CN117930406B - Retro-reflective microprism array structure and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a retro-reflective micro-prism array structure and a manufacturing method thereof, wherein the retro-reflective micro-prism array structure comprises a first substrate having a boss array and a second substrate having a through-hole array, the boss array of the first substrate is correspondingly embedded in the through-hole array of the second substrate, and after the boss array is embedded in the through-hole array, a complete corner cone array is formed on their upper surfaces. The retro-reflective micro-prism array structure and the manufacturing method thereof of the present invention are reasonably designed, convenient for manufacturing, and ensure the quality of the finished product.

Description

Retro-reflective microprism array structure and manufacturing method thereof

Technical Field

The invention belongs to the field of manufacturing a master mold for road traffic reflective film, and particularly relates to a retro-reflective microprism array structure and a manufacturing method thereof, that is, a finished product made by the retro-reflective microprism array structure and the manufacturing method is used as a master mold for road traffic reflective film.

Background technique

The micro-prismatic reflective film is an array composed of regular triangular pyramid structures. The area where the triangular pyramid plays a retro-reflective role is a regular hexagonal area, which only occupies 2/3 of the incident light of the entire triangular pyramid. In order to improve the retro-reflective efficiency, a micro-prismatic structure with a rectangular projection area will be intercepted in the effective area.

At present, it is difficult to produce molds for micro-prismatic reflective films with regular triangular pyramid structures. For example, Chinese Patent 201811202555.9 (a method for manufacturing a microstructure mold with a thin-thick interval stacking) proposes a solution of splicing thin plates. The thickness of the thin plates is in the range of 0.05-0.5mm. The thin plates are tilted by a fixture to finally obtain a corner-cube micro-prism array mold. When this technical solution is applied to road traffic signs, a 0.17mm thick thin plate corresponds to a 0.12mm prism height. The reflective film is mass-produced by rolling. Considering the flexibility of the film and the simplicity of the processing technology, the height of the prism is usually controlled within 0.15mm. The thickness of the processed thin plate corresponding to the patent is 0.21mm. The plate of this thickness is very difficult to process and assemble.

In addition, Chinese Patent 202111086033.9 (A method for processing a mold core having an array of micro-truncated pyramids on its surface) uses a machining tool to perform array processing of a straight path along a first direction on a machined smooth plane to obtain a preliminary machined surface, and the array processing is engraving or planing; then the machining tool is rotated at an angle α, and the angle α is 80 to 100 degrees, and then the machining tool is used to perform array processing of a serpentine path along a second direction on the preliminary machined surface, thereby forming an array of micro-truncated pyramids on the surface of a metal workpiece, and obtaining a mold core having an array of micro-truncated pyramids on its surface, and the array processing is engraving or planing. This processing method is also difficult.

In addition, Chinese patent 201510777260.4 (method for making original molds of full prismatic reflective materials) makes thin sheets of metals such as copper, aluminum, stainless steel or electroless nickel and aligns and stacks them into blocks, and then uses turning or grinding technology to flatten or grind the four bundled sides to form a shape; then any one of the four bundled sides of the preform is processed to have an optical surface bevel; thereafter, a groove structure is planed on the bevel along the direction perpendicular to the edge of the sheet, and a workpiece with a baffle having the same shape as the stacked block with the bevel is made for subsequent reassembly of the metal sheets, and finally the processed metal sheets are assembled in order from high to low close to the baffle to form a full prismatic structure. This processing method is also difficult.

It can be seen from the above existing patents that there are currently two main processing methods for making molds for microprismatic reflective films (or corner-cube microprismatic array molds), one is to use thin plate splicing; the other is direct processing. The direct processing solution has high requirements on processing equipment and processing technology. Although the splicing of thin plates can be solved from the processing level, the thickness of the plate is the key to this technology. The thinner the plate, the more deformed the spliced plate will be. In addition, the precision of the splicing is also higher. Among them, the solution of splicing thin plates proposed in patent 201811202555.9 has a thickness of 0.05-0.5mm. The plate is tilted by a fixture to finally obtain a corner-cube microprism array mold. When this technical solution is applied to road traffic signs, a 0.17mm thick thin plate corresponds to a 0.12mm prism height. The reflective film is mass-produced by rolling. Considering the flexibility of the film and the simplicity of the processing technology, the height of the prism is usually controlled within 0.15mm. The thickness of the processed thin plate corresponding to this patent is 0.21mm. The plate of this thickness is very difficult to process and assemble, and the production cost is relatively high.

