CN118322114B - Bus preparation method, diamond wire, preparation method of diamond wire and silicon wafer cutting application - Google Patents
Bus preparation method, diamond wire, preparation method of diamond wire and silicon wafer cutting application Download PDFInfo
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- CN118322114B CN118322114B CN202410775995.2A CN202410775995A CN118322114B CN 118322114 B CN118322114 B CN 118322114B CN 202410775995 A CN202410775995 A CN 202410775995A CN 118322114 B CN118322114 B CN 118322114B
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 135
- 239000010432 diamond Substances 0.000 title claims abstract description 135
- 238000002360 preparation method Methods 0.000 title claims abstract description 72
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 238000005520 cutting process Methods 0.000 title claims abstract description 15
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 15
- 239000010703 silicon Substances 0.000 title claims abstract description 15
- 238000009713 electroplating Methods 0.000 claims abstract description 186
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 29
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 29
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims description 45
- 238000000576 coating method Methods 0.000 claims description 38
- 239000011248 coating agent Substances 0.000 claims description 37
- 229910001453 nickel ion Inorganic materials 0.000 claims description 21
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 229910052721 tungsten Inorganic materials 0.000 claims description 17
- 239000010937 tungsten Substances 0.000 claims description 17
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical group [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 21
- 230000000452 restraining effect Effects 0.000 abstract description 2
- 241001131688 Coracias garrulus Species 0.000 description 99
- 239000011247 coating layer Substances 0.000 description 32
- 239000000758 substrate Substances 0.000 description 25
- 239000000463 material Substances 0.000 description 19
- 238000001914 filtration Methods 0.000 description 18
- 239000010935 stainless steel Substances 0.000 description 17
- 229910001220 stainless steel Inorganic materials 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
- 239000002585 base Substances 0.000 description 14
- 229910000531 Co alloy Inorganic materials 0.000 description 9
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 9
- 229910001429 cobalt ion Inorganic materials 0.000 description 9
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- -1 for example Substances 0.000 description 6
- LTOKVQLDQRXAHK-UHFFFAOYSA-N [W].[Ni].[Cu] Chemical compound [W].[Ni].[Cu] LTOKVQLDQRXAHK-UHFFFAOYSA-N 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 229910000677 High-carbon steel Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910001080 W alloy Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000001192 hot extrusion Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/124—Saw chains; rod-like saw blades; saw cables
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mining & Mineral Resources (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention relates to the field of diamond wire and silicon wafer cutting, and provides a bus preparation method, a diamond wire, a preparation method thereof and silicon wafer cutting application aiming at the problem that a thin-diameter diamond wire bus is difficult to prepare. The bus preparation method comprises the following steps: the surface of the roller is provided with a groove encircling the circumference direction of the roller, and only the groove part of the surface of the roller is conductive; the roller is partially immersed in a metal ion solution, the metal is nickel or nickel alloy, the solution is electrified, the roller rotates around the central axis of the roller, the metal is deposited in the groove when the groove is immersed in the solution, the metal deposited in the groove is stripped when the groove leaves the solution, and the elongated bus is obtained by continuous stripping. The bus is directly prepared by an electroplating process with a mould for restraining the wire diameter, so that the long and complicated process is reduced. The diamond wire has a busbar made of nickel alloy with a wire diameter of 4-25 μm, and the nickel alloy busbar is prepared by the method, and the outer side of the busbar is covered with nickel alloy and diamond. The invention also provides a preparation method of the diamond wire and application of the diamond wire in silicon wafer cutting.
Description
Technical Field
The invention relates to the field of diamond wire and silicon wafer cutting, in particular to a bus preparation method, a diamond wire, a preparation method thereof and a silicon wafer cutting application.
Background
Silicon wafer dicing is a critical part in the solar photovoltaic cell fabrication process. Diamond wire saw (diamond wire for short) is commonly used for cutting silicon wafers, and diamond abrasive materials are fixed on a metal wire bus by an electroplating process or a resin bonding method.
