CN117977380A - A multi-element coupling device and a method for producing an array semiconductor laser - Google Patents

Abstract

The invention provides multi-element coupling equipment and a production method of an array semiconductor laser, which belong to the technical field of laser production, wherein the equipment comprises a material tray module, a device platform, a coupling module, a probe power-up module, a UV curing module, a periscope module, a detection module and a overlook vision recognition module, any one of a small reflecting mirror, a PBS (phosphate buffer solution), a large reflecting mirror, an anti-reflection sheet and a slow-axis focusing mirror is supported by the material tray module, and the coupling operation of the small reflecting mirror, the PBS, the large reflecting mirror, the anti-reflection sheet and the slow-axis focusing mirror can be executed by adopting different modules according to the element coupling requirement, so that the defect that the conventional equipment can only carry out packaging coupling of a single element is overcome, and the production efficiency can be greatly improved.

Description

A multi-element coupling device and a method for producing an array semiconductor laser

Technical Field

The invention belongs to the technical field of laser production, and in particular relates to a multi-element coupling device and a production method of an array semiconductor laser.

Background technique

As shown in the figure, an array semiconductor laser has a P path and an S path. The chip emits laser, but the emitted laser has unequal divergence angles in the fast axis and slow axis directions. The fast axis divergence angle is large, generally 30°-60°, and the slow axis divergence angle is small, generally 10°-20°. Therefore, a fast axis collimator is used to collimate the fast axis direction of the light beam at the light output of the chip, and then the slow axis direction is collimated at a distance. After the light beam passes through the fast axis collimator and the slow axis collimator, it can be approximately considered as a parallel light beam. The collimated light beam changes its transmission direction through a small reflector, and is coupled into the optical fiber through a PBS (polarization beam combining prism) or a large reflector, a fast axis focusing mirror and a slow axis focusing mirror. The equipment in the prior art can only package a single component, resulting in limited production efficiency.

Summary of the invention

The present invention aims to solve at least one of the above technical problems existing in the prior art. To this end, the present invention provides a multi-element coupling device capable of coupling a small reflector, a PBS, a large reflector, an anti-reflection film, and a slow-axis focusing mirror.

The present invention also provides a method for producing an array semiconductor laser, which improves production efficiency by applying the multi-element coupling device.

A multi-element coupling device according to an embodiment of the first aspect of the present invention comprises:

A tray module for supporting components;

A device platform for placing the laser body;

A coupling module is movably disposed between the material tray module and the device platform, and the coupling module is provided with a material picking mechanism and a glue dispensing mechanism, which are used to pick up the component to the laser body and perform a glue dispensing process;

A probe power-on module, used to power the chip on the laser body;

UV curing module, used to perform the curing process;

a periscope module for beam guidance;

A detection module, used to detect whether the coupling position of the element meets the requirements;

Overlooking the visual recognition module, used for coupling recognition.

According to the multi-element coupling device of the embodiment of the present invention, at least the following beneficial effects are achieved: the multi-element coupling device of the present invention can use the material tray module to support any one of the small reflector, PBS, large reflector, anti-reflection film, and slow-axis focusing mirror. According to the coupling requirements of the components, different modules are used for combined operation. For example, when coupling the small reflector, the large reflector, and the slow-axis focusing mirror, the material picking mechanism is used to pick up the component, and the component is moved to the coupling position corresponding to the laser body in combination with the overhead visual recognition module, and the coupling angle and position are confirmed by the probe power module and the detection module, and then the component is coupled and fixed by the glue dispensing mechanism and the UV curing module. Among them, when coupling the small reflector, the periscope module is used to guide the light beam, and the light beam is guided to the detection module to ensure smooth detection. When coupling the PBS and the anti-reflection film, the material picking mechanism is used to pick up the component, and the overhead visual recognition module is used to determine the coupling position, and then the glue dispensing mechanism and the UV curing module are used to couple and fix. Therefore, the multi-component coupling device of the present invention can perform coupling operations of small reflectors, PBS, large reflectors, anti-reflection films, and slow-axis focusing mirrors, thereby solving the problem that existing equipment can only perform packaging coupling of a single component, and can greatly improve production efficiency.

According to some embodiments of the present invention, the material tray module includes a tray that can be moved and adjusted along the horizontal Y-axis direction and a first detection unit for detecting the movement of the tray, and the material picking mechanism includes a suction nozzle that can be moved and adjusted along the vertical Z-axis direction and a second detection unit for detecting the movement of the suction nozzle.

According to some embodiments of the present invention, the device platform is configured with a cooling system.

According to some embodiments of the present invention, the detection module comprises:

An optical path switching mechanism is provided at the optical path output end of the device platform, and the optical path switching mechanism has a first path and a second path that can be switched;

A beam analyzer, arranged on the first path of the optical path switching mechanism;

The integrating sphere is arranged on the second path of the optical path switching mechanism.

A method for producing an array semiconductor laser according to a second aspect of an embodiment of the present invention comprises:

S100, chip mounting;

S200, slow axis collimator package;

S300, fast axis collimator package;

S400, small reflector package;

S500, polarization beam combining prism package;

S600, large reflector package;

S700, anti-reflection film packaging;

S800, slow axis focusing lens package;

S900, fast axis focusing lens and optical fiber co-packaging;

Wherein, steps S400 to S800 are performed using the multi-element coupling device of the aforementioned structure.

