CN118232131B - Semiconductor electrothermal film wiring device - Google Patents
Semiconductor electrothermal film wiring device Download PDFInfo
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- CN118232131B CN118232131B CN202410641773.1A CN202410641773A CN118232131B CN 118232131 B CN118232131 B CN 118232131B CN 202410641773 A CN202410641773 A CN 202410641773A CN 118232131 B CN118232131 B CN 118232131B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
- H01R43/048—Crimping apparatus or processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
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- Manufacturing & Machinery (AREA)
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Abstract
The utility model provides a semiconductor electric heating film termination, including the wiring platform, the wiring platform includes puts the thing board, the limiting plate, the copper junction block, the wiring support, the wiring groove, hydraulic stem and hydraulic press, the upper portion of putting the thing board is equipped with the limiting plate, the size of the internal groove of limiting plate is unanimous with copper junction block size, the limiting plate is used for placing copper junction block, copper junction block is equipped with the junction block shell, the junction block shell is used for placing the semiconductor electric heating film that needs the wiring, one side of limiting plate is equipped with the wiring support, the surface of wiring support is equipped with the wiring groove, the wiring groove is used for placing the electric wire that needs the butt joint, the lower part rigid coupling hydraulic stem of putting the thing board, the lower part of hydraulic stem is equipped with the hydraulic press; through the limiting function of the limiting plate on the wiring platform, the copper wiring block can be fixed at a specified position, and the copper wiring block can be firmly fixed at the specified position of the semiconductor electrothermal film through the extrusion of the pressing block driven by the air cylinder.
Description
Technical Field
The invention belongs to the field of electrothermal film wiring, and particularly relates to a semiconductor electrothermal film wiring device.
Background
A semiconductor electrothermal film (SEHF), also called a semiconductor heating film or a metal oxide electrothermal film, is a film-like semiconductor electrothermal material capable of being tightly bonded on the surface of a dielectric; after being electrified, the heat source can form a planar heat source; the semiconductor electrothermal film is mainly made of semiconductor material, and has the characteristics of high melting point, high hardness, low resistance, high thermal efficiency, good chemical stability and the like, and particularly has no open fire and acid and alkali resistance in the heating process.
At present, the wiring process of semiconductor electric heating film needs to be in the same place copper junction block and specific electric wire with the specialty, later pastes the insulating tape and covers in copper junction block department to prevent junction department and expose, current termination of semiconductor electric heating film can not consolidate the insulating tape of junction department and handle, because long-time use insulating tape can appear the problem that drops, can lead to the risk of electric shock, and current termination is kneading copper junction block in time, can appear kneading inadequately and kneading the dislocation condition, can take place the problem that the wiring failed and electric wire drops finally.
Disclosure of Invention
In view of the above, the present invention provides a semiconductor electrothermal film wiring device to overcome the defects of the prior art, and at least partially solve the above technical problems.
The technical scheme adopted by the invention is as follows: the utility model provides a semiconductor electrothermal film termination, includes wiring platform, the wiring platform is including putting thing board, limiting plate, copper junction block, wiring support, wiring groove, hydraulic stem and hydraulic press.
The copper junction block includes a junction block housing.
The upper portion of putting the thing board is equipped with the limiting plate, the size of the internal groove of limiting plate is unanimous with copper junction block size, the limiting plate is used for placing copper junction block, copper junction block is equipped with the junction block shell, the junction block shell is used for placing the semiconductor electric heat membrane that needs the wiring, one side of limiting plate is equipped with the wiring support, the surface of wiring support is equipped with the wiring groove, the wiring groove is used for placing the electric wire that needs the butt joint, the lower part rigid coupling hydraulic stem of putting the thing board, the lower part of hydraulic stem is equipped with the hydraulic press.
Further, the wiring platform further comprises a first air inlet valve, a first sliding platform and a first sliding rod.
Still further, the lower part of hydraulic press is equipped with first slide platform, first slide platform is used for placing the hydraulic press, one side of first slide platform is equipped with multiunit first admission valve, each first admission valve is used for transmitting compressed air and then controls first slide platform's removal, first slide platform's inside is equipped with first slide bar, first slide platform can follow first slide bar round trip movement.
Furthermore, the semiconductor electrothermal film wiring device provided by the invention comprises the pressing fastening device, wherein the pressing fastening device is arranged outside the wiring platform, and the pressing fastening device is used for reinforcing between the electrothermal film and the conducting wire.
Still further, press fastener includes cylinder, pull rod, press briquetting, second sliding platform and second slide bar.
Further, the lateral part rigid coupling second slide platform of cylinder, the second slide bar passes from second slide platform is inside, second slide platform can be along second slide bar round trip movement, the lower part of cylinder is equipped with the pull rod, the lower part rigid coupling of pull rod presses the briquetting, press the shape and size unanimity of briquetting and copper junction block, press the briquetting and be used for pressing copper junction block and electric wire.
