memory (random access memory, RAM) are available, such as static random access memory (STATIC RAM, SRAM), dynamic Random Access Memory (DRAM), synchronous Dynamic Random Access Memory (SDRAM), double data rate synchronous dynamic random access memory (double DATA RATE SDRAM, DDR SDRAM), enhanced synchronous dynamic random access memory (ENHANCED SDRAM, ESDRAM), synchronous link dynamic random access memory (SYNCHLINK DRAM, SLDRAM), and direct memory bus random access memory (direct rambus RAM, DR RAM).
Wherein one or more computer program instructions may be stored on the computer readable storage medium, the processor 102 may execute the program instructions to implement client functions and/or other desired functions in embodiments of the present application as described below (implemented by the processor). Various applications and various data, such as various data used and/or generated by the applications, may also be stored in the computer readable storage medium.
The input device 106 may be a device used by a user to input instructions and may include one or more of a keyboard, mouse, microphone, touch screen, and the like.
Second embodiment: referring to a flowchart of a method for detecting surface defects of a light emitting chip shown in fig. 2, the method specifically includes the following steps:
step S100, providing a light emitting chip to be tested;
step S200, cleaning the surface of the light emitting chip to be tested by using ultrasonic waves and a high-pressure air gun;
Step S300, sequentially irradiating the surface of the light emitting chip to be detected by using at least three different light sources, and respectively capturing image information under various light sources;
Step S400, comparing the image information under the various light sources to obtain a color change area of the surface of the light emitting chip to be detected; and
And S500, determining an abnormal pattern area on the surface of the light emitting chip to be detected according to the color change area.
The surface defect detection method of the light-emitting chip has at least the following technical effects: 1. and the detection precision is improved: according to the technical scheme, the surface of the light emitting chip is cleaned before detection, then RGB different light sources are respectively tested on the surface of the same light emitting chip, and the results of three lights are output after being integrated, so that the tiny abnormal pattern area or the abnormal pattern area with lighter color on the surface of the light emitting chip can be more accurately and effectively detected, the detection precision is greatly improved, and the detection omission condition is reduced. 2. The problem of surface defect omission of light emitting chip is solved: according to the technical scheme, different abnormal pattern areas in different areas of the core particle are effectively measured, the trouble of missing detection of surface defects of the light-emitting chip is solved, and the quality control of the light-emitting chip is more reliable. 3. The production efficiency is improved: due to the technical scheme, the defects of the light emitting chip can be detected more accurately, so that the problems can be found and processed in time in the production process, defective products caused by missing detection are prevented from flowing into the market, the production efficiency is improved, and the production cost is reduced. 4. Optimizing an image processing technology: according to the technical scheme, the RGB different light sources of the product are tested, so that the data sources of image processing are enriched, the image processing technology is optimized, and the accuracy and the efficiency of the image processing are improved.
In one embodiment, before the light emitting chip to be tested is irradiated, the light emitting chip to be tested may be further placed in a cleaning machine and cleaned with ultrasonic waves for 10 minutes to remove impurities and dust on the surface. Then, the surface of the light emitting chip was purged using an air compressor and a nozzle, the pressure of the air compressor was set to 0.6MPa, the diameter of the nozzle was 1mm, and the purge time was 5 minutes to remove impurities and dust from the surface.
In one embodiment, the at least three different light sources include red, green and blue LED light sources with wavelengths of 622nm, 528nm and 467nm, respectively. Meanwhile, the intensity of each light source was set to 1mW/cm, and the irradiation time was 2 minutes. A scanner with a resolution of 5000dpi was then used, which could complete a scan of an object with an area of 1 square meter in 1 minute. In the scanning process, the light source brightness of the scanner is set to 80%, the scanning speed is set to a medium speed, the shooting distance is 50cm, and the shooting time is 1 second, so that a high-definition image of the chip surface is obtained.
In one embodiment, the light emitting chip to be tested includes a printed circuit board or a light emitting device. The printed circuit board may be a hard printed circuit board or a flexible printed circuit board. The light emitting device may be a light emitting diode or an organic light emitting diode. For convenience of description, the embodiment takes the light emitting chip to be tested as the light emitting diode for illustration.