Patent 202111086033.9 rotates the machining tool at an angle α of 80 to 100 degrees after V-groove machining, and then uses the machining tool to perform array machining of a serpentine path along a second direction on the preliminary machining surface, thereby forming an array of micro-truncated pyramids on the surface of the metal workpiece. This process has high requirements on the angle rotation accuracy and the machining of special-shaped surfaces, and is prone to produce defective products.

Summary of the invention

In view of the above-mentioned problems, the purpose of the present invention is to provide a retro-reflective micro-prism array structure and a manufacturing method thereof. The retro-reflective micro-prism array structure and the manufacturing method thereof are reasonably designed, convenient for manufacturing, and ensure the quality of the finished product.

The technical solution of the present invention is as follows:

The retro-reflective microprism array structure of the present invention is characterized in that it includes a first substrate having a boss array and a second substrate having a through hole array, the boss array of the first substrate is correspondingly embedded in the through hole array of the second substrate, and after the boss array is embedded in the through hole array, a complete corner cone array is formed on their upper surfaces.

Preferably, the upper surface of the boss of the boss array is cut to form a first local area of the pyramid array, the upper surface of the second substrate is cut to form a second local area of the pyramid array, and the first local area and the second local area are combined to form a complete pyramid array.

Preferably, the boss array is arranged in the form of a regular hexagonal array, each boss cross section is a regular hexagon, a circle or a rectangle, each boss is subjected to fly cutting processing on the upper surface by a V-shaped tool, and the V-shaped tool fly cutting processing has three groups of processing paths, each group has multiple parallel processing paths, adjacent groups of processing paths form an angle of 60 degrees, and the spacing between two parallel adjacent processing paths is , the height of the boss is/> , the distance between the centers of three adjacent bosses is/> .

Preferably, when the cross section of the boss is a regular hexagon, the side length of the regular hexagon is , the distance between the centers of three adjacent bosses is/> ; When the cross section of the boss is circular, the diameter of the circle is / > , the distance between the centers of three adjacent bosses is/> ; When the cross section of the boss is a rectangle, the length of the rectangle is / > , width/> , the distance between the centers of three adjacent bosses is/> .

Preferably, the through hole array is arranged in the form of a regular hexagonal array, and the cross section of each through hole is a regular hexagon, a circle or a rectangle. The upper surface of the second substrate is subjected to fly cutting processing by a V-shaped tool. The processing paths of the V-shaped tool fly cutting processing have three groups, each group has multiple parallel processing paths, and adjacent groups of processing paths form an angle of 60 degrees. The spacing between two parallel adjacent processing paths is , the depth of the through hole/> , the center distance between three adjacent through holes is/> .

Preferably, when the cross section of the through hole is a regular hexagon, the side length of the regular hexagon is , the center distance between three adjacent through holes is/> ; When the cross section of the through hole is circular, the diameter of the circle is / > , the center distance between three adjacent through holes is/> ; When the cross section of the through hole is a rectangle, the length of the rectangle is / > , width/> , the center distance between three adjacent through holes is/> .

For the fly cutter processing of a boss with a regular hexagonal cross-section, the center line of the V-shaped tool of each processing path falls on the side surface of the boss; for the processing of a through hole with a regular hexagonal cross-section, the center line of the V-shaped tool of each processing path falls on the first connecting surface of the diagonal edge of the through hole.

For the fly cutter processing of a boss with a circular cross-section, the center line of the V-shaped tool of each processing path falls on the surface tangent to the boss; for the processing of a through hole with a circular cross-section, the center line of the V-shaped tool of each processing path falls on the second connecting surface passing through the center of the through hole.

For the fly-cut processing of a boss with a rectangular cross-section, the center line of the V-shaped tool in two groups of processing paths falls on the fourth connecting surface with the rectangular end edge of the boss, and the center line of the V-shaped tool in one group of processing paths falls on the short side surface of the boss rectangle; for the processing of a through hole with a rectangular cross-section, the center line of the V-shaped tool in each processing path falls on the third connecting surface passing through the center of the through hole.

The manufacturing method of the retro-reflective microprism array structure of the present invention is characterized in that: firstly, a first substrate and a second substrate are processed, and a boss array is processed on the first substrate, and a through-hole array is processed on the second substrate, and then the boss array of the first substrate is correspondingly embedded in the through-hole array of the second substrate, so that a complete corner cone array is formed on their upper surfaces after the boss array is embedded in the through-hole array.

