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CN118241183B - Chemical vapor deposition air supply system - Google Patents

Chemical vapor deposition air supply system Download PDF

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Publication number
CN118241183B
CN118241183B CN202410675123.9A CN202410675123A CN118241183B CN 118241183 B CN118241183 B CN 118241183B CN 202410675123 A CN202410675123 A CN 202410675123A CN 118241183 B CN118241183 B CN 118241183B
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pressure
block
regulating
source
adjusting
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CN202410675123.9A
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CN118241183A (en
Inventor
徐瑞荣
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Hongge Semiconductor Equipment Shanghai Co ltd
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Hongge Semiconductor Equipment Shanghai Co ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45557Pulsed pressure or control pressure
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561Gas plumbing upstream of the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The invention relates to the technical field of semiconductors, in particular to a chemical vapor deposition air supply system, which comprises an air inlet module, an MO source module and a reaction module, wherein the air inlet module comprises an air inlet first pipeline and an air inlet second pipeline, the air inlet module is connected with the MO source module through the air inlet first pipeline, the air inlet module is connected with the reaction module through the air inlet second pipeline, and the MO source module is connected with the reaction module; the MO source module comprises an MO source first pipeline, an MO source second pipeline and a pressure balancing device, wherein the MO source first pipeline and the MO source second pipeline are both connected with the pressure balancing device so that the pressure in the MO source first pipeline and the pressure in the MO source second pipeline are balanced, the MO source first pipeline is connected with the reaction module, and the MO source second pipeline is connected with the exhaust system. The chemical vapor deposition air supply system can balance the pressure in the pipeline in real time, avoid pressure fluctuation, reduce the number of parts on the whole air supply pipeline and improve the production precision and accuracy.

Description

Chemical vapor deposition air supply system
Technical Field
The application relates to the technical field of semiconductors, in particular to a chemical vapor deposition air supply system.
Background
In the production of semiconductors, such as integrated circuit chips, metal interconnect technology is often used to connect electronic circuits having specific functions. In the prior art, chemical vapor deposition (chemical vapor deposition, CVD) equipment is often used to complete the interconnection process of metal films, and in the metal organic chemical vapor deposition equipment, the pressure of the two pipelines needs to be ensured to be consistent during the process of the discharge pipeline and the process pipeline, so as to ensure that no pressure fluctuation exists at the moment of air supply.
In the process of the production technology of the chemical vapor deposition equipment, the pressure regulation of the gas in the gas supply system is very important, and the fluctuation and the pressure difference of the gas pressure can seriously influence the quality of the product, and specifically, the method can comprise the following aspects: 1. the accuracy of the control of the gas flow controller is affected; 2. affecting film formation quality of the semiconductor device; 3. the phenomenon of blocking the pipeline occurs during the flowing process of the gas due to the fluctuation of the pressure. In addition, the different processes require different gas flows, and the fluctuation of the gas flows can cause the pressure inside the pipeline to change.
In the prior equipment gas supply system in metal organic chemical vapor deposition, a combination of two gas flow controllers and a pressure difference meter is generally adopted, and the pressure of a discharge pipeline and the pressure of a process pipeline are balanced in real time through the controllers. The pipelines of the two gas circuits are regulated by the independently arranged pressure regulating valves, so that the pressure of the two gas circuits is consistent, when the flow of one pipeline is changed, the pressure at the rear end of the pressure regulator is also changed, and an operator is required to manually regulate the pressure regulating valves to balance the pressure of the pipelines. In the adjusting process, because the pressure of two paths is difficult to be adjusted once and consistent, the requirements on experience and operation level of operators are high, and the requirements on precision and accuracy are high for the production of semiconductors, so that a fine gap is not acceptable. In addition, in the equipment gas supply system in metal organic chemical vapor deposition, because the MO source quantity is more (high-purity metal organic compound), the related process pipelines are also more, so that a plurality of groups of discharge pipelines and process pipelines are related, the gas pressure in the pipelines needs to be balanced in pairs, and the adjustment difficulty is further improved for operators.
Therefore, it is desirable to design a chemical vapor deposition gas supply system to solve the above-mentioned problems.
Disclosure of Invention
In view of the above, in order to overcome the defects of the prior art, the invention provides a chemical vapor deposition air supply system, which effectively solves the problems that the existing air supply system cannot ensure accurate balance of the pressure in a discharge pipeline and a process pipeline and the pressure in the pipeline is difficult to adjust.
The invention provides a chemical vapor deposition air supply system, wherein the chemical vapor deposition air supply system comprises: the system comprises an air inlet module, an MO source module and a reaction module, wherein the air inlet module comprises an air inlet first pipeline and an air inlet second pipeline, the air inlet module is connected with the MO source module through the air inlet first pipeline, the air inlet module is connected with the reaction module through the air inlet second pipeline, and the MO source module is connected with the reaction module; the MO source module comprises an MO source first pipeline, an MO source second pipeline and a pressure balancing device, wherein the MO source first pipeline and the MO source second pipeline are connected with the pressure balancing device so as to balance the pressure in the MO source first pipeline and the pressure in the MO source second pipeline, the MO source first pipeline is connected with the reaction module, and the MO source second pipeline is connected with an exhaust system; The pressure balancing device comprises a shell, wherein the shell comprises an inlet end, a first outlet end and a second outlet end, the first outlet end and the second outlet end are respectively connected with the inlet end through air passages, the inlet end is connected with the air inlet first pipeline, and the first outlet end and the second outlet end are respectively connected with the MO source first pipeline and the MO source second pipeline; the inside of the shell is provided with a pressure regulating part and a pressure balancing part which are communicated with each other, and the pressure regulating part and the pressure balancing part are connected with the inlet end, the first outlet end and the second outlet end; the pressure regulating part comprises an active regulating component for regulating the pressure inside the shell and a pressure balancing component for balancing the pressure of the first outlet end and the pressure of the second outlet end, the pressure balancing component comprises a first regulating block and a second regulating block, the first regulating block is arranged in an air passage connected with the first outlet end and the inlet end, the second regulating block is arranged in an air passage connected with the second outlet end and the inlet end, and the first regulating block and the second regulating block are in transmission connection so that the first regulating block and the second regulating block can synchronously move; The active adjusting component is connected with the first adjusting block and the second adjusting block, and can synchronously drive the first adjusting block and the second adjusting block to change positions so as to change the size of the air passage, and then the pressure in the shell is changed by adjusting the air flow in the air passage; the pressure balancing part comprises a first adjusting part, a second adjusting part and a synchronous runner, wherein the first adjusting part is arranged in an air passage with a first outlet end connected with an inlet end, the second adjusting part is arranged in an air passage with a second outlet end connected with the inlet end, the air passage with the first outlet end connected with the inlet end and the air passage with the second outlet end connected with the inlet end are connected with the synchronous runner, the first adjusting part and the second adjusting part are respectively arranged at two ends of the synchronous runner, and the first adjusting part and the second adjusting part are respectively in butt joint with the first adjusting block and the second adjusting block; Under the condition that the pressure of the first outlet end is different from that of the second outlet end, the positions of the first regulating block and the second regulating block are different, the positions of the first regulating member and the second regulating member are different, the pressure balance assembly is in an unbalanced state, the pressures at the two ends of the synchronous runner are different so that the first regulating member and the second regulating member change positions until the positions are the same, and the first regulating block and the second regulating block change positions through the driving of the first regulating member and the second regulating member so that the pressures of the first outlet end and the second outlet end are the same, and the pressure balance assembly is switched from the unbalanced state to the balanced state.
