CN118238065B - Wafer storage device - Google Patents
Wafer storage device Download PDFInfo
- Publication number
- CN118238065B CN118238065B CN202410676896.9A CN202410676896A CN118238065B CN 118238065 B CN118238065 B CN 118238065B CN 202410676896 A CN202410676896 A CN 202410676896A CN 118238065 B CN118238065 B CN 118238065B
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- Prior art keywords
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- concave
- wafer
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Links
- 238000003860 storage Methods 0.000 title claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 112
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000008367 deionised water Substances 0.000 claims abstract description 20
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims description 88
- 238000002347 injection Methods 0.000 claims description 69
- 239000007924 injection Substances 0.000 claims description 69
- 230000000149 penetrating effect Effects 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 30
- 230000000670 limiting effect Effects 0.000 claims description 18
- 230000009471 action Effects 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 238000009423 ventilation Methods 0.000 claims description 9
- 238000009736 wetting Methods 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 230000002441 reversible effect Effects 0.000 claims description 3
- 238000005498 polishing Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 17
- 238000012546 transfer Methods 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000002411 adverse Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 87
- 239000000126 substance Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011550 stock solution Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920001875 Ebonite Polymers 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer storage device, belongs to the equipment that is specially adapted to handle the wafer for the semiconductor, and it includes the box, and the box is rectangular structure of rectangular form, is equipped with a plurality of storage units in the box, can fix a position the multi-disc wafer through the storage unit that provides to still carry out effectual protection to the wafer, above all can moisten the polished surface of wafer that shifts, in order to reduce the influence of polishing liquid to the polished surface of wafer. The invention can effectively protect the wafer disc when the wafer disc is transferred, thereby ensuring the safety during transfer, and wets the polished surface of the wafer in a manner of forming a deionized water film on the polished surface of the wafer during transfer so as to avoid adverse effect of the polishing liquid on the wafer.
Description
Technical Field
The present invention relates to an apparatus specially adapted for processing wafers for semiconductors, and more particularly to a wafer storage device.
Background
At present, when polishing and polishing a wafer, a chemical mechanical polishing mode with higher efficiency and excellent treatment effect is adopted, along with the continuous development of a semiconductor manufacturing process, higher requirements are put on the processing precision of the wafer for processing a semiconductor device, for example, when the wafer is finished through chemical mechanical polishing, a certain amount of polishing liquid is attached on a polished surface, and in the process of transferring the wafer, part of substances are attached on the polished surface of a wafer disc due to volatilization of volatile substances in the polishing liquid, residues remained on the polished surface of the wafer influence the polishing effect, and substances in the polishing liquid are easy to corrode the wafer, so that the cleaning degree of the polished surface can be improved through cleaning of the wafer, and part of substances cannot be removed through the cleaning mode in the actual production process, and the influence of the chemical polishing liquid on the wafer is difficult to recover later, so that how to ensure the cleaning degree of the polished surface after transferring the wafer becomes the problem to be solved.
Disclosure of Invention
The invention provides a wafer storage device, which solves the defects in the prior art, and forms a deionized water film on a polished surface of a wafer during transfer so as to moisten the polished surface, thereby avoiding that partial substances of polishing liquid are attached to the polished surface due to drying and the like during transfer, and diluting the polishing liquid through moistening, and avoiding that the partial substances of the polishing liquid corrode the polished surface of the wafer.
In order to achieve the object of the present invention, the following techniques are proposed:
the utility model provides a wafer storage device, includes the box, and the box is rectangular structure of rectangular shape, can set up corresponding transfer connecting element on it, through with transfer connecting element connect on the handling system who shifts the transportation wafer to the circulation of wafer storage device is conveniently carried out.
The box body is internally provided with a plurality of storage units, a plurality of wafers can be positioned through the storage units, the wafers are effectively protected, and most importantly, the polished surfaces of the transferred wafers can be wetted, so that the influence of polishing liquid on the polished surfaces of the wafers is reduced.
The storage unit comprises a rectangular frame arranged in the box body, the upper end of the rectangular frame is provided with an upper plate, the upper plate is provided with a rectangular hole, the lower end of the rectangular frame is provided with a lower plate, and the upper plate and the lower plate play a role in protecting a wafer placed between the upper plate and the lower plate.
The movable moving mechanism that is equipped with on the rectangle frame, the positioning mechanism is installed to moving mechanism's upper end, be equipped with coupling mechanism on the rectangle frame, coupling mechanism is used for moving mechanism and the fixed connection of rectangle frame, be equipped with annotate liquid mechanism on the rectangle frame, annotate and be equipped with on the liquid mechanism and open and close the mechanism, annotate liquid mechanism knot and locate the wetting that is used for the wafer upper wall on the positioning mechanism, positioning mechanism can fix a position the wafer to the wafer takes place to remove when shifting, and causes influence such as wearing and tearing to the face of placing of wafer. The connecting mechanism can connect and fix the moving mechanism on the rectangular frame, so that the influence on the placed wafer caused by the phenomenon of toppling and the like in the transferring process is avoided. The liquid injection mechanism not only plays a role in protecting the wafer, but also can wet the polished surface of the wafer through the deionized water provided by the liquid injection mechanism. The opening and closing mechanism is used for deionized water and controlling the opening and closing during injection.
The moving mechanism comprises a pair of movable cross bars, the movable cross bars penetrate through the rectangular frame, the outer side ends of the movable cross bars are provided with protruding portions, the inner side ends of the protruding portions are provided with lower rings, the lower ends of the lower rings are provided with lower discs, and the lower discs are located above the lower plates.
The positioning mechanism comprises an upper disc arranged at the upper end of a lower ring, a middle ring is arranged on the periphery of the upper disc, an upper ring plate is arranged at the upper end of the middle ring, a convex ring is arranged on the upper ring plate and is of an inverted V-shaped structure, a plurality of positioning lower blocks are movably arranged in the middle ring, a positioning plate is arranged at the upper end of each positioning lower block, each positioning lower block is used for supporting a wafer, the positioning plate is used for limiting the periphery of the lower end of the wafer, and through positioning of the positioning plate, the wafer is prevented from moving relative to the positioning lower blocks in the transferring process, so that the positioning lower blocks are worn on the wafer. And the convex ring plays a role in protecting the wafer placed in the convex ring.
The liquid injection mechanism comprises a liquid injection disc, a ventilation middle hole is formed in the center of the liquid injection disc, a ventilation cover is screwed on the ventilation middle hole, and when liquid is injected, air is conveniently discharged, so that liquid injection operation is facilitated. The inside of annotating the liquid dish is equipped with annular stock solution chamber, and annular stock solution intracavity is filled with deionized water, and a plurality of notes liquid holes have been seted up to annular stock solution chamber's lower extreme, annotates liquid dish upper end intercommunication and has the inlet, is connected with the feed liquor pipe on the inlet, and the tip setting of feed liquor pipe is on the box, conveniently carries out the injection operation of deionized water. And deionized water can be sucked out through the arranged liquid inlet pipe in a sucking way. The lower extreme of annotating the liquid dish is equipped with the sealing ring, and the lower extreme open-ended shaping of sealing ring has the groove of falling V, and the diameter of annotating the liquid hole lower extreme is less than the diameter of its upper end, and when annotating liquid mechanism and positioning mechanism and being connected, the bulge loop inserts and locates the groove of falling V, and wherein the sealing ring inserts and establishes between the border of bulge loop and wafer to the problem that deionized water leaked appears when shifting, and in order to ensure sealed effect, the sealing ring adopts hard rubber to make.