The production method of the array semiconductor laser according to the embodiment of the present invention has at least the following beneficial effects: referring to the production method of the array semiconductor laser of the above steps, the chip mounting, slow axis collimator lens packaging, and fast axis collimator lens packaging are successively performed, and then the multi-element coupling device of the above embodiment is used to sequentially package the small reflector, PBS, large reflector, anti-reflection film, and slow axis focusing lens, and finally the fast axis focusing lens and optical fiber are jointly packaged, wherein the operations of step S100 to step S300 can ensure that the laser body can cooperate with the corresponding module to achieve coupling and detection of components such as the small reflector after being placed in the multi-element coupling device. Therefore, referring to the production method of the above steps, firstly, the smooth production of the array semiconductor laser and the production quality can be ensured, and secondly, the multi-element coupling device can be used to improve the production efficiency, and there is no need to switch the processing equipment in step S400 to step S800, which optimizes the equipment replacement time between multiple processes and greatly improves the production efficiency.

According to some embodiments of the present invention, step S400 includes: firstly packaging the P-path small reflectors one by one, then controlling the array semiconductor laser to rotate horizontally by 180°, and then packaging the S-path small reflectors one by one, wherein the packaging process of each small reflector includes:

S401, lens picking: a small reflector material tray is arranged on a tray on the tray module that can be moved and adjusted along the horizontal Y-axis direction, the tray module is provided with a first detection unit for detecting the movement of the tray, the material picking mechanism is first controlled to move to the top of the small reflector material tray, and then move downward along the vertical Z-axis direction to a designated position, and move along the Y-axis direction, when the suction nozzle on the material picking mechanism docks with the small reflector, the small reflector material tray will be driven to move and be acquired by the first detection unit, and then move along the Z-axis direction, and be known by the second detection unit on the material picking mechanism for detecting the movement of the suction nozzle, and it is determined that the suction nozzle docks with the small reflector, and the vacuum is turned on to suck the small reflector;

S402, posture adjustment: after the material picking mechanism sucks up the small reflector, the lateral visual recognition mechanism of the tray module disposed on both sides of the tray adjusts the angle of the small reflector;

S403, controlling the probe power-on module to move to the position of the chip corresponding to the small reflector, and controlling the periscope module to move to the output optical path of the small reflector, so as to guide the light beam to dock with the detection module;

S404, controlling the suction nozzle to move the small reflector to the coupling position, and then controlling the probe power-on module to power on the chip;

S405, small reflector angle coupling: controlling the beam analyzer provided in the detection module to be in the near field and the far field respectively to determine whether the light spot positions are the same, and adjusting the angle of the small reflector by adjusting the suction nozzle until the beam analyzer is in the near field and the far field respectively to determine whether the light spot positions are the same;

S406, small reflector plane coupling: controlling the material taking mechanism to move along the horizontal X-axis and the horizontal Y-axis until the position of the light spot moves to a set position;

S407, power down the small reflector: switch the optical path to the integrating sphere of the detection module, and control the suction nozzle to move downward along the Z axis until the power change value meets the requirement;

S408, recording the current position and controlling the material taking mechanism to move back upwards, performing glue dispensing, and then controlling the material taking mechanism to move downwards to the height of step S407;

S409, repeating step S405 and step S406 until the light spot meets the requirements;

S410, controlling the UV curing module to perform adhesive curing of the small reflector.

According to some embodiments of the present invention, step S500 includes:

S501, picking up a polarization beam combining prism: picking up a polarization beam combining prism by referring to the process of step S401;

S502, posture adjustment: refer to the process of step S402 to adjust the angle of the polarization beam combining prism;

S503, identifying the position: controlling the top-view visual recognition module to perform coupling position identification;

S504, controlling the material taking mechanism to move to a specified position, and performing identification and judgment through the overhead visual recognition module;

S505, controlling the material taking mechanism to retreat to a certain position, and then performing glue dispensing;

S506, perform UV curing.

According to some embodiments of the present invention, step S600 includes:

S601, picking up the large reflecting mirror: referring to step S401 to pick up the large reflecting mirror;

S602, posture adjustment: refer to step S402 to adjust the angle of the large reflector;

S603, controlling the probe power-on module to sequentially power on the central paths of the P-path and S-path chips, and performing angle coupling and plane coupling of the large reflector through the beam analyzer;

S604, controlling the material taking mechanism to retreat and then dispense glue;

S605, perform angle coupling and plane coupling again, and then perform UV curing.

According to some embodiments of the present invention, step S700 includes:

S701, anti-reflection sheet picking: referring to step S401 to pick up the anti-reflection sheet;

S702, posture adjustment: refer to step S402 to perform angle adjustment;

S703, identifying the position: controlling the top-view visual recognition module to perform coupling position identification;

S704, controlling the material taking mechanism to move the anti-reflection sheet to the coupling position, and performing coupling detection through the top-view visual recognition module;

S705, controlling the material taking mechanism to retract upward, re-couple after dispensing, and perform UV curing.

According to some embodiments of the present invention, step S800 includes:

S801, slow axis focusing mirror picking up: referring to step S401 to pick up the slow axis focusing mirror;

S802, posture adjustment: refer to step S402 to adjust the angle of the slow axis focusing mirror;

S803, controlling the probe power-on module to power on the central path of the P-path chip, and performing planar coupling of the slow-axis focusing mirror through the beam analyzer;

S804, controlling the material taking mechanism to retract upward, re-couple after dispensing, and perform UV curing.

Additional aspects and advantages of the present invention will be given in part in the following description, and some additional aspects and advantages will become obvious from the following description, or will be learned through practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

FIG1 is a schematic diagram of an overall structure of a multi-element coupling device in the present invention;

FIG2 is a schematic structural diagram of a coupling module of a multi-element coupling device in the present invention;

FIG3 is a schematic structural diagram of a tray module of a multi-component coupling device in the present invention;

FIG4 is a schematic structural diagram of a device platform of a multi-element coupling device in the present invention;

FIG5 is a schematic structural diagram of a periscope module of a multi-element coupling device in the present invention;

FIG6 is a schematic structural diagram of a detection module of a multi-element coupling device in the present invention;

FIG7 is a schematic diagram of a structure of a probe power-on module of a multi-element coupling device in the present invention;

FIG8 is a schematic diagram of a structure of an array semiconductor laser;

FIG. 9 is a schematic diagram showing a principle of a periscope module of a multi-element coupling device in the present invention.

