CN117984664A - ink cartridge - Google Patents
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- CN117984664A CN117984664A CN202310752829.6A CN202310752829A CN117984664A CN 117984664 A CN117984664 A CN 117984664A CN 202310752829 A CN202310752829 A CN 202310752829A CN 117984664 A CN117984664 A CN 117984664A
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- ink cartridge
- conductive
- chip
- grounding
- terminal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/1752—Mounting within the printer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17543—Cartridge presence detection or type identification
- B41J2/17546—Cartridge presence detection or type identification electronically
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- Ink Jet (AREA)
Abstract
本申请提供一种墨盒,涉及打印耗材技术领域,用于解决墨盒的芯片无法接地或接地不稳定的情况,从而影响芯片接地稳定性的技术问题,该墨盒可拆卸地安装于打印装置内,打印装置具有安装部包括容纳腔以及触针组件,接地部件位于触针组件所在位置之外的位置处,墨盒包括墨盒本体、芯片及导通构件,芯片设置于墨盒本体上,墨盒本体及芯片的至少一部分可位于容纳腔内,且芯片设置有通信端子组和接地端子,通信端子组与触针组件电连接;导通构件设置于装配仓内,导通构件配置为将接地端子和接地部件电连接,本申请提供的墨盒,其不仅用于向打印机提供墨水,而且还能够提升接地稳定性,提升芯片的安全性。
The present application provides an ink cartridge, which relates to the technical field of printing consumables, and is used to solve the technical problem that the chip of the ink cartridge cannot be grounded or the grounding is unstable, thereby affecting the grounding stability of the chip. The ink cartridge can be detachably installed in a printing device, and the printing device has an installation portion including a accommodating cavity and a contact pin assembly. The grounding component is located at a position outside the position of the contact pin assembly. The ink cartridge includes an ink cartridge body, a chip and a conductive component. The chip is arranged on the ink cartridge body, and the ink cartridge body and at least a part of the chip can be located in the accommodating cavity, and the chip is provided with a communication terminal group and a grounding terminal, and the communication terminal group is electrically connected to the contact pin assembly; the conductive component is arranged in an assembly bin, and the conductive component is configured to electrically connect the grounding terminal and the grounding component. The ink cartridge provided by the present application is not only used to provide ink to the printer, but also can improve the grounding stability and improve the safety of the chip.
Description
本申请要求于如下中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to the following Chinese patent application, the entire contents of which are incorporated herein by reference.
1、2022年11月04日提交中国专利局、申请号为202222944358.2、申请名称为“一种芯片及使用该芯片的耗材盒”;1. Submitted to the China Patent Office on November 4, 2022, application number 202222944358.2, application name "A chip and consumable box using the chip";
2、2022年12月28日提交中国专利局、申请号为202223590399.2、申请名称为“一种电连接组件及打印耗材”;2. Submitted to the China Patent Office on December 28, 2022, application number 202223590399.2, application name “An electrical connection component and printing consumables”;
3、2023年1月3日提交中国专利局、申请号为202320013888.7、申请名称为“一种耗材盒”;3. Submitted to the China Patent Office on January 3, 2023, application number 202320013888.7, application name “A consumable box”;
4、2023年1月5日提交中国专利局、申请号为202320023573.0、申请名称为“一种芯片及使用该芯片的耗材盒”;4. Submitted to the China Patent Office on January 5, 2023, application number 202320023573.0, application name “A chip and consumable box using the chip”;
5、2023年1月13日提交中国专利局、申请号为202320398789.5、申请名称为“一种耗材盒”;5. Submitted to the China Patent Office on January 13, 2023, application number 202320398789.5, application name “A consumable box”;
6、2023年1月19日提交中国专利局、申请号为202320433991.7、申请名称为“一种芯片及使用该芯片的耗材盒”;6. Submitted to the China Patent Office on January 19, 2023, application number 202320433991.7, application name “A chip and consumable box using the chip”;
7、2023年2月9日提交中国专利局、申请号为202320200880.1、申请名称为“一种芯片及使用该芯片的耗材盒”;7. Submitted to the China Patent Office on February 9, 2023, application number 202320200880.1, application name “A chip and consumable box using the chip”;
8、2023年2月9日提交中国专利局、申请号为202320200931.0、申请名称为“一种芯片及使用该芯片的耗材盒”;8. Submitted to the China Patent Office on February 9, 2023, application number 202320200931.0, application name “A chip and consumable box using the chip”;
9、2023年2月16日提交中国专利局、申请号为202320251503.0、申请名称为“一种芯片及使用该芯片的耗材盒”;9. Submitted to the China Patent Office on February 16, 2023, application number 202320251503.0, application name “A chip and consumable box using the chip”;
10、2023年2月27日提交中国专利局、申请号为202320331045.1、申请名称为“一种芯片及使用该芯片的耗材盒”。10. Submitted to the China Patent Office on February 27, 2023, application number 202320331045.1, and application name "A chip and a consumable box using the chip".
技术领域Technical Field
本申请涉及打印耗材技术领域,尤其涉及一种墨盒。The present application relates to the technical field of printing consumables, and in particular to an ink cartridge.
背景技术Background technique
图像形成设备是通过成像处理技术在介质上形成图像的设备,其包括打印装置以及多个墨盒,其中打印装置包括成像组件,墨盒通常可插装至打印装置内并能够向成像组件提供打印用的墨水。An image forming device is a device that forms an image on a medium through imaging processing technology, which includes a printing device and multiple ink cartridges, wherein the printing device includes an imaging component, and the ink cartridge can usually be inserted into the printing device and can provide ink for printing to the imaging component.
相关技术中墨盒包括墨盒本体以及芯片,其中芯片设置有端子组,墨盒通过端子组中的通信端子与打印装置的触针组件的相应触针接触,以实现打印装置与墨盒的电连接;以及,通过端子组中的接地子端子与相应的接地触针接触,以使芯片接地,进而与打印装置之间传输接地信号,防止电流过大而损坏芯片及打印装置。In the related technology, the ink cartridge includes an ink cartridge body and a chip, wherein the chip is provided with a terminal group, and the ink cartridge contacts the corresponding contact pin of the contact pin assembly of the printing device through the communication terminal in the terminal group to realize the electrical connection between the printing device and the ink cartridge; and, the grounding sub-terminal in the terminal group contacts the corresponding grounding contact pin to ground the chip, thereby transmitting the grounding signal between the chip and the printing device to prevent excessive current from damaging the chip and the printing device.
然而,上述接地端子与接地触针接触不稳定,存在芯片无法接地或接地不稳定的情况,影响芯片接地稳定性以及使用安全性,也可能导致打印装置无法正常识别墨盒。However, the contact between the ground terminal and the ground pin is unstable, and there is a situation where the chip cannot be grounded or the grounding is unstable, which affects the grounding stability and safety of the chip and may also cause the printing device to be unable to normally identify the ink cartridge.
发明内容Summary of the invention
鉴于上述问题,本申请实施例提供一种墨盒,能够提升芯片接地稳定性以及使用安全性。In view of the above problems, an embodiment of the present application provides an ink cartridge that can improve the grounding stability and usage safety of the chip.
为了实现上述目的,本申请实施例提供如下技术方案:In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:
本申请实施例提供了一种墨盒,其可拆卸地安装于打印装置内,所述打印装置具有装配仓以及设置于所述装配仓内的安装部、接地部件,所述安装部包括容纳腔以及触针组件,所述接地部件位于所述触针组件所在位置之外的位置处;所述墨盒包括墨盒本体、芯片及导通构件,所述芯片设置于所述墨盒本体上,所述墨盒本体及所述芯片的至少一部分可位于所述容纳腔内,且所述芯片设置有通信端子组和接地端子,所述通信端子组与所述触针组件电连接;所述导通构件设置于所述装配仓内,所述导通构件配置为用于将所述接地端子和所述接地部件电连接。An embodiment of the present application provides an ink cartridge, which can be detachably installed in a printing device, wherein the printing device has an assembly bin and a mounting portion and a grounding component arranged in the assembly bin, wherein the mounting portion includes a accommodating cavity and a contact pin assembly, and the grounding component is located at a position other than the position of the contact pin assembly; the ink cartridge includes an ink cartridge body, a chip and a conducting component, wherein the chip is arranged on the ink cartridge body, wherein the ink cartridge body and at least a portion of the chip can be located in the accommodating cavity, and the chip is provided with a communication terminal group and a grounding terminal, wherein the communication terminal group is electrically connected to the contact pin assembly; the conducting component is arranged in the assembly bin, and the conducting component is configured to electrically connect the grounding terminal and the grounding component.
与相关技术相比,本申请实施例提供的墨盒,具有以下优点:Compared with the related art, the ink cartridge provided in the embodiment of the present application has the following advantages:
本申请实施例提供的墨盒,其包括导通构件以及芯片,且芯片的接地端子与导通构件电连接,以及通过导通构件与位于打印装置的装配仓内接地部件电连接。如此设置,可使墨盒插装于打印装置内时,芯片通过其接地端子、导通构件与接地部件电连接,以使芯片接地,进而芯片接收、传输接地信号。The ink cartridge provided in the embodiment of the present application includes a conductive component and a chip, and the ground terminal of the chip is electrically connected to the conductive component, and is electrically connected to a ground component located in an assembly bin of a printing device through the conductive component. In this way, when the ink cartridge is inserted into the printing device, the chip is electrically connected to the ground component through its ground terminal and the conductive component, so that the chip is grounded, and then the chip receives and transmits a ground signal.
与相关技术中芯片的接地端子与触针组件中相应的接地触针电连接的方案相比,本申请实施例中的墨盒通过导通构件将芯片的接地端子与接地部件连接,可避免接地端子与接地触针接触不稳定,而导致芯片无法接地或接地不稳定的情况的出现,因此可提升芯片接地的可靠性,防止电流过大而损坏芯片及打印装置,提升芯片及打印装置的使用安全性。Compared with the solution in the related art in which the ground terminal of the chip is electrically connected to the corresponding ground contact pin in the contact pin assembly, the ink cartridge in the embodiment of the present application connects the ground terminal of the chip to the ground component through a conductive component, which can avoid unstable contact between the ground terminal and the ground contact pin, resulting in the chip being unable to be grounded or unstable in grounding. Therefore, the reliability of the chip grounding can be improved, the chip and the printing device can be prevented from being damaged by excessive current, and the safety of the chip and the printing device can be improved.
在一种可能的实现方式中,所述安装部固定在所述装配仓内,且所述接地部件设置于所述容纳腔内。In a possible implementation, the mounting portion is fixed in the assembly bin, and the grounding component is disposed in the accommodating cavity.
在一种可能的实现方式中,所述容纳腔的至少部分腔壁配置成所述接地部件,所述接地部件与所述导通构件的电连接位置位于所述芯片的上方。In a possible implementation manner, at least a portion of the cavity wall of the accommodating cavity is configured as the grounding component, and the electrical connection position between the grounding component and the conducting member is located above the chip.
在一种可能的实现方式中,所述导通构件包括第一导电片和第一导电传输介质体;所述墨盒本体包括储墨部,所述储墨部具有由膜层结构围成的容墨腔;所述膜层结构包括由外及内依次层叠设置的绝缘外膜、导电中间膜以及绝缘内膜;所述导电中间膜配置成所述第一导电传输介质体,且至少部分所述导电中间膜用于将所述第一导电片与所述接地部件电连接。In one possible implementation, the conductive component includes a first conductive sheet and a first conductive transmission medium; the ink cartridge body includes an ink storage portion, the ink storage portion has an ink holding cavity surrounded by a film layer structure; the film layer structure includes an insulating outer film, a conductive intermediate film, and an insulating inner film stacked in sequence from the outside to the inside; the conductive intermediate film is configured as the first conductive transmission medium, and at least a portion of the conductive intermediate film is used to electrically connect the first conductive sheet to the grounding component.
在一种可能的实现方式中,所述绝缘外膜包括第一镂空部和第二镂空部,暴露于所述第一镂空部内的部分所述导电中间膜形成第一电连接部,暴露于所述第二镂空部内的部分所述导电中间膜形成第二电连接部;所述第一电连接部与所述第一导电片的一端电连接,所述第一导电片的另一端与所述接地端子电连接;所述第二电连接部与所述接地部件电连接。In a possible implementation, the insulating outer film includes a first hollow portion and a second hollow portion, the portion of the conductive intermediate film exposed in the first hollow portion forms a first electrical connection portion, and the portion of the conductive intermediate film exposed in the second hollow portion forms a second electrical connection portion; the first electrical connection portion is electrically connected to one end of the first conductive sheet, and the other end of the first conductive sheet is electrically connected to the ground terminal; the second electrical connection portion is electrically connected to the grounding component.
在一种可能的实现方式中,所述导通构件包括第一导电片,所述容纳腔内设置导电摆杆,所述导电摆杆位于所述墨盒本体的底部,并能够对所述墨盒本体进行限位;所述导电摆杆配置成所述接地部件,所述导电摆杆与所述第一导电片电连接,且所述导电摆杆与所述第一导电片的电连接位置位于所述芯片的下方。In a possible implementation, the conductive component includes a first conductive sheet, a conductive rocker arm is arranged in the accommodating cavity, the conductive rocker arm is located at the bottom of the ink cartridge body, and can limit the ink cartridge body; the conductive rocker arm is configured as the grounding component, the conductive rocker arm is electrically connected to the first conductive sheet, and the electrical connection position between the conductive rocker arm and the first conductive sheet is located below the chip.
在一种可能的实现方式中,所述安装部可活动地安装在所述装配仓内;所述接地部件设置于所述安装部外,部分所述导通构件设置于所述容纳腔内,并与所述接地端子电连接,部分所述导通构件设置于所述安装部外,并与所述接地部件电连接。In a possible implementation, the mounting portion can be movably mounted in the assembly bin; the grounding component is arranged outside the mounting portion, part of the conductive component is arranged in the accommodating cavity and electrically connected to the grounding terminal, and part of the conductive component is arranged outside the mounting portion and electrically connected to the grounding component.
在一种可能的实现方式中,所述接地部件包括接地导轨,且所述接地导轨位于所述装配仓内;所述安装部滑动安装在所述接地导轨上。In a possible implementation, the grounding component includes a grounding rail, and the grounding rail is located in the assembly compartment; and the mounting portion is slidably mounted on the grounding rail.
在一种可能的实现方式中,所述接地导轨朝向所述安装部的一侧设置有导电壁板;所述导电壁板的长度方向与所述导轨的延伸方向一致,且所述导电壁板与水平面相交;所述导通构件的端部与所述导电壁板接触并电连接。In a possible implementation, a conductive wall plate is provided on one side of the grounding rail toward the mounting portion; the length direction of the conductive wall plate is consistent with the extension direction of the rail, and the conductive wall plate intersects with a horizontal plane; the end of the conductive component contacts and is electrically connected to the conductive wall plate.
在一种可能的实现方式中,所述导通构件具有朝向所述导电壁板方向延伸的第一折弯区和与所述第一折弯区相连接且朝向上方方向延伸第二折弯区,所述导通构件与所述导电壁板接触的位置位于所述第二折弯区上。In a possible implementation, the conductive member has a first bending area extending toward the conductive wall plate and a second bending area connected to the first bending area and extending upward, and the position where the conductive member contacts the conductive wall plate is located on the second bending area.
在一种可能的实现方式中,所述接地部件还包括导电支板,所述安装部滑动的设置在导轨上;所述导轨与所述导电支板之间设置有阻隔板;所述导电支板设置在所述阻隔板背离所述安装部的一侧;所述导通构件具有跨接部,所述跨接部跨设于所述阻隔板上方,并与所述导电支板的表面接触并电连接。In a possible implementation, the grounding component also includes a conductive support plate, and the mounting portion is slidably arranged on a guide rail; a blocking plate is arranged between the guide rail and the conductive support plate; the conductive support plate is arranged on a side of the blocking plate away from the mounting portion; the conductive member has a bridging portion, which is arranged across the blocking plate and contacts and is electrically connected to the surface of the conductive support plate.
在一种可能的实现方式中,所述导通构件包括第二导电片、第二导电传输介质体以及承载件;所述承载件设置于所述墨盒本体远离所述导轨的一端,且所述承载件的一端与所述接地端子电连接,且所述承载件的另一端延伸至所述墨盒本体的容墨腔内;所述容墨腔内具有打印用液体介质,所述液体介质配置为所述第二导电传输介质体,并且所述第二导电传输介质体与所述承载件电连接;部分所述第二导电片形成所述跨接部,所述第二导电片远离所述跨接部的一端延伸至所述容墨腔内,并与所述第二导电传输介质体电连接。In one possible implementation, the conductive component includes a second conductive sheet, a second conductive transmission medium body and a carrier; the carrier is arranged at an end of the ink cartridge body away from the guide rail, and one end of the carrier is electrically connected to the ground terminal, and the other end of the carrier extends into the ink containing cavity of the ink cartridge body; the ink containing cavity contains a liquid medium for printing, the liquid medium is configured as the second conductive transmission medium body, and the second conductive transmission medium body is electrically connected to the carrier; a portion of the second conductive sheet forms the jumper, and an end of the second conductive sheet away from the jumper extends into the ink containing cavity and is electrically connected to the second conductive transmission medium body.
在一种可能的实现方式中,所述导通构件靠近所述接地部件的一端设置有抵接部;所述抵接部用于与所述接地部件接触,且所述抵接部配置成滚珠或球轴承,所述滚珠、所述球轴承与所述导通构件电连接。In a possible implementation, an abutment portion is provided at one end of the conductive component close to the grounding component; the abutment portion is used to contact the grounding component, and the abutment portion is configured as a ball or a ball bearing, and the ball or the ball bearing is electrically connected to the conductive component.
在一种可能的实现方式中,所述导通构件与所述导电壁板接触的位置是球面状的突起。In a possible implementation manner, the position where the conducting member contacts the conductive wall plate is a spherical protrusion.
在一种可能的实现方式中,所述接地部件配置为所述容纳腔的顶壁;所述导通构件具有所述墨盒安装到打印装置前的初始状态、所述墨盒安装到打印装置后的抵接状态,所述导通构件可以在所述初始状态和所述抵接状态之间切换。In one possible implementation, the grounding component is configured as the top wall of the accommodating cavity; the conductive component has an initial state before the ink cartridge is installed in the printing device and an abutment state after the ink cartridge is installed in the printing device, and the conductive component can switch between the initial state and the abutment state.
在一种可能的实现方式中,所述墨盒安装到打印装置的过程中,所述导通构件接触所述接地部件在先,所述芯片接触所述触针组件在后。In a possible implementation, when the ink cartridge is installed in the printing device, the conducting member contacts the grounding component first, and then the chip contacts the contact pin assembly.
在一种可能的实现方式中,所述触针组件中的触针可发生形变,所述接地部件不可形变;当所述芯片与所述触针接触时,至少一个所述触针发生形变;当所述导通构件与所述接地部件相接触时,所述接地部件不发生形变。In a possible implementation, the contact pins in the contact pin assembly can be deformed, and the grounding component cannot be deformed; when the chip contacts the contact pins, at least one of the contact pins is deformed; when the conductive member contacts the grounding component, the grounding component is not deformed.
在一种可能的实现方式中,所述通信端子组包括数据端子、复位端子、电源端子、时钟端子;沿所述墨盒安装到所述打印装置的安装方向上,所述通信端子组的各端子与所述触针组件相接触的接触部分两排排列。In one possible implementation, the communication terminal group includes a data terminal, a reset terminal, a power terminal, and a clock terminal; along the installation direction of the ink cartridge to the printing device, the contact parts of the terminals of the communication terminal group that contact the contact pin assembly are arranged in two rows.
在一种可能的实现方式中,在所述安装方向上,所述数据端子的接触部、所述复位端子的接触部设置在上游侧;所述电源端子的接触部、所述时钟端子的接触部设置在下游侧。In a possible implementation, in the installation direction, the contact portion of the data terminal and the contact portion of the reset terminal are arranged on the upstream side; the contact portion of the power terminal and the contact portion of the clock terminal are arranged on the downstream side.
在一种可能的实现方式中,所述芯片包括基板,所述基板包括相对设置的第一表面和第二表面;所述第一表面配置为所述基板靠近所述触针组件的表面,所述通信端子组设置于所述第一表面上;所述接地端子设置于所述第二表面或所述第一表面上,且所述接地端子与所述导通构件电连接,并配置成所述芯片的接地位点。In one possible implementation, the chip includes a substrate, the substrate includes a first surface and a second surface arranged opposite to each other; the first surface is configured as a surface of the substrate close to the contact pin assembly, and the communication terminal group is arranged on the first surface; the ground terminal is arranged on the second surface or the first surface, and the ground terminal is electrically connected to the conductive component and configured as a grounding point of the chip.
在一种可能的实现方式中,所述第一表面具有正交的第一方向和第二方向,且所述第一方向配置为所述墨盒安装到所述打印装置的安装方向在第一表面的投影线的延伸方向;所述通信端子组包括多个通信端子;每一所述通信端子具备与所述触针组件配合的第一接触部;多个所述第一接触部在所述第一表面上的第一投影围成第一区域,所述接地端子在所述第一表面形成第二投影。In one possible implementation, the first surface has a first direction and a second direction that are orthogonal to each other, and the first direction is configured as the extension direction of a projection line of an installation direction of the ink cartridge to the printing device on the first surface; the communication terminal group includes a plurality of communication terminals; each of the communication terminals has a first contact portion that cooperates with the contact pin assembly; the first projections of the plurality of first contact portions on the first surface enclose a first area, and the ground terminal forms a second projection on the first surface.
在一种可能的实现方式中,在第二方向上,至少部分所述第二投影位于所述第一区域的外部;所述第二投影靠近所述第一区域的一侧与所述第一区域之间的距离小于所述第一区域的长度。In a possible implementation manner, in the second direction, at least a portion of the second projection is located outside the first area; and a distance between a side of the second projection close to the first area and the first area is less than a length of the first area.
在一种可能的实现方式中,在第二方向上,所述第二投影与所述第一区域存在重合。In a possible implementation manner, in the second direction, the second projection overlaps with the first area.
在一种可能的实现方式中,所述接地部件与所述触针组件配置为两个不同部件。In a possible implementation manner, the grounding component and the contact pin assembly are configured as two different components.
在一种可能的实现方式中,所述接地部件不属于所述触针组件的一部分。In a possible implementation manner, the grounding component is not a part of the contact pin assembly.
本申请实施例提供了一种芯片,所述芯片可拆卸地安装于打印装置内,所述打印装置具有装配仓以及设置于所述装配仓内的安装部、接地部件,所述安装部包括容纳腔以及触针组件,所述接地部件位于所述触针组件所在位置之外的位置处;所述芯片具有通信端子组、导通构件(也可称为连接件)、存储器;所述通信端子组与所述触针组件电连接;所述导通构件与所述接地部件、所述存储器电连接。An embodiment of the present application provides a chip, which can be detachably installed in a printing device. The printing device has an assembly bin and a mounting portion and a grounding component arranged in the assembly bin, the mounting portion includes a accommodating cavity and a contact pin assembly, and the grounding component is located at a position outside the position of the contact pin assembly; the chip has a communication terminal group, a conductive component (also called a connector), and a memory; the communication terminal group is electrically connected to the contact pin assembly; the conductive component is electrically connected to the grounding component and the memory.
在一种可能的实现方式中,所述接地部件与所述触针组件是两个不同部件。In a possible implementation manner, the grounding component and the contact pin assembly are two different components.
在一种可能的实现方式中,所述芯片设置于所述墨盒本体上,所述墨盒本体及所述芯片的至少一部分可位于所述容纳腔内,所述导通构件设置于所述装配仓内。In a possible implementation, the chip is disposed on the ink cartridge body, the ink cartridge body and at least a portion of the chip may be located in the accommodating cavity, and the conducting component is disposed in the assembly compartment.
在一种可能的实现方式中,所述安装部固定在所述装配仓内,且所述接地部件设置于所述容纳腔内。In a possible implementation manner, the mounting portion is fixed in the assembly bin, and the grounding component is disposed in the accommodating cavity.
在一种可能的实现方式中,所述容纳腔的至少部分腔壁配置成所述接地部件,所述接地部件与所述导通构件的电连接位置位于所述芯片的上方。In a possible implementation manner, at least a portion of the cavity wall of the accommodating cavity is configured as the grounding component, and the electrical connection position between the grounding component and the conducting member is located above the chip.
本申请实施例提供了一种墨盒的使用,所述墨盒可拆卸地安装于打印装置内,所述打印装置具有装配仓以及设置于所述装配仓内的安装部、接地部件,所述安装部包括容纳腔以及触针组件,所述接地部件位于所述触针组件所在位置之外的位置处;所述墨盒包括墨盒本体、芯片;所述芯片具有通信端子组、导通构件(也可称为连接件)、存储器;所述通信端子组与所述触针组件电连接;所述导通构件与所述接地部件、所述存储器电连接。An embodiment of the present application provides a use of an ink cartridge, which is detachably installed in a printing device, wherein the printing device has an assembly bin and a mounting portion and a grounding component arranged in the assembly bin, the mounting portion including a accommodating cavity and a stylus assembly, and the grounding component is located at a position other than the position of the stylus assembly; the ink cartridge includes an ink cartridge body and a chip; the chip has a communication terminal group, a conductive component (also referred to as a connector), and a memory; the communication terminal group is electrically connected to the stylus assembly; the conductive component is electrically connected to the grounding component and the memory.
本申请实施例提供了一种芯片的使用,所述芯片可拆卸地安装于打印装置内,所述打印装置具有装配仓以及设置于所述装配仓内的安装部、接地部件,所述安装部包括容纳腔以及触针组件,所述接地部件位于所述触针组件所在位置之外的位置处;所述芯片具有通信端子组、导通构件(也可称为连接件)、存储器;所述通信端子组与所述触针组件电连接;所述导通构件与所述接地部件、所述存储器电连接。An embodiment of the present application provides a use of a chip, wherein the chip is detachably installed in a printing device, and the printing device has an assembly bin and a mounting portion and a grounding component arranged in the assembly bin, wherein the mounting portion includes a accommodating cavity and a contact pin assembly, and the grounding component is located at a position other than the position of the contact pin assembly; the chip has a communication terminal group, a conductive component (also referred to as a connector), and a memory; the communication terminal group is electrically connected to the contact pin assembly; the conductive component is electrically connected to the grounding component and the memory.