Preferably, the MO source module comprises a plurality of MO source units, each MO source unit comprises a MO source first pipe, a MO source second pipe and a pressure balancing device, the MO source unit further comprises a MO source third pipe, the air inlet first pipe is connected to the inlet end of the pressure balancing device through the MO source third pipe, and the MO source first pipe and the MO source second pipe are connected to the first outlet end of the pressure balancing device and the second outlet end of the pressure balancing device, respectively.
Preferably, a pressure regulating cavity is arranged on the upper portion of the inside of the shell, the pressure balancing component and the active regulating component are arranged in the pressure regulating cavity, an air inlet runner, a first air inlet cavity, a second air inlet cavity, a first air outlet runner and a second air outlet runner are arranged on the lower portion of the pressure regulating cavity, the air inlet runner is connected with the inlet end, two ends of the air inlet runner are respectively connected with the first air inlet cavity and the second air inlet cavity, the first air inlet cavity and the second air inlet cavity are respectively connected with the pressure regulating cavity, the first air outlet runner and the second air outlet runner are respectively connected with the pressure regulating cavity, and the first air outlet runner and the second air outlet runner are respectively connected with the first outlet end and the second outlet end.
Preferably, the pressure regulating cavity comprises a first sub-cavity and a second sub-cavity corresponding to the first air outlet flow channel and the second air outlet flow channel respectively; the active adjusting assembly comprises a handle, a push rod, a pressure spring, a first pressure block and a second pressure block, wherein the handle is arranged outside the shell and is rotatably connected with the shell, the push rod is connected with the handle, the push rod is enabled to move along a first direction or a second direction through rotation of the handle, two ends of the push rod are respectively connected with the first adjusting block and the second adjusting block to enable the first adjusting block and the second adjusting block to synchronously move, the first adjusting block is connected with the first pressure block through the pressure spring, the second adjusting block is connected with the second pressure block through the pressure spring, and the first pressure block and the second pressure block are respectively arranged in the first sub-cavity and the second sub-cavity.
Preferably, a first gas flow cavity is arranged between the first pressure block and the first air outlet flow channel, and a second gas flow cavity is arranged between the second pressure block and the second air outlet flow channel.
Preferably, the first adjusting member is abutted to the first pressure block through a first diaphragm, the second adjusting member is abutted to the second pressure block through a second diaphragm, the first diaphragm is disposed between the first gas flow chamber and the first pressure block, and the second diaphragm is disposed between the second gas flow chamber and the second pressure block.
Preferably, the first adjusting member includes a first linkage rod, where the first linkage rod is connected to the first membrane, and the first membrane can be bent along a first direction or a second direction to drive the first linkage rod to move; the second adjusting piece comprises a second linkage rod, the second linkage rod is connected with the second diaphragm, and the second diaphragm can be bent along the first direction or the second direction to drive the second linkage rod to move.
Preferably, the pressure balance assembly further comprises a balance spring and an adjusting gear piece, the connection parts of the first adjusting block and the second adjusting block and the pushing rod are respectively provided with the balance spring, the end faces of the first adjusting block and the second adjusting block facing each other are provided with a rack structure, and the rack structure of the first adjusting block is connected with the rack structure of the second adjusting block through the adjusting gear piece, so that the first adjusting block and the second adjusting block can synchronously move.
Preferably, in the case that the pressures of the first outlet end and the second outlet end are the same, the pressure balance assembly is in a balanced state, and the compression amount of the pressure spring of the first regulating block is the same as that of the pressure spring of the second regulating block; under the condition that the pressure of the first outlet end is different from that of the second outlet end, the pressure balance component is in an unbalanced state, the positions of the first pressure block and the second pressure block are different, the compression amounts of the pressure springs of the first regulating block and the second regulating block are different, so that the regulating gear piece is driven, the positions of the first regulating block and the second regulating block are regulated until the compression amounts of the pressure springs of the first regulating block and the second regulating block are the same, and the pressure balance component is switched from the unbalanced state to the balanced state.
Preferably, the pressure balancing part is in an unbalanced state when the pressures in the first air inlet cavity and the second air inlet cavity are different, the positions of the first regulating part and the second regulating part are different, the pressures at two ends of the synchronous flow channel are different, the first regulating part is pushed when the pressure of the first regulating part is higher than the pressure of the second regulating part, the second regulating part is pushed when the pressure of the second regulating part is higher than the pressure of the first regulating part, and the pressure balancing part is switched from the unbalanced state to the balanced state until the pressures at two ends of the synchronous flow channel are the same.
Preferably, a first valve cover and a second valve cover are respectively arranged at two ends of the first air inlet cavity, the two ends of the first adjusting piece penetrate through the first valve cover and the second valve cover respectively to form a first flow channel and a second flow channel, and the air passing through the pressure balancing device passes through the first flow channel and the second flow channel respectively; the two ends of the second air inlet cavity are respectively provided with a third valve cover and a fourth valve cover, the two ends of the second adjusting piece respectively penetrate through the third valve cover and the fourth valve cover to form a third flow channel and a fourth flow channel, gas passing through the pressure balancing device passes through the third flow channel and the fourth flow channel respectively, and the second flow channel is communicated with the fourth flow channel through the synchronous flow channel.
Preferably, the first adjusting member and the second adjusting member are movably disposed in the first air inlet chamber and the second air inlet chamber, respectively, and in the moving process of the first adjusting member and the second adjusting member, the opening degrees of the first runner and the third runner are changed to adjust the pressure in the first air inlet chamber and the second air inlet chamber.
Preferably, the first end of the first adjusting member and the first end of the second adjusting member are also provided with a return buffer spring.
Preferably, the chemical vapor deposition gas supply system further comprises a transition module, the gas inlet module is connected with the MO source module through the transition module, the MO source module is connected with the reaction module through the transition module, and the transition module is provided with the pressure balancing device.
Preferably, the transition module comprises a main exhaust pipe and a main air supply pipe, wherein the first air inlet pipe is connected with the inlet end of the pressure balancing device, the main exhaust pipe and the main air supply pipe are respectively connected with the first outlet end of the pressure balancing device and the second outlet end of the pressure balancing device, the main exhaust pipe is connected with the exhaust system, and the main air supply pipe is connected with the MO source module and the reaction module.
This chemical vapor deposition gas supply system can be for chemical vapor deposition equipment air feed through the air inlet module, MO source module and the reaction module that are connected each other, has adopted pressure balancing device in gas supply system can the real-time balance pipeline in pressure, avoids pressure fluctuation, has reduced the quantity of part on the whole gas supply pipeline simultaneously, also does not need artifical manual pressure regulation, has promoted the precision and the accuracy of production.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a schematic diagram of a chemical vapor deposition gas supply system according to an embodiment of the present invention;
FIG. 2 shows yet another schematic structural view of a chemical vapor deposition gas supply system according to an embodiment of the present invention;
fig. 3 shows a schematic structural view of an intake module according to an embodiment of the present invention;
FIG. 4 shows a schematic structural view of a reaction module according to an embodiment of the present invention;
FIG. 5 illustrates a schematic structural view of a transition module according to an embodiment of the present invention;
fig. 6 illustrates a schematic structure of an MO source module according to an embodiment of the present invention;
FIG. 7 shows a schematic structural diagram of a chemical vapor deposition gas supply system according to an embodiment of the present invention;
fig. 8 shows a schematic structural view of a pressure balancing apparatus according to an embodiment of the present invention;
FIG. 9 shows a cross-sectional view of a pressure balancing device according to an embodiment of the invention;
Fig. 10 shows a first internal structural schematic diagram of a pressure balancing apparatus according to an embodiment of the present invention;
FIG. 11 shows a second internal structural schematic diagram of a pressure balancing device according to an embodiment of the present invention;
fig. 12 shows a third internal structural schematic diagram of a pressure balancing apparatus according to an embodiment of the present invention;
fig. 13 shows a first enlarged structural schematic view of a pressure balancing apparatus according to an embodiment of the present invention;
fig. 14 shows a second enlarged structural schematic view of the pressure balancing apparatus according to the embodiment of the present invention.