Still further, press the fastener still including third slide bar, steam outlet channel, pressurization intensification valve, first gas-supply pipeline, air pump, air blowing valve, gas-blowing mouth and second gas-supply pipeline.
Further, the upper portion of steam gas outlet is equipped with the pressurization intensification valve, the pressurization intensification valve is to the gas pressurization intensification that gets into wherein, the third sliding rod passes from steam gas outlet is inside, steam gas outlet can follow third sliding rod round trip movement, one side rigid coupling of steam gas outlet is equipped with the gas blowing valve, the lower part of gas blowing valve is equipped with the gas blowing mouth, the gas blowing mouth is used for cooling down the copper junction block after the heating, the lateral part of pressurization intensification valve is equipped with first gas transmission pipeline, the opposite side and the air pump of first gas transmission pipeline meet, the lateral part of gas blowing valve is equipped with the second gas transmission pipeline, the opposite side and the air pump of second gas transmission pipeline meet.
Furthermore, the semiconductor electrothermal film wiring device provided by the invention comprises an automatic attaching device, wherein the automatic attaching device is arranged outside the wiring platform and is used for automatically attaching an insulating tape to a wiring position.
Furthermore, the automatic attaching device comprises an insulating adhesive tape, a limiting shaft, a sliding column, a fixed support, an upper clamping device, an adjustable clamping block and a lower clamping device.
Further, one side of the limiting shaft is provided with an insulating adhesive tape, the limiting shaft is used for limiting shaking of the insulating adhesive tape, one side of the limiting shaft is provided with a sliding column, one side of the limiting shaft is fixedly connected with a fixing support, the lower part of the limiting shaft is provided with an upper clamping device, the lower part of the upper clamping device is provided with a lower clamping device, and one sides of the upper clamping device and the lower clamping device are respectively provided with an adjustable clamping block.
Furthermore, the automatic attaching device further comprises a controllable pushing block, a cutting block, a control base station, a supporting table, an upper moving plate, a lower moving plate and a pushing plate.
Further, lower clamp gets device lateral part and is equipped with the control base, the slip post passes from control base inside, the control base can reciprocate from top to bottom along the slip post, go up one side of clamp and get the device and be equipped with the cutting block, be provided with the blade on the cutting block surface, cutting block one side and controllable ejector pad meet, controllable ejector pad control cutting block makes a round trip to stretch out and draw back, accomplishes the cutting to the insulating tape through the blade that sets up on the cutting block, the lower part of control base is equipped with the brace table, insulating tape one side is equipped with movable plate and movable plate down, the one end of last movable plate and movable plate down all is equipped with the push pedal, go up movable plate and movable plate down and be used for pasting the insulating tape to the copper wiring piece.
Furthermore, the semiconductor electrothermal film wiring device provided by the invention comprises a conveying and cutting device, wherein the conveying and cutting device is arranged outside the wiring platform and is used for conveying and accurately cutting the semiconductor electrothermal film.
Further, the conveying and cutting device comprises a conveying shaft, a conveying supporting table, a cutting base, a fourth sliding rod, a distance sensor, a cutting platform, a third air inlet valve and a cutting knife.
Still further, the upper portion of conveying supporting bench is equipped with multiunit conveying axle, each the conveying axle is used for transmitting the semiconductor electric heat membrane, the upper portion of conveying axle is equipped with the fourth slide bar, fourth slide bar both ends are equipped with the cutting base, the upper portion of conveying axle is equipped with cutting platform, cutting platform's lower part is equipped with the cutting knife, the cutting knife is used for the fast cutting semiconductor electric heat membrane, cutting platform's upper portion is equipped with the third admission valve, the back and forth movement of cutting platform is controlled to third admission valve transmission compressed gas.
The beneficial effects obtained by the invention by adopting the structure are as follows:
(1) The copper junction block can be fixed at a designated position through the limiting action of the limiting plate on the junction platform, and then the copper junction block can be firmly fixed at the designated position of the semiconductor electrothermal film through the extrusion of the pressing block driven by the air cylinder;
(2) Through setting up the steam air blowing way on wiring platform upper portion, to the blowing of accomplishing the insulating tape, can soften the insulating tape that pastes on copper junction block surface, make the position insulating properties of junction better, solved the long-time wearing and tearing and lead to the problem that the insulating tape drops.