除了上面所描述的本公开实施例解决的技术问题、构成技术方案的技术特征以及由这些技术方案的技术特征所带来的有益效果外,本公开实施例提供的墨盒所能解决的其他技术问题、技术方案中包含的其他技术特征以及这些技术特征带来的有益效果,将在具体实施方式中作出进一步详细的说明。In addition to the technical problems solved by the embodiments of the present disclosure, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of the technical solutions described above, other technical problems that can be solved by the ink cartridge provided by the embodiments of the present disclosure, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
图1为本申请实施例提供的墨盒安装至安装部的结构示意图;FIG1 is a schematic diagram of a structure in which an ink cartridge is installed on a mounting portion according to an embodiment of the present application;
图2为本申请实施例提供的导通构件与接地部件的连接示意图;FIG2 is a schematic diagram of the connection between the conducting component and the grounding component provided in an embodiment of the present application;
图3为本申请实施例一的第一实施方式的墨盒与安装部的插装示意图;FIG3 is a schematic diagram of the insertion of an ink cartridge and a mounting portion according to a first implementation mode of Example 1 of the present application;
图4为本申请实施例一的第一实施方式的触针组件的结构示意图;FIG4 is a schematic structural diagram of a stylus assembly according to a first embodiment of the present application;
图5为图4中第一触针的结构示意图;FIG5 is a schematic structural diagram of the first contact pin in FIG4 ;
图6为本申请实施例一的第一实施方式中的芯片的背面结构示意图;FIG6 is a schematic diagram of the back structure of a chip in the first implementation mode of Example 1 of the present application;
图7为图6所示芯片的正面结构示意图;FIG7 is a schematic diagram of the front structure of the chip shown in FIG6 ;
图8、9为本申请实施例一提供的芯片变形例一的正面结构示意图;8 and 9 are schematic diagrams of the front structure of a chip variation 1 provided in the first embodiment of the present application;
图10为本申请实施例一提供的芯片变形例一的背面结构示意图;FIG10 is a schematic diagram of the back structure of a chip variant 1 provided in the first embodiment of the present application;
图11为本申请实施例一提供的芯片变形例一和连接件的爆炸图;FIG11 is an exploded view of a first variation of a chip and a connector provided in the first embodiment of the present application;
图12为本申请实施例一提供的芯片变形例二(所具有5个端子在芯片)的布置示意图一;FIG12 is a schematic diagram of the arrangement of the second variation of the chip provided in the first embodiment of the present application (having 5 terminals on the chip);
图13为本申请实施例一提供的芯片变形例二(所具有5个端子在芯片)的布置示意图二;FIG13 is a second schematic diagram of the arrangement of a second variation of the chip provided in the first embodiment of the present application (having 5 terminals on the chip);
图14为本申请实施例一提供的芯片变形例三(所具有9个端子在芯片)的布置示意图一;FIG14 is a schematic diagram of the arrangement of the third variation of the chip (having 9 terminals on the chip) provided in the first embodiment of the present application;
图15为本申请实施例一的芯片安装至墨盒的示意图;FIG15 is a schematic diagram of a chip installed in an ink cartridge according to Embodiment 1 of the present application;
图16为本申请实施例一的芯片与触针组件接触示意图;FIG16 is a schematic diagram of contact between a chip and a contact pin assembly according to the first embodiment of the present application;
图17为本申请实施例一的第二实施方式中墨盒安装至安装部的结构示意图一;FIG17 is a first structural diagram of an ink cartridge installed on a mounting portion in a second embodiment of the first embodiment of the present application;
图18为图17中的墨盒的结构示意图;FIG18 is a schematic diagram of the structure of the ink cartridge in FIG17 ;
图19为本申请实施例一的第二实施方式中的导通构件的拆分示意图;FIG19 is a schematic diagram of a disassembled conductive component in the second implementation mode of the first embodiment of the present application;
图20为本申请实施例一的第二实施方式中的导通构件的结构示意图一;FIG20 is a first structural diagram of a conducting component in a second implementation manner of Example 1 of the present application;
图21为本申请实施例一的第二实施方式中的把手的整体结构示意图;FIG21 is a schematic diagram of the overall structure of a handle in a second embodiment of the first embodiment of the present application;
图22为本申请实施例一的第二实施方式中的把手的剖视示意图;FIG22 is a cross-sectional schematic diagram of a handle in a second embodiment of the first embodiment of the present application;
图23为本申请实施例一的第三实施方式的墨盒与打印装置的示意图;FIG23 is a schematic diagram of an ink cartridge and a printing device according to a third embodiment of the first embodiment of the present application;
图24为本申请实施例一的第三实施方式的打印装置的示意图;FIG24 is a schematic diagram of a printing device according to a third embodiment of the first embodiment of the present application;
图25为本申请实施例一的第三实施方式的墨盒的示意图;FIG25 is a schematic diagram of an ink cartridge according to a third embodiment of Example 1 of the present application;
图26为本申请实施例一的第三实施方式的墨盒的爆炸图;FIG26 is an exploded view of an ink cartridge according to a third embodiment of the first embodiment of the present application;
图27为本申请实施例一的第四实施方式的墨盒的示意图;FIG27 is a schematic diagram of an ink cartridge according to a fourth embodiment of Example 1 of the present application;
图28为本申请实施例二的芯片的背面结构示意图;FIG28 is a schematic diagram of the back structure of the chip according to the second embodiment of the present application;
图29为本申请实施例二的芯片安装至墨盒的结构示意图;FIG29 is a schematic diagram of the structure of the chip installed in the ink cartridge according to the second embodiment of the present application;
图30为本申请实施例二中墨盒安装至安装部上的结构示意图;FIG30 is a schematic diagram of the structure of the ink cartridge installed on the mounting portion in the second embodiment of the present application;
图31为本申请实施例二中的导通构件与接地部件的连接示意图;FIG31 is a schematic diagram of the connection between the conducting component and the grounding component in the second embodiment of the present application;
图32为本申请实施例三的第一实施方式芯片安装至墨盒的结构示意图;FIG32 is a schematic diagram of the structure of a chip mounted on an ink cartridge in the first embodiment of the third embodiment of the present application;
图33为本申请实施例三的第二实施方式中的墨盒安装至安装部的示意图;FIG33 is a schematic diagram of an ink cartridge installed on a mounting portion in a second embodiment of the third embodiment of the present application;
图34为图33中的安装部的内部结构示意图;FIG34 is a schematic diagram of the internal structure of the mounting portion in FIG33;
图35为本申请实施例三的第二实施方式中的芯片与导通构件的连接示意图一;35 is a schematic diagram 1 of the connection between the chip and the conducting component in the second implementation manner of the third embodiment of the present application;
图36为本申请实施例三的第二实施方式中的芯片与导通构件的连接示意图二;36 is a second schematic diagram of connection between a chip and a conducting component in the second implementation manner of the third embodiment of the present application;
图37为本申请实施例三的第二种实施方式中的芯片安装至墨盒的示意图;FIG37 is a schematic diagram of a chip installed in an ink cartridge in a second implementation manner of Example 3 of the present application;
图38为本申请实施例三的第二种实施方式中芯片安装至墨盒的局部放大示意图;FIG38 is a partial enlarged schematic diagram of a chip mounted on an ink cartridge in the second implementation manner of Example 3 of the present application;
图39为本申请实施例三的第二种实施方式中的墨盒安装至安装部的示意图;FIG39 is a schematic diagram of an ink cartridge installed on a mounting portion in a second implementation manner of Example 3 of the present application;
图40为本申请实施例三的第二种实施方式中的墨盒安装至托盘的示意图;FIG40 is a schematic diagram of an ink cartridge installed on a tray in a second implementation of Example 3 of the present application;
图41为图40中的导通构件的结构示意图;FIG41 is a schematic structural diagram of the conducting component in FIG40;
图42为本申请实施例三的第二种实施方式中的墨盒与安装部的部分示意图;FIG42 is a partial schematic diagram of an ink cartridge and a mounting portion in a second implementation manner of Example 3 of the present application;
图43为本申请实施例三的第三种实施方式中的芯片的正面结构示意图;FIG43 is a schematic diagram of the front structure of a chip in a third implementation manner of Example 3 of the present application;
图44为本申请实施例三的第三种实施方式中的芯片的背面结构示意图;FIG44 is a schematic diagram of the back structure of a chip in a third implementation manner of Example 3 of the present application;
图45为本申请实施例三的第三种实施方式中的导通构件的结构示意图;FIG45 is a schematic structural diagram of a conducting component in a third implementation manner of Example 3 of the present application;
图46为本申请实施例三的第三种实施方式中的墨盒与安装部的接触示意图;FIG46 is a schematic diagram of contact between the ink cartridge and the mounting portion in the third implementation manner of Example 3 of the present application;
图47为本申请实施例三的第三种实施方式中的芯片架的结构示意图一;FIG47 is a first structural diagram of a chip rack in a third implementation manner of Example 3 of the present application;
图48为本申请实施例三的第三种实施方式中的芯片架的结构示意图二;FIG48 is a second structural schematic diagram of a chip rack in the third implementation manner of Example 3 of the present application;
图49为本申请实施例三的第三种实施方式中的墨盒的部分示意图;FIG49 is a partial schematic diagram of an ink cartridge in a third implementation of Example 3 of the present application;
图50为本申请实施例三的第三种实施方式中的供墨头的结构示意图;FIG50 is a schematic structural diagram of an ink supply head in a third implementation manner of Example 3 of the present application;
图51为本申请实施例三的第三种实施方式中的供墨头与连接件的连接示意图;FIG51 is a schematic diagram of the connection between the ink supply head and the connecting member in the third implementation manner of Example 3 of the present application;
图52为本申请实施例三的第三种实施方式中的墨盒的结构示意图;FIG52 is a schematic diagram of the structure of an ink cartridge in a third implementation of Example 3 of the present application;
图53为本申请实施例三的第四种实施方式中的墨盒与托盘的安装示意图一;FIG53 is a schematic diagram of the installation of the ink cartridge and the tray in the fourth implementation of the third embodiment of the present application;
图54为本申请实施例三的第四种实施方式中的墨盒与托盘的安装示意图二;FIG54 is a second schematic diagram of the installation of the ink cartridge and the tray in the fourth implementation of the third embodiment of the present application;
图55为本申请实施例三的第四种实施方式中的托盘与锁定部的连接示意图;FIG55 is a schematic diagram of the connection between the tray and the locking portion in the fourth implementation manner of the third embodiment of the present application;
图56为本申请实施例三的第四种实施方式中的导通构件的结构示意图;FIG56 is a schematic structural diagram of a conducting component in a fourth implementation manner of Example 3 of the present application;
图57为本申请实施例三的第五种实施方式中的墨盒与托盘的连接示意图一;FIG57 is a schematic diagram of the connection between the ink cartridge and the tray in the fifth implementation of the third embodiment of the present application;
图58为本申请实施例三的第五种实施方式中的墨盒与托盘的连接示意图二;FIG58 is a second schematic diagram of the connection between the ink cartridge and the tray in the fifth implementation of the third embodiment of the present application;
图59为本申请实施例三的第五种实施方式中的墨盒安装状态下与接地部件连接示意图一;FIG59 is a schematic diagram 1 of the connection between the ink cartridge and the grounding component in the fifth implementation manner of the third embodiment of the present application when the ink cartridge is installed;
图60为本申请实施例三的第五种实施方式中的墨盒与托盘的连接示意图三;FIG60 is a third schematic diagram of the connection between the ink cartridge and the tray in the fifth implementation of the third embodiment of the present application;
图61为本申请实施例三的第五种实施方式中的墨盒安装状态下与接地部件连接示意图二;FIG61 is a second schematic diagram of the connection between the ink cartridge and the grounding component in the fifth implementation manner of the third embodiment of the present application when the ink cartridge is installed;
图62为本申请实施例三的第六实施方式墨盒的示意图;FIG62 is a schematic diagram of an ink cartridge according to a sixth embodiment of Example 3 of the present application;
图63为本申请实施例三的第七实施方式墨盒的示意图;FIG63 is a schematic diagram of an ink cartridge according to a seventh embodiment of Example 3 of the present application;
图64为本申请实施例四中的芯片的背面结构示意图;FIG64 is a schematic diagram of the back structure of the chip in the fourth embodiment of the present application;
图65为本申请实施例四中的导通构件的结构示意图;FIG65 is a schematic diagram of the structure of a conducting component in Embodiment 4 of the present application;
图66为本申请实施例四中的墨盒安装至安装部的结构示意图;FIG66 is a schematic diagram of the structure of the ink cartridge installed on the mounting portion in the fourth embodiment of the present application;
图67为本申请实施例四中的墨盒安装至安装部的爆炸示意图;FIG67 is an exploded schematic diagram of an ink cartridge installed on a mounting portion in Embodiment 4 of the present application;
图68为本申请实施例四中的墨盒的后侧壁的结构示意图;FIG68 is a schematic structural diagram of the rear side wall of the ink cartridge in the fourth embodiment of the present application;
图69为本申请实施例四中芯片安装至墨盒上的结构示意图;FIG69 is a schematic diagram of the structure of a chip installed on an ink cartridge in Embodiment 4 of the present application;
图70为本申请实施例四中导通构件与接地部件的连接示意图一;FIG70 is a first schematic diagram of connection between a conducting component and a grounding component in Embodiment 4 of the present application;
图71为本申请实施例四提供的导通构件的结构示意图;FIG71 is a schematic diagram of the structure of a conducting component provided in Embodiment 4 of the present application;
图72为本申请实施例四提供的导电件的结构示意图;FIG72 is a schematic diagram of the structure of a conductive member provided in Embodiment 4 of the present application;
图73为本申请实施例四提供的墨盒的剖面结构示意图;FIG73 is a schematic cross-sectional view of the ink cartridge provided in Embodiment 4 of the present application;
图74为图73中A处放大示意图;FIG74 is an enlarged schematic diagram of point A in FIG73;
图75为图73中B处放大示意图;FIG75 is an enlarged schematic diagram of point B in FIG73;
图76为本申请实施例四提供的墨盒与芯片的连接示意图;FIG76 is a schematic diagram of the connection between the ink cartridge and the chip provided in the fourth embodiment of the present application;
图77为本申请实施例四中导通构件与接地部件的连接示意图二。Figure 77 is the second connection diagram of the conductive component and the grounding component in the fourth embodiment of the present application.
具体实施方式Detailed ways
正如背景技术所述,图像形成设备包括墨盒及打印装置,墨盒插装至打印装置内时,墨盒的芯片出现无法接地或者接地不稳定的情况,影响芯片接地稳定性以及使用安全性;经发明人研究发现,出现这种问题的原因在于:As described in the background technology, an image forming device includes an ink cartridge and a printing device. When the ink cartridge is inserted into the printing device, the chip of the ink cartridge cannot be grounded or the grounding is unstable, which affects the grounding stability of the chip and the safety of use. The inventors have found that the reason for this problem is:
在墨盒的安装过程中,打印装置的触针组暴露在其安装部内,此时当墨盒或异物意外掉落安装部内并撞击该接地触针时,则该接地触针可能会出现意外弯曲、接触点摩擦损坏或位置不固定的情况,导致其不能保证与芯片的接地子端子稳定接触,从而芯片存在无法接地或接地不稳定的可能性。因此,在墨盒出现电流过大的情况,可能损坏芯片以及打印装置的风险,也可能导致打印装置无法正常识别墨盒。During the installation of the ink cartridge, the contact pin group of the printing device is exposed in its installation part. At this time, when the ink cartridge or foreign objects accidentally fall into the installation part and hit the ground contact pin, the ground contact pin may be accidentally bent, the contact point may be damaged by friction, or the position may be unstable, resulting in it being unable to ensure stable contact with the ground sub-terminal of the chip, so that the chip may not be grounded or the grounding may be unstable. Therefore, if the current in the ink cartridge is too large, there is a risk of damaging the chip and the printing device, and it may also cause the printing device to fail to recognize the ink cartridge normally.
针对上述技术问题,本申请实施例提供的墨盒,其包括导通构件以及芯片,且芯片的接地端子与导通构件电连接,以及通过导通构件与位于打印装置的装配仓内接地部件电连接。如此设置,可使墨盒插装于打印装置内时,芯片通过其接地端子、导通构件与接地部件电连接,以使芯片稳定接地。In view of the above technical problems, the ink cartridge provided in the embodiment of the present application includes a conductive member and a chip, and the ground terminal of the chip is electrically connected to the conductive member, and is electrically connected to a ground component located in an assembly compartment of a printing device through the conductive member. With such a configuration, when the ink cartridge is inserted into the printing device, the chip is electrically connected to the ground component through its ground terminal and the conductive member, so that the chip is stably grounded.
如此设置,本申请实施例中的墨盒通过导通构件将芯片的接地端子与接地部件连接,可避免接地子端子与接地触针接触不稳定,而导致芯片无法接地或接地不稳定的情况的出现,因此可提升芯片接地的可靠性,防止电流过大而损坏芯片及打印装置,提升墨盒及打印装置的使用安全性,降低了打印装置无法识别墨盒情况的出现。With such a configuration, the ink cartridge in the embodiment of the present application connects the ground terminal of the chip to the ground component through a conductive component, which can avoid unstable contact between the ground sub-terminal and the ground contact pin, resulting in the chip being unable to be grounded or the grounding being unstable. Therefore, the reliability of the chip grounding can be improved, and excessive current can be prevented from damaging the chip and the printing device, thereby improving the safety of the ink cartridge and the printing device and reducing the occurrence of the printing device being unable to recognize the ink cartridge.
为了使本申请实施例的上述目的、特征和优点能够更加明显易懂,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请的一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其它实施例,均属于本申请保护的范围。In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of this application.
如图1至图3所示,本申请实施例提供的墨盒10,其作为打印装置的耗材件之一,耗材件包括不限于墨盒10,例如耗材件还可以是硒鼓、色带等,本申请实施例以墨盒为例进行说明。As shown in Figures 1 to 3, the ink cartridge 10 provided in the embodiment of the present application is one of the consumable parts of the printing device. The consumable parts include but are not limited to the ink cartridge 10. For example, the consumable parts can also be toner cartridges, ribbons, etc. The embodiment of the present application is explained using the ink cartridge as an example.
在墨盒10消耗完毕时,需要对墨盒10进行更换,因此墨盒10通常可拆卸安装至打印装置。例如,本申请实施例中的打印装置可以称为打印机,打印机具有装配仓,装配仓内具有容纳墨盒的安装部90和接地部件,其中接地部件用于将打印机(也称为打印装置)接地。墨盒可插装至安装部内,并与打印机的安装部电连接,以使墨盒和打印机建立通信。When the ink cartridge 10 is consumed, it is necessary to replace the ink cartridge 10, so the ink cartridge 10 is usually detachably mounted to the printing device. For example, the printing device in the embodiment of the present application can be called a printer, and the printer has an assembly compartment, and the assembly compartment has a mounting portion 90 for accommodating the ink cartridge and a grounding component, wherein the grounding component is used to ground the printer (also referred to as the printing device). The ink cartridge can be inserted into the mounting portion and electrically connected to the mounting portion of the printer so that the ink cartridge and the printer establish communication.
具体地,打印装置具有装配仓,安装部设置于装配仓内。安装部包括容纳腔以及触针组件,接地部件位于触针组件所在位置之外的位置处,其中容纳腔用于供至少一个墨盒插装,且至少部分触针组件暴露于容纳腔内,并与墨盒的芯片电连接。接地部件与触针组件是2个不同部件,换言之,接地部件不属于触针组件的一部分。Specifically, the printing device has an assembly chamber, and the mounting portion is arranged in the assembly chamber. The mounting portion includes a receiving chamber and a stylus assembly, and the grounding component is located at a position outside the position where the stylus assembly is located, wherein the receiving chamber is used for inserting at least one ink cartridge, and at least part of the stylus assembly is exposed in the receiving chamber and is electrically connected to the chip of the ink cartridge. The grounding component and the stylus assembly are two different components, in other words, the grounding component is not a part of the stylus assembly.
墨盒可拆卸地安装于打印装置内,打印装置具有装配仓以及设置于装配仓内的安装部、接地部件,安装部包括容纳腔以及触针组件,接地部件位于触针组件所在位置之外的位置处,墨盒包括墨盒本体、芯片及导通构件,芯片设置于所述墨盒本体上,墨盒本体及芯片的至少一部分可位于容纳腔内,且芯片设置有通信端子组和接地端子,通信端子组与触针组件电连接;导通构件设置于装配仓内,导通构件配置为将接地端子和接地部件电连接。The ink cartridge can be detachably installed in the printing device. The printing device has an assembly chamber and a mounting portion and a grounding component arranged in the assembly chamber. The mounting portion includes a accommodating cavity and a contact pin assembly. The grounding component is located at a position other than the position of the contact pin assembly. The ink cartridge includes an ink cartridge body, a chip and a conductive component. The chip is arranged on the ink cartridge body. At least a portion of the ink cartridge body and the chip can be located in the accommodating cavity. The chip is provided with a communication terminal group and a grounding terminal. The communication terminal group is electrically connected to the contact pin assembly. The conductive component is arranged in the assembly chamber, and the conductive component is configured to electrically connect the grounding terminal and the grounding component.
触针组件中的触针可发生形变,接地部件不可形变;当芯片与触针接触时,至少一个触针发生形变;当导通构件与接地部件相接触时,接地部件不发生形变。需要说明的是,由于任何两个物体抵接,其接触面均会发生形变,因此本实施例中的接地部件的“不可形变”指的是与触针的大幅度形变相比,接地部件与导通构件接触时发生的一般人肉眼不可视的微小形变。The contact pins in the contact pin assembly can be deformed, while the grounding component cannot be deformed; when the chip contacts the contact pins, at least one contact pin is deformed; when the conductive component contacts the grounding component, the grounding component does not deform. It should be noted that since any two objects abut against each other, their contact surfaces will deform, so the "non-deformable" grounding component in this embodiment refers to the tiny deformation that is invisible to the naked eye when the grounding component contacts the conductive component, compared with the large deformation of the contact pins.
墨盒10包括墨盒本体50、芯片20及导通构件,其中墨盒本体50用于盛放墨水,且芯片20设置于墨盒本体50的表面。芯片20用于存储墨盒的生产厂信息、墨水量信息、墨盒类别信息、墨水颜色等信息,芯片设置有多个端子,按照端子的用途可将多个端子划分为通信端子及接地端子,即芯片上设置有通信端子组和接地端子,通信端子组包括多个通信端子。The ink cartridge 10 includes an ink cartridge body 50, a chip 20 and a conducting member, wherein the ink cartridge body 50 is used to hold ink, and the chip 20 is disposed on the surface of the ink cartridge body 50. The chip 20 is used to store information such as the manufacturer information, ink volume information, ink cartridge category information, ink color, etc. of the ink cartridge, and the chip is provided with a plurality of terminals, which can be divided into communication terminals and ground terminals according to the purpose of the terminals, that is, a communication terminal group and a ground terminal are provided on the chip, and the communication terminal group includes a plurality of communication terminals.
进一步地,通信端子配置为与触针组件的各触针接触并电连接。接地端子与导通构件的一端连接,导通构件的另一端可连接于接地部件,以使芯片的接地信号可通过导通构件传输至接地部件,进而完成接地。Further, the communication terminal is configured to contact and electrically connect with each contact pin of the contact pin assembly. The ground terminal is connected to one end of the conductive member, and the other end of the conductive member can be connected to the grounding component, so that the grounding signal of the chip can be transmitted to the grounding component through the conductive member, thereby completing the grounding.
当墨盒10插装至容纳腔时,芯片20的各通信端子与对应的触针组件接触并电连接,以使墨盒10与打印机之间会进行数据传输、确认、数据交互等。同时,导通构件与接地部件电连接,以使墨盒、打印机均接地。When the ink cartridge 10 is inserted into the accommodating cavity, each communication terminal of the chip 20 contacts and electrically connects with the corresponding contact pin assembly, so that data transmission, confirmation, data interaction, etc. can be performed between the ink cartridge 10 and the printer. At the same time, the conducting component is electrically connected to the grounding component, so that the ink cartridge and the printer are both grounded.
与相关技术相比,芯片20的接地子端子与触针组件中相应的接地触针电连接的方案相比,本申请实施例中的墨盒通过导通构件将芯片的接地端子与接地部件连接,可避免接地端子与接地触针接触不稳定,而导致芯片无法接地或接地不稳定的情况的出现,因此可提升芯片接地的可靠性,防止电流过大而损坏芯片及打印装置,提升芯片及打印装置的使用安全性,降低了打印装置无法识别墨盒情况的出现。Compared with the related art, compared with the solution in which the grounding sub-terminal of the chip 20 is electrically connected to the corresponding grounding contact pin in the contact pin assembly, the ink cartridge in the embodiment of the present application connects the grounding terminal of the chip to the grounding component through a conductive component, which can avoid unstable contact between the grounding terminal and the grounding contact pin, which may cause the chip to be unable to be grounded or unstable in grounding. Therefore, the reliability of the chip grounding can be improved, and the chip and the printing device can be prevented from being damaged by excessive current, thereby improving the safety of the chip and the printing device and reducing the occurrence of the printing device being unable to recognize the ink cartridge.
在上述实施例的基础上,本申请实施例中安装部可固定于装配仓内,或者安装部可活动安装于装配仓内,例如安装部滑动安装于装配仓内。然而由于安装部在装配仓内的布置方式不同,因此影响着墨盒与安装部之间的安装方式,进而芯片在墨盒上的布置方式以及导通构件与接地部件的电连接方案也不相同,本申请对此以不同实施例分别进行介绍。On the basis of the above embodiments, in the embodiments of the present application, the mounting part can be fixed in the assembly bin, or the mounting part can be movably mounted in the assembly bin, for example, the mounting part is slidably mounted in the assembly bin. However, due to the different arrangements of the mounting part in the assembly bin, the installation method between the ink cartridge and the mounting part is affected, and thus the arrangement of the chip on the ink cartridge and the electrical connection scheme of the conductive component and the grounding component are also different. This application introduces this in different embodiments.
实施例一:Embodiment 1:
本申请实施例中安装部设置在装配仓内,且接地部件设置于安装部的容纳腔内;具体的,安装部可活动安装于装配仓内。In the embodiment of the present application, the mounting portion is disposed in the assembly bin, and the grounding component is disposed in the accommodating cavity of the mounting portion; specifically, the mounting portion can be movably mounted in the assembly bin.
在第一种实施方式中,本实施方式中提供了一种天线式导通构件,且设置于装配仓的金属件配置成接地部件,即金属件接地;导通构件的一端与芯片20的接地端子电连接,另一端与接地部件连接,且两者电连接点位于芯片的上方。In the first embodiment, an antenna-type conductive component is provided in this embodiment, and the metal part arranged in the assembly bin is configured as a grounding part, that is, the metal part is grounded; one end of the conductive component is electrically connected to the ground terminal of the chip 20, and the other end is connected to the grounding part, and the electrical connection point between the two is located above the chip.
继续参阅图3,安装部是打印装置的一部件,用于承载多个或者一个墨盒,墨盒沿安装方向P可拆卸地安装到安装部中,当墨盒使用完毕后,需要更换新的墨盒。Continuing to refer to FIG. 3 , the mounting portion is a component of the printing device, which is used to carry multiple or one ink cartridge. The ink cartridge is detachably mounted in the mounting portion along the mounting direction P. When the ink cartridge is used up, it needs to be replaced with a new ink cartridge.
墨盒10包括芯片20、把手30、出墨口41及墨盒本体50,安装部90具有触针组件91、供墨部92、开口95、底壁90a。墨盒10沿安装方向P(-Z轴方向)从开口95安装到安装部90中,把手30用于将墨盒10固定到安装部90上,防止墨盒10从安装部90中脱离出来。The ink cartridge 10 includes a chip 20, a handle 30, an ink outlet 41, and an ink cartridge body 50. The mounting portion 90 includes a stylus assembly 91, an ink supply portion 92, an opening 95, and a bottom wall 90a. The ink cartridge 10 is mounted in the mounting portion 90 from the opening 95 along the mounting direction P (-Z axis direction). The handle 30 is used to fix the ink cartridge 10 to the mounting portion 90 to prevent the ink cartridge 10 from being separated from the mounting portion 90.
盒体50(亦称为墨盒本体50)内存储有墨水,墨水经出墨口41到达供墨部92处,进而供墨部92可以将墨水供给到打印机的打印头处,从而墨水可以用于执行打印的动作。The cartridge body 50 (also referred to as the ink cartridge main body 50 ) stores ink, and the ink reaches the ink supply portion 92 through the ink outlet 41 , and then the ink supply portion 92 can supply the ink to the print head of the printer, so that the ink can be used to perform printing.
如图4所示,触针组件91包括触针91a及基座910,触针91a设置在基座910上。芯片20上具有通信端子组,通信端子组可以与触针组件的触针接触电连接,用于电信号之间的相互传输。As shown in Fig. 4, the contact pin assembly 91 includes a contact pin 91a and a base 910, and the contact pin 91a is disposed on the base 910. The chip 20 has a communication terminal group, which can be electrically connected to the contact pins of the contact pin assembly for mutual transmission of electrical signals.
本实施方式中设定三维直角坐标系,即XYZ轴坐标系,墨盒的三维直角坐标系与安装部的三维直角坐标系一致。以墨盒10安装到安装部的方向为-Z轴方向,则墨盒从安装部脱离的方向为+Z轴方向,开口位于+Z轴方向上,底壁90a位于-Z轴方向上。一般情况下,打印机平放在办公桌面或者打印桌面上,开口95位于安装部90的顶部,底壁90a位于安装部90的底部,如此设置,便于使用者安装或者拆卸墨盒。In this embodiment, a three-dimensional rectangular coordinate system, i.e., an XYZ axis coordinate system, is set, and the three-dimensional rectangular coordinate system of the ink cartridge is consistent with the three-dimensional rectangular coordinate system of the mounting portion. The direction in which the ink cartridge 10 is installed to the mounting portion is the -Z axis direction, and the direction in which the ink cartridge is separated from the mounting portion is the +Z axis direction, the opening is located in the +Z axis direction, and the bottom wall 90a is located in the -Z axis direction. In general, the printer is placed flat on an office desktop or a printing desktop, the opening 95 is located at the top of the mounting portion 90, and the bottom wall 90a is located at the bottom of the mounting portion 90. This arrangement is convenient for users to install or remove the ink cartridge.
进一步的,安装部90可以承载多个或者一个墨盒,安装部具有多个或者一个安装位。例如,安装部90具有四个安装位,每个安装位可插装一个安装位,四个墨盒内可以存储四种不同颜色的墨水,例如黑色、黄色、蓝色、红色。Further, the mounting portion 90 can carry multiple or one ink cartridge, and the mounting portion has multiple or one mounting position. For example, the mounting portion 90 has four mounting positions, each mounting position can be inserted into one mounting position, and the four ink cartridges can store four different colors of ink, such as black, yellow, blue, and red.
本实施方式提供的安装部是一个近似长方体或者正方体的具有开口的部件,安装部的内侧壁及底壁90a构成了安装位。触针组件91安装在安装部的第一侧壁90c上,安装位在Y轴方向上依次排列,四个安装位在Y轴方向上依次排列。同时垂直于Y轴和Z轴的方向为X轴方向,其中,从安装部90内部指向触针组件91的方向为+X轴方向。+X轴垂直于第一侧壁90c,沿+X轴方向观察,在YZ平面上,+Z轴在上方时,+Y轴方向位于左侧。The mounting portion provided in this embodiment is a component with an opening that is approximately a rectangular parallelepiped or a cube, and the inner side wall and the bottom wall 90a of the mounting portion constitute the mounting position. The stylus assembly 91 is mounted on the first side wall 90c of the mounting portion, and the mounting positions are arranged in sequence in the Y-axis direction, and the four mounting positions are arranged in sequence in the Y-axis direction. The direction that is perpendicular to the Y-axis and the Z-axis at the same time is the X-axis direction, wherein the direction from the inside of the mounting portion 90 to the stylus assembly 91 is the +X-axis direction. The +X-axis is perpendicular to the first side wall 90c, and when viewed along the +X-axis direction, on the YZ plane, when the +Z-axis is at the top, the +Y-axis direction is on the left.
继续参阅图4,触针组件91具有:基座910、安装在基座910上的多个触针。例如基座910上设置有五个触针,五个触针分别为第一触针911-第五触针915,各触针为薄片状的金属片,可以起到导电作用,且不易磨损。相应地,基座910具有多个与触针相对应的狭缝981-985。其中,狭缝981、982、983、984、985分别与触针911、912、913、914、915对应,多个狭缝981-985均呈U字形,其具有+Z轴方向的狭缝口,多个触针911-915沿-Z轴方向分别通过狭缝口安装到狭缝981-985中。Continuing to refer to FIG. 4 , the stylus assembly 91 comprises: a base 910 and a plurality of stylus pins mounted on the base 910. For example, five stylus pins are arranged on the base 910, and the five stylus pins are respectively the first stylus pin 911 to the fifth stylus pin 915. Each stylus pin is a thin sheet of metal, which can play a conductive role and is not easy to wear. Accordingly, the base 910 has a plurality of slits 981-985 corresponding to the stylus pins. Among them, the slits 981, 982, 983, 984, 985 correspond to the stylus pins 911, 912, 913, 914, 915, respectively. The plurality of slits 981-985 are all U-shaped, and have a slit opening in the +Z axis direction. The plurality of stylus pins 911-915 are respectively installed in the slits 981-985 through the slit opening along the -Z axis direction.
具体地,第一触针911沿-Z轴方向通过狭缝口安装到第一狭缝981中;第二触针912-第五触针915的安装方式与之相同,在此不重复阐述。第一触针911-第五触针915中的每一个触针的一侧通过安装部的内部电路连接到打印机的主电路上,另一侧暴露于安装部90的容纳腔内,且当墨盒插装至容纳腔时,可与芯片20的各通信端子电连接。Specifically, the first contact pin 911 is installed in the first slit 981 through the slit opening along the -Z axis direction; the installation method of the second contact pin 912 to the fifth contact pin 915 is the same, and will not be repeated here. One side of each of the first contact pin 911 to the fifth contact pin 915 is connected to the main circuit of the printer through the internal circuit of the installation part, and the other side is exposed in the accommodating cavity of the installation part 90, and when the ink cartridge is inserted into the accommodating cavity, it can be electrically connected to each communication terminal of the chip 20.
本申请实施例中第一触针911-第五触针915的结构一致,本实施例以第一触针911为例对各触针的结构进行说明。如图5所示,第一触针911分为第一部分911a、第二部分911b和第三部分911c。其中第一部分911a用于与芯片20的通信端子电连接,并形成第一接触部;第二部分911b与打印机的内部电路相连接。The structures of the first contact pin 911 to the fifth contact pin 915 in the embodiment of the present application are consistent. This embodiment takes the first contact pin 911 as an example to illustrate the structures of each contact pin. As shown in FIG5 , the first contact pin 911 is divided into a first part 911a, a second part 911b and a third part 911c. The first part 911a is used to electrically connect to the communication terminal of the chip 20 and form a first contact portion; the second part 911b is connected to the internal circuit of the printer.
第三部分911c与第一部分911a、第二部分911b相连接,第三部分911c位于第一触针911的+Z轴方向,第一触针911通过第三部分911c或者是第三部分911c的一部分(例如是第三部分911c的水平部分911h)固定在第一狭缝981。第一部分911a、第二部分911b设置在第一触针911的-Z轴方向的末端,使得第一部分911a、第二部分911b可以弹性变形且变形后易恢复至原状。第一触针911的第一部分911a设置在-X轴方向,第二部分911b设置在+X轴方向。第一部分911a、第二部分911b突出于基座910,第三部分911c非突出于基座910。The third part 911c is connected to the first part 911a and the second part 911b, and the third part 911c is located in the +Z axis direction of the first contact pin 911. The first contact pin 911 is fixed to the first slit 981 through the third part 911c or a part of the third part 911c (for example, the horizontal part 911h of the third part 911c). The first part 911a and the second part 911b are arranged at the ends of the first contact pin 911 in the -Z axis direction, so that the first part 911a and the second part 911b can be elastically deformed and easily restored to their original state after deformation. The first part 911a of the first contact pin 911 is arranged in the -X axis direction, and the second part 911b is arranged in the +X axis direction. The first part 911a and the second part 911b protrude from the base 910, and the third part 911c does not protrude from the base 910.
