CN118081099B - Laser processing system and hole wall metal coating laser processing method - Google Patents
Laser processing system and hole wall metal coating laser processing method Download PDFInfo
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- CN118081099B CN118081099B CN202410530235.5A CN202410530235A CN118081099B CN 118081099 B CN118081099 B CN 118081099B CN 202410530235 A CN202410530235 A CN 202410530235A CN 118081099 B CN118081099 B CN 118081099B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of printed circuit board production, in particular to a laser processing system and a hole wall metal coating laser processing method. The system laser generating module generates an initial beam; the beam diameter and divergence angle dynamic control module is used for adjusting the diameter and divergence angle of the initial beam to form an adjusted beam with the same diameter as the metal coating; the annular beam dynamic focusing module shapes the adjusting beam into an annular beam matched with the cross section shape of the metal coating, refracts a branch beam, and acquires the laser energy and the beam diameter dynamic of the annular beam by monitoring the laser energy and the beam diameter of the branch beam; the focus three-dimensional offset module dynamically adjusts the focus of the annular light beam according to the laser energy and the light beam diameter of the annular light beam, and the laser processing system can reduce and even completely remove the problem of the stub in the drilling hole and has the advantage of high accuracy of removing the stub site.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a laser processing system and a hole wall metal coating laser processing method.
Background
The printed circuit board is a structure with multiple layers of circuits overlapped, in order to realize signal interconnection between layers, two layers of boards to be connected are usually connected by drilling holes at reserved nodes of the two layers of boards to be connected, and metal plating layers are formed on hole walls through an electroplating process to electrically connect the two layers of boards to be connected.
When two plate layers needing to be electrically connected are positioned in the inner layer of the printed circuit board, the metal plating layer covers the whole hole wall, and only the metal plating section between the two plate layers actually playing the role of electric connection, namely, the metal plating layer has a large number of redundant parts. For printed circuit boards for high-speed transmission applications, the redundant metal plating can not only break the impedance continuity, but also seriously affect the transmission of high-frequency and high-speed signals.
For the above reasons, the prior art means of treating redundant metallic coatings is: after the metal coating is formed in the hole wall, the redundant metal coating is removed by drilling in an approximate reaming mode. However, because the drill bit has a point angle, the drill bit rotates to form an inverted cone-shaped drill cutting area, and in order to ensure the electric connection quality of the effective metal plating section, the plate layer to be connected positioned at a shallower position can be marked as an untrillable layer, so that the cutting depth is limited. When the tip of the drill-down cutting zone reaches the non-drillable layer to be in a limit position, a section of residual metal coating at the edge of the drill-down cutting zone, which exceeds the non-drillable layer, still exists, and is called as a stub in the industry. Stub can also affect impedance continuity and transmission performance of high frequency and high speed signals.
In view of the foregoing, there is a need for a method of minimizing or even completely removing stubs to enhance the performance of printed circuit boards for high speed transmission applications.
Disclosure of Invention
The invention aims to avoid the defects in the prior art and provide a laser processing system which can reduce and even completely remove the problem of the stub in the drilled hole and has the advantage of high accuracy of removing the stub site.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the laser processing system comprises a laser generation module, a beam diameter and divergence angle dynamic control module, an annular beam dynamic focusing module and a focus three-dimensional offset module which are arranged on the same laser path;
the laser generation module generates an initial beam;
the beam diameter and divergence angle dynamic control module is used for adjusting the diameter and divergence angle of the initial beam to form an adjusted beam with the same diameter as the metal coating;
The annular beam dynamic focusing module shapes the adjusting beam into an annular beam matched with the cross section shape of the metal coating, refracts a branch beam, and acquires the laser energy and the beam diameter dynamic of the annular beam by monitoring the laser energy and the beam diameter of the branch beam;
The focus three-dimensional offset module dynamically adjusts the focus of the annular light beam according to the laser energy and the beam diameter of the annular light beam.
Preferably, the beam diameter and divergence angle dynamic control module comprises a beam expander group and a beam expander switcher which are arranged on the optical path, wherein the beam expander group consists of beam expanders with various beam expansion multiplying factors, and the beam expander switcher outputs adjustment beams with different diameters through switching the beam expanders with different beam expansion multiplying factors.
