CN118057602A - Component assembly for a power electronic device and method for providing a component assembly for a power electronic device - Google Patents

Abstract

The invention relates to a component assembly (1) for a power electronic device, comprising a power module (2), a control circuit carrier (3) separated therefrom, and a flat embedded frame (4) with a recess and/or a recess (5), wherein the embedded frame (4) is arranged between the control circuit carrier (3) and the power module (2), and wherein an electrical connection (6, 7) between the power module (2) and the control circuit carrier (3) is formed via the embedded frame (4), wherein for this purpose the electrical connection (6) between the power module (2) and the embedded frame (4) is formed or can be formed through the recess and/or the recess (5) by means of a bonding connection (8), and the electrical connection (7) between the embedded frame (4) and the control circuit carrier (3) is formed or can be formed by means of crimping pins (9). The invention also relates to a method for providing a component assembly (1) for a power electronic device.

Description

Component assembly for power electronic device and method for providing a component assembly for power electronic device

Technical Field

The invention relates to a component assembly for a power electronics device and a method for providing a component assembly for a power electronics device.

Background technique

Power modules are used in power electronics. Currently, these power modules are electrically connected directly to a control circuit carrier (control circuit board) by means of press-fit pins, solder pins, plug contacts or screw contacts and are in particular plugged onto the control circuit carrier. In pulse-controlled inverters, the power modules are usually connected via press-fit pins.

During the development phase of the power module, the interface of the power module to the control electronics carrier must be determined at a very early stage, since the power modules usually have long mold production and demoulding times, which dominate the development time of the pulse-controlled inverter. As a result, the power module already sets the spatial layout and design of the power electronics, in particular the pulse-controlled inverter, at an early stage of development, and this limits flexibility.

Summary of the invention

The object of the present invention is to specify a solution to the above-mentioned problem, wherein the solution is intended to achieve greater flexibility, in particular during the development phase of a power electronics device.

According to the invention, this object is achieved by the component assembly according to the invention and the method according to the invention.

In particular, a component assembly for a power electronic device is created, which includes a power module, a control circuit carrier separated therefrom, and a flat embedded frame with recesses and/or recesses, wherein the embedded frame is arranged between the control circuit carrier and the power module, and wherein the electrical connection between the power module and the control circuit carrier is constructed through the embedded frame, wherein for this purpose, the electrical connection between the power module and the embedded frame is constructed or can be constructed by means of a bonding connection through the recess and/or recess, and the electrical connection between the embedded frame and the control circuit carrier is constructed or can be constructed by means of crimping pins.

In addition, in particular, a method for providing a component assembly for a power electronic device is provided, wherein a power module, a control circuit carrier separated therefrom, and a surface-type embedded frame with recesses and/or recesses are arranged on one another in a preset manner and a preset order and are electrically connected to one another, wherein for this purpose the embedded frame is arranged between the power module and the control circuit carrier, and wherein the electrical connection between the power module and the control circuit carrier is constructed via the embedded frame, wherein for this purpose the electrical connection between the power module and the embedded frame is constructed by means of a bonding connection through the recesses and/or recesses, and the electrical connection between the embedded frame and the control circuit carrier is constructed by means of crimping pins.

The component assembly and the method achieve: the design of the electrical interfaces and/or connections of the power module and the control circuit carrier (which can also be called a control circuit board) are decoupled from each other during the development process. To this end, the following embedded frame is created, via which the electrical connection between the power module and the control circuit carrier is constructed. In particular, it is provided that the electrical connection between at least one power module and the control circuit carrier is constructed only via the embedded frame. In particular, the power module is not directly (i.e. not in a direct path) electrically connected or connected to the control circuit carrier. The electrical connection between the power module and the embedded frame is constructed or constructed by means of a bonding connection through a recess and/or recess provided for this purpose. The electrical connection between the control circuit carrier and the embedded frame is constructed or constructed by means of crimping pins.