进一步地,第一部分911a、第二部分911b在X轴方向上突出于基座910,且基座910位于第一部分911a与第二部分911b之间。第一部分911a相比第二部分911b更靠近安装位,即第一部分911a可与芯片20电连接。Furthermore, the first portion 911a and the second portion 911b protrude from the base 910 in the X-axis direction, and the base 910 is located between the first portion 911a and the second portion 911b. The first portion 911a is closer to the mounting position than the second portion 911b, that is, the first portion 911a can be electrically connected to the chip 20.
第三部分911c包括垂直于X轴方向的第一垂直部分911k与第二垂直部分911j、平行于X轴方向的水平部分911h,其中水平部分911h连接第一垂直部分911k与第二垂直部分911j。第一垂直部分911k与第二垂直部分911j沿Z轴方向上、下延伸。第一垂直部分911k相比第二垂直部分911j更靠近安装位,第一垂直部分911k的末端连接第一部分911a,第二垂直部分911j的末端连接第二部分911b,水平部分911h或者第一垂直部分911k、第二垂直部分911j在+Z轴方向上固定在第一狭缝981。The third portion 911c includes a first vertical portion 911k and a second vertical portion 911j perpendicular to the X-axis direction, and a horizontal portion 911h parallel to the X-axis direction, wherein the horizontal portion 911h connects the first vertical portion 911k and the second vertical portion 911j. The first vertical portion 911k and the second vertical portion 911j extend up and down along the Z-axis direction. The first vertical portion 911k is closer to the mounting position than the second vertical portion 911j, the end of the first vertical portion 911k is connected to the first portion 911a, the end of the second vertical portion 911j is connected to the second portion 911b, and the horizontal portion 911h or the first vertical portion 911k and the second vertical portion 911j are fixed to the first slit 981 in the +Z-axis direction.
继续参阅图5,第一部分911a包括第一表面部911a1、第二表面部911a2、第三表面部911a3以及第四表面部(图中未示出),其中第三表面部911a3与第四表面部沿X方向相对设置,第一表面部911a1与第二表面部911a2围合区域形成山脊区,第一垂直部分911k就是垂直区,而第二部分911b就是另一山脊区,第二垂直部分911j就是另一垂直区。第二触针912-第五触针915与第一触针911具有相同的布置、结构,此处不再赘述。Continuing to refer to FIG. 5, the first portion 911a includes a first surface portion 911a1, a second surface portion 911a2, a third surface portion 911a3 and a fourth surface portion (not shown in the figure), wherein the third surface portion 911a3 and the fourth surface portion are arranged opposite to each other along the X direction, the first surface portion 911a1 and the second surface portion 911a2 enclose an area to form a ridge region, the first vertical portion 911k is the vertical region, the second portion 911b is another ridge region, and the second vertical portion 911j is another vertical region. The second contact pins 912 to the fifth contact pins 915 have the same arrangement and structure as the first contact pin 911, and will not be described in detail here.
如图6和图7所示,本实施例提供的芯片20具有存储器100、基板120以及多个端子130(通信端子组)。基板120具有前表面120a,后表面120b,左侧面120c,右侧面120d、顶面120e(图中未示出)以及底面120f。As shown in Figures 6 and 7, the chip 20 provided in this embodiment has a memory 100, a substrate 120, and a plurality of terminals 130 (communication terminal group). The substrate 120 has a front surface 120a, a rear surface 120b, a left side 120c, a right side 120d, a top surface 120e (not shown in the figure), and a bottom surface 120f.
其中,前表面120a与后表面120b相对设置,且前表面120a位于后表面120b的+X侧;左侧面120c与右侧面120d相对设置,且左侧面120c位于右侧面120d的-Y轴侧;顶面120e和底面120f相对设置,且顶面120e位于底面120f的+Z轴侧。Among them, the front surface 120a is arranged opposite to the rear surface 120b, and the front surface 120a is located on the +X side of the rear surface 120b; the left side surface 120c is arranged opposite to the right side surface 120d, and the left side surface 120c is located on the -Y axis side of the right side surface 120d; the top surface 120e and the bottom surface 120f are arranged opposite to each other, and the top surface 120e is located on the +Z axis side of the bottom surface 120f.
进一步地,前表面120a上设置有多个端子130,故前表面120a也称为第一端子面。例如前表面120a上设置有第一端子131、第二端子132、第三端子133以及第四端子134,第一端子131、第二端子132、第三端子133以及第四端子134在Y轴上位置均不相同,第一端子131、第四端子134在Z轴上位置相同,第二端子132、第三端子133在Z轴上位置相同,但第一端子131、第三端子133在Z轴上位置不相同。Further, a plurality of terminals 130 are disposed on the front surface 120a, so the front surface 120a is also referred to as a first terminal surface. For example, a first terminal 131, a second terminal 132, a third terminal 133, and a fourth terminal 134 are disposed on the front surface 120a, and the first terminal 131, the second terminal 132, the third terminal 133, and the fourth terminal 134 are all at different positions on the Y axis, the first terminal 131 and the fourth terminal 134 are at the same position on the Z axis, the second terminal 132 and the third terminal 133 are at the same position on the Z axis, but the first terminal 131 and the third terminal 133 are at different positions on the Z axis.
进一步地,第一端子131、第二端子132、第三端子133以及第四端子134均配置成通信端子。第一端子131(数据端子)配置为用于进行数据信号的发送或者接收;第二端子132(时钟端子)配置为用于接收时钟信号的时钟端子;第三端子133(电源端子)配置为用于向存储器100提供工作电压;第四端子134(复位端子)用于对存储器100内部数据进行复位。Furthermore, the first terminal 131, the second terminal 132, the third terminal 133 and the fourth terminal 134 are all configured as communication terminals. The first terminal 131 (data terminal) is configured to send or receive a data signal; the second terminal 132 (clock terminal) is configured as a clock terminal for receiving a clock signal; the third terminal 133 (power supply terminal) is configured to provide an operating voltage to the memory 100; and the fourth terminal 134 (reset terminal) is used to reset the internal data of the memory 100.
每个通信端子都具有一个接触部C,接触部C使用圆表示。多个通信端子所具有多个接触部C,其分别为第一接触部C1—第四接触部C4。接触部C是当墨盒10安装到打印机上时,触针在端子130上的最可能的接触区域。Each communication terminal has a contact portion C, which is represented by a circle. Multiple communication terminals have multiple contact portions C, which are respectively the first contact portion C1 to the fourth contact portion C4. The contact portion C is the most likely contact area of the contact pin on the terminal 130 when the ink cartridge 10 is installed on the printer.
通信端子组包括数据端子(第一端子131)、复位端子(第四端子134)、电源端子(第三端子133)、时钟端子(第二端子132);沿墨盒10安装到打印装置的安装方向P,通信端子组的各端子与触针组件相接触的接触部C1-C4分两排排列。The communication terminal group includes a data terminal (first terminal 131), a reset terminal (fourth terminal 134), a power terminal (third terminal 133), and a clock terminal (second terminal 132); along the installation direction P of the ink cartridge 10 to the printing device, the contact parts C1-C4 of each terminal of the communication terminal group that contact the contact pin assembly are arranged in two rows.
在安装方向P上(即图中Z轴方向),数据端子的接触部C1、复位端子的接触部C4设置在上游侧;电源端子的接触部C3、时钟端子的接触部C2设置在下游侧。In the installation direction P (ie, the Z-axis direction in the figure), the contact portion C1 of the data terminal and the contact portion C4 of the reset terminal are arranged on the upstream side; the contact portion C3 of the power terminal and the contact portion C2 of the clock terminal are arranged on the downstream side.
本申请实施例中存储器100与上述通信端子均分别设置在基板120上,存储器100需接地,可视为“接地端子”。存储器100需要与打印装置之间进行接地信号的传输、交互,使得墨盒正常安装到打印装置内且执行相应任务。In the embodiment of the present application, the memory 100 and the above-mentioned communication terminal are respectively arranged on the substrate 120, and the memory 100 needs to be grounded and can be regarded as a "ground terminal". The memory 100 needs to transmit and interact with the printing device for grounding signals so that the ink cartridge can be normally installed in the printing device and perform corresponding tasks.
需要说明的是,存储器100用于存储生产厂信息、墨水量信息、墨盒类别信息、墨水颜色等信息。当墨盒10安装到打印机的安装部内时,存储器100与打印机之间会进行数据传输、确认、数据交互等,且二者通过通信端子与打印机各触针之间的连接而实现的。It should be noted that the memory 100 is used to store information such as manufacturer information, ink volume information, ink cartridge category information, ink color, etc. When the ink cartridge 10 is installed in the installation part of the printer, data transmission, confirmation, data interaction, etc. will be performed between the memory 100 and the printer, and the two are realized through the connection between the communication terminal and each contact pin of the printer.
进一步地,存储器100可以设置在前表面120a—底面120f的任一或者任几个面上。优选的,存储器100设置在后表面120b上。基板120的具体形状结构不做限定,本领域技术人员可以根据具体的设计需求进行设置,例如可以将芯片20设置为矩形结构、切角矩形结构、圆角矩形结构、T形结构、梯形结构、平行四边形结构均可。Further, the memory 100 can be arranged on any one or several surfaces of the front surface 120a to the bottom surface 120f. Preferably, the memory 100 is arranged on the rear surface 120b. The specific shape and structure of the substrate 120 are not limited, and those skilled in the art can set it according to specific design requirements. For example, the chip 20 can be set to a rectangular structure, a cut-corner rectangular structure, a rounded rectangular structure, a T-shaped structure, a trapezoidal structure, or a parallelogram structure.
此外,对于存储器100在基板120的设置的位置不做限定,例如可以将存储器100设置于芯片20上靠近方向-Z轴的后端的一侧,或者也可以将存储器100设置于芯片20上靠近方向+Z轴的前端的一侧,还可以将存储器100设置于芯片20的中部,本领域技术人员可以根据具体的设计需求进行设置,此处不再赘述。In addition, there is no limitation on the location of the memory 100 on the substrate 120. For example, the memory 100 can be set on the side of the chip 20 near the rear end in the direction of the -Z axis, or the memory 100 can be set on the side of the chip 20 near the front end in the direction of the +Z axis, or the memory 100 can be set in the middle of the chip 20. Those skilled in the art can make settings according to specific design requirements, which will not be repeated here.
继续参阅图6,在本实施方式中存储器100设置在后表面120b上,并靠近右侧面120d及顶面120e设置。连接件135(亦可以称为导通构件)由具有一定硬度的导电材质制成,并通过焊锡连接在导电片135a(亦可以称为接地端子)处,导电片135a(亦可以称为接地端子)通过基板120内置的电路/导电线连接存储器100,进而使连接件135与存储器100连接。Continuing to refer to FIG. 6 , in this embodiment, the memory 100 is disposed on the rear surface 120b and is disposed near the right side surface 120d and the top surface 120e. The connector 135 (also referred to as a conducting member) is made of a conductive material having a certain hardness and is connected to the conductive sheet 135a (also referred to as a grounding terminal) by soldering. The conductive sheet 135a (also referred to as a grounding terminal) is connected to the memory 100 through the circuit/conductive wire built into the substrate 120, thereby connecting the connector 135 to the memory 100.
导电片135a(亦可以称为接地端子)可以看作时芯片20的一部分,具体的,导电片135a(亦可以称为接地端子)可以是芯片20上的覆铜(电镀工艺实现),可以将导通构件135、存储器100电连接。连接件135(亦可以称为导通构件)可以与导电片135a(亦可以称为接地端子)之间焊接或者抵接或者其它接触形式,只要能够电连接即可。The conductive sheet 135a (also called the ground terminal) can be regarded as a part of the chip 20. Specifically, the conductive sheet 135a (also called the ground terminal) can be copper-clad (realized by electroplating process) on the chip 20, and can electrically connect the conductive component 135 and the memory 100. The connector 135 (also called the conductive component) can be welded or abutted or in other contact forms with the conductive sheet 135a (also called the ground terminal), as long as it can be electrically connected.
连接件135(亦可以称为导通构件)设置于装配仓内,连接件135配置为将导电片135a(亦可以称为接地端子)和接地部件电连接。进一步的,墨盒10与打印装置之间通过接地端子135a、导通构件135、接地部件传输接地信号。可选的,墨盒10与打印装置之间通过芯片上的存储器100、导通构件135、接地部件传输接地信号的。进一步的,墨盒10与打印装置之间通过芯片上的存储器100、接地端子135a、导通构件135、接地部件传输接地信号的。The connector 135 (also referred to as a conducting member) is disposed in the assembly compartment, and the connector 135 is configured to electrically connect the conductive sheet 135a (also referred to as a grounding terminal) and the grounding component. Further, the ink cartridge 10 and the printing device transmit a grounding signal through the grounding terminal 135a, the conducting member 135, and the grounding component. Optionally, the ink cartridge 10 and the printing device transmit a grounding signal through the memory 100 on the chip, the conducting member 135, and the grounding component. Further, the ink cartridge 10 and the printing device transmit a grounding signal through the memory 100 on the chip, the grounding terminal 135a, the conducting member 135, and the grounding component.
因连接件135(亦可以称为导通构件)与芯片存储器100、接地端子135a之间有电连接,故连接件135(亦可以称为导通构件)也可以视为芯片20。即,芯片20包括:存储器100、基板120、通信端子组130、导通构件135、接地端子135a。Since the connector 135 (also referred to as a conducting member) is electrically connected to the chip memory 100 and the ground terminal 135a, the connector 135 (also referred to as a conducting member) can also be regarded as the chip 20. That is, the chip 20 includes: the memory 100, the substrate 120, the communication terminal group 130, the conducting member 135, and the ground terminal 135a.
触针组件91中的触针911-914可发生形变,接地部件不可形变;当芯片20与触针911-914接触时,至少一个触针发生形变;当导通构件105与接地部件相接触时,接地部件不发生形变,肉眼不可视的微小形变也属于不可形变的情况。此结构有利于保证了芯片20的电信号,特别是接地信号的传输的稳定性。The contact pins 911-914 in the contact pin assembly 91 can be deformed, but the grounding component cannot be deformed; when the chip 20 contacts the contact pins 911-914, at least one contact pin is deformed; when the conductive member 105 contacts the grounding component, the grounding component does not deform, and even tiny deformations that are invisible to the naked eye are also considered non-deformable. This structure is beneficial for ensuring the stability of the transmission of the electrical signals of the chip 20, especially the grounding signals.
需要说明的是,通常接地信号是由打印装置的总CPU输出的,接地信号由总CPU输出到触针组件的接地触针、接地部件等。当墨盒安装到打印装置上时,墨盒、打印装置之间要保持接地信号的互通。相关技术中,墨盒与打印装置之间是依次通过芯片端子组的接地子端子、接地触针传输接地信号的。It should be noted that the ground signal is usually output by the main CPU of the printing device, and the ground signal is output by the main CPU to the ground contact pin of the contact pin assembly, the ground component, etc. When the ink cartridge is installed on the printing device, the ground signal must be interconnected between the ink cartridge and the printing device. In the related art, the ground signal is transmitted between the ink cartridge and the printing device through the ground sub-terminal and the ground contact pin of the chip terminal group in sequence.
然而本申请中通过接地端子、导通构件、接地部件传输接地信号的。可选的,本申请是通过芯片上的存储器、导通构件(也可称为连接件)、接地部件传输接地信号的。可选的,本申请是通过芯片上的存储器、接地端子、导通构件(也可称为连接件)、接地部件传输接地信号的,能够提升接地信号传输的稳定性。However, in the present application, the ground signal is transmitted through the ground terminal, the conductive component, and the ground component. Optionally, the present application transmits the ground signal through the memory on the chip, the conductive component (also referred to as the connector), and the ground component. Optionally, the present application transmits the ground signal through the memory on the chip, the ground terminal, the conductive component (also referred to as the connector), and the ground component, which can improve the stability of the ground signal transmission.
本实施例对芯片上设置的通信端子组以及接地端子在芯片基板上的布局进行详细说明。This embodiment describes in detail the layout of the communication terminal group and the grounding terminals provided on the chip on the chip substrate.
如图7所示,本实施例中芯片20包括基板120,基板120包括相对设置的第一表面120a和第二表面120b,第一表面120a和第二表面120b,其中第一表面120a为基板120的前表面,第二表面120b为基板的后表面。第一表面120a配置为基板靠近打印机的触针组件91的表面,第一表面120a设置有通信端子组,通信端子组包括多个通信端子131-134。As shown in FIG7 , in this embodiment, the chip 20 includes a substrate 120, and the substrate 120 includes a first surface 120a and a second surface 120b that are arranged opposite to each other, wherein the first surface 120a is the front surface of the substrate 120, and the second surface 120b is the rear surface of the substrate. The first surface 120a is configured as a surface of the substrate close to the stylus assembly 91 of the printer, and the first surface 120a is provided with a communication terminal group, and the communication terminal group includes a plurality of communication terminals 131-134.
进一步地,芯片还包括接地端子135a,接地端子135a设置于第一表面120a或第二表面120b上,并且接地端子135a与导通构件135电连接,并形成芯片的接地位点。Furthermore, the chip further includes a ground terminal 135 a , which is disposed on the first surface 120 a or the second surface 120 b , and is electrically connected to the conductive component 135 , and forms a grounding point of the chip.
在一种实施方式中,第一表面120a具有正交的第一方向和第二方向,且第一方向配置为墨盒10安装到打印装置的安装方向。上述每一通信端子具备与触针之间所接触形成的第一接触部相对第一表面120a具有第一投影,多个第一接触部在第一表面120a上的第一投影围成第一区域,导通构件与接地端子所形成的接地位点在第一表面120a具有第二投影。In one embodiment, the first surface 120a has a first direction and a second direction that are orthogonal to each other, and the first direction is configured as the installation direction of the ink cartridge 10 installed on the printing device. Each of the communication terminals has a first contact portion formed by contact with the contact pin, and has a first projection relative to the first surface 120a. The first projections of the plurality of first contact portions on the first surface 120a enclose a first area, and the grounding point formed by the conductive member and the grounding terminal has a second projection on the first surface 120a.
沿第二方向,至少部分第二投影位于第一区域的外部,换言之,在第二方向上,部分第二投影位于第一区域内,至少部分第二投影位于第一区域外。例如,部分第二投影位于第一区域外,此情形下在第二方向上,第二投影靠近第一区域的一侧,且与第一区域之间的距离小于第一区域的长度。可选的,在第二方向上,第二投影与第一区域存在重合。Along the second direction, at least part of the second projection is located outside the first area. In other words, in the second direction, part of the second projection is located in the first area, and at least part of the second projection is located outside the first area. For example, part of the second projection is located outside the first area. In this case, in the second direction, the second projection is close to one side of the first area, and the distance between the second projection and the first area is less than the length of the first area. Optionally, in the second direction, the second projection overlaps with the first area.
芯片20还可以有以下变形例,不同的芯片变形例均可以安装在墨盒10上。The chip 20 may also have the following variations, and different chip variations may be installed on the ink cartridge 10 .
芯片的变形例一:Chip modification example 1:
如图8至图10所示,本变形例与实施例一的芯片不同之处在于:本变形例提供的芯片20具有存储器100、基板120、端子组(相当于实施例一的通信端子组)。As shown in FIG. 8 to FIG. 10 , the difference between the chip of this variation and the chip of the first embodiment is that the chip 20 provided in this variation has a memory 100 , a substrate 120 , and a terminal group (equivalent to the communication terminal group of the first embodiment).
存储器100与端子组(相当于实施例一的通信端子组)设置在芯片基板120上,存储器100用于存储生产厂信息、墨水量信息、耗材盒类别信息、墨水颜色等信息。当耗材盒10安装到打印机的安装部90内时,存储器100与打印机之间会进行数据传输、确认、数据交互等,且二者是通过端子组与打印机触针之间的连接而实现的。进一步的,端子组中的每个端子的形状可以是其它形状,比如:长方形、正方形、圆形、梯形或者是其它不规则形状。The memory 100 and the terminal group (equivalent to the communication terminal group of the first embodiment) are arranged on the chip substrate 120, and the memory 100 is used to store information such as the manufacturer information, the ink volume information, the consumable box category information, the ink color, etc. When the consumable box 10 is installed in the installation part 90 of the printer, data transmission, confirmation, data interaction, etc. will be performed between the memory 100 and the printer, and the two are realized through the connection between the terminal group and the printer contact pin. Furthermore, the shape of each terminal in the terminal group can be other shapes, such as: rectangular, square, circular, trapezoidal or other irregular shapes.
本变形例在前表面120a上设置有端子组,端子组包括多个端子(131-139)。当然,存储器100可以设置在前表面120a——底面120f的任一或者任几个面上,在Z轴方向上,顶面120e和底面120f相对设置。芯片20的具体形状结构不做限定,本领域技术人员可以根据具体的设计需求进行设置,如可以将芯片20设置为矩形结构、切角矩形结构、圆角矩形结构、T形结构、梯形结构、平行四边形结构均可。In this variation, a terminal group is provided on the front surface 120a, and the terminal group includes a plurality of terminals (131-139). Of course, the memory 100 can be provided on any one or several surfaces of the front surface 120a-bottom surface 120f, and in the Z-axis direction, the top surface 120e and the bottom surface 120f are relatively arranged. The specific shape and structure of the chip 20 are not limited, and those skilled in the art can set it according to specific design requirements, such as the chip 20 can be set to a rectangular structure, a cut-corner rectangular structure, a rounded rectangular structure, a T-shaped structure, a trapezoidal structure, or a parallelogram structure.
此外,对于存储器100设置的位置不做限定,如可以将存储器100设置于芯片20上靠近安装方向的后端的一侧,或者也可以将存储器100设置于芯片20上靠近安装方向的前端的一侧,还可以将存储器100设置于芯片20的中部,本领域技术人员可以根据具体的设计需求进行设置,在此不再赘述。In addition, there is no limitation on the location of the memory 100. For example, the memory 100 can be set on the side of the chip 20 close to the rear end of the installation direction, or the memory 100 can be set on the side of the chip 20 close to the front end of the installation direction, or the memory 100 can be set in the middle of the chip 20. Those skilled in the art can make settings according to specific design requirements, which will not be repeated here.
本实施例中端子组包含9个端子,其各个端子的功能及作用为:第一端子131;第二端子132(复位端子):用于对晶元内部数据进行复位;第三端子133(时钟端子):用于接收时钟信号;第四端子134;第五端子135;第六端子136(电源端子):用于接收不同于接地电位的电源电位(比如3.6V),通过此端子为存储器100的工作提供电源;第七端子137a、137b、137c、137d(接地端子):用于间接接收接地电位;第八端子138(数据端子):用于进行数据信号的发送或者接收,第九端子139。In this embodiment, the terminal group includes 9 terminals, and the functions and effects of each terminal are as follows: a first terminal 131; a second terminal 132 (reset terminal): used to reset the internal data of the chip; a third terminal 133 (clock terminal): used to receive a clock signal; a fourth terminal 134; a fifth terminal 135; a sixth terminal 136 (power terminal): used to receive a power potential different from the ground potential (for example, 3.6V), and provide power for the operation of the memory 100 through this terminal; a seventh terminal 137a, 137b, 137c, 137d (ground terminal): used to indirectly receive the ground potential; an eighth terminal 138 (data terminal): used to send or receive data signals, and a ninth terminal 139.
本实施例中第三端子组包括第一端子131、第四端子134,第二端子组包括第五端子135、第九端子139,第三端子组、第二端子组均为安装检测端子,其中第一端子131、第四端子134也可以为短路检测端子,其他端子为第一端子组。当耗材盒10安装到打印机上时,安装检测端子与打印机之间发生电信号传输,为耗材盒10是否安装做检测。此外,第五端子135及第九端子139也称为高压端子,用于接收安装检测电压(比如42V),完成耗材盒安装到安装部上的安装检测功能。In this embodiment, the third terminal group includes a first terminal 131 and a fourth terminal 134, and the second terminal group includes a fifth terminal 135 and a ninth terminal 139. The third terminal group and the second terminal group are both installation detection terminals, wherein the first terminal 131 and the fourth terminal 134 may also be short circuit detection terminals, and the other terminals are the first terminal group. When the consumable box 10 is installed on the printer, an electrical signal is transmitted between the installation detection terminal and the printer to detect whether the consumable box 10 is installed. In addition, the fifth terminal 135 and the ninth terminal 139 are also called high-voltage terminals, which are used to receive an installation detection voltage (such as 42V) to complete the installation detection function of the consumable box installed on the installation portion.
例如,第五端子135、第九端子139之间连接一个高电阻(比如:62kΩ),通过检测电流或者电压的变化来判断耗材盒10是否已经安装到安装部内。第一端子131、第四端子134:也称为短路检测端子,通过检测端子上的电压变化来检测芯片20上是否有短路的情况;同时可通过二者是否连接来判定耗材盒10是否安装到打印机上。For example, a high resistor (e.g., 62 kΩ) is connected between the fifth terminal 135 and the ninth terminal 139, and the change in current or voltage is detected to determine whether the consumable box 10 has been installed in the installation portion. The first terminal 131 and the fourth terminal 134 are also called short circuit detection terminals. The voltage change on the terminals is detected to detect whether there is a short circuit on the chip 20; at the same time, whether the consumable box 10 is installed on the printer can be determined by whether the two are connected.
此外,第一端子131、第四端子134还用于检测端子之间是否发生短路,具体的,用于检测第五端子135/第九端子139与第一端子131/第四端子134之间是否发生短路。当第五端子135/第九端子139与第一端子131/第四端子134之间短路时,打印机就能检测到第一端子131/第四端子134上的电压被升高了,随即打印机提示短路信息,避免了芯片或者打印机因短路被损坏的风险。In addition, the first terminal 131 and the fourth terminal 134 are also used to detect whether a short circuit occurs between the terminals, specifically, to detect whether a short circuit occurs between the fifth terminal 135/the ninth terminal 139 and the first terminal 131/the fourth terminal 134. When a short circuit occurs between the fifth terminal 135/the ninth terminal 139 and the first terminal 131/the fourth terminal 134, the printer can detect that the voltage on the first terminal 131/the fourth terminal 134 is increased, and then the printer prompts a short circuit information, thereby avoiding the risk of the chip or the printer being damaged due to the short circuit.
端子组中的每个端子都具有各自的接触部,在图8中由圆点表示。接触部是当耗材盒10安装到打印机上时,触针在端子上的最可能的接触区域。沿着与安装方向P方向相垂直的方向上观察,排列顺序为接地端子(第七端子137a、137b、137c、137d),一个第二接触部,一个第三接触部,第一接触部分,另一个第三接触部,另一个第二接触部,或者接地端子与第五端子135沿着Z方向上处于一条直线(如图8所示),当然,接地端子可以设置在芯片前表面120a上或者是后表面120b上,比如,接地端子可以为图8、9中所示的137a、137b、137c、137d四种位置排布,在本实施例中优选的将接地端子137a、137b、137c、137d设置在前表面120a或者后表面120b上,其排布方式为,接地端子位于第五端子135的+Z方向上或者在+Z方向偏向-Y方向侧。Each terminal in the terminal group has a respective contact portion, represented by a dot in Figure 8. The contact portion is the most likely contact area of the contact pin on the terminal when the consumable cartridge 10 is installed in the printer. When observed in a direction perpendicular to the installation direction P, the arrangement order is a ground terminal (seventh terminal 137a, 137b, 137c, 137d), a second contact portion, a third contact portion, a first contact portion, another third contact portion, another second contact portion, or the ground terminal and the fifth terminal 135 are in a straight line along the Z direction (as shown in FIG8). Of course, the ground terminal can be set on the front surface 120a of the chip or on the rear surface 120b. For example, the ground terminal can be arranged in the four positions of 137a, 137b, 137c, and 137d shown in FIGS. 8 and 9. In the present embodiment, the ground terminals 137a, 137b, 137c, and 137d are preferably set on the front surface 120a or the rear surface 120b. The arrangement method is that the ground terminal is located in the +Z direction of the fifth terminal 135 or in the +Z direction toward the -Y direction side.
可选的,沿着Z方向上,接地端子(第七端子)与第一端子131处于一条直线上。可选的,沿着Z方向上,接地端子(第七端子)与第一端子131、第五端子135的至少一部分重叠。可选的,沿着Z方向上,接地端子(第七端子)与第一端子131的至少一部分重叠。可选的,沿着Z方向上,接地端子(第七端子)与第五端子135的至少一部分重叠。可选的,沿着Z方向上,接地端子(第七端子)与第四端子134、第九端子139的至少一部分重叠。可选的,沿着Z方向上,接地端子(第七端子)与第四端子134的至少一部分重叠。可选的,沿着Z方向上,接地端子(第七端子)与第九端子139的至少一部分重叠。接地端子(第七端子)与存储器100、导通构件140相电连接。Optionally, along the Z direction, the ground terminal (seventh terminal) and the first terminal 131 are in a straight line. Optionally, along the Z direction, the ground terminal (seventh terminal) overlaps with at least a portion of the first terminal 131 and the fifth terminal 135. Optionally, along the Z direction, the ground terminal (seventh terminal) overlaps with at least a portion of the first terminal 131. Optionally, along the Z direction, the ground terminal (seventh terminal) overlaps with at least a portion of the fifth terminal 135. Optionally, along the Z direction, the ground terminal (seventh terminal) overlaps with at least a portion of the fourth terminal 134 and the ninth terminal 139. Optionally, along the Z direction, the ground terminal (seventh terminal) overlaps with at least a portion of the fourth terminal 134. Optionally, along the Z direction, the ground terminal (seventh terminal) overlaps with at least a portion of the ninth terminal 139. The ground terminal (seventh terminal) is electrically connected to the memory 100 and the conductive member 140.
如图11所示,在本实施例中存储器100设置在后表面120b上,在基板120的后表面120b靠近右侧面120d、顶面120e处,连接件140(相当于实施例一的导通构件,由具有一定硬度的导电材质制成)通过焊锡/抵接连接在导电片140a(相当于实施例一的接地端子)处,导电片140a为预制在基板的后表面120b的触点,此触点通过设置在基板120内部的导电线与存储器100相连接,进而实现连接件140与存储器100电连接。As shown in Figure 11, in this embodiment, the memory 100 is arranged on the rear surface 120b. On the rear surface 120b of the substrate 120, close to the right side 120d and the top surface 120e, the connector 140 (equivalent to the conductive component of the first embodiment, made of a conductive material with a certain hardness) is connected to the conductive sheet 140a (equivalent to the ground terminal of the first embodiment) through soldering/abutment. The conductive sheet 140a is a contact prefabricated on the rear surface 120b of the substrate. This contact is connected to the memory 100 through a conductive wire arranged inside the substrate 120, thereby realizing the electrical connection between the connector 140 and the memory 100.
芯片变形例二:Chip variation example 2:
本变形例与实施例一的芯片不同的有:如图12和图13所示,基板上的端子组130包括四个通信端子,四个通信端子分别定义为第一端子131、第二端子132、第三端子133及第四端子134,其中第一端子131(数据端子)用于进行数据信号的发送或者接收;第二端子132(时钟端子)用于接收时钟信号;第三端子133(电源端子)用于接收不同于接地电位的电源电位(比如3.6V/3.3V),通过此端子为存储器的工作提供电源;第四端子134(复位端子)用于对晶元内部数据进行复位或者将处理装置调至可响应状态。The chip of this variant example is different from that of the first embodiment in that: as shown in FIGS. 12 and 13 , the terminal group 130 on the substrate includes four communication terminals, which are respectively defined as a first terminal 131, a second terminal 132, a third terminal 133 and a fourth terminal 134, wherein the first terminal 131 (data terminal) is used for sending or receiving data signals; the second terminal 132 (clock terminal) is used for receiving clock signals; the third terminal 133 (power terminal) is used for receiving a power potential different from the ground potential (such as 3.6V/3.3V), and power is provided for the operation of the memory through this terminal; the fourth terminal 134 (reset terminal) is used for resetting the internal data of the chip or adjusting the processing device to a responsive state.