Reference numerals: 1-an air intake module; 101-an inlet first duct; 102-an intake second conduit; a 2-MO source module; 201-MO source first conduit; a 202-MO source second conduit; 203-MO source third conduit; 3-reaction module; 4-a transition module; 401-a main exhaust duct; 402-a main air supply duct; 5-a pressure balancing device; 501-a housing; 502-an inlet end; 503-a first outlet end; 504-a second outlet end; 505-a first adjustment block; 506-a second adjustment block; 507-a first adjustment member; 508-a second adjustment member; 509-synchronous flow channels; 510-a pressure regulating chamber; 511-an intake runner; 512-a first air inlet cavity; 513-a second air inlet chamber; 514-a first outlet flow channel; 515-a second flow path; 516-first subchamber; 517-a second subchamber; 518-handle; 519-push rod; 520-a pressure spring; 521-a first pressure block; 522-a second pressure block; 523-a first gas flow chamber; 524-a second gas flow chamber; 525-a first membrane; 526-a second diaphragm; 527—a first linkage rod; 528-second trace; 529-balancing springs; 530-adjusting the gear member; 531-rack structure; 532—a first valve cover; 533-a second valve cap; 534-a third valve cover; 535-a fourth valve cover; 536—a first flow channel; 537-a second flow channel; 538-third flow passage; 539-a fourth flow passage; 540-a return buffer spring; 601-a first exhaust duct; 602-a second exhaust duct; 7-a reaction chamber; 8-a flow controller; 9-a pressure gauge; s1-a first direction; s2-a second direction.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, or directions or positional relationships in which products of the application are conventionally put in use, are merely for convenience of describing the present application and simplifying the description, and are not indicative or implying that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," "coupled" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
According to the chemical vapor deposition air supply system provided by the invention, as shown in fig. 1 to 14, the chemical vapor deposition air supply system is used for the production of semiconductors, and the pressure consistency of a discharge pipeline and a process pipeline can be ensured in the production process. The chemical vapor deposition gas supply system comprises a gas inlet module 1, an MO source module 2 and a reaction module 3.
In the following description, detailed structures of the gas inlet module 1, the MO source module 2, and the reaction module 3 of the chemical vapor deposition gas supply system will be described in detail with reference to fig. 1 to 7.
As shown in fig. 1 and 2, in the embodiment, the air intake module 1 includes an air intake first pipe 101 and an air intake second pipe 102, the air intake module 1 is connected to the MO source module 2 through the air intake first pipe 101, the air intake module 1 is connected to the reaction module 3 through the air intake second pipe 102, and the MO source module 2 is connected to the reaction module 3. Specifically, the gas inlet module 1 is used for supplying gas, and the gas entering the MO source module 2 through the gas inlet first pipe 101 is used as a carrier gas of the MO source, so as to convey the MO source into a reaction chamber 7 described below. The gas entering the reaction module 3 through the gas inlet second pipeline 102 serves as auxiliary gas to assist the chemical vapor deposition production.
Preferably, as shown in fig. 1 to 3, in an embodiment, the air intake module 1 may include multiple sets of air intake pipe groups, each set of air intake pipe groups may include an air intake first pipe 101 and an air intake second pipe 102, for example, in an embodiment, the air intake module 1 includes four sets of air intake pipe groups, and the four sets of air intake pipe groups may be used for hydrogen, nitrogen, siH4-H2 silane and hydrogen mixture MSDS and ammonia, respectively, and different special gases may be selected according to different process requirements. Each intake duct group may be provided with a plurality of valves, such as an automatic valve, a manual valve, a solenoid valve, and the like, for controlling opening and closing of the duct. In addition, in the embodiment, the second intake duct group from left to right in fig. 2 includes only one intake first duct 101, which is introduced with nitrogen gas for assisting production, detecting airtightness, discharging impurity gas, and the like.
Specifically, as shown in fig. 1, 2 and 6, in an embodiment, MO source module 2 includes MO source first conduit 201, MO source second conduit 202 and pressure balancing device 5, MO source first conduit 201 and MO source second conduit 202 are each connected to pressure balancing device 5 such that the pressures within MO source first conduit 201 and MO source second conduit 202 are balanced, MO source first conduit 201 is connected to reaction module 3, and MO source second conduit 202 is connected to an exhaust system. The carrier gas is conveyed to the MO source module 2 through the air inlet first pipeline 101, then part of the gas carrier MO source is conveyed to the reaction cavity 7, the other part of the gas is discharged from the MO source module 2, one path of gas is conveyed to the reaction cavity 7, and the other path of gas is discharged, so that the stability of the whole gas path can be realized. The gas delivered to the reaction chamber 7 first passes through the pressure balancing device 5 and is respectively connected with the reaction module 3 through the MO source first pipeline 201 and the MO source second pipeline 202, part of the bearing gas is delivered to the reaction chamber 7 of the reaction module 3 through the MO source first pipeline 201, and the other part of the bearing gas is delivered to the exhaust system through the MO source second pipeline 202 and is discharged. In an embodiment, there are two total exhaust positions, the first exhaust position is disposed at the MO source module 2 and uses the first exhaust pipe 601 to exhaust, and the second exhaust position is disposed at the connection between the reaction module 3 and the MO source module 2 (i.e., the exhaust system) and uses the second exhaust pipe 602 to exhaust. The chemical vapor deposition air supply system utilizes the cooperation of two exhaust systems and a conveying pipeline (namely an exhaust pipeline and a process pipeline which are mentioned in the background art) to realize the consistency of the pressure in the pipeline and ensure that no pressure fluctuation exists at the moment of air supply.
Meanwhile, as the MO source first pipeline 201 and the MO source second pipeline 202 are connected with the pressure balancing device 5, the pressure balancing device 5 can automatically adjust the pressure balance in the MO source first pipeline 201 and the MO source second pipeline 202, a plurality of pressure regulating valves, flow control valves, pressure differential meters and controllers for controlling the components, which are arranged for guaranteeing the balance of the two pipelines, are reduced in the original production line, meanwhile, the pressure balance of the two pipelines can be realized without manual operation, and the influence of gas fluctuation on the rear-end production is avoided. The gas fluctuation here can be understood simply as: in the production process adopting the chemical vapor deposition technology, because the demand of the rear end (the reaction cavity 7) on a certain MO source is different, the flow required by different technologies is also different, and the fluctuation of the flow can cause the pressure of the pipeline to change, so that the pressures in the two pipelines need to be balanced in real time.
Preferably, as shown in fig. 1, 2 and 6, in an embodiment, MO source module 2 comprises a plurality of MO source units, each comprising a MO source first conduit 201, a MO source second conduit 202 and one pressure balancing means 5, the MO source unit further comprising a MO source third conduit 203, the MO source third conduit 203 being connected to an inlet end 502 of the pressure balancing means 5, the MO source first conduit 201 and the MO source second conduit 202 being connected to a first outlet end 503 of the pressure balancing means 5 and a second outlet end 504 of the pressure balancing means 5, respectively; the first inlet pipe 101 is connected to a plurality of MO source units for supplying air to the plurality of MO source units, and three of the inlet port 502, the first outlet port 503 and the second outlet port 504 can be seen in fig. 8.
