CN118198233B - Display panel and display device - Google Patents
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- CN118198233B CN118198233B CN202410330021.3A CN202410330021A CN118198233B CN 118198233 B CN118198233 B CN 118198233B CN 202410330021 A CN202410330021 A CN 202410330021A CN 118198233 B CN118198233 B CN 118198233B
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- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000011159 matrix material Substances 0.000 claims description 54
- 238000005538 encapsulation Methods 0.000 claims description 21
- 239000003086 colorant Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 18
- 239000004831 Hot glue Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本发明提供一种显示面板及显示设备，显示面板包括基板、反光层、阵列分布的第一发光单元和阵列分布的第二发光单元，第一发光单元和第二发光单元设置于基板的同一侧且交替间隔分布，第一发光单元的第一出光方向和第二发光单元的第二出光方向相反；反光层设置于第一发光单元和第二发光单元之间。通过在第一发光单元和第二发光单元之间设置反光层，第一发光单元朝向第二发光单元的方向射出的散射光线会被反光层反射回去，第二发光单元朝向第一发光单元的方向射出的散射光线同样会被反光层反射回去，这样就能够避免第一发光单元和第二发光单元发射的光线的相互干扰，提升显示面板的显示效果。
The present invention provides a display panel and a display device, wherein the display panel comprises a substrate, a reflective layer, a first light emitting unit distributed in an array, and a second light emitting unit distributed in an array, wherein the first light emitting unit and the second light emitting unit are arranged on the same side of the substrate and are arranged alternately and spaced apart, and the first light emitting direction of the first light emitting unit and the second light emitting direction of the second light emitting unit are opposite; and the reflective layer is arranged between the first light emitting unit and the second light emitting unit. By arranging the reflective layer between the first light emitting unit and the second light emitting unit, the scattered light emitted by the first light emitting unit toward the direction of the second light emitting unit will be reflected back by the reflective layer, and the scattered light emitted by the second light emitting unit toward the direction of the first light emitting unit will also be reflected back by the reflective layer, thereby avoiding mutual interference between the light emitted by the first light emitting unit and the second light emitting unit, and improving the display effect of the display panel.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
With the rapid development of display technologies, more application modes such as transparent display and reflective display are expanded by display technologies such as liquid crystal display and light emitting diode display, wherein double-sided display is applied to many scenes as an application mode capable of effectively saving the space occupation rate of a display screen, and the rapid development of liquid crystal display accelerates the expansion of the application mode. However, the related art has a drawback that the display effect of the double-sided display panel is poor.
In view of the foregoing, there is a need for a new display panel and display device that solves or at least alleviates the above-mentioned technical drawbacks.
Disclosure of Invention
The invention mainly aims to provide a display panel and display equipment, and aims to solve the technical problem that a double-sided display panel in the prior art is poor in display effect.
In order to achieve the above object, according to an aspect of the present invention, there is provided a display panel including a substrate;
The first light-emitting units and the second light-emitting units are arranged on the same side of the substrate and are alternately distributed at intervals, and the first light-emitting direction of the first light-emitting units is opposite to the second light-emitting direction of the second light-emitting units;
the light reflecting layer is arranged between the first light emitting unit and the second light emitting unit.
In some embodiments, the width of the middle of the light reflecting layer is L2, the width of the top of the light reflecting layer is L1, the width of the bottom of the light reflecting layer is L3, then L2> L1 and L2> L3 are present, and the cross-sectional width of the light reflecting layer gradually decreases from the middle to the top and the bottom respectively.
In some embodiments, the substrate includes a driving circuit layer, and an insulating layer is disposed between the light reflecting layer and the driving circuit layer.
In some embodiments, the display panel further includes an encapsulation layer, a first groove is disposed on the encapsulation layer, a second groove is disposed on the driving circuit layer, the insulating layer is disposed in the second groove, a third groove is formed on the insulating layer, one end of the light reflecting layer is disposed in the first groove, and the other end of the light reflecting layer is disposed in the third groove.
In some embodiments, the display panel further includes a reflective layer, a concave groove is formed at a position of the encapsulation layer corresponding to the first light emitting unit, the reflective layer is disposed in the concave groove, and a length of the reflective layer is greater than or equal to a distance between two adjacent reflective layers.
In some embodiments, transparent conductive layers are further disposed on the encapsulation layer, and the conductive layers are alternately connected with the reflective layer, and the transparent conductive layers are electrically connected with the cathode of the first light emitting unit and the cathode of the second light emitting unit.
In some embodiments, the first light emitting unit includes a first light emitting chip, a second light emitting chip and a third light emitting chip that are sequentially arranged, the second light emitting unit includes a fourth light emitting chip, a fifth light emitting chip and a sixth light emitting chip that are sequentially arranged, the first light emitting chip is close to the sixth light emitting chip of an adjacent second light emitting unit, the third light emitting chip is close to the fourth light emitting chip of an adjacent second light emitting unit, the colors of the light rays emitted by the first light emitting chip and the sixth light emitting chip are the same, and the colors of the light rays emitted by the third light emitting chip and the fourth light emitting chip are the same.
