CN118174674B - Filter chip and electronic device - Google Patents

Abstract

The application relates to a filter chip and an electronic device. Wherein, the filter chip includes: input port, output port, multimode resonator, input feeder and output feeder. The input end feeder comprises a first input end feeder and a second input end feeder, and the output end feeder comprises a first output end feeder and a second output end feeder. The first input end feeder line is arranged opposite to the first output end feeder line. The input port is for receiving an input signal for transmission through the input feed line to the multimode resonator in an energy coupling. The multimode resonator is used for filtering an input signal. The output feed is at least used for obtaining a filtered input signal through energy coupling and transmitting the filtered input signal to the output port. The first input end feeder line and the first output end feeder line which are oppositely arranged are also used for directly transmitting the input signals transmitted by the first input end feeder line to the first output end feeder line through energy coupling.

Description

Filter chips and electronic devices

Technical Field

The present application relates to the field of integrated circuits, and in particular to a filter chip and an electronic device.

Background technique

In related technologies, modern wireless communications are developing towards millimeter wave bands with high data rates, large capacity and low latency, but at the same time, high frequencies will face greater atmospheric attenuation. The E band is limited by rain attenuation and is acceptable in most areas. It also has abundant spectrum resources and can solve the problem of relatively insufficient bandwidth for high-bandwidth services in current mobile communication networks. It has a wide range of application scenarios and is one of the best 5G and 6G bearer solutions. The design of related devices has also become a research hotspot.

With the continuous improvement of integrated circuit manufacturing technology, the size of millimeter wave integrated circuit systems has become smaller and more integrated. As an important component of the RF front end, the performance of the filter is related to the overall performance of the system. Therefore, how to obtain a higher performance, highly integrated filter is still a problem that needs to be solved.

Summary of the invention

According to a first aspect of an embodiment of the present application, there is provided a filter chip, comprising: an input port, an output port, a multi-mode resonator, an input feed line and an output feed line;

The input feeder at least includes a first input feeder and a second input feeder, and the output feeder at least includes a first output feeder and a second output feeder; the input port is connected to the input feeder, and the output port is connected to the output feeder; the first input feeder and the first output feeder are arranged opposite to each other, and the second input feeder and the second output feeder are located on both sides of the multi-mode resonator;

The input port is used to receive an input signal and to transmit the input signal to the connected input end feeder; the input end feeder is at least used to transmit the input signal to the multimode resonator through energy coupling; the multimode resonator is used to form a signal passband through resonance to filter the input signal received by the input port; the output end feeder is at least used to obtain the filtered input signal from the multimode resonator through energy coupling, and transmit it to the connected output port to output the filtered input signal;

The first input feeder and the first output feeder that are arranged opposite to each other are also used to directly transmit the input signal transmitted by the first input feeder to the first output feeder through energy coupling.

In some embodiments, the multi-mode resonator includes a first step impedance, a second step impedance and a connecting line;

The first ladder impedance includes a first ladder first sub-line and a first ladder second sub-line, and the first ladder first sub-line and the first ladder second sub-line extend in the same direction; the second ladder impedance includes a second ladder first sub-line and a second ladder second sub-line that are arranged oppositely, and the second ladder first sub-line and the second ladder second sub-line extend in the same direction; wherein the first ladder first sub-line and the second ladder first sub-line are arranged oppositely, and the first ladder second sub-line and the second ladder second sub-line are arranged oppositely; the first ladder first sub-line is connected to the first ladder second sub-line, and the second ladder first sub-line is connected to the second ladder second sub-line;

In the respective extending directions, the width of the first-step first sub-line or the second-step first sub-line is greater than the width of the first-step second sub-line or the second-step second sub-line;

The connecting line connects the first-step second sub-line and the second-step second sub-line.

