CN117925327A - Microbubble dissolution-promoting cleaning solution and application thereof - Google Patents
Microbubble dissolution-promoting cleaning solution and application thereof Download PDFInfo
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- CN117925327A CN117925327A CN202311873701.1A CN202311873701A CN117925327A CN 117925327 A CN117925327 A CN 117925327A CN 202311873701 A CN202311873701 A CN 202311873701A CN 117925327 A CN117925327 A CN 117925327A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 74
- 239000006184 cosolvent Substances 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000006243 chemical reaction Methods 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000002994 raw material Substances 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 18
- -1 alcohol compound Chemical class 0.000 claims abstract description 16
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims abstract description 14
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 12
- 239000008367 deionised water Substances 0.000 claims abstract description 12
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims abstract description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims abstract description 9
- 235000019832 sodium triphosphate Nutrition 0.000 claims abstract description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000010517 secondary reaction Methods 0.000 claims abstract description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical group COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims abstract description 4
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 239000002736 nonionic surfactant Substances 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- 239000003607 modifier Substances 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 8
- 230000035699 permeability Effects 0.000 abstract description 6
- 238000004090 dissolution Methods 0.000 abstract description 5
- KBEFBSGNGSLHOD-UHFFFAOYSA-N 4-methylpentane-1,1-diol Chemical compound CC(C)CCC(O)O KBEFBSGNGSLHOD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 19
- 239000012459 cleaning agent Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000005063 solubilization Methods 0.000 description 1
- 230000007928 solubilization Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C11D3/2048—Dihydric alcohols branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2093—Esters; Carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
The invention relates to the technical field of cleaning solutions, and discloses a microbubble dissolution-promoting cleaning solution which comprises the following raw materials in parts by weight: 35-40 parts of alcohol compound, 6-8 parts of regulator, 10-12 parts of dimethyl carbonate, 12-18 parts of permeable cosolvent, 6-8 parts of ethylenediamine tetraacetic acid and 10-15 parts of auxiliary solvent, wherein the alcohol compound is one of isohexanediol, isopropanol, ethanol and dipropylene glycol, the auxiliary solvent is propylene glycol methyl ether acetate, the regulator is sodium hydroxide and/or potassium hydroxide, and the permeable cosolvent comprises the following preparation steps: and pouring alkylphenol ethoxylates, glycerol and deionized water into a reaction kettle for mixed reaction, and then adding sodium tripolyphosphate and deionized water for secondary reaction to obtain a finished product of the permeable cosolvent. Through preparing the permeability cosolvent, along with the flow of the cleaning liquid, certain tiny bubbles can be generated by permeation at tiny gaps on the printed circuit board, and the dissolution rate of gap impurities of the printed circuit board is promoted.
Description
Technical Field
The invention relates to the technical field of cleaning liquid, in particular to a microbubble dissolution-promoting cleaning liquid and application thereof.
Background
The printed circuit board is also called a printed circuit board, is an important electronic component, is manufactured by adopting an electronic printing technology, is mainly used as a carrier for electric connection of various electronic components, enables various electronic component assemblies to be connected through a circuit, plays a role in conducting and transmitting, almost all electronic devices are separated from the printed circuit board, and the manufacturing quality of the electronic component assemblies directly influences the stability and the service life of electronic products and influences the overall competitiveness of system products.
In the current manufacturing process of the printed circuit board, various auxiliary materials for soldering are generally used, the materials mainly ensure the soldering effectiveness and the firmness of welding spots, in the actual processing process, the non-volatilized soldering flux in the soldering process can remain on the printed circuit board, and the auxiliary materials also comprise various fine fibers, dust and other impurities, if the impurities cannot be removed in time, the residual substances on the surface of the printed circuit board can corrode soldering connection points and electronic components of the circuit board, the problems of signal interference, electromigration, reduced adhesion of protective coating and the like of a circuit are generated, the quality and the reliability of the product of the printed circuit board are influenced to a certain extent, and therefore, the cleaning procedure of the product must be supplemented in the processing process.