In some embodiments, the display panel further includes a first black matrix layer and a second black matrix layer, the first black matrix layer is disposed on a first light emitting direction side of the first light emitting unit, and an orthographic projection of the first black matrix layer on the substrate covers an orthographic projection of the second light emitting unit on the substrate;
The second black matrix layer is arranged on the second light emitting direction side of the second light emitting unit, and orthographic projection of the second black matrix layer on the substrate covers orthographic projection of the first light emitting unit and the reflecting layer on the substrate.
According to another aspect of the present invention, there is also provided a method for manufacturing a display panel, including:
Providing a substrate;
A reflective layer is arranged on the substrate;
The light emitting device comprises a substrate, a first light emitting unit, a second light emitting unit, a reflecting layer and a light source, wherein the first light emitting unit and the second light emitting unit are distributed in an array mode on the same side of the substrate, the first light emitting direction of the first light emitting unit is opposite to the second light emitting direction of the second light emitting unit, and the reflecting layer is located between the first light emitting unit and the second light emitting unit.
In some embodiments, the step of providing a substrate comprises:
providing a bottom plate, and arranging a first black matrix layer on the bottom plate;
providing a driving circuit layer on the first black matrix layer to form the substrate, wherein the driving circuit layer is provided with a second groove;
the step of disposing a reflective layer on the substrate includes:
an insulating layer is arranged in the second groove of the driving circuit layer, a third groove is formed in the insulating layer, and the bottom of the reflecting layer is arranged in the third groove;
After the step of arranging the first light emitting units and the second light emitting units which are distributed in an array on the same side of the substrate, the method further comprises the steps of:
And mounting a packaging layer, wherein a first groove and a reflecting layer are arranged on the packaging layer, the top of the reflecting layer is mounted in the first groove, and the reflecting layer is arranged corresponding to the first light-emitting unit.
In the scheme, the display panel comprises a substrate, a reflective layer, first light-emitting units distributed in an array and second light-emitting units distributed in an array, wherein the first light-emitting units and the second light-emitting units are arranged on the same side of the substrate and are alternately distributed at intervals, the first light-emitting direction of the first light-emitting units is opposite to the second light-emitting direction of the second light-emitting units, and the reflective layer is arranged between the first light-emitting units and the second light-emitting units. The first light-emitting unit and the second light-emitting unit are arranged on the same side of the substrate, so that occupation of space can be reduced, and light and thin display panels can be realized. Meanwhile, the first light emitting direction of the first light emitting unit is opposite to the second light emitting direction of the second light emitting unit, so that double-sided display of the display panel can be realized. In the scheme of the invention, the reflective layer is arranged between the first light-emitting unit and the second light-emitting unit, which is equivalent to setting a barrier between the first light-emitting unit and the second light-emitting unit, the scattered light emitted by the first light-emitting unit towards the second light-emitting unit can be reflected back by the reflective layer, and the scattered light emitted by the second light-emitting unit towards the first light-emitting unit can be reflected back by the reflective layer, so that the mutual interference of the light emitted by the first light-emitting unit and the second light-emitting unit can be avoided, and the display effect of the display panel is improved. In addition, the light reflection layer can reflect the scattered light of the first light-emitting unit and the scattered light of the second light-emitting unit, so that the utilization rate of light energy can be improved, and the display effect is further improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings may be obtained from the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a display panel according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a reflective layer of a display panel according to an embodiment of the invention;
FIG. 3 is a schematic view of a reflective layer of a display panel according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram of a display panel according to another embodiment of the invention;
FIG. 5 is a schematic diagram showing the arrangement of the first light emitting unit and the second light emitting unit in FIG. 4 according to the present invention;
FIG. 6 is a schematic structural diagram of a display panel according to another embodiment of the invention;
FIG. 7 is a schematic view of a display panel with a first groove and a third groove according to another embodiment of the present invention;
FIG. 8 is a schematic diagram of a display panel with a reflective layer according to another embodiment of the present invention;
FIG. 9 is a schematic view showing a structure of a display panel provided with a reflective layer and a transparent conductive layer according to another embodiment of the present invention;
FIG. 10 is a schematic view illustrating a portion of a manufacturing method of a display panel according to a first embodiment of the invention;
FIG. 11 is a schematic view illustrating a portion of a manufacturing method of a display panel according to a first embodiment of the invention;
FIG. 12 is a schematic view of a display panel according to another embodiment of the invention;
FIG. 13 is a flowchart illustrating a method for fabricating a display panel according to a first embodiment of the present invention;
FIG. 14 is a flowchart illustrating a method for fabricating a display panel according to a second embodiment of the present invention;
Reference numerals illustrate:
10. The LED comprises a bottom plate, 20, a first light emitting unit, 21, a first light emitting chip, 22, a second light emitting chip, 23, a third light emitting chip, 30, a second light emitting unit, 31, a fourth light emitting chip, 32, a fifth light emitting chip, 33, a sixth light emitting chip, 40, a light reflecting layer, 41, a middle part, 42, a top part, 43, a bottom part, 50, a driving circuit layer, 60, a first black matrix layer, 70, a second black matrix layer, 80, a packaging layer, 90, an insulating layer, 100, a reflecting layer, 110 and a transparent conducting layer.
1. Black matrix material, 2, metal material, 3, hot melt adhesive, 4, groove, 5, reflecting material.
The achievement of the object, functional features and advantages of the present invention will be further described with reference to the drawings in connection with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
It should be noted that all directional indications (such as upper and lower..once.. Times.) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a certain specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.