In the figure:

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

In the description of the present invention, it is necessary to understand that descriptions involving orientation, such as orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

In the description of the present invention, "a plurality" means more than two. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

An array semiconductor laser as shown in FIG8 has a P path and an S path. The chip 101 emits laser light, but the emitted laser light has unequal divergence angles in the fast axis and slow axis directions. The fast axis divergence angle is large, generally 30°-60°, and the slow axis divergence angle is small, generally 10°-20°. Therefore, the fast axis direction of the light beam is first collimated with a fast axis collimator 102 at the light output of the chip 101, and then the slow axis direction is collimated at a distance. After the light beam passes through the fast axis collimator 102 and the slow axis collimator 103, it can be approximately considered as a parallel light beam. The collimated light beam changes its transmission direction through a small reflector 104, and is coupled into an optical fiber 110 through a PBS (polarization beam combining prism 106) or a large reflector 105, a fast axis focusing mirror 108, and a slow axis focusing mirror 109. The equipment in the prior art can only package a single component, resulting in limited production efficiency.

To this end, the present invention provides a multi-element coupling device capable of performing coupling operations of the small reflector 104 , the PBS, the large reflector 105 , the anti-reflection film 107 , and the slow-axis focusing mirror 109 .

1 to 9, a multi-element coupling device according to an embodiment of the present invention includes an equipment platform 200 and a tray module 500, a device platform 300, a coupling module 400, a probe power module 600, a UV curing module 900, a periscope module 1000, a detection module 700, and a top-view visual recognition module 800 arranged on the equipment platform 200, wherein the device platform 300 is used to place a laser body 100, i.e., a semi-finished product of an array semiconductor laser to be produced; the tray module 500 is used to support the components; the coupling module 400 is used to place the laser body 100, i.e., the semi-finished product of the ... 00 is movably arranged between the material tray module 500 and the device platform 300, the coupling module 400 is provided with a material picking mechanism 403 and a glue dispensing mechanism 404, which are used to pick up components to the laser body 100 and perform the glue dispensing process; the probe power-on module 600 is used to power the chip 101 on the laser body 100; the UV curing module 900 is used to perform the curing process; the periscope module 1000 is used for light beam guidance; the detection module 700 is used to detect whether the coupling position of the component meets the requirements; the overhead visual recognition module 800 is used for coupling recognition.

It is understandable that the relative position relationship between the modules can be flexibly set. The semi-finished products targeted by the multi-component coupling device of the present invention should be products that have undergone laser chip 101 mounting and fast axis and slow axis alignment. Since the laser at the head and tail of the P and S paths (i.e., the chip 101 laser near the two ends) is difficult to pass through the nozzle, a periscope module 1000 is provided. When the small reflectors 104 at the head and tail of the P and S paths are coupled, the periscope module 1000 can be used to guide the light beam to the detection module 700, thereby avoiding the problem that the light beam cannot pass through the nozzle and the coupling detection judgment cannot be performed.

The multi-element coupling device of the present invention can use the tray module 500 to support any one of the small reflector 104, PBS, large reflector 105, anti-reflection sheet 107, and slow axis focusing mirror 109. According to the component coupling requirements, different modules are used for combined operation. For example, when the small reflector 104, the large reflector 105 and the slow axis focusing mirror 109 are coupled, the material picking mechanism 403 is used to pick up the component, and the top-view visual recognition module 800 is used to cooperate to move the component to the coupling position corresponding to the laser body 100, and the coupling angle and position are confirmed by the probe power module 600 and the detection module 700, and then the dispensing mechanism 404 and the UV curing module 900 are used to couple and fix the component. Among them, when the small reflector 104 is coupled, the periscope module 1000 is used to guide the light beam, and the light beam is guided to the detection module 700 to ensure smooth detection. When coupling the PBS and the anti-reflection film 107, the material picking mechanism 403 is used to pick up the component, the top-view visual recognition module 800 is used to determine the coupling position, and then the dispensing mechanism 404 and the UV curing module 900 are used to couple and fix. Therefore, the multi-component coupling device of the present invention can perform the coupling operation of the small reflector 104, PBS, large reflector 105, anti-reflection film 107, and slow axis focusing mirror 109, which solves the disadvantage that the existing equipment can only perform the packaging coupling of a single component, and can greatly improve the production efficiency.

3, in some embodiments of the present invention, the tray module 500 includes a tray 502 that can be moved and adjusted along the horizontal Y-axis direction and a first detection unit 503 for detecting the movement of the tray 502, and the picking mechanism 403 includes a suction nozzle 405 that can be moved and adjusted along the vertical Z-axis direction and a second detection unit for detecting the movement of the suction nozzle 405. When the picking mechanism 403 picks up components, it can be determined based on the detection signal of the first detection unit 503 and the detection signal of the second detection unit whether the suction nozzle 405 accurately docks the component, which can improve the automation and accuracy of component pickup.