Drawings
Fig. 1 is a perspective view of a semiconductor electrothermal film wiring device according to an embodiment of the present invention;
FIG. 2 is a perspective view of a wiring platform according to an embodiment of the present invention;
FIG. 3 is a front view of a wiring platform according to an embodiment of the present invention;
FIG. 4 is a top view of a wiring platform according to an embodiment of the present invention;
FIG. 5 is a perspective view of a copper junction block according to an embodiment of the present invention;
Fig. 6 is a perspective view of an automatic attaching device according to an embodiment of the present invention;
fig. 7 is a front view of an automatic attaching device according to an embodiment of the present invention;
fig. 8 is a left side view of an automatic attaching device according to an embodiment of the present invention;
fig. 9 is a perspective view of an automatic attaching device according to an embodiment of the present invention;
fig. 10 is a front view of an automatic attaching device according to an embodiment of the present invention;
FIG. 11 is a left side view of an automatic attachment device according to an embodiment of the present invention;
fig. 12 is a perspective view of a conveying and cutting device according to an embodiment of the present invention;
FIG. 13 is a top view of a conveyor cutting device according to an embodiment of the present invention;
Fig. 14 is a cross-sectional view of a front view of a conveyor cutting device according to an embodiment of the present invention.
1. A wiring platform, 2, a pressing fastening device, 3, an automatic attaching device, 4, a conveying and cutting device;
11. the device comprises a storage plate, 12, a limiting plate, 13, a copper junction block, 131, a junction block shell, 132, a reinforcing hole, 133, a junction outer shaft, 14, a junction bracket, 15, a hydraulic rod, 16, a hydraulic device, 17, a first air inlet valve, 18, a first sliding platform, 19 and a first sliding rod;
21. The device comprises a second air inlet valve, 22, a reinforcing base, 23, an air cylinder, 24, a pull rod, 25, a pressing block, 26, a supporting frame, 27, a second sliding platform, 28, a second sliding rod, 29, a third sliding rod, 210, a hot air outlet channel, 211, a pressurizing and heating valve, 212, a first air conveying pipeline, 213, an air pump, 214, an air blowing valve, 215, an air blowing port, 216, a second air conveying pipeline, 217 and a regulating base block;
31. The device comprises an insulating adhesive tape, 32, a limiting shaft, 33, a sliding column, 34, a fixed support, 35, an upper clamping device, 36, an adjustable clamping block, 37, a controllable push block, 38, a cutting block, 39, a control base, 310, a lower clamping device, 311, a supporting table, 312, an upper moving plate, 313, a lower moving plate, 314, a push plate, 315 and a central control platform;
41. The device comprises a conveyor belt, 42, guard plates, 43, a conveyor shaft, 44, a conveyor support table, 45, a cutting base, 46, a fourth sliding rod, 47, a distance sensor, 48, a cutting platform, 49, a third air inlet valve, 410 and a cutting knife.
The accompanying drawings are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of embodiments of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, merely for convenience in describing the embodiments of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
When the conventional semiconductor electric heating film is used, wiring treatment is needed manually, copper junction blocks with characteristics, wires and interfaces of the semiconductor electric heating film are required to be kneaded together manually, and insulating tapes are required to be adhered to the junction after kneading is finished, so that leakage is prevented in the use process. Because the whole course manual treatment in the wiring process, the phenomenon of poor wiring at the wiring position can appear, and secondly, the problem that the adhesive tape falls off can also appear when the insulating adhesive tape 31 is pasted, and then the risk of electric shock can occur.
As shown in fig. 1, 2, 3, 4 and 5, an embodiment of the present invention provides a semiconductor electrothermal film wiring device, which comprises a wiring platform 1, wherein the wiring platform 1 comprises a storage plate 11, a limiting plate 12, a copper wiring block 13, a wiring bracket 14, a hydraulic rod 15 and a hydraulic device 16.
The wiring platform 1 further comprises a first air inlet valve 17, a first sliding platform 18 and a first sliding rod 19.
The copper terminal block 13 includes a terminal block housing 131, a reinforcement hole 132, and a terminal outer shaft 133.
In the embodiment of the invention, the upper part of the object placing plate 11 is provided with the limiting plate 12, the shape and the size of the limiting plate 12 are consistent with those of the copper wiring block 13, firstly, an operator places the copper wiring block 13 in the limiting plate 12, as shown in fig. 2, one side of the limiting plate 12 is provided with a notch for placing a wiring outer shaft 133 at one end of the copper wiring block 13, one side of the limiting plate 12 is provided with the wiring support 14, the surface of the wiring support 14 is provided with a wiring groove, firstly, the copper wiring block 13 is placed in the limiting plate 12, then, a wire to be connected is placed in the wiring groove on the surface of the wiring support 14, one end of the wire needs to be trimmed off an insulating cover, the internal wire is exposed, and one side of the exposed wire extends into the interior of the wiring outer shaft 133.
The copper junction block 13 is provided with a junction block housing 131, a reinforcing hole 132 and a junction outer shaft 133, the reinforcing hole 132 can press the junction block housing 131 to be firmer, and the conveying and cutting device 4 can convey the semiconductor electrothermal film to be connected to a specified position.
