CN118243262B - Manufacturing method of curved surface microstructure flexible pressure sensor - Google Patents
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
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- G—PHYSICS
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
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- G—PHYSICS
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- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
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Abstract
本发明公开了一种曲面微结构柔性压力传感器的制作方法，首先制作带有多个半球形薄膜结构的一级微结构薄膜，然后进行预拉伸，使得一级微结构薄膜上的多个半球形薄膜结构均被拉伸为平面结构，得到预拉伸薄膜，再在预拉伸薄膜每个被拉伸为平面结构的部分上制作多个二级微结构凸起，而后释放预拉伸薄膜的预拉伸应力，形成二级微结构薄膜，再将二级微结构薄膜和基底薄膜复合为一体式结构，得到二级微结构导电复合物薄膜，最后由二级微结构导电复合物薄膜、电极层、绝缘层和封装层组成曲面微结构柔性压力传感器。本发明利用柔性材料的预拉伸性，在一级微结构上形成二级微结构，显著提高传感器的灵敏度，延长柔性压力的线性响应区间，并增大整体的量程。
The present invention discloses a method for manufacturing a curved microstructure flexible pressure sensor, firstly manufacturing a primary microstructure film with a plurality of hemispherical film structures, then pre-stretching, so that the plurality of hemispherical film structures on the primary microstructure film are stretched into a plane structure, obtaining a pre-stretched film, then manufacturing a plurality of secondary microstructure protrusions on each portion of the pre-stretched film stretched into a plane structure, then releasing the pre-stretching stress of the pre-stretched film, forming a secondary microstructure film, then compounding the secondary microstructure film and the base film into an integrated structure, obtaining a secondary microstructure conductive composite film, and finally forming a curved microstructure flexible pressure sensor by the secondary microstructure conductive composite film, an electrode layer, an insulating layer and a packaging layer. The present invention utilizes the pre-stretching property of the flexible material to form a secondary microstructure on the primary microstructure, significantly improving the sensitivity of the sensor, extending the linear response interval of the flexible pressure, and increasing the overall range.
Description
技术领域Technical Field
本发明涉及柔性压力传感器技术领域，具体是一种曲面微结构柔性压力传感器的制作方法。The invention relates to the technical field of flexible pressure sensors, and in particular to a method for manufacturing a curved microstructure flexible pressure sensor.
背景技术Background Art
柔性压力传感器因其出色的灵敏度、可穿戴性和柔韧性，已经成为电子皮肤、软机器人和可穿戴电子产品等领域的关键技术。这些应用场景对传感器的机械性能、灵敏度和量程提出了更高的要求。传统的微结构柔性压力传感器主要通过在平面基底上生成微结构来实现，如沉积、溅射、刻蚀和压印等技术。然而，这种基于平面的加工方式限制了传感器灵敏度的提升，因为它难以在微观层面上有效地利用空间结构来增强传感性能。Flexible pressure sensors have become a key technology in the fields of electronic skin, soft robots, and wearable electronics due to their excellent sensitivity, wearability, and flexibility. These application scenarios place higher requirements on the mechanical properties, sensitivity, and range of sensors. Traditional microstructured flexible pressure sensors are mainly realized by generating microstructures on planar substrates, such as deposition, sputtering, etching, and imprinting. However, this plane-based processing method limits the improvement of sensor sensitivity because it is difficult to effectively utilize spatial structures at the microscopic level to enhance sensing performance.
金字塔结构压力传感器在低压范围内表现出高灵敏度和线性度，而其线性度范围过于有限。得益于结构均匀，柱式结构压力传感器具有良好的线性度，但压力灵敏度相对较低。多孔结构赋予传感器较低的模量和较好的柔韧性，但受孔隙制备工艺的限制，结构中空隙的分布不均匀，导致传感器的一致性差。至于可用的制备技术，它们对于微观结构制造来说太复杂了，无法实现大规模生产。The pyramid structure pressure sensor shows high sensitivity and linearity in the low pressure range, but its linearity range is too limited. Thanks to the uniform structure, the columnar structure pressure sensor has good linearity, but the pressure sensitivity is relatively low. The porous structure gives the sensor a lower modulus and better flexibility, but due to the limitations of the pore preparation process, the distribution of voids in the structure is uneven, resulting in poor consistency of the sensor. As for the available preparation technologies, they are too complex for microstructure manufacturing and cannot be achieved in large-scale production.
