CN118315352A - Novel high-power liquid-cooled phase-change radiator and manufacturing method thereof - Google Patents

Abstract

The invention discloses a novel high-power liquid cooling phase-change radiator and a manufacturing method thereof, wherein the novel high-power liquid cooling phase-change radiator comprises an evaporation end and a condensation end, the evaporation end comprises an evaporation condensing plate, a lower shell and a liquid injection port, the lower surface of the evaporation condensing plate is fixedly connected with the lower shell to form an evaporation cavity, the condensation end comprises an upper shell and an evaporation condensing plate, the upper surface of the evaporation condensing plate is fixedly connected with the upper shell to form a condensation cavity, and the heat dissipation mechanism comprises at least one tooth plate heat dissipation area and at least one cylindrical heat dissipation area.

Description

A novel high-power liquid-cooled phase-change radiator and its manufacturing method

Technical Field

The present invention relates to the technical field of radiators, and in particular to a novel high-power liquid-cooled phase-change radiator and a manufacturing method thereof.

Background technique

Traditional radiators rely on heat sinks to diffuse heat outward. The horizontal and vertical distances between the heat sink and the heat source are different. The heat dissipation of the heat sink is not uniform, and the heat dissipation efficiency is not high. In addition, with the upgrading of integrated circuits, the requirements for the heat dissipation power of the radiator are getting higher and higher.

The existing VC radiator generally has a heat dissipation power of 400-500W, and the limit can be increased to 800-900W. The heat dissipation power limit of the water-cooled radiator is 1200W. With the development of technology, the thermal power of heat sources such as chips is getting higher and higher, especially chips, the thermal power has exceeded 1200W. The unit heat of the existing air-cooled radiator and water-cooled radiator exceeds the process limit and can no longer meet the unit heat flow requirements. A new heat dissipation method is urgently needed to meet the heat dissipation needs.

Summary of the invention

In view of the above-mentioned problems, the purpose of the present invention is to provide a new high-power liquid-cooled phase change radiator and a manufacturing method thereof, breaking the heat dissipation mode of the temperature equalizing plate heating tube plus the heat sink, so that the new high-power liquid-cooled phase change radiator has higher heat dissipation power and more uniform heat dissipation.

To achieve the above object, the present invention provides a novel high-power liquid-cooled phase-change radiator, comprising an evaporation end and a condensation end.

The evaporation end includes an evaporation condensation plate, a lower shell and a liquid injection port. The lower side of the evaporation condensation plate is fixedly connected to the lower shell to form an evaporation chamber. The liquid injection port is located at one end of the evaporation chamber. A first capillary structure is provided on the inner wall of the evaporation chamber. A first liquid medium is provided inside the evaporation chamber.

The condensation end includes an upper shell and an evaporative condensation plate. The upper surface of the evaporative condensation plate is fixedly connected to the upper shell to form a condensation chamber. The upper shell is provided with at least two inlet and outlet interfaces. The evaporative chamber and the condensation chamber are not connected to each other.

A heat dissipation mechanism is disposed on the upper surface of the evaporative condensation plate. The heat dissipation mechanism comprises at least one tooth plate heat dissipation area and at least one columnar heat dissipation area. The heat dissipation mechanism is located in the condensation chamber.

Preferably, the fin heat dissipation area includes a plurality of heat dissipation fins, the heat dissipation fins are vertically connected to the evaporative condensation plate, and intervals are provided between adjacent heat dissipation fins.

Preferably, the tooth plate heat dissipation zone is provided with a plurality of blind holes, and the blind holes are set to be one or more of square holes, round holes, and elliptical holes, and the total upper surface area of the blind holes is 10%-85% of the surface area of the tooth plate heat dissipation zone.

Preferably, the columnar heat dissipation area includes a plurality of heat dissipation columns, and the heat dissipation columns are provided with one or more of circular, elliptical, square and diamond-shaped cross-sectional structures.

Preferably, the heat dissipation column comprises a first heat dissipation column and a second heat dissipation column, and the diameter of the first heat dissipation column is larger than that of the second heat dissipation column.

Preferably, the volume of the first liquid medium is 3%-18% of the volume of the evaporation chamber, and the pressure in the evaporation chamber is less than 0.06 atmospheres.

The first liquid medium is one of water, salt water, diethyl ether or acetone.

Preferably, a second liquid medium is provided in the condensing chamber, the volume of the second liquid medium is 90%-100% of the volume of the condensing chamber, and the pressure in the condensing chamber is atmospheric pressure.

The second liquid medium is one of water, salt water, diethyl ether or acetone, or a mixture of the second liquid medium and an antifreeze agent.

Preferably, the radiator also includes a liquid circulation end, which includes a driving device and at least one connecting pipe, and both ends of the connecting pipe are respectively connected to the inlet and outlet interfaces, and the second liquid medium circulates in the condensation chamber and the connecting pipe under the drive of the driving device.

Preferably, the evaporation end further comprises a plurality of support columns, both ends of which are fixedly connected to the evaporation condensation plate and the lower shell, respectively, and a second capillary structure is provided on the outer wall of the support column.