Preferably, the annular beam dynamic focusing module comprises a telecentric focusing field lens, an annular beam shaper set and a lens set switcher, wherein the lens set switcher switches the annular beam shaper to output annular beams with different diameters, and the telecentric focusing field lens further shapes and focuses the annular beams.
Preferably, the annular beam dynamic focusing module further comprises a spectroscope and an energy distribution detector, the energy distribution detector is arranged at the side of the laser path, the spectroscope is arranged on the laser path and refracts a part of the annular beam to form a branch beam to be projected to the receiving end of the energy distribution detector, and the energy distribution detector dynamically monitors the laser energy of the annular beam.
Preferably, the focus three-dimensional offset module comprises a scanning galvanometer and a three-dimensional motion guide rail, wherein the telecentric focusing field lens and the annular beam shaper are both slidably installed on the three-dimensional motion guide rail, the scanning galvanometer is in data intercommunication with the energy distribution detector, and the distance between the telecentric focusing field lens and the annular beam shaper is controlled to adjust the focus position of the annular beam.
Preferably, the laser beam collimator further comprises a beam collimation module, wherein the beam collimation module is arranged on a laser path between the laser generation module and the beam diameter and divergence angle dynamic control module and is used for adjusting the collimation of the initial beam.
Preferably, the laser beam focusing device further comprises a control center, wherein the laser generation module, the beam diameter and divergence angle dynamic control module, the annular beam dynamic focusing module and the focus three-dimensional offset module are respectively in communication connection with the control center, and the control center is provided with laser parameters and printed circuit board processing parameters to cooperatively control the operation of each module.
Preferably, depth coordinate data of the non-drillable layer is pre-stored in the control center, and the control center instructs the annular beam dynamic focusing module and the focus three-dimensional offset module to adjust the minimum distance between the focus of the annular beam and the non-drillable layer to be larger than the maximum radius of the annular beam defocused radiation area.
The invention also provides the following technical scheme: a laser processing method of a hole wall metal coating, which is applied to the laser processing system, further comprises the following steps:
step one: measuring the position coordinates, diameter and depth of the drilled holes, and detecting the thickness of the metal coating;
Step two: starting a laser generating module to generate an initial beam, and adjusting a laser path according to the position coordinates of the drilling hole so that a light spot projected on the printed circuit board by the initial beam covers the drilling hole;
step three: adjusting the diameter and the divergence angle of the initial beam, and outputting a controlled laser beam matched with the diameter of the drilling hole, namely adjusting the beam;
Step four: performing secondary shaping on the adjustment beam according to the thickness of the metal coating, and outputting an annular beam;
step five: extracting a part of the annular beam to form a branch beam, and carrying out laser energy monitoring on the branch beam, wherein the monitoring branch beam laser energy is converted into the monitoring annular beam laser energy by means of adjusting the branch beam and the annular beam in an equal ratio:
When the laser energy of the annular beam is lower than 90% of the calibration energy, adjusting the focal position of the annular beam to enable the laser energy of the annular beam to occupy the percentage of the calibration energy to be between 90% and 100%;
and/or, synchronously monitoring the diameter of the annular beam by monitoring the diameter variation of the branch beam by adjusting the branch beam and the annular beam in equal ratio:
When the deviation between the diameter of the annular light beam and the diameter of the drilling hole exceeds +/-10%, adjusting the focus position of the annular light beam to ensure that the deviation is less than or equal to 10%;
step six: and limiting the moving distance of the annular beam focus to be smaller than the drilling depth according to the drilling depth until the stub is removed and the machining is completed.
Preferably, in the sixth step, the machining is completed after the focus adjustment is stopped and maintained for a period of time when the edge of the out-of-focus radiation area of the annular beam reaches the non-drillable layer.