In some embodiments, the multi-mode resonator further includes a third step impedance, a fourth step impedance and a loading structure;

The third ladder impedance includes a third ladder first sub-line and a third ladder second sub-line, and the third ladder first sub-line and the third ladder second sub-line extend in different directions; the fourth ladder impedance includes a fourth ladder first sub-line and a fourth ladder second sub-line, and the fourth ladder first sub-line and the fourth ladder second sub-line extend in different directions; the third ladder first sub-line and the fourth ladder first sub-line are arranged opposite to each other and are connected through the connecting line; the third ladder second sub-line and the fourth ladder second sub-line are arranged opposite to each other; the third ladder first sub-line is connected to the third ladder second sub-line at an angle, and the fourth ladder first sub-line is connected to the fourth ladder second sub-line at an angle;

In the respective extending directions, the width of the third-step second sub-line or the fourth-step second sub-line is greater than the width of the third-step first sub-line or the fourth-step first sub-line;

The loading structure comprises the first loading sub-line, the second loading sub-line and the third loading sub-line; the first loading sub-line and the second loading sub-line are connected to the same end of the third loading sub-line, and the other end of the third loading sub-line is connected to the connecting line; in their respective extending directions, the first loading sub-line, the second loading sub-line and the third loading sub-line have the same width;

The first loading sub-line and the third-step second sub-line extend in the same direction and are arranged opposite to each other, and the second loading sub-line and the fourth-step second sub-line extend in the same direction and are arranged opposite to each other.

In some embodiments, the first step first sub-line, the first step second sub-line and the third step first sub-line extend in the same direction, and the second step first sub-line, the second step second sub-line and the fourth step first sub-line extend in the same direction; the connecting line is perpendicular to the extension direction of the first step and the second step; the third step second sub-line is perpendicular to the third step first sub-line, and the fourth step second sub-line is perpendicular to the fourth step first sub-line; the first loading sub-line and the second loading sub-line extend in the same direction; the third loading sub-line is perpendicular to the first loading sub-line and the second loading sub-line, and is perpendicular to the connecting line.

In some embodiments, the multi-mode resonator comprises parts formed integrally.

In some embodiments, it includes a substrate layer, a first dielectric layer, a gas layer, a first filter structure layer, a second filter structure layer, a ground layer, a conductor via and a second dielectric layer;

The substrate is located on the grounding layer; the first dielectric layer is located on the side of the substrate facing away from the grounding layer; the first filter structure layer is located in the dielectric layer; the gas layer is located on the side of the first dielectric layer facing away from the substrate; the second dielectric layer is located on the side of the gas layer facing away from the first dielectric layer, and the second filter structure layer is located in the second dielectric layer; the first filter structure layer and the second filter structure layer both include the same filter structure; the first filter structure layer and the second filter structure layer are connected to each other via the conductor vias;

The second filter structure layer is arranged corresponding to the same filter structure included in the first filter structure layer, and the orthographic projection of the second filter structure layer on the first filter structure layer is located within the first filter structure layer.

In some embodiments, the material of the substrate includes silicon carbide, and the materials of the first dielectric layer and the second dielectric layer include silicon nitride.

In some embodiments, a filter structure using the multi-mode resonator is formed on the substrate by an IPD process.

In some embodiments, both the first filter structure layer and the second filter structure layer include a ground port; the orthographic projection of the conductor via on the ground port is located within the ground port;

The conductor via includes a first section via and a second section via; the first filter structure layer and the second filter structure layer are connected through the second section via, and the ground port is connected to the ground layer through the first section via to achieve grounding.

According to a second aspect of the present application, an electronic device is provided, comprising any one of the above-mentioned filter chips.

According to the above embodiments, the first output feeder and the second output feeder can be used to obtain the input signal filtered by the multimode resonator from the multimode resonator. Thus, the external quality factor of the filter chip can be flexibly adjusted through the input feeder and the output feeder.

Furthermore, by setting a relative first input feeder and a first output feeder, the input signal transmitted by the first input feeder can be directly transmitted to the first output feeder through energy coupling, and multiple resonant modes of the multi-mode resonator can be simultaneously excited at the input port and the output port. In addition to the multiple paths formed, an additional path is generated from the input port via the first input feeder and the first output feeder to the output port. Therefore, multiple out-of-band transmission zeros can be introduced through the phase differences between more transmission paths, and thus the filter chip can have better high-frequency selectivity.

Therefore, such a setting can achieve flexible adjustment of the external quality factor of the filter chip while enabling the filter chip to have better high-frequency selectivity.

It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

FIG. 1 is a schematic diagram of the structure of a filter chip according to an embodiment of the present application.