Moreover, the technical solutions of the embodiments of the present invention may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the embodiments, and when the technical solutions are contradictory or cannot be implemented, it should be considered that the combination of the technical solutions does not exist, and is not within the scope of protection claimed by the present invention.
In the related art, a display panel of a double-sided display includes a first light emitting unit and a second light emitting unit, wherein the first light emitting unit and the second light emitting unit may include LED lamps. In order to meet the increasing demand of users for ultra-thin display panels, there is a technical solution in the related art that the first light emitting unit and the second light emitting unit are disposed on the same side of the substrate. The applicant found that this solution, although further reducing the thickness of the display panel, has poor display effects. The applicant has found through careful study that, since the first light emitting unit and the second light emitting unit are generally composed of a plurality of light emitting chips, the light emitted from two light emitting chips adjacent to the first light emitting unit and the second light emitting unit interfere with each other, which is a main cause of poor display.
To this end, the present application provides a display panel and a display device.
Referring to fig. 1, according to an aspect of the present invention, the present invention provides a display panel including a substrate, a reflective layer 40, first light emitting units 20 distributed in an array and second light emitting units 30 distributed in an array, the first light emitting units 20 and the second light emitting units 30 being disposed at the same side of the substrate and alternately spaced apart from each other, a first light emitting direction of the first light emitting units 20 and a second light emitting direction of the second light emitting units 30 being opposite, and the reflective layer 40 being disposed between the first light emitting units 20 and the second light emitting units 30.
The first light emitting direction is shown as Z1 in fig. 1, and the second light emitting direction is shown as Z2 in fig. 1. The first light emitting unit 20 and the second light emitting unit 30 are disposed on the same side of the substrate, which can reduce space occupation and facilitate light and thin display panels. Meanwhile, the first light emitting direction of the first light emitting unit 20 is opposite to the second light emitting direction of the second light emitting unit 30, so that double-sided display of the display panel can be realized. In the above embodiment of the present invention, by providing the reflective layer 40 between the first light emitting unit 20 and the second light emitting unit 30, which is equivalent to setting up a barrier between the first light emitting unit 20 and the second light emitting unit 30, the scattered light emitted from the first light emitting unit 20 toward the second light emitting unit 30 is reflected back by the reflective layer 40, and the scattered light emitted from the second light emitting unit 30 toward the first light emitting unit 20 is also reflected back by the reflective layer 40, so that mutual interference of the light emitted from the adjacent first light emitting unit 20 and second light emitting unit 30 can be avoided, and the display effect of the display panel can be improved. In addition, the reflective layer 40 can reflect the scattered light of the first light emitting unit 20 and the second light emitting unit 30, so that the utilization rate of light energy can be improved, and the display effect can be further improved.
Referring to fig. 2 and 3, in some embodiments, the width of the middle 41 of the reflective layer 40 is L2, the width of the top 42 of the reflective layer 40 is L1, the width of the bottom 43 of the reflective layer 40 is L3, then L2> L1, and L2> L3. The cross section here refers to a cross section perpendicular to the first light-exiting direction or the second light-exiting direction, and because the first light-exiting direction and the second light-exiting direction are opposite, the cross section is perpendicular to both the first light-exiting direction and the second light-exiting direction. The width L2 of the middle part of the reflective layer 40 is at least greater than the width L1 of the top part 42 and the width L3 of the bottom part 43, and the distance H1 from the top part 42 at the widest part of the middle part is equal to the distance H2 from the bottom part 43, L1 and L3 are at least 1um, and L2 is at least 1um greater than L1 and L3. The width of the middle 41 is set larger, the widths of the top 42 and the bottom 43 are designed smaller, or the cross-sectional area of the middle 41 is larger, and the cross-sectional areas of the two ends are designed smaller, so as to form an inclined plane, which is beneficial for reflecting the light emitted from the first light emitting unit 20 back after being reflected by the reflecting layer 40. For example, referring to fig. 3, light a emitted from the upper side edge of the first light emitting unit 20 is reflected to the light outlet or the light emitting chip itself by the reflective layer, and light B emitted from the lower side edge of the first light emitting unit 20 is reflected to the first black matrix layer 60 or the light emitting chip itself by the reflective layer. Similarly, the light ray C emitted from the upper side edge of the second light emitting unit 30 is reflected to the second black matrix layer 70 or the light emitting chip itself by the reflective layer, and the light ray D emitted from the lower side edge of the second light emitting unit 30 is reflected to the light outlet or the light emitting chip itself by the reflective layer. The light outlet has a spacing layer of the first black matrix layer 60 or the second black matrix layer 70. Therefore, the effect of preventing adjacent light interference can be effectively achieved, the utilization rate of light energy can be further improved, and the display effect is enhanced.
Referring to fig. 2 and 3, in some embodiments, the retroreflective layer 40 has a cross-sectional width that tapers from the middle 41 to the top 42 and bottom 43, respectively. Thus, the middle 41 of the retroreflective layer 40 is inclined from the top 42 and the middle 41 of the retroreflective layer 40 to the bottom 43 as seen in cross section.