The common bus is tungsten wire and high-carbon steel wire, the tungsten wire (tungsten wire) is a filament made by forging and drawing tungsten bar, the purity is up to more than 99.95%, and the diameter is 35-40 μm; the high carbon steel wire (STEEL WIRE) is a filament produced by drawing or cold rolling from a hot rolled wire rod and has a diameter of about 43 μm. The bus bar with the wire diameter below 30 μm is manufactured by the traditional drawing process and needs to undergo the following steps: (1) Mixing metal powder according to the proportion of bus components, and forming a bar by hot extrusion; (2) Carrying out hot extrusion on the alloy bar, wherein the diameter of the extruded alloy bar is 1/5-1/3 of that of the original alloy bar; (3) Performing rotary forging processing for 10-15 times in a high-temperature melting state, wherein the diameter of the rotary forged product is changed to 1/5-1/3 of the original diameter; (4) Performing primary drawing at high temperature for at least 3 times to make the diameter smaller than 0.6 mm; (5) And carrying out fine drawing at least 2 times at different temperatures, wherein each drawing is carried out for 15-30 times. The bus manufacturing process is long and complicated, and is limited by a drawing process, so that the bus with the diameter of less than 20 mu m is difficult to achieve finally.
The fabrication of the busbar into a diamond wire also requires a series of cumbersome steps. For example, patent CN115652382a discloses an electroplated diamond wire and a method for preparing the same, wherein the diamond wire is coated with silicon carbide, a nickel layer, a nickel-iron alloy layer and a nickel layer in sequence from inside to outside; the preparation method comprises the steps of sequentially carrying out alkaline washing, preplating sand, activating treatment, nickel plating, drying and discharging on a bus to obtain the diamond wire; the nickel-iron alloy plating is carried out after the sand pre-plating and before the activation treatment. Moreover, because the bus bar and the plating material have different compositions, when plating is performed on the bus bar, the bonding force of the bus bar and the plating material is not good enough, the phenomenon of fracture and stripping can occur during bending, and the condition of broken wire can easily occur during cutting. The broken wire not only wastes the time of wiring, but also increases the damage to the silicon chip.
There is a need for an ideal solution.
Disclosure of Invention
In order to solve the problem that a diamond wire bus with a small diameter is difficult to prepare, the invention provides a bus preparation method, a diamond wire, a preparation method thereof and a silicon wafer cutting application, and the bus is directly prepared through an electroplating process with a mould for restraining the wire diameter, so that the long and complicated process in the traditional bus preparation process is reduced.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The bus preparation method comprises the following steps: the surface of the roller is provided with a groove encircling the circumference direction of the roller, and only the groove part of the surface of the roller is conductive; the roller is partially immersed in a metal ion solution, the metal is nickel or nickel alloy, the solution is electrified, the current density is 6-40A/dm 2, the roller rotates around the central axis of the roller at the linear speed of 600-20000 m/H, the metal is deposited in the roller when the roller is immersed in the solution, the metal deposited in the roller is stripped when the roller leaves the solution, and the elongated bus with the wire diameter of more than or equal to 4 mu m is obtained by continuous stripping.
The electroplating solution is a solution containing metal ions of nickel or nickel alloy of a bus substrate, and under the action of a direct current power supply, the metal ions in the electroplating solution are reduced into metal in a cathode conductive groove and deposited in the groove. And stripping the bus when the bus deposited in the groove reaches the required thickness. The surface finish and cross-sectional shape and size of the busbar are affected by the internal structure of the groove. The internal dimensions of the grooves, i.e. the dimensions of the resulting busbar, can be made very thin (at least as thin as 4 μm) by controlling the dimensions of the grooves. The shape of the bus bar cross section depends on the shape of the cross section of the groove, so that bus bars of various shapes can be made.
Preferably, a plurality of grooves are arranged on the surface of the roller, and the distance between adjacent grooves is larger than 5 mm.
Preferably, the groove has an internal width of at most 4-25 μm and a depth of at most 4-25 μm; the surface finish of the grooves is 0.05 to 0.8, more preferably 0.12 to 0.5. The smoothness of the surface of the groove affects the smoothness of the surface of the bus bar, on one hand, the smoothness of the bus bar is expected to be large, so the smoothness of the surface of the groove is slightly better, but if the smoothness of the surface of the groove is too large, the deposition generation of the bus bar is not favored, so the smoothness of the groove needs to be controlled within a reasonable range.
Preferably, the roller is a cylinder with a diameter of 500-5000 mm, and is transversely placed in the electroplating solution. The roller is made of stainless steel or titanium.