In one embodiment, the step of determining the abnormal pattern area of the surface of the light emitting chip to be measured according to the color change area includes:
identifying the color change region through a pre-trained neural network model to anomaly graph region results; the neural network model is configured to: the discontinuous portion in the color change region is defined as an abnormal pattern region, and the continuous portion in the color change region is defined as a normal pattern.
In this embodiment, we can use open source image processing software OpenCV, which has powerful image processing capability and efficient operation speed. Then, a deep learning framework TensorFlow is used, which has strong model training capabilities and excellent predictive performance. By means of a large amount of training data, a neural network model capable of automatically identifying abnormal graphic areas can be trained.
In one embodiment, the step of comparing the image information under the various light sources to obtain the color change area of the surface of the light emitting chip to be measured includes: projecting and splicing the image information under various light sources to obtain a fusion spliced image; extracting features of the fusion spliced images to generate corresponding feature images to be predicted;
and determining a color change area of the surface of the light emitting chip to be detected based on the feature map to be predicted.
Specifically, before the fusion processing, each image can be converted into a gray level image, then the photographed images are fused by using special image processing software, and a weighted average method is adopted in a fusion algorithm, wherein the weight coefficients are respectively 0.3, 0.4 and 0.3, so that the recognition accuracy of the surface defects is improved. By the method, the detection efficiency and accuracy of the surface defects of the light-emitting chip can be effectively improved, and the detection cost can be reduced.
In one embodiment, the method further comprises: acquiring position coordinates associated with the abnormal graphic area; acquiring a positioning instruction sent out based on the abnormal graphic area, and determining the position coordinates of a target abnormal area pointed by the positioning instruction; and controlling a target detection device to be aligned with the target abnormal region according to the position coordinates of the target abnormal region so as to carry out the repeated judgment detection.
In this embodiment, the abnormal pattern region may be a region in which an abnormality is detected optically, such as a dark spot region, a bright spot region, a chromaticity abnormality region, or a light color, or may be a region in which an abnormality is detected visually, such as a core-missing region. The abnormal pattern region may be marked with a character, a pattern, or the like, and is not limited thereto. In some examples, the position distribution of each abnormal region indicated in the abnormal graphic region corresponds to an actual position relationship. In the abnormal pattern region, the indication position of each abnormal region may be the same as the actual position, or may not strictly correspond to the actual position, and only the relative positional relationship may be reflected.
For different anomalies, respectively forming an anomaly pattern area, for example, after obtaining an optical detection result, forming a corresponding optical anomaly pattern area, wherein the areas such as brightness anomalies and chromaticity anomalies are marked; after the appearance detection result is obtained, a corresponding appearance abnormal pattern area is formed, wherein areas such as a missing chip, a light emitting diode with a defect and the like are marked.
In this embodiment, the subsequent re-judging detection may be performed based on the previously formed abnormal pattern region, for example, in some embodiments, according to the indication of the dark point region in the abnormal pattern region, the position coordinates of the dark point region are determined, and the detection camera in the target detection device is controlled to align with the dark point region so as to perform the core-missing re-judging.
Further, the resolution of the object detection device is higher than the resolution of the detection device for capturing image information under various light sources. In this embodiment, the target detection device may be a 12000dpi digital camera, and the camera may complete the secondary photographing confirmation of an abnormal graphic area within 1 minute, so as to achieve more accurate defect identification and re-judgment.
Furthermore, in the process of secondary photographing confirmation, the abnormal graph area can be identified by using the deep learning model. In this embodiment, a computer vision system equipped with a deep learning algorithm that can accurately identify abnormal graphic areas during the secondary photographing confirmation process can be used. Finally, the identified abnormal pattern area is further analyzed and processed by the identification method to determine whether the abnormal pattern area really has the abnormality and the type and degree of the abnormality.
