CN117884972A - Detection system and method for controlling polishing effect of PCB - Google Patents
Detection system and method for controlling polishing effect of PCB Download PDFInfo
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- CN117884972A CN117884972A CN202410254774.0A CN202410254774A CN117884972A CN 117884972 A CN117884972 A CN 117884972A CN 202410254774 A CN202410254774 A CN 202410254774A CN 117884972 A CN117884972 A CN 117884972A
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- 238000001514 detection method Methods 0.000 title claims abstract description 73
- 238000005498 polishing Methods 0.000 title claims abstract description 58
- 230000000694 effects Effects 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims description 17
- 238000012986 modification Methods 0.000 claims abstract description 28
- 230000004048 modification Effects 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000012634 optical imaging Methods 0.000 claims abstract description 10
- 238000007405 data analysis Methods 0.000 claims abstract description 7
- 230000007547 defect Effects 0.000 claims abstract description 7
- 238000003384 imaging method Methods 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims description 8
- 238000004458 analytical method Methods 0.000 claims description 3
- 238000011157 data evaluation Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000007619 statistical method Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 abstract description 7
- 238000007517 polishing process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010801 machine learning Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention provides a detection system and a detection method for controlling a polishing effect of a PCB, and belongs to the technical field of PCB production. The device comprises a data acquisition unit, a product conveying unit, a product sorting unit and a detection modification unit; the data acquisition unit comprises an optical imaging module, a surface detection module, an image processing block and a data analysis module. An optical imaging module: and photographing and imaging the surface of the PCB by using a high-resolution camera and a microscope so as to detect defects, flaws and polishing effects of the surface. The shot images can be analyzed and compared through an image processing algorithm so as to ensure that the polishing effect meets the requirements. And a surface detection module: and non-contact detection is carried out on the surface of the PCB by using a sensor such as laser or infrared rays. The invention improves the accuracy and the efficiency of detection, realizes the comprehensive monitoring and control of the polishing process and the effect, can ensure the product quality, improves the production efficiency, reduces the cost and can ensure the product quality.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a detection system and method for controlling polishing effect of a PCB.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. Circuit boards may be referred to as printed wiring boards or printed circuit boards, and are classified into three major categories, single-sided boards, double-sided boards, and multi-layer boards, if the number of layers is divided.
First, a single panel, on the most basic PCB, the parts are concentrated on one side and the wires are concentrated on the other side. Such a PCB is called a single-sided circuit board because the wires are present on only one side thereof. Single panel is generally simple to manufacture and low cost, but has the disadvantage of not being applicable to products that are too complex.
The double panel is an extension of a single panel, and is used when a single wiring layer cannot meet the needs of the electronic product. The copper-clad wiring is arranged on both sides, and the wiring between the two layers can be conducted through the via hole so as to form the required network connection.
The multi-layer board is a printed board having three or more conductive pattern layers laminated with insulating materials therebetween at a distance, and conductive patterns therebetween being interconnected as required. The multilayer circuit board is a product of electronic information technology which is developed in the directions of high speed, multifunction, large capacity, small volume, thin and light weight.
The PCB is an indispensable component in the electronic product, the quality of the PCB has important influence on the performance and stability of the whole electronic product, polishing is a very critical link in the manufacturing process of the PCB, the flatness and the surface roughness of the PCB are directly influenced, and in order to ensure the quality of the PCB, strict detection and control are required for polishing effect, so that a detection system and a detection method suitable for the polishing effect of the PCB are designed, and the detection system and the detection method have important significance for improving the quality and the stability of the PCB.
Disclosure of Invention
The invention aims to solve the technical problem of providing a detection system and a detection method for controlling the polishing effect of a PCB (printed Circuit Board) so as to solve the problem that the polishing effect is strictly detected and controlled in order to ensure the quality of the PCB due to the fact that the flatness and the surface roughness of the PCB are directly influenced by the conventional polishing.