发明内容Summary of the invention
本发明要解决的技术问题是提供一种曲面微结构柔性压力传感器的制作方法，利用柔性材料的预拉伸性，从而在一级微结构上形成二级微结构，显著提高柔性压力传感器的灵敏度，且二级微结构还能够延长柔性压力的线性响应区间，并增大整体的量程。The technical problem to be solved by the present invention is to provide a method for manufacturing a curved microstructure flexible pressure sensor, which utilizes the pre-stretching property of the flexible material to form a secondary microstructure on the primary microstructure, thereby significantly improving the sensitivity of the flexible pressure sensor. The secondary microstructure can also extend the linear response range of the flexible pressure and increase the overall measuring range.
本发明的技术方案为：The technical solution of the present invention is:
一种曲面微结构柔性压力传感器的制作方法，具体包括有以下步骤：A method for manufacturing a curved microstructure flexible pressure sensor specifically comprises the following steps:
(1)、首先制作一级微结构的阴模具和阳模具，然后将复合混合物浇筑到阴模具上，然后阳模具下压，制得一级微结构薄膜，一级微结构薄膜上有多个呈矩阵排列的半球形薄膜结构；(1) First, a negative mold and a positive mold of a primary microstructure are prepared, and then the composite mixture is poured onto the negative mold, and then the positive mold is pressed down to obtain a primary microstructure film, on which a plurality of hemispherical film structures are arranged in a matrix;
(2)、对一级微结构薄膜进行预拉伸，使得一级微结构薄膜上的多个半球形薄膜结构均被拉伸为平面结构，得到预拉伸薄膜；(2) pre-stretching the primary microstructure film so that the multiple hemispherical film structures on the primary microstructure film are stretched into a planar structure to obtain a pre-stretched film;
(3)、将复合混合物浇筑到二级微结构模具呈矩阵排列的凹槽中，然后将预拉伸薄膜置于二级微结构模具上，使得二级微结构模具中的复合混合物粘接于预拉伸薄膜被拉伸为平面结构的部分上，从而在预拉伸薄膜每个被拉伸为平面结构的部分上均形成多个二级微结构凸起；(3) pouring the composite mixture into the grooves arranged in a matrix in the secondary microstructure mold, and then placing the pre-stretched film on the secondary microstructure mold, so that the composite mixture in the secondary microstructure mold is bonded to the portion of the pre-stretched film stretched into a planar structure, thereby forming a plurality of secondary microstructure protrusions on each portion of the pre-stretched film stretched into a planar structure;
(4)、脱模，然后释放预拉伸薄膜的预拉伸应力，使得预拉伸薄膜被拉伸为平面结构的部分均复位成半球形薄膜结构，每个半球形薄膜结构上均形成多个二级微结构凸起，从而形成二级微结构薄膜；(4) demolding, and then releasing the pre-stretching stress of the pre-stretched film, so that the parts of the pre-stretched film that were stretched into a planar structure are reset to a hemispherical film structure, and a plurality of secondary microstructure protrusions are formed on each hemispherical film structure, thereby forming a secondary microstructure film;
(5)、制作基底模具，基底模具上设置有多个呈矩阵排列的半球形凹槽，然后将流体状态下的复合混合物浇筑到基底模具上，得到正面有呈矩阵排列的半球形微结构、反面为平面的基底薄膜；(5) preparing a substrate mold, on which a plurality of hemispherical grooves arranged in a matrix are provided, and then pouring the composite mixture in a fluid state onto the substrate mold to obtain a substrate film having a hemispherical microstructure arranged in a matrix on the front side and a flat back side;
(6)、基底薄膜脱模后、固化前，将二级微结构薄膜附着于基底薄膜上，且二级微结构薄膜半球形薄膜结构的内球面朝向基底薄膜的半球形微结构且一一对应完全贴合，待基底薄膜完全固定后，即得到二级微结构导电复合物薄膜；(6) After the base film is demolded and before curing, the secondary microstructure film is attached to the base film, and the inner spherical surface of the hemispherical film structure of the secondary microstructure film faces the hemispherical microstructure of the base film and the two films are completely fitted one by one. After the base film is completely fixed, the secondary microstructure conductive composite film is obtained;
(7)、在两个二级微结构导电复合物薄膜的平面上均顺次设置有电极层、绝缘层和封装层，然后将两个二级微结构导电复合物薄膜带有微结构的表面相对，两个二级微结构导电复合物薄膜上的电极层分别与导线连接，从而制得曲面微结构柔性压力传感器。(7) An electrode layer, an insulating layer and a packaging layer are sequentially arranged on the planes of two secondary microstructure conductive composite films, and then the surfaces of the two secondary microstructure conductive composite films with microstructures are placed opposite to each other, and the electrode layers on the two secondary microstructure conductive composite films are respectively connected to wires, thereby obtaining a curved microstructure flexible pressure sensor.