The opening and closing mechanism comprises a movable ring movably arranged in the annular liquid storage cavity, a plurality of sealing cone pieces are arranged on the movable ring, the diameter of the lower end of each sealing cone piece is smaller than that of the upper end of each sealing cone piece, when the opening and closing mechanism closes the liquid injection of the liquid injection mechanism, each sealing cone piece penetrates through the corresponding liquid injection hole, and the movable ring is arranged in a movable manner, so that the purpose of injecting deionized water is achieved.
Further, the front end of hypoplastron has the front end board through hinged joint, a pair of vertical hole has been seted up to the front end board upper end, vertical downthehole activity is equipped with first screw, the outside end of first screw is equipped with movable planking, be equipped with on the movable planking and go up the push pedal, go up to wear to be equipped with many vertical poles on the push pedal, the lower extreme of vertical pole is equipped with installs the hypoplastron, install the hypoplastron and install on the front end board, vertical pole cover is equipped with first spring, first spring is located between installation hypoplastron and the push pedal, the inboard end of first screw is equipped with the L shaped plate, the L shaped plate is located the inboard of front end board, be equipped with a plurality of inserted bars on the L shaped plate, the front end of locating the upper plate is inserted to the inserted bar. Through the front end board that rotates the setting, conveniently protect wafer and relevant internals between hypoplastron and the upper plate to in-process that is shifting, cause the damage to the wafer. The scheme provided by the scheme is also convenient to open and close, has stronger stability after closing, and obviously improves the safety of the wafer during transferring.
Further, the cover is equipped with the concave plate on the movable cross bar, be equipped with the concave pull rod on the vertical section of concave plate, install a pair of connecting rod on the horizontal segment of concave plate, the front end cover of connecting rod is equipped with the seventh spring, the seventh spring is located the front side of rectangle frame front wall board, the connecting rod wears to locate on the front wall board of rectangle frame, the inner end of connecting rod is installed to the inboard end, install on the inner end board and prolong the flange, it is equipped with the movable rod to go up to prolong the upper end rotation of flange, a pair of removal guide hole has been seted up to the front wall board upper end of rectangle frame, wear to be equipped with the third screw in the removal guide hole, vertical movable plate is installed to the inboard end of third screw, be equipped with a pair of effect curb plate on the vertical movable plate, the second inclined hole has been seted up on the effect curb plate, the rear end upward slope of second inclined hole extends, the horizontal hole has been seted up to the rear end of second inclined hole, the movable rod moves in second inclined hole and horizontal hole, the link is installed to the outer end of third screw, the link is located the front side of rectangle frame front wall, the link, the outer end of link is equipped with the collar, the filling tray is installed in the collar. Through the concave pull rod provided by the invention, the concave plate can be conveniently moved, the seventh spring can be compressed when the concave plate moves, the liquid injection disc can be downwards moved through the movement of the moving rod, the liquid injection disc is buckled on the convex ring, the polished surface of the wafer is protected through the liquid injection disc, and meanwhile, the polished surface of the wafer can be wetted. In addition, the concave pull rod can be used for independently buckling and upwards moving the liquid injection disc, and in addition, the concave pull rod is pushed and pulled to lift the liquid injection disc during operation, so that convenience is brought to operation.
The movable end plate is installed to the outside end of movable horizontal pole, installs outer flange on the movable end plate, wears to be equipped with many first spring pins on the outer flange, and the cover is equipped with the sixth spring on the first spring pin, and the upper end of first spring pin is equipped with the stopper, and the shaping of stopper upper end opening has the U-shaped groove, and the sixth spring is located between stopper and the evagination board, and the front end of outer flange is equipped with the removal depression bar, and when annotating liquid mechanism and positioning mechanism connection, the transversal segment of spill pull rod wears to locate the U-shaped inslot. Although the above-mentioned when annotating the liquid dish and detaining and setting up on the bulge loop, through removing the movable rod to the horizontal hole in and lock the state of annotating the liquid dish, and this kind of locking mode's stability is relatively poor, in the removal process, because reasons such as rock make the movable rod outwards move under the effect of seventh spring very easily, consequently have the influence to annotating stability and the tightness after the liquid dish detains. Therefore, the limiting block and the U-shaped groove are arranged, the movement of the concave pull rod can be locked through the arranged U-shaped groove, and before limiting, the whole moving mechanism is fixedly connected to the rectangular frame through the connecting mechanism, so that the limiting stability can be ensured.
Further, coupling mechanism is including installing the first concave part on lower ring periphery, wear to be equipped with many second spring pins on the first concave part, the second spring pin wears to locate on the front wall board of rectangle frame, the inboard end of second spring pin is equipped with the kayser concave part, the cover is equipped with the second spring on the second spring, the second spring is located between kayser concave part and the first concave part, a pair of rectangle mouth has been seted up to the front wall board of rectangle frame, the inboard end of kayser concave part wears to locate the rectangle mouth, kayser convex part has been formed in the inboard end both sides of kayser concave part, the kayser convex part is right trapezoid structure, and the inner wall shaping of kayser convex part has first inclined plane, the outside end forward slope of first inclined plane. A pair of location curb plate is installed to the front wall board inboard of rectangle frame, wear to be equipped with a pair of activity on the location curb plate and wear the pole, the interior roof is installed to the inboard end of every pair of activity of being located the homonymy, be equipped with a pair of locking flange on the interior roof, the locking flange is right trapezoid structure, and the outer wall shaping of locking flange has the second inclined plane, the inboard end of second inclined plane inclines to the rear side, the cover is equipped with the third spring on the activity wear the pole, the third spring is located between location curb plate and the interior roof, the outside end that the pole was worn in the activity is equipped with the end cap, the outside pot head that the pole was worn in every pair of activity of homonymy is equipped with the waist shaped plate, the waist shaped plate is located between end cap and the location curb plate, be equipped with the external pulling diaphragm on the outer wall of waist shaped plate, first inclined hole has been seted up on the external pulling diaphragm, the end cross hole has been seted up respectively at the both ends of first inclined hole, be parallel to each other between the length direction of end cross hole, the rear end of first inclined hole inclines to the inboard. When the moving mechanism is fixedly connected with the rectangular frame, the inner side wall of the locking convex plate acts on the outer side wall of the locking convex part, and the locking convex plate locks the state of the locking concave part. And when the locking concave part is connected, the locking concave part is pushed inwards, so that the first inclined surface of the locking convex part acts on the second inclined surface of the locking convex plate, the locking convex plate is opened, and when the locking concave part moves in place, the locking convex plate moves inwards again under the action of the third spring, and then the locking convex part is limited through the locking convex plate, so that the moving mechanism and the wafer are positioned, and meanwhile, when the liquid injection disc moves downwards, the liquid injection disc can be accurately buckled on the convex ring through positioning.
Further, in order to cancel the locking effect of the locking convex plate on the locking convex portion conveniently, therefore, two pairs of fourth spring pins are installed on the outer side of the front wall plate of the rectangular frame, a pushing plate is sleeved on the outer side end of each pair of fourth spring pins located on the same side, the pushing plate is located on the inner side of the first concave piece, a fourth spring is sleeved on the fourth spring pin, the fourth spring is located between the pushing plate and the front wall plate of the rectangular frame, a pair of inward extending convex plates are arranged on the pushing plate in an inward extending mode, two pairs of movable holes are formed in the front wall plate of the rectangular frame, the inward extending convex plates penetrate through the movable holes, an inner pressing rod is rotatably arranged at the inner side end of each pair of inward extending convex plates located on the same side, the inner pressing rod moves in the first inclined holes and the end transverse holes, during application, the inner pressing rod can move inwards through the first inclined holes in a continuous inward pushing mode, the outer wall of the waist end cap can act on along with the movement of the inner pressing rod, the outward pulling of the locking convex plates, and then the wafer can be removed through the fast moving operation mode of the fast moving mechanism.