各接触部C1-C4在第一表面上具有第一投影,其中第一表面包括正交的第一方向和第二方向;其中第一方向配置为墨盒安装到打印装置的安装方向P,此状况下第一表面与第一方向(也就是安装方向P)平行;或者,第一方向配置为墨盒安装到打印装置的安装方向P在第一表面的投影线的延伸方向,第一表面可相对第一方向倾斜,即基板倾斜设置于墨盒本体上。Each contact portion C1-C4 has a first projection on the first surface, wherein the first surface includes a first direction and a second direction that are orthogonal to each other; wherein the first direction is configured as an installation direction P of the ink cartridge to be installed on the printing device, in which case the first surface is parallel to the first direction (i.e., the installation direction P); or, the first direction is configured as an extension direction of a projection line of the installation direction P of the ink cartridge to be installed on the printing device on the first surface, and the first surface may be inclined relative to the first direction, i.e., the substrate is obliquely arranged on the ink cartridge body.
例如,附图中的第一方向为Z轴方向,X轴方向为第二方向,且第二方向与第一方向垂直,此时第一表面可以是基板的前表面120a或后表面120b。上述各接触部在第一表面的第一投影围成第一区域M。例如基板包括沿基板中心线布置的区域Q1和区域Q2,且第一区域M位于区域Q1内,上述第一端子至第四端子均位于区域Q1内,且各形成的接触部均在第一区域M内,当然第一区域也位于区域Q1内。For example, the first direction in the figure is the Z-axis direction, the X-axis direction is the second direction, and the second direction is perpendicular to the first direction. In this case, the first surface can be the front surface 120a or the rear surface 120b of the substrate. The first projection of each of the above-mentioned contact portions on the first surface encloses a first region M. For example, the substrate includes a region Q1 and a region Q2 arranged along the center line of the substrate, and the first region M is located in the region Q1, the first terminal to the fourth terminal are all located in the region Q1, and each of the formed contact portions is in the first region M, and of course the first region is also located in the region Q1.
进一步地,基板的后表面还设置有接地端子,接地端子有可以称为第五端子/附加端子,其中接地端子135a、135b、135c、135d(相当于实施例一的接地端子)连接导通构件及存储器,且接地端子与导通构件连接并形成接地位点。接地端子可以位于135a、135b、135c、135d四种位置排布。Furthermore, the rear surface of the substrate is also provided with a grounding terminal, which can be called a fifth terminal/additional terminal, wherein the grounding terminals 135a, 135b, 135c, 135d (equivalent to the grounding terminals of the first embodiment) are connected to the conductive member and the memory, and the grounding terminal is connected to the conductive member and forms a grounding point. The grounding terminal can be arranged at four positions: 135a, 135b, 135c, and 135d.
例如,上述第一端子至第四端子均位于区域Q1内。进一步的,区域Q2可以取消或者尽量小,从而缩小芯片的尺寸,达到芯片、墨盒、打印机的小型化。当区域Q2取消或者尽量小时,区域Q1就是指第一端子131-第四端子134所在的芯片区域,且第一端子131-第四端子的接触部在第一区域M内。For example, the first terminal to the fourth terminal are all located in the region Q1. Furthermore, the region Q2 can be eliminated or minimized, thereby reducing the size of the chip and miniaturizing the chip, ink cartridge, and printer. When the region Q2 is eliminated or minimized, the region Q1 refers to the chip region where the first terminal 131 to the fourth terminal 134 are located, and the contact portion of the first terminal 131 to the fourth terminal is within the first region M.
接地端子135a、135b、135c、135d的位置可以是在后表面120b上的区域Q1上。例如图13所示,第一附加端子135a或者第二附加端子135b所示的位置,此种情况下所形成的接地位点在第一表面的第二投影位于区域Q1内,且第二投影与第一区域M部分重合。或者第五端子135的位置可以是在前表面120a上的区域Q1上,比如,第四附加端子135d所示的位置上,此情况下所形成的接地位点在第一表面的第二投影位于区域Q1内,即第二投影位于第一区域M外。The positions of the grounding terminals 135a, 135b, 135c, and 135d may be on the region Q1 on the rear surface 120b. For example, as shown in FIG. 13 , the first additional terminal 135a or the second additional terminal 135b is at the position shown, and the second projection of the grounding point formed in this case is located in the region Q1 on the first surface, and the second projection partially overlaps with the first region M. Alternatively, the position of the fifth terminal 135 may be on the region Q1 on the front surface 120a, for example, at the position shown by the fourth additional terminal 135d, and the second projection of the grounding point formed in this case is located in the region Q1 on the first surface, that is, the second projection is located outside the first region M.
在另一些实施方式中,第五端子135的位置可以是在后表面120b上的第二区域Q2上。比如,图13所示的第三附加端子135c所示的位置上,此种情况下所形成的接地位点在第一表面的第二投影位于第一区域Q1外,即第二投影位于第一区域M外。进一步地,在一些实施方式中,可将区域Q2在X轴方向的宽度小于区域Q1方向的宽度,可使第二投影靠近第一区域M的一侧与第一区域之间的距离小于第一区域的长度。In other embodiments, the fifth terminal 135 may be located on the second region Q2 on the rear surface 120b. For example, at the position shown in the third additional terminal 135c shown in FIG. 13, the second projection of the grounding point formed in this case is located outside the first region Q1 on the first surface, that is, the second projection is located outside the first region M. Further, in some embodiments, the width of the region Q2 in the X-axis direction may be smaller than the width of the region Q1, and the distance between the side of the second projection close to the first region M and the first region may be smaller than the length of the first region.
芯片变形例三:Chip variation 3:
本变形例三与芯片变形例一相类似,与之不同的是:如图14和图64所示,在另一种实施方式中,本实施例中基板的前表面120a上设有8个端子。在基板120的后表面120b上设有第七端子137a、137b作为接地端子,第七端子还可以设置在后表面120b上的其他位置,用于接收接地电位。另外,第七端子仅需设置到后表面120b上,对于数量和形状都不做限制,本变形例中的芯片20含有2个大致呈矩形的第七端子。The third variation is similar to the first variation of the chip, except that: as shown in FIG. 14 and FIG. 64, in another embodiment, eight terminals are provided on the front surface 120a of the substrate in this embodiment. Seventh terminals 137a and 137b are provided on the rear surface 120b of the substrate 120 as grounding terminals, and the seventh terminals can also be provided at other positions on the rear surface 120b for receiving the grounding potential. In addition, the seventh terminals only need to be provided on the rear surface 120b, and there is no restriction on the number and shape. The chip 20 in this variation has two substantially rectangular seventh terminals.
接地端子可以位于区域Q1内,如图64所示的接地端子137a的所在位置;接地端子可以位于区域Q2内,如图64所示的接地端子137b所在的位置。The ground terminal may be located within region Q1, such as the location of the ground terminal 137a shown in FIG64; the ground terminal may be located within region Q2, such as the location of the ground terminal 137b shown in FIG64.
需要说明的是,触针组件包括8个触针,每个触针分别与前表面各端子接触并形成各自的接触部,在图14中由圆点表示接触部。接触部是当墨盒10安装到打印机上时,触针在端子上的最可能的接触区域。It should be noted that the contact pin assembly includes 8 contact pins, each of which contacts each terminal on the front surface and forms a respective contact portion, which is represented by a dot in Figure 14. The contact portion is the most likely contact area of the contact pin on the terminal when the ink cartridge 10 is installed on the printer.
如图64所示,各接触部在第一表面所形成的第一投影围成第一区域M,接地端子与导通构件连接所形成接地位点,接地位点在第一表面的投影为第二投影,其中接地端子137a所形成的接地位点时,第二投影至少部分位于第一区域M内,至少部分位于第一区域M外,即第二投影与第一区域M至少部分重合。接地端子137b所形成的接地位点时,第二投影至少部分位于第一区域M内,至少部分位于第一区域M外,即第二投影与第一区域M至少部分重合。As shown in FIG64 , the first projections formed by the contact portions on the first surface enclose the first region M, and the grounding terminal and the conductive member are connected to form a grounding point, and the projection of the grounding point on the first surface is a second projection, wherein when the grounding point is formed by the grounding terminal 137a, the second projection is at least partially located in the first region M and at least partially located outside the first region M, that is, the second projection at least partially overlaps with the first region M. When the grounding point is formed by the grounding terminal 137b, the second projection is at least partially located in the first region M and at least partially located outside the first region M, that is, the second projection at least partially overlaps with the first region M.
如图7和图15所示,芯片20具有定位孔,墨盒本体50设置有与定位孔配合的定位柱,且当芯片20的定位孔插装至定位柱后,可完成对芯片20的定位,可进一步通过焊接方式将芯片20固定在墨盒本体50上。As shown in Figures 7 and 15, the chip 20 has a positioning hole, and the ink cartridge body 50 is provided with a positioning column that cooperates with the positioning hole. When the positioning hole of the chip 20 is inserted into the positioning column, the positioning of the chip 20 can be completed, and the chip 20 can be further fixed to the ink cartridge body 50 by welding.
具体地,在本实施方式中芯片20具有第一孔121、第二孔122。第一孔121、第二孔122均为基板120上的通孔,均贯通基板120的前表面120a和后表面120b。Specifically, in this embodiment, the chip 20 has a first hole 121 and a second hole 122. The first hole 121 and the second hole 122 are both through holes on the substrate 120, and both penetrate the front surface 120a and the rear surface 120b of the substrate 120.
其中第一孔121是由基板的顶面向底面120f形成的矩形凹陷部分,第二孔122是位于基板120的120a/120b一面靠近底面120f的通孔部分。相应地,与该芯片对应的墨盒上设置有芯片安装部,芯片安装部包括与第一孔121配合的第一定位柱601以及与第二孔122配合的第二定位柱602,第一定位柱601与第二定位柱602分别与第一孔121、第二孔122呈插装方式相结合,然后通过热焊头焊接的方式将芯片20固定到盒体50(亦称为墨盒本体50)上,如此设置,可防止芯片20在安装过程或使用过程中发生位置的偏移,具体的可以实现X轴、Y轴、Z轴三个方向的定位。The first hole 121 is a rectangular recessed portion formed by the top surface of the substrate and the bottom surface 120f, and the second hole 122 is a through hole portion located on the 120a/120b side of the substrate 120 near the bottom surface 120f. Correspondingly, a chip mounting portion is provided on the ink cartridge corresponding to the chip, and the chip mounting portion includes a first positioning column 601 matched with the first hole 121 and a second positioning column 602 matched with the second hole 122. The first positioning column 601 and the second positioning column 602 are respectively combined with the first hole 121 and the second hole 122 in a plug-in manner, and then the chip 20 is fixed to the cartridge body 50 (also referred to as the ink cartridge body 50) by means of hot welding. Such a setting can prevent the chip 20 from being offset during the installation process or the use process, and specifically can achieve positioning in the three directions of the X axis, the Y axis, and the Z axis.
可理解的是,上述定位孔的数目在此不受限制,具体的,可以只设置1个定位孔(比如,第一孔121),也可以设置两个或两个以上的定位孔。此外,定位孔的形状也不受限制,定位孔可以是圆形孔,也可以是方形孔,或者是不规则形状的孔。同样的,定位柱和限制部的具体形状和数量在此也不作过多限制。It is understandable that the number of the above-mentioned positioning holes is not limited here. Specifically, only one positioning hole (for example, the first hole 121) can be provided, or two or more positioning holes can be provided. In addition, the shape of the positioning hole is not limited. The positioning hole can be a circular hole, a square hole, or a hole of an irregular shape. Similarly, the specific shape and number of the positioning column and the limiting portion are not too limited here.
在上述实施例的基础上,本申请实施例的墨盒本体在把手30的-Y轴一侧设有固定组件603,固定组件603包括第一固定件603a、第二固定件603b、第三固定件603c,第三固定件603c使连接件135(亦可以称为导通构件)限制在墨盒本体50上,第一固定件603a和第二固定件603b相对设置,能够将连接件135夹住并使连接件135呈直角弯折,并折向远离墨盒本体50的方向。On the basis of the above-mentioned embodiments, the ink cartridge body of the embodiment of the present application is provided with a fixing assembly 603 on the -Y-axis side of the handle 30, and the fixing assembly 603 includes a first fixing member 603a, a second fixing member 603b, and a third fixing member 603c. The third fixing member 603c restricts the connecting member 135 (also referred to as a conducting member) on the ink cartridge body 50. The first fixing member 603a and the second fixing member 603b are arranged opposite to each other, and can clamp the connecting member 135 and bend the connecting member 135 at a right angle and fold it in a direction away from the ink cartridge body 50.
如此设置,将实现对连接件135(亦可以称为导通构件)固定,避免因连接件135摇摆,而导致连接件135与打印机上的接地部件(图中未示出)接触不良。进一步地,连接件135呈直角状弯折,有利于将连接件135调整至朝向打印机的接地部件延伸,便于将其方便与打印机的接地部件电接触,防止电流过大,降低了因接地不稳定而带来触电危险的概率。Such a configuration can achieve the fixation of the connector 135 (also referred to as a conducting member) to prevent the connector 135 from swinging and causing poor contact between the connector 135 and the grounding component (not shown) on the printer. Furthermore, the connector 135 is bent at a right angle, which is conducive to adjusting the connector 135 to extend toward the grounding component of the printer, making it convenient to electrically contact the grounding component of the printer, preventing excessive current, and reducing the probability of electric shock caused by unstable grounding.
如图16所示,具有本实施例的芯片20的墨盒10在装入安装部90的过程中,第一端子131-第四端子134分别与第一触针9111-第四触针914的对应第一部分911a-914a的第二表面部911a2-914a2实现电连接。As shown in FIG. 16 , when the ink cartridge 10 having the chip 20 of this embodiment is installed in the mounting portion 90 , the first terminal 131 - the fourth terminal 134 are electrically connected to the second surface portions 911a2 - 914a2 of the corresponding first portions 911a - 914a of the first contact pin 9111 - the fourth contact pin 914 , respectively.
继续参阅图1和图2,当墨盒10安装至安装部时,连接件135一端连接设置在基板后表面120b的接地端子,且接地端子与存储器100电连接,连接件135从基板后表面120b伸出,紧贴墨盒本体50向+Z轴方向延伸,第一固定件603a、第二固定件603b作用于连接件135弯折成直角状的部分,使连接件135拐向打印机的金属件(亦可以称为接地部件),需要说明的是,本申请实施例中的金属件可以为接地部件的一部分,或者其就是接地部件,金属件设置于打印机的装配仓内,且金属件(亦可以称为接地部件)接地,且金属件上有接地信号的传输。Continuing to refer to Figures 1 and 2, when the ink cartridge 10 is installed in the installation portion, one end of the connector 135 is connected to the ground terminal set on the rear surface 120b of the substrate, and the ground terminal is electrically connected to the memory 100. The connector 135 extends from the rear surface 120b of the substrate and extends in the +Z axis direction close to the ink cartridge body 50. The first fixing member 603a and the second fixing member 603b act on the portion of the connector 135 that is bent into a right angle, so that the connector 135 turns toward the metal part of the printer (also referred to as the grounding part). It should be noted that the metal part in the embodiment of the present application can be a part of the grounding part, or it is the grounding part. The metal part is set in the assembly bin of the printer, and the metal part (also referred to as the grounding part) is grounded, and a grounding signal is transmitted on the metal part.
进一步地,上述连接件135与打印机的接地部件实现电连接,并通过接地部件接地。如此设置,接地部件与导通构件的电连接位置位于芯片的上方,且芯片接地的稳定性好,提高了芯片使用的安全性,降低了打印装置无法识别墨盒情况的出现。连接件135(导通构件)在端部135e(如图15所示)与导电壁板81接触并电连接。具体的,连接件135(导通构件)的+X轴侧的端部135e(如图15所示)与导电壁板81接触并电连接。Furthermore, the connector 135 is electrically connected to the grounding component of the printer and is grounded through the grounding component. With this arrangement, the electrical connection position between the grounding component and the conductive component is located above the chip, and the chip grounding has good stability, which improves the safety of chip use and reduces the occurrence of the situation where the printing device cannot recognize the ink cartridge. The connector 135 (conductive component) is in contact with and electrically connected to the conductive wall plate 81 at the end 135e (as shown in FIG. 15). Specifically, the end 135e (as shown in FIG. 15) of the connector 135 (conductive component) on the +X axis side is in contact with and electrically connected to the conductive wall plate 81.
本申请实施例中安装部90可活动安装在装配仓内,并且接地部件设置于安装部外,部分导通构件设置于安装部的容纳腔内,并与芯片的接地端子电连接;部分导通构件设置于安装部外,并用于与接地部件电连接,即墨盒的芯片的接地端子通过导通构件与接地部件电连接,以实现接地信号的传输。In the embodiment of the present application, the mounting portion 90 can be movably mounted in the assembly bin, and the grounding component is arranged outside the mounting portion, and part of the conductive component is arranged in the accommodating cavity of the mounting portion and is electrically connected to the grounding terminal of the chip; part of the conductive component is arranged outside the mounting portion and is used to be electrically connected to the grounding component, that is, the grounding terminal of the chip of the ink cartridge is electrically connected to the grounding component through the conductive component to realize the transmission of the grounding signal.
每种芯片均可以适配到不同实施例、不同实施方式墨盒上。Each chip can be adapted to ink cartridges of different embodiments and implementations.
进一步地,由于安装部滑动安装在接地导轨上,为保证安装部滑动顺畅性,本申请实施例中导通构件与接地部件相接触的位置可配置成滚珠或球轴承,滚珠和球轴承作为导通构件的一部分,并与导通构件电连接。如此设置,可减少相接触的位置与导电部件的摩擦力,保证安装部、墨盒在接地导轨上顺畅滑动。Furthermore, since the mounting part is slidably mounted on the grounding rail, in order to ensure the smooth sliding of the mounting part, the position where the conductive member contacts the grounding component in the embodiment of the present application can be configured as a ball or a ball bearing, and the ball and the ball bearing are part of the conductive member and are electrically connected to the conductive member. Such a configuration can reduce the friction between the contacting position and the conductive member, and ensure that the mounting part and the ink cartridge slide smoothly on the grounding rail.
导通构件也可以视为芯片的一部分,当导通构件视为芯片的一部分时,芯片可拆卸地安装于打印装置内,打印装置具有装配仓以及设置于装配仓内的安装部、接地部件,安装部包括容纳腔以及触针组件,接地部件位于触针组件所在位置之外的位置处;芯片具有通信端子组、导通构件(也可称为连接件)、存储器;通信端子组与触针组件电连接;导通构件与接地部件、存储器电连接。芯片也可以达到本申请的有益效果。The conducting member can also be regarded as a part of the chip. When the conducting member is regarded as a part of the chip, the chip can be detachably installed in the printing device. The printing device has an assembly bin and a mounting part and a grounding part arranged in the assembly bin. The mounting part includes a receiving cavity and a stylus assembly. The grounding part is located outside the position of the stylus assembly. The chip has a communication terminal group, a conducting member (also called a connector), and a memory. The communication terminal group is electrically connected to the stylus assembly. The conducting member is electrically connected to the grounding part and the memory. The chip can also achieve the beneficial effects of the present application.
需要说明的是,接地部件与触针组件是2个不同部件。进一步的,芯片设置于所述墨盒本体上,墨盒本体及芯片的至少一部分可位于容纳腔内,导通构件设置于装配仓内。It should be noted that the grounding component and the contact pin assembly are two different components. Further, the chip is arranged on the ink cartridge body, the ink cartridge body and at least a part of the chip can be located in the accommodating cavity, and the conducting component is arranged in the assembly chamber.
实施例一的第二实施方式:Second implementation of Example 1:
本申请实施例与前述实施方式的区别在于:The difference between the embodiment of the present application and the aforementioned implementation is that:
如图17至图20所示,本申请实施例提供的接地部件包括接地导轨80,且接地导轨80接地。接地导轨80设置于装配仓内,并且安装部90可滑动设置于接地导轨80上,即接地导轨80不仅作为安装部90的承载部件,还作为接地部件以传输接地信号。As shown in Figures 17 to 20, the grounding component provided in the embodiment of the present application includes a grounding rail 80, and the grounding rail 80 is grounded. The grounding rail 80 is arranged in the assembly bin, and the mounting portion 90 can be slidably arranged on the grounding rail 80, that is, the grounding rail 80 not only serves as a bearing component of the mounting portion 90, but also serves as a grounding component to transmit a grounding signal.
在一种实施方式中,接地导轨80朝向安装部的一侧设置有导电壁板81,导电壁板81与接地部件连接,两者可以是一整体结构,本申请实施例对此不加以限制。导电壁板81的长度延伸方向与接地导轨80的延伸方向一致,并且导电壁板81与水平面相交,例如导电壁板81与水平面垂直,或者导电壁板81相对水平面倾斜设置。In one embodiment, a conductive wall plate 81 is provided on one side of the grounding rail 80 facing the mounting portion, and the conductive wall plate 81 is connected to the grounding component, and the two can be an integral structure, which is not limited in the embodiment of the present application. The length extension direction of the conductive wall plate 81 is consistent with the extension direction of the grounding rail 80, and the conductive wall plate 81 intersects with the horizontal plane, for example, the conductive wall plate 81 is perpendicular to the horizontal plane, or the conductive wall plate 81 is inclined relative to the horizontal plane.
具体地,本实施例中墨盒10还具有连接件135(相当于导通构件),连接件135用于连接芯片20和打印装置上其他金属部分(相当于接地部件),以实现芯片20的接地功能,即该连接件135配置为导通构件。例如,连接件135包括连接主体135bb和导体135cc,其中连接主体135bb和导体135cc可以一体设置也可以分体设置,本申请实施例对此不加以限制。连接件135可以是一个铜、铝、钢等金属件,也可以是导电硅胶、导电塑料等制成的部件。Specifically, in this embodiment, the ink cartridge 10 also has a connector 135 (equivalent to a conducting member), which is used to connect the chip 20 and other metal parts on the printing device (equivalent to a grounding member) to achieve the grounding function of the chip 20, that is, the connector 135 is configured as a conducting member. For example, the connector 135 includes a connecting body 135bb and a conductor 135cc, wherein the connecting body 135bb and the conductor 135cc can be integrally arranged or separately arranged, and the embodiment of the present application does not limit this. The connector 135 can be a metal part such as copper, aluminum, steel, etc., or it can be a part made of conductive silicone, conductive plastic, etc.
连接件135靠近芯片的一端与导电片135a(相当于接地端子)电连接,其中导电片135a设置在基板120上并与芯片20的存储器电连接,存储器需要接地,导电片135a与存储器连接方式不限。例如,导电片135a可通过导电线连接存储器,进而使连接件135与存储器连接。导电片135a在基板120上的位置不做限制,在本实施例中,导电片135a设置在芯片后表面120b上,与芯片20上其他端子位于基板上不同表面,确保导电片135a不会与其他端子发生短路、保证芯片接地的稳定性好,提高了芯片使用的安全性。导电片135a(相当于接地端子)是芯片20上的利用电镀等工艺制成的覆铜。One end of the connector 135 close to the chip is electrically connected to the conductive sheet 135a (equivalent to the ground terminal), wherein the conductive sheet 135a is arranged on the substrate 120 and is electrically connected to the memory of the chip 20. The memory needs to be grounded, and the connection method between the conductive sheet 135a and the memory is not limited. For example, the conductive sheet 135a can be connected to the memory through a conductive line, thereby connecting the connector 135 to the memory. The position of the conductive sheet 135a on the substrate 120 is not limited. In this embodiment, the conductive sheet 135a is arranged on the rear surface 120b of the chip, and is located on a different surface of the substrate from other terminals on the chip 20, ensuring that the conductive sheet 135a will not short-circuit with other terminals, ensuring good stability of the chip grounding, and improving the safety of chip use. The conductive sheet 135a (equivalent to the ground terminal) is a copper clad on the chip 20 made by electroplating and other processes.
导体135cc设置在墨盒本体50上,与打印机上其他金属部分(相当于接地部件)接触。优选地,导体135cc设置在墨盒本体50的内部,避免与外部物品接触、损坏导体135cc,保证连接件135接地功能稳定实现。在本实施例中,导体135cc设置在把手30内。连接主体135bb用于连接导电片135a和导体135cc。The conductor 135cc is disposed on the ink cartridge body 50 and contacts other metal parts (equivalent to the grounding component) on the printer. Preferably, the conductor 135cc is disposed inside the ink cartridge body 50 to avoid contact with external objects and damage to the conductor 135cc, thereby ensuring that the grounding function of the connector 135 is stably realized. In this embodiment, the conductor 135cc is disposed inside the handle 30. The connecting body 135bb is used to connect the conductive sheet 135a and the conductor 135cc.
具体地,连接主体135bb具有第一部分135b1、第二部分135b2和连接部分135b3。第一部分135b1用于与导电片135a连接。第一部分135b1的材质、与导电片135a的连接方式不限,例如,第一部分135b1可由具有一定硬度的导电材质制成,并可通过焊锡连接在导电片135a处。Specifically, the connecting body 135bb has a first portion 135b1, a second portion 135b2 and a connecting portion 135b3. The first portion 135b1 is used to connect to the conductive sheet 135a. The material of the first portion 135b1 and the connection method with the conductive sheet 135a are not limited. For example, the first portion 135b1 can be made of a conductive material with a certain hardness and can be connected to the conductive sheet 135a by soldering.
在一些其他实施例中,连接件135(相当于导通构件)可以不设置导电片135a,即第一部分135b1直接与芯片20的存储器(图中未示出)连接。第一部分135b1与存储器的连接方式不限,例如,第一部分135b1可通过焊锡直接与连接到存储器的导电线连接。第二部分135b2用于与导体135cc连接。连接部分135b3用于连接第一部分135b1和第二部分135b2。优选地,连接部分135b3设置在墨盒本体50上对应的凹槽内,避免外部物品损坏连接部分135b3、影响连接件135导电功能,同时也可以起到固定作用。In some other embodiments, the connector 135 (equivalent to the conducting member) may not be provided with the conductive sheet 135a, that is, the first part 135b1 is directly connected to the memory (not shown in the figure) of the chip 20. The connection method of the first part 135b1 and the memory is not limited. For example, the first part 135b1 can be directly connected to the conductive wire connected to the memory through solder. The second part 135b2 is used to connect with the conductor 135cc. The connecting part 135b3 is used to connect the first part 135b1 and the second part 135b2. Preferably, the connecting part 135b3 is arranged in the corresponding groove on the ink cartridge body 50 to prevent external objects from damaging the connecting part 135b3 and affecting the conductive function of the connector 135, and it can also play a fixing role.
如图21和图22所示,在本实施例中,导体135cc设置在把手30内。把手30具有主体部301、延伸部302、限制部303、卡合部304和连接部305。其中延伸部302、限制部303、卡合部304和连接部305分别设置在主体部301上,其设置在主体部301上的方式不受限制,例如,可以是可拆卸连接、固定连接等。As shown in Figures 21 and 22, in this embodiment, the conductor 135cc is disposed in the handle 30. The handle 30 has a main body 301, an extension portion 302, a limiting portion 303, a clamping portion 304, and a connecting portion 305. The extension portion 302, the limiting portion 303, the clamping portion 304, and the connecting portion 305 are respectively disposed on the main body 301, and the manner in which they are disposed on the main body 301 is not limited, for example, they may be detachably connected, fixedly connected, etc.
延伸部302在X轴方向上的一端与主体部301连接,另一端与打印机上其他金属部分(相当于接地部件)接触。在本实施例中,延伸部302另一端与打印机的导电壁板81接触,以使导体135cc与导电壁板81接触,形成电连接。延伸部302起到保护导体135cc的作用,防止其被碰伤、折断、位置偏移等。One end of the extension part 302 in the X-axis direction is connected to the main body 301, and the other end is in contact with other metal parts (equivalent to the grounding component) on the printer. In this embodiment, the other end of the extension part 302 is in contact with the conductive wall plate 81 of the printer, so that the conductor 135cc is in contact with the conductive wall plate 81 to form an electrical connection. The extension part 302 plays a role in protecting the conductor 135cc to prevent it from being damaged, broken, or displaced.
与现有墨盒安装部内触针上芯片接地端子可接触面积相比,本实施例中导电壁板81与连接件135可接触面积更大,可以确保连接件135与接地导轨80电连接稳定、准确接触,确保芯片20接地功能稳定实现,防止电流过大,降低了因接地不稳定而带来触电危险的概率。Compared with the contact area of the chip grounding terminal on the contact pin in the existing ink cartridge installation part, the contact area between the conductive wall plate 81 and the connector 135 in this embodiment is larger, which can ensure stable and accurate electrical connection between the connector 135 and the grounding rail 80, ensure the stable implementation of the grounding function of the chip 20, prevent excessive current, and reduce the probability of electric shock danger caused by unstable grounding.
在上述实施例的基础上,本申请实施例中的延伸部302还设置颜色识别部302a,用于指示墨盒内存储的墨水颜色。颜色识别部302a墨水颜色指示方式不受限制,例如,可以通过颜色、图案、文字及其组合方式等方式指示墨盒内存储的墨水颜色。On the basis of the above embodiment, the extension portion 302 in the embodiment of the present application is further provided with a color identification portion 302a for indicating the ink color stored in the ink cartridge. The ink color indication method of the color identification portion 302a is not limited, for example, the ink color stored in the ink cartridge can be indicated by color, pattern, text and a combination thereof.
限制部303与墨盒上设置的限制凸起502配合,限制把手30在X轴方向上的可移动范围。限制凸起502在墨盒本体50上的位置和形状不受限制,例如,限制凸起502可以为圆柱体、可以为圆锥体、可以为不规则形状凸起等。在本实施例中限制凸起502为圆柱体。The limiting portion 303 cooperates with the limiting protrusion 502 provided on the ink cartridge to limit the movable range of the handle 30 in the X-axis direction. The position and shape of the limiting protrusion 502 on the ink cartridge body 50 are not limited. For example, the limiting protrusion 502 can be a cylinder, a cone, an irregular shape protrusion, etc. In this embodiment, the limiting protrusion 502 is a cylinder.
卡合部304与安装部90上设置的固定部90d配合,用于将墨盒10固定到安装部90上,防止墨盒10从安装部90中脱离出来。连接部305用于将把手30连接到墨盒墨盒本体50上,连接部305与墨盒本体50的连接方式不限,例如,可以是可拆卸连接、固定连接等。在一些其他实施例中,把手30可以不设置连接部305,主体部301直接连接到墨盒本体50上。The engaging portion 304 cooperates with the fixing portion 90d provided on the mounting portion 90 to fix the ink cartridge 10 to the mounting portion 90 to prevent the ink cartridge 10 from being separated from the mounting portion 90. The connecting portion 305 is used to connect the handle 30 to the ink cartridge body 50. The connection method between the connecting portion 305 and the ink cartridge body 50 is not limited, for example, it can be a detachable connection, a fixed connection, etc. In some other embodiments, the handle 30 may not be provided with the connecting portion 305, and the main body 301 is directly connected to the ink cartridge body 50.