所述的一级微结构的阴模具上设置有多个呈矩阵排列的半球形凹槽，一级微结构的阳模具上设置有多个呈矩阵排列的半球形凸起，阳模具上的半球形凸起和阴模具上的半球形凹槽上下一一对应，阳模具下压到位后，阴模具和阳模具之间的间距即为一级微结构薄膜的厚度。The negative mold of the primary microstructure is provided with a plurality of hemispherical grooves arranged in a matrix, and the positive mold of the primary microstructure is provided with a plurality of hemispherical protrusions arranged in a matrix. The hemispherical protrusions on the positive mold and the hemispherical grooves on the negative mold correspond one to another up and down. After the positive mold is pressed down into place, the distance between the negative mold and the positive mold is the thickness of the primary microstructure film.
所述的复合混合物的制备方法为：将碳纳米管通过超声处理均匀分散在溶剂中，得到均匀分散的碳纳米管溶液，然后将碳纳米管溶液与聚二甲基硅氧烷按1：10-50的质量比混合均匀后，蒸发以去除其中的溶剂，最后添加己烷和固化剂并混合，得到复合混合物。The preparation method of the composite mixture is as follows: uniformly dispersing carbon nanotubes in a solvent by ultrasonic treatment to obtain a uniformly dispersed carbon nanotube solution, then uniformly mixing the carbon nanotube solution with polydimethylsiloxane at a mass ratio of 1:10-50, evaporating to remove the solvent therein, and finally adding hexane and a curing agent and mixing to obtain a composite mixture.
所述的对一级微结构薄膜进行预拉伸的具体步骤为：将一级微结构薄膜沿横向和纵向进行四周水平预拉伸，预拉伸时，在一级微结构薄膜正面的正上方布设多个呈矩阵排列的中心激光位移传感器和一个平面激光位移传感器，每个中心激光位移传感器分别朝向多个半球形薄膜结构顶端的中心点处，一个平面激光位移传感器朝向一级微结构薄膜正面的平面部分，当多个中心激光位移传感器采集的位移值均位于平面激光位移传感器采集位移值的误差范围内后，再进行3-5％伸长量的预拉伸，保证一级微结构薄膜预拉伸后平面的平整度。The specific steps of pre-stretching the primary microstructure film are as follows: pre-stretching the primary microstructure film horizontally in all directions in the transverse and longitudinal directions. During pre-stretching, a plurality of central laser displacement sensors and a plane laser displacement sensor arranged in a matrix are arranged directly above the front of the primary microstructure film. Each central laser displacement sensor faces the center point of the top of a plurality of hemispherical film structures, and a plane laser displacement sensor faces the plane part of the front of the primary microstructure film. When the displacement values collected by the plurality of central laser displacement sensors are all within the error range of the displacement values collected by the plane laser displacement sensor, pre-stretching with an elongation of 3-5% is performed to ensure the flatness of the plane of the primary microstructure film after pre-stretching.
所述的二级微结构模具上设置有多组凹槽，每组凹槽与预拉伸薄膜每个被拉伸为平面结构的部分重叠，每组凹槽均包括有多个呈矩阵排列的二级微结构凹槽。The secondary microstructure mold is provided with a plurality of groups of grooves, each group of grooves overlaps with each part of the pre-stretched film stretched into a planar structure, and each group of grooves includes a plurality of secondary microstructure grooves arranged in a matrix.
所述的二级微结构凸起为金子塔凸起结构、半球形凸起结构、圆锥形凸起结构或柱状凸起结构。The secondary microstructure protrusions are pyramid protrusion structures, hemispherical protrusion structures, conical protrusion structures or columnar protrusion structures.
所述的二级微结构薄膜和基底薄膜的制作同步进行，然后在二级微结构薄膜的二级微结构凸起固化前、基底薄膜固化前，将二级微结构薄膜附着于基底薄膜上，然后二级微结构薄膜和基底薄膜同步固化，得到二级微结构导电复合物薄膜。The secondary microstructure film and the base film are manufactured simultaneously, and then before the secondary microstructure protrusions of the secondary microstructure film are solidified and before the base film is solidified, the secondary microstructure film is attached to the base film, and then the secondary microstructure film and the base film are solidified simultaneously to obtain a secondary microstructure conductive composite film.
所述的电极层通过金属蒸发沉积或溅射沉积的方式附着于二级微结构导电复合物薄膜的平面上。The electrode layer is attached to the plane of the secondary microstructure conductive composite film by metal evaporation deposition or sputtering deposition.
所述的绝缘层选用PI绝缘层。The insulating layer is a PI insulating layer.