In order to solve the technical problems, the invention provides the following technical scheme:
the detection system and the method for controlling the polishing effect of the PCB board comprise a data acquisition unit, a product conveying unit, a product sorting unit and a detection modification unit;
the data acquisition unit comprises an optical imaging module, a surface detection module, an image processing block and a data analysis module.
Preferably, the optical imaging module: and photographing and imaging the surface of the PCB by using a high-resolution camera and a microscope so as to detect defects, flaws and polishing effects of the surface. The shot images can be analyzed and compared through an image processing algorithm so as to ensure that the polishing effect meets the requirements.
Preferably, the surface detection module: and non-contact detection is carried out on the surface of the PCB by using a laser or infrared sensor and the like so as to check parameters such as flatness, smoothness, roughness and the like of the surface. Through high-precision measurement and analysis, whether the polishing effect meets the requirement can be determined.
Preferably, the image processing block: the collected image data is processed, the characteristic information of the surface of the PCB is extracted, and the flatness of the surface is analyzed and calculated, so that the polishing effect is judged.
Preferably, the data analysis module: and processing the acquired data by using a mathematical statistical analysis method, quantitatively analyzing the roughness and the flatness of the surface, and judging according to a preset detection standard.
Preferably, the product conveying unit comprises a feeding, transferring and discharging unit for products, and specifically comprises a conveying line, wherein a support is arranged above the conveying line, a collecting device is arranged in the support, the collecting device can be a high-precision camera and a laser range finder, the collecting device is used for processing and analyzing collected data, judging whether the polishing effect is qualified or not according to a preset detection standard, a display device is used for displaying the processed result to an operator, and the collecting device needs to be capable of obtaining the appearance and roughness data of the surface of a PCB (printed circuit board) with high precision, so that the high-resolution camera and the laser range finder can be adopted, and the accuracy and the reliability of the data are ensured.
Preferably, the product sorting unit comprises the steps of distinguishing products, picking and sorting and transferring qualified products and unqualified products, conveying the qualified products into a qualified conveying line, taking over and packing the qualified products by a subsequent work, conveying the unqualified products into the unqualified conveying line, carrying out data evaluation by returning inspection again by an inspection worker, numbering, pasting the numbers on the surfaces of the products, inputting unqualified data of the PCB into a database, generating a product catalog column in the database, and carrying out listing according to the numbering sequence.
Preferably, the detection and modification unit receives an unqualified product database in the product sorting unit, performs scheme modification according to the polishing deviation degree of the product, automatically fills in a product number catalog after scheme modification data are produced, and can modify according to scheme modification data when a subsequent repairing person carries out secondary processing on the numbered product, wherein the modification data are recommended modes set by a system and are not forced to execute, and the repairing person can modify according to modification recommendation;
in the repairing process, optical microscope detection is one of the more common PCB polishing quality detection methods, micro defects or uneven polishing conditions of the surface of the PCB can be clearly found by magnifying images of the surface of the PCB and observing the surface by using a microscope, and meanwhile, some special microscopes can be used for observing the smoothness and flatness of the surface of the PCB so as to judge the polishing quality of the PCB more accurately.
The detection method of the detection system for controlling the polishing effect of the PCB comprises the following steps:
s1, setting a detection line, and setting detection equipment on the detection line;
s2, detecting data, and checking one by one in the product moving process;
s3, distinguishing products, and when qualified and unqualified products are distinguished, carrying out opposite conveying by using two production lines;
s4, inputting products, carrying out subsequent processing on qualified products, recovering unqualified products, numbering and warehousing, and carrying out one-by-one repair according to the input numbers.
