CN118284009B - Heat dissipation module, electronic device and electronic device protective case - Google Patents
Heat dissipation module, electronic device and electronic device protective case Download PDFInfo
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- CN118284009B CN118284009B CN202410485551.5A CN202410485551A CN118284009B CN 118284009 B CN118284009 B CN 118284009B CN 202410485551 A CN202410485551 A CN 202410485551A CN 118284009 B CN118284009 B CN 118284009B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明涉及流体输送技术领域，尤其涉及一种散热模组、电子设备及电子设备保护壳，该散热模组包括主体单元和至少一个致动单元，主体单元内部具有供散热工质流动的流道，致动单元用于为散热工质在循环流路内的循环流动提供动力，本发明的散热模组通过在流道上设置膨胀腔，主体单元的至少与膨胀腔相对的部分形成为柔性部分，使得散热模组既可以有效工作在散热工质不发生相变的第一模式，也可以工作在散热工质发生相变的第二模式，通过主体单元的至少膨胀腔随着流道内气体压力的变化而产生体积膨胀或收缩的变形，可有效地维持流道内的气体压力基本不变，散热工质的饱和温度也基本不会发生变化，从而使得相变过程能够实质不受抑制的持续进行。
The present invention relates to the field of fluid transport technology, and in particular to a heat dissipation module, an electronic device and an electronic device protective shell, wherein the heat dissipation module comprises a main unit and at least one actuating unit, wherein the main unit has a flow channel for a heat dissipating medium to flow therein, and the actuating unit is used to provide power for the circulation of the heat dissipating medium in the circulation flow path. The heat dissipation module of the present invention is provided with an expansion chamber on the flow channel, and at least a portion of the main unit opposite to the expansion chamber is formed as a flexible portion, so that the heat dissipation module can effectively work in a first mode in which the heat dissipating medium does not undergo a phase change, and can also work in a second mode in which the heat dissipating medium undergoes a phase change. By causing at least the expansion chamber of the main unit to expand or contract in volume as the gas pressure in the flow channel changes, the gas pressure in the flow channel can be effectively maintained basically unchanged, and the saturation temperature of the heat dissipating medium will basically not change, thereby allowing the phase change process to continue substantially uninhibited.
Description
Technical Field
The present invention relates to a heat dissipation module, an electronic device including the heat dissipation module, and a protective housing for an electronic device including the heat dissipation module.
Background
The miniaturization and high integration of high-power electronic components lead to rapid increase of heat productivity of the electronic components, local high temperature of the equipment caused by untimely heat dissipation of the high-heat-productivity electronic components can seriously affect temperature uniformity of the equipment and comprehensive performance of the electronic equipment, and researches show that when the equipment works at a temperature higher than rated working temperature, reliability of the semiconductor electronic components is greatly reduced, and meanwhile, about 20% of faults of the high-precision electronic equipment are caused by overhigh temperature of the heat-productivity electronic components. Efficient heat dissipation of high heating elements in a limited space becomes an important factor for guaranteeing stable operation of electronic equipment.
The micro-channel two-phase flow circulation cooling heat dissipation technology based on pump driving is considered as one of the most effective cooling technologies applied to high-power consumption circuits such as integrated circuits, and the cooling problems of small channels, high heat load, high precision, multiple heat sources or complex distributed heat sources can be effectively solved through high-performance power equipment and circulation working media. In the existing pump-driven micro-channel two-phase flow circulation cooling system, a mechanical pump is mostly adopted to provide circulation power, as disclosed in Chinese patent publication No. CN108509004A, a mechanical pump is mainly adopted to convey liquid working medium, and as the mechanical pump can only pump liquid, a liquid storage device is required to be added in front of an inlet pipeline of the mechanical pump, and meanwhile, the temperature of the inlet liquid has a certain supercooling degree so as to avoid cavitation to influence the reliability of the system;
Against this background, in recent years, a micro-channel two-phase circulation cooling system has been developed in which a micro-pump (e.g., a piezoelectric pump) is used instead of a mechanical pump, and a micro-channel phase change heat exchange cooling system based on a piezoelectric pump is disclosed in chinese patent publication No. CN207519054U, which is a phase change heat exchange cooling system comprising a piezoelectric pump, a micro-channel evaporator, and a radiator. The liquid phase working medium absorbs heat and changes phase in the microchannel evaporator to form a gas-liquid two-phase flow, and the gas-liquid two-phase flow is condensed into a liquid phase after reaching the radiator to release latent heat, and then reaches the next cycle through the piezoelectric pump. The piezoelectric pump is introduced to replace the traditional mechanical pump, so that the advantages of compact structure, low noise and low power consumption can be realized, meanwhile, the phase change heat transfer of the liquid working medium is utilized, the heat exchange and heat transfer efficiency can be improved theoretically, and some problems still exist:
On the one hand, in the prior art, the material of a closed loop pipeline for containing the heat-radiating working medium is in a rigid or difficult-to-deform structural form, when the heat-radiating working medium contained in the pipeline reaches the saturation temperature, the heat-radiating working medium absorbs heat and changes phase, and the liquid phase is converted into the gas phase, so that the gas pressure in the pipeline is increased, the saturation temperature of the heat-radiating working medium is further increased, the inhibiting effect is generated on the continuous phase change process of the heat-radiating working medium, the heat-radiating working medium is further subjected to phase change, the heat-radiating working medium is required to reach the higher saturation temperature, and the corresponding heat source temperature is also increased, so that the heat radiation is not facilitated;
On the other hand, the heat dissipation working medium in the pipeline is a single type of heat dissipation working medium, the heat load of the micro-channel evaporator is directly related to the evaporation rate of the single working medium, the working medium is possibly not subjected to phase change due to relatively low heat load, the heat dissipation efficiency is limited, the heat dissipation phenomenon is possibly caused by the fact that all working mediums are subjected to phase change due to excessive high heat load, the fluctuation of the heat load can greatly influence the stability of the system operation, and the proper single type of heat dissipation working medium is difficult to find according to the fluctuation of the heat load, particularly the heat load with large fluctuation;
Moreover, the input and output performance of the piezoelectric pump is greatly influenced by the composition of the fluid, when the fluid flows through the piezoelectric pump in a pure liquid phase, the inlet end of the piezoelectric pump can provide continuous and stable high negative pressure, when the fluid flows through the piezoelectric pump in a gas-liquid two-phase state, the negative pressure at the inlet end of the piezoelectric pump is continuously reduced along with the increase of the mixing amount of the gas-phase working medium, the output performance of the piezoelectric pump is reduced along with the increase of the mixing amount of the gas-phase working medium, and the flow limit of the phase-change heat exchange cooling system is greatly weakened, so that the problems of evaporation and liquid blockage are caused, and the working stability and the reliability of the system are seriously influenced, so that the piezoelectric pump is usually arranged at the condensation section of a loop.
