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CN117916093A - 用于封装流体管芯的导电化合物 - Google Patents

用于封装流体管芯的导电化合物 Download PDF

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Publication number
CN117916093A
CN117916093A CN202180102252.3A CN202180102252A CN117916093A CN 117916093 A CN117916093 A CN 117916093A CN 202180102252 A CN202180102252 A CN 202180102252A CN 117916093 A CN117916093 A CN 117916093A
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Prior art keywords
conductive
epoxy molding
molding compound
carbon
fluid
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CN202180102252.3A
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English (en)
Inventor
宋波
张竹青
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Publication of CN117916093A publication Critical patent/CN117916093A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
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    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
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    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/135—Nozzles
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    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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    • C09D163/04—Epoxynovolacs
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
    • B29C70/545—Perforating, cutting or machining during or after moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
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    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers
    • B29K2105/162—Nanoparticles
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    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/20—Inserts
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
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    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
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    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/767—Printing equipment or accessories therefor
    • B29L2031/7678—Ink or toner cartridges
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    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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Abstract

在示例性实施方式中，提供了一种环氧树脂化合物。环氧树脂化合物包括硬化剂、无机基填料、催化剂、以及导电添加剂。无机基填料的量大于环氧树脂化合物的80重量百分比(wt％)。催化剂用于使环氧树脂化合物的固化加速。导电添加剂的量为环氧树脂化合物的0.1wt％至5wt％。

Description

用于封装流体管芯的导电化合物
背景技术
打印装置使用流体喷射装置将打印流体分配到衬底上。流体喷射装置可以被电控制以将期望量的打印流体喷射到衬底的期望位置上以打印出图像或文本。典型的流体喷射装置包括流体管芯，该流体管芯被放置在岬头单元上以形成打印头。打印头然后可以附接到流体喷射装置的打印流体的本体或储器上。
流体管芯可以包括形成有开口的硅条，这些硅条允许打印流体通过这些开口喷射。硅条可以包括可以电连接到打印头的电气部分的接合焊盘。可以在硅条上形成与打印头的电路的电连接部，以提供对通过硅条中的开口分配打印流体的电控制。
附图说明
图1是示例性流体喷射装置的代表性图像，该流体喷射装置包括利用本公开的导电级环氧模制料(EMC)包覆模制的流体管芯；
图2是利用本公开的导电级EMC包覆模制的示例性流体管芯的俯视图；
图3是利用本公开的导电级EMC包覆模制的示例性流体管芯的截面图；
图4是制备本公开的导电级EMC的示例性方法的流程图；以及
图5是制造利用本公开的导电级EMC包覆模制的流体管芯的示例性方法的流程图。
具体实施方式
本文所描述的示例提供了一种用于封装流体管芯的导电化合物。如上文所讨论的，流体喷射装置可以包括流体管芯，该流体管芯包括可以被封装的硅器件。硅器件通常形成在较大的硅衬底上。硅衬底的部分可以被环氧模制料(EMC)取代，以通过减少用于形成流体管芯的硅量来降低成本。
然而，EMC的电阻率比硅的电阻率高得多。因此，撞击流体管芯的静电放电(ESD)将会朝向流体管芯的电气部件行进，而不是通过导电硅衬底消散。ESD可能会导致流体管芯发生故障。
此外，高功率/电压信号可能会使ESD故障加速，并最终导致电阻器级联腐蚀。
先前的解决方案试图通过创建增强的电路布局以增加电路线路的路径来解决该问题。例如，电路线路将铺设在蛇形路径上，以试图在级联故障发生前争取到更多时间。这会延迟级联故障，但并不会阻止级联故障。
另一个先前的解决方案是添加钽接地屏蔽体。然而，此解决方案为工艺增加了额外的掩模层。此外，钽接地屏蔽体使用不同的系统架构，这会影响流体管芯的电子设计和写入系统。
本公开提供了一种导电级EMC，该导电级EMC可以用于防止ESD因朝向流体管芯消散而发生撞击，从而防止级联故障。在示例中，本公开的导电级EMC向EMC添加导电部件以降低EMC的电阻率。例如，目前使用的商用EMC在150摄氏度(℃)可能具有1×1012欧姆厘米(Ω·cm)以上的电阻率并且在室温下可能具有1×1016Ω·cm以上的电阻率，这可能会比先前使用的掺杂硅衬底的电阻率高出14个数量级。在2重量百分比(wt％)填料加载量下和在低的逾渗阈值的情况下，本公开的EMC可以将电阻率降低到低至6.5×104Ω·cm，以维持EMC的粘度，从而实现可模制性和流动均匀性。
图1图示了示例性流体喷射装置100，该流体喷射装置包括利用本公开的导电级环氧模制料(EMC)包覆模制的流体管芯108。流体喷射装置100可以插入到打印或成像装置(未示出)中，以在衬底上打印出图像。打印装置可以是喷墨打印机。