Preferably, as shown in fig. 1,2,5 and 6, in an embodiment, the chemical vapor deposition gas supply system further includes a transition module 4, the gas inlet module 1 is connected with the MO source module 2 through the transition module 4, the MO source module 2 is connected with the reaction module 3 through the transition module 4, and the transition module 4 is provided with a pressure balancing device 5. Since the MO source module 2 includes a plurality of MO source units, in order to ensure the gas pressure balance of each pipe in the plurality of MO source units and to avoid the gas fluctuation caused by the more pipes, a transition module 4 is additionally provided for auxiliary balance. As shown in fig. 1,2 and 5, MO1 to MO8 represent a first MO source to an eighth MO source, respectively, and in the embodiment in which the first MO source, the second MO source and the third MO source are used, these MO sources are not shown since the piping arrangement of the fourth MO source to the eighth MO source is identical to the three MO source piping shown.
Specifically, the transition module 4 includes a main exhaust duct 401 and a main air supply duct 402, the first air intake duct 101 is connected to an inlet end 502 of the pressure balancing device 5, the main exhaust duct 401 and the main air supply duct 402 are respectively connected to a first outlet end 503 and a second outlet end 504 of the pressure balancing device 5, the main exhaust duct 401 is connected to an exhaust system, and the main air supply duct 402 is connected to the MO source module 2. The main gas supply line 402 is used for continuously supplying gas toward the reaction module 3, and the carrier gas coming out of the MO source module 2 is also supplied to the reaction module 3 through the main gas supply line 402. The main gas supply pipe 402 continuously exhausts to the exhaust system, and the gas to be exhausted from the MO source module 2 is exhausted through the main gas supply pipe 402. The pressure balancing device 5 can ensure the pressure balance of the main exhaust pipe 401 and the main gas supply pipe 402, avoid gas fluctuation in the pipes, and can also adjust the pressures in the main exhaust pipe 401 and the main gas supply pipe 402 so that the pressures reach the set values.
In addition, in the chemical vapor deposition gas supply system, a plurality of valves, a flow controller 8 and a pressure detector 9 are also involved, wherein the valves can be an automatic valve, an electromagnetic valve and a manual valve, and are used for controlling the opening and closing of a pipeline and controlling the flow direction of gas, and the flow controller 8 and the pressure detector 9 are respectively used for controlling the flow and detecting the pressure, and as the components are all common devices, the installation position, the setting method and the use principle are all well known to those skilled in the art, and are not repeated herein.
As shown in fig. 1 and 7, the chemical vapor deposition gas supply system has more modules, more pipes and complex transportation modes, and the simplified process is performed for easy understanding and description, which is only an example. Arrows in the figure indicate the flow direction of the gas. In one possible embodiment, as shown in fig. 7, the gas is, for example, hydrogen, which is fed through the inlet module 1, partly to the transition module 4 via the inlet first conduit 101, and partly directly into the reaction chamber 7 via the inlet second conduit 102. The gas delivered to the transition module 4 is respectively three parts, the first part is delivered to the reaction chamber 7, the second part is taken as carrier gas to enter the MO source module 2, the third part passes through a pressure balancing device 5, and flows through a main exhaust pipeline 401 and a main gas supply pipeline 402 respectively, after the gas taken as carrier gas to enter the MO source module 2 enters the MO source module 2, a part of the carrier MO source passes through a pressure balancing device 5 through a MO source third pipeline 203, and the other part of the carrier MO source is discharged from a first exhaust pipeline 601. The carrier gas flowing through one pressure balancing device 5 enters the MO source first pipeline 201 and the MO source second pipeline 202 respectively, the gas entering the MO source first pipeline 201 is conveyed to the reaction cavity 7 through two control valves, one part of the gas entering the MO source second pipeline 202 enters the reaction cavity 7 through the main gas supply pipeline 402, and the other part of the gas is conveyed to the second gas exhaust pipeline 602 through the main gas exhaust pipeline 401 and is discharged (here, the on-off control of the pipeline can be performed by adjusting the two control valves on the transition module 4). In addition, because the chemical vapor deposition air supply system is provided with a plurality of manual valves and automatic valves, the on-off of the pipeline can be realized by utilizing the opening and closing of the control valves, and the selection can be carried out according to the process requirements.
By using the pipeline layout and the pressure balancing device 5, the pressure consistency of the discharge pipeline and the process pipeline in the production process is realized, and no pressure fluctuation is ensured at the moment of gas supply.
In the following description, a detailed structure of the pressure balancing device 5 will be specifically described with reference to fig. 8 to 14. Further, as shown in fig. 9, 11 and 14, two directions, namely, a first direction S1 and a second direction S2 are also referred to in the following description, the first direction S1 may be understood as a direction from bottom to top in fig. 9, 11 and 14, and the second direction S2 may be understood as a direction from top to bottom in fig. 9, 11 and 14.
As shown in fig. 2 and 8, in an embodiment, the pressure balancing device 5 may include a housing 501, and an inlet end 502, a first outlet end 503, and a second outlet end 504 are disposed outside the housing 501, and the first outlet end 503 and the second outlet end 504 are connected to the inlet end 502, respectively. An inlet 502 is connected to the inlet first conduit 101 for receiving gas, and a first outlet 503 and a second outlet 504 are connected to the MO source first conduit 201 and the MO source second conduit 202, respectively, for allowing part of the gas to enter the process conduit and the other gas to enter the exhaust conduit. The housing 501 may be formed in an approximately rectangular parallelepiped structure, and the inlet end 502 is disposed opposite to the first outlet end 503 and the second outlet end 504, so that a user can conveniently connect the pressure balancing device 5 with a pipe, and a handle 518 for adjusting pressure, which will be described below, is further provided at the top of the housing 501, and the user can adjust the pressure in the pipe by screwing the handle 518.
As shown in fig. 8 and 9, in the embodiment, the inside of the housing 501 is provided with a pressure adjusting portion for effecting pressure adjustment and a pressure balancing portion for balancing the pressures at both the first outlet end 503 and the second outlet end 504, which are communicated with each other. The pressure regulating portion and the pressure balancing portion are each connected to an inlet end 502, a first outlet end 503 and a second outlet end 504.
Specifically, as shown in fig. 8 and 9, in the embodiment, the pressure adjusting section includes an active adjusting assembly for adjusting the set pressure of the pressure balancing device 5 and a pressure balancing assembly for balancing the pressure. The pressure balance assembly comprises a first adjusting block 505 and a second adjusting block 506, wherein the first adjusting block 505 is arranged in an air passage where the first outlet end 503 is connected with the inlet end 502, the second adjusting block 506 is arranged in an air passage where the second outlet end 504 is connected with the inlet end 502, and the first adjusting block 505 and the second adjusting block 506 can respectively adjust the pressures of the two outlet air passages so as to ensure the pressure balance of the first outlet end 503 and the second outlet end 504.
The first adjusting block 505 and the second adjusting block 506 are in driving connection so that the first adjusting block 505 and the second adjusting block 506 can move synchronously. Synchronous movement here means, for example, that the first adjusting block 505, after being influenced by a higher pressure, moves the second adjusting block 506 until both the first adjusting block 505 and the second adjusting block 506 are in the same position (pressure-balanced state).
The active adjusting component is connected with the first adjusting block 505 and the second adjusting block 506, and the active adjusting component can synchronously drive the first adjusting block 505 and the second adjusting block 506 to change positions, so that the pressure inside the shell 501 changes. Synchronous entrainment herein refers to the active adjustment assembly enabling the first and second adjustment blocks 505 and 506 to change position simultaneously, thereby balancing the pressure inside the housing 501.