In one embodiment, after the abnormal pattern areas are determined, the areas may be further scanned using a laser sensor. The scanning precision of the laser sensor can reach 0.01mm, and the shape, size and depth of the abnormal pattern area can be accurately detected. By the method, the accuracy and the speed of detecting the surface defects of the light-emitting chip can be effectively improved, and the requirement of a high-speed production line is met.
In an embodiment, the threshold of the fused image may also be adjusted so that it can more sensitively detect small abnormal pattern areas.
Third embodiment: referring to fig. 3, there is shown a surface defect detecting apparatus of a light emitting chip, the apparatus comprising: a providing unit 10 for providing a light emitting chip to be tested; a cleaning unit 20 for cleaning the surface of the light emitting chip to be tested using ultrasonic waves and a high-pressure air gun; an illumination unit 30 configured to sequentially illuminate the surface of the light emitting chip to be tested using at least three different light sources, and to capture image information under the various light sources, respectively; a comparing unit 40, configured to compare the image information under the various light sources to obtain a color change area of the surface of the light emitting chip to be tested; and an abnormal pattern area determining unit 50 for determining an abnormal pattern area of the surface of the light emitting chip to be measured according to the color change area.
Further, the present embodiment also provides a computer readable storage medium, on which a computer program is stored, which when executed by a processing device performs the steps of any of the data processing methods provided in the second embodiment.
The embodiment of the application provides a method, a device and a system for detecting surface defects of a light emitting chip, which comprises a computer readable storage medium storing a program code, wherein the program code comprises instructions for executing the method described in the previous method embodiment, and specific implementation can be referred to the method embodiment and will not be repeated herein.
The method and the device for detecting the surface defects of the light-emitting chip, the electronic equipment and the medium provided by the application have at least the following technical effects: 1. and the detection precision is improved: according to the technical scheme, the surface of the light emitting chip is cleaned before detection, then RGB different light sources are respectively tested on the surface of the same light emitting chip, and the results of three lights are output after being integrated, so that the tiny abnormal pattern area or the abnormal pattern area with lighter color on the surface of the light emitting chip can be more accurately and effectively detected, the detection precision is greatly improved, and the detection omission condition is reduced. 2. The problem of surface defect omission of light emitting chip is solved: according to the technical scheme, different abnormal pattern areas in different areas of the core particle are effectively measured, the trouble of missing detection of surface defects of the light-emitting chip is solved, and the quality control of the light-emitting chip is more reliable. 3. The production efficiency is improved: due to the technical scheme, the defects of the light emitting chip can be detected more accurately, so that the problems can be found and processed in time in the production process, defective products caused by missing detection are prevented from flowing into the market, the production efficiency is improved, and the production cost is reduced. 4. Optimizing an image processing technology: according to the technical scheme, the RGB different light sources of the product are tested, so that the data sources of image processing are enriched, the image processing technology is optimized, and the accuracy and the efficiency of the image processing are improved.
Due to the advancement of the technical scheme, the method can be widely applied to the application fields of optical detection technology, image processing technology, product manufacturing quality control and the like. Firstly, the technical scheme can more comprehensively acquire the surface image information of the product by testing RGB different light sources of the same product, thereby improving the accuracy of optical detection. Secondly, the technical scheme can more effectively analyze the tiny abnormal pattern area or the abnormal pattern area with lighter color on the surface of the product by integrating the results of the three lights, thereby solving the problem of missed detection of the existing detection system. In addition, the technical scheme can also improve the quality control efficiency of the product and reduce the production cost, thereby improving the market competitiveness of the product. Therefore, the technical scheme has wide application prospect in the future product manufacturing quality control.
It should be noted that the foregoing embodiments may be implemented in whole or in part by software, hardware (such as a circuit), firmware, or any other combination. When implemented in software, the above-described embodiments may be implemented in whole or in part in the form of a computer program product. The computer program product comprises one or more computer instructions or computer programs. When the computer instructions or computer program are loaded or executed on a computer, the processes or functions described in accordance with embodiments of the present application are produced in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from one website site, computer, server, or data center to another website site, computer, server, or data center by wired (e.g., infrared, wireless, microwave, etc.). The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that contains one or more sets of available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium. The semiconductor medium may be a solid state disk.