The present invention provides a novel method for manufacturing a high-power liquid-cooled phase-change radiator, comprising the following steps:

S1, production of evaporative condensation plate,

The one-piece evaporative condensation plate is processed by a tooth-shoveling process. The one-piece evaporative condensation plate includes at least one tooth-fin heat dissipation area, and the tooth-fin heat dissipation area is composed of a plurality of heat dissipation tooth-fins.

Weld the processed heat dissipation columns to the columnar heat dissipation area of the evaporative condensation plate.

S2, sintering the first capillary structure, sintering the adapted upper cover capillary layer with the lower surface of the evaporative condensation plate, and sintering the adapted lower cover capillary layer with the lower shell, to form the first capillary structure,

S3, making the evaporation end, welding the bottom of the evaporation condensation plate to the lower shell to form a closed evaporation chamber, sintering the first capillary structure in step S2 on the inner wall of the evaporation chamber, and obtaining the evaporation end,

S4, the production of the condensation end, the upper surface of the evaporation condensation plate is welded to the upper shell to form a condensation chamber, and the condensation end is obtained.

S5, helium side leakage inspection, flush helium into the evaporation chamber through the injection port to detect whether there is side leakage. If there is side leakage, deal with the side leakage. If there is no side leakage, the helium inspection is completed.

S6, injecting the first liquid medium and evacuating the vacuum, injecting the first liquid medium into the evaporation chamber through the liquid injection port, and then evacuating the evaporation chamber, welding the liquid injection port to keep the evaporation chamber sealed, and completing the manufacture of the radiator.

The beneficial effects of the present invention are as follows: the new type of high-power liquid-cooled phase-change radiator provided by the present invention designs a condensing end on the evaporating end, and at the same time, designs a brand-new heat dissipation mechanism, the heat dissipation mechanism includes at least one tooth-shaped heat dissipation area and at least one columnar heat dissipation area, and the heat dissipation mechanism is combined with the second liquid medium to improve the heat dissipation power and temperature uniformity performance of the radiator, and the second liquid medium circulation passage is designed on the condensing end to improve the flow of the second liquid medium, thereby achieving the purpose of quickly and efficiently diffusing heat, greatly improving the heat dissipation power of the radiator, and solving the problem of high-power heat dissipation.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

FIG1 is a schematic diagram of an exploded structure of a novel high-power liquid-cooled phase-change radiator in Example 1;

FIG2 is a schematic diagram of the external structure of the novel high-power liquid-cooled phase-change radiator in Example 1;

FIG3 is a schematic diagram of the internal structure of the novel high-power liquid-cooled phase-change radiator in Example 1;

FIG4 is a schematic diagram of the structure of the evaporative condensation plate and the heat dissipation mechanism in Example 1;

FIG5 is a top view of the novel high-power liquid-cooled phase-change radiator in Example 1;

FIG6 is a top view of the installation connection joint of the novel high-power liquid-cooled phase-change radiator in Example 1;

FIG7 is a schematic diagram of a process for manufacturing a novel high-power liquid-cooled phase-change heat sink in Example 1;

Figure 8 is a schematic diagram of the structure of the evaporative condensation plate and the heat dissipation mechanism in Example 2;

Figure 9 is a top view of the new high-power liquid-cooled phase change radiator in Example 3;

FIG10 is a schematic diagram of the structure of the new high-power liquid-cooled phase-change radiator in Comparative Example 1;

FIG11 is a schematic diagram of the structure of a new high-power liquid-cooled phase-change radiator in Comparative Example 2;

Figure 12 is a schematic diagram of the structure of the new high-power liquid-cooled phase-change radiator in Comparative Example 3.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant contents, rather than to limit the present invention. It is also necessary to explain that, for ease of description, only the parts related to the present invention are shown in the accompanying drawings.

It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

Embodiment 1: Please refer to Figures 1 to 7. Embodiment 1 includes:

A new type of high-power liquid-cooled phase-change radiator, comprising an evaporation end 1 and a condensation end 2.

The evaporation end 1 includes an evaporation condensation plate 3, a lower shell 11 and a liquid injection port 12. The lower surface of the evaporation condensation plate 3 is fixedly connected to the lower shell 11 to form an evaporation chamber 31. The liquid injection port 12 is located at one end of the evaporation chamber 31. A first capillary structure 13 is provided on the inner wall of the evaporation chamber 31. A first liquid medium is provided inside the evaporation chamber 31.

The condensation end 2 includes an upper shell 21 and an evaporative condensation plate 3. The upper surface of the evaporative condensation plate 3 is fixedly connected to the upper shell 21 to form a condensation chamber 32. The upper shell 21 is provided with at least two inlet and outlet interfaces 5. The condensation chamber 32 is provided with a second liquid medium. The evaporative chamber 31 and the condensation chamber 32 are not connected to each other.

A heat dissipation mechanism is provided on the upper surface of the evaporative condensation plate 3 . The heat dissipation mechanism includes at least one tooth-shaped heat dissipation area and at least one columnar heat dissipation area. The heat dissipation mechanism is located in the condensation chamber 32 .

In this embodiment 1, the heat dissipation mechanism includes a tooth plate heat dissipation area and two columnar heat dissipation areas. As shown in Figure 1, the tooth plate heat dissipation area is located between the two columnar heat dissipation areas. Due to the size limitation of Figure 1, the specific structures of the tooth plate heat dissipation area and the columnar heat dissipation area are simplified as a structural schematic diagram.