The pressure balancing part comprises a first adjusting part 507, a second adjusting part 508 and a synchronous runner 509, wherein the first adjusting part 507 is arranged in an air passage where the first outlet end 503 is connected with the inlet end 502, the second adjusting part 508 is arranged in an air passage where the second outlet end 504 is connected with the inlet end 502, and the first adjusting part 507 and the second adjusting part 508 can adjust the positions of the first adjusting part and the second adjusting part through different pressures in the air passages so as to balance the pressures at the first outlet end 503 and the second outlet end 504. The first and second adjustment members 507 and 508 are capable of position adjustment via the synchronizing channel 509. The first adjusting member 507 and the second adjusting member 508 may be formed in a long rod-shaped structure, the first adjusting member 507 formed in a long rod-shaped structure and the second adjusting member 508 formed in a long rod-shaped structure are respectively abutted against the first adjusting block 505 and the second adjusting block 506, so that in the case that the first adjusting member 507 and the second adjusting member 508 change positions, the first adjusting block 505 and the second adjusting block 506 can be driven by the first adjusting member 507 and the second adjusting member 508 to change positions, thereby making the pressures of the first outlet end 503 and the second outlet end 504 the same. Since the first and second adjustment blocks 505, 506 are in driving connection, a change in position of one adjustment block will cause a change in position of the other adjustment block until the positions of the two adjustment blocks are the same, at which time the pressures at the first and second outlet ends 503, 504 are the same.
The synchronizing flow passage 509 is provided at the lower portion of the first regulating member 507 and the lower portion of the second regulating member 508, and when the pressure of the gas at one side increases, the gas is transferred to the other side through the synchronizing flow passage 509 due to the influence of the pressure, thereby balancing the pressures at both sides.
Preferably, as shown in fig. 8 and 10, in an embodiment, a pressure adjusting chamber 510 is provided at an upper portion of an inside of the housing 501, a pressure balancing component and a part of an active adjusting component are provided at the pressure adjusting chamber 510, and an air inlet flow passage 511, a first air inlet chamber 512, a second air inlet chamber 513, a first air outlet flow passage 514 and a second air outlet flow passage 515 are provided at a lower portion of the pressure adjusting chamber 510. An inlet flow passage 511 is connected to inlet end 502 for receiving gas. The two ends of the air inlet flow passage 511 are respectively connected with a first air inlet cavity 512 and a second air inlet cavity 513, the air entering from the inlet end 502 is divided into two parts, flows through the first air inlet cavity 512 and the second air inlet cavity 513 respectively, the first air inlet cavity 512 and the second air inlet cavity 513 are both connected with the pressure regulating cavity 510, the pressure regulation is realized through the pressure regulating cavity 510, the first air outlet flow passage 514 and the second air outlet flow passage 515 are both connected with the pressure regulating cavity 510, and the first air outlet flow passage 514 and the second air outlet flow passage 515 are respectively connected with the first outlet end 503 and the second outlet end 504. Thus, in the pressure equalization device 5, gas enters the inlet flow passage 511 from the inlet end 502, enters the first outlet flow passage 514 and the second outlet flow passage 515 through the first inlet chamber 512 and the second inlet chamber 513, respectively, and finally exits the first outlet end 503 and the second outlet end 504, respectively.
Preferably, as shown in fig. 9 to 11, in an embodiment, the pressure regulating chamber 510 may include first and second subchambers 516 and 517 corresponding to the first and second air outlet flow passages 514 and 515, respectively. The first sub-cavity 516 and the second sub-cavity 517 can be convenient for the active adjusting component to adjust the single flow channel, and meanwhile, the first adjusting block 505 is disposed in the first sub-cavity 516, and the second adjusting block 506 is disposed in the second sub-cavity 517, so as to realize independent adjustment.
Preferably, as shown in fig. 8 and 11, in an embodiment, the active adjustment assembly includes a handle 518, a push rod 519, a pressure spring 520, a first pressure block 521, and a second pressure block 522. Specifically, the handle 518 is disposed outside the housing 501 and rotatably connected to the housing 501, and the rotatable connection may be in the form of a threaded connection, where the portion of the housing 501 connected to the handle 518 is provided with external threads, and the portion of the handle 518 connected to the housing 501 is provided with internal threads, and by the connection of the external threads and the internal threads, the handle 518 is moved in the first direction S1 or the second direction S2. The push rod 519 is coupled to the handle 518 and is configured to move the push rod 519 in either the first direction S1 or the second direction S2 by rotation of the handle 518. The connection may be by a fixed connection, such as welding, bonding, and the use of a connecting bolt. Thus, in the event of movement of the handle 518, the push rod 519 may also move in either the first direction S1 or the second direction S2 following the handle 518.
The two ends of the pushing rod 519 are respectively connected with the first adjusting block 505 and the second adjusting block 506 so that the first adjusting block 505 and the second adjusting block 506 can synchronously move, the pushing rod 519 is formed into an inverted T-shaped structure, and the three ends of the inverted T-shaped structure are respectively connected with the handle 518, the first adjusting block 505 and the second adjusting block 506, so that the handle 518 is rotated, and the first adjusting block 505 and the second adjusting block 506 can synchronously move. Specifically, the first adjusting block 505 is connected to the first pressure block 521 through a pressure spring 520, the second adjusting block 506 is connected to the second pressure block 522 through a pressure spring 520, and the first pressure block 521 and the second pressure block 522 are disposed in the first subchamber 516 and the second subchamber 517, respectively. The first and second pressure blocks 521 and 522 are used to adjust the pressure within the pressure regulation chamber 510; the first and second adjusting blocks 505 and 506 may adjust the pressures of the two flow paths such that the pressures of the two flow paths are balanced; the pressure spring 520 can transmit the displacement amount of the first adjusting block 505 and the second adjusting block 506 to the first pressure block 521 and the second pressure block 522, so that the first pressure block 521 and the second pressure block 522 change positions to adjust the pressure in the pressure adjusting cavity 510, and can transmit the pressure to change positions of the first adjusting block 505 or the second adjusting block 506 to balance the pressure in case that two flow passage gases are unbalanced.
Preferably, in an embodiment, the end of the handle 518 may be provided with a pressure scale, typically in production, the pressure of the tubing is around 0-30psig, the pressure scale may be provided in the middle of the end of the handle 518 for ensuring a universal pressure adjustment range of 0-100psig, the middle may not follow the handle 518 to rotate, the rotating portion of the handle 518 is provided with an indicator needle, and by rotating the handle 518 the indicator needle is moved along the outer peripheral side of the pressure scale until it is moved to the pressure desired by the user. During the design process, the designer can determine the positional relationship of the pointer and the pressure scale by testing the flow of gas through the pressure balancing device 5 at this time.
Preferably, as shown in fig. 10 to 12, in the embodiment, a first gas flow chamber 523 is provided between the first pressure block 521 and the first outlet flow channel 514, and a second gas flow chamber 524 is provided between the second pressure block 522 and the second outlet flow channel 515. The gas introduced into the pressure equalization device 5 (the pressure equalization device 5 is shown in fig. 1 and 2) is introduced into the first gas flow chamber 523 and the second gas flow chamber 524, respectively, and is discharged through the first gas outlet flow passage 514 and the second gas outlet flow passage 515, respectively.
Preferably, as shown in fig. 9, 11 and 12, in the embodiment, the first adjusting member 507 is abutted with the first pressure block 521 through the first diaphragm 525, the second adjusting member 508 is abutted with the second pressure block 522 through the second diaphragm 526, the first diaphragm 525 is disposed between the first gas flow chamber 523 and the first pressure block 521, and the second diaphragm 526 is disposed between the second gas flow chamber 524 and the second pressure block 522. The first diaphragm 525 and the second diaphragm 526 can realize sealing, prevent gas from moving outside the first gas flow chamber 523 and the second gas flow chamber 524, allow gas to flow only along a set flow path, and further the first diaphragm 525 and the second diaphragm 526 can help to realize pressure balance.
