CN117838426A - A brain perfusion machine for mild hypothermia treatment - Google Patents

Abstract

The invention provides a brain perfusion machine for sub-low temperature treatment, belonging to the technical field of medical appliances; the device comprises a machine body, a heat exchanger and a circulating tank, wherein a blood circulation assembly is arranged on the surface of the heat exchanger, a semiconductor refrigerating sheet is arranged on the outer surface of the circulating tank, and a driving part is arranged on the lower surface of the circulating tank; through setting up circulation jar and drive part, when cooling down to the patient, make the circular telegram of semiconductor refrigeration piece work, the circular telegram of semiconductor refrigeration piece is cooled down to the circulation jar, when carrying out the rewarming to the patient, drive part operation, the heating surface of semiconductor refrigeration piece pastes with the circulation jar and contacts, make the circular telegram work of semiconductor refrigeration piece, can heat the circulation jar to realize the rewarming of the internal blood of patient, such setting avoids heating electrical apparatus component and normal saline direct contact, thereby the heating electrical apparatus component oxidation damage that causes is favorable to the long-term stable use of this device, the life of this device has been ensured, the risk of operation has been reduced.

Description

A brain perfusion machine for mild hypothermia treatment

Technical Field

The present invention relates to the technical field of medical devices, and in particular to a brain perfusion machine for sub-hypothermia treatment.

Background technique

Mild hypothermia therapy is one of the important means of treating neurological diseases, and the conditions for its application are mature. In the treatment of stroke, whole body or local surface cooling and moderate hypothermia are more commonly used. Human mild hypothermia thermostat is used in treatment. Human mild hypothermia thermostat is an instrument that controls the temperature and flow of circulating fluid and physically cools/warms the patient's head and body through an ice cap or ice blanket. However, there are many complications when using human mild hypothermia thermostat for whole body mild hypothermia treatment, which can easily lead to electrolyte disorders, arrhythmias, coagulation disorders, and serious infections, thus limiting its clinical use; if only an ice cap is used to physically cool the patient's head, because the scalp and skull are rich in blood supply, only the surface temperature can be reduced, and the cooling of the patient's intracranial brain tissue is extremely slow, and the cooling effect is not good.

In order to improve the speed of regulating human body temperature during surgery, a Chinese patent with publication number CN103417325B discloses a hypothermia treatment-intravascular heat exchange body temperature precision control device, which consists of an intravascular catheter system, an extracorporeal saline circulation system and a heat exchange controller. The intravascular catheter system is connected to the extracorporeal saline circulation system through a pipeline to form a closed-loop saline flow channel. The circulating water pump controls the flow of sterile saline in this closed-loop channel, and the heat exchange coil is immersed in the refrigerant. The temperature of the refrigerant can be changed by heating the refrigeration device, thereby adjusting the temperature of the sterile saline. The heat exchange controller consists of a heating refrigeration device, a temperature control system and a display operation unit, which are connected through a circuit. The heat exchange controller can change the temperature of the saline in the extracorporeal saline circulation system, so that the intravascular catheter system obtains temperature-controlled saline, which is heat-exchanged with the patient's blood through the balloon surface of the catheter system, thereby achieving the purpose of regulating the core body temperature for patients with high risk of central nervous system or hypothermia.

Although the above-mentioned device is simple and easy to operate in that it regulates the patient's body temperature by changing the temperature of the saline solution in the extracorporeal circulation, conventional heat exchange coils are mostly made by arranging a heat-conducting metal outside the heating wire. During the heating process of the physiological saline, the heat-conducting metal outside the heat exchange coil will be accelerated by the salt for oxidation. At the same time, long-term high-temperature heating can easily cause tiny holes to be oxidized on the surface of the heat-conducting metal, allowing the physiological saline to contact the heating wire in the heat-conducting metal tube. The water with added salt is more conductive, which can easily cause the heating wire to short-circuit or short-circuit, thereby making the current instantly become very large, causing a short circuit, which is not conducive to the long-term and stable use of the device, reduces the service life of the device, and increases the risk of surgery. Therefore, the present application provides a brain perfusion machine for sub-hypothermia treatment to meet the needs.

Summary of the invention

The technical problem to be solved by the present invention is to provide a brain perfusion machine for hypothermic treatment by setting a driving component. When the patient needs to be cooled down, the semiconductor refrigeration chip is energized to work, and multiple semiconductor refrigeration chips are energized to cool the circulation tank. When the patient needs to be rewarmed, the driving component is operated, and the heating surface of the semiconductor refrigeration chip is in contact with the circulation tank, so that the semiconductor refrigeration chip is energized to work, and the circulation tank can be heated, and the blood in the patient's body can be rewarmed. The advantage of such a setting is that it avoids direct contact between the heating electrical components and the physiological saline, thereby preventing the heating electrical components from being oxidized and damaged, which is beneficial to the long-term and stable use of the device, ensures the service life of the device, reduces the risk of surgery, and makes full use of the semiconductor refrigeration chip. It is clever and practical. The above setting can solve the problem that during the use of the existing perfusion machine, the heating component is prone to aging and short-circuiting when used for a long time, which is not conducive to the long-term use of the device.

