CN118219442A - Semiconductor processing cutting equipment - Google Patents

Abstract

The invention relates to the field of semiconductor processing equipment and discloses a cutting device for semiconductor processing; the wafer transverse cutting and longitudinal cutting step by step are realized by the aid of the rotating carrying disc and the self-rotating carrying table arranged on the carrying disc, and meanwhile, the reciprocating movement of the cutter splitting roller is matched, so that the moving track of the cutter is reduced, the cutting precision is ensured, the cutting efficiency is improved, the control difficulty is reduced, and the spray header is arranged to centrifugally flush the surface of the wafer and the inner side of the cutting slit in the cutting process and the wafer transferring process, so that waste liquid and chips are prevented from remaining on the surface of the wafer and the inner side of the cutting slit, the cleaning effect is improved, and the subsequent treatment is facilitated; through being equipped with hollow roller and setting up the orifice in blade both sides for deionized water is at the quick diffusion of blade surface, improves the effect of cooling and anti-dandruff.

Description

Semiconductor processing cutting equipment

Technical Field

The present invention relates to the field of semiconductor processing equipment, and more particularly to a cutting device for semiconductor processing.

Background technique

Wafer dicing is an indispensable process in chip manufacturing and belongs to the last process of wafer manufacturing. Wafer dicing is to divide the entire wafer of the chip into individual chips according to the size of the chip. The high-speed rotating diamond blade cuts the wafer into individual wafer particles to form independent single crystals, preparing for subsequent processes.

During the cutting process of traditional wafer cutting equipment, the tool and the wafer carrier need to perform complex matching movements to form a mesh-like cut. It is difficult to control the movement trajectory of the cutting blade. At the same time, the complex movement trajectory of the cutting blade makes it inconvenient to clean the debris generated by cutting.

The present application provides a cutting device for semiconductor processing, which performs step-by-step cutting and fully rinses and cleans the wafer at the same time.

Summary of the invention

1. Technical issues to be solved

In view of the problems existing in the prior art, the purpose of the present invention is to provide a cutting device for semiconductor processing, which can realize distributed cutting of wafers and at the same time fully centrifuge the debris on the wafer surface and in the cut during the cutting and transfer processes to ensure the cutting quality and cleaning effect.

To solve the above problems, the present invention adopts the following technical solutions.

A cutting device for semiconductor processing, comprising a base, a mounting cylinder fixedly connected to the base, a carrying plate rotatably connected to the upper end of the mounting cylinder, and a driving mechanism driving the carrying plate to rotate; a wafer stage for adsorbing and fixing a wafer is installed on the carrying plate; a cross-cutting mechanism is installed on the left side of the carrying plate, and a longitudinal cutting mechanism is installed on the front side of the carrying plate, and the cross-cutting mechanism and the longitudinal cutting mechanism have the same structure and are arranged in perpendicular directions;

The cross-cutting mechanism includes a mounting cover fixedly connected to the mounting cylinder and extending above the carrier plate, a slitting knife roller is installed in the mounting cover, the slitting knife roller is rotatably connected to a moving frame slidably connected to the mounting cover, and the moving frame is connected to a horizontal screw rod assembly that drives it to move horizontally along the setting direction of the mounting cover; one end of the slitting knife roller extends to the outside of the moving frame and is connected to a high-speed motor through a transmission gear set; a spray plate arranged opposite to the wafer carrier is installed on the upper part of the mounting cover, the spray plate is connected to an external liquid supply mechanism, and the external liquid supply mechanism injects deionized water into the spray plate;

The lower end of the wafer platform is fixedly connected to a rotating shaft that extends to the bottom of the carrying plate and is rotatably connected to it. The lower end of the rotating shaft is fixedly connected to a rolling gear, and the rolling gear is meshed with a fixed gear ring that is fixedly connected to the mounting cylinder. The upper part of the mounting cylinder is provided with an annular groove for carrying waste liquid, and the carrying plate is located on the outer side of the wafer platform and is provided with a mesh for waste liquid to flow down, and the mesh is arranged opposite to the annular groove.