Preferably, as shown in fig. 9, 11 and 12, in the embodiment, the first adjusting member 507 includes a first linkage rod 527, the first linkage rod 527 is connected to the first membrane 525, the connection may be an adhesive, and the first membrane 525 can be bent along the first direction S1 or the second direction S2 to drive the first linkage rod 527 to move; the second adjusting member 508 includes a second linkage rod 528, where the second linkage rod 528 is connected to the second membrane 526, and the connection manner may be adhesion, and the second membrane 526 can be bent along the first direction S1 or the second direction S2 to drive the second linkage rod 528 to move. The end portions of the first pressure block 521 and the second pressure block 522 facing the first diaphragm 525 and the second diaphragm 526 are provided with accommodating spaces for bending the first diaphragm 525 and the second diaphragm 526, for example, in the case that the internal pressure of the first gas flow chamber 523 becomes large, the first diaphragm 525 bends toward the first direction S1 due to the pushing force of the gas, and drives the first linkage rod 527 to move along the first direction S1, so that the flow channel through which the gas can flow in the first adjusting member 507 becomes small, the flow pressure of the gas is reduced, and the pressure in the first gas flow chamber 523 is reduced.
Preferably, as shown in fig. 9 and fig. 11 to fig. 13, in the embodiment, the pressure balance assembly may further include a balance spring 529 and an adjusting gear 530, where the first adjusting block 505 and the second adjusting block 506 are connected to the pushing rod 519, each of the balance spring 529 is provided with a balance spring 529, and the balance spring 529 may enable the first adjusting block 505 and the second adjusting block 506 to move stably, so that shaking of the adjusting blocks in a process of adjusting positions is avoided, stability of gas is ensured, and fluctuation of gas in a pipeline is avoided. The balance spring 529 has two functions, on one hand, in the case of adjusting the pressure by using the handle 518, the movement of the first adjusting block 505 and the second adjusting block 506 can be smooth and balanced relatively, and on the other hand, in the case of triggering automatic adjustment of the pressure balance (for example, the internal pressure of the first gas flow chamber 523 is greater than the internal pressure of the second gas flow chamber 524), the movement of the first adjusting block 505 and the second adjusting block 506 along the first direction S1 or the second direction S2 can be smooth, so as to cooperate with the adjusting gear member 530, thereby avoiding shaking of the adjusting gear member 530 due to gear engagement, avoiding gas fluctuation in the pressure balancing device 5, and further affecting the production in the back-end reaction chamber 7 (see fig. 1 and 2 for the pressure balancing device 5 and the reaction chamber 7).
The end surfaces of the first and second adjustment blocks 505 and 506 facing each other are provided with a rack structure 531, and the rack structure 531 of the first adjustment block 505 is connected with the rack structure 531 of the second adjustment block 506 through an adjustment gear member 530 so that the first and second adjustment blocks 505 and 506 can move synchronously. The adjusting gear member 530 may include two opposite rotatable gears, each of which is respectively coupled to the rack structure 531 of the first adjusting block 505 and the rack structure 531 of the second adjusting block 506 in a gear engagement manner, where for convenience of illustration and description, the adjusting gear member 530 in fig. 13 and the rest of the schematic drawings has a smaller number of teeth and a larger pitch, and for further realizing the balanced movement of the first adjusting block 505 and the second adjusting block 506, gears having a larger number of teeth and a smaller pitch may be selected, which is not limited herein.
Preferably, in an embodiment, where the pressures at the first outlet end 503 and the second outlet end 504 are the same, the pressure balance assembly is in a balanced state, and the compression amount of the pressure spring 520 of the first regulating block 505 is the same as the compression amount of the pressure spring 520 of the second regulating block 506; in the case that the pressures in the first outlet end 503 and the second outlet end 504 are different, the pressure balance assembly is in an unbalanced state, the positions of the first pressure block 521 and the second pressure block 522 are different, the compression amounts of the pressure spring 520 of the first adjusting block 505 and the pressure spring 520 of the second adjusting block 506 are different, so that the adjusting gear member 530 is driven, and the positions of the first adjusting block 505 and the second adjusting block 506 are adjusted until the compression amounts of the pressure spring 520 of the first adjusting block 505 and the pressure spring 520 of the second adjusting block 506 are the same, and the pressure balance assembly is switched from the unbalanced state to the balanced state. The reason why the pressures of the first outlet port 503 and the second outlet port 504 are different can be simply understood as: because the reaction chamber 7 has different demands (flows) for a certain MO source, the demand may increase at a certain moment, but the exhaust gas in the exhaust pipe is not changed, so that the pressure is different, and further, gas fluctuation occurs. Thus, in one possible scenario, the pressure of the first outlet 503 is changed, here taking an example of an increase in pressure of the first outlet 503, at which time the first diaphragm 525 bends toward the first direction S1 due to the increase in gas pressure, the first pressure block 521 moves toward the first direction S1 due to the increase in gas pressure while being under the pressure of the pressure spring 520, the first pressure block 521 moves the first adjusting block 505 toward the first direction S1 by the transmission of the pressure spring 520, and the first adjusting block 505 moves the second adjusting block 506 together toward the first direction S1 by the adjusting gear member 530 to balance the pressures at the first outlet 503 and the second outlet 504.
Preferably, as shown in fig. 9, 10 and 14, in the embodiment, in the case that the pressures in the first air intake chamber 512 and the second air intake chamber 513 are different, the pressure balance part is in an unbalanced state, the first adjusting member 507 and the second adjusting member 508 are located at different positions, and the pressures at both ends of the synchronization flow channel 509 are different, so that the first adjusting member 507 or the second adjusting member 508 at the higher side of the pressure is pushed until the pressures at both ends of the synchronization flow channel 509 are the same, and the pressure balance part is switched from the unbalanced state to the balanced state. The pressure of the gas in the first gas inlet chamber 512 and the second gas inlet chamber 513 may be affected by different requirements of the external environment, gas flow and rear end production, so that the pressure of the two gas inlet chambers is different, and the gas fluctuation may be caused, for example, in a possible case, the pressure in the first gas inlet chamber 512 rises, at this time, the first adjusting member 507 moves along the first direction S1, so that the gas flow passage of the first adjusting member 507 near the synchronizing flow passage 509 is enlarged, the gas throughput increases, so that the pressure of the left end of the synchronizing flow passage 509 is greater than the right end, the gas enters the right end from the left end, and further, the second adjusting member 508 is pushed to move towards the first direction S1 until the pressure at the two ends of the synchronizing flow passage 509 is balanced, and the positions of the first adjusting member 507 and the second adjusting member 508 are the same. Here, the right and left refer to the right and left sides in fig. 14.
Preferably, as shown in fig. 9, 10 and 14, in the embodiment, the first air inlet chamber 512 is provided with a first valve cover 532 and a second valve cover 533 at both ends thereof, and the first regulator 507 is provided with the first valve cover 532 and the second valve cover 533 at both ends thereof to form a first flow passage 536 and a second flow passage 537, respectively, through which the air passing through the pressure balancing device 5 passes through the first flow passage 536 and the second flow passage 537, respectively. The third valve cover 534 and the fourth valve cover 535 are respectively arranged at two ends of the second air inlet chamber 513, the third valve cover 534 and the fourth valve cover 535 are respectively arranged at two ends of the second adjusting member 508 in a penetrating manner to form a third flow passage 538 and a fourth flow passage 539, the air passing through the pressure balancing device 5 passes through the third flow passage 538 and the fourth flow passage 539 respectively, and the second flow passage 537 is communicated with the fourth flow passage 539 through the synchronous flow passage 509. Further, in fig. 14, arrows within the pressure balancing device 5 (the pressure balancing device 5 is referred to in fig. 1 and 2) are indicated as paths of gas flow. The first, second, third and fourth valve caps 532, 533, 534 and 535 are used to seal both ends of the first and second adjusting members 507 and 508, respectively, and to pass through the first and second adjusting members 507 and 508.