In order to solve the above technical problems, the present invention provides the following technical solutions:

A brain perfusion machine for sub-hypothermia treatment comprises a machine body, a heat exchanger and a circulation tank, wherein a control panel is arranged on the outer surface of the machine body, a body temperature sensor is arranged on the surface of the machine body, a blood circulation component is arranged on the surface of the heat exchanger, a semiconductor refrigeration sheet is arranged on the outer surface of the circulation tank, a water temperature sensor is arranged on the inner surface of the circulation tank, and a liquid level sensor is arranged on the inner surface of the circulation tank, the blood circulation component is used to take blood from the femoral artery of the patient, and control the blood temperature through the heat exchanger and then perfuse it into the carotid artery of the patient to achieve the purpose of artificial intervention on the patient's brain temperature, the blood circulation component is connected to the heat exchanger and the machine body respectively, a coolant circulation component is arranged on the surface of the circulation tank, and the coolant circulation component is used to physically cool the blood by passing the coolant through the heat exchanger. The coolant circulation component is connected to the heat exchanger and the circulation tank respectively. A driving component is arranged on the lower surface of the circulation tank. The driving component is used to drive the semiconductor refrigeration plate to move. The driving component is connected to the body and the semiconductor refrigeration plate respectively. A diverter component is arranged on the surface of the circulation tank. The diverter component is used to divert and decelerate the coolant. The diverter component is connected to the circulation tank. A guide component is arranged on the surface of the circulation tank. The guide component is used to cool the coolant diverted by the diverter component through the semiconductor refrigeration plate. The guide component is connected to the circulation tank. A cooling component is arranged on the outer surface of the semiconductor refrigeration plate. The cooling component is used to install and fix the semiconductor refrigeration plate. The cooling component is connected to the semiconductor refrigeration plate.

Preferably, the blood circulation component includes a collection tube inserted on the surface of the heat exchanger, a blood transfusion tube is inserted on the surface of the heat exchanger, a circulation pump is fixedly connected to the inner surface of the body, a monitoring sensor module is provided on the inner surface of the body, a return blood tube is inserted on the surface of the circulation pump, and the return blood tube and the blood transfusion tube are connected via the monitoring sensor module and the circulation pump.

Preferably, the coolant circulation component includes an infusion tube inserted on the surface of the circulation tank, the surface of the infusion tube is fixedly connected to a first pump body, the surface of the circulation tank is fixedly connected to a first solenoid valve, the surface of the circulation tank is inserted with a discharge tube, the infusion tube and the discharge tube are both connected to the circulation tank through the first solenoid valve, the surface of the heat exchanger is inserted with a return tube, the surface of the circulation tank is fixedly connected to a second solenoid valve, the surface of the circulation tank is inserted with a catheter, the surface of the catheter is provided with a second pump body, and the catheter and the return tube are both connected to the circulation tank through the second solenoid valve.

Preferably, the driving component includes a chassis fixedly connected to the inner surface of the body, a servo motor is fixedly connected to the lower surface of the chassis, a main gear is fixedly connected to the output end of the servo motor, a driven gear is rotatably connected to the outer surface of the main gear, a rotating shaft is fixedly connected to the upper surface of the driven gear, a bracket is fixedly connected to the outer surface of the rotating shaft, and the cooling component is connected to the bracket.

Preferably, the diversion component includes a connecting pipe fixedly connected to the inner surface of the circulation tank, the outer surface of the connecting pipe is provided with a conical sleeve, the inner surface of the circulation tank is provided with a diversion disk, the upper surface of the diversion disk is fixedly connected to a diversion plate, the upper surface of the diversion disk is fixedly connected to a baffle, and the guide component is connected to the diversion disk.

Preferably, a diversion groove is provided on the upper surface of the diversion plate, and an avoidance groove is provided on the upper surface of the diversion plate.

Preferably, the guide component includes a step plate fixedly connected to the side surface of the diverter plate, the side surface of the step plate is fixedly connected to a limiting plate, the surface of the limiting plate is fixedly connected to a guide plate, and the surface of the limiting plate is fixedly connected to an inclined plate.

Preferably, a branch plate is fixedly connected to the lower surface of the inclined plate, and the inclined plate and the guide plate are staggered.

Preferably, the cooling component includes a heat conducting plate inserted on the surface of the bracket, a clamping block is fixedly connected to the surface of the heat conducting plate, a clamping groove is provided on the surface of the bracket, an elastic groove is provided on the inner surface of the clamping block, an inclined spring sheet is fixedly connected to the surface of the semiconductor refrigeration plate, a concave spring sheet is fixedly connected to the surface of the inclined spring sheet, an adapting groove is provided on the inner surface of the bracket, and a limiting groove is provided on the surface of the circulation tank.

Compared with the prior art, the present invention has at least the following beneficial effects:

In the above scheme, by setting up a blood circulation component, the blood is allowed to pass through a closed-loop extracorporeal circulation. After the blood is cooled, it is infused into the patient's intracranial artery to quickly achieve low-temperature control of the patient's brain, while having little effect on the patient's whole body temperature. This can greatly reduce the chances of arrhythmias, infections, coagulation disorders and electrolyte disorders in patients under systemic hypothermia, thereby reducing treatment risks.

By setting up a coolant circulation component, the coolant is allowed to circulate between the heat exchanger and the circulation tank. The coolant physically cools the blood through the heat exchanger. Compared with the freezing setting and the heating setting that directly act on the blood, this is safer, the temperature change curve is softer, and there is less stimulation to the patient.

By setting a driving component, when it is necessary to cool down the patient, the semiconductor refrigeration chip is energized and operated, and multiple semiconductor refrigeration chips are energized to cool the circulation tank. When it is necessary to rewarm the patient, the driving component is operated, and the heating surface of the semiconductor refrigeration chip contacts the circulation tank, so that the semiconductor refrigeration chip is energized and operated, thereby heating the circulation tank and rewarming the blood in the patient's body. The advantage of such a setting is that it avoids direct contact between the heating electrical components and saline, thereby causing oxidation damage to the heating electrical components, which is conducive to the long-term and stable use of the device, ensures the service life of the device, reduces the risk of surgery, and makes full use of the semiconductor refrigeration chip, which is clever and practical.

By providing the diversion component, not only can the coolant be evenly diverted on the surface of the diversion plate, but the high-speed flowing coolant can also be decelerated.

By setting up the guide components, not only can the coolant flow more evenly and smoothly in the limit plate, but the staggered distribution of the inclined plates and guide plates can ensure that the coolant has a sufficient flow rate to flow smoothly through the branch plate, thereby greatly improving the use efficiency of the semiconductor refrigeration plate.

By setting up the cooling components, the semiconductor refrigeration plate can be installed and disassembled very efficiently. The setting of the inclined spring piece and the concave spring piece allows a one-way self-locking card structure to be formed between the semiconductor refrigeration plate and the bracket, ensuring the stability of the semiconductor refrigeration plate during use.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable those skilled in the relevant art to make and use the present disclosure.