Disclosure of Invention
The invention aims to solve the technical problems of the prior art, and provides a heat radiation module, electronic equipment comprising the heat radiation module and an electronic equipment protective shell comprising the heat radiation module, wherein the heat radiation module can solve the problems of phase change inhibition caused by rigid or difficult deformation structural form of a closed loop pipeline containing a heat radiation working medium in the prior art, and in addition, the invention can also solve the problems of steam drying or liquid plug caused by the difficulty in adapting a single heat radiation working medium to a large range of heat load fluctuation and the efficiency reduction of a power device caused by gas-liquid two-phase flow.
The invention solves the technical problems by adopting the technical scheme that the heat radiation module comprises a main body unit and at least one actuating unit, wherein a flow passage for the heat radiation working medium to flow is arranged in the main body unit, the flow passage and the actuating unit are matched to form a closed circulation flow path, the actuating unit is used for providing power for the circulation flow of the heat radiation working medium in the circulation flow path, and the heat radiation module is provided with a first mode of working in the heat radiation working medium without phase change and a second mode of working in the heat radiation working medium with phase change;
A part of the flow passage is formed as an expansion chamber, at least one of the expansion chambers is provided, and at least a portion of the main body unit opposite to the expansion chamber is formed as a flexible portion which is deformed to cause the flow passage to expand or contract in volume in response to a change in the pressure of the gas in the flow passage.
Further, the part of the runner except the expansion cavity is a main body section, the main body section is communicated with the expansion cavity, and the cross-sectional area of the expansion cavity is larger than that of the main body section.
Further, the expansion chamber has a transverse width W 1 in a transverse direction perpendicular to the direction of flow of the internal heat-dissipating working medium, and the main body section has a transverse width W 2,W1＞W2 in a transverse direction perpendicular to the direction of flow of the internal heat-dissipating working medium.
Further, the main body unit is provided with a heat absorption section for absorbing heat of a heat source, the flow passage extends to the heat absorption section, and the expansion cavity is positioned so that the heat dissipation working medium passes through the expansion cavity in the process of flowing from the heat absorption section to the actuating unit along the flow passage.
Further, the heat dissipation working medium in the flow channel is of a single type, and the heat dissipation working medium is fluorinated liquid or silicone oil.
Further, the heat dissipation working medium in the flow channel is a mixed heat dissipation working medium, and the mixed heat dissipation working medium is at least provided with a base liquid and at least provided with a dispersion liquid;
All base fluids and all dispersion fluids which form the mixed heat dissipation working medium respectively have different saturation temperatures under the same gas pressure.
Further, all the base liquid and all the dispersion liquid which form the mixed heat dissipation working medium are mutually insoluble.
Further, the base liquid is water, methanol, ethanol or quicksand oil, and the dispersion liquid is fluorinated liquid or silicone oil.
Further, at the same gas pressure, the saturation temperature of any base liquid is larger than that of the dispersion liquid, and part of the base liquid does not participate in phase change heat exchange.
Regarding the actuation unit, the following two schemes may be adopted:
the actuating unit comprises an actuating element and a containing cavity arranged in the main body unit;
The two sides of the containing cavity are communicated with the flow channel, the two sides of the containing cavity are respectively provided with an inlet one-way valve and an outlet one-way valve, the inlet one-way valve allows the heat dissipation working medium to flow from the flow channel to the containing cavity, the outlet one-way valve allows the heat dissipation working medium to flow from the containing cavity to the flow channel, and the actuating element is arranged in the area, opposite to the containing cavity, outside the main body unit and is used for promoting the containing cavity to generate volume change.
The actuating unit is a fluid pump, at least one liquid inlet and at least one liquid outlet are formed in the outer portion of the main body unit and communicated with the flow channel, the liquid inlet is communicated with a liquid outlet of the fluid pump, the liquid outlet is communicated with a liquid inlet of the fluid pump, and the fluid pump provides power for unidirectional circulating flow of heat dissipation working media in the circulating flow channel.
Further, the main body unit is formed by at least two layers of film materials, and all the film materials are laminated and sealed together to form at least one closed space, and the closed space forms the flow channel.