当墨盒10安装至安装部时,连接件135的一端为导电片135a,连接墨盒芯片20上的存储器,接收芯片20输出的电流。导电片135a通过连接主体135bb,将接收到的电流传递给导体135cc。连接件135的另一端为导体135cc,连接打印机上其他金属部分,将从连接主体135bb接收到的电流传递给打印机上其他金属部分,实现芯片接地功能。When the ink cartridge 10 is installed in the installation part, one end of the connector 135 is a conductive sheet 135a, which is connected to the memory on the ink cartridge chip 20 and receives the current output by the chip 20. The conductive sheet 135a passes the received current to the conductor 135cc through the connecting body 135bb. The other end of the connector 135 is a conductor 135cc, which is connected to other metal parts on the printer and passes the current received from the connecting body 135bb to other metal parts on the printer to realize the chip grounding function.
具体地,导体135cc贯穿设置在把手30内,导体135cc贯穿设置在把手30主体部301、延伸部302和连接部305内。由于设置在把手主体部301上的卡合部304与安装部90上设置的固定部90d配合,用于将墨盒10固定到安装部90上,导体135cc贯穿设置在把手30内,与把手30上卡合部304距离较近,可以确保连接件135与打印机上其他金属部分稳定、准确接触,确保芯片20接地功能稳定实现,防止电流过大,降低了因接地不稳定而带来触电危险的概率。保证芯片接地的稳定性好,提高了芯片使用的安全性,降低了打印装置无法识别墨盒情况的出现。Specifically, the conductor 135cc is set through the handle 30, and the conductor 135cc is set through the main body 301, the extension part 302 and the connecting part 305 of the handle 30. Since the clamping part 304 set on the main body 301 of the handle cooperates with the fixing part 90d set on the mounting part 90, it is used to fix the ink cartridge 10 to the mounting part 90. The conductor 135cc is set through the handle 30 and is close to the clamping part 304 on the handle 30, which can ensure that the connector 135 is in stable and accurate contact with other metal parts on the printer, ensure that the grounding function of the chip 20 is stably realized, prevent excessive current, and reduce the probability of electric shock caused by unstable grounding. The stability of the chip grounding is ensured, the safety of chip use is improved, and the occurrence of the situation where the printing device cannot recognize the ink cartridge is reduced.
实施例一的第三实施方式:The third implementation of Example 1:
图23至图26为本申请实施例一的第三实施方式的相关示意图。本实施方式与第二实施方式不同的有:如图23至图26所示,图23为墨盒10安装到安装部90上的示意图,接地部件具有接地导轨,接地导轨具有导电壁板81,其导通构件105与导电壁板81相接触并且传输接地信号。在导电壁板81的+Z轴方向上设置有挡板84。Figures 23 to 26 are schematic diagrams of the third embodiment of the first embodiment of the present application. The differences between this embodiment and the second embodiment are as follows: As shown in Figures 23 to 26, Figure 23 is a schematic diagram of the ink cartridge 10 being installed on the mounting portion 90, the grounding component has a grounding rail, the grounding rail has a conductive wall plate 81, and its conductive member 105 contacts the conductive wall plate 81 and transmits a grounding signal. A baffle 84 is provided in the +Z axis direction of the conductive wall plate 81.
一般情况下,挡板84是由塑料且不导电的材质制成的。在X轴的方向上,挡板84的端部比导电壁板81的端部更靠近安装部90(即,挡板841的端部比导电壁板81更位于+Z轴、-X轴侧),因此当墨盒10安装到打印装置的过程中,导通构件105需要越过挡板841然后才能与导电壁板81相接触。Generally, the baffle 84 is made of plastic and non-conductive material. In the direction of the X-axis, the end of the baffle 84 is closer to the mounting portion 90 than the end of the conductive wall plate 81 (i.e., the end of the baffle 841 is located closer to the +Z axis and -X axis side than the conductive wall plate 81), so when the ink cartridge 10 is installed in the printing device, the conductive member 105 needs to pass over the baffle 841 before it can contact the conductive wall plate 81.
本实施方式中的导通构件105的一端与芯片20上的接地端子135a,另一端与接地部件的导电壁板81相接触。接地信号的传输路径依次是:芯片20的存储器、接地端子135a、导通构件105、接地部件的导电壁板81。One end of the conductive member 105 in this embodiment is in contact with the ground terminal 135a on the chip 20, and the other end is in contact with the conductive wall plate 81 of the grounding component. The transmission path of the ground signal is: the memory of the chip 20, the ground terminal 135a, the conductive member 105, and the conductive wall plate 81 of the grounding component.
把手30具有:主体部301、延伸部302、卡合部304、第一间隙308、第二间隙309。墨盒上还设置有固定部307,用于固定导通构件105。延伸部302包括平伸部3025、第一折弯部3021、第二折弯部3022、抵接容纳腔3023、固定开孔3024。设置延伸部302的目的是:固定导通构件105、导通构件105越过挡板84、导通构件105与导电壁板81相抵接。平伸部3025朝向+X轴方向延伸,目的是为了更好的让导通构件105与导电壁板81相抵接。The handle 30 comprises: a main body 301, an extension 302, a snap-fitting portion 304, a first gap 308, and a second gap 309. A fixing portion 307 is also provided on the ink cartridge for fixing the conductive member 105. The extension 302 comprises a flat extension portion 3025, a first bending portion 3021, a second bending portion 3022, an abutting accommodating cavity 3023, and a fixing opening 3024. The purpose of providing the extension portion 302 is to fix the conductive member 105, to allow the conductive member 105 to pass over the baffle 84, and to allow the conductive member 105 to abut against the conductive wall plate 81. The flat extension portion 3025 extends in the +X axis direction in order to better allow the conductive member 105 to abut against the conductive wall plate 81.
第一折弯部3021是从平伸部3025的基础上延伸出来的,第一折弯部3021朝向+X轴(导电壁板81所在方向)、+Z轴方向(上方)方向延伸;第二折弯部3022是从第一折弯部3021的基础上延伸出来的,第二折弯部3022朝向-X轴(远离导电壁板81的方向/朝向盒体所在方向)、+Z轴方向(上方)方向延伸,此结构设计是为了让墨盒10安装到打印装置过程中引导延伸部302、导通构件105越过挡板84,且可以在将墨盒10从打印装置取出时,第二折弯部3022可以引导把手30的形变/压缩进而有助于墨盒10的取出。The first bending portion 3021 extends from the flat portion 3025, and the first bending portion 3021 extends toward the +X axis (the direction where the conductive wall plate 81 is located) and the +Z axis direction (upward); the second bending portion 3022 extends from the first bending portion 3021, and the second bending portion 3022 extends toward the -X axis (away from the conductive wall plate 81/toward the direction where the box body is located) and the +Z axis direction (upward). This structural design is intended to guide the extension portion 302 and the conductive component 105 to cross the baffle 84 during the installation of the ink cartridge 10 into the printing device, and when the ink cartridge 10 is taken out of the printing device, the second bending portion 3022 can guide the deformation/compression of the handle 30 to facilitate the removal of the ink cartridge 10.
抵接容纳腔3023用于容纳导通构件105的抵接部1057,抵接部1057用于使导通构件105与导电壁板81相抵接。抵接容纳腔3023相对来说是一个凹部,可以在一定程度上,保护抵接部1057,降低其被无损伤的情况。抵接容纳腔3023设置在第一折弯部3021、第二折弯部3022相交的位置上,使得抵接部1057位于墨盒10的最靠近+X轴的位置,以便于导通构件105与导电壁板81相抵接。The abutment accommodating chamber 3023 is used to accommodate the abutment portion 1057 of the conducting member 105, and the abutment portion 1057 is used to make the conducting member 105 abut against the conductive wall plate 81. The abutment accommodating chamber 3023 is relatively a recessed portion, which can protect the abutment portion 1057 to a certain extent and reduce the possibility of it being damaged. The abutment accommodating chamber 3023 is arranged at the intersection of the first bending portion 3021 and the second bending portion 3022, so that the abutment portion 1057 is located at the position closest to the +X axis of the ink cartridge 10, so that the conducting member 105 abuts against the conductive wall plate 81.
进一步地,固定开孔3024与弹性部1056相配合,使得导通构件105稳固的固定在墨盒10上,防止导通构件105脱离墨盒10。把手30是从墨盒本体50上延伸出来的,其具有一定的弹性,可以朝向-X轴方向收缩,且可以恢复到原位置。延伸部302位于把手30上,因此延伸部302也具有一定的弹性,可以朝向-X轴方向移动,可以让导通构件105越过挡板84,且在把手30被压缩的情况下可以朝向+X轴有运动趋势,从而可以让抵接部1057有压迫力,让抵接部1057更好的与导电壁板81相抵接。抵接部1057位于第一折弯部3021与第二折弯部3022相交的位置处。Further, the fixed opening 3024 cooperates with the elastic part 1056, so that the conducting member 105 is firmly fixed on the ink cartridge 10, and prevents the conducting member 105 from being separated from the ink cartridge 10. The handle 30 is extended from the ink cartridge body 50, and has a certain elasticity, can be contracted toward the -X axis direction, and can be restored to the original position. The extension part 302 is located on the handle 30, so the extension part 302 also has a certain elasticity, can move toward the -X axis direction, and can allow the conducting member 105 to pass over the baffle 84, and can have a tendency to move toward the +X axis when the handle 30 is compressed, so that the abutting part 1057 has a compressive force, so that the abutting part 1057 can better abut against the conductive wall plate 81. The abutting part 1057 is located at the intersection of the first bending part 3021 and the second bending part 3022.
导通构件105包括第一部分1051a、第二部分1051b、第三部分1051c。第一部分1051a固定在墨盒本体50上,具体的通过通孔1053与固定部307的配合,防止导通构件105脱离墨盒本体50。通孔1053与固定部307可以是紧固定的方式配合。The conducting member 105 includes a first portion 1051a, a second portion 1051b, and a third portion 1051c. The first portion 1051a is fixed to the ink cartridge body 50, and specifically prevents the conducting member 105 from being separated from the ink cartridge body 50 through the cooperation of the through hole 1053 and the fixing portion 307. The through hole 1053 and the fixing portion 307 can be tightly fixed.
可选的,通孔1053与固定部307配合后也可以再通过焊接热熔的方式将通孔1053突出于固定部307的部分铺设在第一部分1051a上,防止导通构件105脱离墨盒本体50。第二部分1051b与把手30的主体部301相适配,在卡合部304的-X轴方向侧、主体部301的+X轴方向侧设置有第一间隙308,第一间隙308容纳第二部分1051b的一部分。第三部分1051c与延伸部302的形状贴合,可以让导通构件105更好的与导电壁板81相抵接。Optionally, after the through hole 1053 is matched with the fixing portion 307, the portion of the through hole 1053 protruding from the fixing portion 307 can be laid on the first portion 1051a by welding and hot melting to prevent the conductive member 105 from being separated from the ink cartridge body 50. The second portion 1051b is matched with the main body 301 of the handle 30, and a first gap 308 is provided on the -X axis direction side of the engaging portion 304 and the +X axis direction side of the main body 301, and the first gap 308 accommodates a portion of the second portion 1051b. The third portion 1051c is in conformity with the shape of the extension portion 302, so that the conductive member 105 can better abut against the conductive wall plate 81.
第三部分1051c上具有:抵接部1057、弹性部1056。抵接部1057设置在抵接容纳腔3023内。弹性部1056是从导通构件105上延伸出来就有弹性的片状构件,可以与固定开孔3024相配合,使得导通构件105固定在把手30上。导通构件105具有朝向导电壁板41方向延伸的第一折弯区AA和与第一折弯区AA相连接且朝向上方方向(+Z轴方向)延伸第二折弯区BB,导通构件105与导电壁板81接触的位置位于第二折弯区BB上,即抵接部1057位于第二折弯区BB上。The third part 1051c has: an abutting portion 1057 and an elastic portion 1056. The abutting portion 1057 is disposed in the abutting accommodating cavity 3023. The elastic portion 1056 is an elastic sheet-like member extending from the conducting member 105, and can cooperate with the fixing opening 3024 to fix the conducting member 105 on the handle 30. The conducting member 105 has a first bending area AA extending toward the conductive wall plate 41 and a second bending area BB connected to the first bending area AA and extending toward the upward direction (+Z axis direction). The position where the conducting member 105 contacts the conductive wall plate 81 is located on the second bending area BB, that is, the abutting portion 1057 is located on the second bending area BB.
第一折弯区AA与延伸部302的第一折弯部3021方向一致,第一折弯区AA朝向+X轴(导电壁板81所在方向)、+Z轴方向(上方)方向延伸,第二折弯区BB是容纳在抵接容纳腔3023内的部分,其与第一折弯区AA相连接且朝向上方方向(+Z轴方向)延伸,此结构有利于导通构件105与导电壁板81的抵接。抵接部1057是在第二折弯区BB上的突起,抵接部1057可以是圆弧状、球面状、线条状、点状的突起,优选的,抵接部1057是球面状的突起(如图26所示),其方便与导电壁板81的抵接且可以墨盒10随着安装部90的滑动减少抵接部1057与导电壁板81之间的摩擦力,保证墨盒10在滑动过程中顺畅。The first bending area AA is in the same direction as the first bending part 3021 of the extension part 302. The first bending area AA extends toward the +X axis (the direction of the conductive wall plate 81) and the +Z axis (upward). The second bending area BB is a part contained in the abutment accommodating cavity 3023, which is connected to the first bending area AA and extends toward the upward direction (+Z axis direction). This structure is conducive to the abutment between the conductive component 105 and the conductive wall plate 81. The abutment part 1057 is a protrusion on the second bending area BB. The abutment part 1057 can be an arc-shaped, spherical, linear, or dot-shaped protrusion. Preferably, the abutment part 1057 is a spherical protrusion (as shown in FIG. 26), which is convenient for abutment with the conductive wall plate 81 and can reduce the friction between the abutment part 1057 and the conductive wall plate 81 as the ink cartridge 10 slides with the mounting part 90, thereby ensuring that the ink cartridge 10 slides smoothly.
由于把手30是弹性的,可收缩也恢复到原状态。把手30在自然状态和安装到打印装置的状态是不同的。导通构件105也具有2种状态:初始状态、抵接状态。导通构件105可以在初始状态和抵接状态之间切换。导通构件105在初始状态比抵接状态下更远离墨盒本体50。抵接部1057在初始状态时相比其在抵接状态下更远离墨盒本体50,在墨盒10安装到打印装置后,导通构件105的抵接部1057对导电壁板81之间有压迫力,可以使得抵接部1057更好的与导电壁板81相抵接。Since the handle 30 is elastic, it can shrink and return to its original state. The handle 30 is different in its natural state and in the state installed in the printing device. The conducting member 105 also has two states: an initial state and an abutting state. The conducting member 105 can switch between the initial state and the abutting state. The conducting member 105 is farther away from the ink cartridge body 50 in the initial state than in the abutting state. The abutting portion 1057 is farther away from the ink cartridge body 50 in the initial state than in the abutting state. After the ink cartridge 10 is installed in the printing device, the abutting portion 1057 of the conducting member 105 exerts a compressive force on the conductive wall plate 81, which can make the abutting portion 1057 better abut against the conductive wall plate 81.
需要说明的是,导通构件105由可导电材质制成,比如:金属、导电硅胶、导电塑料等。可选的,导通构件105是由金属制成,且弯折成如图23-图25所示的结构。抵接部1057可以采用热压的方式制成,将原本平面的金属板面热压出球面状的突起;弹性部1056可以采用冲压的方式制成,将弹性部1056的一端冲断,形成悬挂式的弹性部1056;通孔1053可以采用冲压的方式制成,冲压成通孔。It should be noted that the conducting member 105 is made of a conductive material, such as metal, conductive silicone, conductive plastic, etc. Optionally, the conducting member 105 is made of metal and bent into a structure as shown in Figures 23 to 25. The abutment portion 1057 can be made by hot pressing, and a spherical protrusion is hot pressed from the original flat metal plate surface; the elastic portion 1056 can be made by stamping, and one end of the elastic portion 1056 is punched off to form a hanging elastic portion 1056; the through hole 1053 can be made by stamping, and is punched into a through hole.
实施例一的第四实施方式:Fourth implementation of Example 1:
图27是第四实施方式的示意图。此实施方式墨盒的描述同实施例一的内容一致,芯片使用的是芯片的变形例一或者芯片的变形例三,此处不再赘述。Fig. 27 is a schematic diagram of the fourth embodiment. The description of the ink cartridge in this embodiment is consistent with that of the first embodiment, and the chip used is the first variation of the chip or the third variation of the chip, which will not be described in detail here.
实施例二Embodiment 2
需要说明的是,本实施例中安装部与墨盒的插装方式与实施例一不同,其打印机的安装部结构也有所不同,实施例二的安装部90固定在装配仓内,且接地部件设置于容纳腔内。It should be noted that the installation method of the installation part and the ink cartridge in this embodiment is different from that in the first embodiment, and the installation part structure of the printer is also different. The installation part 90 of the second embodiment is fixed in the assembly bin, and the grounding component is arranged in the accommodating cavity.
实施例二的墨盒可以适配实施例一中的几种墨盒。实施例二与实施例一不同的是:在实施例二提供了一种天线式导通构件,且形成安装腔的至少部分腔壁配置成接地部件,导通构件的一端与芯片的接地端子电连接,另一端与安装腔的至少部分顶壁电连接,且两者的电连接点位于芯片的上方。The ink cartridge of the second embodiment can be adapted to several ink cartridges of the first embodiment. The second embodiment is different from the first embodiment in that: the second embodiment provides an antenna-type conductive component, and at least part of the cavity wall forming the installation cavity is configured as a grounding component, one end of the conductive component is electrically connected to the grounding terminal of the chip, and the other end is electrically connected to at least part of the top wall of the installation cavity, and the electrical connection point between the two is located above the chip.
在上述实施方式的基础上,本实施方式中导通构件中的导电片135a可取消,连接件135可通过焊锡直接与导电线连接,以及芯片设置的定位孔的位置与上述实施例一也不同。On the basis of the above embodiment, the conductive sheet 135a in the conductive component can be eliminated in this embodiment, the connector 135 can be directly connected to the conductive wire by soldering, and the position of the positioning hole provided on the chip is also different from that in the above embodiment 1.
如图28至图31所示,在本实施方式中芯片20具有第一孔121、第二孔122。其中第一孔121、第二孔122均为基板120上的通孔,均贯通基板120的前表面120a和后表面120b。其中,第一孔121是由左侧面120c向右侧面120d形成的半圆凹陷部分,第二孔122是由右侧面120d向左侧面120c形成的半圆凹陷部分。As shown in FIGS. 28 to 31 , in this embodiment, the chip 20 has a first hole 121 and a second hole 122. The first hole 121 and the second hole 122 are both through holes on the substrate 120, and both penetrate the front surface 120a and the rear surface 120b of the substrate 120. The first hole 121 is a semicircular concave portion formed from the left side 120c to the right side 120d, and the second hole 122 is a semicircular concave portion formed from the right side 120d to the left side 120c.
相应地,墨盒设置有芯片安装部,芯片安装部包括第一定位柱601、第二定位柱602,第一定位柱601与第二定位柱602分别与第一孔121、第二孔122呈突出的方式相结合,然后通过热焊头焊接的方式将芯片20固定到墨盒本体50上。如此设置,可防止芯片20在安装过程或安装完成后的使用过程中沿发生位置的偏移。Correspondingly, the ink cartridge is provided with a chip mounting portion, which includes a first positioning column 601 and a second positioning column 602. The first positioning column 601 and the second positioning column 602 are respectively combined with the first hole 121 and the second hole 122 in a protruding manner, and then the chip 20 is fixed to the ink cartridge body 50 by a hot welding head. Such a configuration can prevent the chip 20 from being offset during the installation process or during use after the installation is completed.
如图30、图31所示,当耗材盒10安装至安装部90时,连接件135一端连接设置在基板后表面120b的存储器100/后表面120b的接地端子135a,连接件135从基板后表面120b伸出,沿着盒体50远离芯片20的方向贴合盒体50(墨盒本体50),直至靠近连接件135的端部一侧,连接件135朝远离盒体50表面的方向弯折,从而与打印装置上的金属件96(相当于实施例一的接地部件)连接,这样设计的有益效果有:芯片接地的稳定性好,提高了芯片使用的安全性。As shown in Figures 30 and 31, when the consumable box 10 is installed on the mounting portion 90, one end of the connector 135 is connected to the ground terminal 135a of the memory 100/rear surface 120b set on the rear surface 120b of the substrate, and the connector 135 extends from the rear surface 120b of the substrate, and fits the box body 50 (ink cartridge body 50) along the direction of the box body 50 away from the chip 20 until it is close to the end side of the connector 135. The connector 135 bends in the direction away from the surface of the box body 50, thereby connecting with the metal part 96 (equivalent to the grounding component of Example 1) on the printing device. The beneficial effects of this design are: the chip grounding has good stability and the safety of chip use is improved.
当墨盒10安装至安装部90时,与存储器100连接的连接件135沿着芯片20的后表面120b贴合(也可以抵接)并延伸至墨盒10的顶面,后顺着墨盒10的顶面,从芯片20上端、墨盒10的顶面伸出,进入安装部的缝隙中,连接件135的末端折成直角状。连接件135的端部135e(远离墨盒本体的端部)与金属件96(相当于实施例一的接地部件)相抵接。When the ink cartridge 10 is mounted on the mounting portion 90, the connector 135 connected to the memory 100 is attached (or abutted) along the rear surface 120b of the chip 20 and extends to the top surface of the ink cartridge 10, and then extends from the upper end of the chip 20 and the top surface of the ink cartridge 10 along the top surface of the ink cartridge 10, and enters the gap of the mounting portion, and the end of the connector 135 is folded into a right angle. The end 135e of the connector 135 (the end away from the ink cartridge body) abuts against the metal member 96 (equivalent to the grounding member of the first embodiment).
连接件135(同实施例一的导通构件)朝向远离墨盒本体50表面的方向弯折,并朝向打印机(容纳墨盒10的腔体)的金属件96,该金属件96为本申请实施例中安装部的第一侧壁90c,即至少部分形成容纳腔的腔壁配置成接地部件,且接地部件与导通构件的电连接位置位于芯片的上方。如此设置,芯片接地的稳定性好,提高了芯片使用的安全性。The connecting member 135 (same as the conducting member in the first embodiment) is bent in a direction away from the surface of the ink cartridge body 50 and toward the metal member 96 of the printer (the cavity containing the ink cartridge 10). The metal member 96 is the first side wall 90c of the mounting portion in the embodiment of the present application, that is, at least part of the cavity wall forming the accommodating cavity is configured as a grounding member, and the electrical connection position between the grounding member and the conducting member is located above the chip. In this way, the stability of the chip grounding is good, which improves the safety of the chip.
连接件135一端连接基板120的后表面120b,另一端连接打印设备的金属件96,打印装置的金属件96不受限制,可以是打印设备上的任何可以被连接件135接触到的金属。One end of the connector 135 is connected to the rear surface 120 b of the substrate 120 , and the other end is connected to the metal component 96 of the printing device. The metal component 96 of the printing device is not limited and can be any metal on the printing device that can be contacted by the connector 135 .
实施例三:Embodiment three:
需要说明的是,本实施例中安装部与墨盒的插装方式与实施例一不同,其打印机的安装部结构也有所不同。实施例二的安装部90固定在装配仓内,且接地部件设置于容纳腔内。It should be noted that the installation method of the installation part and the ink cartridge in this embodiment is different from that in the first embodiment, and the installation part structure of the printer is also different. The installation part 90 of the second embodiment is fixed in the assembly compartment, and the grounding component is arranged in the accommodating cavity.
本实施例中提供了另一种天线式导通构件,且形成安装腔的至少部分腔壁配置成接地部件,导通构件的一端与芯片的接地端子电连接,另一端与安装腔的至少部分腔壁电连接。This embodiment provides another antenna-type conductive component, and at least part of the cavity wall forming the installation cavity is configured as a grounding component, one end of the conductive component is electrically connected to the ground terminal of the chip, and the other end is electrically connected to at least part of the cavity wall of the installation cavity.
实施例三的第一实施方式:The first implementation method of the third embodiment:
如图32所示,芯片20的前表面120a设置有第一端子131-第四端子134,其各自的接触部C的位置排列、存储器100、连接件135、基板的定位孔第二孔122同实施例二,在此不做赘述。As shown in FIG32 , the front surface 120a of the chip 20 is provided with a first terminal 131 to a fourth terminal 134, and the position arrangement of their respective contact portions C, the memory 100, the connector 135, and the second positioning hole 122 of the substrate are the same as those in the second embodiment and are not described in detail here.
与存储器100连接的连接件135(相当于实施例一中的导通构件)沿着芯片20的后表面120b贴合(也可以抵接)并延伸至墨盒10的顶面,后顺着墨盒10的顶面,从芯片20上端、墨盒10的顶面伸出,进入安装部的缝隙中。连接件135的端部135e(远离墨盒本体的端部)与接地部件相抵接。连接带135(可以称为连接件135)(相当于实施例一的导通构件)伸出的部分弯折,折向远离盒体50表面的方向,朝向打印装置(容纳墨盒10的腔体)的金属件(相当于实施例一的接地部件),从而与打印设备的金属件实现电连接。The connector 135 (equivalent to the conductive member in the first embodiment) connected to the memory 100 is attached (or abutted) along the rear surface 120b of the chip 20 and extends to the top surface of the ink cartridge 10, and then extends from the upper end of the chip 20 and the top surface of the ink cartridge 10 along the top surface of the ink cartridge 10 to enter the gap of the mounting portion. The end 135e (the end away from the ink cartridge body) of the connector 135 abuts against the grounding component. The extended portion of the connecting strip 135 (which can be called the connector 135) (equivalent to the conductive member in the first embodiment) is bent, folded in a direction away from the surface of the box body 50, toward the metal part (equivalent to the grounding part in the first embodiment) of the printing device (the cavity that accommodates the ink cartridge 10), thereby achieving electrical connection with the metal part of the printing device.
实施例三的第二实施方式:Second implementation of Example 3:
在第二种实施方式中,本实施方式中提供了另一种天线式导通构件,且形成安装腔的至少部分腔壁配置成接地部件,导通构件的一端与芯片的接地端子电连接,另一端与安装腔的至少部分腔壁电连接。In a second embodiment, another antenna-type conductive component is provided in this embodiment, and at least part of the cavity wall forming the installation cavity is configured as a grounding component, one end of the conductive component is electrically connected to the ground terminal of the chip, and the other end is electrically connected to at least part of the cavity wall of the installation cavity.
本实施例中安装部与墨盒的插装方式与实施例一不同,其打印机的安装部结构也有所不同,因此本实施方式中的三维坐标系所代表的方向也与实施例一不同。实施例二的安装部90固定在装配仓内,且接地部件设置于容纳腔内。The installation method of the mounting portion and the ink cartridge in this embodiment is different from that in the first embodiment, and the structure of the mounting portion of the printer is also different, so the direction represented by the three-dimensional coordinate system in this embodiment is also different from that in the first embodiment. The mounting portion 90 of the second embodiment is fixed in the assembly bin, and the grounding component is arranged in the accommodating cavity.
如图33所示,本实施方式中的打印机包括:打印单元4、底座5。底座5包括:支架、一个或者多个安装部90。As shown in FIG. 33 , the printer in this embodiment includes: a printing unit 4 and a base 5 . The base 5 includes: a bracket and one or more mounting parts 90 .
进一步地,一个安装部90可以承载一个墨盒10,当安装部90的个数是4时(如图33所示),四个墨盒10内可以存储四种不同颜色的墨水,例如黑色、黄色、蓝色、红色。再比如,底座5内可以承载六个墨盒10时,安装部90的个数是6,六个墨盒10分别存储有黑色、黄色、蓝色、红色、浅蓝色、浅红色颜色的墨水。进一步的,多个安装部90内可以容纳同一种颜色(比如,黑色)的墨水。Furthermore, one mounting portion 90 can carry one ink cartridge 10. When the number of mounting portions 90 is 4 (as shown in FIG. 33 ), four ink cartridges 10 can store four different colors of ink, such as black, yellow, blue, and red. For another example, when the base 5 can carry six ink cartridges 10, the number of mounting portions 90 is 6, and the six ink cartridges 10 store black, yellow, blue, red, light blue, and light red inks, respectively. Furthermore, multiple mounting portions 90 can contain ink of the same color (e.g., black).
墨盒10沿着第一方向D1先安装到托盘97中,然后墨盒10和托盘97的组合体沿着第二方向D2安装到安装部90内。打印机打印时,底座5为打印单元4的打印工作提供墨水,确保打印单元4的正常打印工作的进行。当打印机自然状态放置时,打印单元4在底座5的正上方。The ink cartridge 10 is first installed in the tray 97 along the first direction D1, and then the combination of the ink cartridge 10 and the tray 97 is installed in the mounting portion 90 along the second direction D2. When the printer is printing, the base 5 provides ink for the printing work of the printing unit 4 to ensure the normal printing work of the printing unit 4. When the printer is placed in a natural state, the printing unit 4 is directly above the base 5.
附图33中所示三维直角XYZ轴坐标系,X轴、Y轴、Z轴三者相互垂直。当打印机自然状态放置时,以重力方向为+Z方向,以墨盒10安装到安装部90内的安装方向D2(第二方向D2)为+Y方向,安装部90的排列方向为+X方向。第一方向D1是+Z方向。当墨盒10需要安装到安装部90时,墨盒10先沿着第一方向D1安装到托盘97上;然后墨盒10和托盘97的组合体沿着安装方向D2安装到安装部90内。In the three-dimensional right-angle XYZ axis coordinate system shown in FIG. 33 , the X axis, Y axis, and Z axis are perpendicular to each other. When the printer is placed in a natural state, the direction of gravity is the +Z direction, the installation direction D2 (second direction D2) of the ink cartridge 10 installed in the installation portion 90 is the +Y direction, and the arrangement direction of the installation portion 90 is the +X direction. The first direction D1 is the +Z direction. When the ink cartridge 10 needs to be installed in the installation portion 90, the ink cartridge 10 is first installed on the tray 97 along the first direction D1; then the combination of the ink cartridge 10 and the tray 97 is installed in the installation portion 90 along the installation direction D2.
如图34所示,此结构是安装在底座5的+Y方向上的部分,当墨盒10(也可以是组合体)沿着安装方向D2安装到安装部90内时,墨盒10的+Y方向的前端侧与图34所示结构相接触,从而保证墨盒10(也可以是组合体)与安装部90结合到位。As shown in Figure 34, this structure is the part installed in the +Y direction of the base 5. When the ink cartridge 10 (or it can be a combination) is installed in the mounting portion 90 along the mounting direction D2, the front end side of the ink cartridge 10 in the +Y direction contacts the structure shown in Figure 34, thereby ensuring that the ink cartridge 10 (or it can be a combination) is combined with the mounting portion 90 in place.
安装部90的内部结构包括固定架,固定架上设有触针组件91,供墨部92(注墨管)、柱状的定位部93f、93s和锁定部94。锁定部94为可复位摆动的杆状部件,即锁定部94配置为本申请的导电摆杆,该杆状部件在活动端设有-Z轴向延伸的凸起,该凸起用于与托盘97底部的沟槽配合以固定墨盒10与托盘97组成的组合体。The internal structure of the mounting portion 90 includes a fixing frame, on which are disposed a stylus assembly 91, an ink supply portion 92 (ink injection tube), columnar positioning portions 93f, 93s and a locking portion 94. The locking portion 94 is a rod-shaped component that can be reset and swung, that is, the locking portion 94 is configured as a conductive swing rod of the present application, and the rod-shaped component is provided with a protrusion extending in the -Z axial direction at the movable end, and the protrusion is used to cooperate with the groove at the bottom of the tray 97 to fix the combination of the ink cartridge 10 and the tray 97.