In some embodiments, the retroreflective layer 40 includes one or more of copper, aluminum, silver. The reflective layer 40 may be made of a material with good light reflection performance. Of course, in order to avoid interference caused by light passing through the reflective layer 40, the reflective layer 40 may be made of metal. The reflective layer 40 may be made of copper, aluminum, or silver, or a mixture of two or three of copper, aluminum, and silver.
Referring to fig. 6, in some embodiments, the substrate includes a base plate 10, a first black matrix layer 60 disposed on the base plate 10, and a driving circuit layer 50 disposed on the first black matrix layer 60, with an insulating layer 90 disposed between the reflective layer 40 and the driving circuit layer 50. The driving circuit layer 50 is disposed between the first light emitting unit 20 and the substrate, and/or the driving circuit layer 50 is disposed between the second light emitting unit 30 and the substrate. The driving circuit layer 50 includes a plurality of pixel driving circuits distributed in an array, and any one of the pixel driving circuits drives at least one of the first light emitting units 20 to emit light or at least one of the second light emitting units 30 to emit light. The driving circuit layer 50 includes a plurality of thin film transistors electrically connected to each other. The thickness of the insulating layer 90 is generally 1um to 2um, so as to prevent the conduction between the reflective layer 40 and the driving circuit layer 50 from affecting signal transmission.
Referring to fig. 7, in some embodiments, the display panel further includes an encapsulation layer 80, a first groove is disposed on the encapsulation layer 80, a second groove is disposed on the driving circuit layer 50, an insulating layer 90 is disposed in the second groove, a third groove is formed on the insulating layer 90, a top 42 of the reflective layer 40 is disposed in the first groove, and a bottom 43 of the reflective layer 40 is disposed in the third groove. The first groove means that the encapsulation layer 80 is formed by recessing inwards, the driving circuit layer 50 is provided with the second groove for accommodating the insulating layer 90, the insulating layer 90 is formed by recessing inwards to form the third groove, and here, the height of the reflective layer 40 is set to be higher, so that the top 42 of the reflective layer 40 is inserted into the first groove, and meanwhile, the bottom 43 is inserted into the third groove, so that poor display caused by light leakage at the top 42 or the bottom 43 of the reflective layer 40 can be further avoided.
Referring to fig. 8, in some embodiments, the display panel further includes a reflective layer 100, a concave groove is formed at a position of the encapsulation layer 80 corresponding to the first light emitting unit 20, the reflective layer 100 is disposed in the concave groove, and a length of the reflective layer 100 is greater than or equal to a distance between two adjacent reflective layers 40. Here, the first light emitting unit 20 is set to emit light upwards, and this embodiment prevents light generated by the first light emitting unit 20 from propagating from the encapsulation layer 80 by providing a reflective layer 100 between the first display surface and the first light emitting unit 20, so that the display effect of the first display surface is poor. Specifically, the height of the reflective layer 100 is at least 1um, and the length is not less than the distance between two adjacent reflective layers 40. The material of the reflective layer 100 may be one or more of copper, silver, aluminum, or other low-transmittance alloys. Namely, the application is a display panel with double-sided display, comprising a top emission structure and a bottom emission structure. Specifically, bottom emission means that light can be emitted onto the reflective layer 100 at the top and then emitted downwards, and the reflective layer 100 is an opaque layer with strong reflective capability. Top emission means that light can be directed upward through the encapsulation layer 80. The reflective layer 100 may be manufactured together with the portion of the reflective layer 40 embedded in the encapsulation layer 80 in a process, which may simplify the process. Compared with the two parts which are arranged at intervals, the two parts are connected into an integral structure, so that the light reflecting effect can be improved.
Referring to fig. 9, in some embodiments, transparent conductive layers 110 or semitransparent conductive layers are further disposed on the encapsulation layer 80, the conductive layers being alternately connected with the reflective layer 100, the transparent conductive layers 110 being electrically connected with the cathodes of the first light emitting units 20 and the cathodes of the second light emitting units 30. This embodiment adds a transparent conductive layer 110 or a semitransparent conductive layer between adjacent reflective layers 100, the transparent conductive layer 110 semitransparent conductive layer being integrally connected with the reflective layers 100 and electrically connected with the cathodes of the first light emitting units 20 and/or the second light emitting units 30. Therefore, the cathodes of all the light reflecting units can be electrically connected into an integral cathode network, the power supply is realized together, and the connection process of the cathodes and peripheral power supply signals is simplified. It should be noted that, although all cathodes are of the same electrical signal, the anodes of each light emitting unit are spaced apart, and each light emitting unit can still be controlled individually. The transparent conductive layer 110 is provided so as not to affect the light extraction rate of the top emission unit. The material of the transparent conductive layer 110 or the semitransparent conductive layer may be Ag/Mg alloy, or ultrathin Ag/mg+izo. The reflective layer 40 is shaped like a double trapezoid reflective column and is electrically connected to the reflective layer 100 and the transparent (or semitransparent) conductive layer, which is equivalent to increasing the thickness of the cathode network at a local position, thereby being beneficial to reducing the resistance of the whole cathode network and improving the stability of the cathode signal.