As a further solution of the present invention, the slitting roller includes a roller shaft and blades equidistantly distributed on the roller shaft. The roller shaft is provided with spray holes facing the blades on both sides of the blades, and the outer end of the roller shaft is connected to an external liquid supply mechanism through a rotating joint.

As a further solution of the present invention: the carrier plate is provided with chip collecting grooves which are equidistantly distributed in a circumference, the bottom plate of the chip collecting groove is provided with evenly distributed liquid leakage holes, and the wafer support table is installed in the chip collecting groove.

As a further solution of the present invention: the mounting cover is a rectangular cover with an opening at the lower end, the mounting cover is sleeved above the chip collecting groove, and the lower end of the mounting cover abuts against the carrying plate and slides against the carrying plate.

As a further solution of the present invention: the annular groove is an annular groove with an opening at the upper end, the leakage holes are all arranged directly above the annular groove, and the annular groove is connected to a drainage pipe.

As a further solution of the present invention: the fixed gear ring is fixedly connected to the inner wall of the annular groove through a fixed rod.

As a further solution of the present invention: the driving mechanism includes a supporting shaft fixedly connected to the center position of the lower end of the carrier plate and extending into the mounting cylinder, and the supporting shaft is connected to the driving motor through a worm gear assembly.

As a further solution of the present invention: the movable frame is a door-shaped frame structure and its lower end extends into the installation cover, and rectangular through grooves for the movable frame to slide are opened on the outer walls on both sides of the installation cover.

As a further solution of the present invention: the horizontal screw rod assembly includes a slide slot frame, a screw rod installed in the slide slot frame and threadedly connected to the upper part of the movable frame, and a screw rod motor connected to the screw rod.

As a further solution of the present invention: two groups of spray holes are arranged on both sides of the blade and are equidistantly distributed in a circumference, and the spray holes on both sides of the blade are arranged to be inclined relative to each other.

Compared with the prior art, the advantages of the present invention are:

(1) The present invention realizes the step-by-step cross-cutting and longitudinal cutting of the wafer by providing a rotating carrier plate and a wafer stage installed on the carrier plate and rotating. At the same time, the reciprocating movement of the slitting knife roller is coordinated to reduce the movement trajectory of the knife, thereby ensuring the cutting accuracy and improving the cutting efficiency, reducing the control difficulty, and providing a spray head to centrifugally rinse the wafer surface and the inner side of the slit during the cutting process and the wafer transfer process, thereby avoiding waste liquid and debris from remaining on the wafer surface and the inner side of the slit, improving the cleaning effect, and facilitating subsequent processing.

(2) The present invention is provided with a carrier plate with a chip collecting groove, a mounting cylinder with an annular groove, and a wafer support table installed on the inner side thereof and connected to a rotating shaft, which cooperate with the mounting cover to centrally collect and discharge waste liquid and debris to avoid splashing of debris and waste liquid.

(3) The present invention is provided with a rolling gear fixed under the wafer stage and a fixed gear ring matched therewith, so as to ensure that the transverse cut is perpendicular to the blade after the wafer is transferred between the transverse cutting mechanism and the longitudinal cutting mechanism, thereby ensuring the formation of a mesh-like cut and realizing the slicing operation; at the same time, in cooperation with the spray head, the centrifugal force generated by the self-rotating wafer stage allows the waste liquid and debris to quickly separate from the wafer, thereby achieving a better cleaning effect.