Further, the main body unit is provided with an upper membrane material, a middle membrane material and a lower membrane material which are sequentially stacked along the thickness direction of the main body unit, a gap structure is formed in the middle membrane material, the gap structure is a groove part and/or a hole part penetrating through the middle membrane material, and the gap structure is covered by the upper membrane material and the lower membrane material so as to form the flow channel.
Further, the materials constituting the upper film material, the middle film material and the lower film material are at least one of polymer materials, metal materials or functional materials formed by compounding polymer materials and metal materials.
Further, the main body unit is formed into a patch shape, the thickness is 0.01 mm-2 mm, and the equivalent diameter of the flow channel is 10 mu m-1 mm.
The invention also provides electronic equipment comprising the heat radiation module.
The invention also provides an electronic equipment protection housing which comprises the heat radiation module.
The beneficial effects of the invention are as follows:
1) According to the heat radiation module, the expansion cavity is arranged on the flow channel, at least the part, opposite to the expansion cavity, of the main body unit is formed into the flexible part, deformation which causes the volume expansion or contraction of the flow channel can be generated along with the change of the gas pressure in the flow channel, and the heat radiation module can effectively work in a first mode in which the heat radiation working medium does not generate phase change and also can work in a second mode in which the heat radiation working medium generates phase change. In the second mode, the heat dissipation working medium generates heat absorption phase change from liquid phase to gas phase and/or heat release phase change from gas phase to liquid phase, the phase change process can cause gas pressure change in the flow channel, and at least the expansion cavity of the main body unit generates volume expansion or contraction deformation along with the change of the gas pressure in the flow channel, so that the gas pressure in the flow channel can be effectively maintained to be basically unchanged, the saturation temperature of the heat dissipation working medium is basically unchanged, the phase change process can be carried out continuously without being restrained, and the heat dissipation efficiency is improved.
2) The heat radiation module can work in a first mode that the heat radiation working medium does not generate phase change and a second mode that the heat radiation working medium generates phase change, can adapt to heat load fluctuation in a large range, and has wide application range. In the second mode, the heat absorption and the heat release phase change of the heat radiation working medium are carried out, a gas-liquid two-phase flow is formed in the flow channel, only a small part of the gas-phase heat radiation working medium is mixed into the liquid-phase heat radiation working medium to form a gas column, most of the gas-phase heat radiation working medium can cause the gas pressure in the flow channel to rise, so that at least an expansion cavity of the main body unit is subjected to volume expansion, and the heat radiation working medium flowing through the heat absorption section is still kept as a liquid phase substantially when reaching the actuating unit, the actuating efficiency of the actuating unit is not greatly reduced due to the mixing of a large amount of gas-phase working medium, and the working stability and the working reliability of the heat radiation module are improved.
3) The heat radiation module can adopt a single type of heat radiation working medium or a mixed phase change working medium, firstly, an expansion cavity is arranged on a runner, at the same time, at least the part of a main body unit opposite to the expansion cavity is formed into a flexible part, deformation which causes the expansion or contraction of the volume of the runner along with the change of the pressure of gas in the runner can be generated, the problem of phase change inhibition in the phase change heat exchange process of the single type of heat radiation working medium in the prior art is solved, secondly, the invention has higher feasibility in matching a phase change heat exchange cooling system with fluctuating heat load or heat flux by designing the composition form of the mixed phase change working medium, and in addition, the invention can achieve good matching effect by controlling the ratio of each component in the mixed phase change working medium formed by a plurality of easily obtained base liquids and dispersion liquids and can actively control the phase change process.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the application, which proceeds with reference to the accompanying drawings.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of a main unit formed by laminating and sealing two layers of film materials into a flow channel;
FIG. 2 is a schematic view of a body unit sealed together into a flow channel using three layers of film material;
FIG. 3 is a schematic diagram of a heat dissipating module configured with an actuation unit of a first embodiment;
FIG. 4 is a schematic diagram of a heat dissipating module configured with a second embodiment of an actuation unit;
FIG. 5 is a schematic illustration of an expansion chamber undergoing expansion deformation;
FIG. 6 is a schematic diagram of example 4;
Fig. 7 is a schematic diagram of example 5.
In the figure, 1, a main body unit, 11, a runner, 111, a main body section, 112, an expansion cavity, 12, an absorbing section, 1-1, an upper membrane material, 1-2, an intermediate membrane material, 1-3 and a lower membrane material;
2. the actuating element, 3, the holding cavity, 4, the inlet check valve, 5, the outlet check valve;
6.A fluid pump;
7. an electronic device housing;
8. A protective cover;
9. A heating element.
W 1 the transverse width of the expansion cavity in the transverse direction perpendicular to the flow direction of the heat dissipation working medium in the expansion cavity;
w 2 the transverse width of the main body section in the transverse direction perpendicular to the flow direction of the heat dissipation working medium in the main body section.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only those features which are relevant to the invention, and orientation and reference (e.g., up, down, left, right, etc.) may be used solely to aid in the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.