Preferably, the current density is 10-15A/dm 2; the drum rotates around its own central axis, and the linear speed of the drum surface is 10000-15000 m/H. The current density in the electroplating process directly influences the quality of the bus, the current density is too low, and defects such as holes, bubbles and the like are easy to occur in metal deposition, so that the bus has poor compactness and poor mechanical strength; the current density is improved within the normal current density range, so that a finer coating can be obtained, and the deposition speed can be increased; however, the too high current density can cause the problems of poor surface finish, even cracking, automatic falling of the bus before winding and the like. Therefore, it is necessary to select a suitable current density to obtain a good coating quality. The invention also needs to control the rotating speed of the roller to be matched with the winding of the connecting bus, the rotating speed of the roller is too high, the metal is not deposited, the rotating speed of the roller is too low, and the metal deposition is uneven, so that the proper rotating speed of the roller is regulated and controlled by matching the deposition speed of the metal, and the bus with uniformity and good compactness is obtained.
Preferably, the temperature of the solution is 25-60deg.C and pH is 2.8-5.0. Further preferably at a temperature of 38-40deg.C and a pH of 4.0-4.2.
Preferably, the concentration of nickel ions in the solution is 60-720 g/L, more preferably 100-150 g/L.
Preferably, the nickel alloy is one or more of cobalt, iron, tungsten, zinc, copper and chromium, and the concentration of alloy ions in the electroplating solution is 1-110 g/L, more preferably 5-8 g/L. The quality of the bus bar is also affected by the nature of the plating solution and the salt concentration. Too small a concentration of metal ions can produce loose coatings in shapes such as branches or sponges.
More preferably, the nickel alloy is nickel tungsten or copper alloy, the mass concentration of tungsten in the solution is 3-6% of nickel, and the mass concentration of copper is 0.5-1% of nickel. The tungsten is introduced into the nickel, so that the hardness and cutting capability of the bus can be improved, but the internal stress can be increased, after the copper is introduced, the grain size of the copper is between that of the nickel and tungsten, so that the copper is beneficial to entering the plating layer, on one hand, the copper can make the crystal grains of the plating layer fine, uniform and compact, and promote the crystal face of the nickel to produce preferred orientation, and on the other hand, the copper can form good intermetallic bonding with the nickel and tungsten metal plating layers, so that good bonding force between the plating layers is obtained.
The ratio of the cathode to the anode of the plating to the ratio of the S-cathode to the S-anode is preferably (0.3-2): 1, more preferably (0.8-1.0): 1. The cathode and anode ratio of electroplating is too large, deposition is slow, and metal ions in the solution are reduced due to insufficient replenishment; too small, a strong edge effect is generated, the deposition speed is high, and the compactness of the plating layer is poor.
Preferably, the plating solution is circulated at a filtration rate of 2 to 20 times/H, more preferably 8 times/H. The impurities in the electroplating solution are removed by circulating filtration, and the stirring purpose can be achieved by repeatedly flowing the solution.
The invention also provides a diamond wire, wherein the bus is a nickel alloy bus with the wire diameter of 4-25 mu m, the nickel alloy bus is prepared by the method, and the outer side of the bus is covered with nickel alloy and diamond.
The invention also provides a preparation method of the diamond wire, which comprises the following steps: the diamond is coated with a nickel alloy and then directly coated on the master wire manufactured by the above method by electroplating.
The invention also provides application of the diamond wire in silicon wafer cutting.
Therefore, the invention has the beneficial effects that:
1. The invention generates the diamond wire bus by electroplating in the groove, and has at least the following advantages compared with the traditional drawing process: (1) The limit of the wire diameter is overcome, the drawing process is difficult to achieve below 35 mu m, the wire diameter of the invention depends on the size of the cross section of the groove, and therefore, the wire diameter can be very thin, and the minimum wire diameter can be as thin as 4 mu m. (2) The invention overcomes the limit of bus length, and the bus length prepared by the drawing process is limited, so long as the electroplating liquid is always supplemented, the bus with infinite length can be prepared theoretically. (3) The limit of the section of the bus is overcome, the section of the bus manufactured by the drawing process can only be round, and the section shape of the bus depends on the section shape of the groove, so that the bus with various shapes can be manufactured. (4) The invention adopts the electroplating process to widen the selection range of the bus base material, for example, nickel/nickel alloy can be selected as a bus, and the drawing process can not be used for preparing the fine bus.