触针组件91能够在装配体安装至安装部90的状态下与墨盒10上的芯片电性连接,触针组件91包含弹性导电钢片制成的多根触针(图中未标出),触针组件91是倾斜式的设置在安装部90内,对于触针组件91的具体结构不再赘述,其结构可参阅图4。具体地,上述组合体沿图中的+Y和-Y方向安装或者移出,这个组合体通过壳体与安装部90物理卡合,通过位于墨盒上的芯片与触针组件91电连接。The stylus assembly 91 can be electrically connected to the chip on the ink cartridge 10 when the assembly is mounted to the mounting portion 90. The stylus assembly 91 includes a plurality of stylus pins (not shown in the figure) made of elastic conductive steel sheets. The stylus assembly 91 is tiltedly arranged in the mounting portion 90. The specific structure of the stylus assembly 91 is not described in detail. The structure can be referred to in Figure 4. Specifically, the above-mentioned assembly is installed or removed along the +Y and -Y directions in the figure. The assembly is physically engaged with the mounting portion 90 through the housing, and is electrically connected to the stylus assembly 91 through the chip on the ink cartridge.
如图35-38所示,墨盒10包括:芯片20、连接件60、供墨头40和墨水袋10a,其中芯片20设置在墨盒10的安装方向D2的前端侧,连接件60配置为导通构件,连接件60为导电材质,且连接件60一部分连接至芯片20上,另一部分连接至接地部件上。As shown in Figures 35-38, the ink cartridge 10 includes: a chip 20, a connector 60, an ink supply head 40 and an ink bag 10a, wherein the chip 20 is arranged on the front end side of the installation direction D2 of the ink cartridge 10, the connector 60 is configured as a conductive component, the connector 60 is made of conductive material, and a part of the connector 60 is connected to the chip 20, and the other part is connected to the grounding component.
供墨头40的+Y轴侧设置有出墨口41,墨水袋10a内存储有墨水,出墨口41与墨水袋10a内部液体连通,墨水经出墨口41到达注墨管92处,进而注墨管92可以将墨水供给到打印头处,从而打印头可以用于执行打印的动作。An ink outlet 41 is provided on the +Y axis side of the ink supply head 40. Ink is stored in the ink bag 10a. The ink outlet 41 is connected to the internal liquid of the ink bag 10a. The ink reaches the ink filling tube 92 through the ink outlet 41, and then the ink filling tube 92 can supply ink to the print head, so that the print head can be used to perform printing.
采用上述技术方案后,通过金属件、导通构件将接地信号传输给芯片20,提升了稳定性,减少了无法接地或接地不稳定的情况。在基板上不再设置接地端子,通过使用连接件,提高芯片的接地稳定性,防止电流过大,降低了芯片上的接地端子有可能无法与打印机上的触针稳定接触而带来触电危险的概率,有助于提高芯片的使用安全性,降低了打印装置无法识别墨盒情况的出现。After adopting the above technical solution, the ground signal is transmitted to the chip 20 through the metal parts and the conductive components, which improves the stability and reduces the situation where the grounding cannot be connected or the grounding is unstable. No ground terminal is set on the substrate. By using the connector, the grounding stability of the chip is improved to prevent excessive current, and the probability of the ground terminal on the chip failing to stably contact the contact pin on the printer to cause electric shock is reduced, which helps to improve the safety of the chip and reduce the situation where the printing device cannot recognize the ink cartridge.
上述方案中,安装部90的金属件(相当于实施例一的接地部件)可以是安装部90的外框体(+Z轴、-Z轴、+X轴、-X轴、+Y轴方向上的外框体)或者外框体的一部分。为了使用者的安全,安装部90的金属件都是接地的,与打印机之间的接地信号都是相通的。优选地,在本实施方式中连接件60(相当于实施例一的导通构件)另一部分连接的是安装部90的-Z轴方向上的金属件96的一部分,即至少部分容纳腔的腔壁形成接地部件。如图33所示,金属件96设置在底座5的-Z轴方向上,且与金属件96(相当于实施例一的接地部件)与打印机1的接地信号是连通的。In the above scheme, the metal part of the mounting portion 90 (equivalent to the grounding component of the first embodiment) can be the outer frame of the mounting portion 90 (the outer frame in the +Z axis, -Z axis, +X axis, -X axis, +Y axis directions) or a part of the outer frame. For the safety of the user, the metal parts of the mounting portion 90 are all grounded, and the grounding signals between the printers are all connected. Preferably, in this embodiment, the other part of the connecting member 60 (equivalent to the conducting member of the first embodiment) is connected to a part of the metal part 96 in the -Z axis direction of the mounting portion 90, that is, at least part of the cavity wall of the accommodating cavity forms a grounding component. As shown in Figure 33, the metal part 96 is arranged in the -Z axis direction of the base 5, and the metal part 96 (equivalent to the grounding component of the first embodiment) is connected to the grounding signal of the printer 1.
如图35、图36所示,本实施例提供的芯片20具有存储器100、基板120、多个端子130。基板120具有前表面120a,后表面120b,左侧面120c,右侧面120d,顶面120e,底面120f其中,前表面120a与后表面120b相对设置;左侧面120c与右侧面120d相对设置;顶面120e和底面120f相对设置。As shown in Figures 35 and 36, the chip 20 provided in this embodiment has a memory 100, a substrate 120, and a plurality of terminals 130. The substrate 120 has a front surface 120a, a rear surface 120b, a left side surface 120c, a right side surface 120d, a top surface 120e, and a bottom surface 120f, wherein the front surface 120a is arranged opposite to the rear surface 120b; the left side surface 120c is arranged opposite to the right side surface 120d; and the top surface 120e and the bottom surface 120f are arranged opposite to each other.
进一步地,芯片20具有第一孔121、第二孔122、第三孔123和第四孔124。第一孔121、第二孔122、第三孔123和第四孔124均为基板120上的通孔,均贯通基板120的前表面120a和后表面120b。Furthermore, the chip 20 has a first hole 121, a second hole 122, a third hole 123 and a fourth hole 124. The first hole 121, the second hole 122, the third hole 123 and the fourth hole 124 are all through holes on the substrate 120, and all penetrate the front surface 120a and the rear surface 120b of the substrate 120.
其中,第一孔121是由顶面120e向底面120f形成的凹陷部分,第二孔122是由底面120f向顶面120e形成的凹陷部分。第三孔123是由左侧面120c向右侧面120d形成的凹陷部分,第四孔124是由右侧面120d向左侧面120c形成的凹陷部分。The first hole 121 is a recessed portion formed from the top surface 120e to the bottom surface 120f, the second hole 122 is a recessed portion formed from the bottom surface 120f to the top surface 120e, the third hole 123 is a recessed portion formed from the left side surface 120c to the right side surface 120d, and the fourth hole 124 is a recessed portion formed from the right side surface 120d to the left side surface 120c.
如此设置,能够安装本实施例的芯片20的墨盒10上设置有芯片安装部,芯片安装部包括多个定位柱,多个定位柱会分别与第一孔121、第二孔122、第三孔123和第四孔124呈突出的方式相结合,然后通过热焊头焊接的方式将芯片20固定到供墨头40上,防止芯片20在安装过程或安装完成后的使用过程中沿Y轴或Z轴方向发生位置的偏移。In this way, a chip mounting portion is provided on the ink cartridge 10 capable of mounting the chip 20 of this embodiment, and the chip mounting portion includes a plurality of positioning columns, which are respectively combined with the first hole 121, the second hole 122, the third hole 123 and the fourth hole 124 in a protruding manner, and then the chip 20 is fixed to the ink supply head 40 by means of a hot welding head, so as to prevent the chip 20 from being shifted in position along the Y-axis or Z-axis direction during the installation process or the use process after the installation is completed.
与上述第一种实施方式相同之处,本实施方式中的设置于前表面各端子131-134均为通信端子,各通信端子的用途及在前表面的布局与第一种实施方式相同,此处不再赘述。Similar to the first embodiment described above, the terminals 131 - 134 arranged on the front surface in this embodiment are all communication terminals, and the purpose and layout of each communication terminal on the front surface are the same as those in the first embodiment, which will not be repeated here.
连接件60(相当于实施例一的导通构件)和存储器100也可以通过第五端子/附加端子135a(相当于实施例一的接地端子)及其导线相连通。可理解的是,本实施方式中也可以不具有第五端子135a,而是连接件60直接与存储器100相连接。优选地,使用第五端子135a使得连接件60与存储器100的连接更加有效、接触更加稳定。The connector 60 (equivalent to the conducting member of the first embodiment) and the memory 100 may also be connected via the fifth terminal/additional terminal 135a (equivalent to the ground terminal of the first embodiment) and its wire. It is understandable that the fifth terminal 135a may not be provided in this embodiment, but the connector 60 is directly connected to the memory 100. Preferably, the fifth terminal 135a is used to make the connection between the connector 60 and the memory 100 more effective and the contact more stable.
进一步地,导通构件和第五端子/附加端子135a可以通过焊锡、固定的方式相连接。每个端子130都具有一个接触部,其分别为第一接触部——第四接触部。接触部是当墨盒安装到打印机上时,触针在端子130上的最可能的接触区域。Further, the conducting member and the fifth terminal/additional terminal 135a can be connected by soldering or fixing. Each terminal 130 has a contact portion, which is respectively the first contact portion-the fourth contact portion. The contact portion is the most likely contact area of the contact pin on the terminal 130 when the ink cartridge is installed on the printer.
本申请实施例中连接件60作为导通构件,连接件60采用导电材质制作,打印机的接地信号通过导通构件、第五端子/附加端子(相当于接地端子)与存储器相连通,以使墨盒的芯片与接地部件共同接地。In the embodiment of the present application, the connector 60 serves as a conducting component, and the connector 60 is made of a conductive material. The ground signal of the printer is connected to the memory through the conducting component and the fifth terminal/additional terminal (equivalent to the ground terminal) so that the chip of the ink cartridge and the grounding component are grounded together.
如图37至图42所示,连接件60包括第一部分60a和第二部分60b。其中第一部分60a用于连接第二部分60b以及芯片20的第五端子/附加端子135a;第二部分60b用于连接金属件96、第一部分60a。As shown in Figures 37 to 42, the connector 60 includes a first portion 60a and a second portion 60b, wherein the first portion 60a is used to connect the second portion 60b and the fifth terminal/additional terminal 135a of the chip 20; and the second portion 60b is used to connect the metal member 96 and the first portion 60a.
芯片20连接第一部分60a,当墨盒安装到安装部90上时,芯片20的各通信端子分别与触针组件52上的第一触针911-第四触针914相连接。第一部分60a和第二部分60b的形状不受限制,其可以设置成规则的形状,比如矩形,也可以设置成曲折或其他不规则的形状。此外,第一部分60a可以一体成型,也可以设置成由若干段金属片拼接而成。The chip 20 is connected to the first part 60a. When the ink cartridge is installed on the mounting portion 90, the communication terminals of the chip 20 are respectively connected to the first contact pin 911 to the fourth contact pin 914 on the contact pin assembly 52. The shapes of the first part 60a and the second part 60b are not limited. They can be set to regular shapes, such as rectangles, or to zigzag or other irregular shapes. In addition, the first part 60a can be integrally formed or can be formed by splicing several sections of metal sheets.
进一步地,连接件60也可以是一体式结构,不具有第一部分60a和第二部分60b。当导通构件包括第一部分60a和第二部分60b时,简化了第一部分60a的结构,第二部分60b可以制造成较复杂的结构。Furthermore, the connector 60 may also be an integrated structure without the first part 60a and the second part 60b. When the conductive member includes the first part 60a and the second part 60b, the structure of the first part 60a is simplified, and the second part 60b can be manufactured into a more complex structure.
例如,第二部分60b还可以作为墨盒的把手30使用,在墨盒安装到托盘97的过程中起到装机、取机过程中的把手的作用,方便用户操作装取墨盒。如此设置,使得既可以完成接地信号的传输,也可以达到简化了墨盒结构(减少了把手的零部件的生产、制造、组装)的作用。因此,此结构可以使得减少零部件的数量、简化了墨盒的部分结构、降低成本。For example, the second portion 60b can also be used as the handle 30 of the ink cartridge, and when the ink cartridge is installed on the tray 97, it plays the role of a handle during the installation and removal process, making it convenient for the user to install and remove the ink cartridge. This arrangement can not only complete the transmission of the ground signal, but also simplify the structure of the ink cartridge (reducing the production, manufacturing, and assembly of the parts of the handle). Therefore, this structure can reduce the number of parts, simplify the partial structure of the ink cartridge, and reduce costs.
进一步的,连接件60的第一部分60a具有:第一连接部60aa、第二连接部60ab。第一连接部60aa用于与芯片20的第五端子或附加端子135相连接;第二连接部60ab用于与第二部分60b相连接。Furthermore, the first part 60a of the connector 60 has a first connecting portion 60aa and a second connecting portion 60ab. The first connecting portion 60aa is used to connect to the fifth terminal or the additional terminal 135 of the chip 20; and the second connecting portion 60ab is used to connect to the second part 60b.
第二部分60b具有:第一连接部60ba、第二连接部60bb。其中第二连接部60bb用于与第二连接部60ab相连接;第一连接部60ba用于与金属件96相抵接。The second portion 60 b includes a first connection portion 60 ba and a second connection portion 60 bb, wherein the second connection portion 60 bb is used to connect with the second connection portion 60 ab, and the first connection portion 60 ba is used to abut against the metal member 96 .
具体地,第一连接部60ba与金属件96的+Z轴的表面相抵接,完成接地信号的传输。第一连接部60ba不一定是在第二部分60b的端部;如图41-42所示,第一连接部60ba设置在第二部分60b的中部位置。第一连接部60ba可以是一个或者多个位置组合而成的。Specifically, the first connection portion 60ba abuts against the surface of the +Z axis of the metal member 96 to complete the transmission of the ground signal. The first connection portion 60ba is not necessarily at the end of the second portion 60b; as shown in Figures 41-42, the first connection portion 60ba is set in the middle of the second portion 60b. The first connection portion 60ba can be a combination of one or more positions.
如图41所示,第一连接部60ba可以是3个不同位置。因为第二部分60b除了需要抵接金属件96之外,还需要充当把手的作用,因此,在Z轴方向上,第一连接部60ba在第二部分60b的-Z轴方向侧。在Z轴方向上,第一连接部60ba位于第二连接部60bb的-Z轴方向侧;第二部分60b位于第一部分60a的-Z轴方向侧;第一部分60a位于芯片20的-Z轴方向侧。即,与金属件96相抵接的部分的位于最上方位置处。As shown in FIG. 41 , the first connection portion 60ba can be in three different positions. Because the second portion 60b needs to abut the metal member 96 and also needs to act as a handle, the first connection portion 60ba is on the -Z-axis side of the second portion 60b in the Z-axis direction. In the Z-axis direction, the first connection portion 60ba is located on the -Z-axis side of the second connection portion 60bb; the second portion 60b is located on the -Z-axis side of the first portion 60a; and the first portion 60a is located on the -Z-axis side of the chip 20. That is, the portion abutting against the metal member 96 is located at the uppermost position.
在Y轴方向上,第一连接部60ba位于第二连接部60bb的-Y轴方向侧;第二部分60b位于第一部分60a的-Y轴方向侧;第一部分60a位于芯片20的-Y轴方向侧。即,第一连接部60ba位于第二连接部60bb的-Z轴、-Y轴方向侧;第二部分60b位于第一部分60a的-Z轴、-Y轴方向侧;第一部分60a位于芯片20的-Z轴、-Y轴方向侧。In the Y-axis direction, the first connection portion 60ba is located on the -Y-axis direction side of the second connection portion 60bb; the second portion 60b is located on the -Y-axis direction side of the first portion 60a; and the first portion 60a is located on the -Y-axis direction side of the chip 20. That is, the first connection portion 60ba is located on the -Z-axis and -Y-axis direction sides of the second connection portion 60bb; the second portion 60b is located on the -Z-axis and -Y-axis direction sides of the first portion 60a; and the first portion 60a is located on the -Z-axis and -Y-axis direction sides of the chip 20.
需要说明的是,第二部分60b接触的金属件96可以是打印机任何一处可以导电的金属件。优选的,沿Z轴方向,第二部分60b接触的金属件96的位置位于墨盒10的最上方处。It should be noted that the metal part 96 that the second part 60b contacts can be any conductive metal part of the printer. Preferably, along the Z-axis direction, the metal part 96 that the second part 60b contacts is located at the top of the ink cartridge 10.
此外,继续参阅图34、37,当墨盒安装到安装部90上后,柱状的定位部53f、53s与托盘97上的定位孔97a与97b、墨盒上的孔部42a与42b相配合对组合体的在安装部的位置进行限制;注墨管92(相当于实施例一的供墨部92)与出墨口41相匹配,可以为打印机的打印提供墨水;触针组件91与芯片20相接触,提供芯片信号的传输。In addition, referring to Figures 34 and 37, when the ink cartridge is installed on the mounting portion 90, the columnar positioning portions 53f and 53s cooperate with the positioning holes 97a and 97b on the tray 97 and the holes 42a and 42b on the ink cartridge to limit the position of the assembly on the mounting portion; the ink injection tube 92 (equivalent to the ink supply portion 92 of Example 1) matches the ink outlet 41 to provide ink for the printer to print; the stylus assembly 91 contacts the chip 20 to provide chip signal transmission.
锁定部94上的凸起用于与托盘97底部的沟槽配合以固定墨盒与托盘97组成的组合体。连接件60与金属件96相接触传输接地信号。连接件60在墨盒安装到托盘97的过程中起到装机、取机过程中的把手的作用,方便用户操作装取墨盒。The protrusion on the locking portion 94 is used to cooperate with the groove at the bottom of the tray 97 to fix the combination of the ink cartridge and the tray 97. The connecting member 60 contacts the metal member 96 to transmit the ground signal. The connecting member 60 acts as a handle during the process of installing the ink cartridge to the tray 97, which is convenient for users to operate the installation and removal of the ink cartridge.
需要说明的是,托盘97上的定位孔97a/97b以及墨盒上的孔部42a/42b的数目和形状不受限制。比如,可以设置有一个,或一个以上数目的定位孔,形状可以设置成圆形,方形或其他不规则的形状,只能能够实现与打印机稳定配合、达到墨盒的稳定安装即可。It should be noted that the number and shape of the positioning holes 97a/97b on the tray 97 and the holes 42a/42b on the ink cartridge are not limited. For example, one or more positioning holes may be provided, and the shapes may be circular, square or other irregular shapes, as long as they can be stably matched with the printer and stably installed in the ink cartridge.
进一步地,继续参阅图37至图40,本实施方式中的墨盒具有供墨头40和内部储存有墨水的墨水袋10a。其中,芯片20与连接件60均设置在供墨头40上。其中,供墨头40的+X侧设置有出墨口41,出墨口41通过其内部的导出流道与墨水袋10a连通,用于将墨水袋10a内部储存的墨水经由出墨口41供给至打印机。Further, referring to Figures 37 to 40, the ink cartridge in this embodiment has an ink supply head 40 and an ink bag 10a storing ink therein. The chip 20 and the connector 60 are both disposed on the ink supply head 40. An ink outlet 41 is disposed on the +X side of the ink supply head 40, and the ink outlet 41 is connected to the ink bag 10a through an internal lead-out flow channel thereof, and is used to supply the ink stored in the ink bag 10a to the printer via the ink outlet 41.
参阅图40,供墨头40的+Z轴侧设置有轴孔,第二部分60b的轴与该轴孔配合安装。供墨头40的+Z轴侧还设置有支撑件102,其位于第二部分60b的+Z轴侧,轴孔的-Y轴侧,对第二部分60b的至少一部分起到支撑作用。Referring to Fig. 40, an axial hole is provided on the +Z axis side of the ink supply head 40, and the axis of the second part 60b is installed in cooperation with the axial hole. A support member 102 is also provided on the +Z axis side of the ink supply head 40, which is located on the +Z axis side of the second part 60b and the -Y axis side of the axial hole, and supports at least a portion of the second part 60b.
具体的,本实施例中支撑件102为自供墨头40的上表面向+Z轴方向延伸的凸起,且沿+Z轴方向,支撑件102高于上述轴,在墨盒安装状态下,第二部分60b的至少部分与支撑件102接触并位于支撑件102的+Z轴侧。Specifically, in this embodiment, the support member 102 is a protrusion extending from the upper surface of the ink supply head 40 in the +Z axis direction, and along the +Z axis direction, the support member 102 is higher than the above-mentioned axis. When the ink cartridge is installed, at least part of the second part 60b is in contact with the support member 102 and is located on the +Z axis side of the support member 102.
因此,在安装状态下,第二部分60b由于支撑件102的作用,其向-Y轴侧、-Z轴侧倾斜,且第二部分60b的-Z轴端部与墨盒上方的金属件96接触并实现电连接,因此才能实现:第一连接部60ba位于第二连接部60bb的-Z轴、-Y轴方向侧;第二部分60b位于第一部分60a的-Z轴、-Y轴方向侧。Therefore, in the installed state, the second part 60b is inclined toward the -Y axis side and the -Z axis side due to the action of the support member 102, and the -Z axis end of the second part 60b contacts the metal part 96 above the ink cartridge and realizes electrical connection, so that it can be achieved that: the first connecting part 60ba is located on the -Z axis and -Y axis direction side of the second connecting part 60bb; the second part 60b is located on the -Z axis and -Y axis direction side of the first part 60a.
如此设置,不仅降低了因接地不稳定而带来触电危险的风险,并且使得芯片接地的稳定性好,提高了芯片使用的安全性。同时,也方便用户操作装取墨盒。Such a setting not only reduces the risk of electric shock caused by unstable grounding, but also makes the chip grounding stable, improving the safety of chip use. At the same time, it is also convenient for users to operate and remove ink cartridges.
需要说明的是,支撑件102的数目和形状不受限制,具体的,支撑件102可以设置成一个,两个或两个以上,且可以设置成长方体,圆柱或三棱柱或其他规则或不规则的形状,只要能够对第二部分60b起到支撑作用并使其与金属件96能够实现稳定接触即可。It should be noted that the number and shape of the support members 102 are not limited. Specifically, the support members 102 can be set to one, two or more, and can be set to a cuboid, a cylinder or a triangular prism or other regular or irregular shapes, as long as they can support the second part 60b and enable it to achieve stable contact with the metal member 96.
优选的,沿X轴方向,相比于芯片基板120的右侧面120d,第二部分60b与金属件96的接触区域更靠近芯片基板120的左侧面120c。优选的,第二部分60b与金属件96的抵接区域可以不设置在如图41所示的第一连接部60ba上,而是可以设置在第一区域R1的区域范围内。Preferably, along the X-axis direction, the contact area between the second portion 60b and the metal member 96 is closer to the left side 120c of the chip substrate 120 than the right side 120d of the chip substrate 120. Preferably, the contact area between the second portion 60b and the metal member 96 may not be set on the first connecting portion 60ba as shown in FIG. 41, but may be set within the region range of the first region R1.
如图41所示,第二部分60b与金属件96相连接的部分为:第三连接部60bc。第三连接部60bc位于第一区域R1处,且X轴方向上,第二部分60b是倾斜设置的(此倾斜方式,可以通过多个支撑件102的高低不同来实现),第三连接部60bc位于第二部分的+Z轴端部处。As shown in FIG41 , the portion where the second portion 60b is connected to the metal member 96 is the third connection portion 60bc. The third connection portion 60bc is located at the first region R1, and in the X-axis direction, the second portion 60b is tilted (this tilting manner can be achieved by different heights of the plurality of support members 102), and the third connection portion 60bc is located at the +Z-axis end of the second portion.
需要说明的是,在墨盒10安装到打印装置的过程中,连接件60(导通构件)接触接地部件在先,芯片20接触触针组件91在后。It should be noted that, during the process of installing the ink cartridge 10 into the printing device, the connector 60 (conducting member) contacts the grounding component first, and the chip 20 contacts the contact pin assembly 91 later.
实施例三的第三种实施方式:The third implementation method of the third embodiment:
在第三种实施方式中,本实施方式在上述实施方式二的基础上,又提供了一种新的导通构件,此导通构件的一端与芯片的接地端子电连接,另一端与安装腔的至少部分腔壁电连接,且两者电连接位置位于芯片的上方。In the third embodiment, based on the above-mentioned embodiment 2, this embodiment provides a new conductive component, one end of which is electrically connected to the ground terminal of the chip, and the other end is electrically connected to at least part of the cavity wall of the mounting cavity, and the electrical connection position between the two is located above the chip.
如图43和图44所示,本实施方式提供的芯片与上述实施方式三不同之处在于:芯片20设置了一个凹部21。其凹部21的作用是:避开第五触针915,防止第五触针915与芯片20相抵接或者接触;即当墨盒10安装到打印机的安装部上时,第五触针915的一部分位于凹部21内,而第五触针915不会与芯片20相抵接或者接触。As shown in FIGS. 43 and 44 , the chip provided in this embodiment is different from the above-mentioned embodiment 3 in that: a recess 21 is provided in the chip 20. The function of the recess 21 is to avoid the fifth contact pin 915 and prevent the fifth contact pin 915 from abutting or contacting the chip 20; that is, when the ink cartridge 10 is installed on the installation part of the printer, a part of the fifth contact pin 915 is located in the recess 21, and the fifth contact pin 915 will not abut or contact the chip 20.
需要说明的是,芯片20也可以不具有凹部21,只要在芯片的X轴方向上不具有可以与第五触针915相连接的端子/接触部,即使芯片20与第五触针915相抵接,但是二者之间不会产生电连接,也不会产生接地信号的传输。It should be noted that the chip 20 may not have the recess 21, as long as there is no terminal/contact portion that can be connected to the fifth contact pin 915 in the X-axis direction of the chip. Even if the chip 20 is in contact with the fifth contact pin 915, no electrical connection will be generated between the two, and no ground signal will be transmitted.
如图45至51所示,墨盒10包括:芯片20,连接件70(相当于实施例一的导通构件),供墨头(也可以称为底座)40和墨水袋10a;芯片20设置在墨盒10的安装方向D2的前端侧;连接件70配置为导通构件,其材质为导电材质,其中连接件70的一部分连接至芯片20上,另一部分连接至安装部90的金属件96(相当于实施例一的接地部件)上。例如,连接件70连接金属件96的+Z轴方向的下面96a,即连接件70连接金属件96(相当于实施例一的接地部件)的朝向安装部90的下面96a。As shown in FIGS. 45 to 51 , the ink cartridge 10 includes: a chip 20, a connector 70 (equivalent to the conductive member of the first embodiment), an ink supply head (also referred to as a base) 40 and an ink bag 10a; the chip 20 is arranged at the front end side of the installation direction D2 of the ink cartridge 10; the connector 70 is configured as a conductive member, and its material is a conductive material, wherein a part of the connector 70 is connected to the chip 20, and another part is connected to the metal member 96 (equivalent to the grounding member of the first embodiment) of the mounting portion 90. For example, the connector 70 is connected to the lower side 96a of the metal member 96 in the +Z axis direction, that is, the connector 70 is connected to the lower side 96a of the metal member 96 (equivalent to the grounding member of the first embodiment) facing the mounting portion 90.
芯片20与打印机之间的接地信号通过连接件70、金属件96进行传输。采用上述技术方案后,通过金属件96、连接件70将接地信号传输给芯片20,提升了稳定性,减少了无法接地或接地不稳定的情况。The grounding signal between the chip 20 and the printer is transmitted through the connector 70 and the metal member 96. After adopting the above technical solution, the grounding signal is transmitted to the chip 20 through the metal member 96 and the connector 70, which improves the stability and reduces the situation of being unable to ground or unstable grounding.
进一步地,本实施方式中第一端子131-第四端子134设置在芯片20的前表面120a上,第五端子135设置在芯片20的后表面120b上。多个端子130(第一端子131-第五端子135)设置在芯片20的-X轴的第一区域R1内。第一区域R1位于芯片的-X轴侧,使得芯片20上的端子紧凑布置,且传输的接地信号的第五端子135,与传输具有高电平的信号的通信端子(第一端子131-第四端子134)分布在芯片20的不同表面上,使得二者之间减少了短路的可能性、避免了相互之间的电磁干扰。Further, in this embodiment, the first terminal 131-the fourth terminal 134 are arranged on the front surface 120a of the chip 20, and the fifth terminal 135 is arranged on the rear surface 120b of the chip 20. A plurality of terminals 130 (the first terminal 131-the fifth terminal 135) are arranged in the first region R1 of the -X axis of the chip 20. The first region R1 is located on the -X axis side of the chip, so that the terminals on the chip 20 are compactly arranged, and the fifth terminal 135 for transmitting the ground signal and the communication terminal (the first terminal 131-the fourth terminal 134) for transmitting the signal with a high level are distributed on different surfaces of the chip 20, so that the possibility of short circuit between the two is reduced and electromagnetic interference between them is avoided.
与上述实施方式三中的区别还在于,如图45、图46所示,本实施方式提供的连接件70是一个一体成型的构件。其制作材料可以是用低碳钢或者高碳钢制成的一种金属型材,为了防锈可以在表面镀镍或者镀铬;其原材料也可以是不锈钢制成的一种金属型材。The difference from the third embodiment is that, as shown in Figures 45 and 46, the connector 70 provided in this embodiment is an integrally formed component. Its manufacturing material can be a metal profile made of low carbon steel or high carbon steel, and the surface can be nickel-plated or chrome-plated for rust prevention; its raw material can also be a metal profile made of stainless steel.
连接件70的截面可以是圆形、椭圆形、长方形、正方形、梯形等形状。生产工艺可以是热成形或者冷成形。例如通过弹簧机将原材料为表面镀镍的82B高碳钢的直径为0.6mm的金属丝通过热变形的工艺方式生产制造出如图45的导通构件。对于导通构件的原材料、型材、生产工艺等方面本实施方式不加以限制,只要能够保证稳定的进行接地信号的传输即可。The cross section of the connector 70 may be circular, oval, rectangular, square, trapezoidal, etc. The production process may be hot forming or cold forming. For example, a metal wire with a diameter of 0.6 mm and a surface nickel-plated 82B high carbon steel is produced by a spring machine through a hot deformation process to produce a conductive component as shown in FIG. 45. The present embodiment does not limit the raw materials, profiles, production processes, etc. of the conductive component, as long as the stable transmission of the ground signal can be guaranteed.
例如,如果型材的截面是圆形的话,可以是直径为0.3-2.5mm的金属丝,优选地,导通构件的直径为0.5-1.0mm的金属丝,并且金属丝的弹性、形状的稳固性均有要求。如果金属丝的截面直径较小,可能会由于不能稳固的保持原有形状,而造成不能满足墨盒10多次安装后仍然可以保持原有形状,从而影响接地信号的畅通性传输。如果金属丝的直径较大,可能会导致墨盒10的安装或者取出的过程中发生卡顿的情况。For example, if the cross section of the profile is circular, it can be a metal wire with a diameter of 0.3-2.5 mm. Preferably, the diameter of the conductive member is a metal wire with a diameter of 0.5-1.0 mm, and the elasticity and stability of the shape of the metal wire are required. If the cross-sectional diameter of the metal wire is small, it may not be able to maintain the original shape stably, and it may not be able to meet the requirement that the ink cartridge 10 can still maintain the original shape after multiple installations, thereby affecting the smooth transmission of the ground signal. If the diameter of the metal wire is large, it may cause jamming during the installation or removal of the ink cartridge 10.