The advantages of the retro-reflective microprism array structure and the manufacturing method thereof of the present invention are: 1. While improving the retro-reflective efficiency of the microprisms, the difficulty of existing thin plate splicing processing can be reduced, the quality of the finished product can be improved, and the processing of the boss of the first substrate and the second substrate are both placed on a horizontal plane, and there is no need to rotate the workpiece, thereby reducing the processing difficulty; 2. The difficulty of secondary clamping and special-shaped surface processing is avoided during the processing.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is further described below in conjunction with the accompanying drawings;

Fig. 1 is a block diagram of the working principle of flying cutter processing in three-dimensional perspective;

Fig. 2 is a block diagram of the working principle of the flying cutter machining cross-section perspective;

FIG3 is a block diagram of the working principle of a V-shaped tool (flying tool) machining a boss on a first substrate;

FIG4 is a block diagram of the relative positions of the V-shaped tool (flying tool) and the boss machining path on the first substrate;

FIG5 is a perspective view of the first substrate and the boss array;

FIG6 is a perspective view of the second substrate and the through hole array;

FIG7 is a front view of the relative positional relationship of the boss array on the first substrate (the cross-section of the boss and the through hole is a regular hexagon);

FIG8 is a front view of the processing path of the boss array on the first substrate (the cross-section of the boss and the through hole is a regular hexagon);

FIG9 is a front view of the processing path of the through hole array on the second substrate (the cross section of the boss and the through hole is a regular hexagon);

FIG10 is a three-dimensional view of the boss array on the first substrate after fly-cut processing (the cross-sections of the bosses and through holes are regular hexagons);

FIG11 is a three-dimensional view of the through hole array on the second substrate after fly-cut processing (the cross-section of the boss and the through hole is a regular hexagon);

FIG12 is a three-dimensional view of the boss array of the first substrate after being correspondingly embedded into the through-hole array of the second substrate (the cross-sections of the bosses and through-holes are regular hexagons);

FIG13 is a front view of the relative positional relationship of the boss array on the first substrate (the boss and through hole cross-section are circular);

FIG14 is a front view of the processing path of the boss array on the first substrate (the cross-sections of the bosses and through holes are circular);

FIG15 is a front view of the processing path of the through hole array on the second substrate (the boss and through hole cross-section are circular);

FIG16 is a three-dimensional view of the boss array on the first substrate after fly-cut processing (the cross-sections of the bosses and through holes are circular);

FIG17 is a three-dimensional view of the through hole array on the second substrate after fly-cut processing (the cross-sections of the bosses and through holes are circular);

FIG18 is a three-dimensional view of the boss array of the first substrate after being correspondingly embedded into the through-hole array of the second substrate (the cross-sections of the bosses and through-holes are circular);

FIG19 is a front view of the relative positional relationship of the boss array on the first substrate (the boss and through hole cross-section are rectangular);

FIG20 is a front view of the machining path of the boss array on the first substrate (the boss and through hole cross-section are rectangular);

FIG21 is a front view of a processing path of a through hole array on a second substrate (the boss and through hole cross-section are rectangular);

FIG22 is a three-dimensional view of the boss array on the first substrate after fly-cut processing (the cross-sections of the bosses and through holes are rectangular);

FIG23 is a three-dimensional view of the through hole array on the second substrate after fly-cut processing (the cross-section of the boss and the through hole is rectangular);

FIG24 is a three-dimensional view of the boss array of the first substrate after being correspondingly embedded into the through-hole array of the second substrate (the cross-sections of the bosses and through-holes are rectangular);

FIG. 25 is a schematic diagram of the mechanism of processing a pyramid according to the present invention.

Detailed ways

The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

The retro-reflective microprism array structure of the present invention includes a first substrate 2 having a boss array 1 and a second substrate 4 having a through hole array 3. The boss array 1 of the first substrate is correspondingly embedded in the through hole array 3 of the second substrate, and after the boss array is embedded in the through hole array, a complete corner cone array 5 is formed on their upper surfaces. The boss array 1 refers to an array of multiple bosses, the through hole array 3 refers to an array of multiple through holes, and the corner cone array 5 is an array composed of structures such as regular triangular pyramids and triangular pyramids; the first substrate 2 and the second substrate 4 can be substrates in the shape of a rectangle or a circle, and the boss array 1 can be obtained by cutting on a thicker first substrate.