Firstly, an operator places the copper junction block 13 in the limiting plate 12, then stretches the treated electric wire into the junction outer shaft 133, then the conveying and cutting device 4 works to convey the semiconductor electric heating film to a specified position, the semiconductor electric heating film is just placed in the middle of the junction block housing 131, after the position is determined, the pressing and fastening device 2 drives the pressing block 25 to move downwards, the shape and the size of the inner grooves of the pressing block 25 and the limiting plate 12 are consistent, so the pressing block 25 can press the junction block housing 131, the junction block housing 131 is pressed into a kneading state from the opening state of fig. 5, the electric wire and the semiconductor electric heating film are firmly clamped in the copper junction block 13 through the pressing of the pressing block 25 due to the fact that the semiconductor electric heating film is inside the junction block housing 131 and the electric wire is inside the junction outer shaft 133, and finally, the electric conduction of the electric wire and the semiconductor electric heating film is completed due to the fact that the copper junction block 13 has conductivity.
The lower part of the limiting plate 12 is arranged on the object placing plate 11, the lower part of the object placing plate 11 is connected with the hydraulic rod 15, the lower part of the hydraulic rod 15 is connected with the hydraulic device 16, the hydraulic rod 15 can be moved up and down through the control of the hydraulic device 16, the limiting plate 12 on the upper part of the object placing plate 11 can be further moved up and down, the lower part of the hydraulic device 16 is arranged on the first sliding platform 18, the first air inlet valve 17 is arranged on the upper surface of the first sliding platform 18, the first sliding rod 19 penetrates through the inside of the first sliding platform 18, the first sliding platform 18 can move back and forth along the first sliding rod 19, the sliding distance of the first sliding platform 18 can be controlled by compressed air entering and exiting through the first air inlet valve 17, the position of the hydraulic device 16 can be further controlled, and finally, the wiring treatment of different semiconductor electric heating films can be met through program control.
Compared with manual work kneading copper junction block 13 with pliers, through pressing the accurate of briquetting 25, can make junction more firm, reduced the risk that the electric wire dropped, and wiring platform 1 also can change different positions according to the semiconductor electric heat membrane of different models, has promoted the efficiency of wiring.
As shown in fig. 1, 6, 7 and 8, an embodiment of the present invention provides a semiconductor electrothermal film wiring device, which includes a pressing and fastening device 2, wherein the pressing and fastening device 2 is disposed outside a wiring platform 1, and the pressing and fastening device 2 reinforces between an electrothermal film and a wire.
The pressing and fastening device 2 comprises a second air inlet valve 21, a reinforcing base 22, an air cylinder 23, a pull rod 24, a pressing block 25, a supporting frame 26, a second sliding platform 27, a second sliding rod 28, a third sliding rod 29, a hot air outlet channel 210, a pressurizing and heating valve 211, a first air conveying pipeline 212, an air pump 213, an air blowing valve 214, an air blowing port 215, a second air conveying pipeline 216 and a regulating and controlling base block 217.
In the embodiment of the invention, a second sliding rod 28 and a third sliding rod 29 are arranged in the middle of the supporting frame 26, the second sliding rod 28 passes through the second sliding platform 27, the third sliding rod 29 passes through the inside of the hot air outlet channel 210, so that the second sliding platform 27 and the hot air outlet channel 210 can respectively move back and forth along the second sliding rod 28 and the third sliding rod 29, an air cylinder 23 is arranged on one side of the second sliding platform 27, the air cylinder 23 can be driven to move when the second sliding platform 27 moves, a reinforcing base 22 and a second air inlet valve 21 are arranged on the upper part of the air cylinder 23, the reinforcing base 22 is used for reinforcing the air cylinder 23, the second air inlet valve 21 is used for transmitting air, the second air inlet valve 21 is externally connected with a compressed air tank, a pull rod 24 is arranged on the lower part of the air cylinder 23, a pressing block 25 is arranged on the other end of the pull rod 24, the pressing block 25 and a groove in the limiting plate 12 are consistent in shape and size, when the air cylinder 23 drives the pull rod 24 to move up and down, the pressing block 25 is driven by the air cylinder 23 to press a copper block 13 placed in the limiting plate 12, and the pressing block 25 can be pressed by the pressing block 25 through the second sliding platform 27 at different positions of the second sliding platform 28 according to different types of semi-conductors.