Further, a convex shell is arranged on the periphery of the middle ring, a rotating wheel is rotatably arranged at the inner outer side end of the convex shell, a rotating cap is connected to the upper end of the rotating wheel, a rotating shaft is rotatably arranged on the upper disc, a driving wheel is arranged at the upper end of the rotating shaft, the driving wheel and the rotating wheel are driven by a driving belt, a gear is arranged at the lower end of the rotating shaft, a middle gear is meshed on the gear, a screw rod is arranged on the middle gear, the lower end of the screw rod is rotatably arranged on the upper disc, a screw sleeve is connected on the screw rod by threads, a spline sleeve is arranged at the upper end of the screw sleeve, a top disc is arranged at the upper end of the spline sleeve, a fixed disc is sleeved at the upper end of the spline sleeve, at least three concave support pieces are formed at the periphery of the fixed disc, a pair of guide transverse holes are formed in each concave support piece, a pair of second screws are movably arranged in the guide transverse holes, a movable lower plate is arranged at the lower end of each second screw, the outer side end of the movable lower plate is provided with a downward extending convex plate, a sleeve is arranged on the downward extending convex plate, a movable inner rod is arranged in the sleeve in a penetrating manner, an outer end plate is arranged at the outer side end of the movable inner rod, the outer end plate is arranged at the outer side end of the concave support, a fifth spring is sleeved on the movable inner rod and positioned between the outer end plate and the downward extending convex plate, the upper end of a second screw positioned on the same concave support is arranged on a positioning lower block, the positioning lower block is positioned on the upper side of the concave support, at least three supporting plates are arranged on the periphery of a wire sleeve, a third inclined surface is formed on the outer wall of the supporting plates, the upper end of the third inclined surface extends inwards in a tilting manner, the outer side end of the sleeve acts on the outer wall of the third inclined surface, an installation protrusion is arranged on the outer wall of each concave support, a concave frame is arranged on the installation protrusion, and the lower end of the concave frame is provided with a guide vertical rod. In order to stably restrain the wafer, a fifth spring is arranged, the wafer is limited by the locating plate through the elastic force provided by the fifth spring when the supporting plate moves downwards, and in addition, when the wafer is taken out, the located wafer can be ejected out of the convex ring in a mode of pushing the fixing disc when the wire sleeve moves upwards, so that the wafer is taken out conveniently.
Further, the upper end of the positioning lower block is rotatably provided with a plurality of balls, and the arrangement of the balls can prevent the positioning lower block from wearing the wafer and can support the wafer.
Further, the outer side end of the sleeve is rotationally provided with an action ball, the periphery of the action ball is tangential to the outer wall of the third inclined plane, and flexibility of the supporting plate and the wire sleeve in moving is improved.
Further, the inner wall of the positioning plate is formed with an inner concave arc groove so as to avoid damaging the periphery of the wafer during positioning.
Further, be equipped with a pair of vertical connecting rod on the expansion ring, the upper end of vertical connecting rod wears to locate the upper end of annotating the liquid dish, the upper end of vertical connecting rod is equipped with the connecting block, the upper end of connecting block is equipped with the diaphragm, transverse hole has been seted up on the diaphragm, annotate the upper end of liquid dish and install a pair of rotation boss, spacing curb plate is still installed to the upper end of annotating the liquid dish, wear to be equipped with the spill inserted bar on the spacing curb plate, the inboard end of spill inserted bar is equipped with the interior movable plate, the lower extreme of interior movable plate is equipped with the movable lower plate, a pair of pulling riser is installed to the inboard end of movable lower plate, vertical broach has been seted up to the upper end of pulling riser, wear to be equipped with first horizontal pole in the vertical broach, the both ends of first horizontal pole are buckled and are buckled to have the spill pendulum rod, the horizontal segment rotation of spill pendulum rod is located on the rotation boss, the outside end of spill pendulum rod is equipped with the pendulum rod, the pendulum rod wears to locate in the transverse hole, the axial and the axial collineation of first horizontal pole of pendulum rod. When the wafer polishing surface is injected with the deionized water through the liquid injection hole, a wetting water film is formed on the surface of the wafer under the constraint sealing of the sealing ring. And then through continuing to move the pulling vertical plate, the sealing can be performed again, so that polluted water is prevented from entering the annular liquid storage cavity in the transferring process, and the pollution to the deionized water in the annular liquid storage cavity is avoided, or the phenomenon that the movable space of the deionized water is large and flows everywhere can be avoided, and the wetting effect on the polished surface of the wafer is influenced during transferring.
The technical scheme has the advantages that:
The invention can effectively protect the wafer disc when the wafer disc is transferred, thereby ensuring the safety during transfer, and wets the polished surface of the wafer in a manner of forming a deionized water film on the polished surface of the wafer during transfer so as to avoid adverse effect of the polishing liquid on the wafer.
Drawings
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1 shows a perspective view of a wafer storage device.
Fig. 2 shows a perspective view of a storage unit.
Fig. 3 shows a side view angle perspective view of an embodiment of the connection between the upper front end plate and the upper and lower plates of the storage unit.
Fig. 4 is a perspective view showing the structure of the inner perspective view of the connection embodiment between the upper front end plate and the upper and lower plates of the storage unit.
Fig. 5 shows a front view of a rectangular frame.
Fig. 6 shows a perspective view of the connecting embodiment between the movable rail and the female drawbar.
Fig. 7 shows a perspective view of the moving mechanism.
Fig. 8 shows a structural view of an outer housing of the positioning mechanism.
Fig. 9 shows a first perspective view of the internal structure of the positioning mechanism.
Fig. 10 shows a second perspective view of the internal structure of the positioning mechanism.
Fig. 11 shows a third perspective view of the internal structure of the positioning mechanism.
Fig. 12 shows a first perspective view of the connection mechanism.
Fig. 13 shows a second perspective view of the connection mechanism.
Fig. 14 is a perspective view showing a first perspective view of a movable member of the liquid injection mechanism.
Fig. 15 is a perspective view showing a second perspective view of the movable member of the liquid injection mechanism.
Fig. 16 is a perspective view showing a third perspective view of the movable member of the liquid injection mechanism.
Fig. 17 is a sectional view showing a structure of the pouring tray.
Fig. 18 shows a schematic connection of the opening and closing mechanism to the pouring tray.
Fig. 19 shows a structural view of the opening and closing mechanism.