In order to realize the formation of a complete corner cone array 5 on their upper surfaces after the boss array is embedded in the through hole array, the upper surface of each boss of the above-mentioned boss array 1 is cut to form a first local area 501 of the corner cone array, and the upper surface of the second substrate 4 is cut to form a second local area 502 of the corner cone array. The first local area and the second local area are spliced together to form a complete corner cone array. That is, the existing complete corner cone array is obtained by cutting on a plane or splicing thin plates, which has the problem of great processing difficulty. The present application divides the complete corner cone array into two local areas (a first local area 501 and a second local area 502), and the two local areas are processed separately and then combined, thereby greatly reducing the difficulty of processing.

Specifically, the above-mentioned boss array is arranged in the form of a regular hexagonal, circular or rectangular array (as shown in Figures 5, 7, 8, 13, 14, 19 and 20), and the cross-section of each boss can be a regular hexagonal, circular or rectangular array (as shown in Figures 5, 7, 8, 13, 14, 19 and 20). Each boss is fly-cut on the upper surface by a V-shaped tool 6 (as shown in Figures 1, 2, 3 and 4). The processing paths of the V-shaped tool fly-cut processing have three groups, namely the first group 701, the second group 702 and the third group 703. Each group has multiple parallel and equidistant processing paths. The adjacent groups of processing paths in the circumferential direction form an angle of 60 degrees, and the spacing between two parallel adjacent processing paths is 20 degrees. (As shown in Figure 4), the height of the boss is/> , where/> is the center distance between three adjacent bosses.

When the cross section of the above-mentioned boss is a regular hexagon, the side length of the regular hexagon is , the distance between the centers of three adjacent bosses is/> (As shown in Figures 7-8); when the cross section of the boss is circular, the diameter of the circle is/> , the distance between the centers of three adjacent bosses is/> (As shown in Figures 13-14); when the cross section of the boss is a rectangle, the length of the rectangle is/> , width/> , the distance between the centers of three adjacent bosses is/> (As shown in Figures 19-20).

When processing the boss array on the first substrate, a first substrate having a boss array is firstly obtained by machining a thicker first substrate (as shown in Figures 5, 7, 13 and 19), and then the boss array is processed according to the processing path (dotted lines) shown in Figures 4, 8, 14 or 20. After processing, a structure as shown in Figures 10, 16 or 22 is obtained, that is, the upper surface of each boss of the boss array 1 of the first substrate is cut to form a first local area 501 of the corner cone array.

Similarly, the above-mentioned through hole array is arranged in the form of a regular hexagonal array (as shown in Figures 6, 9, 15 and 21), and the cross-section of each through hole can be a regular hexagon, a circle or a rectangle (as shown in Figures 6, 9, 15 and 21). The upper surface of the second substrate is processed by a V-shaped tool fly cutter. The V-shaped tool fly cutter processing has three groups of processing paths (as shown in Figures 9, 15 and 21), each group has multiple parallel processing paths, and adjacent groups of processing paths form an angle of 60 degrees. The spacing between two parallel adjacent processing paths is , the depth of the through hole/> , where/> is the center distance between three adjacent through holes.

When the cross section of the through hole is a regular hexagon, the side length of the regular hexagon is , the distance between the centers of three adjacent bosses is/> (As shown in Figs. 7 and 9, since the through hole array corresponds to the boss array, the relative size of the through hole array can refer to Fig. 7); when the cross section of the through hole is circular, the diameter of the circle is / > , the distance between the centers of three adjacent bosses is/> (As shown in Figs. 13 and 15, since the through hole array corresponds to the boss array, the relative size of the through hole array can be referred to Fig. 13); when the cross section of the through hole is a rectangle, the length of the rectangle is /> , width/> , the distance between the centers of three adjacent bosses is/> (As shown in FIGS. 19 and 21 , since the through hole array corresponds to the boss array, the relative size of the through hole array can be referred to in FIG. 19 ).

When processing the through hole array on the second substrate, the second substrate is machined to obtain a second substrate having a through hole array (as shown in Figures 6, 9, 15 and 21), and then the through hole array is processed according to the processing path (dotted line) shown in Figures 9, 15 or 21, and after processing, a structure as shown in Figures 11, 17 or 23 is obtained, that is, the second local area 502 of the corner cone array is formed by cutting on the upper surface of the second substrate.