FIG1 is a schematic diagram of a brain perfusion machine system for mild hypothermia treatment;

FIG2 is a schematic diagram of the three-dimensional structure of a brain perfusion machine for mild hypothermia treatment;

FIG3 is a schematic diagram of a three-dimensional structure of a driving component in cross section;

FIG4 is a schematic diagram of a cross-sectional perspective structure of a coolant circulation assembly;

FIG5 is a schematic diagram of an enlarged three-dimensional structure of a flow dividing component;

FIG6 is a schematic diagram of an enlarged three-dimensional structure of the guide component;

FIG7 is a schematic diagram of a three-dimensional structure of the diverter plate when viewed from the bottom;

FIG8 is a schematic diagram of an enlarged three-dimensional structure of the circulation tank;

FIG9 is a schematic diagram of the top view of the structure of FIG8;

FIG10 is a schematic diagram of a three-dimensional structure of an explosion-proof cooling component;

FIG. 11 is a schematic diagram of a cross-sectional three-dimensional structure of a cooling component.

[Reference Signs]

1. Machine body; 2. Control panel; 3. Circulation tank; 4. First solenoid valve; 5. Infusion tube; 6. First pump body; 7. Heat exchanger; 8. Liquid return pipe; 9. Second solenoid valve; 10. Liquid discharge pipe; 11. Catheter; 12. Second pump body; 13. Collection tube; 14. Blood transfusion tube; 15. Circulation pump; 16. Monitoring sensor module; 17. Blood return tube; 18. Body temperature sensor; 19. Chassis; 20. Servo motor; 21. Main gear; 22. Driven gear; 23. Rotating shaft; 24. Support Frame; 25, semiconductor cooling plate; 26, limit groove; 27, connecting pipe; 28, conical sleeve; 29, diverter plate; 30, diverter plate; 31, baffle plate; 32, diverter groove; 33, avoidance groove; 34, step plate; 35, limit plate; 36, guide plate; 37, inclined plate; 38, branch plate; 39, water temperature sensor; 40, liquid level sensor; 41, oblique spring piece; 42, concave spring piece; 43, adapter groove; 44, thermal conductive sheet; 45, block; 46, elastic groove; 47, card slot.

As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments, and the adjustments or modifications made are still included in the scope of the attached claims.

Detailed ways

The following is a detailed description of a brain perfusion machine for mild hypothermia treatment provided by the present invention in conjunction with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternatives to implement some known technologies; and the accompanying drawings are only for a more specific description of the embodiments, and are not intended to specifically limit the present invention.

It should be noted that the references to "one embodiment", "embodiment", "exemplary embodiments", "some embodiments" and the like in the specification indicate that the embodiments described may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it should be within the knowledge of a person skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments (whether or not explicitly described).

In general, a term can be understood, at least in part, from its use in context. For example, depending, at least in part, on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending, at least in part, on the context, allow for the presence of other factors that are not necessarily explicitly described.

It will be understood that the meaning of “on,” “over,” and “above” in this disclosure should be interpreted in the broadest manner, so that “on” means not only “directly on” something, but also includes the meaning of being “on” something with intervening features or layers therebetween, and “on” or “over” means not only “on” or “above” something, but also includes the meaning of being “on” or “above” something with no intervening features or layers therebetween.

In addition, spatially relative terms such as "under," "beneath," "lower," "over," "upper," and the like may be used herein for descriptive convenience to describe the relationship of one element or feature to another element or features, as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially relative descriptors used herein may be similarly interpreted accordingly.

As shown in Figures 1 to 11, an embodiment of the present invention provides a brain perfusion machine for sub-hypothermia treatment, including a body 1, a heat exchanger 7 and a circulation tank 3. The outer surface of the body 1 is provided with a control panel 2, the surface of the body 1 is provided with a body temperature sensor 18, the surface of the heat exchanger 7 is provided with a blood circulation component, the outer surface of the circulation tank 3 is provided with a semiconductor refrigeration sheet 25, the inner surface of the circulation tank 3 is provided with a water temperature sensor 39, and the inner surface of the circulation tank 3 is provided with a liquid level sensor 40. The blood circulation component is used to draw blood from the patient's artery, and control the blood temperature through the heat exchanger 7 and then infuse it into the patient's carotid artery to achieve the purpose of artificial intervention on the patient's brain temperature. The blood circulation component is connected to the heat exchanger 7 and the body 1 respectively. The surface of the circulation tank 3 is provided with a coolant circulation component, which is used to The coolant physically cools the blood through the heat exchanger 7. The coolant circulation component is respectively connected to the heat exchanger 7 and the circulation tank 3. A driving component is provided on the lower surface of the circulation tank 3. The driving component is used to drive the semiconductor refrigeration sheet 25 to move. The driving component is respectively connected to the body 1 and the semiconductor refrigeration sheet 25. A diversion component is provided on the surface of the circulation tank 3. The diversion component is used to divert and decelerate the coolant. The diversion component is connected to the circulation tank 3. A guide component is provided on the surface of the circulation tank 3. The guide component is used to cool the coolant diverted by the diversion component through the semiconductor refrigeration sheet 25. The guide component is connected to the circulation tank 3. A cooling component is provided on the outer surface of the semiconductor refrigeration sheet 25. The cooling component is used to install and fix the semiconductor refrigeration sheet 25. The cooling component is connected to the semiconductor refrigeration sheet 25.