FIG. 2 is a schematic diagram showing the results of S-parameter and group delay simulation for the filter chip shown in FIG. 1 according to an embodiment of the present application.

FIG. 3 is a top view of the filter chip shown in FIG. 1 according to an embodiment of the present application.

FIG. 4 is a partial enlarged view of the multi-mode resonator in FIG. 3 according to an embodiment of the present application.

FIG. 5 is a schematic diagram of a transmission line equivalent circuit of the circuit structure shown in FIG. 4 according to an embodiment of the present application.

FIG. 6 is a schematic diagram of the transmission line equivalent circuit shown in FIG. 5 under even-mode excitation according to an embodiment of the present application.

FIG. 7 is a schematic diagram of the transmission line equivalent circuit shown in FIG. 5 under odd-mode excitation according to an embodiment of the present application.

FIG. 8 is a simplified cross-sectional view of the IPD process used in the filter chip according to an embodiment of the present application.

Detailed ways

Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

The present application provides a filter chip 10. Fig. 1 shows a schematic diagram of the structure of the filter chip 10. As shown in Fig. 1, the filter chip 10 includes: an input port 11, an output port 12, a multi-mode resonator 13, an input feed line 14 and an output feed line 15.

The input feeder 14 at least includes a first input feeder 141 and a second input feeder 142, and the output feeder 15 at least includes a first output feeder 151 and a second output feeder 152. The input port 11 is connected to the input feeder 14, and the output port 12 is connected to the output feeder 15. The first input feeder 141 and the first output feeder 151 are arranged opposite to each other, and the second input feeder 142 and the second output feeder 152 are located on both sides of the multimode resonator 13.

The first input feeder 141 and the first output feeder 151 are arranged opposite to each other, that is, the corresponding parts of the first input feeder 141 and the first output feeder 151 are of comparable size and aligned with each other, and there is no other wiring structure blocking the two.

It should be noted that, although only the relative arrangement between the first input feeder 141 and the first output feeder 151 is described here, it is conceivable that the description of the relative arrangement of other parts in the present application can also refer to the description here.

The input port 11 is used to receive an input signal and to transmit the input signal to a connected input feeder 14. The input feeder 14 is at least used to transmit the input signal to the multimode resonator 13 through energy coupling. The multimode resonator 13 is used to form a signal passband through resonance to filter the input signal received by the input port 11. The output feeder 15 is at least used to obtain a filtered input signal from the multimode resonator 13 through energy coupling, and transmit it to the connected output port 12 to output the filtered input signal.

The input signal is transmitted by energy coupling, that is, there is no direct physical connection between the input feeder 14 and the multi-mode resonator 13, and between the output feeder 15 and the multi-mode resonator 13. Instead, the input signal is transmitted by energy coupling transmission without direct physical connection.

The first input-end feeder 141 and the first output-end feeder 151 that are arranged opposite to each other are also used to directly transmit the input signal transmitted by the first input-end feeder 141 to the first output-end feeder 151 through energy coupling.

Specifically, the first input feeder 141 and the second input feeder 142 can be used to transmit the input signal received by the input port 11 to the multi-mode resonator 13 by energy coupling. And the first output feeder 151 and the second output feeder 152 can be used to obtain the input signal filtered by the multi-mode resonator 13 from the multi-mode resonator 13. Therefore, the external quality factor of the filter chip 10 can be flexibly adjusted through the input feeder 14 and the output feeder 15.

In addition, refer to FIG2 for the schematic diagram of the results of the S parameter and group delay simulation of the filter chip 10 shown in FIG1. Wherein, the horizontal axis shown in FIG2 is the frequency, the unit is GHz, the left vertical axis is the S parameter, the unit is dB, and the right vertical axis is the group delay, the unit is ns. As shown in FIG2, by setting the first input end feeder 141 and the first output end feeder 151 relative to each other, the input signal transmitted by the first input end feeder 141 can be directly transmitted to the first output end feeder 151 through energy coupling, and multiple resonant modes of the multimode resonator 13 can be simultaneously excited at the input port 11 and the output port 12. In addition to the multiple paths formed, an additional path from the input port 11 to the output port via the first input end feeder 141 and the first output end feeder 151 is generated, so that multiple out-of-band transmission zeros can be introduced through the phase difference between more transmission paths, and then, the filter chip can have better high-frequency selectivity.