Specifically, the material tray module 500 includes a first support 501, and a tray 502 is slidably arranged at the upper end of the first support 501 along the Y-axis direction. The first support 501 is provided with centering springs on both sides of the tray 502. The first detection unit 503 is arranged on the first support 501, and specifically adopts a displacement sensor. The material tray loaded with components is relatively fixedly placed on the tray 502. When the suction nozzle 405 is at the same height as the corresponding component, the suction nozzle 405 is controlled to move along the Y-axis direction. After the suction nozzle 405 abuts the component, it will drive the tray 502 to move along the Y-axis direction, and the first detection unit 503 will know it, so as to judge that the suction nozzle 405 has contacted the component along the Y-axis direction. Similarly, when the material picking mechanism 403 reaches the set height, the suction nozzle 405 is controlled to move downward along the vertical Z-axis direction, which will be known by the second detection unit, so as to judge that the suction nozzle 405 has contacted the component along the Z-axis direction. After determining that the suction nozzle 405 is completely docked with the component in the Y-axis direction and the Z-axis direction, the vacuum is turned on for suction. The judgment order of the Y-axis direction and the Z-axis direction can be flexibly set according to parameters such as the shape and size of the component.

Referring to Fig. 3, in some embodiments of the present invention, the tray module 500 also includes a side-view visual recognition mechanism, specifically including a mirror assembly 504 arranged on one side of the tray 502 along the Y-axis direction and an identification assembly 505 arranged on the other side of the tray 502, the mirror assembly 504 is arranged with two lenses along the X-axis direction horizontally perpendicular to the Y-axis direction, and the mirror assembly 504 can be moved and adjusted along the X-axis direction by a cylinder drive, so as to control the two lenses to align the identification assembly 505 on the other side one by one. The two lenses correspond to one direction of the component respectively, and reflect the state view of the corresponding direction of the component to the identification assembly 505, and the identification assembly 505 is used to identify and judge whether the component meets the requirements in this direction. The identification assembly 505 is mainly visual recognition. Taking the small reflector 104 as an example, the side-view visual recognition mechanism identifies and judges the angles of the TY and TZ directions of the small reflector 104 through two lenses. When the angle does not meet the setting conditions, the corresponding angle is adjusted by the material taking mechanism 403 until the TY and TZ axes of the small reflector 104 meet the requirements.

In some embodiments of the present invention, the device platform 300 is provided with a rotating support that can rotate around a vertical rotation axis. As shown in FIG8 , the inclination angles of the small reflectors 104 corresponding to the P-path and the S-path are opposite. If the coupling of the small reflectors 104 of the P-path and the S-path is adapted based on the angle adjustment of the material-picking mechanism 403, there are certain difficulties in the control and structural setting of the material-picking mechanism 403. And because there is a certain height difference in the coupling position on the laser body 100, the coupling difficulty is also relatively large. In this embodiment, a rotating support is provided at the upper end of the device platform 300, and the laser body 100 is placed on the rotating support. After the coupling of the small reflector 104 of the P-path is completed, the laser body 100 can be controlled to rotate horizontally 180°, and then the coupling of the small reflector 104 corresponding to the S-path is performed, so that the material-picking mechanism 403 does not need to be adjusted at a large angle, which helps to reduce the coupling difficulty and optimize the structural setting of the material-picking mechanism 403.

In some embodiments of the present invention, the rotating support is equipped with a cooling system. The cooling system adopts a water cooling system, including a water inlet, a water outlet and a water channel connecting the two provided on the rotating support. It is understandable that since the 180° reversal of the laser body 100 can also be performed manually, such as after the P-way small reflector 104 is coupled, the laser body 100 is manually taken out for 180° reversal, in this case, there is no need to set a rotating support, so the cooling system can also be directly provided on the device platform 300. With the structural setting of this embodiment, the cooling system can be used to cool the laser body 100 to avoid excessive temperature during the process of exciting the laser. It is understandable that the cooling system can also be directly provided on the upper end of the device platform 300 to cancel the setting of the rotating support.

6 , in some embodiments of the present invention, the detection module 700 includes a beam analyzer 701, an integrating sphere 702, and an optical path switching mechanism disposed therebetween, the optical path switching mechanism being disposed at the optical path output end of the device platform 300, the optical path switching mechanism having a first path and a second path that can be switched, wherein the first path corresponds to the beam analyzer 701, for allowing the light beam to enter the beam analyzer 701, and the second path corresponds to the integrating sphere 702, for allowing the light beam to enter the integrating sphere 702. The beam analyzer 701 is used to determine the corresponding angle and position by the light spot position, and the integrating sphere 702 is used to detect the light beam power.

Referring to FIG6 , the beam analyzer 701 is directly opposite to the nozzle of the laser body 100, and the integrating sphere 702 is located below one end of the beam analyzer 701 close to the laser body 100. The optical path switching mechanism can be arranged in front of the beam analyzer 701 so as to be movable laterally, and enter and exit the beam path by moving. When the optical path switching mechanism exits, it is the first path, and the laser excited by the laser body 100 is introduced into the beam analyzer 701 through the nozzle. When it is necessary to determine the beam power, the optical path switching mechanism is controlled to enter the beam path, and the laser is reflected downward into the integrating sphere 702 for power detection.

It should be noted that, when the laser cannot pass through the nozzle, the periscope module 1000 can be used to guide the laser to connect the beam analyzer 701 or the integrating sphere 702. The periscope module 1000 uses a combination of multiple lenses to form a laser transmission channel that bypasses the nozzle of the laser body 100.

1 to 9, in some embodiments of the present invention, the multi-component coupling device includes an equipment platform 200 and a tray module 500, a device platform 300, a coupling module 400, a probe power module 600, a UV curing module 900, a periscope module 1000, a detection module 700, and a top-view visual recognition module 800 disposed on the equipment platform 200. In this embodiment, the Y-axis direction is the front-to-back direction, the X-axis direction is the left-to-right direction, and the Z-axis direction is the up-down direction.