如果是非圆形的金属丝,则可以选择宽度在0.3-2.5mm内的金属型材,优选地导通构件选择宽度在0.5-1.0mm内的金属型材。如果是型号的直径是圆形、椭圆形等主体表面是圆弧形状的型材的话,可以在第四部分704的位置上磨削出一个接触平面(如图45的虚线所在的位置处)使得与金属件96的+Z轴的下面96a连接的部分变为第一接触部70a。If the metal wire is non-circular, a metal profile with a width of 0.3-2.5 mm can be selected, and preferably a metal profile with a width of 0.5-1.0 mm can be selected for the conductive member. If the diameter of the profile is circular, elliptical, etc., and the main surface is an arc shape, a contact plane can be ground at the position of the fourth part 704 (such as the position where the dotted line in Figure 45 is located) so that the part connected to the lower side 96a of the +Z axis of the metal part 96 becomes the first contact part 70a.
该接触平面70a’可以是以原有的第一接触部70a为中心磨削,具体的可以在砂轮机上磨削出小平面(如图45的虚线所在的位置处),从而使得起到与金属件96连接作用的部分变为第一接触部70a。因为连接件70与金属件96的接触是平面接触而不是点接触,能够降低由于打印机工作过程中产生的震动、外界的一些震动对于连接件70(相当于实施例一的导通构件)与金属件96的接触稳定性的影响,有利于提高接触的稳定性,有利于接地信号的稳定传输。接触平面70a’也可以是以原有的第一接触部70a的基础上挤压出小平面,称为第一接触部70a。The contact plane 70a' can be ground with the original first contact part 70a as the center. Specifically, a small plane can be ground on a grinding machine (such as the position of the dotted line in Figure 45), so that the part that plays a role in connecting with the metal part 96 becomes the first contact part 70a. Because the contact between the connecting member 70 and the metal part 96 is a plane contact rather than a point contact, it can reduce the impact of the vibration generated during the operation of the printer and some external vibrations on the contact stability between the connecting member 70 (equivalent to the conductive component of the first embodiment) and the metal part 96, which is beneficial to improve the contact stability and the stable transmission of the ground signal. The contact plane 70a' can also be a small plane extruded on the basis of the original first contact part 70a, which is called the first contact part 70a.
本实施方式中的连接件70包括:第一接触部70a、第二接触部70b、半封闭环70c、第一弯折空间70d、第二弯折空间70e、第三弯折空间70f、第四弯折空间70g。根据型材的弯折情况依次将连接件70分为第一部分701、第二部分702、第三部分703、第四部分704、第五部分705、第六部分706、第七部分707、第八部分708、第九部分709、第十部分710、第十一部分711。The connector 70 in this embodiment includes: a first contact portion 70a, a second contact portion 70b, a semi-closed loop 70c, a first bending space 70d, a second bending space 70e, a third bending space 70f, and a fourth bending space 70g. According to the bending conditions of the profile, the connector 70 is divided into a first portion 701, a second portion 702, a third portion 703, a fourth portion 704, a fifth portion 705, a sixth portion 706, a seventh portion 707, an eighth portion 708, a ninth portion 709, a tenth portion 710, and an eleventh portion 711.
其中,第二部分702、第四部分704、第六部分706、第七部分707、第八部分708、第十部分710为弯折区域。第一接触部70a位于第四部分704上,在Z轴方向上观察,第一接触部70a位于连接件70的-Z方向的端部位置处,与金属件96的+Z轴的下面96a相抵接。第一接触部70a位于第二接触部70b的-Z轴方向上。Among them, the second part 702, the fourth part 704, the sixth part 706, the seventh part 707, the eighth part 708, and the tenth part 710 are bending areas. The first contact portion 70a is located on the fourth part 704. When viewed in the Z-axis direction, the first contact portion 70a is located at the end position of the connecting member 70 in the -Z direction, and abuts against the lower surface 96a of the +Z axis of the metal member 96. The first contact portion 70a is located in the -Z-axis direction of the second contact portion 70b.
第四部分704相比连接件70的其它部分来说位于-Z轴侧。半封闭环70c位于连接件70的-Y轴侧处,半封闭环70c是由第一部分701、第二部分702、第三部分703、第四部分704、第五部分705共同构成的空间。第三部分703、第五部分705的倾斜方向是不同的,沿着Y轴方向观察第三部分703朝向-Z轴方向倾斜,第五部分705朝向+Z轴方向倾斜。The fourth portion 704 is located at the -Z axis side compared to other portions of the connector 70. The semi-enclosed loop 70c is located at the -Y axis side of the connector 70, and the semi-enclosed loop 70c is a space formed by the first portion 701, the second portion 702, the third portion 703, the fourth portion 704, and the fifth portion 705. The inclination directions of the third portion 703 and the fifth portion 705 are different. When viewed along the Y axis direction, the third portion 703 is inclined toward the -Z axis direction, and the fifth portion 705 is inclined toward the +Z axis direction.
即第三部分703朝向+Y轴、-Z轴方向倾斜,第五部分705朝向+Y轴、+Z轴方向倾斜。第三部分703、第四部分704、第五部分705共同组成了一个山峰形状,第四部分704位于最-Z轴侧。第五部分705的至少一部分位于第六部分706至第十一部分711的-Z轴方向侧。That is, the third portion 703 is inclined toward the +Y axis and the -Z axis direction, and the fifth portion 705 is inclined toward the +Y axis and the +Z axis direction. The third portion 703, the fourth portion 704, and the fifth portion 705 together form a peak shape, and the fourth portion 704 is located at the -Z axis side. At least a portion of the fifth portion 705 is located at the -Z axis side of the sixth portion 706 to the eleventh portion 711.
在墨盒10安装到安装部90时,第五部分705会先接触到金属件96(同时如果打印机中在金属件96的-Y轴方向设置有一个安装部保护部件的话,第五部分705会先接触到安装部保护部件,越过安装部保护部件后第五部分705才接触金属件96),随着墨盒10沿着安装方向D2的不断装入,连接部件70的-X轴侧以及半封闭环70c会被压缩发生一定的形变,直到连接件70整体进入到安装部90内,此时第一接触部70a与金属件96的下面96a相抵接。在上述安装过程中,第五部分705起到引导连接件70安装到安装部90、引导连接件70的形变的作用,最终完成第一接触部70a与金属件96的抵接。When the ink cartridge 10 is installed in the installation part 90, the fifth part 705 will first contact the metal part 96 (if a mounting part protection component is provided in the -Y axis direction of the metal part 96 in the printer, the fifth part 705 will first contact the mounting part protection component, and the fifth part 705 will contact the metal part 96 after passing the mounting part protection component). As the ink cartridge 10 is continuously installed along the installation direction D2, the -X axis side of the connecting part 70 and the semi-enclosed ring 70c will be compressed and deformed to a certain extent, until the connecting part 70 enters the installation part 90 as a whole, and the first contact part 70a abuts against the lower surface 96a of the metal part 96. In the above installation process, the fifth part 705 plays the role of guiding the connecting part 70 to be installed in the installation part 90 and guiding the deformation of the connecting part 70, and finally completing the abutment of the first contact part 70a with the metal part 96.
在墨盒10要脱离安装部90的时候,当芯片20脱离打印机的触针组件91时,第一接触部70a不会脱离金属件96,当墨盒10要完全脱离安装部90的时候,第一接触部70a才会脱离金属件96。When the ink cartridge 10 is about to be separated from the mounting portion 90 and the chip 20 is about to be separated from the contact pin assembly 91 of the printer, the first contact portion 70a will not be separated from the metal part 96. The first contact portion 70a will be separated from the metal part 96 only when the ink cartridge 10 is about to be completely separated from the mounting portion 90.
进一步地,在第一接触部70a与金属件96脱离前,随着墨盒10沿着与安装方向D2相反的方向不断移出,第三部分703会起到引导、缓冲作用,避免了连接件70在墨盒10脱离安装部90的过程中会被卡死在金属件96上的保护部件的情况出现,最终可以顺利的取出墨盒10。Furthermore, before the first contact portion 70a disengages from the metal part 96, as the ink cartridge 10 is continuously moved out in a direction opposite to the installation direction D2, the third portion 703 will play a guiding and buffering role, thereby preventing the connecting member 70 from being stuck on the protective component on the metal part 96 during the process of the ink cartridge 10 disengaging from the installation portion 90, and finally the ink cartridge 10 can be smoothly removed.
如此设置,当墨盒10脱离安装部90的时候,连接件70会在本身弹性力的作用下恢复到初始状态。连接件70具有初始状态(连接件70尚未安装到安装部90的时候)、抵接状态(连接件70安装到安装部90内的时候)有利于连接件70更好的与金属件96接触,降低了接触不稳定的情况出现。With such a configuration, when the ink cartridge 10 is separated from the mounting portion 90, the connector 70 will return to its initial state under the action of its own elastic force. The connector 70 has an initial state (when the connector 70 has not yet been mounted on the mounting portion 90) and an abutting state (when the connector 70 is mounted on the mounting portion 90), which is conducive to better contact between the connector 70 and the metal member 96, thereby reducing the occurrence of unstable contact.
第七部分707、第八部分708均是弯折成开口朝向+Z轴方向的U形结构,可以与供墨头40上的第一棱403、第二棱404接合在一起,起到固定导通构件的作用,从而使得连接件70可以承受金属件96对于导通构件70的-Y轴侧部分的压力、芯片20对于第二接触部70b的压力,且可以保证连接件70的弹性恢复力,可以保证连接件70在初始状态、抵接状态之间切换。The seventh part 707 and the eighth part 708 are both bent into a U-shaped structure with the opening facing the +Z axis direction, which can be joined together with the first edge 403 and the second edge 404 on the ink supply head 40 to play the role of fixing the conductive component, so that the connecting part 70 can withstand the pressure of the metal part 96 on the -Y axis side of the conductive component 70 and the pressure of the chip 20 on the second contact part 70b, and can ensure the elastic restoring force of the connecting part 70, and can ensure that the connecting part 70 switches between the initial state and the abutment state.
第七部分707与第八部分708之间形成开口朝向-Z轴方向的U形结构的第三弯折空间70f。供墨头40上可以设置一些活动卡扣,活动卡扣卡合到第三弯折空间70f上,可以防止连接件70从供墨头40上脱离出来。A third bending space 70f of a U-shaped structure with an opening toward the −Z axis direction is formed between the seventh portion 707 and the eighth portion 708. Some movable buckles may be provided on the ink supply head 40, and the movable buckles are engaged with the third bending space 70f to prevent the connector 70 from being separated from the ink supply head 40.
第二接触部70b形成在第十部分710上,第二接触部70b与芯片20的第五端子135相抵接,且芯片20会给予第二接触部70b一定的压力,使得第二接触部70b更好的与第五端子135接触。第十部分710可以在弯折的尖点处磨削出一个小平面,形成第二接触部,从而使得连接件70与芯片20更稳定的接触。The second contact portion 70b is formed on the tenth portion 710, and the second contact portion 70b abuts against the fifth terminal 135 of the chip 20, and the chip 20 applies a certain pressure to the second contact portion 70b, so that the second contact portion 70b is better in contact with the fifth terminal 135. The tenth portion 710 can grind a small plane at the tip of the bend to form the second contact portion, so that the connector 70 and the chip 20 are in more stable contact.
如图43至图46所示,在X轴方向上连接件70并没有偏移的位置,即沿-Y轴方向观察墨盒10,连接件70的投影在垂直于X轴的同一条线上。因此,第一接触部70a在芯片20上的投影位于第五端子135上,第一接触部70a在芯片20上的投影位于第一区域R1内,第一接触部70a在芯片20上的投影位于芯片20的-X轴位置侧。第十一部分711的存在可以防止在生产制造过程中,连接件70刮伤第五端子135,避免了第五端子135的损伤。As shown in Figures 43 to 46, the connector 70 is not offset in the X-axis direction, that is, when the ink cartridge 10 is observed along the -Y-axis direction, the projection of the connector 70 is on the same line perpendicular to the X-axis. Therefore, the projection of the first contact portion 70a on the chip 20 is located on the fifth terminal 135, the projection of the first contact portion 70a on the chip 20 is located in the first region R1, and the projection of the first contact portion 70a on the chip 20 is located on the -X-axis position side of the chip 20. The presence of the eleventh portion 711 can prevent the connector 70 from scratching the fifth terminal 135 during the manufacturing process, thereby avoiding damage to the fifth terminal 135.
需要说明的是,如图47和图48所示,墨盒10上还包括:芯片安装部201。芯片安装部201用于承载芯片20。芯片20通过芯片安装部201固定在墨盒10上。芯片安装部201具有:通槽2011、容纳部2012、平面2013、定位柱2014、固定部2015。It should be noted that, as shown in FIG. 47 and FIG. 48 , the ink cartridge 10 further includes a chip mounting portion 201. The chip mounting portion 201 is used to carry the chip 20. The chip 20 is fixed to the ink cartridge 10 through the chip mounting portion 201. The chip mounting portion 201 has a through groove 2011, a receiving portion 2012, a plane 2013, a positioning column 2014, and a fixing portion 2015.
平面2013与芯片20上的后表面120b相贴合,并用于定位芯片20。容纳部2012用于容纳存储器100。定位柱2014与芯片20的第一孔-第四孔相匹配,从而保证芯片20固定在芯片安装部201上。连接件70穿过通槽2011与芯片20的第五端子135相抵接。如图31所示,连接件70的第九部分709、第十部分710、第十一部分711的全部或者至少一部分被容纳在通槽2011内。The plane 2013 is in contact with the rear surface 120b of the chip 20 and is used to position the chip 20. The receiving portion 2012 is used to receive the memory 100. The positioning column 2014 matches the first hole to the fourth hole of the chip 20, thereby ensuring that the chip 20 is fixed on the chip mounting portion 201. The connector 70 passes through the through slot 2011 and abuts against the fifth terminal 135 of the chip 20. As shown in FIG. 31 , all or at least a part of the ninth portion 709, the tenth portion 710, and the eleventh portion 711 of the connector 70 are received in the through slot 2011.
固定部2015是设置在芯片安装部201上的突起,与供墨头40上的固定槽451匹配,用于固定芯片安装部201。在固定部2015上可以设置一些卡扣,并通过卡扣卡合在固定槽451上,如此设置可以减少芯片安装部201在连接件70的弹性力作用下脱离供墨头40。The fixing portion 2015 is a protrusion provided on the chip mounting portion 201, which matches the fixing groove 451 on the ink supply head 40 and is used to fix the chip mounting portion 201. Some buckles can be provided on the fixing portion 2015, and are engaged with the fixing groove 451 through the buckles. Such a setting can reduce the chip mounting portion 201 from being separated from the ink supply head 40 under the elastic force of the connecting member 70.
供墨头40具有-Z轴侧的上表面40a、突起部及承载部45。突起部位于上表面40a上的-Y轴侧。突起部可以只具有第一突起部43(如图50所示),也可以具有第一突起部43和第二突起部44(如图50所示)。当突起部包括第一突起部43和第二突起部44时,第一突起部43和第二突起部44可以充当沿着安装方向D1安装墨盒10到托盘97或者沿着与安装方向D1相反的方向取出墨盒10的使用者的拿捏部分,使用者通过拿捏第一突起部43和第二突起部44的侧面,可以移动墨盒10,有利于取出和安装墨盒10。The ink supply head 40 has an upper surface 40a on the -Z axis side, a protrusion and a bearing portion 45. The protrusion is located on the -Y axis side of the upper surface 40a. The protrusion may have only the first protrusion 43 (as shown in FIG. 50 ), or may have the first protrusion 43 and the second protrusion 44 (as shown in FIG. 50 ). When the protrusion includes the first protrusion 43 and the second protrusion 44, the first protrusion 43 and the second protrusion 44 may serve as a gripping portion for a user who installs the ink cartridge 10 to the tray 97 along the installation direction D1 or takes out the ink cartridge 10 in a direction opposite to the installation direction D1. The user can move the ink cartridge 10 by gripping the sides of the first protrusion 43 and the second protrusion 44, which is conducive to taking out and installing the ink cartridge 10.
供墨头40还包括:第一凸起401、第二凸起402、第一棱403、第二棱404、固定槽451。固定槽451用于固定芯片安装部201。当连接件70安装到供墨头40上时,第一凸起401位于连接件70的半封闭环70c内,减少连接件70脱离供墨头40的情况的发生。The ink supply head 40 further includes: a first protrusion 401, a second protrusion 402, a first ridge 403, a second ridge 404, and a fixing groove 451. The fixing groove 451 is used to fix the chip mounting portion 201. When the connecting member 70 is installed on the ink supply head 40, the first protrusion 401 is located in the semi-enclosed ring 70c of the connecting member 70, thereby reducing the occurrence of the situation where the connecting member 70 is separated from the ink supply head 40.
第二凸起402位于连接件70的第一弯折空间70d内,减少连接件70脱离供墨头40的情况的发生;第一棱403与第七部分707相配合,二者之间可以是过盈配合状态,减少连接件70脱离供墨头40的情况的发生;第二棱404与第八部分708相配合,二者之间可以是过盈配合状态,减少连接件70脱离供墨头40的情况的发生。供墨头40上可以设置一些活动卡扣,活动卡扣卡合到第三弯折空间70f上,可以防止连接件70从供墨头40上脱离出来。The second protrusion 402 is located in the first bending space 70d of the connecting member 70, so as to reduce the occurrence of the connecting member 70 being separated from the ink supply head 40; the first ridge 403 cooperates with the seventh portion 707, and the two may be in an interference fit state, so as to reduce the occurrence of the connecting member 70 being separated from the ink supply head 40; the second ridge 404 cooperates with the eighth portion 708, and the two may be in an interference fit state, so as to reduce the occurrence of the connecting member 70 being separated from the ink supply head 40. Some movable buckles may be provided on the ink supply head 40, and the movable buckles are engaged with the third bending space 70f, so as to prevent the connecting member 70 from being separated from the ink supply head 40.
第一凸起401的-Z轴侧设置有斜面401a,第二凸起402在-Z轴侧设置有斜面402a,第一棱403的-Z轴侧设置有斜面403a,第二棱404的-Z轴侧设置有斜面404a,以上斜面在安装连接件70到供墨头40上的时候起到引导的作用。The first protrusion 401 is provided with a slope 401a on the -Z axis side, the second protrusion 402 is provided with a slope 402a on the -Z axis side, the first edge 403 is provided with a slope 403a on the -Z axis side, and the second edge 404 is provided with a slope 404a on the -Z axis side. The above slopes serve as a guide when installing the connecting part 70 onto the ink supply head 40.
进一步地,如图52所示,本实施方式中墨盒10的供墨头40在+X轴侧和-X轴侧处设置了增宽件46,增加了墨盒10在X轴方向的宽度,有利于增宽墨水袋10a,的宽度,增大墨水袋10a的墨水容量。同时可以理解的是,托盘97也会在X轴方向增宽的。需要说明的是,本实施方式中在墨盒10安装到打印装置的过程中,连接件60(导通构件)接触接地部件在先,芯片20接触触针组件91在后。Further, as shown in FIG. 52 , the ink supply head 40 of the ink cartridge 10 in this embodiment is provided with a widening member 46 at the +X axis side and the -X axis side, which increases the width of the ink cartridge 10 in the X axis direction, and is conducive to widening the width of the ink bag 10a, and increasing the ink capacity of the ink bag 10a. At the same time, it can be understood that the tray 97 will also be widened in the X axis direction. It should be noted that in this embodiment, when the ink cartridge 10 is installed in the printing device, the connector 60 (conducting member) contacts the grounding component first, and the chip 20 contacts the contact pin assembly 91 later.
实施例三的第四实施方式:Fourth implementation of Example 3:
在第四种实施方式中,本实施方式在上述实施方式的基础上提供了一种地线式导通构件,其中导通构件的一端与芯片的接地端子电连接,另一端向下延伸,并与导电摆杆电连接,且两者电连接位置位于芯片的下方,并进一步通过导电摆杆连接至接地部件。In the fourth embodiment, this embodiment provides a ground wire type conductive component based on the above embodiment, wherein one end of the conductive component is electrically connected to the ground terminal of the chip, and the other end extends downward and is electrically connected to the conductive rocker arm, and the electrical connection position of the two is located below the chip, and is further connected to the grounding component through the conductive rocker arm.
具体地,如图53和图54所示,墨盒本体50还包括底壳51(相当于实施方式二、三中的供墨头40),在安装方向D2(+Y轴方向)上,连接件70的至少一部分设置在前表面51a的前端侧,连接件70(相当于导通构件)与前表面51a之间形成空间Q,空间Q可容纳安装部90的一部分;连接件70的至少一部分设置在墨盒10的底表面51b的下方。Specifically, as shown in Figures 53 and 54, the ink cartridge body 50 also includes a bottom shell 51 (equivalent to the ink supply head 40 in embodiments two and three). In the installation direction D2 (+Y-axis direction), at least a portion of the connecting member 70 is arranged on the front end side of the front surface 51a, and a space Q is formed between the connecting member 70 (equivalent to the conductive member) and the front surface 51a, and the space Q can accommodate a portion of the mounting portion 90; at least a portion of the connecting member 70 is arranged below the bottom surface 51b of the ink cartridge 10.
进一步地,如图55所示,连接件70配置为第一导电片,容纳腔的底部设置有导电摆杆,其中导电摆杆位于墨盒本体的底部,并能够对墨盒本体进行限位。本实施方式中锁定部94为可复位摆动的杆状部件,即锁定部94配置为导电摆杆,锁定部94的上表面可与第一导电片电连接,且两者电连接位置位于芯片的下方。Further, as shown in FIG. 55 , the connector 70 is configured as a first conductive sheet, and a conductive swing rod is provided at the bottom of the accommodating cavity, wherein the conductive swing rod is located at the bottom of the ink cartridge body and can limit the ink cartridge body. In this embodiment, the locking portion 94 is a rod-shaped component that can be reset and swung, that is, the locking portion 94 is configured as a conductive swing rod, and the upper surface of the locking portion 94 can be electrically connected to the first conductive sheet, and the electrical connection position of the two is located below the chip.
采用上述技术方案后,利用连接件70与前表面51a之间的空间Q与安装部90进行限位,使得空间Q与安装部90配合好的情况下连接件70才能与锁定部94接触,连接件70与锁定部94接触后,芯片20的接地信号才能正常进行传输。After adopting the above technical solution, the space Q between the connector 70 and the front surface 51a is used to limit the mounting portion 90, so that the connector 70 can contact the locking portion 94 only when the space Q and the mounting portion 90 are well matched. After the connector 70 contacts the locking portion 94, the ground signal of the chip 20 can be transmitted normally.
进一步的,空间Q中还可以容纳连接件70的一部分。比如,连接件70的一侧设置成“n”形,在空间Q中也设置有连接件70的一部分。如图56所示,连接件70还包括延伸部710,延伸部710设置在空间Q中,设置在空间Q和前表面51a之间。如此结构下,空间Q依然是设置在连接件70与前表面51a之间。只要有连接件70的一部分符合此描述,即为符合连接件70与前表面51a之间形成空间Q的特征。Furthermore, a portion of the connector 70 may also be accommodated in the space Q. For example, one side of the connector 70 is arranged in an "n" shape, and a portion of the connector 70 is also arranged in the space Q. As shown in FIG. 56 , the connector 70 further includes an extension portion 710, and the extension portion 710 is arranged in the space Q, between the space Q and the front surface 51a. Under such a structure, the space Q is still arranged between the connector 70 and the front surface 51a. As long as a portion of the connector 70 meets this description, it meets the characteristics of forming a space Q between the connector 70 and the front surface 51a.
连接件70与前表面51a之间形成的空间Q可以容纳托盘97的前壁97aa。通过空间Q与前壁97aa进行限位,导通构件本身与接地部件接触。进一步地,容纳腔的底部具有底壁97bb,接地部件也可以是容纳腔的底壁97bb。The space Q formed between the connector 70 and the front surface 51a can accommodate the front wall 97aa of the tray 97. The space Q and the front wall 97aa are limited, and the conductive member itself is in contact with the grounding component. Further, the bottom of the accommodating cavity has a bottom wall 97bb, and the grounding component can also be the bottom wall 97bb of the accommodating cavity.
继续参阅图53至图56可以看出,连接件70的一部分连接至芯片20上,另一部分连接至安装部90的接地部件上。连接件70同时起到了机械手段和芯片信号检测手段确保墨盒正确的安装到打印机的安装部90上。53 to 56, it can be seen that a portion of the connector 70 is connected to the chip 20, and another portion is connected to the grounding component of the mounting portion 90. The connector 70 serves as both a mechanical means and a chip signal detection means to ensure that the ink cartridge is correctly installed on the mounting portion 90 of the printer.
连接件70与前表面之间的空间Q用来与托盘97的前壁97aa相配合,只有前壁97aa进入到空间Q中,则托盘97才与墨盒10安装定位好。当组合体安装到安装部90内时,连接件70与锁定部94的上表面相接触,才能完成芯片型号的检测,才能保证墨盒10能够通过芯片信号检测手段的检测;机械手段与芯片信号检测的手段合并,更全面的确保墨盒正确的安装到打印机上。The space Q between the connector 70 and the front surface is used to match the front wall 97aa of the tray 97. Only when the front wall 97aa enters the space Q, the tray 97 and the ink cartridge 10 are properly installed and positioned. When the assembly is installed in the installation portion 90, the connector 70 contacts the upper surface of the locking portion 94, and the chip model detection can be completed, and the ink cartridge 10 can be guaranteed to pass the detection of the chip signal detection means; the mechanical means and the chip signal detection means are combined to more comprehensively ensure that the ink cartridge is correctly installed on the printer.
进一步地,需要说明的是,墨盒10包括芯片20、底壳51、墨水袋10a、连接件70、孔部220与210、位于+Y轴方向的前表面51a、位于+Z轴方向的底表面51b、出墨口41。托盘97具有前壁97aa、定位孔971与972。Further, it should be noted that the ink cartridge 10 includes a chip 20, a bottom shell 51, an ink bag 10a, a connector 70, holes 220 and 210, a front surface 51a located in the +Y axis direction, a bottom surface 51b located in the +Z axis direction, and an ink outlet 41. The tray 97 has a front wall 97aa, and positioning holes 971 and 972.
锁定部94具有-Z轴方向的上表面94a。当墨盒10安装到安装部90上后,供墨部92(注墨管)与出墨口41相匹配,可以为打印机的打印提供墨水。打印机的触针组件91与芯片20的通信端子相接触,提供芯片信号的传输。The locking portion 94 has an upper surface 94a in the -Z axis direction. When the ink cartridge 10 is mounted on the mounting portion 90, the ink supply portion 92 (ink injection tube) matches the ink outlet 41 and can provide ink for the printer to print. The printer's contact pin assembly 91 contacts the communication terminal of the chip 20 to provide chip signal transmission.
柱状的定位部93f、93s与托盘97上的定位孔971与972、墨盒上的孔部220与210相配合对组合体的在安装部的位置进行限制;锁定部94上的凸起941用于与托盘97底部的沟槽配合以固定墨盒10与托盘97组成的组合体;连接件70与托盘97的前壁97aa相配合且连接件70与锁定部94的上表面94a相接触传输接地信号。The columnar positioning portions 93f, 93s cooperate with the positioning holes 971 and 972 on the tray 97 and the holes 220 and 210 on the ink cartridge to limit the position of the assembly in the mounting portion; the protrusion 941 on the locking portion 94 is used to cooperate with the groove at the bottom of the tray 97 to fix the assembly consisting of the ink cartridge 10 and the tray 97; the connecting member 70 cooperates with the front wall 97aa of the tray 97 and the connecting member 70 contacts the upper surface 94a of the locking portion 94 to transmit the ground signal.
实施例三的第五实施方式:The fifth implementation of the third embodiment:
在上述实施方式的基础上,本实施方式中提供了另一种天线式导通构件,其中导通构件由导电片和部分墨水袋的导电膜组成,具体实施如下:On the basis of the above-mentioned embodiment, another antenna-type conductive component is provided in this embodiment, wherein the conductive component is composed of a conductive sheet and a conductive film of a part of the ink bag, and is specifically implemented as follows:
本实施方式提供的导通构件包括第一导电片71和第一导电传输介质体;墨盒本体包括储墨部,储墨部具有由膜层结构围成的容墨腔;膜层结构包括由外及内依次层叠设置的绝缘外膜、导电中间膜以及绝缘内膜;导电中间膜配置成第一导电传输介质体,且至少部分导电中间膜用于将第一导电片与容纳腔的顶壁电连接。The conductive component provided in this embodiment includes a first conductive sheet 71 and a first conductive transmission medium body; the ink cartridge body includes an ink storage portion, the ink storage portion has an ink containing cavity surrounded by a film layer structure; the film layer structure includes an insulating outer film, a conductive intermediate film and an insulating inner film stacked in sequence from the outside to the inside; the conductive intermediate film is configured as a first conductive transmission medium body, and at least part of the conductive intermediate film is used to electrically connect the first conductive sheet to the top wall of the containing cavity.
示例性地,如图57和图58所示,本实施方式中的墨盒包括设置于墨盒本体内的储墨部,储墨部配置为墨水袋10a,墨水袋10a具有由膜层结构围成的容墨腔,且容墨腔用于储存墨水。Exemplarily, as shown in Figures 57 and 58, the ink cartridge in this embodiment includes an ink storage portion disposed in the ink cartridge body, the ink storage portion is configured as an ink bag 10a, the ink bag 10a has an ink containing cavity surrounded by a membrane layer structure, and the ink containing cavity is used to store ink.
例如,墨水袋具有上表面以及下表面,上表面和下表面为膜层结构的外表面。膜层结构包括由外以内依次设置的绝缘外膜、导电中间膜以及绝缘内膜,绝缘外膜形成墨水袋的外表面,外表面包括上述上表面和下表面,绝缘内膜形成墨水袋的内表面,并与墨水接触,导电中间膜设置于绝缘外膜和绝缘内膜之间,且至少部分导电中间膜可作为上述第一导电传输介质体,以视为导通构件的一部分,并且部分导电中间膜可与接地部件电连接。For example, the ink bag has an upper surface and a lower surface, and the upper surface and the lower surface are the outer surfaces of the film structure. The film structure includes an insulating outer film, a conductive intermediate film and an insulating inner film arranged in sequence from the outside to the inside, the insulating outer film forms the outer surface of the ink bag, and the outer surface includes the upper surface and the lower surface, the insulating inner film forms the inner surface of the ink bag and contacts with the ink, the conductive intermediate film is arranged between the insulating outer film and the insulating inner film, and at least part of the conductive intermediate film can be used as the first conductive transmission medium body, so as to be regarded as a part of the conductive component, and part of the conductive intermediate film can be electrically connected to the grounding component.
本申请实施例中部分导电中间膜暴露于膜层结构的外表面,并形成第一电连接部,第一电连接部可与第一导电片电连接,第一导电片的另一端与芯片的接地端子电连接。例如,绝缘外膜包括第一镂空部,第一镂空部靠近第一导电片设置,部分导电中间膜暴露于第一镂空部并形成第一电连接部。In the embodiment of the present application, part of the conductive intermediate film is exposed to the outer surface of the film structure and forms a first electrical connection portion, which can be electrically connected to the first conductive sheet, and the other end of the first conductive sheet is electrically connected to the ground terminal of the chip. For example, the insulating outer film includes a first hollow portion, the first hollow portion is arranged close to the first conductive sheet, and part of the conductive intermediate film is exposed to the first hollow portion and forms the first electrical connection portion.