The beneficial effects are that:
The laser processing system of the application processes redundant portions of the metal coating in a manner that the laser processing replaces mechanical drilling processing. And shaping the laser into an annular shape matched with the cross section shape of the metal coating by utilizing the plasticity characteristics of the laser, and forming a cylindrical removing area to axially remove the redundant metal coating along the drilling hole. When the annular laser reaches the non-drillable layer, the cylindrical removing area of the annular laser has better edge shaping effect compared with the inverted cone-shaped cutting area of drilling processing, namely, the annular laser can be closer to the non-drillable layer to remove redundant metal coating, so that the purpose of reducing stub and even completely cleaning the stub is realized. In particular, in order to overcome the technical barrier that the focus is difficult to control in laser processing, the processing system provides a focus dynamic adjusting function special for precisely removing the stub, and ensures the integrity of the non-drillable layer while removing the stub to the maximum extent, thereby greatly improving the performance of the printed circuit board for high-speed transmission.
The processing method of the application also provides a method for adaptively adjusting the focus of the annular light beam according to the thickness of the drilled holes and the metal coating in the drilled holes after the laser ablation continuously penetrates into the drilled holes, and the method can accurately control the focus position of the annular light beam, accurately ablate the stub, avoid damaging the hole wall of the drilled holes and the non-drillable layer, ensure the yield of the high-performance printed circuit board and spread the cost.
Drawings
Fig. 1 is a schematic view of a laser processing system according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of an annular beam of an embodiment of the present invention.
Fig. 3 is a front view of an annular beam of an embodiment of the present invention.
FIG. 4 is a schematic illustration of an annular beam focus tooling hole wall metallization according to an embodiment of the present invention.
FIG. 5 is a schematic illustration of annular beam defocusing process of hole wall metallization in accordance with an embodiment of the present invention.
Detailed Description
In order to further describe the technical means and effects adopted by the invention for achieving the preset aim, the following detailed description is given below of the specific implementation, structure, characteristics and effects according to the invention with reference to the attached drawings and the preferred embodiment.
Example 1
As shown in fig. 1, the embodiment discloses a laser processing system, which comprises a laser generating module, a beam diameter and divergence angle dynamic control module, an annular beam dynamic focusing module and a focus three-dimensional offset module. The laser generating module generates laser beams which are refracted and/or reflected by the multiple mirror structures and are projected on the surface of the printed circuit board to form light spots, and the route of the laser beams is a laser path. Since each module is used for adjusting the laser beam, the installation position of each module is based on the laser beam that can be adjusted onto the laser path. In order to eliminate the effect of each module on the laser beam, the new state of the same laser beam output after being processed by each module is named in a segmentation way. The processing flow of the laser processing system is as follows:
The laser beam generated by the laser generating module is named as an initial beam, and the initial beam enters the beam diameter and divergence angle dynamic control module and is subjected to primary modification treatment. The diameter of the light beam is changed by adjusting the divergence angle, so that the diameter of the light beam is the same as the outer edge diameter of the metal coating or the diameter of a drilled hole, and the initial light beam output after the outer contour modification is finished is named as an adjustment light beam. The adjusting light beam enters the annular light beam dynamic focusing module, and is shaped and adjusted again, so that the light beam projected to be circular is shaped into the annular light beam projected to be circular, and the annular light beam is output. The projection of the annular light beam is completely the same as the section of the metal coating on the wall of the drilling hole, so that the annular light beam covers the section of the metal coating to ablate and remove materials, and further the problem that the wall of the drilling hole is damaged or the metal coating is not left thoroughly is avoided. In addition, the annular beam dynamic focusing module can also reflect an annular beam to form a branch beam, the branch beam is projected onto corresponding monitoring equipment, and the diameter and laser energy change of the branch beam can be correspondingly converted into the diameter and laser energy change of the annular beam in the metal coating removal process through monitoring. When the diameter of the branch beam and/or the laser energy change monitored in real time exceeds a preset range, the current focus of the annular beam is judged to need to be adjusted, and a feedback adjustment mechanism is established by the monitoring means. The three-dimensional offset module performs actions to operate the annular beam dynamic focusing module for adjustment. The system solves the problems that the annular beam is positioned in the drilling hole and is difficult to observe, and the focus position cannot be adjusted in time through the branch beam. A technical idea of enabling the ring laser to remove the stub is implemented.