流体喷射装置100可以由打印装置的处理器电控制，以通过位于流体管芯108上的喷嘴喷射打印流体。处理器可以控制流体喷射装置100将期望量的打印流体分配到衬底的期望位置上，以打印出图像。
流体喷射装置100可以包括打印流体(如油墨)的储器，这些储器在流体喷射装置100的储器本体102内部。储器本体102可以储存打印流体。例如，储器本体102可以包括若干不同的储器，这些不同的储器可以储存用于彩色打印装置的不同颜色(例如，青色、黄色、品红色和黑色)的打印流体。在另一个示例中，储器本体102可以包括单个储器，以储存用于黑白打印装置的单一颜色(例如，黑色)打印流体。
在示例中，打印头104可以耦接到流体喷射装置100的储器本体102。打印头104也可以称为包括电盘106的集成式岬头单元。电盘106可以与打印装置的可移动墨盒上的对应的电盘建立电连接。打印装置的处理器可以经由电盘106向流体管芯108传输电信号，以控制打印流体的喷射。例如，电信号可以控制流体管芯108中喷嘴的打开、或打印流体的局部加热以喷射打印流体(例如，在热喷墨(TIJ)电阻器的情况下)。
图2图示了本公开的流体管芯108的更详细的俯视图。流体管芯108可以包括硅条1101至110n(在下文中也单独地称为硅条110或统称为硅条110)。尽管在图2中图示了三个硅条110，但是应当注意，可以在流体管芯108上部署任意数量的硅条110。
硅条可以利用导电级EMC 116包覆模制。在示例中，硅条110中的每一个可以包括至少一个喷嘴114以喷射打印流体。硅条110中的每一个还可以包括接合焊盘112以建立电连接并允许喷嘴114被电控制。
例如，打印流体的喷射可以经由TIJ电阻器来控制。电信号可以被发送到TIJ电阻器以加热该电阻器。TIJ电阻器可以产生局部热以在打印流体中引起气泡。气泡的力可以致使少量打印流体经由喷嘴114喷射。
图3图示了流体管芯108穿过图2所图示的线118的截面图。在示例中，流体管芯108可以是通过将导电级EMC 116包覆模制在硅条110之上而形成的。导电级EMC 116可以被模制为包括开放容积部或沟槽120。打印流体可以从流体喷射装置100的储器本体102中的储器朝向开放容积部120分配。打印流体然后可以流向硅条110的喷嘴114。
导电级EMC 116可以是使用如压缩模制、传递模制、狭缝模制等各种技术来模制的。下文将参照图5所图示的方法500进一步详细讨论模制工艺的细节。
如上文所讨论，先前的流体管芯108包括非导电EMC来取代流体管芯上的部分硅。非导电EMC取代了硅衬底上的大部分硅并且降低了制造流体管芯的成本。然而，先前使用的非导电EMC制剂具有高电阻率。因此，撞击流体管芯的静电放电(ESD)会导致ESD朝向硅条行进。随着时间的推移，ESD可能会导致流体管芯发生故障。
在示例中，当用户在将流体喷射装置100插入到打印装置中时触摸流体管芯时，可能会从用户释放的静电产生ESD。在另一个示例中，可能会从来自其它硅器件的撞击产生ESD。在自动化生产线中，工具上的装载、卸载和搬运系统也可能是ESD的另一个来源。
如上所述，本公开提供了一种与先前使用的EMC相比降低了EMC的电阻率的导电级EMC 116。例如，在2重量百分比(wt％)的填料加载量下和在低的逾渗阈值的情况下，本公开的导电级EMC 116的电阻率可以低至6.5×104Ω·cm(与先前使用的EMC的电阻率高于1×1012Ω·cm相比)，以维持导电级EMC 116的粘度，从而实现可模制性和流动均匀性。
逾渗阈值预示着复合材料的电阻率与导电元件的体积之间的关系。当导电填料含量增加时，复合材料会经历绝缘体到导体的转变。填料含量可以称为逾渗阈值，其中由于导电网络的形成，电阻率急剧下降若干数量级。在示例中，逾渗阈值可以小于或等于5wt％。
导电级EMC 116最初可以被配制为具有相对较长的适用期(例如，长达24小时)和低粘度(例如，小于220帕斯卡-秒(Pa·s))的液体。液体形式的导电级EMC 116然后可以被加工成各种形状的固体(例如，颗粒、粉末、片剂等)，以适应可以用于制造流体管芯108的不同类型的包覆模制工艺。