2. According to the invention, through the arrangement of the electroplating device and the control of the electroplating process, the diamond wire bus which is thinner (the minimum length can be 4 μm) and longer (the theoretical length can be infinitely long) and has good strength is obtained.
3. The nickel alloy is used as a bus, and diamond coated by the nickel alloy is electroplated outside the bus, so that the diamond wire can be manufactured, and the long and complicated process in the traditional bus manufacturing process is reduced. The traditional tungsten wire/high carbon steel wire bus needs to be sequentially subjected to alkali washing, preplating sand, activating treatment, nickel plating, drying and discharging to obtain a desired diamond wire, and the bus and the plating material have different components and have poor binding force. The main component of the electroplated bus is nickel/nickel alloy, and diamond is electroplated on the bus to prepare the diamond wire saw, electroplating and nickel pre-plating are not needed in the process, and the whole diamond wire saw is composed of nickel or nickel alloy, so that the situation that different plating layers are not good in binding force and fall off in a layering manner is avoided. Meanwhile, as the nickel alloy is used for coating the diamond particles, the hardness of the wire saw can be improved, and the wear resistance is better.
Drawings
Fig. 1 is a drawing of an apparatus for producing a diamond wire busbar according to the present invention.
In the figure, 1, a roller, 2, a groove, 3, a bus, 4, a non-conductive shielding area, 5 and electroplating solution.
Detailed Description
The technical scheme of the invention is further described through specific embodiments.
In the present invention, unless otherwise specified, the materials and equipment used are commercially available or are commonly used in the art, and the methods in the examples are conventional in the art unless otherwise specified. Unless otherwise indicated, parts are parts by weight, temperatures are expressed in degrees celsius or at ambient temperature, and pressures are at or near atmospheric. The presence of reaction conditions (e.g., component concentrations, solvents required, solvent mixtures, temperatures, pressures, and other reaction ranges) and numerous variations and combinations of conditions that can be used to optimize the purity and yield of the product obtained by the process will require only reasonably routine experimentation to optimize such process conditions.
Examples
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The preparation of the busbar 3 is carried out in an apparatus as shown in fig. 1. The surface of the drum 1 is provided with a groove 2 which surrounds the circumference thereof. The surface of the groove 2 is made of stainless steel or titanium, the part except the groove 2 of the surface of the roller 1 is a non-conductive shielding area 4, and if the non-conductive shielding area 4 is a coating layer, the thickness of the coating layer is 1-98 mu m. The grooves 2 are arranged at least one circle, or a plurality of circles, and when the grooves 2 on the surface of the roller 1 are arranged in a plurality of circles (the grooves on the roller are independent of each other and are not spirally connected), the distance between the adjacent grooves 2 is more than 5 mm. Preferably, the groove 2 has an inner width of at most 4-25 μm and a depth of at most 4-25 μm; the surface finish of the groove 2 is 0.05 to 0.8, more preferably 0.12 to 0.5.
The roller 1 is preferably a cylinder with the diameter of 500-5000 mm and is transversely placed in the electroplating solution 5, at least part of the roller 1 is immersed in the electroplating solution 5, at least part of the roller is not immersed in the electroplating solution 5, and the electroplating solution 5 is a metal ion solution of a substrate of the bus bar 3. The plating current density is 6-40A/dm 2, more preferably 10-15A/dm 2.
The temperature of the electroplating solution is 25-60 ℃ and the pH value is 2.8-5.0; further preferably at a temperature of 38-40deg.C and a pH of 4.0-4.2. The busbar substrate is nickel or nickel alloy, and the ion concentration of nickel in the electroplating solution is 60-720 g/L, and more preferably 100-150 g/L. The nickel alloy is one or more of cobalt, iron, tungsten, zinc, copper and chromium, and the concentration of alloy ions in the electroplating solution is 1-110 g/L, and more preferably 5-8 g/L.
More preferably, the nickel alloy is nickel tungsten or copper alloy, the mass concentration of tungsten in the solution is 3-6% of nickel, and the mass concentration of copper is 0.5-1% of nickel.
The ratio of the anode to the cathode to the anode of the plating is (0.3-2): 1, more preferably (0.8-1.0): 1.
The circulating filtration rate of the plating solution is 2 to 20 times/H, more preferably 8 times/H.