The processed components of the boss array on the first substrate and the through hole array on the second substrate are nested with each other, that is, the boss array 1 of the first substrate is correspondingly embedded in the through hole array 3 of the second substrate, and after the boss array is embedded in the through hole array, a complete corner cone array 5 is formed on their upper surfaces, as shown in Figures 12, 18 and 24.

For the fly cutter processing of a boss with a regular hexagonal cross section, as shown in Figures 4 and 8, the center line of the V-shaped tool of each processing path falls on the side surface 101 of the boss; for the processing of a through hole with a regular hexagonal cross section, as shown in Figure 9, the center line of the V-shaped tool of each processing path falls on the first connecting surface 301 of the diagonal edge of the through hole. As shown in Figures 4, 8 and 9, the processing paths of the third group 703 are arranged along the first direction, and the first group 701 processing paths and the second group 702 processing paths form a 60-degree angle with the third group 703 processing paths.

For the fly cutter processing of a boss with a circular cross-section, as shown in Figures 14 and 15, the center line of the V-shaped tool of each processing path falls on the surface 102 tangent to the boss. For the processing of a through hole with a circular cross-section, the center line of the V-shaped tool of each processing path falls on the second connecting surface 302 passing through the center of the through hole. The processing paths of the third group 703 are arranged along the first direction, and the first group 701 processing paths and the second group 702 processing paths form a 60-degree angle with the processing paths of the third group 703.

For the fly-cut processing of a boss with a rectangular cross-section, as shown in Figures 20 and 21, the center line of the V-shaped tool in two groups of processing paths falls on the fourth connecting surface 103 with the rectangular end edge of the boss, and the center line of the V-shaped tool in one group of processing paths falls on the rectangular short side surface 104 of the boss; for the processing of a through hole with a rectangular cross-section, the center line of the V-shaped tool of each processing path falls on the third connecting surface 303 passing through the center of the through hole, the processing paths of the third group 703 are arranged along the first direction, and the first group 701 processing paths and the second group 702 processing paths all form a 60-degree angle with the processing paths of the third group 703.

In the above-mentioned fly cutter processing, the V-shaped tool 6 adopts a diamond tip tool with a tool angle of 70.5°.

In a regular triangular pyramid ABCD (as shown in Figure 25) with a known base length of L, its edge height H is A V-shaped sharp knife is used for fly cutting in three directions, and the cutting depth is the edge height H. The bosses and through holes described in this application are cut into different shapes within the effective area in the center of the regular triangular pyramid, so the processing depth of the bosses and through holes is also H. In order to reduce tool wear, the feed of the processing depth can be divided into multiple times during processing.

The manufacturing method of the retro-reflective microprism array structure of the present invention first processes a first substrate and a second substrate, and processes a boss array on the first substrate and a through-hole array on the second substrate, and then embeds the boss array of the first substrate into the through-hole array of the second substrate accordingly, so that a complete corner cone array is formed on their upper surfaces after the boss array is embedded in the through-hole array.

Specifically, when processing the boss array on the first substrate, a thicker first substrate is first machined to obtain a first substrate having a boss array (as shown in Figures 5, 7, 13 and 19), and then the boss array is processed according to the processing path (dotted lines) shown in Figures 4, 8, 14 or 20. After processing, a structure as shown in Figures 10, 16 or 22 is obtained, that is, the upper surfaces of each boss of the boss array 1 of the first substrate are cut to form a first local area 501 of the corner cone array.

When processing the through hole array on the second substrate, the second substrate is machined to obtain a second substrate having a through hole array (as shown in Figures 6, 9, 15 and 21), and then the through hole array is processed according to the processing path (dotted line) shown in Figures 9, 15 or 21, and after processing, a structure as shown in Figures 11, 17 or 23 is obtained, that is, the second local area 502 of the corner cone array is formed by cutting on the upper surface of the second substrate.

The processed components of the boss array on the first substrate and the through hole array on the second substrate are nested with each other, that is, the boss array 1 of the first substrate is correspondingly embedded in the through hole array 3 of the second substrate, and after the boss array is embedded in the through hole array, a complete corner cone array 5 is formed on their upper surfaces, as shown in Figures 12, 18 and 24.