In the present embodiment 1, the heat source uses the chip 7, and of course, other heat sources may also be used according to actual needs. The chip 7 is placed on the lower surface of the lower shell 11. During the operation of the integrated circuit, the chip 7 generates a large amount of heat, the temperature rises, the evaporation chamber 31 is in a sealed state, and is not connected to the condensation chamber 32, ensuring that the pressure in the evaporation chamber 31 is relatively small, while the condensation chamber 32 is under natural pressure, and the pressure requirement is not high; the pressure in the evaporation chamber 31 is less than 0.06 atmospheres. In this embodiment 1, the evaporation chamber 31 is 0.02-0.05 atmospheres. Due to technical limitations, it can only be evacuated as much as possible at this stage, and it is impossible to achieve an absolute vacuum state. When the pressure in the evaporation chamber 31 is within 0.06, it is considered to be in a vacuum state, meeting the requirements of the radiator. When the evaporation chamber 31 is within 0.003 atmospheres, the heat dissipation power is higher. Due to the low pressure and very low temperature, the first liquid medium in the evaporation chamber 31 will undergo a phase change, from liquid to gas. In this embodiment 1, the first liquid medium is water. During the phase change of water into water vapor, it absorbs the heat of the chip 7. The water vapor in The water vapor flows upward in the evaporation chamber 31, and the heat on the chip 7 is also conducted and diffused upward. When the water vapor contacts the lower surface of the evaporation condensation plate 3 upward, the heat is conducted to the condensation end 2 above through the evaporation condensation plate 3. A heat dissipation mechanism is provided on the upper surface of the evaporation condensation plate 3, and a second liquid medium is provided in the condensation chamber 32. The heat dissipation mechanism and the second liquid medium jointly dissipate the heat, thereby quickly diffusing the heat and reducing the temperature in the condensation chamber 32, thereby reducing the temperature of the evaporation condensation plate 3. At this time, the water vapor in contact with the evaporation condensation plate 3 releases heat and turns into liquid water, and flows back to the lower shell body 11 through the first capillary structure 13 again, encounters the chip 7 with a high temperature again, and turns into water vapor again, and the cycle repeats, continuously diffusing the heat of the chip 7 and reducing the temperature of the chip 7. By combining the evaporation chamber 31 and the condensation chamber 32, by combining the evaporation chamber 31 and the condensation chamber 32, and by dissipating the heat through the heat dissipation mechanism and the second liquid medium, the heat dissipation power is significantly increased by more than 68%, and the heat dissipation is more efficient, faster and more uniform.

The radiator also includes a liquid circulation end, which includes a driving device and at least one connecting pipe 4. In this embodiment 1, two inlet and outlet interfaces 5 and a connecting pipe 4 are provided, and the two ends of the connecting pipe 4 are respectively connected to the two inlet and outlet interfaces 5. Driven by the driving device, the second liquid medium circulates in the condensation chamber 32 and the connecting pipe 4, and contacts with the second liquid medium through the heat dissipation mechanism. At the evaporation end 1, the heat on the chip 7 is diffused to the condensation end 2 through the principle of phase change of the first liquid medium and capillary circuit absorption. At the condensation end 2, the heat dissipation is combined with the heat dissipation mechanism and the second liquid medium circulation. Moreover, by setting the flow rate of the second liquid medium, rapid heat dissipation and high-power heat dissipation can be achieved, thereby greatly improving the heat dissipation power of the radiator.

Of course, considering the convenience of transportation and storage of the radiator, as shown in FIG6 , the radiator may also include a connection joint 100, which is used in conjunction with the inlet and outlet interface 5. When the radiator is transported or stored, the liquid circulation end can be independently retracted and does not need to be fixedly connected to the condensation end 2. At this time, in order to prevent dust from the condensation chamber 32, the connection joint 100 is connected to the inlet and outlet interface 5 so that the condensation chamber 32 is in a sealed state. In addition, according to actual heat dissipation requirements, when the heat dissipation requirements can be met without using the liquid circulation end, the liquid circulation end may not be used, and the condensation chamber 32 is ensured to be in a sealed state by the connection joint 100. Of course, during the transportation and storage of the radiator, the second liquid medium may also be stored independently, and the second liquid medium may be injected into the condensation chamber 32 through the inlet and outlet interface 5 before the radiator is used. The second liquid medium may also use tap water. Therefore, the radiator may not be injected with the second liquid medium during the production process and transportation process, and may be injected before use.

The radiator in this embodiment 1 achieves the purpose of quickly and efficiently reducing the temperature of the chip 7 by designing a condensation end 2 on the evaporation end 1 and a second liquid medium circulation passage on the condensation end 2. A new heat dissipation mechanism is designed, and the heat dissipation mechanism includes a tooth plate heat dissipation area and two columnar heat dissipation areas. The first liquid medium absorbs and releases heat through phase change at the evaporation end 1, and transfers the heat of the chip 7 (heat source) to the condensation end 2. By utilizing the principle of capillary loop liquid absorption, the first liquid medium returns to the bottom of the evaporation chamber 31, and at the condensation end 2, the heat dissipation is combined with the heat dissipation mechanism and the second liquid medium. By combining the heat dissipation mechanism and the circulating flow of the second liquid medium, the second liquid medium is driven to circulate in the loop formed by the inlet and outlet interface 5, the condensation chamber 32, and the connecting pipe 4, so as to quickly diffuse the heat, reduce the temperature in the condensation chamber 32, and finally quickly diffuse the heat on the chip 7 to reduce the temperature of the chip 7.