The upper portion of the hot gas outlet channel 210 is provided with a pressurizing and heating valve 211, the pressurizing and heating valve 211 pressurizes and heats the air entering the interior, one side of the pressurizing and heating valve 211 is provided with a first air conveying pipeline 212, the other side of the first air conveying pipeline 212 is connected with an air pump 213, one side of the hot gas outlet channel 210 is provided with an air blowing valve 214, the lower portion of the air blowing valve 214 is provided with an air blowing port 215, the air blowing valve 214 is connected with a second air conveying pipeline 216, the other side of the second air conveying pipeline 216 is connected with the air pump 213, the upper portion of the air pump 213 is provided with a regulating base block 217, the regulating base block 217 can regulate different air pressures so as to control the air flow rate of the air pump 213, the air flowing out from the air pump 213 can enter the pressurizing and heating valve 211 and the air conveying pipeline 216 respectively, the air entering the pressurizing and heating valve 211 can be pressurized and heated up and then enter the air outlet channel 210 to be blown out, and the air entering the air blowing valve 214 is finally blown out from the air blowing port 215.
The temperature of the gas blown out from the hot gas outlet channel 210 is higher, the gas blown out from the gas outlet 215 is normal temperature gas, so the gas blown out from the gas outlet 215 has a cooling effect, when the pressing block 25 presses the copper junction block 13, the electric wire and the semiconductor electric heating film, the hydraulic device 16 can drive the hydraulic rod 15 to move downwards, and then drive the limiting plate 12 to move downwards, the copper junction block 13 is mounted with the electric wire and the semiconductor electric heating film, then the automatic attaching device 3 attaches the insulating tape 31 to the junction, the junction where the insulating tape 31 is attached is heated by the hot gas blown out from the hot gas outlet channel 210, the insulating tape 31 attached to the junction is softened by the gas blown out from the hot gas outlet channel 210, and then the insulating tape 31 is attached to the junction more, and then the gas blown out from the gas outlet 215 cools the insulating tape 31, and the insulating tape 31 after cooling is attached to the junction tightly.
In the embodiment of the invention, as shown in fig. 1 and 6, the insulating tape 31 is softened by blowing out hot air from the hot air outlet channel 210 and cooled by the air blown out from the air blowing opening 215, so that the insulating tape 31 is attached to the position of the wiring, the problem that the insulating tape 31 is easy to fall off in the use process is solved, and the use safety of products is enhanced.
As shown in fig. 1, 9, 10 and 11, an embodiment of the present invention provides a semiconductor electrothermal film wiring device, which includes an automatic attaching device 3, wherein the automatic attaching device 3 is configured outside a wiring platform 1, and the automatic attaching device 3 is used for automatically attaching an insulating tape to a wiring position.
The automatic attaching device 3 includes an insulating tape 31, a limiting shaft 32, a sliding column 33, a fixed bracket 34, an upper clamping device 35, an adjustable clamping block 36, a lower clamping device 310, a controllable pushing block 37, a cutting block 38, a control base 39, a supporting table 311, an upper moving plate 312, a lower moving plate 313, a pushing plate 314 and a central control console 315.
In the embodiment of the invention, after the pressing block 25 presses the copper junction block 13, the pressing block 25 moves upwards at this moment, the hydraulic device 16 drives the limiting plate 12 to move downwards, then the automatic attaching device 3 works, the automatic attaching device 3 attaches the insulating tape at the junction line, the traditional attaching insulating tape 31 is manual attaching, namely, one section of the two sections of the insulating tape 31 is attached to the front surface and the other section of the insulating tape 31 is attached to the back surface, then the insulating tape 31 and the junction line are tightly attached in a manual pressing mode, and the position of the junction line is generally the outermost side part of the semiconductor electrothermal film.
One side of the limiting shaft 32 is provided with an insulating tape 31, the limiting shaft 32 can limit the movement of the insulating tape 31, one side of the limiting shaft 32 is provided with a fixed support 34, the lower part of the limiting shaft 32 is provided with an upper clamping device 35, the lower part of the upper clamping device 35 is provided with a lower clamping device 310, one ends of the upper clamping device 35 and the lower clamping device 310 are respectively provided with an adjustable clamping block 36, the adjustable clamping blocks 36 can control the clamping of the insulating tape 31, one side of the upper clamping device 35 is provided with a cutting block 38, the other side of the cutting block 38 is provided with a controllable push block 37, the controllable push block 37 can control the expansion and contraction of the cutting block 38, the side face of the cutting block 38 is provided with a blade, and when the controllable push block 37 pushes the cutting block 38 to move inwards, the blade arranged on the side face of the cutting block 38 can cut off the insulating tape 31.
The upper clamping device 35 is provided with an upper moving plate 312 and a lower moving plate 313 outside, one ends of the upper moving plate 312 and the lower moving plate 313 are respectively provided with a push plate 314, the side parts of the upper moving plate 312 and the lower moving plate 313 are provided with a central control console 315, the central control console 315 can control the whole process of attaching the insulating tape 31, the central control console 315 can control the upper moving plate 312 and the lower moving plate 313 to stretch, and when the upper moving plate 312 and the lower moving plate 313 stretch outside, the push plates 314 arranged at the front parts of the upper moving plate 312 and the lower moving plate 313 can push out the insulating tape 31.