Preferably, as shown in fig. 9, 10 and 14, in an embodiment, the first and second adjusting members 507 and 508 are movably disposed in the first and second air intake chambers 512 and 513, respectively, and the openings of the first and third flow passages 536 and 538 are changed during the movement of the first and second adjusting members 507 and 508 to adjust the pressures in the first and second air intake chambers 512 and 513. The opening degree here refers to the flow rate of the gas passing therethrough, and the larger the opening degree is, the larger the flow rate of the gas passing therethrough is. In this way, the first and second adjusting members 507 and 508 can be understood as valve cores, and the control of the gas flow is achieved by the movement of the valve cores. The first flow passage 536 and the third flow passage 538 are used to regulate the flow of gas, and the second flow passage 537, the fourth flow passage 539, and the synchronizing flow passage 509 are used to equalize the pressure of gas.
Preferably, as shown in fig. 9, 13 and 14, in an embodiment, the first end of the first adjuster 507 and the first end of the second adjuster 508 are also provided with a return buffer spring 540. The return buffer spring 540 has the same function as the balance spring 529, and has a smooth motion function, so that the first adjusting piece 507 and the second adjusting piece 508 can avoid the fluctuation of the gas in the pipeline caused by the motion.
The pressure balancing device 5 has two conditions, in which the pressure at the outlet end is greater than the set pressure, for example, the user sets the pressure at the outlet end of the pressure balancing device 5 to 20psig through the handle 518, and the back end demand increases during production, such that the pressure at one outlet end increases (for example, the first outlet end 503) to 35psig, at which time the first diaphragm 525 bends toward the first direction S1 due to the increase of the gas pressure, the first pressure block 521 is simultaneously moved toward the first direction S1 due to the increase of the gas pressure by the pressure spring 520, and the first adjusting block 505 is simultaneously moved toward the first direction S1 by the driving of the pressure spring 520, and the first adjusting block 505 drives the second adjusting block 506 to move toward the first direction S1 together through the adjusting gear 530 to balance the pressures at the first outlet end 503 and the second outlet end 504. After the subsequent production demand changes, the first adjusting block 505 and the second adjusting block 506 are correspondingly adjusted to ensure the pressure balance of the two outlet ends in real time.
In the second case, the pressures in the first air inlet chamber 512 and the second air inlet chamber 513 are different or air fluctuation occurs, for example, the pressure in the first air inlet chamber 512 increases, the first adjusting member 507 moves toward the first direction S1, during the moving process, the opening of the second runner 537 increases, so that the pressure on one side of the synchronous runner 509 increases, and the second adjusting member 508 on the other side is pushed, so that the opening of the fourth runner 539 is the same as the opening of the second runner 537, and the positions of the first adjusting member 507 and the second adjusting member 508 are the same. In addition, since the first linkage rod 527 of the first adjusting member 507 is connected to the first membrane 525, both the first adjusting member 507 and the second adjusting member 508 are moved during the actual use, so that the adjustment of the outlet pressure and the balancing of the pressure of the pipeline can be achieved at the same time, and in addition, the pressure balancing device 5 can achieve the real-time adjustment of the pressure balance of the pipeline by pushing the gas and matching with the adjustment mode similar to the valve body.
The chemical vapor deposition air supply system can realize air supply of chemical vapor deposition equipment through the air inlet module, the MO source module and the reaction module which are connected with each other, and the pressure in the pipeline can be balanced in real time by adopting the pressure balancing device in the air supply system, so that pressure fluctuation is avoided, the number of parts on the whole air supply pipeline is reduced, manual pressure regulation is not needed, and the production precision and accuracy are improved.
Finally, it should be noted that: the above examples are only specific embodiments of the present application, and are not intended to limit the scope of the present application, but it should be understood by those skilled in the art that the present application is not limited thereto, and that the present application is described in detail with reference to the foregoing examples: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or perform equivalent substitution of some of the technical features, while remaining within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (15)

1. A chemical vapor deposition gas supply system, the chemical vapor deposition gas supply system comprising: the system comprises an air inlet module, an MO source module and a reaction module, wherein the air inlet module comprises an air inlet first pipeline and an air inlet second pipeline, the air inlet module is connected with the MO source module through the air inlet first pipeline, the air inlet module is connected with the reaction module through the air inlet second pipeline, and the MO source module is connected with the reaction module;
The MO source module comprises an MO source first pipeline, an MO source second pipeline and a pressure balancing device, wherein the MO source first pipeline and the MO source second pipeline are connected with the pressure balancing device so as to balance the pressure in the MO source first pipeline and the pressure in the MO source second pipeline, the MO source first pipeline is connected with the reaction module, and the MO source second pipeline is connected with an exhaust system;
The pressure balancing device comprises a shell, wherein the shell comprises an inlet end, a first outlet end and a second outlet end, the first outlet end and the second outlet end are respectively connected with the inlet end through air passages, the inlet end is connected with the air inlet first pipeline, and the first outlet end and the second outlet end are respectively connected with the MO source first pipeline and the MO source second pipeline;
The inside of the shell is provided with a pressure regulating part and a pressure balancing part which are communicated with each other, and the pressure regulating part and the pressure balancing part are connected with the inlet end, the first outlet end and the second outlet end;
the pressure regulating part comprises an active regulating component for regulating the pressure inside the shell and a pressure balancing component for balancing the pressure of the first outlet end and the pressure of the second outlet end, the pressure balancing component comprises a first regulating block and a second regulating block, the first regulating block is arranged in an air passage connected with the first outlet end and the inlet end, the second regulating block is arranged in an air passage connected with the second outlet end and the inlet end, and the first regulating block and the second regulating block are in transmission connection so that the first regulating block and the second regulating block can synchronously move; the active adjusting component is connected with the first adjusting block and the second adjusting block, and can synchronously drive the first adjusting block and the second adjusting block to change positions so as to change the size of the air passage, and then the pressure in the shell is changed by adjusting the air flow in the air passage;
The driving adjusting assembly comprises a handle, a pushing rod, a pressure spring, a first pressure block and a second pressure block, wherein the handle is arranged outside the shell and can be rotatably connected with the shell, the pushing rod is connected with the handle, the pushing rod is enabled to move along a first direction or a second direction through rotation of the handle, two ends of the pushing rod are respectively connected with the first adjusting block and the second adjusting block so that the first adjusting block and the second adjusting block can synchronously move, the first adjusting block is connected with the first pressure block through the pressure spring, and the second adjusting block is connected with the second pressure block through the pressure spring;
The pressure balancing part comprises a first adjusting part, a second adjusting part and a synchronous runner, wherein the first adjusting part is arranged in an air passage with a first outlet end connected with an inlet end, the second adjusting part is arranged in an air passage with a second outlet end connected with the inlet end, the air passage with the first outlet end connected with the inlet end and the air passage with the second outlet end connected with the inlet end are connected with the synchronous runner, the first adjusting part and the second adjusting part are respectively arranged at two ends of the synchronous runner, and the first adjusting part and the second adjusting part are respectively in butt joint with the first adjusting block and the second adjusting block;
The first regulating block and the second regulating block are positioned differently under the condition that the pressures of the first outlet end and the second outlet end are different, the positions of the first regulating member and the second regulating member are different, and the pressure balance assembly is in an unbalanced state; the pressure at two ends of the synchronous runner is different so that the first regulating piece and the second regulating piece change positions until the positions are the same, the first regulating block and the second regulating block are driven by the first regulating piece and the second regulating piece to change positions so that the pressure at the first outlet end and the pressure at the second outlet end are the same, and the pressure balance assembly is switched from an unbalanced state to a balanced state.