Embodiment 1, as shown in fig. 1-4, a heat dissipation module comprises a main body unit 1 and at least one actuating unit, wherein a flow channel 11 for heat dissipation working medium to flow is formed inside the main body unit 1;
The main body unit 1 is formed by at least two layers of film materials, all the film materials are laminated and sealed together to form at least one sealed space, the sealed space forms a flow channel 11, the adjacent film materials are bonded together by adopting a mode of opposite surface sealing, the opposite surface sealing can be carried out by adopting bonding, welding or other modes capable of realizing effective surface connection, the formed flow channel 11 can be a single path or multiple paths with manifold paths according to the shape and distribution of surface sealing areas, the multiple paths of flow channel 11 comprises at least two manifold paths which are mutually intersected and communicated, the cross section of the flow channel 11 can be in the form as shown in fig. 1-2, in the embodiment, the main body unit 1 is formed by laminating three layers of film materials, the upper film material 1-1, the middle film material 1-2 and the lower film material 1-3 are sequentially laminated along the thickness direction of the main body unit, the middle film material 1-2 is provided with a gap structure, the gap structure is formed by a groove part and/or a hole part penetrating through the middle film material 1-2, and the gap structure is formed by the upper film material 1-1 and the lower film material 1-3. In addition, the middle membrane material 1-2 can be integrally formed with the upper membrane material 1-1, or the middle membrane material 1-2 can be integrally formed with the lower membrane material 1-3.
The materials of the upper membrane material 1-1, the middle membrane material 1-2 and the lower membrane material 1-3 constituting the main body unit 1 may be at least one of a polymer material, a metal material and a functional material formed by compounding the polymer material and the metal material, and specific types are not limited herein, and the materials constituting the main body unit 1 are required not to react with or hardly react with the heat dissipation working medium filled in the flow channel 11. The upper membrane material 1-1, the middle membrane material 1-2 and the lower membrane material 1-3 which form the main body unit 1 are made of polymer materials, such as PC, PP or PET, or functional materials compounded by a plurality of polymer materials, and the polymer materials have the advantages that on one hand, the lamination and sealing process between the polymer plastic membrane materials is relatively mature, high-strength sealing connection between adjacent membrane materials is easy to realize, on the other hand, the materials are easy to obtain, the cost is low, the environment is protected, no pollution is caused, the application range of products is greatly expanded by selecting the polymer plastic membrane materials of proper types, the industrial grade, the food grade and the medical grade can be realized, and the novel application scene is not caused by electromagnetic interference, so that the novel application scene is developed in the electronic terminal products. In addition, the main body unit 1 is endowed with excellent flexibility, the main body unit 1 is formed into a flexible patch shape, can be bent and twisted, and can be shaped, shaped and formed into a set shape by heating and pressurizing each layer of film material forming the main body unit 1 or the main body unit 1 after sealing molding, so that the main body unit 1 can be well attached to an attaching surface in the application process, the interface thermal resistance is reduced, and the heat exchange efficiency is improved.
The thickness of the main body unit 1 can be 0.01 mm-2 mm, the equivalent diameter of the flow channel 11 can be 10 mu m-1 mm, on the basis, even the main body unit 1 made of high polymer materials has heat dissipation efficiency comparable to that of metal materials, the scale of the flow channel 11 is controlled at the micro-channel level, and the heat exchange efficiency of the main body unit 1 is further improved by utilizing the characteristic that the micro-channel has a large surface area-volume ratio, and meanwhile, the whole liquid filling amount is small and the weight is light.
It should be noted that the membrane layers are laminated and bonded together by means of opposite surface sealing, which may be performed by bonding, welding or other means that can achieve effective surface connection, and the flow channel 11 may be formed by a single path or multiple paths with branches according to the shape and distribution of the surface sealing area, but not limited thereto, for example, the cross-sectional span of the portion of the flow channel 11 except for the expansion chamber 112 in the transverse direction perpendicular to the flowing direction of the heat dissipation medium may be the same, equivalent to a constant-section flow channel, or may be different, equivalent to a variable-section flow channel, and, for example, in the structural form of the main body unit 1 formed by three layers of membrane materials, sealing may be formed between the upper membrane material 1-1 and the lower membrane material 1-3 at the outermost periphery of the main body unit 1, and the intermediate membrane material 1-2 may be substantially pressed or riveted between the upper membrane material 1-1 and the lower membrane material 1-3 to form the main body unit 1 with the internal flow channel 11.
The flow channel 11 and the actuating unit cooperate to form a closed circulation flow path, and the actuating unit is used for providing power for the circulation flow of the heat dissipation working medium in the circulation flow path.