Reference numerals illustrate:
Case 1, storage unit 2, rectangular frame 200, upper plate 201, rectangular hole 202, lower plate 203, front plate 204, vertical hole 205, first screw 206, movable outer plate 207, upper push plate 208, vertical rod 209, lower plate 210, first spring 211, l-shaped plate 212, insertion rod 213, rectangular opening 214, movable hole 215, movable guide hole 216, movable cross bar 300, movable end plate 301, outer convex plate 302, movable compression bar 303, sixth spring 304, stopper 305, u-shaped groove 306, convex portion 307, lower ring 308, lower plate 309, upper plate 310, middle ring 311, upper ring plate 312, convex ring 314, convex case 315, rotary wheel 316, rotary cap 317, belt 318, driving wheel 319, rotary shaft 320, gear 321, middle gear 322, lead screw 323, guide post 324, concave frame 325, mounting boss 326, concave support 327, guide cross hole 328, second screw 329, movable lower plate 330, lower convex portion 331, sleeve 332, fifth spring 333, action ball 335, outer end plate 336, silk sleeve 337, spline sleeve 338, fixed disk 339, stay 340, third ramp 341, positioning lower block 342, positioning plate 343, concave arc groove 344, ball 345, top disk 346, first female member 400, second spring pin 401, second spring 402, snap female member 403, snap male member 404, first ramp 405, locking tab 406, second ramp 407, inner top plate 408, positioning side plate 409, end cap 410, third spring 411, kidney plate 413, outer cross plate 414, first angled hole 415, end cross hole 416, inner pressure bar 417, inner protruding plate 418, fourth spring pin 419, fourth spring 420, top push plate 421, movable through bar 422, concave plate 500, concave pull bar 501, connecting bar 502, seventh spring 503, inner end plate 504, upper protruding plate 505, movable bar 506, third screw 507, vertical movable plate 508, action side plate 509, second angled hole 510, horizontal hole 511, link 512, mounting ring 513, priming plate 514, ventilative mesopore 515, annular reservoir 516, inlet 517, sealing ring 518, inverted V-groove 519, limit side plate 520, concave insert bar 521, inner shift plate 522, moving lower plate 523, pulling riser 524, vertical pull hole 525, rotating boss 526, first cross bar 527, concave swing link 528, swinging pressure lever 529, movable ring 530, sealing cone 531, vertical link 532, connecting block 534, cross plate 535, transverse hole 536, ventilative cover 537.
Detailed Description
As shown in fig. 1, a wafer storage device includes a case 1, where the case 1 has a rectangular structure, and a plurality of storage units 2 are disposed in the case 1.
As shown in fig. 2, the storage unit 2 includes a rectangular frame 200 installed in the case 1, an upper plate 201 is installed at an upper end of the rectangular frame 200, a rectangular hole 202 is formed in the upper plate 201, and a lower plate 203 is installed at a lower end of the rectangular frame 200. The movable moving mechanism is arranged on the rectangular frame 200, the positioning mechanism is arranged at the upper end of the moving mechanism, the connecting mechanism is arranged on the rectangular frame 200 and used for connecting and fixing the moving mechanism and the rectangular frame 200, the liquid injection mechanism is arranged on the rectangular frame 200 and provided with an opening and closing mechanism, and the liquid injection mechanism is buckled on the positioning mechanism and used for wetting the upper wall of the wafer.
As shown in fig. 3 and fig. 4, the front end of the lower plate 203 is connected with the front end plate 204 through a hinge, a pair of vertical holes 205 are formed in the upper end of the front end plate 204, a first screw 206 is movably arranged in the vertical holes 205, a movable outer plate 207 is arranged at the outer side end of the first screw 206, an upper pushing plate 208 is arranged on the movable outer plate 207, a plurality of vertical rods 209 are arranged on the upper pushing plate 208 in a penetrating manner, a mounting lower plate 210 is arranged at the lower end of the vertical rods 209, the mounting lower plate 210 is arranged on the front end plate 204, a first spring 211 is sleeved on the vertical rods 209, the first spring 211 is arranged between the mounting lower plate 210 and the upper pushing plate 208, an L-shaped plate 212 is arranged at the inner side end of the first screw 206, the L-shaped plate 212 is arranged at the inner side of the front end plate 204, a plurality of inserting rods 213 are arranged on the L-shaped plate 212, and the inserting rods 213 are inserted at the front end of the upper plate 201.
As shown in fig. 7, the moving mechanism includes a pair of movable rails 300, the movable rails 300 are threaded on the rectangular frame 200, a convex portion 307 is mounted on the outer side end of the movable rails 300, a lower ring 308 is provided on the inner side end of the convex portion 307, and a lower plate 309 is provided on the lower end of the lower ring 308.
As shown in fig. 8 to 11, the positioning mechanism includes an upper disc 310 mounted at the upper end of the lower ring 308, a middle ring 311 is disposed at the periphery of the upper disc 310, an upper ring plate 312 is disposed at the upper end of the middle ring 311, a convex ring 314 is disposed on the upper ring plate 312, the convex ring 314 is in an inverted V-shaped structure, a plurality of positioning lower blocks 342 are movably disposed in the middle ring 311, a plurality of balls 345 are rotatably disposed at the upper end of the positioning lower blocks 342, a positioning plate 343 is mounted at the upper end of the positioning lower blocks 342, an inner concave arc groove 344 is formed on the inner wall of the positioning plate 343, the positioning lower blocks 342 are used for supporting the wafer, and the positioning plate 343 is used for limiting the periphery of the lower end of the wafer.
More specifically, a convex shell 315 is arranged on the periphery of the middle ring 311, a rotating wheel 316 is rotatably arranged at the inner outer side end of the convex shell 315, a rotating cap 317 is connected at the upper end of the rotating wheel 316, a rotating shaft 320 is rotatably arranged on the upper disc 310, a driving wheel 319 is arranged at the upper end of the rotating shaft 320, the driving wheel 319 and the rotating wheel 316 are driven by a driving belt 318, a gear 321 is arranged at the lower end of the rotating shaft 320, a middle gear 322 is meshed with the gear 321, a screw rod 323 is arranged on the middle gear 322, the lower end of the screw rod 323 is rotatably arranged on the upper disc 310, a screw sleeve 337 is connected on the screw rod 323 through threads, a spline sleeve 338 is arranged at the upper end of the screw sleeve 337, a top disc 346 is arranged at the upper end of the spline sleeve 338, a fixed disc 339 is sleeved at least three concave support members 327 are formed on the periphery of the fixed disc 339, a pair of guide transverse holes 328 are formed on each concave support member 327, the guide transverse hole 328 is internally and movably provided with a pair of second screws 329, the lower end of each second screw 329 is provided with a movable lower plate 330, the outer side end of each movable lower plate 330 is provided with a downward extending convex plate 331, a sleeve 332 is arranged on each downward extending convex plate 331, a movable inner rod is arranged in each sleeve 332 in a penetrating manner, the outer side end of each movable inner rod is provided with an outer end plate 336, each outer end plate 336 is arranged at the outer side end of each concave support 327, a fifth spring 333 is sleeved on each movable inner rod, the fifth springs 333 are located between the outer end plates 336 and the downward extending convex plates 331, the upper ends of the second screws 329 located on the same concave support 327 are arranged on a positioning lower block 342, the positioning lower block 342 is located on the upper side of each concave support 327, at least three supporting plates 340 are arranged on the periphery of each wire sleeve 337, the outer walls of the supporting plates 340 are formed with third inclined surfaces 341, the upper ends of the third inclined surfaces 341 extend inwards in an inclined manner, and the outer side ends of the sleeves 332 act on the outer walls of the third inclined surfaces 341. Optionally, an action ball 335 is rotatably disposed at the outer end of the sleeve 332, and the outer circumference of the action ball 335 is tangential to the outer wall of the third inclined surface 341. A mounting protrusion 326 is mounted on the outer wall of each concave support 327, a concave frame 325 is mounted on the mounting protrusion 326, a guide vertical rod 324 is arranged at the lower end of the concave frame 325, and the guide vertical rod 324 is arranged on the upper disc 310 in a penetrating manner.