At present, the cleaning agent for the printed circuit board on the market mainly uses a water-based cleaning agent, is environment-friendly and nontoxic, can dissolve and separate pollutants on the printed circuit board to realize efficient cleaning of the circuit board, but in the use process of the water-based cleaning agent, in order to improve the dissolving speed of the pollutants, the water-based cleaning agent needs to be matched with modes such as ultrasonic vibration, flushing and the like to improve the efficiency, and when the cleaning is assisted by an external process, if the impact force and the vibration intensity are not effectively controlled, certain damage is easily caused to the circuit board body, and the problems of damage of internal circuits, falling of surface components and the like are caused.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a microbubble dissolution-promoting cleaning solution and application thereof, and solves the problems that when a water-based cleaning agent is used for cleaning a printed circuit board in a mode of vibration, flushing and the like, certain damage is easily caused to the circuit board body, and internal circuits are disconnected and components fall.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the microbubble dissolution-promoting cleaning liquid comprises the following raw materials in parts by weight: 35-40 parts of alcohol compound, 6-8 parts of regulator, 10-12 parts of dimethyl carbonate, 12-18 parts of permeable cosolvent, 6-8 parts of ethylenediamine tetraacetic acid and 10-15 parts of auxiliary solvent.
Preferably, the alcohol compound is one of isohexylene glycol, isopropanol, ethanol and dipropylene glycol.
Preferably, the auxiliary solvent is propylene glycol methyl ether acetate.
Preferably, the regulator is sodium hydroxide and/or potassium hydroxide.
Preferably, the preparation method of the permeable cosolvent comprises the following method steps:
primary reaction: according to the mass ratio (1): (3-5): (12-16) preparing alkylphenol ethoxylates, glycerol and deionized water, pouring the mixture into a reaction kettle, mixing the mixture and reacting the mixture at the temperature of between 45 and 50 ℃ for 25 to 35 minutes;
secondary reaction: after the primary reaction is finished, the temperature of the reaction kettle is reduced to 18-23 ℃, then sodium tripolyphosphate and deionized water are added, and the reaction is carried out again for 20-25 min under the condition of rising the temperature to 25-29 ℃ to obtain a finished product of the permeable cosolvent.
Preferably, in the secondary reaction step, the mass of the sodium tripolyphosphate is 3-5 times that of the nonionic surfactant, and the mass of the deionized water added for the second time is 1.8-2.4 times that of the sodium tripolyphosphate.
A method for preparing a microbubble dissolution-promoting cleaning solution as defined in any one of claims 1 to 6, comprising the steps of:
Firstly, after the raw materials are prepared according to the proportion, adding an auxiliary solvent into a stirring kettle, and then adding an alcohol compound, dimethyl carbonate and a permeable cosolvent to stir and react for a certain time at 55-65 ℃ to obtain a mixture I;
And step two, adding ethylenediamine tetraacetic acid into the mixture I obtained in the step one, heating the stirring kettle to 67-75 ℃, stirring and reacting for 20-25 min, adding a regulator after the reaction is finished, stirring and mixing again, and cooling to obtain the finished product of the microbubble dissolution-promoting cleaning liquid.
Preferably, in the first step, the stirring speed of the stirring kettle is controlled to be 350-420 r/min, and the stirring time is controlled to be 25-35 min.
An application of microbubble dissolution-promoting cleaning solution in cleaning printed circuit boards.
In the process of cleaning the printed circuit board by the microbubble dissolution-promoting cleaning liquid, the temperature range of the cleaning liquid is controlled to be 50-60 ℃.
The invention provides a microbubble dissolution-promoting cleaning solution and application thereof. The beneficial effects are as follows:
1. The cleaning agent is prepared by adopting the cleaning solvent and the components, so that the use of toxic organic solvents such as toluene and the like is avoided while the cleaning effect of the circuit board product is ensured, and the cleaning agent has high use safety and meets the environmental protection requirement.