(4) The present invention provides a hollow roller shaft and spray holes on both sides of the blade, so that deionized water can be quickly diffused on the surface of the blade, thereby improving the cooling and chip removal effects.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of a three-dimensional structure of the present invention from a left side perspective;

FIG2 is a schematic diagram of the three-dimensional structure of the present invention from the right side viewing angle;

FIG3 is a schematic diagram of a transverse cross-sectional structure of the present invention;

FIG4 is an enlarged schematic diagram of the structure at A in FIG3 ;

FIG5 is a schematic diagram of a longitudinal cross-sectional structure of the present invention;

FIG6 is a schematic diagram of the three-dimensional structure of the carrier plate in the present invention;

FIG7 is a schematic diagram of the assembly structure of the wafer carrier and the mounting cylinder in the present invention;

FIG8 is a schematic diagram of the three-dimensional structure of the cross-cutting mechanism of the present invention;

FIG9 is a schematic diagram of the assembly structure of the slitting knife roller in the present invention;

FIG10 is a schematic cross-sectional view of the slitting roller of the present invention;

FIG. 11 is an enlarged structural schematic diagram of point B in FIG. 10 of the present invention.

Explanation of the numbers in the figure: 1. Base; 2. Mounting cylinder; 201. Annular groove; 3. Carrying plate; 301. Chip collecting groove; 302. Leakage hole; 4. Wafer table; 5. Wafer; 6. Cross-cutting mechanism; 7. Longitudinal cutting mechanism; 8. Support shaft; 9. Worm gear assembly; 10. Driving motor; 11. Mounting cover; 12. Slitting roller; 1201. Roller shaft; 1202. Blade; 1203. Spray hole; 13. Moving frame; 14. Horizontal screw assembly; 15. Spray plate; 16. Rotating shaft; 17. Rolling gear; 18. Fixed gear ring; 19. Fixed rod; 20. High-speed motor.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "mounted/connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Please refer to FIGS. 1-9 . In one embodiment of the present invention, a semiconductor processing cutting device includes a base 1, a mounting cylinder 2 is fixedly connected to the base 1, a carrier plate 3 is rotatably connected to the upper end of the mounting cylinder 2, and the carrier plate 3 is connected to a driving mechanism for driving the rotation thereof; a wafer stage 4 for adsorbing and fixing a wafer 5 is installed on the carrier plate 3; a cross-cutting mechanism 6 is installed on the left side of the carrier plate 3, and a longitudinal cutting mechanism 7 is installed on the front side of the carrier plate 3, and the cross-cutting mechanism 6 and the longitudinal cutting mechanism 7 have the same structure and are arranged in perpendicular directions;

The cross-cutting mechanism 6 includes a mounting cover 11 fixedly connected to the mounting cylinder 2 and extending above the carrier plate 3, a slitting knife roller 12 is installed in the mounting cover 11, the slitting knife roller 12 is rotatably connected to a moving frame 13 slidably connected to the mounting cover 11, and the moving frame 13 is connected to a horizontal screw rod assembly 14 that drives it to move horizontally along the setting direction of the mounting cover 11; one end of the slitting knife roller 12 extends to the outside of the moving frame 13 and is connected to a high-speed motor 20 through a transmission gear set; a spray plate 15 arranged opposite to the wafer carrier 4 is installed on the upper part of the mounting cover 11, and the spray plate 15 is connected to an external liquid supply mechanism, and the external liquid supply mechanism injects deionized water into the spray plate 15;

The lower end of the wafer support platform 4 is fixedly connected to a rotating shaft 16 extending to the bottom of the supporting plate 3 and rotatably connected thereto, the lower end of the rotating shaft 16 is fixedly connected to a rolling gear 17, and the rolling gear 17 is meshed with a fixed gear ring 18 fixedly connected to the mounting cylinder 2; an annular groove 201 for carrying waste liquid is provided on the upper part of the mounting cylinder 2, and the supporting plate 3 is located on the outer side of the wafer support platform 4 and is provided with a mesh for waste liquid to flow downstream, and the mesh is arranged opposite to the annular groove 201.