As an implementation in this embodiment, as shown in Figures 1, 2 and 7, the blood circulation component includes a collection tube 13 inserted on the surface of the heat exchanger 7, a blood transfusion tube 14 is inserted on the surface of the heat exchanger 7, a circulation pump 15 is fixedly connected to the inner surface of the body 1, a monitoring sensor module 16 is provided on the inner surface of the body 1, a return blood vessel 17 is inserted on the surface of the circulation pump 15, the return blood vessel 17 and the blood transfusion tube 14 are connected through the monitoring sensor module 16 and the circulation pump 15, the collection tube 13 takes blood from the patient's artery and then transports it to the heat exchanger 7, the blood is cooled by the coolant in the heat exchanger 7, and the blood after cooling is pumped into the detection sensor module under the action of the circulation pump 15, the blood pressure and bubble content are detected by the monitoring sensor module 16, and the safety of the injected blood is ensured, when the parameter index is greater than or less than the safety value, an alarm is issued by a buzzer provided on the body 1 to remind the monitoring personnel, and at the same time, the patient's cranial brain can be selectively and accurately controlled at sub-hypothermia for a long time, and the accuracy of the slow heating curve when the sub-hypothermia treatment is ended can also be maintained. The blood temperature change curve of the patient is gentler, the stimulation to the patient is smaller, and the safety of the use of the device is further improved. The blood is pumped out of the monitoring sensor module 16 and flows back into the patient's carotid artery through the return blood vessel 17, thereby realizing rapid cooling of the patient. The patient's own blood is used, and the blood is cooled through closed-loop extracorporeal circulation, and then infused into the patient's intracranial artery to quickly achieve low-temperature control of the patient's brain, reduce the probability of rejection, hemolysis, and disease transmission in the patient, and reduce the risk of treatment. The control panel 2 controls the electrical components on the body 1, which effectively improves the convenience of operation of the device. Before treatment, the body temperature sensor 18 is fitted to the surface of the patient's head, and the temperature of the patient's head is monitored. After the temperature is converted into the intracranial temperature through the empirical fitting curve, the semiconductor refrigeration sheet 25 is controlled by the control panel 2 to heat or cool the coolant to change the coolant temperature. The temperature of the coolant in the circulation tank 3 is monitored by the water temperature sensor 39. The first pump body 6 and the circulation pump 15 are controlled by the control panel 2 to change the blood and coolant flow rates, and the blood reaches the set cooling curve or heating curve in conjunction with the temperature control of the coolant.

As an implementation method in this embodiment, as shown in Figures 1 and 2, the coolant circulation component includes an infusion tube 5 inserted on the surface of the circulation tank 3, the surface of the infusion tube 5 is fixedly connected to the first pump body 6, the surface of the circulation tank 3 is fixedly connected to the first solenoid valve 4, the surface of the circulation tank 3 is inserted with a discharge tube 10, the infusion tube 5 and the discharge tube 10 are both connected to the circulation tank 3 through the first solenoid valve 4, the surface of the heat exchanger 7 is inserted with a return tube 8, the surface of the circulation tank 3 is fixedly connected to the second solenoid valve 9, the surface of the circulation tank 3 is inserted with a conduit 11, the surface of the conduit 11 is provided with a second pump body 12, the conduit 11 and the return tube 8 are both connected to the circulation tank 3 through the second solenoid valve 9, and the coolant in the circulation tank 3 is pumped into the heat exchanger 7 through the infusion tube 5 under the action of the first pump body 6 The coolant is then transported back to the circulation tank 3 through the return pipe 8. In this process, the coolant physically cools the blood through the heat exchanger 7. Compared with the freezing setting and the heating setting, the coolant directly acts on the blood, which is safer and has a softer temperature change curve, and has less stimulation to the patient. By setting the drain pipe 10, when it is necessary to remove the coolant in the circulation tank 3, the first solenoid valve 4 can be adjusted to discharge the coolant in the circulation tank 3 through the drain pipe 10. By setting the conduit 11, when it is necessary to add coolant to the circulation tank 3, the second solenoid valve 9 can be adjusted to pump the external coolant into the circulation tank 3 through the conduit 11 and the second solenoid valve 9 through the second pump body 12, thereby completing the addition of the coolant. The structure is simple and the operation is convenient.

As an implementation method in this embodiment, as shown in Figures 1 to 3, the driving component includes a chassis 19 fixedly connected to the inner surface of the body 1, a servo motor 20 is fixedly connected to the lower surface of the chassis 19, the output end of the servo motor 20 is fixedly connected to a main gear 21, the outer surface of the main gear 21 is rotatably connected to a driven gear 22, the upper surface of the driven gear 22 is fixedly connected to a rotating shaft 23, the outer surface of the rotating shaft 23 is fixedly connected to a bracket 24, the cooling component is connected to the bracket 24, when it is necessary to cool the patient, the semiconductor refrigeration sheet 25 is powered on, multiple semiconductor refrigeration sheets 25 are powered on and the circulation tank 3 is cooled, the cooled coolant in the circulation tank 3 is pumped into the heat exchanger 7 through the first solenoid valve 4, the infusion tube 5 and the first pump body 6, the blood in the heat exchanger 7 is cooled, and the heat exchanger 7 is cooled. The liquid pipe 8 and the second solenoid valve 9 pump back the circulation tank 3; when the patient needs to be rewarmed, the servo motor 20 is started, and the servo motor 20 drives multiple driven gears 22 to rotate synchronously through the main gear 21. The driven gear 22 drives the semiconductor refrigeration plate 25 to rotate through the rotating shaft 23 and the bracket 24, and moves to the adjacent side of the circulation tank 3. At this time, the heating surface of the semiconductor refrigeration plate 25 is in contact with the circulation tank 3, so that the semiconductor refrigeration plate 25 is powered on to heat the circulation tank 3 and realize the rewarming of the patient's blood. The advantage of this setting is that it avoids direct contact between the heating electrical components and the physiological saline, thereby causing oxidation damage to the heating electrical components, which is conducive to the long-term and stable use of the device, ensures the service life of the device, reduces the risk of surgery, and makes full use of the semiconductor refrigeration plate 25, which is clever and practical.