One advantage of the component assembly and the method is that the development process, in particular the development process of the power module, can be designed more flexibly because the interface between the power module and the control circuit carrier can also be changed at a later point in time by adapting the embedded frame in a less complex manner. This saves time and cost and achieves flexibility. In addition, the electrical connection between the power module and the control circuit carrier can be designed more flexibly in terms of interconnection and/or spatial arrangement. In particular, the electrical connection can also be constructed on multiple planes by relaying via the embedded frame and/or the embedded frame can electrically connect two planes to each other.

In particular, it is provided that when the embedded frame (together with the crimping pins) is arranged in the housing, the crimping pins are already pressed into the embedded frame and/or connected to the embedded frame. Therefore, the crimping pins can be pressed into the embedded frame or connected to the embedded frame before the embedded frame is arranged in the housing. Thus, when pressing the crimping pins into and/or connecting them to the embedded frame, a suitable tool can be used, in particular from the opposite side (usually from the bottom), in order to prevent the crimping pins from bending when pressed into/connected to the embedded frame.

It can be provided that the power module is surrounded by a molding compound after being arranged in the housing and after the embedded frame and the control circuit carrier are arranged. This can be done in particular before the electrical connection between the control circuit carrier and the embedded frame is formed by means of crimping pins. In addition, the crimping pins can also be surrounded by the molding compound so that they are rigidly fixed when connected to the control circuit carrier (i.e. when pressed in).

In particular, the power module and the circuit carrier layer are separate (ie, separate from one another) components. In particular, the power module and the circuit carrier layer are not in (direct) mechanical contact with one another.

In particular, the power module is a power component of a converter, in particular a pulse-controlled inverter. In particular, the power module comprises a half-bridge circuit, which is in particular arranged and in particular molded on a ceramic substrate.

In principle, the component assembly can include a plurality of such power modules, in particular three such power modules. For example, these plurality of power modules can be arranged or arranged on a (common) heat sink.

In this case, a plurality of power modules can also be connected to the control circuit carrier via a (common) embedded frame. In this case, the procedure and arrangement are similar to the procedure and arrangement as described in the present disclosure for a single power module.

The embedded frame is in particular a connection plane and/or a connection layer. For example, the embedded frame can be constructed of plastic and/or composite materials (such as FR4) and/or ceramics, or include these materials. For example, the embedded frame can be made of a flat raw material by stamping. The embedded frame has a shape that is adapted to the corresponding combination consisting of a power module and a control circuit carrier. In particular, the recess and/or recess is adapted to the position of the electrical contacts of the power module and the control circuit carrier. In particular, the embedded frame includes a conductor line adapted to the corresponding combination consisting of the power module and the control circuit carrier, and the conductor line connects the electrical contacts on the embedded frame for connecting to the power module with the electrical contacts on the embedded frame for connecting to the control circuit carrier. In particular, the electrical conductor line follows an interconnection diagram preset based on the combination.

The control circuit carrier is in particular a control circuit board, in particular a control circuit board for a converter, in particular a pulse-controlled inverter. In particular, the control circuit carrier comprises components for controlling and monitoring one or more power modules and/or converters, in particular pulse-controlled inverters. For example, the control circuit carrier may comprise at least one of the following components: a microcontroller, a gate driver, an ASIC and/or a communication interface (such as a CAN).

In the case of a gate path, the electrical connection is designed in particular for a current intensity in the range of up to 1 A, in particular up to 10 A, further in particular up to 20 A. In the case of a source path or a drain path, the electrical connection is designed in particular for a current intensity in the range of μA to mA.

The bond is in particular designed as a thick wire bond (wire thickness in the range of 125 μm). The bond can in particular be designed as a double pin bond, a thick wire bond, an aluminum copper bond, an aluminum bond and/or an aluminum gold bond.

In particular, the power module has dimensions in the centimeter range, in particular in the range of several centimeters, for example with the width and length of the side being between 3 cm and 15 cm each, for example 5×4 cm ² . However, depending on the current requirement, these values can in principle also be larger or smaller.