Specifically, when the wafer 5 is cut, first, the wafer 5 after film bonding is placed on the wafer table 4 on the carrier plate 3 by an external robot arm, and the wafer table 4 adsorbs the wafer 5 after film bonding; the driving mechanism is started, and the driving mechanism drives the carrier plate 3 to rotate, and the carrier plate 3 rotates the wafer table 4 adsorbing the wafer 5 to the bottom of the cross-cutting mechanism 6, and the driving mechanism is closed;

Start the high-speed motor 20, the horizontal screw assembly 14 and the external liquid supply mechanism; the high-speed motor 20 drives the slitting roller 12 to rotate at a high speed through the transmission gear set, and at the same time, the horizontal screw assembly 14 drives the moving frame 13 and the slitting roller 12 thereon to move back and forth horizontally, and performs horizontal reciprocating cutting on the wafer 5, and forms equidistantly distributed slits on the wafer 5 through the slitting roller 12; while cutting, the external liquid supply mechanism injects deionized water into the spray plate 15, sprays and cools the cut slitting roller 12, and washes the debris accumulated on the wafer 5 after cutting, and then turns off the high-speed motor 20 and the horizontal screw assembly 14;

The driving mechanism is started, and the driving mechanism drives the carrier plate 3 to rotate ninety degrees, so that the wafer stage 4 drives the wafer 5 after cross-cutting to move to the bottom of the longitudinal cutting mechanism 7. During this transfer process, the rolling gear 17 rolls on the fixed gear ring 18, and the rolling gear 17 drives the wafer stage 4 to rotate in a circle through the rotating shaft 16. At the same time, the deionized water sprayed by the spray plate 15 continuously rinses the rotating wafer 5, and the waste liquid containing debris is separated from the surface and the cross-cut seam of the wafer 5 by the centrifugal force, so as to ensure that there is no debris on the surface and the cross-cut seam of the wafer 5 during longitudinal cutting, so as to ensure the cutting quality; in addition, during the transfer process, the rolling gear 17 drives the wafer stage 4 to rotate two hundred and seventy degrees, so that the cross-cut seam of the wafer 5 is parallel to the slitting roller 12 of the longitudinal cutting mechanism 7;

Similarly, the longitudinal cutting mechanism 7 is started to longitudinally cut the wafer 5 after the cross-cutting, and longitudinal slits are formed on the wafer 5 with equal distances. After the cutting is completed, the longitudinal cutting mechanism 7 is closed.

The driving mechanism is started again, so that the carrier plate 3 drives the wafer 5 after cutting to rotate 90 degrees and separate from the longitudinal cutting mechanism 7. During the separation process, a secondary centrifugal flushing is performed through the external liquid supply mechanism to ensure the cleanliness of the cut wafer; then the material is unloaded through the external robotic arm.

Traditional wafer cutting machines use the combined movement of a tool and a wafer stage to achieve wafer slicing. The movement trajectories of the tool and the wafer stage are complex and difficult to control. The technical solution provided in the present application achieves step-by-step transverse and longitudinal cutting through a rotating carrier plate 3, a self-rotating wafer stage 4, and a transverse cutting mechanism 6 and a longitudinal cutting mechanism 7 including a slitting knife roller. The slitting knife roller 12 only needs to move back and forth horizontally and vertically, and the movement trajectory is simple, while ensuring the cutting accuracy and stability. At the same time, the wafer 5 is centrifugally rinsed during the cutting process and in the interval between cutting to further ensure the cutting accuracy and the cleanliness of the wafer after cutting.

Please refer to FIG. 6 and FIG. 7 . In this embodiment, the carrier plate 3 is provided with chip collecting grooves 301 which are evenly spaced around the circumference. The bottom plate of the chip collecting groove 301 is provided with evenly distributed liquid leakage holes 302 . The wafer support table 4 is installed in the chip collecting groove 301 .

Specifically, it is convenient to collect the waste liquid generated after cutting.

Please refer to Figures 2, 3 and 8. In this embodiment, the mounting cover 11 is a rectangular cover with an open lower end. The mounting cover 11 is sleeved above the chip collecting groove 301. The lower end of the mounting cover 11 abuts against the carrier plate 3 and slides against the carrier plate 3.