The tooth plate heat dissipation area includes a plurality of heat dissipation tooth plates 91, which are vertically connected to the evaporative condensation plate 3, with intervals provided between adjacent heat dissipation tooth plates 91, and the evaporative condensation plate 3 and the tooth plate heat dissipation area are integrally formed by a tooth-shoveling process. The evaporative condensation plate 3 and the heat dissipation tooth plates 91 are integrally formed by the tooth-shoveling process. The advantage of integral forming is that the structural materials are unified, no other materials such as solder are added, and there are no welds. Even if it is soaked in the second liquid medium for a long time, the occurrence of rust and corrosion at the welds is delayed, thereby extending the service life of the radiator.

The tooth plate heat dissipation area is provided with a plurality of blind holes 92, and the blind holes 92 are set as one or more of square holes, round holes, and elliptical holes. The total upper surface area of the blind holes 92 is 10%-85% of the surface area of the tooth plate heat dissipation area. By punching a plurality of blind holes 92 on the heat dissipation tooth plate 91, the depth of the blind hole 92 is not greater than the height of the heat dissipation tooth plate 91. While reducing the overall weight of the radiator, the plurality of blind holes 92 can also increase the contact area between the heat dissipation tooth plate 91 and the second liquid medium, that is, increase the heat dissipation area of the heat dissipation tooth plate 91, and better improve the overall heat dissipation power of the radiator. The heat dissipation tooth plate 91 and the second liquid medium are in contact with each other, and the heat on the chip 7 is diffused to the condensation end 2 at the evaporation end 1 through the principle of phase change of the first liquid medium and liquid absorption by the capillary circuit. At the condensation end 2, the heat dissipation is combined by the heat dissipation mechanism and the second liquid medium circulation heat dissipation, and the flow rate of the second liquid medium can be set to achieve rapid heat dissipation and high-power heat dissipation, thereby greatly improving the heat dissipation power of the radiator.

The columnar heat dissipation area includes a plurality of heat dissipation columns, and the heat dissipation columns are provided with one or more of circular, elliptical, square, and diamond cross-sectional structures. In the present embodiment 1, the heat dissipation column is provided with an elliptical cross-sectional structure, and the plurality of heat dissipation columns are evenly distributed. In the present embodiment 1, the two columnar heat dissipation areas are respectively located on both sides of a tooth plate heat dissipation area, and one of the two inlet and outlet interfaces 5 is a liquid inlet and the other is a liquid outlet. By changing the flow direction of the second liquid medium, it can be adjusted. The driving device such as a driving motor or a driving circuit and the like can be located outside the entire radiator, so it is not shown in the figure. The second liquid The liquid medium circulates in the connecting pipe 4 and the condensation chamber 32 through the driving device to dissipate heat. Since the heat dissipation mechanism is also located in the condensation chamber 32, the columnar heat dissipation area and the tooth heat dissipation area are in contact with the second liquid medium. The heat on the chip 7 is conducted to the evaporative condensation plate 3 through the first liquid medium. The heat on the evaporative condensation plate 3 is diffused out through the heat dissipation mechanism and the second liquid medium, and finally the heat dissipation of the chip 7 is achieved. The heat dissipation column can increase the heat dissipation contact area between the evaporative condensation plate 3 and the second liquid medium. At the same time, the temperature at each distance from the chip 7 is kept balanced, and the heat dissipation is more uniform.

The heat dissipation column includes a first heat dissipation column 93 and a second heat dissipation column 94. The diameter of the first heat dissipation column 93 is larger than that of the second heat dissipation column 94. The first heat dissipation column 93 and the second heat dissipation column 94 have the same height, or the height of the first heat dissipation column 93 is larger than that of the second heat dissipation column 94. In the present embodiment 1, the first heat dissipation column 93 and the second heat dissipation column 94 have the same height, and the height of the heat dissipation column is also the same as the height of the heat dissipation fin 91. In practice, the height of the heat dissipation column and the height of the heat dissipation fin 91 can also be set differently according to actual needs. The heat dissipation column can not only increase the heat dissipation contact area between the evaporation condensation plate 3 and the second liquid medium, but also, in the process of the water in the evaporation chamber 31 turning into water vapor and flowing upward, the pressure on the evaporation condensation plate 3 will increase with the rise of the water vapor. Therefore, the heat dissipation column and the heat dissipation fin 91 increase the heat dissipation area, and also prevent the evaporation condensation plate 3 from being deformed due to pressure changes, thereby extending the service life of the radiator.

A recessed area 14 is also provided on the lower shell 11. The recessed area 14 is provided with a third capillary structure. The upper surface of the third capillary structure is flush with the upper surface of the lower shell 11. The chip 7 is close to the lower surface of the recessed area 14. The design of the recessed area 14 is convenient for controlling the position of the chip 7. The more important function is that due to the small size of the chip 7, the heat of the chip 7 is quickly conducted to the recessed area 14, and then quickly conducted to the third capillary structure, the lower shell 11 and the first capillary structure 13. A certain gap is left between the lower surface of the chip 7 and the upper surface of the lower shell 11, which can reduce the thermal resistance of heat conduction and improve the heat dissipation power.