The actuating unit can adopt the following two schemes;
the actuation unit of the first solution:
The actuating unit comprises an actuating element 2 and a containing cavity 3 arranged in the main body unit 1, wherein the containing cavity 3 is also a closed space formed by laminating and sealing all film materials together, namely the containing cavity 3 is a part of the actuating unit, and a closed circulation flow path is formed by communicating the containing cavity 3 with a flow channel 11, two sides of the containing cavity 3 are communicated with the flow channel 11, an inlet one-way valve 4 and an outlet one-way valve 5 are respectively arranged at two sides of the containing cavity 3, the inlet one-way valve 4 allows heat dissipation working medium to flow from the flow channel 11 to the containing cavity 3, but prevents the heat dissipation working medium from flowing from the containing cavity 3 to the flow channel 11, but prevents the heat dissipation working medium from flowing from the flow channel 11 to the containing cavity 3, the actuating element 2 can be but is not limited to be a piezoelectric vibrator, an electromagnetic actuator, an electrostatic actuator, an actuator formed by shape memory metal or a micro mechanical piston type actuating device, and the embodiment takes the piezoelectric vibrator as an example, and the piezoelectric vibrator is arranged at the outer part of the main body unit 1 and opposite to the containing cavity 3 for promoting the containing cavity 3 to generate volume change so as to provide power for the unidirectional circulation flow of heat dissipation working medium. The piezoelectric vibrator arranged outside the main body unit 1, the containing cavity 3 formed inside the main body unit 1, and the inlet check valve 4 and the outlet check valve 5 arranged at two sides of the containing cavity 3 cooperate to realize the pumping effect of the fluid pump 6, as shown in fig. 3;
the actuation unit of the second solution:
the actuating unit is a fluid pump 6, at least one liquid inlet and at least one liquid outlet are formed in the outer portion of the main body unit 1, the fluid pump 6 can be, but not limited to, a micro piezoelectric pump, a micro electromagnetic pump or a micro static pump, etc., in this embodiment, the fluid pump 6 is an example of the micro piezoelectric pump, the liquid inlet of the flow channel 11 is communicated with the liquid outlet of the micro piezoelectric pump, the liquid outlet of the flow channel 11 is communicated with the liquid inlet of the micro piezoelectric pump, the micro piezoelectric pump and the flow channel 11 cooperate to form a closed circulation flow path, the micro piezoelectric pump provides power for unidirectional circulation flow of a heat dissipation working medium, as shown in fig. 4, a liquid cooling heat dissipation module, a liquid cooling heat dissipation system and a matching form of the flow channel and a power pump (pump-driven circulation flow channel) in the electronic device disclosed in chinese patent with publication No. CN111818770a, a matching form of a bendable liquid cooling heat dissipation module and the flow channel matrix and the micro pump (pump-driven circulation flow channel) in the chinese patent with publication No. CN115167646a, and a liquid cooling and heat dissipation module and a liquid cooling heat dissipation module and a cooling heat dissipation system and a power pump disclosed in chinese patent with CN212573382U (the same type of the application) cooperate with the pump as a power circulation channel and a protection form of the pump (pump) in the same application and the pump and the heat dissipation system and the pump and the like).
As shown in fig. 3 and 4, a portion of the flow path 11 is formed as an expansion chamber 112, at least one of the expansion chambers 112 is formed, at least a portion of the body unit 1 opposite to the expansion chamber 112 is formed as a flexible portion, as shown in fig. 5, the flexible portion is capable of generating deformation that causes the flow path 11 to expand or contract in volume according to the change of the gas pressure in the flow path 11, and when the gas pressure in the flow path 11 changes, at least the expansion chamber 112 of the body unit 1 is capable of generating volumetric expansion or contraction deformation along one or both sides of the thickness direction of the body unit 1 to balance the pressure in the flow path 11, so that the gas pressure in the flow path 11 can be effectively maintained substantially unchanged.
The heat radiation module is provided with a first mode of working in which the heat radiation working medium does not generate phase change and a second mode of working in which the heat radiation working medium generates phase change;
The heat radiation module can work in a first mode that the heat radiation working medium does not generate phase change and also can work in a second mode that the heat radiation working medium generates phase change. Meanwhile, the heat dissipation working medium filled in the flow channel 11 can be a single kind of heat dissipation working medium, such as low-viscosity and low-boiling point fluorinated liquid such as FC3283 and FC72 or low-viscosity and low-boiling point silicone oil, so that the heat dissipation module has a lower starting temperature so as to respond to the temperature change of a heat source quickly, and the heat dissipation working medium filled in the flow channel 11 can also be a mixed heat dissipation working medium consisting of at least one base liquid and at least one dispersion liquid, and all the base liquids and all the dispersion liquids forming the mixed heat dissipation working medium respectively have different saturation temperatures under the same gas pressure, so that the heat dissipation working medium meeting the design requirement can be obtained through the mixing of a plurality of heat dissipation working mediums, and the problem that the proper single kind of heat dissipation working medium is difficult to find and obtain is solved. Preferably, all base fluids and all dispersion fluids forming the mixed heat dissipation working medium are mutually insoluble, and the saturation temperatures of the base fluids and the dispersion fluids are distributed in a gradient manner under the same gas pressure, preferably, the minimum value of the saturation temperature gradient formed by all base fluids forming the mixed fluid is larger than the maximum value of the saturation temperature gradient formed by all dispersion fluids, which is equivalent to that under the same gas pressure, the saturation temperature of any base fluid is larger than the saturation temperature of the dispersion fluid, namely, the base fluid has higher saturation temperature under the same gas pressure than the dispersion fluid, namely, higher heat load is needed to be enough to promote the phase change of the base fluid. For example, the base liquid may be one of water, methanol, ethanol, quicksand oil, etc. having a low viscosity and a high boiling point, and the dispersion liquid may be one or both of the above-mentioned fluorinated liquid and silicone oil.
It will be appreciated that in general, the same liquid has different saturation temperatures at different gas pressures, and different liquids also have different saturation temperatures at the same gas pressure, and when the liquid temperature reaches its saturation temperature at that gas pressure, the liquid undergoes a phase change from a liquid phase working medium to a gas phase working medium, which is accompanied by the absorption of heat, and when the temperature is lower than its saturation temperature at that gas pressure, the gas phase working medium is again converted to a liquid phase working medium, which is accompanied by the release of heat. It is also understood that the saturation temperature of the same liquid increases with increasing gas pressure and decreases with decreasing gas pressure.