在示例中，导电级EMC 116可以是通过将导电添加剂混合到环氧树脂化合物中来配制的。在示例中，导电添加剂可以是碳基添加剂。碳基添加剂可以是轻质的、化学惰性的、机械稳固的、并且与环氧树脂相容。碳基添加剂可以呈微米或纳米形式，包括粒子、球粒、片材、薄片、纳米管、纳米纤维、交联结构等。环氧树脂可以是任何类型的环氧树脂，如多官能型环氧树脂、联苯型环氧树脂、二环戊二烯型环氧树脂、邻甲酚酚醛清漆型环氧树脂、多芳型环氧树脂等。
在示例中，导电添加剂可以按期望量进行添加，以调整导电级EMC 116的电阻率。例如，导电级EMC 116的电阻率在室温下测量可以在1×1012Ω·cm至1×101Ω·cm之间。在示例中，导电级EMC 116的电阻率在室温下在低的逾渗阈值(例如，小于导电添加剂的5wt％)下可以被调整为从6.5×104Ω·cm至1×1010Ω·cm。导电EMC 116的热膨胀系数可以保持在每摄氏度百万分之15(ppm/℃)以下，以确保低翘曲。导电级EMC 116的螺旋流动距离、凝胶时间和粘度可以被优化以防止空泡形成并最小化流动痕迹。
碳基添加剂的示例可以包括但不限于炭黑、石墨、石墨烯、纳米片、碳纳米管、碳纳米纤维、碳球、和碳纳米结构。炭黑可以具有高聚集度的初级碳粒子。炭黑的含量和粒度分布可以被控制以维持导电EMC的粘度，从而实现可模制性和流动均匀性。
碳纳米管可以由90％至93％的碳构成。碳纳米管可以包括纠缠的纳米管束。碳纳米管可以具有1×104Ω·cm的非常低的电阻率，但是可能更难分配和处理。
碳纳米结构可以是包含高纯度(例如，超过95％的碳和最少量的氧)的高纯度碳添加剂。交联碳纳米管结构可以在比单壁碳纳米管或多壁碳纳米管低得多的加载量下形成稳固的网络。由于碳纳米结构的优异的分散质量，碳纳米结构在环氧树脂化合物中可以达到低于1wt％的期望的逾渗阈值。
在示例中，导电级EMC 116中所包含的导电添加剂的量可以基于所使用的导电添加剂的类型、整个化合物的含量、导电添加剂的粒度、导电添加剂的纯度、导电添加剂的几何形状、以及导电添加剂的纵横比。在示例中，导电添加剂可以按环氧树脂化合物的0.1重量百分比(wt％)至5重量百分比的量进行添加。
还可以包含其他添加剂来控制导电级EMC 116的物理性质。例如，导电级EMC 116可以包含硬化剂、无机填料和催化剂。例如，硬化剂可以用于使环氧树脂化合物固化。硬化剂可以包括多官能型硬化剂、联苯型硬化剂、苯酚酚醛清漆型硬化剂、二环戊二烯型硬化剂、或类似的化合物。
无机基填料可以限定导电级EMC 116的物理性质。例如，无机基填料可以限定如模量、热导率等性质。无机基填料的示例可以包括熔凝硅石、氧化铝、硅石/氧化铝混合物、氮化铝等。无机基填料的添加量可以大于环氧树脂化合物的80wt％。
可以添加催化剂以使环氧树脂化合物的固化加速。可以使用的示例性催化剂可以包括咪唑、磷、胺、和其他类似的化合物。
在示例中，可以向导电级EMC 116添加其他添加剂。例如，可以添加如改性剂(例如，粘合促进剂、硅烷偶联剂、增塑剂、低应力添加剂等)、着色剂、阻燃剂、脱模剂(例如，脱模化合物、天然蜡或合成蜡等)、离子捕集剂等其他添加剂。
环氧树脂、导电添加剂、无机基填料和其他材料可以按期望量混合。混合物可以被加热并加工成用于对硅条110进行包覆模制的期望形式。
下文提供了导电级EMC 116的几个示例性制剂。
示例1：
环氧树脂包含多官能树脂和多官能硬化剂。熔凝硅石填料的用量为85wt％。导电添加剂是0.1wt％至0.5wt％的碳纳米结构。咪唑用作催化剂来使导电级EMC的固化加速。
示例2：
环氧树脂包含联苯树脂和多官能硬化剂。硅石/氧化铝填料的用量为88wt％。导电添加剂是0.5wt％至3wt％的石墨烯纳米片。磷用作催化剂来使导电级EMC的固化加速。
示例3：
环氧树脂包含邻甲酚酚醛清漆树脂和苯酚酚醛清漆硬化剂。硅石填料的用量为82wt％。导电添加剂是2wt％至5wt％的炭黑。咪唑用作催化剂来使导电级EMC的固化加速。
应当注意，示例1至示例3提供了几个非限制性示例。硬化剂、导电添加剂、催化剂和无机基填料的其他组合可以与环氧树脂混合以形成本公开的导电级EMC。
图4图示了用于制备本公开的导电级EMC 116的示例性方法400的流程图。在示例中，方法400可以由各种工具和/或设备来执行，这些工具和/或设备由监督工具和/或设备的操作的处理器或控制器来控制。
在框402处，可以接收原材料。原材料可以包括用于配制上文所描述的导电级EMC116的材料。例如，原材料可以包括环氧树脂、导电添加剂、无机基填料、硬化剂、催化剂等。