2. According to the invention, the dimethyl carbonate is added into the preparation raw materials of the cleaning liquid, so that dirt on the printed circuit board can be cleaned quickly, moisture or dirt cannot be remained on the dried printed circuit board after the cleaning is finished, and the cleaning liquid is volatilized quickly after the cleaning.
3. According to the invention, the permeable cosolvent is added into the preparation raw material of the printed circuit board, and along with the flowing of the cleaning liquid, certain micro bubbles can be generated by permeation at the micro gaps on the printed circuit board and move along with water flow, so that the dissolution speed of gap impurities of the printed circuit board is promoted, and the residue of the gap impurities on the surface of the printed circuit board is reduced.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a microbubble dissolution-promoting cleaning solution and application thereof, wherein the microbubble dissolution-promoting cleaning solution comprises the following components: alcohol compound, regulator, dimethyl carbonate, permeability cosolvent, ethylenediamine tetraacetic acid and auxiliary solvent.
The permeable cosolvent is composed of alkylphenol ethoxylates, glycerol, deionized water and sodium tripolyphosphate, wherein the alkylphenol ethoxylates are nonionic surfactants, have multiple performances of good washing, dispersing, foaming, solubilization, antistatic, corrosion resistance and the like, and are stable in property, acid-base resistant and low in cost.
Through the preparation permeability cosolvent, add in the preparation raw materials of printed wiring board, along with the flow of washing liquid, in the tiny gap department on printed wiring board, can permeate and produce certain tiny bubble to follow rivers and remove, promote the dissolution rate of printed wiring board gap impurity, reduce the residual of printed wiring board surface gap impurity.
Further, the microbubble dissolution-promoting cleaning solution provided by the invention is prepared by the following process steps:
Firstly, after the raw materials are prepared according to the proportion, adding an auxiliary solvent into a stirring kettle, and then adding an alcohol compound, dimethyl carbonate and a permeable cosolvent, heating, stirring and reacting for a certain time to obtain a mixture I;
And step two, adding ethylenediamine tetraacetic acid into the mixture I obtained in the step one, stirring and reacting for a certain time after the temperature of a stirring kettle is raised, adding a regulator after the reaction is finished, stirring and mixing again, and cooling to obtain a finished product of the microbubble dissolution-promoting cleaning liquid.
According to the invention, the dimethyl carbonate is added into the preparation raw material of the cleaning liquid, so that dirt on the printed circuit board can be cleaned quickly, moisture or dirt cannot be remained after the printed circuit board is dried, the cleaning liquid can volatilize quickly after cleaning, and meanwhile, certain tiny bubbles can be generated at tiny gaps on the printed circuit board along with the flowing of the cleaning liquid and move along with water flow, so that the dissolution rate of gap impurities of the printed circuit board is promoted, and the metal ion residues can be reduced.
The technical scheme and technical effects of the invention are further described below with reference to specific embodiments.
Example 1:
The embodiment of the invention provides a microbubble dissolution-promoting cleaning solution, which comprises the following main raw materials: 40 parts of alcohol compound, 6 parts of regulator, 10 parts of dimethyl carbonate, 15 parts of permeability cosolvent, 6 parts of ethylenediamine tetraacetic acid and 12 parts of auxiliary solvent.
Wherein the alcohol compound is isohexanediol, the auxiliary solvent is propylene glycol methyl ether acetate, and the regulator is sodium hydroxide.
Wherein, the permeability cosolvent is mainly prepared by the following preparation process:
primary reaction: according to the mass ratio of 1:3:12, preparing alkylphenol ethoxylates, glycerol and deionized water, pouring the alkylphenol ethoxylates, the glycerol and the deionized water into a reaction kettle, mixing and reacting for a certain time at 45 ℃;
secondary reaction: and after the primary reaction is finished, reducing the temperature of the reaction kettle to 23 ℃, then adding sodium tripolyphosphate and deionized water, and reacting again for 25 minutes under the condition of heating to 29 ℃ to obtain a finished product of the permeable cosolvent.