Thus, it is not easy to understand,
In the first mode, the heat dissipation working medium does not generate phase change, the actuating unit promotes the liquid heat dissipation working medium to circularly flow, heat of a heat source in contact with the main body unit 1 is rapidly and uniformly dispersed to the whole main body unit 1, the temperature of the heat source is reduced, and the heat dissipation efficiency is improved. The first mode is suitable for the scene with relatively low heat load, the heat dissipation working medium in the flow channel 11 is in pure liquid phase circulation flow, the local pressure change caused by the actuating unit does not cause the obvious change of the gas pressure in the flow channel 11, and the arrangement of the expansion cavity 112 does not prevent the directional circulation flow of the liquid phase heat dissipation working medium;
In the second mode, the heat dissipation working medium is subjected to heat absorption phase transition from the liquid phase to the gas phase and/or heat release phase transition from the gas phase to the liquid phase, the phase transition process can cause gas pressure change in the flow channel 11, when the heat dissipation working medium is subjected to heat absorption phase transition from the liquid phase to the gas phase, the gas pressure in the flow channel 11 is increased to be larger than the external gas pressure, at least the expansion cavity 112 of the main body unit 1 is caused to undergo volume expansion deformation, the at least the expansion cavity 112 of the main body unit 1 is caused to undergo volume expansion deformation, namely, the gas pressure in the flow channel 11 is kept unchanged basically through the at least the expansion cavity 112 of the main body unit 1, the phase transition temperature of the liquid heat dissipation working medium is basically unchanged, so that the phase transition process can be carried out basically uninhibited, and the heat dissipation efficiency is improved, and likewise, when the heat dissipation working medium is subjected to heat release phase transition from the gas phase to the liquid phase, the gas pressure in the flow channel 11 is reduced to be smaller than the external gas pressure, at least the expansion cavity 112 of the main body unit 1 is caused to undergo volume shrinkage deformation, and the volume expansion of at least the expansion cavity 112 of the main body unit 1 is caused to undergo volume shrinkage deformation, namely, the gas pressure in the flow channel 11 is not changed basically, the phase transition process is not restrained, and the heat dissipation efficiency is not changed continuously, and the heat dissipation process is not changed.
In addition, in the second mode, with the heat absorption and heat release phase transition of the heat dissipation working medium, a gas-liquid two-phase flow is formed in the flow channel 11, only a small part of the gas phase working medium is mixed into the liquid phase working medium to form a gas column, and most of the gas phase working medium can cause the gas pressure in the flow channel 11 to rise, so that at least the expansion cavity 112 of the main body unit 1 is subjected to volume expansion, and the gas phase working medium is accommodated in a gas chamber formed by the volume expansion of at least the expansion cavity 112 of the main body unit 1, therefore, the heat dissipation working medium flowing through the actuating unit is still kept into a liquid phase substantially, the actuating efficiency of the actuating unit is not greatly reduced due to the mixing of a large amount of gas phase working medium, and the stability and reliability of the work of the heat dissipation module are improved.
Preferably, the heat dissipation working medium is a mixed heat dissipation working medium, the mode of designing the composition form of the mixed heat dissipation working medium has higher feasibility in matching a phase change heat exchange cooling system with fluctuating heat load or heat flux density, and the good matching effect can be achieved by regulating and controlling the duty ratio of each component in the mixed heat dissipation working medium consisting of a plurality of easily obtained base liquids and dispersion liquids, and meanwhile, the phase change process can be actively controlled.
For example, by designing the composition form of the mixed heat dissipation working medium, the ratio of each component in the mixed heat dissipation working medium is controlled, so that when the heat load of the heat source is small, the actuating unit promotes the mixed liquid heat dissipation working medium to circularly flow in the flow channel 11, the heat of the concentrated heat source contacting with the main body unit 1 is rapidly and uniformly dispersed to the whole main body unit 1, the heat source temperature is reduced, as the heat load is increased, part of dispersion liquid in the mixed heat dissipation working medium participates in phase change heat exchange, as the heat load is further increased, more or all of dispersion liquid participates in phase change, when the heat load is continuously increased, even part of base liquid participates in phase change heat exchange, but part of base liquid does not participate in phase change heat exchange when the heat load and the heat dissipation efficiency of the heat dissipation module reach balance. On the one hand, the liquid heat dissipation working medium can be ensured to exist in the flow channel 11 all the time, so that local dryness is avoided, on the other hand, the heat dissipation working medium converted into the gas phase is mostly accommodated in a gas chamber formed by the volume expansion of at least the expansion cavity 112 of the main body unit 1, which is equivalent to the reduced gas quantity in the gas-liquid two-phase flow flowing through the actuating unit arranged at the far end, the inlet end of the actuating unit has continuous stable high negative pressure, the actuating efficiency of the actuating unit is not greatly reduced due to the mixing of a large amount of the heat dissipation working medium in the gas phase, the phenomenon of dryness evaporation or liquid blockage caused by the fact that the phase change heat exchange cooling system reaches the flow limit is avoided, and the working stability and reliability of the heat dissipation module are improved.
Of course, the ratio of each component in the mixed heat dissipation working medium can be controlled by designing the composition form of the mixed heat dissipation working medium, so that the condition that only the dispersion liquid changes phase and the base liquid does not change phase all the time can be realized aiming at the fluctuation of the heat load, and the detailed description is omitted.
Embodiment 2 differs from embodiment 1 in that the portion of the flow channel 11 other than the expansion chamber 112 is the main body section 111, which corresponds to that the expansion chamber 112 and the main body section 111 are both part of the flow channel 11, the main body section 111 is communicated with the expansion chamber 112, the cross-sectional area of the expansion chamber 112 is larger than that of the main body section 111, so that the expansion chamber 112 can accommodate more gas-phase heat dissipation working medium without obstructing the normal flow of the liquid-phase heat dissipation working medium.