In one embodiment, it is provided that a spacing pin (which can also be referred to as a support) is constructed at the embedded frame and/or at the power module, and the embedded frame is arranged or can be arranged at the power module using and/or with the aid of the spacing pin. As a result, a predetermined distance between the embedded frame and the power module can be maintained in a simple manner, and other undesirable mechanical and electrical contacts between the power module and the embedded frame can be prevented. In particular, the spacing pin is constructed of a non-conductive material.

In one embodiment, it is provided that the component assembly has a housing, wherein at least the power module and the embedded frame are arranged or are arranged in the housing. As a result, the component assembly can be protected from external influences.

In one embodiment, it is provided that the embedded frame has at least one carrier element, by means of which the embedded frame is arranged, in particular anchored and/or fixed, on the housing.

In one embodiment, it is provided that at least one carrier element comprises at least one laterally protruding carrier tongue (which can also be referred to as a tab) or is designed as such a carrier tongue. This makes it possible in particular to engage the laterally protruding tongue on and/or in a recess and/or step of the housing provided for this purpose, so that the embedded frame is kept at a predetermined distance from the power module.

In one embodiment, it is provided that at least one carrier element has a carrier frame which surrounds the outer edge of the embedded frame, or that such a carrier frame is formed, wherein the surrounding carrier frame is placed or can be placed on a step formed in and/or on the housing. This makes it possible to provide a particularly stable arrangement of the embedded frame on the housing.

In one embodiment, it is provided that at least one intermediate space between the power module and the embedded frame is filled with a molding compound. This can protect the bonded connection from mechanical influences in particular. It is also possible that the embedded frame is also completely surrounded or surrounded by the molding compound. In this case, the housing surrounds the embedded frame in such a way that the embedded frame can be completely accommodated by the molding compound.

In one embodiment, it is provided that the embedded frame has at least one active or passive electrical component. As a result, additional electrical functions in the form of circuits can also be provided by means of the embedded frame.

In one embodiment of the method, it is provided in particular that providing the component assembly comprises the following sequence:

- arranging the power module in the housing,

- arranging the embedded frame in the housing at or above the power module,

- forming an electrical connection between the power module and the embedded frame by means of a bonded connection through the cutouts and/or recesses at the contact points provided for this purpose,

- arranging the control circuit carrier on or above the embedded frame,

The electrical connection between the control circuit carrier and the embedded frame is produced by means of crimp pins.

Furthermore, in particular, a vehicle is also provided, which comprises at least one component assembly according to one of the embodiments. The vehicle is in particular a motor vehicle. However, the vehicle can also be another land vehicle, a rail vehicle, a water vehicle, an air vehicle or a space vehicle, for example an air taxi or a drone.

Further features of the configuration of the method are apparent from the description of the configuration of the component assembly. The advantages of the method are in each case the same advantages as in the configuration of the component assembly.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be explained in more detail below with reference to the accompanying drawings based on preferred embodiments.

FIG. 1 shows a schematic diagram (side view) of an embodiment of a component assembly;

FIG. 2 shows a schematic diagram (top view) of this embodiment of the component assembly;

FIG3 shows a schematic diagram (top view) of another embodiment of the component assembly;

FIG. 4 shows a schematic flow chart of an embodiment of a method for providing a component assembly for a power electronics device.

Detailed ways

1 shows a schematic diagram of an embodiment of a component assembly 1 for power electronics as a side view. The component assembly 1 is arranged, for example, in a vehicle, in particular a motor vehicle. For example, the component assembly 1 is part of the power electronics of a pulse-controlled inverter.

The component assembly 1 comprises a power module 2, a control circuit carrier 3 separated therefrom and a flat embedded frame 4 with recesses and/or recesses 5 (FIG. 2). The embedded frame 4 is arranged between the control circuit carrier 3 and the power module 2. For the sake of clarification, FIG. 2 shows a schematic diagram of this embodiment in a top view without the control circuit carrier 3.