The device platform 300 is arranged in the middle area of the equipment platform 200. A water cooling plate 301 is rotatably arranged on the upper end of the device platform 300, and a water cooling system is built in the water cooling plate 301. A positioning hole is arranged on the upper end of the water cooling plate 301, which is used to fix the laser body 100 from the front and rear sides to match the hole position of the laser body 100, so as to keep the P path and S path of the laser body 100 in the left and right distribution direction.

The material tray module 500 is arranged on the right side of the device platform 300. The material tray module 500 is provided with a first support 501, and a tray 502 that can slide forward and backward is arranged on the upper end of the first support 501, and springs are arranged on the front and rear sides of the tray 502. At the same time, the first support 501 is provided with a first detection unit 503 for detecting the movement of the tray 502. A positioning structure or a clamping structure that matches the material tray of the component can be arranged on the upper end of the tray 502. The material tray module 500 is provided with a mirror component 504 on the left side of the tray 502, and an identification component 505 is provided on the right side of the tray 502. The mirror component 504 can be moved forward and backward by cylinder drive. Two lenses are arranged in the front and rear direction of the mirror component 504, which are used to reflect the component viewing angle of the TY angle and the TZ angle to the identification component 505. The identification component 505 identifies and judges whether the component meets the requirements at the TY angle and whether it meets the requirements at the TZ angle. When it does not meet the requirements, it is adjusted through the coupling module 400.

The coupling module 400 is arranged at the rear end of the device platform 300, and includes a motion platform 401, a material picking mechanism 403 and a glue dispensing mechanism 404, wherein the motion platform 401 includes a left-right moving axis, a front-back moving axis and a vertical moving axis from bottom to top, which are used for three-dimensional movement adjustment, and a lifting plate 402 is provided at the front side of the upper end of the motion platform 401. The material picking mechanism 403 is installed on the lifting plate 402, and the material picking mechanism 403 has two rotating axes, one rotating axis is vertically arranged, represented by TZ, and the other rotating axis is horizontally arranged, represented by TY, wherein the horizontal rotating axis is arranged below the vertical rotating axis, and a suction nozzle 405 is arranged below the horizontal rotating axis, and the TZ angle and TY angle of the suction nozzle 405 can be changed by rotation. The material picking mechanism 403 is also provided with a second detection unit for performing downward detection of the suction nozzle 405. The second detection unit can detect the downward movement of the suction nozzle 405 by detecting the downward movement of the lifting plate 402. The material picking mechanism 403 can also be set on the lifting plate 402 for lifting and lowering, or a lifting and lowering adjustment stroke can be set for the suction nozzle 405 on the material picking mechanism 403, and the downward movement detection of the suction nozzle 405 can be performed by the second detection unit. The material picking mechanism 403 can switch back and forth between the upper part of the device platform 300 and the upper part of the material tray module 500 by moving left and right. The dispensing mechanism 404 is set on the lifting plate 402 or the upper end of the motion platform 401, and is located on the left side of the material picking mechanism 403. The dispensing mechanism 404 can be independently lifted and lowered outside the material picking mechanism 403, but is adjusted based on the motion platform 401 for XY axis movement.

The top-view visual recognition module 800 is disposed on the lifting plate 402 and is located on the right side of the material taking mechanism 403. The top-view visual recognition module 800 is disposed vertically.

The probe power-on module 600 is arranged at the front end of the device platform 300. The equipment platform 200 is provided with an adjustment rail 201 along the left and right direction at the front end of the device platform 300. The probe power-on module 600 is slidably arranged on the adjustment rail 201. The probe power-on module 600 has two groups of probes 601 that can be adjusted independently, and each probe 601 has the freedom of front-to-back adjustment and the freedom of lifting and lowering adjustment. The probe 601 can dock with any chip 101 on the laser body 100 based on three-axis movement adjustment to power on and excite the laser. One group of probes 601 has a shorter installation length along the front-to-back direction, which is defined as the P-path probe 602, and the other group of probes 601 has a longer installation length along the front-to-back direction, which is defined as the S-path probe 603. The S-path probe 603 has a clearance space formed by installing rods along the front-to-back and left-to-right directions.

The UV curing module 900 is provided with two groups of UV lamps, one group is fixedly disposed on both sides of the probe 601 , and the other group is fixedly disposed on both sides of the suction nozzle 405 .

The detection module 700 is arranged on the adjustment rail 201. The detection module 700 has a detection mounting seat that can be adjusted forward and backward and lifted and lowered. A beam analyzer 701 is arranged at the rear end of the detection mounting seat. The light-incoming part of the beam analyzer 701 is horizontally facing right. The detection mounting seat is provided with an integrating sphere 702 at the lower right side of the beam analyzer 701. The light-incoming part of the integrating sphere 702 is vertically facing upward. An optical path switching lens 703 is arranged on the detection mounting seat to slide along the front-to-back direction. The optical path switching lens 703 is aligned with the light-incoming end of the integrating sphere 702 front-to-back, so that it can be moved to the top of the integrating sphere 702.

The periscope module 1000 is disposed at the rear end of the device platform 300 and has an XYZ three-axis movement adjustment stroke. The periscope module 1000 has a first lens and a second lens for docking the light beam, the first lens and the second lens are arranged oppositely and at an angle of 45°, and are used to translate the horizontally incident laser upward, but keep the conveying direction unchanged.