Therefore, such a configuration can achieve flexible adjustment of the external quality factor of the filter chip 10 while enabling the filter chip 10 to have better high-frequency selectivity.

In some embodiments, FIG3 shows a top view of the filter chip 10 shown in FIG1 . As shown in FIG1 and FIG3 , the multi-mode resonator 13 includes a first step impedance 131 , a second step impedance 132 and a connecting line 135 .

The first step impedance 131 includes a first step first sub-line 1311 and a first step second sub-line 1312, and the first step first sub-line 1311 and the first step second sub-line 1312 extend in the same direction. The second step impedance 132 includes a second step first sub-line 1321 and a second step second sub-line 1322, and the second step first sub-line 1321 and the second step second sub-line 1322 extend in the same direction. The first step first sub-line 1311 and the second step first sub-line 1321 are arranged opposite to each other, and the first step second sub-line 1312 and the second step second sub-line 1322 are arranged opposite to each other. The first step first sub-line 1311 is connected to the first step second sub-line 1312, and the second step first sub-line 1321 is connected to the second step second sub-line 1322.

In the respective extending directions, the width of the first-step first sub-line 1311 or the second-step first sub-line 1321 is greater than the width of the first-step second sub-line 1312 or the second-step second sub-line 1322 .

Referring to the partial enlarged view of the multimode resonator 13 in FIG. 3 shown in FIG. 4, in the respective extension directions, the width of the first step first sub-line 1311 or the second step first sub-line 1321 is greater than the width of the first step second sub-line 1312 or the second step second sub-line 1322, that is, the width L1 of the first step first sub-line 1311 or the second step first sub-line 1321 shown in FIG. 3 is greater than the width L2 of the second step second sub-line 1312 or the second step second sub-line 1322. And the width L1 is greater than the width L2, that is, the impedance of the first step first sub-line 1311 or the second step first sub-line 1321 is less than the first step second sub-line 1312 or the second step second sub-line 1322. Specifically, the form of the impedance can refer to the schematic diagram of the transmission line equivalent circuit of the circuit structure shown in FIG. 4 shown in FIG. 5.

The connection line 135 connects the first-step second sub-line 1312 and the second-step second sub-line 1322 .

In this way, by setting the first step impedance 131 and the second step impedance 132, and the connecting line 135 connecting the first step second sub-line 1312 and the second step second sub-line 1322, the proposed multi-mode resonator is formed. Therefore, the increase in size and loss caused by multi-stage cascading can be avoided through a single multi-mode resonator 13, and it also has better in-band flatness and frequency selectivity.

In some embodiments, as shown in Figures 1, 3 and 4, and with reference to the simulation schematic diagram shown in Figure 2 and the transmission line equivalent circuit schematic diagram shown in Figure 5, the multi-mode resonator 13 also includes a third step impedance 133, a fourth step impedance 134 and a loading structure 136.

The third step impedance 133 includes a third step first sub-line 1331 and a third step second sub-line 1332, and the third step first sub-line 1331 and the third step second sub-line 1332 extend in different directions. The fourth step impedance 134 includes a fourth step first sub-line 1341 and a fourth step second sub-line 1342, and the fourth step first sub-line 1341 and the fourth step second sub-line 1342 extend in different directions. The third step first sub-line 1331 and the fourth step first sub-line 1321 are arranged opposite to each other and are connected by a connecting line 135. The third step second sub-line 1332 and the fourth step second sub-line 1342 are arranged opposite to each other. The third step first sub-line 1331 and the third step second sub-line 1332 are connected at an angle, and the fourth step first sub-line 1341 and the fourth step second sub-line 1342 are connected at an angle.

In the respective extension directions, the width of the third-step second sub-line 1332 or the fourth-step second sub-line 1342 is greater than the width of the third-step first sub-line 1331 or the fourth-step first sub-line 1341. That is, the impedance of the third-step second sub-line 1332 or the fourth-step second sub-line 1342 is less than the third-step first sub-line 1331 or the fourth-step first sub-line 1341. Specifically, the form of the impedance can refer to the schematic diagram of the transmission line equivalent circuit of the multi-mode resonator 13 shown in FIG. 4 shown in FIG. 5 .