As shown in fig. 17, the liquid injection mechanism comprises a liquid injection plate 514, a ventilation middle hole 515 is formed in the center of the liquid injection plate 514, a ventilation cover 537 is screwed on the ventilation middle hole 515, an annular liquid storage cavity 516 is formed in the liquid injection plate 514, deionized water is filled in the annular liquid storage cavity 516, a plurality of liquid injection holes are formed in the lower end of the annular liquid storage cavity 516, a liquid inlet 517 is communicated with the upper end of the liquid injection plate 514, a sealing ring 518 is arranged at the lower end of the liquid injection plate 514, the sealing ring 518 is made of rubber, a reverse V-shaped groove 519 is formed in an opening mode at the lower end of the sealing ring 518, and the diameter of the lower end of the liquid injection hole is smaller than that of the upper end of the liquid injection hole. As shown in fig. 8 and 17, when the liquid injection mechanism is connected to the positioning mechanism, the collar 314 is inserted into the inverted V-groove 519.
As shown in fig. 5, 14-16 and 18, a concave plate 500 is sleeved on the movable cross bar 300, a concave pull rod 501 is arranged on a vertical section of the concave plate 500, a pair of connecting rods 502 is mounted on a horizontal section of the concave plate 500, a seventh spring 503 is sleeved on the front end of the connecting rod 502, the seventh spring 503 is positioned on the front side of the front wall plate of the rectangular frame 200, the connecting rod 502 penetrates through the front wall plate of the rectangular frame 200, an inner end plate 504 is mounted on the inner end plate 502, an upper extension plate 505 is mounted on the inner end plate 504, a moving rod 506 is rotatably arranged at the upper end of the upper extension plate 505, a pair of moving guide holes 216 are formed at the upper end of the front wall plate of the rectangular frame 200, a third screw 507 is penetrated in the moving guide holes 216, a vertical moving plate 508 is mounted at the inner end of the third screw 507, a pair of acting side plates 509 are arranged on the vertical moving plate 508, a second inclined hole 510 is formed on the acting side plate 509, the rear end of the second inclined hole 510 extends obliquely upwards, a horizontal hole 511 is formed at the rear end of the second inclined hole 510, a moving rod 506 is mounted on the inner side of the second inclined hole 510 and the horizontal hole 510, a pair of moving plates 512 is rotatably mounted on the outer side of the horizontal hole 507, a connecting frame is mounted on the outer side of the rectangular frame 200, a connecting frame 512 is mounted on the front side of the moving frame 512, and a connecting ring 512 is mounted on the side of the moving frame 512.
As shown in fig. 6, a movable end plate 301 is mounted at the outer end of the movable cross bar 300, an outer convex plate 302 is mounted on the movable end plate 301, a plurality of first spring pins are arranged on the outer convex plate 302 in a penetrating manner, sixth springs 304 are sleeved on the first spring pins, limiting blocks 305 are arranged at the upper ends of the first spring pins, U-shaped grooves 306 are formed in the upper ends of the limiting blocks 305 in an opening manner, the sixth springs 304 are located between the limiting blocks 305 and the outer convex plate 302, movable compression rods 303 are arranged at the front ends of the outer convex plate 302, and when the liquid injection mechanism is connected with the positioning mechanism, transverse sections of concave pull rods 501 penetrate through the U-shaped grooves 306.
As shown in fig. 17 to 19, the opening and closing mechanism includes a movable ring 530 movably disposed in the annular liquid storage cavity 516, a plurality of sealing cone members 531 are disposed on the movable ring 530, the diameter of the lower end of the sealing cone member 531 is smaller than the diameter of the upper end of the sealing cone member 531, and when the opening and closing mechanism closes the liquid injection of the liquid injection mechanism, the sealing cone member 531 is disposed in the liquid injection hole in a penetrating manner. The movable ring 530 is provided with a pair of vertical connecting rods 532, the upper ends of the vertical connecting rods 532 penetrate through the upper ends of the liquid injection plates 514, the upper ends of the vertical connecting rods 532 are provided with connecting blocks 534, the upper ends of the connecting blocks 534 are provided with transverse plates 535, the transverse plates 535 are provided with transverse holes 536, the upper ends of the liquid injection plates 514 are provided with a pair of rotating bosses 526, the upper ends of the liquid injection plates 514 are also provided with limiting side plates 520, the limiting side plates 520 are provided with concave inserting rods 521 in a penetrating manner, the inner side ends of the concave inserting rods 521 are provided with inner moving plates 522, the lower ends of the inner moving plates 522 are provided with movable lower plates 523, the inner side ends of the movable lower plates 523 are provided with a pair of pulling vertical plates 524, the upper ends of the pulling vertical plates 524 are provided with vertical pulling holes 525, first transverse rods 527 are penetrated in the vertical pulling holes 525, two ends of the first transverse rods 527 are bent with concave swing rods 528, the horizontal sections of the concave swing rods 528 are rotatably arranged on the rotating bosses 526, the outer side ends of the concave swing rods 528 are provided with swing pressure rods 529, the swing pressure rods 529 are penetrated in the transverse holes 536, and the axial directions of the swing pressure rods 529 are collinear with the first transverse rods 527.
As shown in fig. 5, 7, 12 and 13, the connection mechanism includes a first concave member 400 mounted on the outer periphery of the lower ring 308, a plurality of second spring pins 401 are arranged on the first concave member 400 in a penetrating manner, the second spring pins 401 are arranged on the front wall plate of the rectangular frame 200 in a penetrating manner, a locking concave member 403 is arranged at the inner side end of the second spring pins 401, a second spring 402 is sleeved on the second spring pins 401, the second spring 402 is located between the locking concave member 403 and the first concave member 400, a pair of rectangular openings 214 are formed in the front wall plate of the rectangular frame 200, the inner side ends of the locking concave member 403 are arranged in the rectangular openings 214 in a penetrating manner, locking convex portions 404 are formed at two sides of the inner side ends of the locking concave member 403, the locking convex portions 404 are in a right trapezoid structure, a first inclined surface 405 is formed on the inner wall of the locking convex portions 404, and the outer side ends of the first inclined surface 405 incline forwards.
A pair of positioning side plates 409 are installed on the inner side of the front wall plate of the rectangular frame 200, a pair of movable penetrating rods 422 are arranged on the positioning side plates 409 in a penetrating manner, an inner top plate 408 is installed at the inner side end of each pair of movable penetrating rods 422 located on the same side, a pair of locking convex plates 406 are arranged on the inner top plate 408, each locking convex plate 406 is of a right trapezoid structure, second inclined planes 407 are formed on the outer walls of the locking convex plates 406, the inner side ends of the second inclined planes 407 incline towards the rear side, third springs 411 are sleeved on the movable penetrating rods 422, the third springs 411 are located between the positioning side plates 409 and the inner top plate 408, end caps 410 are arranged at the outer side ends of the movable penetrating rods 422, waist-shaped plates 413 are sleeved on the outer side ends of each pair of movable penetrating rods 422 located between the end caps 410 and the positioning side plates 409, outer pull transverse plates 414 are arranged on the outer walls of the waist-shaped plates 413, first inclined holes 415 are formed in the outer pull transverse plates 414, the two ends of the first inclined holes 415 are respectively formed with end transverse holes 416, the length directions of the end transverse holes 416 are parallel to each other, and the rear ends of the first inclined holes 415 incline towards the rear sides. When the connection of the moving mechanism to the rectangular frame 200 is fixed, the inner side wall of the locking projection 406 acts on the outer side wall of the latching projection 404.