When the wiring platform 1 finishes pressing the copper wiring block 13, the hydraulic device 16 drives the limiting plate 12 to move downwards, the pressing block 25 moves upwards, the wiring position is located between the upper clamping device 35 and the lower clamping device 310, then the controllable pushing block 37 controls the expansion and contraction of the cutting block 38 to cut off the insulating tape 31, then the upper moving plate 312 and the lower moving plate 313 drive the pushing plate 314 to move outwards, at this moment, the adjustable clamping block 36 releases the extrusion of the insulating tape 31, when the pushing plate 314 moves outwards, the cut insulating tape 31 can be just pushed away, because the wiring position is located in the middle of the cut insulating tape 31, one surface of the insulating tape 31 with glue faces the wiring completion position, when the pushing plate 314 pushes the cut insulating tape 31, the cut insulating tape 31 can be attached to the wiring position, then the control base 39 arranged at the lower part of the controllable pushing block 37 moves upwards, and one side of the control base 39 is fixedly connected with the lower clamping device 310, so the control base 39 can drive the lower clamping device 310 to move upwards, when the pushing plate 314 moves outwards, the cut insulating tape 31 is just pulled down, and when the cut insulating tape 31 is pulled down to the lower clamping device 35, the cut insulating tape 31 is attached to the position of the lower clamping device 35, and the insulating tape 31 is pulled downwards when the cut down device is pulled to the insulating device is attached to the insulating tape 31.
Compared with the original manual taping, the automatic taping device 3 can accurately and automatically finish the cutting and the attaching of the insulating tape 31 by the movement of the upper moving plate 312 and the lower moving plate 313 and the cutting of the cutting block 38, and is more accurate and efficient than the manual taping of the insulating tape 31.
As shown in fig. 1, 12 and 13, an embodiment of the present invention proposes a semiconductor electrothermal film wiring device, which includes a transfer cutting device 4, the transfer cutting device 4 is disposed outside a wiring platform 1, and the transfer cutting device 4 is used for transferring and precisely cutting a semiconductor electrothermal film.
The conveying and cutting device 4 includes a conveying belt 41, a guard plate 42, a conveying shaft 43, a conveying support table 44, a cutting base 45, a fourth slide bar 46, a distance sensor 47, a cutting platform 48, a third air intake valve 49, and a cutter 410.
In the embodiment of the invention, a guard plate 42 is arranged at the side of the conveyor belt 41, the guard plate 42 prevents the semiconductor electrothermal film from shifting in position when moving, a plurality of groups of conveyor shafts 43 are arranged at the upper part of the conveyor support table 44, a transmission device is arranged in the conveyor support table 44 and can drive the conveyor shafts 43 to rotate, and then the semiconductor electrothermal film placed at the upper part of the conveyor shafts 43 can be driven to move.
The upper part of the conveying shaft 43 is provided with a fourth sliding rod 46, two ends of the fourth sliding rod 46 are provided with cutting bases 45, the cutting bases 45 are used for fixing the fourth sliding rod 46, the fourth sliding rod 46 penetrates through the inside of the cutting platform 48, the cutting platform 48 can move back and forth along the fourth sliding rod 46, the upper part of the cutting platform 48 is provided with a third air inlet valve 49, the third air inlet valve 49 is connected with an air compressor, the third air inlet valve 49 is used for conveying compressed air, the cutting platform 48 can be driven to move back and forth on the fourth sliding rod 46, the lower part of the cutting platform 48 is provided with a cutting knife 410, as shown in fig. 14, the initial position of the cutting knife 410 is arranged on one side of the conveying shaft 43, the side face of the cutting knife 410 has a cutting effect, and as shown in fig. 14, the initial position of the cutting knife 410 is lower than the topmost face of the conveying shaft 43, namely, the initial position of the cutting knife 410 is lower than the position of a semiconductor electrothermal film placed above the conveying shaft 43, so that the cutting platform 48 can be driven to move back and forth when the cutting platform 48 moves, and forth, and the cutting of the semiconductor electrothermal film can be cut.
The upper part of the conveying supporting table 44 is provided with the distance sensor 47, the distance sensor 47 can accurately calculate the length of the semiconductor electrothermal film passing through the cutting platform 48, the lengths of the semiconductor electrothermal films are inconsistent according to the requirements of different products, and the problem of inaccurate manual measurement is solved through the measurement of the distance sensor 47 and the cutting of the cutting platform 48.