It should be understood that the term "and/or" is merely an association relationship describing the associated object, and means that three relationships may exist, for example, a and/or B may mean: there are three cases, a alone, a and B together, and B alone, wherein a, B may be singular or plural. In addition, the character "/" herein generally indicates that the associated object is an "or" relationship, but may also indicate an "and/or" relationship, and may be understood by referring to the context.
It should be understood that, in various embodiments of the present application, the sequence numbers of the foregoing processes do not mean the order of execution, and the order of execution of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present application.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.
In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Claims (10)
1. A method for detecting surface defects of a light emitting chip, the method comprising:
providing a light-emitting chip to be tested;
Cleaning the surface of the light-emitting chip to be tested by using ultrasonic waves and a high-pressure air gun;
sequentially irradiating the surface of the light emitting chip to be detected by using at least three different light sources, and respectively capturing image information under various light sources;
comparing the image information under the various light sources to obtain a color change area of the surface of the light emitting chip to be detected; and
And determining an abnormal pattern area on the surface of the light emitting chip to be detected according to the color change area.
2. The method as recited in claim 1, further comprising:
The anomalous pattern region is further scanned using a laser sensor to determine the shape, size, and depth of the anomalous defect.
3. The method according to claim 1, wherein the step of determining an abnormal pattern area of the surface of the light emitting chip to be measured from the color change area comprises:
Identifying the color change region through a pre-trained neural network model to anomaly a graphic region; the neural network model is configured to: the discontinuous portion in the color change region is defined as an abnormal pattern region, and the continuous portion in the color change region is defined as a normal pattern region.
4. The method of claim 1, wherein the step of comparing the image information under the various light sources to obtain the color change region of the surface of the light emitting chip to be measured comprises:
projecting and splicing the image information under various light sources to obtain a fusion spliced image;
Extracting features of the fusion spliced images to generate corresponding feature images to be predicted;
and determining a color change area of the surface of the light emitting chip to be detected based on the feature map to be predicted.
5. The method of claim 4, wherein the step of projecting and stitching the image information under the various light sources to obtain a fused stitched image comprises:
And (3) projecting and splicing the image information under various light sources by adopting a weighted average method to obtain a fusion spliced image.
6. The method as recited in claim 1, further comprising:
Acquiring position coordinates associated with the abnormal graphic area;
acquiring a positioning instruction sent out based on the abnormal graphic area, and determining the position coordinates of a target abnormal area pointed by the positioning instruction;
and controlling a target detection device to be aligned with the target abnormal region according to the position coordinates of the target abnormal region so as to carry out the repeated judgment detection.
7. The method of claim 6, wherein the resolution of the object detection device is higher than the resolution of a detection device used to capture image information under various light sources.
8. A surface defect detecting device of a light emitting chip, the device comprising:
The providing unit is used for providing a light-emitting chip to be tested;
the cleaning unit is used for cleaning the surface of the light-emitting chip to be tested by using ultrasonic waves and a high-pressure air gun;
The illumination unit is configured to sequentially illuminate the surface of the light emitting chip to be detected by using at least three different light sources and respectively capture image information under various light sources;
the comparison unit is used for comparing the image information under the various light sources to obtain a color change area of the surface of the light-emitting chip to be detected; and
And the abnormal pattern area determining unit is used for determining an abnormal pattern area of the surface of the light emitting chip to be detected according to the color change area.
9. An electronic device, comprising:
a memory for storing executable instructions;
a processor for implementing the surface defect detection method of a light emitting chip according to any one of claims 1 to 7 when executing executable instructions stored in the memory.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when run by a processing device, performs the steps of the method for detecting surface defects of a light emitting chip according to any one of claims 1-7.
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| CN202410567745.XA CN118348029A (en) | 2024-05-09 | 2024-05-09 | Surface defect detection method and device for light-emitting chip |
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| CN202410567745.XA CN118348029A (en) | 2024-05-09 | 2024-05-09 | Surface defect detection method and device for light-emitting chip |
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