Two pairs of fourth spring pins 419 are arranged on the outer side of the front wall plate of the rectangular frame 200, a pushing plate 421 is sleeved on the outer side end of each pair of fourth spring pins 419 on the same side, the pushing plate 421 is positioned on the inner side of the first concave piece 400, a fourth spring 420 is sleeved on the fourth spring pins 419, the fourth spring 420 is positioned between the pushing plate 421 and the front wall plate of the rectangular frame 200, a pair of inward extending convex plates 418 are arranged on the pushing plate 421 in an inward extending mode, two pairs of movable holes 215 are formed in the front wall plate of the rectangular frame 200, the inward extending convex plates 418 penetrate through the movable holes 215, an inner pressing rod 417 is rotatably arranged at the inner side end of each pair of inward extending convex plates 418 on the same side, and the inner pressing rod 417 moves in the first inclined holes 415 and the end transverse holes 416.
The solution provided in this embodiment is performed in the following manner when placing the wafer, wetting the polished surface of the wafer, and taking out the wafer after transferring the wafer.
In step 1, the operator places the polished wafer on the balls 345 of the positioning lower block 342.
In step 2, the operator rotates the rotating wheel 316 through the rotating cap 317, the rotating wheel 316 drives the driving wheel 319 to rotate through the driving belt 318, the rotation of the driving wheel 319 drives the rotating shaft 320 and the gear 321 thereon to rotate, the rotation of the gear 321 drives the middle gear 322 to rotate, the rotation of the middle gear 322 drives the screw rod 323 to rotate, the rotation of the screw rod 323 causes the wire sleeve 337 to move downwards along the axial direction thereof and the limit of the spline sleeve 338 on the screw rod 323, when the wire sleeve 337 moves downwards, the supporting plate 340 moves downwards, and when the supporting plate 340 moves downwards, the positioning plate 343 and the positioning lower block 342 move inwards under the elastic force of the fifth spring 333, and the concave arc groove 344 of the positioning plate 343 is clung to the periphery of the wafer and positions the wafer, and when the wire sleeve 337 moves downwards, the top disc 346 acts on the fixed disc 339, and thus the whole wafer moves downwards, the polishing surface of the wafer 325 is located in the convex ring 314, and the lower end of the concave frame 310 is tightly propped against the upper disc 310.
In step 3, the operator pushes the wafer inwards through the movable end plate 301, when pushing inwards, the locking concave part 403 penetrates through the rectangular opening 214, and acts on the second inclined surface 407 of the locking convex plate 406 through the first inclined surface 405 on the locking convex plate 404, so that the locking convex plate 406 opens, when the locking convex plate 404 passes the locking convex plate 406, the locking convex plate 406 moves inwards under the action of the third spring 411, and the locking convex plate 404 and the whole wafer are positioned through the locking convex plate 406.
Step 4, the operator pushes the concave pull rod 501 inwards, when the concave pull rod 501 moves inwards, the connecting rod 502 drives the upper extension convex plate 505 and the moving rod 506 thereon to move inwards, and when the moving rod 506 moves, the second inclined hole 510 is acted on, so that the acting side plate 509 and the liquid injection plate 514 move downwards, the liquid injection plate 514 is buckled on the convex ring 314, meanwhile, the convex ring 314 is also inserted in the inverted V-shaped groove 519, meanwhile, the sealing ring 518 is also inlaid in a gap between the edge of the wafer and the convex ring 314, and when the liquid injection plate 514 is buckled, the operator releases the downward acting force on the limiting block 305, so that the limiting block 305 moves upwards under the action of the sixth spring 304 and limits the concave pull rod 501 through the U-shaped groove 306.
In step 5, the operator pushes the concave plunger 521 inward, so that the pulling riser 524 moves inward, and when the pulling riser 524 moves inward, the outer circumference of the first cross bar 527 is acted on by the vertical pulling hole 525, so that the swinging pressure bar 529 rotates around the axial direction of the concave swing bar 528, and as the swinging pressure bar 529 rotates upward, the swinging pressure bar 529 acts on the transverse hole 536, and pulls the movable ring 530 upward through the transverse plate 535, and draws the sealing cone 531 out of the liquid injection hole, and then deionized water is injected into the annular liquid storage cavity 516 through the liquid inlet pipe connected to the liquid inlet 517, or deionized water stored in the annular liquid storage cavity 516 flows onto the polished surface of the wafer through the liquid injection hole, and when the deionized water is injected, air in the sealing ring 518 is discharged through the air permeable cover 537, and finally a wet water film is formed on the polished surface of the wafer, and when the deionized water injection is completed, the pulling riser 524 continues to move inward, and finally the sealing cone 531 is inserted into the liquid injection hole.
In step 6, the operator rotates the front end plate 204 upward, applies downward force to the movable outer plate 207 during rotation, and finally makes the front end plate 204 in an upright posture, then releases the force to the movable outer plate 207, and then the insert rod 213 inserts the insert rod 213 on the upper plate 201 under the action of the first spring 211.
And 7, performing other wafer placement and wetting operations as described above.
And 8, connecting the wafer storage device to a transfer and conveying system, and performing wafer transfer operation.
At step 9, after the wafer is transferred into place, the operator applies a downward force to the movable outer plate 207 to remove the pins 213 from the upper plate 201 and then rotate the front end plate 204 outwardly.
At step 10, the operator pulls the female plunger 521 to move the movable ring 530 upward and withdraw deionized water through the feed tube.
In step 11, the operator presses the stopper 305 downward, and then pulls the concave pull rod 501 outward, so that the pouring tray 514 moves upward by the movement of the concave pull rod 501, and the pouring tray 514 and the convex ring 314 are disengaged.
In step 12, the operator pushes the movable end plate 301 inwardly, and when the movable end plate 301 moves inwardly, the first concave member 400 acts on the top pushing plate 421 to move inwardly, when the top pushing plate 421 moves inwardly, the inner pressing rod 417 moves, and when the inner pressing rod 417 moves through the first inclined hole 415, the kidney-shaped plate 413 moves outwardly, and acts on the end cap 410 through the kidney-shaped plate 413, so that the locking convex plate 406 moves outwardly, and the locking effect of the locking convex plate 406 on the locking convex plate 404 is canceled, then the movable end plate 301 is pulled outwardly rapidly, and finally the wafer is removed from the case 1.