Referring to fig. 1 and 4, in some embodiments, the display panel further includes a first black matrix layer 60 and a second black matrix layer 70, where the first black matrix layer 60 refers to the first black matrix layer 60 in the substrate, the first black matrix layer 60 is disposed on the first light emitting direction side of the first light emitting unit 20, and the front projection of the first black matrix layer 60 on the substrate covers the front projection of the second light emitting unit 30 on the substrate, and the first black matrix layer 60 is used to shield the second light emitting unit 30 to avoid the light leakage of the second light emitting unit 30 from affecting the first light emitting unit 20.
The second black matrix layer 70 is disposed on the second light emitting direction side of the second light emitting unit 30, and the orthographic projection of the second black matrix layer 70 on the substrate covers the orthographic projection of the first light emitting unit 20 and the reflective layer 40 on the substrate. Similarly, the second black matrix layer 70 is used for shielding the first light emitting unit 20, so as to avoid the light leakage of the first light emitting unit 20 from affecting the second light emitting unit 30.
Referring to fig. 4 and 5, in some embodiments, the first light emitting unit 20 includes a first light emitting chip 21, a second light emitting chip 22, and a third light emitting chip 23 sequentially arranged, the second light emitting unit 30 includes a fourth light emitting chip 31, a fifth light emitting chip 32, and a sixth light emitting chip 33 sequentially arranged, the first light emitting chip 21 is disposed close to the sixth light emitting chip 33 of an adjacent second light emitting unit 30, the third light emitting chip 23 is disposed close to the fourth light emitting chip 31 of an adjacent other second light emitting unit 30, the colors of light emitted from the first light emitting chip 21 and the sixth light emitting chip 33 are the same, and the colors of light emitted from the third light emitting chip 23 and the fourth light emitting chip 31 are the same. Specifically, referring to fig. 5, fig. 5 is a schematic diagram showing the arrangement of two second light emitting units 30 and one first light emitting unit 20, wherein the third light emitting chip 23 of the first light emitting unit 20 is disposed adjacent to the fourth light emitting chip 31 of the second light emitting unit 30 on the right, at this time, the first light emitting chip 21 of the first light emitting unit 20 is disposed adjacent to the sixth light emitting chip 33 on the left, at this time, the colors of the light rays emitted by the first light emitting chip 21 and the sixth light emitting chip 33 may be the same, and the colors of the light rays emitted by the third light emitting chip 23 and the fourth light emitting chip 31 are the same. Specifically, for the three primary colors of red, green and blue, the first light emitting chip 21 and the sixth light emitting chip 33 may be configured to be red light (or red pixel), the third light emitting chip 23 and the fourth light emitting chip 31 may be configured to be blue light (or blue pixel), and the second light emitting chip 22 and the fifth light emitting chip 32 may be configured to be green light (or green pixel), so that the colors of the light emitted from the adjacent light emitting chips are the same, and the interference between the light emitting chips of the first light emitting unit 20 and the second light emitting unit 30 may be reduced or eliminated.
Referring to fig. 6, in particular, the display panel includes, from bottom to top, a substrate, a first black matrix layer 60, a driving circuit layer 50, first light emitting units 20, second light emitting units 30, and a light reflecting layer 40 respectively disposed on the driving circuit layer 50, the bottom of the light reflecting layer 40 is connected with the driving circuit layer 50 through an insulating layer 90, the top of the light reflecting layer 40 is provided with an encapsulation layer 80, and the upper side of the encapsulation layer 80 is provided with a second black matrix layer 70. Of course, the driving circuit layer 50 may be disposed on top of the light reflecting layer 40 in addition to the bottom of the light reflecting layer 40, and in this case, the insulating layer 90 is also disposed between the top of the light reflecting layer 40 and the driving circuit layer 50 to prevent conduction.
Referring to fig. 13, fig. 13 is a flowchart illustrating a method for manufacturing a display panel according to a first embodiment of the invention. The manufacturing method of the display panel comprises the following steps:
S100, providing a substrate;
the substrate herein may include a base plate 10, a first black matrix layer disposed on the base plate 10, and a driving circuit layer disposed on the first black matrix layer.
S200, arranging a reflecting layer 40 on the substrate;
the reflective layer is disposed on the driving circuit layer 50, where the number of reflective layers 40 is generally plural, and the plural reflective layers are disposed at intervals.
S300, arranging first light-emitting units and second light-emitting units which are distributed in an array mode on the same side of the substrate, wherein the first light-emitting direction of the first light-emitting units is opposite to the second light-emitting direction of the second light-emitting units, and the light reflecting layer is located between the first light-emitting units and the second light-emitting units.
The first light emitting direction is shown as Z1 in fig. 1, and the second light emitting direction is shown as Z2 in fig. 1. The first light emitting unit 20 and the second light emitting unit 30 are disposed on the same side of the substrate, which can reduce space occupation and facilitate light and thin display panels. Meanwhile, the first light emitting direction of the first light emitting unit 20 is opposite to the second light emitting direction of the second light emitting unit 30, so that double-sided display of the display panel can be realized. Referring to fig. 11 (11 a) of fig. 11, the first light emitting unit 20 may be a first Micro LED light emitting unit, and the second light emitting unit 30 may be a second Micro LED light emitting unit, and the first light emitting unit 20 and the second light emitting unit 30 are electrically connected to the driving circuit layer 50, respectively.