Firstly, the semiconductor electrothermal film is conveyed to the position of the cutting platform 48 by the conveying shaft 43, according to the requirements of different products, the distance sensor 47 can measure fixed parameters, then the semiconductor electrothermal film is cut into preset sizes by the cutting platform 48, then the cut semiconductor electrothermal film is conveyed to the conveying belt 41, at this time, an operator places the copper junction block 13 in the limiting plate 12, then places the processed electric wire in the junction outer shaft 133, then the conveying belt 41 stretches one end of the semiconductor electrothermal film into the junction block shell 131, then moves downwards according to the pressing block 25, the pressing block 25 can tightly knead the semiconductor electrothermal film, the copper junction block 13 and the electric wire together, then moves upwards according to the pressing block 25, the limiting plate 12 moves downwards, the junction is suspended at the position of the copper junction block 13 due to the certain elastic effect of the semiconductor electrothermal film, then the automatic attaching device 3 can accurately attach the insulating adhesive tape 31 to the junction position of the copper junction block 13, then the air outlet channel 210 moves to the junction block 31 to carry out heat treatment, so that the insulating adhesive tape 31 is better at the junction block 31, the air outlet of the valve 31 is better at the junction block position, the air outlet of the junction block 31 is better at the junction block 31 is cooled, and finally the air outlet of the insulating tape is cooled, the junction tape is cooled, and finally the air outlet of the insulating tape is cooled down, and finally the insulating tape is cooled, the junction tape is cooled, and finally, the junction tape is cooled, and the junction 31 is cooled.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made hereto without departing from the spirit and principles of the present invention.
The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the embodiment of the present invention.
Claims (7)
1. The utility model provides a semiconductor electrothermal film termination, includes wiring platform (1), its characterized in that: the wiring platform (1) comprises a storage plate (11), a limiting plate (12), a copper wiring block (13), a wiring bracket (14), a hydraulic rod (15) and a hydraulic device (16), wherein,
The copper junction block (13) comprises a junction block housing (131);
The upper portion of putting thing board (11) is equipped with limiting plate (12), the size of the inner groove of limiting plate (12) is unanimous with copper junction block (13) size, limiting plate (12) are used for placing copper junction block (13), copper junction block (13) are equipped with junction block shell (131), junction block shell (131) are used for placing the semiconductor electric heat membrane that needs the wiring, one side of limiting plate (12) is equipped with wiring support (14), the surface of wiring support (14) is equipped with wiring groove, the wiring groove is used for placing the electric wire that needs the butt joint, the lower part rigid coupling hydraulic stem (15) of putting thing board (11), the lower part of hydraulic stem (15) is equipped with hydraulic press (16);
The wire connection device comprises a pressing and fastening device (2), wherein the pressing and fastening device (2) is arranged outside the wire connection platform (1), and the pressing and fastening device (2) reinforces between an electrothermal film and a wire;
the pressing and fastening device (2) comprises an air cylinder (23), a pull rod (24), a pressing block (25), a second sliding platform (27) and a second sliding rod (28), wherein,
The side part of the air cylinder (23) is fixedly connected with a second sliding platform (27), a second sliding rod (28) penetrates through the second sliding platform (27), the second sliding platform (27) moves back and forth along the second sliding rod (28), a pull rod (24) is arranged at the lower part of the air cylinder (23), a pressing block (25) is fixedly connected at the lower part of the pull rod (24), the pressing block (25) is consistent with the copper wiring block (13) in shape and size, and the pressing block (25) is used for pressing the copper wiring block (13) and an electric wire;
The pressing and fastening device (2) further comprises a third sliding rod (29), a hot gas outlet channel (210), a pressurizing and heating valve (211), a first gas transmission pipeline (212), an air pump (213), a blowing valve (214), a blowing port (215) and a second gas transmission pipeline (216), wherein,
The upper portion of steam outlet channel (210) is equipped with pressurization intensification valve (211), pressurization intensification valve (211) are to getting into the gaseous pressurization intensification wherein, third slide bar (29) are passed from steam outlet channel (210) inside, steam outlet channel (210) are along third slide bar (29) round trip movement, one side rigid coupling air blowing valve (214) of steam outlet channel (210), the lower part of air blowing valve (214) is equipped with blow port (215), blow port (215) are used for cooling down processing to copper junction block (13) after heating, the lateral part of pressurization intensification valve (211) is equipped with first gas transmission pipeline (212), the opposite side of first gas transmission pipeline (212) meets with air pump (213), the lateral part of air blowing valve (214) is equipped with second gas transmission pipeline (216), the opposite side and the air pump (213) of second gas transmission pipeline (216) meet.
2. The semiconductor electrothermal film wiring device according to claim 1, wherein: the wiring platform (1) also comprises a first air inlet valve (17), a first sliding platform (18) and a first sliding rod (19), wherein,
The lower part of hydraulic press (16) is equipped with first slide platform (18), first slide platform (18) are used for placing hydraulic press (16), one side of first slide platform (18) is equipped with multiunit first admission valve (17), each first admission valve (17) are used for transmitting compressed air and then control the removal of first slide platform (18), the inside of first slide platform (18) is equipped with first slide bar (19), first slide platform (18) are along first slide bar (19) round trip movement.