本发明的优点：Advantages of the present invention:
(1)、本发明采用两种模具分别注塑形成一级微结构和二级微结构，传统的采用一次脱模注塑成型的多级微结构在脱膜的时候易出现多级微结构损坏的问题，通过两次注塑的方式可以有效减少微结构的损坏，保证柔性压力传感器制作结构的稳定性，提高了微结构的制备精度，降低后续生产过程中的废品率，从而降低整体生产成本。(1) The present invention adopts two kinds of molds to form the primary microstructure and the secondary microstructure by injection molding respectively. The traditional multi-level microstructure formed by one-time demolding injection molding is prone to the problem of multi-level microstructure damage during demolding. The double injection molding method can effectively reduce the damage of the microstructure, ensure the stability of the flexible pressure sensor manufacturing structure, improve the preparation accuracy of the microstructure, reduce the scrap rate in the subsequent production process, and thus reduce the overall production cost.
(2)、本发明通过两次注塑加拉伸的过程，使得导电复合物薄膜在微结构形成后获得更好的拉伸性能和强度，有助于提高柔性压力传感器的耐久性和抗干扰能力，在长时间使用中能够更好地保持其性能；且通过拉伸，可以使导电复合物薄膜中的晶粒重新排列，提高晶粒取向度，同时对预拉伸的不同应力进行控制，可以对微结构接触刚度进行调整，调控柔性压力传感器的量程和灵敏度。(2) The present invention uses a two-step injection molding plus stretching process to enable the conductive composite film to obtain better tensile properties and strength after the microstructure is formed, which helps to improve the durability and anti-interference ability of the flexible pressure sensor and better maintain its performance during long-term use; and through stretching, the grains in the conductive composite film can be rearranged to improve the grain orientation. At the same time, by controlling the different pre-stretching stresses, the microstructure contact stiffness can be adjusted to regulate the range and sensitivity of the flexible pressure sensor.
(3)、本发明使用一级微结构模具和二级微结构模具分别制作不同级别的微结构，可以实现金子塔、半球状、圆锥形、柱状等二级微结构的制作，利用不同微结构的优势可以制作不同曲面形状微结构的柔性压力传感器，从而更好地适应不同的压力传感器应用场景。(3) The present invention uses a primary microstructure mold and a secondary microstructure mold to respectively manufacture microstructures of different levels, and can realize the manufacture of secondary microstructures such as a pyramid, a hemisphere, a cone, and a column. By utilizing the advantages of different microstructures, flexible pressure sensors with microstructures of different curved shapes can be manufactured, thereby better adapting to different pressure sensor application scenarios.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明的流程示意图。FIG. 1 is a schematic diagram of the process of the present invention.
图2是发明基底模具的结构示意图。FIG. 2 is a schematic structural diagram of the inventive substrate mold.
图3是本发明制得的二级微结构导电复合物薄膜的结构示意图一。FIG. 3 is a first schematic diagram of the structure of the secondary microstructure conductive composite film obtained in the present invention.
图4是本发明制得的二级微结构导电复合物薄膜的结构示意图二。FIG. 4 is a second schematic diagram of the structure of the secondary microstructure conductive composite film obtained in the present invention.
图5是本发明制得的曲面微结构柔性压力传感器的结构示意图。FIG. 5 is a schematic structural diagram of a curved microstructure flexible pressure sensor manufactured by the present invention.
图6是本发明二级微结构导电复合物薄膜受压接触的放大视图一。FIG. 6 is an enlarged view of the second-level microstructure conductive composite film of the present invention under pressure contact.
图7是本发明二级微结构导电复合物薄膜受压接触的放大视图二。FIG. 7 is a second enlarged view of the pressure contact of the secondary microstructure conductive composite film of the present invention.
图8是本发明传统微结构柔性压力传感器压力P和电导率Cond的标定线性度示意图。FIG8 is a schematic diagram of the calibration linearity of the pressure P and the conductivity Cond of the conventional microstructure flexible pressure sensor of the present invention.
图9是本发明曲面微结构柔性压力传感器压力P和电导率Cond的标定线性度示意图。FIG. 9 is a schematic diagram of the calibration linearity of the pressure P and the conductivity Cond of the curved microstructure flexible pressure sensor of the present invention.
图10超重力条件下的实验模型示意图。Fig. 10 Schematic diagram of the experimental model under hypergravity conditions.