The beam diameter and divergence angle dynamic control module is used as a key module for realizing shaping of the outer profile of the laser beam, and is composed of a beam expander group and a beam expander switcher. The beam expander group comprises a plurality of beam expanders with different beam expander multiplying power, and each beam expander is placed on the laser path to refract the laser beam. And obtaining the diameter of the drilled hole or taking the diameter data of the outer edge of the metal coating as a target diameter value, selecting a beam expander with a proper multiplying power according to the multiplying power ratio of the diameter value of the initial beam to the target diameter value, and placing the selected beam expander on a laser path by a beam expander switcher to fulfill the aim of outputting an adjustment beam by adjusting the diameter of the beam expansion of the initial beam.
The structure for realizing secondary shaping laser beam in the annular beam dynamic focusing module comprises a telecentric focusing field lens, an annular beam shaper set and a lens set switcher. The annular beam shaper group is also composed of annular beam shapers with various sizes, and the annular beam shaper group is called by the lens group switcher to modify the circular projection of the adjustment beam into a circular shape, as shown in fig. 2, so as to output an annular beam. Focusing arrangement is carried out through a telecentric focusing field lens, as shown in fig. 3, the energy of the annular light beam is focused at a focus point, and the cleaning effect of laser on the metal coating is enhanced. Wherein the telecentric focusing field lens adjusts the focal position of the annular beam along the axial direction of the laser path by changing the distance between the telecentric focusing field lens and the annular beam shaper. The annular light beam after shaping output can be used as a laser beam for removing redundant parts of the metal coating.
The structure for realizing the separation of the branched beam in the annular beam dynamic focusing module comprises a spectroscope and an energy distribution detector. The beam splitter is arranged on the laser path and can transmit one part of the annular light beam, and the other part of the annular light beam is refracted out of the original laser path at a specific angle to generate a branch light path. In this embodiment, the energy and diameter of the annular beam transmitted by the beam splitter are equal to those of the branch beam refracted out, and the energy and diameter states of the annular beam in the borehole can be obtained by actually measuring the laser energy and diameter of the branch beam by projecting the branch beam on the receiving end of the energy distribution detector.
Based on the above embodiment, in order to realize the distance between the telecentric focusing field lens and the annular beam shaper, the focus three-dimensional offset module comprises a scanning galvanometer and a three-dimensional motion guide rail, the scanning galvanometer is a high-precision sub-controller widely applied to a laser processing control system, after the scanning galvanometer acquires the branched beam data transmitted by the energy distribution detector, the focus three-dimensional offset module is used as a center of feedback response to control the telecentric focusing field lens and the annular beam shaper which are arranged on the three-dimensional motion guide rail to move relatively, and the distance between the focus three-dimensional focusing field lens and the annular beam shaper is finely adjusted so as to achieve the purpose of changing the focus position.
Based on the above embodiment, in order to adjust the collimation of the initial beam, a beam collimation module is further provided, and the beam collimation module is disposed on a laser path between the laser generation module and the beam diameter and divergence angle dynamic control module, and transmits the laser line generated by the laser generation module to the beam diameter and divergence angle dynamic control module after collimation.
Since the laser processing system in the above embodiment requires a plurality of modules to cooperate to perform better functions, in order to reduce operation difficulty and improve system reliability, in one embodiment, a control center is added to the processing system as a central point of integrated control. All the modules are connected to a control center to realize data interconnection, and the control center integrally sends an instruction to coordinate the coordination of all the modules.
In a normal state, if the energy intensity of the laser beam is adjusted, the energy of the focus of the annular light beam is close to the energy required for ablating the metal coating, and the focus of the annular light beam can reach the surface of the non-drillable layer by precisely controlling the focus movement without causing damage of the non-drillable layer, so that the effect of completely removing the stub is realized. However, the ideal process mode has the problems that the ablation speed is slow and the efficiency is extremely low if the energy difference value is too small. For throughput and cost, higher energy laser beams have to be used for processing, which results in an out-of-focus radiation zone around the focal area of the ring beam that is of sufficient energy to ablate the non-drillable layer of the stub. In order to avoid damaging the non-drillable layer, a distance between the annular beam focus and the non-drillable layer needs to be reserved so that the defocused radiation area is not contacted with the non-drillable layer, and the section of stub is ablated and removed by the defocused radiation area.