In the above embodiment of the present invention, by providing the reflective layer 40 between the first light emitting unit 20 and the second light emitting unit 30, which is equivalent to setting up a barrier between the first light emitting unit 20 and the second light emitting unit 30, the scattered light emitted from the first light emitting unit 20 toward the second light emitting unit 30 is reflected back by the reflective layer 40, and the scattered light emitted from the second light emitting unit 30 toward the first light emitting unit 20 is also reflected back by the reflective layer 40, so that mutual interference of the light emitted from the adjacent first light emitting unit 20 and second light emitting unit 30 can be avoided, and the display effect of the display panel can be improved. In addition, the reflective layer 40 can reflect the scattered light of the first light emitting unit 20 and the second light emitting unit 30, so that the utilization rate of light energy can be improved, and the display effect can be further improved.
Referring to fig. 14, fig. 14 is a flowchart illustrating a manufacturing method of a display panel according to a second embodiment of the invention. The step of S100 includes:
S110, providing a bottom plate 10, and arranging a first black matrix layer 60 on the bottom plate 10;
The first black matrix layer 60 may be formed by coating the black matrix material 1 on the base plate 10, exposing and developing, referring to fig. 9a and 9b, the base plate 10 may be a glass substrate, or a transparent substrate, firstly, uniformly coating a layer of the black matrix material 1 on the base plate 10 by coating or coating, exposing and developing with ultraviolet rays under a photomask to form the first black matrix layer 60, the first black matrix layer 60 includes a plurality of black blocks arranged in an array, and the first black matrix layer 60 mainly plays a role of shading. The black blocks arranged in an array are distributed at intervals, and light outlets are formed at intervals for light passing through the first light-emitting units 20.
S120, arranging a driving circuit layer 50 on the first black matrix layer 60 to form a substrate, wherein the driving circuit layer 50 is provided with a second groove;
the metal material 2 is coated on the base plate 10 and the first black matrix layer 60, and the driving circuit layer 50 is formed after exposure and development, and referring to fig. 9 (9 c), it should be noted that the number of exposure and development may be plural, or the driving circuit layer 50 may be formed by a thin film deposition method according to actual needs.
The step of S200 includes:
S210, arranging an insulating layer 90 in the second groove of the driving circuit layer 50, forming a third groove in the insulating layer 90, and arranging the bottom 43 of the light reflecting layer 40 in the third groove;
Specifically, the hot melt adhesive 3 may be coated on the driving circuit layer 50, and grooves 4 are formed on the hot melt adhesive 3, and referring to fig. 10 (10 a) and fig. 10 b), the main components of the hot melt adhesive 3 include a base resin, a tackifier, a viscosity modifier, an antioxidant, and the like, wherein the base resin is composed of ethylene and vinyl acetate, the tackifier is petroleum resin or terpene resin, the purpose of the tackifier is to improve the fluidity of the colloid of the hot melt adhesive 3, improve the adhesive property, and achieve the required adhesive strength, and the viscosity modifier is one of paraffin wax, microcrystalline wax, synthetic wax, and phorotor wax, and is used for increasing the fluidity of the colloid of the hot melt adhesive 3, adjusting the solidification speed, and the melting point of the hot melt adhesive 3 is about 135 ℃. Grooves 4 may be formed on the hot melt adhesive 3 by a laser irradiation method, the number of the grooves 4 being plural, being set corresponding to the positions of the reflective layers 40 of the display panel, the positions of the grooves 4 being used for setting the reflective layers 40. Then coating the reflective material 5 in the groove 4 and on the upper surface of the driving circuit layer 50, and forming the reflective layer 40 after exposure and development, referring to fig. 10 (10 c) and fig. 10 d), coating the reflective material 5 in the groove 4 and on the upper surface of the driving circuit layer 50, selecting a proper photomask according to the requirement, and removing the redundant part by using a developing solution after ultraviolet exposure to form the reflective layer 40 with the required shape. The cross-sectional width of retroreflective layer 40 tapers from middle 41 to top 42 and bottom 43, respectively. The width of the middle 41 of the reflective layer 40 is L2, the width of the top 42 of the reflective layer 40 is L1, and the width of the bottom 43 of the reflective layer 40 is L3, then L2> L1, and L2> L3. Therefore, the effect of preventing adjacent light interference can be effectively achieved, the utilization rate of light energy can be further improved, and the display effect is enhanced. The reflective layer 40 may be made of a material with good light reflection performance. Of course, in order to avoid interference caused by light passing through the reflective layer 40, the reflective layer 40 may be made of metal. The reflective layer 40 may be made of copper, aluminum, or silver, or a mixture of two or three of copper, aluminum, and silver. Finally, the residual hot melt adhesive 3 is removed, the hot melt adhesive 3 mainly plays a role in protection, and after the reflective layer 40 is manufactured, referring to the graph (10 e) in fig. 10, the residual hot melt adhesive 3 can be removed by ultraviolet curing or heat curing. Here, the height of the light reflecting layer 40 is set to be higher, so that one end and the other end of the light reflecting layer 40 refer to the top 42 and the bottom 43, respectively, the top 42 is inserted into the first groove, and the bottom 43 is inserted into the third groove, thereby further avoiding poor display caused by light leakage at the top or the bottom of the light reflecting layer 40.
After the step of S300, the method further includes the steps of:
And S400, mounting a packaging layer, wherein a first groove and a reflecting layer 100 are arranged on the packaging layer 80, the top 42 of the reflecting layer 40 is mounted on the first groove, and the reflecting layer 100 is arranged corresponding to the first light-emitting unit 20.