The loading structure 136 includes a first loading sub-line 1361, a second loading sub-line 1362, and a third loading sub-line 1363. The first loading sub-line 1361 and the second loading sub-line 1362 are connected to the same end of the third loading sub-line 1363, and the other end of the third loading sub-line 1363 is connected to the connection line 135. In their respective extension directions, the first loading sub-line 1361, the second loading sub-line 1362, and the third loading sub-line 1363 have the same width.

The first loading sub-line 1361 and the second loading sub-line 1362 are connected to the same end of the third loading sub-line 1363. Therefore, a structure similar to a "T" shape can be formed by the first loading sub-line 1361, the second loading sub-line 1362 and the third loading sub-line 1363. It should be noted that the "T"-shaped structure here does not strictly require the structure to be the same as the "T" shape, but only needs to be similar to the "T" shape.

The first loading sub-line 1361 and the third-step second sub-line 1332 extend in the same direction and are disposed opposite to each other. The second loading sub-line 1362 and the fourth-step second sub-line 1342 extend in the same direction and are disposed opposite to each other.

In this way, coupling can be generated with the third-step second sub-line 1332 and the fourth-step second sub-line 1342 through the loading structure 136, thereby introducing more transmission zeros for the filter chip 10. In addition, referring to the simulation schematic diagram shown in FIG2 , the transmission zero position of the multi-mode resonator 13 is close to both sides of the passband, thereby effectively suppressing out-of-band interference, and further enabling the filter chip 10 to have better high-frequency selectivity.

Among them, the resonance characteristics of the multimode resonator can be derived by performing odd and even mode analysis on the multimode resonator. FIG6 shows a schematic diagram of the transmission line equivalent circuit shown in FIG5 under even mode excitation. As shown in FIG6, the input admittance of the even mode equivalent circuit of the multimode resonator 13 is Yin-even. By adding a virtual port to calculate the ABCD matrix of the transmission line equivalent circuit and performing parameter conversion, the corresponding expression can be obtained. The even mode resonance condition is Im(Yin-even)=0, which corresponds to its transmission pole. When the input impedance of the equivalent circuit is 0, its transmission zero point can be obtained. Compared with uniform impedance, the structure of the multi-mode resonator 13 has more impedance and electrical length parameters, and the resonance frequency can be adjusted by the electrical length ratio α1=θ1a/(θ1a+θ1b) of the first sub-line 1311 of the first step impedance 131 and the second sub-line 1312 of the first step impedance 131, the first sub-line 1321 of the second step impedance 132 and the second sub-line 1322 of the second step impedance 132, the electrical length ratio α2=θ2a/(θ2a+θ2b) of the second sub-line 1332 of the third step impedance 133 and the first sub-line 1331 of the third step impedance 133, and the second sub-line 1344 of the fourth step impedance 134 and the first sub-line 1341 of the fourth step impedance 134. Thus, the design and tuning freedom of the multi-mode resonator 13 can be improved. Similarly, the equivalent input admittance Yin-odd under odd-mode excitation can be calculated and its resonance characteristics can be analyzed. FIG7 shows a schematic diagram of the transmission line equivalent circuit shown in FIG5 under odd-mode excitation.

5 to 7, it can be found that the multimode resonator 13 has two modes fe1 and fe2 under even-mode excitation, and also has two modes fo1 and fo2 under odd-mode excitation. Therefore, by adopting the aforementioned configuration of the multimode resonator 13 and selecting a suitable feeding structure, four modes can be excited simultaneously to form a desired passband.

In some embodiments, as shown in FIG. 1 , FIG. 3 and FIG. 4 , and with reference to the simulation schematic diagram shown in FIG. 2 and the transmission line equivalent circuit schematic diagram shown in FIG. 5 , the first step first sub-line 1311 extends in the same direction as the first step second sub-line 1312 and the third step first sub-line 1331 , and the second step first sub-line 1321 extends in the same direction as the second step second sub-line 1322 and the fourth step first sub-line 1341 . The connecting line 135 is perpendicular to the extending direction of the first step 131 and the second step 132 . The third step second sub-line 1332 is perpendicular to the third step first sub-line 1331 , and the fourth step second sub-line 1342 is perpendicular to the fourth step first sub-line 1341 . The first loading sub-line 1361 extends in the same direction as the second loading sub-line 1362 . The third loading sub-line 1363 is perpendicular to the first loading sub-line 1361 and the second loading sub-line 1362 , and is perpendicular to the connecting line 135 .