Compared with the prior art, the invention has at least the following beneficial effects:
in the scheme, the optical imaging and surface detection technology is combined with the automatic control system, real-time monitoring and adjustment of the PCB polishing process are achieved, the intellectualization and self-adaption of the system can be achieved by means of a machine vision and machine learning algorithm, thereby improving the detection accuracy and efficiency, realizing comprehensive monitoring and control of the polishing process and effect, ensuring the product quality, improving the production efficiency, reducing the cost, realizing comprehensive monitoring and control of the polishing process and effect, ensuring the product quality, realizing real-time monitoring and control of the PCB polishing effect, ensuring the quality and stability of the PCB, having important significance for improving the quality and stability of the PCB, having important influence on the performance and reliability of electronic products, applying the detection system to a production line, combining with automatic equipment, realizing automatic detection and control of the PCB polishing effect, improving the production efficiency and the product quality, realizing comprehensive monitoring and control of the PCB polishing effect, finding problems in time and adjusting, and ensuring the stability and consistency of the product.
Drawings
The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present invention and, together with the description, further serve to explain the principles of the invention and to enable a person skilled in the pertinent art to make and use the invention.
FIG. 1 is a schematic diagram of a detection method for controlling PCB polishing effect;
FIG. 2 is a schematic diagram of a detection system for controlling PCB polishing effects;
FIG. 3 is a schematic diagram of a data acquisition unit;
FIG. 4 is a schematic diagram of a product delivery unit;
FIG. 5 is a schematic diagram of a product sorting unit;
fig. 6 is a schematic diagram of a detection modification unit.
Specific structures and devices are labeled in the drawings to enable clear implementation of embodiments of the invention, but this is merely illustrative and is not intended to limit the invention to the specific structures, devices and environments that may be modified or adapted by those of ordinary skill in the art, based on the specific needs.
Detailed Description
The detection system and method for controlling the polishing effect of the PCB provided by the invention are described in detail below with reference to the accompanying drawings and specific embodiments. While the invention has been described herein in terms of the preferred and preferred embodiments, the following embodiments are intended to be more illustrative, and may be implemented in many alternative ways as will occur to those of skill in the art; and the accompanying drawings are only for the purpose of describing the embodiments more specifically and are not intended to limit the invention specifically.
It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the relevant art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
Generally, the terminology may be understood, at least in part, from the use of context. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending at least in part on the context. In addition, the term "based on" may be understood as not necessarily intended to convey an exclusive set of factors, but may instead, depending at least in part on the context, allow for other factors that are not necessarily explicitly described.
It is to be understood that the meaning of "on … …", "on … …" and "over … …" in this disclosure should be interpreted in the broadest sense such that "on … …" means not only "directly on" something but also includes meaning "on" something with intervening features or layers therebetween, and "on … …" or "over … …" means not only "on" or "over" something, but also may include its meaning "on" or "over" something without intervening features or layers therebetween.
Furthermore, spatially relative terms such as "under …," "under …," "lower," "above …," "upper," and the like may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented and the spatially relative descriptors used herein may similarly be interpreted accordingly.
As shown in fig. 1 to 6, the embodiment of the invention provides a detection system and a method for controlling the polishing effect of a PCB board, comprising a data acquisition unit, a product conveying unit, a product sorting unit and a detection modification unit;
the data acquisition unit comprises an optical imaging module, a surface detection module, an image processing block and a data analysis module.
An optical imaging module: and photographing and imaging the surface of the PCB by using a high-resolution camera and a microscope so as to detect defects, flaws and polishing effects of the surface. The shot images can be analyzed and compared through an image processing algorithm so as to ensure that the polishing effect meets the requirements.
And a surface detection module: and non-contact detection is carried out on the surface of the PCB by using a laser or infrared sensor and the like so as to check parameters such as flatness, smoothness, roughness and the like of the surface. Through high-precision measurement and analysis, whether the polishing effect meets the requirement can be determined.
Image processing block: the collected image data is processed, the characteristic information of the surface of the PCB is extracted, and the flatness of the surface is analyzed and calculated, so that the polishing effect is judged.
And a data analysis module: and processing the acquired data by using a mathematical statistical analysis method, quantitatively analyzing the roughness and the flatness of the surface, and judging according to a preset detection standard.