部分导电中间膜暴露于膜层结构的外表面,并形成第二电连接部,第二电连接部可与第一电连接部相对,并通过两者之间未暴露的导电中间膜电连接,第二电连接部与接地部件电连接。Part of the conductive intermediate film is exposed on the outer surface of the film layer structure to form a second electrical connection portion, which may be opposite to the first electrical connection portion and electrically connected through the unexposed conductive intermediate film therebetween, and is electrically connected to the grounding component.
例如,绝缘外膜包括第二镂空部,至少部分导电中间膜暴露于第二镂空部内,并形成第二电连接部,且第二电连接部与第一电连接部通过部分导电中间膜电连接,以传输接地信号;即芯片与打印机之间的接地信号通过第一导电片、中间导电膜以及接地部件进行传输。如此设置,提升了墨盒的接地稳定性,减少了无法接地或接地不稳定的情况。For example, the insulating outer film includes a second hollow portion, at least part of the conductive intermediate film is exposed in the second hollow portion, and a second electrical connection portion is formed, and the second electrical connection portion is electrically connected to the first electrical connection portion through part of the conductive intermediate film to transmit a grounding signal; that is, the grounding signal between the chip and the printer is transmitted through the first conductive sheet, the intermediate conductive film, and the grounding component. This arrangement improves the grounding stability of the ink cartridge and reduces the situation where the grounding cannot be achieved or the grounding is unstable.
在上述实施方式的基础上,本实施方式中接地部件可以是安装部90的外框体(+Z轴、-Z轴、+X轴、-X轴、+Y轴方向上的外框体)或者外框体的一部分,例如形成容纳腔的腔壁作为接地部件,第一电连接部位于墨水袋10a的Y轴的一侧,上述第二电连接部位于墨水袋的-Y轴的一侧,且第二电连接部处于第一电连接部的-Z轴一侧,即第二电连接部相比第一电连接部更加靠近容纳腔的腔壁。Based on the above embodiment, in this embodiment, the grounding component can be the outer frame of the mounting part 90 (the outer frame in the +Z axis, -Z axis, +X axis, -X axis, and +Y axis directions) or a part of the outer frame, for example, the cavity wall of the accommodating cavity is used as the grounding component, the first electrical connection part is located on the Y-axis side of the ink bag 10a, the above-mentioned second electrical connection part is located on the -Y-axis side of the ink bag, and the second electrical connection part is on the -Z-axis side of the first electrical connection part, that is, the second electrical connection part is closer to the cavity wall of the accommodating cavity than the first electrical connection part.
需要说明的是,墨水袋10a表面的局部区域的膜层结构具有四层膜:沿着由墨水袋10a的外部朝向内部的方向,第一层膜为PET材质,故第一层膜也称PET膜,即绝缘外膜;第二层膜为Al材质并可导电,又称为铝膜、金属膜或中间导电膜10a1;第三层膜为尼龙膜;第四层膜为PET140材质,故第四层膜也称PET140膜。It should be noted that the membrane structure of the local area on the surface of the ink bag 10a has four layers of membrane: along the direction from the outside to the inside of the ink bag 10a, the first layer of membrane is made of PET material, so the first layer of membrane is also called PET membrane, that is, an insulating outer membrane; the second layer of membrane is made of Al material and is conductive, also called aluminum film, metal film or intermediate conductive film 10a1; the third layer of membrane is nylon membrane; the fourth layer of membrane is made of PET140 material, so the fourth layer of membrane is also called PET140 membrane.
而墨水袋10a表面的另一些区域只设置了三层膜,即该区域暴露于膜层结构的外表面,沿着由墨水袋10a的外部朝向内部的方向,依次为前述的导电膜10a1、尼龙膜和PET140膜,由于在这些区域中导电膜10a1位于最外侧,这些区域也称为墨水袋10a的导电区域,换言之,该导电区域形成电连接部。其中,墨水袋10a上所有区域的导电膜10a1都是相连接的,也就是说,无论是墨水袋10a上设置了三层膜的区域,还是设置了四层膜的区域,都具有同一层导电膜10a1。同时,导电膜10a1与墨水袋10a中储存的墨水之间是隔绝的,因此本方案中,墨水不参与接地信号的传输。However, other areas on the surface of the ink bag 10a are only provided with three layers of film, that is, the area is exposed to the outer surface of the film layer structure, and along the direction from the outside to the inside of the ink bag 10a, the aforementioned conductive film 10a1, nylon film and PET140 film are provided in sequence. Since the conductive film 10a1 is located at the outermost side in these areas, these areas are also called conductive areas of the ink bag 10a. In other words, the conductive areas form electrical connections. Among them, the conductive films 10a1 in all areas of the ink bag 10a are connected, that is, whether it is an area on the ink bag 10a where three layers of film are provided or an area where four layers of film are provided, they all have the same layer of conductive film 10a1. At the same time, the conductive film 10a1 is isolated from the ink stored in the ink bag 10a, so in this solution, the ink does not participate in the transmission of the ground signal.
本申请实施方式中第一导电片71的一部分连接至芯片20上,另一部分连接至墨水袋10a的导电区域A的导电膜上(第一电连接部)。第一导电片71具有第一部分71a、第二部分71b。第一部分71a连接至芯片20上,第二部分71b连接至导电膜上。In the embodiment of the present application, a portion of the first conductive sheet 71 is connected to the chip 20, and another portion is connected to the conductive film of the conductive area A of the ink bag 10a (first electrical connection portion). The first conductive sheet 71 has a first portion 71a and a second portion 71b. The first portion 71a is connected to the chip 20, and the second portion 71b is connected to the conductive film.
在导电区域A的导电膜与第一导电片71连接之后,在两者的连接处的-Z轴侧用PET材质的膜覆盖,使墨盒10外表更加美观,或者用粘性件(比如胶带等)固定住两者的连接处,使得第一导电片71与第一电连接部之间的连接更稳定。After the conductive film of the conductive area A is connected to the first conductive sheet 71, the -Z axis side of the connection between the two is covered with a PET film to make the appearance of the ink cartridge 10 more beautiful, or the connection between the two is fixed with an adhesive (such as tape, etc.) to make the connection between the first conductive sheet 71 and the first electrical connection part more stable.
如图59所示,本实施例中墨水袋40的-Y轴侧端部向-Z轴方向延伸,该端部的-Z轴侧表面具有导电区域B,该导电区域为第二电连接部,导电区域B的导电膜10a1与安装部90的+Z轴侧外框体的金属件96连接,并且该金属件96为形成容纳腔的腔壁,从而实现芯片20与打印机1之间的接地信号的传输。As shown in Figure 59, in this embodiment, the -Y-axis side end of the ink bag 40 extends in the -Z-axis direction, and the -Z-axis side surface of the end has a conductive area B, which is the second electrical connection part. The conductive film 10a1 of the conductive area B is connected to the metal part 96 of the +Z-axis side outer frame of the mounting part 90, and the metal part 96 is the cavity wall forming the accommodating cavity, thereby realizing the transmission of the ground signal between the chip 20 and the printer 1.
需要说明的是,墨水袋10a的任意一处都可以设置导电区域、并将该区域的导电膜与安装部90的金属件96连接,例如除了墨水袋10a的-Y轴侧端部外,墨水袋10a的+Y轴侧位置处、+X轴侧、-X轴侧、-Z轴侧或+Z轴侧位置处的导电膜均可以与安装部90的金属件96连接。It should be noted that a conductive area can be set at any position of the ink bag 10a, and the conductive film in the area can be connected to the metal part 96 of the mounting part 90. For example, except for the -Y axis side end of the ink bag 10a, the conductive film at the +Y axis side, +X axis side, -X axis side, -Z axis side or +Z axis side of the ink bag 10a can be connected to the metal part 96 of the mounting part 90.
如图60和图61所示,在上述实施方式的基础上,本申请实施例提供的墨盒还包括第二导电片72,第二导电片72和第一导电片71间隔设置,且第二导电片72具有第一部分72a和第二部分72b,第一部分72a连接墨水袋10a的导电区域C上的导电膜,第二部分72b连接安装部90的金属件96,接地信号是通过金属件96、第二导电片72、导电膜、第一导电片71传输给芯片20的;而墨水袋的40的-Y轴侧端部不与安装部90的金属件直接接触。As shown in Figures 60 and 61, on the basis of the above-mentioned embodiment, the ink cartridge provided in the embodiment of the present application also includes a second conductive sheet 72, and the second conductive sheet 72 and the first conductive sheet 71 are arranged at an interval, and the second conductive sheet 72 has a first part 72a and a second part 72b, the first part 72a is connected to the conductive film on the conductive area C of the ink bag 10a, and the second part 72b is connected to the metal part 96 of the mounting part 90, and the ground signal is transmitted to the chip 20 through the metal part 96, the second conductive sheet 72, the conductive film, and the first conductive sheet 71; and the -Y-axis side end of the ink bag 40 is not in direct contact with the metal part of the mounting part 90.
可选的,在导电区域C的导电膜与第二导电片72连接之后,在两者的连接处的-Z轴侧用PET材质的膜覆盖,使墨盒10外表更加美观,或者用粘性件(比如胶带等)固定住两者的连接处,使得第二导电片72与导电膜10a1之间的连接更稳定。Optionally, after the conductive film of the conductive area C is connected to the second conductive sheet 72, the -Z axis side of the connection between the two is covered with a PET film to make the appearance of the ink cartridge 10 more beautiful, or the connection between the two is fixed with an adhesive (such as tape, etc.) to make the connection between the second conductive sheet 72 and the conductive film 10a1 more stable.
上述方案中,安装部90的金属件可以是安装部90的外框体(+Z轴、-Z轴、+X轴、-X轴、+Y轴方向上的外框体)或者外框体的一部分。为了使用者的安全,安装部90的金属件都是接地的,与打印机之间的接地信号都是相通的。In the above solution, the metal parts of the mounting portion 90 can be the outer frame of the mounting portion 90 (the outer frame in the +Z axis, -Z axis, +X axis, -X axis, +Y axis directions) or a part of the outer frame. For the safety of the user, the metal parts of the mounting portion 90 are all grounded, and the grounding signal between the printer is connected.
本实施例中第二导电片72由墨水袋10a的导电区域C先向-Z轴方向延伸,再向-X轴侧或+X轴侧延伸直至越过托盘97,然后向+Z轴方向延伸并与安装部90的+Z轴侧的外框体连接。In this embodiment, the second conductive sheet 72 extends from the conductive area C of the ink bag 10a first in the -Z axis direction, then extends to the -X axis side or the +X axis side until it crosses the tray 97, and then extends to the +Z axis direction and is connected to the outer frame on the +Z axis side of the mounting portion 90.
需要说明的是,第二导电片72的数量不限制,例如可以设置一个或多个,且其设置在墨水袋10a上的位置也不限制,例如可以设置在墨水袋10a的上表面或下表面,可以设置在墨水袋10a的+X轴侧、-X轴侧、+Y轴侧或-Y轴侧。实施例三的第六实施方式:It should be noted that the number of the second conductive sheet 72 is not limited, for example, one or more can be provided, and the position of the second conductive sheet 72 on the ink bag 10a is also not limited, for example, it can be provided on the upper surface or the lower surface of the ink bag 10a, and can be provided on the +X axis side, -X axis side, +Y axis side or -Y axis side of the ink bag 10a. Sixth implementation of the third embodiment:
图62为本申请实施例三的第六实施方式墨盒的示意图。此实施方式墨盒的描述同实施例三的第四实施方式内容一致,芯片使用的是芯片的变形例一或者芯片的变形例三,此处不再赘述。Figure 62 is a schematic diagram of the ink cartridge of the sixth embodiment of the third embodiment of the present application. The description of the ink cartridge of this embodiment is consistent with the fourth embodiment of the third embodiment, and the chip used is the first variant of the chip or the third variant of the chip, which will not be repeated here.
实施例三的第七实施方式:The seventh implementation method of the third embodiment:
图63为本申请实施例三的第七实施方式墨盒的示意图。此实施方式墨盒的描述同实施例三的第一至三的实施方式内容一致,芯片使用的是芯片的变形例一或者芯片的变形例三,此处不再赘述。Figure 63 is a schematic diagram of the ink cartridge of the seventh embodiment of the third embodiment of the present application. The description of the ink cartridge of this embodiment is consistent with the first to third embodiments of the third embodiment, and the chip used is the first variant of the chip or the third variant of the chip, which will not be repeated here.
实施例四:Embodiment 4:
在上述实施例一的基础上,本申请实施例还包括导电支板82,安装部90滑动的设置在导轨86上;导轨86与导电支板82支架设置有阻隔板85;导电支板82设置于阻隔板85远离安装部的一侧,且导电支板82的长度方向与接地导轨80的延伸方向一致,例如导电支板82与水平面平行设置,且导电支板82与导电壁板81相对布置在接地导轨80的两侧。相应地,导通构件包括跨接部,以使导通构件越过阻隔板85,即跨接部跨设在阻隔板85的上方,并且跨接部靠近导电支板的部分能够与导电支板接触并电连接。On the basis of the above-mentioned embodiment 1, the embodiment of the present application further includes a conductive support plate 82, and the mounting portion 90 is slidably arranged on the guide rail 86; the guide rail 86 and the conductive support plate 82 support are provided with a blocking plate 85; the conductive support plate 82 is arranged on the side of the blocking plate 85 away from the mounting portion, and the length direction of the conductive support plate 82 is consistent with the extension direction of the grounding guide rail 80, for example, the conductive support plate 82 is arranged parallel to the horizontal plane, and the conductive support plate 82 and the conductive wall plate 81 are arranged on both sides of the grounding guide rail 80. Correspondingly, the conducting component includes a bridging portion, so that the conducting component passes over the blocking plate 85, that is, the bridging portion is arranged above the blocking plate 85, and the portion of the bridging portion close to the conductive support plate can contact and be electrically connected with the conductive support plate.
如图66所示,导轨86可以是携带有接地信号的导电部件,可能也是不携带有接地信号的不导电部件。当导轨86携带有接地信号时,其导电支板82可能是导轨的一部分,也可能导轨86与导电支板82属于2个不同的部件。阻隔板85是不携带有接地信号的不导电部件(例如阻隔板85采用不导电的塑料制作),因此本实施例中导通构件必须要跨过阻隔板85才能与导电支板82相抵接达到本申请的有益效果。As shown in FIG. 66 , the guide rail 86 may be a conductive component carrying a ground signal, or may be a non-conductive component not carrying a ground signal. When the guide rail 86 carries a ground signal, its conductive support plate 82 may be a part of the guide rail, or the guide rail 86 and the conductive support plate 82 may belong to two different components. The blocking plate 85 is a non-conductive component not carrying a ground signal (for example, the blocking plate 85 is made of non-conductive plastic), so in this embodiment, the conductive component must cross the blocking plate 85 to abut against the conductive support plate 82 to achieve the beneficial effects of the present application.
具体地,如图64和图65所示,在本实施例中芯片20设置在墨盒10的安装方向的前端侧,存储器100设置在芯片20的后表面120b上,在芯片20与墨盒10之间还设有导电片140a,导电片140a形状与芯片20大致一致,在导电片140a中部设有与存储器100形状一致的开孔111,开孔111大小刚好容纳存储器100的突起部分通过,接地端子137a、137b在芯片20与导电片140a在安装完成后贴合连接。Specifically, as shown in Figures 64 and 65, in this embodiment, the chip 20 is arranged on the front end side of the installation direction of the ink cartridge 10, and the memory 100 is arranged on the rear surface 120b of the chip 20. A conductive sheet 140a is also provided between the chip 20 and the ink cartridge 10. The shape of the conductive sheet 140a is roughly consistent with that of the chip 20. An opening 111 consistent with the shape of the memory 100 is provided in the middle of the conductive sheet 140a. The size of the opening 111 is just enough to accommodate the protruding part of the memory 100. The grounding terminals 137a and 137b are bonded and connected to the chip 20 and the conductive sheet 140a after the installation is completed.
连接件140配置为导通构件,连接件140(相当于导通构件)由具有一定硬度的导电材质制成,连接件140(相当于导通构件)的一端通过焊锡与导电片140a连接。当然,连接件140与导电片140a可以是一体成型的钣金件,也可以是具有多部分连接组成的结构。可选的,本实施例中也可以不具有导电片140a,连接件140(相当于导通构件)直接与接地端子相连接也可以达到传输接地信号的作用。The connector 140 is configured as a conducting component. The connector 140 (equivalent to the conducting component) is made of a conductive material with a certain hardness. One end of the connector 140 (equivalent to the conducting component) is connected to the conductive sheet 140a by solder. Of course, the connector 140 and the conductive sheet 140a can be an integrally formed sheet metal part, or a structure composed of multiple parts. Optionally, the conductive sheet 140a may not be provided in this embodiment, and the connector 140 (equivalent to the conducting component) can be directly connected to the ground terminal to achieve the function of transmitting the ground signal.
如图66至图70所示,连接件140另一端可以沿着墨盒本体50在-Y轴方向的第一侧壁50a、或者沿着墨盒本体在+Y方向的第二侧壁(与第一侧壁50a相对设置,图中未示出)、或者沿着盒体在+Z方向的顶壁50d,向远离芯片20的方向延伸到10的后侧壁,直至靠近连接件140的端部一侧,连接件140朝远离墨盒10表面的方向弯折并形成跨接部140b,并且连接到接地导轨的导电支板82。进一步地,芯片20与打印机之间的接地信号通过导电片140a、连接件140、导电支板82进行传输。As shown in Figures 66 to 70, the other end of the connector 140 can extend along the first side wall 50a of the ink cartridge body 50 in the -Y axis direction, or along the second side wall of the ink cartridge body in the +Y direction (arranged opposite to the first side wall 50a, not shown in the figure), or along the top wall 50d of the cartridge body in the +Z direction, in a direction away from the chip 20 to the rear side wall of 10, until it is close to the end side of the connector 140, and the connector 140 is bent in a direction away from the surface of the ink cartridge 10 to form a bridging portion 140b, and is connected to the conductive support plate 82 of the ground rail. Further, the ground signal between the chip 20 and the printer is transmitted through the conductive sheet 140a, the connector 140, and the conductive support plate 82.
需要说明的是,上述导轨86是用于承载安装部90的部件,为了使用者的安全,导轨86与打印装置之间的接地信号都是相通的。导电支板82是打印装置中的金属件,为了使用者的安全,导电支板82与打印装置之间的接地信号都是相通的。如此设置,采用上述技术方案后,通过导电支板82、连接件140将接地信号传输给芯片20,提升了稳定性,减少了无法接地或接地不稳定的情况,达到本申请的有益效果。It should be noted that the guide rail 86 is a component for supporting the mounting portion 90. For the safety of the user, the grounding signals between the guide rail 86 and the printing device are all connected. The conductive support plate 82 is a metal component in the printing device. For the safety of the user, the grounding signals between the conductive support plate 82 and the printing device are all connected. In this way, after adopting the above technical solution, the grounding signal is transmitted to the chip 20 through the conductive support plate 82 and the connector 140, which improves stability and reduces the situation where the grounding cannot be connected or the grounding is unstable, thereby achieving the beneficial effects of the present application.
在上述实施例的基础上,本申请实施例中导通构件靠近接地部件的一端设置有抵接部,抵接部配置为用于与上述导电支板82接触,以使导通构件与导电支板82、导电壁板电连接。On the basis of the above embodiment, in the embodiment of the present application, an abutment portion is provided at one end of the conductive member close to the grounding component, and the abutment portion is configured to contact the above conductive support plate 82 to electrically connect the conductive member to the conductive support plate 82 and the conductive wall plate.
进一步地,由于安装部滑动安装在导轨上,为保证安装部滑动顺畅性,本申请实施例中抵接部可配置成滚珠或球轴承,滚珠和球轴承作为导通构件的一部分,并与导通构件电连接。如此设置,可减少抵接部与导电支板或导电壁板的摩擦力,保证安装部、墨盒10在接地导轨上顺畅滑动。Furthermore, since the mounting portion is slidably mounted on the guide rail, in order to ensure the smooth sliding of the mounting portion, the abutting portion in the embodiment of the present application can be configured as a ball or a ball bearing, and the ball and the ball bearing are part of the conductive component and are electrically connected to the conductive component. This arrangement can reduce the friction between the abutting portion and the conductive support plate or the conductive wall plate, ensuring that the mounting portion and the ink cartridge 10 slide smoothly on the grounding guide rail.
在另一种实施方式中,导通构件不仅包括第二导电片,还包括与第二导电片电连接的第二导电传输介质体,以及与第二导电传输介质体电连接的承载件,即本实施方式中导通构件由导电片、导电传输介质体以及承载件组成。In another embodiment, the conductive component includes not only a second conductive sheet, but also a second conductive transmission medium electrically connected to the second conductive sheet, and a carrier electrically connected to the second conductive transmission medium, that is, the conductive component in this embodiment is composed of a conductive sheet, a conductive transmission medium and a carrier.
进一步地,其中承载件靠近芯片设置,即承载件位于墨盒本体远离导轨的一端。承载件的一端与芯片的接地端子连接,承载件的另一端延伸至墨盒本体的容墨腔内,并与容墨腔内的打印用液体介质电连接,例如该打印用液体介质为墨水,且墨水作为一种导电介质与承载件连接,以使接地端子的接地信号经过承载件传输至墨水。Furthermore, the carrier is arranged close to the chip, that is, the carrier is located at an end of the ink cartridge body away from the guide rail. One end of the carrier is connected to the ground terminal of the chip, and the other end of the carrier extends into the ink chamber of the ink cartridge body and is electrically connected to the printing liquid medium in the ink chamber. For example, the printing liquid medium is ink, and the ink is connected to the carrier as a conductive medium, so that the ground signal of the ground terminal is transmitted to the ink through the carrier.
进一步地,第二导电片的一端延伸至容墨腔内,并能够与墨水接触,第二导电片的另一端形成跨接部,并通过跨接部跨设在阻隔板85的上方,跨接部可与导电支板电连接,从而接地信号从墨水经过第二导电片传输至导电支板。Furthermore, one end of the second conductive sheet extends into the ink containing cavity and is able to contact the ink. The other end of the second conductive sheet forms a jumper portion and is spanned over the blocking plate 85 through the jumper portion. The jumper portion can be electrically connected to the conductive support plate, so that the ground signal is transmitted from the ink through the second conductive sheet to the conductive support plate.
示例性地,如图71所示,连接件140配置为上述第二导电片,其作为导通构件的一部分,其是由具有一定硬度的导电材质制成,连接件140可以是一体成型的钣金件,也可以是具有多部分连接组成的结构,本申请实施例对此不加以限制。Exemplarily, as shown in Figure 71, the connecting member 140 is configured as the above-mentioned second conductive sheet, which is a part of the conductive component and is made of a conductive material with a certain hardness. The connecting member 140 can be an integrally formed sheet metal part or a structure composed of multiple parts. The embodiment of the present application is not limited to this.
连接件140还包括固定件141,固定件141的材质可以为硅胶材料,固定件141的中部具有能够容纳连接件140的弯折部分1402通过的通孔,连接件140的安装方式为:先将固定件141套入连接件140中,然后将带有固定件141的连接件140的竖直部分1401穿入墨盒10后侧壁50b上部的通孔,再调整固定件141的位置以封堵上述通孔并使连接件140相对墨盒10处于预设的位置及姿态。The connecting member 140 also includes a fixing member 141, which can be made of silicone material. The middle part of the fixing member 141 has a through hole that can accommodate the bent portion 1402 of the connecting member 140. The connecting member 140 is installed as follows: first, the fixing member 141 is inserted into the connecting member 140, and then the vertical portion 1401 of the connecting member 140 with the fixing member 141 is inserted into the through hole on the upper part of the rear side wall 50b of the ink cartridge 10, and then the position of the fixing member 141 is adjusted to block the above-mentioned through hole and make the connecting member 140 in a preset position and posture relative to the ink cartridge 10.
如图73所示,连接件140安装完成后的状态为:连接件140的竖直部分1401贴于墨盒10中的后侧壁50b内侧,从后侧壁50b的底部靠近出墨口41端沿+Z轴方向延伸至后侧壁50b顶部,通过固定件141固定于墨盒10上,固定件141能够起到密封后侧壁50b、不仅能够防止漏墨且能够固定连接件140。连接件140的弯折部分1402从固定件141的通孔伸出墨盒10外侧,朝远离墨盒10表面的方向弯折,并且连接到打印机上的金属件,该金属件为上述导电支板82。As shown in FIG. 73 , the state of the connector 140 after installation is as follows: the vertical portion 1401 of the connector 140 is attached to the inner side of the rear side wall 50b in the ink cartridge 10, extending from the bottom of the rear side wall 50b near the ink outlet 41 end along the +Z axis direction to the top of the rear side wall 50b, and is fixed to the ink cartridge 10 by the fixing member 141. The fixing member 141 can seal the rear side wall 50b, not only to prevent ink leakage but also to fix the connector 140. The bent portion 1402 of the connector 140 extends from the through hole of the fixing member 141 to the outside of the ink cartridge 10, bends in a direction away from the surface of the ink cartridge 10, and is connected to a metal part on the printer, which is the above-mentioned conductive support plate 82.
如图72和图75所示,导电件140a为上述承载件,其整体为导电硅胶材质,并镶嵌于墨盒10的安装面上,能够起到密封墨盒10且与墨水接触。具体的说,导电件140a置于芯片20后面,存储器100设置在芯片20的后表面120b上,导电件140a上设有开孔111,开孔111与存储器100配合设置,以使开孔111大小刚好容纳存储器100。As shown in Figures 72 and 75, the conductive member 140a is the above-mentioned carrier, which is made of conductive silicone material as a whole and is embedded in the mounting surface of the ink cartridge 10, and can seal the ink cartridge 10 and contact the ink. Specifically, the conductive member 140a is placed behind the chip 20, and the memory 100 is set on the rear surface 120b of the chip 20. The conductive member 140a is provided with an opening 111, and the opening 111 is arranged in cooperation with the memory 100 so that the size of the opening 111 is just enough to accommodate the memory 100.
安装状态下,芯片20在对应于后表面120b的一侧与导电件140a至少部分贴合,第七端子137a、137b(本申请中的接地端子)均与导电件140a相抵,导电件140a的第一面140b用于与芯片20连接,第二面140c(面向墨盒10内部容纳腔)与墨水接触及电性连接。In the installed state, the chip 20 is at least partially in contact with the conductive member 140a on the side corresponding to the rear surface 120b, and the seventh terminals 137a and 137b (ground terminals in this application) are both against the conductive member 140a. The first surface 140b of the conductive member 140a is used to connect to the chip 20, and the second surface 140c (facing the internal accommodating cavity of the ink cartridge 10) is in contact with the ink and electrically connected.
如图76和图77所示,连接件140置于墨盒10的-X轴方向,导电件140a置于墨盒10的+X轴方向,由于墨盒10内的墨水具备导电性能,在本实施例中芯片20与打印机之间的接地信号可通过导电件140a、墨水,连接件140、导电支板82进行传输.As shown in FIG. 76 and FIG. 77 , the connecting member 140 is placed in the -X axis direction of the ink cartridge 10, and the conductive member 140a is placed in the +X axis direction of the ink cartridge 10. Since the ink in the ink cartridge 10 has conductive properties, in this embodiment, the ground signal between the chip 20 and the printer can be transmitted through the conductive member 140a, the ink, the connecting member 140, and the conductive support plate 82.
当然,本实施例涉及的墨盒接地方式也适用于其他类型的芯片,比如芯片20正面设有4个端子,并在背面设置了接地端子(图中未示出),该接地端子同样能够借助导电件140a,墨水,连接件140、导电支板82实现芯片与打印机之间的接地信号的传输。(部件1401在墨盒的腔体内,与墨水电连接)Of course, the ink cartridge grounding method involved in this embodiment is also applicable to other types of chips. For example, the chip 20 has four terminals on the front and a grounding terminal (not shown in the figure) on the back. The grounding terminal can also transmit the grounding signal between the chip and the printer by means of the conductive member 140a, ink, the connecting member 140, and the conductive support plate 82. (The component 1401 is in the cavity of the ink cartridge and is electrically connected to the ink)
采用上述技术方案后,通过导电支板82、连接件140、墨水、导电件140a将接地信号传输给芯片20,提升了稳定性,减少了无法接地或接地不稳定的情况,当墨盒10中的墨水使用完或即将使用完时,芯片20上的接地信号与打印机无法导通,打印机会出现未装墨盒的提示,这能够与打印机本身提示墨水耗尽的信号起到同样警示使用者更换墨盒的作用。After adopting the above technical solution, the ground signal is transmitted to the chip 20 through the conductive support plate 82, the connecting member 140, the ink, and the conductive member 140a, thereby improving stability and reducing the situation where the grounding cannot be achieved or the grounding is unstable. When the ink in the ink cartridge 10 is used up or is about to be used up, the ground signal on the chip 20 cannot be connected to the printer, and the printer will display a prompt that the ink cartridge is not installed. This can have the same function as the signal of the printer itself indicating that the ink is exhausted to warn the user to replace the ink cartridge.
本说明书中各实施例或实施方式采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分相互参见即可。The various embodiments or implementations in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
应当指出,在说明书中提到的“一个实施例”、“实施例”、“示例性实施例”、“一些实施例”等表示所述的实施例可以包括特定特征、结构或特性,但未必每个实施例都包括该特定特征、结构或特性。此外,这样的短语未必是指同一实施例。此外,在结合实施例描述特定特征、结构或特性时,结合明确或未明确描述的其他实施例实现这样的特征、结构或特性处于本领域技术人员的知识范围之内。It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when a certain feature, structure or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments, whether explicitly or not explicitly described.
一般而言,应当至少部分地由语境下的使用来理解术语。例如,至少部分地根据语境,文中使用的术语“一个或多个”可以用于描述单数的意义的任何特征、结构或特性,或者可以用于描述复数的意义的特征、结构或特性的组合。类似地,至少部分地根据语境,还可以将诸如“一”或“所述”的术语理解为传达单数用法或者传达复数用法。In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.
应当容易地理解,应当按照最宽的方式解释本公开中的“在……上”、“在……以上”和“在……之上”,以使得“在……上”不仅意味着“直接处于某物上”,还包括“在某物上”且其间具有中间特征或层的含义,并且“在……以上”或者“在……之上”不仅包括“在某物以上”或“之上”的含义,还可以包括“在某物以上”或“之上”且其间没有中间特征或层(即,直接处于某物上)的含义。It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).
此外,文中为了便于说明可以使用空间相对术语,例如,“下面”、“以下”、“下方”、“以上”、“上方”等,以描述一个元件或特征相对于其他元件或特征的如图所示的关系。空间相对术语意在包含除了附图所示的取向之外的处于使用或操作中的器件的不同取向。装置可以具有其他取向(旋转90度或者处于其他取向上),并且文中使用的空间相对描述词可以同样被相应地解释。In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.
最后应说明的是:以上各实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述各实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
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CN118991249B (en) * | 2024-10-18 | 2025-02-14 | 珠海天威微电子股份有限公司 | Consumable chip, working method thereof, consumable container and printing equipment |
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