As an implementation method in this embodiment, as shown in Figures 4, 5 and 9, the diversion component includes a connecting pipe 27 fixedly connected to the inner surface of the circulation tank 3, the outer surface of the connecting pipe 27 is sleeved with a conical sleeve 28, the inner surface of the circulation tank 3 is provided with a diversion plate 29, the upper surface of the diversion plate 29 is fixedly connected to a diversion plate 30, the upper surface of the diversion plate 29 is fixedly connected to a baffle plate 31, the guide component is connected to the diversion plate 29, the upper surface of the diversion plate 29 is provided with a diversion groove 32, the upper surface of the diversion plate 29 The surface is provided with an avoidance groove 33, and the coolant affected by the blood temperature in the heat exchanger 7 flows into the circulation tank 3 through the return pipe 8, the second solenoid valve 9 and the connecting pipe 27, and the coolant flowing out of the connecting pipe 27 will enter the conical sleeve 28, and the coolant in the conical sleeve 28 will flow into the surface of the diverter plate 30 along the inner wall of the conical sleeve 28. The conical structure of the conical sleeve 28 can be matched with the shape of the upper surface of the diverter plate 30, so that the coolant can flow directly to the surface of the diverter plate 30 along the conical sleeve 28, and the diverter plate The arrangement of the wavy structure 30 can not only initially decelerate the flow rate of the coolant, but also guide the flow direction of the coolant, thereby making the coolant flowing to the surface of the diverter plate 29 evenly distributed, and the coolant flowing down from the diverter plate 30 will continue to flow down along the direction of the diverter groove 32. Because the shape of the entire diverter plate 29 is an arc-shaped curved surface structure, the coolant will continue to flow down on the upper surface of the diverter plate 29 without stagnation, thereby increasing the liquid output of the circulation tank 3, and the coolant will finally flow down along the diverter groove 32. The coolant flows out of the diverter plate 29 in the direction of the flow groove 32. In order to prevent the coolant from flowing out of the diverter groove 32 and entering the gap between the two groups of diverter plates 30 during the flow process, an avoidance groove 33 is set on the outer surface of the baffle plate 31. The setting of the avoidance groove 33 can allow the coolant flowing into the gap between the diverter plates 30 to flow out along the diverter plate 29 under the blocking effect of the baffle plate 31. Through the above setting, not only can the coolant be evenly diverted on the surface of the diverter plate 29, but also the high-speed flowing coolant can be slowed down.

As an implementation method in this embodiment, as shown in Figures 4 and 6, the guide component includes a step plate 34 fixedly connected to the side surface of the diverter plate 29, the side surface of the step plate 34 is fixedly connected to the limiting plate 35, the surface of the limiting plate 35 is fixedly connected to the guide plate 36, the surface of the limiting plate 35 is fixedly connected to the inclined plate 37, the lower surface of the inclined plate 37 is fixedly connected to the branch plate 38, the inclined plate 37 and the guide plate 36 are staggered, the coolant flowing down from the surface of the diverter plate 29 will first enter the surface of the step plate 34, the stepped design of the step plate 34 can not only The coolant is decelerated for a second time, and the structure of the step plate 34 is a gradually flat step-type structure. Such a setting can prevent the coolant from stagnating on the surface of the step plate 34, thereby increasing the liquid output of the circulation tank 3. The coolant decelerated by the step plate 34 will enter the upper surface of the first group of guide plates 36 under the limiting action of the limiting plate 35. The limiting plate 35 can limit the overall flow direction of the coolant. After the semiconductor refrigeration sheet 25 is energized, it will transfer heat to the surface of the circulation tank 3 through the heat conducting sheet 44. The limiting plate 35 cools the circulation tank 3. The range of the liquid action is just within the cooling range of the semiconductor refrigeration sheet 25. In this way, when the coolant flows into the first set of guide plates 36, the temperature begins to change. The guide plates 36 are inclined structures. This arrangement is to allow the coolant to automatically flow downward when it reaches the surface of the guide plates 36. When the coolant flows to the surface of the inclined plate 37, it will gradually enter the gap formed by the branch plate 38. The branch structure of the branch plate 38 can not only decelerate the coolant three times, but also make the coolant more evenly distributed in the limit plate 35, thereby improving the semiconductor refrigeration. In order to improve the utilization efficiency of the temperature of the sheet 25, the gap generated by the branch plate 38 gradually becomes larger on the surface of the inclined plate 37. This arrangement is to allow the coolant on the surface of the inclined plate 37 to enter the branch plate 38. After the coolant flows down from the surface of the branch plate 38, it will enter the second set of guide plates 36. Since the guide plates 36 and the inclined plates 37 are staggered, this arrangement can not only allow the coolant to flow more evenly and smoothly in the limit plate 35, but also the staggered distribution of the inclined plates 37 and guide plates 36 can ensure that the coolant has a sufficient flow rate to flow smoothly through the branch plates 38.