附图标记：1-一级微结构薄膜，11-半球形薄膜结构，2-预拉伸薄膜，21-二级微结构凸起，3-二级微结构薄膜，4-基底薄膜，41-半球形微结构，5-基底模具，51-基底模具的半球形凹槽，6-二级微结构导电复合物薄膜，7-电极层，8-PI绝缘层，9-封装层，10-导线，01-土体，02-液压机，03-曲面微结构柔性压力传感器。Figure markings: 1-primary microstructure film, 11-hemispherical film structure, 2-pre-stretched film, 21-secondary microstructure protrusion, 3-secondary microstructure film, 4-base film, 41-hemispherical microstructure, 5-base mold, 51-hemispherical groove of base mold, 6-secondary microstructure conductive composite film, 7-electrode layer, 8-PI insulating layer, 9-packaging layer, 10-wire, 01-soil, 02-hydraulic press, 03-curved microstructure flexible pressure sensor.
具体实施方式DETAILED DESCRIPTION
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
见图1，一种曲面微结构柔性压力传感器的制作方法，具体包括有以下步骤：As shown in FIG1 , a method for manufacturing a curved microstructure flexible pressure sensor specifically includes the following steps:
(1)、复合混合物的制备：将多壁碳纳米管(MWNT)通过超声处理均匀分散在氯仿溶剂中，得到均匀分散的碳纳米管溶液，然后将碳纳米管溶液与聚二甲基硅氧烷(PDMS)按1：10-50的质量比混合均匀后，蒸发以去除其中的溶剂，最后添加己烷和固化剂并混合，得到复合混合物；(1) Preparation of a composite mixture: multi-walled carbon nanotubes (MWNT) are uniformly dispersed in a chloroform solvent by ultrasonic treatment to obtain a uniformly dispersed carbon nanotube solution, and then the carbon nanotube solution is uniformly mixed with polydimethylsiloxane (PDMS) in a mass ratio of 1:10-50, and then evaporated to remove the solvent therein, and finally hexane and a curing agent are added and mixed to obtain a composite mixture;
(2)、首先制作一级微结构的阴模具和阳模具，一级微结构的阴模具上设置有多个呈矩阵排列的半球形凹槽，一级微结构的阳模具上设置有多个呈矩阵排列的半球形凸起，阳模具上的半球形凸起和阴模具上的半球形凹槽上下一一对应，然后将复合混合物浇筑到阴模具上，然后阳模具下压，制得一级微结构薄膜1，一级微结构薄膜1上有多个呈矩阵排列的半球形薄膜结构11；其中，阳模具下压到位后，阴模具和阳模具之间的间距即为一级微结构薄膜的厚度；(2) First, a negative mold and a positive mold of a primary microstructure are prepared, wherein the negative mold of the primary microstructure is provided with a plurality of hemispherical grooves arranged in a matrix, and the positive mold of the primary microstructure is provided with a plurality of hemispherical protrusions arranged in a matrix, and the hemispherical protrusions on the positive mold correspond to the hemispherical grooves on the negative mold in a one-to-one manner, and then the composite mixture is poured onto the negative mold, and then the positive mold is pressed down to obtain a primary microstructure film 1, and the primary microstructure film 1 has a plurality of hemispherical film structures 11 arranged in a matrix; wherein, after the positive mold is pressed down into place, the distance between the negative mold and the positive mold is the thickness of the primary microstructure film;
(3)、对一级微结构薄膜1进行预拉伸，具体是将一级微结构薄膜1沿横向和纵向进行四周水平预拉伸，预拉伸时，在一级微结构薄膜1正面的正上方布设多个呈矩阵排列的中心激光位移传感器和一个平面激光位移传感器，每个中心激光位移传感器分别朝向多个半球形薄膜结构11顶端的中心点处，一个平面激光位移传感器朝向一级微结构薄膜1正面的平面部分，当多个中心激光位移传感器采集的位移值均位于平面激光位移传感器采集位移值的误差范围内后，再进行3-5％伸长量的预拉伸，使得一级微结构薄膜1上的多个半球形薄膜结构11均被拉伸为平面结构，且保证一级微结构薄膜1预拉伸后平面的平整度，从而得到预拉伸薄膜2；(3) Pre-stretching the primary microstructure film 1, specifically, pre-stretching the primary microstructure film 1 horizontally and longitudinally on all sides. During pre-stretching, a plurality of central laser displacement sensors and a plane laser displacement sensor arranged in a matrix are arranged directly above the front of the primary microstructure film 1. Each central laser displacement sensor faces the center point of the top of a plurality of hemispherical film structures 11, and a plane laser displacement sensor faces the plane part of the front of the primary microstructure film 1. When the displacement values collected by the plurality of central laser displacement sensors are all within the error range of the displacement values collected by the plane laser displacement sensor, a pre-stretching with an elongation of 3-5% is performed, so that the plurality of hemispherical film structures 11 on the primary microstructure film 1 are stretched into a plane structure, and the flatness of the plane of the primary microstructure film 1 after pre-stretching is ensured, thereby obtaining a pre-stretched film 2;