The electrical connections 6, 7 between the power module 2 and the control circuit carrier 3 are formed via the embedded frame 4. For this purpose, it is provided that the electrical connection 6 between the power module 2 and the embedded frame 4 is formed through the recess and/or the recess 5 by means of a bonding connection 8. The bonding connection 8 is especially formed between the contact pads provided for this purpose. The electrical connection 7 between the embedded frame 4 and the control circuit carrier 3 is formed by means of a crimping pin 9. On the embedded frame 4, the crimping pin 9 is especially electrically connected to a contact pad provided for contacting the power module 2 via a conductor line.

It can be provided that spacer pins 10 are formed on the embedded frame 4 and/or on the power module 2, with which the embedded frame 4 is arranged or can be arranged on the power module 2 and/or by means of which the spacer pins 10 are formed, in particular, from a non-conductive material.

It can be provided that the component assembly 1 has a housing 11, wherein at least the power module 2 and the embedded frame 4 are arranged in the housing 11. FIG. 1 shows an embodiment in which only the power module 2 and the embedded frame 4 are arranged in the housing 11. In principle, however, the control circuit carrier 3 can also be arranged in the housing 11.

In a further development, it can be provided that the embedded frame 4 has at least one carrier element 12 ( FIG. 2 ), by means of which the embedded frame 4 is arranged on the housing 11 .

In particular, it can be provided that at least one carrier element 12 comprises at least one laterally protruding carrier tongue 13 or is designed as such a carrier tongue as schematically shown in Figure 2. The carrier tongue 13 is placed in particular in a stepped groove 14 of the housing 11 provided for this purpose and thereby fixes the embedded frame 4 in place.

FIG. 3 shows a schematic diagram of another embodiment of the component assembly 1. This embodiment is designed in principle as in the embodiment shown in FIGS. 1 and 2; the same reference numerals represent the same features and terms. In this embodiment, it is provided that at least one carrier element 12 has a surrounding carrier frame 15 at the outer edge of the embedded frame 4, or that such a carrier frame is designed, wherein the surrounding carrier frame 15 is placed or can be placed on a surrounding step 16 formed in and/or on the housing 11.

It can be provided that at least one intermediate space between power module 2 and embedded frame 4 is filled with molding compound 17 ( FIG. 1 ). In the embodiment shown in FIG. 1 , the intermediate space between control circuit carrier 3 and embedded frame 4 is also additionally filled with molding compound 17 .

It can be provided that the embedded frame has at least one active or passive electrical component 18 ( FIGS. 1 and 2 ).

FIG. 4 shows a schematic flow chart of an embodiment of a method for providing a component assembly for a power electronics device.

In measure 100 , a power module is arranged in a housing.

In measure 101, the embedded frame is arranged in the housing at or above the power module. In this case, a plurality of carrier elements engage in recesses of the housing provided for this purpose, so that the embedded frame can be supported at a set distance above the power module. Additionally or alternatively, spacer pins can also be provided, by means of which the embedded frame is arranged at the power module.

In particular, it can be arranged that when the embedded frame (together with the crimping pins) is arranged in the housing, the crimping pins are already pressed into the embedded frame and/or connected to the embedded frame. Therefore, the crimping pins can be pressed into the embedded frame and/or connected to the embedded frame before the embedded frame is arranged in the housing.

In measure 102 , a bonding connection is formed between the power module and the embedded frame through a recess and/or a cutout of the embedded frame, wherein in particular corresponding contact pads are electrically connected to one another via bonding wires.

In measure 103, the control circuit carrier is arranged on or above the embedded frame, and an electrical connection is formed between the control circuit carrier and the embedded frame via crimping pins, in that the crimping pins are pressed into crimping holes provided for this purpose and anchored there, thereby forming the electrical connection.

It can be provided that the power module is surrounded by a molding compound after being arranged in the housing and after the embedded frame and the control circuit carrier are arranged. This can be done in particular before the electrical connection between the control circuit carrier and the embedded frame is formed by means of crimping pins. In addition, the crimping pins can also be molded so that they are rigidly fixed when connected (pressed into) to the control circuit carrier.