As an implementation method in this embodiment, as shown in Figures 3, 8, 10 and 11, the cooling component includes a heat conductive sheet 44 inserted on the surface of the bracket 24, a block 45 is fixedly connected to the surface of the heat conductive sheet 44, a card slot 47 is provided on the surface of the bracket 24, an elastic slot 46 is provided on the inner surface of the block 45, an oblique spring sheet 41 is fixedly connected to the surface of the semiconductor cooling sheet 25, a concave spring sheet 42 is fixedly connected to the surface of the oblique spring sheet 41, an adapting slot 43 is provided on the inner surface of the bracket 24, and a limiting slot 26 is provided on the surface of the circulation tank 3. When installing the semiconductor cooling sheet 25, the operator only needs to put the semiconductor cooling sheet 25 The surface with the inclined structure is aligned with the inclined groove on the surface of the bracket 24, and then pressed to complete the installation. An inclined spring piece 41 is set on the side surface of the semiconductor refrigeration sheet 25. The inclined spring piece 41 is an elastic piece with a built-in inclined angle. When the operator presses the semiconductor refrigeration sheet 25, the inclined spring piece 41 will deform and drive the concave spring piece 42 to deform and shrink until the inclined spring piece 41 slides into the adapter groove 43. The inclined spring piece 41 will rebound to its original shape under the action of the concave spring piece 42, and cooperate with the adapter groove 43 to complete the card connection. At this time, the inclined spring piece 41 cannot be pulled out under the action of the concave spring piece 42. This setting operation is very convenient. The invention is simple and greatly improves the installation efficiency of the semiconductor cooling sheet 25. It is worth mentioning that the heat conductive sheet 44 is arranged on the surface of the bracket 24 and when the semiconductor cooling sheet 25 is installed, it will fit with the heat conductive sheet 44. The installation method of the heat conductive sheet 44 is also in the form of press-fit connection. However, the heat conductive sheet 44 and the bracket 24 are connected by a card block 45 and a card slot 47. An elastic groove 46 is arranged inside the card block 45. When the operator presses the heat conductive sheet 44, the elastic groove 46 will shrink and squeeze the card block 45 into the card slot 47. When the heat conductive sheet 44 needs to be removed, it only needs to be pulled outward. When the semiconductor cooling sheet 25 needs to be removed, It is necessary to remove the heat conductive sheet 44 first and then continue to press the semiconductor cooling sheet 25 inward. During the continuous pressing of the semiconductor cooling sheet 25, the inclined structure of the inclined spring sheet 41 and the setting of the matching groove 43 can allow the concave spring sheet 42 to be deformed and contracted again under force. At this time, the inclined spring sheet 41 will gradually deform and contract until it completely slides out of the matching groove 43. This setting makes the semiconductor cooling sheet 25 very efficient in both installation and removal. Moreover, the inclined spring sheet 41 and the setting of the concave spring sheet 42 form a one-way self-locking card connection structure between the semiconductor cooling sheet 25 and the bracket 24, thereby ensuring the stability of the semiconductor cooling sheet 25 during use.

The technical solution provided by the present invention is to set a body temperature sensor 18, a control panel 2, a blood circulation component and a heat exchanger 7. The collection tube 13 takes blood from the patient's artery and then transports it to the heat exchanger 7. The blood is cooled by the coolant in the heat exchanger 7. The blood after cooling is pumped into the detection sensor module under the action of the circulation pump 15. The blood passes through the monitoring sensor module 16 to detect the pressure and bubble content of the blood, thereby ensuring the safety of the injected blood. When the parameter index is greater than or less than the safety value, an alarm is issued through a buzzer set on the body 1 to remind the monitoring personnel. At the same time, the patient's brain can be selectively and accurately controlled at sub-hypothermia for a long time, and the accuracy of the slow heating curve when the sub-hypothermia treatment is ended can be maintained, which is conducive to a softer blood temperature change curve for the patient and less stimulation to the patient, further improving the safety of the device. The blood is pumped out of the monitoring sensor module 16 through the return blood vessel 1 7 flows back into the patient's carotid artery, thereby achieving rapid cooling of the patient. The patient's own blood is used through a closed-loop extracorporeal circulation. After cooling the blood, it is infused into the patient's intracranial artery to quickly achieve low-temperature control of the patient's brain, reduce the patient's chances of rejection, hemolysis, and disease transmission, and reduce treatment risks. The control panel 2 controls the electrical components on the body 1, which effectively improves the convenience of operation of the device. Before treatment, the body temperature sensor 18 is fitted to the surface of the patient's head. By monitoring the patient's head epidermal temperature, the temperature is converted into the intracranial temperature through an empirical fitting curve. The semiconductor refrigeration sheet 25 is controlled by the control panel 2 to heat or cool the coolant and change the coolant temperature. The temperature of the coolant in the circulation tank 3 is monitored by the water temperature sensor 39. The first pump body 6 and the circulation pump 15 are controlled by the control panel 2 to change the blood and coolant flow rates, and the blood reaches the set cooling curve or heating curve in coordination with the temperature control of the coolant.

By setting the heat exchanger 7, the circulation tank 3 and the coolant circulation component, the coolant is allowed to circulate between the heat exchanger 7 and the circulation tank 3. The coolant in the circulation tank 3 is pumped into the heat exchanger 7 through the infusion tube 5 under the action of the first pump body 6, and exchanges heat with the blood in the heat exchanger 7. Then the coolant is transported back to the circulation tank 3 through the return pipe 8. In this process, the coolant physically cools the blood through the heat exchanger 7. Compared with the freezing setting and the heating setting, it is safer to directly act on the blood, the temperature change curve is softer, and the stimulation to the patient is smaller. By setting the drain pipe 10, when it is necessary to discharge the coolant in the circulation tank 3, the first solenoid valve 4 can be adjusted to discharge the coolant in the circulation tank 3 through the drain pipe 10. By setting the conduit 11, when it is necessary to add coolant to the circulation tank 3, the second solenoid valve 9 can be adjusted, and the external coolant can be pumped into the circulation tank 3 through the conduit 11 and the second solenoid valve 9 through the second pump body 12, so as to complete the addition of coolant, and the structure is simple and the operation is convenient.

By setting a driving component and a semiconductor refrigeration sheet 25, when it is necessary to cool the patient, the semiconductor refrigeration sheet 25 is powered on, multiple semiconductor refrigeration sheets 25 are powered on and the circulation tank 3 is cooled, and the cooled coolant in the circulation tank 3 is pumped into the heat exchanger 7 through the first solenoid valve 4, the infusion tube 5 and the first pump body 6, the blood in the heat exchanger 7 is cooled, and the coolant is pumped back to the circulation tank 3 through the return tube 8 and the second solenoid valve 9; when it is necessary to reheat the patient, the servo motor 20 is started, and the servo motor 20 drives the multiple driven gears 22 to rotate synchronously through the main gear 21, and the driven gears 22 The semiconductor refrigeration sheet 25 is driven to rotate by the rotating shaft 23 and the bracket 24, and moves to the adjacent side of the circulation tank 3. At this time, the heating surface of the semiconductor refrigeration sheet 25 is in contact with the circulation tank 3, so that the semiconductor refrigeration sheet 25 is powered on to heat the circulation tank 3 and rewarm the blood in the patient's body. The advantage of such a setting is that it avoids direct contact between the heating electrical components and the physiological saline solution, thereby avoiding oxidation damage to the heating electrical components, which is beneficial to the long-term and stable use of the device, ensures the service life of the device, reduces the risk of surgery, and makes full use of the semiconductor refrigeration sheet 25, which is clever and practical.