The evaporation end 1 also includes a plurality of support columns 15, the two ends of the support columns 15 are respectively fixedly connected to the evaporation condensation plate 3 and the lower shell 11, and a second capillary structure is provided on the outer wall of the support column 15. The plurality of first capillary structures 13 and the second capillary structures are connected to form a plurality of capillary loops. As the water vapor continues to rise, the pressure in the evaporation chamber 31 increases, and the support columns 15 play a role in supporting the inner wall of the evaporation chamber 31. As the rising water vapor encounters the evaporation condensation plate 3 with a lower temperature, it releases heat again and changes from water vapor to water. Liquid water will flow in the loop of the first capillary structure 13 and the second capillary structure. Adding the second capillary structure can accelerate the reflux of liquid water into the first capillary structure 13, and can diffuse the heat on the chip 7 upward more quickly and evenly.

The support column 15 is configured to be a cylindrical, prism or prism-shaped structure. In the present embodiment 1, the support column 15 is configured to be a cylindrical body.

The evaporation end 1 also includes a powder column 16, which is a cylinder or a cone. At the same time, the powder column 16 can also be set to a hollow structure and installed on the outside of the support column 15. It has the same function as the support column 15 and plays the role of supporting the inner wall of the evaporation chamber 31. The capillary structure is sintered on the outer wall of the powder column 16 to enhance the reflux of liquid water.

The volume of the first liquid medium is 3%-18% of the volume of the evaporation chamber 31, and the pressure in the evaporation chamber 31 is less than 0.03 atmospheres. The first liquid medium is one of water, salt water, diethyl ether or acetone. In this embodiment 1, the first liquid medium is water. The volume of the first liquid medium is 15% of the volume of the evaporation chamber 31, and the pressure in the evaporation chamber 31 is 0.02-0.05 atmospheres.

The volume of the second liquid medium is 90%-100% of the volume of the condensation chamber 32, the pressure in the condensation chamber 32 is atmospheric pressure, the second liquid medium is one of water, brine, diethyl ether or acetone, or a mixture thereof with antifreeze. In this embodiment 1, the volume of the second liquid medium is 92% of the volume of the condensation chamber 32, the pressure in the condensation chamber 32 is atmospheric pressure, the second liquid medium is one of water, brine, diethyl ether or acetone, or a mixture thereof with antifreeze. In this embodiment 1, the second liquid medium is a mixture of water and antifreeze, and of course a mixture of brine and antifreeze can also be used.

The lower housing 11 is also provided with a recessed area 14, and the recessed area 14 is provided with a third capillary structure, and the upper surface of the third capillary structure is flush with the upper surface of the lower housing 11.

In this embodiment 1, the novel high-power liquid-cooled phase-change heat sink manufacturing method comprises the following steps:

S1, the production of the evaporative condensation plate 3, comprises the following steps:

S11, processing the integrally formed evaporative condensation plate 3 by a tooth-scratching process, wherein the integrally formed evaporative condensation plate 3 includes a tooth plate heat dissipation area, and the tooth plate heat dissipation area is composed of a plurality of heat dissipation tooth plates 91,

S12, performing a stamping operation on the heat dissipation tooth plate 91 to obtain a blind hole 92 on the heat dissipation tooth plate 91,

S13, welding the processed multiple heat dissipation columns to the columnar heat dissipation area of the evaporative condensation plate 3,

The heat dissipation fins 91 and the heat dissipation columns in the finished radiator are located inside the condensation chamber 32 and are in direct contact with the second liquid medium. The heat dissipation power of the radiator is significantly improved through the combined effect of the heat dissipation fins 91, the heat dissipation columns and the second liquid medium.

S2, sintering the first capillary structure 13, sintering the adapted upper cover capillary layer 81 with the lower surface of the evaporative condensation plate 3, and sintering the adapted lower cover capillary layer 82 with the lower shell 11, to form the first capillary structure 13,

S3, manufacturing the evaporation end 1, welding the bottom of the evaporation condensation plate 3 to the lower shell 11 to form a closed evaporation chamber 31, and sintering the first capillary structure 13 in step S2 on the inner wall of the evaporation chamber 31 to obtain the evaporation end 1,

S4, manufacturing the condensation end 2, welding the upper surface of the evaporation condensation plate 3 to the upper shell 21 to form a condensation chamber 32, and obtaining the condensation end 2,

S5, helium side leakage check, flush helium into the evaporation chamber 31 through the liquid injection port 12 to detect whether there is side leakage, if there is side leakage, treat the side leakage, if there is no side leakage, the helium inspection is completed,

S6, injecting and vacuumizing the first liquid medium, injecting the first liquid medium into the evaporation chamber 31 through the liquid injection port 12, and then vacuumizing the evaporation chamber 31, welding the liquid injection port 12 to keep the evaporation chamber 31 sealed, and completing the manufacture of the heat sink. Using the principle of water absorption by the capillary structure, the first liquid medium is absorbed by the first capillary structure 13, the second capillary structure and the third capillary structure during the injection process. When the injection volume is large, the excess first liquid medium is stored in the evaporation chamber 31. Theoretically, the closer the evaporation chamber 31 is to the vacuum radiator, the better the heat dissipation power. In this embodiment 1, the evaporation chamber 31 is 0.02-0.05 atmospheres. Due to technical limitations, it can only be vacuumed as much as possible at this stage, and it is impossible to achieve an absolute vacuum state. When the pressure in the evaporation chamber 31 is within 0.06, it is considered to be in a vacuum state, which meets the requirements of the radiator. When the evaporation chamber 31 is within 0.003 atmospheres, the heat dissipation power is higher.