By making the third-step second sub-line 1332 perpendicular to the third-step first sub-line 1331 and the fourth-step second sub-line 1342 perpendicular to the fourth-step first sub-line 1341, the loading structure 136 can effectively benefit the space between the third-step second sub-line 1332 and the fourth-step second sub-line 1342, so that the first loading sub-line 1361 and the third-step second sub-line 1332 extend in the same direction, the second loading sub-line 1362 and the fourth-step second sub-line 1342 extend in the same direction, and the third loading sub-line 1363 and the third-step first sub-line 1331 or the fourth-step first sub-line 1341 extend in the same direction. Thus, the space occupied by the third-step second sub-line 1332, the fourth-step second sub-line 1342 and the loading structure 136 can be effectively reduced, and the loading structure 136 can be coupled with the third-step second sub-line 1332 and the fourth-step second sub-line 1342. As a result, the filter chip 10 can be further endowed with better high-frequency selectivity while achieving the adjustment of the resonant mode of the filter chip 10 with less space occupied.

In some embodiments, the various parts included in the multi-mode resonator 13 are formed in one piece. The multi-mode resonator 13 uses a single resonator to generate multiple controllable resonance modes, so that one resonator can replace multiple resonators, reducing the number of resonators in the filter, reducing the size and insertion loss, facilitating integration, and reducing costs.

In some embodiments, FIG8 shows a simplified cross-sectional view of the IPD process used in the filter chip 10 , including a substrate layer 20 , a first dielectric layer 21 , a gas layer 22 , a first filter structure layer 23 , a second filter layer 24 , a ground layer 25 , a conductor via 17 and a second dielectric layer 26 .

The substrate 20 is located on the grounding layer 25. The first dielectric layer 21 is located on the side of the substrate 20 facing away from the grounding layer 25. The first filter structure layer 23 is located in the dielectric layer 21. The gas layer 22 is located on the side of the first dielectric layer 21 facing away from the substrate 20. The second dielectric layer 26 is located on the side of the gas layer 22 facing away from the first dielectric layer 21, and the second filter structure layer 24 is located in the second dielectric layer 26. The first filter structure layer 23 and the second filter structure layer 24 both include the same filter structure. The first filter structure layer 23 and the second filter structure layer 24 are connected to each other via the conductor via 17.

Each filter structure layer includes the same filter structure, that is, the first filter structure layer 23 and the second filter structure layer 24 both include: an input port 11, an output port 12, a multimode resonator 13, an input feeder 14 and an output feeder 15. The specific arrangement of the filter structure in each filter structure layer can refer to the structures and corresponding descriptions shown in Figures 1, 3 and 4, which will not be repeated here. In addition, the material of each filter structure layer may include a metal material.

The second filter structure layer 24 is arranged corresponding to the same filter structure included in the first filter structure layer 23 , and the orthographic projection of the second filter structure layer 24 on the first filter structure layer 23 is located inside the first filter structure layer 23 .

The second filter structure layer 24 is arranged corresponding to the same filter structure included in the first filter structure layer 23, that is, the orthographic projection of a filter structure of the second filter structure layer 24 on the first filter structure layer 23 is located in the same filter structure in the first filter structure layer 23, or at least mostly overlaps.

Such an arrangement can make the filter structure in the filter chip 10 meet the requirements of the IPD process, so that the high integration of the filter chip 10 can be achieved through the IPD process.

In some embodiments, Fig. 8 shows a simplified cross-sectional view of the IPD process used in the filter chip 10. As shown in Fig. 8, the material of the substrate 20 includes silicon carbide, and the materials of the first dielectric layer 21 and the second dielectric layer 26 include silicon nitride.