In step 13, the operator moves the supporting plate 340 upward by rotating the rotating cap 317 and moves the positioning plate 343 outward by the third inclined surface 341 of the supporting plate 340, and when the supporting plate 340 and the wire sleeve 337 move upward, the upper end of the wire sleeve 337 acts on the fixing plate 339 to move the fixing plate 339 and the wafer thereon upward and expose the polished surface and the upper end portion of the wafer from the upper end of the convex ring 314, and then moves the wafer out.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (8)
1. A wafer storage device, characterized by comprising a box (1);
a plurality of storage units (2) are arranged in the box body (1);
The storage unit (2) comprises a rectangular frame (200) arranged in the box body (1), an upper plate (201) is arranged at the upper end of the rectangular frame (200), and a lower plate (203) is arranged at the lower end of the rectangular frame (200);
a moving mechanism is movably arranged on the rectangular frame (200), a positioning mechanism is arranged at the upper end of the moving mechanism, a connecting mechanism is arranged on the rectangular frame (200) and used for connecting and fixing the moving mechanism and the rectangular frame (200), a liquid injection mechanism is arranged on the rectangular frame (200), an opening and closing mechanism is arranged on the liquid injection mechanism, and the liquid injection mechanism is buckled on the positioning mechanism and used for wetting the upper wall of the wafer;
The moving mechanism comprises a pair of movable cross bars (300), the movable cross bars (300) penetrate through the rectangular frame (200), a convex part (307) is arranged at the outer side end of each movable cross bar (300), a lower ring (308) is arranged at the inner side end of each convex part (307), and a lower disc (309) is arranged at the lower end of each lower ring (308);
The connecting mechanism comprises a first concave part (400) arranged on the periphery of a lower ring (308), a plurality of second spring pins (401) are arranged on the first concave part (400) in a penetrating manner, the second spring pins (401) are arranged on a front wall plate of the rectangular frame (200) in a penetrating manner, a locking concave part (403) is arranged at the inner side end of each second spring pin (401), a second spring (402) is sleeved on each second spring pin (401), each second spring (402) is arranged between each locking concave part (403) and each first concave part (400), a pair of rectangular openings (214) are formed in the front wall plate of the rectangular frame (200), locking convex parts (404) are formed at the inner side ends of the corresponding locking concave parts (403), the locking convex parts (404) are in a right trapezoid structure, a first inclined plane (405) is formed on the inner wall of each locking convex part (404), and the outer side ends of the first inclined planes (405) incline forwards;
A pair of positioning side plates (409) are arranged on the inner side of a front wall plate of a rectangular frame (200), a pair of movable penetrating rods (422) are arranged on the positioning side plates (409) in a penetrating manner, an inner top plate (408) is arranged at the inner side end of each pair of movable penetrating rods (422) on the same side, a pair of locking convex plates (406) are arranged on the inner top plate (408), each locking convex plate (406) is in a right trapezoid structure, a second inclined plane (407) is formed on the outer wall of each locking convex plate (406), the inner side end of each second inclined plane (407) is inclined to the rear side, a third spring (411) is sleeved on each movable penetrating rod (422), an end cap (410) is arranged at the outer side end of each movable penetrating rod (422), a waist-shaped plate (413) is sleeved at the outer side end of each pair of movable penetrating rods (422) on the same side, each waist-shaped plate (413) is arranged between the end cap (410) and the positioning side plate (409), an outer transverse plate (414) is arranged on the outer wall of each waist-shaped plate, a third spring (411) is sleeved on the outer transverse plate (414), a third spring (411) is arranged on the outer transverse plate (414), the outer transverse plate (414) is provided with a first inclined hole (415), and the first inclined ends (415) are arranged at the opposite ends in parallel to each other, and the opposite directions of the first inclined holes (415) are formed between the opposite ends;
When the moving mechanism is fixedly connected with the rectangular frame (200), the inner side wall of the locking convex plate (406) acts on the outer side wall of the locking convex part (404);
The positioning mechanism comprises an upper disc (310) arranged at the upper end of a lower ring (308), a middle ring (311) is arranged at the periphery of the upper disc (310), an upper ring plate (312) is arranged at the upper end of the middle ring (311), a convex ring (314) is arranged on the upper ring plate (312), the convex ring (314) is of an inverted V-shaped structure, a plurality of positioning lower blocks (342) are movably arranged in the middle ring (311), a positioning plate (343) is arranged at the upper end of each positioning lower block (342), each positioning lower block (342) is used for supporting a wafer, and each positioning plate (343) is used for limiting the periphery of the lower end of the wafer;
The periphery of the middle ring (311) is provided with a convex shell (315), the inner outer side end of the convex shell (315) is rotationally provided with a rotating wheel (316), the upper end of the rotating wheel (316) is connected with a rotating cap (317), the upper disc (310) is rotationally provided with a rotating shaft (320), the upper end of the rotating shaft (320) is provided with a driving wheel (319), the driving wheel (319) and the rotating wheel (316) are driven by a driving belt (318), the lower end of the rotating shaft (320) is provided with a gear (321), the gear (321) is meshed with a middle gear (322), the middle gear (322) is provided with a screw rod (323), the lower end of the screw rod (323) is rotationally arranged on the upper disc (310), the screw rod (323) is connected with a screw sleeve (337) through threads, the upper end of the screw sleeve (337) is provided with a spline sleeve (338), the upper end of the spline sleeve (338) is provided with a top disc (346), the upper end of the spline sleeve (338) is sleeved with a fixed disc (339), the periphery of the fixed disc (339) is formed with at least three concave supports (327), each concave support (327) is provided with a pair of guide transverse holes (328), the guide transverse holes (328) are internally and movably provided with a pair of second screws (329), the lower end of each second screw (329) is provided with a movable lower plate (330), the outer side end of the movable lower plate (330) is provided with a downward extending convex plate (331), a sleeve (332) is arranged on the downward extending convex plate (331), a movable inner rod is arranged in the sleeve (332) in a penetrating manner, an outer end plate (336) is arranged at the outer side end of the movable inner rod, the outer end plate (336) is arranged at the outer side end of the concave support (327), a fifth spring (333) is sleeved on the movable inner rod, the fifth spring (333) is positioned between the outer end plate (336) and the downward extending convex plate (331), the upper ends of second screws (329) positioned on the same concave support (327) are arranged on a positioning lower block (342), the positioning lower block (342) is positioned on the upper side of the concave support (327), at least three supporting plates (340) are arranged on the periphery of a wire sleeve (337), a third inclined surface (341) is formed on the outer wall of the supporting plate (340), the upper end of the third inclined surface (341) extends inwards in a slanting manner, a mounting boss (326) is arranged on the outer wall of each concave support (327), a concave support (325) is arranged on the outer wall of the same concave support (326), and a guide disc (324) is arranged on the lower end of the concave support (324);
The liquid injection mechanism comprises a liquid injection disc (514), a ventilation middle hole (515) is formed in the center of the liquid injection disc (514), a ventilation cover (537) is screwed on the ventilation middle hole (515), an annular liquid storage cavity (516) is formed in the liquid injection disc (514), deionized water is filled in the annular liquid storage cavity (516), a plurality of liquid injection holes are formed in the lower end of the annular liquid storage cavity (516), a liquid inlet (517) is communicated with the upper end of the liquid injection disc (514), a sealing ring (518) is arranged at the lower end of the liquid injection disc (514), a reverse V groove (519) is formed in an opening mode at the lower end of the sealing ring (518), the diameter of the lower end of the liquid injection hole is smaller than that of the upper end of the liquid injection hole, and when the liquid injection mechanism is connected with the positioning mechanism, the convex ring (314) is inserted in the reverse V groove (519);
The opening and closing mechanism comprises a movable ring (530) movably arranged in the annular liquid storage cavity (516), a plurality of sealing cone pieces (531) are arranged on the movable ring (530), the diameter of the lower end of each sealing cone piece (531) is smaller than that of the upper end of each sealing cone piece, and when the opening and closing mechanism closes the liquid injection of the liquid injection mechanism, each sealing cone piece (531) penetrates through the corresponding liquid injection hole.
2. The wafer storage device according to claim 1, wherein the front end of the lower plate (203) is connected with the front end plate (204) through a hinge, a pair of vertical holes (205) are formed in the upper end of the front end plate (204), first screws (206) are movably arranged in the vertical holes (205), movable outer plates (207) are arranged at the outer ends of the first screws (206), upper pushing plates (208) are arranged on the movable outer plates (207), a plurality of vertical rods (209) are arranged on the upper pushing plates (208) in a penetrating mode, lower plates (210) are arranged at the lower ends of the vertical rods (209), the lower plates (210) are arranged on the front end plate (204) in a mounting mode, first springs (211) are sleeved on the vertical rods (209), the first springs (211) are located between the lower plates (210) and the upper pushing plates (208), L-shaped plates (212) are arranged at the inner ends of the first screws (206), a plurality of inserting rods (213) are arranged on the L-shaped plates (212) and are arranged at the inner sides of the front ends of the front end plates (204).