3. The semiconductor electrothermal film wiring device according to claim 2, wherein: the automatic attaching device (3) is configured outside the wiring platform (1), and the automatic attaching device (3) is used for automatically attaching an insulating tape to a wiring position.
4. A semiconductor electrothermal film junction apparatus according to claim 3, wherein: the automatic attaching device (3) comprises an insulating adhesive tape (31), a limiting shaft (32), a sliding column (33), a fixed bracket (34), an upper clamping device (35), an adjustable clamping block (36) and a lower clamping device (310), wherein,
One side of spacing axle (32) is equipped with insulating tape (31), spacing axle (32) are used for restricting rocking of insulating tape (31), one side of spacing axle (32) is equipped with sliding column (33), one side rigid coupling fixed bolster (34) of spacing axle (32), the lower part of spacing axle (32) is equipped with and presss from both sides and get device (35), the lower part of last clamp and get device (35) is equipped with down and presss from both sides and get device (310), go up clamp and get device (35) and one side of lower clamp and get device (310) all are equipped with adjustable clamp and get piece (36).
5. The semiconductor electrothermal film wiring device according to claim 4, wherein: the automatic attaching device (3) also comprises a controllable pushing block (37), a cutting block (38), a control base (39), a supporting table (311), an upper moving plate (312), a lower moving plate (313) and a pushing plate (314), wherein,
The utility model discloses a copper tape cutting device, including lower clamp device (310) lateral part, control base platform (39) are equipped with down clamp device (310), slip post (33) are passed from control base platform (39) inside, control base platform (39) reciprocate from top to bottom along slip post (33), one side of going up clamp device (35) is equipped with cutting block (38), cutting block (38) are provided with the blade on the surface, cutting block (38) one side and controllable ejector pad (37) meet, controllable ejector pad (37) control cutting block (38) are made a round trip to stretch out and draw back, accomplish the cutting to insulating tape (31) through the blade that sets up on cutting block (38), the lower part of control base platform (39) is equipped with brace table (311), insulating tape (31) one side is equipped with movable plate (312) and movable plate (313) down, the one end of movable plate (312) and movable plate (313) all is equipped with push pedal (314) down, upper movable plate (312) and movable plate (313) are used for pasting insulating tape (31) to copper tape (13).
6. The semiconductor electrothermal film wiring device according to claim 5, wherein: the semiconductor electric heating film cutting device comprises a conveying cutting device (4), wherein the conveying cutting device (4) is arranged outside a wiring platform (1), and the conveying cutting device (4) is used for conveying and accurately cutting the semiconductor electric heating film.
7. The semiconductor electrothermal film wiring device according to claim 6, wherein: the conveying and cutting device (4) comprises a conveying shaft (43), a conveying supporting table (44), a cutting base (45), a fourth sliding rod (46), a distance sensor (47), a cutting platform (48), a third air inlet valve (49) and a cutting knife (410),
The upper portion of conveying supporting bench (44) is equipped with multiunit conveying axle (43), each conveying axle (43) are used for transmitting the semiconductor electric heat membrane, the upper portion of conveying axle (43) is equipped with fourth slide bar (46), fourth slide bar (46) both ends are equipped with cutting base (45), the upper portion of conveying axle (43) is equipped with cutting platform (48), the lower part of cutting platform (48) is equipped with cutting knife (410), cutting knife (410) are used for the fast-cutting semiconductor electric heat membrane, the upper portion of cutting platform (48) is equipped with third admission valve (49), the round trip movement of cutting platform (48) is controlled to third admission valve (49) transmission compressed gas.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410641773.1A CN118232131B (en) | 2024-05-23 | 2024-05-23 | Semiconductor electrothermal film wiring device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410641773.1A CN118232131B (en) | 2024-05-23 | 2024-05-23 | Semiconductor electrothermal film wiring device |
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| CN118232131B true CN118232131B (en) | 2024-09-17 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210016220U (en) * | 2019-08-01 | 2020-02-04 | 天津市江旭通信技术有限公司 | Wiring device for power distribution engineering |
| CN116130384A (en) * | 2022-12-16 | 2023-05-16 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN216055472U (en) * | 2021-07-28 | 2022-03-15 | 郑州市通达氧应用开发有限公司 | Control equipment for variable-frequency negative pressure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210016220U (en) * | 2019-08-01 | 2020-02-04 | 天津市江旭通信技术有限公司 | Wiring device for power distribution engineering |
| CN116130384A (en) * | 2022-12-16 | 2023-05-16 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
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