This arrangement can effectively reduce the insertion loss of the filter chip by using a substrate 20 made of silicon carbide material and a medium 21 made of silicon nitride material. Referring to the simulation schematic diagram shown in FIG2 , after the substrate 20 is made of silicon carbide material and the medium 21 is made of silicon nitride material, the minimum insertion loss of the bandpass filter is 1.15 dB, and the passband is flat, and the maximum and minimum insertion loss differ by only 0.3 dB. The substrate 20 made of silicon carbide material has excellent heat resistance and thermal conductivity.

In some embodiments, a filter structure using the multi-mode resonator 13 is formed on the substrate 20 by an IPD process.

Such an arrangement can effectively improve the miniaturization and integration of the filter chip 10 .

In some embodiments, as shown in FIG. 1 , FIG. 3 , FIG. 4 and FIG. 8 , the first filter structure layer 23 and the second filter structure layer 24 constituting the filter are connected through a conductor via 172 .

This arrangement can increase the thickness of the equivalent metal conductor, thereby facilitating the reduction of the insertion loss of the filter.

In some embodiments, as shown in FIG1 , FIG3 , FIG4 and FIG8 , the first filter structure layer 23 and the second filter structure layer 24 both include a ground port 16 . The orthographic projection of the conductor via 17 on the ground port 16 is located inside the ground port 16 .

The conductor via 17 includes a first section via 171 and a second section via 172. The first filter structure layer 23 and the second filter structure layer 24 are connected through the second section via 172, and the ground port 16 is connected to the ground layer 25 through the first section via 171 to achieve grounding.

The material of the grounding layer 25 may include metal to achieve grounding of the filter chip 10 .

With this arrangement, the filter structure can be easily connected to the ground layer 25 through the conductor via 17 penetrating the substrate 20 , the first dielectric layer 21 and the second dielectric layer 26 , and the ground port 16 in the filter chip 10 is grounded through the conductor via 17 .

In some embodiments, as shown in reference Figure 2, a filter chip 10 with the above-mentioned multiple settings is used. In the E-band operating frequency band of 71-86 GHz, the return loss of the bandpass filter is better than 20 dB, the minimum insertion loss is 1.15 dB, and the passband is flat. The maximum and minimum insertion losses differ by only 0.3 dB. At the same time, the group delay is relatively flat, and the group delay is between 38.5 ps and 46.3 ps. In addition, there are four transmission zeros distributed in the upper and lower sidebands of the passband. The filter chip 10 using the bandpass filter has good frequency selectivity.

The present application also provides an electronic device, comprising any one of the filter chips 10 described above.

The above embodiments of the present application may complement each other if no conflict occurs.

It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

The term "plurality" means two or more than two, unless expressly limited otherwise.

Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims (8)

1. A filter chip, comprising: the input port, the output port, the multimode resonator, the input feeder and the output feeder;

The input end feeder comprises at least a first input end feeder and a second input end feeder, and the output end feeder comprises at least a first output end feeder and a second output end feeder; the input port is connected with the input end feeder line, and the output port is connected with the output end feeder line; the first input end feeder line and the first output end feeder line are arranged opposite to each other, and the second input end feeder line and the second output end feeder line are positioned at two sides of the multimode resonator;

The input port is used for receiving an input signal and transmitting the input signal to the connected input end feeder line; the input feed line is at least used for transmitting the input signal to the multimode resonator through energy coupling; the multimode resonator is used for forming a signal passband through resonance so as to filter an input signal received by the input port; the output end feeder line is at least used for obtaining the filtered input signals from the multimode resonator through energy coupling and transmitting the filtered input signals to a connected output port to output the filtered input signals;

The first input end feeder line and the first output end feeder line which are arranged oppositely are also used for directly transmitting the input signals transmitted by the first input end feeder line to the first output end feeder line through energy coupling;

the multimode resonator comprises a first ladder impedance, a second ladder impedance and a connecting wire;

The first ladder impedance comprises a first ladder first sub-line and a first ladder second sub-line, and the first ladder first sub-line and the first ladder second sub-line extend along the same direction; the second ladder impedance comprises a second ladder first sub-line and a second ladder second sub-line which are oppositely arranged, and the second ladder first sub-line and the second ladder second sub-line extend along the same direction; the first step first sub-line and the second step first sub-line are arranged oppositely, and the first step second sub-line and the second step second sub-line are arranged oppositely; the first ladder first sub-line is connected with the first ladder second sub-line, and the second ladder first sub-line is connected with the second ladder second sub-line;