Specifically, avoid splashing and overflowing of waste liquid.

Please refer to FIG. 5 and FIG. 7 . In the present embodiment, the annular groove 201 is an annular groove with an upper opening. The leakage holes 302 are all arranged right above the annular groove 201 . The annular groove 201 is connected to a drainage pipe.

Specifically, it is convenient to collect waste liquid and drain it centrally through the drainage pipe.

Please refer to FIG. 7 . In this embodiment, the fixed gear ring 18 is fixedly connected to the inner wall of the annular groove 201 via a fixing rod 19 .

Specifically, the rolling stability of the rolling gear 17 on the fixed gear ring 18 is ensured.

Please refer to FIG. 3 . In this embodiment, the driving mechanism includes a supporting shaft 8 fixedly connected to the center of the lower end of the carrier plate 3 and extending into the mounting tube 2 . The supporting shaft 8 is connected to a driving motor 10 via a worm gear assembly 9 .

Specifically, the driving motor 10 drives the support shaft 8 to rotate through the worm gear assembly 9, and the support shaft 8 drives the carrier plate 3 to rotate, thereby achieving stable transfer of the wafer stage 4 and the wafer 5 thereon.

Please refer to FIG. 8 and FIG. 9 . In this embodiment, the movable frame 13 is a door-shaped frame structure and its lower end extends into the mounting cover 11 . The outer walls on both sides of the mounting cover 11 are provided with rectangular through grooves for the movable frame 13 to slide.

Please refer to FIG. 3 and FIG. 5 . In this embodiment, the horizontal screw rod assembly 14 includes a slide slot frame, a screw rod installed in the slide slot frame and threadedly connected to the upper portion of the moving frame 13 , and a screw rod motor connected to the screw rod.

Specifically, the horizontal screw rod assembly 14 drives the moving frame 13 to move stably along the mounting cover 11 .

Please refer to Figures 1 and 9-11. In another embodiment of the present invention, the slitting roller 12 includes a roller shaft 1201 and blades 1202 equidistantly distributed on the roller shaft 1201. The roller shaft 1201 is located on both sides of the blades 1202 and has spray holes 1203 facing the blades 1202. The outer end of the roller shaft 1201 is connected to an external liquid supply mechanism through a rotating joint.

Specifically, when cutting, the external liquid supply mechanism injects deionized water into the wind cutting roller 12 and sprays it from the nozzle 1203, so that the roller shaft 1201 is cooled by the deionized water, and the deionized water is sprayed onto the rotating blade 1202, so that the deionized water is evenly diffused on the surface of the blade 1202 under the action of centrifugal force, thereby enhancing the heat dissipation of the blade 1202. At the same time, the cutting position where the blade 1202 contacts the wafer 5 always has sufficient deionized water, thereby improving the cooling and chip removal effects.

Please refer to FIG. 11 . In this embodiment, two groups of spray holes 1203 are arranged on both sides of the blade 1202 and are equidistantly distributed in a circumference. The spray holes 1203 on both sides of the blade 1202 are arranged to be inclined relative to each other.

Specifically, the diffusion effect of deionized water is improved.

The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims (9)