The product conveying unit comprises a conveying line, a support is arranged above the conveying line, acquisition equipment is arranged in the support, the acquisition equipment can be a high-precision camera and a laser range finder, the acquisition equipment is used for processing and analyzing acquired data and judging whether the polishing effect is qualified or not according to a preset detection standard, the display equipment is used for displaying the processed result to an operator, and the acquisition equipment needs to be capable of acquiring the appearance and roughness data of the surface of the PCB with high precision, so that the high-resolution camera and the laser range finder equipment can be adopted, and the accuracy and reliability of the data are guaranteed.
The product sorting unit comprises a sorting unit for sorting, sorting and transferring the products, a sorting unit for sorting and transferring the qualified products and the unqualified products, wherein the qualified products enter a qualified conveying line for conveying, the unqualified products enter the unqualified conveying line for successive job replacement and packaging, the unqualified products enter the unqualified conveying line for re-inspection by an inspection worker for data evaluation and numbering, the numbering is pasted to the surface of the products, unqualified data of the PCB are input into a database, a product catalog column is generated in the database, and the sorting is performed according to the numbering sequence.
The detection and modification unit is used for receiving an unqualified product database in the product sorting unit, carrying out scheme modification according to the polishing deviation degree of the product, automatically filling the scheme modification data into the product number catalog after the scheme modification data are produced, carrying out modification according to the scheme modification data when a subsequent repair person carries out secondary processing on the numbered product, wherein the modification data are recommended modes set by a system and are not forced to be executed, and the repair person can refer to modification recommendation to carry out modification;
in the repairing process, optical microscope detection is one of the more common PCB polishing quality detection methods, micro defects or uneven polishing conditions of the surface of the PCB can be clearly found by magnifying images of the surface of the PCB and observing the surface by using a microscope, and meanwhile, some special microscopes can be used for observing the smoothness and flatness of the surface of the PCB so as to judge the polishing quality of the PCB more accurately.
The detection method of the detection system for controlling the polishing effect of the PCB comprises the following steps:
s1, setting a detection line, and setting detection equipment on the detection line;
s2, detecting data, and checking one by one in the product moving process;
s3, distinguishing products, and when qualified and unqualified products are distinguished, carrying out opposite conveying by using two production lines;
s4, inputting products, carrying out subsequent processing on qualified products, recovering unqualified products, numbering and warehousing, and carrying out one-by-one repair according to the input numbers. The optical imaging and surface detection technology is combined with an automatic control system, so that real-time monitoring and adjustment of the polishing process of the PCB are realized, and the intellectualization and self-adaption of the system can be realized by means of machine vision and a machine learning algorithm, thereby improving the detection accuracy and efficiency.
The invention is intended to cover any alternatives, modifications, equivalents, and variations that fall within the spirit and scope of the invention. In the following description of preferred embodiments of the invention, specific details are set forth in order to provide a thorough understanding of the invention, and the invention will be fully understood to those skilled in the art without such details. In other instances, well-known methods, procedures, flows, components, circuits, and the like have not been described in detail so as not to unnecessarily obscure aspects of the present invention.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (9)
1. The detection system for controlling the polishing effect of the PCB is characterized by comprising a data acquisition unit, a product conveying unit, a product sorting unit and a detection modification unit;
the data acquisition unit comprises an optical imaging module, a surface detection module, an image processing block and a data analysis module.
2. The detection system for controlling a PCB panel polishing effect of claim 1, wherein the optical imaging module: and photographing and imaging the surface of the PCB by using a high-resolution camera and a microscope so as to detect defects, flaws and polishing effects of the surface. The shot images can be analyzed and compared through an image processing algorithm so as to ensure that the polishing effect meets the requirements.
3. The inspection system for controlling the polishing effect of a PCB board of claim 1, wherein the surface inspection module: and non-contact detection is carried out on the surface of the PCB by using a laser or infrared sensor and the like so as to check parameters such as flatness, smoothness, roughness and the like of the surface. Through high-precision measurement and analysis, whether the polishing effect meets the requirement can be determined.