(4)、制作二级微结构模具，二级微结构模具上设置有多组凹槽，每组凹槽与预拉伸薄膜2每个被拉伸为平面结构的部分重叠，每组凹槽均包括有多个呈矩阵排列的二级微结构凹槽，将复合混合物浇筑到二级微结构模具的二级微结构凹槽中，然后将预拉伸薄膜2置于二级微结构模具上，使得二级微结构模具中的复合混合物粘接于预拉伸薄膜2被拉伸为平面结构的部分上，从而在预拉伸薄膜2每个被拉伸为平面结构的部分上均形成多个二级微结构凸起21；(4) preparing a secondary microstructure mold, wherein the secondary microstructure mold is provided with a plurality of groups of grooves, each group of grooves overlaps with each portion of the pre-stretched film 2 stretched into a planar structure, and each group of grooves includes a plurality of secondary microstructure grooves arranged in a matrix, and pouring the composite mixture into the secondary microstructure grooves of the secondary microstructure mold, and then placing the pre-stretched film 2 on the secondary microstructure mold, so that the composite mixture in the secondary microstructure mold is bonded to the portion of the pre-stretched film 2 stretched into a planar structure, thereby forming a plurality of secondary microstructure protrusions 21 on each portion of the pre-stretched film 2 stretched into a planar structure;
(5)、脱模，然后释放预拉伸薄膜2的预拉伸应力，使得预拉伸薄膜2被拉伸为平面结构的部分均复位成半球形薄膜结构11，每个半球形薄膜结构11上均形成多个二级微结构凸起21，二级微结构凸起21为半球形凸起结构(见图3)或圆锥形凸起结构(见图4)，从而形成二级微结构薄膜3；其中，半球形凸起结构的线性度更好：半球形凸起结构的几何形状导致施加在柔性压力传感器上的应变在整体结构上均匀分布，有助于产生更加均匀的电信号响应，由于应变的均匀分布，柔性压力传感器的输出与施加的压力之间的关系更加线性，使得柔性压力传感器的响应更容易被建模和预测，进而实现更好的线性度；圆锥形凸起结构的灵敏度更好：圆锥形凸起结构的尖端使得施加在柔性压力传感器上的应变在尖端附近集中，尖端处的形变会相对较大，使得在尖端处的应变更大，引起更大的电信号变化，因此，柔性压力传感器对于施加的小的压力变化更加敏感，产生更大的电信号响应，从而具有更好的灵敏度；(5) Demolding, and then releasing the pre-stretching stress of the pre-stretched film 2, so that the parts of the pre-stretched film 2 that are stretched into a planar structure are reset to a hemispherical film structure 11, and a plurality of secondary microstructure protrusions 21 are formed on each hemispherical film structure 11, and the secondary microstructure protrusions 21 are hemispherical protrusion structures (see FIG. 3) or conical protrusion structures (see FIG. 4), thereby forming a secondary microstructure film 3; wherein the hemispherical protrusion structure has better linearity: the geometric shape of the hemispherical protrusion structure causes the strain applied to the flexible pressure sensor to be evenly distributed on the overall structure, which helps to generate a more uniform electrical signal Response: Due to the uniform distribution of strain, the relationship between the output of the flexible pressure sensor and the applied pressure is more linear, making the response of the flexible pressure sensor easier to model and predict, thereby achieving better linearity; The sensitivity of the conical convex structure is better: The tip of the conical convex structure makes the strain applied to the flexible pressure sensor concentrated near the tip, and the deformation at the tip will be relatively large, making the strain at the tip larger, causing a larger electrical signal change. Therefore, the flexible pressure sensor is more sensitive to small applied pressure changes, produces a larger electrical signal response, and thus has better sensitivity;
(6)、制作基底模具5(见图2)，基底模具5上设置有多个呈矩阵排列的半球形凹槽51，然后将流体状态下的复合混合物浇筑到基底模具5上，得到正面有呈矩阵排列的半球形微结构41、反面为平面的基底薄膜4；(6) preparing a base mold 5 (see FIG. 2 ), on which a plurality of hemispherical grooves 51 arranged in a matrix are provided, and then pouring the composite mixture in a fluid state onto the base mold 5 to obtain a base film 4 having hemispherical microstructures 41 arranged in a matrix on the front side and a flat back side;