Example 2
The embodiment discloses a hole wall metal coating laser processing method, which is matched with the laser processing system of the embodiment 1, and comprises the following steps:
Step one: measuring the position coordinates, diameter and depth of the drill hole, detecting the thickness of the metal coating, and inputting the data into a control center;
step two: after the preparation work is finished, the control center starts the laser generating module to generate an initial beam, and adjusts a laser path according to the position coordinates of the drilling hole, so that the spot projected on the printed circuit board by the initial beam covers the drilling hole;
Step three: firstly, adjusting the collimation degree of the initial beam, then adjusting the divergence angle of the initial beam, and outputting a controlled laser beam matched with the diameter of the drilled hole, namely, adjusting the beam;
Step four: performing secondary shaping on the adjustment beam according to the thickness of the metal coating, and outputting an annular beam;
step five: extracting a part of the annular beam to form a branch beam, and carrying out laser energy monitoring on the branch beam, wherein the monitoring branch beam laser energy is converted into the monitoring annular beam laser energy by means of adjusting the branch beam and the annular beam in an equal ratio:
When the laser energy of the annular beam is lower than 90% of the calibration energy, adjusting the focal position of the annular beam to enable the laser energy of the annular beam to occupy the percentage of the calibration energy to be between 90% and 100%;
and/or, synchronously monitoring the diameter of the annular beam by monitoring the diameter variation of the branch beam by adjusting the branch beam and the annular beam in equal ratio:
When the deviation between the diameter of the annular light beam and the diameter of the drilling hole exceeds +/-10%, adjusting the focus position of the annular light beam to ensure that the deviation is less than or equal to 10%;
step six: according to the depth of the drilled hole, a schematic diagram of machining the hole wall metal plating layer by using the annular beam focus is shown in fig. 4, and the moving distance of the annular beam focus is limited to be smaller than the depth of the drilled hole until the stub is removed and the machining is completed.
It should be noted that in step six, in order to increase the overall efficiency and increase the laser energy, as shown in fig. 5, it is necessary to use the defocused radiation area of the annular beam to ablate the stub near the last part of the non-drillable layer, and the defocused radiation area has lower energy than the focal area, so that the focal point is stopped to be adjusted and kept for a period of time when the edge of the defocused radiation area reaches the non-drillable layer, so that the defocused radiation area has enough time to ablate the stub. Specifically, when the focal distance of the annular light beam is controlled to be equal to the focal depth of the annular light beam, the focal point of the annular light beam stops moving, so that the residual metal coating can be removed just in the out-of-focus range of the annular light beam, the non-drillable layer is not damaged, and the accuracy of removing the stub by the laser is improved.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The laser processing system is characterized by comprising a laser generation module, a beam diameter and divergence angle dynamic control module, an annular beam dynamic focusing module and a focus three-dimensional offset module which are arranged on the same laser path;
the laser generation module generates an initial beam;
the beam diameter and divergence angle dynamic control module is used for adjusting the diameter and divergence angle of the initial beam to form an adjusted beam with the same diameter as the metal coating;
The annular beam dynamic focusing module shapes the adjusting beam into an annular beam matched with the cross section shape of the metal coating, refracts a branch beam, and acquires the laser energy and the beam diameter dynamic of the annular beam by monitoring the laser energy and the beam diameter of the branch beam;
The annular light beam dynamic focusing module comprises a telecentric focusing field lens, an annular light beam shaper set and a lens set switcher, wherein the lens set switcher switches the annular light beam shaper to output annular light beams with different diameters, and the telecentric focusing field lens further shapes and focuses the annular light beams;
The focus three-dimensional offset module dynamically adjusts the focus of the annular light beam according to the laser energy and the beam diameter of the annular light beam.
2. The laser processing system according to claim 1, wherein the beam diameter and divergence angle dynamic control module comprises a beam expander group and a beam expander switch, which are arranged on the optical path, wherein the beam expander group is composed of beam expanders with various beam expander ratios, and the beam expander switch outputs the adjustment beams with different diameters by switching the beam expanders with different beam expander ratios.
3. The laser processing system of claim 2, wherein the ring beam dynamic focusing module further comprises a beam splitter and an energy distribution detector, the energy distribution detector being disposed laterally of the laser path, the beam splitter being disposed in the laser path and refracting a portion of the ring beam to form a branch beam for projection onto a receiving end of the energy distribution detector, the energy distribution detector dynamically monitoring the laser energy of the ring beam.