在框404处，可以对原材料进行检验。例如，可以测试原材料的物理特性。这些特性可以包括导电添加剂的纯度、环氧树脂的粘度、导电添加剂的微米/纳米结构、导电添加剂的电气性质等。
在框406处，可以由原材料的混合物配制导电级EMC。制剂可以包含环氧树脂、导电添加剂、无机基填料、硬化剂和催化剂的期望混合物。制剂可以包含如着色剂、阻燃剂等其他添加剂。上述示例1至示例3中提供了示例性制剂。
在框408处，可以对制剂进行混合。在示例中，制剂最初可以呈液相或液体形式，并且原材料可以混合。流体管芯的一些制造工艺可以使用呈液体形式的导电级EMC。
在框410处，可以对经混合的制剂进行加热和轧制。例如，加热可以有助于改善导电添加剂和其他添加剂在环氧树脂和无机基填料中的均匀分散。然后可以将经加热的制剂轧制成片材。
在框412处，可以对经轧制的片材应用冷却和破碎。这可以将所配制的导电级EMC转化为固相。然后可以将固体片材破碎或粉碎成粉末或颗粒形式。如上所述，流体管芯的一些制造工艺可以使用呈粉末或颗粒形式的导电级EMC。
在框414处，可以对粉末形式的导电级EMC执行中间检验。中间检验可以检验粉末的平均直径或粒度和/或其他特性。然后，可以将粉末形式的导电级EMC留作储存之用。
在框416处，可以对粉末形式的导电级EMC进行压片。例如，可以将粉末包装在一起以形成导电级EMC的片剂。如上所述，流体管芯的一些制造工艺可以使用呈片剂形式的导电级EMC。
在框418处，可以对片剂进行包装。可以将片剂包装在适当的装运容器中。
在框420处，可以对片剂执行最终检验。最终检验可以检查片剂的大小和均匀性。最终检验还可以检查片剂是否有污染或其他不期望的缺陷。
在框422处，可以对包装好的片剂进行装运。在另一个示例中，可以将包装好的片剂储存起来。在示例中，包装好的片剂可以在保持温度低于5℃的容器中进行储存或装运。
图5图示了用于制造利用本公开的导电级EMC 116包覆模制的流体管芯108的示例性方法500的流程图。在示例中，方法500可以由各种工具和/或设备来执行，这些工具和/或设备由监督工具和/或设备的操作的处理器或控制器来控制。
在框502处，方法500开始。在框504处，方法500制备导电级环氧模制料(EMC)。在示例中，导电级EMC可以是与无机基填料、导电添加剂、催化剂和硬化剂混合的环氧树脂化合物。硬化剂可以有助于使环氧树脂固化。无机基填料可以决定导电级EMC的一些物理性质，如模量、热导率等。在示例中，无机基填料可以大于环氧树脂化合物的80wt％。
在示例中，导电添加剂可以是碳基添加剂。碳基添加剂的示例可以包括炭黑、石墨、石墨烯、纳米片、碳纳米管、和碳纳米结构。
在示例中，硬化剂可以用于使环氧树脂化合物固化。催化剂可以有助于提高利用硬化剂固化环氧树脂化合物的速度。
基于可以应用于制造流体管芯的模制类型，可以以各种不同的形式制备导电级EMC。例如，可以将导电级EMC可以制备为液体或颗粒形式以用于压缩模制，或者制备为粉末或片剂以用于传递/狭缝模制。
在框506处，方法500将导电级环氧模制料模制在由预先放置的硅条填充的衬底上，以形成流体管芯，该流体管芯包括利用导电级环氧模制料包覆模制的硅条。衬底可以是高达12英寸的晶片或高达300毫米(mm)乘300mm的面板。硅条可以包括形成喷嘴以喷射打印流体的开口。硅条还可以包括用于电连接的接合焊盘，以控制流体管芯内的部件(例如，控制打印流体通过硅条的喷嘴喷射的TIJ电阻器)。
可以将导电级EMC分配在硅衬底上的硅条之间的位置。可以将导电级EMC模制为形成沟槽或开口，其中打印流体可以从流体喷射装置的储器流向硅条以经由喷嘴喷射。
在示例中，导电级EMC可以使用压缩模制工艺或传递/狭缝模制工艺来模制。压缩模制工艺可以使用呈液体、颗粒或粉末形式的导电级EMC。可以将导电级EMC分配到衬底的期望位置上。可以将真空模具在加热和向下施压的情况下施加到所分配的EMC，以形成沟槽和/或使所分配的EMC成形，如图3中流体管芯108的截面视图所示的那样。
传递/狭缝模制工艺可以使用呈片剂形式的导电级EMC。可以将模具嵌件施加到按期望图案填充有硅管芯的衬底上。模具嵌件可以限定导电级EMC的形状。可以将导电级EMC的片剂熔融并分配以填充衬底与模具嵌件之间的开口。