The drum 1 rotates around its own central axis, and the linear velocity of the drum surface is 600-20000 m/H, more preferably 10000-15000 m/H. When the groove 2 is immersed in the electroplating liquid 5, metal is deposited in the groove, when the groove 2 leaves the electroplating liquid 5, the deposited metal is stripped, and long-length bus bars 3 with the wire diameter more than or equal to 4 mu m are obtained by continuous winding, so long as the electroplating liquid 5 is always replenished, the bus bars 3 with infinite lengths can be obtained theoretically.
2. Preparation of diamond wire
And coating the diamond with nickel alloy, and coating the diamond on the bus by a conventional electroplating method to obtain the diamond wire.
The invention also provides the diamond wire prepared by the preparation method, the bus is preferably a nickel alloy bus with the wire diameter of 4-25 mu m, and the outer side of the bus is covered with nickel alloy and diamond.
The invention also provides application of the diamond wire prepared by the preparation method in silicon wafer cutting, and the silicon wafer cutting line speed is 1500-2000 m/min.
Example 1
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 108 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 10000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 2
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x25 μm; the surface finish of the groove was 0.5.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 38 ℃, and the pH value of the electroplating solution is 4.2. The bus base material is nickel-tungsten alloy, the concentration of nickel ions in the electroplating solution is 128 g/L, and the concentration of tungsten ions is 6 g/L. The plating current density was 12A/dm 2. The cathode-anode ratio S-anode of electroplating is 0.8:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 10000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 3
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of non-conductive shielding areas, the areas between the adjacent grooves are non-conductive shielding areas, the non-conductive shielding areas are coating layers, and the thickness of the coating layers is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is 18 μm square with the diameter of 18 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 108 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates about its own central axis with a linear velocity of 15000 m/H at the drum surface. The metal is deposited in the groove when the groove is immersed in the electroplating solution, the metal deposited in the groove is stripped when the groove leaves the electroplating solution, and the groove is continuously rolled to obtain an elongated bus bar with the cross section of 18 mu m and 18 mu m square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 4
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of non-conductive shielding areas, the areas between the adjacent grooves are non-conductive shielding areas, the non-conductive shielding areas are coating layers, and the thickness of the coating layers is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is 18 μm square with the diameter of 18 μm; the surface finish of the groove was 0.5.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 38 ℃, and the pH value of the electroplating solution is 4.2. The bus base material is nickel-tungsten alloy, the concentration of nickel ions in the electroplating solution is 118 g/L, and the concentration of tungsten ions is 6 g/L. The plating current density was 14A/dm 2. The cathode-anode ratio S-anode of electroplating is 0.8:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates about its own central axis with a linear velocity of 15000 m/H at the drum surface. The metal is deposited in the groove when the groove is immersed in the electroplating solution, the metal deposited in the groove is stripped when the groove leaves the electroplating solution, and the groove is continuously rolled to obtain an elongated bus bar with the cross section of 18 mu m and 18 mu m square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 5
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of non-conductive shielding areas, the areas between the adjacent grooves are non-conductive shielding areas, the non-conductive shielding areas are coating layers, and the thickness of the coating layers is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is a cuboid with the width of 10 mu m and the length of 15 mu m; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 110 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates about its own central axis with a linear velocity of 15000 m/H at the drum surface. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, the metal deposited in the grooves is stripped when the grooves leave the electroplating solution, and the grooves are continuously rolled to obtain the elongated bus with the cross section of 10 microns by 15 microns.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 6
The difference from example 4 is that the bus bar cross section is a square of 4 μm by 4 μm.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of non-conductive shielding areas, the areas between the adjacent grooves are non-conductive shielding areas, the non-conductive shielding areas are coating layers, and the thickness of the coating layers is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square with the diameter of 4 μm and the diameter of 4 μm; the surface finish of the groove was 0.5.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 38 ℃, and the pH value of the electroplating solution is 4.2. The bus base material is nickel-tungsten-copper alloy, the concentration of nickel ions in the electroplating solution is 118 g/L, and the concentration of tungsten ions is 6 g/L. The plating current density was 14A/dm 2. The cathode-anode ratio S-anode of electroplating is 0.8:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates about its own central axis with a linear velocity of 15000 m/H at the drum surface. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the slender bus with the cross section of 4 microns by 4 microns.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 7