3. The wafer storage device of claim 1, wherein the movable cross bar (300) is sleeved with a concave plate (500), a vertical section of the concave plate (500) is provided with a concave pull rod (501), a horizontal section of the concave plate (500) is provided with a pair of connecting rods (502), a front end of each connecting rod (502) is sleeved with a seventh spring (503), each seventh spring (503) is positioned at the front side of a front wall plate of the rectangular frame (200), each connecting rod (502) is arranged on the front wall plate of the rectangular frame (200) in a penetrating manner, an inner end plate (504) is arranged at the inner side end of each connecting rod (502), an upper extension convex plate (505) is arranged on each inner end plate (504), the upper end of each upper extension convex plate (505) is provided with a moving rod (506), the upper end of each front wall plate of the rectangular frame (200) is provided with a pair of moving guide holes (216), a third screw (507) is arranged in each moving guide hole (216), the inner side end of each third screw (507) is provided with a vertical moving plate (508), each vertical moving plate (508) is provided with a pair of acting side plates (509), each acting side plates (509) is provided with a second inclined hole (510) arranged on the front side plate, each second inclined hole (510) is provided with a second inclined hole (510) and the second inclined hole (510) is formed at the upper horizontal end of the second inclined hole (511), the outer side end of the third screw (507) is provided with a connecting frame (512), the connecting frame (512) is positioned at the front side of the front wall plate of the rectangular frame (200), the outer side end of the connecting frame (512) is provided with a mounting ring (513), and the liquid injection disc (514) is arranged in the mounting ring (513);
The movable end plate (301) is installed at the outer side end of the movable cross rod (300), the outer convex plate (302) is installed on the movable end plate (301), a plurality of first spring pins are arranged on the outer convex plate (302) in a penetrating mode, sixth springs (304) are sleeved on the first spring pins, limiting blocks (305) are arranged at the upper ends of the first spring pins, U-shaped grooves (306) are formed in an opening mode at the upper ends of the limiting blocks (305), the sixth springs (304) are located between the limiting blocks (305) and the outer convex plate (302), and movable compression rods (303) are arranged at the front ends of the outer convex plate (302);
When the liquid injection mechanism is connected with the positioning mechanism, the transverse section of the concave pull rod (501) is penetrated in the U-shaped groove (306).
4. The wafer storage device according to claim 1, wherein two pairs of fourth spring pins (419) are mounted on the outer side of the front wall plate of the rectangular frame (200), a top pushing plate (421) is sleeved on the outer side end of each pair of fourth spring pins (419) located on the same side, the top pushing plate (421) is located on the inner side of the first concave piece (400), a fourth spring (420) is sleeved on the fourth spring pins (419), the fourth spring (420) is located between the top pushing plate (421) and the front wall plate of the rectangular frame (200), a pair of inward extending protruding plates (418) are arranged on the inward extending side of the top pushing plate (421), two pairs of movable holes (215) are formed in the front wall plate of the rectangular frame (200), the inward extending protruding plates (418) penetrate through the movable holes (215), an inner pressing rod (417) is rotatably arranged on the inner side end of each pair of inward protruding plates (418) located on the same side, and the inner pressing rod (417) moves in the first inclined holes (415) and the end transverse holes (416).
5. The wafer storage device of claim 1, wherein the upper end of the positioning lower block (342) is rotatably provided with a plurality of balls (345).
6. Wafer storage device according to claim 1, characterized in that the outer end of the sleeve (332) is rotatably provided with an action ball (335), the outer circumference of the action ball (335) being tangential to the outer wall of the third ramp (341).
7. The wafer storage device of claim 1, wherein an inner wall of the positioning plate (343) is formed with a concave arc groove (344).
8. The wafer storage device of claim 1, wherein the movable ring (530) is provided with a pair of vertical connecting rods (532), the upper ends of the vertical connecting rods (532) are arranged at the upper ends of the liquid injection plates (514) in a penetrating manner, the upper ends of the vertical connecting rods (532) are provided with connecting blocks (534), the upper ends of the connecting blocks (534) are provided with transverse plates (535), the transverse plates (535) are provided with transverse holes (536), the upper ends of the liquid injection plates (514) are provided with a pair of rotating boss (526), the upper ends of the liquid injection plates (514) are also provided with limiting side plates (520), concave inserting rods (521) are arranged on the limiting side plates (520) in a penetrating manner, the inner side ends of the concave inserting rods (521) are provided with inner moving plates (522), the lower ends of the inner moving plates (522) are provided with moving lower plates (523), the inner side ends of the moving lower plates (523) are provided with a pair of pulling vertical plates (524), the upper ends of the pulling vertical pulling plates (525) are provided with vertical pulling holes (536), the inner side rods (527) are provided with a pair of first transverse rods (527), the two ends of the first transverse rods (527) are provided with a pair of rotating boss 526), the two ends of the first transverse rods (527) are provided with concave swing rods (528) and the concave swing rods (528) are provided with the concave swing rods (528) and are provided with swing rods (528) and swing rods (528) respectively, the axial direction of the swinging compression bar (529) is collinear with the axial direction of the first cross bar (527).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN118858906B (en) * | 2024-09-26 | 2024-11-29 | 山东强茂电子科技有限公司 | A wafer spot measuring machine with a temperature-controlled stage |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1331838A (en) * | 1998-12-24 | 2002-01-16 | Memc电子材料有限公司 | Method for storing carrier for polishing wafer |
KR20150060126A (en) * | 2013-11-26 | 2015-06-03 | 주식회사 케이씨텍 | Injection type wafer wetting device |
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JP3631554B2 (en) * | 1996-02-28 | 2005-03-23 | 株式会社荏原製作所 | Polishing device |
JP5093652B2 (en) * | 2007-06-12 | 2012-12-12 | 株式会社ニコン | Polishing equipment |
KR100902098B1 (en) * | 2007-08-24 | 2009-06-09 | 앰코 테크놀로지 코리아 주식회사 | Wafer alignment device for wafer mount |
CN109732474A (en) * | 2019-01-30 | 2019-05-10 | 杭州众硅电子科技有限公司 | A kind of chemical-mechanical polisher and its wafer exchange mechanism and wafer transfer method |
CN213561843U (en) * | 2020-10-30 | 2021-06-29 | 天津梅曼激光技术有限公司 | Laser crystal double-side polishing device |
CN113246004B (en) * | 2021-06-08 | 2021-10-12 | 四川上特科技有限公司 | Wafer end surface finish grinding device |
CN113601314A (en) * | 2021-08-16 | 2021-11-05 | 四川洪芯微科技有限公司 | Wafer disc rounding device for chip |
CN114496858A (en) * | 2022-02-09 | 2022-05-13 | 四川洪芯微科技有限公司 | Wafer front coating device |
CN114628303B (en) * | 2022-05-16 | 2022-07-26 | 四川上特科技有限公司 | Crystal grain stripping off device |
CN220439577U (en) * | 2022-06-30 | 2024-02-02 | 杭州众硅电子科技有限公司 | A kind of chemical mechanical planarization equipment |
CN117124233A (en) * | 2023-10-13 | 2023-11-28 | 吉姆西半导体科技(无锡)有限公司 | Wafer buffer device and CMP equipment |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1331838A (en) * | 1998-12-24 | 2002-01-16 | Memc电子材料有限公司 | Method for storing carrier for polishing wafer |
KR20150060126A (en) * | 2013-11-26 | 2015-06-03 | 주식회사 케이씨텍 | Injection type wafer wetting device |
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