S7, injection of the second liquid medium, injecting the second liquid medium into the condensing chamber 32 through the inlet and outlet interface 5. In this embodiment 1, there are two inlet and outlet interfaces 5, and the connecting pipe 4 is connected to the two inlet and outlet interfaces 5. Of course, because the second liquid medium can be produced, transported and stored separately, even tap water can be used, therefore, step S7 can be injected after the radiator is installed and before work, and it will not be repeated here.

In this embodiment 1, a driving device, two inlet and outlet interfaces 5, a condensation chamber 32, and a connecting pipe 4 form a circulation channel for the second liquid medium. Driven by the driving device, the second liquid medium circulates in the inlet and outlet interfaces 5, the condensation chamber 32, and the connecting pipe 4, diffuses the heat in the condensation chamber 32, and further diffuses the heat in the evaporation chamber 31, and finally realizes the diffusion of heat on the chip 7, thereby achieving the effect of dissipating the heat of the chip 7 and reducing the temperature of the chip 7.

The following steps are also included:

S21, manufacturing the support column 15, arranging a plurality of support columns 15 on the lower shell 11, sintering metal powder on the outer wall of the support column 15 to form a second capillary structure,

The welding includes one or more of brazing, diffusion welding or laser welding, the welding temperature is 700-950° C., and the welding time is 7-10 hours.

The supporting column 15 mainly plays the role of supporting the inner wall of the evaporation chamber 31. As the rising water vapor encounters the evaporation condensation plate 3 with a lower temperature, it releases heat again and changes from water vapor into water. The liquid water will flow in multiple loops formed by the first capillary structure 13, the second capillary structure and the third capillary structure. Under the capillary action, it is accelerated to flow back into the first capillary structure 13, which can quickly and evenly diffuse the heat on the chip 7 upward.

The heat sink in this embodiment 1, (1) by designing a condensing end 2 on the evaporating end 1, a new heat dissipation mechanism is designed, and the heat dissipation mechanism includes a tooth plate heat dissipation area and two columnar heat dissipation areas, (2) a second liquid medium circulation passage is designed on the condensing end 2 to improve the flow of the second liquid medium to achieve the purpose of quickly and efficiently diffusing the heat of the chip 7. The first liquid medium absorbs heat through phase change at the evaporating end 1 and becomes gaseous. The gas conducts the heat of the heat source to the condensing end 2. The gas encounters the evaporating condensing plate 3 with a lower temperature and releases heat to change into liquid. Using the principle of capillary loop liquid absorption, the first liquid medium returns to the bottom of the evaporating chamber 31, and the heat is dissipated at the condensing end 2 through the heat dissipation tooth plate 91, the heat dissipation column and the second liquid medium. The heat is quickly diffused by using the heat dissipation mechanism and the circulating flow of the second liquid medium to reduce the temperature in the condensing chamber 32, and finally the heat of the heat source is quickly diffused to reduce the temperature of the chip 7.

Embodiment 2, as shown in Figure 8, the difference between this embodiment 2 and embodiment 1 is that: the heat dissipation mechanism includes two tooth plate heat dissipation areas and two columnar heat dissipation areas, and the distribution order is: columnar heat dissipation area, tooth plate heat dissipation area, columnar heat dissipation area, tooth plate heat dissipation area, the heat dissipation tooth plate 91 of the tooth plate heat dissipation area and the evaporative condensation plate 3 are processed into an integrally formed mechanism through a scraping process, and the heat dissipation column of the columnar heat dissipation area is fixedly connected to the evaporative condensation plate 3 by welding. The heat dissipation principle is the same as that of embodiment 1, which will not be repeated here.

Embodiment 3, as shown in FIG9 , is different from Embodiment 1 in that the radiator in Embodiment 3 includes three second liquid medium circulation passages, that is, the heat dissipation zone includes: a driving device, a first inlet and outlet interface 51, a second inlet and outlet interface 52, a third inlet and outlet interface 53, a condensation chamber 32, a first liquid outlet 61, a second liquid outlet 62, a third liquid outlet 63, a first connecting pipe 41, a second connecting pipe 42, and a third connecting pipe 43, wherein the first inlet and outlet interface 51, the condensation chamber 32, the first liquid outlet 61 and the first connecting pipe 41 form a circulation passage, the second inlet and outlet interface 52, the condensation chamber 32, the second liquid outlet 62 and the second connecting pipe 42 form a second circulation passage, the third inlet and outlet interface 53, the condensation chamber 32, the third liquid outlet 63 and the third connecting pipe 43 form a third circulation passage, and under the drive of the driving device, the second liquid medium circulates in the three circulation passages to dissipate heat. Due to the addition of a circulating heat dissipation circuit, the heat dissipation power is higher and the temperature uniformity performance is better.