The expansion chamber 112 has a transverse width W 1 in a transverse direction perpendicular to the flow direction of the heat-dissipating working medium therein, the main body section 111 has a transverse width W 2,W1＞W2 in a transverse direction perpendicular to the flow direction of the heat-dissipating working medium therein, and the transverse direction is perpendicular to the thickness direction of the main body unit 1, and the transverse width of the expansion chamber 112 is larger than that of the main body section 111 of the flow passage 11, so that the expansion chamber 112 has a larger transverse width, has a larger span, and is easily deformed than other portions of the flow passage 11.
Embodiment 3 differs from embodiment 1 or 2 in that the main body unit 1 has a heat absorbing section 12 for absorbing heat of a heat source, i.e., the area of the main body unit 1 in contact with the heat source is defined as the heat absorbing section 12, and the flow passage 11 extends to the heat absorbing section 12;
The actuating units are arranged far away from the heat absorption sections 12, and the positions of the expansion cavities 112 are arranged so that the heat dissipation working medium passes through the expansion cavities 112 in the process of flowing from the heat absorption sections 12 to the actuating units along the flow channels 11, namely, the expansion cavities 112 are arranged on the flow channels 11 between the heat absorption sections 12 and the actuating units, so that when the heat dissipation working medium absorbs heat and possibly begins to change phase, enough space is provided by the expansion cavities 112 to accommodate the heat dissipation working medium in gas phase;
It should be noted that, the expansion cavity 112 may be added to the flow channel 11 between the heat absorbing sections 12 and the heat dissipating working medium flowing from the actuating unit;
Further, the distance between the expansion chamber 112 and the heat absorbing section 12 in the flow direction of the heat dissipating working medium may be, but is not limited to, smaller than the distance between the expansion chamber 112 and the actuation unit, such that the expansion chamber 112 is closer to the heat absorbing section 12 than the actuation unit.
Embodiment 4, as shown in fig. 6, is an electronic device, which adopts the heat dissipation module in the above embodiment, and the heat dissipation module is disposed on the inner side wall of the electronic device housing 7 and forms heat exchange with the heating element 9 of the electronic device. The heat of the heating element 9 is rapidly and uniformly dispersed to the shell of the electronic equipment through the heat radiation module, so that the heat exchange between the shell and the external environment is accelerated, and the heat radiation efficiency is improved.
Embodiment 5, as shown in fig. 7, is an electronic equipment protection housing, and the heat dissipation module in the above embodiment is applied to the inner wall of the protection housing 8 facing the electronic equipment, and forms heat exchange with the heat generating area of the electronic equipment housing 7. The heat accumulated in the electronic device case 7 is rapidly and uniformly dispersed to the protective cover 8 via the heat radiation module, so that heat exchange between the protective cover 8 and the external environment is accelerated, and heat radiation efficiency is improved.
The above-described preferred embodiments according to the present invention are intended to suggest that, from the above description, various changes and modifications can be made by the worker in question without departing from the technical spirit of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (18)
1. The heat radiation module comprises a main body unit (1) and at least one actuating unit, wherein a flow channel (11) for flowing a heat radiation working medium is arranged in the main body unit (1), the flow channel (11) and the actuating unit are matched to form a closed circulation flow path, and the actuating unit is used for providing power for the circulation flow of the heat radiation working medium in the circulation flow path;
A part of the flow passage (11) is formed into an expansion chamber (112), at least one expansion chamber (112) is arranged, and at least the part of the main body unit (1) opposite to the expansion chamber (112) is formed into a flexible part, and the flexible part can generate deformation which causes the volume expansion or contraction of the flow passage (11) along with the change of the gas pressure in the flow passage (11);
in the first mode, the expansion cavity (112) does not obstruct the directional circulation flow of the liquid-phase heat dissipation working medium;
In the second mode, when the heat dissipation working medium is subjected to heat absorption phase change from a liquid phase to a gas phase, the gas pressure in the flow channel (11) is increased to be larger than the external gas pressure, so that at least the expansion cavity (112) of the main body unit (1) is subjected to volume expansion deformation, the gas pressure in the flow channel (11) is reduced due to the volume expansion of at least the expansion cavity (112) of the main body unit (1), when the heat dissipation working medium is subjected to heat release phase change from the gas phase to the liquid phase, the gas pressure in the flow channel (11) is reduced to be smaller than the external gas pressure, the at least the expansion cavity (112) of the main body unit (1) is subjected to volume contraction deformation, and the gas pressure in the flow channel (11) is increased due to the volume contraction of at least the expansion cavity (112) of the main body unit (1);
in the second mode, the gas-phase working medium is accommodated in a gas chamber formed by volume expansion of at least the expansion chamber (112) of the main body unit (1).
2. The heat dissipating module of claim 1, wherein the portion of the flow passage (11) other than the expansion chamber (112) is a main body section (111), the main body section (111) communicates with the expansion chamber (112), and the cross-sectional area of the expansion chamber (112) is larger than the cross-sectional area of the main body section (111).
3. The heat dissipating module as set forth in claim 2, wherein the expansion chamber (112) has a lateral width W 1 in a lateral direction perpendicular to the direction in which the internal heat dissipating working fluid flows, and the main body section (111) has a lateral width W 2, W1＞W2 in a lateral direction perpendicular to the direction in which the internal heat dissipating working fluid flows.