Based on the multi-element coupling device with the above structure, the present invention further proposes a method for producing an array semiconductor laser, which specifically includes:

S100, chip 101 mounting;

S200, slow axis collimator 103 package;

S300, fast axis collimator 102 packaging, after packaging is completed

S400, packaging of small reflectors 104: the laser body 100 after chip 101 mounting, fast axis collimator 102 packaging, and slow axis collimator 103 packaging is placed in the device platform 300 of the multi-element coupling device for fixing, firstly packaging of P-path small reflectors 104 one by one, then controlling the water cooling plate 301 to rotate 180°, so that the array semiconductor laser rotates 180° horizontally, and then packaging of S-path small reflectors 104 one by one, and the packaging process of each small reflector 104 includes:

S401, lens picking: Place the small reflector 104 material tray loaded with small reflectors 104 on the tray 502 of the tray module 500, control the tray 502 to move in the front-to-back direction to the identification component 505 on the right side corresponding to the first row of small reflectors 104, and at the same time keep the first lens of the mirror component 504 on the left side aligned with the identification component 505, then use the top-view visual recognition module 800 to identify the small reflector 104, and then control the suction nozzle 405 to perform three-axis movement adjustment to the tray 502 The suction nozzle 405 is moved along the Y-axis direction to drive the tray 502 to move until it is captured by the first detection unit 503, and it is determined that the suction nozzle 405 is aligned with the small reflector 104 in the Y-axis direction at this time. The suction nozzle 405 is controlled to move downward along the Z-axis direction until it is captured by the second detection unit, and it is determined that the suction nozzle 405 is aligned with the small reflector 104 in the Z-axis direction at this time, that is, the suction nozzle 405 is completely aligned with the small reflector 104, and the vacuum is turned on so that the suction nozzle 405 sucks the small reflector 104;

S402, posture adjustment: the suction nozzle 405 moves upward for an appropriate distance, and the TY angle state of the small reflector 104 is reflected to the recognition component 505 on the right through the mirror component 504 on the left side of the tray 502, and the TY angle is adjusted based on the rotation of the material picking mechanism 403 around the horizontal axis until the recognition component 505 determines that the angle meets the requirements, and then the mirror component 504 on the left side is controlled to move and switch the lens, and the TZ angle state of the small reflector 104 is reflected to the recognition component 505 on the right side, and the TZ angle is adjusted based on the rotation of the material picking mechanism 403 around the vertical axis until the recognition component 505 determines that the angle meets the requirements, and the angle adjustment of the small reflector 104 is completed;

S403, control the probe power module 600 to move to the position of the small reflector 104 corresponding to the chip 101, control the periscope module 1000 to move to the output optical path position of the small reflector 104 shown in FIG. 1, and control the beam analyzer 701 to align the optical path of the periscope module 1000 upward;

S404, identifying the coupling position by looking down at the visual recognition module 800, then controlling the suction nozzle 405 to move the small reflector 104 to the coupling position, and then controlling the probe 601 to press down to power on the chip 101;

S405, angle coupling of small reflector 104: control the beam analyzer 701 to move to the near field and the far field, determine whether the light spot positions are the same, and adjust the angle of the small reflector 104 by rotating the nozzle 405 until the beam analyzer 701 is respectively in the near field and the far field to determine that the light spot positions are the same, that is, the beam is determined to be collimated, and the TY and TZ angle coupling is completed;

S406, plane coupling of the small reflector 104: control the suction nozzle 405 to move in the front-back and left-right directions until the position of the light spot moves to the set position, that is, the plane coupling is completed, and the X and Y axis positions of the small reflector 104 are determined;

S407, the power of the small reflector 104 is pressed down: the optical path entering the beam analyzer 701 is switched to the integrating sphere 702 through the optical path switching lens 703, and the suction nozzle 405 is controlled to move downward along the Z axis until the power change value meets the requirement, which means that the Z-axis position of the small reflector 104 is confirmed;

S408, recording the current position of the small reflector 104 and controlling the suction nozzle 405 to retreat a certain distance upward, then controlling the dispensing mechanism 404 to dispense glue, and then controlling the suction nozzle 405 to return to the position of step S407;

S409, repeat step S405 and step S406 until the requirements are met;

S410, start two groups of UV lamps to cure the adhesive of the small reflector 104;

S500, polarization beam combining prism 106 package, including:

S501, picking up the polarization beam combining prism 106: picking up the polarization beam combining prism 106 with reference to the picking up process of the small reflecting mirror 104;

S502, posture adjustment: refer to the posture adjustment process of the small reflector 104 to adjust the angle of the polarization beam combining prism 106;

S503, identifying the position: controlling the top-view visual recognition module 800 to identify the coupling position of the polarization beam combining prism 106;

S504, control the suction nozzle 405 to move the polarization beam combining prism 106 to the coupling position, and identify and judge through the top-view visual recognition module 800, and adjust the movement and rotation of the material taking mechanism 403 so that the coupling position reaches the requirement;

S505, recording the qualified position, controlling the suction nozzle 405 to retreat to a certain position, and then dispensing;

S506, start two groups of UV lamps for curing;

S600, large reflector 105 package, including:

S601, picking up the large reflector 105: picking up the large reflector 105 with reference to the picking up process of the small reflector 104;

S602, posture adjustment: refer to the posture adjustment process of the small reflector 104 to adjust the angle of the large reflector 105;

S603, control the probe power-on module 600 to sequentially power on the central paths of the P-path and S-path chips 101, and perform angle coupling and plane coupling of the large reflector 105 through the beam analyzer 701;

S604, recording the current position, then controlling the suction nozzle 405 to retract, and then controlling the glue dispensing mechanism 404 to dispense glue;

S605, controlling the suction nozzle 405 to reset and perform angle coupling and plane coupling again, and then starting two sets of UV lamps for curing;

S700, anti-reflection sheet 107 packaging, including:

S701, picking up the anti-reflection sheet 107: picking up the anti-reflection sheet 107 with reference to the picking up process of the small reflector 104;