The advantages of the retro-reflective microprism array structure and the manufacturing method thereof of the present invention are: 1. While improving the retro-reflective efficiency of the microprisms, the difficulty of existing thin plate splicing processing can be reduced, the quality of the finished product can be improved, and the processing of the boss of the first substrate and the second substrate are both placed on a horizontal plane, and there is no need to rotate the workpiece, thereby reducing the processing difficulty; 2. The difficulty of secondary clamping and special-shaped surface processing is avoided during the processing process.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the specific implementation methods of the present invention can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the present invention, which should be included in the scope of the technical solution for protection of the present invention.

Claims (6)

1. A retro-reflective microprism array structure, characterized in that: it comprises a first substrate having a boss array and a second substrate having a through-hole array, the boss array of the first substrate is correspondingly embedded in the through-hole array of the second substrate, and after the boss array is embedded in the through-hole array, a complete pyramid array is formed on their upper surfaces, the boss array is arranged in the form of a regular hexagonal array, and the cross-section of each boss is a regular hexagon, a circle or a rectangle; the upper surface of the boss of the boss array is cut to form a first local area of the pyramid array, and the upper surface of the second substrate is cut to form a second local area of the pyramid array, and the first local area and the second local area are combined to form a complete pyramid array; each boss is fly-cut on the upper surface by a V-shaped tool, and the V-shaped tool fly-cut processing has three groups of processing paths, each group has multiple parallel processing paths, adjacent groups of processing paths form an angle of 60 degrees, and the spacing between two parallel adjacent processing paths is 1.5°. , the height of the boss is/> , the distance between the centers of three adjacent bosses is/> ; When the cross section of the boss is a regular hexagon, the side length of the regular hexagon is / > , the distance between the centers of three adjacent bosses is/> ; When the cross section of the boss is circular, the diameter of the circle is / > , the distance between the centers of three adjacent bosses is/> ; When the cross section of the boss is a rectangle, the length of the rectangle is / > , width/> , the distance between the centers of three adjacent bosses is/> The through hole array is in the form of a regular hexagonal array, and the cross section of each through hole is a regular hexagon, a circle or a rectangle. The upper surface of the second substrate is processed by a V-shaped tool fly cutter. The V-shaped tool fly cutter processing has three groups of processing paths, each group has multiple parallel processing paths, and adjacent groups of processing paths form an angle of 60 degrees. The spacing between two parallel adjacent processing paths is , the depth of the through hole/> , the center distance between three adjacent through holes is/> . 2. The retro-reflective microprism array structure according to claim 1, wherein when the cross-section of the through hole is a regular hexagon, the side length of the regular hexagon is , the center distance between three adjacent through holes is/> ; When the cross section of the through hole is circular, the diameter of the circle is / > , the center distance between three adjacent through holes is/> ; When the cross section of the through hole is a rectangle, the length of the rectangle is / > , width/> , the center distance between three adjacent through holes is/> . 3. The retro-reflective microprism array structure according to claim 1 is characterized in that: for the fly-cut processing of a boss with a regular hexagonal cross-section, the center line of the V-shaped tool of each processing path falls on the side surface of the boss; for the processing of a through hole with a regular hexagonal cross-section, the center line of the V-shaped tool of each processing path falls on the first connecting surface of the diagonal edge of the through hole. 4. The retro-reflective microprism array structure according to claim 1 is characterized in that: for the fly-cut processing of a boss with a circular cross-section, the center line of the V-shaped tool of each processing path falls on a surface tangent to the boss; for the processing of a through hole with a circular cross-section, the center line of the V-shaped tool of each processing path falls on a second connecting surface passing through the center of the through hole. 5. The retro-reflective microprism array structure according to claim 1 is characterized in that: for the fly-cut processing of a boss with a rectangular cross-section, the center line of the V-shaped tool in two groups of processing paths falls on the fourth connecting surface with the rectangular end edge of the boss, and the center line of the V-shaped tool in one group of processing paths falls on the short side surface of the rectangle of the boss; for the processing of a through hole with a rectangular cross-section, the center line of the V-shaped tool of each processing path falls on the third connecting surface passing through the center of the through hole. 6. A method for manufacturing a retro-reflective microprism array structure as described in any one of claims 1 to 5, characterized in that: first, a first substrate and a second substrate are processed, and a boss array is processed on the first substrate, and a through-hole array is processed on the second substrate, and then the boss array of the first substrate is correspondingly embedded in the through-hole array of the second substrate, so that a complete corner cone array is formed on their upper surfaces after the boss array is embedded in the through-hole array.