By setting up a diversion component, the coolant affected by the blood temperature in the heat exchanger 7 flows into the circulation tank 3 through the return pipe 8, the second solenoid valve 9 and the connecting pipe 27, and the coolant flowing out of the connecting pipe 27 will enter the conical sleeve 28. The coolant in the conical sleeve 28 will flow along the inner wall of the conical sleeve 28 into the surface of the diverter plate 30. The conical structure of the conical sleeve 28 can be matched with the shape of the upper surface of the diverter plate 30, so that the coolant can flow directly to the surface of the diverter plate 30 along the conical sleeve 28. The wavy structure of the diverter plate 30 can not only preliminarily decelerate the flow rate of the coolant, but also guide the flow direction of the coolant, so that the coolant flowing to the surface of the diverter plate 29 is evenly distributed, and the coolant flowing down from the diverter plate 30 will flow along the diverter groove The cooling liquid continues to flow in the direction of 32 because the shape of the entire diverter plate 29 is an arc-shaped curved structure. Therefore, the coolant will continue to flow downward on the upper surface of the diverter plate 29 without stagnation, thereby increasing the liquid output of the circulation tank 3. The coolant finally flows out of the diverter plate 29 along the direction of the diverter groove 32. In order to prevent the coolant from exceeding the diverter groove 32 and entering the gap between the two groups of diverter plates 30 during the flow process, an avoidance groove 33 is provided on the outer surface of the baffle plate 31. The setting of the avoidance groove 33 can allow the coolant flowing into the gap between the diverter plates 30 to flow out along the diverter plate 29 under the blocking effect of the baffle plate 31. Through the above setting, not only can the coolant be evenly diverted on the surface of the diverter plate 29, but also the high-speed flowing coolant can be slowed down.

By setting the guide component, the coolant flowing down from the surface of the diverter plate 29 will first enter the surface of the step plate 34. The stepped design of the step plate 34 can not only decelerate the coolant for a second time, but also the structure of the step plate 34 is a gradually tending stepped structure. Such a setting can prevent the coolant from stagnating on the surface of the step plate 34, thereby increasing the liquid output of the circulation tank 3. The coolant decelerated by the step plate 34 will enter the upper surface of the first group of guide plates 36 under the limiting action of the limiting plate 35. The limiting plate 35 can limit the overall flow direction of the coolant. After the semiconductor refrigeration plate 25 is energized, it will transfer heat to the surface of the circulation tank 3 through the heat conducting plate 44. The range of the limiting plate 35 on the coolant in the circulation tank 3 is just within the refrigeration range of the semiconductor refrigeration plate 25. In this way, when the coolant flows into the first group of guide plates 36, the temperature begins to change. The guide plates 36 are an inclined structure. This arrangement is intended to allow the coolant to automatically flow downward when it reaches the surface of the guide plate 36. When the coolant flows to the surface of the inclined plate 37, it will gradually enter the gap formed by the branch plate 38. The branch plate 38 branch structure can not only decelerate the coolant three times, but also allow the coolant to be more evenly distributed in the limit plate 35, thereby improving the utilization efficiency of the temperature of the semiconductor refrigeration plate 25. The gap generated by the branch plate 38 gradually becomes larger on the surface of the inclined plate 37. This arrangement is intended to allow the coolant on the surface of the inclined plate 37 to enter the branch plate 38. After flowing down from the surface of the branch plate 38, the coolant will enter the second group of guide plates 36. Since the guide plates 36 and the inclined plates 37 are staggered, this arrangement can not only allow the coolant to flow more evenly and smoothly in the limit plate 35, but also the staggered inclined plates 37 and guide plates 36 can ensure that the coolant has a sufficient flow rate to flow smoothly through the branch plates 38.

By setting a cooling component, the efficiency of disassembly and assembly of the semiconductor refrigeration sheet 25 is higher. The semiconductor refrigeration sheet 25 is fixed to the surface of the rotating shaft 23 by the bracket 24. When installing the semiconductor refrigeration sheet 25, the operator only needs to align the surface of the semiconductor refrigeration sheet 25 with the inclined structure with the inclined groove on the surface of the bracket 24, and then press to complete the installation. The side surface of the semiconductor refrigeration sheet 25 is provided with an inclined spring piece 41, and the inclined spring piece 41 is an elastic piece with a built-in inclined angle. When the operator presses the semiconductor refrigeration sheet 25, the inclined spring piece 41 will deform and drive the concave spring piece 42 to deform and shrink until the inclined spring piece 41 slides into the adapter groove 43. The inclined spring piece 41 will rebound to its original shape under the action of the concave spring piece 42, and form a match with the adapter groove 43 to complete the snap-in. At this time, the inclined spring piece 41 cannot be pulled out under the action of the concave spring piece 42. Such a setting operation is very simple, which greatly improves the installation efficiency of the semiconductor refrigeration sheet 25. It is worth mentioning that the thermal conductive sheet 44 is arranged on the surface of the bracket 24 and when the semiconductor refrigeration sheet 25 is installed, it will be matched with the thermal conductive sheet 44. The heat conducting sheet 44 is fitted to the bracket 24, and the installation method of the heat conducting sheet 44 is also in the form of press-fit connection. However, the heat conducting sheet 44 and the bracket 24 are connected by a card block 45 and a card slot 47. An elastic slot 46 is arranged inside the card block 45. When the operator presses the heat conducting sheet 44, the elastic slot 46 will shrink and squeeze the card block 45 into the card slot 47. When the heat conducting sheet 44 needs to be removed, it is only necessary to pull the heat conducting sheet 44 outward. When the semiconductor cooling sheet 25 needs to be removed, the heat conducting sheet 44 needs to be removed first and then the semiconductor cooling sheet 25 needs to be pressed inward continuously. During the process of pressing the semiconductor refrigeration plate 25, the inclined structure of the inclined spring piece 41 and the setting of the matching groove 43 can allow the concave spring piece 42 to be deformed and contracted again under force. At this time, the inclined spring piece 41 will gradually deform and contract until it completely slides out of the matching groove 43. This setting makes the semiconductor refrigeration plate 25 very efficient in both installation and disassembly. Moreover, the setting of the inclined spring piece 41 and the concave spring piece 42 form a one-way self-locking clamping structure between the semiconductor refrigeration plate 25 and the bracket 24, thereby ensuring the stability of the semiconductor refrigeration plate 25 during use.