Referring to fig. 11 (11 a) of fig. 11, the first light emitting unit 20 may be a first Micro LED light emitting unit, and the second light emitting unit 30 may be a second Micro LED light emitting unit, and the first light emitting unit 20 and the second light emitting unit 30 are electrically connected to the driving circuit layer 50, respectively. Referring to fig. 11 (11 b) and fig. 4, the encapsulation layer 80 is disposed on the top 42 of the reflective layer 40, the second black matrix layer 70 is fabricated in the same manner as the first black matrix layer 60, a layer of black matrix material 1 is uniformly coated on the encapsulation layer 80 by coating or coating, the second black matrix layer 70 is formed after uv exposure and development under a photomask, the second black matrix layer 70 includes a plurality of black blocks disposed in an array, and the second black matrix layer 70 mainly plays a role of shading. The black blocks arranged in an array are distributed at intervals, and light outlets are formed at intervals for light rays of the second light-emitting units 30 to pass through. The packaging layer is formed with a concave groove at a position corresponding to the first light-emitting unit, the reflecting layer 100 is arranged in the concave groove, and the length of the reflecting layer 100 is greater than or equal to the distance between two adjacent reflecting layers. In this embodiment, by providing a reflective layer 100 between the first display surface and the first light emitting unit, light generated by the first light emitting unit is prevented from propagating from the packaging layer, so that the display effect of the first display surface is poor. Specifically, the height of the reflective layer 100 is at least 1um, and the length is not less than the distance between two adjacent reflective layers. The material of the reflective layer 100 may be one or more of copper, silver, aluminum, or other low-transmittance alloys. Namely, the application is a display panel with double-sided display, which comprises a top emission structure and a bottom emission structure, wherein the top emission structure and the bottom emission structure are respectively a bottom emission structure and a top emission structure. Specifically, bottom emission means that light can be emitted onto the reflective layer 100 at the top and then emitted downwards, and the reflective layer 100 is opaque and has strong reflective capability. Top emission means that light can be directed upward through the encapsulation layer 80. The reflective layer 100 may be manufactured together with the portion of the reflective layer 40 embedded in the encapsulation layer 80 in a process, which may simplify the process. Compared with the two parts which are arranged at intervals, the two parts are connected into an integral structure, so that the light reflecting effect can be improved.
Of course, when the display panel needs to be provided with the reflective layer 100, the first groove and the third groove, a schematic structural diagram of the display panel is shown in fig. 12.
In some embodiments, the first light emitting unit 20 includes a first light emitting chip 21, a second light emitting chip 22, and a third light emitting chip 23, the second light emitting unit 30 includes a fourth light emitting chip 31, a fifth light emitting chip 32, and a sixth light emitting chip 33, and the step of s300 includes:
the first light emitting unit 20 and the second light emitting unit 30 are sequentially arranged on the driving circuit, the first light emitting chip 21 is arranged close to the sixth light emitting chip 33 of the adjacent second light emitting unit 30, the third light emitting chip 23 is arranged close to the fourth light emitting chip 31 of the adjacent other second light emitting unit 30, the colors of light rays emitted by the first light emitting chip 21 and the sixth light emitting chip 33 are the same, and the colors of light rays emitted by the third light emitting chip 23 and the fourth light emitting chip 31 are the same. The third light emitting chip 23 of the first light emitting unit 20 may be disposed adjacent to the fourth light emitting chip 31 of the right second light emitting unit 30 while the first light emitting chip 21 of the first light emitting unit 20 may be disposed adjacent to the left sixth light emitting chip 33, and the colors of the light emitted from the first light emitting chip 21 and the sixth light emitting chip 33 may be the same, and the colors of the light emitted from the third light emitting chip 23 and the fourth light emitting chip 31 may be the same, when the first light emitting unit 20 and the second light emitting unit 30 are disposed. Specifically, for the three primary colors of red, green and blue, the first light emitting chip 21 and the sixth light emitting chip 33 may be set to be red light (or red pixel), the third light emitting chip 23 and the fourth light emitting chip 31 are set to be blue light (or blue pixel), and the second light emitting chip 22 and the fifth light emitting chip 32 are set to be green light (or green pixel), so that the colors of the light emitted by the adjacent light emitting chips are the same, and the mutual interference of the light emitting chips between the light emitting units may be reduced or eliminated.
It should be noted that the foregoing embodiments are merely for illustrating the technical solution of the present application and not for limiting the scope of the present application, and although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that modifications to the technical solution described in the foregoing embodiments or equivalent substitution of some or all of the technical features thereof may be made or directly/indirectly applied to other related technical fields without departing from the essence of the corresponding technical solution from the scope of the technical solution of the embodiments of the present application, and all such modifications or substitutions should be included in the scope of the claims and the specification of the present application. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (9)
1. A display panel, comprising:
A substrate;
The first light-emitting units and the second light-emitting units are arranged on the same side of the substrate and are alternately distributed at intervals, and the first light-emitting direction of the first light-emitting units is opposite to the second light-emitting direction of the second light-emitting units;
The light reflecting layer is arranged between the first light emitting unit and the second light emitting unit;
The width of the middle of the reflecting layer is L2, the width of the top of the reflecting layer is L1, the width of the bottom of the reflecting layer is L3, L2 is greater than L1, L2 is greater than L3, and the cross section width of the reflecting layer gradually decreases from the middle to the top and the bottom respectively.