在框508处，方法500使导电级环氧模制料固化以形成包覆模制的面板。例如，可以将载体或胶带从模制的面板上脱粘。在脱粘之后，可以使导电级EMC通过加热而固化以使导电级EMC变硬或硬化。
在示例中，可以进行两个固化工艺来使导电级环氧模制料固化。第一固化工艺可以在导电级EMC的注入阶段之后立即发生。固化的发生可以持续相对较短的时间(例如，60秒(s)至180秒)，以确保可以将导电级EMC从模腔中释放出来。
然后，第二/最终固化可以在载体或胶带被脱粘之后发生。这一固化的发生可以在升高的温度(例如，大约150℃至200℃)下持续5分钟(min)至30分钟。最终固化工艺还可以包括翘曲控制工艺，其中将机械夹具施加于利用包覆模制的导电级EMC包覆模制而形成的流体管芯。
在框510处，方法500将包覆模制的面板切割成单个的流体管芯。例如，可以将利用导电级EMC包覆模制的流体管芯切割成具有多个流体管芯的较小的尺寸规格、或具有单个的流体管芯的单一规格。然后可以将流体管芯插入到打印头或集成式岬头单元中。然后可以将打印头插入到流体喷射装置的本体中。在框512处，方法500结束。
应当理解，上文所公开的特征和功能以及其他特征和功能的变体或其替代方案可以组合到许多其他不同的系统或应用中。本领域技术人员随后可以进行各种目前未预见或未预料到的替代方案、修改、变化或改进，这些替代方案、修改、变化或改进也旨在被以下权利要求所涵盖。

Claims (15)

1.一种环氧模制料，包括：
硬化剂；
无机基填料，其中所述无机基填料的量大于所述环氧模制料的80重量百分比(wt％)；
催化剂，用于使所述环氧模制料的固化加速；以及
导电添加剂，其中所述导电添加剂的量为所述环氧模制料的0.1wt％至5wt％。
2.根据权利要求1所述的环氧模制料，其中在室温下，在所述导电添加剂少于5wt％的情况下，所述环氧模制料的电阻率在1×1012欧姆厘米(Ω·cm)至1×101Ω·cm之间。
3.根据权利要求2所述的环氧模制料，其中在室温下，在所述导电添加剂少于5wt％的情况下，所述环氧模制料的电阻率在1×1010Ω·cm至6.5×104Ω·cm之间。
4.根据权利要求1所述的环氧模制料，其中所述环氧模制料的热膨胀系数小于每摄氏度百万分之15(ppm/℃)。
5.根据权利要求1所述的环氧模制料，其中所述导电添加剂包括碳基添加剂。
6.根据权利要求5所述的环氧模制料，其中所述碳基添加剂包括占所述环氧模制料的0.1wt％至0.5wt％的碳纳米结构。
7.根据权利要求5所述的环氧模制料，其中所述碳基添加剂包括占所述环氧模制料的0.5wt％至3wt％的石墨烯纳米片。
8.根据权利要求5所述的环氧模制料，其中所述碳基添加剂包括占所述环氧模制料的2wt％至5wt％的炭黑。
9.一种流体喷射装置，包括：
储器本体，用于储存打印流体；以及
打印头，所述打印头耦接到所述储器本体，其中所述打印头包括：
电盘；以及
流体管芯，所述流体管芯电连接到所述电盘，其中所述流体管芯包括利用导电级环氧模制料封装的硅条。
10.根据权利要求9所述的流体喷射装置，其中，所述导电级环氧模制料包括环氧树脂与硬化剂、无机基填料、催化剂和导电添加剂的混合物。
11.根据权利要求10所述的流体喷射装置，其中所述导电添加剂包括以下中的至少一种：炭黑、石墨、石墨烯、碳纳米管、碳纳米纤维、碳球、或碳纳米结构。
12.一种方法，包括：
制备导电级环氧模制料；
将所述导电级环氧模制料模制在由预先放置的硅条填充的衬底上，以形成流体管芯，所述流体管芯包括利用所述导电级环氧模制料包覆模制的所述硅条；
使所述导电级环氧模制料固化以形成包覆模制的面板；以及
将所述包覆模制的面板切割成单个的流体管芯。
13.根据权利要求12所述的方法，其中所述模制包括压缩模制或传递模制。
14.根据权利要求13所述的方法，其中所述导电级环氧模制料被制备为液体形式、颗粒形式或粉末形式以用于所述压缩模制。
15.根据权利要求13所述的方法，其中所述导电级环氧模制料被制备为片剂以用于所述传递模制。
CN202180102252.3A 2021-09-09 2021-09-09 用于封装流体管芯的导电化合物 Pending CN117916093A (zh)

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