The difference from example 6 is that the busbar substrate is nickel tungsten copper alloy.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of non-conductive shielding areas, the areas between the adjacent grooves are non-conductive shielding areas, the non-conductive shielding areas are coating layers, and the thickness of the coating layers is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square with the diameter of 4 μm and the diameter of 4 μm; the surface finish of the groove was 0.5.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 38 ℃, and the pH value of the electroplating solution is 4.2. The bus base material is nickel-tungsten-copper alloy, the concentration of nickel ions in the electroplating solution is 118 g/L, the concentration of tungsten ions is 6 g/L, and the concentration of copper ions is 0.6 g/L. The plating current density was 14A/dm 2. The cathode-anode ratio S-anode of electroplating is 0.8:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates about its own central axis with a linear velocity of 15000 m/H at the drum surface. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the slender bus with the cross section of 4 microns by 4 microns.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 8
The difference from example 7 is that the amount of copper is outside the preferred range.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of non-conductive shielding areas, the areas between the adjacent grooves are non-conductive shielding areas, the non-conductive shielding areas are coating layers, and the thickness of the coating layers is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square with the diameter of 4 μm and the diameter of 4 μm; the surface finish of the groove was 0.5.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 38 ℃, and the pH value of the electroplating solution is 4.2. The bus base material is nickel-tungsten-copper alloy, the concentration of nickel ions in the electroplating solution is 118 g/L, the concentration of tungsten ions is 6 g/L, and the concentration of copper ions is 1.6 g/L. The plating current density was 14A/dm 2. The cathode-anode ratio S-anode of electroplating is 0.8:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates about its own central axis with a linear velocity of 15000 m/H at the drum surface. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the slender bus with the cross section of 4 microns by 4 microns.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Example 9
The difference from example 1 is that the busbar substrate is nickel.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus substrate is nickel, and the concentration of nickel ions in the electroplating solution is 108 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 10000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Comparative example
Comparative example 1
The diamond wire prepared by the traditional drawing process is characterized in that a bus is a high-carbon steel wire with a wire diameter of 30 mu m, and diamond is coated outside the bus.
Comparative example 2
The difference from example 1 is that the plating current density is 5A/dm 2, which is lower than the preferred range of 10-15A/dm 2.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 108 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 5A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 10000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Comparative example 3
The difference from example 1 is that the plating current density is 45A/dm 2, which is higher than the preferred range of 10-15A/dm 2.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 108 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 45A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 10000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Comparative example 4
The difference from example 1 is that the linear velocity of the drum surface is 500 m/H, which is lower than the preferred range 10000-15000m/H.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 108 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates about its own central axis with a linear velocity of 500 m/H at the drum surface. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Comparative example 5
The difference from example 1 is that the linear velocity of the drum surface is 35000 m/H, which is higher than the preferred range 10000-15000 m/H.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 108 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 35000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Comparative example 6
The difference from example 1 is that the concentration of nickel ions in the plating solution is 50 g/L, which is lower than the preferable range of 100-150 g/L.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus base material is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 50 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 10000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Comparative example 7
The difference from example 1 is that the concentration of nickel ions in the plating solution is 258 g/L, which is higher than the preferable range of 100-150 g/L.
The preparation method of the diamond wire comprises the following steps:
1. preparation busbar
The surface of the roller is provided with a circle of grooves encircling the circumference direction of the roller. The grooves on the surface of the roller are provided with a plurality of grooves, the distance between every two adjacent grooves is 6 mm, the area between every two adjacent grooves is a non-conductive shielding area, the non-conductive shielding area is a coating layer, and the thickness of the coating layer is 50 mu m. The surface of the groove is made of stainless steel, and the cross section of the hollow structure in the groove is square 25 μm x 25 μm; the surface finish of the groove was 0.12.
The roller is a cylinder with the diameter of 2500 mm and is transversely placed in the electroplating solution, the roller is partially immersed in the electroplating solution, the electroplating solution is a metal ion solution of a bus substrate, the temperature of the electroplating solution is 40 ℃, and the pH value of the electroplating solution is 4.0. The bus substrate is nickel-cobalt alloy, the concentration of nickel ions in the electroplating solution is 258 g/L, and the concentration of cobalt ions is 5 g/L. The plating current density was 10A/dm 2. The cathode-anode ratio S-anode is 1:1. The circulating filtration rate of the electroplating solution is 8 times/H.