Reference numerals list

1. Components

2 Power Module

3. Control circuit carrier

4Embedded Framework

5 Recesses/Concave

6 Electrical connections

7 Electrical Connections

8 Bonding

9 Crimp Pins

10 Spacer Pins

11 Shell

12 Carrier elements

13 carrier tongue

14 grooves

15 Carrier Frame

16 Surrounding steps

17 Molding plastic

18Electrical structural components

100-103 Method Measures

Claims (10)

1. A component assembly (1) for a power electronic device, comprising

A power module (2),

A control circuit carrier (3) separate therefrom, and

A planar insert frame (4) with recesses and/or recesses (5),

Wherein the embedded frame (4) is arranged between the control circuit carrier (3) and the power module (2), and

Wherein the electrical connection (6, 7) between the power module (2) and the control circuit carrier (3) is formed via the embedded frame (4), wherein for this purpose the electrical connection (6) between the power module (2) and the embedded frame (4) is formed or can be formed by means of a bonding connection (8) through the recess and/or recess (5), and the electrical connection (7) between the embedded frame (4) and the control circuit carrier (3) is formed or can be formed by means of a crimp pin (9).

2. Component assembly (1) according to claim 1, characterized in that a spacer pin (10) is provided at the insert frame (4) and/or at the power module (2), with which spacer pin the insert frame (4) is arranged or arrangeable at the power module (2).

3. Component assembly (1) according to claim 1 or 2, characterized in that the component assembly (1) has a housing (11), wherein at least the power module (2) and the embedded frame (4) are arranged in the housing (11).

4. A component assembly (1) according to claim 3, characterized in that the embedded frame (4) has at least one carrier element (12), by means of which the embedded frame (4) is arranged at the housing (11).

5. Component assembly (1) according to claim 4, characterized in that the at least one carrier element (12) comprises or is configured as at least one laterally protruding carrier tongue (13).

6. Component assembly (1) according to claim 4 or 5, characterized in that the at least one carrier element (12) has a carrier frame (15) encircling at the outer edge of the embedded frame (4), or is constructed in that the encircling carrier frame (15) is placed or placeable on a step (16) constructed in and/or at the housing (11).

7. Component assembly (1) according to any of the preceding claims, characterized in that at least one intermediate space between the power module (2) and the embedded frame (4) is filled by means of a molding compound (17).

8. A method for providing a component assembly (1) for a power electronic device,

Wherein the power module (2), the control circuit carrier (3) separated therefrom and the planar embedded frame (4) with the recess and/or the recess (5) are arranged at each other in a predetermined manner and in a predetermined sequence and are electrically connected to each other,

Wherein for this purpose the embedded frame (4) is arranged between the power module (2) and the control circuit carrier (3), and

Wherein an electrical connection (6, 7) between the power module (2) and the control circuit carrier (3) is formed via the insert frame (4), wherein for this purpose an electrical connection (6) between the power module (2) and the insert frame (4) is formed by means of a bond connection (8) through the recess and/or recess (5), and an electrical connection (7) between the insert frame (4) and the control circuit carrier (3) is formed by means of a crimp pin (9).

9. Method according to claim 8, characterized in that at least the power module (2) and the embedded frame (4) are arranged in a housing (11).

10. The method according to claim 9, wherein providing the component assembly (1) comprises the following sequence:

-arranging the power module (2) in the housing (11),

-Arranging the embedded frame (4) in the housing (11) at or above the power module (2),

The electrical connection (6) between the power module (2) and the insert frame (4) is formed by means of a bonding connection (8) through the recess and/or recess (5) at the contact points provided for this purpose,

-Arranging the control circuit carrier (3) at or above the embedded frame (4),

-Constructing an electrical connection (7) between the control circuit carrier (3) and the embedded frame (4) by means of the crimp pin (9).