Further, the microbubble dissolution-promoting cleaning solution is prepared by the following process steps:
Firstly, after the raw materials are prepared according to the proportion, adding an auxiliary solvent into a stirring kettle, and then adding an alcohol compound, dimethyl carbonate and a permeable cosolvent to stir and react for a certain time at the temperature of 55 ℃ to obtain a mixture I;
And step two, adding ethylenediamine tetraacetic acid into the mixture I obtained in the step one, heating the stirring kettle to 67 ℃, stirring and reacting for 25min, adding a regulator after the reaction is finished, stirring and mixing again, and cooling to obtain a finished product of the microbubble dissolution-promoting cleaning solution, wherein the application effect of the finished product of the microbubble dissolution-promoting cleaning solution prepared by the embodiment is shown in a table 2.
Example 2:
The embodiment of the invention provides a microbubble dissolution-promoting cleaning solution, which comprises the following main raw materials: 40 parts of alcohol compound, 6 parts of regulator, 10 parts of dimethyl carbonate, 16 parts of permeable cosolvent, 6 parts of ethylenediamine tetraacetic acid and 13 parts of auxiliary solvent.
The preparation methods of the permeable cosolvent and the finished product of the microbubble dissolution-promoting cleaning liquid in the embodiment are the same as those in the embodiment 1, except that the raw materials are different in addition parts, and the application effects of the finished product of the microbubble dissolution-promoting cleaning liquid prepared by the embodiment are shown in table 2.
Example 3:
The embodiment of the invention provides a microbubble dissolution-promoting cleaning solution, which comprises the following main raw materials: 40 parts of alcohol compound, 6 parts of regulator, 10 parts of dimethyl carbonate, 17 parts of permeability cosolvent, 6 parts of ethylenediamine tetraacetic acid and 14 parts of auxiliary solvent.
The preparation methods of the permeable cosolvent and the finished product of the microbubble dissolution-promoting cleaning liquid in the embodiment are the same as those in the embodiment 1, except that the raw materials are different in addition parts, and the application effects of the finished product of the microbubble dissolution-promoting cleaning liquid prepared by the embodiment are shown in table 2.
Example 4:
40 parts of alcohol compound, 6 parts of regulator, 10 parts of dimethyl carbonate, 18 parts of permeable cosolvent, 6 parts of ethylenediamine tetraacetic acid and 15 parts of auxiliary solvent.
The preparation methods of the permeable cosolvent and the finished product of the microbubble dissolution-promoting cleaning liquid in the embodiment are the same as those in the embodiment 1, except that the raw materials are different in addition parts, and the application effects of the finished product of the microbubble dissolution-promoting cleaning liquid prepared by the embodiment are shown in table 2.
Comparative example: the comparative example provides a cleaning solution which is mainly used for cleaning a printed circuit board, and the total amount of raw materials is 100 parts by weight:
petroleum ether: 60%, limonene: 2% of dichloromethane: 7%, isopropanol: 20% and the balance of water.
And heating and mixing the raw materials to obtain a cleaning liquid finished product.
Table 1: examples 1-4 permeation co-solvents and co-solvents addition parameter profiles;
| Sequence number | 1 | 2 | 3 | 4 |
| Parts of permeable cosolvent | 15 | 16 | 17 | 18 |
| Auxiliary solvent part | 12 | 13 | 14 | 15 |
The test methods for testing the application properties of the cleaning solutions prepared in examples 1 to 4 and comparative examples according to the present invention are as follows:
the cleaning solutions prepared in examples 1 to 4 and comparative example were applied to an ultrasonic cleaning tank in which 100 printed wiring boards were placed, the amount of the cleaning solution was kept uniform, the cleaning period was controlled to 30 minutes, and the vibration frequency of the ultrasonic cleaner was kept uniform, and the detection results thereof were shown in table 2.