Of course, this is only to distinguish the liquid inlets and liquid outlets of the three circulation paths. In actual working process, the inlet and outlet interface 5 can be used as both the liquid inlet and the liquid outlet. Under the drive of the driving device, the liquid inlet and the liquid outlet can be interchangeable.

Comparative Example 1: As shown in Figure 10, Comparative Example 1 is an existing air-cooled radiator, including a temperature equalizing plate 71, a heat pipe 72 and a heat sink 73. The total volume of the radiator in Examples 1-3 is basically the same as that in Comparative Example 1. The heat pipe 72 is a straight heat pipe, and a fourth capillary structure is provided inside it. The temperature equalizing plate 71 is provided with a fifth capillary structure, and the fourth capillary structure and the fifth capillary structure form a loop. The heat sink 73 and the heat pipe 72 are perpendicular to each other. The interior of the temperature equalizing plate 71 and the interior of the heat pipe 72 form a connected closed cavity, and the pressure in the cavity is basically the same as that in Examples 1-4. The bottom of the temperature equalizing plate 71 contacts the chip 7, and the heat generated by the chip 7 is transferred to the fifth capillary structure and the fourth capillary structure, and finally diffused out by the heat sink 73. The heat dissipation principle of Comparative Example 1 is basically the same as the heat dissipation principle of the evaporation end 1 in Examples 1-4.

Comparative Example 2: As shown in FIG. 11 , the difference from Example 1 is that the heat dissipation mechanism only includes a columnar heat dissipation area, and the rest is the same as Example 1. The heat dissipation principle is the same as that of Example 1, and will not be described again here.

Comparative Example 3: As shown in FIG. 12 , the difference from Example 1 is that the heat dissipation mechanism only includes the tooth plate heat dissipation area, and the rest is the same as Example 1. The heat dissipation principle is the same as that of Example 1, and will not be described again here.

For the convenience of comparison, the difference in volume and weight of the radiator in Comparative Examples 1-3 and Example 1-3 is controlled within 1%, the volume and weight of the temperature equalizing plate 71 are almost the same as those of the evaporation end 1 in Example 1-3 and Comparative Example 2-3, and the volume formed by the heat pipe 72 and the heat sink 73 is equivalent to the volume of the condensation end 2 in Example 1-3 and Comparative Example 2-3, which is achieved by adjusting the specific structure of the heat dissipation mechanism in Example 1-3 and Comparative Example 2-3, specifically by changing the specific parameters of the heat dissipation fins 91, the blind holes 92, the first heat dissipation columns 93 and the second heat dissipation columns 94. The height of the heat dissipation fins 91 in Example 1-3 is lower than the height of the heat pipe 72. The heat dissipation power of Example 1-3, Comparative Example 2-3 and Comparative Example 1 is compared under similar external temperature, environment, and working state of the chip 7. The specific comparison data is shown in Table 1.

Table 1 Comparison data

serial number Radiator volume Maximum heat dissipation power (W) The cooling power limit is increased by 100% Comparative Example 1 1 800 —— Comparative Example 2 1 1100 37% increase Comparative Example 3 1 1200 Increase by 50% Example 1 1 1350 Increase by 68% Example 2 1 1600 Increase by 100% Example 3 1 1400 Increase by 75%

Table 1 is a comparative data of Examples 1-3 and Comparative Examples 1-3, wherein the volume of the radiator is approximately 45cmX20cmX35cm, and the heat dissipation power limit of the radiator in Comparative Example 1 is selected as 800W. Under other conditions where the ambient temperature and working environment are basically the same, it is obvious that the heat dissipation power of the radiator in Examples 1-3 is significantly higher than that in Comparative Example 1, and the heat dissipation power is greatly increased by 68-100%.

In summary, the present invention provides a novel high-power liquid-cooled phase-change radiator and a manufacturing method thereof. (1) A condensing end is designed on the evaporating end. At the same time, a new heat dissipation mechanism is designed. The heat dissipation mechanism includes at least one tooth plate heat dissipation area and at least one columnar heat dissipation area. The heat dissipation power and temperature uniformity performance of the radiator are improved by combining the heat dissipation mechanism with the second liquid medium. (2) A second liquid medium circulation passage is designed on the condensing end to improve the flow of the second liquid medium and achieve the purpose of quickly and efficiently diffusing heat. The first liquid medium absorbs and releases heat through phase change at the evaporating end, and transfers the heat of the chip to the condensing end. By utilizing the principle of capillary loop liquid absorption, the first liquid medium returns to the bottom of the evaporating chamber. At the condensing end, heat dissipation is combined with heat dissipation teeth, heat dissipation columns and the second liquid medium. The heat dissipation mechanism is combined with the circulating flow of the second liquid medium to drive the second liquid medium to circulate in the circulation passage, thereby quickly diffusing the heat and reducing the temperature in the condensing chamber. Finally, the heat on the chip is quickly diffused and the temperature of the chip is reduced.

In summary, the radiator provided by the present invention designs a new condensation end structure and heat dissipation mechanism, and diffuses the heat on the chip to the condensation end through the principle of liquid medium phase change heat absorption and heat release and capillary circuit liquid absorption at the evaporation end. At the condensation end, the heat dissipation mechanism and liquid circulating flow heat dissipation are combined to diffuse the heat on the chip more quickly and efficiently, thereby solving the problem of high-power heat dissipation.