The drum rotates around its own central axis, and the linear velocity of the drum surface is 10000 m/H. And when the grooves are immersed in the electroplating solution, metal is deposited in the grooves, when the grooves leave the electroplating solution, the metal deposited in the grooves is stripped, and the grooves are continuously rolled to obtain the elongated bus bar with the cross section of 25 microns by 25 microns square.
2. Preparation of diamond wire
And coating the diamond by using nickel alloy, and directly coating the diamond on the bus by electroplating to obtain the diamond wire.
Performance testing
The performance of the bus bars and the diamond wires prepared in each example and comparative example is tested by the following test method: (1) linear compactness is measured by weighing per km length; (2) The breaking tension adopts a universal material pulling machine to measure the limit tension during stretching; (3) Measuring uniformity of the wire diameter by using a confocal microscope after measuring the 3D morphology; (4) The bonding force between diamond and bus is observed and measured by microscope, and the number of diamond particles separated from the bus per unit length is measured.
The results are shown in the following table:
As can be seen from the examples of the table above, the present invention can produce finer bus bars and is more excellent in performance, particularly in the bonding force of diamond with the bus bars, than comparative example 1.
Comparative example 2 has a current density lower than the preferred range compared to example 1, resulting in insufficient compactness of the bus bar and lower breaking tension. Comparative example 3 has a current density greater than the preferred range, and the uniformity of the wire diameter thereof is deteriorated. Comparative example 4 the drum was rotated at an insufficient speed, resulting in deterioration of uniformity of the wire diameter. The comparative example 5 was too fast in the rotation speed of the drum, insufficient in the compactness of the wire diameter, small in breaking tension, and poor in the adhesion force in the subsequent diamond plating. The metal main salt of comparative example 6 has low nickel ion concentration, insufficient surface roughness, and the bonding force is not good in the subsequent diamond electroplating. Comparative example 7 the metal main salt nickel ion concentration was high, its compactness was insufficient, broken Zhang Lidi.
The busbar substrates of examples 2, 4 and 7 were nickel tungsten, the difference being mainly that the wire diameter was gradually changed from large to small, and the busbar performance was gradually reduced, and the busbar substrate of example 6 was nickel tungsten copper, and compared with example 7, the busbar substrate of example 6 still maintained better performance at the same wire diameter of 4 μm, indicating that the addition of copper did indeed improve the busbar performance. However, in example 8, the copper content was excessive and the effect was rather lowered, so that the copper content was controlled within a reasonable range to promote the effect.
The present invention is not limited to the preferred embodiments, and the present invention is described above in any way, but is not limited to the preferred embodiments, and any person skilled in the art will appreciate that the present invention is not limited to the embodiments described above, while the above disclosure is directed to various equivalent embodiments, which are capable of being modified or varied in several ways, any simple modification, equivalent changes and variation of the above embodiments according to the technical principles of the present invention will still fall within the scope of the present invention.
Claims (9)
1. The bus preparation method is characterized by comprising the following steps: the surface of the roller is provided with a groove encircling the circumference direction of the roller, and only the groove part of the surface of the roller is conductive; the roller is partially immersed in a metal ion solution, wherein the metal is nickel alloy, the nickel alloy is nickel tungsten or copper alloy, the concentration of nickel ions in the solution is 60-720g/L, the concentration of alloy ions is 1-110 g/L, the mass concentration of tungsten in the solution is 3-6% of nickel, and the mass concentration of copper in the solution is 0.5-1% of nickel; the method comprises the steps of introducing tungsten into nickel to improve the hardness and cutting capacity of a bus, introducing copper, wherein the particle size of the copper is between that of the nickel and tungsten, so that the copper is favorable for entering a plating layer, the crystal grains of the plating layer are fine, uniform and compact, the crystal face of the nickel generates preferred orientation, and the copper can form good intermetallic bonding with the nickel and tungsten metal plating layers to obtain good bonding force between the plating layers; the solution is electrified, the current density is 6-40A/dm 2, the roller rotates around the central axis of the roller at the linear speed of 600-20000m/H, metal is deposited in the groove when the groove is immersed in the solution, the metal deposited in the groove is stripped when the groove leaves the solution, the long bus with the wire diameter of 4-25 mu m is continuously rolled and stripped, and the section shape of the bus is consistent with the section shape of the groove.
2. The bus bar preparation method according to claim 1, wherein a plurality of grooves are formed in the surface of the drum, and the distance between adjacent grooves is greater than 5 mm.