(7)、基底薄膜4脱模后、固化前，将二级微结构薄膜3附着于基底薄膜4上，且二级微结构薄膜3半球形薄膜结构21的内球面朝向基底薄膜4的半球形微结构41且一一对应完全贴合，待基底薄膜4完全固定后，即得到二级微结构导电复合物薄膜6；(7) After the base film 4 is demolded and before curing, the secondary microstructure film 3 is attached to the base film 4, and the inner spherical surface of the hemispherical film structure 21 of the secondary microstructure film 3 faces the hemispherical microstructure 41 of the base film 4 and they are completely fitted one by one. After the base film 4 is completely fixed, the secondary microstructure conductive composite film 6 is obtained;
(8)、在两个二级微结构导电复合物薄膜6的平面上均顺次设置有电极层7(金属蒸发沉积或溅射沉积)、PI绝缘层8和封装层9，然后将两个二级微结构导电复合物薄膜6带有微结构的表面相对，两个二级微结构导电复合物薄膜上的电极层7分别与导线10连接，从而制得曲面微结构柔性压力传感器(见图5)。(8) An electrode layer 7 (metal evaporation deposition or sputtering deposition), a PI insulating layer 8 and a packaging layer 9 are sequentially arranged on the planes of the two secondary microstructure conductive composite films 6, and then the surfaces with microstructures of the two secondary microstructure conductive composite films 6 are placed opposite to each other, and the electrode layers 7 on the two secondary microstructure conductive composite films are respectively connected to the wires 10, thereby obtaining a curved microstructure flexible pressure sensor (see FIG. 5 ).
其中，二级微结构薄膜3和基底薄膜4的制作同步进行，然后在二级微结构薄膜3的二级微结构凸起21固化前、基底薄膜4固化前，将二级微结构薄膜3附着于基底薄膜4上，然后二级微结构薄膜3和基底薄膜4同步固化，得到二级微结构导电复合物薄膜6，固化同步进行，从而大大节省了制作时间。Among them, the production of the secondary microstructure film 3 and the base film 4 is carried out simultaneously, and then before the secondary microstructure protrusions 21 of the secondary microstructure film 3 are cured and before the base film 4 is cured, the secondary microstructure film 3 is attached to the base film 4, and then the secondary microstructure film 3 and the base film 4 are cured simultaneously to obtain the secondary microstructure conductive composite film 6, and the curing is carried out simultaneously, thereby greatly saving the production time.
实施例1Example 1
在人体脉搏表面应用的微结构柔性压力传感器能够精确测量微小的脉搏跳动，并具备对外界较大力冲击的监测能力。这种传感器通过其精细的微结构设计，不仅可以捕捉到人体脉搏产生的细微变化，还能够有效识别和响应来自外部的较大力量冲击。The microstructured flexible pressure sensor applied on the surface of the human pulse can accurately measure tiny pulse beats and has the ability to monitor large external force impacts. Through its fine microstructure design, this sensor can not only capture the subtle changes in the human pulse, but also effectively identify and respond to large external force impacts.
首先，将制作好的曲面微结构柔性压力传感器通过医用硅胶精确地粘贴在受试者手腕的脉搏位置。在粘贴过程中，确保曲面微结构柔性压力传感器的中心部位正对脉搏跳动最强烈的区域，使用量为0.1毫升的医用硅胶均匀涂抹于曲面微结构柔性压力传感器背面，轻压30秒以保证良好的粘合效果和信号传输稳定性。随后，通过导线10将曲面微结构柔性压力传感器连接至American NI USB 6009数据采集卡，并设置计算机上数据处理软件(如LabVIEW)的采样频率为1000Hz，以捕捉高精度的脉搏信号。此外，采用高通滤波和低通滤波组合的方法，去除噪声干扰，确保数据的准确性和可靠性。First, the prepared curved microstructure flexible pressure sensor is precisely pasted to the pulse position of the subject's wrist through medical silicone. During the pasting process, ensure that the center of the curved microstructure flexible pressure sensor is facing the area with the strongest pulse beating. Use 0.1 ml of medical silicone to evenly apply it on the back of the curved microstructure flexible pressure sensor, and press lightly for 30 seconds to ensure good bonding effect and signal transmission stability. Subsequently, the curved microstructure flexible pressure sensor is connected to the American NI USB 6009 data acquisition card through wire 10, and the sampling frequency of the data processing software (such as LabVIEW) on the computer is set to 1000Hz to capture high-precision pulse signals. In addition, a combination of high-pass filtering and low-pass filtering is used to remove noise interference and ensure the accuracy and reliability of the data.