4. The inspection system for controlling PCB panel polishing as set forth in claim 1, wherein the image processing block: the collected image data is processed, the characteristic information of the surface of the PCB is extracted, and the flatness of the surface is analyzed and calculated, so that the polishing effect is judged.
5. The detection system for controlling a polishing effect of a PCB board of claim 1, wherein the data analysis module: and processing the acquired data by using a mathematical statistical analysis method, quantitatively analyzing the roughness and the flatness of the surface, and judging according to a preset detection standard.
6. The detection system for controlling the polishing effect of the PCB according to claim 1, wherein the product conveying unit comprises a feeding, transferring and discharging of products, and specifically comprises a conveying line, a support is arranged above the conveying line, a collecting device is arranged in the support, the collecting device can be a high-precision camera and a laser range finder, the collecting device is used for processing and analyzing collected data, judging whether the polishing effect is qualified or not according to a preset detection standard, the display device is used for displaying the processed result to an operator, and the collecting device needs to be capable of obtaining morphology and roughness data of the surface of the PCB with high precision, so that the camera and the laser range finder with high resolution can be adopted, and the accuracy and the reliability of the data are ensured.
7. The inspection system for controlling polishing effect of PCB board according to claim 1, wherein the product sorting unit includes sorting, sorting and transferring of products, sorting and transferring of qualified products and unqualified products, the qualified products enter into a qualified conveyor line for transportation, are successively packed by subsequent works, the unqualified products enter into a unqualified conveyor line, are checked again by a checker to perform data evaluation and numbering, the numbering is pasted to the surface of the products, and unqualified data of PCB board is entered into a database, a product catalog column is generated in the database, and are listed in order of numbering.
8. The detecting system for controlling the polishing effect of a PCB board according to claim 1, wherein the detecting and modifying unit receives the unqualified product database in the product sorting unit, and performs scheme modification according to the polishing deviation degree of the product, and after the scheme modification data is produced, the product is automatically filled according to the product number catalog, when the subsequent repairing personnel performs secondary processing on the numbered product, the modification can be performed according to the scheme modification data, the modification data is a recommended mode set by the system, and is not forced to be executed, and the repairing personnel can refer to the modification recommendation to modify;
in the repairing process, optical microscope detection is one of the more common PCB polishing quality detection methods, micro defects or uneven polishing conditions of the surface of the PCB can be clearly found by magnifying images of the surface of the PCB and observing the surface by using a microscope, and meanwhile, some special microscopes can be used for observing the smoothness and flatness of the surface of the PCB so as to judge the polishing quality of the PCB more accurately.
9. The detection method of the detection system for controlling the polishing effect of the PCB board is characterized by comprising the following steps of: s1, setting a detection line, and setting detection equipment on the detection line;
s2, detecting data, and checking one by one in the product moving process;
s3, distinguishing products, and when qualified and unqualified products are distinguished, carrying out opposite conveying by using two production lines;
s4, inputting products, carrying out subsequent processing on qualified products, recovering unqualified products, numbering and warehousing, and carrying out one-by-one repair according to the input numbers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410254774.0A CN117884972A (en) | 2024-03-06 | 2024-03-06 | Detection system and method for controlling polishing effect of PCB |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410254774.0A CN117884972A (en) | 2024-03-06 | 2024-03-06 | Detection system and method for controlling polishing effect of PCB |
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| CN117884972A true CN117884972A (en) | 2024-04-16 |
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| CN202410254774.0A Pending CN117884972A (en) | 2024-03-06 | 2024-03-06 | Detection system and method for controlling polishing effect of PCB |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118898875A (en) * | 2024-10-08 | 2024-11-05 | 青岛领军智能建造新材料科技有限公司 | Fault prediction management method and system for inorganic board production line based on data analysis |
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2024
- 2024-03-06 CN CN202410254774.0A patent/CN117884972A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118898875A (en) * | 2024-10-08 | 2024-11-05 | 青岛领军智能建造新材料科技有限公司 | Fault prediction management method and system for inorganic board production line based on data analysis |
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