S702, posture adjustment: refer to the posture adjustment process of the small reflector 104 to adjust the angle;

S703, identifying the position: identifying the coupling position by looking down at the visual recognition module 800;

S704, controlling the suction nozzle 405 to move the anti-reflection sheet 107 to the coupling position, and performing coupling detection through the top-view visual recognition module 800;

S705, record the current position, then control the suction nozzle 405 to retreat upward, reset and recouple after dispensing, and start the UV lamp for curing;

S800, slow axis focusing lens 109 package, including:

S801, picking up the slow axis focusing mirror 109: picking up the slow axis focusing mirror 109 with reference to the picking up process of the small reflecting mirror 104;

S802, posture adjustment: refer to the posture adjustment process of the small reflector 104 to adjust the angle of the slow axis focusing mirror 109;

S803, control the probe power-on module 600 to power on the central path of the P-path chip 101, and perform planar coupling of the slow-axis focusing mirror 109 through the beam analyzer 701;

S804, control the suction nozzle 405 to retract upward, recouple after dispensing, and perform UV curing;

S900 , taking out the laser body 100 from the multi-element coupling device and sending it to the next process device for joint packaging of the fast axis focusing lens 108 and the optical fiber 110 .

In the above production and processing steps, the recognition component 505 and the mirror component 504 can also be used in step S402 to calibrate the glue needle of the glue dispensing mechanism 404. After the glue is dispensed in step S408, the top-view visual recognition module 800 can be used to identify and determine whether the glue dispensing length and width meet the requirements. The center road of the P road and the S road refers to the middle position chip 101 of the P road and the middle position chip 101 of the S road, and is not limited to the midpoint. For example, if there are 13 chips 101 in the P road, the center road is preferably the 7th chip 101, and the 6th and 8th chips 101 can also be selected. If there are 12 chips 101 in the P road, the center road can select the 6th chip 101, or the 7th chip 101, or other adjacent chips 101. When coupling the small reflector 104 corresponding to the P path, the P path probe 602 is used for power-on. When coupling the small reflector 104 corresponding to the S path after rotating 180°, the S path probe 603 is used for power-on. The space left by the S path probe 603 is used to ensure the coupling action of the suction nozzle 405 to avoid interference.

In step S603, first control the probe 601 to power on the center road of the P road, and control the periscope module 1000 to the specified position, record the spot position of the center road of the P road, and then control the suction nozzle 405 to move the large reflector 105 to the coupling position, control the probe 601 to power on the center road of the S road, and control the beam analyzer 701 to move to the near field and far field. When the spot positions are the same, the TY and TZ angles of the large reflector 105 are determined to complete the angle coupling. When the suction nozzle 405 moves along the X and Y axis directions until the spot coincides with the P road spot position, the X and Y axis positions of the large reflector 105 are determined to complete the plane coupling.

Referring to the production method of the array semiconductor laser of the above steps, the chip 101 is mounted, the slow axis collimator 103 is packaged, and the fast axis collimator 102 is packaged. Then, the multi-element coupling device of the above embodiment is used to sequentially package the small reflector 104, PBS, large reflector 105, anti-reflection film 107, and slow axis focusing mirror 109. Finally, the fast axis focusing mirror 108 and the optical fiber 110 are jointly packaged. The operations of step S100 to step S300 can ensure that the laser body 100 can cooperate with the corresponding module to achieve coupling and detection of components such as the small reflector 104 after being placed in the multi-element coupling device. Therefore, referring to the production method of the above steps, firstly, the smooth production of the array semiconductor laser can be ensured and the production quality can be ensured. Secondly, the multi-element coupling device can be used to improve the production efficiency. There is no need to switch the processing equipment in step S400 to step S800, which optimizes the equipment replacement time between multiple processes and greatly improves the production efficiency. The position specified by the periscope module 1000 is preferably between the polarization beam combining prism 106 and the anti-reflection film 107 shown in Figure 1.

It is understandable that the suction nozzle 405 can also be replaced by a clamping claw to clamp the component, and the picking process can refer to the above method. The tray module 500 can also cancel the setting of the first bracket plate and directly slide the tray 502 on the upper end of the tray module 500.

In summary, the present invention has the following advantages:

1. With the structure as simple as possible, it can meet the packaging requirements of 5 optical components, solving the current dilemma that one device can only package one optical component, thus improving the packaging efficiency;

2. Combining the top-view camera and the side-view camera can improve the packaging accuracy and packaging speed;

3. Use two sensors to detect and complete the material picking action, which can be blindly scanned and sucked, and the success rate of material picking is high;

4. The TY axis of the coupling module 400 is suspended below the TZ axis, with a simple structure and high adaptability;

5. Compatible with both vacuum suction and motor clamping modes;

6. The coupling process is simple, the first-time success rate is high, and the coupling effect is good;

7. The beam analyzer 701 and the integrating sphere 702 are combined to monitor the light spot and power simultaneously.

The present invention has been described in detail above in conjunction with the embodiments, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims (10)