Table 2: a microbubble dissolution promoting cleaning fluid application performance data determination table;
By combining examples 1-4 and comparative examples and combining Table 2, it can be seen that the microbubble dissolution-promoting cleaning solution provided by the invention and the cleaning agent provided by the comparative examples have certain advantages in terms of cleaning effect and product damage rate of the printed circuit board, good cleaning effect and good environmental protection performance under the same dosage and cleaning quantity of the printed circuit board and with lower ultrasonic vibration frequency compared with the cleaning agent with higher ultrasonic vibration frequency.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The microbubble dissolution-promoting cleaning solution is characterized by comprising the following raw materials in parts by weight: 35-40 parts of alcohol compound, 6-8 parts of regulator, 10-12 parts of dimethyl carbonate, 12-18 parts of permeable cosolvent, 6-8 parts of ethylenediamine tetraacetic acid and 10-15 parts of auxiliary solvent.
2. The microbubble dissolution-promoting cleaning solution as set forth in claim 1, wherein the alcohol compound is one of isohexylene glycol, isopropanol, ethanol and dipropylene glycol.
3. The microbubble dissolution-promoting cleaning solution as set forth in claim 1, wherein the auxiliary solvent is propylene glycol methyl ether acetate.
4. A microbubble dissolution-promoting cleaning solution as claimed in claim 1, wherein the modifier is sodium hydroxide and/or potassium hydroxide.
5. A microbubble dissolution-promoting cleaning solution as claimed in claim 1, wherein the preparation method of the permeable cosolvent comprises the following method steps:
primary reaction: according to the mass ratio (1): (3-5): (12-16) preparing alkylphenol ethoxylates, glycerol and deionized water, pouring the mixture into a reaction kettle, mixing the mixture and reacting the mixture at the temperature of between 45 and 50 ℃ for 25 to 35 minutes;
secondary reaction: after the primary reaction is finished, the temperature of the reaction kettle is reduced to 18-23 ℃, then sodium tripolyphosphate and deionized water are added, and the reaction is carried out again for 20-25 min under the condition of rising the temperature to 25-29 ℃ to obtain a finished product of the permeable cosolvent.
6. The microbubble dissolution-promoting cleaning solution as set forth in claim 5, wherein in the secondary reaction step, the mass of sodium tripolyphosphate is 3 to 5 times that of the nonionic surfactant, and the deionized water added for the second time is 1.8 to 2.4 times that of the sodium tripolyphosphate.
7. A method for preparing a microbubble dissolution-promoting cleaning solution as defined in any one of claims 1 to 6, comprising the steps of:
Firstly, after the raw materials are prepared according to the proportion, adding an auxiliary solvent into a stirring kettle, and then adding an alcohol compound, dimethyl carbonate and a permeable cosolvent to stir and react for a certain time at 55-65 ℃ to obtain a mixture I;
And step two, adding ethylenediamine tetraacetic acid into the mixture I obtained in the step one, heating the stirring kettle to 67-75 ℃, stirring and reacting for 20-25 min, adding a regulator after the reaction is finished, stirring and mixing again, and cooling to obtain the finished product of the microbubble dissolution-promoting cleaning liquid.
8. The method for preparing a dissolution-promoting cleaning solution for microbubbles according to claim 7, wherein in the first step, the stirring speed of the stirring kettle is controlled to be 350-420 r/min, and the stirring time is controlled to be 25-35 min.
9. Use of a microvesicle dissolution-promoting cleaning solution as defined in claims 1-6 for cleaning printed wiring boards.
10. The use according to claim 9, wherein the temperature of the cleaning solution is controlled in the range of 50-60 ℃ during the cleaning of the printed wiring board by the microbubble dissolution-promoting cleaning solution.
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