进一步进行外部冲击荷载测试，轻轻敲击曲面微结构柔性压力传感器3次，每次敲击间隔约2秒，力度保持一致，以模拟日常可能遇到的轻微撞击情形。敲击时，曲面微结构柔性压力传感器两层二级微结构导电复合物薄膜的二级微结构凸起21会接触挤压(见图6和图7)，通过LabVIEW软件实时观察和记录传感器在敲击过程中的电信号变化，特别关注敲击瞬间曲面微结构柔性压力传感器输出信号的波形和幅度变化。测试结果显示，每次轻轻敲击曲面微结构柔性压力传感器时，曲面微结构柔性压力传感器的输出信号均出现了明显的瞬时波峰，与正常脉搏信号相比，这些波峰具有更高的幅度和更短的持续时间，清晰地反映了外部冲击荷载的特点。通过对这些波形的分析，可以确定曲面微结构柔性压力传感器对外部冲击的灵敏度和响应速度。Further external impact load test was conducted, and the curved microstructure flexible pressure sensor was gently tapped 3 times, with an interval of about 2 seconds between each tap, and the force was kept consistent to simulate the slight impact that may be encountered in daily life. When tapping, the secondary microstructure protrusions 21 of the two layers of secondary microstructure conductive composite film of the curved microstructure flexible pressure sensor will contact and squeeze (see Figures 6 and 7). The changes in the electrical signals of the sensor during the tapping process were observed and recorded in real time by LabVIEW software, with special attention paid to the waveform and amplitude changes of the output signal of the curved microstructure flexible pressure sensor at the moment of tapping. The test results show that each time the curved microstructure flexible pressure sensor is gently tapped, the output signal of the curved microstructure flexible pressure sensor has obvious instantaneous peaks. Compared with the normal pulse signal, these peaks have higher amplitudes and shorter durations, which clearly reflect the characteristics of the external impact load. By analyzing these waveforms, the sensitivity and response speed of the curved microstructure flexible pressure sensor to external impact can be determined.
将传统微结构柔性压力传感器和本发明制得的曲面微结构柔性压力传感器进行压力P和电导率Cond的标定测试，得到线性度示意图(见图8和图9)。从图8和图9得知，曲面微结构柔性压力传感器可以使得柔性压力传感器在较宽的测量范围内保持良好的线性度，相较于传统的微结构柔性压力传感器有很大的优势。The conventional microstructure flexible pressure sensor and the curved microstructure flexible pressure sensor prepared by the present invention were calibrated for pressure P and conductivity Cond to obtain linearity schematic diagrams (see Figures 8 and 9). As shown in Figures 8 and 9, the curved microstructure flexible pressure sensor can maintain good linearity in a wider measurement range, which is a great advantage over the conventional microstructure flexible pressure sensor.
实施例2Example 2
见图10，在超重力条件下，土体01受到液压机02的压力会显著增大，使用传统的刚性土压力传感器时，其埋设可能会扰动土体原有的应力分布，影响测量结果的准确性。相比之下，曲面微结构柔性压力传感器03以其可随土体01同步协调变形的特性，有效克服了这一缺陷。曲面微结构柔性压力传感器不仅能够在常规重力条件下准确测量力的大小，对于超重力环境下土体所承受的较大压力也能进行精确监测，从而为岩土体可能发生的灾害变化提供及时预警。As shown in Figure 10, under hypergravity conditions, the pressure on the soil 01 by the hydraulic press 02 will increase significantly. When using traditional rigid soil pressure sensors, their burial may disturb the original stress distribution of the soil, affecting the accuracy of the measurement results. In contrast, the curved microstructure flexible pressure sensor 03, with its characteristic of synchronous and coordinated deformation with the soil 01, effectively overcomes this defect. The curved microstructure flexible pressure sensor can not only accurately measure the magnitude of force under conventional gravity conditions, but also accurately monitor the greater pressure on the soil under hypergravity, thereby providing timely warnings for possible disaster changes in the rock and soil.
当液压机02的外部加载作用于土体01时，不同位置处的压力分布会发生变化。通过埋设在土体中的曲面微结构柔性压力传感器03，可以实时监测并记录土体01内部各个位置的压力变化情况。曲面微结构柔性压力传感器03的微小尺寸和灵活性使其能够适应复杂的土体结构并实现高精度的压力测量。When the external load of the hydraulic press 02 acts on the soil 01, the pressure distribution at different positions will change. Through the curved microstructure flexible pressure sensor 03 buried in the soil, the pressure changes at various positions inside the soil 01 can be monitored and recorded in real time. The small size and flexibility of the curved microstructure flexible pressure sensor 03 enable it to adapt to complex soil structures and achieve high-precision pressure measurement.
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
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