2. The display panel according to claim 1, wherein the substrate includes a driving circuit layer, and an insulating layer is provided between the light reflecting layer and the driving circuit layer.
3. The display panel according to claim 2, further comprising an encapsulation layer, wherein a first groove is provided on the encapsulation layer, a second groove is provided on the driving circuit layer, the insulating layer is provided in the second groove, a third groove is formed on the insulating layer, one end of the light reflecting layer is provided in the first groove, and the other end of the light reflecting layer is provided in the third groove.
4. The display panel according to claim 3, further comprising a reflective layer, wherein a concave groove is formed in the packaging layer at a position corresponding to the first light emitting unit, the reflective layer is disposed in the concave groove, and a length of the reflective layer is greater than or equal to a distance between two adjacent light reflecting layers.
5. The display panel according to claim 4, wherein a transparent conductive layer or a semitransparent conductive layer is further disposed on the encapsulation layer, the transparent conductive layer or semitransparent conductive layer being alternately connected to the reflective layer, the transparent conductive layer or semitransparent conductive layer being electrically connected to the cathode of the first light emitting unit and the cathode of the second light emitting unit.
6. The display panel according to any one of claims 1 to 5, wherein the first light emitting unit includes a first light emitting chip, a second light emitting chip and a third light emitting chip which are sequentially arranged, the second light emitting unit includes a fourth light emitting chip, a fifth light emitting chip and a sixth light emitting chip which are sequentially arranged, the first light emitting chip is disposed close to a sixth light emitting chip of an adjacent one of the second light emitting units, the third light emitting chip is disposed close to a fourth light emitting chip of an adjacent other of the second light emitting units, colors of light rays emitted by the first light emitting chip and the sixth light emitting chip are the same, and colors of light rays emitted by the third light emitting chip and the fourth light emitting chip are the same.
7. The display panel according to any one of claims 1 to 5, further comprising a first black matrix layer and a second black matrix layer, wherein the first black matrix layer is disposed on a first light emitting direction side of the first light emitting unit, and an orthographic projection of the first black matrix layer on the substrate covers an orthographic projection of the second light emitting unit on the substrate;
The second black matrix layer is arranged on the second light emitting direction side of the second light emitting unit, and orthographic projection of the second black matrix layer on the substrate covers orthographic projection of the first light emitting unit and the reflecting layer on the substrate.
8. A method for manufacturing a display panel, applied to manufacturing the display panel of any one of claims 1 to 7, characterized in that the method for manufacturing the display panel comprises:
Providing a substrate;
The light reflecting layer is arranged on the substrate, the width of the middle of the light reflecting layer is L2, the width of the top of the light reflecting layer is L1, the width of the bottom of the light reflecting layer is L3, and the L2 is more than L1 and the L2 is more than L3;
The light emitting device comprises a substrate, a first light emitting unit, a second light emitting unit, a reflecting layer and a light source, wherein the first light emitting unit and the second light emitting unit are distributed in an array mode on the same side of the substrate, the first light emitting direction of the first light emitting unit is opposite to the second light emitting direction of the second light emitting unit, and the reflecting layer is located between the first light emitting unit and the second light emitting unit.
9. The method of claim 8, wherein the step of providing a substrate comprises:
providing a bottom plate, and arranging a first black matrix layer on the bottom plate;
providing a driving circuit layer on the first black matrix layer to form the substrate, wherein the driving circuit layer is provided with a second groove;
the step of disposing a reflective layer on the substrate includes:
an insulating layer is arranged in the second groove of the driving circuit layer, a third groove is formed in the insulating layer, and the bottom of the reflecting layer is arranged in the third groove;
After the step of arranging the first light emitting units and the second light emitting units which are distributed in an array on the same side of the substrate, the method further comprises the steps of:
And mounting a packaging layer, wherein a first groove and a reflecting layer are arranged on the packaging layer, the top of the reflecting layer is mounted in the first groove, and the reflecting layer is arranged corresponding to the first light-emitting unit.
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| CN113314682A (en) * | 2021-05-27 | 2021-08-27 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and electronic equipment |
| CN114170919A (en) * | 2021-12-13 | 2022-03-11 | Tcl华星光电技术有限公司 | Double-sided display panel and double-sided display splicing screen |
| CN117637971A (en) * | 2023-11-29 | 2024-03-01 | 武汉华星光电技术有限公司 | Display panels and display devices |
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| CN112133734B (en) * | 2020-09-29 | 2022-08-30 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
| CN114242874B (en) * | 2021-12-14 | 2024-08-20 | 惠州华星光电显示有限公司 | Display screen, display device and manufacturing method of display screen |
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| CN113314682A (en) * | 2021-05-27 | 2021-08-27 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and electronic equipment |
| CN114170919A (en) * | 2021-12-13 | 2022-03-11 | Tcl华星光电技术有限公司 | Double-sided display panel and double-sided display splicing screen |
| CN117637971A (en) * | 2023-11-29 | 2024-03-01 | 武汉华星光电技术有限公司 | Display panels and display devices |
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