1. A multi-element coupling device, comprising: A tray module for supporting components; A device platform for placing the laser body; A coupling module is movably disposed between the material tray module and the device platform, and the coupling module is provided with a material picking mechanism and a glue dispensing mechanism, which are used to pick up the component to the laser body and perform a glue dispensing process; A probe power-on module, used to power the chip on the laser body; UV curing module, used to perform the curing process; a periscope module for beam guidance; A detection module, used to detect whether the coupling position of the element meets the requirements; Overlooking the visual recognition module, used for coupling recognition. 2. The multi-component coupling device according to claim 1 is characterized in that the material tray module includes a tray that can be moved and adjusted along the horizontal Y-axis direction and a first detection unit for detecting the movement of the tray, and the material picking mechanism includes a suction nozzle that can be moved and adjusted along the vertical Z-axis direction and a second detection unit for detecting the movement of the suction nozzle. 3. The multi-element coupling device according to claim 1, wherein the device platform is provided with a cooling system. 4. The multi-element coupling device according to claim 1, wherein the detection module comprises: An optical path switching mechanism is provided at the optical path output end of the device platform, and the optical path switching mechanism has a first path and a second path that can be switched; A beam analyzer, arranged on the first path of the optical path switching mechanism; The integrating sphere is arranged on the second path of the optical path switching mechanism. 5. A method for producing an array semiconductor laser, comprising: S100, chip mounting; S200, slow axis collimator package; S300, fast axis collimator package; S400, small reflector package; S500, polarization beam combining prism package; S600, large reflector package; S700, anti-reflection film packaging; S800, slow axis focusing lens package; S900, fast axis focusing lens and optical fiber co-packaging; Wherein, steps S400 to S800 are performed using the multi-element coupling device described in claim 1. 6. The method for producing an array semiconductor laser according to claim 5, characterized in that step S400 comprises: firstly packaging the P-path small reflectors one by one, then controlling the array semiconductor laser to rotate horizontally by 180°, and then packaging the S-path small reflectors one by one, wherein the packaging process of each small reflector comprises: S401, lens picking: a small reflector material tray is arranged on a tray on the tray module that can be moved and adjusted along the horizontal Y-axis direction, the tray module is provided with a first detection unit for detecting the movement of the tray, the material picking mechanism is first controlled to move to the top of the small reflector material tray, and then move downward along the vertical Z-axis direction to a designated position, and move along the Y-axis direction, when the suction nozzle on the material picking mechanism docks with the small reflector, the small reflector material tray will be driven to move and be acquired by the first detection unit, and then move along the Z-axis direction, and be known by the second detection unit on the material picking mechanism for detecting the movement of the suction nozzle, and it is determined that the suction nozzle docks with the small reflector, and the vacuum is turned on to suck the small reflector; S402, posture adjustment: after the material picking mechanism sucks up the small reflector, the lateral visual recognition mechanism of the tray module disposed on both sides of the tray adjusts the angle of the small reflector; S403, controlling the probe power-on module to move to the position of the chip corresponding to the small reflector, and controlling the periscope module to move to the output optical path of the small reflector, so as to guide the light beam to dock with the detection module; S404, controlling the suction nozzle to move the small reflector to the coupling position, and then controlling the probe power-on module to power on the chip; S405, small reflector angle coupling: controlling the beam analyzer provided in the detection module to be in the near field and the far field respectively to determine whether the light spot positions are the same, and adjusting the angle of the small reflector by adjusting the suction nozzle until the beam analyzer is in the near field and the far field respectively to determine whether the light spot positions are the same; S406, small reflector plane coupling: controlling the material taking mechanism to move along the horizontal X-axis and the horizontal Y-axis until the position of the light spot moves to a set position; S407, power down the small reflector: switch the optical path to the integrating sphere of the detection module, and control the suction nozzle to move downward along the Z axis until the power change value meets the requirement; S408, recording the current position and controlling the material taking mechanism to move back upwards, performing glue dispensing, and then controlling the material taking mechanism to move downwards to the height of step S407; S409, repeating step S405 and step S406 until the light spot meets the requirements; S410, controlling the UV curing module to perform adhesive curing of the small reflector. 7. The method for producing an array semiconductor laser according to claim 6, wherein step S500 comprises: S501, picking up a polarization beam combining prism: picking up a polarization beam combining prism by referring to the process of step S401; S502, posture adjustment: refer to the process of step S402 to adjust the angle of the polarization beam combining prism; S503, identifying the position: controlling the top-view visual recognition module to perform coupling position identification; S504, controlling the material taking mechanism to move to a specified position, and performing identification and judgment through the overhead visual recognition module; S505, controlling the material taking mechanism to retreat to a certain position, and then performing glue dispensing; S506, perform UV curing. 8. The method for producing an array semiconductor laser according to claim 6, wherein step S600 comprises: S601, picking up the large reflecting mirror: referring to step S401 to pick up the large reflecting mirror; S602, posture adjustment: refer to step S402 to adjust the angle of the large reflector; S603, controlling the probe power-on module to sequentially power on the central paths of the P-path and S-path chips, and performing angle coupling and plane coupling of the large reflector through the beam analyzer; S604, controlling the material taking mechanism to retreat and then dispense glue; S605, perform angle coupling and plane coupling again, and then perform UV curing. 9. The method for producing an array semiconductor laser according to claim 6, wherein step S700 comprises: S701, anti-reflection sheet picking: referring to step S401 to pick up the anti-reflection sheet; S702, posture adjustment: refer to step S402 to perform angle adjustment; S703, identifying the position: controlling the top-view visual recognition module to perform coupling position identification; S704, controlling the material taking mechanism to move the anti-reflection sheet to the coupling position, and performing coupling detection through the top-view visual recognition module; S705, controlling the material taking mechanism to retract upward, re-couple after dispensing, and perform UV curing. 10. The method for producing an array semiconductor laser according to claim 6, wherein step S800 comprises: S801, slow axis focusing mirror picking up: referring to step S401 to pick up the slow axis focusing mirror; S802, posture adjustment: refer to step S402 to adjust the angle of the slow axis focusing mirror; S803, controlling the probe power-on module to power on the central path of the P-path chip, and performing planar coupling of the slow-axis focusing mirror through the beam analyzer; S804, controlling the material taking mechanism to retract upward, re-couple after dispensing, and perform UV curing.