4. The heat radiation module set forth in claim 1, wherein the main body unit (1) has a heat absorption section (12) for absorbing heat of a heat source, the flow passage (11) extends to the heat absorption section (12), and the expansion chamber (112) is positioned so that a heat radiation working medium flows from the heat absorption section (12) to the actuation unit along the flow passage (11) through the expansion chamber (112).
5. The heat radiation module set forth in claim 1, wherein the heat radiation working medium in the flow channel (11) is of a single kind.
6. The heat radiation module set according to claim 5, wherein said heat radiation working medium is fluorinated liquid or silicone oil.
7. The heat radiation module set forth in claim 1, wherein the heat radiation working medium in the flow channel (11) is a mixed heat radiation working medium, and the mixed heat radiation working medium is provided with at least one base liquid and at least one dispersion liquid;
All base fluids and all dispersion fluids which form the mixed heat dissipation working medium respectively have different saturation temperatures under the same gas pressure.
8. The heat dissipating module of claim 7 wherein all of the base fluid and all of the dispersion that make up the hybrid heat dissipating medium are immiscible with each other.
9. The heat dissipating module of claim 7 wherein the base fluid is water, methanol, ethanol or a quicksand oil and the dispersion is a fluorinated fluid or a silicone oil.
10. The heat dissipating module of claim 7 wherein the saturation temperature of any of the base fluids is greater than the saturation temperature of the dispersion at the same gas pressure and a portion of the base fluid is not involved in the phase change heat transfer.
11. The heat radiation module set forth in any one of claims 1-10, wherein the actuation unit comprises an actuation element (2) and a cavity (3) disposed inside the main body unit (1);
Both sides of holding chamber (3) all communicate with runner (11), and hold the both sides of chamber (3) and be equipped with entry check valve (4) and export check valve (5) respectively, entry check valve (4) allow cooling medium to flow from runner (11) to holding chamber (3), export check valve (5) allow cooling medium to flow from holding chamber (3) to runner (11), actuating element (2) set up in main part unit (1) outside with hold the region that chamber (3) is relative, be used for promoting hold chamber (3) to produce the volume variation.
12. The heat radiation module set forth in any one of claims 1-10, wherein the actuating unit is a fluid pump (6), the exterior of the main body unit (1) is provided with at least one liquid inlet and at least one liquid outlet which are communicated with the flow channel (11), the liquid inlet is communicated with the liquid outlet of the fluid pump (6), the liquid outlet is communicated with the liquid inlet of the fluid pump (6), and the fluid pump (6) provides power for unidirectional circulation flow of the heat radiation working medium in the circulation flow channel.
13. The heat radiation module set forth in any one of claims 1-10, wherein the main body unit (1) is composed of at least two layers of film materials, all film materials being laminated and sealed together to form at least one closed space, the closed space constituting the flow passage (11).
14. The heat dissipating module of claim 13, wherein the main body unit (1) has an upper film (1-1), an intermediate film (1-2) and a lower film (1-3) stacked in this order in the thickness direction thereof, a void structure is provided on the intermediate film (1-2), the void structure is a groove and/or a hole penetrating the intermediate film (1-2), and the upper film (1-1) and the lower film (1-3) cover the void structure to form the flow channel (11).
15. The heat dissipating module of claim 14 wherein said upper film (1-1), said middle film (1-2) and said lower film (1-3) are made of at least one of a polymer material, a metal material, and a functional material formed by compounding a polymer material and a metal material.
16. The heat dissipating module of claim 13, wherein said main body unit (1) is formed in a patch shape having a thickness of 0.01mm to 2mm, and said flow path (11) has an equivalent diameter of 10 μm to 1mm.
17. An electronic device comprising the heat dissipation module of any one of claims 1-16.
18. An electronic device protection enclosure comprising the heat dissipation module of any one of claims 1-16.
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| WO2014007354A1 (en) * | 2012-07-06 | 2014-01-09 | 国立大学法人九州大学 | Ebullient cooling device |
| CN115696843A (en) * | 2021-07-27 | 2023-02-03 | 华为技术有限公司 | Liquid cold plate, liquid cooling system and electronic equipment |
| CN116658400A (en) * | 2023-08-01 | 2023-08-29 | 常州威图流体科技有限公司 | A fluid delivery device, a liquid-cooled heat dissipation module, and a microfluidic chip |
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| US20060065386A1 (en) * | 2004-08-31 | 2006-03-30 | Mohammed Alam | Self-actuating and regulating heat exchange system |
| JP6172060B2 (en) * | 2014-06-11 | 2017-08-02 | 株式会社デンソー | Cooler |
| CN105246302B (en) * | 2015-11-04 | 2017-06-30 | 天津商业大学 | A kind of heat-pipe radiating apparatus |
| CN217770738U (en) * | 2022-06-30 | 2022-11-08 | 歌尔股份有限公司 | Loop heat pipe structure and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014007354A1 (en) * | 2012-07-06 | 2014-01-09 | 国立大学法人九州大学 | Ebullient cooling device |
| CN115696843A (en) * | 2021-07-27 | 2023-02-03 | 华为技术有限公司 | Liquid cold plate, liquid cooling system and electronic equipment |
| CN116658400A (en) * | 2023-08-01 | 2023-08-29 | 常州威图流体科技有限公司 | A fluid delivery device, a liquid-cooled heat dissipation module, and a microfluidic chip |
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