In the respective extending directions, the width of the first stepped first sub-line or the second stepped first sub-line is larger than the width of the first stepped second sub-line or the second stepped second sub-line;

The connecting wire is connected with the first step second sub-line and the second step second sub-line;

The multimode resonator further comprises a third ladder impedance, a fourth ladder impedance and a loading structure;

The third ladder impedance comprises a third ladder first sub-line and a third ladder second sub-line, and the third ladder first sub-line and the third ladder second sub-line extend along different directions; the fourth ladder impedance comprises a fourth ladder first sub-line and a fourth ladder second sub-line, and the fourth ladder first sub-line and the fourth ladder second sub-line extend along different directions; the third step first sub-line is arranged opposite to the fourth step first sub-line and is connected with the fourth step first sub-line through the connecting line; the third step second sub-line is arranged opposite to the fourth step second sub-line; the third step first sub-line is connected with the third step second sub-line in an angle, and the fourth step first sub-line is connected with the fourth step second sub-line in an angle;

The width of the third step second sub-line or the fourth step second sub-line is larger than the width of the third step first sub-line or the fourth step first sub-line in the respective extending directions;

The loading structure comprises a first loading sub-line, a second loading sub-line and a third loading sub-line; the first loading sub-line and the second loading sub-line are connected to the same end of the third loading sub-line, and the other end of the third loading sub-line is connected with the connecting line; the widths of the first loading sub-line, the second loading sub-line and the third loading sub-line are the same in the respective extending directions;

The first loading sub-line and the third step second sub-line extend along the same direction and are oppositely arranged, and the second loading sub-line and the fourth step second sub-line extend along the same direction and are oppositely arranged.

2. The filter chip of claim 1, wherein the first stepped first sub-line extends in a same direction as the first stepped second sub-line and the third stepped first sub-line, and the second stepped first sub-line extends in a same direction as the second stepped second sub-line and the fourth stepped first sub-line; the connecting line is perpendicular to the extending direction of the first step and the second step; the third step second sub-line is perpendicular to the third step first sub-line, and the fourth step second sub-line is perpendicular to the fourth step first sub-line; the first loading sub-line and the second loading sub-line extend along the same direction; the third loading sub-line is perpendicular to the first loading sub-line and the second loading sub-line and perpendicular to the connecting line.

3. The filter chip of claim 2, wherein the portions included in the multimode resonator are integrally formed.

4. The filter chip of claim 1, comprising a substrate layer, a first dielectric layer, a gas layer, a first filter structure layer, a second filter structure layer, a ground layer, a conductor via, and a second dielectric layer;

The substrate is positioned on the grounding layer; the first dielectric layer is positioned on one side of the substrate, which is away from the grounding layer; the first filter structure layer is positioned in the dielectric layer; the gas layer is positioned on one side of the first dielectric layer, which is away from the substrate; the second dielectric layer is positioned on one side of the gas layer, which is opposite to the first dielectric layer, and the second filter structure layer is positioned in the second dielectric layer; the first filter structure layer and the second filter structure layer each comprise the same filter structure; the first filter structure layer and the second filter structure layer are connected to each other via the conductor via;

the second filter structure layer is correspondingly arranged with the same filter structure included in the first filter structure layer, and orthographic projection of the second filter structure layer on the first filter structure layer is positioned in the first filter structure layer.

5. The filter chip of claim 4, wherein the material of the substrate comprises silicon carbide and the material of the first dielectric layer and the second dielectric layer comprises silicon nitride.

6. The filter chip of claim 5, wherein the filter structure employing the multimode resonator is formed on the substrate by an IPD process.

7. The filter chip of claim 4, wherein the first filter structure layer and the second filter structure layer each include a ground port; the orthographic projection of the conductor via hole on the grounding port is positioned in the grounding port;

The conductor via hole comprises a first section via hole and a second section via hole; the first filter structure layer and the second filter structure layer are connected through the second section of through hole, and the grounding port is connected to the grounding layer through the first section of through hole again so as to realize grounding.

8. An electronic device comprising the filter chip of any one of claims 1 to 7.