1. A cutting device for semiconductor processing, characterized in that it comprises a base (1), a mounting cylinder (2) is fixedly connected to the base (1), a carrying plate (3) is rotatably connected to the upper end of the mounting cylinder (2), and the carrying plate (3) is connected to a driving mechanism for driving the rotation thereof; a wafer support table (4) for adsorbing and fixing a wafer (5) is installed on the carrying plate (3); a cross-cutting mechanism (6) is installed on the left side of the carrying plate (3), and a longitudinal cutting mechanism (7) is installed on the front side of the carrying plate (3), and the cross-cutting mechanism (6) and the longitudinal cutting mechanism (7) have the same structure and are arranged in perpendicular directions. 2. A semiconductor processing cutting device according to claim 1, characterized in that the cross-cutting mechanism (6) comprises a mounting cover (11) fixedly connected to the mounting cylinder (2) and extending above the carrier plate (3), a slitting knife roller (12) is installed in the mounting cover (11), the slitting knife roller (12) is rotatably connected to a moving frame (13) slidably connected to the mounting cover (11), and the moving frame (13) is connected to a horizontal screw rod assembly (14) for driving it to move horizontally along the setting direction of the mounting cover (11); one end of the slitting knife roller (12) extends to the outside of the moving frame (13) and is connected to a high-speed motor (20) through a transmission gear set; a spray plate (15) arranged opposite to the wafer carrier (4) is installed on the upper part of the mounting cover (11), the spray plate (15) is connected to an external liquid supply mechanism, and the external liquid supply mechanism injects deionized water into the spray plate (15); The lower end of the wafer support platform (4) is fixedly connected to a rotating shaft (16) extending to the bottom of the carrier plate (3) and rotatably connected thereto; the lower end of the rotating shaft (16) is fixedly connected to a rolling gear (17); the rolling gear (17) is meshed with a fixed gear ring (18) fixedly connected to the mounting cylinder (2); an annular groove (201) for carrying waste liquid is provided on the upper part of the mounting cylinder (2); the carrier plate (3) is located outside the wafer support platform (4) and is provided with a mesh hole for waste liquid to flow down; the mesh hole and the annular groove (201) are arranged opposite to each other; the slitting knife roller (12) comprises A roller (1201) and blades (1202) equidistantly distributed on the roller (1201); the roller (1201) is provided with spray holes (1203) facing the blades (1202) on both sides of the blades (1202); the outer end of the roller (1201) is connected to an external liquid supply mechanism via a rotary joint; the carrier plate (3) is provided with chip collecting grooves (301) equidistantly distributed in a circumference; the bottom plate of the chip collecting groove (301) is provided with evenly distributed liquid leakage holes (302); and the wafer support table (4) is installed in the chip collecting groove (301). 3. A cutting device for semiconductor processing according to claim 2, characterized in that the mounting cover (11) is a rectangular cover with an opening at the lower end, the mounting cover (11) is sleeved above the chip collecting groove (301), and the lower end of the mounting cover (11) abuts against the carrying plate (3) and slides against the carrying plate (3). 4. A semiconductor processing cutting device according to claim 2, characterized in that the annular groove (201) is an annular groove with an upper opening, the leakage holes (302) are all arranged directly above the annular groove (201), and the annular groove (201) is connected to a drainage pipe. 5. A semiconductor processing cutting device according to claim 2, characterized in that the fixed gear ring (18) is fixedly connected to the inner wall of the annular groove (201) via a fixing rod (19). 6. A cutting device for semiconductor processing according to claim 2, characterized in that the driving mechanism comprises a support shaft (8) fixedly connected to the center position of the lower end of the carrier plate (3) and extending into the mounting cylinder (2), and the support shaft (8) is connected to a driving motor (10) through a worm gear assembly (9). 7. A semiconductor processing cutting device according to claim 2, characterized in that the movable frame (13) is a gate-shaped frame structure and its lower end extends into the mounting cover (11), and rectangular through grooves for the movable frame (13) to slide are provided on the outer walls on both sides of the mounting cover (11). 8. A semiconductor processing cutting device according to claim 7, characterized in that the horizontal screw assembly (14) includes a slide slot frame, a screw installed in the slide slot frame and threadedly connected to the upper part of the movable frame (13), and a screw motor connected to the screw. 9. A semiconductor processing cutting device according to claim 2, characterized in that two groups of spray holes (1203) are arranged on both sides of the blade (1202) and are equidistantly distributed in a circle, and the spray holes (1203) located on both sides of the blade (1202) are arranged to be relatively inclined.