It should be understood by those skilled in the art that the above embodiments are only for the purpose of clearly illustrating the present invention, and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications may be made based on the above invention, and these changes or modifications are still within the scope of the present invention.

Claims (10)

1. A new type of high-power liquid-cooled phase-change radiator, characterized in that it includes an evaporation end and a condensation end, The evaporation end includes an evaporation condensation plate, a lower shell and a liquid injection port. The lower side of the evaporation condensation plate is fixedly connected to the lower shell to form an evaporation chamber. The liquid injection port is located at one end of the evaporation chamber. A first capillary structure is provided on the inner wall of the evaporation chamber. A first liquid medium is provided inside the evaporation chamber. The condensation end includes an upper shell and an evaporative condensation plate. The upper surface of the evaporative condensation plate is fixedly connected to the upper shell to form a condensation chamber. The upper shell is provided with at least two inlet and outlet interfaces. The evaporative chamber and the condensation chamber are not connected to each other. A heat dissipation mechanism is disposed on the upper surface of the evaporative condensation plate. The heat dissipation mechanism comprises at least one tooth plate heat dissipation area and at least one columnar heat dissipation area. The heat dissipation mechanism is located in the condensation chamber. 2. The new high-power liquid-cooled phase-change radiator according to claim 1 is characterized in that: the fin heat dissipation area includes a plurality of heat dissipation fins, the heat dissipation fins are vertically connected to the evaporative condensation plate, and there are gaps between adjacent heat dissipation fins. 3. According to claim 1, the new high-power liquid-cooled phase-change radiator is characterized in that: the tooth plate heat dissipation area is provided with a plurality of blind holes, and the blind holes are set to be one or more of square holes, round holes, and elliptical holes. The total upper surface area of the blind holes is 10%-85% of the surface area of the tooth plate heat dissipation area. 4. The novel high-power liquid-cooled phase-change radiator according to claim 1 is characterized in that: the columnar heat dissipation area includes a plurality of heat dissipation columns, and the heat dissipation columns are provided with one or more of circular, elliptical, square, and diamond-shaped cross-sectional structures. 5. The novel high-power liquid-cooled phase-change radiator according to claim 4 is characterized in that: the heat dissipation column comprises a first heat dissipation column and a second heat dissipation column, and the diameter of the first heat dissipation column is larger than that of the second heat dissipation column. 6. The novel high-power liquid-cooled phase-change radiator according to claim 1 is characterized in that: the volume of the first liquid medium is 3%-18% of the volume of the evaporation chamber, and the pressure in the evaporation chamber is less than 0.06 atmospheres. The first liquid medium is one of water, salt water, diethyl ether or acetone. 7. The novel high-power liquid-cooled phase-change radiator according to claim 1 is characterized in that: a second liquid medium is provided in the condensing chamber, the volume of the second liquid medium is 90%-100% of the volume of the condensing chamber, and the pressure in the condensing chamber is atmospheric pressure. The second liquid medium is one of water, salt water, diethyl ether or acetone, or a mixture of the second liquid medium and an antifreeze agent. 8. According to the new high-power liquid-cooled phase-change radiator described in claim 7, it is characterized in that: the radiator also includes a liquid circulation end, the liquid circulation end includes a driving device and at least one connecting pipe, the two ends of the connecting pipe are respectively connected to the inlet and outlet interfaces, and the second liquid medium circulates in the condensation chamber and the connecting pipe under the drive of the driving device. 9. The novel high-power liquid-cooled phase-change radiator according to claim 1 is characterized in that: the evaporation end further comprises a plurality of support columns, both ends of the support columns are respectively fixedly connected to the evaporation condensation plate and the lower shell, and a second capillary structure is provided on the outer wall of the support column. 10. A novel high-power liquid-cooled phase-change radiator manufacturing method, characterized in that it includes the following steps: S1, production of evaporative condensation plate, The one-piece evaporative condensation plate is processed by a tooth-shoveling process. The one-piece evaporative condensation plate includes at least one tooth-fin heat dissipation area, and the tooth-fin heat dissipation area is composed of a plurality of heat dissipation tooth-fins. Weld the processed heat dissipation columns to the columnar heat dissipation area of the evaporative condensation plate. S2, sintering the first capillary structure, sintering the adapted upper cover capillary layer with the lower surface of the evaporative condensation plate, and sintering the adapted lower cover capillary layer with the lower shell, to form the first capillary structure, S3, making the evaporation end, welding the bottom of the evaporation condensation plate to the lower shell to form a closed evaporation chamber, sintering the first capillary structure in step S2 on the inner wall of the evaporation chamber, and obtaining the evaporation end, S4, the production of the condensation end, the upper surface of the evaporation condensation plate is welded to the upper shell to form a condensation chamber, and the condensation end is obtained. S5, helium side leakage inspection, flush helium into the evaporation chamber through the injection port to detect whether there is side leakage. If there is side leakage, deal with the side leakage. If there is no side leakage, the helium inspection is completed. S6, injecting the first liquid medium and evacuating the evaporation chamber through the liquid injection port, and then evacuating the evaporation chamber, welding the liquid injection port to keep the evaporation chamber sealed, and completing the manufacture of the radiator. The radiator is a novel high-power liquid-cooled phase-change radiator as described in any one of claims 1-9.