4. A laser machining system according to claim 3 wherein the focus three-dimensional offset module comprises a scanning galvanometer and a three-dimensional motion rail, the telecentric focus lens and the annular beam shaper are both slidably mounted to the three-dimensional motion rail, the scanning galvanometer is in data communication with the energy distribution detector, and the distance between the telecentric focus lens and the annular beam shaper is controlled to adjust the focus position of the annular beam.
5. The laser processing system of claim 1, further comprising a beam collimation module disposed in the laser path between the laser generating module and the beam diameter and divergence angle dynamic control module for adjusting the collimation of the initial beam.
6. The laser processing system of claim 1, further comprising a control center, wherein the laser generation module, the beam diameter and divergence angle dynamic control module, the annular beam dynamic focusing module, and the focus three-dimensional offset module are respectively in communication with the control center, and wherein the control center is provided with laser parameters and printed circuit board processing parameters to cooperatively control the operation of the modules.
7. The laser processing system of claim 6, wherein the control center has pre-stored non-drillable layer depth coordinate data, and wherein the control center instructs the annular beam dynamic focusing module and the focal point three-dimensional shifting module to adjust a minimum distance between a focal point of the annular beam and the non-drillable layer to be greater than a maximum radius of the annular beam out-of-focus radiation area.
8. A method of laser machining a metal coating on a hole wall, matching a laser machining system as claimed in any one of claims 1 to 7, further comprising the steps of:
step one: measuring the position coordinates, diameter and depth of the drilled holes, and detecting the thickness of the metal coating;
Step two: starting a laser generator to generate an initial beam, and adjusting a laser path according to the position coordinates of the drilling hole so that a light spot projected on the printed circuit board by the initial beam covers the drilling hole;
step three: adjusting the diameter and the divergence angle of the initial beam, and outputting a controlled laser beam matched with the diameter of the drilling hole, namely adjusting the beam;
Step four: performing secondary shaping on the adjustment beam according to the thickness of the metal coating, and outputting an annular beam;
step five: extracting a part of the annular beam to form a branch beam, and carrying out laser energy monitoring on the branch beam, wherein the monitoring branch beam laser energy is converted into the monitoring annular beam laser energy by means of adjusting the branch beam and the annular beam in an equal ratio:
When the laser energy of the annular beam is lower than 90% of the calibration energy, adjusting the focal position of the annular beam to enable the laser energy of the annular beam to occupy the percentage of the calibration energy to be between 90% and 100%;
and/or, synchronously monitoring the diameter of the annular beam by monitoring the diameter variation of the branch beam by adjusting the branch beam and the annular beam in equal ratio:
When the deviation between the diameter of the annular light beam and the diameter of the drilling hole exceeds +/-10%, adjusting the focus position of the annular light beam to ensure that the deviation is less than or equal to 10%;
step six: and limiting the moving distance of the annular beam focus to be smaller than the drilling depth according to the drilling depth until the stub is removed and the machining is completed.
9. The method of claim 8, wherein in step six, the machining is completed after stopping the focus adjustment and maintaining for a period of time when the edge of the defocused radiation area of the annular beam reaches the non-drillable layer.
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| CN113916891A (en) * | 2021-09-24 | 2022-01-11 | 哈尔滨工业大学 | Dark field confocal Brillouin microscopic measurement device and method based on optical fiber annular light beam |
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| KR20130030682A (en) * | 2011-09-19 | 2013-03-27 | 삼성전기주식회사 | Laser processing device |
| CN213969513U (en) * | 2020-10-19 | 2021-08-17 | 旭臻科技有限公司 | System for applying nanosecond pulse laser to strip epitaxial chip |
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| CN113916891A (en) * | 2021-09-24 | 2022-01-11 | 哈尔滨工业大学 | Dark field confocal Brillouin microscopic measurement device and method based on optical fiber annular light beam |
| CN113960010A (en) * | 2021-09-24 | 2022-01-21 | 江苏锐精光电研究院有限公司 | Dark field confocal Raman polarization spectrum measuring device and method based on vortex light beams |
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