3. The bus bar manufacturing method according to claim 1 or 2, wherein the groove has an inner width of at most 4-25 μm and a depth of at most 4-25 μm; the surface finish of the groove is 0.05-0.8.
4. The bus bar manufacturing method according to claim 1, wherein the current density is 10-15A/dm 2.
5. The bus bar manufacturing method according to claim 1, wherein the drum rotation line speed is 10000-15000 m/H.
6. The bus bar preparation method according to claim 1, wherein the solution has a temperature of 25-60 ℃ and a pH of 2.8-5.0.
7. The diamond wire is characterized in that the bus is a nickel alloy bus with the wire diameter of 4-25 mu m, the outer side of the bus is covered with nickel alloy and diamond, and the bus is prepared by the bus preparation method according to any one of claims 1-6.
8. The use of the diamond wire of claim 7 in silicon wafer dicing.
9. The preparation method of the diamond wire is characterized by comprising the following steps of:
(1) Producing a bus bar by the bus bar production method of any one of claims 1 to 6;
(2) Coating the diamond with nickel alloy;
(3) And (3) directly coating the diamond prepared in the step (2) on the bus prepared in the step (1) through electroplating to obtain the diamond wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410775995.2A CN118322114B (en) | 2024-06-17 | 2024-06-17 | Bus preparation method, diamond wire, preparation method of diamond wire and silicon wafer cutting application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410775995.2A CN118322114B (en) | 2024-06-17 | 2024-06-17 | Bus preparation method, diamond wire, preparation method of diamond wire and silicon wafer cutting application |
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| CN1523137A (en) * | 2003-02-17 | 2004-08-25 | 未来金属株式会社 | Apparatus and process for manufacturing metallic fiber by electromoulding |
| CN101823240A (en) * | 2009-03-02 | 2010-09-08 | 住友电气工业株式会社 | Diamond wire saw and manufacturing method of diamond wire saw |
| CN217839178U (en) * | 2022-05-16 | 2022-11-18 | 益阳市明远机械制造有限公司 | Diamond wire electroplating conductive wheel |
| CN117403301A (en) * | 2023-10-25 | 2024-01-16 | 江西新光金刚石工具有限公司 | Diamond tool surface metal treatment device |
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| GB784518A (en) * | 1954-07-15 | 1957-10-09 | Albert Richard Norman Heath | Apparatus for electro-plating wire |
| KR19980035164U (en) * | 1996-12-12 | 1998-09-15 | 김종진 | Rolling Roll of Radial Plating Electrolyzer |
| CN211420339U (en) * | 2019-12-10 | 2020-09-04 | 江苏中畅精密科技有限公司 | Conductive roller for preparing electroplated diamond wire |
| CN213203241U (en) * | 2020-08-20 | 2021-05-14 | 宁波钱壮新材料科技有限公司 | Diamond wire electroplating device |
| CN113584549A (en) * | 2021-08-17 | 2021-11-02 | 长沙岱勒新材料科技股份有限公司 | Diamond wire sanding device, diamond wire preparation method and diamond wire preparation system |
| CN114211049A (en) * | 2022-01-07 | 2022-03-22 | 江苏聚成金刚石科技有限公司 | Tungsten wire alloy wire, diamond wire saw made of tungsten wire alloy wire, and preparation method and application of tungsten wire alloy wire |
| CN217579107U (en) * | 2022-05-16 | 2022-10-14 | 益阳市明远机械制造有限公司 | Diamond wire electroplating box |
| CN116427003B (en) * | 2023-06-12 | 2023-09-01 | 无锡富泰盛精模科技有限公司 | Diamond wire electroplating equipment |
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| CN1523137A (en) * | 2003-02-17 | 2004-08-25 | 未来金属株式会社 | Apparatus and process for manufacturing metallic fiber by electromoulding |
| CN101823240A (en) * | 2009-03-02 | 2010-09-08 | 住友电气工业株式会社 | Diamond wire saw and manufacturing method of diamond wire saw |
| CN217839178U (en) * | 2022-05-16 | 2022-11-18 | 益阳市明远机械制造有限公司 | Diamond wire electroplating conductive wheel |
| CN117403301A (en) * | 2023-10-25 | 2024-01-16 | 江西新光金刚石工具有限公司 | Diamond tool surface metal treatment device |
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