The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims (9)

1. A brain perfusion machine for sub-hypothermia treatment, comprising a machine body, a heat exchanger and a circulation tank, characterized in that a control panel is arranged on the outer surface of the machine body, a body temperature sensor is arranged on the surface of the machine body, a blood circulation component is arranged on the surface of the heat exchanger, a semiconductor cooling sheet is arranged on the outer surface of the circulation tank, a water temperature sensor is arranged on the inner surface of the circulation tank, and a liquid level sensor is arranged on the inner surface of the circulation tank; The blood circulation component is used to take blood from the patient's artery and control the blood temperature through the heat exchanger before injecting it into the patient's carotid artery to achieve the purpose of artificial intervention on the patient's brain temperature. The blood circulation component is connected to the heat exchanger and the body respectively; A cooling liquid circulation component is provided on the surface of the circulation tank, and the cooling liquid circulation component is used to physically cool the blood by passing the cooling liquid through the heat exchanger, and the cooling liquid circulation component is respectively connected to the heat exchanger and the circulation tank; A driving component is provided on the lower surface of the circulation tank, and the driving component is used to drive the semiconductor refrigeration plate to move, and the driving component is connected to the machine body and the semiconductor refrigeration plate respectively; A flow dividing component is provided on the surface of the circulation tank, and the flow dividing component is used to divide and slow down the coolant, and the flow dividing component is connected to the circulation tank; The circulation tank is provided with a flow guide component on its surface, the flow guide component is used to cool the coolant diverted by the diversion component through a semiconductor refrigeration sheet, and the flow guide component is connected to the circulation tank; The outer surface of the semiconductor refrigeration plate is provided with a cooling component, and the cooling component is used to install and fix the semiconductor refrigeration plate, and the cooling component is connected to the semiconductor refrigeration plate. 2. The brain perfusion machine for sub-hypothermia treatment according to claim 1 is characterized in that the blood circulation component includes a collection tube inserted on the surface of the heat exchanger, a blood transfusion blood vessel is inserted on the surface of the heat exchanger, a circulation pump is fixedly connected to the inner surface of the body, a monitoring sensor module is provided on the inner surface of the body, a return blood vessel is inserted on the surface of the circulation pump, and the return blood vessel and the blood transfusion blood vessel are connected via the monitoring sensor module and the circulation pump. 3. The brain perfusion machine for sub-hypothermia treatment according to claim 1 is characterized in that the coolant circulation assembly includes an infusion tube inserted on the surface of the circulation tank, the surface of the infusion tube is fixedly connected to a first pump body, the surface of the circulation tank is fixedly connected to a first solenoid valve, the surface of the circulation tank is inserted with a discharge tube, the infusion tube and the discharge tube are both connected to the circulation tank through the first solenoid valve, the surface of the heat exchanger is inserted with a return tube, the surface of the circulation tank is fixedly connected to a second solenoid valve, the surface of the circulation tank is inserted with a catheter, the surface of the catheter is provided with a second pump body, the catheter and the return tube are both connected to the circulation tank through the second solenoid valve. 4. The brain perfusion machine for hypothermia treatment according to claim 1 is characterized in that the driving component includes a chassis fixedly connected to the inner surface of the body, a servo motor is fixedly connected to the lower surface of the chassis, a main gear is fixedly connected to the output end of the servo motor, a driven gear is rotatably connected to the outer surface of the main gear, a rotating shaft is fixedly connected to the upper surface of the driven gear, a bracket is fixedly connected to the outer surface of the rotating shaft, and the cooling component is connected to the bracket. 5. The brain perfusion machine for sub-hypothermia treatment according to claim 1 is characterized in that the diversion component includes a connecting pipe fixedly connected to the inner surface of the circulation tank, the outer surface of the connecting pipe is sleeved with a conical sleeve, the inner surface of the circulation tank is provided with a diversion disk, the upper surface of the diversion disk is fixedly connected with a diversion plate, the upper surface of the diversion disk is fixedly connected with a baffle, and the flow guide component is connected to the diversion disk. 6. The brain perfusion machine for mild hypothermia treatment according to claim 5, characterized in that a diversion groove is provided on the upper surface of the diversion plate, and an avoidance groove is provided on the upper surface of the diversion plate. 7. A brain perfusion machine for sub-hypothermia treatment according to claim 5, characterized in that the guide component includes a step plate fixedly connected to the side surface of the diverter plate, the side surface of the step plate is fixedly connected to a limiting plate, the surface of the limiting plate is fixedly connected to a drainage plate, and the surface of the limiting plate is fixedly connected to an inclined plate. 8. The brain perfusion machine for mild hypothermia treatment according to claim 7, characterized in that a branch plate is fixedly connected to the lower surface of the inclined plate, and the inclined plate and the drainage plate are staggered. 9. The brain perfusion machine for hypothermia treatment according to claim 4 is characterized in that the cooling component includes a heat conductive sheet inserted on the surface of the bracket, a clamping block is fixedly connected to the surface of the heat conductive sheet, a clamping groove is provided on the surface of the bracket, an elastic groove is provided on the inner surface of the clamping block, an inclined spring sheet is fixedly connected to the surface of the semiconductor refrigeration sheet, a concave spring sheet is fixedly connected to the surface of the inclined spring sheet, an adapting groove is provided on the inner surface of the bracket, and a limiting groove is provided on the surface of the circulation tank.