2. The chemical vapor deposition gas supply system of claim 1 wherein the MO source module comprises a plurality of MO source units, each comprising the MO source first conduit, the MO source second conduit, and one of the pressure equalization devices, the MO source unit further comprising a MO source third conduit, the gas inlet first conduit being connected to the MO source third conduit, the gas inlet first conduit being connected to an inlet end of the pressure equalization device through the MO source third conduit, the MO source first conduit and the MO source second conduit being connected to a first outlet end of the pressure equalization device and a second outlet end of the pressure equalization device, respectively.
3. The chemical vapor deposition air supply system according to claim 1, wherein a pressure regulating cavity is arranged at the upper part of the interior of the shell, the pressure balancing component and the active regulating component are arranged in the pressure regulating cavity, an air inlet channel, a first air inlet cavity, a second air inlet cavity, a first air outlet channel and a second air outlet channel are arranged at the lower part of the pressure regulating cavity, the air inlet channel is connected with the inlet end, two ends of the air inlet channel are respectively connected with the first air inlet cavity and the second air inlet cavity, the first air inlet cavity and the second air inlet cavity are respectively connected with the pressure regulating cavity, the first air outlet channel and the second air outlet channel are respectively connected with the first outlet end and the second outlet end.
4. The chemical vapor deposition gas supply system of claim 3 wherein the pressure regulating chamber comprises first and second subchambers corresponding to the first and second flow channels, respectively;
the first pressure block and the second pressure block are respectively arranged in the first sub-cavity and the second sub-cavity.
5. The chemical vapor deposition gas supply system of claim 4 wherein a first gas flow chamber is disposed between the first pressure block and the first gas outlet flow path and a second gas flow chamber is disposed between the second pressure block and the second gas outlet flow path.
6. The chemical vapor deposition gas supply system of claim 5, wherein the first regulator is in abutment with the first pressure block via a first diaphragm, the second regulator is in abutment with the second pressure block via a second diaphragm, the first diaphragm is disposed between the first gas flow chamber and the first pressure block, and the second diaphragm is disposed between the second gas flow chamber and the second pressure block.
7. The chemical vapor deposition gas supply system of claim 6, wherein the first adjustment member comprises a first linkage rod, the first linkage rod is connected with the first membrane, and the first membrane can be bent along a first direction or a second direction to drive the first linkage rod to move;
The second adjusting piece comprises a second linkage rod, the second linkage rod is connected with the second diaphragm, and the second diaphragm can be bent along the first direction or the second direction to drive the second linkage rod to move.
8. The chemical vapor deposition gas supply system according to claim 4, wherein the pressure balancing assembly further comprises a balancing spring and an adjusting gear member, the balancing springs are arranged at the joints of the first adjusting block and the second adjusting block and the pushing rod, a rack structure is arranged at the end faces of the first adjusting block and the second adjusting block, which face each other, and the rack structure of the first adjusting block is connected with the rack structure of the second adjusting block through the adjusting gear member, so that the first adjusting block and the second adjusting block can synchronously move.
9. The chemical vapor deposition gas supply system of claim 8 wherein the pressure balance assembly is in an equilibrium state with the same pressure at the first and second outlet ends, the compression amount of the pressure spring of the first regulator block being the same as the compression amount of the pressure spring of the second regulator block;
Under the condition that the pressure of the first outlet end is different from that of the second outlet end, the pressure balance component is in an unbalanced state, the positions of the first pressure block and the second pressure block are different, the compression amounts of the pressure springs of the first regulating block and the second regulating block are different, so that the regulating gear piece is driven, the positions of the first regulating block and the second regulating block are regulated until the compression amounts of the pressure springs of the first regulating block and the second regulating block are the same, and the pressure balance component is switched from the unbalanced state to the balanced state.
10. The chemical vapor deposition gas supply system according to claim 9, wherein the pressure balancing part is in an unbalanced state when the pressures in the first gas inlet chamber and the second gas inlet chamber are different, the first regulating member and the second regulating member are positioned at different positions, the pressures at both ends of the synchronous flow passage are different, the first regulating member is pushed when the pressure of the first regulating member is higher than the pressure of the second regulating member, and the second regulating member is pushed when the pressure of the second regulating member is higher than the pressure of the first regulating member until the pressures at both ends of the synchronous flow passage are the same, and the pressure balancing part is switched from the unbalanced state to the balanced state.
11. The chemical vapor deposition gas supply system according to claim 4, wherein a first valve cover and a second valve cover are respectively arranged at two ends of the first gas inlet cavity, and two ends of the first adjusting piece respectively penetrate through the first valve cover and the second valve cover to form a first flow channel and a second flow channel, and gas passing through the pressure balancing device passes through the first flow channel and the second flow channel respectively; the two ends of the second air inlet cavity are respectively provided with a third valve cover and a fourth valve cover, the two ends of the second adjusting piece respectively penetrate through the third valve cover and the fourth valve cover to form a third flow channel and a fourth flow channel, gas passing through the pressure balancing device passes through the third flow channel and the fourth flow channel respectively, and the second flow channel is communicated with the fourth flow channel through the synchronous flow channel.
12. The chemical vapor deposition gas supply system of claim 11, wherein the first and second adjustment members are movably disposed in the first and second gas inlet chambers, respectively, and wherein openings of the first and third flow passages are changed to adjust pressures in the first and second gas inlet chambers during movement of the first and second adjustment members.
13. The chemical vapor deposition gas supply system of claim 1, wherein the first end of the first adjustment member and the first end of the second adjustment member are each further provided with a return buffer spring.
14. The chemical vapor deposition gas supply system of claim 1 further comprising a transition module, wherein the gas inlet module is connected to the MO source module via the transition module, wherein the MO source module is connected to the reaction module via the transition module, and wherein the transition module is provided with the pressure balancing device.
15. The chemical vapor deposition gas supply system of claim 14 wherein the transition module comprises a main gas exhaust conduit and a main gas supply conduit, the first gas inlet conduit being connected to the inlet end of the pressure equalization device, the main gas exhaust conduit and the main gas supply conduit being connected to the first outlet end of the pressure equalization device and the second outlet end of the pressure equalization device, respectively, the main gas exhaust conduit being connected to the gas exhaust system, the main gas supply conduit being connected to the MO source module and the reaction module.
CN202410675123.9A 2024-05-29 2024-05-29 Chemical vapor deposition air supply system Active CN118241183B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1236060A (en) * 1998-05-20 1999-11-24 新西兰运输燃料系统有限公司 Fuel regulating system
CN211820905U (en) * 2020-03-18 2020-10-30 无锡金都机械装备有限公司 Pressure reducing and stabilizing valve capable of adjusting gas flow

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219549674U (en) * 2022-08-06 2023-08-18 英飞腾(上海)氢能源发展有限公司 Pressure regulating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1236060A (en) * 1998-05-20 1999-11-24 新西兰运输燃料系统有限公司 Fuel regulating system
CN211820905U (en) * 2020-03-18 2020-10-30 无锡金都机械装备有限公司 Pressure reducing and stabilizing valve capable of adjusting gas flow

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